Component mounting device and component mounting method

Abstract

The present invention provides a component mounting device and a component mounting method, comprising: a mounting head having a nozzle capable of moving in an axial direction parallel to a drive shaft and in a rotational direction centered on the drive shaft; a photographing device for photographing a component held by the nozzle; a first photographing control unit for controlling the photographing device to obtain an image of the component viewed from the axial direction; a nozzle control unit for controlling the nozzle based on the image viewed from the axial direction to adjust the position of the component in the rotational direction; a second photographing control unit for controlling the photographing device to obtain an image of the component viewed from a first direction orthogonal to the drive shaft and an image viewed from a second direction after adjusting the position in the rotational direction; an angle calculation unit for calculating the angle of the component based on the image viewed from the first direction and the image viewed from the second direction; and a mounting control unit for controlling the mounting head based on the angle to mount the component at a target mounting position on a substrate.

Description

Technical Field

[0001] The present invention relates to a component mounting device and a component mounting method. Background Art

[0002] In the technical field related to component mounting devices, a component mounter disclosed in Patent Document 1 is known. In Patent Document 1, the component mounter uses an imaging device to image a component adsorbed by an adsorption nozzle. The component mounter determines the adsorption posture of the component based on the image obtained by imaging and then mounts the component on a substrate.

[0003] Patent Document 1: International Publication No. 2017 / 013781

[0004] If the posture of the component before being mounted on the substrate cannot be properly recognized, it is difficult to mount the component at the target mounting position on the substrate. Summary of the Invention

[0005] An object of the present invention is to properly recognize the posture of a component before being mounted on a substrate.

[0006] According to the present invention, there is provided a component mounting device including: a mounting head having a nozzle capable of moving in an axial direction parallel to a drive shaft and a rotational direction centered on the drive shaft; an imaging device that images a component held by the nozzle; a first imaging control unit that controls the imaging device to obtain an image of the component viewed from the axial direction; a nozzle control unit that controls the nozzle based on the image viewed from the axial direction to adjust the position of the component in the rotational direction; a second imaging control unit that, after the position in the rotational direction is adjusted, controls the imaging device to obtain an image of the component viewed from a first direction orthogonal to the drive shaft and an image viewed from a second direction; an angle calculation unit that calculates the angle of the component based on the image viewed from the first direction and the image viewed from the second direction; and a mounting control unit that controls the mounting head based on the angle to mount the component at a target mounting position on a substrate.

[0007] According to the present invention, it is possible to properly recognize the posture of a component before being mounted on a substrate. Brief Description of the Drawings

[0008] Figure 1 It is a side view schematically showing a component mounting device according to an embodiment.

[0009] Figure 2 It is a top view schematically showing a component mounting device according to an embodiment.

[0010] Figure 3 It is a perspective view showing a mounting head according to an embodiment.

[0011] Figure 4 It is a side view of the mounting head showing an embodiment.

[0012] Figure 5 It is a schematic diagram of the imaging device showing an embodiment.

[0013] Figure 6 It is a diagram for explaining the operation of the mounting head of the embodiment.

[0014] Figure 7 It is a functional block diagram of the control device showing an embodiment.

[0015] Figure 8 It is a diagram for explaining the processing of the image processing unit of the embodiment.

[0016] Figure 9 It is a diagram for explaining the processing of the nozzle processing unit of the embodiment.

[0017] Figure 10 It is a diagram showing an image of a component obtained by imaging with the second imaging device of the embodiment.

[0018] Figure 11 It is a diagram showing an image of a component obtained by imaging with the second imaging device of the embodiment.

[0019] Figure 12 It is a diagram for explaining the operation of the mounting head of the embodiment.

[0020] Figure 13 It is a diagram for explaining the operation of the mounting head of the embodiment.

[0021] Figure 14 It is a diagram for explaining the processing of the correction amount calculation unit of the embodiment.

[0022] Figure 15 It is a schematic diagram showing the relationship between the determination result of the angle determination unit and the processing of the mounting control unit of the embodiment.

[0023] Figure 16 It is a flowchart showing the component mounting method of the embodiment.

[0024] Figure 17 It is a block diagram showing the computer system of the embodiment. Detailed Embodiments

[0025] Hereinafter, embodiments of the present invention will be described with reference to the drawings, but the present invention is not limited thereto. The components of the embodiments described below can be appropriately combined. In addition, there are cases where some components are not used.

[0026] In an embodiment, an XgYgZg rectangular coordinate system is set, and the positional relationships of respective parts are described with reference to the XgYgZg rectangular coordinate system. The direction parallel to the Xg axis of the horizontal plane is set as the Xg-axis direction, the direction parallel to the Yg axis of the horizontal plane orthogonal to the Xg axis is set as the Yg-axis direction, and the direction parallel to the Zg axis orthogonal to the horizontal plane is set as the Zg-axis direction. In addition, the rotational direction centered on the Xg axis is set as the θXg direction, the rotational direction centered on the Yg axis is set as the θYg direction, and the rotational direction centered on the Zg axis is set as the θZg direction. In addition, in the embodiment, the plane including the Xg axis and the Yg axis is appropriately referred to as the XgYg plane, the plane including the Yg axis and the Zg axis is appropriately referred to as the YgZg plane, and the plane including the Zg axis and the Xg axis is appropriately referred to as the ZgXg plane. The XgYg plane is parallel to the horizontal plane. In addition, the XgYg plane may not be parallel to the horizontal plane.

[0027] [Component mounting device]

[0028] Figure 1 is a side view schematically showing the component mounting device 1 of the embodiment. Figure 2 is a top view schematically showing the component mounting device 1 of the embodiment. The component mounting device 1 mounts a component C on a substrate P. The component mounting device 1 includes: a base member 2; a substrate conveying device 3 for conveying the substrate P; a component supply device 4 for supplying the component C; a mounting head 6 having a nozzle 5; a head moving device 7 for moving the mounting head 6; a nozzle moving device 8 for moving the nozzle 5; and a control device 9.

[0029] The base member 2 supports the substrate conveying device 3, the component supply device 4, the mounting head 6, the head moving device 7, and the nozzle moving device 8, respectively.

[0030] The substrate conveying device 3 conveys the substrate P to the mounting area DM. The mounting area DM is defined on the conveying path of the substrate conveying device 3. In the embodiment, the substrate conveying device 3 conveys the substrate P along the Xg-axis direction. The substrate P before mounting the component C is carried into the substrate conveying device 3 from the -Xg side end of the base member 2. The substrate conveying device 3 conveys the carried-in substrate P in the +Xg direction and stops the substrate P in the mounting area DM. The mounting head 6 mounts the component C on the surface of the substrate P disposed in the mounting area DM. The substrate conveying device 3 conveys the substrate P after mounting the component C in the +Xg direction. The substrate P after mounting the component C is carried out from the +Xg side end of the base member 2.

[0031] The component supply device 4 supplies components C to the supply area SM. The component supply device 4 includes a plurality of tape feeders 41. A plurality of tape feeders 41 are arranged along the Xg axis direction. The supply area SM of the component C is defined by the tape feeders 41. The tape feeder 41 conveys a carrier tape holding a plurality of components C. By conveying the carrier tape, at least one component C among the plurality of components C is supplied to the supply area SM. In the embodiment, the component supply device 4 is arranged on both the +Yg side and the -Yg side of the substrate conveying device 3. Alternatively, the component supply device 4 may be arranged on either the +Yg side or the -Yg side of the substrate conveying device 3.

[0032] The mounting head 6 holds the component C supplied from the component supply device 4 with the suction nozzle 5 and mounts the component C on the substrate P. The mounting head 6 has a plurality of suction nozzles 5. The mounting head 6 can move between the supply area SM where the component C is supplied and the mounting area DM where the substrate P is arranged. The supply area SM and the mounting area DM are defined at different positions in the XgYg plane. The mounting head 6 holds the component C supplied to the supply area SM with the suction nozzle 5, and after moving to the mounting area DM, mounts the component C on the substrate P arranged in the mounting area DM.

[0033] The head moving device 7 can move the mounting head 6 along the Xg axis direction, the Yg axis direction, and the Zg axis direction respectively. The head moving device 7 has an Xg axis moving device 71 that moves the mounting head 6 along the Xg axis direction, a Yg axis moving device 72 that moves the mounting head 6 along the Yg axis direction, and a Zg axis moving device 73 that moves the mounting head 6 along the Zg axis direction.

[0034] The Zg axis moving device 73 is connected to the mounting head 6. By driving the Zg axis moving device 73, the mounting head 6 moves along the Zg axis direction. The Xg axis moving device 71 is connected to the mounting head 6 via the Zg axis moving device 73. By driving the Xg axis moving device 71, the Zg axis moving device 73 moves along the Xg axis direction, so that the mounting head 6 moves along the Xg axis direction. The Yg axis moving device 72 is connected to the mounting head 6 via the Xg axis moving device 71 and the Zg axis moving device 73. By driving the Yg axis moving device 72, the Xg axis moving device 71 moves along the Yg axis direction, so that the mounting head 6 moves along the Yg axis direction.

[0035] In an embodiment, the Yg-axis moving device 72 includes: support columns 72P respectively disposed at four corner portions of the base member 2; a Yg-axis guide member 72G supported by the support columns 72P; a Yg-axis sliding member 72S guided by the Yg-axis guide member 72G; and a Yg-axis actuator 72D that generates power to move the Yg-axis sliding member 72S in the Yg-axis direction. The Yg-axis guide member 72G is supported by two support columns 72P disposed along the Yg-axis direction. The Yg-axis guide member 72G extends along the Yg-axis direction. A pair of Yg-axis guide members 72G are provided. The Yg-axis guide member 72G guides the Yg-axis sliding member 72S in the Yg-axis direction. The Yg-axis sliding member 72S extends along the Xg-axis direction. The +Xg side end portion of the Yg-axis sliding member 72S is guided by one of the Yg-axis guide members 72G. The -Xg side end portion of the Yg-axis sliding member 72S is guided by the other Yg-axis guide member 72G. The Yg-axis actuator 72D is disposed on the Yg-axis sliding member 72S.

[0036] The Xg-axis moving device 71 includes: an Xg-axis sliding member 71S guided by the Yg-axis sliding member 72S; and an Xg-axis actuator 71D that generates power to move the Xg-axis sliding member 71S in the Xg-axis direction. The Yg-axis sliding member 72S guides the Xg-axis sliding member 71S in the Xg-axis direction. The Xg-axis actuator 71D is disposed on the Xg-axis sliding member 71S.

[0037] The Zg-axis moving device 73 includes: a Zg-axis guide member 73G supported by the Xg-axis sliding member 71S; and a Zg-axis actuator 73D that generates power to move the mounting head 6 in the Zg-axis direction. The Zg-axis guide member 73G guides the mounting head 6 in the Zg-axis direction. The Zg-axis actuator 73D is disposed on the mounting head 6.

[0038] The mounting head 6 can move between the supply area SM and the mounting area DM by the head moving device 7.

[0039] The nozzle 5 can releasably hold the component C. The nozzle 5 is a suction nozzle that adsorbs and holds the component C. An opening is provided at the front end portion of the nozzle 5. The opening of the nozzle 5 is connected to a vacuum system. In a state where the front end portion of the nozzle 5 is in contact with the component C, by performing a suction operation from the opening provided at the front end portion of the nozzle 5, the component C is adsorbed and held at the front end portion of the nozzle 5. By releasing the suction operation from the opening, the component C is released from the nozzle 5. Additionally, the nozzle 5 can be a gripping nozzle that grip-holds the component C.

[0040] [Mounting head]

[0041] Figure 3 is a perspective view showing the mounting head 6 of the embodiment. Figure 4This is a side view of the mounting head 6 showing an embodiment. In the embodiment, the mounting head 6 is of the turret type. As Figure 1 , Figure 3 and Figure 4 shown, the mounting head 6 has: a housing 61 connected to the Zg-axis moving device 73; a rotor shaft 62 supported by at least a part of the housing 61; and a turret 63 supported by the housing 61 via the rotor shaft 62.

[0042] The turret 63 supports a plurality of suction nozzles 5. The turret 63 rotates about the rotation axis AX. The rotation axis AX is inclined with respect to the Zg axis. The plurality of suction nozzles 5 are arranged at intervals on the peripheral portion of the turret 63. By rotating the turret 63 about the rotation axis AX, the plurality of suction nozzles 5 revolve around the rotation axis AX.

[0043] The suction nozzle 5 can move axially with respect to the turret 63 along a direction parallel to a specified drive axis. In addition, the suction nozzle 5 can move in a rotational direction about the drive axis. In the embodiment, the drive axis of the suction nozzle 5 is appropriately referred to as the Zc axis, the direction parallel to the Zc axis is appropriately referred to as the Zc-axis direction, and the rotational direction about the Zc axis is appropriately referred to as the θZc direction.

[0044] In addition, the first axis extending along the first direction of a specified plane orthogonal to the Zc axis is appropriately referred to as the Xc axis, the direction parallel to the Xc axis is appropriately referred to as the Xc-axis direction, and the rotational direction about the Xc axis is appropriately referred to as the θXc direction. In addition, the second axis extending along the second direction of a specified plane orthogonal to the first direction is appropriately referred to as the Yc axis, the direction parallel to the Yc axis is appropriately referred to as the Yc-axis direction, and the rotational direction about the Yc axis is appropriately referred to as the θYc direction. In addition, the revolving direction about the rotation axis AX is appropriately referred to as the revolving direction of the rotation axis AX.

[0045] The suction nozzle moving device 8 can move the suction nozzle 5 in the revolving direction of the rotation axis AX, the Zc-axis direction, and the θZc direction, respectively. The suction nozzle moving device 8 has: a revolving device 81 that moves the suction nozzle 5 in the revolving direction of the rotation axis AX; a Zc-axis moving device 82 that moves the suction nozzle 5 in the Zc-axis direction; and a θZc moving device 83 that moves the suction nozzle 5 in the θZc direction.

[0046] The revolving device 81 includes an actuator that generates power to rotate the turret 63 about the rotation axis AX. The revolving device 81 is connected to the rotor shaft 62. The revolving device 81 rotates the rotor shaft 62 to rotate the turret 63. The turret 63 rotates inside the housing 61. If the turret 63 rotates about the rotation axis AX, the plurality of suction nozzles 5 revolve around the rotation axis AX.

[0047] The Zc-axis moving device 82 is respectively provided on a plurality of suction nozzles 5. The Zc-axis moving device 82 includes an actuator that generates power to move the suction nozzle 5 along the Zc-axis direction. At least a part of the Zc-axis moving device 82 is disposed on the turret 63. The plurality of suction nozzles 5 can move along the Zc-axis direction respectively.

[0048] The θZc moving device 83 includes an actuator that generates power to move the suction nozzle 5 along the θZc direction. At least a part of the θZc moving device 83 is disposed on the turret 63. In the embodiment, the plurality of suction nozzles 5 move synchronously with the θZc direction.

[0049] The suction nozzle 5 can move along the Xg-axis direction, Yg-axis direction, Zg-axis direction, the turning direction of the rotating AX, Zc-axis direction, and θZc direction respectively through the head moving device 7 and the suction nozzle moving device 8.

[0050] In the embodiment, the drive shafts of a pair of adjacent suction nozzles 5 are parallel. A pair of suction nozzles 5 with parallel drive shafts constitute one suction nozzle unit 50. In one suction nozzle unit 50, the pair of suction nozzles 5 can move along the Zc-axis direction simultaneously. In the embodiment, 16 suction nozzles 5 are provided on the turret 63. 8 suction nozzle units 50 are provided.

[0051] [Imaging device]

[0052] As Figure 4 shown, the mounting head 6 has an imaging device 10 for imaging the component C held by the suction nozzle 5. In the embodiment, the imaging device 10 includes a first imaging device 11 disposed in the Zc-axis direction with respect to the suction nozzle 5, and a second imaging device 12 disposed in the Xc-axis direction with respect to the suction nozzle 5. The first imaging device 11 and the second imaging device 12 are respectively supported by the housing 61.

[0053] The first imaging device 11 images the component C held by the suction nozzle 5 from the Zc-axis direction. In the embodiment, a reflecting mirror 20 is disposed between the suction nozzle 5 and the optical path of the first imaging device 11. The first imaging device 11 images the component C held by the suction nozzle 5 from the Zc-axis direction via the reflecting mirror 20. The reflecting mirror 20 is supported by the housing 61. The reflecting mirror 20 is disposed below the first imaging device 11. The optical axis OX1 of the optical system of the first imaging device 11 is parallel to the reflection axis of the Zc-axis reflected by the reflecting mirror 20. In addition, the first imaging device 11 can image the component C held by the suction nozzle 5 from the Zc-axis direction without passing through the reflecting mirror 20.

[0054] The second imaging device 12 images the component C held by the suction nozzle 5 from the Xc-axis direction. The optical axis OX2 of the optical system of the second imaging device 12 is parallel to the Xc-axis. In addition, the second imaging device 12 can image the component C held by the suction nozzle 5 from the Xc-axis direction via a reflecting mirror.

[0055] Figure 5 This is a schematic diagram of the imaging device 10 showing an embodiment. As Figure 5 shown, the first imaging device 11 is arranged in the Zc-axis direction with respect to the suction nozzle 5. The second imaging device 12 is arranged in the Xc-axis direction with respect to the suction nozzle 5. In Figure 5 the example shown, the first imaging device 11 is arranged at a position in the -Zc direction (substantially downward) relative to the suction nozzle 5. The second imaging device 12 is arranged laterally of the suction nozzle 5.

[0056] The first imaging device 11 acquires an image of the component C held by the suction nozzle 5 as viewed from the Zc-axis direction. In the embodiment, the first imaging device 11 captures the component C held by the suction nozzle 5 from the -Zc direction (substantially downward). The optical axis OX1 of the optical system of the first imaging device 11 in the component C is parallel to the Zc axis.

[0057] The second imaging device 12 acquires an image of the component C held by the suction nozzle 5 as viewed from the Xc-axis direction. In the embodiment, the second imaging device 12 captures the component C held by the suction nozzle 5 from the -Xc direction. The optical axis OX2 of the optical system of the second imaging device 12 in the component C is parallel to the Xc axis.

[0058] In the embodiment, the component C is in the shape of a rectangular parallelepiped. The component C has an upper surface Ct facing the +Zc direction, a lower surface Cz facing the -Zc direction, a pair of first side surfaces Cx facing the Xc-axis direction, and a pair of second side surfaces Cy facing the Yc-axis direction. The first side surface Cx is orthogonal to the second side surface Cy. The first side surface Cx is orthogonal to the upper surface Ct. The second side surface Cy is orthogonal to the upper surface Ct. The first side surface Cx is orthogonal to the lower surface Cz. The second side surface Cy is orthogonal to the lower surface Cz.

[0059] The suction nozzle 5 holds the upper surface Ct of the component C. The first imaging device 11 captures the lower surface Cz of the component C. The image of the component C acquired by the first imaging device 11 as viewed from the Zc-axis direction is an image including the lower surface Cz of the component C.

[0060] The second imaging device 12 captures the first side surface Cx of the component C. The image of the component C acquired by the second imaging device 12 as viewed from the Xc-axis direction is an image including the first side surface Cx of the component C.

[0061] The second photographing device 12 photographs the second side surface Cy of the component C. In the embodiment, the suction nozzle 5 rotates in the θZc direction so that the second photographing device 12 faces the second side surface Cy of the component C. That is, when the second photographing device 12 photographs the second side surface Cy of the component C, the suction nozzle 5 rotates 90 degrees, which is the angle formed by the Xc axis direction and the Yc axis direction, in the θZc direction, so that the second photographing device 12 faces the second side surface Cy of the component C. Thereby, the second photographing device 12 can photograph the component C held by the suction nozzle 5 substantially from the Yc axis direction. The image of the component C obtained in the state where the second photographing device 12 faces the second side surface Cy of the component C can be regarded as the image of the component C observed from the Yc axis direction. The image of the component C obtained by the second photographing device 12 from the Yc axis direction is an image including the second side surface Cy of the component C.

[0062] In addition, when the second photographing device 12 photographs the second side surface Cy of the component C, the suction nozzle 5 may not rotate, but the second photographing device 12 may be moved to face the second side surface Cy of the component C. When the second photographing device 12 photographs the second side surface Cy of the component C, the suction nozzle 5 may be rotated and the second photographing device 12 may be moved so that the second photographing device 12 faces the second side surface Cy of the component C.

[0063] [Operation of the mounting head]

[0064] Figure 6 This is a diagram for explaining the operation of the mounting head 6 of the embodiment. The rotation axis AX of the turret 63 is inclined with respect to the Zg axis. When the turret 63 rotates, the suction nozzle 5 moves along the Zg axis direction (vertical direction) while revolving around the rotation axis AX. As Figure 4 and Figure 6 shown, when the suction nozzle 5 is arranged at the first position LP in the circumferential direction of the rotation axis AX, it is arranged at the lowest position in the revolving path. When the suction nozzle 5 is arranged at the second position TP in the circumferential direction of the rotation axis AX, it is arranged at the highest position in the revolving path. The first position LP and the second position TP are opposed to each other in the radial direction of the rotation axis AX.

[0065] The drive shaft of the suction nozzle 5 arranged at the first position LP is parallel to the Zg axis. The drive shaft of the suction nozzle 5 arranged at the second position TP is inclined with respect to the Zg axis.

[0066] As Figure 6As shown in (A) of FIG. , when the nozzle 5 is disposed at the first position LP, the component C supplied from the component supply device 4 to the supply area SM is held. The drive shaft of the nozzle 5 disposed at the first position LP is parallel to the Zg axis. The nozzle 5 can hold the component C disposed in the supply area SM by moving in the Zc axis direction. In the embodiment, a pair of nozzles 5 of one nozzle unit 50 can respectively acquire two components C from the component supply device 4 at the same time. That is, a pair of nozzles 5 of one nozzle unit 50 can respectively adsorb the component C at the same time.

[0067] As Figure 6 shown in (B) of FIG. , when the nozzle 5 is disposed at the second position TP, the imaging device 10 images the component C held by the nozzle 5. The imaging device 10 images the component C before being supplied to the supply area SM and mounted on the substrate P.

[0068] As Figure 6 shown in (C) of FIG. , when the nozzle 5 is disposed at the first position LP, the component C is mounted on the substrate P disposed in the mounting area DM. The drive shaft of the nozzle 5 disposed at the first position LP is parallel to the Zg axis. The nozzle 5 can mount the component C on the substrate P by moving in the Zc axis direction.

[0069] [Control device]

[0070] Figure 7 is a functional block diagram showing the control device 9 of the embodiment. The control device 9 includes a computer system. In the embodiment, controlling the mounting head 6 includes controlling the head moving device 7. Controlling the nozzle 5 includes controlling the nozzle moving device 8.

[0071] The control device 9 has a first imaging control unit 91, a second imaging control unit 92, an image processing unit 93, a nozzle control unit 94, a mounting control unit 95, an angle calculation unit 96, a correction amount calculation unit 97, an angle determination unit 98, and a threshold storage unit 99.

[0072] The first imaging control unit 91 controls the first imaging device 11. The first imaging control unit 91 controls the first imaging device 11 so as to acquire an image of the component C held by the nozzle 5 as viewed from the Zc axis direction.

[0073] The second imaging control unit 92 controls the second imaging device 12. The second imaging control unit 92 controls the second imaging device 12 so as to acquire an image of the component C held by the nozzle 5 as viewed from the Xc axis direction and an image as viewed from the Yc axis direction. In the embodiment, the second imaging control unit 92 controls the nozzle 5 during imaging of the component C. As referred to Figure 5As described, the second shooting control unit 92 rotates the suction nozzle 5 by an angle of 90 degrees between the Xc axis direction and the Yc axis direction, and controls the second shooting device 12 to obtain an image of the component C observed from the Xc axis direction and an image observed from the Yc axis direction.

[0074] The image processing unit 93 processes the image of the component C captured by the imaging device 10. The image processing unit 93 performs edge extraction as the image processing, for example.

[0075] Figure 8 1 is a diagram for explaining the processing of the image processing unit 93 according to the embodiment. Figure 8 As shown in FIG. 1 (A), the upper surface Ct of the component C is held by the suction nozzle 5 . Figure 8 (A) shows a state where the component C is properly held by the suction nozzle 5. The state where the component C is properly held by the suction nozzle 5 means that the suction nozzle 5 sucks the center portion of the upper surface Ct of the component C so that the upper surface Ct is substantially perpendicular to the Zc axis.

[0076] The first imaging device 11 captures the component C held by the nozzle 5. Figure 8 As shown in FIG. 1B , the image of the component C obtained by the first imaging device 11 as viewed from the Zc-axis direction includes the lower surface Cz of the component C. FIG.

[0077] like Figure 8 As shown in (B), the image processing unit 93 extracts the edge of the image of the lower surface Cz of the component C and calculates the outer edge line Le of the component C. In addition, the image processing unit 93 calculates the center line Lx and the center line Ly of the component C based on the outer edge line Le. The center line Lx is a line passing through the center of the first side surface Cx on one side and the center of the first side surface Cx on the other side. The center line Ly is a line passing through the center of the second side surface Cy on one side and the center of the second side surface Cy on the other side. Figure 8 As shown in (B), when the component C is appropriately held by the suction nozzle 5, the center line Lx is parallel to the Yc axis, and the center line Ly is parallel to the Xc axis.

[0078] The nozzle control unit 94 controls the nozzle 5. In the embodiment, the nozzle control unit 94 controls the nozzle 5 so as to adjust the position of the component C in the θZc direction based on the image of the component C viewed from the Zc axis direction acquired by the first imaging device 11.

[0079] Figure 9 It is a diagram for explaining the processing of the nozzle control unit 94 according to the embodiment. Figure 9 (A) shows a state where the component C is held by the suction nozzle 5 in an inclined state.

[0080] The first imaging device 11 captures the component C held by the nozzle 5.Figure 9 As shown in (B) of FIG. 1, the image of component C taken by the first imaging device 11 as viewed from the Zc-axis direction is an image including the lower surface Cz of component C.

[0081] As Figure 9 shown in (B) of FIG. 1, the image processing unit 93 calculates the outer edge line Le, the center line Lx, and the center line Ly based on the image of component C in the Zc-axis direction. As Figure 9 shown in (B) of FIG. 1, when component C is held by the suction nozzle 5 in an inclined state, it is possible that the center line Lx is inclined with respect to the Yc-axis and the center line Ly is inclined with respect to the Xc-axis.

[0082] As Figure 9 shown in (C) of FIG. 1, the suction nozzle control unit 94 adjusts the position of component C in the θZc direction based on the image including the lower surface Cz so that the first side surface Cx of component C faces the Xc-axis direction. That is, the suction nozzle control unit 94 rotates the suction nozzle 5 holding component C along the θZc direction based on the image including the lower surface Cz so that the center line Ly is parallel to the Xc-axis. By making the first side surface Cx of component C face the Xc-axis direction, the second side surface Cy faces the Yc-axis direction. The center line Lx is parallel to the Xy-axis.

[0083] After the suction nozzle control unit 94 adjusts the position of component C in the θZc direction, the second imaging control unit 92 controls the second imaging device 12 to obtain an image of component C as viewed from the Xc-axis direction and an image as viewed from the Yc-axis direction.

[0084] Figure 10 And Figure 11 are respectively diagrams showing the images of component C taken by the second imaging device 12 of the embodiment. Figure 10 Shows the image of component C as viewed from the Xc-axis direction. Figure 11 Shows the image of component C as viewed from the Yc-axis direction.

[0085] As Figure 10 shown, the image of component C as viewed from the Xc-axis direction is an image including the first side surface Cx. The position of component C in the θZc direction is adjusted so that the first side surface Cx of component C faces the Xc-axis direction. Therefore, as Figure 10 shown, the image of component C as viewed from the Xc-axis direction substantially only includes the first side surface Cx.

[0086] The image processing unit 93 performs edge extraction on the image of the first side surface Cx of component C and calculates the outer edge line Le of component C. In addition, the image processing unit 93 calculates the center line Ly and the center line Lz of component C based on the outer edge line Le. The center line Lx is the line passing through the centers of the upper surface Ct and the lower surface Cz.

[0087] AsFigure 11 As shown, the image of component C taken from the Yc-axis direction is an image including the second side surface Cy. Adjust the position of component C in the θZc direction so that the second side surface Cy of component C faces the Yc-axis direction. Therefore, as Figure 11 shown, the image of component C viewed from the Yc-axis direction substantially includes only the second side surface Cy.

[0088] The image processing unit 93 extracts the edge of the image of the second side surface Cy of component C and calculates the outer edge line Le of component C. In addition, the image processing unit 93 calculates the center line Lx and the center line Lz of component C based on the outer edge line Le.

[0089] The angle calculation unit 96 calculates the angle θ of component C based on the image of component C viewed from the Xc-axis direction and the image viewed from the Yc-axis direction. In the embodiment, the angle calculation unit 96 calculates the angle θ of component C with respect to the XcYc plane.

[0090] As Figure 10 shown, the angle θ of component C includes a first angle θx in the YcZc plane orthogonal to the Xc-axis direction. In addition, as Figure 11 shown, the angle θ of component C includes a second angle θy in the ZcXc plane orthogonal to the Yc-axis direction. The angle calculation unit 96 calculates the first angle θx of component C with respect to the XcYc plane based on the image of component C viewed from the Xc-axis direction. The angle calculation unit 96 calculates the second angle θy of component C with respect to the XcYc plane based on the image of component C viewed from the Yc-axis direction. The first angle θx can be the angle formed by the center line Lz set on the first side surface Cx and the XcYc plane. The second angle θy can be the angle formed by the center line Lz set on the second side surface Cy and the XcYc plane.

[0091] The mounting control unit 95 controls the mounting head 6 based on the angle θ of component C calculated by the angle calculation unit 96 so as to mount component C on the target mounting position MP of the substrate P.

[0092] Figure 12 And Figure 13 are respectively diagrams for explaining the operation of the mounting head 6 of the embodiment.

[0093] Figure 12 Shows a state where component C is mounted on the substrate P in a state of being properly held by the suction nozzle 5. In a state where component C is properly held by the suction nozzle 5, the mounting control unit 95 lowers the suction nozzle 5 in the -Zg direction in a state where the central axis NX of the suction nozzle 5 coincides with the central position MX of the target mounting position MP, so that component C can be mounted on the target mounting position MP of the substrate P.

[0094] Figure 13It shows a state where component C is held obliquely by nozzle 5 and is being mounted on substrate P. In the state where component C is held obliquely by nozzle 5, if the mounting control unit 95 lowers nozzle 5 in the -Zg direction with the central axis NX of nozzle 5 aligned with the central position MX of the target mounting position MP, component C cannot be mounted on the target mounting position MP of substrate P. As Figure 13 shown, if nozzle 5 is lowered with component C in an inclined state, the corner at the lower end of component C first contacts the surface of substrate P. The position of the corner of component C is different from the position of the peripheral portion of the target mounting position MP. After the corner of component C contacts the surface of substrate P, if the holding of component C by nozzle 5 is released, component C falls down such that the lower surface Cz of component C contacts the surface of substrate P. As a result, as Figure 13 shown, component C is mounted at a position deviated from the target mounting position MP.

[0095] In the embodiment, in the state where component C is held obliquely by nozzle 5, the mounting control unit 95 adjusts the position of the mounting head 6 in the XgYg plane based on the angle θ of component C calculated by the angle calculation unit 96 so as to mount component C on the target mounting position MP of substrate P, thereby mounting component C on substrate P.

[0096] The correction amount calculation unit 97 calculates a correction amount Rc related to the position of the mounting head 6 when mounting component C on substrate P based on the angle θ of component C calculated by the angle calculation unit 96 and the target mounting position MP of substrate P. The correction amount Rc calculated by the correction amount calculation unit 97 is a correction amount related to the position of the mounting head 6 in the XgYg plane.

[0097] The correction amount Rc includes Figure 13 the deviation amount Rd of component C from the target mounting position MP shown. That is, the correction amount Rc includes the deviation amount Rd of component C predicted when releasing component C that is in contact with substrate P in a state inclined at the angle θ calculated by the angle calculation unit 96 from nozzle 5.

[0098] The correction amount Rc calculated by the correction amount calculation unit 97 includes a first correction amount Rcy calculated based on the first angle θx and the target mounting position MP, and a second correction amount Rcx calculated based on the second angle θy and the target mounting position MP. The first correction amount Rcy is a correction amount related to the position of the mounting head 6 in the Yg-axis direction at the first position LP. The second correction amount Rcx is a correction amount related to the position of the mounting head 6 in the Xg-axis direction at the first position LP.

[0099] The position and angle of the XgYgZg rectangular coordinate system are correlated with the position and angle of the XcYcZc rectangular coordinate system. The angle θ of the component C and the correction amount calculated at the second position TP have the same meaning as the angle θ of the component C and the correction amount at the first position LP. The correction amount calculation unit 97 can calculate the first correction amount Rcy related to the position of the mounting head 6 in the Yg-axis direction at the first position LP based on the first angle θx and the target mounting position MP calculated at the second position TP. The correction amount calculation unit 97 can calculate the second correction amount Rcx related to the position of the mounting head 6 in the Xg-axis direction at the first position LP based on the second angle θy and the target mounting position MP calculated at the second position TP.

[0100] Figure 14 This is a diagram for explaining the processing of the correction amount calculation unit 97 of the embodiment. Refer to Figure 14 An example of a method for calculating the first correction amount Rcy based on the first angle θx will be described.

[0101] Let the dimension of the component C in the Xg-axis direction be X, the dimension of the component C in the Yg-axis direction be Y, and the dimension of the component C in the Zg-axis direction be Z. The dimension X, the dimension Y, and the dimension Z are known data derived from various factors of the component C. When the angle calculation unit 96 calculates that the component C is tilted at the first angle θx, the correction amount calculation unit 97 calculates the first correction amount Rcy based on the following formula (1).

[0102] Rcy = (Y / 2) - [(Y / 2)·cosθx] + [(Z / 2)·sinθx] …… (1)

[0103] In addition, in the XgYg plane, sometimes the position of the component C deviates from the target mounting position MP. The correction amount calculation unit 97 calculates the correction amount Rb related to the deviation amount of the position of the component C in the XgYg plane. For example, as Figure 14 shown, when the correction amount related to the deviation amount of the center OP of the component C and the front end of the nozzle 5 in the Yg-axis direction is set as Rby, the overall correction amount Ry in the Yg-axis direction is [Rcy + Rby].

[0104] In addition, although not shown in the figure, when the angle calculation unit 96 calculates that the component C is tilted at the second angle θy, the correction amount calculation unit 97 can calculate the second correction amount Rcx based on the following formula (2).

[0105] Rcx = (X / 2) - [(X / 2)·cosθy] + [(Z / 2)·sinθy] …… (2)

[0106] In addition, when the correction amount related to the deviation amount in the Xg-axis direction between the center OP of the component C and the tip of the nozzle 5 is set as Rbx, the overall correction amount Rx in the Xg-axis direction is [Rcx + Rbx].

[0107] The mounting control unit 95 controls the mounting head 6 based on the correction amount R (Rx, Ry) calculated by the correction amount calculation unit 97. That is, the mounting control unit 95 mounts the component C on the substrate P in a state where the position of the mounting head 6 is adjusted based on the correction amount R (Rx, Ry) calculated by the correction amount calculation unit 97. In the embodiment, the mounting control unit 95 mounts the component C on the substrate P in a state where the position of the mounting head 6 in the Xg-axis direction is adjusted based on the correction amount Rx and the position of the mounting head 6 in the Yg-axis direction is adjusted based on the correction amount Ry.

[0108] The threshold storage unit 99 stores a first threshold S1 related to the angle θ of the component C and a second threshold S2 larger than the first threshold S1. The first threshold S1 and the second threshold S2 are respectively predetermined values.

[0109] The angle determination unit 98 determines the relationship between the angle θ of the component C calculated by the angle calculation unit 96 and each of the first threshold S1 and the second threshold S2 stored in the threshold storage unit 99.

[0110] The mounting control unit 95 controls the mounting head 6 based on the determination result of the angle determination unit 98.

[0111] Figure 15 It is a schematic diagram showing the relationship between the determination result of the angle determination unit 98 of the embodiment and the processing of the mounting control unit 95.

[0112] As Figure 15 shown, when it is determined that the angle θ is below the first threshold S1, the mounting control unit 95 controls the mounting head 6 without relying on the correction amount R (Rx, Ry) to mount the component C on the substrate P. In the embodiment, when it is determined that the angle θ is below the first threshold S1, the correction amount calculation unit 97 does not perform the calculation process of the correction amount R (Rx, Ry). The angle θ being below the first threshold S1 can be regarded as a state where the component C is properly held by the nozzle 5. Therefore, when it is determined that the angle θ is below the first threshold S1, the mounting control unit 95 controls the mounting head 6 without relying on the correction amount R (Rx, Ry) to mount the component C on the substrate P.

[0113] As Figure 15 shown, when it is determined that the angle θ exceeds the first threshold S1 and is below the second threshold S2, the mounting control unit 95 controls the mounting head 6 based on the correction amount R (Rx, Ry) calculated by the correction amount calculation unit 97 to mount the component C on the substrate P.

[0114] As Figure 15 shown, when it is determined that the angle θ exceeds the second threshold value S2, the mounting control unit 95 controls the mounting head 6 so as not to mount the component C on the substrate P. In the embodiment, the mounting control unit 95 controls the mounting head 6 so as to discard the component C into a specified discard box. The situation where the angle θ exceeds the second threshold value S2 can be regarded as a state where the component C is not properly held by the suction nozzle 5 and the component C cannot be properly mounted on the substrate P even with the use of the correction amounts R (Rx, Ry). Therefore, when it is determined that the angle θ exceeds the second threshold value S2, the mounting control unit 95 controls the mounting head 6 so as not to mount the component C on the substrate P.

[0115] [Component Mounting Method]

[0116] Figure 16 is a flowchart showing the component mounting method of the embodiment. The mounting control unit 95 moves the mounting head 6 to the supply area SM. The suction nozzle control unit 94 causes the suction nozzle 5 to hold the upper surface Ct of the component C supplied to the supply area SM. The component C is held by the suction nozzle 5 disposed at the first position LP (step ST1).

[0117] The suction nozzle control unit 94 rotates the turret 63 to move the suction nozzle 5 holding the component C to the second position TP. The first imaging control unit 91 causes the first imaging device 11 to image the lower surface Cz of the component C held by the suction nozzle 5. The first imaging device 11 images the lower surface Cz of the component C held by the suction nozzle 5 from the Zc-axis direction (step ST2).

[0118] The image processing unit 93 processes the image of the component C imaged by the first imaging device 11. The suction nozzle control unit 94 rotates the suction nozzle 5 based on the image processing result of the image processing unit 93 so that the first side surface Cx of the component C is orthogonal to the Xc-axis direction. By rotating the suction nozzle 5, the component C rotates so that the first side surface Cx faces the second imaging device 12 (step ST3).

[0119] The second imaging control unit 92 causes the second imaging device 12 to image the first side surface Cx of the component C held by the suction nozzle 5. The second imaging device 12 images the first side surface Cx of the component C facing the Xc-axis direction from the Xc-axis direction (step ST4).

[0120] The second imaging control unit 92 rotates the suction nozzle 5 so that the second side surface Cy of the component C held by the suction nozzle 5 is orthogonal to the Xc-axis direction. By rotating the suction nozzle 5, the component C rotates so that the second side surface Cy faces the second imaging device 12.

[0121] The second shooting control unit 92 causes the second shooting device 12 to shoot the second side surface Cy of the component C held by the suction nozzle 5. The second shooting device 12 shoots the second side surface Cy of the component C facing the Xc-axis direction from the Xc-axis direction. Thus, the second shooting device 12 shoots the second side surface Cy of the component C facing the Yc-axis direction from the Yc-axis direction (step ST5).

[0122] The angle calculation unit 96 calculates the first angle θx of the component C in the YcZc plane orthogonal to the Xc-axis direction based on the image of the first side surface Cx captured in step ST4. In addition, the angle calculation unit 96 calculates the second angle θy of the component C in the ZcXc plane orthogonal to the Yc-axis direction based on the image of the second side surface Cy captured in step ST5 (step ST6).

[0123] The angle determination unit 98 determines whether at least one of the first angle θx and the second angle θy calculated in step ST6 exceeds the first threshold S1 (step ST7).

[0124] In step ST7, when it is determined that at least one of the first angle θx and the second angle θy exceeds the first threshold S1 (step ST7: YES), the angle determination unit 98 determines whether at least one of the first angle θx and the second angle θy determined to exceed the first threshold S1 is below the second threshold S2 (step ST8).

[0125] In step ST8, when it is determined that at least one of the first angle θx and the second angle θy exceeds the first threshold S1 and is below the second threshold S2 (step ST8: YES), the correction amount calculation unit 97 calculates the first correction amount Rcy related to the position of the suction nozzle 5 in the Yc-axis direction (Yg-axis direction) when the component C is mounted on the substrate P based on the first angle θx and the target mounting position MP of the component C. In addition, the correction amount calculation unit 97 calculates the second correction amount Rcx related to the position of the suction nozzle 5 in the Xc-axis direction (Xg-axis direction) when the component C is mounted on the substrate P based on the second angle θy and the target mounting position MP of the component C (step ST9).

[0126] As described above, the positions and angles in the XgYgZg rectangular coordinate system and the positions and angles in the XcYcZc rectangular coordinate system are correlated with each other. The significance of calculating the first correction amount Rcy related to the position of the suction nozzle 5 in the Yc-axis direction is the same as the significance of calculating the first correction amount Rcy related to the position in the Yg-axis direction at the first position LP. The significance of calculating the second correction amount Rcx related to the position of the suction nozzle 5 in the Xc-axis direction is the same as the significance of calculating the second correction amount Rcx related to the position in the Xg-axis direction at the first position LP.

[0127] The mounting control unit 95 adjusts the position of the mounting head 6 including the nozzle 5 in the XgYg plane based on the first correction amount Rcy and the second correction amount Rcx calculated in step ST9, and mounts the component C on the substrate P (step ST10).

[0128] In step ST7, when it is determined that both the first angle θx and the second angle θy are below the first threshold value S1 (step ST7: No), the mounting control unit 95 controls the mounting head 6 without based on the correction amount to mount the component C on the substrate P (step ST11).

[0129] In step ST8, when it is determined that at least one of the first angle θx and the second angle θy exceeds the second threshold value S2 (step ST8: No), the mounting control unit 95 controls the mounting head 6 so as not to mount the component C on the substrate P (step ST12).

[0130] [Computer System]

[0131] Figure 17 It is a block diagram of the computer system 1000 showing the embodiment. The above control device 9 includes the computer system 1000. The computer system 1000 has: a processor 1001 such as a CPU (Central Processing Unit); a main memory 1002 including a non-volatile memory such as a ROM (Read Only Memory) and a volatile memory such as a RAM (Random Access Memory); a memory 1003; and an interface 1004 including an input / output circuit. The functions of the control device 9 are stored in the memory 1003 as a computer program. The processor 1001 reads the computer program from the memory 1003 and expands it in the main memory 1002, and executes the above processing according to the computer program. In addition, the computer program can also be distributed to the computer system 1000 via a network.

[0132] The computer program can execute the following according to the above embodiment:

[0133] Hold the upper surface Ct of the component C with the nozzle 5 that can move in the axial direction parallel to the drive shaft and in the rotational direction centered on the drive shaft;

[0134] Take a picture of the lower surface Cz of the component C held by the nozzle 5;

[0135] Rotate the component C based on the image of the lower surface Cz so that the first side surface Cx of the component C is orthogonal to the first direction;

[0136] Take a picture of the first side surface Cx facing the first direction;

[0137] Photograph the second side Cy in the second direction orthogonal to the first direction of the photographing member C;

[0138] Calculate the first angle θx of the member C in the first plane orthogonal to the first direction based on the image of the first side Cx;

[0139] Calculate the second angle θy of the member C in the second plane orthogonal to the second direction based on the image of the second side Cy;

[0140] Based on the first angle θx and the target mounting position MP of the member C, calculate the first correction amount Rcy related to the position of the nozzle 5 in the second direction when mounting the member C on the substrate P;

[0141] Based on the second angle θy and the target mounting position MP of the member C, calculate the second correction amount Rcx related to the position of the nozzle 5 in the first direction when mounting the member C on the substrate P;

[0142] Adjust the position of the nozzle 5 based on the first correction amount Rcy and the second correction amount Rcx, and mount the member C on the substrate P.

[0143] [Effect]

[0144] As described above, according to the embodiment, the member C before being mounted on the substrate P is photographed while being held by the nozzle 5. An image of the member C viewed from the Zc-axis direction is obtained, and thus, the angle of the member C in the θZc direction can be recognized. After adjusting the angle of the member C in the θZc direction based on the image of the member C viewed from the Zc-axis direction, an image of the member C viewed from the Xc-axis direction and an image of the member C viewed from the Yc-axis direction are obtained. Therefore, the first angle θx and the second angle θy of the member C can be calculated with high precision. Therefore, the posture of the member C before being mounted on the substrate P can be appropriately recognized. Since the posture of the member C before being mounted on the substrate P is appropriately recognized, the component mounting device 1 can mount the member C on the target mounting position MP of the substrate P.

[0145] Based on the first angle θx, the second angle θy, and the target mounting position MP, calculate the correction amount Rc (Rcx, Rcy) related to the position of the mounting head 6 when mounting the member C. Thereby, the mounting control unit 95 can mount the member C on the target mounting position MP of the substrate P based on the correction amount Rc.

[0146] As referred to Figure 13As described, after the component C in the tilted state at an angle θ contacts the substrate P, if the holding of the component C by the suction nozzle 5 is released, the component C is mounted on the substrate P in a state deviated from the target mounting position MP. As shown in equations (1) and (2), the correction amount Rc (Rcx, Rcy) includes the deviation amount Rd of the component C from the target mounting position MP predicted when releasing the component C in the tilted state at an angle θ that contacts the substrate P. The mounting control unit 95 mounts the component C on the substrate P based on the correction amount Rc, thereby enabling the component C to be mounted at the target mounting position MP on the substrate P.

[0147] The correction amount Rc includes a first correction amount Rcy related to the Xc-axis direction (Xg-axis direction) calculated based on the first angle θx, and a second correction amount Rcx related to the Yc-axis direction (Yg-axis direction) calculated based on the second angle θy. Thereby, the component C can be made to coincide with the target mounting position MP in the Xg-axis direction and the Yg-axis direction, respectively.

[0148] When it is determined that the angle θ of the component C is equal to or less than the first threshold S1, it is regarded that the component C is properly held by the suction nozzle 5, and the component C is mounted on the substrate P without performing the calculation process of the correction amount Rc. When it is determined that the angle θ of the component C exceeds the first threshold S1 and is equal to or less than the second threshold S2, the component C is mounted on the substrate P based on the correction amount Rc. Thereby, the component C can be efficiently mounted on the substrate P. When it is determined that the angle θ of the component C exceeds the second threshold S2, the component C is not mounted on the substrate P. Thereby, the occurrence of mounting defects can be suppressed.

[0149] When the component C is in the shape of a rectangular parallelepiped, the image processing unit 93 can accurately calculate the angle of the component C in the θZc direction based on the image of the component C captured by the first imaging device 11. In addition, the image processing unit 93 can accurately calculate the first angle θx and the second angle θy respectively based on the image of the component C captured by the second imaging device 12.

[0150] The imaging device 10 includes a first imaging device 11 arranged in the Zc-axis direction with respect to the suction nozzle 5, and a second imaging device 12 arranged in the Xc-axis direction with respect to the suction nozzle 5. By rotating the suction nozzle 5 holding the component C in the θZc direction, the second imaging device 12 can substantially capture the component C from the Xc-axis direction and the Yc-axis direction, respectively. According to the embodiment, the number of imaging devices 10 can be suppressed.

[0151] [Other Embodiments]

[0152] In addition, in the above-described embodiment, the imaging device 10 may also include a first imaging device 11 disposed in the Zc-axis direction with respect to the nozzle 5, a second imaging device 12 disposed in the Xc-axis direction with respect to the nozzle 5, and a third imaging device disposed in the Yc direction with respect to the nozzle 5. Thus, even without rotating the nozzle 5, the second imaging control unit 92 can cause the second imaging device 12 to image the component C whose position in the θZc direction is adjusted from the Xc-axis direction, and cause the third imaging device to image the component C whose position in the θZc direction is adjusted from the Yc-axis direction.

[0153] Description of Reference Numerals:

[0154] 1: Component mounting device; 2: Base member; 3: Substrate conveying device; 4: Component supply device; 5: Nozzle; 6: Mounting head; 7: Head moving device; 8: Nozzle moving device; 9: Control device; 10: Imaging device; 11: First imaging device; 12: Second imaging device; 20: Mirror; 41: Tape feeder; 50: Nozzle unit; 61: Housing; 62: Rotor shaft; 63: Tower; 71: Xg-axis moving device; 71D: Xg-axis actuator; 71S: Xg-axis sliding member; 72: Yg-axis moving device; 72D: Yg-axis actuator; 72G: Yg-axis guiding member; 72P: Support pillar; 72S: Yg-axis sliding member; 73: Zg-axis moving device; 73D: Zg-axis actuator; 73G: Zg-axis guiding member; 81: Rotary device; 82: Zc-axis moving device; 83: θZc moving device; 91: First imaging control unit; 92: Second imaging control unit; 93: Image processing unit; 94: Nozzle control unit; 95: Mounting control unit; 96: Angle calculation unit; 97: Correction amount calculation unit; 98: Angle determination unit; 99: Threshold storage unit; 1000: Computer system; 1001: Processor; 1002: Main memory; 1003: Memory; 1004: Interface; C: Component; Ct: Upper surface; Cx: First side surface; Cy: Second side surface; Cz: Lower surface; DM: Mounting area; LP: First position; Le: Outer edge line; Lx: Center line; Ly: Center line; Lz: Center line; MP: Target mounting position; MX: Center position; NX: Central axis; OX1: Optical axis; OX2: Optical axis; P: Substrate; SM: Supply area; TP: Second position.

Claims

1. A component mounting device, characterized in that, Comprising: A mounting head having a nozzle that can move in an axial direction parallel to the drive shaft and in a rotational direction centered on the drive shaft respectively; An imaging device that images a component held by the nozzle; A first imaging control unit that controls the imaging device to obtain an image of the component viewed from the axial direction; A nozzle control unit that controls the nozzle based on the image viewed from the axial direction to adjust the position of the component in the rotational direction; A second imaging control unit that, after the position in the rotational direction is adjusted, controls the imaging device to obtain an image of the component viewed from a first direction orthogonal to the drive shaft and an image viewed from a second direction; An angle calculation unit that calculates the angle of the component based on the image viewed from the first direction and the image viewed from the second direction; And A mounting control unit that controls the mounting head based on the angle to mount the component at a target mounting position on a substrate.

2. The component mounting device according to claim 1, wherein The component mounting device is provided with a correction amount calculation unit that calculates a correction amount related to the position of the mounting head when mounting the component based on the angle and the target mounting position, The mounting control unit controls the mounting head based on the correction amount.

3. The component mounting device according to claim 2, wherein The correction amount includes a deviation amount of the component from the target mounting position predicted when releasing the component in a state inclined at the angle and contacting the substrate from the nozzle.

4. The component mounting device according to claim 2 or 3, wherein The angle includes a first angle in a first plane orthogonal to the first direction and a second angle in a second plane orthogonal to the second direction, The correction amount includes a first correction amount calculated based on the first angle and a second correction amount calculated based on the second angle.

5. The component mounting device according to claim 2 or 3, wherein The component mounting device comprises: A threshold storage unit that stores a first threshold related to the angle and a second threshold larger than the first threshold; and An angle determination unit that determines the relationship between the angle and the first threshold and the second threshold, When it is determined that the angle is below the first threshold, the mounting control unit controls the mounting head to mount the component on the substrate without based on the correction amount, When it is determined that the angle exceeds the first threshold and is below the second threshold, the mounting control unit controls the mounting head based on the correction amount to mount the component on the substrate, When it is determined that the angle exceeds the second threshold, the mounting control unit controls the mounting head so as not to mount the component on the substrate.

6. The component mounting device according to any one of claims 1 to 3, wherein The component is in the shape of a cuboid, The image obtained by photographing from the axial direction is an image including the lower surface of the component, the nozzle control unit adjusts the position of the component in the rotational direction based on the image including the lower surface so that the first side surface of the component faces the first direction, the image observed from the first direction is an image including the first side surface of the component, the image observed from the second direction is an image including the second side surface of the component orthogonal to the first side surface.

7. The component mounting device according to any one of claims 1 to 3, characterized in that the photographing device includes a first photographing device arranged in the axial direction with respect to the nozzle and a second photographing device arranged in the first direction with respect to the nozzle, the first photographing control unit controls the first photographing device so as to obtain an image observed from the axial direction, the second photographing control unit rotates the nozzle by the angle formed by the first direction and the second direction and controls the second photographing device so as to obtain an image observed from the first direction and an image observed from the second direction.

8. A component mounting method, characterized in that, Comprising: holding the upper surface of the component with a nozzle capable of moving respectively in the axial direction parallel to the drive shaft and in the rotational direction centered on the drive shaft; photographing the lower surface of the component held by the nozzle; rotating the component based on the image of the lower surface so that the first side surface of the component is orthogonal to the first direction; photographing the first side surface facing the first direction; photographing the second side surface of the component facing the second direction orthogonal to the first direction; calculating a first angle of the component in the first plane orthogonal to the first direction based on the image of the first side surface; calculating a second angle of the component in the second plane orthogonal to the second direction based on the image of the second side surface, calculating a first correction amount related to the position of the nozzle in the second direction when mounting the component on the substrate based on the first angle and the target mounting position of the component; calculating a second correction amount related to the position of the nozzle in the first direction when mounting the component on the substrate based on the second angle and the target mounting position of the component; and adjusting the position of the nozzle based on the first correction amount and the second correction amount and mounting the component on the substrate.

Images