Display panel and display device
By setting a conductive structure in the bonding area of the display substrate and utilizing the electrostatic protection measures of the cover plate assembly, the problem of insufficient antistatic capability of traditional display panels is solved, achieving a balance between the stability of display and touch functions and the narrow bezel design.
Patent Information
- Application Number
- CN202210335000.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2022-03-31
- Publication Date
- 2025-12-30
- Estimated Expiration
- 2042-03-31
AI Technical Summary
Traditional display panels have insufficient anti-static capabilities, making the screen susceptible to damage from external electrostatic discharge, which affects the stability of display and touch functions. This is especially true in narrow bezel designs where the exposed bonding area is easily damaged.
A conductive structure is set in the bonding area of the display substrate, and the exposed part of the bonding area is covered by a cover plate assembly. The conductive structure and optical adhesive layer in the cover plate assembly form electrostatic protection to protect the conductive structure of the bonding area and improve the antistatic capability.
It effectively prevents the exposed parts of the bonding area from being damaged by electrostatic discharge, improves the anti-static capability of the display panel, ensures the stability of display and touch functions, and meets the design requirements of narrow bezels.
Smart Images

Figure CN114639714B_ABST
Abstract
Description
Technical Field
[0001] This invention relates to the field of display technology, and in particular to display panels and display devices. Background Technology
[0002] With the development of the display industry, the requirements for thinner, lighter, and narrower display devices are becoming increasingly stringent. The circuit protection capabilities of the screen are somewhat reduced due to structural or film layer thickness limitations; for example, the anti-static capabilities of touch circuitry cannot meet product performance requirements. Furthermore, the anti-static requirements of the operating environment are becoming increasingly stringent. Traditional display panels lack sufficient anti-static capabilities, making the screen susceptible to damage from external electrostatic discharge. Therefore, improving the anti-static capabilities of display devices has become crucial for ensuring normal display and touch functionality. Summary of the Invention
[0003] Therefore, it is necessary to provide a display panel and display device that address the problem of insufficient anti-static capability of traditional display panels.
[0004] A display panel, the display panel comprising:
[0005] A display substrate includes a display area and a non-display area surrounding the display area. The non-display area has a bonding area. The bonding area includes a first sub-area away from the display area and a second sub-area close to the display area. The second sub-area is located between the first sub-area and the display area. The first sub-area is used for bonding to a circuit board. A conductive structure is provided on the surface of the second sub-area.
[0006] A cover plate assembly is disposed on the display substrate, and a portion of the cover plate assembly covers the second sub-region, and the cover plate assembly is in contact with the conductive structure.
[0007] In the aforementioned display panel, the non-display area of the display substrate forms a bonding area to bond and connect the circuit board, achieving electrical connection between the circuit board and the display substrate. Finally, a cover plate assembly is placed on the display substrate to protect it. The bonding area of the display substrate includes a second sub-area near the display area and a first sub-area away from the display area and near the outer edge. During the circuit board bonding process, to meet the requirement of a narrow bezel, the circuit board is bonded from the outside of the bonding area. Due to limitations in the bonding process and the influence of bonding errors, the circuit board is bonded to the first sub-area on the outer side of the bonding area. The second sub-area, exposed by the bonding area, is covered by the cover plate assembly stacked on the display substrate. The conductive structure on the surface of the second sub-area contacts the cover plate assembly, which provides electrostatic protection for the conductive structure. This avoids exposed portions in the bonding area that could lead to insufficient anti-static capability of the display panel, thereby improving the anti-static capability of the display panel and ensuring the stability of display and touch functions.
[0008] In one embodiment, the cover plate assembly includes a cover plate and an optical adhesive layer, the cover plate being disposed on the display substrate, and the optical adhesive layer being disposed on the side of the cover plate facing the display substrate;
[0009] The optical adhesive layer directly covers the second sub-region.
[0010] In one embodiment, the cover plate assembly further includes a light-shielding layer coated on the side of the cover plate facing the display substrate, the light-shielding layer covering the non-display area with its orthographic projection toward the display substrate, and the optical adhesive layer at least partially connecting the light-shielding layer and the second sub-area.
[0011] In one embodiment, the light-blocking layer is partially stacked on the circuit board, and another portion of the light-blocking layer is connected to the second sub-region by at least a portion of the optical adhesive layer.
[0012] In one embodiment, the light-blocking layer protrudes toward the surface of the display substrate to form a protrusion, a portion of the protrusion is stacked with the circuit board, and at least a portion of the optical adhesive layer is filled between the other portion of the protrusion and the second sub-region.
[0013] In one embodiment, the light-blocking layer includes a first flat portion and the protrusion. The first flat portion is coated on the side of the cover plate facing the display substrate, and the protrusion is connected to the first flat portion and protrudes in the direction toward the display substrate. The optical adhesive layer includes a second flat portion and a bonding portion. The second flat portion is disposed between the display substrate and the cover plate, and the bonding portion is connected to the second flat portion and disposed on the same layer as the circuit board, and is bonded between the first protrusion and the second sub-area.
[0014] In one embodiment, the end of the protrusion that contacts the binding portion is chamfered.
[0015] In one embodiment, the display substrate has a protrusion on the surface facing the cover plate assembly, and the bonding area is located on the side surface of the protrusion facing the cover plate assembly.
[0016] In one embodiment, the cover plate assembly includes a cover plate and a polarizer, the polarizer being disposed between the cover plate and the display substrate;
[0017] The polarizer directly covers the second sub-region.
[0018] A display device includes the aforementioned display panel. Attached Figure Description
[0019] Figure 1This is a cross-sectional schematic diagram of the display panel in one embodiment of the present invention;
[0020] Figure 2 This is a cross-sectional schematic diagram of the display panel in another embodiment of the present invention;
[0021] Figure 3 This is a cross-sectional schematic diagram of the display panel in another embodiment of the present invention.
[0022] Reference numerals: 100, display panel; 10, display substrate; 12, display area; 14, non-display area; 15, bonding area; 151, first sub-area; 153, second sub-area; 30, circuit board; 50, cover plate assembly; 52, cover plate; 54, optical adhesive layer; 541, second flat portion; 543, bonding portion; 56, polarizer; 561, first portion; 563, second portion; 58, light-shielding layer; 59, first flat portion; 60, protrusion. Detailed Implementation
[0023] To make the above-mentioned objects, features, and advantages of the present invention more apparent and understandable, specific embodiments of the present invention will be described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of the present invention. However, the present invention can be practiced in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of the present invention. Therefore, the present invention is not limited to the specific embodiments disclosed below.
[0024] In the description of this invention, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.
[0025] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this invention, "a plurality of" means at least two, such as two, three, etc., unless otherwise explicitly specified.
[0026] In this invention, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise explicitly limited. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.
[0027] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "over," and "on top" of the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.
[0028] It should be noted that when an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. When an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only possible implementation.
[0029] As described in the background section, traditional display panels have insufficient anti-static capabilities. The inventors discovered that the root cause of this problem lies in the increasingly stringent requirements for narrow bezels as the display industry develops. To meet this demand, when bonding circuit boards to the bezel, the boards typically cover only a small portion of the edge width, aligning only with the inner edge of the bonding terminals. The boards do not completely cover or extend beyond the inner edge of the bonding terminals. However, due to limitations in the bonding process, errors can occur during board bonding, leading to partial exposure of the bonding terminals. Therefore, during contact between the display module and the entire device, or during air electrostatic discharge testing, the exposed portions of the screen's bonding terminals can be damaged, causing problems such as display malfunction and touch failure.
[0030] To better solve the above-mentioned technical problems, the present invention provides a display panel 100.
[0031] Figure 1 A cross-sectional schematic diagram of a display panel 100 according to an embodiment of the present invention is shown.
[0032] See Figure 1 An embodiment of the present invention provides a display panel 100 including a display substrate 10. The display substrate 10 includes a display area 12 and a non-display area 14 surrounding the display area 12. The non-display area 14 has a bonding area 15, which includes a first sub-area 151 away from the display area 12 and a second sub-area 153 close to the display area 12. The second sub-area 153 is located between the first sub-area 151 and the display area 12. The first sub-area 151 is used for bonding with a circuit board 30, and a conductive structure is provided on the surface of the second sub-area 153. The display panel 100 also includes a cover plate assembly 50, which is disposed on the display substrate 10. A portion of the cover plate assembly 50 covers the second sub-area 153 and is in contact with the conductive structure. It can be understood that the non-display area 14 of the display substrate 10 forms the bonding area 15 to bond and connect the circuit board 30, thereby realizing the electrical connection between the circuit board 30 and the display substrate 10. Finally, the cover plate assembly 50 is disposed on the display substrate 10 to protect the display substrate 10.
[0033] In other words, the bonding area 15 of the display substrate 10 includes a second sub-area 153 near the display area 12 and a first sub-area 151 away from the display area 12 and near the outer edge. During the bonding process of the circuit board 30, in order to meet the manufacturing requirements of a narrow bezel, the circuit board 30 is bonded to the outside of the bonding area 15. Moreover, due to the limitations of the bonding process and the influence of bonding errors, the circuit board 30 is bonded to the first sub-area 151 on the outer side of the bonding area 15, while the second sub-area 153 exposed on the inner side of the bonding area 15 can be covered by a cover plate assembly 50 stacked on the display substrate 10. The conductive structure on the surface of the second sub-area 153 is in contact with the cover plate assembly 50, and the cover plate assembly 50 provides electrostatic protection for the conductive structure. This avoids the display panel 100 from having exposed parts in the bonding area 15, thus improving the antistatic capability of the display panel 100 and ensuring the stability of the display and touch functions.
[0034] In some embodiments, the display substrate 10 includes at least a driving substrate, a display device, and an encapsulation film layer. The display device is disposed on the driving substrate, which is used to input a driving current to the display device to control the display device to emit light. The encapsulation film layer encapsulates the display device to protect the light-emitting material in the display device. Specifically, the display device may include a first electrode, a second electrode, and an organic light-emitting layer, with the organic light-emitting layer located between the first electrode and the second electrode. One of the first electrode and the second electrode can be a cathode, and the other can be an anode. The polarity of the first electrode and the second electrode is specifically set according to requirements and is not limited here. The organic light-emitting layer is located between the cathode and the anode. Electrons injected from the cathode and holes injected from the anode combine with each other in the organic light-emitting layer to form excitons. When the excitons release energy, they emit light, realizing the display function of the display panel 100.
[0035] Understandably, the display area 12 of the display substrate 10 is provided with the aforementioned display device, and the non-display area 14 of the display substrate 10 surrounds the display area 12 and is used to arrange touch lines and other lines, and also to form a bonding area 15 to bond and connect with the circuit board 30.
[0036] In some embodiments, the cover plate assembly 50 includes a cover plate 52 and an optical adhesive layer 54. The cover plate 52 is disposed on the display substrate 10 to protect the display substrate 10. The optical adhesive layer 54 is disposed on the side of the cover plate 52 facing the display substrate 10, and the optical adhesive layer 54 directly covers the second sub-region 153. In this way, the second sub-region 153 can be covered and protected by the optical adhesive layer 54, preventing the second sub-region 153 of the bonding area 15 from being exposed and affecting the antistatic performance of the display panel 100, preventing the display panel 100 from being damaged by electrostatic discharge, and ensuring the stability of the touch and display functions of the display panel 100.
[0037] Specifically, the cover plate assembly 50 also includes a polarizer 56, and an optical adhesive layer 54 is bonded between the polarizer 56 and the cover plate 52. The optical adhesive layer 54 directly covers the second sub-region 153. When the optical adhesive layer 54 is applied to the cover plate 52, the coating area of the optical adhesive layer 54 is expanded. Subsequently, the cover plate 52 is placed on the polarizer 56. The optical adhesive layer 54 is not only bonded between the cover plate 52 and the polarizer 56, but can also extend to the bonding area 15 to cover the second sub-region 153 to protect the second sub-region 153.
[0038] Furthermore, the cover plate assembly 50 also includes a light-shielding layer 58. The side of the cover plate 52 facing the display substrate 10 is coated with the light-shielding layer 58. The orthographic projection of the light-shielding layer 58 onto the display substrate 10 covers the non-display area 14. That is, the non-display area 14 corresponding to the periphery of the display area 12 is coated with the light-shielding layer 58 on the cover plate 52 to cover the metal traces of the non-display area 14. Additionally, an optical adhesive layer 54 is at least partially connected between the light-shielding layer 58 and the second sub-area 153 to cover and protect the second sub-area 153, while the optical adhesive layer 54 does not affect the arrangement of the light-shielding layer 58 on the cover plate 52. Optionally, the light-shielding layer 58 is an ink layer.
[0039] Furthermore, a portion of the light-shielding layer 58 is stacked on the circuit board 30, and another portion of the light-shielding layer 58 is connected to the second sub-region 153 by at least a portion of the optical adhesive layer 54. Thus, not only is the second sub-region 153 covered and protected by the optical adhesive layer 54, but the light-shielding layer 58 is also stacked with the circuit board 30 outside the second sub-region 153. This mutual stacking of the light-shielding layer 58 and the circuit board 30 seals the outer periphery of the display panel 100, further protecting the second sub-region 153 and preventing it from being exposed to the outside world and damaged by electrostatic discharge.
[0040] Specifically, at least one of the light-shielding layer 58 and the display substrate 10 has a protrusion 60 protruding from its surface toward the other, and the orthographic projection of the protrusion 60 toward the display substrate 10 is located in the bonding area 15. That is, corresponding to the bonding area 15, a protrusion 60 is provided on at least one of the display substrate 10 and the light-shielding layer 58 to bring the circuit board 30 bonded to the bonding area 15 of the display substrate 10 and the light-shielding layer 58 closer together, facilitating the stacking of the circuit board 30 and the light-shielding layer 58.
[0041] See Figure 1In some embodiments, the light-shielding layer 58 protrudes towards the surface of the display substrate 10, forming a protrusion 60. A portion of the protrusion 60 is stacked with the circuit board 30, and at least a portion of the optical adhesive layer 54 is filled between the other portion of the protrusion 60 and the second sub-region 153. During the molding process of the display panel 100, the light-shielding layer 58 is coated on the inner surface of the cover plate 52 corresponding to the non-display area 14, and then the optical adhesive layer 54 is coated on the inner surface of the cover plate 52 corresponding to the display area 12. The optical adhesive layer 54 is then applied to the protrusion 60 of the light-shielding layer 58. Finally, the cover plate 52 is placed on the display substrate 10 and the polarizer 56, so that a portion of the optical adhesive layer 54 is bonded to the polarizer 56, while another portion of the optical adhesive layer 54 is pressed between the second sub-region 153 and the protrusion 60. The protrusion 60 guides the optical adhesive layer 54 to bond to the second sub-region 153, thereby covering and protecting the second sub-region 153. At the same time, the internal space of the display panel 100 is sealed by the overlapping of the protrusion 60 and the circuit board 30 to prevent the optical adhesive layer 54, which is squeezed into the second sub-area 153, from continuing to flow out.
[0042] Specifically, the light-blocking layer 58 includes a first flat portion 59 and a protrusion 60. The first flat portion 59 is coated on the side of the cover plate 52 facing the display substrate 10. The protrusion 60 is connected to the first flat portion 59 and protrudes in the direction toward the display substrate 10. The optical adhesive layer 54 includes a second flat portion 541 and a bonding portion 543. The second flat portion 541 is disposed between the display substrate 10 and the cover plate 52. The bonding portion 543 is connected to the second flat portion 541 and is disposed on the same layer as the circuit board 30. It is bonded between the first protrusion 60 and the second sub-region 153 so as to cover and seal the second sub-region 153 through the bonding portion 543. Thus, when the cover plate 52 is laminated, optical adhesive is applied to the side of the cover plate 52 where the light-shielding layer 5858 is provided, and then the cover plate 52 is covered onto the polarizer 56. During the covering process, the optical adhesive is squeezed and, blocked by the first protrusion 60, no longer diffuses outward, but flows downward to the second sub-area 153 below the first protrusion 60. Thus, the final optical adhesive layer 54 includes a bonding portion 543 that is bonded between the second sub-area 153 and the first protrusion 60, so that the second sub-area 153 is covered by the bonding portion 543, thereby improving the antistatic capability of the display panel 100.
[0043] Furthermore, the end of the protrusion 60 that contacts the bonding portion 543 is chamfered, allowing the optical adhesive layer 54 to flow smoothly to the second sub-region 153 outside the rounded corner of the protrusion 60. This facilitates guiding the optical adhesive layer 54 to flow to the second sub-region 153 via the protrusion 60, ultimately forming the bonding portion 543. Specifically, in this embodiment, the protrusion 60 is formed on the bottom surface of the light-shielding layer 58. The orthogonal projection of the protrusion 60 toward the display substrate 10 covers the bonding area 15, so that the optical adhesive layer 54 can be guided to flow to the second sub-region 153 of the bonding area 15 via the protrusion 60 on the light-shielding layer 58. Moreover, the inner end of the protrusion 60 near the display area 12 is chamfered, allowing the optical adhesive layer 54 to flow smoothly along the outer periphery of the rounded corner to the second sub-region 153.
[0044] Figure 2 A cross-sectional schematic diagram of a display panel 100 according to another embodiment of the present invention is shown.
[0045] See Figure 2 In other embodiments, a protrusion 60 is formed on the surface of the display substrate 10 facing the cover plate assembly 50, and a bonding area 15 is located on the surface of the protrusion 60 facing the cover plate assembly 50. Thus, the bonding area 15 is formed on the upper surface of the bonding area 15, the circuit board 30 is bonded to a first sub-region 151 on the protrusion 60, and the optical adhesive layer 54 at least partially covers a second sub-region 153 on the protrusion 60. In other words, the protrusion 60 is formed on the display substrate 10, and the bonding area 15 is formed on the upper surface of the protrusion 60, bonding the circuit board 30 to the first sub-region 151 of the bonding area 15 on the upper surface of the protrusion 60. This facilitates the stacking of the circuit board 30 with the light-shielding layer 58 on the cover plate 52, while simultaneously covering the second sub-region 153 of the bonding area 15 on the upper surface of the protrusion 60 with the optical adhesive layer 54 to protect the bonding area 15 and improve the antistatic capability of the display panel 100.
[0046] Figure 3 A cross-sectional schematic diagram of a display panel 100 is shown in another embodiment of the present invention.
[0047] See Figure 3 In some embodiments, the display panel 100 includes a cover plate 52 and a polarizer 56. The polarizer 56 is disposed between the cover plate 52 and the display substrate 10 and is used to adjust the emitted light from the display substrate 10. Specifically, an optical adhesive layer 54 is bonded between the polarizer 56 and the cover plate 52 to bond the cover plate 52 and the polarizer 56. The polarizer 56 directly covers the second sub-region 153 to protect the second sub-region 153, preventing the second sub-region 153 of the bonding area 15 from being exposed and affecting the antistatic performance of the display panel 100, preventing the display panel 100 from being damaged by electrostatic discharge, and ensuring the stability of the touch and display functions of the display panel 100.
[0048] In other words, the polarizer 56 directly covers the second sub-region 153. By expanding the polarizer 56 and covering it on the display substrate 10, the polarizer 56 not only covers the display area 12 of the display substrate 10, but also covers the second sub-region 153 of the bonding area 15 of the display substrate 10, thus preventing any exposed portions of the bonding area 15 and improving the anti-static capability of the display panel 100. Specifically, the polarizer 56 includes a first portion 561 and a second portion 563. The first portion 561 covers the display area 12, and the second portion 563 covers the second sub-region 153. Thus, the first portion 561 is used to adjust the emitted light from the display area 12, and the second portion 563 protects the bonding area 15, preventing any exposed portions of the bonding area 15.
[0049] In this way, during the manufacturing process of the display panel 100, in order to meet the requirement of a narrow bezel, the circuit board 30 is bonded to the first sub-region 151 outside the bonding area 15, and then a polarizer 56 is stacked on the display substrate 10. The polarizer 56 can cover the second sub-region 153 exposed inside the bonding area 15 to protect the bonding area 15, ensure the anti-static capability of the display panel 100, and meet the manufacturing requirements of a narrow bezel.
[0050] Based on the same inventive concept, in one embodiment of the present invention, a display device is also provided, including the aforementioned display panel 100. This display device can be any product or component with display functionality, such as a mobile phone, tablet computer, television, monitor, laptop computer, digital photo frame, in-vehicle equipment, wearable device, or Internet of Things device.
[0051] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.
[0052] The embodiments described above are merely illustrative of several implementations of the present invention, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the invention patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of the present invention, and these all fall within the protection scope of the present invention. Therefore, the protection scope of this invention patent should be determined by the appended claims.
Claims
1. A display panel, characterized by, The display panel comprises: a display substrate comprising a display area and a non-display area surrounding the display area, the non-display area having a binding area, the binding area comprising a first sub-area away from the display area and a second sub-area close to the display area, the second sub-area being located between the first sub-area and the display area, the first sub-area being used for binding with a circuit board; a surface of the second sub-area being provided with a conductive structure; a cover plate assembly, a cover being arranged on the display substrate, and a part of the cover plate assembly covering the second sub-area, and the cover plate assembly being in contact with the conductive structure; the cover plate assembly comprising a cover plate and an optical adhesive layer, the cover plate being arranged on the display substrate, and the optical adhesive layer being arranged on a side of the cover plate facing the display substrate; the optical adhesive layer directly covering the second sub-area; the cover plate assembly further comprising a light shielding layer, a side of the cover plate facing the display substrate being coated with the light shielding layer, a projection of the light shielding layer towards the display substrate covering the non-display area, and the optical adhesive layer being at least partially connected between the light shielding layer and the second sub-area; the light shielding layer comprising a first flat portion and a first protrusion, the first flat portion being coated on a side of the cover plate facing the display substrate, and the first protrusion being connected with the first flat portion and being arranged in a protruding manner towards the display substrate; the optical adhesive layer comprising a second flat portion and a binding portion, the second flat portion being arranged between the display substrate and the cover plate, and the binding portion being connected with the second flat portion and being pasted between the first protrusion and the second sub-area.
2. The display panel of claim 1, wherein, a part of the first protrusion is arranged in a laminated manner with the circuit board, and another part of the first protrusion is filled with the binding portion between the first protrusion and the second sub-area.
3. The display panel of claim 1, wherein, the binding portion is arranged in a same layer as the circuit board.
4. The display panel of claim 1, wherein, an end of the first protrusion in contact with the binding portion is chamfered.
5. The display panel of claim 1, wherein, the display panel further comprises a polarizer arranged on a side of the display substrate facing the cover plate, the second flat portion being pasted between the polarizer and the cover plate, the second sub-area and the binding portion covering the second sub-area being located between the polarizer and the circuit board in a direction from the display area to the non-display area.
6. The display panel according to any one of claims 1-4, wherein, the display substrate is arranged in a protruding manner towards the cover plate assembly to form a second protrusion, and the binding area is located on a side surface of the second protrusion towards the cover plate assembly.
7. A display device, characterized by comprising: the display panel comprises any one of the display panels in claims 1-6.
Citation Information
Patent Citations
Touch panel, manufacturing method thereof and touch panel display and device
CN105892755A
Display device and preparation method thereof
CN112951089A