Silicon rod cutting and grinding integrated machine and silicon rod cutting and grinding method

Abstract

The present application discloses a silicon rod cutting and grinding machine and a silicon rod cutting and grinding method. The silicon rod cutting and grinding machine includes a cutting device and a grinding device. The cutting device includes a first cutting unit, a first spacing unit, a second cutting unit, and a second spacing unit. The first cutting unit includes two orthogonal first cutting wire saws, and the second cutting unit includes two orthogonal second cutting wire saws. The first spacing unit is used to adjust the cutting positions of the two orthogonal first cutting wire saws to adjust the cutting space formed by the two orthogonal first cutting wire saws. The second spacing unit is used to adjust the cutting positions of the two orthogonal second cutting wire saws to adjust the cutting space formed by the two orthogonal second cutting wire saws. In this way, based on the silicon rod cutting and grinding machine, the integrated operation of squaring and grinding multiple processes of silicon rods can be completed, thereby improving production efficiency and the quality of product processing operations. The cutting space formed by each cutting wire saw can be adjusted to adapt to silicon rods of different specifications and sizes.

Description

Technical Field

[0001] The present application relates to the technical field of silicon workpiece processing, and in particular to a silicon rod cutting and grinding machine and a silicon rod cutting and grinding method. Background Art

[0002] At present, with the society's emphasis on and openness to the use of green renewable energy, the photovoltaic solar power generation field has been increasingly valued and developed. In the field of photovoltaic power generation, the usual crystalline silicon solar cells are made on high-quality silicon wafers, which are cut from pulled or cast silicon ingots by multi-wire saws and subsequently processed.

[0003] The existing silicon wafer production process, taking single crystal silicon products as an example, generally, the approximate operating procedures may include: first, use a silicon rod cutting machine to cut the original long silicon rod to form multiple short silicon rods; after the cutting is completed, use a silicon rod squarer to square the cut short silicon rods to form single crystal silicon rods; then perform surface grinding, chamfering and other processing operations on each single crystal silicon rod, so that the surface shaping of the single crystal silicon rod meets the corresponding flatness and dimensional tolerance requirements; subsequently, use a slicer to slice the single crystal silicon rod to obtain single crystal silicon wafers.

[0004] However, under normal circumstances, in the relevant technology, the operations required for each process operation (such as cutting and squaring, grinding, chamfering, etc.) are arranged independently, and the corresponding processing equipment is scattered in different production units or production workshops or different production areas of production workshops. The conversion of workpieces performing different process operations requires transportation and allocation, and pretreatment may be required before performing each process operation. In this way, the process is complicated and inefficient, and it is easy to affect the quality of silicon rod processing operations, requiring more manpower or transfer equipment, and there are great safety hazards. In addition, there are many flow links between the operating equipment of each process, which increases the risk of workpiece damage during the transfer of the workpiece, and is prone to non-production factors. Unqualified products reduce the product qualification rate and the unreasonable losses caused by the existing processing methods. This is a major improvement issue faced by each company. Summary of the invention

[0005] In view of the shortcomings of the above-mentioned related technologies, the purpose of the present application is to disclose a silicon rod cutting and grinding machine and a silicon rod cutting and grinding method, which are used to solve the problems of low efficiency between various process operations and poor silicon rod processing results existing in the existing related technologies.

[0006] To achieve the above-mentioned purpose and other related purposes, the present application discloses a silicon rod grinding machine, comprising: a machine base, having a silicon rod processing platform; the silicon rod processing platform comprises a first cutting position, a second cutting position, and a grinding position; a cutting device, comprising: a first cutting unit, a first spacing unit, a second cutting unit, and a second spacing unit; the first cutting unit comprises two orthogonal first cutting wire saws, the two orthogonal first cutting wire saws are used to cut the silicon rod to be cut at the first cutting position to form two orthogonal side surfaces; the first spacing unit is used to adjust the two orthogonal first cutting wires in the first cutting unit. The second cutting unit comprises two orthogonal second cutting wire saws, which are used to cut the silicon rod to be cut at the second cutting position to form two orthogonal sides, and cut the silicon rod into a silicon rod with a rectangular cross-section; the second spacing unit is used to adjust the cutting position of the two orthogonal second cutting wire saws in the second cutting unit; a grinding device is used to grind and chamfer the cut silicon rod at the grinding position; a silicon rod conversion device is arranged on the silicon rod processing platform, and is used to convert the silicon rod between the first cutting position, the second cutting position, and the grinding position.

[0007] The silicon rod cutting and grinding machine disclosed in the present application includes a cutting device, a grinding device, and a silicon rod conversion device. The cutting device includes a first cutting unit, a first spacing unit, a second cutting unit, and a second spacing unit. The first cutting unit includes two orthogonal first cutting wire saws, and the second cutting unit includes two orthogonal second cutting wire saws. The first spacing unit is used to adjust the cutting positions of the two orthogonal first cutting wire saws to adjust the cutting space formed by the two orthogonal first cutting wire saws. The second spacing unit is used to adjust the cutting positions of the two orthogonal second cutting wire saws to adjust the cutting space formed by the two orthogonal second cutting wire saws. In this way, based on the silicon rod cutting and grinding machine, the integrated operation of squaring and grinding multiple processes of silicon rods can be completed, thereby improving production efficiency and the quality of product processing operations. The cutting space formed by each cutting wire saw can be adjusted to adapt to silicon rods of different specifications and sizes.

[0008] In certain embodiments of the first aspect of the present application, the first cutting unit includes: a first wire frame, a plurality of first cutting wheels and a first transition wheel arranged on the first wire frame, and a first cutting wire, the first cutting wire is wound around the plurality of first cutting wheels and the first transition wheel to form two orthogonal first cutting wire saws; the first distance adjustment unit includes a first wire frame adjustment mechanism, the first wire frame adjustment mechanism is used to adjust the positions of the first wire frame and the plurality of first cutting wheels and the first transition wheel thereon; the second cutting unit includes: a second wire frame, a plurality of second cutting wheels and a second transition wheel arranged on the second wire frame, and a second cutting wire, the second cutting wire is wound around the plurality of second cutting wheels and the second transition wheel to form two orthogonal second cutting wire saws; the second distance adjustment unit includes a second wire frame adjustment mechanism, the second wire frame adjustment mechanism is used to adjust the positions of the second wire frame and the plurality of second cutting wheels and the second transition wheel thereon.

[0009] In certain embodiments of the first aspect of the present application, the first cutting wheel has at least two cutting wire grooves, and the first distance adjusting unit also includes a first calibration mechanism, which is used to drive the first transition wheel to move so that the current wire groove in the first transition wheel around which the first cutting wire is wound is adjusted from the first cutting wire groove corresponding to the first cutting wheel to the second cutting wire groove corresponding to the first cutting wheel; the second cutting wheel has at least two cutting wire grooves, and the second distance adjusting unit also includes a second calibration mechanism, which is used to drive the second transition wheel to move so that the current wire groove in the second transition wheel around which the second cutting wire is wound is adjusted from the first cutting wire groove corresponding to the second cutting wheel to the second cutting wire groove corresponding to the second cutting wheel.

[0010] In certain embodiments of the first aspect of the present application, the cutting device also includes: a first cutting frame and a first cutting support located in a first cutting area, the first cutting frame is arranged on a machine base, the first cutting support is movably raised and lowered on the first cutting frame, and the first cutting unit is arranged on the first cutting support; a second cutting frame and a second cutting support located in a second cutting area, the second cutting frame is arranged on a machine base, the second cutting support is movably raised and lowered on the second cutting frame, and the second cutting unit is arranged on the second cutting support.

[0011] In certain embodiments of the first aspect of the present application, the silicon rod cutting and grinding machine further includes: a first pay-and-retract wire unit corresponding to the first cutting unit and a second pay-and-retract wire unit corresponding to the second cutting unit.

[0012] In certain embodiments of the first aspect of the present application, the first cutting line is wound around the multiple first cutting wheels and the first transition wheel to form a first closed-loop cutting line connected end to end, and the second cutting line is wound around the multiple second cutting wheels and the second transition wheel to form a second closed-loop cutting line connected end to end.

[0013] In certain embodiments of the first aspect of the present application, the cutting device also includes: a cutting frame, which is arranged on the machine base; the cutting frame is located between the first cutting area and the second cutting area; a cutting support, which is movably raised and lowered on the cutting frame; the cutting support includes a support body and a first support wing and a second support wing located on opposite sides of the support body; wherein the first cutting unit is arranged on the first support wing of the cutting support, and the second cutting unit is arranged on the second support wing of the cutting support.

[0014] In certain embodiments of the first aspect of the present application, the first cutting line and the second cutting line are the same cutting line, and the cutting support is further provided with an intermediate transition wheel located between the first cutting unit and the second cutting unit for the cutting line to be wound around.

[0015] In certain embodiments of the first aspect of the present application, the cutting device further includes a wire retracting and unreeling unit.

[0016] In certain embodiments of the first aspect of the present application, the cutting line is wound around the plurality of first cutting wheels, the first transition wheel, the intermediate transition wheel, the plurality of second cutting wheels and the second transition wheel to form a closed-loop cutting line connected end to end.

[0017] In certain embodiments of the first aspect of the present application, when the first cutting unit performs a first fold cut on the silicon rod to be cut, the intersection of two orthogonal first cutting wire saws is located within the cross-section of the silicon rod to be cut; and when the second cutting unit performs a second fold cut on the silicon rod to be cut, the intersection of two orthogonal second cutting wire saws is located within the cross-section of the silicon rod to be cut.

[0018] In certain embodiments of the first aspect of the present application, the silicon rod cutting and grinding machine also includes: a first edge skin unloading device for unloading the edge skin generated after the first cutting unit performs the first folding surface cutting; a second edge skin unloading device for unloading the edge skin generated after the second cutting unit performs the second folding surface cutting.

[0019] In certain embodiments of the first aspect of the present application, any one of the first edge skin unloading device and the second edge skin unloading device includes: an edge skin lifting unit, used to lift the edge skin so that the top end of the edge skin protrudes from the cut silicon rod; and an edge skin clamping and transporting unit, used to clamp the edge skin and transport the edge skin.

[0020] In certain embodiments of the first aspect of the present application, the edge skin clamping and transporting unit includes: a clamping mechanism for clamping or releasing the top end of the edge skin; and a lifting drive mechanism for driving the clamping mechanism to perform lifting and lowering movements so that the clamping mechanism drives the clamped edge skin to separate from the cut silicon rod.

[0021] In certain embodiments of the first aspect of the present application, the clamping mechanism includes: a cover body, used to cover the edge skin; a clamping assembly, arranged inside the cover body; and a clamping space for clamping the edge skin is formed between the clamping assembly and the cover body.

[0022] In certain embodiments of the first aspect of the present application, the cover body includes an arc-shaped plate with a semicircular cross-section; and the clamping assembly includes two orthogonal clamping members.

[0023] In certain embodiments of the first aspect of the present application, the clamping member is a movable pressure block controlled by a cylinder, and the movable pressure block is connected to the output shaft of the cylinder via a swing arm.

[0024] In certain embodiments of the first aspect of the present application, any one of the first edge skin unloading device and the second edge skin unloading device also includes a wire dialing mechanism for dialing the corresponding first cutting wire saw or second cutting wire saw to expand outward to avoid interference between the first cutting wire saw or the second cutting wire saw and the cut silicon rods.

[0025] In certain embodiments of the first aspect of the present application, the grinding device includes: a grinding support movably disposed on the machine base; and at least one pair of grinding tools disposed opposite to each other on the grinding support.

[0026] In certain embodiments of the first aspect of the present application, the grinding tool includes: a main shaft; and at least one grinding wheel assembly disposed at a working end of the main shaft.

[0027] In certain embodiments of the first aspect of the present application, the grinding wheel assembly includes a rough grinding wheel, a fine grinding wheel, or a nested combination of a rough grinding wheel and a fine grinding wheel.

[0028] In certain embodiments of the first aspect of the present application, the grinding tool includes: a rotating chassis; a double-headed spindle, which is arranged on the rotating chassis and has at least one rough grinding wheel at its first end and at least one fine grinding wheel at its second end; a conversion motor, which is used to drive the rotating chassis to rotate so that the first end and the second end of the double-headed spindle are interchanged.

[0029] In certain embodiments of the first aspect of the present application, the grinding device further comprises at least one chamfering grinder, wherein the chamfering grinder is disposed on the grinding support and is used to chamfer or round the edges of the cut silicon rods.

[0030] In certain embodiments of the first aspect of the present application, the chamfering grinding tool comprises a chamfering grinding wheel, and the axis of the chamfering grinding wheel is offset from the axis of the cut silicon rod.

[0031] In certain embodiments of the first aspect of the present application, the first cutting position, the second cutting position and the grinding position of the silicon rod processing platform are adjacent to each other at an angle of 120°, and the rotation angle range of the silicon rod conversion device is ±240°.

[0032] In certain embodiments of the first aspect of the present application, the silicon rod processing platform is further provided with a preprocessing area, and the silicon rod cutting and grinding machine further includes a silicon rod transfer device, which is adjacent to the preprocessing area of ​​the silicon rod processing platform and is used to transfer the silicon rods to be processed to the preprocessing area of ​​the silicon rod processing platform or to transfer the processed silicon rods on the preprocessing area out of the silicon rod processing platform.

[0033] In certain embodiments of the first aspect of the present application, the first cutting position, the second cutting position, the grinding position and the pretreatment position of the silicon rod processing platform are adjacent to each other at 90°, and the rotation angle range of the silicon rod conversion device is ±270°.

[0034] In certain embodiments of the first aspect of the present application, the silicon rod conversion device includes: a conveying body; a silicon rod positioning mechanism, which is arranged on the conveying body and is used to position the silicon rod; and a conversion drive mechanism, which is used to drive the conveying body to rotate so as to drive the silicon rod positioned by the silicon rod positioning mechanism to convert between various positions.

[0035] The second aspect of the present application discloses a silicon rod cutting and grinding method, wherein the silicon rod cutting and grinding method is applied to a silicon rod cutting and grinding integrated machine.

[0036] The silicon rod cutting and grinding method is applied to a silicon rod cutting and grinding machine, which includes a machine base with a silicon rod processing platform, the silicon rod processing platform is provided with a first cutting position, a second cutting position, and a grinding position, the silicon rod cutting and grinding machine also includes a cutting device, a grinding device, and a silicon rod conversion device, the cutting device includes a first cutting unit, a first spacing unit, a second cutting unit, and a second spacing unit, the first cutting unit includes two orthogonal first cutting wire saws, the second cutting unit includes two orthogonal second cutting wire saws, and the silicon rod cutting and grinding method includes the following steps:

[0037] The silicon rod conversion device is used to convert the first silicon rod to the first cutting position, and two orthogonal first cutting wire saws in the first cutting unit are used to cut the first silicon rod at the first cutting position to form two orthogonal side surfaces; wherein the cutting position of the first cutting unit is adjusted by the distance adjustment unit according to the cutting task;

[0038] The silicon rod conversion device is used to convert the first silicon rod from the first cutting position to the second cutting position and the second silicon rod to the first cutting position, and the two orthogonal second cutting wires in the second cutting unit are used to cut the first silicon rod at the second cutting position to form two orthogonal side surfaces, and the first silicon rod is cut into a silicon rod with a rectangular cross section. At this stage, the two orthogonal first cutting wires in the first cutting unit are used to cut the second silicon rod at the first cutting position to form two orthogonal side surfaces;

[0039] The silicon rod conversion device is used to convert the first silicon rod from the second cutting position to the first grinding position, the second silicon rod from the first cutting position to the second cutting position, and the third silicon rod to the first cutting position. The grinding device is used to grind and chamfer the first silicon rod at the grinding position. At this stage, two orthogonal second cutting wire saws in the second cutting unit are used to cut the second silicon rod at the second cutting position to form two orthogonal side surfaces, and the second silicon rod is cut into silicon rods with rectangular cross sections. Two orthogonal first cutting wire saws in the first cutting unit are used to cut the third silicon rod at the first cutting position to form two orthogonal side surfaces.

[0040] The silicon rod cutting and grinding method disclosed in the present application is applied to the aforementioned silicon rod cutting and grinding integrated machine. When performing the silicon rod cutting and grinding operation, the first distance adjusting unit can adjust the cutting position of the two orthogonal first cutting wire saws to adjust the cutting space formed by the two orthogonal first cutting wire saws, and the second distance adjusting unit can adjust the cutting position of the two orthogonal second cutting wire saws to adjust the cutting space formed by the two orthogonal second cutting wire saws, so that the silicon rod conversion device transfers the silicon rods between various processing locations in an orderly and seamless manner, and the cutting device performs two folding cuts on the silicon rod to form a square silicon rod, and the grinding device grinds the square silicon rod after the square cutting, thereby completing the integrated operation of squaring and grinding multiple processes of the silicon rod, and improving the production efficiency and the quality of the product processing operation. In this way, based on the silicon rod cutting and grinding integrated machine, the integrated operation of squaring and grinding multiple processes of the silicon rod can be completed, the production efficiency and the quality of the product processing operation can be improved, and the cutting space formed by each cutting wire saw can be adjusted to adapt to silicon rods of different specifications and sizes. BRIEF DESCRIPTION OF THE DRAWINGS

[0041] The specific features of the invention involved in this application are shown in the attached claims. The features and advantages of the invention involved in this application can be better understood by referring to the exemplary embodiments and drawings described in detail below. A brief description of the drawings is as follows:

[0042] Figure 1 It is a schematic diagram of the structure of the silicon rod cutting and grinding machine in one embodiment of the present application.

[0043] Figure 2 Shown is a top view of the silicon rod cutting and grinding machine in one embodiment of the present application.

[0044] Figure 3 Shown is a top view of a cutting device in a silicon rod cutting and grinding machine of the present application in one embodiment.

[0045] Figure 4 Shown is a schematic structural diagram of the first cutting unit of the cutting device in the silicon rod cutting and grinding machine of the present application.

[0046] Figure 5 Display as Figure 3 Schematic diagram of the structure of the cutting device from another perspective.

[0047] Figure 6 Display as Figure 3 A top view of the first cutting unit of the cutting device.

[0048] Figure 7 Display as Figure 6 A local enlarged schematic diagram of the .

[0049] Figure 8 A schematic diagram showing the states of a first edge skin unloading device and a second edge skin unloading device in the silicon rod cutting integrated machine of the present application.

[0050] Fig. 9 It shows a second schematic diagram of the states of the first edge skin unloading device and the second edge skin unloading device in the silicon rod cutting integrated machine of the present application.

[0051] Fig.10 and Fig.11 It is a schematic diagram showing the clamping assembly of the clamping mechanism in the first edge skin unloading device and the cover body cooperating to clamp the edge skin. DETAILED DESCRIPTION

[0052] The following is an explanation of the implementation of the present application by means of specific embodiments. People familiar with the art can easily understand other advantages and effects of the present application from the contents disclosed in this specification.

[0053] In the following description, with reference to the accompanying drawings, several embodiments of the present application are described. It should be understood that other embodiments may also be used, and mechanical composition, structure, electrical and operational changes may be made without departing from the spirit and scope of the present disclosure. The following detailed description should not be considered restrictive, and the scope of the embodiments of the present application is limited only by the claims of the published patents. The terms used here are only to describe specific embodiments and are not intended to limit the present application. Spatially related terms, such as "upper", "lower", "left", "right", "below", "below", "lower", "above", "upper", etc., may be used in the text to facilitate the description of the relationship between an element or feature shown in the figure and another element or feature.

[0054] Although the terms first, second, etc. are used to describe various elements or parameters in this article in some instances, these elements or parameters should not be limited by these terms. These terms are only used to distinguish one or parameter from another or parameter. For example, the first direction can be referred to as the second direction, and similarly, the second direction can be referred to as the first direction, without departing from the scope of the various described embodiments.

[0055] Furthermore, as used in this article, the singular forms "one", "an" and "the" are intended to include plural forms as well, unless there is an indication to the contrary in the context. It should be further understood that the terms "comprise", "include" indicate the presence of the described features, steps, operations, elements, components, projects, kinds, and / or groups, but do not exclude the presence, occurrence or addition of one or more other features, steps, operations, elements, components, projects, kinds, and / or groups. The terms "or" and "and / or" used herein are interpreted as inclusive, or mean any one or any combination. Therefore, "A, B or C" or "A, B and / or C" means "any of the following: A; B; C; A and B; A and C; B and C; A, B and C". Exceptions to this definition will only occur when the combination of elements, functions, steps or operations is inherently mutually exclusive in some way.

[0056] The relevant processing technology for silicon rods involves several processes such as square cutting, grinding, chamfering, etc.

[0057] Generally, most of the existing silicon rods are cylindrical in structure. The silicon rods are squared and cut by silicon rod squaring equipment so that the cross-section of the silicon rods after squaring is rectangular (including square-like), and the cut silicon rods are overall in the shape of a cuboid (also including a cube-like shape).

[0058] Taking a single crystal silicon rod as an example, the process for forming a single crystal silicon rod may include: first using a silicon rod cutter to cut the original long silicon rod to form multiple short silicon rods; after the cutting is completed, using a silicon rod squarer to square the short silicon rod to form a single crystal silicon rod with a rectangular cross section. Among them, the specific implementation method of using a silicon rod cutter to cut the original long silicon rod to form multiple short silicon rods can refer to patent disclosures such as CN105856445A, CN105946127A, and CN105196A, and the specific implementation method of using a silicon rod squarer to square the short silicon rod to form a single crystal silicon rod with a rectangular cross section can refer to patent disclosures such as CN105818285A. However, the process for forming a single crystal silicon rod is not limited to the aforementioned technology. In an optional example, the process for forming a single crystal silicon rod may also include: first, using a full silicon rod squaring machine to square the original long silicon rod to form a long single crystal silicon rod with a rectangular cross section; after the square is cut, using a silicon rod cutting machine to cut the squared long single crystal silicon rod to form a short silicon rod. Among them, the specific implementation method of using a full silicon rod squaring machine to square the original long silicon rod to form a rectangular long single crystal silicon rod can be referred to, for example, patent disclosures such as CN003443A.

[0059] After the cylindrical single crystal silicon rod is cut into a rectangular silicon rod by using a squaring device, the rectangular silicon rod can be ground, chamfered (or rounded) by using a grinding device.

[0060] The inventors of the present application have discovered that in the relevant processing technology for silicon rods, the processing devices involved, such as squaring cutting, grinding (such as grinding, chamfering, etc.), etc., are dispersed and independently arranged from each other. The conversion of silicon rods performing different process operations requires transportation, allocation and pre-processing before processing, resulting in problems such as complicated processes and low efficiency.

[0061] In addition, in the relevant square cutting device, the multiple cutting wheels are mostly either respectively arranged on the rotating shaft and then fixed by the mounting bracket, or several of the cutting wheels are arranged on the same main shaft and then fixed by the mounting bracket. Generally, once installed in place, the positions and mutual relations of the cutting wheels will not change easily. In some cases, in order to adapt to the cutting of round silicon rods of different sizes to form rectangular silicon rods of corresponding sizes, it is necessary to adjust the cutting line in the square cutting device to change the cutting space formed by the cutting line. Or, in some cases, when the wire groove of one of the cutting wheels is worn, the wire groove needs to be replaced as a whole, and the replacement of the wire groove requires adjusting the position of the cutting wheel or other components (such as transition wheels, etc.) and recalibration. In the existing square cutting device, either there is no such adjustment mechanism, or the adjustment mechanism has a complex structure, and the entire adjustment process is very cumbersome and inefficient.

[0062] In view of this, the present application proposes a silicon rod cutting and grinding machine, including a machine base, a cutting device, a grinding device, and a silicon rod conversion device, the cutting device including a first cutting unit, a first distance adjusting unit, a second cutting unit, and a second distance adjusting unit, the two orthogonal first cutting wire saws are used to cut the silicon rod to be cut at the first cutting position to form two orthogonal sides; the first distance adjusting unit is used to adjust the cutting positions of the two orthogonal first cutting wire saws in the first cutting unit; the second cutting unit includes two orthogonal second cutting wire saws, the two orthogonal second cutting wire saws are used to cut the silicon rod to be cut at the second cutting position to form two orthogonal sides, and cut the silicon rod into a silicon rod with a rectangular cross-section; the second distance adjusting unit is used to adjust the cutting positions of the two orthogonal second cutting wire saws in the second cutting unit; the grinding device is used to grind and chamfer the cut silicon rod at the grinding position; the silicon rod conversion device is used to convert the silicon rod between the first cutting position, the second cutting position, and the grinding position.

[0063] The silicon rod cutting and grinding machine of the present application is used for the integrated operation of square cutting and grinding of silicon rods. In an embodiment, the silicon rod may be, for example, a single crystal silicon rod, which is a rod-shaped single crystal silicon grown from a melt by a vertical pulling method or a floating zone melting method, such as a single crystal silicon rod with a length of about 5000 mm (for example, a specification of 5360 mm, etc.) or a single crystal silicon rod with a length of about 800 mm, etc., which is common in silicon rod processing. Polycrystalline silicon is a silicon rod in which silicon is precipitated on the surface of a silicon core wire by a precipitation technology such as chemical vapor deposition technology, but it is not limited thereto. In other possible embodiments of the present application, the silicon rod cutting and grinding machine can also be used to cut single crystal silicon rods, or other long strips of hard materials that need to be cut.

[0064] In any embodiment provided in the present application, the end faces of the silicon rod refer to two opposite faces in the length direction of the silicon rod. For example, for a silicon rod to be cut, its two end faces are circular or quasi-circular, and the side faces of the silicon rod are arcuate; for a cut silicon rod, its two end faces are rectangular or quasi-rectangular, and the side faces of the silicon rod are the four sides of the silicon rod in the length direction that are usually rectangular.

[0065] See also Figure 1 , which is a schematic diagram of the structure of the silicon rod cutting and grinding machine in one embodiment of the present application, Figure 2 Shown is a top view of the silicon rod cutting and grinding machine in one embodiment of the present application.

[0066] The silicon rod squaring device disclosed in the present application comprises: a machine base, a cutting device, a grinding device, and a silicon rod conversion device.

[0067] The machine base is the main component of the silicon rod cutting and grinding machine, and is used to provide a silicon rod processing platform. In one example, the machine base is large in size and weight to provide a larger mounting surface and a more solid stability of the whole machine. It should be understood that the machine base can be used as the base of different structures or components that perform processing operations in the silicon rod cutting and grinding machine, and the specific structure of the machine base can be changed based on different functional requirements or structural requirements. In some examples, the machine base includes a fixed structure or a limiting structure such as a base, a rod, a column, a frame, etc. for receiving different components in the silicon rod cutting and grinding machine, which are all the machine bases described in this application.

[0068] Meanwhile, in some examples, the base may be an integrated base, and in other examples, the base may include a plurality of independent bases.

[0069] exist Figure 1 and Figure 2 In the embodiment shown, the machine base 1 has a silicon rod processing platform, which can be divided into multiple functional areas according to the specific operation content of the silicon rod processing operation. For example, the silicon rod processing platform at least includes a cutting area and a grinding area. The shape of the silicon rod processing platform can be determined according to the machine base, or can be determined jointly according to the processing requirements of the machine base and the cutting device.

[0070] The silicon rod conversion device is arranged on the silicon rod processing platform and is used to convert the silicon rod between the cutting position and the grinding position. Figure 1 and Figure 2 In the illustrated embodiment, the silicon rod conversion device 4 is disposed in the central area of ​​the silicon rod processing platform, and is used to convert the silicon rod between various functional positions on the silicon rod processing platform. In one embodiment, the silicon rod conversion device 4 is rotatably disposed on the silicon rod processing platform, and the silicon rod conversion device 4 may further include: a conveying body in the shape of a disc, an annular ring, a square disc or other similar shapes; a silicon rod positioning mechanism disposed on the conveying body, used to position the silicon rod; and a conversion drive mechanism, used to drive the conveying body to rotate to drive the silicon rod positioning mechanism and the silicon rod conversion position it locates.

[0071] In the silicon rod conversion device, the number of silicon rod positioning mechanisms provided on the conveying body may vary according to the layout of the silicon rod cutting and grinding machine.

[0072] For example, in some embodiments, the silicon rod processing platform may include a first processing location and a second processing location. To match these functional locations, the number of silicon rod positioning mechanisms on the conveying body may be set to two, and each silicon rod positioning mechanism may position at least one silicon rod. Furthermore, the angles set between the two silicon rod positioning mechanisms are also consistent with the angle distribution between the two functional locations. In this way, when a silicon rod positioning mechanism corresponds to a functional location, inevitably, another silicon rod positioning mechanism also corresponds to another functional location. In this way, in the assembly line operation, at any time, when at least one silicon rod is positioned on each silicon rod positioning mechanism and the silicon rod positioning mechanism corresponds to the functional location, these silicon rods are located at a corresponding functional location to perform corresponding processing operations, for example: the silicon rod located in the first processing location can perform the first processing operation, and the silicon rod located in the second processing location can perform the second processing operation.

[0073] In some embodiments, the silicon rod processing platform may include a first processing location, a second processing location, and a third processing location. To match these functional locations, the number of silicon rod positioning mechanisms on the conveying body may be set to three, and each silicon rod positioning mechanism may position at least one silicon rod. Further, the angles set between the three silicon rod positioning mechanisms are also consistent with the angle distribution between the three functional locations. In this way, when a silicon rod positioning mechanism corresponds to a functional location, the other two silicon rod positioning mechanisms are also necessarily corresponding to the other two functional locations. In this way, in the flow operation, at any time, when at least one silicon rod is positioned on each silicon rod positioning mechanism and the silicon rod positioning mechanism corresponds to the functional location, these silicon rods are located at a corresponding functional location to perform corresponding processing operations, for example: the silicon rod located in the first processing location can perform the first processing operation, the silicon rod located in the second processing location can perform the second processing operation, and the silicon rod located in the third processing location can perform the third processing operation. In an optional example, the first processing position, the second processing position, and the third processing position on the silicon rod processing platform are distributed at 120° between each other, so correspondingly, the three silicon rod positioning mechanisms on the conveying body are also distributed at 120° between each other. Of course, the number of silicon rod positioning mechanisms can be changed according to actual needs and is not limited thereto. For example, the number of silicon rod positioning mechanisms can be determined according to the number of functional positions set on the silicon rod processing platform.

[0074] In some embodiments, the silicon rod processing platform includes a waiting position, a first processing position, a second processing position, and a third processing position. To match these functional positions, the number of silicon rod positioning mechanisms on the conveying body can be set to four, and each silicon rod positioning mechanism can position at least one silicon rod. Further, the angles set between the four silicon rod positioning mechanisms are also consistent with the angle distribution between the four functional positions. In this way, when a silicon rod positioning mechanism corresponds to a functional position, the other three silicon rod positioning mechanisms also correspond to the other three functional positions. In this way, in the flow operation, at any time, when at least one silicon rod is positioned on each silicon rod positioning mechanism and the silicon rod positioning mechanism corresponds to the functional position, these silicon rods are located at a corresponding functional position to perform corresponding processing operations, for example: the silicon rod located in the waiting position can perform pretreatment operations, the silicon rod located in the first processing position can perform the first processing operation, the silicon rod located in the second processing position can perform the second processing operation, and the silicon rod located in the third processing position can perform the third processing operation. In an optional embodiment, the waiting area, the first processing area, the second processing area, and the third processing area on the silicon rod processing platform are distributed at 90 degrees to each other, so correspondingly, the four silicon rod positioning mechanisms on the conveying body are also distributed at 90 degrees to each other. Of course, the number of silicon rod positioning mechanisms can be changed according to actual needs and is not limited to this. For example, the number of silicon rod positioning mechanisms can be determined according to the number of functional areas set on the silicon rod processing platform.

[0075] In the silicon rod cutting and grinding machine of this embodiment, at least a cutting device and a grinding device are included. Therefore, in some embodiments, the silicon rod processing platform includes a cutting position and a grinding position, wherein the cutting position or the grinding position includes one or more positions. For example, the cutting position may include a first cutting position and a second cutting position, and the grinding position may include a first grinding position and a second grinding position. In addition, the silicon rod processing platform may also include a waiting position. Figure 1 and Figure 2 In the illustrated embodiment, the silicon rod processing platform includes a waiting position, a first cutting position, a second cutting position, and a grinding position. The number of silicon rod positioning mechanisms on the conveying body can be set to four. The waiting position, the first cutting position, the second cutting position, and the grinding position are distributed at 90° between each other. Therefore, the four silicon rod positioning mechanisms on the conveying body are also distributed at 90° between each other.

[0076] In certain embodiments, the silicon rod positioning mechanism may further include: a rotating support platform, a rotating pressing device, a lifting driving device (not shown in the figure), and a rotating driving device (not shown in the figure).

[0077] The rotating support platform is arranged on the conveying body in the silicon rod conversion device 4, and is used to carry the silicon rod 100 (200) and make the silicon rod 100 (200) be placed upright, that is, the bottom of the silicon rod 100 (200) is located on the rotating support platform. In this embodiment, the rotating support platform rotates together with the conveying body in the silicon rod conversion device 4. In some embodiments, the rotating support platform can also be designed to be able to rotate, for example, the rotating support platform has a rotating shaft relative to the conveying body to achieve self-rotation, so that after the rotating support platform supports the silicon rod 100 (200), the rotating support platform and the silicon rod 100 (200) thereon can rotate together. Furthermore, the contact surface of the rotating support platform for contacting with the silicon rod has damping to provide a certain friction force that can drive the silicon rod. The rotating support platform is adapted to the silicon rod 100 (200). In some embodiments, the rotating support platform can be a circular support platform or a square support platform adapted to the cross-sectional size of the silicon rod 100 (200).

[0078] The rotary pressing device is relatively arranged above the rotating support platform, and is used to press on the top of the silicon rod 100 (200) to press the silicon rod 100 (200). The rotary pressing device may further include a movably arranged support and a pressing movable block arranged at the bottom of the support. The support is movably arranged on a central mounting frame, and the central mounting frame is located in the central area of ​​the conveying body and rotates with the conveying body. The pressing movable block is adapted to the silicon rod 100 (200). In an optional embodiment, the pressing movable block may be a round cake-shaped pressing block or a square pressing block adapted to the cross-sectional size of the silicon rod 100 (200). Furthermore, the pressing movable block in the rotary pressing device is axially connected to the support and can rotate relative to the support.

[0079] As can be seen from the above, the rotating bearing platform is designed to be able to rotate and the pressing movable block in the rotating clamping device is axially connected to the support, so the rotating bearing platform or the pressing movable block can be linked to a rotating drive device. In one case, when the rotating bearing platform is linked to a rotating drive device, the rotating bearing platform serves as the active rotating component and the pressing movable block serves as the driven rotating component; in another case, when the pressing movable block is linked to a rotating drive device, the pressing movable block serves as the active rotating component and the rotating bearing platform serves as the driven rotating component.

[0080] In practical applications, the rotary clamping device can cooperate with the rotary bearing platform below it. Specifically, after the silicon rod 100 (200) is placed vertically on the rotary bearing platform, the lifting drive device drives the support to move downward along the central mounting frame until the top pressing movable block on the support presses against the top of the silicon rod 100 (200). Subsequently, when it is necessary to rotate the silicon rod 100 (200), the rotary driving device drives the linked rotary bearing platform or the top pressing movable block to rotate, and the friction between the rotary bearing platform, the silicon rod 100 (200), and the top pressing movable block is used to drive the silicon rod 100 (200) to rotate together, so as to adjust the working surface or working area in the silicon rod 100 (200), so as to perform processing operations on the adjusted working surface or working area in the silicon rod 100. The rotation speed and rotation angle of the silicon rod 100 (200) can be controlled by the rotary driving device. In a specific implementation, the lifting drive device may be, for example, a cylinder or a lifting motor, and the rotating drive device may be, for example, a rotating motor.

[0081] Further, it can be seen from the above that in some cases, the rotating support platform or the top pressing movable block can be controlled by the rotating drive device to rotate to drive the silicon rod 100 (200) to rotate to change the working surface or working area. Sometimes, when the silicon rod 100 (200) rotates to the required working surface or working area, it is necessary to stop the action and position it to accept the processing operation of the processing device in the corresponding functional area. Therefore, in the present application, the silicon rod positioning mechanism can also be configured with a locking mechanism if necessary. In one implementation, a support platform locking mechanism (not shown in the figure) can be configured at the bottom of the central mounting frame and adjacent to the rotating support platform. The support platform locking mechanism may include a locking pin and a locking cylinder connected to the locking pin. In actual application, when the rotating carrier platform needs to be locked, the locking cylinder in the carrier platform locking mechanism drives the locking pin to extend and act on the bottom or neck of the rotating carrier platform to ensure that the rotating carrier platform is stable and immobile; when the silicon rod needs to be rotated to change the working surface or working area, the locking cylinder in the carrier platform locking mechanism drives the locking pin to retract, unlocking the rotating carrier platform, thereby allowing the rotating carrier platform to rotate.

[0082] The conveying body is driven by the conversion drive mechanism to rotate, and the silicon rod positioning mechanism on the conveying body and the silicon rod 100 (200) positioned by the silicon rod positioning mechanism are converted between different functional positions through the rotation of the conveying body.

[0083] In some embodiments, the conversion drive mechanism further includes: a conversion toothed belt, which is arranged on the peripheral side of the conveying body; a driving motor and a linkage structure connected to the driving motor and driven by the driving motor, which are arranged on the silicon rod processing platform of the machine base 1, and the linkage structure includes a rotating gear meshed with the conversion toothed belt. In this way, the rotating gear drives the conveying body to rotate under the drive of the driving motor to drive the silicon rod positioning mechanism and the silicon rods 100 (200) thereon to convert to other functional positions to complete the conveying, and the driving motor can be a servo motor.

[0084] In some embodiments, the silicon rod conversion device 4 may further include a locking mechanism (not shown in the figure) for locking the conveying body. For example, the locking mechanism may include a locking latch and a locking cylinder connected to the locking latch, wherein the number of the locking latches may be multiple and evenly distributed on the edge of the conveying body (for example, the number of the locking latches is four and evenly distributed at a 90° angle). In practical applications, when the silicon rod needs to be converted from a certain processing position to another processing position, the locking cylinder drives the locking latch to contract and unlock the conveying body, thereby enabling the conveying body to rotate; when the silicon rod is converted, that is, the silicon rod is converted from a certain processing position to a target processing position, the locking cylinder in the locking mechanism drives the locking latch to extend and act on the conveying body to lock the conveying body.

[0085] As mentioned above, the silicon rods in the waiting area can be pre-processed. The silicon rod cutting and grinding machine described in the present application also includes a silicon rod transfer device 6, which is adjacent to the waiting area of ​​the silicon rod processing platform and is used to transfer the silicon rods 100 (200) to be processed to the waiting area of ​​the silicon rod processing platform or to transfer the processed silicon rods in the waiting area out of the silicon rod processing platform.

[0086] The silicon rod transfer device 6 further includes: a transfer base, a silicon rod platform, and a platform turning mechanism.

[0087] As mentioned above, the silicon rod transfer device is used to transfer the silicon rod 100 to be processed to the waiting area of ​​the silicon rod processing platform or to transfer the processed silicon rod 200 in the waiting area out of the silicon rod processing platform, wherein the cross section of the silicon rod 100 is circular and the cross section of the silicon rod 200 is square.

[0088] In certain embodiments, a first silicon rod transfer device dedicated to round silicon rods 100 and a second silicon rod transfer device dedicated to square silicon rods 200 are provided.

[0089] In certain embodiments, a silicon rod transfer device that can be used for round silicon rods 100 and square silicon rods 200 is provided.

[0090] The transfer base is slidably mounted on the machine base 1 through a sliding mechanism. In this embodiment, the sliding mechanism can achieve sliding in at least two directions. For example, the sliding mechanism includes a support portion, a conversion portion, a first direction sliding unit disposed between the support portion and the conversion portion, and a second direction sliding unit disposed between the conversion portion and the transfer base, wherein the first direction sliding unit may include a first direction slide rail, a first direction slider or slider corresponding to the first direction slide rail, and a first direction driving source, and the second direction sliding unit may include a second direction slide rail, a second direction slider or slider corresponding to the second direction slide rail, and a second direction driving source.

[0091] Wherein, the first slide rail, the first direction slider or slider, the second slide rail, the second direction slider or slider are arranged in a horizontal state, and any of the first direction drive source and the second direction drive source may include: a sliding rack and a rotating gear meshed with the sliding rack (not shown in the figure) and a sliding drive motor. With the first direction sliding unit, the first drive source can drive the conversion part and the transfer base thereon to slide along the first direction through the first direction slider or slider and the first direction slide rail. With the second direction sliding unit, the second drive source can drive the transfer base to slide along the second direction through the second direction slider or slider and the second direction slide rail.

[0092] In some examples, the first direction may be, for example, a left-right direction (ie Figure 2 and Figure 3 The second direction may be, for example, the front-to-back direction (i.e. Figure 2 and Figure 3 in the Y-axis direction).

[0093] The silicon rod platform is movably arranged on the transfer base, and is used to place the silicon rod 100 (200) horizontally (i.e., horizontally). In this embodiment, the silicon rod platform is a plate-like structure or a frame structure, and at least one silicon rod support bracket is provided at least at the front and rear ends of the silicon rod platform, respectively, for supporting the front and rear ends of the silicon rod 100 (200), so that the silicon rod 100 (200) can be placed horizontally. At the same time, stopper structures can also be provided on the left and right sides of the silicon rod platform, respectively, for limiting the movement of the silicon rod 100 (200) in the left and right directions.

[0094] We know that in subsequent processing operations, the silicon rod 100 needs to be converted from a horizontal state (horizontally placed) to an upright state (vertically placed). Therefore, in the present application, a silicon rod fastening mechanism may also be provided for fastening the silicon rod during the silicon rod transfer process (not shown in the figure). In some embodiments, the silicon rod fastening mechanism may include a fastening claw and a fastening motor or a fastening cylinder for controlling the fastening claw. Furthermore, the silicon rod fastening mechanism includes at least two pairs of fastening claws, and at least two pairs of fastening claws correspond to the two aforementioned silicon rod support brackets, that is, a pair of fastening claws corresponds to a silicon rod support bracket and the two fastening claws in a pair of fastening claws are arranged on the left and right sides of the silicon rod support bracket, and each fastening claw is configured with a fastening motor or a fastening cylinder. In practical applications, when the silicon rod 100 (200) lies horizontally on the silicon rod platform, the fastening motor or the fastening cylinder drives the corresponding fastening claws toward the silicon rod 100 (200) on the silicon rod platform, so that the overall fastening of the silicon rod 100 (200) is achieved through the cooperation of at least two pairs of fastening claws. Preferably, a buffer component can be provided at the contact point between the fastening claws and the silicon rod 100 (200) to avoid or reduce damage to the silicon rod 100 (200).

[0095] In order to convert the silicon rod 100 from a horizontal state (horizontally placed) to an upright state (vertically placed), the silicon rod transfer device 6 also includes a platform flipping mechanism. The platform flipping mechanism is used to drive the silicon rod platform to flip relative to the transfer base, so that the silicon rod 100 (200) is placed vertically on the silicon rod conversion device 4. In this embodiment, the platform flipping mechanism includes: a mounting frame, a mobile frame, a flip cylinder or a flip motor, a flip rack, and a flip gear. The mounting frame is fixed on the transfer base. In some embodiments, the mounting frame is a plate-like structure or a frame structure. The mobile frame is movably mounted above the mounting frame. In some embodiments, the mobile frame is a hollow plate-like structure or a frame structure. Further, flip racks are respectively provided on the left and right opposite sides of the mobile frame adjacent to the silicon rod conversion device 4, and correspondingly, flip gears are respectively provided on the left and right opposite sides of the flip end of the silicon rod platform adjacent to the silicon rod conversion device 4, and the flip gears are meshed with the corresponding flip racks. The flip cylinder or flip motor is used to drive the mobile frame to move relative to the mounting frame. Taking the flip cylinder as an example, the flip cylinder is arranged in the hollow area of ​​the mobile frame as a whole. Specifically, the cylinder body (for example, including a cylinder barrel and a piston) in the flip cylinder is arranged on the mounting frame, and the piston rod in the flip cylinder is connected to the mobile frame. In practical applications, for the silicon rod platform to flip from a horizontal state to a vertical state: the flip cylinder is actuated, the piston rod extends and pushes the mobile frame, so that the mobile frame moves relative to the mounting frame under the push, and the flip rack on the mobile frame also moves with the mobile frame. The flip gear on the silicon rod platform that is meshed with the flip rack rotates under the drive of the flip rack, thereby driving the silicon rod platform to flip, and finally realizing the flipping of the silicon rod platform from a horizontal state to a vertical state. For flipping the silicon rod platform from a vertical state to a horizontal state: the flip cylinder is actuated, the piston rod contracts and pulls the moving frame, so that the moving frame moves relative to the mounting frame under the push, and the flip rack on the moving frame also moves with the moving frame, and the flip gear on the silicon rod platform that is meshed with the flip rack rotates under the drive of the flip rack, thereby driving the silicon rod platform to flip, and finally realizing the flipping of the silicon rod platform from a vertical state to a horizontal state.

[0096] It should be added that: In addition, in order to enable the mobile frame to move smoothly and steadily relative to the mounting frame, the mounting frame is provided with slide rails on the left and right opposite sides, and the left and right opposite sides of the bottom of the mobile frame are provided with sliders or slide bars for sliding on the slide rails. Of course, the above is only an exemplary description and is not intended to limit the present invention. For example, in other embodiments, the slide rails can be replaced on the mobile frame and the sliders or slide bars can be replaced on the mounting frame. Furthermore, in order to avoid or reduce the collision damage caused by the silicon rod platform to the mobile frame, the mounting frame or the flip cylinder or the flip motor during the flipping process (for example, when the silicon rod platform flips from a vertical state to a horizontal state), a relatively raised buffer can be further provided on the mobile frame or the mounting frame.

[0097] The silicon rod transfer device 6 may also include a lifting mechanism. The lifting mechanism is arranged on the silicon rod platform, and is used to lift the silicon rod 100 (200) after flipping. In this embodiment, the lifting mechanism may include a slide rail or a slide rod and a lifting motor or a lifting cylinder, wherein, in order to realize the lifting movement of the silicon rod 100 (200), the silicon rod support bracket is arranged on the silicon rod platform through a slide rail or a slide rod (the silicon rod fastening mechanism is installed and connected to the silicon rod support bracket), and the lifting motor or the lifting cylinder controls the silicon rod support bracket (together with the silicon rod fastening mechanism) to perform lifting movement, thereby driving the silicon rod 100 (200) to achieve lifting. Still taking the lifting cylinder as an example, the lifting cylinder is arranged in the middle of the silicon rod platform as a whole. Specifically, the cylinder body (for example, including a cylinder barrel and a piston) in the lifting cylinder is arranged on the silicon rod platform, and the piston rod in the lifting cylinder is connected to the silicon rod support bracket. In actual application, the lifting cylinder is actuated, the piston rod is telescoped (extended or contracted) and pushes and pulls (pushes or pulls) the silicon rod support bracket, so that the silicon rod support bracket moves up and down relative to the mounting frame under the push and pull, and the silicon rods 100 (200) on the silicon rod support bracket also move up and down with the silicon rod support bracket.

[0098] The aforementioned silicon rod transfer device 6 is only an exemplary description, but is not limited thereto, and the silicon rod transfer device may still be modified in other ways.

[0099] In some embodiments, the silicon rod transfer device may include: a reversing carrier, a silicon rod clamp disposed on the reversing carrier, and a reversing drive mechanism for driving the reversing carrier to perform a reversing motion.

[0100] The reversing carrier is a main device for setting up other various components in the silicon rod transfer device. The other various components may mainly include silicon rod clamps, but are not limited to this. Other components may also be, for example, mechanical structures, electrical control systems, and numerical control equipment. In this embodiment, the reversing carrier may include a base, a top frame opposite to the base, and a support structure arranged between the base and the top frame. In addition, another important function of the reversing carrier is to support the reversing conversion of the silicon rod clamp through reversing movement. The reversing carrier may, for example, perform reversing movement through a reversing drive mechanism. Using the reversing drive mechanism, the reversing carrier can be driven to perform reversing movement so that the silicon rod clamp on the reversing carrier clamps the silicon rod 100 to be processed and transfer it from the loading and unloading area to the corresponding waiting area, or clamp the processed silicon rod 200 corresponding to the waiting area and transfer it from the waiting area to the loading and unloading area.

[0101] In a specific implementation, a reversing drive mechanism that enables the reversing carrier to realize the reversing motion may include a rotating shaft and a rotating motor, and the reversing carrier is connected to the mounting base structure thereunder through the rotating shaft. When implementing the steering motion, the rotating motor is started to drive the rotating shaft to rotate so as to drive the reversing carrier to rotate to realize the reversing motion. The aforementioned driving rotating shaft rotation can be designed as a unidirectional rotation or a bidirectional rotation. The unidirectional rotation can be, for example, a unidirectional clockwise rotation or a unidirectional counterclockwise rotation, and the bidirectional rotation can be, for example, to realize clockwise rotation and counterclockwise rotation. In addition, the angle of rotation of the driving rotating shaft can be set according to the actual structure of the silicon rod transfer device. Furthermore, the base in the reversing carrier can adopt a disc structure, a rectangular disc or an elliptical disc, and its central position is connected to the rotating shaft, but the shape of the base is not limited thereto. In other embodiments, the base can also adopt other shapes.

[0102] A silicon rod clamp is provided on the reversing carrier for clamping the corresponding silicon rod. For example, in some embodiments, a silicon rod clamp is provided on a certain mounting surface of the reversing carrier, and the silicon rod clamp may include at least two silicon rod clamps, wherein at least two silicon rod clamps are arranged at intervals. The silicon rod clamps in the silicon rod clamp can be used to clamp round silicon rods (i.e., silicon rods to be processed) and square silicon rods (i.e., processed silicon rods). In this way, by driving the reversing carrier to perform reversing motion, the silicon rod clamp on the reversing carrier is switched between the loading and unloading area and the waiting area to transport the silicon rods to be processed and between the waiting area and the loading and unloading area to transport the processed silicon rods. In actual applications, the rotation angle of the reversing carrier for reversing motion is determined according to the positional relationship between the loading and unloading area and the waiting area. In some embodiments, the loading and unloading area and the waiting area are arranged relative to each other, and the silicon rod transfer device is located between the two, so the reversing carrier is driven by the reversing drive mechanism to rotate 180°. In some embodiments, the loading and unloading area and the waiting area are arranged at an angle of 90 degrees, and the reversing carrier is driven by the reversing drive mechanism to rotate at an angle of 90 degrees. However, in any case, there is no specific restriction on the positional relationship between the loading and unloading area and the waiting area, and their arrangement order and the angles between them can still be changed in other ways, as long as it is ensured that no unnecessary interference occurs between the various workstations. In this way, the rotation direction and rotation angle of the reversing carrier can also be adaptively adjusted.

[0103] In some embodiments, both the silicon rod to be processed and the processed silicon rod are placed vertically, so at least two silicon rod clamps in the silicon rod clamp are arranged at intervals up and down. Any silicon rod clamp may further include: a clamp arm mounting seat and two clamp arms, wherein the clamp arm mounting seat is arranged on the reversing carrier, and at least two clamp arms are movably arranged on the clamp arm mounting seat. The two clamp arms are arranged symmetrically on the left and right, and the two clamp arms can form a clamping space for clamping a single-wafer silicon rod or a silicon cube. In addition, the silicon rod clamp can also have the function of centering adjustment. Under normal circumstances, when the clamp arms in the silicon rod clamp are in the clamped state, the center of the clamping space formed by the two clamp arms coincides with the center of the silicon rod to be processed and the processed silicon rod. Therefore, when the silicon rod clamp is used to clamp the vertically placed silicon rod to be processed or the processed silicon rod, the two clamp arms in the silicon rod clamp shrink, and the clamp arms are against the silicon rod to be processed or the processed silicon rod. In the process of the clamping arms contracting and clamping the silicon rod to be processed or the processed silicon rod, the silicon rod to be processed or the processed silicon rod is pushed by the two clamping arms on both sides and moves toward the central area of ​​the clamping space until the silicon rod to be processed or the processed silicon rod is clamped by the two clamping arms in the silicon rod clamping piece. At this time, the center of the silicon rod to be processed or the processed silicon rod can be located at the center of the clamping space of the silicon rod clamping piece.

[0104] In order to enable at least two clamping arms in the silicon rod clamp to smoothly and firmly clamp the silicon rods to be processed or processed silicon rods of different sizes, at least one of the clamping arms in the silicon rod clamp is designed to be adjustable. Taking two clamping arms as an example, at least one of the two clamping arms is designed to be movable (one or both of the two clamping arms are designed to be movable), so that the clamping distance between the two clamping arms can be adjusted.

[0105] In addition, the silicon rod clamp in the silicon rod transfer device of the present application may have other changes. For example, the silicon rod transfer device may be configured with two silicon rod clamps, and the two silicon rod clamps may be respectively arranged on two opposite mounting surfaces in the reversing carrier. Moreover, the two silicon rod clamps may be the same or different. In an embodiment in which the two silicon rod clamps are the same, the two silicon rod clamps are used to clamp round silicon rods and square silicon rods. In an embodiment in which the two silicon rod clamps are different, one of the two silicon rod clamps is used to clamp round silicon rods, and the other silicon rod clamp is used to clamp square silicon rods.

[0106] Furthermore, the silicon rod transfer device 6 in the present application can provide movement in at least one direction. For example, the silicon rod transfer device can also include a forward and backward mechanism, and the forward and backward mechanism can include: an advance and backward guide rail and an advance and backward motor, wherein the advance and backward guide rail is arranged along the front and back direction, and the base of the reversing carrier can be supported on the advance and backward guide rail through a slider, so that when the position of the reversing carrier needs to be adjusted, the advance and backward motor drives the reversing carrier to advance and retreat along the advance and backward guide rail.

[0107] The silicon rod cutting and grinding machine of the present application further includes a positioning detection device. In this embodiment, the positioning detection device (not shown in the figure) is used to perform edge detection and center positioning on the silicon rod 100 located in the waiting area.

[0108] The positioning detection device further includes: an edge detection unit and an axis adjustment unit.

[0109] In some embodiments, the edge detection unit includes a contact detection mechanism, a rotating mechanism, and a detection controller electrically connected to the contact detection mechanism and the rotating mechanism, wherein the contact detection structure is used to send an on-off signal to the detection controller by contacting the edge of the silicon rod, and the rotating mechanism is used to adjust the position of the silicon rod according to the control of the detection controller.

[0110] The number of silicon rod positioning mechanisms may be varied according to actual needs but is not limited thereto. For example, the number of silicon rod positioning mechanisms may be determined according to the number of functional locations provided on the silicon rod processing platform.

[0111] In some embodiments, the silicon rod positioning mechanism may further include: a rotating support platform,

[0112] In some embodiments, the axis adjustment unit is used to position the axis of the silicon rod 100 at the center of the pretreatment zone, and includes a clamping mechanism, which is used to form a clamping space for clamping the silicon rod and the center of the clamping space coincides with the center of the pretreatment zone.

[0113] In a specific implementation, the clamping mechanism may include at least two clamping members, and each clamping member may include at least two clamping arms.

[0114] In view of the circular cross-section of the silicon rod, in some examples, the clamping member is a circular workpiece fixture as a whole, and the clamping arms constituting the clamping member are two symmetrically designed, and a single clamping arm is designed to have an arc-shaped clamping surface. Preferably, the arc-shaped clamping surface of a single clamping arm should exceed a quarter of the arc of the silicon rod 100, so that the arc-shaped clamping surface of the clamping member composed of two clamping arms should exceed a half of the arc of the silicon rod 100. Of course, additional buffer pads can be provided on the arc-shaped clamping surface in the clamping arm to avoid damage to the surface of the silicon rod during the clamping of the silicon rod, thereby achieving a good effect of protecting the silicon rod. Under normal circumstances, when the clamping arms in the clamping member are in the clamped state, the center of the clamping space formed by the two clamping arms coincides with the center of the silicon rod 100. Therefore, when the clamping member is used to clamp the silicon rod 100 placed upright in the area to be processed, the two clamping arms in the clamping member are contracted, and the arc-shaped clamping surface in the clamping arm is against the silicon rod. During the process of the clamping arms contracting and clamping the silicon rod 100, the silicon rod 100 is pushed by the two clamping arms on both sides and moves toward the central area of ​​the clamping space until the silicon rod 100 is clamped by the clamping arms in the clamping member. At this time, the center of the silicon rod 100 is located in the center of the clamping space of the clamping member.

[0115] When the silicon rod 100 to be processed is transferred to the waiting area of ​​the silicon rod processing platform by the silicon rod transfer device 6 and pre-processed, the silicon rod conversion device 4 can convert the silicon rod from the waiting area to other processing areas.

[0116] The cutting device is used to perform square cutting operations on silicon rods, so as to cut silicon rods with circular cross-sections into square silicon rods with rectangular cross-sections.

[0117] The cutting device comprises a cutting unit, and the cutting unit comprises two orthogonal cutting wire saws, which are used to cut the silicon rod to be cut at the cutting position to form two orthogonal side surfaces.

[0118] In some embodiments, the silicon rod cutting and grinding machine includes a cutting device, and the cutting device includes a cutting unit, and correspondingly, the silicon rod processing platform includes a cutting area. When the silicon rod is squared by the cutting device, the silicon rod to be cut at the cutting area is firstly cut by the cutting unit at the first folding surface to form two orthogonal side surfaces, and then the position of the silicon rod to be cut is changed or the position of the cutting unit is changed, and then the silicon rod to be cut at the cutting area is cut by the cutting unit at the second folding surface to form two orthogonal side surfaces, so that the cross section of the silicon rod to be cut is rectangular.

[0119] In some embodiments, the silicon rod cutting and grinding machine includes two cutting devices, wherein each of the cutting devices includes at least one cutting unit, for example, the silicon rod cutting and grinding machine includes a first cutting device and a second cutting device, wherein the first cutting device includes a first cutting unit, and the second cutting device includes a second cutting unit, and correspondingly, the silicon rod processing platform includes a first cutting position corresponding to the first cutting device and a second cutting position corresponding to the second cutting device. When the silicon rod is squared, the first cutting unit in the first cutting device is used to perform a first folding surface cutting on the silicon rod to be cut at the first cutting position to form two orthogonal side surfaces, and then the position of the silicon rod to be cut is converted from the first cutting position to the second cutting position, and then the second cutting unit in the second cutting device is used to perform a second folding surface cutting on the silicon rod to be cut at the second cutting position to form two orthogonal side surfaces, so that the cross-section of the silicon rod to be cut is rectangular.

[0120] In some embodiments, the silicon rod cutting and grinding machine includes a cutting device, the cutting device includes a first cutting unit and a second cutting unit, and correspondingly, the silicon rod processing platform includes a first cutting position corresponding to the first cutting unit and a second cutting position corresponding to the second cutting unit. When the silicon rod is squared, the first cutting unit is used to perform a first folding cut on the silicon rod to be cut at the first cutting position to form two orthogonal side surfaces, and then the position of the silicon rod to be cut is transferred from the first cutting position to the second cutting position, and then the second cutting unit is used to perform a second folding cut on the silicon rod to be cut at the second cutting position to form two orthogonal side surfaces, so that the cross-section of the silicon rod to be cut is rectangular.

[0121] exist Figure 1 and Figure 2 In the illustrated embodiment, the silicon rod cutting and grinding machine includes a cutting device 2, and the cutting device 2 further includes a first cutting unit and a second cutting unit. The cutting device 2 is arranged on the machine base 1, and is used to perform a first folding surface cutting on the silicon rod 100 on the first cutting position of the silicon rod processing platform and a second folding surface cutting on the silicon rod 100 on the second cutting position of the silicon rod processing platform, so as to form a silicon rod with a rectangular cross section. Wherein, any one of the first folding surface cutting and the second folding surface cutting refers to cutting the silicon rod to form two orthogonal side surfaces.

[0122] Combination Figures 1 to 3 In the silicon rod cutting and grinding machine, the cutting device 2 includes: a cutting frame 21, a cutting support 22, a first cutting unit 23, and a second cutting unit 25.

[0123] The cutting frame 21 is disposed on the machine base 1. In this embodiment, the cutting frame 21 is a columnar structure or a frame structure, and serves as a supporting body of the cutting device 2, and can provide support for other components in the cutting device 2.

[0124] The cutting support 22 can be lifted and lowered on the cutting frame 21 by a lifting mechanism. In some embodiments, the lifting mechanism may include a mechanism including a lifting motor, a lifting guide rail, and a lifting slider, etc., which can realize the vertical movement of the cutting support 22, wherein the lifting guide rail is vertically arranged on the cutting frame 21, and the lifting slider is arranged on the back of the cutting support 22 and cooperates with the lifting guide rail. In order to enable the cutting support 22 to realize a stable lifting and lowering installation structure on the machine base 1, a double guide rail design can be adopted, that is, two lifting guide rails are adopted, and the two lifting guide rails are arranged in parallel. Driven by the lifting motor (the lifting motor can be, for example, a servo motor), the cutting support 22 can be lifted and lowered relative to the cutting frame 21 and the machine base 1 by means of the lifting guide rail and the lifting slider.

[0125] In this embodiment, since the cutting support 22 can be used to configure the first cutting unit 23 and the second cutting unit 25, that is, the first cutting unit 23 and the second cutting unit 25 share the cutting support 22. Therefore, in this embodiment, on the one hand, the cutting frame 21 and the cutting support 22 in the cutting device 2 are arranged at the center between the first cutting position and the second cutting position. On the other hand, the cutting support 22 is specially designed. Figures 1 to 5 As shown, the cutting support 22 in this embodiment may include a support body and a first support wing and a second support wing located at opposite sides of the support body.

[0126] The first cutting unit 23 is disposed at a first side of the cutting support 22 and is used for performing a first folding surface cutting on the silicon rod 100 at the first cutting position of the silicon rod processing platform.

[0127] In this embodiment, as mentioned above, the cutting support 22 includes a support body and a first support wing and a second support wing located at opposite sides of the support body, so the first cutting unit 23 is installed at the first support wing of the cutting support 22. Specifically, the first cutting unit 23 includes a first wire frame 231 disposed on the first support wing, a plurality of first cutting wheels 233 disposed on the first wire frame 231, and a first cutting wire 235, and the first cutting wire 235 is sequentially wound around the plurality of first cutting wheels 233 to form two orthogonal first cutting wire saws.

[0128] In actual applications, the first cutting unit 23 may include at least four first cutting wheels 233, and the four first cutting wheels 233 may be combined into two orthogonal first cutting wheel groups, that is, two first cutting wheels arranged opposite to each other along the M axis form one first cutting wheel group, and two first cutting wheel groups along the N axis form a pair of first cutting wheel groups, wherein the M axis is orthogonal to the N axis. Specifically, the first cutting unit 23 includes two orthogonal first cutting wheel groups, wherein one first cutting wheel group includes two first cutting wheels 233 arranged front and back (along the M axis), and the other first cutting wheel group includes two first cutting wheels 233 arranged front and back (along the N axis).

[0129] The first cutting wire 235 is sequentially wound around each first cutting wheel 233 in the first cutting unit 23 to form a first cutting wire net. In actual applications, the first cutting wire 235 is sequentially wound around the four first cutting wheels 233 in the first cutting unit 23 to form two mutually orthogonal first cutting wire saws, constituting a first cutting wire net. Specifically, the first cutting wire 235 is wound around two first cutting wheels 233 arranged front and back (along the M axis) in one first cutting wheel group to form one first cutting wire saw, and the first cutting wire 235 is wound around two first cutting wheels 233 arranged front and back (along the N axis) in another first cutting wheel group to form another second cutting wire saw. In this way, the two mutually orthogonal first cutting wire saws cooperate to form a first cutting wire net in the shape of a "Γ".

[0130] Of course, the first cutting unit 23 is not Figures 1 to 3 The embodiments shown are limited thereto, and other changes may be made in other embodiments.

[0131] In this embodiment, the first cutting unit 23 may further include a transition wheel 234 for implementing transition guidance of the first cutting line 235. The transition wheel 234 may not be limited to one, and may be disposed on the first wire frame 231 and / or the first support wing. For example, in some embodiments, some transition wheels 234 may be disposed on the first wire frame 231, in some embodiments, some transition wheels 234 may be disposed on the first support wing, and in some embodiments, some transition wheels 234 may be disposed on the first wire frame 231, and some transition wheels 234 may be disposed on the first support wing.

[0132] In addition, in some embodiments, the first cutting unit 23 may further include a tension wheel disposed on the first wire frame 231 and / or the side wing of the first support, for adjusting the tension of the first cutting wire 235 .

[0133] The second cutting unit 25 is disposed on a second side of the cutting support 22 and is used for performing a second folding surface cutting on the silicon rod 100 on the second processing area of ​​the silicon rod processing platform.

[0134] In this embodiment, as mentioned above, the cutting support 22 includes a support body and a first support wing and a second support wing located on opposite sides of the support body, so the second cutting unit 25 is installed at the second support wing of the cutting support 22. Specifically, the second cutting unit 25 includes a second wire frame 251 disposed on the second support wing, a plurality of second cutting wheels 253 disposed on the second wire frame 251, and a second cutting wire 255, and the second cutting wire 255 is sequentially wound around the plurality of second cutting wheels 253 to form two orthogonal second cutting wire saws.

[0135] In actual applications, the second cutting unit 25 may include at least four second cutting wheels 253, and the four second cutting wheels 253 may be combined into two orthogonal second cutting wheel groups, that is, two second cutting wheels arranged opposite to each other along the M axis form one second cutting wheel group, and two second cutting wheel groups arranged along the N axis form a pair of second cutting wheel groups, wherein the M axis is orthogonal to the N axis. Specifically, the second cutting unit 25 includes two orthogonal second cutting wheel groups, wherein one second cutting wheel group includes two second cutting wheels 253 arranged front and back (along the M axis), and the other second cutting wheel group includes two second cutting wheels 253 arranged front and back (along the N axis).

[0136] The second cutting wire 255 is sequentially wound around each second cutting wheel 253 in the second cutting unit 25 to form a second cutting wire net. In actual applications, the second cutting wire 255 is sequentially wound around the four second cutting wheels 253 in the second cutting unit 25 to form two mutually orthogonal second cutting wire saws, forming a second cutting wire net. Specifically, the second cutting wire 255 is wound around two second cutting wheels 253 arranged front and back (along the M axis) in one second cutting wheel group to form one second cutting wire saw, and the second cutting wire 255 is wound around two second cutting wheels 253 arranged front and back (along the N axis) in another second cutting wheel group to form another second cutting wire saw. In this way, these two mutually orthogonal second cutting wire saws cooperate to form a second cutting wire net in the shape of a "Γ".

[0137] Of course, the second cutting unit 25 is not Figures 1 to 4 The embodiments shown are limited thereto, and other changes may be made in other embodiments.

[0138] In this embodiment, the second cutting unit 25 may further include a transition wheel 254 for realizing transition guidance of the second cutting line 255. The transition wheel 254 may not be limited to one, and it may be arranged on the first wire frame 231 and / or the first support side wing. For example, in some embodiments, some transition wheels 254 may be arranged on the second wire frame 251, in some embodiments, some transition wheels 254 may be arranged on the second support side wing, in some embodiments, some transition wheels 254 may be arranged on the second wire frame 251, and some transition wheels 254 may be arranged on the second support side wing.

[0139] In addition, in some embodiments, the second cutting unit 25 may further include a tension wheel disposed on the second wire frame 251 and / or the side wing of the second support, for adjusting the tension of the second cutting wire 255 .

[0140] In some embodiments, the first cutting line and the second cutting line are the same cutting line. The cutting device further comprises a wire-retracting and wire-unretracting unit. For example, the wire-retracting and wire-unretracting unit may comprise a wire-unreel and a wire-retracting reel, and the wire-unreel and the wire-retracting reel may be arranged on a machine base or a cutting frame.

[0141] In such Figure 1 In the embodiment of, the first cutting line 235 in the first cutting unit 23 and the second cutting line 255 in the second cutting unit 25 can be the same cutting line. In this case, the common cutting line is sequentially wound around the multiple first cutting wheels 233 (and transition wheels) in the first cutting unit 23 to form two orthogonal first cutting line saws, and then transferred to the second cutting unit next to it to be sequentially wound around the multiple second cutting wheels 253 (and transition wheels) in the second cutting unit 25 to form two orthogonal second cutting line saws. Therefore, in this embodiment, the cutting support 22 is also provided with one or more guide wheels located between the first cutting unit 23 and the second cutting unit 25 for winding the common cutting line. Specifically, in Figure 4 In the illustrated embodiment, an intermediate transition wheel 26 for winding the common cutting line is provided on the support body 221 located between the first cutting unit 23 and the second cutting unit 25 in the cutting support 22 .

[0142] In addition, in Figure 1 In the embodiment shown, the cutting device further comprises a wire retracting and unreeling unit. For example, the wire retracting and unreeling unit may comprise a wire reeling reel and a wire reeling reel, which may be arranged on the machine base 1 and located on opposite sides of the cutting frame 21, for retracting and unreeling the common cutting wire.

[0143] The first cutting unit 23 and the second cutting unit 25 share the same cutting line, which can simplify the cutting unit structure (for example, eliminating a set of wire reels and wire reels), has good integrity, simplifies the winding process, improves efficiency, and can better control the wire tension of the two cutting units.

[0144] In some embodiments, the first cutting unit and the second cutting unit in the cutting device are independent components. Then, the cutting device also includes a first wire-retracting and paying-out unit cooperating with the first cutting unit, and a second wire-retracting and paying-out unit cooperating with the second cutting unit, wherein the first wire-retracting and paying-out unit includes a first wire-retracting reel and a first wire-retracting reel arranged on a machine base or a cutting frame, and used for retracting and releasing the first cutting line, and the second wire-retracting and paying-out unit includes a second wire-retracting reel and a second wire-retracting reel on the machine base or the cutting frame, and used for retracting and releasing the second cutting line.

[0145] Of course, in addition to adopting the retractable wire unit, the cutting wire can still make other changes.

[0146] In some embodiments, the first cutting unit and the second cutting unit in the cutting device are independent components, wherein, for the first cutting unit, the first cutting line is wound around a plurality of first cutting wheels and a first transition wheel to form a first closed-loop cutting line connected end to end, and for the second cutting unit, the second cutting line is wound around a plurality of second cutting wheels and a second transition wheel to form a second closed-loop cutting line connected end to end. The first closed-loop cutting line and the second closed-loop cutting line can avoid the acceleration and deceleration process of the cutting line affecting the cutting accuracy during the operation to perform cutting, thereby improving the cutting accuracy and being beneficial to simplifying subsequent processes.

[0147] In some embodiments, the first cutting line in the first cutting unit and the second cutting line in the second cutting unit may be the same cutting line. In this case, the common cutting line is wound around the plurality of first cutting wheels, the first transition wheel, the intermediate transition wheel, the plurality of second cutting wheels and the second transition wheel to form a closed-loop cutting line connected end to end. The closed-loop cutting line can avoid the acceleration and deceleration process of the cutting line affecting the cutting accuracy during the operation to perform cutting, thereby improving the cutting accuracy and simplifying the subsequent processes.

[0148] When using Figure 2When the cutting device 2 in the illustrated embodiment cuts the silicon rods on the first cutting position and the silicon rods on the second cutting position of the silicon rod processing platform, the cutting support 22 is driven to descend relative to the cutting frame 21, and the first cutting units 23 and the second cutting units 25 on the left and right sides of the cutting support 22 simultaneously cut the corresponding silicon rods on the first cutting position and the second cutting position, wherein the first cutting unit 23 performs first folding surface cutting on the silicon rods on the first cutting position (the first cutting unit 23 is provided with two orthogonal first cutting wire saws in the shape of a "Γ"), and the second cutting unit 25 performs second folding surface cutting on the silicon rods on the second cutting position (the second cutting unit 25 is provided with two orthogonal second cutting wire saws in the shape of a "Γ"). It can be seen that in this embodiment, the first cutting unit 23 and the second cutting unit 25 in the cutting device 2 share the cutting support 22. By driving the shared cutting support 22 to move up and down, the first cutting unit 23 and the second cutting unit 25 thereon can respectively perform the first folding surface cutting on the silicon rod at the first cutting position and the second folding surface cutting on the silicon rod at the second cutting position at the same time. The cutting device 2 has a simple structure as a whole, is easy to control, and can improve the efficiency and quality of silicon rod cutting.

[0149] It should be noted that in the present embodiment, when the first folding cut is performed on the silicon rod to be cut in the first cutting unit 23, the intersection of the two orthogonal first cutting wire saws is located within the cross section of the silicon rod to be cut (including the case where the intersection is located on the circumference of the cross section), and when the second folding cut is performed on the silicon rod to be cut in the second cutting unit 25, the intersection of the two orthogonal second cutting wire saws is located within the cross section of the silicon rod to be cut (including the case where the intersection is located on the circumference of the cross section), so that the formed cut silicon rod obtains the largest possible cross section (the surface area of ​​the silicon wafer obtained after subsequent slicing is larger), reduces the material loss in subsequent grinding operations (such as grinding and chamfering, etc.), and improves the utilization rate of silicon materials.

[0150] By means of the cutting device 2, after the first cutting operation (the first cutting unit 23 performs a first folding surface cutting on the silicon rod 100) and the second cutting operation (the second cutting unit 25 performs a second folding surface cutting on the silicon rod 100), a square silicon rod (i.e., a silicon rod having a rectangular cross-section) is formed.

[0151] In the silicon rod cutting and grinding machine of the present application, the cutting device also includes a distance adjustment unit. Figure 1 and Figure 2In the embodiment shown, the cutting device includes a cutting frame 21, a cutting support 22, a first cutting unit 23, and a second cutting unit 25, and further includes a first distance adjusting unit 53 and a second distance adjusting unit 55. The first distance adjusting unit 53 is arranged on the first support wing of the cutting support 22, and is used to adjust the position of the first cutting unit 23; the second distance adjusting unit 55 is arranged on the second support wing of the cutting support 22, and is used to adjust the position of the second cutting unit 25.

[0152] When the silicon rod to be cut is placed on the silicon rod positioning mechanism and its position is fixed, the cutting position of at least one cutting wire saw in the cutting unit can be adjusted by adjusting the position of the corresponding cutting unit through the distance adjustment unit, which can be used to control the cutting amount of the silicon rod, so that silicon rods to be cut of different sizes can be cut according to the production process requirements and / or cut out cut silicon rods of different sizes.

[0153] Taking the first cutting unit as an example, by adjusting the position of the first cutting unit through the first distance adjusting unit, the cutting position of at least one first cutting wire saw in the first cutting unit 23 can be adjusted. Taking the second cutting unit as an example, by adjusting the position of the second cutting unit through the second distance adjusting unit, the cutting position of at least one second cutting wire saw in the second cutting unit 25 can be adjusted.

[0154] Therefore, in some embodiments, the first distance adjustment unit includes a first wire rack adjustment mechanism, which is used to adjust the position of the first wire rack and the multiple first cutting wheels and the first transition wheels thereon, and the second distance adjustment unit includes a second wire rack adjustment mechanism, which is used to adjust the position of the second wire rack and the multiple second cutting wheels and the second transition wheels thereon.

[0155] Combination Figure 3 and Figure 4 , Figure 3 The figure shows a top view of a cutting device in a silicon rod cutting and grinding machine according to an embodiment of the present invention. Figure 4 Shown is a schematic structural diagram of the first cutting unit of the cutting device in the silicon rod cutting and grinding machine of the present application.

[0156] like Figure 3 and Figure 4As shown, the first spacing adjustment unit 53 includes a first wire frame adjustment mechanism (in the following description, the first wire frame adjustment mechanism is marked as 53), and the first wire frame adjustment mechanism 53 is used to adjust the position of the first wire frame 231 and the multiple first cutting wheels 233 and the first transition wheel 234 thereon. The adjustment of the position of the first wire frame 231 and the multiple first cutting wheels 233 and the first transition wheel 234 thereon can be, for example, driving the first wire frame 231 and the multiple first cutting wheels 233 and the first transition wheel 234 thereon to move along the X-axis, so that the two orthogonal first cutting lines in the first cutting unit change their positions by moving along the X-axis. For example, by using the first wire frame adjustment mechanism 53 to drive the first wire frame 231 and the multiple first cutting wheels 233 and the first transition wheel 234 thereon to move toward the silicon rod conversion device 4 along the X-axis, the two orthogonal first cutting lines in the first cutting unit 23 can be moved toward the silicon rod to be cut on the silicon rod conversion device 4, so that the cutting amount of the silicon rod to be cut can be increased or the silicon rod to be cut with a smaller size can be cut. The first wire frame adjustment mechanism 53 is used to drive the first wire frame 231 and the multiple first cutting wheels 233 and the first transition wheel 234 thereon to move away from the silicon rod conversion device 4 along the X-axis, so that the two orthogonal first cutting lines in the first cutting unit 23 can be moved away from the silicon rods to be cut on the silicon rod conversion device 4, thereby reducing the cutting amount of the silicon rods to be cut or cutting larger silicon rods to be cut.

[0157] Similarly, the second spacing unit 55 includes a second wire frame adjustment mechanism (in the following description, the second wire frame adjustment mechanism is marked as 55), and the second wire frame adjustment mechanism 55 is used to adjust the position of the second wire frame 251 and the multiple second cutting wheels 253 and the second transition wheel 254 thereon. The adjustment of the position of the second wire frame 251 and the multiple second cutting wheels 253 and the second transition wheel 254 thereon can be, for example, driving the second wire frame 251 and the multiple second cutting wheels 253 and the second transition wheel 254 thereon to move along the Y axis (the Y axis is orthogonal to the X axis), so that the two orthogonal second cutting lines in the second cutting unit change their positions by moving along the X axis. For example, by using the second wire frame adjustment mechanism 55 to drive the second wire frame 251 and the multiple second cutting wheels 253 and the second transition wheel 254 thereon to move along the Y axis toward the silicon rod conversion device 4, the two orthogonal second cutting lines in the second cutting unit 25 can be moved toward the silicon rod to be cut on the silicon rod conversion device 4, which can increase the cutting amount of the silicon rod to be cut or can cut the silicon rod to be cut with a smaller size. The second wire frame adjustment mechanism 55 is used to drive the second wire frame 251 and the multiple second cutting wheels 253 and the second transition wheels 254 thereon to move away from the silicon rod conversion device 4 along the Y-axis, so that the two orthogonal second cutting lines in the second cutting unit 25 can be moved away from the silicon rods to be cut on the silicon rod conversion device 4, thereby reducing the cutting amount of the silicon rods to be cut or cutting larger silicon rods to be cut.

[0158] In some embodiments, the first wire frame adjustment mechanism may include a first screw and a first motor, wherein the first screw is associated with the first wire frame, and the first motor drives the first screw to rotate forward and reversely to drive the first wire frame to move forward and backward along the X-axis. For example, the first motor drives the first screw to rotate forward to drive the first wire frame to move toward the silicon rod conversion device along the X-axis; the first motor drives the first screw to rotate reversely to drive the first wire frame to move away from the silicon rod conversion device along the X-axis.

[0159] Similarly, the second wire frame adjustment mechanism may include a second screw rod and a second motor, wherein the second screw rod is associated with the second wire frame, and the second motor drives the second screw rod to rotate forward and reversely to drive the second wire frame to move forward and backward along the Y axis. For example, the second motor drives the second screw rod to rotate forward to drive the second wire frame to move toward the silicon rod conversion device along the Y axis; the second motor drives the second screw rod to rotate reversely to drive the second wire frame to move away from the silicon rod conversion device along the Y axis.

[0160] like Figure 4 As shown, the first wire frame adjustment mechanism 53 may include a first screw rod 531, a first synchronous belt 533, and a first motor 535, wherein the first screw rod 531 is associated with the first wire frame 231, and the first screw rod 531 is associated with the output shaft of the first motor 535 through the first synchronous belt 533, and the first motor 535 is used to drive the first screw rod 531 to rotate forward and reversely to drive the first wire frame to move forward and backward along the X-axis. For example, the first motor 535 drives the first screw rod 531 to rotate forward, driving the first wire frame 231 to move toward the silicon rod conversion device along the X-axis; the first motor 535 drives the first screw rod 531 to rotate reversely, driving the first wire frame 231 to move away from the silicon rod conversion device along the X-axis. Similarly, the second wire frame adjustment mechanism 55 may include a second screw rod 551, a second synchronous belt 553, and a second motor 555, wherein the second screw rod 551 is associated with the second wire frame 251, and the second screw rod 551 is associated with the output shaft of the second motor 555 via the second synchronous belt 553, and the second motor 555 drives the second screw rod 551 to rotate forward and reverse to drive the second wire frame to move forward and backward along the Y-axis. For example, the second motor 555 drives the second screw rod 551 to rotate forward to drive the second wire frame 251 to move along the Y-axis toward the silicon rod conversion device; the second motor 555 drives the second screw rod 551 to rotate reversely to drive the second wire frame 251 to move away from the silicon rod conversion device along the Y-axis. Figure 4 In the illustrated embodiment, the lead screw and the motor in the wire rack adjustment mechanism are connected via a synchronous belt, which can save layout space of the mechanism on a straight line (such as the X-axis or Y-axis) compared to a direct connection between the lead screw and the motor, and the structure is more compact.

[0161] In such Figure 4In the illustrated embodiment, the first wire rack adjustment mechanism may further include a first guide rail 537 disposed on the first wire rack 231, which facilitates the smooth movement of the first wire rack 231 along the X-axis. Similarly, the second wire rack adjustment mechanism may further include a second guide rail 557 disposed on the second wire rack 251, which facilitates the smooth movement of the second wire rack 251 along the Y-axis.

[0162] The first wire rack adjustment mechanism and the second wire rack adjustment mechanism may still be modified in other ways. For example, the first wire rack adjustment mechanism or the second wire rack adjustment mechanism may include: a sliding rack, a rotating gear meshing with the sliding rack, and a sliding drive motor associated with the rotating gear.

[0163] In some examples, the at least one cutting unit also includes at least one transition wheel, each transition wheel having at least two wire grooves; wherein, when the multiple cutting wheels in the at least one cutting unit are driven to move along the second direction by the at least one distance adjustment mechanism, the at least one transition wheel in the at least one cutting unit remains relatively stationary with the multiple cutting wheels.

[0164] The first distance adjusting unit includes a first wire frame adjustment mechanism, which is used to adjust the position of the first wire frame and the multiple first cutting wheels and the first transition wheel thereon; the second cutting unit includes: a second wire frame, a multiple second cutting wheels and a second transition wheel arranged on the second wire frame, and a second cutting wire, the second cutting wire is wound around the multiple second cutting wheels and the second transition wheel to form two orthogonal second cutting wires saw; the second distance adjusting unit includes a second wire frame adjustment mechanism, which is used to adjust the position of the second wire frame and the multiple second cutting wheels and the second transition wheel thereon.

[0165] In the first cutting unit or the second cutting unit, each first cutting wheel 233 has at least two cutting grooves, different cutting grooves are parallel to each other, and there is a cutting groove spacing between two adjacent cutting grooves. The cutting groove spacing between two different adjacent cutting grooves is not limited, and it can be the same (i.e., equidistant) or different. For example, the first cutting wheel has 4 cutting grooves, namely 1# cutting groove, 2# cutting groove, 3# cutting groove, and 4# cutting groove, and there is a 1# cutting groove spacing between the 1# cutting groove and the 2# cutting groove, a 2# cutting groove spacing between the 2# cutting groove and the 3# cutting groove, and a 3# cutting groove spacing between the 3# cutting groove and the 4# cutting groove. In some cases, the 1# cutting groove spacing, the 2# cutting groove spacing, and the 3# cutting groove spacing are the same. In some cases, the 1# cutting groove spacing, 2# cutting groove spacing, and 3# cutting groove spacing are not exactly the same, for example, two of the 1# cutting groove spacing, 2# cutting groove spacing, and 3# cutting groove spacing are the same and one is different, for example, three of the 1# cutting groove spacing, 2# cutting groove spacing, and 3# cutting groove spacing are all different.

[0166] Taking the first cutting unit as an example, when the first cutting wire 213 changes the cutting wire groove wound on the first cutting wheel 233, the position of the first cutting wheel on the first wire frame can be adjusted by using the first wire frame adjustment mechanism.

[0167] For example, Figure 7As shown, assuming that at the initial moment, the first cutting wire 235 is wound around the outermost cutting wire groove of the first cutting wheel 233, when the first cutting wire 235 is to be changed to be wound around the cutting wire groove on the first cutting wheel 233, for example, the winding position of the first cutting wire 235 is to be changed from the outermost cutting wire groove to other cutting wire grooves, the moving distance of the first cutting wheel 233 along the X-axis is determined according to the spacing between the outermost cutting wire groove and the cutting wire groove at the target position. In this way, the first wire frame adjustment mechanism can be used to drive the first wire frame and the first cutting wheel and the first transition wheel thereon to move along the X-axis toward the silicon rod conversion device by a distance corresponding to the determined moving distance. Subsequently, the first cutting wire 235 is wound around the cutting wire groove at the target position. After the winding is completed, the cutting space formed by the two orthogonal first cutting wire saws in the first cutting unit 23 does not change, that is, the cutting amount remains unchanged. In this way, the first cutting wire groove change is achieved. Of course, when the first wire frame adjustment mechanism is used to drive the first wire frame and the first cutting wheel and the first transition wheel thereon to move toward the silicon rod conversion device along the X-axis and the determined moving distance does not correspond to the determined moving distance, then the first cutting wire 235 is wound around the cutting wire groove at the target position. After the winding is completed, the cutting space formed by the two orthogonal first cutting wire saws in the first cutting unit 23 will change, that is, the cutting amount changes. In this way, both the cutting wire groove replacement and the cutting amount adjustment are achieved. In the above description, the reasons for changing the groove of the first cutting wire include but are not limited to the wear of the original cutting wire groove to the extent that it needs to be replaced due to long-term use. In addition, the moving distance of the first cutting wheel 233 along the X-axis is determined based on the distance between the cutting wire groove at the starting position and the cutting wire groove at the target position, which is determined based on the relationship between each cutting wire groove in the first cutting wheel and the X-axis. Figure 6 In the embodiment shown, the plane of the cutting groove in the first cutting wheel is at an angle of 45° to the X-axis, so the relationship between the spacing between the cutting groove at the starting position and the cutting groove at the target position in the first cutting wheel and the moving distance along the X-axis satisfies the Pythagorean theorem, that is, the ratio of the spacing between the two cutting grooves to the moving distance along the X-axis is

[0168] In addition, in the first cutting unit, since the first transition wheel and the first cutting wheel are relatively stationary, when the position of the first cutting wheel on the first wire rack is adjusted by the first wire rack adjustment mechanism, the first transition wheel may be designed differently so that the first cutting wire saw after the first cutting wire is wound around the cutting wire groove of the first cutting wheel 233 after the position change and the part of the first cutting wire wound around the first transition wheel are still in the same plane (the plane may be, for example, a vertical plane).

[0169] In some embodiments, the first transition wheel has at least two guide grooves, different guide grooves are parallel to each other, and there is a guide groove spacing between two adjacent guide grooves. The guide groove spacing between two different adjacent guide grooves is not limited, and it can be the same (i.e., equidistant) or different. For example, the first transition wheel has 4 guide grooves, namely 1# guide groove, 2# guide groove, 3# guide groove, and 4# guide groove, and there is a 1# guide groove spacing between 1# guide groove and 2# guide groove, a 2# guide groove spacing between 2# guide groove and 3# guide groove, and a 3# guide groove spacing between 3# guide groove and 4# guide groove. In some cases, the 1# guide groove spacing, the 2# guide groove spacing, and the 3# guide groove spacing are the same. In some cases, the 1# guide groove spacing, 2# guide groove spacing, and 3# guide groove spacing are not exactly the same, for example, two of the 1# guide groove spacing, 2# guide groove spacing, and 3# guide groove spacing are the same and one is different, for example, three of the 1# guide groove spacing, 2# guide groove spacing, and 3# guide groove spacing are all different.

[0170] In some embodiments, the number of guide grooves in the first transition wheel is the same as the number of cutting grooves in the first cutting wheel, and the spacing between each guide groove in the first transition wheel is consistent with the spacing between each corresponding cutting groove in the first cutting wheel. For example, the first cutting wheel has 4 cutting grooves, namely 1# cutting groove, 2# cutting groove, 3# cutting groove, and 4# cutting groove. There is a 1# cutting groove spacing between 1# cutting groove and 2# cutting groove, a 2# cutting groove spacing between 2# cutting groove and 3# cutting groove, and a 3# cutting groove spacing between 3# cutting groove and 4# cutting groove. Similarly, the first transition wheel has 4 guide grooves, namely 1# guide groove, 2# guide groove, 3# guide groove, and 4# guide groove. There is a 1# guide groove spacing between 1# guide groove and 2# guide groove, and a 2# guide groove spacing between 2# guide groove and 3# guide groove. There is a 2# guide groove spacing between them, and a 3# guide groove spacing between the 3# guide groove and the 4# guide groove, among which, the 1# cutting groove spacing is the same as the 1# guide groove spacing, the 2# cutting groove spacing is the same as the 2# guide groove spacing, the 3# cutting groove spacing is the same as the 3# guide groove spacing, and the 4# cutting groove spacing is the same as the 4# guide groove spacing. When configuring the first cutting wheel and the first transition wheel, it is only necessary to align the 1# cutting groove in the first cutting wheel with the 1# guide groove in the first transition wheel to ensure that the 2# cutting groove is aligned with the 2# guide groove, the 3# cutting groove is aligned with the 3# guide groove, and the 4# cutting groove is aligned with the 4# guide groove.

[0171] In this implementation, when the position of the first cutting wheel on the first wire frame is adjusted by using the first wire frame adjustment mechanism, the first transition wheel on the first wire frame is also adjusted synchronously with the first cutting wheel. When the first cutting wire is changed to be wound around the cutting wire groove on the first cutting wheel, the first cutting wire substantially also changes the guide wire groove wound around the first transition wheel, and it can still be ensured that the first cutting wire saw after the first cutting wire is wound around the cutting wire groove on the first cutting wheel and the part of the first cutting wire after the transition wire groove on the first transition wheel are still in the same vertical plane.

[0172] In some embodiments, although the first transition wheel has at least two guide grooves, due to one or more of the following reasons, for example, the number of guide grooves in the first transition wheel is different from the number of cutting grooves in the first cutting wheel, or the guide groove spacing between each guide groove in the first transition wheel is inconsistent with the cutting groove spacing between each cutting groove in the first cutting wheel, or the problem of the configuration and installation of the first cutting wheel and the first transition wheel does not make the guide grooves in the first transition wheel completely aligned with the cutting grooves in the first cutting wheel. At this time, simply adjusting by the first wire rack adjustment mechanism cannot ensure that the first transition wheel and the first cutting wheel are relatively stationary.

[0173] In some embodiments, the first transition wheel has only one guide wire groove, and when simply adjusted by the first wire frame adjustment mechanism, it cannot ensure that the first transition wheel and the first cutting wheel are relatively stationary. In addition, the wire groove may have a replaceable wire groove bushing, which can be replaced with a new one after being worn out for a long time.

[0174] As can be seen from the above, in some cases, simply adjusting by the first wire rack adjustment mechanism cannot ensure that the first transition wheel and the first cutting wheel are relatively stationary. In view of this, in some embodiments, the first distance adjustment unit includes a first calibration mechanism in addition to the first wire rack adjustment mechanism, and the first calibration mechanism is used to drive the first transition wheel to move relative to the first cutting wheel, so that the current wire groove in the first transition wheel where the first cutting wire is wound is adjusted from the first cutting wire groove corresponding to the first cutting wheel to the second cutting wire groove corresponding to the first cutting wheel.

[0175] In some embodiments, the first calibration mechanism includes two meshing racks, the two racks are respectively provided on the first cutting wheel and the first transition wheel, and the relative movement of the first transition wheel and the first cutting wheel can be driven by the mutual movement of the two racks. Figure 6 and Figure 7In the illustrated embodiment, the first calibration mechanism 83 includes a first rack 831 and a second rack 833 meshing with each other, wherein the first rack 831 corresponds to the first cutting wheel 233, and the second rack 833 corresponds to the first transition wheel 234. The first rack 831 corresponds to the first cutting wheel 233, and the first rack 831 may be, for example, disposed on the first wire rack 231, and the second rack 833 corresponds to the first transition wheel 234, and the second rack 833 may be, for example, disposed on the bracket 2344 for mounting the first transition wheel.

[0176] The first rack may also be provided with a cutting groove mark corresponding to the position of the cutting groove in the first cutting wheel, and correspondingly, the second rack may also be provided with a guide groove mark corresponding to the position of the guide groove in the first transition wheel. Figure 5In the illustrated embodiment, assuming that the first cutting wheel 233 has a plurality of cutting grooves, for example, 1 or more, taking 8 as an example, the first rack 831 is provided with cutting groove markings corresponding to the positions of the cutting grooves in the first cutting wheel 233, for example, numbers "1, 2, 3, 4, 5, 6, 7, 8", wherein number "1" corresponds to the 1# cutting groove, number "2" corresponds to the 2# cutting groove, ..., number "7" corresponds to the 7# cutting groove, and number "8" corresponds to the 8# cutting groove. Assuming that the first transition wheel 234 has a plurality of cutting grooves, for example, 1 or more, taking 1 as an example, the second rack 833 is provided with guide groove markings corresponding to the positions of the guide grooves in the first transition wheel, for example, number "0". When the guide groove mark on the second rack 833 corresponds to the cutting groove mark on the first rack 831, it means that a guide groove on the first transition wheel 234 corresponding to the guide groove mark is aligned with a cutting groove on the first cutting wheel 233 corresponding to the cutting groove mark. For example, the guide groove mark "0" on the second rack 833 is aligned with the cutting groove mark "5" on the first rack 831, which indicates that the guide groove on the first transition wheel 234 is aligned with the fifth cutting groove on the first cutting wheel 233. Assuming that the guide groove on the first transition wheel 234 needs to be aligned with the fifth cutting groove on the first cutting wheel 233, the bracket 2344 where the first transition wheel 234 is located is driven to move relative to the first wire rack 231. At this time, the second rack 833 on the bracket 2344 and the first rack 831 on the first wire rack 231 also move relative to each other until the guide groove mark "0" on the second rack 833 is aligned with the cutting groove mark "5" on the first rack 831. Then, the movement of the bracket 2344 is stopped. At this time, the guide groove on the first transition wheel 234 is aligned with the fifth cutting groove on the first cutting wheel 233, and the calibration operation is completed. Among them, the implementation method of driving the bracket 2344 where the first transition wheel 234 is located can be operated by a corresponding driving mechanism or manually operated by an operator. Taking the use of a driving mechanism as an example, the driving mechanism can be configured on the bracket 2344 where the first transition wheel 234 is located, and is used to drive the bracket 2344 to move relative to the first wire rack.

[0177] Afterwards, the first cutting wire can be wound around the cutting wire groove of the first cutting wheel 233 after the position change and the guide groove of the first transition wheel 234, so that the first cutting wire saw after the first cutting wire is wound around the cutting wire groove of the first cutting wheel 233 after the position change and the part of the first cutting wire wound around the first transition wheel are still in the same plane (the plane can be, for example, a vertical plane).

[0178] As can be seen from the above, the first wire frame 231 and the multiple first cutting wheels 233 and the first transition wheel 234 thereon are driven to move toward or away from the silicon rod conversion device 4 along the X-axis by the first wire frame adjustment mechanism in the first spacing unit, so that the two orthogonal first cutting lines in the first cutting unit 23 can be moved toward or away from the silicon rod to be cut on the silicon rod conversion device 4, and the cutting amount of the silicon rod to be cut can be adjusted or it can be suitable for silicon rods to be cut of different sizes; in addition, the first calibration mechanism in the first spacing unit is used to drive the relative movement of the first transition wheel 234 and the first cutting wheel 233, so that the current wire groove in the first transition wheel around which the first cutting wire is wound is adjusted from the first cutting wire groove corresponding to the first cutting wheel to the second cutting wire groove corresponding to the first cutting wheel, thereby ensuring the relative stillness of the first transition wheel and the first cutting wheel.

[0179] Regarding the second distance adjusting unit associated with the second cutting unit, in some embodiments, the second distance adjusting unit may include a second wire frame adjustment mechanism. In some embodiments, such as Figure 3 As shown, the second distance adjustment unit may include a second wire rack adjustment mechanism 55 and a second calibration mechanism 85. For the application and working principle of the second wire rack adjustment mechanism, or the second wire rack adjustment mechanism and the second calibration mechanism, please refer to the description of the first wire rack adjustment mechanism, or the first wire rack adjustment mechanism and the first calibration mechanism, which will not be repeated here.

[0180] In this embodiment, according to the above, after the silicon rod is squared, a skin will be formed. In order not to hinder the rise of the wire cutting device, the skin needs to be unloaded in time. For the unloading of the skin, the general skin unloading method is mostly for the operator to manually separate the skin from the squared silicon rod and move it out of the silicon rod squared device, which is not only inefficient, but also causes the skin to collide with the squared silicon rod during transportation, thereby increasing the risk of damage to the squared silicon rod. In view of this, the silicon rod cutting and grinding machine of the present application also includes a skin unloading device, which is used to unload the skin formed after the wire cutting device performs square cutting on the silicon rod, that is, in this embodiment, the first cutting unit also includes a first skin unloading device, which is used to unload the skin formed after the first cutting unit performs the first folding surface cutting on the silicon rod; the second cutting unit also includes a second skin unloading device, which is used to unload the skin formed after the second cutting unit performs the second folding surface cutting on the silicon rod.

[0181] like Figure 1 and Figure 2 As shown, the integrated silicon rod cutting machine of the present application further includes a first edge skin unloading device 73 corresponding to the first cutting unit 23 , and a second edge skin unloading device 75 corresponding to the second cutting unit 25 .

[0182] See also Figure 8 and Fig. 9 ,in, Figure 8 A schematic diagram showing the states of the first edge skin unloading device and the second edge skin unloading device in the silicon rod cutting integrated machine of the present application, Fig. 9 A second schematic diagram showing the states of the first edge skin unloading device and the second edge skin unloading device in the silicon rod cutting integrated machine of the present application.

[0183] Since the first edge skin unloading device and the second edge skin unloading device have the same structure, only the first edge skin unloading device is taken as an example for description.

[0184] Generally, the first edge skin unloading device may include an edge skin lifting unit and an edge skin clamping and transferring unit, wherein the edge skin lifting unit is used to lift the edge skin so that the top end of the edge skin protrudes from the cut silicon rod, and the edge skin clamping and transferring unit is used to clamp the edge skin and transfer the edge skin.

[0185] The edge skin lifting unit includes a lifting member. Figure 8 and 9 As shown, the side skin lifting unit in the first side skin unloading device 73 includes a lifting member 7311 (the side skin lifting unit in the second side skin unloading device 75 includes a lifting member 7511), and the lifting member 7311 is arranged on the first wire frame 231 in the first cutting unit. The lifting member 7311 can be driven by a telescopic component to perform telescopic movement. After the lifting member 7311 is controlled to perform the extension movement, it supports the bottom of the side skin to lift the side skin.

[0186] In some embodiments, the lifting member includes a support plate and a supporting plate, wherein the support plate extends upward from the bottom of the supporting plate, and further, the support plate can be a curved plate adapted to the curved surface of the edge skin, and when the support plate is against the edge skin, it can fully contact the curved surface of the edge skin, and the contact portion of the support plate with the edge skin is of smooth design or a buffer pad is provided on the inner surface of the support plate that contacts the edge skin. The supporting plate is used to support the bottom of the edge skin, and further, the supporting plate can be a bow-shaped plate adapted to the bottom surface of the edge skin. In other embodiments, the chord side of the bow-shaped plate serving as the support plate can also be provided with a protrusion to increase the contact area with the bottom surface of the edge skin.

[0187] In some embodiments, the telescopic component may be, for example, a cylinder with a telescopic rod, wherein the telescopic rod may be connected to the support plate in the lifting member through a connecting structure, and the cylinder may drive the telescopic rod to drive the lifting member to perform telescopic movement. Here, the telescopic movement of the lifting member includes the contraction movement of the lifting member and the extension movement of the lifting member, wherein the contraction movement of the lifting member specifically refers to the cylinder driving the telescopic rod to contract to drive the lifting member away from the side skin, and the extension movement of the lifting member specifically refers to the cylinder driving the telescopic rod to extend to drive the lifting member close to the side skin. Of course, the telescopic component can also be implemented in other ways. For example, the telescopic component can also be a servo motor with a screw, and the screw is connected to the lifting member. The servo motor drives the screw to rotate to drive the connected lifting member to perform telescopic movement. For example, the screw is driven to rotate forward to drive the lifting member to perform contraction movement and the screw is driven to rotate reversely to drive the lifting member to perform extension movement, or the screw is driven to rotate forward to drive the lifting member to perform extension movement and the screw is driven to rotate reversely to drive the lifting member to perform contraction movement. For the specific structure of the first edge skin unloading device and its implementation method, reference can be made to patent disclosures such as CN208148230U.

[0188] In actual application, in the initial state, the telescopic rod drives the lifting member to be in a retracted state, and the first cutting unit is driven to descend along with the cutting support so that the first cutting line segment in the first cutting unit performs a first folding surface cut on the silicon rod located in the first processing position, until the first cutting line segment penetrates the silicon rod, completing the first folding surface cut of the silicon rod and forming a side skin. At this time, the side skin lifting unit has followed the first wire frame to descend to the bottom, and the cylinder drives the telescopic rod to extend to drive the lifting member to approach the side skin until the abutment plate in the lifting member contacts and abuts against the side skin. Subsequently, the first cutting unit is driven The side skin lifting unit follows the cutting support to rise, and drives the side skin to rise relative to the silicon rod that has been cut once, so that the top of the side skin protrudes from the silicon rod. When the top of the side skin meets the set conditions compared with the protruding part of the silicon rod, the cutting support can be controlled to stop rising. In this way, the top of the side skin can be used as a fulcrum for grasping, so that the side skin can be grasped and unloaded. Then, the cylinder drives the telescopic rod to contract to drive the lifting part to return to the initial state, while controlling the cutting support to drive the first cutting unit and the side skin lifting unit to continue to rise above the silicon rod to prepare for the next cutting operation.

[0189] In other embodiments, the edge skin lifting unit may include an adsorbent and a telescopic component that drives the adsorbent to perform telescopic movement, and the adsorbent is controlled by the telescopic component to abut against the edge skin and adsorb the edge skin. The adsorbent may further include a support plate and a suction element. The support plate may be, for example, an arc-shaped plate that matches the arc surface of the edge skin, and when the support plate abuts against the edge skin, it can fully contact the arc surface of the edge skin. The suction element may be, for example, a vacuum suction cup, and a plurality of vacuum suction cups may be arranged on the contact surface of the support plate that is to contact the edge skin. The telescopic component may be, for example, a cylinder with a telescopic rod or a servo motor with a lead screw. Taking the cylinder with a telescopic rod as an example, the telescopic rod can be connected to the support plate in the lifting member through a connecting structure, and the cylinder can drive the telescopic rod to contract to drive the support plate away from the edge skin, and the cylinder can drive the telescopic rod to extend to drive the support plate close to the edge skin and the support plate is adsorbed by the suction element after the support plate contacts the edge skin. Subsequently, the cutting support is driven to rise, and the edge skin lifting unit and the first cutting unit rise along with the cutting support. The edge skin lifting unit can use the adsorption force to drive the edge skin to rise relative to the silicon rod, so that the top of the edge skin protrudes from the silicon rod.

[0190] In some embodiments, the first edge skin unloading device may also include a wire-pulling mechanism for shifting the corresponding first cutting wire saw or the second cutting wire saw to expand outward to avoid interference between the first cutting wire saw or the second cutting wire saw and the cut silicon rod. For example, the wire-pulling mechanism may include: a wire-pulling member and a wire-pulling driving source for driving the wire-pulling member to translate, or a wire-pulling member and a rotating motor that drives the wire-pulling member to swing along an arc path through a transmission member. For the specific structure of the wire-pulling mechanism and its implementation, reference may be made to patent disclosures such as CN109129947A.

[0191] In addition, the edge skin unloading device may further include an edge skin clamping and transferring unit, which is disposed above the machine base and is used to clamp the top of the edge skin and pull up the edge skin to separate from the silicon rod.

[0192] In some embodiments, the edge skin clamping and transporting unit includes: a clamping mechanism for clamping or releasing the top of the edge skin; and a lifting drive mechanism for driving the clamping mechanism to move up and down so that the clamping mechanism can separate the clamped edge skin from the cut silicon rod.

[0193] The lifting drive mechanism drives the clamping mechanism to move up and down so that the clamping mechanism can separate the edge skin clamped by the clamping mechanism from the cut silicon rod. The lifting mechanism may include a lifting guide structure and a lifting drive source, and the lifting guide structure may be arranged vertically; the lifting drive source is associated with the clamping mechanism and is used to drive the clamping mechanism to move up and down along the lifting guide structure.

[0194] like Figure 8 and Fig. 9 As shown, the lifting mechanism 735 in the first edge skin unloading device includes a lifting guide structure 7351 and a lifting drive source 7353, wherein the lifting guide structure 7351 can be, for example, a vertically arranged lifting guide rod, and the number of the lifting guide rods can be one or more, and the lifting drive source 7353 can be, for example, a servo motor with a synchronous belt 7355. In practical applications, the movable basic structure 7330 (for example, a movable block or a movable plate) that is linked with the clamping mechanism is movably arranged on the lifting guide rod 7351 and is linked with the servo motor 7353 through the synchronous belt 7355. The servo motor is used to drive the movable basic structure 7330 and its associated holding mechanism to perform lifting and lowering movements along the setting direction of the lifting guide rod 7351 through the synchronous belt 7355 in forward or reverse rotation. Regarding the second side skin unloading device, the lifting mechanism 755 in the second side skin unloading device includes a lifting guide structure 7551 and a lifting drive source 7553, wherein the lifting guide structure 7551 can be, for example, a vertically arranged lifting guide rod, and the number thereof can be one or more, and the lifting drive source 7553 can be, for example, a servo motor with a synchronous belt 7555.

[0195] The lifting guide structure and the lifting drive source in the lifting drive mechanism may still have other changes. For example, in other embodiments, in the lifting drive mechanism, the lifting guide structure may be a lifting rod, the lifting drive source may be a lifting cylinder, the lifting rod is connected to the clamping mechanism, and the lifting cylinder can be used to control the extension and retraction of the lifting rod to drive the clamping mechanism to move up and down. In another embodiment, in the lifting drive mechanism, the lifting guide structure may be a lifting guide rod or a lifting guide rail, the lifting drive source may be a servo motor with a screw assembly, the screw assembly is connected to the clamping mechanism (for example, the screw assembly is associated with a movable base structure, and the movable base structure is associated with the clamping mechanism), and the motor is used to drive the screw assembly to move up and down to drive the clamping mechanism to move up and down.

[0196] The clamping mechanism may include a cover body and a clamping assembly disposed inside the cover body. Fig.10 and Fig.11 As shown, still taking the first edge skin unloading device as an example, the clamping mechanism 733 may include a cover body 7331 and a clamping assembly, wherein the clamping assembly is arranged inside the cover body; a clamping space for clamping the edge skin is formed between the clamping assembly and the cover body.

[0197] In some embodiments, the clamping assembly may include a retractable clamping member, which is arranged inside the cover body, and a clamping space for clamping the edge skin is formed between the clamping member and the cover body. In an embodiment, the cover body 7331 is used to cover the edge skin, and the cover body can be covered with a size slightly larger than the cross-sectional circle of the silicon rod to be cut. In this embodiment, the first cutting unit 23 includes two orthogonal first cutting wire saws, and the second cutting unit 25 includes two orthogonal second cutting wire saws. After the silicon rod is cut by the first cutting unit 23, two edge skins with a 90° angle will be formed, and after the silicon rod is cut by the second cutting unit 25, two edge skins with a 90° angle will be formed. Therefore, the cover body 7331 includes an arc plate with a semicircular cross-section, and the clamping assembly includes two orthogonal clamping members 7333, and the two orthogonal clamping members 7333 correspond to the two orthogonal side surfaces. The clamping member 7333 is controlled by a driving source 7335, and the driving source 7335 can be used to drive the clamping member 7333 to move, so that the clamping member 7333 is close to or away from the cover body 7331. In some embodiments, the clamping member 7333 can be, for example, a movable pressure block or a swing arm, and the driving source 7335 can be, for example, a cylinder. The movable pressure block or the swing arm is directly connected to the output shaft of the cylinder or is connected to the output shaft of the cylinder through a connecting rod assembly, and the cylinder can drive the movable pressure block or the swing arm to move. For example, in one case, the movable pressure block or the swing arm serving as the clamping member 7333 is driven by the cylinder serving as the driving source 7335 to swing toward the cover body 7331, and the side skin 101 located between them is clamped by the clamping member 7333 and the cover body 7331 (see also Fig.10 and Fig.11 , showing a schematic diagram of the clamping assembly and the cover body cooperating to clamp the side skin). In one case, the movable pressing block or the swing arm as the clamping member 7333 is driven by the cylinder as the driving source 7335 to swing back to the cover body 7331, thereby increasing the clamping space between the clamping member 7333 and the cover body 7331, and the side skin 101 that was originally clamped can be released.

[0198] The structure of the clamping assembly is not limited thereto. In other embodiments, the clamping assembly includes an arc-shaped plate and a retractable clamping member, and a clamping space for clamping the edge skin is formed between the clamping member and the arc-shaped plate.

[0199] The edge skin clamping and transporting unit may further include a transporting mechanism that moves in at least one direction. The transporting mechanism may include: a guide structure and a transporting driving source, and the guide structure is arranged in at least one direction. In some embodiments, Figure 8 and Fig. 9As shown, the guide structure can be arranged along one direction, the guide structure 7371 in the first edge skin unloading device 73 is arranged along the X axis, and the guide structure 7571 in the second edge skin unloading device 75 is arranged along the Y axis (as shown in FIG. Figure 2 ). Figure 8 and Fig. 9 In the illustrated embodiment, the guide structure 7371 may be, for example, a rack structure, and the driving source 7373 is a servo motor with a driving gear 7375, wherein the driving gear 7375 is connected to the output shaft of the servo motor 7373 and the driving gear 7375 is meshed with the rack structure 7371, and the servo motor 7373 is used to drive the driving gear 7375 to rotate forward or reverse to drive the clamping assembly and the edge skin clamped therein to move along the setting direction of the rack structure 7371.

[0200] The guide structure and the rotation drive source in the transfer mechanism can still have other changes. For example, in other embodiments, the guide structure can also be a slide rail structure, and the transfer drive source can be a servo motor with a transfer screw. The servo motor drives the transfer screw to rotate forward or reverse to drive the clamping assembly and the edge skin clamped therein to move along the setting direction of the slide rail structure.

[0201] When the first edge skin unloading device is used to unload the edge skin formed after the first cutting unit cuts the silicon rod with the first folded surface, the lifting member 7311 is first driven to stretch and then support the bottom of the edge skin to lift the edge skin 101, so that the top of the edge skin 101 is lifted and protrudes from the silicon rod 100 (or silicon rod 200). Figure 8 As shown; thereafter, the clamping mechanism 733 is controlled to move to the edge skin and driven to clamp the protruding edge skin 101, and the clamping mechanism 733 and the clamped edge skin 101 are driven to rise by the lifting drive mechanism until the edge skin 101 is separated from the silicon rod 100 (or silicon rod 200), wherein the separation of the edge skin 101 from the silicon rod 100 (or silicon rod 200) means that the bottom end of the edge skin 101 is higher than the top end of the silicon rod 100 (or silicon rod 200), as shown in FIG. Fig. 9 As shown; the transfer mechanism is then used to drive the clamping mechanism 733 and the edge skin 101 clamped therein to move along the preset guide structure to be transferred to the edge skin unloading area, where the edge skin 101 is unloaded. The whole process is easy to operate, improves the edge skin unloading efficiency, and does not cause damage to the silicon rod.

[0202] exist Figure 1 and Figure 2In the silicon rod cutting and grinding machine shown, the cutting device 2 includes: a cutting frame 21, a cutting support 22, a first cutting unit 23, and a second cutting unit 25. However, this is not limited to this, and in other embodiments, the cutting device of the silicon rod cutting and grinding machine of the present application can still be modified in other ways.

[0203] In some embodiments, the cutting device may include a first cutting device disposed at a first cutting position of the silicon rod processing platform and a second cutting device disposed at a second cutting position of the silicon rod processing platform, wherein the first cutting device and the second cutting device are two independent devices.

[0204] The first cutting device includes: a first cutting frame, a first cutting support, and a first cutting unit.

[0205] The first cutting frame is arranged on the machine base. The first cutting frame is a columnar structure or a frame structure, serving as a supporting body of the first cutting device, and can provide support for other components in the first cutting device.

[0206] The first cutting support can be movably raised and lowered on the first cutting frame. In some embodiments, the first cutting support can be movably raised and lowered on the first cutting frame by a lifting mechanism. The lifting mechanism may include a mechanism that can realize the vertical movement of the first cutting support, such as a lifting motor, a lifting guide rail, and a lifting slider, wherein the lifting guide rail is vertically arranged on the first cutting frame, and the lifting slider is arranged on the back of the first cutting support and cooperates with the lifting guide rail. In order to enable the first cutting support to realize a stable lifting and lowering installation structure on the machine base, a double guide rail design can be adopted, that is, two lifting guide rails are adopted, and the two lifting guide rails are arranged in parallel. Driven by the lifting motor (the lifting motor can be, for example, a servo motor), the first cutting support can be lifted and lowered relative to the first cutting frame and the machine base by means of the lifting guide rail and the lifting slider.

[0207] The first cutting unit may include at least four first cutting wheels, and the four first cutting wheels may be combined into two orthogonal first cutting wheel groups, that is, two first cutting wheels arranged opposite to each other along the M axis form one first cutting wheel group, and two first cutting wheel groups along the N axis form a pair of first cutting wheel groups, wherein the M axis is orthogonal to the N axis. Specifically, the first cutting unit includes two orthogonal first cutting wheel groups, wherein one first cutting wheel group includes two first cutting wheels arranged front and back (along the M axis), and the other first cutting wheel group includes two first cutting wheels arranged front and back (along the N axis).

[0208] The first cutting wire is sequentially wound around each first cutting wheel in the first cutting unit to form a first cutting wire net. In actual applications, the first cutting wire is sequentially wound around the four first cutting wheels in the first cutting unit to form two mutually orthogonal first cutting wire saws, constituting the first cutting wire net. Specifically, the first cutting wire is wound around two first cutting wheels arranged front and back (along the M axis) in one first cutting wheel group to form a first cutting wire saw, and the first cutting wire is wound around two first cutting wheels arranged front and back (along the N axis) in another first cutting wheel group to form another second cutting wire saw. In this way, the two mutually orthogonal first cutting wire saws cooperate to form a first cutting wire net in the shape of a "Γ".

[0209] Of course, in some embodiments, the location, direction, and quantity of the first cutting wheel and the first cutting wire saw in the first cutting unit may also be changed.

[0210] The second cutting device includes: a second cutting frame, a second cutting support, and a second cutting unit.

[0211] The second cutting frame is arranged on the machine base. The second cutting frame is a columnar structure or a frame structure, serving as a supporting body of the second cutting device, and can provide support for other components in the second cutting device.

[0212] The second cutting support can be movably raised and lowered on the second cutting frame. In some embodiments, the second cutting support can be movably raised and lowered on the second cutting frame by a lifting mechanism. The lifting mechanism may include a mechanism that can realize the vertical movement of the second cutting support, such as a lifting motor, a lifting guide rail, and a lifting slider, wherein the lifting guide rail is vertically arranged on the second cutting frame, and the lifting slider is arranged on the back of the second cutting support and cooperates with the lifting guide rail. In order to enable the second cutting support to realize a stable lifting and lowering installation structure on the machine base, a double guide rail design can be adopted, that is, two lifting guide rails are adopted, and the two lifting guide rails are arranged in parallel. Driven by the lifting motor (the lifting motor can be, for example, a servo motor), the second cutting support can be lifted and lowered relative to the first cutting frame and the machine base by means of the lifting guide rail and the lifting slider.

[0213] The second cutting unit may include at least four second cutting wheels, and the four second cutting wheels may be combined into two orthogonal second cutting wheel groups, that is, two second cutting wheels arranged opposite to each other along the M axis form one second cutting wheel group, and two second cutting wheel groups along the N axis form a pair of second cutting wheel groups, wherein the M axis is orthogonal to the N axis. Specifically, the second cutting unit includes two orthogonal second cutting wheel groups, wherein one first cutting wheel group includes two first cutting wheels arranged front and back (along the M axis), and the other first cutting wheel group includes two first cutting wheels arranged front and back (along the N axis).

[0214] The second cutting wire is sequentially wound around each second cutting wheel in the second cutting unit to form a second cutting wire net. In actual applications, the second cutting wire is sequentially wound around the four second cutting wheels in the second cutting unit to form two mutually orthogonal second cutting wire saws, constituting a second cutting wire net. Specifically, the second cutting wire is wound around two second cutting wheels 253 arranged front and back (along the M axis) in a second cutting wheel group to form a second cutting wire saw, and the second cutting wire is wound around two second cutting wheels arranged front and back (along the N axis) in another second cutting wheel group to form another second cutting wire saw. In this way, the two mutually orthogonal second cutting wire saws cooperate to form a second cutting wire net in the shape of a "Γ".

[0215] Of course, in some embodiments, the arrangement position, direction, and quantity of the second cutting wheel and the second cutting wire saw in the second cutting unit may also be changed.

[0216] The grinding device 3 is arranged on the machine base 1, and is used to grind the square silicon rods which have been squared and cut on the grinding area of ​​the silicon rod processing platform. In this embodiment, the grinding operation includes grinding and chamfering.

[0217] The grinding device 3 has a receiving space for receiving the silicon rod that has been converted from the second cutting position to the grinding position by the silicon rod conversion device 4 and has been square cut. The grinding device 3 mainly includes a grinding support 31 and at least one pair of grinding tools 33. The at least one pair of grinding tools 33 is arranged on the grinding support 31 in opposite directions and is used to grind the silicon rod that has been square cut and is located at the grinding position.

[0218] In this embodiment, the cross-section of the silicon rod that has been squared is square (the silicon rod as a whole is a rectangular body), with four vertical sections and four connecting edges. Therefore, the grinding tools 33 are at least one pair arranged opposite to each other, and there is a storage space for accommodating the silicon rod 200 between them. After the silicon rod 200 is transferred to the grinding position and located in the storage space between the at least one stack of grinding tools 33, the at least one pair of grinding tools 33 can contact the opposite pair of vertical sections or a pair of connecting edges in the silicon rod 200, and then move up and down to grind.

[0219] The grinding support is movably arranged on the machine base. In this embodiment, the grinding support 31 can be slidably arranged on the machine base 1 through a first sliding mechanism. The sliding mechanism can achieve sliding in at least one direction. For example, the first sliding mechanism can achieve the grinding support 31 to move along a first direction (such as Figure 2 Specifically, the first sliding mechanism may include a first direction slide rail, a first direction slider or slider corresponding to the first direction slide rail, and a first direction drive source. The first direction drive source may be, for example, a drive motor.

[0220] The grinding tool 33 can be slidably mounted on the grinding support 31 via a second sliding mechanism.

[0221] In some embodiments, at least one pair of grinding tools 33 in the grinding device 3 is independently arranged. Taking a pair of grinding tools 33 as an example, the two grinding tools 33 are slidably arranged on the grinding support 31 through their own second sliding mechanisms, wherein the second sliding mechanism can achieve sliding in at least two directions. Specifically, the second sliding mechanism may include a first-direction sliding unit and a second-direction sliding unit, wherein the first-direction sliding unit is a lifting and sliding unit, including a lifting guide rail arranged on the grinding support 31, a lifting slider or a slide bar arranged on a movable mounting frame, and a lifting and lifting drive source. The lifting drive source may be, for example, a drive motor. The second-direction sliding unit includes a second-direction guide rail (the second direction is as shown in FIG. 1 ) arranged on the movable mounting frame. Figure 2 The second direction driving source is a second direction slider or a slide bar provided on the mold 33. The second direction driving source may be, for example, a driving motor.

[0222] In some embodiments, at least one pair of grinding tools 33 in the grinding device 3 is jointly arranged. Taking a pair of grinding tools 33 as an example, the two grinding tools 33 are slidably arranged on the grinding support 31 through a second sliding mechanism, wherein the second sliding mechanism can realize sliding in at least two directions. Specifically, the second sliding mechanism may include a first direction sliding unit and a second direction sliding unit, wherein the first direction sliding unit is a lifting sliding unit, including a lifting guide rail arranged on the grinding support 31, a lifting slider or slide bar arranged on a common movable mounting frame, and a lifting drive source. The lifting drive source may be, for example, a driving motor. The two grinding tools 33 are slidably arranged on the common movable mounting frame through a second direction sliding unit, and the second direction sliding unit includes a second direction guide rail (the second direction is as shown in the figure) arranged on the common movable mounting frame. Figure 2 The second direction driving source is a second direction slider or a slide bar provided on the mold 33. The second direction driving source may be, for example, a driving motor.

[0223] In this embodiment, the grinding support 31 can be slidably mounted on the machine base 1 through the first sliding mechanism to achieve the advance and retreat of the grinding support 31, that is, close to or away from the silicon rod. The grinding tool 33 can be slidably mounted on the grinding support 31 through the second sliding mechanism, and the second sliding mechanism can include a first direction sliding unit and a second direction sliding unit. In this way, the grinding tool 33 can be slidably mounted on the grinding support 31 through the first direction sliding unit to achieve the lifting and lowering of the grinding tool 33. The grinding tool 33 can also be slidably mounted on the grinding support 31 through the second direction sliding unit to achieve the advance and retreat of the grinding tool 33, that is, close to or away from the silicon rod, to control the grinding amount of the silicon rod.

[0224] In some embodiments, the grinding tool may include a spindle and at least one grinding wheel, wherein the at least one grinding wheel is disposed at a working end of the spindle.

[0225] In certain embodiments, each grinding tool in the grinding device is a double-headed structure. Specifically, each grinding tool includes: a rotating chassis; a double-headed spindle arranged on the rotating chassis, a rough grinding wheel is provided at the first end of the double-headed spindle, and a fine grinding wheel is provided at the second end of the double-headed spindle; a driving motor, which is used to drive the rotating chassis to rotate so that the rough grinding wheel and the fine grinding wheel in the double-headed spindle are swapped. In practical applications, during grinding, the rough grinding wheel of the double-headed spindle in at least one pair of grinding tools in the grinding device is first used to perform rough grinding on the silicon rod that has been squared, and then the rotating chassis is driven to rotate so that the rough grinding wheel and the fine grinding wheel in the double-headed spindle are swapped, and the fine grinding wheel of the double-headed spindle in at least one pair of grinding tools in the grinding device is used to perform fine grinding on the silicon rod that has been squared. The rough grinding operation may include rough grinding of the vertical section of the silicon rod that has been square cut and rough chamfering of the connecting edge surfaces, and the fine grinding operation may include fine grinding of the vertical section of the silicon rod that has been square cut and fine chamfering of the connecting edge surfaces.

[0226] In certain embodiments, each grinding tool in the grinding device is a double-headed structure. Specifically, each grinding tool includes: a rotating chassis; a double-headed spindle arranged on the rotating chassis, a rough grinding wheel is provided at the first end of the double-headed spindle, and a fine grinding wheel is provided at the second end of the double-headed spindle; a driving motor, which is used to drive the rotating chassis to rotate so that the rough grinding wheel and the fine grinding wheel in the double-headed spindle are swapped. In practical applications, during grinding, the rough grinding wheel of the double-headed spindle in at least one pair of grinding tools in the grinding device is first used to perform rough grinding on the silicon rod that has been squared, and then the rotating chassis is driven to rotate so that the rough grinding wheel and the fine grinding wheel in the double-headed spindle are swapped, and the fine grinding wheel of the double-headed spindle in at least one pair of grinding tools in the grinding device is used to perform fine grinding on the silicon rod that has been squared. The rough grinding operation may include rough grinding of the vertical section of the silicon rod that has been square cut and rough chamfering of the connecting edge surfaces, and the fine grinding operation may include fine grinding of the vertical section of the silicon rod that has been square cut and fine chamfering of the connecting edge surfaces.

[0227] In some embodiments, each grinding tool in the grinding device includes a coarse grinding wheel and a fine grinding wheel nested with each other. For example, the coarse grinding wheel is nested in the fine grinding wheel, or, the fine grinding wheel is nested in the coarse grinding wheel.

[0228] For example, the grinding tool includes a grinding head seat and a rough grinding wheel and a fine grinding wheel arranged on the grinding head seat, wherein the rough grinding wheel is nested in the fine grinding wheel, the fine grinding wheel is larger than the rough grinding wheel, the fine grinding wheel is circular and has a hollow space in the middle (i.e., a circular ring structure), and the rough grinding wheel can be a circular structure or the rough grinding wheel can be circular and has a hollow space in the middle (i.e., a circular ring structure). The abrasive grain size of the fine grinding wheel is smaller than the abrasive grain size of the rough grinding wheel, and the abrasive grain density of the fine grinding wheel is greater than the abrasive grain density of the rough grinding wheel.

[0229] When the grinding tool includes a rough grinding wheel and a fine grinding wheel, the grinding tool can be used to perform rough grinding and fine grinding on the silicon rod clamped by the first silicon rod clamp or the second silicon rod clamp. Therefore, at least one of the rough grinding wheel and the fine grinding wheel is provided with a telescopic drive mechanism. For example, when the rough grinding wheel is nested in the fine grinding wheel, the rough grinding wheel can be provided with a telescopic drive mechanism. When performing the rough grinding operation, the telescopic drive mechanism is used to drive the rough grinding wheel to extend and protrude from the fine grinding wheel, so that the protruding rough grinding wheel can be used to perform the rough grinding operation on the silicon rod, and when performing the fine grinding operation, the telescopic drive mechanism is used to drive the rough grinding wheel to contract and be recessed in the fine grinding wheel, so that the fine grinding wheel can be used to perform the fine grinding operation on the silicon rod. Alternatively, when the rough grinding wheel is nested in the fine grinding wheel, the fine grinding wheel may be provided with a telescopic drive mechanism. When performing rough grinding, the telescopic drive mechanism is utilized to drive the fine grinding wheel to retract and be recessed in the rough grinding wheel, so that the rough grinding wheel can be used to perform rough grinding on the silicon rod. When performing fine grinding, the telescopic drive mechanism is utilized to drive the fine grinding wheel to extend and protrude from the rough grinding wheel, so that the protruding fine grinding wheel can be used to perform fine grinding on the silicon rod.

[0230] For example, the fine grinding wheel is nested in the rough grinding wheel, the rough grinding wheel is larger than the fine grinding wheel, the rough grinding wheel is circular with a hollow space in the middle (i.e., a ring structure), and the fine grinding wheel can be a circular structure or the fine grinding wheel can be circular with a hollow space in the middle (i.e., a ring structure). The abrasive grain size of the fine grinding wheel is smaller than the abrasive grain size of the rough grinding wheel, and the abrasive grain density of the fine grinding wheel is greater than the abrasive grain density of the rough grinding wheel.

[0231] When the grinding tool includes a rough grinding wheel and a fine grinding wheel, the grinding tool can be used to perform rough grinding and fine grinding on the silicon rod clamped by the first silicon rod clamp or the second silicon rod clamp. Therefore, at least one of the rough grinding wheel and the fine grinding wheel is provided with a telescopic drive mechanism. For example, when the fine grinding wheel is nested in the rough grinding wheel, the rough grinding wheel can be provided with a telescopic drive mechanism. When performing the rough grinding operation, the telescopic drive mechanism is used to drive the rough grinding wheel to extend and protrude from the fine grinding wheel, so that the protruding rough grinding wheel can be used to perform the rough grinding operation on the silicon rod, and when performing the fine grinding operation, the telescopic drive mechanism is used to drive the rough grinding wheel to contract and be recessed in the fine grinding wheel, so that the fine grinding wheel can be used to perform the fine grinding operation on the silicon rod. Alternatively, when the fine grinding wheel is nested in the rough grinding wheel, the fine grinding wheel may be provided with a telescopic drive mechanism, and when performing rough grinding, the telescopic drive mechanism is utilized to drive the fine grinding wheel to contract and be recessed in the rough grinding wheel, so that the rough grinding wheel can be used to perform rough grinding on the silicon rod, and when performing fine grinding, the telescopic drive mechanism is utilized to drive the fine grinding wheel to extend and protrude from the rough grinding wheel, so that the protruding fine grinding wheel can be used to perform fine grinding on the silicon rod.

[0232] In some embodiments, the grinding device includes a grinding tool and a chamfering tool, wherein the grinding tool includes a spindle and at least one grinding wheel assembly, which is arranged at the working end of the spindle, and the chamfering tool is arranged on the grinding support and is used to chamfer or round the edges of the cut silicon rod.

[0233] In this embodiment, if Figure 2 As shown, the grinding device 3 mainly includes a grinding support 31, at least one pair of grinding tools 33, and a chamfering tool 35. At least one pair of grinding tools 33 are arranged on the grinding support 31 opposite to each other, and are used to grind the silicon rods that have been squared and cut at the grinding position. The chamfering tool 35 is arranged on the grinding support 31, and is used to chamfer or round the edges of the cut silicon rods.

[0234] The chamfering grinding tool may include a chamfering grinding wheel.

[0235] In some embodiments, the chamfering tool 35 can move together with the grinding tool 33, for example, in one or a combination of the following: moving forward and backward along the X-axis, moving along the Y-axis, and moving up and down vertically.

[0236] In some embodiments, the chamfering tool 35 can be independently configured with a corresponding chamfering tool advance and retreat mechanism and / or a chamfering tool translation mechanism, wherein the chamfering tool advance and retreat mechanism is used to drive the chamfering tool to advance and retreat along the X-axis, and the chamfering tool translation mechanism is used to drive the chamfering tool to move along the Y-axis.

[0237] In practical applications, the chamfering grinder can be driven to move along the direction of the vertical line so that the chamfering grinder contacts the edge of the silicon rod, the cut silicon rod can be driven to rotate along its axis so that the edge of the silicon rod contacts the chamfering grinder to achieve rounding, or the cut silicon rod can be driven to rotate along its axis at a preset angle so that the edge of the silicon rod contacts the chamfering grinder, or the chamfering grinder can be driven forward and backward to contact the edge of the silicon rod to achieve chamfering.

[0238] In addition, the axis of the chamfering grinding wheel is offset from the axis of the cut silicon rod. Figure 2 As shown, the axis of the chamfering grinding wheel serving as the chamfering grinding tool 35 has an offset with the axis of the cut silicon rod (i.e., the clamping center of the silicon rod clamp in the silicon rod transfer device), so that the chord edge of the chamfering grinding wheel can contact the cut silicon rod, thereby obtaining as large a contact area as possible and improving the chamfering or rounding work efficiency.

[0239] It should be noted that the above is only an exemplary description and is not intended to limit the scope of protection of the present application. For example, in the description of the grinding operation of the grinding device, the grinding operation of the silicon rod is performed first and then the chamfering operation of the silicon rod is performed, but it is not limited to this. In other embodiments, it is also feasible to first perform the chamfering operation of the silicon rod and then the grinding operation of the silicon rod, which should still fall within the scope of protection of the present application.

[0240] Subsequently, after the silicon rod 200 is ground by the grinding device 3, the silicon rod conversion device 4 converts the silicon rod 200 from the grinding position to the waiting position, and the silicon rod loading and unloading device unloads the processed silicon rod from the waiting position of the silicon rod processing platform. Of course, before unloading the silicon rod 200, if necessary, the silicon rod 200 after the processing operation can be inspected by the detection device in the waiting position, for example, the silicon rod is inspected for the flatness of the plane using a flatness detector. Using the flatness detector, on the one hand, the flatness of the silicon rod 200 can be detected to check whether the silicon rod meets the product requirements after each processing operation, so as to determine the effect of each processing operation; on the other hand, the wear condition of the processing components in each processing device can also be indirectly obtained by detecting the flatness of the silicon rod 200, so as to facilitate real-time calibration or correction, or even repair or replacement.

[0241] Furthermore, in the integrated cutting and grinding machine of the present application, in an optional embodiment, a silicon rod cleaning device may also be included. The silicon rod cleaning device may be arranged on the machine base, and is used to carry out and clean the silicon rod. With respect to the silicon rod cleaning device, generally, after the silicon rod undergoes the above-mentioned processing operation, the cutting debris generated during the operation will adhere to the surface of the silicon rod. Therefore, when necessary, the silicon rod needs to be cleaned as necessary. Generally, the silicon rod cleaning device includes a cleaning brush head and a cleaning liquid spraying device that cooperates with the cleaning brush head. During cleaning, the cleaning liquid spraying device sprays the cleaning liquid on the silicon rod, and at the same time, the cleaning brush head is driven by a motor to act on the silicon rod to complete the cleaning operation. In practical applications, the cleaning liquid may be, for example, pure water, and the cleaning brush head may be, for example, a rotating brush head.

[0242] In addition, it is particularly important to point out that for the integrated cutting and grinding machine of the present application, if the integrated cutting and grinding machine has increased or decreased the corresponding processing operation devices, then the functional positions on the silicon rod processing platform and the number and positional relationship of the silicon rod positioning mechanisms on the conveying body must be adjusted accordingly.

[0243] In some embodiments, it is assumed that the silicon rod multi-station processing machine omits the waiting position, and the silicon rod conversion device also reduces one silicon rod positioning mechanism accordingly. Further, preferably, the angles set between the three silicon rod positioning mechanisms are also consistent with the angle distribution between the three functional positions. In this way, when a silicon rod positioning mechanism corresponds to a functional position, the other two silicon rod positioning mechanisms also correspond to the other two functional positions respectively. In this way, in the assembly line operation, at any time, when a silicon rod is positioned on each silicon rod positioning mechanism and the silicon rod positioning mechanism corresponds to the functional position, these silicon rods are located at the corresponding functional position to perform the corresponding processing operations. In an optional embodiment, the three functional positions on the silicon rod processing platform are distributed at 120° between each other, so correspondingly, the four silicon rod positioning mechanisms on the disc-shaped or annular conveying body are also distributed at 120° between each other.

[0244] In addition, it is particularly important to point out that for the integrated cutting and grinding machine of the present application, if the integrated cutting and grinding machine is equipped with a corresponding processing device, the number of functional positions on the silicon rod processing platform and the silicon rod positioning mechanism on the conveying body and their positional relationship need to be adjusted accordingly. Assuming that a processing device is added to the multi-station processing machine for silicon rods, a corresponding functional position will be added to the silicon rod processing platform and a silicon rod positioning mechanism will be added to the silicon rod conversion device accordingly. Further, preferably, the angles set between the five silicon rod positioning mechanisms are also consistent with the angle distribution between the five functional positions. In this way, when a silicon rod positioning mechanism corresponds to a functional position, the other four silicon rod positioning mechanisms also correspond to the other four functional positions respectively. In this way, in the assembly line operation, at any time, when a silicon rod is positioned on each silicon rod positioning mechanism and the silicon rod positioning mechanism corresponds to the functional position, these silicon rods are located at a corresponding functional position to perform corresponding processing operations. In an optional embodiment, the five functional areas on the silicon rod processing platform are distributed at 72° between each other. Therefore, correspondingly, the four silicon rod positioning mechanisms on the disc-shaped or annular conveying body are also distributed at 72° between each other.

[0245] The silicon rod cutting and grinding machine disclosed in the present application integrates a cutting device and a grinding device. The silicon rod conversion device can be used to transfer the silicon rods in an orderly and seamless manner between various processing devices, and the cutting device can be used to square the silicon rods to form square silicon rods, and the grinding device can be used to grind the square silicon rods after square cutting, thereby completing the integrated operation of squaring and grinding multiple processes of the silicon rods, thereby improving production efficiency and the quality of product processing operations.

[0246] The present application discloses a silicon rod cutting and grinding method, which is applied to a silicon rod cutting and grinding machine. The silicon rod cutting and grinding machine includes a machine base with a silicon rod processing platform. The silicon rod processing platform is provided with a cutting area and a grinding area. The silicon rod cutting and grinding machine also includes a cutting device, a grinding device and a silicon rod conversion device. The cutting device includes the cutting unit and a distance adjustment unit.

[0247] The silicon rod cutting and grinding method disclosed in the present application may include the following steps:

[0248] The silicon rod conversion device is instructed to convert the first silicon rod to a cutting position, and the cutting unit in the cutting device is instructed to cut the first silicon rod at the cutting position to form two orthogonal side surfaces, so as to cut the first silicon rod into a silicon rod with a rectangular cross section; wherein the cutting position of the distance adjusting unit in the cutting device is adjusted by the distance adjusting unit according to the cutting task;

[0249] The silicon rod conversion device is rotated to a first preset angle to convert the first silicon rod from the cutting position to the grinding position and to convert the second silicon rod to the cutting position, and the grinding device is operated to grind and chamfer the first silicon rod at the grinding position. At this stage, the cutting unit in the cutting device is operated to cut the second silicon rod at the cutting position to form two orthogonal side surfaces, so as to cut the second silicon rod into a silicon rod with a rectangular cross-section.

[0250] The silicon rod cutting and grinding method disclosed in the present application is applied to the aforementioned silicon rod cutting and grinding integrated machine. When executing the silicon rod cutting and grinding operation, the distance adjustment unit in the silicon rod cutting device can adjust the cutting position of the cutting unit according to the silicon rod cutting task to adapt to silicon rods of different specifications and sizes, and the silicon rod conversion device can transfer the silicon rods between various processing devices in an orderly and seamless manner, and the cutting device can perform two folding cuts on the silicon rod to form a square silicon rod, and the grinding device can grind the square silicon rod after squaring, thereby completing the integrated operation of squaring and grinding multiple processes of the silicon rod, thereby improving production efficiency and the quality of product processing operations.

[0251] In certain embodiments, such as Figure 1 As shown, the silicon rod cutting and grinding machine includes a machine base with a silicon rod processing platform, the silicon rod processing platform is provided with a waiting position, a first cutting position, a second cutting position, and a grinding position, the silicon rod cutting and grinding machine also includes a cutting device, a grinding device, and a silicon rod conversion device, and the waiting position, the first cutting position, the second cutting position, and the grinding position of the silicon rod processing platform are adjacent to each other at 90 degrees. In this embodiment, it is assumed that the direction in the order of the waiting position, the first cutting position, the second cutting position, and the grinding position is defined as the forward direction.

[0252] The silicon rod cutting and grinding method of the present application may at least include the following steps:

[0253] Step S101, instructing the distance adjusting unit in the cutting device to adjust the cutting position of the distance adjusting unit in the cutting device according to the cutting task.

[0254] Step S103, loading the first silicon rod into the waiting area, and pre-processing the first silicon rod. In this embodiment, in step S101, the first silicon rod to be processed is transferred to the waiting area of ​​the silicon rod processing platform by using a silicon rod transfer device.

[0255] The specific method of using the silicon rod transfer device to transfer the first silicon rod to be processed to the waiting area of ​​the silicon rod platform can be found in the above description and will not be repeated here.

[0256] In addition, the pre-processing may include using a positioning detection device to perform edge line detection and center positioning on the first silicon rod located in the waiting area.

[0257] Step S105, the silicon rod conversion device is rotated to a first preset angle to convert the first silicon rod from the waiting position to the first cutting position, and the first cutting unit in the cutting device performs a first folding cut on the first silicon rod in the first cutting position. At this stage, the second silicon rod is loaded into the waiting position and pre-processed.

[0258] In step S105, since the waiting position and the first cutting position are at an angle of 90°, the first preset angle for rotating the silicon rod conversion device is to rotate the silicon rod conversion device in the forward direction by 90°.

[0259] The silicon rod conversion device 4 is rotated forward by 90° to convert the first silicon rod to be processed from the waiting position to the first cutting position.

[0260] In this way, the first cutting unit 23 in the cutting device 2 can be used to cut the first silicon rod at the first cutting position.

[0261] When the first silicon rod at the first cutting position is cut by the first cutting unit 23 in the cutting device 2, Figure 1 , driving the cutting support 22 to descend relative to the cutting frame 21, and the first cutting unit 23 on one side of the cutting support 22 performs a first folding cut on the first silicon rod at the first cutting position (the first cutting unit 23 is provided with a first cutting wire mesh in the shape of a "Γ").

[0262] As for loading the second silicon rod into the waiting area and pre-processing the second silicon rod, reference may be made to the description of the first silicon rod in step S103 , which will not be described in detail herein.

[0263] Step S107, the silicon rod conversion device is rotated to a first preset angle to convert the first silicon rod from the first cutting position to the second cutting position and the second silicon rod from the waiting position to the first cutting position, and the cutting device is controlled to perform a second folding surface cut on the first silicon rod in the second cutting position and a first folding surface cut on the second silicon rod in the first cutting position. At this stage, the third silicon rod is loaded into the waiting position for pre-processing.

[0264] In step S107, since the waiting position, the first cutting position and the second cutting position of the silicon rod processing platform are 90° apart in sequence, the first preset angle for rotating the silicon rod conversion device is to rotate the silicon rod conversion device 90° in the forward direction.

[0265] The silicon rod conversion device 4 is rotated forward by 90° to convert the first silicon rod from the first cutting position to the second cutting position and to convert the second silicon rod from the waiting position to the first cutting position.

[0266] In this way, the cutting device 2 can be used to cut the first silicon rod on the second cutting position of the silicon rod processing platform and the second silicon rod on the first cutting position.

[0267] When the cutting device 2 cuts the second silicon rod on the first cutting position of the silicon rod processing platform and the second silicon rod 100 on the first cutting position, Figure 1 , drive the cutting support 22 to descend relative to the cutting frame 21, and the first cutting unit 23 and the second cutting unit 25 on the left and right sides of the cutting support 22 simultaneously cut the second silicon rod on the corresponding first cutting position and the first silicon rod on the second cutting position, wherein the first cutting unit 23 performs the first folding surface cutting on the second silicon rod on the first cutting position (the first cutting unit 23 is provided with a first cutting wire net in the shape of "Γ"), and the second cutting unit 25 performs the second folding surface cutting on the first silicon rod on the second cutting position (the second cutting unit 25 is provided with a second cutting wire net in the shape of "Γ"). It should be noted that before the second cutting unit 25 performs the second folding surface cutting on the first silicon rod on the second cutting position, due to the aforementioned folding surface cutting problem, the silicon rod positioning mechanism in the silicon rod conversion device 4 needs to be used to drive the first silicon rod to rotate 180° forward or reversely to adjust the cutting surface. In this way, after the second folding surface cutting of the first silicon rod on the second cutting position by the second cutting unit 25, a silicon rod in a square shape as a whole is formed.

[0268] As for loading the third silicon rod into the waiting area to pre-treat the third silicon rod, reference may be made to the description of the first silicon rod in step S103 , which will not be described in detail herein.

[0269] Step S109, the silicon rod conversion device is rotated to a first preset angle to convert the first silicon rod from the second cutting position to the grinding position, the second silicon rod from the first cutting position to the second cutting position, and the third silicon rod from the waiting position to the first cutting position, and the grinding device is controlled to grind and chamfer the first silicon rod in the grinding position. At this stage, the cutting device is controlled to perform a second folding surface cutting on the second silicon rod in the second cutting position and a first folding surface cutting on the third silicon rod in the first cutting position. At the same time, the fourth silicon rod is loaded into the waiting position for pre-processing of the fourth silicon rod.

[0270] In step S109, since the waiting area, the first cutting area, the second cutting area and the grinding area of ​​the silicon rod processing platform are 90° apart in sequence, the first preset angle for rotating the silicon rod conversion device is to rotate the silicon rod conversion device 90° in the forward direction.

[0271] The silicon rod conversion device 4 is rotated forward 90 degrees to convert the first silicon rod from the second cutting position to the grinding position, the second silicon rod from the first cutting position to the second cutting position, and the third silicon rod from the waiting position to the first cutting position.

[0272] In this way, the first silicon rod on the grinding area of ​​the silicon rod processing platform can be ground by the grinding device 3. The specific method of grinding the first silicon rod on the grinding area of ​​the silicon rod processing platform by the grinding device 3 can be found in the above description, which will not be repeated here.

[0273] At the same time, the cutting device 2 can be used to cut the third silicon rod on the first cutting position and the second silicon rod on the second cutting position of the silicon rod processing platform.

[0274] When the cutting device 2 is used to cut the third silicon rod on the first cutting position of the silicon rod processing platform and the second silicon rod on the second cutting position, Figure 1 , drive the cutting support 22 to descend relative to the cutting frame 21, and the first cutting unit 23 and the second cutting unit 25 on the left and right sides of the cutting support 22 simultaneously cut the third silicon rod on the corresponding first cutting position and the second silicon rod on the second cutting position, wherein the first cutting unit 23 performs the first folding surface cutting on the third silicon rod on the first cutting position (the first cutting unit 23 is provided with a first cutting wire net in the shape of "Γ"), and the second cutting unit 25 performs the second folding surface cutting on the second silicon rod on the second cutting position (the second cutting unit 25 is provided with a second cutting wire net in the shape of "Γ"). It should be noted that before the second cutting unit 25 performs the second folding surface cutting on the second silicon rod on the second cutting position, due to the aforementioned folding surface cutting problem, the silicon rod positioning mechanism in the silicon rod conversion device 4 needs to be used to drive the second silicon rod to rotate 180° forward or reversely to adjust the cutting surface. In this way, after the second silicon rod on the second cutting position is cut by the second cutting unit 25, a square silicon rod is formed as a whole.

[0275] As for loading the fourth silicon rod into the waiting area to pre-treat the fourth silicon rod, reference may be made to the description of the first silicon rod in step S103 , which will not be described in detail herein.

[0276] Step S111, the silicon rod conversion device is rotated to a second preset angle to convert the first silicon rod from the grinding position to the waiting position, the second silicon rod from the second cutting position to the grinding position, the third silicon rod from the first cutting position to the second cutting position, and the fourth silicon rod from the waiting position to the first cutting position, the first silicon rod is unloaded from the waiting position and the fifth silicon rod is loaded, and the fifth silicon rod is pre-processed. At this stage, the grinding device is controlled to grind and chamfer the second silicon rod on the grinding position, and the cutting device is controlled to perform a second folding surface cutting on the third silicon rod on the second cutting position and a first folding surface cutting on the fourth silicon rod on the first cutting position.

[0277] In step S111, since the waiting position, the first cutting position, the second cutting position and the grinding position of the silicon rod processing platform are 90° apart in sequence, the first preset angle for rotating the silicon rod conversion device is to rotate the silicon rod conversion device forward by 90° or reversely by 270°. Among them, rotating the silicon rod conversion device reversely by 270° can return the silicon rod conversion device to the initial position and release the cable entangled in the forward rotation process.

[0278] The silicon rod conversion device 4 is reversed (i.e. Figure 2 The silicon rod is rotated 270° (counterclockwise arrow in the figure), the first silicon rod is transferred from the grinding position to the waiting position, the second silicon rod is transferred from the second cutting position to the grinding position, the third silicon rod is transferred from the first cutting position to the second cutting position, and the fourth silicon rod is transferred from the waiting position to the first cutting position.

[0279] In this way, the silicon rod transfer device 6 can be used to transfer the processed first silicon rod in the waiting position out of the silicon rod processing platform, and transfer the fifth silicon rod 108 to be processed to the waiting position of the silicon rod processing platform.

[0280] At the same time, the second silicon rod on the grinding area of ​​the silicon rod processing platform is ground by the grinding device 3. The specific method of grinding the second silicon rod on the grinding area of ​​the silicon rod processing platform by the grinding device 3 can be found in the above description, which will not be repeated here.

[0281] At the same time, the cutting device 2 can be used to cut the fourth silicon rod on the first cutting position and the third silicon rod on the second cutting position of the silicon rod processing platform.

[0282] When the cutting device 2 is used to cut the fourth silicon rod on the first cutting position of the silicon rod processing platform and the third silicon rod on the second cutting position, Figure 1, drive the cutting support 22 to descend relative to the cutting frame 21, and the first cutting unit 23 and the second cutting unit 25 on the left and right sides of the cutting support 22 simultaneously cut the corresponding fourth silicon rod on the first cutting position and the third silicon rod on the second cutting position, wherein the first cutting unit 23 performs the first folding surface cutting on the fourth silicon rod on the first cutting position (the first cutting unit 23 is provided with a first cutting wire net in the shape of "Γ"), and the second cutting unit 25 performs the second folding surface cutting on the third silicon rod on the second cutting position (the second cutting unit 25 is provided with a second cutting wire net in the shape of "Γ"). It should be noted that before the second cutting unit 25 performs the second folding surface cutting on the third silicon rod on the second cutting position, due to the aforementioned folding surface cutting problem, the silicon rod positioning mechanism in the silicon rod conversion device 4 needs to be used to drive the third silicon rod to rotate 180° forward or reversely to adjust the cutting surface. In this way, after the third silicon rod on the second cutting position is cut by the second cutting unit 25, a square silicon rod is formed as a whole.

[0283] Through the aforementioned silicon rod cutting and grinding method, the silicon rods can be transferred between various processing devices in an orderly and seamless manner, and at the same time, the silicon rods can be squared to form square silicon rods and the square silicon rods after square cutting can be ground, thereby completing the integrated operation of squaring and grinding multiple processes of the silicon rods, thereby improving production efficiency and the quality of product processing operations.

[0284] The above embodiments are merely illustrative of the principles and effects of the present application and are not intended to limit the present application. Anyone familiar with the technology may modify or change the above embodiments without violating the spirit and scope of the present application. Therefore, all equivalent modifications or changes made by a person of ordinary skill in the art without departing from the spirit and technical ideas disclosed in the present application shall still be covered by the claims of the present application.

Claims

1. A silicon rod cutting and grinding machine, characterized in that: include: The machine base has a silicon rod processing platform; The silicon rod processing platform includes a first cutting area, a second cutting area, and a grinding area; A cutting device, comprising: a first cutting unit, a first spacing unit, a second cutting unit, and a second spacing unit; the first cutting unit comprises: a first wire frame, a plurality of first cutting wheels and a first transition wheel arranged on the first wire frame, and a first cutting wire, the first cutting wire is wound around the plurality of first cutting wheels and the first transition wheel to form two orthogonal first cutting wire saws, the two orthogonal first cutting wire saws are arranged along a third direction and a fourth direction respectively, the two orthogonal first cutting wire saws are used to cut the silicon rod to be cut at the first cutting position to form two orthogonal side faces; the first spacing unit comprises a first wire frame adjustment mechanism, which is used to drive the first wire frame and the plurality of first cutting wheels and the first transition wheel thereon to move along a first direction to adjust the cutting position of the two orthogonal first cutting wire saws in the first cutting unit; the second cutting The unit comprises: a second wire frame, a plurality of second cutting wheels and a second transition wheel arranged on the second wire frame, and a second cutting wire, the second cutting wire is wound around the plurality of second cutting wheels and the second transition wheel to form two orthogonal second cutting wire saws, the two orthogonal second cutting wire saws are arranged along the third direction and the fourth direction respectively, the two orthogonal second cutting wire saws are used to cut the silicon rod to be cut at the second cutting position to form two orthogonal side faces, and cut the silicon rod into a silicon rod with a rectangular cross section; the second spacing unit comprises a second wire frame adjustment mechanism, which is used to drive the second wire frame and the plurality of second cutting wheels and the second transition wheel thereon to move along the second direction to adjust the cutting positions of the two orthogonal second cutting wire saws in the second cutting unit; wherein the first direction is perpendicular to the second direction, and the third direction is perpendicular to the fourth direction; The first cutting wheel has at least two cutting wire grooves, and the first distance adjustment unit further includes a first calibration mechanism, which is used to drive the first transition wheel to move so that the current wire groove in the first transition wheel around which the first cutting wire is wound is adjusted from the first cutting wire groove corresponding to the first cutting wheel to the second cutting wire groove corresponding to the first cutting wheel; the second cutting wheel has at least two cutting wire grooves, and the second distance adjustment unit further includes a second calibration mechanism, which is used to drive the second transition wheel to move so that the current wire groove in the second transition wheel around which the second cutting wire is wound is adjusted from the first cutting wire groove corresponding to the second cutting wheel to the second cutting wire groove corresponding to the second cutting wheel; A grinding device, used for grinding and chamfering the cut silicon rods at the grinding position; and The silicon rod conversion device is arranged on the silicon rod processing platform and is used for converting the silicon rod between the first cutting position, the second cutting position and the grinding position.

2. The silicon rod cutting and grinding machine according to claim 1, characterized in that: The cutting device also includes: A first cutting frame and a first cutting support located in the first cutting area, wherein the first cutting frame is arranged on the machine base, the first cutting support is movable up and down on the first cutting frame, and the first cutting unit is arranged on the first cutting support; and The second cutting frame and the second cutting support are located in the second cutting area, the second cutting frame is arranged on the machine base, the second cutting support is movably raised and lowered on the second cutting frame, and the second cutting unit is arranged on the second cutting support.

3. The silicon rod cutting and grinding machine according to claim 2, characterized in that: The silicon rod cutting and grinding machine further includes: a first pay-and-retract wire unit corresponding to the first cutting unit and a second pay-and-retract wire unit corresponding to the second cutting unit.

4. The silicon rod cutting and grinding machine according to claim 2, characterized in that: The first cutting line is wound around the first cutting wheels and the first transition wheel to form a first closed-loop cutting line connected end to end, and the second cutting line is wound around the second cutting wheels and the second transition wheel to form a second closed-loop cutting line connected end to end.

5. The silicon rod cutting and grinding machine according to claim 1, characterized in that: The cutting device also includes: A cutting frame, arranged on the machine base; the cutting frame is located between the first cutting area and the second cutting area; A cutting support, movable and liftable on the cutting frame; the cutting support comprises a support body and a first support wing and a second support wing located on opposite sides of the support body; Wherein, the first cutting unit is arranged on a first support wing of the cutting support, and the second cutting unit is arranged on a second support wing of the cutting support.

6. The silicon rod cutting and grinding machine according to claim 5, characterized in that: The first cutting line and the second cutting line are the same cutting line, and the cutting support is further provided with an intermediate transition wheel located between the first cutting unit and the second cutting unit for the cutting line to wind around.

7. The silicon rod cutting and grinding machine according to claim 6, characterized in that: The cutting device also includes a wire retracting and unreeling unit.

8. The silicon rod cutting and grinding machine according to claim 6, characterized in that: The cutting line is wound around the plurality of first cutting wheels, the first transition wheel, the middle transition wheel, the plurality of second cutting wheels and the second transition wheel to form a closed-loop cutting line connected end to end.

9. The silicon rod cutting and grinding machine according to claim 1, characterized in that: When the first cutting unit performs a first folding cut on the silicon rod to be cut, the intersection of two orthogonal first cutting wire saws is located within the cross-section of the silicon rod to be cut; when the second cutting unit performs a second folding cut on the silicon rod to be cut, the intersection of two orthogonal second cutting wire saws is located within the cross-section of the silicon rod to be cut.

10. The silicon rod cutting and grinding machine according to claim 1, characterized in that: Also includes: A first edge skin unloading device, used for unloading the edge skin produced after the first cutting unit performs the first folding surface cutting; The second edge skin unloading device is used to unload the edge skin generated after the second cutting unit performs the second folding surface cutting.

11. The silicon rod cutting and grinding machine according to claim 10, characterized in that: Either of the first edge skin unloading device and the second edge skin unloading device comprises: A side skin lifting unit, used for lifting the side skin so that the top of the side skin protrudes out of the cut silicon rod; and The edge skin clamping and transporting unit is used for clamping the edge skin and transporting the edge skin.

12. The silicon rod cutting and grinding machine according to claim 11, characterized in that: The edge skin clamping and transporting unit comprises: A clamping mechanism, used for clamping or releasing the top end of the edge skin; and The lifting drive mechanism is used to drive the clamping mechanism to move up and down so that the clamping mechanism drives the clamped edge skin to separate from the cut silicon rod.

13. The silicon rod cutting and grinding machine according to claim 12, characterized in that: The clamping mechanism comprises: A cover body, used for covering the side skin; and A clamping assembly is arranged inside the cover body; a clamping space for clamping the edge skin is formed between the clamping assembly and the cover body.

14. The silicon rod cutting and grinding machine according to claim 13, characterized in that: The cover body comprises an arc-shaped plate with a semicircular cross section; the clamping assembly comprises two orthogonal clamping members.

15. The silicon rod cutting and grinding machine according to claim 14, characterized in that: The clamping member is a movable pressure block controlled by a cylinder, and the movable pressure block is connected to the output shaft of the cylinder through a swing arm.

16. The silicon rod cutting and grinding machine according to claim 11, characterized in that: Any one of the first edge skin unloading device and the second edge skin unloading device further includes a wire shifting mechanism for shifting the corresponding first cutting wire saw or second cutting wire saw to expand outward to avoid interference between the first cutting wire saw or the second cutting wire saw and the cut silicon rods.

17. The silicon rod cutting and grinding machine according to claim 1, characterized in that: The grinding device comprises: a grinding support movably disposed on the machine base; and At least one pair of grinding tools are disposed opposite to each other on the grinding support.

18. The silicon rod cutting and grinding machine according to claim 17, characterized in that: The grinding tool comprises: The main axis; and At least one grinding wheel assembly is disposed at the working end of the spindle.

19. The silicon rod cutting and grinding machine according to claim 18, characterized in that: The grinding wheel assembly includes a rough grinding wheel, a fine grinding wheel, or a nested combination of a rough grinding wheel and a fine grinding wheel.

20. The silicon rod cutting and grinding machine according to claim 17, characterized in that: The grinding tool comprises: Rotating chassis; a double-headed spindle, disposed on the rotating chassis, with at least one rough grinding wheel disposed at the first end thereof and at least one fine grinding wheel disposed at the second end thereof; and The conversion motor is used to drive the rotating chassis to rotate so that the first end and the second end of the double-headed spindle can exchange positions.

21. The silicon rod cutting and grinding machine according to claim 17, characterized in that: The grinding device further comprises at least one chamfering grinding tool, which is arranged on the grinding support and is used for chamfering or rounding the edges of the cut silicon rods.

22. The silicon rod cutting and grinding machine according to claim 21, characterized in that: The chamfering grinding tool comprises a chamfering grinding wheel, and the axis of the chamfering grinding wheel is offset from the axis of the cut silicon rod.

23. The silicon rod cutting and grinding machine according to claim 1, characterized in that: The first cutting area, the second cutting area and the grinding area of ​​the silicon rod processing platform are adjacent to each other and are distributed at 120 degrees, and the rotation angle range of the silicon rod conversion device is ±240 degrees.

24. The silicon rod cutting and grinding machine according to claim 1, characterized in that: The silicon rod processing platform is also provided with a pretreatment area, and the silicon rod cutting and grinding machine also includes a silicon rod transfer device, which is adjacent to the pretreatment area of ​​the silicon rod processing platform and is used to transfer the silicon rods to be processed to the pretreatment area of ​​the silicon rod processing platform or to transfer the processed silicon rods on the pretreatment area out of the silicon rod processing platform.

25. The silicon rod cutting and grinding machine according to claim 24, characterized in that: The first cutting area, the second cutting area, the grinding area and the pre-processing area of ​​the silicon rod processing platform are adjacent to each other and arranged at 90 degrees, and the rotation angle range of the silicon rod conversion device is ±270 degrees.

26. The silicon rod cutting and grinding machine according to claim 1, characterized in that: The silicon rod conversion device comprises: Conveying body; A silicon rod positioning mechanism, disposed on the conveying body, for positioning the silicon rod; and The conversion drive mechanism is used to drive the conveying body to rotate so as to drive the silicon rods positioned by the silicon rod positioning mechanism to convert between various positions.

27. A silicon rod cutting and grinding method, characterized in that: The silicon rod cutting and grinding method is applied to the silicon rod cutting and grinding integrated machine according to any one of claims 1 to 26, and the silicon rod cutting and grinding method comprises the following steps: The silicon rod conversion device is used to convert the first silicon rod to the first cutting position, and two orthogonal first cutting wire saws in the first cutting unit are used to cut the first silicon rod at the first cutting position to form two orthogonal side surfaces; wherein the cutting position of the first cutting unit is adjusted by the distance adjustment unit according to the cutting task; The silicon rod conversion device is used to convert the first silicon rod from the first cutting position to the second cutting position and the second silicon rod to the first cutting position, and the two orthogonal second cutting wires in the second cutting unit are used to cut the first silicon rod at the second cutting position to form two orthogonal side surfaces, and the first silicon rod is cut into a silicon rod with a rectangular cross section. At this stage, the two orthogonal first cutting wires in the first cutting unit are used to cut the second silicon rod at the first cutting position to form two orthogonal side surfaces; The silicon rod conversion device is used to convert the first silicon rod from the second cutting position to the grinding position, the second silicon rod from the first cutting position to the second cutting position, and the third silicon rod to the first cutting position. The grinding device is used to grind and chamfer the first silicon rod at the grinding position. At this stage, two orthogonal second cutting wire saws in the second cutting unit are used to cut the second silicon rod at the second cutting position to form two orthogonal side surfaces, and the second silicon rod is cut into silicon rods with rectangular cross sections. Two orthogonal first cutting wire saws in the first cutting unit are used to cut the third silicon rod at the first cutting position to form two orthogonal side surfaces.

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