Methods for manufacturing three-dimensional structures and three-dimensional structures

Abstract

This invention relates to a method for manufacturing a three-dimensional structure and the three-dimensional structure itself. The invention reduces the possibility of accidental displacement of conductive wiring in the three-dimensional structure. A method for manufacturing a three-dimensional structure (S1) includes: preparing a first structure (100) including a fixed surface (101); fixing a plastic layer (200) to the fixed surface (101) of the first structure (100); preparing conductive wiring (300); and operating an ultrasonic head (U) to apply ultrasonic waves to the conductive wiring (300) and press the conductive wiring (300) against the plastic layer (200), thereby partially embedding the conductive wiring (300) into the plastic layer (200).

Description

Technical Field

[0001] This invention relates to a method for manufacturing three-dimensional structures and to three-dimensional structures. Background Technology

[0002] Japanese Patent Application Publication No. 2018-066706 discloses a conventional three-dimensional structure. This three-dimensional structure is a decorative vehicle component attached to the front of a millimeter-wave radar device in the direction of millimeter-wave transmission. The structure includes a decorative body transparent to millimeter-wave radiation and a sheet-like heater.

[0003] The decorative element comprises a transparent portion, a substrate, and a decorative layer. The transparent portion is made of a plastic material that is transparent to millimeter waves. The substrate is also made of a plastic material. The substrate includes a front substrate formed on the transparent portion and located behind the transparent portion in the transmission direction, and a rear substrate formed on the front substrate and located behind the front substrate in the transmission direction. The front and rear substrates sandwich the main part of the heater from front to back in the transmission direction and are joined together in this state. The decorative layer is formed between the transparent portion and the substrate.

[0004] The heater includes a main section comprising a linear heating element, a pair of electrodes, and a pair of plastic sheets. The electrodes are connected to opposite ends of the heating element. The plastic sheets cover and sandwich the heating element and electrodes from front to back in the transmission direction. A gap is formed between the main section of the heater and a recess in the front substrate, which is filled with a filler portion that forms part of the rear substrate. Summary of the Invention

[0005] Technical issues

[0006] The aforementioned conventional three-dimensional structure is manufactured as follows: First, a transparent portion is prepared, and a front substrate insert is molded onto the transparent portion, positioned behind it. Next, the main body of the heater is attached to the back side of the front substrate. At this point, a gap is left between the recess in the front substrate and the main body of the heater. Then, a rear substrate is inserted and molded onto the front substrate, positioned behind it and covering the main body of the heater. At this point, a portion of the rear substrate (the filling portion) fills the gap. Thus, the conventional three-dimensional structure is manufactured.

[0007] During the insertion molding of the post-substrate, the molten plastic material forming the post-substrate squeezes the main part of the heater, which may cause the main part of the heater to be accidentally displaced.

[0008] This invention provides a method for manufacturing a three-dimensional structure and a three-dimensional structure that reduces the possibility of accidental displacement of conductive wiring in the three-dimensional structure.

[0009] Technical solution

[0010] One aspect of the present invention is a method for manufacturing a three-dimensional structure, comprising: preparing a first structure including a fixed surface; fixing a plastic layer to the fixed surface of the first structure; preparing conductive wiring; and operating an ultrasonic head to apply ultrasonic waves to the conductive wiring and press the conductive wiring against the plastic layer, thereby partially embedding the conductive wiring in the plastic layer.

[0011] In this method, the conductive wiring is partially embedded in the plastic layer, which reduces the possibility of accidental displacement of the conductive wiring.

[0012] Fixing the plastic layer may include placing a first structure in the cavity of a first molding die, injecting molten plastic into the fixed surface of the first structure within the cavity of the first molding die, and solidifying the molten plastic to form a plastic layer on the fixed surface of the first structure.

[0013] Molding the plastic layer may include: placing at least a portion of the embedded portion of the terminal in a cavity of a first molding die, inserting an outer connecting portion of the terminal into a receiving hole in the first molding die communicating with the cavity, inserting at least a portion of the embedded portion of the terminal into molten plastic injected into the cavity of the first molding die, and solidifying the molten plastic to mold at least a portion of the embedded portion of the terminal into the plastic layer. In this case, the method may further include electrically connecting the terminal to conductive wiring.

[0014] The fixing of the plastic layer may include a fixing surface that bonds or joins the plastic layer to the first structure. When terminals are provided, at least a first portion of the terminal insert may be embedded in the plastic layer.

[0015] The plastic layer may include a first surface that contacts the fixed surface of the first structure and a second surface that is opposite to the first surface.

[0016] Molding the plastic layer may include: placing a portion of the terminal's insert into the cavity of a first molding die, inserting the remaining portion of the terminal's insert and the external connection portion of the terminal into a receiving hole of the first molding die, inserting a portion of the terminal's insert into molten plastic injected into the cavity of the first molding die, and solidifying the molten plastic to mold a portion of the terminal's insert into the plastic layer. In this case, embedding the conductive wiring may include: operating an ultrasonic head to apply ultrasonic waves to the conductive wiring and pressing the conductive wiring against a second surface of the plastic layer, thereby partially embedding the conductive wiring into the second surface of the plastic layer; and operating the ultrasonic head to apply ultrasonic waves to the conductive wiring and pressing the conductive wiring against the remaining portion of the terminal's insert, thereby partially contacting the remaining portion of the terminal's insert.

[0017] An adhesive layer may be provided on the embedded portion of the terminal. In this case, the embedded portion of the insert-molded terminal may include: molding the embedded portion of the terminal into a plastic layer such that the exposed surface of the adhesive layer is flush with the second surface of the plastic layer. Embedding the conductive wiring may include: operating an ultrasonic head to apply ultrasonic waves to the conductive wiring and press the conductive wiring against the second surface of the plastic layer, thereby partially embedding the conductive wiring into the second surface of the plastic layer; and operating the ultrasonic head to apply ultrasonic waves to the conductive wiring and make the conductive wiring partially contact the exposed surface of the adhesive layer. Electrically connecting the terminal to the conductive wiring may include: melting the adhesive layer by hot forging, welding, or soldering, and partially exposing the embedded portion of the terminal from the adhesive layer, thereby connecting the conductive wiring to the embedded portion of the terminal.

[0018] Conductive wiring may include at least a wiring body.

[0019] The conductive wiring may also include a fusion layer covering the wiring body. In this case, electrically connecting the terminal to the conductive wiring may include partially melting the fusion layer by hot forging, soldering, or soldering, and partially exposing the wiring body from the fusion layer to connect the conductive wiring to the insertion portion of the terminal. The conductive wiring may also include an insulating layer located between the wiring body and the fusion layer. In this case, electrically connecting the terminal to the conductive wiring may include partially melting not only the insulating layer but also the fusion layer by hot forging, soldering, or soldering, and partially exposing the wiring body from both the insulating layer and the fusion layer to connect the conductive wiring to the insertion portion of the terminal.

[0020] The fixing surface of the first structure may have at least one protrusion and at least one recess. In this case, the second surface of the plastic layer may be a smooth surface. Embedding the conductive wiring may include: operating an ultrasonic head to apply ultrasonic waves to the conductive wiring and press the conductive wiring against the second surface of the plastic layer, thereby partially embedding the conductive wiring into the second surface of the plastic layer.

[0021] The methods described above may also include: fixing a second structure to a plastic layer after embedding conductive wiring, and covering conductive wiring that partially protrudes from the plastic layer with the second structure.

[0022] The methods described above may further include: placing a first structure, a plastic layer, conductive wiring, and a second structure in a cavity of a second molding die; injecting molten plastic into the cavity of the second molding die between the plastic layer and the second structure; inserting a portion of the conductive wiring protruding from the plastic layer into the molten plastic injected into the cavity of the second molding die; solidifying the molten plastic in the cavity of the second molding die to form the filler layer between the plastic layer and the second structure; and embedding a portion of the conductive wiring protruding from the plastic layer into the filler layer.

[0023] One aspect of the present invention includes a three-dimensional structure comprising: a first structure having a fixed surface; a plastic layer fixed to the fixed surface of the first structure; and conductive wiring partially embedded in the plastic layer.

[0024] The plastic layer can be formed on the fixed surface of the first structure. Alternatively, for example, the plastic layer can be bonded or joined to the fixed surface of the first structure.

[0025] The three-dimensional structure described above may also include terminals electrically connected to conductive wiring. Terminals may include embedded portions and external connecting portions. At least a portion of the embedded portion may be embedded in the plastic layer, and the external connecting portion may be disposed outside the plastic layer.

[0026] The plastic layer may include a first surface that contacts the fixed surface of the first structure and a second surface that is opposite to the first surface.

[0027] An adhesive layer may be provided on the embedded portion of the terminal. In this case, the embedded portion of the terminal may be embedded in the plastic layer, such that the exposed surface of the adhesive layer is flush with the second surface of the plastic layer. The conductive wiring may be bonded not only to the adhesive layer but also to the embedded portion of the terminal.

[0028] Conductive wiring may include at least a wiring body.

[0029] The conductive wiring may also include a fusion layer covering the wiring body. In this case, the wiring body may be partially exposed from the fusion layer and connected to the embedding portion of the terminal. The conductive wiring may also include an insulating layer inserted between the wiring body and the fusion layer. In this case, the wiring body may be partially exposed from the insulating layer and the fusion layer and connected to the embedding portion of the terminal.

[0030] The fixing surface of the first structure may have at least one protrusion and at least one recess. In this case, the second surface of the plastic layer may be a smooth surface. The conductive wiring may be partially embedded in the second surface of the plastic layer.

[0031] The three-dimensional structure described above may also include a second structure. The second structure may be fixed to the plastic layer and cover the conductive wiring that partially protrudes from the plastic layer.

[0032] The three-dimensional structure described above may also include a filler layer between the plastic layer and the second structure. Conductive wiring that partially protrudes from the plastic layer may be embedded in the filler layer.

[0033] The three-dimensional structure can be a vehicle component. In this case, the first structure can be a trim piece and / or cover of the vehicle component.

[0034] The three-dimensional structure can be positioned in front of the millimeter-wave radar device in the direction of millimeter-wave transmission.

[0035] Conductive wiring can be configured to be energized and thereby generate heat. Alternatively, conductive wiring can be used as a communication antenna, coil, or conductive wire. Attached Figure Description

[0036] Figure 1A This is a schematic cross-sectional view of a three-dimensional structure according to the first embodiment of the present invention.

[0037] Figure 1B This is a schematic back view of the three-dimensional structure according to the first embodiment.

[0038] Figure 1C This is a schematic cross-sectional view of a first variant of the three-dimensional structure of the first embodiment.

[0039] Figure 2A The diagram includes steps for illustrating a method of manufacturing a three-dimensional structure according to the first embodiment. These steps include: preparing a first structure of the three-dimensional structure; placing the first structure in a first molding die; molding a plastic layer on the first structure; and embedding conductive wiring in the plastic layer.

[0040] Figure 2B Including the method for describing the manufacture of the three-dimensional structure of the first embodiment in Figure 2A The diagram illustrates the subsequent steps following the steps shown. These subsequent steps include: placing the first structure, intermediate layer, conductive wiring, and second structure into a second molding die; molding a filler layer between the plastic layer and the second structure; and removing the three-dimensional structure from the second molding die.

[0041] Figure 3A This is a schematic cross-sectional view of a three-dimensional structure according to a second embodiment of the present invention.

[0042] Figure 3B This is a schematic cross-sectional view of a three-dimensional structure of a first variant according to a second embodiment of the present invention.

[0043] Figure 3C This is a schematic cross-sectional view of a three-dimensional structure of a second variant according to a second embodiment of the present invention.

[0044] Figure 4A The diagram includes steps for illustrating a method of manufacturing a three-dimensional structure according to the second embodiment. These steps include: preparing a first structure of the three-dimensional structure; placing the first structure and terminals in a first molding die; molding a plastic layer on the first structure; and embedding conductive wiring in the plastic layer and electrically connecting the conductive wiring to the terminals.

[0045] Figure 4B Including the method for describing the manufacture of the three-dimensional structure of the first embodiment in Figure 4A The diagram illustrates the subsequent steps following the steps shown. These subsequent steps include: placing the first structure, terminals, intermediate layer, conductive wiring, and second structure into a second molding die; molding the filler layer between the plastic layer and the second structure; and a second step of removing the three-dimensional structure from the molding die.

[0046] Figure 5 This is a schematic cross-sectional view of a three-dimensional structure according to the third embodiment of the present invention.

[0047] Figure 6A The diagram includes steps illustrating the method for manufacturing the aforementioned three-dimensional structure. These steps include: preparing a first structure of the three-dimensional structure; placing the first structure and terminals in a first molding die; molding a plastic layer on the first structure; and embedding conductive wiring in the plastic layer.

[0048] Figure 6B Including the method for illustrating the manufacture of the above-mentioned three-dimensional structure Figure 6A The diagram illustrates the subsequent steps following the steps shown. These subsequent steps include: connecting conductive wiring to terminals; placing the first structure, terminals, intermediate layer, conductive wiring, and second structure in a second molding die; molding the filler layer between the plastic layer and the second structure; and removing the three-dimensional structure from the second molding die.

[0049] List of symbols in the attached diagram

[0050] 10, 10′: First molding die

[0051] 10a, 10a′: First mold

[0052] 10b: Second mold

[0053] 11: Cavity

[0054] 12: Gate

[0055] 13: Receiving hole

[0056] 20, 20′: Second molding die

[0057] 20a, 20a′: First mold

[0058] 20b: Second mold

[0059] 21: Cavity

[0060] 22: convex part

[0061] 23: Receiving hole

[0062] S1, S2, S3: Three-dimensional structures

[0063] 100: First structure; 101: Fixed surface; 110: Main body; 120: Functional layer

[0064] 200: Plastic layer; 201: First side; 202: Second side

[0065] 300: Conductive wiring; 310: Wiring body; 320: Fusion layer; 330: Insulating layer

[0066] 400: Second Structure

[0067] 500: Terminal; 510: Embedded part; 520: External connection part

[0068] U: Ultrasonic head Detailed Implementation

[0069] The following describes several embodiments of the present invention, including a first embodiment, a second embodiment, a third embodiment, and variations thereof. It should be noted that the components of the embodiments and variations thereof described can be combined in any possible manner. It should also be noted that the materials, shapes, dimensions, quantities, arrangements, etc., of each component constituting the embodiments and variations thereof described are presented by way of example only and can be modified in any way, as long as the same function is achieved.

[0070] First Implementation Method

[0071] In the following text, refer to Figures 1A to 1C A three-dimensional structure Sl is described according to a plurality of embodiments of the present invention, including the first embodiment and variations thereof. Figure 1A and Figure 1B The three-dimensional structure S1 of the first embodiment is illustrated. Figure 1C A first variation of the three-dimensional structure S1 of the first embodiment is illustrated. Figure 1A and Figure 1C The ZZ′ direction indicates the thickness direction of the three-dimensional structure S1. Figure 1B The XX′ direction indicates the length direction of the three-dimensional structure S1. Figures 1A to 1C The YY′ direction indicates the width direction of the three-dimensional structure S1.

[0072] The three-dimensional structure S1 includes a first structure 100. The first structure 100 can be any structure having dimensions in the ZZ′ direction, the XX′ direction, and the YY′ direction. For example, the first structure can be a decorative part such as a sign on a vehicle (e.g., a car, railway vehicle, motorcycle, or bicycle), a ship, an aircraft, etc.; a cover for a camera or light on a vehicle, ship, aircraft, etc.; a cover for a camera or light on a vending machine or security device; a cover for a measuring device such as a millimeter-wave sensor or a LiDAR sensor; a cover for a bumper on a vehicle, ship, aircraft, etc.; or a cover for an electronic component unit. The dimensions of the first structure 100 in the XX′ direction and in the YY′ direction can be different from each other or substantially the same. The dimension of the first structure 100 in the ZZ′ direction can be smaller than the dimensions of the first structure 100 in the XX′ direction and in the YY′ direction, but is not limited thereto.

[0073] The first structure 100 includes a main body 110 (see...) Figures 1A to 1C The main body 110 is made of plastic (e.g., molded plastic, plastic film, etc.), glass, ceramic, wood, or a combination thereof. The main body 110 includes a first surface on the Z-direction side and a second surface on the Z′-direction side. The first structure 100 may also include at least one functional layer 120 (see...). Figure 1C The functional layer, or each functional layer 120, is a decorative layer, a hard coating, or an optical adjustment layer. At least one functional layer is formed on at least a portion of at least one of the first and second surfaces of the body 110. In other words, at least one functional layer is formed on at least a portion of the first surface and / or at least a portion of the second surface of the body 110.

[0074] The first structure 100 includes a fixed surface 101. When at least one functional layer 120 is disposed on the entire second surface of the body 110 (see...), Figure 1C When at least one functional layer 120 is disposed on a portion of the second surface of the body 110, the fixing surface 101 is the second surface of the body 110 and the surface of at least one functional layer 120 on the Z′-direction side. In the case where no at least one functional layer 120 is disposed on the second surface of the body 110 (see...), the fixing surface 101 is the second surface of the body 110 and the surface of at least one functional layer 120 on the Z′-direction side. Figure 1A and Figure 1B The fixing surface 101 is the second surface of the main body 110. The fixing surface 101 may or may not have one or more protrusions and one or more recesses. The fixing surface 101 may be a flat surface, a convex curved surface that protrudes to one side in the length direction or in the Z′ direction, or alternatively a concave curved surface that is recessed to the other side in the length direction or in the Z direction.

[0075] The three-dimensional structure S1 also includes a plastic layer 200. The plastic layer 200 is fixed to the fixing surface 101 of the first structure 100. For example, the plastic layer 200 may be a molded plastic formed on the fixing surface 101 of the first structure 100 or a molded plastic bonded to and / or joined with the fixing surface 101 of the first structure 100. The plastic layer 200 has dimensions in the ZZ′ direction, dimensions in the XX′ direction, and dimensions in the YY′ direction. The plastic layer 200 includes a first surface 201 on the Z-direction side and a second surface 202 on the Z′-direction side. The first surface 201 is fixed to the fixing surface 101 of the first structure 100. When the plastic layer 200 is formed on the fixing surface 101 of the first structure 100, the first surface 201 has a shape corresponding to the fixing surface 101 of the first structure 100. When the plastic layer 200 is bonded to and / or joined to the fixing surface 101 of the first structure 100, the first surface 201 may have a shape corresponding to the fixing surface 101 of the first structure 100, or may have a different shape. When the plastic layer 200 is joined to the fixing surface 101 of the first structure 100, one surface of the first surface 201 of the plastic layer 200 and the fixing surface 101 of the first structure 100 may be provided with a joining protrusion, and the other may be provided with a joining recess that accommodates the joining protrusion. The second surface 202 may be a smooth surface. For example, a smooth surface may be a flat surface, a convex surface protruding to one side of the length direction or protruding in the Z′ direction, or alternatively, a concave surface recessed to the other side of the length direction or recessed in the Z direction.

[0076] The three-dimensional structure S1 also includes conductive wiring 300. Conductive wiring 300 includes at least wiring body 310. Conductive wiring 300 can be a heater configured to generate heat when wiring body 310 is energized, or it can be a communication antenna, coil, conductive wire, etc., but is not limited thereto. Wiring body 310 is an elongated object having a cylindrical or polygonal prism shape and made of a conductive and flexible material. When the three-dimensional structure S1 is to be installed outdoors, conductive wiring 300 can be used as a heater configured as described above to melt ice and snow adhering to the three-dimensional structure S1.

[0077] Conductive wiring 300 may also include a fusion layer covering wiring body 310 (see Figure 5 When the wiring body 310 has a cylindrical shape, the fusion layer has a tubular shape with a circular cross-section and covers the outer periphery of the wiring body 310. When the wiring body 310 has a polygonal prism shape, the fusion layer has a tubular shape with a polygonal cross-section and covers the outer periphery of the wiring body 310.

[0078] The conductive wiring 300 may also include an insulating layer inserted between the wiring body 310 and the fusion layer (see [link]). Figure 5 When the wiring body 310 has a cylindrical shape, the insulating layer has a tubular shape with a circular cross-section and covers the outer periphery of the wiring body 310, while the fusion layer has a tubular shape with a circular cross-section and covers the wiring body 310 by covering the outer periphery of the insulating layer. When the wiring body 310 has a polygonal prism shape, the insulating layer has a tubular shape with a polygonal cross-section and covers the outer periphery of the wiring body 310, while the fusion layer has a tubular shape with a polygonal cross-section and covers the wiring body 310 by covering the outer periphery of the insulating layer. When the conductive wiring 300 includes the wiring body 310, the fusion layer, and the insulating layer, the conductive wiring 300 may be, but is not necessarily, a self-fusing wiring.

[0079] The conductive wiring 300 in any of the above aspects is partially embedded in the second surface 202 of the plastic layer 200. For example, the conductive wiring 300 may be partially embedded in the second surface 202 of the plastic layer 200 and have the shape of a single continuous line, such as a zigzag shape, a spiral shape, etc. (hereinafter referred to as a linear shape). Alternatively, the conductive wiring 300 may include: a plurality of wiring portions partially embedded in the second surface 202 of the plastic layer 200 to have a grid arrangement, a concentric arrangement, a stripe arrangement, etc.; and connecting portions connecting the wiring portions. In any of these configurations, the conductive wiring 300 includes a portion embedded in the second surface 202 of the plastic layer 200 on the Z-direction side (hereinafter also referred to as the embedded portion of the conductive wiring 300) and a portion protruding from the second surface 202 of the plastic layer 200 on the Z′-direction side (hereinafter also referred to as the protruding portion of the conductive wiring 300).

[0080] The wiring body 310 may include at least one connecting portion. The at least one connecting portion may be multiple connecting portions. Multiple connecting portions may include a first connecting portion and a second connecting portion. When the conductive wiring 300 has the linear shape described above and the wiring body 310 includes at least one connecting portion, the at least one connecting portion of the wiring body 310 may be any part or any multiple parts of the wiring body 310. When the conductive wiring 300 has a linear shape and the wiring body 310 includes a first connecting portion and a second connecting portion, the first connecting portion and the second connecting portion may be a first end and a second end of the wiring body 310. When the conductive wiring 300 includes multiple wiring portions and connecting portions, and the wiring body 310 includes at least one connecting portion, the at least one connecting portion of the wiring body 310 may be any one part or any multiple parts of the multiple wiring portions or connecting portions. When the conductive wiring 300 includes multiple wiring portions and connecting portions, and the wiring body 310 includes a first connecting portion and a second connecting portion, the first connecting portion and the second connecting portion of the wiring body 310 may be any two parts of the wiring portions or may be a first end and a second end of the connecting portion.

[0081] The three-dimensional structure S1 may further include a second structure 400 and a filling layer I. The second structure 400 has dimensions in the ZZ′ direction, dimensions in the XX′ direction, and dimensions in the YY′ direction. The second structure 400 includes a first surface contacting the second surface 202 of the plastic layer 200 and a second surface on the opposite side (Z′ direction side). The second structure 400 is fixed to the second surface 202 of the plastic layer 200 and covers the protrusions of the conductive wiring 300. For example, the second structure 400 may be made of plastic (e.g., molded plastic, plastic film, etc.), glass, ceramic, wood, or a combination thereof, and is bonded to and / or joined with the second surface 202 of the plastic layer 200. When the second structure 400 is joined with the second surface 202 of the plastic layer 200, one of the second structure 400 and the plastic layer 200 may be provided with a joining protrusion, and the other may be provided with a joining recess that fits to receive the joining protrusion. A gap exists between the second surface 202 of the plastic layer 200 and the second structure 400. Filler layer I is made of injection-molded plastic that fills the gap. The protrusions of the conductive wiring 300 are embedded in filler layer I.

[0082] The filler layer I can be omitted. If the filler layer I is omitted, the second structure 400 can be molded plastic formed on the second surface 202 of the plastic layer 200, and the protrusions of the conductive wiring 300 can be embedded in the second structure 400; alternatively, the second structure 400 can be made of plastic (e.g., molded plastic, plastic film, etc.), glass, ceramic, wood, or a combination thereof, and is bonded to and / or joined to the second surface 202 of the plastic layer 200. In the latter case, a gap may or may not exist between the second structure 400 and the plastic layer 200. The second structure 400 can also be omitted.

[0083] With the second structure 400 provided, at least one connection portion of the conductive wiring 300 can protrude from the second structure 400 in the Z′ direction for connection to the outside, or can be exposed or protruded from the outer peripheral surface of the plastic layer 200 for connection to the outside (see...). Figure 1B In the absence of both the second structure 400 and the filler layer I, at least one connection of the conductive wiring 300 may have a portion protruding from the plastic layer 200 in the Z′ direction for external connection. In any of these cases, if the conductive wiring 300 is a heater, at least one connection of the conductive wiring 300 may be connected to a power supply device; if the conductive wiring 300 is an antenna, at least one connection of the conductive wiring 300 may be connected to a communication device; and if the conductive wiring 300 is a coil or conductive wire, at least one connection of the conductive wiring 300 may be connected to an electronic device.

[0084] The aforementioned three-dimensional structure Sl is described as follows and as follows: Figure 2A and Figure 2B The method shown is used to manufacture it. Figure 2A and Figure 2B The steps of a method for manufacturing a three-dimensional structure S1 are illustrated. The method for manufacturing the three-dimensional structure S1 uses a first molding die 10 having a cavity 11 conforming to the external shape of a first structure 100 and a plastic layer 200. The method also uses a second molding die 20 having a cavity 21 conforming to the external shape of the first structure 100, the plastic layer 200, and a second structure 400.

[0085] First, prepare the first structure 100 in any of the above aspects (see Figure 2A (First figure from top). The first mold 10a and the second mold 10b of the first molding die 10 are opened, and the first structure 100 is placed on the second mold 10b. Thereafter, the first mold 10a and the second mold 10b are closed together. The first structure 100 is thus positioned within the cavity 11 of the first molding die 10 (see Figure 10b). Figure 2A (See the second figure starting from the top). Subsequently, molten plastic is injected through the gate 12 of the first molding die 10 to fill the space on the fixed surface 101 of the first structure 100 in the cavity 11 of the first molding die 10 (see...). Figure 2A (Third figure starting from the top). Molten plastic is cooled or otherwise solidified, causing a plastic layer 200 to be formed on the fixed surface 101 of the first structure 100, and a first plastic portion P1 to be formed within the gate 12 of the first molding die 10. The plastic layer 200 is thus fixed to the fixed surface 101 of the first structure 100. Thereafter, the first mold 10a and the second mold 10b are opened, the first structure 100 and the plastic layer 200 are removed, and the first plastic portion P1 is removed.

[0086] Alternatively, instead of molding the plastic layer 200 as described above, the plastic layer 200 is prepared in a molding die (not shown). The first surface 201 of the plastic layer 200 is joined to and / or engaged with the fixing surface 101 of the first structure 100 as described above, and thereby fixed to the fixing surface 101.

[0087] After fixing the plastic layer 200, conductive wiring 300 is prepared in any of the above aspects. The ultrasonic head U of the ultrasonic generator, configured for ultrasonic vibration, is operated to apply ultrasonic waves to the conductive wiring 300 and press the conductive wiring 300 against the plastic layer 200, thereby partially embedding the conductive wiring 300 into the plastic layer 200. The step of embedding the conductive wiring 300 may be specifically defined, for example, as step (1) or (2).

[0088] (1) When the conductive wiring 300 has the above-mentioned linear shape, the step of embedding the conductive wiring 300 can be specifically the following steps (1-1), (1-2) or (1-3).

[0089] (1-1) When the conductive wire 300 is partially and sequentially fed onto the second surface 202 of the plastic layer 200 from its first end to its second end, the ultrasonic head U of the ultrasonic generator is operated to sequentially apply ultrasonic waves to a portion of the conductive wire 300 that has been fed onto the second surface 202 of the plastic layer 200, and to sequentially press said portion of the conductive wire 300 against the second surface 202 of the plastic layer 200, such that the Z-direction side portion of said portion of the conductive wire 300 is sequentially embedded into the second surface 202 of the plastic layer 200 (see...). Figure 2A (The fourth figure starting from the top).

[0090] (1-2) The conductive wiring 300 is arranged in a linear shape on the second surface 202 of the plastic layer 200. Thereafter, a portion of the conductive wiring 300 on the Z-direction side is sequentially embedded into the second surface 202 of the plastic layer 200 from its first end to its second end in the manner described above for step (1-1)

[0091] (1-3) The conductive wires 300 are arranged in a linear shape on the second surface 202 of the plastic layer 200. Thereafter, the ultrasonic head U of the ultrasonic generator is operated to apply ultrasonic waves to the entire conductive wires 300 and press the entire conductive wires 300 against the second surface 202 of the plastic layer 200, such that the Z-direction side portion (embedded portion) of the conductive wires 300 is embedded into the second surface 202 of the plastic layer 200 at one time (not shown).

[0092] (2) When the conductive wiring 300 includes multiple wiring portions and connecting portions, the step of embedding the conductive wiring 300 may specifically be the following steps (2-1), (2-2) or (2-3).

[0093] (2-1) While a portion of the conductive wiring 300 is partially and sequentially fed onto the second surface 202 of the plastic layer 200 from its first end to its second end, the ultrasonic head U of the ultrasonic generator is operated to sequentially apply ultrasonic waves to a portion of the wiring portion that has been fed onto the second surface 202 of the plastic layer 200, and sequentially presses the portion of the wiring portion against the second surface 202 of the plastic layer 200, such that the Z-direction side portion of the portion of the wiring portion is sequentially embedded into the second surface 202 of the plastic layer 200. This step is performed on all wiring portions. Before and after the step of embedding all the wiring portions, while the connecting portion of the conductive wiring 300 is partially and sequentially fed onto the second surface 202 of the plastic layer 200 from its first end to its second end, the ultrasonic head U of the ultrasonic generator is operated to sequentially apply ultrasonic waves to a portion of the connecting portion that has been fed onto the second surface 202 of the plastic layer 200, and sequentially press the portion of the connecting portion against the second surface 202 of the plastic layer 200, such that the Z-direction side portion of the connecting portion is sequentially embedded into the second surface 202 of the plastic layer 200 (not shown).

[0094] (2-2) A plurality of wiring portions and connecting portions of the conductive wiring 300 are arranged on the second surface 202 of the plastic layer 200. Thereafter, a portion of the conductive wiring 300 of one of the plurality of wiring portions, from its first end to its second end, is sequentially embedded into the second surface 202 of the plastic layer 200 in the manner described above for step (2-1). This step is performed on all wiring portions. Before and after the step of embedding all wiring portions, as described above, a portion of the connecting portion, from its first end to its second end, is sequentially embedded into the second surface 202 of the plastic layer 200 in the manner described above for step (2-1).

[0095] (2-3) Multiple wiring portions and connecting portions of the conductive wiring 300 are arranged on the second surface 202 of the plastic layer 200. Thereafter, the ultrasonic head U of the ultrasonic generator is operated to apply ultrasonic waves to the entire conductive wiring 300 and press the entire conductive wiring 300 against the second surface 202 of the plastic layer 200, such that the Z-direction side portion of the conductive wiring 300 is embedded into the second surface 202 of the plastic layer 200 at one time (not shown).

[0096] Therefore, the Z-direction side of the conductive wiring 300 is embedded in the second surface 202 of the plastic layer 200, and the Z′-direction side of the conductive wiring 300 protrudes from the second surface 202 of the plastic layer 200 in the Z′ direction. When the plastic layer 200 is fixed to the fixing surface 101 of the first structure 100 by bonding and / or joining, the embedded portion of the conductive wiring 300 can be embedded in the second surface 202 of the plastic layer 200, and then the plastic layer 200 can be fixed to the fixing surface 101 of the first structure 100 by bonding and / or joining.

[0097] After the step of embedding the conductive wiring 300, a second structure 400 is prepared. The second structure 400 is fixed to the second surface 202 of the plastic layer 200 by bonding and / or joining to cover the protrusion of the conductive wiring 300. At this time, a gap is created between the first surface of the second structure 400 and the second surface 202 of the plastic layer 200.

[0098] Subsequently, the first mold 20a and the second mold 20b of the second molding die 20 are opened, and the first structure 100, the plastic layer 200, the conductive wiring 300, and the second structure 400 are placed on the second mold 20b. Then, the first mold 20a and the second mold 20b are closed together. Therefore, the first structure 100, the plastic layer 200, the conductive wiring 300, and the second structure 400 are disposed within the cavity 21 of the second molding die 20 (see...). Figure 2B (See the first figure starting from the top). Subsequently, molten plastic is injected through the gate (not shown) of the second molding die 20 to fill the gap in the cavity 21 of the second molding die 20 between the first surface of the second structure 400 and the second surface 202 of the plastic layer 200 (see...). Figure 2B (See the second figure starting from the top). At this point, the protrusion of the conductive wire 300 is inserted into the molten plastic. The molten plastic is cooled or otherwise solidified, such that a filler layer I is formed between the second structure 400 and the second surface 202 of the plastic layer 200, the protrusion of the conductive wire 300 is embedded (insert molding) in the filler layer I, and a second plastic part is formed inside the gate of the second molding die 20. Thereafter, the first mold 20a and the second mold 20b are opened, and the first structure 100, the plastic layer 200, the conductive wire 300, the second structure 400, and the filler layer I are removed (see...). Figure 2B (The third figure starting from the top) and remove the second plastic part.

[0099] By omitting the second structure 400 and the filler layer I, the steps of fixing the second structure 400 to the second surface 202 of the plastic layer 200 and the steps of forming the filler layer I are also omitted.

[0100] With the filler layer I omitted but a second structure 400 provided, the first structure 100, plastic layer 200, and conductive wiring 300 can be arranged within the cavity of a molding die (not shown). Molten plastic is injected into the cavity and then cured to form the second structure 400 on the second surface 202 of the plastic layer 200, and protrusions of the conductive wiring 300 are inserted into the second structure 400. Alternatively, the second structure 400 can be fixed to the second surface 202 of the plastic layer 200 by bonding or joining.

[0101] The three-dimensional structure S1 is manufactured using one of the methods described above. In the three-dimensional structure S1 and its manufacturing method, the conductive wiring 300 is partially embedded in the plastic layer 200, thereby reducing the possibility of accidental displacement of the conductive wiring 300. Specifically, when the filler layer I is formed between the second structure 400 and the plastic layer 200, even if the molten plastic forming the filler layer I is injected into the cavity 21 of the second molding die 20 and the conductive wiring 300 is extruded, the possibility of accidental displacement of the conductive wiring 300 can be reduced because the conductive wiring 300 is partially embedded in the second surface 202 of the plastic layer 200. Similarly, when the second structure 400 is formed on the plastic layer 200, such as when the filler layer I is formed, even if the molten plastic extrudes the conductive wiring 300, the possibility of accidental displacement of the conductive wiring 300 can be reduced because the conductive wiring 300 is partially embedded in the second surface 202 of the plastic layer 200.

[0102] Since the conductive wiring 300 is partially embedded in the plastic layer 200, the first structure 100 can be made of any desired material, and no deformation occurs in the first structure 100 by embedding the conductive wiring 300 in the first structure 100.

[0103] Furthermore, when the fixing surface 101 of the first structure 100 has protrusions and recesses, it is difficult to embed the conductive wire 300 into the fixing surface 101 using the ultrasonic head U of the ultrasonic generator. This is because when a portion of the conductive wire 300 is located in the recess of the fixing surface 101, the ultrasonic head U of the ultrasonic generator will contact the outer periphery of the recess, making it impossible for the ultrasonic head U to press down on that portion of the conductive wire 300. Conversely, the three-dimensional structure S1 can be configured such that the second surface 202 of the plastic layer 200 is a smooth surface. In this case, the ultrasonic head U of the ultrasonic generator can press down on the conductive wire 300, making it easier to embed the conductive wire 300 into the second surface 202 of the plastic layer 200.

[0104] The conductive wiring 300 is directly embedded in the plastic layer 200. Therefore, the number of components in the three-dimensional structure Sl is reduced.

[0105] Second Implementation Method

[0106] In the following text, refer to Figures 3A to 3C A three-dimensional structure S2 is described according to a plurality of embodiments of the present invention, including the second embodiment and variations thereof. Figure 3A The three-dimensional structure S2 of the second embodiment is illustrated. Figure 3B A first variation of the three-dimensional structure S2 of the second embodiment is illustrated, while Figure 3C A second variation of the three-dimensional structure S2 of the second embodiment is illustrated. Figure 3A The ZZ′ direction indicates the thickness direction of the three-dimensional structure S2. Figure 3A The YY′ direction indicates the width of the three-dimensional structure S2. The XX′ direction, which is the length of the three-dimensional structure S2, can be indicated by referring to... Figure 1B .

[0107] Apart from including at least one terminal 500, the three-dimensional structure S2 has the same construction as the three-dimensional structure S1. The three-dimensional structure S2 will now be described, focusing on the differences from the three-dimensional structure S1 and omitting overlapping descriptions.

[0108] At least one terminal 500 is made of a conductive material. For example, at least one terminal 500 may be made of a metal plate with a strength higher than that of the wiring body 310 of the conductive wiring 300. At least one terminal 500 may be a plurality of terminals 500. For example, a plurality of terminals 500 may include a first terminal 500 and a second terminal 500. For ease of description, at least one terminal 500 may be referred to hereinafter as "the terminal or each terminal 500". When at least one terminal 500 is a single terminal 500, "the terminal or each terminal 500" refers to a single terminal 500, while when at least one terminal 500 is a plurality of terminals, "the terminal or each terminal 500" refers to each of the plurality of terminals 500.

[0109] The terminal or each terminal 500 includes an insert portion 510 and an external connection portion 520. The insert portion 510 of the terminal or each terminal 500 includes a portion embedded in the second surface 202 of the plastic layer 200 and a remaining portion exposed or protruding from the second surface 202 of the plastic layer 200. Hereinafter, the portion of the insert portion 510 will be referred to as the "first portion of the insert portion 510," and the remaining portion of the insert portion 510 will be referred to as the "second portion of the insert portion 510." The external connection portion 520 of the terminal or each terminal 500 is located outside the plastic layer 200. For example, the external connection portion 520 of the terminal or each terminal 500 may be located on the Z′ direction side relative to the plastic layer 200. The external connection portion 520 of the terminal or each terminal 500 is externally connectable. When the conductive wiring 300 is a heater, the terminal or the external connection portion 520 of each terminal 500 can be connected to a power supply device; when the conductive wiring 300 is an antenna, the terminal or the external connection portion 520 of each terminal 500 can be connected to a communication device; and when the conductive wiring 300 is a coil or conductive wire, the terminal or the external connection portion 520 of each terminal 500 can be connected to an electronic device. The external connection portion 520 of the terminal or each terminal 500 includes a first portion on the Z-direction side and a second portion on the Z′-direction side, and the second portion includes the distal end of the external connection portion 520 of the terminal or each terminal 500, which serves as the Z′-direction side portion of the second portion.

[0110] When a second structure 400 and a filling layer I are provided, the second portion of the embedding portion 510 of the terminal or each terminal 500 and the first portion of the external connecting portion 520 of the terminal or each terminal 500 are embedded in the filling layer I. The second structure 400 is provided with a through hole 410. The second portion of the external connecting portion 520 of the terminal or each terminal 500 extends through the through hole 410 in the ZZ′ direction, and the distal end of the external connecting portion 520 of the terminal or each terminal 500 is located on the Z′ direction side relative to the through hole 410. Alternatively, the second portion of the external connecting portion 520 of the terminal or each terminal 500 is located in the through hole 410.

[0111] Without the filling layer I and with the second structure 400 fixed to the second surface 202 of the plastic layer 200, the terminal or the outer connecting portion 520 of each terminal 500 extends through the through hole 410 of the second structure 400 in the ZZ′ direction or is disposed in the through hole 410 of the second structure 400.

[0112] The conductive wiring 300 of the three-dimensional structure S2 includes wiring body 310, and may additionally include a fusion layer (see...). Figure 5The conductive wiring 300 may or may not include an insulating layer and a fusion layer. At least one connection portion of the wiring body 310 of the conductive wiring 300 is electrically and mechanically connected to an embedded portion 510 of at least one terminal 500. For example, the connection portion or each connection portion may be any part of the wiring body 310 that contacts the embedded portion 510 of the corresponding terminal 500 and can be electrically and mechanically connected to the embedded portion 510 of the corresponding terminal 500. When the conductive wiring 300 includes a fusion layer but does not include an insulating layer, the connection portion or each connection portion is at least partially exposed from the fusion layer and is electrically and mechanically connected to the embedded portion 510 of the corresponding terminal 500. When the conductive wiring 300 includes an insulating layer and a fusion layer, the connection portion or each connection portion is at least partially exposed from the insulating layer and the fusion layer and is electrically and mechanically connected to the embedded portion 510 of the corresponding terminal 500. In the case where at least one connection portion of the wiring body 310 includes a first connection portion and a second connection portion, the first connection portion and the second connection portion may be any part of the wiring body 310 that is in contact with the embedded portion 510 of the first terminal 500 and the second terminal 500 respectively and can be electrically and mechanically connected to the embedded portion 510 of the first terminal 500 and the second terminal 500.

[0113] The three-dimensional structure S2 may also include a main body 600 (see Figure 3C The main body 600 is made of an insulating material such as plastic. The main body 600 is fixed to or integrally disposed on the second surface of the second structure 400. The main body 600 is provided with a through hole 610. The through hole 610 communicates with the through hole 410 of the second structure 400, and the external connecting portion 520 of the terminal or each terminal 500 is disposed in the through hole 410 of the second structure 400 and the through hole 610 of the main body 600. The external connecting portion 520 of the terminal or each terminal 500 and the main body 600 constitute a connector. The connector can be connected to a mating connector of an external device (e.g., the aforementioned power supply device, communication device, electronic device, etc.), and the main body 600 is connected to the body of the mating connector such that the external connecting portion 520 of the terminal or each terminal 500 contacts a corresponding terminal among one or more terminals of the mating connector. The main body 600 may be omitted.

[0114] The first structure 100 of the three-dimensional structure S2 may include at least one functional layer 120 (see Figure 3B Alternatively, it may not include at least one functional layer 120.

[0115] Using the following description and in Figure 4A and Figure 4B The method shown above is used to manufacture the three-dimensional structure S2 described above. Figure 4A and Figure 4BThe steps of a method for manufacturing a three-dimensional structure S2 are illustrated. The method for manufacturing the three-dimensional structure S2 uses a first molding die 10', which has the same structure as the first molding die 10 used in the method for manufacturing the three-dimensional structure S1, except that the first mold 10a' also includes a receiving hole 13 communicating with a cavity 11. The method for manufacturing the three-dimensional structure S2 also uses a second molding die 20', which has the same structure as the second molding die 20 used in the method for manufacturing the three-dimensional structure S1, except that the first mold 20a' also includes a protrusion 22 extending and projecting into a cavity 21 and a receiving hole 23 disposed in the outer peripheral region of the cavity 21 of the protrusion 22 and the first mold 20a'.

[0116] First, prepare the first structure 100 in any of the above aspects (see Figure 4A (First figure from top). Prepare one or more terminals 500 in any of the above aspects. Open the first mold 10a' and the second mold 10b of the first molding mold 10', and place the first structure 100 on the second mold 10b. Insert the outer connecting portion 520 of the single terminal 500 and the second portion of the insert portion 510 of the terminal 500 (or alternatively, multiple outer connecting portions 520 of multiple terminals 500 and multiple second portions of multiple insert portions 510 of multiple terminals 500) into the receiving hole 13 of the first mold 10a', and fix one or more terminals 500 to the first mold 10a' with adhesive, double-sided tape, etc. Thereafter, close the first mold 10a' and the second mold 10b together. Thus, the first structure 100 and the first portion of the insert portion 510 of the terminal 500 (or alternatively, multiple first portions of multiple insert portions 510 of multiple terminals 500) are arranged in the cavity 11 of the first molding mold 10' (see Figure 4A (The second figure starting from the top).

[0117] Subsequently, the molten plastic is injected through the gate 12 of the first molding mold 10' to fill the space on the fixed surface 101 of the first structure 100 in the cavity 11 of the first molding mold 10' (see...). Figure 4A(See the third figure starting from the top). At this time, the first portion of the insert portion 510 of a single terminal 500 (or alternatively, multiple first portions of multiple insert portions 510 of multiple terminals 500) is inserted into the molten plastic. The molten plastic is cooled or otherwise solidified such that a plastic layer 200 is formed on the fixing surface 101 of the first structure 100, the first portion of the insert portion 510 of the terminal 500 (or alternatively, multiple first portions of multiple insert portions 510 of multiple terminals 500) is embedded (insert-formed) in the plastic layer 200, and the first plastic portion P1 is formed within the gate 12 of the first molding die 10. The plastic layer 200 is thus fixed to the fixing surface 101 of the first structure 100. Thereafter, the first mold 10a and the second mold 10b are opened, the first structure 100, one or more terminals 500, and the plastic layer 200 are removed, and the first plastic portion P1 is removed.

[0118] Alternatively, instead of molding the plastic layer 200 as described above, the plastic layer 200 is prepared in a molding die (not shown). This plastic layer 200 is also arranged such that the first portion of the insert 510 of a single terminal 500 (or alternatively, multiple first portions of multiple inserts 510 of multiple terminals 500) is inserted (insert-molded) into the plastic layer 200. The first surface 201 of the plastic layer 200 is joined to and / or engaged with the fixing surface 101 of the first structure 100 in a manner similar to that described above for the first structure 100, thereby securing it to the fixing surface 101.

[0119] After fixing the plastic layer 200, conductive wiring 300 is prepared in any of the above aspects. The ultrasonic head U of the ultrasonic generator, configured for ultrasonic vibration, is operated to apply ultrasonic waves to the conductive wiring 300 and press the conductive wiring 300 against the plastic layer 200, thereby partially embedding the conductive wiring 300 into the plastic layer 200.

[0120] When the step of embedding the conductive wiring 300 is the step (1-1) described above, as described above, a portion of the conductive wiring 300 on the Z-direction side is sequentially embedded from its first end to its second end into the second surface 202 of the plastic layer 200 (see...). Figure 4A (Figure 4 from the top). During this process, the connection portion or each connection portion of the conductive wiring 300 is fed onto the embedding portion 510 of the corresponding terminal 500. At this time, the ultrasonic head U of the ultrasonic generator is operated to apply ultrasonic waves to the connection portion or each connection portion of the conductive wiring 300 and press the connection portion or each connection portion of the conductive wiring 300 against the second part of the embedding portion 510 of the corresponding terminal 500. Therefore, the connection portion or each connection portion of the conductive wiring 300 is properly arranged and contacts the embedding portion 510 of the corresponding terminal 500.

[0121] When the step of embedding the conductive wiring 300 is as described in steps (1-2), when the conductive wiring 300 is arranged in a linear shape on the second surface 202 of the plastic layer 200, the connecting portion or each connecting portion of the conductive wiring 300 is disposed on the embedding portion 510 of the corresponding terminal 500. Thereafter, as described above, a portion of the conductive wiring 300 on the Z-direction side is sequentially embedded in the second surface 202 of the plastic layer 200 (not shown) from its first end to its second end in the manner described above. During this process, the ultrasonic head U of the ultrasonic generator is operated to apply ultrasonic waves to the connecting portion or each connecting portion of the conductive wiring 300 and press the connecting portion or each connecting portion of the conductive wiring 300 against the second portion of the embedding portion 510 of the corresponding terminal 500. Therefore, the connecting portion or each connecting portion of the conductive wiring 300 is properly arranged and contacts the embedding portion 510 of the corresponding terminal 500.

[0122] When the step of embedding the conductive wiring 300 is as described in steps (1-3), when the conductive wiring 300 is arranged in a linear shape on the second surface 202 of the plastic layer 200, the connecting portion or each connecting portion of the conductive wiring 300 is provided on the embedding portion 510 of the corresponding terminal 500. Thereafter, the ultrasonic head U of the ultrasonic generator is operated to apply ultrasonic waves to the entire conductive wiring 300 and press the entire conductive wiring 300 against the second surface 202 of the plastic layer 200, such that the Z-direction side portion (embedding portion) of the conductive wiring 300 is embedded into the second surface 202 of the plastic layer 200 at one time. At this time, the ultrasonic head U of the ultrasonic generator is operated to apply ultrasonic waves to the connecting portion or each connecting portion of the conductive wiring 300 and press the connecting portion or each connecting portion of the conductive wiring 300 against the second portion of the embedding portion 510 of the corresponding terminal 500. Therefore, the connecting portion or each connecting portion of the conductive wiring 300 is properly arranged and contacts the embedding portion 510 of the corresponding terminal 500.

[0123] When the step of embedding the conductive wiring 300 is the aforementioned step (2-1), as described above, a portion of one of the wiring sections of the conductive wiring 300, on the Z-direction side, is sequentially embedded into the second surface 202 of the plastic layer 200 from its first end to its second end. This step is performed on all wiring sections. Before and after the step of embedding all wiring sections, as described above, a portion of the connecting section, on the Z-direction side, is sequentially embedded into the second surface 202 of the plastic layer 200 from its first end to its second end. During the steps of embedding the wiring section or embedding the connecting section, the ultrasonic head U of the ultrasonic generator is operated to apply ultrasonic waves to the connecting section of the conductive wiring 300 or the connecting portion or each connecting portion of the wiring section, and the connecting portion or each connecting portion is pressed against the second part of the embedding portion 510 of the corresponding terminal 500. Therefore, the connecting portion or each connecting portion of the conductive wiring 300 is properly arranged and contacts the embedding portion 510 of the corresponding terminal 500.

[0124] In the case where the step of embedding the conductive wiring 300 is the aforementioned step (2-2), after the plurality of wiring portions and connecting portions of the conductive wiring 300 as described above are arranged on the second surface 202 of the plastic layer 200, as described above, a portion of one of the wiring portions of the conductive wiring 300 on the Z-direction side is sequentially embedded into the second surface 202 of the plastic layer 200 from its first end to its second end. This step is performed on all wiring portions. Before and after the step of embedding all wiring portions, as described above, a portion of the connecting portion on the Z-direction side is sequentially embedded into the second surface 202 of the plastic layer 200 from its first end to its second end. During the step of embedding the wiring portion or the step of embedding the connecting portion, the ultrasonic head U of the ultrasonic generator is operated to apply ultrasonic waves to the connecting portion or the connecting portion or each connecting portion of the conductive wiring 300, and presses the connecting portion or each connecting portion against the second portion of the embedding portion 510 of the corresponding terminal 500. Therefore, the connecting portion or each connecting portion of the conductive wiring 300 is properly arranged and contacts the embedding portion 510 of the corresponding terminal 500.

[0125] When the step of embedding the conductive wiring 300 is as described in (2-3), a plurality of wiring portions and connecting portions of the conductive wiring 300 are arranged on the second surface 202 of the plastic layer 200. Thereafter, the ultrasonic head U of the ultrasonic generator is operated to apply ultrasonic waves to the entire conductive wiring 300, pressing the entire conductive wiring 300 against the second surface 202 of the plastic layer 200, such that the Z-direction side portion of the conductive wiring 300 is embedded into the second surface 202 of the plastic layer 200 at one time. At this time, the ultrasonic head U of the ultrasonic generator is operated to press the connecting portion or the connecting portion of the wiring portion, or each connecting portion, of the conductive wiring 300 against the second portion of the embedding portion 510 of the corresponding terminal 500. Therefore, the connecting portion or each connecting portion of the conductive wiring 300 is properly arranged and contacts the embedding portion 510 of the corresponding terminal 500.

[0126] Therefore, the embedded portion of the conductive wiring 300 on the Z-direction side is embedded in the second surface 202 of the plastic layer 200, and the protrusion of the conductive wiring 300 on the Z′-direction side protrudes from the second surface 202 of the plastic layer 200 in the Z′ direction, and the connection portion or each connection portion of the conductive wiring 300 is properly arranged and contacts the embedded portion 510 of the corresponding terminal 500.

[0127] After the step of embedding the conductive wiring 300, the connection portion or each connection portion of the conductive wiring 300 is electrically and mechanically connected to the embedding portion 510 of the corresponding terminal 500 by hot forging, welding (e.g., laser welding, arc welding, resistance welding, ultrasonic welding, etc.) or soldering. In the case where the conductive wiring 300 includes a fusion layer but not an insulating layer, the connection portion or each connection portion of the conductive wiring 300 is heated and pressed onto the embedding portion 510 of the corresponding terminal 500 using the forging head C of a hot forging machine. The heat melts a portion of the fusion layer covering the connection portion or each connection portion of the conductive wiring 300, exposing the connection portion or each connection portion from the fusion layer and electrically and mechanically connected to the embedding portion 510 of the corresponding terminal 500; or alternatively, the heat generated by welding or soldering melts a portion of the fusion layer covering the connection portion or each connection portion of the conductive wiring 300, exposing the connection portion or each connection portion from the fusion layer and electrically and mechanically connected to the embedding portion 510 of the corresponding terminal 500. When the conductive wiring 300 includes an insulating layer and a fusion layer, the connecting portion or each connecting portion of the conductive wiring 300 is heated and pressed onto the embedding portion 510 of the corresponding terminal 500 using the forging head C of a hot forging machine. The heat melts a portion of the fusion layer and a portion of the insulating layer covering the connecting portion or each connecting portion of the conductive wiring 300, and the connecting portion or each connecting portion is exposed from the insulating layer and the fusion layer, and is electrically and mechanically connected to the embedding portion 510 of the corresponding terminal 500; or alternatively, the heat generated by welding or soldering melts a portion of the fusion layer and a portion of the insulating layer covering the connecting portion or each connecting portion of the conductive wiring 300, and the connecting portion or each connecting portion is exposed from the insulating layer and the fusion layer, and is electrically and mechanically connected to the embedding portion 510 of the corresponding terminal 500. In cases where the conductive wiring 300 does not include an insulating layer or a fusion layer, the connecting portion or each connecting portion of the conductive wiring 300 is heated and pressed onto the embedding portion 510 of the corresponding terminal 500 using the forging head C of a hot forging machine, and the connecting portion or each connecting portion is electrically and mechanically connected to the embedding portion 510 of the corresponding terminal 500; or alternatively, the connecting portion or each connecting portion is electrically and mechanically connected to the embedding portion 510 of the corresponding terminal 500 by soldering or tin soldering. In cases where the plastic layer 200 is fixed to the fixing surface 101 of the first structure 100 by bonding and / or joining, after the step of connecting the conductive wiring 300, the plastic layer 200 is fixed to the fixing surface 101 of the first structure 100 by bonding and / or joining.

[0128] After the step of connecting the conductive wiring 300, a second structure 400 is prepared. The second structure 400 is fixed to the second surface 202 of the plastic layer 200 by bonding and / or joining to cover the protrusions of the conductive wiring 300. At this time, the second portion of the outer connection portion 520 of a single terminal 500 (or alternatively, the second portion of the outer connection portion 520 of multiple terminals 500) is inserted into the through hole 410 of the second structure 400. A gap is created between the first surface of the second structure 400 and the second surface 202 of the plastic layer 200.

[0129] Subsequently, the first mold 20a' and the second mold 20b of the second molding mold 20' are opened, and the first structure 100, the plastic layer 200, the conductive wiring 300, one or more terminals 500, and the second structure 400 are placed on the second mold 20b. Then, the first mold 20a and the second mold 20b are closed together. At this time, the first structure 100, the plastic layer 200, the conductive wiring 300, the insert 510 of a single terminal 500 (or alternatively, the insert 510 of multiple terminals 500), the first portion of the external connection portion 520 of the terminal 500 (or alternatively, the first portion of the external connection portion 520 of multiple terminals 500), and the second structure 400 are disposed within the cavity 21 of the second molding mold 20; the second portion of the external connection portion 520 of the terminal 500 (or alternatively, the multiple second portions of the multiple external connection portions 520 of multiple terminals 500) is accommodated in the receiving hole 23 of the first mold 20a' (see...). Figure 4B (First figure starting from the top); and the protrusion 22 is fitted into the through hole 410 of the second structure 400. Thereafter, molten plastic is injected through the gate (not shown) of the second molding die 20' to fill the gap between the first surface of the second structure 400 and the second surface 202 of the plastic layer 200 in the cavity 21 of the second molding die 20' (see...). Figure 4B(See the second figure starting from the top). At this time, the protrusion of the conductive wiring 300, the second portion of the insertion portion 510 of a single terminal 500 (or alternatively, multiple second portions of multiple insertion portions 510 of multiple terminals 500), and the first portion of the external connection portion 520 of the terminal 500 (or multiple first portions of multiple external connection portions 520 of multiple terminals 500) are inserted into the molten plastic. The molten plastic is cooled or otherwise solidified such that a fill layer I is formed between the first surface of the second structure 400 and the second surface 202 of the plastic layer 200, the protrusion of the conductive wiring 300, the second portion of the insertion portion 510 of the terminal 500 (or alternatively, multiple second portions of multiple insertion portions 510 of multiple terminals 500), and the first portion of the external connection portion 520 of the terminal 500 (or alternatively, multiple first portions of multiple external connection portions 520 of multiple terminals 500) are embedded (insert-molded) in the fill layer I, and a second plastic portion is formed inside the gate of the second molding die 20'. Subsequently, the first mold 20a and the second mold 20b are opened, and the first structure 100, the plastic layer 200, the conductive wiring 300, the second structure 400, one or more terminals 500, and the filler layer I (see...) are removed. Figure 4B (See the third figure starting from the top), and remove the second plastic portion. At this time, the protrusion 22 extends from the through hole 410 of the second structure 400, such that the second portion of the outer connection portion 520 of the terminal 500 (or alternatively, the second portions 500 of the multiple outer connection portions 520 of the multiple terminals 500) extends through the through hole 410 or is located in the through hole 410. It should be noted that the protrusion 22 may be omitted. When the protrusion 22 is omitted, the second structure 400 may be provided with a single through hole 410 or multiple through holes 410. The through hole or each through hole 410 may have a shape substantially the same as the shape of the second portion in the outer connection portion 520 of the corresponding terminal 500, excluding the distal end.

[0130] With the main body 600 separated from the second structure 400, the main body 600 is manufactured. The main body 600 is fixed to the second structure 400, and the distal end of the external connection portion 520 of a single terminal 500 (or alternatively, the distal ends of multiple external connection portions 520 of multiple terminals 500) is inserted into the through hole 610 of the main body 600. With the main body 600 and the second structure 400 integrated, the second structure 400 having the main body 600 is manufactured.

[0131] By omitting the second structure 400 and the filling layer I, the steps of fixing the second structure 400 to the second surface 202 of the plastic layer 200 and the steps of shaping the filling layer I are omitted.

[0132] When the filler layer I is omitted and a second structure 400 is provided, the first structure 100, plastic layer 200, conductive wiring 300, and one or more terminals 500 can be arranged in the cavity of a molding die (not shown). Molten plastic is injected into the cavity and then cured to form the second structure 400 on the second surface 202 of the plastic layer 200, and protrusion inserts of the conductive wiring 300 are formed in the second structure 400. When the body 600 is integral with the second structure 400, the body 600 can be formed simultaneously with the second structure 400. Alternatively, the second structure 400 can be fixed to the second surface 202 of the plastic layer 200 by bonding or joining.

[0133] The three-dimensional structure S2 is manufactured using one of the methods described above. This three-dimensional structure S2 and its manufacturing method provide technical features and effects similar to those of the three-dimensional structure S1 and its manufacturing method. Furthermore, when the conductive wiring 300 is embedded in the second surface 202 of the plastic layer 200 using the ultrasonic head U of an ultrasonic generator, the ultrasonic head U of the ultrasonic generator presses the connecting portion or each connecting portion of the conductive wiring 300 against the second part of the embedding portion 510 of the corresponding terminal 500, thereby properly arranging the connecting portion or each connecting portion of the conductive wiring 300 and making contact with the embedding portion 510 of the corresponding terminal 500. This facilitates electrical and mechanical connection between the connecting portion or each connecting portion of the conductive wiring 300 and the corresponding terminal 500 via hot forging, welding, or soldering. Furthermore, since at least one terminal 500 is externally connectable, it is easier to externally connect the three-dimensional structure S1 compared to the case where external connection is made via at least one connecting portion of the conductive wiring 300. When the three-dimensional structure S2 includes a connector, the three-dimensional structure S2 can be connected to the external device more easily by connecting the body 600 of the three-dimensional structure S2 to the mating connector of the external device.

[0134] Third Implementation Method

[0135] In the following text, refer to Figure 5 A three-dimensional structure S3 is described according to a plurality of embodiments of the present invention, including a third embodiment and variations thereof. Figure 5 The three-dimensional structure S3 of the third embodiment is illustrated. Figure 5 The ZZ′ direction indicates the thickness direction of the three-dimensional structure S2. Figure 5 It also indicates the YY′ direction, which is the width direction of the three-dimensional structure S2. For the indication of the XX′ direction, which is the length direction of the three-dimensional structure S3, please refer to... Figure 1B .

[0136] Except that the three-dimensional structure S3 also includes at least one adhesive layer 700, the three-dimensional structure S3 has the same construction as the three-dimensional structure S2. The three-dimensional structure S3 will now be described, focusing on the differences from the three-dimensional structure S2 and omitting overlapping descriptions.

[0137] At least one adhesive layer 700 is provided according to the number of at least one terminal 500. For ease of description, at least one adhesive layer 700 may be referred to hereinafter as "the adhesive layer or each adhesive layer 700". In the case where at least one adhesive layer 700 is a single adhesive layer 700, "the adhesive layer or each adhesive layer 700" refers to a single adhesive layer 700, and in the case where at least one adhesive layer 700 is a plurality of adhesive layers, "the adhesive layer or each adhesive layer 700" refers to each of the plurality of adhesive layers 700.

[0138] The adhesive layer or each adhesive layer 700 is a thermoplastic such as hot melt adhesive and is disposed on the Z′ direction side surface of the embedding portion 510 of the corresponding terminal 500. The adhesive layer or each adhesive layer 700 includes an exposed surface 701 on the Z′ direction side.

[0139] The insertion portion 510 of the terminal or each terminal 500 is embedded in the second surface 202 of the plastic layer 200, such that the exposed surface 701 of the adhesive layer 700 on the insertion portion 510 is substantially flush with the second surface 202 of the plastic layer 200. In this case, the entire insertion portion 510 of the terminal or each terminal 500 is embedded in the plastic layer 200, and the adhesive layer 700 on the insertion portion 510 is embedded in the plastic layer 200, such that the exposed surface 701 is exposed from the second surface 202 of the plastic layer 200.

[0140] The conductive wiring 300 of the three-dimensional structure S3 includes wiring body 310, and may additionally include fusion layer 320, and may additionally include fusion layer 320 and insulating layer 330 (see...). Figure 5Alternatively, neither the fusion layer 320 nor the insulating layer 330 may be provided. When the fusion layer 320 is provided but the insulating layer 330 is not, the connection portion or each connection portion of the conductive wiring 300 is exposed from the fusion layer 320 and electrically and mechanically connected to the embedding portion 510 of the corresponding terminal 500. When both the fusion layer 320 and the insulating layer 330 are provided, the connection portion or each connection portion of the conductive wiring 300 is exposed from both the fusion layer 320 and the insulating layer 330 and electrically and mechanically connected to the embedding portion 510 of the corresponding terminal 500. When neither the fusion layer 320 nor the insulating layer 330 is provided, the connection portion or each connection portion of the conductive wiring 300 is electrically and mechanically connected to the embedding portion 510 of the corresponding terminal 500. In the three-dimensional structure S3, the fusion layer is referred to by reference numeral 320, and the insulating layer is referred to by reference numeral 330. However, the fusion layer 320 and the insulating layer 330 have the same or similar structure as the fusion layer and insulating layer of the three-dimensional structures S1 and S2.

[0141] The first structure 100 of the three-dimensional structure S3 may or may not include at least one functional layer 120.

[0142] Use the following description and as Figure 6A and Figure 6B The method shown is used to manufacture the above-mentioned three-dimensional structure S3. Figure 6A and Figure 6B The steps of a method for manufacturing a three-dimensional structure S3 are illustrated.

[0143] First, prepare the first structure 100 in any of the above aspects (see Figure 6A (First figure from top). Prepare one or more terminals 500 and one or more adhesive layers 700 in any of the above aspects. A single adhesive layer 700 is disposed on the embedding portion 510 of the single terminal 500, or alternatively, multiple adhesive layers 700 are disposed on corresponding embedding portions 510 of multiple terminals 500. Hereinafter, the adhesive layer 700 located on the embedding portion 510 of the single terminal 500 may be referred to as "corresponding adhesive layer 700," and the multiple adhesive layers 700 located on the corresponding embedding portions 510 of multiple terminals 500 may be referred to as "multiple corresponding adhesive layers 700."

[0144] The first mold 10a' and the second mold 10b of the first molding mold 10' are opened, and the first structure 100 is placed on the second mold 10b. The external connection portion 520 of a single terminal 500 (or alternatively, multiple external connection portions 520 of multiple terminals 500) is inserted into the receiving hole 13 of the first mold 10a'; the exposed surface 701 of the corresponding adhesive layer 700 (or alternatively, multiple exposed surfaces 701 of multiple corresponding adhesive layers 700) contacts the edge of the receiving hole 13 of the first mold 10a'; and one or more terminals 500 are fixed to the first mold 10a' using adhesive, double-sided tape, etc. Thereafter, the first mold 10a' and the second mold 10b are closed together. In this manner, the first structure 100, the insert portion 510 of a single terminal 500, and the corresponding adhesive layer 700 (or alternatively, the insert portions 510 of multiple terminals 500 and multiple corresponding adhesive layers 700) are arranged in the cavity 11 of the first molding die 10' (see [reference]). Figure 6A (The second figure starting from the top).

[0145] Subsequently, the molten plastic is injected through the gate 12 of the first molding mold 10' to fill the space on the fixed surface 101 of the first structure 100 in the cavity 11 of the first molding mold 10' (see...). Figure 6A (See the third figure starting from the top). At this time, the insert portion 510 of a single terminal 500 and the corresponding adhesive layer 700 (or alternatively, the insert portions 510 of multiple terminals 500 and multiple corresponding adhesive layers 700) are inserted into the molten plastic, but the exposed surfaces 701 of the corresponding adhesive layers 700 (or alternatively, multiple exposed surfaces 701 of multiple corresponding adhesive layers 700) will not be inserted into the molten plastic. This is because the exposed surfaces 701 (or alternatively, multiple exposed surfaces 701) are in contact with the edge of the receiving hole 13 of the first mold 10a'. The molten plastic is cooled or otherwise solidified, such that a plastic layer 200 is formed on the fixed surface 101 of the first structure 100, and an insert 510 of a single terminal 500 (or alternatively, multiple inserts 510 of multiple terminals 500) and a corresponding adhesive layer 700 (or alternatively, multiple corresponding adhesive layers 700 other than the exposed surface 701) are embedded (insert-formed) in the plastic layer 200, and a first plastic portion P1 is formed in the gate 12 of the first molding die 10'. The plastic layer 200 is thus fixed to the fixed surface 101 of the first structure 100, and the second surface 202 of the plastic layer 200 becomes substantially flush with the exposed surface 701 of the adhesive layer 700 (or alternatively, multiple exposed surfaces 701 of multiple adhesive layers 700). After that, the first mold 10a and the second mold 10b are opened, the first structure 100, one or more terminals 500 and the plastic layer 200 are removed, and the first plastic part P1 is removed.

[0146] Alternatively, instead of molding the plastic layer 200 on the fixing surface 101 of the first structure 100 as described above, the plastic layer 200 is formed on a molding die (which may be referred to as a "molding die for the plastic layer") not shown. The plastic layer 200 is also arranged such that inserts 510 of individual terminals 500 and corresponding adhesive layers 700 (or alternatively, multiple inserts 510 of multiple terminals 500 and multiple corresponding adhesive layers 700) are formed in the plastic layer 200, and the second surface 202 of the plastic layer 200 is substantially flush with the exposed surfaces 701 of the corresponding adhesive layers or multiple corresponding adhesive layers 700. The first surface 201 of the plastic layer 200 is bonded to and / or engaged with the fixing surface 101 of the first structure 100 in a manner similar to that described above for the first structure 100, thereby securing it to the fixing surface 101. It should be noted that, apart from the conformal shape of the cavity and the plastic layer 200, the molding die for the plastic layer has the same structure as the first molding die 10'.

[0147] The insert portion 510 of a single terminal 500 (or alternatively, the insert portions 510 of multiple terminals 500) may be inserted into the plastic layer 200 without being embedded together with the corresponding adhesive layer or multiple corresponding adhesive layers 700. Alternatively, the Z′-direction side of the insert portion 510 of the terminal 500 (or alternatively, the Z′-direction side of the insert portions 510 of multiple terminals 500) may abut against the protrusion of the first mold of the first molding die 10′, or alternatively, against the protrusion of the first mold of the molding die for the plastic layer; and in this state, the insert portion 510 of the terminal 500 (or alternatively, multiple insert portions 510 of multiple terminals 500) may be inserted into the plastic layer 200 in the manner described above. In this case, a recess is formed on the second surface 202 of the plastic layer 200, in which the insert portion 510 of one or more terminals 500 is exposed. A corresponding adhesive layer or a corresponding adhesive layer 700 is applied to the embedded portion or a plurality of embedded portions 510 of one or more terminals 500 in the recess.

[0148] After fixing the plastic layer 200, conductive wiring 300 is prepared in any of the above aspects. An ultrasonic head U configured for ultrasonic vibration is operated to apply ultrasonic waves to the conductive wiring 300 and press the conductive wiring 300 against the plastic layer 200 using the ultrasonic head U, and the conductive wiring 300 is thus partially embedded in the plastic layer 200.

[0149] When the step of embedding the conductive wiring 300 is the step (1-1) described above, as described above, a portion of the conductive wiring 300 on the Z-direction side is sequentially embedded from its first end to its second end into the second surface 202 of the plastic layer 200 (see...). Figure 6A(Figure 4 from the top). During this process, the connection portion or each connection portion of the conductive wiring 300 is fed onto the embedding portion 510 of the corresponding terminal 500. At this time, the ultrasonic head U of the ultrasonic generator is operated to apply ultrasonic waves to the connection portion or each connection portion of the conductive wiring 300, and press the connection portion or each connection portion of the conductive wiring 300 against the corresponding adhesive layer 700 on the embedding portion 510 of the corresponding terminal 500. Therefore, the connection portion or each connection portion of the conductive wiring 300 is bonded to the corresponding adhesive layer 700 on the embedding portion 510 of the corresponding terminal 500.

[0150] When the step of embedding the conductive wiring 300 is as described in steps (1-2), when the conductive wiring 300 is arranged in a linear shape on the second surface 202 of the plastic layer 200, the connecting portion or each connecting portion of the conductive wiring 300 is provided on the embedding portion 510 of the corresponding terminal 500. Thereafter, as described above, a portion of the conductive wiring 300 on the Z-direction side is sequentially embedded in the second surface 202 of the plastic layer 200 (not shown) from its first end to its second end in the manner described above. During this process, the ultrasonic head U of the ultrasonic generator is operated to apply ultrasonic waves to the connecting portion or each connecting portion of the conductive wiring 300, and press the connecting portion or each connecting portion of the conductive wiring 300 against the corresponding adhesive layer 700 on the embedding portion 510 of the corresponding terminal 500. Therefore, the connecting portion or each connecting portion of the conductive wiring 300 is bonded to the corresponding adhesive layer 700 on the embedding portion 510 of the corresponding terminal 500.

[0151] When the step of embedding the conductive wiring 300 is as described in steps (1-3), when the conductive wiring 300 is arranged in a linear shape on the second surface 202 of the plastic layer 200, the connecting portion or each connecting portion of the conductive wiring 300 is provided on the embedding portion 510 of the corresponding terminal 500. Thereafter, the ultrasonic head U of the ultrasonic generator is operated to apply ultrasonic waves to the entire conductive wiring 300 and press the entire conductive wiring 300 against the second surface 202 of the plastic layer 200, such that the portion of the conductive wiring 300 on the Z-direction side (the embedding portion) is embedded into the second surface 202 of the plastic layer 200 at one time. At this time, the ultrasonic head U of the ultrasonic generator is operated to apply ultrasonic waves to the connecting portion or each connecting portion of the conductive wiring 300 and press the connecting portion or each connecting portion of the conductive wiring 300 against the corresponding adhesive layer 700 on the embedding portion 510 of the corresponding terminal 500. Therefore, the connecting portion or each connecting portion of the conductive wiring 300 is bonded to the corresponding adhesive layer 700 on the embedding portion 510 of the corresponding terminal 500.

[0152] When the step of embedding the conductive wiring 300 is the aforementioned step (2-1), as described above, a portion of one of the wiring portions of the conductive wiring 300 is embedded sequentially from its first end to its second end into the second surface 202 of the plastic layer 200. This step is performed on all wiring portions. Before and after the step of embedding all wiring portions, as described above, a portion of the connecting portion is embedded sequentially from its first end to its second end into the second surface 202 of the plastic layer 200. During the steps of embedding the wiring portion or embedding the connecting portion, the ultrasonic head U of the ultrasonic generator is operated to apply ultrasonic waves to the connecting portion of the conductive wiring 300 or the connecting portion or each connecting portion of the wiring portion, and the connecting portion or each connecting portion is pressed against the corresponding adhesive layer 700 on the embedding portion 510 of the corresponding terminal 500. Therefore, the connecting portion or each connecting portion of the conductive wiring 300 is bonded to the corresponding adhesive layer 700 on the embedding portion 510 of the corresponding terminal 500.

[0153] In the case where the step of embedding the conductive wiring 300 is the aforementioned step (2-2), after arranging the plurality of wiring portions and connecting portions of the conductive wiring 300 on the second surface 202 of the plastic layer 200 as described above, as described above, a portion of one of the wiring portions of the conductive wiring 300, on the Z-direction side, is sequentially embedded into the second surface 202 of the plastic layer 200 from its first end to its second end. This step is performed on all wiring portions. Before and after the step of embedding all wiring portions, as described above, a portion of the connecting portion, on the Z-direction side, is sequentially embedded into the second surface 202 of the plastic layer 200 from its first end to its second end. During the step of embedding the wiring portion or the step of embedding the connecting portion, the ultrasonic head U of the ultrasonic generator is operated to apply ultrasonic waves to the connecting portion of the conductive wiring 300 or the connecting portion of the wiring portion or each connecting portion, and the connecting portion or each connecting portion is pressed against the corresponding adhesive layer 700 on the embedding portion 510 of the corresponding terminal 500. Therefore, the connection portion or each connection portion of the conductive wiring 300 is bonded to the corresponding adhesive layer 700 on the embedding portion 510 of the corresponding terminal 500.

[0154] When the step of embedding the conductive wiring 300 is as described in (2-3), a plurality of wiring portions and connecting portions of the conductive wiring 300 are disposed on the second surface 202 of the plastic layer 200. Thereafter, the ultrasonic head U of the ultrasonic generator is operated to apply ultrasonic waves to the entire conductive wiring 300, pressing the entire conductive wiring 300 against the second surface 202 of the plastic layer 200, such that the Z-direction portion of the conductive wiring 300 is embedded into the second surface 202 of the plastic layer 200 at one time. At this time, the ultrasonic head U of the ultrasonic generator is operated to press the connecting portion or the connecting portion of the wiring portion, or each connecting portion, of the conductive wiring 300 against the corresponding adhesive layer 700 on the embedding portion 510 of the corresponding terminal 500. Therefore, the connecting portion or each connecting portion of the conductive wiring 300 is bonded to the corresponding adhesive layer 700 on the embedding portion 510 of the corresponding terminal 500.

[0155] Therefore, the embedded portion of the conductive wiring 300 on the Z-direction side is embedded in the second surface 202 of the plastic layer 200, and the protrusion of the conductive wiring 300 on the Z′-direction side protrudes from the second surface 202 of the plastic layer 200 in the Z′ direction, and the connecting portion or each connecting portion of the conductive wiring 300 is held to the corresponding adhesive layer 700 on the embedded portion 510 of the corresponding terminal 500.

[0156] After the step of embedding the conductive wiring 300, the connection portion or each connection portion of the conductive wiring 300 is mechanically and electrically connected to the embedding portion 510 of the corresponding terminal 500 by hot forging, welding (e.g., laser welding, arc welding, resistance welding, ultrasonic welding, etc.) or soldering. In the case where the conductive wiring 300 includes a fusion layer 320 but not an insulating layer 330, the connection portion or each connection portion of the conductive wiring 300 is heated and pressed onto the embedding portion 510 of the corresponding terminal 500 using the forging head C of a hot forging machine. The heat melts a portion of the fusion layer 320 covering the connection portion or each connection portion of the conductive wiring 300 and melts the corresponding adhesive layer 700, exposing the connection portion or each connection portion from the fusion layer 320. The embedding portion 510 of the corresponding terminal 500 is then exposed from the corresponding adhesive layer 700. The connection portion or each connection portion is electrically and mechanically connected to the embedded portion 510 of the corresponding terminal 500; or alternatively, the heat generated by soldering or tin soldering melts a portion of the connection portion or each connection portion covering the conductive wiring 300 of the fusion layer 320 and melts the corresponding adhesive layer 700, exposing the connection portion or each connection portion from the fusion layer 320, the embedded portion 510 of the corresponding terminal 500 emerges from the corresponding adhesive layer 700, and the connection portion or each connection portion is electrically and mechanically connected to the embedded portion 510 of the corresponding terminal 500. When the conductive wiring 300 includes an insulating layer 330 and a fusion layer 320, using the forging head C of a hot forging machine, the connection portion or each connection portion of the conductive wiring 300 is heated and pressed onto the embedding portion 510 of the corresponding terminal 500. The heat melts a portion of the fusion layer 320 and a portion of the insulating layer 330 covering the connection portion or each connection portion of the conductive wiring 300, and melts the corresponding adhesive layer 700. The connection portion or each connection portion is exposed to the insulating layer 330 and the fusion layer 320, and the embedding portion 510 of the corresponding terminal 500 is exposed from the corresponding adhesive layer 700, and the connection... Each or every connection portion is electrically and mechanically connected to the embedded portion 510 of the corresponding terminal 500; or alternatively, the heat generated by soldering or tin soldering melts a portion of the fusion layer 320 covering the conductive wiring 300 and a portion of the insulating layer 330, and melts the corresponding adhesive layer 700, exposing the connection portion or every connection portion from the insulating layer 330 and the fusion layer 320, exposing the embedded portion 510 of the corresponding terminal 500 from the corresponding adhesive layer 700, and the connection portion or every connection portion is electrically and mechanically connected to the embedded portion 510 of the corresponding terminal 500.In the case where the conductive wiring 300 does not include either the insulating layer 330 or the fusion layer 320, the forging head C of the hot forging machine heats and presses the connection portion or each connection portion of the conductive wiring 300 onto the embedding portion 510 of the corresponding terminal 500. The heat melts the corresponding adhesive layer 700, exposing the embedding portion 510 of the corresponding terminal 500 from the corresponding adhesive layer 700, and the connection portion or each connection portion is electrically and mechanically connected to the embedding portion 510 of the corresponding terminal 500; or alternatively, the heat generated by welding or soldering melts the corresponding adhesive layer 700, exposing the embedding portion 510 of the corresponding terminal 500 from the corresponding adhesive layer 700, and the connection portion or each connection portion is electrically and mechanically connected to the embedding portion 510 of the corresponding terminal 500. When the plastic layer 200 is fixed to the fixing surface 101 of the first structure 100 by bonding and / or joining, after the step of connecting the conductive wiring 300, the plastic layer 200 can be fixed to the fixing surface 101 of the first structure 100 by bonding and / or joining.

[0157] After the step of connecting the conductive wiring 300, a second structure 400 is prepared. The second structure 400 is fixed to the second surface 202 of the plastic layer 200 by bonding and / or joining to cover the protrusions of the conductive wiring 300. At this time, the second portion of the outer connection portion 520 of a single terminal 500 (or alternatively, the second portions of the outer connection portions 520 of multiple terminals 500) is inserted into the through hole 410 of the second structure 400. A gap is created between the first surface of the second structure 400 and the second surface 202 of the plastic layer 200.

[0158] Subsequently, the first mold 20a' and the second mold 20b of the second molding die 20' are opened, and the first structure 100, the plastic layer 200, the conductive wiring 300, one or more terminals 500, the corresponding adhesive layer or more corresponding adhesive layers 700, and the second structure 400 are placed on the second mold 20b. Then, the first mold 20a and the second mold 20b are closed together. At this time, the first structure 100, plastic layer 200, conductive wiring 300, embedded portion 510 of terminal 500 (or alternatively, multiple embedded portions 510 of multiple terminals 500), first portion of external connection portion 520 of terminal 500 (or alternatively, multiple first portions of multiple external connection portions 520 of multiple terminals 500), corresponding adhesive layer or multiple corresponding adhesive layers 700, and second structure 400 are disposed in the cavity 21 of the second molding die 20; the second portion of external connection portion 520 of terminal 500 (or alternatively, multiple second portions of multiple external connection portions 520 of multiple terminals 500) is accommodated in the receiving hole 23 of the first mold 20a′ (see Figure 6B(First figure starting from the top); and the protrusion 22 is fitted into the through hole 410 of the second structure 400. Thereafter, molten plastic is injected through the gate (not shown) of the second molding die 20' to fill the gap in the cavity 21 of the second molding die 20' located between the first surface of the second structure 400 and the second surface 202 of the plastic layer 200 (see...). Figure 6B (See the second figure starting from the top). At this time, the protrusions of the conductive wiring 300 and the first portions of the external connection portions 520 of the terminals 500 (or alternatively, the first portions of the multiple external connection portions 520 of the multiple terminals 500) are inserted into the molten plastic; and the exposed surfaces 701 of the corresponding adhesive layers 700 (or alternatively, the multiple exposed surfaces 701 of the multiple corresponding adhesive layers 700) are covered by the molten plastic. The molten plastic is cooled or otherwise solidified. Thus, a filler layer I is formed between the first surface of the second structure 400 and the second surface 202 of the plastic layer 200; the protrusions of the conductive wiring 300 and the first portions of the external connection portions 520 of the terminals 500 (or alternatively, the multiple first portions of the multiple external connection portions 520 of the multiple terminals 500) are embedded (insert-molded) in the filler layer I; the second plastic portion is formed inside the gate of the second molding die 20'. Subsequently, the first mold 20a and the second mold 20b are opened, and the first structure 100, plastic layer 200, conductive wiring 300, one or more terminals 500, corresponding adhesive layer or multiple corresponding adhesive layers 700, second structure 400, and filler layer I (see [reference]) are removed. Figure 6B (The third figure from the top) and remove the second plastic portion. At this time, the protrusion 22 extends from the through hole 410 of the second structure 400, causing the outer connection portion 520 of the terminal 500 (or alternatively, multiple outer connection portions 520 of multiple terminals 500) to extend through or be located in the through hole 410. It should be noted that the protrusion 22 may be omitted. When the protrusion 22 is omitted, the second structure 400 may be provided with a single through hole 410 or multiple through holes 410. Except for the distal end, the through hole or each through hole 410 may have a shape substantially the same as the outer shape of the second portion of the outer connection portion 520 of the corresponding terminal 500.

[0159] With the main body 600 separated from the second structure 400, the main body 600 is manufactured. The main body 600 is fixed to the second structure 400, and the distal end of the external connection portion 520 of a single terminal 500 (or alternatively, the distal ends of multiple external connection portions 520 of multiple terminals 500) is inserted into the through hole 610 of the main body 600. With the main body 600 and the second structure 400 integrated, the second structure 400 having the main body 600 is manufactured.

[0160] By omitting the second structure 400 and the filling layer I, the steps of fixing the second structure 400 to the second surface 202 of the plastic layer 200 and the steps of shaping the filling layer I are omitted.

[0161] When the filler layer I is omitted and a second structure 400 is provided, the first structure 100, plastic layer 200, conductive wiring 300, one or more terminals 500, and corresponding adhesive layers or more corresponding adhesive layers 700 may be arranged in a cavity of a molding die (not shown). Molten plastic is injected into the cavity and then cured to form the second structure 400 on the second surface 202 of the plastic layer 200. The protrusions of the conductive wiring 300 and the first portions of the external connection portions 520 of the terminals 500 are inserted into the second structure 400 (or alternatively, multiple first portions of multiple external connection portions 520 of multiple terminals 500). When the body 600 is integral with the second structure 400, the body 600 may be formed simultaneously with the second structure 400. Alternatively, the second structure 400 may be fixed to the second surface 202 of the plastic layer 200 by bonding or joining.

[0162] The three-dimensional structure S3 is manufactured using one of the methods described above. This three-dimensional structure S3 and its manufacturing method provide technical features and effects similar to those of the three-dimensional structure S1 and its manufacturing method. Furthermore, when the conductive wire 300 is embedded in the second surface 202 of the plastic layer 200 using the ultrasonic head U of an ultrasonic generator, the ultrasonic head U of the ultrasonic generator presses the connecting portion or each connecting portion of the conductive wire 300 against the corresponding adhesive layer 700 on the embedding portion 510 of the corresponding terminal 500, thereby maintaining the connecting portion or each connecting portion of the conductive wire 300 bonded to the corresponding adhesive layer 700 on the embedding portion 510 of the corresponding terminal 500. This facilitates mechanical and electrical connection between the connecting portion or each connecting portion of the conductive wire 300 and the corresponding terminal 500 via hot forging, welding, or soldering. Furthermore, it can prevent a portion near the connecting portion or each connecting portion of the conductive wire 300 from separating from the embedding portion 510 of the corresponding terminal 500. Furthermore, since at least one terminal 500 is externally connectable, it is easier to externally connect the three-dimensional structure S1 compared to the case where external connection is made via at least one connection portion of the conductive wiring 300. When the three-dimensional structure S3 includes a connector, it is even easier to connect the three-dimensional structure S3 to the external device by connecting the body 600 of the three-dimensional structure S3 to the mating connector of the external device.

[0163] The three-dimensional structure and the method for manufacturing the three-dimensional structure of the present invention are not limited to the embodiments described above, but can be appropriately modified within the scope of the claims. Some examples of modifications are described below.

[0164] A three-dimensional structure can be positioned in front of a millimeter-wave radar device in the direction of millimeter-wave transmission (e.g., the Z-direction). In this case, the first structure 100 and the plastic layer 200 of the aforementioned three-dimensional structure can be made of a material exhibiting low attenuation for millimeter waves transmitted through the first structure 100 and the plastic layer 200. Millimeter waves are those radiated by the millimeter-wave radar device and those subsequently reflected by the radiating target. If the aforementioned three-dimensional structure includes a second structure 400, the second structure 400 can also be made of a material exhibiting low attenuation for millimeter waves transmitted through it. The conductive wiring 300 of the aforementioned three-dimensional structure can be, but is not limited to, arranged at intervals that almost completely prevent the millimeter waves transmitted therethrough from being interrupted.

[0165] The connection portion or each connection portion of the conductive wiring 300 in any of the above aspects can be connected to any part of the corresponding terminal 500. For example, the connection portion or each connection portion of the conductive wiring 300 in any of the above aspects can contact and be electrically connected to a portion of the corresponding terminal 500 other than the embedded portion 510.

[0166] Without either the second structure 400 or the filler layer I, the main body 600 can be fixed to or integrally formed with the second surface 202 of the plastic layer 200. In this case, the external connection portion 520 of a single terminal 500 (or alternatively, multiple external connection portions 520 of multiple terminals 500) is provided in the through hole 610 of the main body 600.

Claims

1. A method for manufacturing a three-dimensional structure, the method comprising the following steps: Prepare a first structure including a fixed surface; A plastic layer is fixed to the fixing surface of the first structure, the plastic layer including a first surface in contact with the fixing surface of the first structure and a second surface opposite to the first surface; Fabrication of conductive wiring; The ultrasonic head is operated to apply ultrasonic waves to the conductive wire and press the conductive wire against the plastic layer, thereby partially embedding the conductive wire into the plastic layer; as well as Connect the terminal electrically to the conductive wiring; The step of fixing the plastic layer includes the following steps: placing the first structure in the cavity of the first molding mold; injecting molten plastic into the fixing surface of the first structure within the cavity of the first molding mold; and solidifying the molten plastic to form the plastic layer on the fixing surface of the first structure. The steps for forming the plastic layer include the following: At least a portion of the embedded part of the terminal is placed in the cavity of the first molding mold, and the outer connecting part of the terminal is inserted into a receiving hole communicating with the cavity of the first molding mold, and an adhesive layer is disposed on the embedded part of the terminal; Insert at least a portion of the embedded portion of the terminal into the molten plastic already injected into the cavity of the first molding die; and The molten plastic is solidified to form at least a portion of the insert of the terminal's embedding portion within the plastic layer. The step of inserting the embedded portion of the terminal includes: molding the embedded portion of the terminal into the plastic layer such that the exposed surface of the adhesive layer is flush with the second surface of the plastic layer. The step of embedding the conductive wiring includes the following steps: The ultrasonic head is operated to apply ultrasonic waves to the conductive wiring and press the conductive wiring against the second surface of the plastic layer, thereby partially embedding the conductive wiring into the second surface of the plastic layer; and The ultrasonic head is operated to apply ultrasonic waves to the conductive wiring, causing the conductive wiring to partially contact the exposed surface of the adhesive layer. The step of electrically connecting the terminal to the conductive wiring includes: melting the adhesive layer by hot forging or welding and partially exposing the embedded portion of the terminal from the adhesive layer to connect the conductive wiring to the embedded portion of the terminal.

2. The method according to claim 1, wherein, The conductive wiring includes a wiring body and a fusion layer covering the wiring body, and The step of electrically connecting the terminal to the conductive wiring includes: partially melting the fusion layer by hot forging or welding and partially exposing the wiring body from the fusion layer to connect the conductive wiring to the embedded portion of the terminal.

3. The method according to claim 2, wherein, The conductive wiring further includes an insulating layer located between the wiring body and the fusion layer, and The step of electrically connecting the terminal to the conductive wiring includes: partially melting the insulating layer and the fusion layer by hot forging or welding, and partially exposing the wiring body from the insulating layer and the fusion layer to connect the conductive wiring to the embedded portion of the terminal.

4. The method according to any one of claims 1 to 3, wherein, The welding includes soldering.

5. The method according to any one of claims 1 to 3, wherein, The fixing surface of the first structure is provided with at least one protrusion and at least one recess. The plastic layer includes a first surface that contacts the fixed surface of the first structure and a second surface that is opposite to the first surface. The second side of the plastic layer is a smooth surface, and The step of embedding the conductive wiring includes: operating the ultrasonic head to apply ultrasonic waves to the conductive wiring and pressing the conductive wiring against the second surface of the plastic layer, thereby partially embedding the conductive wiring into the second surface of the plastic layer.

6. The method according to any one of claims 1 to 3, further comprising the following step: After embedding the conductive wiring, the second structure is fixed to the plastic layer, and the conductive wiring that partially protrudes from the plastic layer is covered by the second structure.

7. The method according to claim 6, further comprising the following step: The first structure, the plastic layer, the conductive wiring, and the second structure are placed in the cavity of the second molding mold; Molten plastic is injected into the cavity of the second molding mold between the plastic layer and the second structure; The portion of the conductive wiring protruding from the plastic layer is inserted into the molten plastic that has been injected into the cavity of the second molding die; The molten plastic in the cavity of the second molding die is solidified to form a filler layer between the plastic layer and the second structure; as well as The portion of the conductive wiring that protrudes from the plastic layer is embedded in the filler layer.

8. A three-dimensional structure manufactured by the method according to claim 1, the three-dimensional structure comprising: A first structure, the first structure including a fixed surface; A plastic layer is formed on and fixed to the fixed surface of the first structure, the plastic layer including a first surface in contact with the fixed surface of the first structure and a second surface opposite to the first surface; Conductive wiring, which is partially embedded in the plastic layer; A terminal electrically connected to the conductive wiring, the terminal comprising: an insert portion, at least a portion of which is embedded in the plastic layer; and An external connecting portion is disposed on the outside of the plastic layer. The adhesive layer is disposed on the embedded portion of the terminal, and the embedded portion of the terminal is embedded in the plastic layer, such that the exposed surface of the adhesive layer is flush with the second surface of the plastic layer. The conductive wiring is bonded to the adhesive layer and connected to the embedded portion of the terminal.

9. The three-dimensional structure according to claim 8, wherein, The conductive wiring includes a wiring body and a fusion layer covering the wiring body, and The wiring is partially exposed from the fusion layer and connected to the embedded portion of the terminal.

10. The three-dimensional structure according to claim 9, wherein, The conductive wiring further includes an insulating layer inserted between the wiring body and the fusion layer, and The wiring portion is partially exposed from the insulating layer and the fusion layer and connected to the embedded portion of the terminal.

11. The three-dimensional structure according to any one of claims 8 to 10, wherein, The fixing surface of the first structure is provided with at least one protrusion and at least one recess. The plastic layer includes a first surface that contacts the fixed surface of the first structure and a second surface that is opposite to the first surface. The second side of the plastic layer is a smooth surface, and The conductive wiring is partially embedded in the second surface of the plastic layer.

12. The three-dimensional structure according to any one of claims 8 to 10, further comprising a second structure fixed to the plastic layer and covering the conductive wiring that partially protrudes from the plastic layer.

13. The three-dimensional structure according to claim 12, further comprising a filling layer filling the space between the plastic layer and the second structure. in, The conductive wiring, which partially protrudes from the plastic layer, is embedded in the filler layer.

14. The three-dimensional structure according to any one of claims 8 to 10, wherein, The three-dimensional structure is a vehicle component, and The first structure is a decorative element and / or cover of the vehicle component.

15. The three-dimensional structure according to claim 14, wherein, The three-dimensional structure is positioned in front of the millimeter-wave radar device in the direction of millimeter-wave transmission.

16. The three-dimensional structure according to any one of claims 8 to 10, wherein, The conductive wiring is configured to be energized and thereby generate heat.

Images