Middle frame and display screen bonding method and device, bonding system, and storage medium

Abstract

The present disclosure relates to a method and device for bonding a middle frame and a display screen, a bonding system, and a storage medium. The method includes: obtaining a middle frame to be bonded and obtaining a display screen to be bonded; when the middle frame and the display screen are aligned, bonding the display screen to the middle frame to obtain a combination including the middle frame and the display screen; and performing a pressure-maintaining treatment on the combination to obtain a target product after bonding the middle frame and the display screen. In this way, in this embodiment, the middle frame to be bonded can be obtained by performing a plasma treatment and a glue dispensing treatment on the middle frame, and combined with the obtained display screen to be bonded, the middle frame and the display screen can be automatically bonded, thereby improving the bonding efficiency.

Description

Technical Field

[0001] The present disclosure relates to the field of control technology, and in particular to a method and device for laminating a middle frame and a display screen, a laminating system, and a storage medium. Background Art

[0002] At present, the middle frame and display screen of electronic devices are mostly manually or semi-automatically assembled. Manual assembly and assembly have two obvious disadvantages: low production efficiency and low product yield. Summary of the invention

[0003] The present invention provides a method and device for laminating a middle frame and a display screen, a laminating system, and a storage medium to solve the deficiencies of the related art.

[0004] According to a first aspect of an embodiment of the present disclosure, a method for laminating a middle frame and a display screen is provided, comprising:

[0005] Obtaining a middle frame to be bonded and obtaining a display screen to be bonded;

[0006] When the middle frame and the display screen are aligned, the display screen is attached to the middle frame to obtain a combination including the middle frame and the display screen;

[0007] The assembly is subjected to a pressure-maintaining treatment to obtain a target product after the middle frame and the display screen are bonded together.

[0008] Optionally, obtaining a middle frame to be bonded includes:

[0009] Load the middle frames into the middle frame carrier one by one;

[0010] Determining a bonding position between the middle frame and the display screen, and performing plasma treatment on the bonding position;

[0011] Performing glue dispensing at the bonding position;

[0012] The glue line of the middle frame after the glue dispensing process is detected and the middle frame with poor glue dispensing is removed to obtain the middle frame to be bonded.

[0013] Optionally, each middle frame carrier can be loaded with at least one middle frame; each middle frame carrier corresponds to at least one bonding device, and each bonding device can bond one middle frame and one display screen at a time.

[0014] Optionally, the assembly is subjected to a pressure-maintaining treatment, comprising:

[0015] Applying a preset pressure to the assembly so that the double-sided adhesive tape adheres the middle frame and the display screen;

[0016] The assembly is placed in a pressure-maintaining fixture, wherein the pressure-maintaining fixture is used to apply a constant pressure to the assembly and keep it relatively fixed;

[0017] The pressure-holding fixture containing the assembly is placed in a pressure-holding fixture static chamber and left to stand for a set period of time.

[0018] Optionally, after attaching the display screen to the middle frame, the method further includes:

[0019] The assemblies are sampled and tested through the docking station, and defective assemblies are eliminated.

[0020] Optionally, obtaining a display screen to be bonded includes:

[0021] Plasma treatment is performed on the lamination position on the back of the display screen;

[0022] The processed display screen is loaded into a display screen storage device to obtain a display screen to be bonded.

[0023] Optionally, before plasma treatment is performed on the lamination position on the back of the display screen, the method includes:

[0024] Disposing auxiliary materials on the back of the display screen;

[0025] A protective liquid is sprayed on the back of the display screen.

[0026] Optionally, before providing auxiliary materials on the back of the display screen, the method includes:

[0027] Loading a display screen into a display screen carrier; the display screen faces upward in the display screen carrier;

[0028] Attach protective films to the display screens in the display screen carrier one by one;

[0029] The display screen with the protective film attached is turned over 180 degrees so that the back side of the display screen faces upward.

[0030] Optionally, after the bonding position on the back of the display screen is subjected to plasma treatment, the method further comprises:

[0031] Flip the display 180 degrees and remove the protective film from the front of the display.

[0032] According to a second aspect of an embodiment of the present disclosure, a middle frame and display screen bonding device is provided, comprising:

[0033] A middle frame acquisition module, used to acquire the middle frame to be attached;

[0034] A display screen acquisition module, used to acquire the display screen to be bonded;

[0035] A combination acquisition module, used for attaching the display screen to the middle frame when the middle frame and the display screen are aligned, so as to obtain a combination including the middle frame and the display screen;

[0036] The target product acquisition module is used to perform a pressure-maintaining treatment on the assembly to obtain a target product after the middle frame and the display screen are bonded together.

[0037] Optionally, the middle frame acquisition module includes:

[0038] A middle frame loading unit, used to load the middle frames into the middle frame carrier in sequence;

[0039] A position processing unit, used to determine the bonding position between the middle frame and the display screen, and perform plasma processing on the bonding position;

[0040] A glue dispensing processing unit, used for performing glue dispensing processing at the bonding position;

[0041] The middle frame detection unit is used to detect the glue line of the middle frame after the glue dispensing process and remove the middle frame with poor glue dispensing to obtain the middle frame to be bonded.

[0042] Optionally, each middle frame carrier can be loaded with at least one middle frame; each middle frame carrier corresponds to at least one bonding device, and each bonding device can bond one middle frame and one display screen at a time.

[0043] Optionally, the target product acquisition module includes:

[0044] An assembly pressure unit, used to apply a preset pressure to the assembly so that the double-sided adhesive tape adheres the middle frame and the display screen;

[0045] The assembly is loaded into a unit, which is used to load the assembly into a pressure-maintaining fixture, and the pressure-maintaining fixture is used to apply a constant pressure to the assembly and keep it relatively fixed;

[0046] The assembly static unit is used to place the pressure-holding fixture equipped with the assembly into the pressure-holding fixture static chamber and let it stand for a set period of time.

[0047] Optionally, the device further comprises:

[0048] The assembly sampling module is used to perform sampling inspection on assemblies through the docking station and eliminate defective assemblies.

[0049] Optionally, the display screen acquisition module includes:

[0050] A middle frame and display screen bonding unit, used for plasma processing the bonding position on the back of the display screen;

[0051] The display screen loading unit is used to load the processed display screen into the display screen storage device to obtain the display screen to be bonded.

[0052] Optionally, the display screen acquisition module further includes:

[0053] An auxiliary material setting unit, used for setting auxiliary materials on the back of the display screen;

[0054] The protection liquid spraying unit is used for spraying the protection liquid on the back of the display screen.

[0055] Optionally, the display screen acquisition module further includes:

[0056] A display screen loading unit, used for loading the display screen into the display screen carrier; the display screen faces upward in the display screen carrier;

[0057] A protective film attaching unit, used to attach protective films to the display screens in the display screen carrier in sequence;

[0058] The display screen flipping unit is used to flip the display screen with the protective film attached thereto by 180 degrees so that the back of the display screen faces upward.

[0059] Optionally, the display screen acquisition module further includes:

[0060] The protective film removal unit is used to flip the display screen 180 degrees and remove the protective film on the front side of the display screen.

[0061] According to a third aspect of an embodiment of the present disclosure, there is provided a bonding system, comprising:

[0062] processor;

[0063] a memory for storing a computer program executable by the processor;

[0064] The processor is configured to execute the computer program in the memory to implement the above method.

[0065] According to a fourth aspect of an embodiment of the present disclosure, a computer-readable storage medium is provided, and when an executable computer program in the storage medium is executed by a processor, the above method can be implemented.

[0066] The technical solution provided by the embodiments of the present disclosure may have the following beneficial effects:

[0067] As can be seen from the above embodiments, the disclosed embodiments can obtain the middle frame to be bonded and the display screen to be bonded; when the middle frame and the display screen are aligned, the display screen is bonded to the middle frame to obtain a combination including the middle frame and the display screen; the combination is subjected to pressure holding treatment to obtain the target product after the middle frame and the display screen are bonded. In this way, in this embodiment, the middle frame to be bonded can be obtained by plasma treatment and glue dispensing treatment on the middle frame, and combined with the obtained display screen to be bonded, the middle frame and the display screen can be automatically bonded, thereby improving the bonding efficiency.

[0068] It is to be understood that the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the present disclosure. BRIEF DESCRIPTION OF THE DRAWINGS

[0069] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present disclosure and, together with the description, serve to explain the principles of the present disclosure.

[0070] Figure 1 The present invention is a flow chart showing a method for bonding a middle frame and a display screen according to an exemplary embodiment.

[0071] Figure 2 The present invention is a flow chart showing the bonding of a display screen and a middle frame according to an exemplary embodiment.

[0072] Figure 3 The figure is a block diagram of a device for laminating a middle frame and a display screen according to an exemplary embodiment. DETAILED DESCRIPTION

[0073] Exemplary embodiments will be described in detail herein, examples of which are shown in the accompanying drawings. When the following description refers to the drawings, the same numbers in different drawings represent the same or similar elements unless otherwise indicated. The embodiments described below by way of example do not represent all embodiments consistent with the present disclosure. Instead, they are merely examples of devices consistent with some aspects of the present disclosure as detailed in the appended claims.

[0074] In order to solve the above technical problems, the embodiments of the present disclosure provide a method for bonding a middle frame and a display screen, which can be applied to a bonding system for bonding a middle frame and a display screen of an electronic device, and the electronic device can include a smart phone, etc. Figure 1 The present invention is a flow chart showing a method for bonding a middle frame and a display screen according to an exemplary embodiment.

[0075] See also Figure 1 A method for bonding a middle frame and a display screen includes steps 11 to 13:

[0076] In step 11, a middle frame to be bonded and a display screen to be bonded are obtained.

[0077] In this embodiment, the bonding system obtains the middle frame to be bonded, including:

[0078] The bonding system may include a middle frame carrier circulating feeding elevator and a middle frame loader. The middle frame carrier circulating feeding elevator can move the middle frame carrier at a set speed. The middle frame loader can load the middle frame into the middle frame carrier in sequence. In this embodiment, one or more middle frames can be loaded in the middle frame carrier. In one example, two middle frames are loaded in the middle frame carrier, thereby improving the bonding efficiency.

[0079] The bonding system may include a middle frame plasma processor, which can determine the bonding position between the middle frame and the display screen and perform plasma treatment on the bonding position.

[0080] For example, the image sensor in the middle frame plasma processor can capture the image of the middle frame, so that the middle frame plasma processor can determine the bonding position in the image based on the pre-stored bonding position of the middle frame. Then, the middle frame plasma processor can determine the bonding position of the middle frame based on the positional relationship between the image sensor and the middle frame carrier. After determining the bonding position, the middle frame plasma processor can perform plasma treatment on the bonding position, so that the surface at the bonding position of the middle frame can be activated and the surface tension can be increased, which is beneficial to improve the bonding effect of the colloid and the middle frame during subsequent bonding.

[0081] For another example, after the middle frame carrier reaches the preset position, since the relative position between the preset position and the middle frame plasma processor is fixed, the bonding position can also be directly determined. In this way, the middle frame plasma processor can perform plasma treatment on the middle frame, thereby activating the surface of the middle frame at the bonding position and increasing the surface tension, which is beneficial to improving the bonding effect of the colloid and the middle frame during subsequent bonding.

[0082] It is understandable that when the middle frame plasma processor includes an image sensor, the accuracy of the bonding position determined by it is high. At this time, a smaller bonding area (such as a diameter or width and length not exceeding 1mm) can be determined, or the same or slightly larger than the area occupied by subsequent glue dispensing can be determined; when the middle frame plasma processor does not include an image sensor, the accuracy of the bonding position determined by it is slightly lower. At this time, a larger bonding area (such as a diameter or width and length not exceeding 2mm) can be determined, or larger than the area occupied by subsequent glue dispensing can be determined. Technicians can select appropriate plasma processing solutions according to specific scenarios, and the corresponding solutions fall within the scope of protection of this disclosure.

[0083] The bonding system may include a middle frame glue dispenser, which often dispenses glue at the bonding position provided by the middle frame plasma processor. Alternatively, the image sensor in the middle frame glue dispenser can capture an image of the middle frame, so that the middle frame glue dispenser can determine the bonding position in the image based on the pre-stored bonding position of the middle frame. Then, the middle frame glue dispenser can determine the bonding position of the middle frame based on the positional relationship between the image sensor and the middle frame carrier, and apply the colloid to the bonding position.

[0084] The bonding system may include a middle frame glue line detection machine, in which the image sensor can capture the image of the middle frame and determine the position of the colloid in the image; and determine whether the colloid is abnormal based on the position of the colloid. When the colloid is abnormal, the state of the middle frame is defective and the defective product is rejected. When the colloid is normal, the state of the middle frame is good and can continue to move, that is, to obtain the middle frame to be bonded.

[0085] In this embodiment, the bonding system obtains the middle frame to be bonded, including:

[0086] The bonding system may include a display screen plasma processor, and an image sensor may be provided in the display screen plasma processor. The image sensor may acquire an image of the back of the display screen. The bonding positions corresponding to the bonding points on the display screen may be pre-stored in the plasma processor, and then the plasma processor may determine the bonding positions in the above image according to the bonding positions on the display screen; thereafter, the plasma processor may determine the bonding positions on the back of the display screen according to the positional relationship between the image sensor and the display screen carrier.

[0087] The display screen plasma processor can perform plasma treatment on the bonding position on the display screen, thereby activating the surface at the bonding position on the back of the display screen and increasing the surface tension, which is beneficial to improving the bonding effect between the colloid and the back during subsequent bonding.

[0088] The bonding system can load the display screen after plasma treatment into a display screen storage device (such as an automatic guided vehicle, AGV), and place the display screen in a set placement order to obtain the display screen to be bonded.

[0089] Considering that the glass on the front of the display screen may be scratched during the above process, in one example, the bonding system can load the display screen onto a display screen carrier, the number of which can be one or more, and make the front of the display screen face upward. Then, the bonding system can sequentially attach protective films to the display screens in the display screen carrier to protect the display screen glass from being scratched.

[0090] Considering other processes after the display screen and the middle frame are bonded, in this embodiment, after the display screen is bonded with the protective film, the display screen in the display screen carrier can be flipped 180 degrees, so that the display screen is facing up from the front to the back, so as to facilitate the auxiliary material machine in the bonding system to attach various auxiliary materials to the back of the display screen, where the auxiliary materials may include but are not limited to double-sided tape, conductive cloth, labels and Mylar. For example, double-sided tape can be used to fix the display screen and the middle frame, conductive cloth can be used to shield electromagnetic interference, Mylar can be used to insulate the display screen, and labels can be used to indicate each module in the display screen or other functions. Appropriate auxiliary materials can be selected according to specific scenarios, and are not limited here.

[0091] Then, after attaching the auxiliary materials, the laminating system can spray a protective liquid, such as a fluorinated liquid, on the back of the display screen to clean impurities on the back of the display screen, and the protective liquid has a flame retardant effect. After spraying the protective liquid, the display screen plasma processor in the laminating system can perform plasma treatment on the display screen. After the plasma treatment is completed, the laminating system can also flip the display screen 180 degrees so that the front of the display screen faces upwards, and remove the protective film on the front of the display screen.

[0092] In step 12, when the middle frame and the display screen are aligned, the display screen is attached to the middle frame to obtain a combination including the middle frame and the display screen.

[0093] In this embodiment, the laminating system may include a laminating device, which may obtain the middle frame to be laminated from the middle frame carrier and the display screen to be laminated from the automatic guided vehicle. Then, the laminating device may align the middle frame and the display screen, that is, correspond the laminating positions of the middle frame and the display screen one by one; when it is determined that the middle frame and the display screen are aligned, the laminating device may laminate the display screen onto the middle frame, and a combination including the middle frame and the display screen may be obtained.

[0094] In this embodiment, the bonding system may also include a docking station, and each assembly output by the bonding device may pass through the docking station. In addition, the bonding system may also obtain the assembly through the docking station for testing, that is, the assembly may be sampled and tested through the docking station, for example, whether the middle frame and the display screen are aligned, whether there is colloid overflow at the bonding position, etc. When the test results are all qualified, the bonding system may determine that the test result of this assembly is a good product, and the subsequent steps may be carried out; when at least one of the test results is unqualified, the bonding system may determine that the test result of this assembly is a defective product, and the defective assembly may be discarded.

[0095] In step 13, the assembly is subjected to a pressure-maintaining treatment to obtain a target product after the middle frame and the display screen are bonded together.

[0096] In this embodiment, the bonding system may include a display screen cold press, which can apply a preset pressure (adjustable) to the assembly. The preset pressure can enable the double-sided adhesive on the display screen to better bond the middle frame and the display screen; and it also helps the bonding of the colloid at the bonding position.

[0097] In this embodiment, the bonding system may include a pressure-holding jig. After applying a preset pressure, the assembly can be loaded into the pressure-holding jig, and the pressure-holding jig maintains the preset pressure to prevent the middle frame and the display from separating. Then, the bonding system can place the pressure-holding jig into a pressure-holding jig static bin for static standing for a set time. The set time can be 1 to 5 hours. In one example, the set time can be 2 hours. After standing for a set time, the target product of the bonding process can be obtained.

[0098] It is understandable that, since the assembly has been transferred from the middle frame carrier to the pressure holding jig, the pressure holding jig is now in an empty state, so the bonding system also includes a carrier reflow machine, which can return the middle frame carrier to the middle frame carrier circulation loading elevator.

[0099] At this point, the embodiment of the present disclosure can obtain the middle frame to be bonded; then, when the middle frame and the display screen are aligned, the display screen is bonded to the middle frame to obtain a combination of the middle frame and the display screen; then, the combination is subjected to a pressure holding treatment to obtain a target product after the middle frame and the display screen are bonded. In this way, in this embodiment, the middle frame to be bonded can be obtained by plasma treatment and glue dispensing treatment on the middle frame, and combined with Figure 1 The display screen to be bonded obtained in the process can be automatically bonded to the middle frame and the display screen, thereby improving the bonding efficiency.

[0100] The following describes the method for laminating the middle frame and the display screen and the process of laminating the display screen and the middle frame in combination with a specific scenario. Figure 2 :

[0101] (1) The bonding system processes the display screen to obtain the display screen to be bonded.

[0102] The bonding system may include a display screen carrier cyclic loading elevator, and the display screen carriers may be placed on the elevator one by one.

[0103] When the display screen carrier moves to the working area of ​​the display screen loader, the display screen loader can load the display screen into the display screen carrier, with the front side of the display screen facing upward. The front side refers to the side facing the user during display or the side with glass.

[0104] When the display carrier moves to the working area of ​​the flip device, the flip device can flip the display 180 degrees so that the back of the display faces upward.

[0105] When the display screen carrier moves to the working area of ​​the display screen auxiliary material machine, the display screen auxiliary material machine can attach auxiliary materials to the back of the display screen, where the auxiliary materials may include but are not limited to double-sided tape, conductive cloth, labels and MYLAR, which are not limited here.

[0106] When the display screen carrier moves to the working area of ​​the display screen spraying equipment, the display screen spraying equipment can spray fluorinated liquid onto the display screen to clean impurities on the back of the display screen.

[0107] When the display screen carrier moves to the working area of ​​the display screen plasma processor, the display screen plasma processor can determine the bonding position where the bonding point in the display screen is located, and then perform plasma treatment on the bonding position to activate the surface of the bonding position.

[0108] When the display screen carrier moves to the working area of ​​the flipping device, the flipping device can flip the display screen 180 degrees so that the front of the display screen faces upward; and remove the protective film on the front of the display screen.

[0109] When the display screen carrier moves to the working area of ​​the loading equipment, the loading equipment can load the display screen into the automatic guided vehicle AGV, and the AGV will send the display screen to the working area of ​​the bonding equipment.

[0110] (2) The bonding system processes the middle frame to obtain the middle frame to be bonded.

[0111] The bonding system may include a middle frame carrier cyclic loading elevator, which can place the middle frame carriers on the elevator in sequence. Each middle frame carrier can load 2 middle frames.

[0112] When the middle frame carrier moves to the working area of ​​the middle frame loader, the middle frame loader can load the middle frame into the middle frame carrier.

[0113] When the middle frame carrier moves to the working area of ​​the middle frame plasma processor, the middle frame plasma processor can determine the bonding position where the bonding point in the middle frame is located, and then perform plasma treatment on the bonding position to activate the surface of the bonding position.

[0114] When the middle frame carrier moves to the working area of ​​the middle frame dispensing machine, the image sensor in the middle frame dispensing machine can capture the image of the middle frame, so that the middle frame dispensing machine can determine the bonding position in the image based on the pre-stored bonding position of the middle frame. Then, the middle frame dispensing machine can determine the bonding position of the middle frame based on the positional relationship between the image sensor and the middle frame carrier, and apply the colloid to the bonding position.

[0115] When the middle frame carrier moves to the working area of ​​the middle frame glue line inspection machine, the image sensor in the middle frame glue line inspection machine can capture the image of the middle frame and determine the position of the colloid in the image; according to the position of the colloid, it is determined whether the colloid is abnormal. When the colloid is abnormal, the status of the middle frame is defective and the defective product is rejected. When the colloid is normal, the status of the middle frame is good and can continue to move, that is, the middle frame to be bonded is obtained.

[0116] (3) The bonding system bonds the middle frame and the display screen to obtain the target product.

[0117] Two bonding devices can be set up in the bonding system. When the middle frame carrier moves to the working area of ​​the bonding device, each bonding device obtains the middle frame to be bonded from the corresponding position of the middle frame carrier, and obtains the display screen to be bonded from the AGV. After aligning the bonding positions of the middle frame and the display screen, a combination of the middle frame and the display screen can be obtained. In this way, the middle frame carrier loads two middle frames, and two bonding devices bond them in parallel, which can improve the bonding efficiency.

[0118] When the middle frame carrier moves to the docking station, the bonding system or the staff can obtain the assembly through the docking station and perform random inspection on the assembly to determine whether the assembly is a good product or a defective product.

[0119] When the middle frame carrier moves to the working area of ​​the display cold press, the display cold press can apply a preset pressure (adjustable) to the combination. The preset pressure can enable the double-sided adhesive on the display to better bond the middle frame and the display; and it also helps the adhesion of the colloid at the fitting position.

[0120] When the middle frame carrier moves to the working area of ​​the loading device, the loading device can load the assembly into the pressure holding fixture. At the same time, the carrier reflow machine can return the middle frame carrier to the starting position of the middle frame carrier circulation loading elevator.

[0121] When the pressure holding fixture moves to the working area of ​​the pressure holding bin loader, the pressure holding bin loader can load the pressure holding fixture into the pressure holding fixture static bin. After that, the pressure holding fixture can be static in the static bin for 2 hours. According to the first-in-first-out principle, the pressure holding bin unloader can move the assembly that has been static for 2 hours out of the static bin.

[0122] When the pressure-holding jig moves to the working area of ​​the placing equipment, the placing equipment can dismantle the pressure-holding jig and automatically place the assembly on a plate to obtain the target product.

[0123] Finally, the middle frame carrier cycles the unloading elevator back.

[0124] The present disclosure also provides a middle frame and display screen bonding device, see Figure 3 ,include:

[0125] A middle frame acquisition module 31 is used to acquire a middle frame to be attached;

[0126] A display screen acquisition module 32, used to acquire the display screen to be bonded;

[0127] A combination acquisition module 33, used for attaching the display screen to the middle frame when the middle frame and the display screen are aligned, to obtain a combination including the middle frame and the display screen;

[0128] The target product acquisition module 34 is used to perform a pressure-maintaining treatment on the assembly to obtain a target product after the middle frame and the display screen are bonded together.

[0129] Optionally, the middle frame acquisition module includes:

[0130] A middle frame loading unit, used to load the middle frames into the middle frame carrier in sequence;

[0131] A position processing unit, used to determine the bonding position between the middle frame and the display screen, and perform plasma processing on the bonding position;

[0132] A glue dispensing processing unit, used for performing glue dispensing processing at the bonding position;

[0133] The middle frame detection unit is used to detect the glue line of the middle frame after the glue dispensing process and remove the middle frame with poor glue dispensing to obtain the middle frame to be bonded.

[0134] Optionally, each middle frame carrier can be loaded with at least one middle frame; each middle frame carrier corresponds to at least one bonding device, and each bonding device can bond one middle frame and one display screen at a time.

[0135] Optionally, the target product acquisition module includes:

[0136] The assembly pressure unit is used to apply a preset pressure to the assembly so that the double-sided adhesive can adhere the middle frame and the display screen;

[0137] The assembly is loaded into a unit, which is used to load the assembly into a pressure-maintaining fixture, and the pressure-maintaining fixture is used to apply a constant pressure to the assembly and keep it relatively fixed;

[0138] The assembly static unit is used to place the pressure-holding fixture equipped with the assembly into the pressure-holding fixture static bin and let it stand for a set period of time.

[0139] Optionally, the device further comprises:

[0140] The assembly sampling module is used to perform sampling inspection on assemblies through the docking station and eliminate defective assemblies.

[0141] Optionally, the display screen acquisition module includes:

[0142] A middle frame and display screen bonding unit, used for plasma processing the bonding position on the back of the display screen;

[0143] The display screen loading unit is used to load the processed display screen into the display screen storage device to obtain the display screen to be bonded.

[0144] Optionally, the display screen acquisition module further includes:

[0145] An auxiliary material setting unit, used for setting auxiliary materials on the back of the display screen;

[0146] The protection liquid spraying unit is used for spraying the protection liquid on the back of the display screen.

[0147] Optionally, the display screen acquisition module further includes:

[0148] A display screen loading unit, used for loading the display screen into the display screen carrier; the display screen faces upward in the display screen carrier;

[0149] A protective film attaching unit, used to attach protective films to the display screens in the display screen carrier in sequence;

[0150] The display screen flipping unit is used to flip the display screen with the protective film attached thereto by 180 degrees so that the back of the display screen faces upward.

[0151] Optionally, the display screen acquisition module further includes:

[0152] The protective film removal unit is used to flip the display screen 180 degrees and remove the protective film on the front side of the display screen.

[0153] It is understandable that the device provided by the embodiment of the present disclosure is different from the above Figure 1 The method shown corresponds to the above, and the specific content can be referred to the content of each embodiment of the method, which will not be repeated here.

[0154] In an exemplary embodiment, a bonding system is also provided, comprising:

[0155] processor;

[0156] a memory for storing a computer program executable by the processor;

[0157] The processor is configured to execute the computer program in the memory to implement the above method.

[0158] In an exemplary embodiment, there is also provided a computer-readable storage medium, such as a memory including instructions, and the above executable computer program can be executed by a processor to implement the above method. The readable storage medium can be a ROM, a random access memory (RAM), a CD-ROM, a magnetic tape, a floppy disk, an optical data storage device, etc.

[0159] Those skilled in the art will readily appreciate other embodiments of the present disclosure after considering the specification and practicing the disclosure disclosed herein. The present disclosure is intended to cover any variations, uses, or adaptations that follow the general principles of the present disclosure and include common knowledge or customary techniques in the art that are not disclosed in the present disclosure. The description and examples are to be considered exemplary only, and the true scope and spirit of the present disclosure are indicated by the following claims.

[0160] It should be understood that the present disclosure is not limited to the exact structures that have been described above and shown in the drawings, and that various modifications and changes may be made without departing from the scope thereof. The scope of the present disclosure is limited only by the appended claims.

Claims

1. A method for bonding a middle frame and a display screen, characterized in that: include: Obtaining a middle frame to be bonded and obtaining a display screen to be bonded; When the middle frame and the display screen are aligned, the display screen is attached to the middle frame to obtain a combination including the middle frame and the display screen; Performing a pressure-maintaining treatment on the assembly to obtain a target product after the middle frame and the display screen are bonded together; Get the middle frame to be bonded, including: Load the middle frames into the middle frame carrier one by one; Determining a bonding position between the middle frame and the display screen, and performing plasma treatment on the bonding position; Performing glue dispensing at the bonding position; Perform glue line inspection on the middle frame after glue dispensing and remove the middle frame with poor glue dispensing to obtain the middle frame to be bonded; The step of obtaining the middle frame to be bonded includes the step of determining the bonding position of the middle frame, including: The image sensor in the middle frame plasma processing machine collects the image of the middle frame, and determines the bonding position in the image according to the pre-stored bonding position of the middle frame; and determines the bonding position of the middle frame according to the positional relationship between the image sensor and the middle frame carrier; The step of obtaining the middle frame to be bonded includes obtaining the middle frame to be bonded, including: The bonding system includes a display screen plasma processor, in which an image sensor is arranged; the image sensor can obtain an image of the back of the display screen; the bonding position corresponding to the bonding point on the display screen is pre-stored in the plasma processor; the plasma processor determines the bonding position in the above image according to the bonding position on the display screen; the plasma processor determines the bonding position on the back of the display screen according to the positional relationship between the image sensor and the display screen carrier.

2. The method according to claim 1, characterized in that Each middle frame carrier can hold at least one middle frame; each middle frame carrier corresponds to at least one bonding device, and each bonding device can bond one middle frame and one display screen at a time.

3. The method according to claim 1, characterized in that The assembly is subjected to a pressure-maintaining treatment, comprising: Applying a preset pressure to the assembly so that the double-sided adhesive tape adheres the middle frame and the display screen; The assembly is placed in a pressure-maintaining fixture, wherein the pressure-maintaining fixture is used to apply a constant pressure to the assembly and keep it relatively fixed; The pressure-holding fixture containing the assembly is placed in a pressure-holding fixture static chamber and left to stand for a set period of time.

4. The method according to claim 1, characterized in that: After the display screen is attached to the middle frame, the method further includes: The assemblies are sampled and tested through the docking station, and defective assemblies are eliminated.

5. The method according to claim 1, characterized in that Get the display screen to be bonded, including: Plasma treatment is performed on the lamination position on the back of the display screen; The processed display screen is loaded into a display screen storage device to obtain a display screen to be bonded.

6. The method according to claim 5, characterized in that Before plasma treatment is performed on the bonding position on the back of the display screen, the method includes: Disposing auxiliary materials on the back of the display screen; A protective liquid is sprayed on the back of the display screen.

7. The method according to claim 6, characterized in that Before providing auxiliary materials on the back of the display screen, the method includes: Loading a display screen into a display screen carrier; the display screen faces upward in the display screen carrier; Attach protective films to the display screens in the display screen carrier one by one; The display screen with the protective film attached is turned over 180 degrees so that the back side of the display screen faces upward.

8. The method according to claim 7, characterized in that After the bonding position on the back of the display screen is subjected to plasma treatment, the method further comprises: Flip the display 180 degrees and remove the protective film from the front of the display.

9. A middle frame and display screen bonding device, characterized in that: include: A middle frame acquisition module, used to acquire the middle frame to be attached; A display screen acquisition module, used to acquire the display screen to be bonded; A combination acquisition module, used for attaching the display screen to the middle frame when the middle frame and the display screen are aligned, so as to obtain a combination including the middle frame and the display screen; A target product acquisition module, used for performing a pressure-maintaining treatment on the assembly to obtain a target product after the middle frame and the display screen are bonded together; The middle frame acquisition module includes: A middle frame loading unit, used to load the middle frames into the middle frame carrier in sequence; A position processing unit is used to determine the bonding position between the middle frame and the display screen, and perform plasma treatment on the bonding position; the step of obtaining the middle frame to be bonded includes the step of determining the bonding position of the middle frame, including: the image sensor in the middle frame plasma processor collects the image of the middle frame, and determines the bonding position in the image according to the pre-stored bonding position of the middle frame; the bonding position of the middle frame is determined according to the positional relationship between the image sensor and the middle frame carrier; and is also used to obtain the middle frame to be bonded in the step of obtaining the middle frame to be bonded, including: the bonding system includes a display screen plasma processor, and the display screen plasma processor is provided with an image sensor; the image sensor can obtain an image of the back of the display screen; the bonding position corresponding to the bonding point on the display screen is pre-stored in the plasma processor; the plasma processor determines the bonding position in the above image according to the bonding position on the display screen; the plasma processor determines the bonding position on the back of the display screen according to the positional relationship between the image sensor and the display screen carrier; A glue dispensing processing unit, used for performing glue dispensing processing at the bonding position; The middle frame detection unit is used to detect the glue line of the middle frame after the glue dispensing process and remove the middle frame with poor glue dispensing to obtain the middle frame to be bonded.

10. The device according to claim 9, characterized in that Each middle frame carrier can hold at least one middle frame; each middle frame carrier corresponds to at least one bonding device, and each bonding device can bond one middle frame and one display screen at a time.

11. The device according to claim 9, characterized in that The target product acquisition module includes: The assembly pressure unit is used to apply a preset pressure to the assembly so that the double-sided adhesive can adhere the middle frame and the display screen; The assembly is loaded into a unit, which is used to load the assembly into a pressure-maintaining fixture, and the pressure-maintaining fixture is used to apply a constant pressure to the assembly and keep it relatively fixed; The assembly static unit is used to place the pressure-holding fixture equipped with the assembly into the pressure-holding fixture static bin and let it stand for a set period of time.

12. The device according to claim 9, characterized in that The device also includes: The assembly sampling module is used to perform sampling inspection on assemblies through the docking station and eliminate defective assemblies.

13. The device according to claim 9, characterized in that The display screen acquisition module includes: A middle frame and display screen bonding unit, used for plasma processing the bonding position on the back of the display screen; The display screen loading unit is used to load the processed display screen into the display screen storage device to obtain the display screen to be bonded.

14. The device according to claim 13, characterized in that The display screen acquisition module also includes: An auxiliary material setting unit, used for setting auxiliary materials on the back of the display screen; The protection liquid spraying unit is used for spraying the protection liquid on the back of the display screen.

15. The device according to claim 14, characterized in that The display screen acquisition module also includes: A display screen loading unit, used for loading the display screen into the display screen carrier; the display screen faces upward in the display screen carrier; A protective film attaching unit, used to attach protective films to the display screens in the display screen carrier in sequence; The display screen flipping unit is used to flip the display screen with the protective film attached thereto by 180 degrees so that the back of the display screen faces upward.

16. The device according to claim 15, characterized in that The display screen acquisition module also includes: The protective film removal unit is used to flip the display screen 180 degrees and remove the protective film on the front side of the display screen.

17. A laminating system, characterized in that: include: processor; a memory for storing a computer program executable by the processor; The processor is configured to execute the computer program in the memory to implement the method according to any one of claims 1 to 8.

18. A computer-readable storage medium, characterized in that: When the executable computer program in the storage medium is executed by a processor, the method according to any one of claims 1 to 8 can be implemented.

Images