Maintenance unit and substrate processing apparatus having the same

Abstract

The present application provides a maintenance unit having side plates arranged on both sides of a calibration plate and a substrate processing apparatus including the same. The substrate processing apparatus includes a process treatment unit supporting a substrate, an inkjet head module jetting a treatment liquid to the substrate, a maintenance unit disposed adjacent to the process treatment unit, and a control unit correcting a jetting position of the treatment liquid using the maintenance unit, wherein the maintenance unit includes a disc disposed on a stage, a first side plate disposed on the disc, and a second side plate disposed on the disc and spaced apart from the first side plate, and the control unit corrects the jetting position of the treatment liquid using the first side plate and the second side plate.

Description

Technical Field

[0001] This invention relates to a maintenance unit and a substrate processing apparatus having the maintenance unit. More specifically, this invention relates to a maintenance unit suitable for printing equipment and a substrate processing apparatus having the maintenance unit. Background Technology

[0002] When performing printing processes (e.g., RGB patterning) on ​​transparent substrates to manufacture display devices such as LCD panels, PDP panels, and LED panels, printing equipment with an inkjet head unit can be used. Summary of the Invention

[0003] In pixel inkjet printing, the accuracy of the printouts is crucial. Therefore, it is necessary to improve metering precision to minimize the deviation between the position of the droplets ejected from the inkjet head unit and the printout measured by NJI (Nozzle Jetting Inspection).

[0004] However, in the existing technology, the position of subsequent droplets is determined based on the position of the first droplet. Therefore, when the first nozzle fails to eject the droplet, it may be impossible to set a reference position.

[0005] Additionally, when using a calibration board, the measurement accuracy may be reduced because the calibration board is only temporarily placed during setup and is not fixed in place.

[0006] The technical problem to be solved by the present invention is to provide a maintenance unit having side plates arranged on both sides of a calibration board and a substrate processing apparatus including the maintenance unit.

[0007] The technical problems to be solved by the present invention are not limited to those mentioned above, and those skilled in the art will clearly understand other technical problems not mentioned through the following description.

[0008] One aspect of the substrate processing apparatus of the present invention for solving the above-mentioned technical problems includes: a process processing unit supporting a substrate; an inkjet head module for ejecting a processing liquid onto the substrate; a maintenance unit disposed adjacent to the process processing unit; and a control unit for correcting the ejection position of the processing liquid using the maintenance unit, wherein the maintenance unit includes: a tray disposed on a table; a first side plate disposed on the tray; and a second side plate disposed on the tray and spaced apart from the first side plate, and the control unit uses the first side plate and the second side plate to correct the ejection position of the processing liquid.

[0009] The first side plate and the second side plate can be respectively disposed on the outer periphery of the two sides of the disk.

[0010] The first side plate can be arranged parallel to the second side plate.

[0011] The control unit can use a second alignment mark formed on the first side plate as a printing start point to control the inkjet head module.

[0012] The control unit can use a second alignment mark formed on the second side plate as a printing endpoint to control the inkjet head module.

[0013] The control unit can use the second alignment mark formed on the first side plate and the second alignment mark formed on the second side plate to correct the printing position of the inkjet head module.

[0014] The substrate processing apparatus may further include: a first vision module disposed on the process processing unit; and a second vision module disposed on the maintenance unit, wherein the control unit uses the measurement results of the first vision module and the measurement results of the second vision module, which measure the second alignment mark formed on the first side plate and the second alignment mark formed on the second side plate, to correct the printing position of the inkjet head module.

[0015] The second alignment mark formed on the first side plate may be at the same level as the second alignment mark formed on the second side plate.

[0016] The maintenance unit may also include a calibration plate disposed on the disk.

[0017] The length direction of the calibration plate may be different from the length direction of the first side plate and the second side plate.

[0018] The calibration plate can be positioned in the area between the first side plate and the second side plate.

[0019] The calibration plate and the first side plate may each include a plurality of first alignment marks and a plurality of second alignment marks formed on their surfaces.

[0020] The plurality of first alignment marks can be formed at the same interval as the plurality of second alignment marks.

[0021] The plurality of first alignment marks and / or the plurality of second alignment marks may have the same size as the processing liquid sprayed onto the substrate.

[0022] The control unit can use the calibration plate to correct the positional deviation between the first side plate and the second side plate.

[0023] The control unit can control the movement of the inkjet head module by utilizing the intervals between a plurality of first alignment marks formed on the calibration plate.

[0024] At least one of the calibration plate, the first side plate, and the second side plate can be fixed to the disk.

[0025] The substrate processing apparatus can be operated before printing the substrate.

[0026] Another aspect of the substrate processing apparatus of the present invention for solving the above-mentioned technical problems includes: a process processing unit supporting a substrate; an inkjet head module for spraying a processing liquid onto the substrate; a maintenance unit disposed adjacent to the process processing unit; and a control unit for correcting the spray position of the processing liquid using the maintenance unit, wherein the maintenance unit includes: a disk disposed on a table; a first side plate disposed on the disk; a second side plate disposed on the disk and spaced apart from the first side plate; and a calibration plate disposed on the disk and spaced apart from the first side plate and the second side plate, wherein the length direction of the calibration plate is different from the length direction of the first side plate and the second side plate.

[0027] One aspect of the maintenance unit of the present invention for solving the above-mentioned technical problems is arranged adjacent to the process unit of the support substrate, and includes: a tray arranged on a table; a first side plate arranged on the tray; and a second side plate arranged on the tray and spaced apart from the first side plate, wherein the first side plate and the second side plate are used to correct the spraying position of the process liquid sprayed onto the substrate.

[0028] Specific details of other embodiments are included in the detailed description and accompanying drawings. Attached Figure Description

[0029] Figure 1 This is a schematic plan view illustrating the internal structure of a substrate processing apparatus according to a first embodiment of the present invention.

[0030] Figure 2 This is a schematic plan view illustrating the internal structure of a substrate processing apparatus according to a second embodiment of the present invention.

[0031] Figure 3 This is a schematic plan view illustrating the structure of a calibration plate constituting a substrate processing apparatus according to an embodiment of the present invention.

[0032] Figure 4 This is a plan view schematically showing the structure of a side plate constituting a substrate processing apparatus according to an embodiment of the present invention.

[0033] Figure 5 This is an example diagram illustrating the arrangement of the calibration plate and side plate of a substrate processing apparatus according to an embodiment of the present invention.

[0034] Figure 6 This is an example diagram showing the printing state of the substrate when the substrate processing apparatus does not include the side plate.

[0035] Figure 7 This is an example diagram illustrating the printing state of a substrate when the substrate processing apparatus includes a side plate according to an embodiment of the present invention.

[0036] Figure 8 This is an example diagram illustrating the effect when the substrate processing apparatus includes a first side plate and a second side plate according to an embodiment of the present invention.

[0037] Figure 9 This is a first example diagram illustrating the effect when the substrate processing apparatus includes a calibration plate, a first side plate, and a second side plate according to an embodiment of the present invention.

[0038] Figure 10 This is a second example diagram illustrating the effect when the substrate processing apparatus includes a calibration plate, a first side plate, and a second side plate according to an embodiment of the present invention.

[0039] Figure 11 This is a third example diagram illustrating the effect when the substrate processing apparatus includes a calibration plate, a first side plate, and a second side plate according to an embodiment of the present invention.

[0040] Explanation of reference numerals in the attached figures

[0041] 100: Substrate processing apparatus; 110: Processing unit

[0042] 111: First unit; 112: Air vent

[0043] 120: Maintenance Unit 121: Second Unit

[0044] 122: First guide rail 123: First plate

[0045] 124: Second guide rail 125: Second tray

[0046] 130: Hanger Unit; 131: Base Module

[0047] 132: Inkjet head module; 133: First vision module

[0048] 134: Second vision module; 135: Third guide rail

[0049] 136: Fourth guide rail; 140: Control unit

[0050] 150: Calibration plate; 160: Side plate

[0051] 210: First alignment mark 220: First scale

[0052] 230: Second alignment mark; 240: Second scale.

[0053] 310: First side panel; 320: Second side panel

[0054] 330: Second alignment mark on the first side plate

[0055] 340: Second alignment mark on the second side plate

[0056] 410: Spray Point 420: Virtual First Line

[0057] 430: The Virtual Second Line

[0058] 520a, 520b, ..., 520n: First alignment marks

[0059] 530: The Virtual Fourth Line Detailed Implementation

[0060] Preferred embodiments of the present invention will now be described in detail with reference to the accompanying drawings. The advantages and features of the present invention, as well as methods for achieving these advantages and features, will be explained below with reference to the accompanying drawings. Figure 1 The invention becomes clear from the detailed description of the embodiments. However, the invention is not limited to the embodiments disclosed below, but can be implemented in many different forms. These embodiments are provided only to make the disclosure of the invention complete and to fully inform those skilled in the art of the scope of the invention, which is defined only by the scope of the claims. Throughout the specification, the same reference numerals refer to the same constituent elements.

[0061] When a component or layer is referred to as "on" or "above" another component or layer, it includes not only that it is directly above another component or layer, but also that other layers or other components are in between. Conversely, when a component is referred to as "directly" on or directly above another component, it indicates that there are no other components or layers in between.

[0062] To readily describe the relationship between one element or component and another, as shown in the figure, spatial relative terms such as "below," "below," "lower," "above," and "upper" can be used. It should be understood that, in addition to the orientation shown in the figure, spatial relative terms also include terms indicating the different orientations of the elements during use or operation. For example, when the element shown in the figure is flipped, an element described as "below" or "below" of another element may be located "above" of that element. Therefore, the exemplary term "below" can include both "below" and "above" orientations. An element may also be oriented in another direction, thus allowing the spatial relative terms to be interpreted according to orientation.

[0063] Although the terms "first," "second," etc., are used to describe various elements, constituent elements, and / or parts, these elements, constituent elements, and / or parts are obviously not limited by these terms. These terms are only used to distinguish one element, constituent element, and / or part from another element, constituent element, and / or part. Therefore, the first element, first constituent element, or first part mentioned below can obviously also be a second element, second constituent element, or second part within the technical concept of the present invention.

[0064] The terminology used in this specification is for illustrative purposes and is not intended to limit the invention. In this specification, the singular form includes the plural form unless specifically stated otherwise. The terms "comprises" and / or "comprising" as used in this specification do not exclude the presence or addition of one or more other constituent elements, steps, operations, and / or components in addition to those mentioned.

[0065] Unless otherwise defined, all terms used in this specification (including technical and scientific terms) may be used in the sense that can be commonly understood by one of ordinary skill in the art to which this invention pertains. Furthermore, terms defined in commonly used dictionaries are not to be ideally or excessively interpreted unless explicitly defined otherwise.

[0066] Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. When describing the invention with reference to the drawings, the same or corresponding constituent elements are given the same reference numerals regardless of the reference numerals, and repeated descriptions thereof are omitted.

[0067] This invention relates to a maintenance unit applicable to printing equipment and a substrate processing apparatus including the maintenance unit. Specifically, this invention relates to a maintenance unit having a calibration board and side boards arranged on both sides thereon, and a substrate processing apparatus including the maintenance unit.

[0068] The present invention will now be described in detail with reference to the accompanying drawings and other accompanying documents.

[0069] Figure 1 This is a schematic plan view illustrating the internal structure of a substrate processing apparatus according to a first embodiment of the present invention.

[0070] according to Figure 1 The substrate processing apparatus 100 may include a process processing unit 110, a maintenance unit 120, a gantry unit 130, and a control unit 140.

[0071] The substrate processing apparatus 100 is used to process a substrate G (e.g., a glass substrate). This substrate processing apparatus 100 can spray a processing liquid (e.g., ink) onto the substrate G to print on the substrate G. For example, the substrate processing apparatus 100 can be implemented by a printing equipment having an inkjet head module 132.

[0072] The process unit 110 is used to support the substrate G. This process unit 110 can support the substrate G during the printing process of the substrate G.

[0073] The process unit 110 may include a first unit 111 and vents 112. The first unit 111 is used to mount the substrate G. Vents 112 may be formed on the upper surface of the first unit 111, and may be formed in at least one (preferably multiple).

[0074] The vent 112 can spray air upwards (to the third direction 30) towards the first unit 111. Thus, the vent 112 can levitate the substrate G placed on the first unit 111.

[0075] The process unit 110 may also include a clamp (not shown). The clamp is used to hold the substrate G suspended on the first unit 111. This clamp can slide along a guide rail (not shown) while holding the substrate G, so that the substrate G can move along the length direction (first direction 10) of the first unit 111.

[0076] The maintenance unit 120 is used to measure the ejection position (i.e., the nozzle) of the processing liquid for each of the plurality of nozzles in the inkjet head module 132. Furthermore, the maintenance unit 120 is used to measure whether the processing liquid is ejected from each nozzle. The control unit 140 can take appropriate measures on the inkjet head module 132 based on the measurement results obtained through the maintenance unit 120 (ejection position of the processing liquid, whether the processing liquid is ejected, etc.).

[0077] The maintenance unit 120 may include a second unit 121, a first guide rail 122, a first tray 123, a second guide rail 124, and a second tray 125.

[0078] The first guide rail 122 is disposed on the second unit 121. This first guide rail 122 can be formed by extending in a direction parallel to the movement direction (first direction 10) of the substrate G. That is, the length direction of the first guide rail 122 can be the first direction 10. For example, the first guide rail 122 can be implemented by an LM guide (Linear Motion Guide).

[0079] The first disc 123 is mounted on the first guide rail 122. This first disc 123 can move along the length direction (first direction 10) of the first guide rail 122.

[0080] The second guide rail 124 is disposed on the first disk 123. This second guide rail 124 can be formed extending in a direction perpendicular to the direction of movement of the substrate G (second direction 20). That is, the length direction of the second guide rail 124 can be the second direction 20. The second guide rail 124 can be implemented using an LM guide rail, just like the first guide rail 122.

[0081] The second disc 125 is mounted on the second guide rail 124. This second disc 125 can move along the length direction (second direction 20) of the second guide rail 124.

[0082] In this embodiment, the calibration board 150 and side board 160 can be used to determine the ejection position of the processing liquid on the substrate G. These calibration board 150 and side board 160 can be disposed on the second disk 125.

[0083] When the calibration plate 150 and the side plate 160 are mounted on the second plate 125, they can be moved along the first guide rail 122 and the second guide rail 124 on the second plate 121 in the first direction 10 and the second direction 20 to achieve displacement.

[0084] However, this embodiment is not limited to this. The calibration plate 150 and side plate 160 can also be moved along the first guide rail 122 on the second unit 121 only in the first direction 10 to achieve displacement. In this case, as... Figure 2 As shown, the second guide rail 124 and the second plate 125 may not be set on the first plate 123, and the calibration plate 150 and the side plate 160 may be set on the first plate 123. Figure 2 This is a schematic plan view illustrating the internal structure of a substrate processing apparatus according to a second embodiment of the present invention.

[0085] On the other hand, a detailed description of the structure and function of the calibration plate 150 and the side plate 160 will be provided later.

[0086] Refer again Figure 1 Please provide an explanation.

[0087] The hanger unit 130 is used to support the inkjet head module 132. This hanger unit 130 can be arranged above the process unit 110 and the maintenance unit 120 so that the inkjet head module 132 can spray processing liquid onto the substrate G.

[0088] The hanger unit 130 may include a base module 131, an inkjet head module 132, and a first vision module 133.

[0089] The base module 131 is disposed on the upper part of the first unit 111 and the second unit 121. For this purpose, the base module 131 can be formed by extending in the width direction (second direction 20) of the first unit 111 and the second unit 121.

[0090] The base module 131 can move along the length direction (first direction 10) of the first unit 111 so that the inkjet head module 132 can be positioned at a desired location on the substrate G. At this time, the base module 131 can be moved along the third guide rail 135 and the fourth guide rail 136 in the first direction 10 under the control of the hanger moving unit (not shown).

[0091] The hanger moving unit can be disposed inside the base module 131 and can include a first moving module and a second moving module. The first moving module and the second moving module can be disposed at two ends inside the base module 131 and can slide along guide rails (not shown) disposed on the outer sides of the first unit 111 and the second unit 121.

[0092] The inkjet head module 132 ejects processing liquid onto the substrate G in the form of droplets. This inkjet head module 132 can be disposed on the side surface of the base module 131 or on the bottom surface of the base module 131.

[0093] The inkjet head module 132 may include a nozzle plate (not shown), a plurality of nozzles (not shown), and a piezoelectric element (not shown).

[0094] The nozzle plate constitutes the main body of the inkjet head module 132. Multiple nozzles (e.g., 128, 256, etc.) can be arranged in a row at certain intervals on the bottom surface of this nozzle plate, and the piezoelectric elements can be set to a number corresponding to the number of nozzles in the nozzle plate. With such a configuration, the inkjet head module 132 can spray processing liquid onto the substrate G through the nozzles according to the operation of the piezoelectric elements.

[0095] On the other hand, the inkjet head module 132 can also independently control the amount of processing liquid ejected through each nozzle (i.e., the ejection volume) based on the voltage applied to the piezoelectric element.

[0096] When a printing process is performed on the substrate G, the inkjet head module 132 can move to the top of the first unit 111 and spray processing liquid onto the substrate G suspended on the first unit 111 while reciprocating along the width direction (second direction 20) of the first unit 111.

[0097] Furthermore, when the inkjet head module 132 is maintained or repaired by performing a maintenance process, the control unit 140 can obtain information about the ejection position and whether the processing fluid ejected by the inkjet head module 132 is ejected, in order to correct the ejection point of the inkjet head module 132 or to identify which of the multiple nozzles is not properly ejecting the processing fluid.

[0098] At least one inkjet head module 132 may be disposed on the base module 131. When multiple inkjet head modules 132 are disposed on the base module 131, the multiple inkjet head modules 132 may be arranged in a row along the length direction (second direction 20) of the base module 131.

[0099] On the other hand, the inkjet head module 132 can move along the length direction (second direction 20) of the base module 131 to be positioned at a desired location on the substrate G. However, this embodiment is not limited to this. The inkjet head module 132 can also move in the height direction (third direction 30) of the base module 131. On the other hand, the inkjet head module 132 can also rotate in a clockwise or counterclockwise direction.

[0100] The inkjet head module 132 can move along the length or height of the base module 131 under the control of a head movement control module (not shown). The head movement control module is used to control the movement of the inkjet head module 132. At least one such head movement control module can be provided in the hanger unit 130. When multiple inkjet head modules 132 are provided in the substrate processing apparatus 100, the head movement control module can make each inkjet head module move independently or make all inkjet head modules move uniformly.

[0101] The first vision module 133 is used to acquire image information about the substrate G, the calibration plate 150, and the side plate 160. This first vision module 133 captures images of the substrate G, the calibration plate 150, and the side plate 160 in real time, thus effectively acquiring image information even if the substrate G, the calibration plate 150, and the side plate 160 move. For example, the first vision module 133 can be implemented using an area camera.

[0102] The first vision module 133 can be disposed on the inkjet head module 132. For example, the first vision module 133 can be disposed in a form attached to the side surface of the inkjet head module 132. However, this embodiment is not limited thereto. The first vision module 133 can also be disposed on the base module 131.

[0103] On the other hand, the first vision module 133 can be fixedly mounted on the inkjet head module 132 or the base module 131, or it can be movably mounted on the inkjet head module 132 or the base module 131.

[0104] At least one first vision module 133 may be disposed in the substrate processing apparatus 100. In the case where multiple first vision modules 133 are disposed in the substrate processing apparatus 100, some first vision modules 133 may be disposed on the side surface of the inkjet head module 132, and others may be disposed on the side surface and / or lower part of the base module 131, etc. However, this embodiment is not limited thereto. A portion of the multiple first vision modules 133 may also be disposed around the first unit 111 and the second unit 121 by means of a support member, etc.

[0105] The hanger unit 130 may also include a second vision module 134.

[0106] The second vision module 134, like the first vision module 133, is used to obtain image information about the substrate G, the calibration plate 150, and the side plate 160. This second vision module 134 can obtain image information about the substrate G, the calibration plate 150, and the side plate 160 in a different manner than the first vision module 133. For example, the second vision module 134 can be implemented using a line scan camera.

[0107] The second vision module 134 can be disposed on the base module 131. In this embodiment, both the first vision module 133 and the second vision module 134 can be disposed on the base module 131. In this case, the first vision module 133 can be disposed on the side surface of the base module 131, and the second vision module 134 can be disposed on the bottom surface of the base module 131. Alternatively, the first vision module 133 and the second vision module 134 can be disposed on the side surface or the bottom surface of the base module 131 in a spaced-apart manner.

[0108] At least one second vision module 134 may be disposed in the substrate processing apparatus 100. When multiple second vision modules 134 are disposed in the substrate processing apparatus 100, some second vision modules 134 may be disposed on the bottom surface of the base module 131, and others may be disposed on the side surface of the base module 131. However, this embodiment is not limited thereto. A portion of the multiple second vision modules 134 may also be disposed around the first unit 111 and the second unit 121 by means of a support member or the like.

[0109] The control unit 140 is used to perform maintenance and repair on the inkjet head module 132. This control unit 140 can correct the ejection position of the processing fluid from each nozzle of the inkjet head module 132 based on the measurement results of the maintenance unit 120, or detect faulty nozzles (i.e., nozzles that do not eject processing fluid) among multiple nozzles to perform cleaning operations on the faulty nozzles. For this purpose, the control unit 140 can control the operation of the process handling unit 110, the maintenance unit 120, the hanger unit 130, etc.

[0110] The control unit 140 may include a process controller, an input tool, an output tool, a control program, and a storage tool. The process controller may be implemented by a microprocessor (computer) or the like that controls the substrate processing apparatus 100. The input tool allows the operator to execute command input operations to manage the substrate processing apparatus 100. The output tool may be implemented by a display device or the like that that visually displays the operating status of the substrate processing apparatus 100. The control program is used to execute the processing performed in the substrate processing apparatus 100 according to the control of the process controller. The storage tool is used to store the program, i.e., the processing recipe, that enables the various components to perform processing based on various data and processing conditions. The output tool and the storage tool may be connected to the process controller, and the processing recipe may be stored in the storage medium of the storage tool. The storage medium may be a hard disk, a portable hard disk such as a CD-ROM or DVD, or a semiconductor memory such as flash memory.

[0111] As described above, the calibration plate 150 and the side plate 160 can be used to determine the ejection position of the processing liquid on the substrate G. This will be explained below.

[0112] The calibration plate 150 and the side plate 160 can be respectively disposed on the outer periphery of the second plate 125. Specifically, the side plate 160 can be respectively disposed on the two outer periphery areas facing each other on the second plate 125, and the calibration plate 150 can be disposed on either of the two outer periphery areas.

[0113] The calibration plate 150 may extend along the length direction (first direction 10) of the second disk 125. Conversely, the side plate 160 may extend along the width direction (second direction 20) of the second disk 125. In this embodiment, the length direction of the calibration plate 150 may be the first direction 10, and the length direction of the side plate 160 may be the second direction 20.

[0114] Side plates 160 can be disposed adjacent to both sides of the calibration plate 150. In this case, two side plates 160 can be disposed on the second disk 125. However, this embodiment is not limited to this. Side plates 160 can also be disposed adjacent to either side of the calibration plate 150. In this case, one side plate 160 can be disposed on the second disk 125.

[0115] like Figure 3 As shown, the calibration plate 150 may include a first alignment mark 210, a first scale 220, and a first auxiliary mark 250 on its surface. Similarly, as Figure 4 As shown, the side plate 160 may include a second alignment mark 230, a second scale 240 and a second auxiliary mark 260 on its surface.

[0116] Figure 3 This is a schematic plan view illustrating the structure of a calibration plate constituting a substrate processing apparatus according to an embodiment of the present invention. Furthermore, Figure 4 This is a plan view schematically illustrating the structure of a side plate constituting a substrate processing apparatus according to an embodiment of the present invention. Hereinafter, reference will be made to... Figure 3 and Figure 4 Please provide an explanation.

[0117] The first alignment mark 210 is used to correct the ejection position of the processing liquid ejected from the inkjet head module 132 onto the substrate G. Multiple such first alignment marks 210 can be formed on the calibration plate 150 at certain intervals.

[0118] The second alignment mark 230 is used to correct the ejection position of the processing liquid ejected from the inkjet head module 132 onto the substrate G. Multiple such second alignment marks 230 can be formed on the side plate 160 at certain intervals.

[0119] The first alignment mark 210 and the second alignment mark 230 can be formed on the calibration plate 150 and the side plate 160 respectively at the same interval. In this case, the consistency of the measurement distance of the first vision module 133 and the second vision module 134 can be confirmed and corrected by confirming whether the interval between the first alignment mark 210 and the second alignment mark 230 is the same.

[0120] However, this embodiment is not limited to this. The first alignment mark 210 and the second alignment mark 230 may also be formed on the calibration plate 150 and the side plate 160 at different intervals. For example, the first alignment mark 210 may be formed on the calibration plate 150 at a larger interval than the second alignment mark 230.

[0121] The first alignment mark 210 and the second alignment mark 230 can be formed on the calibration plate 150 and the side plate 160, respectively, to have the same size. However, this embodiment is not limited to this. The first alignment mark 210 and the second alignment mark 230 can also be formed on the calibration plate 150 and the side plate 160 to have different sizes from each other. For example, the first alignment mark 210 can be formed on the calibration plate 150 to have a larger size than the second alignment mark 230.

[0122] The first alignment mark 210 and the second alignment mark 230 can be formed to have the same size as the processing liquid ejected from the inkjet head module 132 onto the substrate G. For example, the first alignment mark 210 and the second alignment mark 230 can be formed as circles with a diameter of 20 μm at 200 μm intervals on the calibration plate 150 and the side plate 160, respectively. When the first alignment mark 210 and the second alignment mark 230 are formed in this way, detailed setting and S / W correction can be performed for size measurement errors and position measurement errors that may occur in the first vision module 133 and the second vision module 134.

[0123] The first scale 220 is used to measure the ejection position of the processing liquid ejected from the inkjet head module 132 onto the substrate G. The substrate G can be mounted on the first machine 111 for a printing process. The inkjet head module 132 can then eject the processing liquid to a position on the substrate G. Assuming that the substrate G is mounted on the second tray 125 corresponding to the position of the substrate G mounted on the first machine 111, and the processing liquid is ejected to the same position as in the first machine 111, the first scale 220 can measure the ejection position of the processing liquid ejected onto the substrate G mounted on the second machine 121, thereby calculating the ejection position of the processing liquid ejected onto the substrate G mounted on the first machine 111.

[0124] In this embodiment, the ejection position of the processing liquid sprayed onto the substrate G can be measured using the first vision module 133. Furthermore, when the first scale 220 is used, the ejection position of the processing liquid can be measured more accurately.

[0125] Using the first scale 220, the X-axis coordinate value can be obtained as information about the spray position of the treatment fluid. Similarly, using the second scale 240, the Y-axis coordinate value can be obtained as information about the spray position of the treatment fluid. In this embodiment, both the first scale 220 and the second scale 240 can be used to accurately measure the spray position of the treatment fluid.

[0126] On the other hand, when using the inkjet head module 132 printed substrate G, the first auxiliary mark 250 and the second auxiliary mark 260 can be used to determine the reference point.

[0127] In this embodiment, to determine the ejection position of the processing liquid on the substrate G, the substrate processing apparatus 100 may include both a calibration plate 150 and a side plate 160. In this case, for example, as... Figure 5 As shown, calibration plate 150 and side plate 160 can be arranged on the second disk 125 in various peripheral areas.

[0128] Specifically, the side plate 160 can be arranged on the second plate 125 in the two facing outer regions with the second direction 20 as the length direction. That is, the first side plate 310 can be arranged in either of the two facing outer regions, and the second side plate 320 can be arranged in the other outer region of the two facing outer regions.

[0129] Furthermore, the calibration plate 150 can be arranged on the second disk 125 in either of the peripheral regions located between the two side plates 160 with the first direction 10 as the length direction. Figure 5 This is an example diagram illustrating the arrangement of the calibration plate and side plate of a substrate processing apparatus according to an embodiment of the present invention.

[0130] On the other hand, in this embodiment, the substrate processing apparatus 100 may also exclude the calibration plate 150 and include only the side plate 160.

[0131] When the substrate processing apparatus 100 includes only side plates 160, the substrate processing apparatus 100 may include two side plates 160 arranged on the second tray 125 in two facing peripheral regions. That is, the substrate processing apparatus 100 may include a first side plate 310 and a second side plate 320.

[0132] Conversely, if the substrate processing apparatus 100 includes not only the side plate 160 but also the calibration plate 150, it may also include only one side plate 160 arranged adjacent to one end of the calibration plate 150. That is, the substrate processing apparatus 100 may include either the first side plate 310 or the second side plate 320.

[0133] When the substrate processing apparatus 100 includes a first side plate 310 and a second side plate 320 arranged in the peripheral regions on both sides, the second alignment mark 230 on either the first side plate 310 or the second side plate 320 can be used as the absolute reference point for the printing start.

[0134] That is, in this embodiment, the first vision module 133 can be used to identify the second alignment mark 230 formed on either the first side plate 310 or the second side plate 320 before printing on the substrate G, so that the printing position reference is always the same.

[0135] When the substrate processing apparatus 100 includes only the calibration plate 150 and excluding the side plate 160, printing on the substrate G can begin after the ejection position of the processing liquid from the inkjet head module 132 is corrected using the first alignment mark 210 on the calibration plate 150. However, in this case, since the printing start point is not determined, ... Figure 6 As shown, multiple spray dots 410 may be concentrated on one side of the substrate G, thus making it impossible to print the entire surface of the substrate G evenly. Figure 6 This is an example diagram showing the printing state of the substrate when the substrate processing apparatus does not include the side plate.

[0136] Conversely, when the substrate processing apparatus 100 includes a side plate 160, the second alignment mark 230 on either the first side plate 310 or the second side plate 320 can be used as an absolute reference point for the start of printing, thus determining the printing start point. Therefore, as Figure 7 As shown, multiple spray dots 410 can be evenly distributed on the substrate G, thus achieving the effect of uniformly printing the entire surface of the substrate G. Figure 7 This is an example diagram illustrating the printing state of a substrate when the substrate processing apparatus includes a side plate according to an embodiment of the present invention.

[0137] On the other hand, in this embodiment, the second alignment mark 230 on the first side plate 310 can also be used as the absolute reference point for the start of printing, and the second alignment mark 230 on the second side plate 320 can be used as the absolute reference point for the end of printing, so as to align the printing position reference on the substrate G to the desired position (e.g., the center).

[0138] On the other hand, in this embodiment, the first auxiliary mark 250 on the first side plate 310 can also be used as the absolute reference point for the start of printing, and the second auxiliary mark 260 on the second side plate 320 can be used as the absolute reference point for the end of printing.

[0139] When the substrate processing apparatus 100 includes a first side plate 310 and a second side plate 320, such as Figure 8 As shown, the deviation between the printing position of the inkjet head module 132 and the metering position of the second vision module 134 can be corrected by using the second alignment mark 330 on the first side plate 310 and the second alignment mark 340 on the second side plate 320.

[0140] Figure 8 This is an example diagram illustrating the effect when the substrate processing apparatus includes a first side plate and a second side plate according to an embodiment of the present invention. Hereinafter, refer to... Figure 8 Please provide an explanation.

[0141] When the second alignment mark 330 on the first side plate 310 and the second alignment mark 340 on the second side plate 320 are measured by the first vision module 133, the control unit 140 can form a virtual first line 420 along the X-axis direction on the S / W.

[0142] Similarly, when the second alignment mark 330 on the first side plate 310 and the second alignment mark 340 on the second side plate 320 are measured using the second vision module 134, the control unit 140 can form a virtual second line 430 along the X-axis direction on the S / W according to this.

[0143] Subsequently, if a virtual first line 420 and a virtual second line 430 are arranged on a substrate G, the control unit 140 can measure the deviation d between the metering position of the first vision module 133 and the metering position of the second vision module 134. That is, the control unit 140 can measure and correct the deviation between the printing position of the inkjet head module 132 and the metering position of the second vision module 134.

[0144] In the above description, when the second alignment mark 340 of the second side plate 320 is formed at a position corresponding to the second alignment mark 330 of the first side plate 310, the second alignment mark 330 on the first side plate 310 and the second alignment mark 340 on the second side plate 320 can be located at the same level. However, this embodiment is not limited to this. The second alignment mark 330 on the first side plate 310 and the second alignment mark 340 on the second side plate 320 can also be located at different levels.

[0145] When the substrate processing apparatus 100 includes a first side plate 310 and a second side plate 320, the spray position of the processing liquid on the substrate G can be determined by the second scale 240 formed on the first side plate 310 and the second scale 240 formed on the second side plate 320, and even if multiple printings are performed on the substrate G, the printing position to be measured can be accurately found.

[0146] In addition, when the substrate processing apparatus 100 also includes a calibration plate 150, in addition to the second scale 240 formed on the first side plate 310 and the second scale 240 formed on the second side plate 320, the first scale 220 formed on the calibration plate 150 can be used to more accurately determine the spray position of the processing liquid on the substrate G.

[0147] On the other hand, in this embodiment, at least one maintenance unit 120 may be provided in the substrate processing apparatus 100. When multiple maintenance units 120 are provided in the substrate processing apparatus 100, the position setting and S / W correction between the maintenance units 120 can be performed using alignment marks provided in each maintenance unit 120 (at least one of the first alignment mark 210 formed on the calibration plate 150, the second alignment mark 330 formed on the first side plate 310, and the second alignment mark 340 formed on the second side plate 320).

[0148] On the other hand, in this embodiment, a maintenance unit 120 may be provided in the substrate processing device 100, and a plurality of second disks 125 provided with a calibration plate 150 and a side plate 160 may be provided on the maintenance unit 120.

[0149] When the substrate processing apparatus 100 includes a calibration plate 150, a first side plate 310, and a second side plate 320, the calibration plate 150 can be used to correct the positional deviation between the first side plate 310 and the second side plate 320.

[0150] Figure 9 This is a first example diagram illustrating the effect when the substrate processing apparatus includes a calibration plate, a first side plate, and a second side plate according to an embodiment of the present invention, and Figure 10 This is a second example diagram illustrating the effect when the substrate processing apparatus includes a calibration plate, a first side plate, and a second side plate according to an embodiment of the present invention. Furthermore, Figure 11 This is a third example diagram illustrating the effect when the substrate processing apparatus includes a calibration plate, a first side plate, and a second side plate according to an embodiment of the present invention.

[0151] The following is for reference Figures 9 to 11 Please provide an explanation.

[0152] For example, when correcting the deviation between the printing position of the inkjet head module 132 and the metering position of the second vision module 134, the control unit 140 can measure any one of the plurality of second alignment marks 330 formed on the first side plate 310 and any one of the plurality of second alignment marks 340 formed on the second side plate 320 to generate virtual lines 420, 430. At this time, as... Figure 9As shown, the second alignment mark 330 on the first side plate 310 and the second alignment mark 340 on the second side plate 320 can be located at the same level.

[0153] However, when the first side plate 310 and the second side plate 320 are not located in corresponding positions in the outer regions on both sides (i.e., the first side plate 310 and the second side plate 320 are not arranged to be parallel to each other), or when the plurality of second alignment marks on the first side plate 310 and the plurality of second alignment marks on the second side plate 320 are not located in corresponding positions, such as Figure 10 As shown, the second alignment mark 330 on the first side plate 310 and the second alignment mark 340 on the second side plate 320 may not be at the same level.

[0154] In this embodiment, a plurality of first alignment marks arranged in a row on the calibration plate 150 can be used for correction so that the second alignment mark 330 on the first side plate 310 and the second alignment mark 340 on the second side plate 320 are at the same level.

[0155] Specifically, such as Figure 11 As shown, corrections can be made such that the virtual third line connecting the second alignment mark 330 on the first side plate 310 and the second alignment mark 340 on the second side plate 320 is parallel to the virtual fourth line 530 obtained using a plurality of first alignment marks 520a, 520b, ..., 520n, thereby placing the second alignment mark 330 on the first side plate 310 and the second alignment mark 340 on the second side plate 320 at the same level.

[0156] When the substrate processing apparatus 100 includes a calibration plate 150, the first vision module 133 can be used to measure the interval between the plurality of first alignment marks 210, thereby correcting the positional accuracy error of the inkjet head module 132 when it moves in the first direction 10. At this time, the control unit 140 can also use the first vision module 133 to measure the interval between the plurality of second alignment marks 330, 340 formed on the first side plate 310 or the second side plate 320, thereby correcting not only the movement of the inkjet head module 132 in the first direction 10, but also the movement of the inkjet head module 132 in the second direction 20.

[0157] When the substrate processing apparatus 100 includes a calibration plate 150 and a side plate 160, the calibration plate 150 and the side plate 160 can be configured as fixed on the second tray 125. Then, during the operation of the substrate processing apparatus 100, it is possible to selectively or frequently check whether the measurement of the first vision module 133 and / or the second vision module 134 is abnormal.

[0158] In this embodiment, the substrate processing apparatus 100 can be used to correct the ejection position of the processing liquid ejected by the inkjet head module 132. The substrate processing apparatus 100 can perform the above-mentioned function before performing the printing process on the substrate G using the inkjet head module 132.

[0159] In the case of pixel inkjet technology, to improve the accuracy of the nozzles during printing, the nozzles during printing on the glass substrate can be corrected based on the nozzles measured by the metrology unit (JOF) through pre-printing, thereby improving accuracy. In this case, more than one metrology unit (JOF) can be configured, and more than one vision unit (NJI: Nozzle Jetting Inspection) can also be configured for the metrology unit to measure the nozzles.

[0160] In the Metrology Unit (JOF), three boards can be set at three points (3-point): one calibration board and two side boards. Depending on the situation, only side boards can also be set at two points (2-point). The Metrology Unit (JOF) can use the calibration board and / or side boards arranged in this way to improve the metrological accuracy of the Vision Unit (NJI).

[0161] The side panel may include multiple reference marks. These reference marks formed on the side panel can then be used as absolute reference points for the start of printing. Printing can then proceed after identifying the reference marks on the side panel using the head vision system, ensuring that the printing position reference is always the same.

[0162] The accuracy can be improved by using reference marks on the side plate to correct the deviation between the position printed by the printhead and the position measured by the vision unit (NJI). Specifically, after using reference marks set on both sides of the first vision measurement on the printhead and reference marks set on both sides of the second vision measurement on the vision unit (NJI), a virtual line in the X-axis direction can be generated on the S / W to confirm the deviation between the printhead and the vision unit (NJI), thereby reducing the deviation that may occur when the data measured on the metering unit (JOF) is reflected to the printhead. That is, the measurement accuracy of the vision unit (NJI) can be corrected.

[0163] Furthermore, the position of the prints on the measuring section (JOF) can be confirmed by the scale set on the side panel, so that even if multiple prints are made on the measuring section (JOF), the print position to be measured can be accurately found.

[0164] The calibration plate and side plate may include multiple markings. In this case, the markings formed on the calibration plate and side plate can be composed of markings of the same size as the droplet (e.g., circles with a diameter of 20 μm at 200 μm intervals) at certain intervals, thereby enabling detailed setting and S / W correction of measurement size errors and positional errors that may occur in the first and second vision.

[0165] On the other hand, multiple units of measurement (JOF) can be configured. In this case, the position setting and S / W calibration between multiple units of measurement (JOF) can be performed by marking.

[0166] When a calibration plate is added in addition to the side plates, the positional deviation between the side plates can be corrected in detail. That is, the measurement accuracy can be improved by using the markings on the calibration plate to perform additional corrections for errors generated between the virtual lines (e.g., 200 μm intervals) between the side plates.

[0167] Additionally, positional accuracy errors that occur when the head moves in the X-axis direction can be corrected by measuring the intervals between the marks on the calibration plate.

[0168] In addition, when the calibration plate and side plate are configured to be fixed, the measurement of the vision unit (NJI) can be checked selectively or frequently during operation as needed.

[0169] Additionally, the consistency of the measurement distance of the vision unit (NJI) can be confirmed and corrected by configuring markers at the same intervals on the calibration plate and side plate and verifying that the intervals on the markers are the same.

[0170] Additionally, the consistency of additional settings or corrections can be improved by configuring a mark of the same size as the droplet on the calibration plate and side plate and verifying the deviation from the size measured by the camera of the vision unit (NJI) when measuring the mark.

[0171] Above, refer to Figures 1 to 11 The substrate processing apparatus 100 according to various embodiments of the present invention has been described. The following effects can be obtained according to the present invention.

[0172] First, by using the reference marks on the side plate as absolute reference points for printing, the accuracy of the printing position can be improved.

[0173] Secondly, by using the reference marks on the side plate to correct the deviation between the position printed by the inkjet head and the position measured by the vision unit (NJI), accuracy can be improved.

[0174] The embodiments of the present invention have been described above with reference to the accompanying drawings. However, those skilled in the art will understand that the present invention can be implemented in other specific forms without changing its technical concept or essential features. Therefore, it should be understood that the embodiments described above are exemplary in all respects and not restrictive.

Claims

1. A substrate processing apparatus, comprising: Processing unit, supporting substrate; The inkjet head module sprays processing liquid onto the substrate; The maintenance unit is arranged adjacent to the process unit; as well as The control unit uses the maintenance unit to correct the spray position of the treatment fluid. The maintenance unit includes: The plate is set on the table; A calibration plate is mounted on the disk; A first side plate is disposed on the disk; and The second side plate is disposed on the plate and spaced apart from the first side plate. The control unit uses the first side plate and the second side plate to correct the spray position of the treatment liquid, and The length direction of the calibration plate is different from the length direction of the first side plate and the second side plate.

2. The substrate processing apparatus according to claim 1, wherein, The first side plate and the second side plate are respectively disposed on the outer periphery of the two sides of the disk.

3. The substrate processing apparatus according to claim 1, wherein, The first side plate is arranged parallel to the second side plate.

4. The substrate processing apparatus according to claim 1, wherein, The control unit uses a second alignment mark formed on the first side plate as a printing start point to control the inkjet head module.

5. The substrate processing apparatus according to claim 4, wherein, The control unit uses a second alignment mark formed on the second side plate as the printing endpoint to control the inkjet head module.

6. The substrate processing apparatus according to claim 1, wherein, The control unit uses a second alignment mark formed on the first side plate and a second alignment mark formed on the second side plate to correct the printing position of the inkjet head module.

7. The substrate processing apparatus according to claim 6, further comprising: The first vision module is mounted on the process unit; as well as The second vision module is mounted on the maintenance unit. The control unit uses the measurement results of the first vision module and the second vision module, which are measured by measuring the second alignment mark formed on the first side plate and the second alignment mark formed on the second side plate, to correct the printing position of the inkjet head module.

8. The substrate processing apparatus according to claim 6, wherein, The second alignment mark formed on the first side plate is at the same level as the second alignment mark formed on the second side plate.

9. The substrate processing apparatus according to claim 1, wherein, The calibration plate is disposed in the area between the first side plate and the second side plate.

10. The substrate processing apparatus according to claim 1, wherein, The calibration plate and the first side plate each include a plurality of first alignment marks and a plurality of second alignment marks formed on their surfaces.

11. The substrate processing apparatus according to claim 10, wherein, The plurality of first alignment marks are formed at the same intervals as the plurality of second alignment marks.

12. The substrate processing apparatus according to claim 10, wherein, The plurality of first alignment marks and / or the plurality of second alignment marks have the same size as the processing liquid sprayed onto the substrate.

13. The substrate processing apparatus according to claim 1, wherein, The control unit uses the calibration plate to correct the positional deviation between the first side plate and the second side plate.

14. The substrate processing apparatus according to claim 1, wherein, The control unit controls the movement of the inkjet head module by using the spacing between a plurality of first alignment marks formed on the calibration plate.

15. The substrate processing apparatus according to claim 1, wherein, At least one of the calibration plate, the first side plate, and the second side plate is fixed to the disk.

16. The substrate processing apparatus according to claim 1, wherein, The substrate processing apparatus operates before printing the substrate.

17. A substrate processing apparatus, comprising: Processing unit, supporting substrate; The inkjet head module sprays processing liquid onto the substrate; The maintenance unit is arranged adjacent to the process unit; as well as The control unit uses the maintenance unit to correct the spray position of the treatment fluid. The maintenance unit includes: The plate is set on the table; A first side plate is disposed on the disk; A second side plate is disposed on the disk and spaced apart from the first side plate; and A calibration plate is disposed on the disk and spaced apart from the first side plate and the second side plate. The length direction of the calibration plate is different from the length direction of the first side plate and the second side plate.

18. A maintenance unit, disposed adjacent to a process unit of a support substrate, and comprising: The plate is set on the table; A calibration plate is mounted on the disk; A first side plate is disposed on the disk; as well as The second side plate is disposed on the plate and spaced apart from the first side plate. The first side plate and the second side plate are used to correct the spray position of the processing liquid sprayed onto the substrate, and The length direction of the calibration plate is different from the length direction of the first side plate and the second side plate.

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