An integrated crystal resonator

Abstract

The application provides an integrated crystal resonator, which comprises a base, a welding assembly, a fixed chassis, a movable connecting assembly, a lower circuit board, an upper circuit board, a circuit board connecting support assembly, an oscillation circuit, a comprehensive support mechanism, a quartz wafer, a heat dissipation mechanism and a shell. The oscillation circuit is integrated in the crystal oscillator, and a double-layer circuit board is arranged in the crystal oscillator in a mode of integrating a capacitor in the comprehensive support mechanism, so that the frequency of the whole crystal oscillator on the circuit board is stabilized, the area of the whole crystal oscillator on the circuit board is reduced, the heat dissipation mechanism is arranged in the shell, the surrounding of the quartz wafer is cooled by a physical method, the base welded on the circuit board can be detached from other parts of the crystal resonator, so that the crystal oscillator is convenient to replace, and the welding size diversity of the crystal oscillator is met.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of electronic components, in particular to an integrated crystal resonator. BACKGROUND

[0002] With the continuous progress of science and technology, various integrated circuit technologies closely related to people's lives have also developed rapidly, and information communication equipment, Internet hardware, various types of computers, positioning and navigation systems, broadcast television systems, household electronic appliances, digital instruments and meters, and other equipment have gradually entered the industrial control field and people's daily life. Quartz crystal oscillators, due to their low noise and high frequency stability, can be used as standard frequency sources or pulse signal sources, and are one of the key modules that cannot be replaced in current integrated circuit equipment. Miniaturization, low noise, and high frequency stability are the requirements for quartz crystal oscillators.

[0003] The piezoelectric quartz crystal resonator and the manufacturing method thereof provided in CN104283524B arrange the quartz crystal resonator and the thermistor on the circuit board, and then use resin injection molding, so that the quartz crystal resonator has an independent cavity, avoiding pollution of the thermistor to the quartz crystal resonator, and meeting the demand for higher frequency stability. This is also the common structure of the crystal resonator at present, but the existing crystal resonator still has the following deficiencies: 1. The existing quartz crystal only encapsulates a quartz wafer, and needs an external oscillation circuit when in use. Due to the different structures of various circuits, the same crystal oscillator will cause different effects when in use. The existing crystal resonator is limited in size, either cannot integrate the oscillation circuit inside, or is manufactured to be relatively large in size; 2. The quartz wafer is greatly affected by the surrounding temperature when working, and the increase of temperature will cause the wafer to deform, affecting the accuracy of the frequency. Therefore, in order to ensure the work of the quartz wafer, some temperature-controlled crystal oscillators have gradually appeared, but these crystal oscillators are active, causing a large size. For passive crystal oscillators, there is currently still a lack of corresponding heat dissipation scheme; 3. The existing crystal oscillator is of an integrated structure, and needs to be replaced when damaged. For some crystal oscillators welded on the circuit board, it is difficult to replace. In addition, the pin pitch of various circuit boards usually differs, which causes the same crystal oscillator to need to be produced in multiple pin pitches, and the versatility of the crystal oscillator is poor, which increases the production cost. SUMMARY

[0004] The present application aims to provide an integrated crystal resonator to solve the problems in the background art.

[0005] To achieve the above-mentioned purpose, the present application provides the following technical solutions:

[0006] An integrated crystal resonator comprises a base, a welding assembly, a fixed base plate, a movable connecting assembly, a lower circuit board, an upper circuit board, a circuit board connecting support assembly, an oscillation circuit, a comprehensive support mechanism, a quartz wafer, a heat dissipation mechanism and a shell, wherein:

[0007] The welding assembly is mounted on the base for welding the crystal resonator on the circuit board to be installed. The fixed base plate is detachably fixed in the base. The movable connecting assembly is fixed in the fixed base plate. The lower end of the movable connecting assembly is in contact with the welding assembly, and the upper end is welded with the lower circuit board to form an electric circuit between the lower circuit board and the welding assembly. The lower end of the fixed base plate is fixed with the lower circuit board. The circuit board connecting support assembly is fixed on the lower circuit board. The upper end of the circuit board connecting support assembly is fixed with the upper circuit board. The lower circuit board and the upper circuit board are electrically connected through the circuit board connecting support assembly. The lower circuit board and the upper circuit board are printed with the oscillation circuit. Two comprehensive support mechanisms are welded on the lower circuit board. The upper end of the comprehensive support mechanism penetrates through the two electrode connections of the upper circuit board and the quartz wafer to form two sets of capacitors and a main oscillation circuit structure with the quartz wafer inside. The oscillation circuit is used for detecting the amplitude of the quartz wafer and stabilizing it. The shell is mounted on the upper end of the fixed base plate. The heat dissipation mechanism is fixed on the inner wall of the shell.

[0008] Preferably, the base comprises a seat body and a fixing buckle. The middle part of the seat body is provided with a groove matched with the shape of the fixed base plate. The welding assembly comprises a lower contact point and a welding lead. The lower contact point is fixed in the middle part of the upper end face of the groove of the seat body. The upper end of the welding lead is electrically connected with the lower contact point, and the lower end penetrates through the seat body. The fixing buckle is mounted on the inner wall around the groove of the seat body. The outer wall of the fixed base plate is provided with a clamping groove matched with the shape of the fixing buckle.

[0009] Preferably, the fixed base plate comprises a disc body and a shock absorbing ring. The middle part of the disc body is provided with a containing groove. The shock absorbing ring is mounted in the containing groove. The movable connecting assembly comprises a fixed welding seat, a glass insulator, an electrode column and an upper contact point. The middle part of the disc body is provided with the fixed welding seat. The glass insulator is fixed in the disc body at the lower end of the fixed welding seat. The upper contact point is fixed on the lower end face of the disc body. The electrode column penetrates through the glass insulator, and the upper end is electrically connected with the fixed welding seat, and the lower end is electrically connected with the upper contact point. The lower circuit board is welded on the fixed welding seat. The positions of the upper contact point and the lower contact point correspond.

[0010] Preferably, the circuit board connecting support assembly is composed of connecting welding seats, fixing seats, an insulating support column and a connecting conductive column, the upper end surface of the lower circuit board and the lower end surface of the upper circuit board are provided with corresponding connecting welding seats, a circle of fixing seats is arranged around the connecting welding seats, the upper and lower ends of the insulating support column are clamped in the two fixing seats, the connecting conductive column is arranged in the insulating support column, and the upper and lower ends of the connecting conductive column are welded on the connecting welding seats of the lower circuit board and the upper circuit board respectively.

[0011] Preferably, the comprehensive support mechanism is composed of a support spring sheet, an auxiliary spring sheet, a capacitor medium, a capacitor shell and a conductive support frame, the lower ends of the support spring sheet and the auxiliary spring sheet are welded on the lower circuit board, the support spring sheet and the auxiliary spring sheet support the capacitor medium, the support spring sheet and the auxiliary spring sheet are wrapped with the capacitor shell, and the upper end of the support spring sheet is fixed with the conductive support frame, and the electrode of the quartz crystal wafer is fixed on the conductive support frame through conductive glue.

[0012] Preferably, the heat dissipation mechanism is composed of a heat equalizing cavity, a heat dissipation cavity and a heat dissipation plate, the heat equalizing cavity and the heat dissipation cavity are internally communicated, the heat equalizing cavity and the heat dissipation cavity are both filled with cooling liquid, the upper end surface of the heat dissipation cavity is uniformly provided with multiple groups of longitudinal and transverse staggered heat dissipation plates, the heat equalizing cavity is fixed on the inner side wall of the shell and is uniformly distributed around the quartz crystal wafer, and a layer of heat insulation plate is adhered on the side surface of the lower end of the heat dissipation cavity close to the quartz crystal wafer.

[0013] Preferably, the oscillation circuit comprises a Pierce oscillation circuit, an amplitude detection circuit and a start-up bias circuit, the Pierce oscillation circuit and the comprehensive support mechanism are electrically connected, are used for cooperating with the quartz crystal wafer to generate an oscillation signal, the amplitude detection circuit and the Pierce oscillation circuit are electrically connected, are used for detecting the amplitude change of the quartz crystal wafer and limiting the amplitude to ensure that the state of the amplitude is stable, and the start-up bias circuit is used for providing start-up current and bias current for the Pierce oscillation circuit and the amplitude detection circuit so that the Pierce oscillation circuit and the amplitude detection circuit can work.

[0014] Preferably, the Pierce oscillation circuit, the amplitude detection circuit and the start-up bias circuit are all based on transistors.

[0015] Preferably, the quartz crystal wafer adopts a circular metal thin film electrode, and a long strip-shaped metal film with a different expansion coefficient is attached to the surface of the circular metal thin film electrode.

[0016] Compared with the prior art, the present application has the following beneficial effects:

[0017] 1. The present invention integrates an oscillation circuit inside the crystal oscillator, and creatively constructs an oscillation circuit by integrating a capacitor inside the integrated support mechanism and setting up a double-layer circuit board inside the crystal oscillator. This not only stabilizes the frequency occupied by the entire crystal oscillator on the circuit board, but also reduces the area occupied by the entire crystal oscillator on the circuit board.

[0018] 2. The present invention has a heat dissipation mechanism inside the shell, which uses physical methods to dissipate heat around the quartz crystal without the need for additional external circuitry, thereby improving the heat dissipation capacity of the entire crystal oscillator and reducing the impact of high temperature on the crystal oscillator.

[0019] 3. The base soldered onto the circuit board in this invention is detachable from other parts of the crystal resonator, which makes it very convenient to replace the crystal oscillator. Moreover, in order to meet the diversity of crystal oscillator soldering dimensions, only different bases need to be produced, while other parts can remain the same, which is convenient for production and can reduce production costs. Attached Figure Description

[0020] Figure 1 This is a schematic diagram of the overall exploded structure of the present invention;

[0021] Figure 2 This is a schematic diagram of the overall cross-sectional structure of the present invention;

[0022] Figure 3 This is a cross-sectional structural diagram of the base in this invention;

[0023] Figure 4 This is a schematic cross-sectional view of the fixed chassis in this invention;

[0024] Figure 5 This is a schematic diagram of the connection structure between the lower circuit board and the upper circuit board in this invention;

[0025] Figure 6 This is an enlarged structural diagram of point A in this invention;

[0026] Figure 7 This is a cross-sectional structural diagram of the integrated support mechanism in this invention;

[0027] Figure 8 This is a schematic diagram of the structure of the metal film in this invention;

[0028] Figure 9 This is a cross-sectional structural diagram of the heat dissipation mechanism in this invention;

[0029] Figure 10 This is a circuit diagram of the oscillation circuit in this invention.

[0030] In the figure: 1 base, 101 seat body, 102 fixed buckle, 2 welding assembly, 201 lower contact, 202 welding lead, 3 fixed chassis, 301 disc body, 302 shock ring, 31 containing groove, 4 movable connection assembly, 401 fixed welding seat, 402 glass insulator, 403 electrode column, 404 upper contact, 5 lower circuit board, 6 upper circuit board, 7 circuit board connecting support assembly, 701 connecting welding seat, 702 fixed seat, 703 insulating support column, 704 connecting conductive column, 8 oscillation circuit, 801 Pierce oscillation circuit, 802 amplitude detection circuit, 803 start bias circuit, 9 comprehensive support mechanism, 901 support spring piece, 902 auxiliary spring piece, 903 capacitor dielectric, 904 capacitor shell, 905 conductive support frame, 10 quartz wafer, 11 heat dissipation mechanism, 1101 heat equalizing cavity, 1102 heat dissipation cavity, 1103 heat dissipation plate, 12 housing, 13 metal film. DETAILED DESCRIPTION

[0031] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work fall within the scope of protection of the present application.

[0032] Embodiment:

[0033] Please refer to Figures 1 to 10 The present application provides a technical solution:

[0034] An integrated crystal resonator comprises a base 1, a welding assembly 2, a fixed chassis 3, a movable connection assembly 4, a lower circuit board 5, an upper circuit board 6, a circuit board connecting support assembly 7, an oscillation circuit 8, a comprehensive support mechanism 9, a quartz wafer 10, a heat dissipation mechanism 11 and a housing 12, wherein:

[0035] The base 1 is provided with a welding assembly 2, the base 1 comprises a seat body 101 and a fixing buckle 102, the seat body 101 is provided with a groove matching the shape of the fixing base plate 3 in the middle, the welding assembly 2 comprises a lower contact 201 and a welding lead 202, the lower contact 201 is fixed in the middle of the upper end face of the groove of the seat body 101, the upper end of the welding lead 202 is electrically connected with the lower contact 201, and the lower end penetrates through the seat body 101, the fixing buckle 102 is arranged on the inner side wall of the groove of the seat body 101, the outer side wall of the fixing base plate 3 is provided with a clamping groove matching the shape of the fixing buckle 102, the positions of the fixing buckle 102 and the clamping groove are matched, the fixing base plate 3 can be fixed and conveniently disassembled, so that other parts of the crystal oscillator can be disassembled from the base 1, which is very convenient when replacing the crystal oscillator, and in order to meet the diversity of the welding size of the crystal oscillator, only different bases 1 need to be produced, other parts can remain unchanged, production is facilitated, and the production cost can be reduced, in use, the welding lead 202 is welded on the circuit board, so that the crystal resonator is welded on the circuit board to be installed.

[0036] The fixing base plate 3 is detachably fixed in the base 1, the fixing base plate 3 is fixed with a movable connecting assembly 4, the fixing base plate 3 comprises a disc body 301 and a damping ring 302, the middle of the disc body 301 is provided with a containing groove 31, the damping ring 302 is arranged in the containing groove 31, the lower circuit board 5 is fixed on the disc body 301, and the damping ring 302 can play a good damping effect on the lower circuit board 5, and the vibration resistance of the entire crystal oscillator is enhanced, the movable connecting assembly 4 is in contact with the welding assembly 2 at the lower end and is welded with the lower circuit board 5 at the upper end, and is used for forming an electrical circuit between the lower circuit board 5 and the welding assembly 2, the movable connecting assembly 4 comprises a fixed welding seat 401, a glass insulator 402, an electrode column 403 and an upper contact 404, the middle of the disc body 301 is provided with the fixed welding seat 401, the glass insulator 402 is fixed in the disc body 301 at the lower end of the fixed welding seat 401, the disc body 301 is fixed with the upper contact 404 at the lower end face, the electrode column 403 penetrates through the glass insulator 402, and the upper end is electrically connected with the fixed welding seat 401, and the lower end is electrically connected with the upper contact 404, the lower circuit board 5 is welded on the fixed welding seat 401, and the upper contact 404 and the lower contact 201 are in position correspondence, so that the upper contact 404 and the lower contact 201 are in contact when the fixing base plate 3 is installed on the base 1, and can conduct electricity, and electrical conduction is completed.

[0037] The lower circuit board 5 is fixed on the upper end of the fixed chassis 3, the upper circuit board 6 is fixed on the upper end of the circuit board connecting support assembly 7 fixed on the lower circuit board 5, the lower circuit board 5 and the upper circuit board 6 are electrically connected through the circuit board connecting support assembly 7, the circuit board connecting support assembly 7 is composed of a connecting welding seat 701, a fixed seat 702, an insulating support column 703 and a connecting conductive column 704, the connecting welding seat 701 is arranged on the upper end surface of the lower circuit board 5 and the lower end surface of the upper circuit board 6, a circle of fixed seats 702 is arranged around the connecting welding seat 701, the insulating support column 703 is clamped on the two fixed seats 702 at the upper and lower ends, the fixed seat 702 plays a good fixed supporting role on the insulating support column 703, the connecting conductive column 704 is arranged in the insulating support column 703, the insulating support column 703 plays a supporting role on the upper circuit board 6 and can wrap the connecting conductive column 704 to play an insulating role, the connecting conductive column 704 is welded on the connecting welding seat 701 of the lower circuit board 5 and the upper circuit board 6 at the upper and lower ends, and the lower circuit board 5 and the upper circuit board 6 are electrically connected through the connecting conductive column 704.

[0038] Two comprehensive support mechanisms 9 are welded on the lower circuit board 5, the two electrodes of the comprehensive support mechanism 9 penetrate through the upper circuit board 6 and the quartz crystal wafer 10 at the upper end, which is used to build two groups of capacitors in the internal structure and the quartz crystal wafer 10 to form a main oscillation circuit structure, the comprehensive support mechanism 9 is composed of a support spring sheet 901, an auxiliary spring sheet 902, a capacitor dielectric 903, a capacitor shell 904 and a conductive support frame 905, the lower ends of the support spring sheet 901 and the auxiliary spring sheet 902 are welded on the lower circuit board 5, the lower end of the auxiliary spring sheet 902 is welded on the ground end of the lower circuit board 5, the support spring sheet 901 and the auxiliary spring sheet 902 clamp the capacitor dielectric 903, the support spring sheet 901 and the auxiliary spring sheet 902 are wrapped with the capacitor shell 904, the upper end of the support spring sheet 901 is fixed with the conductive support frame 905, the electrodes of the quartz crystal wafer 10 are fixed on the conductive support frame 905 through conductive glue, the support spring sheet 901, the auxiliary spring sheet 902, the capacitor dielectric 903 and the capacitor shell 904 constitute a capacitor structure, and the capacitor structure and the quartz crystal wafer 10 together constitute Figure 10 The main oscillation circuit structure outside the oscillation circuit 8 shown.

[0039] The oscillation circuit 8 is used to detect and stabilize the amplitude of the quartz crystal 10. The lower circuit board 5 and the upper circuit board 6 are printed and soldered with the oscillation circuit 8. The oscillation circuit 8 includes a Pierce oscillation circuit 801, an amplitude detection circuit 802, and a start-up bias circuit 803. The Pierce oscillation circuit 801 is electrically connected to the integrated support mechanism 9 to cooperate with the quartz crystal 10 to generate an oscillation signal. The amplitude detection circuit 802 is electrically connected to the Pierce oscillation circuit 801 to detect amplitude changes in the quartz crystal 10 and limit the amplitude to ensure its amplitude stability. The start-up bias circuit 803 provides start-up current and bias current to the Pierce oscillation circuit 801 and the amplitude detection circuit 802 to enable their operation. The Pierce oscillation circuit 801, the amplitude detection circuit 802, and the start-up bias circuit 803 are all based on transistors. The specific circuit structure of the oscillation circuit 8 is as follows: Figure 10 As shown, Figure 7 As shown, the main oscillation circuit is connected across the two ports of oscillation circuit 8, forming a crystal oscillation structure together with transistor M1 and external capacitors. M2 and R2 form the amplitude detection circuit; capacitors C3 and C4 and resistor R3 form a π-type filter network; M5, M6, and M7 form a current mirror to provide bias current to the circuit; M4 and R5 form a startup circuit to provide startup current; M8, M9, and M10 are digital control transistors, whose switching determines the circuit's operating state. The oscillation circuit operates as follows: when the circuit is first powered on, M4... The circuit is turned on, providing the initial operating current to the current mirror. M1, the quartz crystal 10 connected between the main oscillation circuit structure, and the parallel capacitor constitute the feedback circuit structure. The circuit parameters are set to meet the Barkhausen criterion, and the circuit will start oscillating. As time goes by, under the action of positive feedback, the amplitude of the circuit will gradually increase. M2 and R2 detect the amplitude change and transmit it to the gate terminal of M3. Through the limitation of the gate voltage of M3, the currents of M5, M6 and M7 eventually remain at a stable value. At the same time, the oscillation state of the circuit is stable, and the output oscillation signal has a stable amplitude.

[0040] The present invention integrates an oscillation circuit 8 inside the crystal oscillator, and creatively constructs an oscillation circuit 8 by integrating a capacitor inside the integrated support mechanism 9 and setting up a double-layer circuit board inside the crystal oscillator. This not only stabilizes the frequency occupied by the entire crystal oscillator on the circuit board, but also reduces the area occupied by the entire crystal oscillator on the circuit board.

[0041] The upper end of the fixed base plate 3 is provided with a shell 12, and the inner side wall of the shell 12 is fixed with a heat dissipation mechanism 11, which is composed of a heat equalizing cavity 1101, a heat dissipation cavity 1102 and a heat dissipation plate 1103, the heat equalizing cavity 1101 and the heat dissipation cavity 1102 are in communication, the heat equalizing cavity 1101 and the heat dissipation cavity 1102 are filled with cooling liquid, the upper end surface of the heat dissipation cavity 1102 is uniformly provided with a plurality of groups of longitudinal and transverse staggered heat dissipation plates 1103, the heat equalizing cavity 1101 is fixed on the inner side wall of the shell 12 and is uniformly distributed around the quartz crystal wafer 10, and a layer of heat insulation plate is adhered to the side surface of the lower end of the heat dissipation cavity 1102 close to the quartz crystal wafer 10, when the temperature around the quartz crystal wafer 10 is high, the cooling liquid in the heat equalizing cavity 1101 absorbs heat and vaporizes, moves to the upper end of the heat dissipation cavity 1102, liquefies and discharges heat, so as to reduce the temperature around the quartz crystal wafer 10, the upper end of the heat dissipation plate 1103 closely contacts the inner side wall of the shell 12, and the heat dissipation plate 1103 and the entire shell are used for heat dissipation, so that the heat dissipation effect is improved, the heat insulation plate can prevent the heat dissipation from affecting the quartz crystal wafer 10, the physical method is completely used for heat dissipation around the quartz crystal wafer 10, and no additional external circuit is needed to support, so that the heat dissipation capacity of the entire crystal oscillator is improved, and the influence of high temperature on the crystal oscillator is reduced.

[0042] The quartz crystal wafer 10 adopts a circular metal thin film electrode, and a long strip-shaped metal film 13 with different expansion coefficients is attached to the surface of the circular metal thin film electrode, when the temperature changes, due to the different expansion coefficients of the two metals, the strip-shaped metal film 13 will generate stress on the lower layer of the circular thin film electrode, and due to the close combination of the welding surfaces and the force transmission effect, the stress will be finally directly applied to the quartz crystal wafer 10 for stress compensation, and the influence of temperature on the deformation of the quartz crystal wafer 10 is reduced.

[0043] The use principle of the present application is as follows:

[0044] Before use, the welding lead 202 below the base 1 is welded and fixed on the circuit board required to be used, and then other parts of the crystal oscillator are combined with the base 1 through the clamping groove and the fixed buckle 102 on the outer side wall of the base plate 3.

[0045] In use, the circuit board makes the quartz crystal wafer 10 oscillate through the capacitor structure formed by the oscillation circuit 8 and the comprehensive support mechanism 9, and stable oscillation output is generated, when the temperature around the quartz crystal wafer 10 is high, the cooling liquid in the heat equalizing cavity 1101 absorbs heat and vaporizes, moves to the upper end of the heat dissipation cavity 1102, liquefies and discharges heat, so as to reduce the temperature around the quartz crystal wafer 10, and at the same time, the strip-shaped metal film 13 will generate stress on the lower layer of the circular thin film electrode, and the stress will be finally directly applied to the quartz crystal wafer 10 for stress compensation, and the influence of temperature on the deformation of the quartz crystal wafer 10 is reduced.

[0046] When the maintenance crystal oscillator needs to be replaced, the bottom plate 3 is directly taken off from the base 1, and other new parts are replaced, without the need to replace the base.

[0047] While embodiments of the application have been shown and described, it is to be understood that the embodiments described are merely divergences of the principles and spirit of the application and that numerous modifications, changes, substitutions, and alterations can be made thereto without departing from the spirit and scope of the application as defined by the appended claims and their equivalents.

Claims

1. An integrated crystal resonator, comprising a base (1), a welding assembly (2), a fixed chassis (3), a movable connection assembly (4), a lower circuit board (5), an upper circuit board (6), a circuit board connection support assembly (7), an oscillation circuit (8), a comprehensive support mechanism (9), a quartz crystal (10), a heat dissipation mechanism (11), and a housing (12), characterized in that: A welding assembly (2) is installed on the base (1) for welding the crystal resonator to the circuit board to be installed. The fixed chassis (3) is detachably fixed inside the base (1). A movable connecting assembly (4) is fixed inside the fixed chassis (3). The lower end of the movable connecting assembly (4) contacts the welding assembly (2), and the upper end is welded to the lower circuit board (5) to form an electrical circuit between the lower circuit board (5) and the welding assembly (2). The lower circuit board (5) is fixed at the upper end of the fixed chassis (3). A circuit board connecting support assembly (7) is fixed on the lower circuit board (5). An upper circuit board (6) is fixed at the upper end of the circuit board connecting support assembly (7). The lower circuit board (6) is fixed at the upper end of the circuit board connecting support assembly (7). 5) and the upper circuit board (6) are electrically connected through the circuit board connection support assembly (7). The lower circuit board (5) and the upper circuit board (6) are printed and soldered with an oscillation circuit (8). Two integrated support mechanisms (9) are soldered on the lower circuit board (5). The upper end of the integrated support mechanism (9) passes through the two electrodes of the upper circuit board (6) and the quartz crystal (10) and is used to build two sets of capacitors and the quartz crystal (10) to form the main oscillation circuit structure. The oscillation circuit (8) is used to detect the amplitude of the quartz crystal (10) and stabilize it. The upper end of the fixed chassis (3) is equipped with a shell (12). The inner side wall of the shell (12) is fixed with a heat dissipation mechanism (11).

2. An integrated crystal resonator according to claim 1, characterized in that: The base (1) includes a seat body (101) and a fixing buckle (102). The seat body (101) has a groove in the middle that matches the shape of the fixing chassis (3). The welding assembly (2) includes a lower contact (201) and a welding lead (202). The lower contact (201) is fixed in the middle of the upper end face of the groove of the seat body (101). The upper end of the welding lead (202) is electrically connected to the lower contact (201), and the lower end passes through the seat body (101). The fixing buckle (102) is installed on the inner side wall of the groove of the seat body (101). The outer side wall of the fixing chassis (3) has a slot that matches the shape of the fixing buckle (102).

3. An integrated crystal resonator according to claim 2, characterized in that: The fixed chassis (3) includes a chassis body (301) and a shock-absorbing ring (302). A receiving groove (31) is provided in the middle of the chassis body (301), and the shock-absorbing ring (302) is installed inside the receiving groove (31). The movable connection assembly (4) includes a fixed welding seat (401), a glass insulator (402), an electrode post (403), and an upper contact (404). The fixed welding seat (401) is provided in the middle of the chassis body (301), and the fixed welding... A glass insulator (402) is fixed inside the disc (301) at the lower end of the base (401). An upper contact (404) is fixed on the lower end face of the disc (301). The electrode post (403) passes through the glass insulator (402) and is electrically connected to the fixed welding base (401) at its upper end and to the upper contact (404) at its lower end. The lower circuit board (5) is welded to the fixed welding base (401). The upper contact (404) and the lower contact (201) are in corresponding positions.

4. An integrated crystal resonator according to claim 1, characterized in that: The circuit board connection support assembly (7) consists of a connection welding seat (701), a fixing seat (702), an insulating support column (703), and a connection conductive column (704). The upper end surface of the lower circuit board (5) and the lower end surface of the upper circuit board (6) are respectively provided with connection welding seats (701). A ring of fixing seats (702) is provided around the connection welding seat (701). The upper and lower ends of the insulating support column (703) are locked on the two fixing seats (702). The insulating support column (703) is provided with a connection conductive column (704) inside. The upper and lower ends of the connection conductive column (704) are respectively welded to the connection welding seats (701) of the lower circuit board (5) and the upper circuit board (6).

5. An integrated crystal resonator according to claim 1, characterized in that: The integrated support mechanism (9) consists of a support spring plate (901), an auxiliary spring plate (902), a capacitor dielectric (903), a capacitor shell (904), and a conductive support frame (905). The lower ends of the support spring plate (901) and the auxiliary spring plate (902) are welded to the lower circuit board (5), and the lower end of the auxiliary spring plate (902) is welded to the grounding terminal of the lower circuit board (5). The support spring plate (901) and the auxiliary spring plate (902) support the capacitor dielectric (903). The support spring plate (901) and the auxiliary spring plate (902) are wrapped with a capacitor shell (904). The upper end of the support spring plate (901) is fixed with a conductive support frame (905). The electrodes of the quartz wafer (10) are fixed to the conductive support frame (905) with conductive adhesive.

6. An integrated crystal resonator according to claim 1, characterized in that: The heat dissipation mechanism (11) consists of a heat dissipation cavity (1101), a heat dissipation cavity (1102), and a heat dissipation plate (1103). The heat dissipation cavity (1101) and the heat dissipation cavity (1102) are internally connected. Both the heat dissipation cavity (1101) and the heat dissipation cavity (1102) are filled with coolant. Multiple sets of crisscrossing heat dissipation plates (1103) are evenly arranged on the upper end surface of the heat dissipation cavity (1102). The heat dissipation cavity (1101) is fixed on the inner side wall of the outer shell (12) and is evenly distributed around the quartz crystal (10). A heat insulation plate is adhered to the lower end of the heat dissipation cavity (1102) near the side of the quartz crystal (10).

7. An integrated crystal resonator according to claim 1, characterized in that: The oscillation circuit (8) includes a Pierce oscillation circuit (801), an amplitude detection circuit (802), and a start-up bias circuit (803). The Pierce oscillation circuit (801) is electrically connected to the integrated support mechanism (9) and is used to cooperate with the quartz crystal (10) to generate an oscillation signal. The amplitude detection circuit (802) is electrically connected to the Pierce oscillation circuit (801) and is used to detect the amplitude change of the quartz crystal (10) and limit the amplitude to ensure that its amplitude is stable. The start-up bias circuit (803) is used to provide start-up current and bias current to the Pierce oscillation circuit (801) and the amplitude detection circuit (802) so that they can work.

8. An integrated crystal resonator according to claim 7, characterized in that: The Pierce oscillator circuit (801), amplitude detection circuit (802), and start-up bias circuit (803) are all based on transistors.

9. An integrated crystal resonator according to claim 1, characterized in that: The quartz wafer (10) uses a circular metal thin film electrode, and a strip-shaped metal film (13) with a different coefficient of thermal expansion is attached to the surface of the circular metal thin film electrode.

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