Method of manufacturing components for an ion optical device

Abstract

A method of manufacturing an assembly of an ion-optical device, the assembly comprising aligned first and second electrode sets. A first material is machined to provide a partially machined first electrode set, the partially machined first electrode set comprising the first electrode set attached to a frame portion of the first material. A second material is machined to provide a partially machined second electrode set, the partially machined second electrode set comprising the second electrode set attached to a frame portion of the second material. The assembly of the ion-optical device is assembled by aligning the partially machined first and second electrode sets. After aligning the partially machined first and second electrode sets, the partially machined first electrode set is further machined to separate the first electrode set from the frame portion of the first material, and the partially machined second electrode set is further machined to separate the second electrode set from the frame portion of the second material.

Description

Technical Field

[0001] The present disclosure relates to a method for manufacturing a component of an ion optical device, in particular a component of an ion optical device for use in a mass spectrometer. Background Art

[0002] Ion optics use electric and magnetic fields to control the formation, focusing, and deflection of an ion beam. Ion optics can include ion guides, ion storage devices, ion deflectors, ion analyzers, and other ion manipulation devices known in the art. Ion guides are used to transport ions. For example, in mass spectrometry, ion guides can be used to transport ions from an ion source to an ion analyzer.

[0003] US 7,829,850 describes a branched radio frequency (RF) multipole configured to act as an ion guide. The branched multipole includes a plurality of ion channels through which ions can be alternately guided. The branched multipole is configured to control which multipole ion channels guide ions by applying an RF potential.

[0004] GB 2392005 relates to a mass spectrometer ion guide comprising a plurality of plate electrodes, an upper plate electrode and a lower plate electrode, arranged in a plane in which ions travel. One or more channels are formed in the plate electrodes, so that an ion guide region is formed in the ion guide.

[0005] WO 2017 / 194974 relates to an ion guide comprising a plurality of axially stacked plates, each plate comprising a pair of interleaved electrodes. The electrodes are mounted in a housing to hold the electrodes in their axial position.

[0006] Conventional methods for manufacturing ion guides, such as those discussed above, involve machining individual components (e.g., by milling or etching) and mounting them together using conventional alignment elements such as pins. Using these methods, it is difficult to reliably align the components with high accuracy or provide consistent, controlled conditions when using such ion guides as part of analytical instruments.

[0007] Therefore, there is a need for a method for manufacturing components for ion optical devices that overcomes these problems. Summary of the Invention

[0008] According to the present disclosure, a method of manufacturing a component of an ion-optical device is provided.

[0009] The method advantageously includes an initial step of machining the material to provide a partially machined electrode group prior to aligning the electrode groups of the assembly, the partially machined electrode group comprising the electrode group attached to a frame portion of the material. Following the step of aligning the electrode groups, a further step of machining the partially machined electrode group separates the electrode group from the frame portion of the material.

[0010] Performing the steps in this order advantageously allows the electrode groups to be aligned with high accuracy and consistency. The methods disclosed herein can allow assemblies to be constructed with an accuracy of ±25 μm for size, flatness, and parallelism. In addition, more complex assemblies (e.g., involving a greater number of electrode groups or including electrode groups with complex shapes that are more difficult to align using conventional methods) can be manufactured while maintaining the aforementioned high accuracy and consistency. This high accuracy and consistency also allows for consistent controlled conditions to be maintained in analytical instruments.

[0011] Preferably, the further machining steps are performed simultaneously.Thereby a high accuracy and consistency of the alignment of the electrode groups can be maintained.

[0012] Preferably, the machining and / or further machining steps are performed by wire etching. Wire etching advantageously allows accurate machining of electrode groups that may have complex shapes. When the machining and / or further machining steps are performed by wire etching, the wire used for the wire etching has a cutting direction in which the machining cut occurs, and the wire preferably makes an angle of no more than 15 degrees with a plane perpendicular to the cutting direction. This allows the edge of the electrode group to be tilted at a small angle. Optionally, the angle is 0 degrees. The edge of the electrode group can thus be planar.

[0013] Optionally, the first electrode set includes a first electrode. Optionally, the first electrode set includes a first plurality of electrodes. Where the first electrode set includes a first plurality of electrodes, highly accurate and consistent alignment between many electrodes, which may have complex shapes or configurations, may be difficult to consistently achieve this level of accuracy using conventional methods.

[0014] Optionally, the second electrode group comprises a second electrode. Optionally, the second electrode group comprises a second plurality of electrodes. The same advantages as described with respect to the first plurality of electrodes may be provided.

[0015] Preferably, the step of machining the first material comprises machining formed features to provide a segmented electrode set after a further machining step. In this way, more complex electrode sets can be provided while maintaining the high accuracy alignment of the electrode sets that can be provided by the disclosure herein.

[0016] Preferably, the step of machining the second material includes machining formed features to provide a segmented electrode set after a further machining step. Thus, more complex electrode sets can be provided while maintaining the high accuracy alignment provided by the disclosure herein. Machining the second material to provide formed features can be in addition to or in lieu of machining the first material to provide formed features.

[0017] Preferably, the first material and the second material are the same material.

[0018] Preferably, the component of the ion optical device is an ion guide or an ion deflector. Optionally, the ion guide is more particularly a Y-shaped multipole. Other ion guide types may be provided.

[0019] Preferably, pins and / or guide pins are used to align the partially machined first and second electrode sets. This allows the electrode sets to be conveniently aligned with a high degree of accuracy.

[0020] Preferably, guide holes for the pins and / or guide pins are provided during the machining step. Machining the guide holes during the machining step allows the electrode groups to be aligned with high accuracy and consistency during the aligning step.

[0021] Preferably, the further machining step comprises machining external alignment features for aligning the assembly with an external holder. Advantageously, the external alignment features can allow the assembly to be aligned with the external holder with greater accuracy than using conventional methods. The external holder can be, for example, an ion optics table or a chamber system. Typically, alignment with the external holder is accomplished using additional guide pins and / or supports, which adds an additional step that can reduce the accuracy of the alignment. The accuracy of the alignment disclosed herein can be ±0.01 mm.

[0022] Optionally, before assembling the assembly, the first electrode set is glued to a printed circuit board (PCB); and / or the second electrode set is glued to a PCB. This allows the PCB to be well aligned with the electrode set, thereby improving the alignment of the final assembly. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] The invention can be practiced in various ways and embodiments will now be described by way of example only and with reference to the following drawings, in which:

[0024] Figure 1 shows a perspective view of a partially machined electrode assembly for an ion guide according to the present disclosure;

[0025] Figure 2shows a perspective view of an aligned, partially machined electrode set manufactured in accordance with the present disclosure;

[0026] Figure 3 Shown Figure 2 Exploded view of the ion guide in Figure 1;

[0027] Figure 4 shows a perspective view of a partially machined electrode assembly for an ion deflector;

[0028] Figure 5 shows a perspective view of an ion deflector made in accordance with the present disclosure;

[0029] Figure 6 Shown Figure 5 Exploded view of the ion deflector in Figure 1;

[0030] Figure 7 shows a perspective view of a partially machined bottom electrode set for an ion guide;

[0031] Figure 8 shows a perspective view of a partially machined electrode assembly for an ion guide;

[0032] Figure 9 An exploded view showing a partially machined bottom electrode set bonded to a printed circuit board (PCB);

[0033] Figure 10 An exploded view showing the partially machined top electrode set bonded to the PCB;

[0034] Figure 11 showing a perspective view of the aligned partially machined top and bottom electrode sets;

[0035] Figure 12 Shown Figure 11 an exploded view of the aligned partially machined top and bottom electrode assemblies;

[0036] Figure 13 showing another perspective view of the aligned partially machined top and bottom electrode sets prior to the step of further machining the electrode sets;

[0037] Figure 14 showing a perspective view of the aligned partially machined top and bottom electrode groups after a further machining step of the electrode groups;

[0038] Figure 15 another view showing the aligned partially machined top and bottom electrode sets after the step of further machining the electrode sets;

[0039] Figure 16shows contacts that may be connected to the first electrode set and the second electrode set in the final ion guide assembly;

[0040] Figure 17 The final ion guide assembly is shown;

[0041] Figure 18 Shown Figure 17 a cross-sectional view of an ion guide assembly;

[0042] Figure 19 Shown Figure 17 Another cross-sectional view of an ion guide assembly;

[0043] Figure 20 A flow chart illustrating a method for manufacturing components of an ion optical device; and

[0044] Figure 21 A flow chart illustrating a method for fabricating components of an ion optical device is shown.

[0045] It should be noted that the figures are presented for simplicity and are not necessarily drawn to scale. Similar features are provided with the same reference numerals. DETAILED DESCRIPTION

[0046] The present disclosure provides a method for manufacturing a component of an ion optical device, wherein the component may be the ion optical device itself or a part of the optical device.

[0047] Components of ion optical devices can be manufactured from a single piece of material. The material can be stainless steel. Alternatively, the material can be Alloy 36 (Invar (RTM) 36), a nickel-iron alloy containing 36% nickel. Alloy 36 has a very low coefficient of thermal expansion and offers high dimensional stability. Alloy 36 is also magnetic, and therefore a magnetic chuck can be used to hold the material in place during machining and / or further machining steps.

[0048] refer to Figure 1 , shows a partially machined electrode set 100 for an ion guide, the electrode set being manufactured from a material after a first machining step. The partially machined electrode set comprises: a first electrode set 110; and a frame portion 120. The frame portion 120 may also be referred to as the frame 120. The first machining step may be performed by wire etching and / or milling.

[0049] like Figure 1 As shown, the partially machined electrode set 100 includes a first electrode set 110 attached to a frame portion 120 of a first material. The material may be stainless steel or Alloy 36. The partially machined electrode set 100 may be flat or may contain one or more ridges. Figure 1 The electrode set 110 is shown to include a plurality of electrodes, but it is understood that the electrode set 110 can include one electrode.

[0050] The partially machined electrode assembly 100 includes a guide hole 130 for assembling the ion guide, which can be machined using wire etching. The guide hole 130 is provided in the first electrode assembly 110. The guide hole can be provided in each electrode of the electrode assembly 110 (the electrode assembly can be a single electrode or a plurality of electrodes), or can be provided in only some of the electrodes of the electrode assembly 110. The guide hole 130 can be machined at the same time as the first machining step. This improves the accuracy of the alignment of the fully assembled assembly.

[0051] The partially machined electrode set 100 may also include formed features 140 (also referred to as machined features 140) for providing a segmented and / or shaped electrode set 110 after further machining steps. The further machining steps may thereby separate or segment the electrodes in the electrode set 110 that are connected by the frame portion 120. Figure 1 In the example shown, the machined features provide a segmented and shaped (curved) electrode after a further machining step. It will be appreciated that the electrode need not be curved, but could be rectangular in shape, for example.

[0052] The method can involve machining one or more materials to provide additional partially machined electrode sets 100. For example, a second material can be machined to provide a second partially machined electrode set 100 comprising a second electrode set 110 attached to a frame portion 120 of the second material. The second material can be the same as the first material.

[0053] Figure 2 Shown according to Figure 1 The embodiment shown has the aligned first and second electrode sets 210 and 211 machined after the step of further machining. Note that the step of further machining may also be referred to as a step or "steps" of further machining.

[0054] The second electrode group 211 can be machined from the same material as the first electrode group 210 (i.e., the first material and the second material can be the same). A first step of further machining separates the first partially machined electrode group 100 from the frame portion 120 of the first material, and a second step separates the second partially machined electrode group 100 from the frame portion 120 of the second material. The steps of further machining can be performed simultaneously.

[0055] The aligned first electrode set 210 and the second electrode set 211 may be used for an ion guide. The first electrode set 210 and the second electrode set 211 may also be referred to as a top electrode set 210 and a bottom electrode set 211 .

[0056] The alignment holes 130 are used to align the first electrode group 210 and the second electrode group 211 before further machining steps. Before or after the first electrode group 210 and the second electrode group 211 are aligned, each or either of the first electrode group 210 and the second electrode group 211 can be glued to the PCB 250. In embodiments where the first electrode group 210 and / or the second electrode group 211 are glued to the PCBs 250 and 251, alignment holes 130 (guide holes 130) are provided in the PCBs (not visible). The PCBs 250 and 251 can be made of RF laminate, such as Megtron 6 material, and can be shaped and grooved to correspond to the shape and machined features of the electrode groups 210 and 211 to which they are glued.

[0057] exist Figure 2 In the illustrated embodiment, the first PCB 250 is shown glued to the upper surface of the first electrode set 210, and the second PCB 251 is shown glued to the lower surface of the second electrode set 211. An insulator 260 may be provided between the electrode sets to define the height of the ion channel. The insulator 260 may be provided on one of the electrode sets 210, 211 before the step of aligning the electrode sets 210, 211.

[0058] The step of further machining may also include machining an external alignment feature 270 or an external alignment surface 270. The external alignment feature 270 may be used to align the assembled component 200 ( Figure 2 The external holder (e.g., an ion guide in the assembly) is aligned with an external holder. The external holder may be, for example, an ion optics table or chamber system. Advantageously, the external alignment feature 270 allows the assembly 200 to be aligned with the external holder with greater accuracy than using conventional methods. Typically, alignment with the external holder is accomplished using additional guide pins and / or supports. The alignment accuracy of the present disclosure may be ±0.01 mm.

[0059] As reference Figure 1 As described, the method may involve machining one or more materials to provide additional electrode sets 210, 211. For example, a second material may be machined to provide a second partially machined electrode set 100 comprising a second electrode set 210, 211 attached to a frame portion 120 of the second material. The second material may be the same as the first material.

[0060] Figure 3 Shown Figure 2 . This figure more clearly illustrates how the first and second electrode sets 200 are aligned using the alignment holes 130. The alignment holes 130 are provided in the insulator 260 to allow the first and second partially machined electrode sets 100 to be aligned, for example, using pins or guide pins (not visible).

[0061] refer to Figure 4 , shows a partially machined electrode set 400 for an ion deflector. The partially machined electrode set 400 comprises an electrode set 410 attached to a frame portion 420 of material. The material may be stainless steel or Alloy 36. Figure 4 Electrode set 410 is shown as including a plurality of electrodes, but it should be understood that electrode set 410 may include a single electrode. The partially machined electrode set 400 may be flat or may include one or more ridges 460. When assembled, the one or more ridges may separate first electrode set 410 and second electrode set 411 by a predetermined distance.

[0062] The partially machined electrode assembly 400 includes guide holes 130 for assembling the ion guide, which can be machined using wire etching. The guide holes may be provided in only some of the electrodes in the electrode assembly 410. The guide holes 130 may be machined while the first machining step is being performed.

[0063] The partially machined electrode set 400 may also include forming features 440 for providing a segmented and / or shaped electrode set after further machining steps. The further machining steps may thus separate or segment the electrodes 410 in the electrode set 410 that are connected by the frame portion 420. Figure 4 In the example shown, the machined features 440 provide a segmented and shaped (trapezoidal prism) electrode set 410 after further machining steps. The shape of the trapezoid can be substantially triangular. For example, the trapezoid can be a triangle with one (or more than one) truncated vertex.

[0064] Figure 5 A pair of electrode groups 500 manufactured according to the present disclosure are shown in FIG. Figure 4 The first electrode set 510 and the second electrode set 511 of the configuration shown in FIG are aligned and further machined to provide an ion deflector. Prior to aligning the electrode sets 510, 511 and further machining them, the first electrode set 510 and the second electrode set 511 can be glued to the PCBs 250, 251. The glue can be a conductive glue. When assembled, one or more ridges 460 separate the electrode sets 510, 511 by a predetermined distance.

[0065] Figure 6 Shown Figure 5 2. FIGURE 25 shows an exploded view of the ion deflector assembly shown in FIGURE 25. This view more clearly illustrates how the alignment holes 130 are used to align the first electrode set 410 and the second electrode set 411. The alignment holes 130 are provided in the spine 460 and the PCB 250 to allow alignment of the first and second partially machined electrode sets 400, for example, using pins or guide pins (not visible). The PCB 250 may also have through-holes (vias) for providing electrical contact from the outer surface of the PCB 250 to the electrode sets 410, 411, which may be used in conjunction with a conductive adhesive.

[0066] Figure 7 and 8 The electrode groups 700, 800 of the part machined for making Y-shaped separators (also referred to as Y-shaped multipole) are shown. The Y-shaped separator is a branch multipole that can alternately guide ions. The branches of the multipole are provided by machined features 740, 840. Electrode groups 711, 810 and guide holes 730, 830 can be machined using wire etching or by milling. Guide holes 730, 830 can be of the same size or of different sizes.

[0067] The partially machined electrode groups 700, 800 may be flat or may include one or more ridges 760. When assembled, the one or more ridges 760 may separate the first electrode group 711 and the second electrode group 810 by a predetermined distance. Figure 7 In the embodiment shown, the electrode set 711 is a bottom electrode set 711 and includes ridges 760. Figure 8 In the embodiment of FIG, electrode set 810 is a top electrode set 810 and is flat. It should be understood that the bottom partially machined electrode can instead be flat and the top partially machined electrode can include ridges 760.

[0068] The guide holes 730, 830 are machined (e.g., by milling or wire etching) in the top partially machined electrode set 700 and the bottom partially machined electrode set 800. The guide holes 730, 830 on the top partially machined electrode set 700 and the bottom partially machined electrode set 800 correspond so that when assembled together, the guide holes 830 on the top partially machined electrode set 800 are aligned with the guide holes 730 on the bottom partially machined electrode set 700. The guide holes 730, 830 can be machined during the step of partially machining the electrode sets 711, 810. The method can further include machining a mark 770, 870 for indicating along which axis the further machining step should be performed. The mark 770, 870 can additionally or alternatively indicate a portion of the material forming the frame portion 720, 820 to be removed in the further machining step. The markings 770 , 870 may be machined during the step of partially machining the electrode sets 711 , 810 .

[0069] Figure 9 An exploded view of a partially machined bottom electrode set 700 coupled to a PCB 950 is shown. The partially machined electrode set 700 can be coupled to the PCB 950 using conductive adhesive and aligned using guide pins 1081 or pins 980. The PCB 950 includes alignment holes 730 that correspond to the alignment holes on the partially machined bottom electrode set 700. The PCB 950 can be shaped and slotted to correspond to the shape and machined features of the partially machined electrode set 700 to which it is glued. For example, the PCB 950 can include slots 941 that correspond to the machined features 740.

[0070] Figure 10 An exploded view of the top partially machined electrode set 800 is shown coupled to the PCB 1050. The partially machined electrode set 800 can be coupled to the PCB 1050 using conductive glue and aligned using guide pins 1081 or pins 980. The guide pins 1081 can also or instead provide electrical contact to the electrode set in the final component assembly.

[0071] PCB 1050 includes alignment holes 830 corresponding to the alignment holes on the top partially machined electrode set 800. PCB 1050 can be as shown in FIG. Figure 9 For example, PCB 1050 may include slots (not visible) corresponding to machined features 840.

[0072] Figure 11An exploded view of a top partially machined electrode set 700 and a bottom partially machined electrode set 800 aligned using guide pins 1081 and pins 980 is shown. Alternatively, only pins 980 or only guide pins 1081 may be used to align the electrode sets 700, 800. When not used for alignment, guide pins 1081 may still be present to provide electrical contact with the electrode set in the final component assembly.

[0073] Figure 11 It is further shown how screws 1190 are provided to knob together the partially machined top electrode 700 and the partially machined bottom electrode set 800. Electrical connections 1192 may be provided between some or all of the screws 1190.

[0074] like Figure 12 As shown, the top partially machined electrode set 700 and the bottom partially machined electrode set 800 (e.g., Figure 9 and 10 1050). The electrodes 700, 800 are assembled and aligned using guide pins 1081. Pins 980 may also be used in the alignment step. The ends of screws 1190 may extend through alignment holes 130 in PCB 1050. The assembly of aligned electrode sets 700, 800 and PCBs 950, 1050 may be referred to as an electrode-PCB unit 1200.

[0075] Figure 13 The first and second partially machined electrode groups are shown aligned and glued to PCBs 1350, 1351 to form electrode-PCB unit 1200. Further machining steps are performed, for example using wire etching, to separate first and second partially machined electrode groups 700, 800 from the frame portions 720, 820 of the first and second materials, respectively. The further machining steps can advantageously occur simultaneously, thereby providing first and second electrode groups 711, 810 that are aligned with greater accuracy and consistency than using conventional methods.

[0076] Figure 13 An example wire path 1392 for the further machining step is shown in FIG. The further machining step separates the partially machined electrode groups 700, 800 from their respective frame portions 720, 820. Figure 13 As shown, the further machining step may include machining an external alignment feature 1370. The external alignment feature 1370 may be used to align the assembled component, which may be an ion guide (specifically, an ion guide), with the external holder. Figure 13 Y-splitter in the ).

[0077] Advantageously, the external alignment feature 1370 allows the assembly to be aligned with the external holder with greater accuracy than using conventional methods. Typically, alignment with the external holder is accomplished using additional guide pins and / or supports. The accuracy of the alignment disclosed herein can be ±0.01 mm.

[0078] Figure 13 The initial direction of the cut performed by wire erosion is shown in . Figure 13 In the embodiment of the present invention, one or more metal wires 1391 are arranged in a direction perpendicular to the initial cutting direction. The one or more metal wires 1391 can alternatively be at a small angle to the vertical. This angle can be, for example, 15 degrees. The angle can alternatively be less than 15 degrees.

[0079] like Figure 13 As shown, about Figure 7 and 8 The markings 770 , 870 may be present on more than one frame portion 720 , 820 of a partially machined electrode set 700 , 800 .

[0080] Figure 14 Shown Figure 13 The electrode-PCB unit 1200 after further machining steps is shown in FIG. Figure 13 As described above, the further machining step can include machining one or more external alignment surfaces 1370, 1471, 1472. For example, one or more alignment surfaces 1472 can be provided as hard stops. One or more alignment surfaces 1471 can also or alternatively be provided on an outer surface of the electrode assembly 700, 800. Alternatively or additionally, one or more alignment features 1370 can be provided as edges of the electrode assembly 700, 800. Figure 14 Embodiments are shown that provide each of these types of alignment surfaces 1370 , 1471 , 1472 .

[0081] Figure 15 The assembly of the first electrode set 711 and the second electrode set 810 in the form of a Y-shaped splitter after further machining steps is shown. After further machining steps, the top electrode set 810 has been divided into six electrodes 810 (PCB 1050 has been divided into seven components). The bottom electrode set 711 has been divided into six electrodes (not visible). An RF potential can be applied to the electrodes 711, 810 to guide ions along one or more branches of the Y-shaped splitter.

[0082] The assembly 1500 has a final width w and depth d. The width w may be no greater than 41 mm. The depth d may be no greater than 19 mm.

[0083] Figure 1616. Contacts 1694 are shown in FIG. Contacts 1694 can be welded to connector 1693. Alternatively, laser spot welding can be used. Connector 1693 can preferably be made of stainless steel. If connector 1693 is made of stainless steel and welded to contacts 1694, a solder suitable for stainless steel components should be used. For example, ARAX 96S wire produced by Multicore (RTM) or S SN96Ag4 ARAX wire produced by Stannol (RTM), or equivalent welding wire can be used.

[0084] Figure 17 The final assembly of the ion-optical device including the Y-splitter assembly 1700 is shown. The Y-splitter is assembled into a dielectric holder 1795, which can be achieved by assembling the holder 1795 into the alignment features 270 or alignment surfaces 270 on at least one of the electrode sets 711, 810. Screws 1790 can then secure the electrode-PCB unit 1200 to the dielectric holder 1795.

[0085] The dielectric may be or consist (substantially) of polyetheretherketone (PEEK). Contacts 1694 and wiring are added to the holder. Contacts 1694 may be mounted on guide pins 1081 (on Figure 17 The steps of assembling the electrode sets 711, 810 into the holder 1795 and assembling the wiring and contacts 1694 can be performed in any order (i.e., assembly of the contacts 1694 and wiring can be performed before or after assembly of the electrode sets 711, 810 into the dielectric holder 1795).

[0086] Figure 18 There is shown a cross-sectional view of the final assembly of assembly 1700. Alignment surfaces 270 may be provided to assemble the electrode sets 711, 810 into the dielectric holder.

[0087] A radio frequency (RF) voltage may be applied to the electrode groups 711, 810. For example, Figure 18 A positive RF voltage is applied to the raised electrodes of the electrode group 711. Figure 18 The rod electrodes of the electrode set 711 are shown with a negative RF voltage applied. The RF voltage values ​​of the branch electrodes of the electrode set 711 can be set to direct ions downward along one of the branches rather than the other electrodes. For example, one of the branch electrodes 711 can have a positive RF voltage applied to it, while the other branch electrode 711 can have a negative RF voltage applied to it.

[0088] Another cross-sectional view of ion guide assembly 1700 is shown in FIG. Figure 19The Y-shaped separator is assembled into the dielectric holder 1795, which can be achieved by assembling the holder onto one or more alignment surfaces 1370, 1471, 1472 on at least one of the electrode sets 711, 810. Figure 19 (alignment surface 1472 is not visible). Screws 1790 can then secure the electrode-PCB unit to dielectric holder 1795.

[0089] The dielectric may be or consist (substantially) of polyetheretherketone (PEEK). Contacts 1694 and wiring are added to the holder. The steps of assembling the electrode sets 711, 810 into the holder and assembling the wiring and contacts 1694 may be performed in any order (i.e., assembly of the contacts 1694 and wiring may be performed before or after assembly of the electrode sets 711, 810 into the dielectric holder).

[0090] Figure 20 A flow chart of a method for assembling components of an ion-optical device is shown. At step 2010, a first material is machined to provide a partially machined first electrode set 100, 400. The partially machined first electrode set 100, 400 includes a first electrode set 110, 410 attached to a frame portion 120, 420 of the first material. At step 2020, a second material can be machined to provide a partially machined second electrode set 100, 400, including a second electrode set 110, 410 attached to a frame portion 120, 420 of the second material. The first material and the second material can be the same material or different materials. At step 2030, the components are assembled by aligning the partially machined first electrode set 100 and the partially machined second electrode set 400. Following the alignment step 2030, a further machining step 2040 is performed. The further machining step 2040 separates the first electrode set 110, 410 from the frame portion 120, 420 of the first material. At step 2050, the partially machined second electrode group 100, 400 is further machined to separate the second electrode group 110, 410 from the frame portion 120, 420 of the second material. Steps 2040 and 2050 may be performed simultaneously.

[0091] Figure 21 A flow chart of a method for assembling components of an ion-optical device is shown. At step 2110, a first material is machined to provide a partially machined first electrode set 100, 400, and a second material is machined to provide a partially machined second electrode set 100, 400. The partially machined electrode set 100, 400 includes an electrode set 110, 410 attached to a frame portion 120, 420 of the respective material. The first material and the second material can be the same.

[0092] At step 2120, the first partially machined electrode group 100, 400 is glued to the first printed circuit board 250, and the second partially machined electrode group is glued to the second printed circuit board 251. After step 2120, the assembly is assembled at step 2130 by aligning the partially machined first electrode group 100 and the partially machined second electrode group 400. Step 2140 includes further machining the partially machined first electrode group 100 and the partially machined second electrode group 400. The further machining can be performed by wire etching.

[0093] At step 2150, contacts 1694 and wiring are added to the holder 1794 for the electrode sets 110, 410. The holder is made of a dielectric material, which may be PEEK. At step 2160, the electrode-PCB unit is assembled into the dielectric holder 1794. Steps 2150 and 2160 may be performed in the same manner as Figure 21 The steps are performed in the reverse order shown (ie, step 2160 may occur before step 2150).

[0094] Although embodiments according to the present disclosure have been described with reference to particular types of devices and applications (specifically mass spectrometers) and have particular advantages in this context, as discussed herein, methods according to the present disclosure may be applied to other types of devices and / or applications. Specific manufacturing details of ion optical devices (such as ion guides) and / or ion optical systems may be varied significantly to obtain devices with similar or identical operation, where potentially advantageous (particularly in view of known manufacturing constraints and capabilities). Unless otherwise stated, each feature disclosed in this specification may be replaced by an alternative feature for the same, equivalent, or similar purpose. Therefore, unless otherwise stated, each feature disclosed is merely one example of a series of features of equivalent or similar properties.

[0095] For example, although the machining and further machining steps have been described with reference to wire etching, other methods can be used to separate the electrode group from the material and / or form the guide holes. For example, a thermal cutting process such as flame cutting, plasma cutting, or laser cutting can be used. In another example, chemical etching or form erosion can be used. In another example, a water jet or an abrasive jet can be used to separate the electrode group and / or form the guide holes. In yet another example, the guide holes can be machined by drilling or punching.

[0096] The methods and apparatus of the present disclosure can be utilized with a variety of electrode configurations. Appropriately sized electrodes can be arranged in symmetrical or asymmetrical patterns on a substrate, and can be linear or curved if elongation of the electrodes is beneficial for a particular application. Individual electrodes can be hemispherical, rectangular, or other shapes.

[0097] All aspects and / or features disclosed in this specification may be combined in any combination, except for at least some mutually exclusive combinations of such features and / or steps. Specifically, the preferred features of the present disclosure are applicable to all aspects and embodiments of the present disclosure and may be used in any combination. Similarly, features described in non-essential combinations may be used individually (not in combination).

[0098] As used herein, including in the claims, unless the context indicates otherwise, the singular form of the terms herein should be interpreted to include the plural form, and vice versa. For example, unless the context indicates otherwise, herein, a singular reference included in the claims, such as "a" or "an" (such as a pair of electrode sets) means "one or more" (for example, a pair or more pairs of electrode sets). In the description and claims of the present disclosure, the words "comprise," "include," "have," and "contain," and variations of these words, for example, "comprising" and "comprises," or similar words mean "including but not limited to," and are not intended to (and do not) exclude other components.

[0099] The use of any and all examples or exemplary language ("for instance," "such as," "for example," and similar language) provided herein is intended merely to better illustrate the present disclosure and does not imply a limitation on the scope of the present disclosure unless otherwise claimed. No language in this specification should be construed as indicating any non-claimed element as essential to the practice of the present disclosure.

[0100] The terms "first" and "second" may be reversed without changing the scope of the present invention. That is, an element referred to as a "first" element may instead be referred to as a "second" element, and an element referred to as a "second" element may instead be considered a "first" element. Likewise, the terms "top" and "bottom" are not intended to be limiting, and a "top" element may instead be referred to as a "bottom" element, and vice versa.

[0101] Unless otherwise specified or the context requires otherwise, any steps described in this specification may be performed in any order or simultaneously. In addition, where a step is described as being performed after a step, this does not preclude intermediate steps being performed.

[0102] It should also be understood that, unless otherwise implicitly or explicitly understood or stated, for any given component or embodiment described herein, any possible candidates or alternatives listed for that component can generally be used alone or in combination with each other. It should be understood that any list of such candidates or alternatives is merely illustrative and not restrictive, unless otherwise implicitly or explicitly understood or stated.

Claims

1. A method of manufacturing an assembly for an ion-optical device, the assembly comprising a first electrode set and a second electrode set aligned, the method comprising the steps of: machining a first material to provide a partially machined first electrode set, the partially machined first electrode set comprising the first electrode set attached to a frame portion of the first material; machining a second material to provide a partially machined second electrode set, the partially machined second electrode set comprising the second electrode set attached to a frame portion of the second material; assembling the components of the ion-optical device by aligning the partially machined first electrode set and the partially machined second electrode set; as well as After aligning the partially machined first electrode set and the partially machined second electrode set: further machining the partially machined first electrode group to separate the first electrode group from the frame portion of the first material; as well as The partially machined second electrode set is further machined to separate the second electrode set from the frame portion of the second material.

2. The method of claim 1, wherein the further machining steps are performed simultaneously.

3. The method of claim 1, wherein the step of machining is performed by one of: wire etching; form etching; chemical etching; water jet cutting; and thermal cutting.

4. The method of claim 1, wherein the further machining step is performed by one of: wire etching; form etching; chemical etching; water jet cutting; and thermal cutting. The method according to claim 1 , wherein the first electrode group comprises a first electrode, and / or the second electrode group comprises a second electrode.

6. The method of claim 1, wherein the first electrode set comprises a first plurality of electrodes, and / or the second electrode set comprises a second plurality of electrodes.

7. The method of claim 1, wherein the step of machining a first material and / or the step of machining a second material comprises machining formed features to provide a segmented electrode set after the further machining step.

8. The method of claim 1, wherein the step of machining the first material and / or the step of machining the second material comprises machining features to provide a shaped electrode set after the further machining step.

9. The method of claim 1, wherein the first material and the second material are the same material.

10. The method of claim 1, wherein the component of the ion optical device is an ion guide or an ion deflector. The method of claim 10 , wherein the component is an ion guide, and the ion guide is a Y-shaped multipole.

12. The method of claim 1, wherein the partially machined first electrode set and the partially machined second electrode set are aligned using pins and / or guide pins.

13. Method according to claim 12, wherein during the machining step a guide hole for the pin and / or the guide pin is provided.

14. The method of claim 1, wherein the further machining step comprises machining external alignment features for aligning the component with an external holder.

15. The method of claim 1, wherein prior to said step of assembling said components, The first electrode group is glued to a printed circuit board PCB; and / or The second electrode group is glued to the PCB.

16. The method of claim 3 or 4, wherein a wire used for the wire etching has a cutting direction in which the cutting of the machining occurs, and wherein the wire makes an angle of no more than 15 degrees with a plane perpendicular to the cutting direction. The method of claim 16 , wherein the angle is 0 degrees.

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