Stacked die including multi-contact interconnects

Abstract

The present disclosure relates to stacked tube cores including multi-contact interconnects. A plurality of tube cores are located in a first resin, and a conductive layer is located on the first resin. The conductive layer is coupled between some of the first conductive vias extending into the first resin and corresponding tube cores in the plurality of tube cores. The conductive layer and the first conductive vias couple some of the tube cores in the plurality of tube cores to each other. The second conductive via extends into the first resin, reaches the contact pad of the substrate, and the conductive layer is coupled to the second conductive via, coupling some of the tube cores in the plurality of tube cores to the contact pad of the substrate. The second resin is located on the first resin and covers the first resin and the conductive layer on the first resin. In some embodiments, the first resin includes a plurality of steps (e.g., a step structure). In some embodiments, the first resin includes an inclined surface (e.g., a sloped surface).

Description

Technical Field

[0001] The present disclosure relates to a package including a plurality of stacked dies coupled together using a multi-contact interconnect. The package includes a first resin on the plurality of dies and a second resin on the first resin. Background Art

[0002] Generally, semiconductor device packages, stacked die packages, and other types of semiconductor packages include a single die or multiple dies on a substrate covered by a resin (e.g., molding compound, encapsulant, or other suitable material). The die on the substrate is generally coupled to electrical components (e.g., electrical traces, contact pads, etc.) in and on the substrate. The electrical components of the substrate can be coupled to the die by wires or electrical traces extending through the resin.

[0003] When the electrical components of the substrate are coupled to the die by wires, the wires may be formed by wire bonding techniques (e.g., wedge bonding, ball bonding, conformal bonding, extrusion techniques, etc.). For example, when ball bonding techniques and extrusion techniques are used, balls of conductive material are formed on the contact pads of the die, and wires are extruded from the balls onto the contact pads of the substrate. The wires formed by the ball bonding techniques and extrusion techniques electrically couple the die to the substrate.

[0004] In some other cases, electrical connections between the electrical components of the substrate and the die can be formed by first forming grooves and openings in the resin, the openings exposing the contact pads of the substrate and the die. After the grooves and openings are formed, a conductive material is formed in the grooves by a plating technique that couples the contact pads of the substrate to the contact pads of the die. Summary of the invention

[0005] Reducing the number of steps in these conventional processes to form semiconductor device packages, such as stacked die packages, would reduce manufacturing costs. In addition, reducing the amount of material used to form electrical connections in semiconductor device packages would also reduce the manufacturing costs of those semiconductor device packages.

[0006] Embodiments of semiconductor device packages and methods of manufacturing semiconductor device package embodiments disclosed or within the scope of the present disclosure at least address the problem of reducing the number of steps and amount of material used to form electrical connections in semiconductor device package embodiments. Embodiments according to the present disclosure relate to at least stacked die packages.

[0007] The present disclosure relates to at least one embodiment of a stacked die package, which includes a first resin, a second resin on the first resin, and a conductive layer between the first resin and the second resin. In other words, the conductive layer is located on the first resin, and the second resin covers the first resin and the conductive layer.

[0008] The stacked die may include a first die on a substrate, a second die stacked on the first die, and a first resin on the substrate and encapsulating the first die and the second die. The second die is stacked on the first die so that the second die is offset relative to the first die. In other words, the first die has a first end, and the second die has a second end extending beyond the first end. The first resin has a step structure (e.g., at least one step or multiple steps) covering the first die and the second die.

[0009] In some embodiments, the stacked die are coupled together with a conductive layer. A first conductive via extends into the first resin to reach the first die, a second conductive via extends into the first resin to reach the second die, and a third conductive via extends into the first resin to reach the substrate. The conductive layer is located on the step structure, coupled to the first conductive via, the second conductive via, and the third conductive via and extends between the first conductive via, the second conductive via, and the third conductive via. The conductive layer electrically couples the first conductive via, the second conductive via, and the third conductive via to each other, thereby electrically coupling the first die, the second die, and the substrate to each other. The conductive layer can be formed using a laser direct structuring (LDS) process that uses an LDS compatible material for the first resin.

[0010] In an alternative embodiment, the first resin has an inclined surface covering the first tube core and the second tube core. The first conductive via extends into the inclined surface to reach the first tube core, the second conductive via extends into the inclined surface to reach the second tube core, and the third conductive via extends into the first resin to reach the substrate. The conductive layer is located on the inclined surface and electrically couples the first conductive via, the second conductive via, and the third conductive via to each other.

[0011] The stacked die package forming method in the present disclosure includes forming a conductive layer on the surface of a first resin using a laser direct structuring (LDS) technique or process, and forming a conductive via extending into the first resin. The LDS technique includes moving a laser along the surface of the first resin, activating an additive in the first resin, and plating the activated additive at the surface of the first resin with a conductive material, electrically coupling the stacked dies in the first resin to each other and to a substrate. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] In order to better understand the embodiments, reference will now be made to the accompanying drawings by way of example. In the accompanying drawings, unless the context otherwise indicates, the same reference numerals identify similar elements or actions. The sizes and relative proportions of the elements in the accompanying drawings are not necessarily drawn to scale. For example, some of these elements may be enlarged and positioned to improve the readability of the accompanying drawings.

[0013] Figure 1A is along Figure 1BA cross-sectional view of an embodiment of a stacked die package taken along line AA in FIG.

[0014] Figure 1B yes Figure 1A a top plan view of the stacked die package embodiment shown;

[0015] Figure 2A is along Figure 2B A cross-sectional view of an alternative embodiment of a stacked die package taken along line BB in FIG.

[0016] Figure 2B yes Figure 2A A top plan view of an alternative embodiment of a stacked die package is shown;

[0017] Figure 3A is along Figure 3B A cross-sectional view of an alternative embodiment of a stacked die package taken along line CC in FIG.

[0018] Figure 3B is a top plan view of an alternative embodiment of a stacked die package;

[0019] Figure 4A is along Figure 4B A cross-sectional view of an alternative embodiment of a stacked die package taken along line DD in FIG.

[0020] Figure 4B yes Figure 4A A top plan view of an alternative embodiment of a stacked die package is shown;

[0021] Figure 5 is a cross-sectional view of an alternative embodiment of a stacked die package;

[0022] Figures 6A-6C Yes Figure 1A and Figure 1B Embodiments of methods for manufacturing stacked die packages as shown;

[0023] Figure 7 Yes Figure 3A and Figure 3B Embodiments of methods of manufacturing the stacked die package alternative embodiments shown; and

[0024] Figure 8 Yes Figure 4A and Figure 4B An embodiment of a method of manufacturing an alternative embodiment of a stacked die package is shown. DETAILED DESCRIPTION

[0025] In the following description, certain specific details are set forth to provide a thorough understanding of various embodiments of the present disclosure. However, those skilled in the art will appreciate that the present disclosure may be practiced without these specific details. In other cases, known structures associated with electronic components, packaging, and semiconductor manufacturing techniques are not described in detail to avoid unnecessary confusion in the description of the embodiments of the present disclosure.

[0026] Unless the context requires otherwise, throughout the specification and the appended claims, the word "comprise" and variations such as "include" and "comprising" should be construed in an open, inclusive sense, ie, "including, but not limited to."

[0027] The use of ordinal numbers such as first, second, third, etc. does not necessarily imply a sequential ordering sense but may simply distinguish between multiple instances of an action or similar structures or materials.

[0028] References throughout the specification to "one embodiment" or "an embodiment" mean that a particular feature, structure, or characteristic associated with the embodiment is included in at least one embodiment. Therefore, the phrases "in one embodiment" or "in an embodiment" appearing in multiple places throughout the specification do not necessarily refer to the same embodiment. Furthermore, these particular features, structures, or characteristics may be combined in any suitable manner in one or more embodiments.

[0029] The terms "vertical", "horizontal", "lower", "upper", "top", "bottom", "left", and "right" are used only for the purpose of discussion of component orientations in the following discussion of the drawings of the present disclosure. These terms are not limiting as possible positions are explicitly disclosed, implicitly disclosed, or inherently disclosed in the present disclosure.

[0030] The term "substantially" is used to clarify that when a package is manufactured in the real world, there may be minor differences, as nothing can be completely identical or identical. In other words, substantially means that there may be some slight variations in actual practice, and alternatively are made within acceptable tolerances.

[0031] As used in the specification and the appended claims, the singular forms "a", "an", and "the" include plural referents unless the context clearly dictates otherwise.

[0032] As previously discussed, the disclosed embodiments are directed to a stacked die package including at least one first die on a substrate and a second die stacked on the first die. A first resin encapsulates the first die and the second die. A conductive layer is located on a surface of the first resin, and electrically couples some of a plurality of conductive vias extending into the first resin to the first die, the second die, and the substrate, respectively. The conductive vias and the conductive layer electrically couple the first die, the second die, and the substrate to each other. A second resin is located on the first resin and covers the conductive layer to protect the conductive layer from the external environment outside the stacked die package.

[0033] In some embodiments, the first resin has a step structure (e.g., one step or multiple steps), and a conductive layer exists on the step structure. The conductive layer on the step structure has a step structure that is the same as or similar to that of the first resin. The conductive layer couples some of the multiple dies to each other.

[0034] Additionally or alternatively, the first resin has an inclined surface, and there is a conductive layer on the inclined surface. The conductive layer on the inclined surface has an inclination that is the same or similar to the inclined surface of the first resin. The conductive layer couples some of the multiple dies in the first resin to each other. The conductive layer can be formed using laser direct structuring (LDS) technology or process, wherein a laser moves along the surface of the first resin to activate the additive material in the first resin.

[0035] Some embodiments include a first conductive layer and a second conductive layer that are separate and distinct from each other. The first conductive layer and the second conductive layer are both on the first resin and covered by the second resin. In addition, the first conductive layer and the second conductive layer are formed by LDS technology or process. The first conductive layer can be stepped, and the second conductive layer can be inclined.

[0036] Figure 1A is along Figure 1B FIG. 1 is a cross-sectional view of an embodiment of a stacked die package 100 taken along line AA in FIG. Figure 1B is a top plan view of an embodiment of a stacked die package 100 .

[0037] like Figure 1A As shown, stacked die package 100 includes substrate 102 having a first surface 104, a second surface 106 opposite to first surface 104, and a plurality of sidewalls 105 extending from first surface 104 to second surface 106. Sidewalls 105 are transverse to first surface 104 and second surface 106.

[0038] The substrate 102 also includes a plurality of conductive pads 107 at the first surface 104 of the substrate 102. The conductive pads 107 may be bonding pads, mounting pads, or other suitable pads or connections for coupling the stacked die package 100 to an external electrical component (e.g., a package, a die, a printed circuit board (PCB), etc.), or for mounting the stacked die package 100 within an electronic device (e.g., a computer, a smart phone, a tablet, a television, a calculator, etc.). A plurality of solder balls 109 are coupled to the conductive pads 107, and the plurality of solder balls 109 are used to form electrical connections to an external electrical component or to an electronic device in which the stacked die package is mounted or utilized.

[0039] On the second surface 106 of the substrate 102 are a plurality of tube cores 108a, 108b, 108c, 108d (hereinafter referred to as 108a-108d in the present disclosure). The plurality of tube cores 108a-108d as a group of stacked tube cores include a first tube core 108a, a second tube core 108b, a third tube core 108c and a fourth tube core 108d in a stacked structure. The first tube core 108a is on the second surface 106 and is coupled to the second surface 106 through a first adhesive layer 110a. The second tube core 108b is on the first tube core 108a and is coupled to the first tube core 108a through a second adhesive layer 110b. The third tube core 108c is on the second tube core 108b and is coupled to the second tube core 108b through a third adhesive layer 110c. The fourth die 108d is on the third die 108c and coupled to the third die 108c by a fourth adhesive layer 110d. The adhesive layers 110a-110d may be die attach films (DAF), glue, or some other adhesive material suitable for coupling the dies 108a-108d to each other and to the substrate 102.

[0040] The first die 108a is coupled to the pad 111 by an adhesive layer 110a, which is a conductive adhesive material that electrically couples the die 108a to the substrate 102. The pad 111 may be electrically coupled by an electrical connection (e.g., an electrical trace, an electrical via, etc.) extending from the pad 111 to at least one of the plurality of pads 107 at the first surface 104 of the substrate 102.

[0041] In some embodiments, the adhesive layers 110a-110d may be made of a conductive adhesive material. In some embodiments, the adhesive layers 110a-110d may be made of a non-conductive adhesive material. In some embodiments, some of the adhesive layers 110a-110d may be conductive adhesive materials, and other adhesive layers 110a-110d may be non-conductive adhesive materials. Alternatively, in some embodiments, the adhesive layers 110a, 110b, 110c, 110d may be replaced by a plurality of die attach tape layers or a plurality of die attach films (DAF).

[0042] In other words, based on Figure 1A In the orientation of the stacked die package 100, the fourth die 108d (eg, the upper die) is located on the top of the plurality of dies 108a-108d, and the first die 108a (eg, the lower die) is located on the bottom of the plurality of dies 108a-108d. Figure 1A In the orientation of the stacked die package 100 , the second die 108 b is sandwiched between the first die 108 a and the third die 108 c , and the third die 108 c is sandwiched between the second die 108 b and the fourth die 108 d .

[0043] The first tube core 108a has a first end 112a, the second tube core has a second end 112b, the third tube core 108c has a third end 112c, and the fourth tube core 108d has a fourth end 112d. The second end 112b extends beyond the first end 112a, so that the second end 112b is suspended above the first end 112a. The third end 112c extends beyond the second end 112b, so that the third end 112c is suspended above the first end 112a and the second end 112b, respectively. The fourth end 112d extends beyond the third end 112c, so that the fourth end 112d is suspended above the first end 112a, the second end 112b, and the third section 112c, respectively.

[0044] The first tube core 108a has a fifth end 112e opposite to the first end 112a. Each tube core includes an end that is stacked and displaced from the fifth end 112e of the first tube core 108a. For example, the second tube core 108b has a sixth end 112f opposite to the second end 112b, the third tube core 108c has a seventh end 112g opposite to the third end 112c, and the fourth tube core 108d has an eighth end 112h opposite to the fourth end 112d. The eighth end 112h of the fourth tube core 108d is on the end 112g of the third tube core 108c or is otherwise displaced inward from the end 112g of the third tube core 108c. In other words, the seventh end 112g is closer to the side wall 136. The sixth end 112f extends beyond the seventh end 112g and is positioned or aligned relative to the surface of the first tube core 112a, that is, more centrally positioned than the contact pad 116b. The fifth end 112 e of the first die 108 a is further away from the central axis of the package than the sixth end 112 f and is located on the second surface 106 of the substrate 102 .

[0045] Based on the previous discussion regarding the respective ends 112a - 112h of the plurality of dies 108a - 108d , it is readily understood that the plurality of dies 108a - 108d are stacked in an offset manner.

[0046] The first tube core 108a has a first pad 116a adjacent to the fifth end 112e. Although shown as being flush or coplanar with the fifth end 112e, the first pad 116a can be spaced apart from the fifth end 112e. The second tube core 108b has a second pad 116b at the sixth end 112f closer to the sidewall 136 than the seventh end 112g. The third tube core 108c has a third pad 116c at the seventh end 112g adjacent to the eighth end 112h. The fourth tube core 108d has a fourth pad 116d at the eighth end 112h. The pads 116a-116d are exposed and are not covered by some of the multiple tube cores 108a-108d stacked on each other. Based on the offset mode of the stacked multiple tube cores 108a-108d, the pads 116a-116d remain exposed. The above-mentioned offset manner has been discussed in detail above, and therefore, for the sake of simplicity and brevity of the present disclosure, the offset manner of the stacked plurality of dies 108 a - 108 d will not be discussed again herein.

[0047] The first resin 117 is on, encapsulates, and surrounds the plurality of tube cores 108a-108d. The first resin 117 can be a laser direct structuring (LDS) compatible resin and can have the following non-limiting list of properties: (1) a coefficient of thermal expansion (CTE) in the range of approximately ten parts per million (10 ppm) per degree Celsius (°C) to 40 ppm / °C, (2) a flexural modulus at room temperature in the range of 12 gigapascals (GPa) to 30 GPa, and (3) additives within the LDS compatible resin that activate when exposed to a laser. Even though the first resin can have these properties, the first resin 117 can also be another type of resin having different properties but still suitable for the LDS process. The details of the LDS process will be referred to. FIG. 6A to FIG. 6C Discuss in more detail.

[0048] The first resin 117 is located on the ends 112a-112h of the plurality of dies 108a-108d and on the surface 119 of the fourth die 108d facing away from the first die 108a, the second die 108b, and the third die 108c. The first resin 117 completely covers the ends 112a-112h of the plurality of dies 108a-108d and completely covers the surface 119 of the fourth die 108d.

[0049] The first resin 117 has a plurality of steps 118, and the plurality of steps 118 may be a step structure or a stepped structure formed integrally with the first resin 117. The plurality of steps 118 include four steps (for example, the upper step is based on Figure 1AThe plurality of steps 118 are oriented at the top of the stacked die package 100, with the upper step extending upward to the surface 120 of the first resin 117, and the number is the same as the number of the plurality of dies 108a-108d. The plurality of steps 118 include a plurality of first surfaces (substantially horizontal in the figure) and a plurality of second surfaces (substantially vertical in the figure). The first surface is transverse to the second surface. The vertical surface can be substantially perpendicular to the horizontal surface (i.e., at 90 degrees). In some other embodiments, each vertical surface can be transverse to the corresponding horizontal surface at an angle of substantially 70 degrees, 80 degrees, 90 degrees, 100 degrees, 110 degrees, 120 degrees, etc.

[0050] The horizontal surface may be a tread, a step, or some other suitable surface of the step structure 118. The vertical surface may be a riser, a riser, or some other suitable surface of the step structure 118.

[0051] In some embodiments, the plurality of steps 118 may include two steps, three steps, or any appropriate number of steps. For example, if the stacked die package 100 has five stacked dies, the plurality of steps 118 may include five steps; if the stacked die package 100 has six stacked dies, the plurality of steps 118 may include six steps; if the stacked die package 100 has seven stacked dies, the plurality of steps 118 may include seven steps; and so on. Although in the options discussed, there is a one-to-one relationship with the plurality of dies in the stacked die package, in some other embodiments, the stacked die package 100 may include four stacked dies, and the plurality of steps 118 may include two steps, three steps, five steps, etc., or the stacked die package 100 may include three stacked dies, and the plurality of steps 118 may include two steps, four steps, five steps, etc.

[0052] In some other embodiments, the plurality of steps 118 may be replaced with only a single step having a generally L-shaped structure. In other words, if there is only a single step, the step includes a first step (e.g., based on Figure 1A The stacked die package 100 shown faces the lower horizontal surface), the second step (e.g., based on Figure 1A The stacked die package 100 shown in FIG. 1 is oriented toward an upper horizontal surface), and a vertical portion extending from the first step to the second step (eg, based on FIG. 1 ). Figure 1A The stacked die package 100 is shown oriented with vertical surfaces transverse to horizontal surfaces).

[0053] The first resin 117 includes a central surface 120 and a peripheral surface 122 disposed outwardly from the central surface 120. The peripheral surface 122 is closer to the substrate 102 than the central surface 120. The peripheral surface 122 covers and overlaps the substrate 102 and is spaced outwardly from the plurality of tube cores 108a-108d. The central surface 120 covers and overlaps some of the plurality of tube cores 108a-108d. Figure 1A In the orientation of the stacked die package 100, the central surface 120 may be an upper surface, a raised surface, or some other type of surface disposed closer to the top of the stacked die package 100 than the peripheral surface 122. Figure 1A In the orientation of the stacked die package 100 , the peripheral surface 122 may be a lower surface that is closer to the bottom of the stacked die package 100 than the central surface 120 .

[0054] The first resin 117 includes at least a first side wall 124 and at least a second side wall 126. Both side walls may be Figure 1A 120. The first side wall 124 extends from the second surface 106 of the substrate to the peripheral surface 122, and the second side wall 126 extends from the peripheral surface 122 to the central surface 120. The first side wall 124 is spaced outwardly from the second side wall 126, and the second side wall 126 is spaced inwardly from the first side wall 124. The first side wall 124 can be an outer side wall, an outer side wall, or some other type of side wall. The second side wall 126 can be an inner side wall, an inner side wall, or some other type of side wall. The first side wall 124 can be one of a plurality of first side walls 124 extending from the second surface 106 of the substrate to the peripheral surface 122. The second side wall 126 can be one of a plurality of second side walls 126 extending from the peripheral surface 122 to the central surface 120.

[0055] Figure 1A The first side wall 124 on the right side has a first dimension D1 extending from the second surface 106 to the outer peripheral surface 122. Figure 1A The second side wall 126 on the right side has a second dimension D2 extending from the outer peripheral surface 122 to the central surface 120. The first dimension D1 is smaller than the second dimension D2.

[0056] In some embodiments, some of the plurality of first sidewalls 124 may have a first dimension D1. In some embodiments, some of the plurality of first sidewalls 124 may have a first dimension D1, and others of the plurality of first sidewalls 124 may have a dimension larger or smaller than the first dimension D1.

[0057] In some embodiments, the first dimension D1 may be substantially equal to the second dimension D2. For example, in at least one other embodiment of the stacked die package 100 including only a single die on the substrate 102 covered by the first resin 117, the plurality of steps 118 are formed by Figure 1A The steps shown are replaced with a single step of the same size so that the first dimension D1 of the first sidewall 124 can be substantially equal to the second dimension D2 of the second sidewall 126. In at least another embodiment of the stacked die package 100, if the stacked die package 100 includes a similar Figure 1A The four dies in the embodiment and the plurality of steps 118 are only formed by Figure 1A If each step in is replaced by two steps of the same size, the first dimension D1 can be substantially equal to the second dimension D2.

[0058] In some embodiments, the first dimension D1 of the first sidewall 124 may be greater than the second dimension D2 of the second sidewall 126. For example, in at least one other embodiment of the stacked die package 100, if the stacked die package 100 includes similar Figure 1A The four dies in the Figure 1A If each step in the embodiment is replaced by a step of the same size, the first dimension D1 may be substantially larger than the second dimension D2.

[0059] A plurality of conductive vias 128a, 128b, 128c, 128d (hereinafter referred to as 128a-128d in the present disclosure) extend into the first resin 117. Some of the plurality of conductive vias 128a-128d extend into some of the plurality of steps 118, reaching some of the plurality of pads 116a-116d of the plurality of dies 108a-108d. The first conductive via 128a extends into a first step of the plurality of steps 118, i.e., the leftmost step of the plurality of steps 118, reaching the first pad 116a. The second conductive via 128b extends into a second step of the plurality of steps 118, i.e., the step immediately adjacent to the leftmost step of the plurality of steps 118, reaching the second pad 116b. The third conductive via 128c extends into a third step of the plurality of steps 118, i.e., the step adjacent to the rightmost step of the plurality of steps 118, reaching the third pad 116c. The fourth conductive via 128d extends into a fourth step of the plurality of steps 118, i.e., the rightmost step of the plurality of steps 118, to reach the fourth pad 116d. The fourth conductive via 128d extends into the central surface 120 of the first resin 117. The fifth conductive via 128e located on the left side of the stacked die package 100 extends into the peripheral surface 122 of the first resin 117 to reach the pad 130 at the second surface of the substrate 102. The pad 130 can be coupled to at least one of the plurality of pads 107 at the first side 104 of the substrate 102 by an electrical connection (e.g., an electrical trace, an electrical via, etc.).

[0060] Based on Figure 1A In the orientation of the stacked die package 100 shown, the plurality of conductive vias 128a-128d are substantially vertical. Figure 1A With the orientation of the stacked die package 100 shown, the plurality of conductive vias 128a - 128d may be angled rather than substantially vertical.

[0061] The conductive layer 132 is located on the plurality of steps 118. The conductive layer 132 covers the horizontal and vertical surfaces of the plurality of steps 118. The conductive layer 132 is located on the outer peripheral surface 122 and the central surface 120 of the first resin 117. The conductive layer 132 is located on the ends of the plurality of conductive vias 128a-128d and the end of the fifth conductive via 128e. The conductive layer 132 couples the plurality of conductive vias 128a-128d and the fifth conductive via 128e to each other. The conductive layer 132 is electrically coupled to the plurality of dies 108a-108d through the first, second, third and fourth conductive vias 128a-128d, respectively. The conductive layer 132 is electrically coupled to the pad 130 at the second surface 106 of the substrate 102 through the fifth conductive via 128e. Since the conductive layer 132 is on the horizontal and vertical surfaces of the plurality of steps 118 , the conductive layer 132 has a step structure or a stair-like structure that is the same as or similar to the plurality of steps 118 .

[0062] The conductive layer 132 and the plurality of conductive vias 128a-128d may be a multi-contact interconnect structure that couples the plurality of pads 116a-116d of the plurality of dies 110a-110d to each other and to the pads 130 of the substrate 102. The multi-contact interconnect structure may be a multi-contact interconnect step structure, a multi-contact interconnect ladder structure, a multi-contact step structure, a conductive interconnect structure, a stepped conductive interconnect structure, a multi-contact interconnect, or other suitable structures for coupling the plurality of stacked dies 108a-108d to each other and to the substrate 102.

[0063] The second resin 134 is located on the conductive layer 132 and the first resin 117. The second resin 134 covers the conductive layer 132. The second resin 134 is on and covers the central surface 120, the peripheral surface 122 and the at least one second sidewall 126 of the first resin 117. The second resin 134 can be a molding compound, an epoxy resin, a sealant, a non-conductive resin, an insulating resin, a dielectric resin, or some other type of resin material. The second resin 134 includes a plurality of sidewalls 136, including at least one sidewall that is substantially coplanar and flush with at least one first sidewall 124 of the first resin and one of the plurality of sidewalls 105 of the substrate 102. The second resin 134 includes a surface 138 that extends transversely to the plurality of sidewalls 136 and between some of the plurality of sidewalls 136.

[0064] In some embodiments, the second resin 134 does not cover the central surface 120, but exposes the central surface 120, such that the central surface 120 is substantially coplanar and flush with a surface 138 of the second resin 134, and the surface 138 surrounds the central surface 120. However, when the central surface 120 of the first resin 117 is substantially coplanar and flush with a surface 138 of the second resin 134, the conductive layer 132 does not exist on the central surface 120, and the fourth via 128d does not exist.

[0065] In some embodiments, the second resin 134 does not cover the conductive layer 132, so that an electrical connection can be formed between the conductive layer 132 and an external electrical component. For example, a solder material can be applied to the surface of the conductive layer 132, and an external die can be coupled to the solder material on the surface of the conductive layer 132.

[0066] In some embodiments, second resin 134 is not present in stacked die package 100 . In other words, second resin 134 is not present on first resin 117 and conductive layer 132 .

[0067] Figure 2A is along Figure 2B A cross-sectional view of an alternative embodiment of a stacked die package 200 taken along line BB in FIG. Figure 2B yes Figure 2A A top plan view of an alternative embodiment of a stacked die package 200 is shown. Figure 2A-2B 1A-1B are alternative embodiments of stacked die package 200 having the same or similar features as stacked die package 100. For simplicity and brevity of the present disclosure, only different or additional features of stacked die package 200 relative to stacked die package 100 shown in FIGS. 1A-1B will be discussed in further detail below in the present disclosure.

[0068] and Figure 1A Unlike the first resin 117 in the stacked die package 100 shown, the first resin 202 of the stacked die package 200 includes Figure 2A The first inclined surface 204 on the left side and Figure 2A The first and second inclined surfaces 204 and 206 are separated from each other by a central surface 208. The first and second inclined surfaces 204 and 206 extend from the outer peripheral surface 210 of the first resin 202 to the central surface 208. The first and second inclined surfaces 204 and 206 may be inclined surfaces, angled surfaces, or other suitable surfaces having an inclination. The central surface 208 and the outer peripheral surface 210 are Figure 1A The central surface 120 and the peripheral surface 122 of the illustrated first resin 117 are the same or similar.

[0069] The first inclined surface 204 is at a first angle θ1 relative to the outer peripheral surface 210, and the second inclined surface 206 is at a second angle θ2 relative to the outer peripheral surface 210. The first angle θ1 can be 100 degrees, 110 degrees, 120 degrees, 130 degrees, 170 degrees, or other suitable angles. The second angle θ2 can be 100 degrees, 110 degrees, 120 degrees, 130 degrees, 170 degrees, or other suitable angles. The first angle θ1 and the second angle θ2 can be selected based on the orientation of the plurality of tube cores 212a, 212b, 212c, 212d within the first resin 202. The plurality of tube cores 212a-212d are the same or similar to the plurality of tube cores 108a-108d. For example, the plurality of tube cores 212a-212d are selected based on the orientation of the plurality of tube cores 212a, 212b, 212c, 212d within the first resin 202. Figure 1A-1B The offset modes discussed are the same or similar offset modes are stacked.

[0070] The plurality of dies 212a-212d are arranged in Figure 1A The substrate 215 is the same as or similar to the substrate 102 shown. Figure 1A The plurality of adhesive layers 213a, 213b, 213c, 213d, which are the same as or similar to the plurality of adhesive layers 110a-110d, couple the plurality of dies 212a-212d together and stack them. Figure 1A Similar to the illustrated first resin 117 , the first resin 202 of the stacked die package 200 encapsulates the plurality of dies 212 a - 212 d in the stacked die package 200 .

[0071] and Figure 1A-1B Unlike the plurality of conductive vias 128a-128d shown, the plurality of conductive vias 214a, 214b, 214c, 214d extend at a certain angle to the corresponding pads of the plurality of pads 216a, 216b, 216c, 216d of the plurality of dies 212a-212d, so that the conductive vias 214a-214d are not only based on Figure 2A The orientation of the stacked die package 200 extends in the vertical direction and is based on Figure 2AThe package orientation shown extends in a horizontal direction. Each of the conductive vias 214a-214d extends into the first resin 202 to a corresponding pad in the plurality of pads 216a-216d. The plurality of conductive vias 214a-214d includes a first conductive via 214a, a second conductive via 214b, a third conductive via 214c, and a fourth conductive via 214d. The plurality of pads 216a-216d includes a first pad 216a of the first die 212a, a second pad 216b of the second die 212b, a third pad 216c of the third die 212c, and a fourth pad 216d of the fourth die 212d. In other words, the first conductive via 214a extends to the first pad 216a, the second conductive via 214b extends to the second pad 216b, the third conductive via 214c extends to the third pad 214c, and the fourth conductive via 214d extends to the fourth pad 214d.

[0072] The fifth conductive via 214e is Figure 2B The left side of the fifth conductive via 214e extends into the outer peripheral surface 210 and reaches the pad 218 of the substrate 215. Figure 1A-1B The fifth conductive via 128e is the same or similar to the fifth conductive via 128e shown. Figure 1A The pads 130 of the substrate 102 are shown to be the same or similar.

[0073] and Figure 1A-1B Unlike the conductive layer 132 having a stepped structure, the conductive layer 220 is located between the first inclined surface 204 and the Figure 2B The conductive layer 220 has an inclined surface of the first inclined surface 204. The conductive layer 220 extends between some of the plurality of conductive vias 214a-214d and the fifth conductive via 214e. Figure 1A-1B The conductive layer 132 is shown coupling the plurality of conductive vias 214 a - 214 d and the fifth conductive via 214 e together in the same or similar manner.

[0074] The second resin 222 covers and is located on the first inclined surface 204, the second inclined surface 206, the central surface 208, and the outer peripheral surface 210. Figure 1A-1B The second resin 222 may be the same or similar to the second resin 134 shown. In some embodiments, the second resin 222 may not cover the central surface 208, such as Figure 2B As shown, and in contrast, the second resin 222 may be substantially coplanar and flush with the central surface 208 .

[0075] The substrate 215 has Figure 1A-1B The first resin 202 has a plurality of first side walls 224 that are the same as or similar to the plurality of side walls 105 of the substrate 102 shown. Figure 1A-1B The second resin 222 has at least one second side wall 226 that is the same as or similar to the at least one first side wall 124 of the first resin 117. Figure 1A-1B The second resin 134 is shown with a plurality of sidewalls 136 being the same or similar to a plurality of third sidewalls 228. One of the plurality of first sidewalls 224, at least one second sidewall 226, and one of the plurality of third sidewalls 228 are substantially coplanar and flush with each other. For example, one first sidewall 224, at least one second sidewall 226, and one third sidewall 228 are substantially coplanar and flush with each other. Figure 2A The right sides of the package 200 are substantially flush with each other. The side walls 224, 226, 228 respectively constitute the side walls of the package 200.

[0076] Figure 3A is along Figure 3B A cross-sectional view of an alternative embodiment of a stacked die package 300 taken along line CC in FIG. Figure 3B yes Figure 3A A top plan view of an alternative embodiment of a stacked die package 300 is shown. Figure 3A-3B 1A-1B and 2A-2B are alternative embodiments of a stacked die package 300 having the same or similar features as the stacked die packages 100, 200. For simplicity and brevity of the present disclosure, only different or additional features of the stacked die package 300 relative to the stacked die packages 100, 200 shown in FIGS. 1A-1B and 2A-2B will be discussed in further detail below.

[0077] and Figure 1A-1B and Figure 2A-2B Unlike the stacked die packages 100 and 200 shown, the stacked die package 300 includes a first inclined surface 304 and a first resin 306. Figure 3A The first conductive layer 302 is located on the outer peripheral surface 305 of the first resin 306 on the left. The second conductive layer 308 is located on the central surface 310 and the Figure 3A The first conductive layer 302 is disposed on the second inclined surface 312 of the first resin 306 on the right side. Figure 2A The conductive layer 220 shown is the same or similar. Figure 2A The first resin 222 is the same or similar to the first resin 222 shown. Figure 2A-2B The outer peripheral surface 305 is the same as or similar to the first inclined surface 204 shown in FIG. Figure 2A-2B The central surface 310 is the same as or similar to the outer peripheral surface 210 shown. Figure 1A-1B The second inclined surface 312 is the same as or similar to the central surface 208 shown in FIG. Figure 2B The second inclined surface 206 shown is the same or similar.

[0078] The second conductive layer 308 on the central surface 310 and the second inclined surface 312 of the first resin 306 is coupled to the conductive via 314. Figure 3A The conductive via 314 extends through the first resin 306 to the pad 316 of the substrate 318. The pad 316 may be coupled to one of the plurality of pads 319 on the side of the substrate 318 opposite to the side on which the pad 316 exists. One of the plurality of pads 319 coupled to the pad 316 may be grounded.

[0079] The second conductive layer 308 is an electromagnetic interference (EMI) shielding layer for protecting the electrical components in the first resin 306 from external electrical signals. For example, the second conductive layer 308 absorbs external electrical signals from outside the stacked die package 300, transmits the absorbed external electrical signals to the conductive via 314, and then allows the absorbed external electrical signals to pass through one of the plurality of pads 318 coupled to the pad 316, and then the external electrical signals leave the stacked die package 300. The external electrical signals do not reach the plurality of dies 320a, 320b, 320c, 320d in the package 300. The plurality of dies 320a-320d are respectively connected to the plurality of dies 100, 200, and 320d in the package 300. Figure 1A-1B and Figure 2A-2B The plurality of dies 108a-108d, 212a-212d shown in FIG. 1A-108d may be the same or similar. For example, the plurality of dies 320a-320d may be the same as those shown in FIG. Figure 1B and Figure 2A-2B The packages 100 , 200 are stacked in the same or similar offset manner as shown in FIG.

[0080] The second resin 321 covers the first conductive layer 302, the first resin 306, and the second conductive layer 308. Figure 1A-1B and Figure 2A-2B The second resins 134, 222 shown are the same or similar.

[0081] The first conductive layer 302 is coupled to some of the plurality of dies 320a-320d through a plurality of conductive vias 322a, 322b, 322c, 322d. Figure 2A-2B The plurality of conductive vias 322a-322d are the same or similar to the plurality of conductive vias 212a-212d shown in the package 200. Each of the plurality of conductive vias 322a-322d is coupled to a corresponding die in the plurality of dies 320a-20d. The first conductive layer 302 is coupled to the conductive via 322e, from Figure 3A As can be seen from the left side of FIG. 3 , the conductive via 322e extends into the first resin 306 and reaches the contact pad 324 of the substrate 318. The conductive via 322e and the Figure 1A-1B and Figure 2A-2B The conductive vias 128e, 214e in the illustrated packages 100, 200 are the same or similar. The contact pads 324 and Figure 1A and 2A The contact pads 130 , 218 in the illustrated packages 100 , 200 are the same or similar.

[0082] Figure 4A is along Figure 4B An alternative embodiment of a stacked die package 400 taken along line DD in FIG. Figure 4B yes Figure 4A A top plan view of an alternative embodiment of package 400 is shown. Figure 4A-4B 4 is an alternative embodiment of a stacked die package 400 having the same or similar features as the stacked die packages 100, 200, 300. For simplicity and brevity of the present disclosure, only the stacked die package 300 will be discussed in further detail below with respect to the stacked die package 400. Figure 1A-1B , Figure 2A - Figure 2B and Figure 3A-3B Different or additional features of the stacked die packages 100 , 200 , 300 are shown.

[0083] and Figure 1A-1B , Figure 2A-2B and Figure 3A-3B Unlike the first resins 117, 202, and 306 shown, the first resin 402 has a reservoir 404, and the reservoir 404 is located between a first portion 402a of the first resin 402 and a second portion 402b of the first resin 402. The first portion 402a can be a wall portion, a sidewall portion, a border portion, or other type of portion of the first resin 402. The first portion 402a extends away from the substrate 414 on which the first resin 402 is located. The second portion 402b of the first resin 402 surrounds and encapsulates a plurality of tube cores 406a, 406b, 406c, and 406d. The plurality of tube cores 406a-406d are respectively connected to the substrate 414 as shown in FIG. Figure 1A-1B , Figure 2A-2B and Figure 3A-3BThe plurality of tube cores 108a-108d, 212a-212d, 320a-320d in the packages 100, 200, 300 shown are the same or similar. The third portion 402c of the first resin 402 extends from the first portion 402a to the second portion 402b. The first portion 402a, the second portion 402b and the third portion 402c are integrally formed with the first resin 402 and are integrally formed with each other. In other words, the first portion 402a, the second portion 402b and the third portion are made of a single continuous material of the first resin 402. The second portion 402b has an inclined surface 407 with a conductive layer 408 disposed thereon. In other words, the conductive layer 408 is on and covers the inclined surface 407 of the first resin 402. The inclined surface 407 and the conductive layer 408 are within the reservoir 404.

[0084] The conductive layer 408 is respectively connected to Figure 2A-2B and Figure 3A-3B The conductive layer 408 is the same or similar to the conductive layer 220, 302 shown in the package 200, 300. The conductive layer 408 is coupled to some of the plurality of dies 406a-406d through a plurality of conductive vias 410a, 410b, 410c, 410d, each conductive via being coupled to a corresponding die in the plurality of dies 406a-406d. The plurality of conductive vias 410a-410d are connected to Figure 2A-2B and Figure 3A-3B The conductive vias 212a-212d, 322a-322d in the packages 200, 300 are the same or similar. For example, a plurality of conductive vias 410a-410d extend into the inclined surface 407 of the first resin 402. The conductive layer 408 is coupled to the conductive via 410e, which extends through the third portion 402c of the first resin 402 to the contact pad 412 of the substrate 414. The conductive via 410e is connected to the conductive via 410e. Figure 1A-1B , Figure 2A-2B and Figure 3A - Figure 3B The conductive vias 128e, 214e, 322e in the illustrated packages 100, 200, 300 are the same or similar. The contact pads 412 are Figure 1A , Figure 2A and Figure 3A The contact pads 130, 218, 324 in the illustrated packages 100, 200, 300 are the same or similar. Figure 1A-1B , Figure 2A-2B and Figure 3A-3B The substrates 102, 215, 318 in the illustrated packages 100, 200, 300 are the same or similar.

[0085] The reservoir 404 is filled with a second resin 416, which is separated from the substrate 414 by the third portion 402c of the first resin 402. The first resin 402 includes a first surface 418, and the second resin 416 includes a second surface 420. The first surface 418 and the second surface 420 face away from the substrate 414. The first surface 418 is farther away from the substrate 414 than the second surface 420. The second surface 420 is recessed into the first resin 402.

[0086] In some embodiments, the first surface 418 and the second surface 420 are substantially coplanar and flush with each other. In other words, the second surface 420 is not recessed into the first resin 402. In some embodiments, the second resin 416 covers the first surface 418 of the first resin 402, and the second surface 420 is further away from the substrate 414 than the first surface 418.

[0087] Figure 5 Along with Figure 1B , Figure 2B , Figure 3B and Figure 4B AA, BB, CC and DD in FIG. 5 are cross-sectional views of package 500 taken along lines similar to those in FIG. Figure 1A - Figure 1B , Figure 2A-2B , Figure 3A-3B and Figure 4A-4B The packages 100, 200, 300, 400 shown in FIG. 1 are the same or similar. For the sake of simplicity and brevity of the present disclosure, only the stacked die package 500 will be discussed in further detail below with respect to FIG. Figure 1A-1B , Figure 2A-2B , Figure 3A - Figure 3B and Figure 4A-4B Different or additional features of the stacked die packages 100 , 200 , 300 , 400 are shown.

[0088] Unlike packages 100, 200, 300, 400, package 500 includes a package that is closer to Figure 5 The first set of stacked dies 502 on the left and closer Figure 5 The second group of stacked dies 504 on the right. The first group of stacked dies 502 and the second group of stacked dies 504 are mirror images of each other. In some embodiments, the first group of stacked dies 502 and the second group of stacked dies 504 may not be mirror images of each other. The first group of stacked dies 502 and the second group of stacked dies 504 are separated from each other by openings 506.

[0089] The first resin 508 covers and encapsulates the first group of stacked dies 502 and the second group of stacked dies 504. The first resin 508 fills the opening 506 between the first group of stacked dies 502 and the second group of stacked dies 504. The first conductive layer 512 is located on the first inclined surface 514 of the first resin, and the second conductive layer 516 is located on the second inclined surface 518. The first conductive layer 512 and the first inclined surface 514 are opposite to the second conductive layer 516 and the second inclined surface 518. The first conductive layer 512 and the second conductive layer 516 are opposite to the first conductive layer 512 and the second conductive layer 516. Figure 2A-2B , Figure 3A-3B and Figure 4A-4B The conductive layers 220, 302, 408 in the packages 200, 300, 400 are the same or similar. The first inclined surface 514 and the second inclined surface 518 are respectively Figure 2A , Figure 3A and Figure 4A The angled surfaces 204, 304, 407 in the illustrated packages 200, 300, 400 are the same or similar.

[0090] The first plurality of first conductive vias 520a, 520b, 520c, 520d couple the first conductive layer 512 to some of the dies in the first group of stacked dies 502, and the second plurality of second conductive vias 522a, 522b, 522c, 522d couple the second conductive layer 516 to some of the dies in the second group of stacked dies 504. The first plurality of conductive vias 520a-520d and the second plurality of conductive vias 522a-522d are connected to the first conductive layer 512. Figure 2A-2B , Figure 3A-3B and Figure 4A-4B The conductive vias 214a - 214d , 322a - 322d , 410a - 410d in the illustrated packages 200 , 300 , 400 are the same or similar.

[0091] The first conductive layer 512 and the second conductive layer 516 are coupled to the substrate 523. The first conductive layer 512 is coupled to a conductive via 520e, which extends into the first resin 508 to reach a first contact pad 524 of the substrate 523, as shown in FIG. Figure 5 The second conductive layer 516 is coupled to the conductive via 522e, and the conductive via 522e extends into the first resin 508 and reaches the second contact pad 526 of the substrate 523, as shown in FIG. Figure 5 As shown on the right side. Conductive vias 520e, 522e and Figure 1A - Figure 1B , Figure 2A-2B , Figure 3A-3B and Figure 4A-4BThe conductive vias 128e, 214e, 322e, 410e in the illustrated packages 100, 200, 300, 400 are the same or similar. The contact pads 524, 526 are similar to those in the illustrated packages. Figure 1A , 2A The contact pads 130, 218, 324, 412 in the packages 100, 200, 300, 400 shown in FIGS. 3A and 4A are the same or similar.

[0092] The second resin 528 is located on the first inclined surface 514 and the second inclined surface 518 of the first resin 508. The second resin 528 is located on the first conductive layer 512 and the second conductive layer 516 and covers the first conductive layer 512 and the second conductive layer 516. Figure 1A-1B Figure 2A- Figure 2B , Figure 3A-3B and Figure 4A-4B The second resin 134, 222, 322, 416 in the packages 100, 200, 300, 400 shown are the same or similar. The second resin 528 includes a Figure 5 The first portion 528a on the left and the Figure 5 The second portion 528b on the right side. The first portion 528a is separated from the second portion 528b by the first resin 508.

[0093] The first resin 508 has a first surface 530 facing away from the substrate 523. The first portion 528a of the second resin 528 includes a second surface 532 facing away from the substrate 523. The second portion 528b of the second resin 528 includes a third surface 534 facing away from the substrate 523. The first surface 530, the second surface 532, and the third surface 534 are substantially coplanar and flush with each other, thereby forming a single surface or a single surface. In some embodiments, the second resin 528 can be located on the first surface 530 of the first resin 508 and cover the first surface 530.

[0094] In some embodiments, the first portion 528a and the second portion 528b are two separate and distinct portions separated from each other by the first resin 508. In some embodiments, when the second resin 528 surrounds the first resin 508, the first portion 528a and the second portion 528b are continuous and integrally formed with each other.

[0095] In some embodiments, the die may be stacked on the first group of stacked dies 502 and the second group of stacked dies 504. In other words, the die extends from the first group of stacked dies 502 to the second group of stacked dies 504.

[0096] Figure 6A-6C Yes Figure 1A-1BThe present invention is a cross-sectional view of various steps of an embodiment of a method for manufacturing an embodiment of package 100. For the sake of brevity and simplicity of the present disclosure, the details previously discussed with respect to package 100 will not be repeated herein. Although the following description of the steps of the method for manufacturing package 100 is provided as being completed in a particular order, it is readily understood that the steps of the method for manufacturing package 100 may be reorganized or rearranged to form package 100 using alternative embodiments of the method for manufacturing package 100.

[0097] like Fig. 6A As shown, in an embodiment of the manufacturing method of the stacked die package 100, the stacked die groups 602 are stacked on a substrate 604, which may be a wafer, a printed circuit board (PCB), a lead frame substrate, or a silicon substrate. The stacked die groups 602 may be some of the stacked die groups in an array of stacked die groups on the substrate 604. The stacked die groups 602 include a plurality of stacked die groups located on the substrate 604. Fig. 6A The first set of stacked dies on the left and the Fig. 6A The second set of stacked dies on the right. Fig. 6A As shown in FIG. 6C , each group of stacked dies 602 has four dies. Figure 1A-1B The plurality of dies 108a-108d shown are identical or similar. In other words, each set of stacked dies 602 corresponds to Figure 1A-1B The plurality of dies 108a-108d in the package 100 are shown. The adhesive layer 606 is used to couple the dies in the group of stacked dies 602 to each other and to couple the group of stacked dies 602 to the substrate 604. The adhesive layer 606 is connected to the substrate 604. Figure 1A-1B The illustrated bonding layers 110a - 110d are identical or similar. The grouped stacked dies 602 may be stacked and coupled on the substrate 604 by a pick and place technique or other suitable technique for stacking and coupling the grouped stacked dies 602 on the substrate 604 .

[0098] In some embodiments, each group of stacked dies 602 may have two stacked dies, three stacked dies, five stacked dies, or any number of stacked dies as desired. Fig. 6A At each arrangement position of each group of stacked dies 602 shown, the group of stacked dies 602 stacked on the substrate 604 may be replaced by a single die.

[0099] After the stacked die groups 602 are stacked and coupled on the substrate 604, a first resin 608 is formed on the stacked die groups 602. The first resin 608 is formed to include a group of steps 610, each group of steps 610 being connected to a substrate 604. Figure 1A-1B The plurality of steps 118 in the package 100 shown are the same or similar; and a side wall 611, the side wall 611 and Figure 1A-1BThe second sidewalls 126 of the illustrated packages 100 are identical or similar. The set of steps 610 includes a step closer to Fig. 6A The first plurality of steps 610 on the left correspond to the closer Fig. 6A The first set of stacked dies 602 on the left, and closer Fig. 6A The second plurality of steps 610 on the right side corresponds to the closer Fig. 6A The second group of stacked dies 602 on the right. In other words, each set of steps 610 corresponds to at least one corresponding group of stacked dies 602.

[0100] The first resin 608 may be a molding compound, a sealant, an epoxy resin, or other non-conductive material. The resin 604 is formed by a compression molding technique, an injection molding technique, or other techniques for forming the resin 604. For example, if the injection molding technique is used, a molding tool having a protrusion with a shape or structure similar to the grouped steps 610 and the sidewalls 611 is used to form the grouped steps 610. The molding tool is aligned above and aligned with the plurality of stacked tube cores 602, and then the first resin 608 is injected between the molding tool and the substrate 604. The injected first resin 608 is formed on and covers the grouped stacked tube cores 602. Then, the first resin 608 is allowed to cure between the molding tool and the substrate 604. Then, after the first resin 608 is cured, the molding tool is removed from the first resin 608 to form the grouped steps 610 and the sidewalls 611 of the first resin 608.

[0101] In some embodiments, the first resin 608 can be formed on the plurality of stacked dies 602 without the grouped steps 610, and after the first resin 608 is cured, the first resin 608 is patterned by at least etching technology, laser technology, or other removal technology or a combination of removal technologies suitable for removing a portion of the first resin 608 to form the grouped steps 610.

[0102] like Figure 6B As shown, after forming the group of steps 610 in the first resin 608, a first conductive via 612, a second conductive via 614, and a conductive layer 620 are formed. The first conductive via 612 extends into the step in the group of steps 610 of the first resin 608, contacting the contact pad 613 of the die in the group of stacked dies 602, and the second conductive via 614 extends into the first resin 608, contacting the contact pad 616 of the substrate 604. The contact pad 616 of the substrate 604 is coupled to at least one contact pad of a plurality of contact pads 618 of the substrate 604, and the plurality of contact pads 618 are located on a side of the substrate 604 opposite to a side of the substrate 604 on which the contact pad 616 is disposed. The first conductive via 612 and the second conductive via 614 are connected to each other. Figure 1A-1BThe conductive vias 128a-128d in the package 100 shown are the same or similar, and the second conductive via 614 is the same as Figure 1A The conductive via 128e in the illustrated package 100 is the same or similar. The contact pad 616 is Figure 1A The contact pads 618 are the same or similar to the pads 130 shown. Figure 1A The conductive pads 107 shown are the same or similar.

[0103] First conductive via 612 and second conductive via 614 are formed by laser drilling in first resin 608 using a laser followed by an electroplating process. Conductive layer 620 is formed by moving the laser along and across the surface of set of steps 610, activating the additive material in first resin 608, followed by an electroplating process.

[0104] Drilling holes in the first resin 608 forms openings or recesses extending into the first resin 608. Each opening or recess corresponds to at least one contact pad 613 of the group of stacked dies 602 or at least one contact pad 616 of the substrate 604. The openings or recesses expose some of the contact pads 613, 616 of the group of stacked dies 602 and the substrate 604, respectively. Laser drilling in the first resin 608 to form openings and recesses in the first resin 608 activates the additive material in the first resin 608 so that the additive material can be located on and exposed along the sidewalls of the opening or recess. The additive material can be a material doped in the first resin 608. When in the first resin 608, the additive material can be relatively non-conductive compared to after the first resin 608 is exposed to the laser. When the first resin 608 is exposed to the laser, the additive material in the first resin 608 becomes conductive so that the additive material can be used to attract another conductive material during an electroplating process or other suitable plating process.

[0105] In one embodiment, the laser forms a micro-rough surface, and during the metallization process, copper or another metal or metal alloy can be attached to the micro-rough surface. In some examples, the additive material can be antimony, tin, or a combination of antimony and tin. The additive can be encapsulated in a polycarbonate resin.

[0106] Simultaneously or sequentially with drilling openings or recesses in the first resin 608, the laser moves along the surface of the grouped steps 610, thereby activating and exposing the additive material along the surface of the grouped steps 610 of the first resin 608. For example, the laser may drill openings corresponding to Figure 6BThe laser may be moved along the rightmost group of steps 610 to a second opening or recess drilled by the laser corresponding to another first conductive via 612 after drilling the first opening or recess corresponding to the rightmost first conductive via 612. These simultaneous or sequential movements of the laser activate and expose the additive material within the opening or recess along the surface of the first resin 608. For example, when the opening or recess is drilled, the additive material may cover the sidewalls of the opening or recess extending into the first resin 608, and when the laser moves along the surface of the group of steps 610, the additive material may cover the surface of the group of steps 610.

[0107] The additive material is a material that attracts and adheres to the conductive material during the electroplating process, which forms the conductive material on the additive material along the surface of the group of steps 610 and within the openings or recesses in the first resin 608. The conductive material is formed during this electroplating process while forming the first conductive via 612, the second conductive via 614, and the conductive layer 620.

[0108] As the laser moves along the surface of the groups of steps 610 of the first resin 608, the laser may remove layers of the first resin 608. Removing the layers of the first resin 608 will cause the conductive layer 620 to completely or partially protrude outward from the surface of the groups of steps 610 of the resin 608. In other words, in some embodiments, the conductive layer 620 will protrude outward from the surface of the groups of steps 610 of the first resin 608 such that the conductive layer 620 is not completely or entirely recessed within the first resin 608.

[0109] However, in some embodiments, conductive layer 620 may be partially or completely recessed within first resin 608. Whether conductive layer 620 is partially or completely recessed within first resin 608 depends on the selected speed and time that the laser moves along the surface of set of steps 610. For example, if the laser moves forward at a first speed, the layer of first resin 608 that is removed may be thicker than if the laser moves forward at a second speed, which is faster than the first speed.

[0110] After the additive material in the first resin 608 is activated, the first conductive via 612, the second conductive via 614, and the conductive layer 620 are formed by an electroplating process. During the electroplating process, the conductive material is attracted to and adheres to the additive material, which has been previously activated and exposed by the laser, as described above. During the electroplating process, the conductive material fills the openings or recesses that form the first and second conductive vias 612, 614. While the electroplating process is in progress, the conductive material is attracted to the additive material activated along the surface of the grouped steps 610. The conductive material adheres to the additive material along the surface of the grouped steps 610 that form the conductive layer 620. In other words, the first conductive via 612, the second conductive via 614, and the conductive layer 620 are substantially formed while the electroplating process (which may be a plating bath process) is in progress.

[0111] In some embodiments of the manufacturing method of the stacked die package 100, a resist material covering the surface of the first resin may be formed on the first resin 608. For example, the resist material may be formed on the surface of the group of steps 610. The resist material may be doped with an additive material similar to the additive material in the first resin 608. The resist material may be a photoresist material, a solder resist material, or other types of suitable resist materials.

[0112] As the laser moves along the resist material on the first resin 608, the laser removes a portion of the resist material, so that the laser reaches the first resin 608 and activates the additive material within the first resin 608 along the surface of the first resin 608. The laser forms the resist material into a pattern having recesses and openings. After the resist material and the first resin 608 are patterned by the laser, the resist material can help form conductive vias 612, 614 within the first resin 608 and form a conductive layer 620 at selected locations along the surface of the first resin 608. For example, the openings and recesses in the resist material patterned by the laser serve as boundaries, so that the conductive vias 612, 614 and the conductive layer 620 are formed within the openings and recesses of the resist material.

[0113] The openings and recesses in the resist material guide the conductive material to form the conductive vias 612, 614 and the conductive layer 620 during the electroplating process, thereby reducing the possibility of forming unintended electrical connections within the stacked die package. For example, if the conductive material forming the conductive vias 612, 614 and the conductive layer 620 overflows, an electrical connection may be formed in the stacked die package 100, resulting in a short circuit or crosstalk between the electrical connections within the stacked die package 100.

[0114] In some embodiments of the manufacturing method of the stacked die package 100, the resist material may be removed after forming the conductive vias 612, 614 and the conductive layer 620. In some embodiments of the manufacturing method of the stacked die package 100, the resist material may remain after forming the conductive vias 612, 614 and the conductive layer 620, and then the resist material may be covered by the second resin 622.

[0115] After forming the conductive layer 620 and the conductive vias 612, 614, a second resin 622 is formed on the first resin 608 and the conductive layer 620. The second resin 622 is formed to cover the set of steps 610, the conductive layer 612, and the sidewalls 611. The second resin 622 can be the same or similar to the first resin 608 discussed previously. The second resin 622 can be formed in the same or similar manner as the first resin 608 discussed previously. However, in some embodiments, the second resin 622 can be formed by a process different from the formation of the first resin 608. Therefore, for the sake of brevity and simplicity, the formation of the second resin 622 is not discussed in full detail because it is easy to understand how to form the second resin 622 based on the previous discussion on forming the first resin 608.

[0116] However, unlike the first resin 608 formed using a molding tool having a protrusion for forming a group of steps 610 and a side wall 611, the molding tool for forming the second resin 622 does not include a protrusion like the molding tool for forming the first resin 608 having a group of steps 610 and a side wall 611.

[0117] After forming the second resin 622, a plurality of solder balls 626 are formed on some of the plurality of contact pads 618. The solder balls 626 may be formed by a solder reflow technique or other suitable technique for forming the solder balls 626 on the contact pads 618.

[0118] After forming solder balls 626, the grouped stacked die 602, substrate 604, first resin 608 and second resin 622 are singulated along dashed lines 624 to form stacked die package 100. The singulation step to form stacked die package 100 may be accomplished by saw, laser or other singulation tools.

[0119] In some embodiments, solder balls 626 may not be formed on contact pads 618 before singulation, and alternatively, solder balls 626 may be formed on contact pads 618 after singulation.

[0120] Figure 7 Yes Figure 3A-3B The manufacturing method of the package 300 is a cross-sectional view of the steps of the embodiment of the manufacturing method of the package 300. FIG. 6A to FIG. 6C The manufacturing method of the package 100 shown is the same or similar. Therefore, for the sake of simplicity and brevity of the present disclosure, only the manufacturing method of the package 300 will be discussed in further detail below with respect to the manufacturing method of the package 100. FIG. 6A to FIG. 6C Different or additional steps in the method of manufacturing package 100 are shown.

[0121] Different from the manufacturing method of the package 100, the first resin 702 is formed to have a first inclined surface 704, a second inclined surface 706, and a third surface 707 extending between the first inclined surface 704 and the second inclined surface 706. Figure 3A 3A. The first inclined surface 704, the second inclined surface 706, and the third surface 707 are the same as or similar to the central surface 310 of the package 300 shown in FIG. 3A. The first inclined surface 704, the second inclined surface 706, and the third surface 707 of the first resin 702 are formed in the same manner as in the embodiment of the present invention. Fig. 6A to Figure 6C The steps 610 of the first resin 608 shown and discussed are formed in the same or similar manner. FIG. 6A to FIG. 6C The first resin 608 shown is the same or similar to that discussed above.

[0122] Different from the manufacturing method of package 100, a conductive via 708 is formed extending into the first resin 702 to reach the contact pad 710 of the substrate 712. The conductive via 708 is connected to the Figure 3A-3B The conductive via 314 of the package 300 shown is the same or similar. The conductive via 708 is formed in the same manner as in the embodiment of the present invention. FIG. 6A to FIG. 6C The first and second conductive vias 612 , 614 shown and discussed are formed in the same or similar manner.

[0123] Different from the manufacturing method of the package 100 , the first conductive layer 714 is formed on the corresponding first inclined surface 704 , and the second conductive layer 716 is formed on the corresponding second inclined surface 706 and the corresponding third surface 707 .

[0124] The first conductive layer 714 is connected to Figure 3A-3B The first conductive layer 302 of the package 300 shown and discussed is the same or similar. The second conductive layer 716 is the same as or similar to the first conductive layer 302 of the package 300 shown and discussed. Figure 3A-3B The second conductive layer 716 is the same or similar to the second conductive layer 308 of the package 300 shown and discussed. Fig. 6A - Figure 6C The conductive layer 620 shown and discussed above is formed by the same or similar process. Figure 6A-6CThe conductive layer 620 is formed by the same or similar process as shown and discussed above. Figure 3A and Figure 3B The conductive vias 322a - 322e in the illustrated package 300 are the same or similar.

[0125] In some embodiments, as described above with respect to Figure 6A-6C The same or similar conductive layer 610 discussed above, conductive layers 714 , 716 fully or partially protrude outwardly from the first resin 702 .

[0126] After forming the first conductive layer 714 and the second conductive layer 716, the second resin 718 is formed on the first resin 702, the first conductive layer 714 and the second conductive layer 716. The second resin 718 covers the first resin 702, the first conductive layer 714 and the second conductive layer 716. Figure 3A-3B The second resin 321 of the package 300 shown and discussed is the same or similar.

[0127] It is easy to understand that the manufacturing method of the package 200 is similar to that of the Figure 7 The method of manufacturing package 300 is the same or similar as shown and discussed. However, unlike the method of manufacturing package 300, the method of manufacturing package 200 does not include forming conductive vias 708 and second conductive layer 716.

[0128] Figure 8 Yes Figure 4A-4B The manufacturing method of the package 400 is a cross-sectional view of the steps of the embodiment of the manufacturing method of the package 400. FIG. 6A to FIG. 6C The manufacturing method of the package 400 is the same or similar to that of the package 100 and 300 shown in FIG7 . Therefore, for the sake of simplicity and brevity of the present disclosure, only the manufacturing method of the package 400 will be discussed in further detail below with respect to the manufacturing method of the package 400. FIG. 6A to FIG. 6C Different or additional steps from the method of manufacturing the packages 100 , 300 shown in FIG. 7 .

[0129] Different from the manufacturing method of the package 100, 300, a first resin 802 including a plurality of reservoirs 804 is formed. Figure 4A-4B The reservoirs 404 of the package 400 shown are the same or similar. The formation process of the plurality of reservoirs 804 is the same as Figure 6C The formation process of the group of steps 610 shown and discussed is the same or similar. FIG. 6A to FIG. 6C The first resin 608 shown is the same or similar to that discussed above.

[0130] A plurality of reservoirs 804 are filled with Figure 4A-4B The second resin 416 of the package 400 is the same as or similar to the second resin 806. The second resin 806 is Figure 6C and Figure 7 The second resins 622, 718 shown and described are the same or similar. The second resin 806 may be injected, flowed, or formed within the reservoir using other suitable techniques.

[0131] Because the conductive layer in the package 100, 200, 300, 400, 500 is formed using the LDS process, the package 100, 200, 300, 400, 500 of the present disclosure reduces the amount of conductive material used to form the conductive layer in the package 100, 200, 300, 400, 500. In other words, the laser in the LDS process drills into the first resin and moves along the surface of the first resin, activating the additive material in the first resin, which is used to form the conductive layer in the package 100, 200, 300, 400, 500. After activating the additive material, an electroplating process is performed to couple the conductive material to the additive material, forming a conductive via extending into the first resin, and forming a conductive layer on the first resin in the package 100, 200, 300, 400, 500. The use of the LDS process in combination with the electroplating process reduces the amount of material relative to the wire bonding forming process.

[0132] Packages 100, 200, 300, 400, 500 are less expensive to manufacture than conventional packages that utilize wire bonding techniques to electrically couple stacked die within a conventional package. Wire bonding techniques are very expensive because forming wire bonds requires the use of expensive, high-precision machines that are expensive to maintain and use. Unlike wire bonding techniques, as shown in the present disclosure, forming a conductive layer within package 100, 200, 300, 400, 500 to couple some of the plurality of stacked die is relatively inexpensive compared to forming wire bond connections because a laser can be drawn along the surface of a first resin doped with an additive material, the additive material is activated by the laser, and then an electroplating process is performed to couple the conductive material to the activated additive material. Therefore, it is not necessary to use a high-precision machine that forms wire bonds to electrically couple some of the plurality of stacked die within package 100, 200, 300, 400, 500.

[0133] Compared to conventional packages that utilize wire bonding technology to electrically couple stacked dies within a conventional package, packages 100, 200, 300, 400, 500 have a shorter manufacturing time. As previously described, wire bonding technology is a high-precision process that requires high-precision machinery, and therefore, the formation of wire bonds takes a relatively long time compared to other steps in the manufacturing process of conventional packages with wire bonds. This relatively long amount of time reduces the units per hour (UPH) that can be manufactured using wire bonding technology. Alternatively, relative to the formation of conventional packages using wire bonding technology, packages 100, 200, 300, 400, 500 are formed using the LDS process of the present disclosure, and the formation of conductive vias and conductive layers in packages 100, 200, 300, 400, 500 enables the manufacture of packages 100, 200, 300, 400, 500 with a larger UPH.

[0134] Packages 100, 200, 300, 400, 500 are manufactured with higher reliability than conventional packages that include wirebond electrical connections. Wirebond formation is generally very sensitive and is a step that is relatively more likely to form defects. In addition, wire bonds are very fragile, and the resin formed to cover the wire bonds may cause the wire bonds to break or crack. However, unlike wire bonds, the conductive layer directly located on the surface of the resin reduces the possibility of manufacturing defects or the impact of manufacturing defects. For example, if a wire bond breaks, generally the wire bond will break completely and the two parts will break away from each other, causing the wire bond to not work. However, unlike wire bonds, the conductive layer of the present disclosure can only be partially broken, so that the electrical connection formed by the conductive layer still works in the embodiments of the stacked die packages 100, 200, 300, 400, 500.

[0135] Packages 100, 200, 300, 400, 500 are generally more robust to expansion and contraction due to exposure to temperature changes than conventional packages that utilize wire bonds to form electrical connections within the conventional package. For example, the wire bonds of conventional packages are more likely to crack or break when exposed to temperature changes than the conductive layers of the present disclosure.

[0136] The various embodiments described herein can be combined to provide further embodiments. If necessary, aspects of the embodiments can be modified to adopt the concepts of various patents, applications and publications to provide further embodiments.

[0137] These and other changes may be made to the embodiments in light of the teachings of the detailed description above. Generally, the terms used in the following claims should not be construed to limit the claims to the specific embodiments disclosed in the specification and claims, but should be construed to include the entire scope of all possible embodiments and claim equivalents. Accordingly, the claims are not limited by the present disclosure.

Claims

1. A semiconductor device comprising: substrate; a first die on the substrate; a second tube die, on the first tube die; a first resin having a plurality of steps on the substrate, the first tube die and the second tube die; a first conductive layer, electrically coupled to the substrate, the first tube core and the second tube core, the first conductive layer being located on the plurality of steps; as well as a second resin disposed on the first resin and the first conductive layer; The first conductive layer is located between the second resin and the first resin.

2. The semiconductor device according to claim 1, wherein: The first resin includes a first sidewall; and The second resin includes a second sidewall that is coplanar with the first sidewall of the first resin.

3. The semiconductor device according to claim 1, wherein the first conductive layer further comprises: a first contact on the substrate; a second contact on the first die; a third contact on the second die; a first conductive via extending into the first resin to reach the first contact, the first conductive via electrically coupling the first conductive layer to the first contact; a second conductive via extending into a first step of the plurality of steps to reach the second contact, the second conductive via electrically coupling the first conductive layer to the second contact; as well as A third conductive via extends into a second step of the plurality of steps to reach the third contact, wherein the third conductive via electrically couples the first conductive layer to the third contact. 4 . The semiconductor device according to claim 1 , wherein the first resin encapsulates the first die and the second die, and the second resin encapsulates the first die and the first conductive layer. 5 . The semiconductor device according to claim 1 , wherein the first resin is a laser direct structuring (LDS) compatible resin, and the second resin is a material different from the first resin.

6. The semiconductor device according to claim 5, wherein the first resin includes a first sidewall and a second sidewall opposite to each other, and the second resin includes a first sidewall and a second sidewall opposite to each other, the first sidewall of the first resin being coplanar with the first sidewall of the second resin. 7 . The semiconductor device according to claim 6 , wherein the first sidewall of the first resin has a first dimension in a first direction, and the first sidewall of the second resin has a second dimension in the first direction, the first dimension being larger than the second dimension.

8. The semiconductor device according to claim 7, further comprising: A second conductive layer is between the first resin and the second resin, the second conductive layer being separate and distinct from the first conductive layer, the second conductive layer being electrically coupled to the substrate.

9. The semiconductor device according to claim 1, further comprising: A reservoir is provided in the first resin, the second resin being located in the reservoir and aligned with the first conductive layer. 10 . The semiconductor device according to claim 9 , wherein the first resin includes pillars which form outer side walls and inner walls of the reservoir.

11. A semiconductor device comprising: substrate; a first tube core, on the substrate, the first tube core having a first surface and a plurality of sidewalls; a second tube die, on the first surface, the second tube die having a second surface facing away from the first tube die and a plurality of second sidewalls; a first resin having angled surfaces on the first surface, the second surface, the first sidewall, and the second sidewall, wherein the first resin is compatible with laser direct structuring; as well as a first conductive layer on the angled surface of the first resin, the first conductive layer electrically coupled to the first die, the second die, and the substrate; as well as a second resin on the first resin, the second resin being a different material from the first resin; The first conductive layer is located between the second resin and the first resin. 12 . The semiconductor device according to claim 11 , wherein the first resin completely covers the second surface, the first sidewall, and the second sidewall, the first resin including a plurality of outer sidewalls. 13 . The semiconductor device according to claim 12 , wherein the second resin includes a plurality of outer sidewalls coplanar with a plurality of outer sidewalls of the first resin.

14. The semiconductor device according to claim 13, further comprising: A second conductive layer is on the first resin, the second conductive layer is separate and distinct from the first conductive layer, and the second conductive layer is electrically coupled to the substrate. 15 . The semiconductor device of claim 11 , wherein one of the plurality of sidewalls of the second die extends beyond the first die and forms an opening.

16. The apparatus of claim 15, wherein the first resin completely and fully fills the opening.

17. A semiconductor device comprising: substrate; a first set of stacked dies on the substrate; a second set of stacked dies on the substrate; opening to separate the first group of stacked dies from the second group of stacked dies; a first resin filling the opening and encapsulating the first group of stacked dies and the second group of stacked dies, wherein the first resin further comprises a first inclined surface and a second inclined surface; a first conductive layer on the first resin, the first conductive layer coupling a die in the first set of stacked dies to the substrate; a second conductive layer on the first resin, the second conductive layer being separate and distinct from the first conductive layer and coupling the dies in the second set of stacked dies to the substrate; a second resin on the first inclined surface and the second inclined surface and on the first conductive layer and the second conductive layer; The first conductive layer and the second conductive layer are located between the second resin and the first resin. 18 . The semiconductor device according to claim 17 , wherein the first resin further includes a third surface transverse to the first inclined surface and the second inclined surface, the third surface extending from the first inclined surface to the second inclined surface. 19 . The semiconductor device according to claim 18 , wherein the first conductive layer is located on the first inclined surface, and the second conductive layer is located on the second inclined surface. 20 . The semiconductor device of claim 19 , wherein the second resin further comprises a fourth surface that is substantially coplanar with the third surface.

21. A method for manufacturing a semiconductor device, comprising: coupling the first die to the substrate; coupling a second die offset relative to the first die; forming a first resin having a laser responsive additive material covering the first die and the second die; forming a first opening into the first resin to the first die by activating the additive material with a laser; forming a second opening in the first resin to the second die by activating the additive material with the laser; as well as activating the additive material along a first surface of the first resin between the first opening and the second opening by moving the laser along the first surface; forming a first conductive layer along the first surface, the first opening and the second opening by an electroplating process; as well as A second resin is formed on the first resin to cover the first conductive layer on the first resin, so that the first conductive layer is located between the second resin and the first resin.

22. The method of claim 21, wherein forming the first conductive layer comprises attracting conductive material to the additive material in the first opening and the second opening along the first surface. 23 . The method of claim 21 , wherein forming the first resin further comprises forming a plurality of steps corresponding to the first die and the second die. 24 . The method of claim 23 , wherein forming the first conductive layer further comprises forming the first conductive layer on a step among a plurality of steps of the first resin.

25. The method of claim 21, wherein forming the first resin further comprises forming a reservoir in the first resin.

26. The method of claim 25, wherein forming the first conductive layer further comprises forming the first conductive layer in the reservoir of the first resin.

27. The method of claim 26, wherein forming the second resin on the first resin further comprises filling the reservoir of the first resin by forming the second resin in the reservoir.

28. The method of claim 21, wherein activating the additive material further comprises activating the additive material to be conductive.

Images