An automatic detection circuit board broken line repairing device and repairing method

Abstract

The application relates to a device for automatically detecting and repairing a broken wire of a circuit board, comprising a mounting bracket, a visual detection unit and a control host arranged on the mounting bracket; a shaping assembly, a dispensing assembly and a repair layer feeding assembly are arranged on the mounting bracket, the dispensing assembly and the repair layer feeding assembly are arranged side by side, a horizontal moving unit for driving the dispensing assembly and the repair layer feeding assembly to move horizontally synchronously is arranged on the mounting bracket, and the horizontal moving unit is located between the shaping assembly and the visual detection unit; the device can automatically identify and complete the repair work of the circuit board, saves manpower, has good product consistency, guarantees the repair efficiency and quality, and adopts a mode of extruding a hot-cured resin ring, so that the repair is very flexible, the adaptability to the wire size is excellent, and the applicability of a single device is greatly expanded.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of circuit board broken line repair, in particular to an automatic detection circuit board broken line repair device and repair method. BACKGROUND

[0002] During the processing or maintenance of the circuit board, the broken line repair is often needed. At present, the manual repair is mostly used for the repair, which requires high technical level of the workers, and the product consistency is poor, time-consuming and laborious, and the efficiency is low. There is no automatic detection and repair method for the circuit board broken line repair. SUMMARY

[0003] The present application provides an automatic detection circuit board broken line repair device and repair method to solve the above-mentioned defects of the prior art.

[0004] The technical scheme adopted by the present application to solve the technical problem is:

[0005] An automatic detection circuit board broken line repair device is constructed, which comprises a mounting bracket, a visual detection unit and a control host are arranged on the mounting bracket; a shaping assembly, a dispensing assembly and a repair layer supply assembly are arranged on the mounting bracket, the dispensing assembly and the repair layer supply assembly are arranged side by side, a horizontal movement unit is arranged on the mounting bracket to drive the dispensing assembly and the repair layer supply assembly to move horizontally synchronously, and the horizontal movement unit is located between the shaping assembly and the visual detection unit;

[0006] The shaping assembly comprises a left clamping plate, a right clamping plate, a distance adjusting unit for adjusting the distance between the left clamping plate and the right clamping plate, and a first lifting unit for driving the left clamping plate, the right clamping plate and the distance adjusting unit to lift; the shaping assembly further comprises a first feeding unit for feeding a circular hot curing resin ring in the middle region of the left clamping plate and the right clamping plate;

[0007] The dispensing assembly comprises a dispensing valve for injecting conductive glue into the hot curing resin ring and a second lifting unit for driving the dispensing valve to lift, and the second lifting unit is connected with the horizontal movement unit and driven by the horizontal movement unit to move horizontally;

[0008] The repair layer supply assembly comprises a repair wire, a metal suction head for adsorbing the repair wire, and a third lifting unit for driving the metal suction head to lift; a heating strip assembly for heating the repair wire is arranged at the lower end of the metal suction head;

[0009] The visual detection unit, the shaping assembly, the dispensing assembly, the repair layer supply assembly and the horizontal movement unit are electrically connected with the control host and controlled by the control host.

[0010] The automatic detection circuit board broken line repairing device, wherein the upper end of the clamping surface of the left clamping plate and the right clamping plate is inclined towards each other, and the inclination angle is 1-5 degrees.

[0011] The automatic detection circuit board broken line repairing device, wherein the first lifting unit comprises a first screw rod and a first screw rod motor driving the same; the distance adjusting unit is an electric clamping jaw; a longitudinal mounting plate is arranged on the mounting bracket, the first lifting unit is mounted on the mounting plate, and the electric clamping jaw is longitudinally slidably connected to the mounting plate.

[0012] The automatic detection circuit board broken line repairing device, wherein a placing positioning table for placing the circuit board to be repaired is arranged on the mounting bracket.

[0013] The automatic detection circuit board broken line repairing device, wherein the horizontal moving unit comprises a cross beam fixed on the mounting bracket, an activity plate, a second screw rod and a second screw rod motor driving the activity plate to horizontally move are arranged on the cross beam; the activity plate is provided with the glue dispensing assembly and the repairing layer feeding assembly.

[0014] The automatic detection circuit board broken line repairing device, wherein a feeding tray for feeding the repairing layer feeding assembly is arranged on the mounting bracket.

[0015] The automatic detection circuit board broken line repairing device, wherein a fourth lifting unit driving the visual detection unit to lift is arranged on the mounting bracket.

[0016] An automatic detection circuit board broken line repairing method applied to the automatic detection circuit board broken line repairing device, and the implementation method is as follows.

[0017] The circuit board to be repaired is placed below the visual detection unit, the visual detection unit acquires an image and sends the image to the control host;

[0018] Under the control of the control host, the first lifting unit drives the left clamping plate, the right clamping plate and the distance adjusting unit to descend to within 0.5 mm from the circuit board to be repaired, the first feeding unit feeds the hot curing resin ring to the circuit board in the middle region of the left clamping plate and the right clamping plate, then the distance adjusting unit drives the left clamping plate and the right clamping plate to close, the hot curing resin ring is extruded into an elongated shape, and the inner hole width of the elongated shape is smaller than the width of the wire to be repaired;

[0019] Under the control of the control host, the horizontal moving unit drives the glue dispensing assembly to be located directly above the hot curing resin ring, the second lifting unit drives the glue dispensing valve to move downward to point the conductive glue in the hot curing resin ring, and the glue dispensing valve is reset after the glue dispensing is completed.

[0020] Under the control of the control host, after the metal suction head adsorbs the repair wire of a proper size, the horizontal moving unit operates to make the metal suction head be located right above the heat-curing resin ring, the third lifting unit operates to drive the metal suction head to place the repair wire on the heat-curing resin ring and keep a set pressing force, the heating strip assembly heats to make the heat-curing resin ring be heated to bond the circuit board to be repaired and the repair wire, and the repair action is completed.

[0021] The beneficial effects of the present application are that the circuit board to be repaired is placed below the visual detection unit, the visual detection unit acquires an image and sends it to the control host; under the control of the control host, the first lifting unit operates to drive the left clamping plate, the right clamping plate and the distance adjusting unit to be lowered to be within 0.5mm from the circuit board to be repaired, the first feeding unit feeds the heat-curing resin ring to the circuit board in the middle region between the left clamping plate and the right clamping plate, and then the distance adjusting unit operates to drive the left clamping plate and the right clamping plate to be closed, so that the heat-curing resin ring is extruded into an elongated strip shape and the inner hole width of the elongated strip shape is less than the width of the wire to be repaired; under the control of the control host, the horizontal moving unit operates to make the glue dispensing assembly be located right above the heat-curing resin ring, the second lifting unit operates to drive the glue dispensing valve to be lowered to dispense conductive glue in the heat-curing resin ring, and then the glue dispensing valve is reset after the glue dispensing is completed; under the control of the control host, after the metal suction head adsorbs the repair wire of a proper size, the horizontal moving unit operates to make the metal suction head be located right above the heat-curing resin ring, the third lifting unit operates to drive the metal suction head to place the repair wire on the heat-curing resin ring and keep a set pressing force, the heating strip assembly heats to make the heat-curing resin ring be heated to bond the circuit board to be repaired and the repair wire, and the repair action is completed; the circuit board repair work can be automatically recognized and completed, manpower is saved, product consistency is good, repair efficiency and quality are guaranteed, and the way of extruding the heat-curing resin ring can make the repair very flexible and have excellent adaptability to wire size, and the applicability of a single device is greatly expanded. BRIEF DESCRIPTION OF DRAWINGS

[0022] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the present application will be further described below with reference to the drawings and embodiments. The drawings in the following description are only some embodiments of the present application, and those skilled in the art can also obtain other drawings according to these drawings without creating any inventive labor:

[0023] Figure 1 is a front view of the automatic detection circuit board broken line repair device of the preferred embodiment of the present application;

[0024] Figure 2 is a top view of the distance adjusting unit of the automatic detection circuit board broken line repair device of the preferred embodiment of the present application;

[0025] Figure 3It is the automatic detection circuit board broken line repair device heat curing resin ring extrusion amplification schematic view of the preferred embodiment of the present application;

[0026] Figure 4 It is the automatic detection circuit board broken line repair method flow chart of the preferred embodiment of the present application. DETAILED DESCRIPTION

[0027] In order to make the purpose, technical scheme and advantages of the embodiments of the present application more clear, the following will combine the technical scheme in the embodiments of the present application to make a clear and complete description, obviously, the described embodiments are part of the embodiments of the present application, not all the embodiments. Based on the embodiments of the present application, all other embodiments obtained by the person skilled in the art without creative labor are within the protection scope of the present application.

[0028] The automatic detection circuit board broken line repair device of the preferred embodiment of the present application, as shown in Figure 1 , simultaneously refer to Figure 2 and Figure 3 , including the mounting bracket 1, the mounting bracket 1 is provided with the visual detection unit 10 and the control host 11; The mounting bracket 1 is provided with the shaping assembly 2, the dispensing assembly 3 and the repair layer supply assembly 4, the dispensing assembly 3 and the repair layer supply assembly 4 are arranged side by side, the mounting bracket 1 is provided with the transverse movement unit 12 for driving the dispensing assembly 3 and the repair layer supply assembly 4 to move transversely synchronously, the transverse movement unit 12 is located between the shaping assembly 2 and the visual detection unit 10;

[0029] The shaping assembly 2 includes the left clamping plate 20, the right clamping plate 21, the distance adjusting unit 22 for adjusting the distance between the left clamping plate 20 and the right clamping plate 21, and the first lifting unit 23 for driving the left clamping plate 20, the right clamping plate 21 and the distance adjusting unit 22 to lift; The shaping assembly 2 further includes the first feeding unit (not shown in the figure) for feeding the circular heat curing resin ring 5 in the middle region of the left clamping plate 20 and the right clamping plate 21;

[0030] The dispensing assembly 3 includes the dispensing valve 30 for injecting conductive glue into the heat curing resin ring 5 and the second lifting unit 31 for driving the dispensing valve 30 to lift, the second lifting unit 31 is connected with the transverse movement unit 12 and is driven by the transverse movement unit 12 to move transversely;

[0031] The repair layer supply assembly 4 includes the repair wire 40, the metal suction head 41 for adsorbing the repair wire 40 and the third lifting unit 42 for driving the metal suction head 41 to lift; The lower end of the metal suction head 41 is provided with the heating strip assembly 43 for heating the repair wire;

[0032] The visual detection unit 10, the shaping assembly 2, the dispensing assembly 3, the repair layer supply assembly 4 and the transverse movement unit 12 are electrically connected with the control host 11 and are controlled by the control host 11;

[0033] The circuit board 6 to be repaired is placed below the visual inspection unit 10, and the visual inspection unit 10 acquires the image and sends it to the control host 11;

[0034] Under the control of the host 11, the first lifting unit 23 moves to drive the left clamping plate 20, the right clamping plate 21, and the distance adjustment unit 22 to descend to within 0.5mm of the circuit board to be repaired. The first feeding unit (which can use a robotic arm or manual feeding) feeds the thermosetting resin ring 5 onto the circuit board 6 in the middle area between the left clamping plate 20 and the right clamping plate 21. Then the distance adjustment unit 22 moves to drive the left clamping plate 20 and the right clamping plate 21 to close, extruding the thermosetting resin ring 5 into a long strip with the inner hole width of the long strip being smaller than the width of the wire to be repaired.

[0035] Under the control of the host 11, the horizontal movement unit 12 operates so that the dispensing assembly 3 is located directly above the thermosetting resin ring 5. The second lifting unit 31 operates to drive the dispensing valve 30 to descend and dispense conductive adhesive into the thermosetting resin ring 5. After dispensing is completed, the assembly is reset.

[0036] Under the control of the host 11, after the metal suction head 41 adsorbs the repair wire 40 of the appropriate size, the horizontal movement unit 12 moves so that the metal suction head 41 is directly above the thermosetting resin ring 5. The third lifting unit 42 moves to drive the metal suction head 41 down to place the repair wire 40 on the thermosetting resin ring 5 and maintain a set holding force. The heating strip assembly 43 heats the thermosetting resin ring 5 so that it is heated and adheres to the circuit board and repair wire, thus completing the repair action.

[0037] It can automatically identify and complete circuit board repair work, saving manpower, ensuring product consistency, and guaranteeing repair efficiency and quality. Moreover, the use of extrusion thermosetting resin ring 5 makes the repair process very flexible, with excellent adaptability to wire size, and greatly expanding the applicability of a single device.

[0038] Preferably, the upper ends of the clamping surfaces of the left clamping plate 20 and the right clamping plate 21 are inclined towards each other, and the inclination angle is between 1 and 5 degrees; the clamping surfaces of the left clamping plate 20 and the right clamping plate 21 are distributed in a figure-eight shape, so that the thermosetting resin ring 5 is not easy to bounce off when it is squeezed, and at the same time, the thermosetting resin ring 5 is tightly attached to the surface of the circuit board 6.

[0039] Preferably, the first lifting unit 23 includes a first lead screw and a first lead screw motor that drives it; the adjusting unit 22 is an electric gripper; a longitudinal mounting plate 13 is provided on the mounting bracket 1, the first lifting unit 23 is mounted on the mounting plate 13, and the electric gripper is longitudinally slidably connected to the mounting plate 13; the movement control has high precision and good reliability.

[0040] Preferably, the mounting bracket 1 is provided with a placement and positioning platform 14 for placing the circuit board 6 to be repaired; an existing circuit board positioning component can be installed on the placement and positioning platform 14.

[0041] Preferably, the transverse unit 12 includes a crossbeam 120 fixed on the mounting bracket, a movable plate 121, a second lead screw 122 and a second lead screw motor 123 that drive the movable plate 121 to move laterally, a dispensing assembly 3 and a repair layer feeding assembly 4 are installed on the movable plate 121, and a feeding tray 15 for feeding the repair layer feeding assembly 4 is provided on the mounting bracket 1; the structure is reasonable and compact, and easy to operate.

[0042] Preferably, the mounting bracket 1 is provided with a fourth lifting unit 16 that drives the visual inspection unit 10 to rise and fall, which can adjust the focus of the visual inspection unit 10.

[0043] An automatic circuit board breakage detection and repair method is applied to the aforementioned automatic circuit board breakage detection and repair device, such as... Figure 4 As shown, its implementation method is as follows:

[0044] S01: Place the circuit board to be repaired below the vision inspection unit, which acquires the image and sends it to the control host;

[0045] S02: Under the control of the host, the first lifting unit moves the left clamping plate, the right clamping plate, and the distance adjustment unit down to within 0.5mm of the circuit board to be repaired. The first feeding unit feeds the thermosetting resin ring onto the circuit board in the middle area between the left clamping plate and the right clamping plate. Then the distance adjustment unit moves the left clamping plate and the right clamping plate to close, extruding the thermosetting resin ring into a long strip with the inner hole width of the long strip being smaller than the width of the wire to be repaired.

[0046] S03: Under the control of the control host, the horizontal movement unit moves to position the dispensing assembly directly above the thermosetting resin ring. The second lifting unit moves to drive the dispensing valve downward to dispense conductive adhesive into the thermosetting resin ring. After dispensing is completed, the unit resets.

[0047] S04: Under the control of the host, after the metal suction head adsorbs the repair wire of the appropriate size, the horizontal movement unit moves so that the metal suction head is directly above the thermosetting resin ring. The third lifting unit moves to drive the metal suction head down to place the repair wire on the thermosetting resin ring and maintain a set holding force. The heating strip assembly heats the thermosetting resin ring so that it adheres to the circuit board to be repaired and the repair wire, thus completing the repair action.

[0048] It can automatically identify and complete circuit board repair work, saving manpower, ensuring product consistency, and guaranteeing repair efficiency and quality. Moreover, the use of extrusion thermosetting resin rings makes the repair process very flexible, with excellent adaptability to wire sizes, and greatly expanding the applicability of a single device.

[0049] It should be understood that those skilled in the art can make improvements or modifications based on the above description, and all such improvements and modifications should fall within the protection scope of the appended claims.

Claims

1. An automatic circuit board breakage detection and repair device, characterized in that, The device includes a mounting bracket, on which a vision inspection unit and a control host are mounted; the mounting bracket also includes a shaping component, a dispensing component, and a repair layer supply component, with the dispensing component and the repair layer supply component arranged side by side; the mounting bracket is equipped with a lateral movement unit that drives the dispensing component and the repair layer supply component to move synchronously laterally, the lateral movement unit being located between the shaping component and the vision inspection unit; The shaping assembly includes a left clamping plate, a right clamping plate, an adjusting unit for adjusting the distance between the left clamping plate and the right clamping plate, and a first lifting unit for raising and lowering the left clamping plate, the right clamping plate, and the adjusting unit; the shaping assembly also includes a first feeding unit for feeding a circular thermosetting resin ring into the middle area between the left clamping plate and the right clamping plate. The dispensing assembly includes a dispensing valve for injecting conductive adhesive into a thermosetting resin ring and a second lifting unit that drives the ring to move up and down. The second lifting unit is connected to the lateral movement unit and is driven to move laterally by the second lifting unit. The repair layer feeding assembly includes a repair wire, a metal suction head for adsorbing the repair wire, and a third lifting unit for raising and lowering the metal suction head; the lower end of the metal suction head is provided with a heating strip assembly for heating the repair wire. The visual inspection unit, the shaping component, the dispensing component, the repair layer supply component, and the transverse movement unit are all electrically connected to and controlled by the control host.

2. The automatic circuit board breakage detection and repair device according to claim 1, characterized in that, The upper ends of the clamping surfaces of the left clamping plate and the right clamping plate are inclined towards each other, and the inclination angle is between 1 and 5 degrees.

3. The automatic circuit board breakage detection and repair device according to claim 2, characterized in that, The first lifting unit includes a first lead screw and a first lead screw motor that drives it; the adjusting unit is an electric gripper; the mounting bracket is provided with a longitudinal mounting plate, the first lifting unit is mounted on the mounting plate, and the electric gripper is longitudinally slidably connected to the mounting plate.

4. The automatic circuit board breakage detection and repair device according to claim 3, characterized in that, The mounting bracket is equipped with a placement and positioning platform for placing the circuit board to be repaired.

5. The automatic circuit board breakage detection and repair device according to any one of claims 1-4, characterized in that, The lateral movement unit includes a crossbeam fixed on the mounting bracket, a movable plate, a second lead screw and a second lead screw motor that drive the movable plate to move laterally, and the dispensing assembly and the repair layer feeding assembly are mounted on the movable plate.

6. The automatic circuit board breakage detection and repair device according to claim 5, characterized in that, The mounting bracket is provided with a feeding tray for feeding the repair layer feeding assembly.

7. The automatic circuit board breakage detection and repair device according to any one of claims 1-4, characterized in that, The mounting bracket is equipped with a fourth lifting unit that drives the visual inspection unit to rise and fall.

8. An automatic circuit board breakage detection and repair method, applied to the automatic circuit board breakage detection and repair device as described in any one of claims 1-7, characterized in that, The implementation method is as follows: The circuit board to be repaired is placed below the vision inspection unit, which acquires the image and sends it to the control host. Under the control of the host, the first lifting unit moves the left clamping plate, the right clamping plate, and the distance adjustment unit down to within 0.5mm of the circuit board to be repaired. The first feeding unit feeds the thermosetting resin ring onto the circuit board in the middle area between the left clamping plate and the right clamping plate. Then the distance adjustment unit moves the left clamping plate and the right clamping plate to close together, extruding the thermosetting resin ring into a long strip with the inner hole width of the long strip being smaller than the width of the wire to be repaired. Under the control of the host, the horizontal movement unit moves to position the dispensing assembly directly above the thermosetting resin ring. The second lifting unit moves to drive the dispensing valve downward to dispense conductive adhesive into the thermosetting resin ring. After dispensing is completed, the unit resets. Under the control of the host, after the metal suction head picks up the repair wire of the appropriate size, the horizontal movement unit moves to position the metal suction head directly above the thermosetting resin ring. The third lifting unit moves to drive the metal suction head down to place the repair wire on the thermosetting resin ring and maintain a set holding force. The heating strip assembly heats the thermosetting resin ring so that it adheres to the circuit board to be repaired and the repair wire, thus completing the repair operation.

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