Pickup device and manufacturing method thereof, display panel

Abstract

The application discloses a pickup device and a manufacturing method thereof and a display panel. The pickup device comprises a micro device, one side of the micro device comprising a pin, the micro device further comprising at least one fixing structure, the fixing structure being located on the side of the micro device away from the pin; a transfer substrate, the transfer substrate comprising a transfer head, the transfer head comprising a plurality of grooves; the shape of the groove is the same as that of the fixing structure, and the groove is clamped with the fixing structure to pick up the micro device. By inserting the fixing structure into the groove in the transfer substrate, the accurate alignment of the micro device is realized, and the pickup rate and the yield of the pickup device are improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of display, more particularly, to a pickup device and a manufacturing method thereof, and a display panel. BACKGROUND

[0002] A light emitting diode (LED) is a kind of optoelectronic semiconductor element that can convert current into light in a specific wavelength range. The light emitting principle of the light emitting diode is that the energy difference of electrons moving between n-type semiconductors and p-type semiconductors releases energy in the form of light. Therefore, the light emitting diode is called a cold light source, which has the advantages of low power consumption, small size, high brightness, easy matching with integrated circuits, high reliability, etc. and is widely used as a light source. Moreover, with the maturity of LED technology, the technology of directly using LED as a self-luminous display point pixel of a Mini LED (sub-millimeter level LED) display or a Micro LED (i.e., micro LED) display is also gradually being widely applied. With the maturity of LED technology, the technology of directly using LED as a self-luminous display point pixel of a Mini LED (sub-millimeter level LED) display or a Micro LED (i.e., micro LED) display is also gradually being widely applied.

[0003] However, one of the difficulties in the development of a Mini LED (sub-millimeter level LED) display or a Micro LED (i.e., micro LED) display lies in the transfer process of micro light emitting diodes. Current transfer / migration methods are various, but generally have the problem of low migration yield. SUMMARY

[0004] Therefore, the present application provides a pickup device and a manufacturing method thereof, and a display panel. By inserting a fixing structure into a groove in the transfer substrate, accurate alignment of the micro device is achieved, and the pickup rate and yield of the pickup device are improved.

[0005] In one aspect, the present application provides a pickup device, comprising:

[0006] a micro device, one side of the micro device comprising a pin, the micro device further comprising at least one fixing structure, the fixing structure being located on the side of the micro device away from the pin;

[0007] a transfer substrate, the transfer substrate comprising a transfer head, the transfer head comprising a plurality of grooves;

[0008] The shape of the groove is the same as that of the fixing structure, and the groove and the fixing structure are clamped, and the micro device is picked up.

[0009] In another aspect, based on the same inventive concept, the embodiment of the present application provides a manufacturing method of the pickup device, which is used for manufacturing any one of the pickup devices provided by the present application, and comprises the following steps:

[0010] manufacturing the micro device;

[0011] manufacturing the transfer substrate;

[0012] adjusting the transfer substrate, so that the fixing structure in the micro device is inserted into the groove in the transfer substrate, and the micro device is transferred to the transfer substrate.

[0013] In another aspect, based on the same inventive concept, the embodiment of the present application provides a display panel, which comprises any one of the micro devices provided by the present application, one side of the micro device comprises a pin, the micro device further comprises at least one fixing structure, the fixing structure is located on the side of the micro device away from the pin, the fixing structure is used for clamping with the groove of the transfer substrate, and the micro device is picked up.

[0014] Compared with the related art, the pickup device and the manufacturing method thereof and the display panel provided by the embodiment of the present application at least achieve the following beneficial effects:

[0015] The pickup device and the manufacturing method thereof and the display panel provided by the embodiment of the present application, the pickup device comprises a micro device, the micro device comprises at least one fixing structure, the transfer head in the transfer substrate comprises a plurality of grooves, the shape of the groove is the same as that of the fixing structure, and the groove is clamped with the fixing structure. By inserting the fixing structure into the groove in the transfer substrate, that is, by the fixing structure on the micro device and the groove on the transfer substrate, the precise alignment of the micro device is realized, the micro device is picked up, and the pickup rate and the yield of the pickup device are improved.

[0016] Of course, any product implementing the present application does not necessarily need to achieve all the technical effects mentioned above at the same time.

[0017] Other features of the present application and its advantages will become apparent from the following detailed description of exemplary embodiments thereof, taken in conjunction with the accompanying drawings. BRIEF DESCRIPTION OF DRAWINGS

[0018] The accompanying drawings incorporated in and forming a part of the specification, illustrate embodiments of the present application and, together with the description, serve to explain the principles of the application.

[0019] Figure 1 FIG. 1 is a structural schematic diagram of a pickup device provided by an embodiment of the present application;

[0020] Figure 2 FIG. 2 is a structural schematic diagram of another pickup device provided by an embodiment of the present application;

[0021] Figure 3 A top view of a micro device according to an embodiment of the present application;

[0022] Figure 4 A top view of a micro device according to another embodiment of the present application;

[0023] Figure 5 A top view of a micro device according to another embodiment of the present application;

[0024] Figure 6 A top view of a micro device according to another embodiment of the present application;

[0025] Figure 7 A top view of a micro device according to another embodiment of the present application;

[0026] Figure 8 A structural schematic diagram of a pickup device according to an embodiment of the present application;

[0027] Figure 9 A structural schematic diagram of a pickup device according to another embodiment of the present application;

[0028] Figure 10 A top view of a transfer substrate according to an embodiment of the present application;

[0029] Figure 11 A top view of a transfer substrate according to another embodiment of the present application;

[0030] Figure 12 A sectional view along the direction of N-N' in the above embodiment; Figure 11 A sectional view along the direction of N-N' in the above embodiment;

[0031] Figure 13 A flow chart of a manufacturing method of a pickup device according to an embodiment of the present application;

[0032] Figure 14 A flow chart of a manufacturing method of a pickup device according to another embodiment of the present application;

[0033] Figure 15 A flow chart of a manufacturing method of a pickup device according to another embodiment of the present application;

[0034] Figure 16 A flow chart of a manufacturing method of a pickup device according to another embodiment of the present application;

[0035] Figure 17 A structural schematic diagram of a display panel according to an embodiment of the present application;

[0036] Figure 18 A structural schematic diagram of a display panel according to another embodiment of the present application; Figure 17A sectional view in the direction of E-E';

[0037] Figure 19 A structure schematic diagram of another display panel provided by the embodiment of the present application;

[0038] Figure 20 A structure schematic diagram of another display panel provided by the embodiment of the present application; Figure 19 A sectional view in the direction of F-F'. DETAILED DESCRIPTION

[0039] Various exemplary embodiments of the present application will now be described in detail with reference to the accompanying drawings. Note that the relative arrangement of the components and the numbers and values expressed in these embodiments are not limiting to the scope of the present application unless specifically stated otherwise.

[0040] Various modifications and changes can be made to the present application without departing from the spirit and scope thereof, which is defined by the appended claims. Accordingly, the present application is intended to embrace all modifications and alterations within the scope of the claims. It is to be understood that the embodiments provided by the present application can be combined with each other, if not contradictory.

[0041] The following description of at least one exemplary embodiment is merely exemplary in nature and is in no way intended to limit the scope of the application, its application, or uses.

[0042] Techniques, methods, and apparatus known to those of ordinary skill in the relevant art can not be discussed in detail herein. However, where appropriate, such techniques, methods, and apparatus should be considered as being part of the specification.

[0043] In all of the examples shown and discussed herein, any specific values should be interpreted as merely illustrative and not limiting. Thus, other examples of the exemplary embodiments can have different values.

[0044] It should be noted that like references herein represent like elements or features in the various drawings. Thus, where the same element is referred to in multiple figures, the same number will be used throughout the specification.

[0045] Reference will now be made to the drawings, which depict various embodiments of the application. Figure 1 and Figure 2 as shown in Figure 1 A structure schematic diagram of another display panel provided by the embodiment of the present application; Figure 2Another structure schematic diagram of the pickup device provided by the embodiment of the present application is provided. The embodiment provides a pickup device 100, which comprises a micro device 10, one side of the micro device 10 comprising a pin 11, the micro device 10 further comprising at least one fixing structure G, the fixing structure G being located on the side of the micro device 10 away from the pin 11; a transfer substrate 20, the transfer substrate 20 comprising a transfer head 21, the transfer head 21 comprising a plurality of grooves W; the shape of the groove W is the same as that of the fixing structure G, and the groove W is clamped with the fixing structure G to pick up the micro device 10.

[0046] wherein, Figure 1 and Figure 2 Only the case that the transfer substrate 20 comprises 10 grooves W is taken as an example, but it is not limited thereto, and the number of the grooves W in the transfer substrate 20 can be set according to the number of the micro devices 10 to be transferred, and Figure 1 and and Figure 2 Only the case that each micro device 10 comprises two fixing structures G is taken as an example, but the number of the fixing structures G in each micro device 10 is not specifically limited, and it can also be one or other values, and Figure 1 and Figure 2 Only the case that the shape of the front view of the fixing structure G is a trapezoid is taken as an example, but it is not limited thereto, and it can also be a triangle, for example, if the shape of the front view of the fixing structure G is a right trapezoid, then the shape of the front view of the groove W of the transfer substrate 20 is also a right trapezoid, the shape of the groove W is similar to that of the fixing structure G, which facilitates the clamping of the groove W and the fixing structure G to pick up the micro device 10, and setting the shape of the front view of the fixing structure G as a trapezoid or a triangle both belong to the case that the end size of the fixing structure G close to the groove W is small, which facilitates the insertion to realize the alignment and pick up the micro device 10.

[0047] It can be understood that the pickup device 100 provided by the embodiment is used to pick up the micro device 10, the micro device 10, one side of the micro device 10 comprising a pin 11, the pin 11 can comprise two pins with different polarities, which are used to be connected to a power supply for subsequent normal work of the micro device 10, on the basis of which, the micro device 10 is further provided with at least one fixing structure G, the fixing structure G being located on the side of the micro device 10 away from the pin 11, that is, the fixing structure G is arranged on the side opposite to the pin 11, which facilitates the connection of the pin 11 to the power supply; meanwhile, the transfer head 21 in the transfer substrate 20 is provided with a plurality of grooves W, the shape of the groove W is the same as that of the fixing structure G, the fixing structure G is inserted into the groove W, and the groove W is clamped with the fixing structure G to pick up the micro device 10, that is, the fixing structure G on the micro device 10 and the groove W on the transfer substrate 20 are used to realize the accurate alignment of the micro device 10, thereby improving the pickup rate and the yield of the pickup device 100.

[0048] The micro device 10 is a light emitting element. Optionally, the micro device 10 is a Micro LED or a Mini LED, but the present application is not limited thereto, and in other embodiments of the present application, the micro device 10 can also be other elements, which will not be described herein again.

[0049] In some optional embodiments, the pickup device 100 provided in the present embodiment is as shown in Figure 1 and Figure 2 The fixing structure G is made of a transparent material.

[0050] It can be understood that the pickup device 100 provided in the present embodiment includes at least one fixing structure G on the side of the micro device 10 opposite to the pin 11. On the one hand, the fixing structure G is made of a transparent material, which can avoid the brightness loss of the micro device 10. On the other hand, after the micro device 10 is transferred to the display panel, the fixing structure G does not need to be removed, and can be directly heated and melted to cover the surface of the micro device 10. Since the fixing structure G is made of a transparent material, it will not affect the brightness of the micro device 10, and at the same time, a protective film can be formed to protect the micro device 10. Optionally, the fixing structure G can be made of polymethyl methacrylate, polystyrene, polycarbonate, styrene acrylonitrile copolymer, transparent polyamide, PVC, etc., but the present application is not limited to the specific material of the fixing structure G, and other transparent materials can also be used, which will not be described herein again.

[0051] In some optional embodiments, the pickup device 100 provided in the present embodiment is as shown in Figure 1 and Figure 2 The fixing structure G includes quantum dots or fluorescent powder.

[0052] It can be understood that the pickup device 100 provided in the present embodiment includes at least one fixing structure G on the side of the micro device 10 opposite to the pin 11. The fixing structure G includes quantum dots or fluorescent powder. On the basis of the fixing structure G including quantum dots or fluorescent powder, the base material of the fixing structure G is made of a transparent material, and the quantum dots or fluorescent powder is added in the base material, which can avoid the light loss of the micro device 10. At the same time, after the micro device 10 is transferred to the display panel, the fixing structure G does not need to be removed, and can be directly heated and melted to cover the surface of the micro device 10, which can be directly used as a chroma conversion of the micro device 10. However, the present application is not limited to the specific material of the fixing structure G, and any other material that meets the requirements can also be used, which will not be described herein again.

[0053] In some optional embodiments, the pickup device 100 provided in the present embodiment is as shown in Figure 3 to Figure 5As shown, Figure 3 A top view of a micro device provided by an embodiment of the present application, Figure 4 A top view of another micro device provided by an embodiment of the present application, Figure 5 A top view of another micro device provided by an embodiment of the present application. The pickup device 100 provided by the embodiment includes micro devices 10 of multiple colors, and the shapes of the fixing structures G in the micro devices 10 of different colors are different.

[0054] Among them, Figure 3 to Figure 5 The shapes of the fixing structures G being different respectively means that the shapes of the micro devices 10 in the orthographic projection on the plane where the transfer head 21 is located are square, circular and triangular respectively, and only an example that each micro device 10 includes only one fixing structure G is taken.

[0055] It can be understood that the pickup device 100 provided by the embodiment includes micro devices 10 of multiple colors, and the shapes of the fixing structures G in the micro devices 10 of different colors are different. The shapes of the fixing structures G in the micro devices 10 of different colors are different, which means the shapes of the micro devices 10 in the orthographic projection on the plane where the transfer head 21 is located. By setting the shapes of the fixing structures G in the micro devices 10 of different colors to be different, the color of the micro device 10 can be distinguished by the shape of the fixing structure G in the micro device 10, which is convenient for transfer. Alternatively, the shapes of the fixing structures G in the micro devices 10 of different sizes are different, and then the size of the micro device 10 can be distinguished by the shape of the fixing structure G in the micro device 10, which is convenient for distinguishing and preventing mistakes. The present application does not make specific limitation on the shapes of the fixing structures G, which means the shapes of the micro devices 10 in the orthographic projection on the plane where the transfer head 21 is located. It can be set according to the actual situation, as long as there is some difference in shape, which can achieve the purpose of distinguishing.

[0056] In some optional embodiments, the pickup device 100 provided by the embodiment of the present application continues to combine Figure 6 and Figure 7 As shown, Figure 6 Another top view of a micro device provided by an embodiment of the present application, Figure 7 Another top view of a micro device provided by an embodiment of the present application. The pickup device 100 provided by the embodiment includes two fixing structures G in the micro device 10, which are symmetrically arranged about the center line O of the micro device 10 along the first direction X, or the micro device 10 includes at least three fixing structures G, and the spacing between adjacent fixing structures G is equal along the first direction X, and the first direction X is parallel to the direction of the micro device 10.

[0057] It can be understood that the pickup device 100 provided by the embodiment includes multiple fixing structures G, and the pickup device 100 provided by the embodiment continues to combine Figure 6 As shown, Figure 6For example, each micro device 10 can include two fixed structures G, the two fixed structures G are symmetrically arranged about the center line O of the micro device 10, and the following will be described in combination with Figure 7 as shown in Figure 7 For example, the micro device 10 includes three fixed structures G, and the interval d between adjacent fixed structures G is equal in the first direction X. That is, no matter how many fixed structures G each micro device 10 can include, the fixed structures G can be symmetrically arranged. On the one hand, symmetrically arranging the fixed structures G can simplify the process difficulty, and on the other hand, after the micro device 10 is subsequently transferred to the display panel, the fixed structures G are heated and melted to cover the surface of the micro device 10, and the symmetrically arranged fixed structures G can be evenly covered on the surface of the micro device 10 after melting, thereby improving the brightness uniformity of the micro structure 10.

[0058] In some optional embodiments, in combination with Figure 2 and Figure 8 as shown in Figure 8 This embodiment provides a structure diagram of another pickup device. The pickup device 100 provided in this embodiment has the following structure: the depth of the groove W is less than or equal to the height of the fixed structure G in the second direction Y, wherein the second direction Y is a direction perpendicular to the transfer substrate 20.

[0059] It can be understood that Figure 2 For example, in the second direction Y, the depth h1 of the groove W is equal to the height h2 of the fixed structure G, Figure 8 only in the second direction Y, the depth h1 of the groove W is less than the height h2 of the fixed structure G. The pickup device 100 provided in this embodiment has the following structure: the depth of the groove W is less than or equal to the height of the fixed structure G in the second direction Y, by limiting the depth of the groove W in the second direction Y to be not greater than the height of the fixed structure G, thereby avoiding the transfer head 21 from tightly abutting or extruding the micro device 10 to damage the micro device 10, and further ensuring the yield of the micro device 10.

[0060] In some optional embodiments, in combination with Figure 2 and Figure 9 as shown in Figure 9 This embodiment provides a structure diagram of another pickup device. The pickup device 100 provided in this embodiment has the following structure: the size of the groove W is greater than or equal to the size of the fixed structure G, and the material of the transfer head 21 is a thermal expansion material.

[0061] It can be understood that Figure 9 For example, the size of the groove W is greater than the size of the fixed structure G, Figure 2For example, only when the size of the groove W is equal to the size of the fixed structure G. The pickup device 100 provided by the embodiment has the size of the groove W greater than or equal to the size of the fixed structure G. When the size of the groove W is equal to the size of the fixed structure G, the accurate positioning of the micro device 10 can be realized when the fixed structure G in the micro device 10 is inserted into the groove W in the transfer substrate 20, thereby improving the pickup rate and yield of the pickup device 100. When the size of the groove W is greater than the size of the fixed structure G, the micro device 10 can be easily inserted into the groove W in the transfer substrate 20, and the positioning of the micro device 10 can be basically realized. However, the material of the transfer head 21 is a thermal expansion material, and the size of the groove W can be reduced by expanding the transfer head 21 through heating, so that the size of the groove W is matched with the fixed structure G, thereby reducing the error between the size of the groove W and the size of the fixed structure G, realizing the accurate positioning of the micro device 10, and improving the pickup rate and yield of the pickup device 100.

[0062] In some optional embodiments, in combination with Figure 10 as shown, Figure 10 is a top view of the transfer substrate provided by the embodiment of the present application. The pickup device 100 provided by the embodiment has a side wall of the groove W including a first electrode P1, and the first electrode P1 includes a ring-shaped electrode.

[0063] It can be understood that the pickup device 100 provided by the embodiment has a side wall of the groove W including a first electrode P1, and the first electrode P1 includes a ring-shaped electrode, but the shape of the first electrode P1 is not limited in the present application and can be set according to actual conditions. By setting the first electrode P1 at the position of the groove W of the transfer head 21, a magnetic field can be formed by applying current to the first electrode P1, and then the micro device 10 can be attracted by the magnetic field formed by the first electrode P1, and the micro device 10 can be fixed on the transfer substrate 20. After the micro device 10 is magnetically attracted to the transfer substrate 20, the current applied to the first electrode P1 can be removed, thereby canceling the magnetism of the first electrode P1. At the same time, the current of the magnetic field formed by the first electrode P1 can be detected, so as to judge whether the micro device 10 is successfully picked up according to the change of the current, thereby facilitating to improve the transfer yield of the pickup device 100.

[0064] In some optional embodiments, in combination with Figure 11 and Figure 12 as shown, Figure 11 is another top view of the transfer substrate provided by the embodiment of the present application, Figure 12 is Figure 11A sectional view of the pickup device 100 provided in the embodiment is shown in FIG. 2. The side wall of the groove W of the pickup device 100 provided in the embodiment includes a second electrode P2, and the second electrode P2 includes a first electrode plate P21 and a second electrode plate P22, which are respectively located on the opposite side walls of the groove W.

[0065] It can be understood that, in the pickup device 100 provided in the embodiment, the side wall of the groove W includes the second electrode P2, and the second electrode P2 includes the first electrode plate P21 and the second electrode plate P22, and the first electrode plate P21 and the second electrode plate P22 form a capacitor. When the fixing structure G in the micro device 10 is inserted into the groove W in the transfer substrate 20, the fixing structure G is inserted between the first electrode plate P21 and the second electrode plate P22, thereby affecting the capacitance value formed by the first electrode plate P21 and the second electrode plate P22. Thus, whether the micro device 10 is successfully picked up can be determined according to the change of the capacitance value, so as to facilitate improving the transfer yield of the pickup device 100.

[0066] In some optional embodiments, in the pickup device 100 provided in the embodiment, the fixing structure G can be directly arranged at the edge of the micro device 10, and the minimum distance between the fixing structure G arranged on the outer edge and the edge of the micro device 10 is not limited, that is, the minimum distance between the fixing structure G arranged on the outer edge and the edge of the micro device 10 is equal to the minimum distance between the fixing structure G arranged on the two sides and the edge of the micro device 10. Thus, the size of the micro device 10 can be adjusted without adjusting the position of the fixing structure G on the basis of the fixing structure G, and since the position of the fixing structure G is specified, the transfer substrate 20 can be matched with micro devices 10 of various sizes, thereby reducing the transfer cost of the micro device 10.

[0067] In the embodiment, the pickup device 100 provided in the embodiment is combined with the pickup device 100 provided in the embodiment shown in FIG. 1. Figure 13 Figure 13 A flowchart of a manufacturing method of a pickup device provided in the embodiment of the application is shown in FIG. 3. The manufacturing method of the pickup device provided in the embodiment is used to manufacture the pickup device shown in any of the above embodiments, and includes the following steps.

[0068] Step S1: manufacturing a micro device;

[0069] Step S2: manufacturing a transfer substrate;

[0070] Step S3: adjusting the transfer substrate so that the fixing structure in the micro device is inserted into the groove in the transfer substrate, and the micro device is transferred to the transfer substrate.

[0071] ​It can be understood that the manufacturing method of the pickup device provided in the embodiment comprises the following steps: S1, manufacturing a micro device, the micro device comprising at least one fixing structure on a side away from a pin; S2, manufacturing a transfer substrate, the transfer head of the transfer substrate comprising a plurality of grooves; and S3, adjusting the transfer substrate so that the fixing structure in the micro device is inserted into the groove in the transfer substrate, and the micro device is transferred to the transfer substrate. That is, the manufacturing method of the pickup device provided in the embodiment can realize accurate alignment of the micro device through the fixing structure on the micro device and the groove on the transfer substrate, thereby improving the pickup rate and yield of the pickup device.

[0072] In some optional embodiments, the manufacturing method of the pickup device provided in the embodiment comprises the following steps: S1, manufacturing a micro device, the micro device comprising at least one fixing structure on a side away from a pin; S2, manufacturing a transfer substrate, the transfer head of the transfer substrate comprising a plurality of grooves; and S3, adjusting the transfer substrate so that the fixing structure in the micro device is inserted into the groove in the transfer substrate, and the micro device is transferred to the transfer substrate. That is, the manufacturing method of the pickup device provided in the embodiment can realize accurate alignment of the micro device through the fixing structure on the micro device and the groove on the transfer substrate, thereby improving the pickup rate and yield of the pickup device. Figure 13 As shown in the manufacturing method of the pickup device provided in the embodiment, the transfer substrate is used to transfer the micro device to a to-be-placed substrate; and the fixing structure is heated to be melted and at least partially surround the micro device.

[0073] It can be understood that the manufacturing method of the pickup device provided in the embodiment comprises the following steps: S1, manufacturing a micro device, the micro device comprising at least one fixing structure on a side away from a pin; S2, manufacturing a transfer substrate, the transfer head of the transfer substrate comprising a plurality of grooves; and S3, adjusting the transfer substrate so that the fixing structure in the micro device is inserted into the groove in the transfer substrate, and the micro device is transferred to the transfer substrate. That is, the manufacturing method of the pickup device provided in the embodiment can realize accurate alignment of the micro device through the fixing structure on the micro device and the groove on the transfer substrate, thereby improving the pickup rate and yield of the pickup device.

[0074] In some optional embodiments, the manufacturing method of the pickup device provided in the embodiment comprises the following steps: S1, manufacturing a micro device, the micro device comprising at least one fixing structure on a side away from a pin; S2, manufacturing a transfer substrate, the transfer head of the transfer substrate comprising a plurality of grooves; and S3, adjusting the transfer substrate so that the fixing structure in the micro device is inserted into the groove in the transfer substrate, and the micro device is transferred to the transfer substrate. That is, the manufacturing method of the pickup device provided in the embodiment can realize accurate alignment of the micro device through the fixing structure on the micro device and the groove on the transfer substrate, thereby improving the pickup rate and yield of the pickup device. Figure 14 As shown in the manufacturing method of the pickup device provided in the embodiment, Figure 14 The flow chart of another manufacturing method of a pickup device provided in the embodiment is shown in the figure. The manufacturing method of the pickup device provided in the embodiment comprises the following steps: S1, forming a micro device, which comprises the following steps:

[0075] S111, providing a first substrate;

[0076] S112, forming a micro device master on one side of the first substrate;

[0077] S113, forming a plurality of fixing structures on a side of the micro device master away from the first substrate;

[0078] S114, providing a transfer substrate;

[0079] S115, flipping the micro device master and the fixing structures to the transfer substrate, the fixing structures being located between the micro device master and the transfer substrate, and the fixing structures being inserted into the grooves in the transfer substrate.

[0080] Step S116: cutting the micro device master to form a plurality of micro devices, each of which includes at least one fixed structure.

[0081] It can be understood that the manufacturing method of the pickup device provided in the embodiment forms a micro device master on one side of the first substrate, directly forms a patterned fixed structure on the micro device master, and then reversely cuts the micro device master to form a plurality of periodically arranged micro devices, each of which includes at least one fixed structure. By directly forming a patterned fixed structure on the micro device master, the step of segmenting the fixed structure is not required, and the process is simplified. Meanwhile, after cutting the micro device master to form a plurality of periodically arranged micro devices, a pin can be formed on each micro device away from the fixed structure, which is used for subsequent connection of a power supply to ensure normal operation of the micro device. The above is only an embodiment of the manufacturing method, and the present application does not strictly limit the step of forming the micro device, which can be designed according to actual conditions.

[0082] In some optional embodiments, in combination with Figure 15 as shown, Figure 15 a flowchart of another manufacturing method of a pickup device provided in an embodiment of the present application. The manufacturing method of the pickup device provided in the embodiment includes the following steps.

[0083] Step S121: providing a first substrate;

[0084] Step S122: forming a micro device master on one side of the first substrate;

[0085] Step S123: forming a fixed structure layer on a side of the micro device master away from the first substrate;

[0086] Step S124: etching the fixed structure layer to form a plurality of fixed structures;

[0087] Step S125: providing a transfer substrate;

[0088] Step S126: flipping the micro device master and the fixed structures to the transfer substrate, the fixed structures being located between the micro device master and the transfer substrate, and the fixed structures being inserted into grooves in the transfer substrate;

[0089] Step S127: cutting the micro device master to form a plurality of micro devices, each of which includes at least one fixed structure.

[0090] It can be understood that the manufacturing method of the pickup device provided in the embodiment forms a micro device master on one side of the first substrate, and forms a fixed structure layer on the side of the micro device master away from the first substrate. Since the fixed structure layer is an integral layer structure, the fixed structure layer needs to be patterned to form a plurality of fixed structures. After the patterned fixed structure is formed, the micro device is cut to form a periodically arranged micro device. Compared with the manufacturing method of the pickup device provided in the above embodiment, the fixed structure layer is formed on the micro device master first, and then the fixed structure layer is patterned. The shape of the fixed structure can be better designed to correspond to the transfer substrate and flexibly adjust the fixed structure, and better match various types of micro devices to reduce the transfer cost of the micro device 10. Meanwhile, after the periodically arranged micro device is cut, a pin can be formed on the side of each micro device away from the fixed structure for subsequent connection of a power supply to ensure normal operation of the micro device. The above is only an embodiment of one manufacturing method, and the steps of forming the micro device are not strictly limited. How to manufacture can be designed according to actual conditions.

[0091] In some optional embodiments, in combination with Figure 16 as shown, Figure 16 a flowchart of another manufacturing method of a pickup device provided in an embodiment of the present application. The manufacturing method of the pickup device provided in the embodiment includes the following steps.

[0092] Step S131: providing a first substrate;

[0093] Step S132: forming a fixed structure layer on one side of the first substrate;

[0094] Step S133: forming a micro device master on the side of the fixed structure layer away from the first substrate;

[0095] Step S134: providing a first auxiliary substrate;

[0096] Step S135: turning over the fixed structure layer and the micro device master to the first auxiliary substrate, and the micro device master is located between the fixed structure layer and the first auxiliary substrate;

[0097] Step S136: etching the fixed structure layer to form a plurality of fixed structures;

[0098] Step S137: providing a transfer substrate;

[0099] Step S138: turning over the fixed structure and the micro device master to the transfer substrate, the fixed structure is located on the side of the micro device close to the first substrate, and the fixed structure is inserted into the groove in the transfer substrate;

[0100] Step S139: cutting the micro device master to form a plurality of micro devices, each of which comprises at least one fixing structure.

[0101] It can be understood that the manufacturing method of the pickup device provided in the embodiment forms a fixing structure layer on one side of the first substrate, forms a micro device master on the side of the fixing structure layer away from the first substrate, and the fixing structure layer and the micro device master are both integral and non-patterned structures. The fixing structure layer needs to be patterned first. Since the fixing structure layer is located between the first substrate and the micro device master, it needs to be flipped by means of a transfer substrate, that is, a first auxiliary substrate is provided, and the fixing structure layer and the micro device master are flipped to the first auxiliary substrate. The micro device master is located between the fixing structure layer and the first auxiliary substrate. At this time, the fixing structure layer is located on the outside, and the fixing structure layer is patterned to form a plurality of fixing structures. After the patterned fixing structure is formed, it is flipped to form a periodically arranged micro device. Compared with the manufacturing method of the pickup device provided in the above embodiment, the fixing structure layer can be manufactured first, and then the micro device master can be manufactured. Thus, it can be directly avoided that the micro device master may be damaged when the fixing structure layer is formed, thereby improving the yield. The manufacturing method provided in the embodiment forms an integral fixing structure layer on the micro device master first, and then the fixing structure layer is patterned. The shape of the fixing structure can be better designed to correspond to the transfer substrate and be flexibly adjusted, and better match various types of micro devices, thereby reducing the transfer cost of the micro device 10. After the periodically arranged micro device is cut, a pin can be formed on the side of each micro device away from the fixing structure for subsequent connection of a power supply to ensure normal operation of the micro device. The above is only one embodiment of the manufacturing method. The steps of forming the micro device are not strictly limited, and how to manufacture can be designed according to actual conditions.

[0102] The application further provides a display panel 200, which is combined with Figure 17 and Figure 18 as shown, Figure 17 is a structural schematic diagram of a display panel provided in the embodiment of the application, Figure 18 is Figure 17 is a sectional view in the direction of E-E'. The display panel 200 provided in the embodiment comprises the micro device 10 described in any of the above embodiments. One side of the micro device 10 comprises the pin 11. The micro device 10 further comprises at least one fixing structure G, which is located on the side of the micro device 10 away from the pin 11. The fixing structure G is used for clamping the groove of the transfer substrate and picking up the micro device 10. Since the micro device 10 is transferred to the display panel 200, the work of the transfer substrate 20 is completed, and there is no need to contact the display panel 200. Thus, the pin 11 of the micro device 10 is exposed on the side of the display panel 200 away from the fixing structure G, and the pin 11 can be connected to the power supply of the display panel 200. Figure 17 andFigure 18 The structure of the transfer substrate is not shown in the figures, and the structure of the transfer substrate can be described in combination with the description of the transfer substrate in any of the above embodiments, which will not be described here. Among them, Figure 17 The embodiments are only exemplified by a mobile phone to describe the display panel 200, and it can be understood that the display panel 200 provided by the embodiments of the present application can be a computer, a television, a vehicle display panel, or other display panels having a display function, and the present application does not make specific limitations thereto.

[0103] It can be understood that the display panel 200 provided by the embodiment includes a substrate 00 connected with the micro device 10, and after the micro device 10 is transferred to the substrate 00 in the display panel 200, the micro device 10 is electrically connected with the substrate 00 through the pin 11, and the micro device 10 works normally. The display panel 200 provided by the embodiment can pick up the micro device 10 by inserting the fixing structure G into the groove W, and the groove W is clamped with the fixing structure G, that is, the precise alignment of the micro device 10 is realized through the fixing structure G on the micro device 10 and the groove W on the transfer substrate 20, so as to improve the pickup rate and yield of the pickup device 100, and improve the yield of the micro device 10 in the display panel 200.

[0104] In some optional embodiments, in combination with Figure 19 and Figure 20 shown, Figure 19 is another structure diagram of a display panel provided by the embodiments of the present application, Figure 20 is Figure 19 is a sectional view in the direction of F-F'. The display panel 200 provided by the embodiment includes quantum dots or fluorescent powder in the fixing structure G, and after the fixing structure G is melted, at least part of the micro device 10 is surrounded. Among them, Figure 19 and Figure 20 only take the example that the fixing structure G covers the micro device 10 after melting, but it is not limited thereto.

[0105] It can be understood that the display panel 200 provided by the embodiment, after the micro device 10 is transferred to the display panel 200, the fixing structure G does not need to be removed, and the fixing structure G can be melted by heating, and the melted fixing structure is laid on the micro device 10. On the one hand, the fixing structure G does not need to be removed, which is convenient for simplifying the process, and on the other hand, the fixing structure G includes quantum dots or fluorescent powder, and the melted fixing structure G can also play a role of a protective film to protect the micro device, or be directly used as a chroma conversion for the micro device 10.

[0106] From the above embodiments, it can be known that the pickup device and the manufacturing method thereof, and the display panel provided by the embodiments of the present application at least achieve the following beneficial effects:

[0107] The pickup device, the manufacturing method thereof and the display panel provided by the embodiment of the present application comprise a micro device, the micro device comprises at least one fixing structure, the transfer head in the transfer substrate comprises a plurality of grooves, the shape of the groove is the same as that of the fixing structure, and the groove is clamped with the fixing structure. By inserting the fixing structure into the groove in the transfer substrate, that is, by the precise alignment of the micro device through the fixing structure on the micro device and the groove on the transfer substrate, the micro device is picked up, and the pickup rate and the yield of the pickup device are improved.

[0108] Although some specific embodiments of the present application have been described in detail by examples, those skilled in the art should understand that the above examples are only for illustration, but not for limiting the scope of the present application. Those skilled in the art should understand that the above embodiments can be modified without departing from the scope and spirit of the present application. The scope of the present application is defined by the appended claims.

Claims

1. A pick-up device, characterized in that The micro device includes a pin on one side, and at least one fixing structure on the side of the micro device away from the pin, the fixing structure is made of transparent material, or the fixing structure includes quantum dots or fluorescent powder; The transfer substrate includes a transfer head, and the transfer head includes a plurality of grooves; The shape of the groove is the same as that of the fixing structure, and the groove is engaged with the fixing structure to pick up the micro device. The micro device includes multiple colors, and the shape of the fixing structure in the micro device of different colors is different.

2. The pickup device according to claim 1, characterized in that The micro device includes two fixing structures, and the fixing structures are symmetrically arranged about the center line of the micro device in a first direction.

3. The pickup device according to claim 1, characterized in that Alternatively, the micro device includes at least three fixing structures, and the spacing between adjacent fixing structures is equal in the first direction. The first direction is parallel to the micro device. In a second direction, the depth of the groove is less than or equal to the height of the fixing structure.

4. The pickup device of claim 1, wherein The second direction is perpendicular to the transfer substrate. The size of the groove is greater than or equal to the size of the fixing structure, and the material of the transfer head is a thermal expansion material.

5. The pickup device of claim 1, wherein The side wall of the groove includes a first electrode, and the first electrode includes a ring electrode.

6. The pickup device of claim 1, wherein The side wall of the groove includes a second electrode, and the second electrode includes a first electrode plate and a second electrode plate, and the first electrode plate and the second electrode plate are respectively located on the opposite side walls of the groove.

7. The pickup device of claim 1, wherein The method for manufacturing the pickup device of any one of claims 1 to 7 includes the following steps:

8. A method of manufacturing a pickup device, characterized by: Manufacturing a micro device; Manufacturing a transfer substrate; Adjusting the transfer substrate so that the fixing structure in the micro device is inserted into the groove in the transfer substrate, and transferring the micro device to the transfer substrate. The transfer substrate transfers the micro device to a to-be-placed substrate; 9. The method of manufacturing according to claim 8, wherein, Heating the fixing structure, melting the fixing structure, and at least partially surrounding the micro device. The method for manufacturing the micro device includes:

10. The method of manufacturing according to claim 8, wherein, Providing a first substrate; Forming a micro device master on one side of the first substrate; Forming a plurality of fixing structures on the side of the micro device master away from the first substrate; Providing a transfer substrate; Inverting the micro device master and the fixing structures to the transfer substrate, the fixing structures being located between the micro device master and the transfer substrate, and the fixing structures being inserted into the grooves in the transfer substrate; Cutting the micro device master to form a plurality of micro devices, each of which includes at least one fixing structure. The method for manufacturing the micro device includes:

11. The method of manufacturing according to claim 8, wherein, Providing a first substrate; Forming a micro device master on one side of the first substrate; Forming a fixing structure layer on the side of the micro device master away from the first substrate; Etching the fixing structure layer to form a plurality of fixing structures; Providing a transfer substrate; ​ turning the micro device master and the fixing structure to the transfer substrate, the fixing structure being between the micro device master and the transfer substrate, and the fixing structure being inserted into the groove in the transfer substrate; cutting the micro device master to form a plurality of micro devices, each of the micro devices comprising at least one fixing structure.

12. The method of manufacturing of claim 8, wherein, forming the micro device comprises: providing a first substrate; forming a fixing structure layer on one side of the first substrate; forming a micro device master on a side of the fixing structure layer distal to the first substrate; providing a first auxiliary substrate; turning the fixing structure layer and the micro device master to the first auxiliary substrate, the micro device master being between the fixing structure layer and the first auxiliary substrate; etching the fixing structure layer to form a plurality of the fixing structures; providing a transfer substrate; turning the fixing structure and the micro device master to the transfer substrate, the fixing structure being on a side of the micro device master proximal to the first substrate, and the fixing structure being inserted into the groove in the transfer substrate; cutting the micro device master to form a plurality of micro devices, each of the micro devices comprising at least one fixing structure.

13. A display panel, characterized by a micro device comprising a pin on one side of the micro device, the micro device further comprising at least one fixing structure on a side of the micro device distal to the pin, the fixing structure being configured to engage with the groove in the transfer substrate and allow the micro device to be picked up by the pick-up device.

14. The display panel of claim 13, wherein, the fixing structure comprises quantum dots or phosphor, and the fixing structure at least partially surrounds the micro device after the fixing structure is melted. the fixing structure comprises quantum dots or phosphor, and the fixing structure at least partially surrounds the micro device after the fixing structure is melted.

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