Narrow-frame display panel and display device

Abstract

The present disclosure provides a narrow-frame display panel and display device. The narrow-frame display panel includes at least: a heat dissipation film layer, a display layer, a first adhesive layer, and a second adhesive layer. The display layer includes a display area, a bending area, and a non-display area, the display area and the non-display area being connected by the bending area, the display area and the non-display area being parallel to each other, and the size of the non-display area being smaller than that of the display area. The heat dissipation film layer is disposed between the display area and the non-display area, the display area being connected to the heat dissipation film layer via the first adhesive layer, and the non-display area being connected to the heat dissipation film layer via the second adhesive layer. The heat dissipation film layer has a hollow structure within the orthographic projection range from the non-display area to the display area, with a portion of the second adhesive layer embedded in the hollow structure. In the embodiments of the present disclosure, the thickness of the second adhesive layer on the heat dissipation film layer is adjusted by adjusting the amount of the hollow structure, so that the bending radius can match the bending radius of the narrow frame, thereby achieving a narrow frame effect.

Description

Technical Field

[0001] The present disclosure relates to the field of display, and in particular to a narrow-frame display panel and a display device. Background Art

[0002] As full-screen and large-screen displays become increasingly popular in electronic products like mobile phones, narrow-bezel designs for display modules are becoming increasingly important. In existing technologies, one key approach to narrowing the lower bezel is to reduce the bending radius. However, even with the reduced thickness of existing laminated structures, the thickness remains insufficient to accommodate the narrow bend radius, effectively preventing the desired narrow-bezel effect. Summary of the Invention

[0003] In view of this, the embodiments of the present disclosure propose a narrow-border display panel and display device to solve the following problems in the prior art: the existing laminated structure has been reduced to the extreme, but is still relatively thick and cannot match the bending radius of the narrow border, and cannot achieve the narrow border effect.

[0004] On the one hand, an embodiment of the present disclosure proposes a narrow-border display panel, comprising at least: a heat dissipation film layer, a display layer, a first adhesive layer, and a second adhesive layer; the display layer comprises a display area, a bending area, and a non-display area, the display area and the non-display area are connected via the bending area, the display area and the non-display area are parallel to each other, and the size of the non-display area is smaller than the size of the display area; the heat dissipation film layer is arranged between the display area and the non-display area, the display area is connected to the heat dissipation film layer via the first adhesive layer, and the non-display area is connected to the heat dissipation film layer via the second adhesive layer; the heat dissipation film layer has a hollow structure within the range of the positive projection from the non-display area to the display area, and a portion of the second adhesive layer is embedded in the hollow structure.

[0005] In some embodiments, the heat dissipation film layer is a metal film layer.

[0006] In some embodiments, the heat dissipation film layer includes: a buffer layer and a metal film layer, the buffer layer is connected to the first adhesive layer, the metal film layer is connected to the second adhesive layer, and the hollow structure is provided on the metal film layer.

[0007] In some embodiments, a thermal conductive material is provided on the connection surface between the second adhesive layer and the heat dissipation film layer, or the material of the second adhesive layer is doped with a thermal conductive material.

[0008] In some embodiments, the thermally conductive material includes at least one of the following: graphite, graphene.

[0009] In some embodiments, the pattern of the hollow structure includes at least one of the following: rectangle, square, circle, and triangle.

[0010] In some embodiments, a grid structure is formed on the connection surface between the first adhesive layer and the display area.

[0011] In some embodiments, the material of the first adhesive layer is different from the material of the second adhesive layer.

[0012] In some embodiments, the device further includes: a driving chip, which is disposed on the non-display area and connected to the heat dissipation film layer through the non-display area.

[0013] On the other hand, an embodiment of the present disclosure provides a display device, which at least includes: the narrow-border display panel described in any embodiment of the present disclosure.

[0014] In the disclosed embodiment, a hollow structure is provided on the heat dissipation film layer. The hollow structure is located only within the orthographic projection range from the non-display area to the display area. The area where the hollow structure is located is relatively small and corresponds only to the non-display area, which does not affect the original heat dissipation performance of the heat dissipation film layer. However, the hollow portion of the hollow structure can penetrate the applied second adhesive layer. When the thickness of the second adhesive layer remains unchanged, part of the second adhesive layer is embedded in the hollow structure, resulting in a thinner thickness of the second adhesive layer on the heat dissipation film layer. However, the part of the second adhesive layer embedded in the hollow structure still has adhesion, which does not affect the adhesion of the second adhesive layer while reducing the thickness between the display area and the non-display area, thereby reducing the bending radius. In the disclosed embodiment, the thickness of the second adhesive layer on the heat dissipation film layer is adjusted by adjusting the amount of hollowing of the hollow structure, so that the bending radius can match the bending radius of the narrow frame, thereby achieving a narrow frame effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] In order to more clearly illustrate the embodiments of the present disclosure or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments recorded in the present disclosure. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative labor.

[0016] Figure 1 A schematic diagram of the bending radius of a display module provided by the prior art;

[0017] Figure 2 A schematic cross-sectional view of the narrow-border display panel provided in the first embodiment of the present disclosure;

[0018] Figure 3 A schematic cross-sectional view of a narrow-border display panel according to a second embodiment of the present disclosure;

[0019] Figure 4 A schematic cross-sectional view of a narrow-border display panel according to a third embodiment of the present disclosure;

[0020] Figure 5 A schematic diagram of the stacked structure of a narrow-border display panel provided in a third embodiment of the present disclosure;

[0021] Figure 6 A front view of a thermally conductive metal layer of a narrow-frame display panel provided in a third embodiment of the present disclosure;

[0022] Figure 7 A flowchart of the die-cutting process for a partial structure of a narrow-border display panel provided in the third embodiment of the present disclosure.

[0023] Reference numerals:

[0024] 1-heat dissipation film layer, 2-display layer, 3-first adhesive layer, 4-second adhesive layer, 5-driving chip, 11-hollow structure, 12-buffer layer, 13-metal film layer, 21-display area, 22-bending area, 23-non-display area. DETAILED DESCRIPTION

[0025] In order to make the purpose, technical solutions and advantages of the embodiments of the present disclosure more clear, the technical solutions of the embodiments of the present disclosure will be clearly and completely described below in conjunction with the drawings of the embodiments of the present disclosure. Obviously, the described embodiments are part of the embodiments of the present disclosure, not all of the embodiments. Based on the described embodiments of the present disclosure, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present disclosure.

[0026] Unless otherwise defined, the technical or scientific terms used in this disclosure should have the usual meanings understood by persons of ordinary skill in the field to which this disclosure belongs. The words "first", "second" and similar terms used in this disclosure do not indicate any order, quantity or importance, but are only used to distinguish different components. Words such as "include" or "comprise" mean that the elements or objects appearing before the word include the elements or objects listed after the word and their equivalents, without excluding other elements or objects. Words such as "connect" or "connected" are not limited to physical or mechanical connections, but may include electrical connections, whether direct or indirect. "Up", "down", "left", "right" and the like are only used to indicate relative positional relationships. When the absolute position of the object being described changes, the relative positional relationship may also change accordingly.

[0027] In order to keep the following description of the embodiments of the present disclosure clear and concise, the present disclosure omits detailed descriptions of known functions and known components.

[0028] Figure 1 The bending radius (r) is determined by the thickness of the laminate between the display area and the non-display area connected by the bending area. Figure 1The bending radius in the display should be as small as possible. However, existing laminated structures have been reduced to their limits, and the thickness cannot be reduced to even a few microns, making them incompatible with the narrow bend radius and, consequently, unable to achieve the narrow bezel effect. Therefore, how to reduce the thickness of the laminated layer in the bending area without affecting existing performance is the primary issue addressed by the embodiments of the present disclosure.

[0029] Example 1

[0030] The first embodiment of the present disclosure provides a narrow-frame display panel, the cross-sectional structure of which is shown as follows: Figure 2 As shown, including at least:

[0031] Heat dissipation film layer 1, display layer 2, first adhesive layer 3, second adhesive layer 4;

[0032] The display layer 2 includes a display area 21, a bending area 22, and a non-display area 23. The display area and the non-display area are connected by the bending area. The display area and the non-display area are parallel to each other, and the size of the non-display area is smaller than that of the display area.

[0033] The heat dissipation film layer 1 is arranged between the display area 21 and the non-display area 23. The display area 21 is connected to the heat dissipation film layer 1 through the first adhesive layer 3, and the non-display area 23 is connected to the heat dissipation film layer 1 through the second adhesive layer 4; the heat dissipation film layer 1 has a hollow structure 11 within the orthographic projection range from the non-display area 23 to the display area 21, and part of the second adhesive layer 4 is embedded in the hollow structure 11.

[0034] The above cross-sectional view is only a single cross-section. When viewed from the front, the dimensions of the heat dissipation film layer are the same as those of the display area. When viewed from the front, the pattern of the above hollow structure can be rectangular, square, circular, triangular, or other patterns, and this disclosure is not limited to this. The process for producing the pattern of the above hollow structure can be any feasible process, such as die-cutting, etching, or laser cutting, and this is not limited here.

[0035] In a preferred embodiment, since the materials bonded by the first adhesive layer and the second adhesive layer are different, the material of the first adhesive layer can be different from the material of the second adhesive layer. For example, the second adhesive layer can be an acrylic type adhesive, while the first adhesive layer can be an acrylic type adhesive with greater peeling force.

[0036] Since the first adhesive layer and the second adhesive layer are bonded with different materials, one side of the first adhesive layer is bonded to the display area. Therefore, in order to protect the display area and allow the first adhesive layer to be better attached to the display area, a grid structure is preferably provided on the connecting surface between the first adhesive layer and the display area.

[0037] The disclosed embodiment provides a hollow structure on the heat dissipation film layer. The hollow structure is located only within the orthographic projection from the non-display area to the display area. The area where the hollow structure is located is relatively small, corresponding only to the non-display area, and does not affect the original heat dissipation performance of the heat dissipation film layer. However, the hollow portion of the hollow structure can penetrate the applied second adhesive layer. When the applied thickness of the second adhesive layer remains unchanged, part of the second adhesive layer is embedded in the hollow structure, resulting in a thinner thickness of the second adhesive layer on the heat dissipation film layer. However, the part of the second adhesive layer embedded in the hollow structure still maintains adhesion. This does not affect the adhesion of the second adhesive layer while reducing the thickness between the display area and the non-display area, thereby reducing the bending radius. For example, the thickness of the applied second adhesive layer is 50 μm. In the prior art, the thickness of the second adhesive layer after lamination is 40 μm. However, with the disclosed embodiment, during lamination, part of the second adhesive layer penetrates into the hollow structure. After the second adhesive layer becomes solid, the thickness of the second adhesive layer on the heat dissipation film layer is reduced to 30 μm. Compared with the prior art, the thickness of the second adhesive layer is significantly reduced.

[0038] In the embodiment of the present disclosure, the thickness of the second adhesive layer on the heat dissipation film layer is adjusted by adjusting the hollowing amount of the hollow structure, so that the bending radius can match the bending radius of the narrow frame, thereby achieving a narrow frame effect.

[0039] Example 2

[0040] The second embodiment of the present disclosure provides a narrow-frame display panel, the cross-sectional structure of which is shown as follows: Figure 3 As shown, including at least:

[0041] Heat dissipation film layer 1, display layer 2, first adhesive layer 3, second adhesive layer 4;

[0042] The display layer 2 includes a display area 21, a bending area 22, and a non-display area 23. The display area and the non-display area are connected by the bending area. The display area and the non-display area are parallel to each other, and the size of the non-display area is smaller than that of the display area.

[0043] The heat dissipation film layer 1 is disposed between the display area 21 and the non-display area 23. The display area 21 is connected to the heat dissipation film layer 1 via a first adhesive layer 3, and the non-display area 23 is connected to the heat dissipation film layer 1 via a second adhesive layer 4. The heat dissipation film layer 1 has a hollow structure 11 within the orthographic projection range from the non-display area 23 to the display area 21, and a portion of the second adhesive layer 4 is embedded in the hollow structure 11.

[0044] The heat dissipation film layer 1 includes a buffer layer 12 and a metal film layer 13 . The buffer layer is connected to the first adhesive layer, the metal film layer is connected to the second adhesive layer, and the hollow structure is provided on the metal film layer.

[0045] The heat dissipation film layer of the disclosed embodiment comprises a buffer layer and a technical film layer. The buffer layer can preferably be configured as foam. In specific implementations, the provision of the aforementioned buffer layer is merely a preferred embodiment. The buffer layer can reduce the risk of high temperatures in the display area caused by the heat of the metal film layer. Of course, the heat dissipation film layer can also consist solely of a metal film layer, but this may pose a certain risk to the pixels in the display area during specific implementations. Therefore, the provision of a buffer layer is preferred.

[0046] The above cross-sectional view is only a single cross-section. When viewed from the front, the dimensions of the heat dissipation film layer are the same as those of the display area. When viewed from the front, the pattern of the above hollow structure can be rectangular, square, circular, triangular, or other patterns, and this disclosure is not limited to this. The process for producing the pattern of the above hollow structure can be any feasible process, such as die-cutting, etching, or laser cutting, and this is not limited here.

[0047] In a preferred embodiment, since the materials bonded by the first adhesive layer and the second adhesive layer are different, the material of the first adhesive layer can be different from the material of the second adhesive layer. For example, the second adhesive layer can be an acrylic type adhesive, while the first adhesive layer can be an acrylic type adhesive with greater peeling force.

[0048] Since the first adhesive layer and the second adhesive layer are bonded with different materials, one side of the first adhesive layer is bonded to the display area. Therefore, in order to protect the display area and allow the first adhesive layer to be better attached to the display area, a grid structure is preferably provided on the connecting surface between the first adhesive layer and the display area.

[0049] The disclosed embodiment provides a hollow structure on the heat dissipation film layer. The hollow structure is located only within the orthographic projection from the non-display area to the display area. The area where the hollow structure is located is relatively small, corresponding only to the non-display area, and does not affect the original heat dissipation performance of the heat dissipation film layer. However, the hollow portion of the hollow structure can penetrate the applied second adhesive layer. When the applied thickness of the second adhesive layer remains unchanged, part of the second adhesive layer is embedded in the hollow structure, resulting in a thinner thickness of the second adhesive layer on the heat dissipation film layer. However, the part of the second adhesive layer embedded in the hollow structure still maintains adhesion. This does not affect the adhesion of the second adhesive layer while reducing the thickness between the display area and the non-display area, thereby reducing the bending radius. For example, the thickness of the applied second adhesive layer is 50 μm. In the prior art, the thickness of the second adhesive layer after lamination is 45 μm. However, with the disclosed embodiment, during lamination, part of the second adhesive layer penetrates into the hollow structure. After the second adhesive layer becomes solid, the thickness of the second adhesive layer on the heat dissipation film layer is reduced to 30 μm. Compared with the prior art, the thickness of the second adhesive layer is significantly reduced.

[0050] In the embodiment of the present disclosure, the thickness of the second adhesive layer on the heat dissipation film layer is adjusted by adjusting the hollowing amount of the hollow structure, so that the bending radius can match the bending radius of the narrow frame, thereby achieving a narrow frame effect.

[0051] Example 3

[0052] The third embodiment of the present disclosure provides a narrow-frame display panel, the cross-sectional structure of which is shown as follows: Figure 4 As shown, including at least:

[0053] Heat dissipation film layer 1, display layer 2, first adhesive layer 3, second adhesive layer 4, driver chip 5;

[0054] The display layer 2 includes a display area 21, a bending area 22, and a non-display area 23. The display area and the non-display area are connected by the bending area. The display area and the non-display area are parallel to each other, and the size of the non-display area is smaller than that of the display area.

[0055] The heat dissipation film layer 1 is disposed between the display area 21 and the non-display area 23. The display area 21 is connected to the heat dissipation film layer 1 via a first adhesive layer 3, and the non-display area 23 is connected to the heat dissipation film layer 1 via a second adhesive layer 4. The heat dissipation film layer 1 has a hollow structure 11 within the orthographic projection range from the non-display area 23 to the display area 21, and a portion of the second adhesive layer 4 is embedded in the hollow structure 11. The driver chip 5 is disposed on the non-display area and connected to the heat dissipation film layer via the non-display area.

[0056] The heat dissipation film layer 1 includes: a buffer layer 12 and a metal film layer 13, the buffer layer is connected to the first adhesive layer, the metal film layer is connected to the second adhesive layer, and the hollow structure is provided on the metal film layer;

[0057] A heat-conducting material is provided on the connection surface between the second adhesive layer and the heat-dissipating film layer, or the material of the second adhesive layer is doped with the heat-conducting material.

[0058] The heat dissipation film layer of the disclosed embodiment comprises a buffer layer and a technical film layer. The buffer layer can preferably be configured as foam. In specific implementations, the provision of the aforementioned buffer layer is merely a preferred embodiment. The buffer layer can reduce the risk of high temperatures in the display area caused by the heat of the metal film layer. Of course, the heat dissipation film layer can also consist solely of a metal film layer, but this may pose a certain risk to the pixels in the display area during specific implementations. Therefore, the provision of a buffer layer is preferred.

[0059] In the embodiment of the present disclosure, a hollow structure is provided on the heat dissipation film layer (the portion corresponding to the non-display area), and the heat dissipation film layer is a metal film layer. Its heat dissipation effect is relatively poor compared to when there is no hollow structure, and the thermal conductivity will be worse. In addition, the hollow structure corresponds to the non-display area, and a driver chip is provided on the non-display area. The driver chip will generate more heat when it is working. Therefore, the embodiment of the present disclosure adds a thermal conductive material to assist in heat conduction. Without affecting the bonding strength of the second adhesive layer, the thermal conductive material can be doped into the material of the second adhesive layer. However, in order to better assist in heat conduction without destroying the bonding strength of the second adhesive layer, it is preferred to provide a thermal conductive material on the connecting surface between the second adhesive layer and the heat dissipation film layer. As for the thermal conductive material, it can be graphite, graphene and other substances, and examples are not given here one by one.

[0060] The above cross-sectional view is only a single cross-section. When viewed from the front, the dimensions of the heat dissipation film layer are the same as those of the display area. When viewed from the front, the pattern of the above hollow structure can be rectangular, square, circular, triangular, or other patterns, and this disclosure is not limited to this. The process for producing the pattern of the above hollow structure can be any feasible process, such as die-cutting, etching, or laser cutting, and this is not limited here.

[0061] In a preferred embodiment, since the materials bonded by the first adhesive layer and the second adhesive layer are different, the material of the first adhesive layer can be different from the material of the second adhesive layer. For example, the second adhesive layer can be an acrylic type adhesive, while the first adhesive layer can be an acrylic type adhesive with greater peeling force.

[0062] Since the first adhesive layer and the second adhesive layer are bonded with different materials, one side of the first adhesive layer is bonded to the display area. Therefore, in order to protect the display area and allow the first adhesive layer to be better attached to the display area, a grid structure is preferably provided on the connecting surface between the first adhesive layer and the display area.

[0063] The disclosed embodiment provides a hollow structure on the heat dissipation film layer. The hollow structure is located only within the orthographic projection from the non-display area to the display area. The area where the hollow structure is located is relatively small, corresponding only to the non-display area, and does not affect the original heat dissipation performance of the heat dissipation film layer. However, the hollow portion of the hollow structure can penetrate the applied second adhesive layer. When the applied thickness of the second adhesive layer remains unchanged, part of the second adhesive layer is embedded in the hollow structure, resulting in a thinner thickness of the second adhesive layer on the heat dissipation film layer. However, the part of the second adhesive layer embedded in the hollow structure still maintains adhesion. This does not affect the adhesion of the second adhesive layer while reducing the thickness between the display area and the non-display area, thereby reducing the bending radius. For example, the thickness of the applied second adhesive layer is 50 μm. In the prior art, the thickness of the second adhesive layer after lamination is 45 μm. However, with the disclosed embodiment, during lamination, part of the second adhesive layer penetrates into the hollow structure. After the second adhesive layer becomes solid, the thickness of the second adhesive layer on the heat dissipation film layer is reduced to 35 μm. Compared to the prior art, the thickness of the second adhesive layer is significantly reduced.

[0064] In the embodiment of the present disclosure, the thickness of the second adhesive layer on the heat dissipation film layer is adjusted by adjusting the hollowing amount of the hollow structure, so that the bending radius can match the bending radius of the narrow frame, thereby achieving a narrow frame effect.

[0065] The above embodiments are exemplarily described below with reference to the accompanying drawings.

[0066] The disclosed embodiment proposes a design scheme for a heat dissipation film layer of a narrow-border display panel. The laminated structure of the narrow-border display panel comprises, from top to bottom, a grid adhesive layer (i.e., a first adhesive layer), a foam layer (i.e., a buffer layer of the heat dissipation film layer), and a thermally conductive metal layer (i.e., a metal film layer of the heat dissipation film layer). A local hollow pattern is designed in the thermally conductive metal layer, and the shape of the hollow pattern can be a long strip, a grid, a circular hole, etc. The hollow pattern can be implemented by die-cutting, etching, laser cutting, etc., and the die-cutting process is preferred, as the process is simple, convenient, and low-cost.

[0067] The partially hollowed-out pattern is located within the orthographic projection of the panel's display area (i.e., the display area) and non-display area (i.e., the non-display area). An adhesive layer (i.e., the second adhesive layer) is positioned between the thermally conductive metal layer and the non-display panel for bonding. Due to the partially hollowed-out design, during the bonding process, some of the adhesive will penetrate into the hollowed-out area under pressure, reducing the adhesive layer's thickness and ensuring arc formation with a small bend radius. Simultaneously, the penetrating adhesive layer (i.e., the portion of the second adhesive layer embedded in the heat dissipation film layer) forms a mechanical interlocking structure with the thermally conductive metal layer, improving the adhesion between the heat dissipation film layer and the display panel and reducing the risk of module detachment.

[0068] The adhesive layer used to bond the thermally conductive metal layer to the non-display area can be designed as an integrated heat dissipation film or as a separate material, depending on process requirements. Furthermore, materials such as graphite and graphene can be incorporated into the adhesive layer. This design, due to the applied force during the bonding process, can further form a thermal network, thereby facilitating the transfer of heat generated by the driver IC (i.e., driver chip) to the heat dissipation film layer, which then evenly distributes the heat.

[0069] Through the above-mentioned design of hollowing out the thermally conductive metal layer, the thinning of the stack and the improvement of the bonding strength can be achieved at the same time. Moreover, the thermally conductive metal layer is partially hollowed out, which has little impact on the overall thermal conductivity and electromagnetic shielding effects.

[0070] When implementing it specifically, Figure 5 As shown, the stacked layers of the narrow-frame display panel include a display layer, a grid glue layer, a heat dissipation film layer, an adhesive glue layer, and a driver chip. The display layer consists of a display area, a bending area, and a non-display area. The heat dissipation film layer includes a thermally conductive metal layer and a foam layer from top to bottom. The thermally conductive metal layer includes a hollow area A and a non-hollow area B. The hollow area is located within the positive projection range of the non-display area panel. In the actual production process, when the adhesive layer is attached to the heat dissipation layer, under the action of the attachment pressure, the glue will penetrate into the hollow area of ​​the thermally conductive metal layer, thereby thinning the glue layer to achieve the arc-forming effect when the bending radius is reduced; at the same time, the penetrated glue and the heat dissipation film layer form a mechanical interlocking structure, which improves the adhesion between the heat dissipation film layer and the glue layer and reduces the risk of module falling off.

[0071] like Figure 6 As shown, it is a front view of the thermal conductive metal layer of the narrow frame display panel. The metal in the thermal conductive metal layer can be copper foil, SUS or other metals with certain rigidity and excellent thermal conductivity. The hollow shape can be a long strip ( Figure 6 The hollow pattern can be made of strips, grids, round holes, etc. Since only a part of the hollow pattern is formed, the overall heat conduction and electromagnetic shielding functions of the heat dissipation film are less affected. The hollow pattern can be made by die cutting, etching, laser cutting, etc. This embodiment lists one of the die cutting processes, such as Figure 7 As shown, the specific process is as follows: the die-cutting process first aligns the foam layer and the grid adhesive layer, and then cuts out the hollow pattern of the thermally conductive metal layer. After the cut thermally conductive metal layer is transferred to the foam layer, the holes, shapes and other structures required for the heat dissipation film layer are cut out. Compared with the traditional solution, this method only adds the thermally conductive metal layer cutting process, and has the advantages of simple implementation and low cost. Furthermore, the adhesive layer can also be directly attached to the hollow pattern area A of the heat dissipation film layer, and the adhesive layer can be added with graphene, graphite and other filling materials with excellent thermal conductivity, so that the heat generated by the driver IC can be transferred to the metal layer, and the heat is evenly distributed, reducing the risk of burns during the operation of the display module.

[0072] The fourth embodiment of the present disclosure further provides a display device, which at least includes the narrow-border display panel in the above embodiments of the present disclosure. The structure of the narrow-border display panel refers to the above embodiments and will not be repeated here.

[0073] Furthermore, although exemplary embodiments have been described herein, the scope includes any and all embodiments based on the present disclosure with equivalent elements, modifications, omissions, combinations (e.g., solutions that intersect various embodiments), adaptations, or changes. The elements in the claims are to be interpreted broadly based on the language employed in the claims and are not limited to the examples described in this specification or during the prosecution of this application, which examples are to be interpreted as non-exclusive. Therefore, this specification and examples are intended to be considered as examples only, with the true scope and spirit being indicated by the following claims and the full scope of their equivalents.

[0074] The above description is intended to be illustrative and not restrictive. For example, the above examples (or one or more schemes thereof) can be used in combination with each other. For example, a person of ordinary skill in the art may use other embodiments when reading the above description. In addition, in the above-mentioned specific embodiments, various features can be grouped together to simplify the present disclosure. This should not be interpreted as an intention that a disclosed feature that is not required to be protected is necessary for any claim. On the contrary, the subject matter of the present disclosure may be less than all the features of a specific disclosed embodiment. Thus, the following claims are incorporated into the specific embodiments as examples or embodiments, wherein each claim is independently a separate embodiment, and it is considered that these embodiments can be combined with each other in various combinations or arrangements. The scope of the present disclosure should be determined with reference to the appended claims and the full scope of equivalents to which these claims are entitled.

[0075] The above describes in detail multiple embodiments of the present disclosure, but the present disclosure is not limited to these specific embodiments. Those skilled in the art can make various variations and modifications to the embodiments based on the concepts of the present disclosure, and these variations and modifications should all fall within the scope of protection claimed by the present disclosure.

Claims

1. A narrow-frame display panel, characterized in that: At least: Heat dissipation film layer, display layer, first adhesive layer, second adhesive layer; The display layer includes a display area, a bending area, and a non-display area, wherein the display area and the non-display area are connected via the bending area, the display area and the non-display area are parallel to each other, and the size of the non-display area is smaller than that of the display area; The heat dissipation film layer is arranged between the display area and the non-display area, the display area is connected to the heat dissipation film layer through a first adhesive layer, and the non-display area is connected to the heat dissipation film layer through a second adhesive layer; the heat dissipation film layer has a hollow structure within the range of the orthographic projection from the non-display area to the display area, and a portion of the second adhesive layer is embedded in the hollow structure; the embedded portion of the second adhesive layer forms a mechanical interlocking structure with the heat dissipation film layer.

2. The narrow-border display panel according to claim 1, wherein: The heat dissipation film layer is a metal film layer.

3. The narrow-border display panel according to claim 1, wherein: The heat dissipation film layer comprises: A buffer layer and a metal film layer, the buffer layer is connected to the first adhesive layer, the metal film layer is connected to the second adhesive layer, and the hollow structure is arranged on the metal film layer.

4. The narrow-border display panel according to claim 1, wherein: A heat-conducting material is provided on the connection surface between the second adhesive layer and the heat-dissipating film layer, or the material of the second adhesive layer is doped with a heat-conducting material.

5. The narrow-border display panel according to claim 4, wherein: The thermally conductive material includes at least one of the following: graphite and graphene.

6. The narrow-border display panel according to any one of claims 1 to 5, wherein: The pattern of the hollow structure includes at least one of the following: rectangle, square, circle, and triangle.

7. The narrow-border display panel according to any one of claims 1 to 5, wherein: A grid structure is provided on the connection surface between the first adhesive layer and the display area.

8. The narrow-border display panel according to any one of claims 1 to 5, wherein: The material of the first adhesive layer is different from that of the second adhesive layer.

9. The narrow-border display panel according to any one of claims 1 to 5, wherein: Also includes: The driving chip is arranged on the non-display area and connected to the heat dissipation film layer through the non-display area.

10. A display device, characterized in that: At least: The narrow-border display panel according to any one of claims 1 to 9.

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