A mold for producing amorphous SMT carrier board and a processing method thereof

Abstract

The present invention provides a mold for producing an amorphous SMT carrier and a method for using the same: the mold comprises a corresponding fixed mold (1) and a movable mold (2), characterized in that a carrier molding groove (3) is provided on the movable mold (2), the carrier molding groove (3), a group of material flow channels (4) and a group of exhaust channels (5), and one end of the material flow channel (4) is connected to a material injection barrel (6) of a die-casting machine. After the fixed and movable molds are closed, the material is injected to quickly fill the carrier cavity, and then quickly cooled and solidified to form an amorphous SMT carrier blank, and then the amorphous SMT carrier is taken out, and the amorphous SMT carrier is obtained after artificial residual material removal and grinding. The present invention is easy to operate, high in production efficiency, and high in product yield. It adopts the emerging cutting-edge molding process - amorphous die-casting process to solve problems that cannot be solved by basic molding processes.

Description

Technical field:

[0002] The present invention relates to the field of production of amorphous SMT carrier boards, and specifically to a mold for producing amorphous SMT carrier boards and a method for using the mold. Background technology:

[0004] SMT surface assembly technology is the most popular technology and process in the electronic assembly industry. Reflow soldering, as a key process in SMT production, melts the solder paste on the circuit board pads to achieve mechanical and electrical connections between the solder ends of surface mounted components and the PCB pads to form an electrical circuit. In order to ensure that the pads corresponding to the SMT components and the PCB achieve good electrical connections and have sufficient mechanical strength during reflow soldering, the SMT components and the pads corresponding to the PCB need to be matched one by one, and then uniformly placed on the SMT carrier for compression and fixation, and then the solder paste is melted through the reflow soldering furnace together with the SMT carrier, so that the SMT components and the PCB are firmly connected. Therefore, the SMT carrier plays a vital role in ensuring the connection between the SMT components and the PCB.

[0005] SMT substrates have high flatness requirements, usually below 0.05mm. If the flatness of SMT substrates is too large, the PCB board will have welding defects such as incomplete welding, cold welding, and component warping, which will affect product quality. The manufacturing process of SMT substrates generally uses stainless steel sheet stamping, followed by milling, and finally double-sided grinding. The entire processing process is time-consuming, the material utilization rate is low, and among the products produced, there are not many products that can meet the flatness requirements, and the yield rate is low. Summary of the invention:

[0007] The present invention aims to overcome the deficiencies in the prior art and provides a mold for producing an amorphous SMT carrier board and a method for using the mold.

[0008] This application provides the following technical solutions:

[0009] A mold for producing an amorphous SMT carrier board: it includes a corresponding fixed mold and a movable mold, and is characterized in that: a carrier board forming groove is provided on the movable mold, and a group of material flow channels and a group of exhaust channels are provided in the carrier board forming groove, and one end of the material flow channel is connected to the injection barrel of a die-casting machine.

[0010] On the basis of the above technical solutions, there are also the following further technical solutions:

[0011] The group of material flow channels includes main flow grooves distributed on both sides of the carrier plate forming groove, a group of branch flow grooves are distributed between the main flow groove and the carrier plate forming groove, and one end of the main flow groove is connected to the injection barrel of the die casting machine.

[0012] The group of exhaust channels includes first exhaust channels distributed at the upper and lower ends of the carrier plate forming groove, and second exhaust channels are distributed outside each material flow channel.

[0013] A group of first columns, a group of second columns, a group of third columns and a fourth column are also distributed in the carrier plate forming groove. The group of first columns and the group of second columns are staggered in a matrix shape in the carrier plate forming groove. The third columns are distributed at both ends of the carrier plate forming groove, and the fourth columns are distributed on one side of the length edge of the carrier plate forming groove.

[0014] The diameter of one end of the main groove is larger than that of the other end, a teardrop-shaped groove body extends from the other end of the main groove, and a group of ejector pin through holes corresponding to the ejector pins of the die-casting machine are arranged at the bottom of the main groove.

[0015] A method for using a mold for producing an amorphous SMT carrier board.

[0016] The method comprises the following steps: installing a fixed die and a movable die on a die-casting machine, and connecting the fixed die and the movable die with a die temperature controller through a pipeline, wherein the method is characterized in that the die temperature of the fixed die and the movable die are controlled at 160-240°C by the die temperature controller; heating and melting the alloy material put into the vacuum melting system of the die-casting machine into a liquid state, and maintaining the material temperature at 900-980°C, and then pouring the liquid material into a casting barrel, after the fixed die and the movable die are closed, a push rod in the casting barrel pushes the liquid material into a material flow channel at a speed of 1.5-2.5m / s, and then enters a carrier forming groove, and as the temperature rapidly decreases, the liquid material is cooled and solidified to form an amorphous SMT carrier blank, and then the fixed die and the movable die are separated, and a ejector pin on the die-casting machine extends to eject the amorphous SMT carrier blank out of the movable die, and the SMT carrier blank can be taken out by a tool, and then the residual material formed on both sides of the amorphous SMT carrier is cut off, and then the cut-off part is polished and flattened to obtain the amorphous SMT carrier.

[0017] Advantages of the invention:

[0018] The present invention is easy to operate, has high production efficiency and high product yield. It uses the emerging amorphous die-casting process to form the product at one time and perfectly replicate the precision of the mold, so that the product has high dimensional accuracy. At the same time, it only needs a small amount of auxiliary CNC processing, which can greatly reduce the manufacturing cost. The amorphous SMT carrier has a high flatness. After testing, it can meet the flatness of less than 0.05mm, and the hardness can reach about HV460. The process is simple, the processing time is short, the material utilization rate is high, and the net near forming can be achieved, which is conducive to ensuring that the PCB board will not have welding defects such as incomplete welding, cold welding, and component warping, thereby ensuring product quality. Description of the drawings:

[0020] Figure 1 It is a structural schematic diagram of the movable mold in the present invention;

[0021] Figure 2 It is a structural schematic diagram of the fixed mold in the present invention;

[0022] Figure 3 It is a schematic diagram of the fixed mold and the movable mold when they are closed;

[0023] Figure 4 This is a finished product structure view of the amorphous SMT substrate;

[0024] Figure 5 It is a schematic diagram of the structure of the amorphous SMT carrier blank after die-casting. Specific implementation method:

[0026] like Figure 1-5 As shown, a mold for producing an amorphous SMT carrier board includes a fixed mold 1 and a movable mold 2 that can be mounted on a die-casting machine and correspondingly matched. The fixed mold 1 is a flat plate structure, and a first clearance groove 1b correspondingly matched with a filling barrel 6 is provided at the lower end. A temperature control medium flow channel 1a is provided in both the fixed mold 1 and the movable mold 2, and the inlet and outlet of the temperature control medium flow channel 1a are connected to the mold temperature controller on one side of the die-casting machine through a pipeline. Since they are all prior arts, they will not be described here.

[0027] A second clearance groove 2a is provided at the lower end of the movable mold 2 and is matched with the injection barrel 6. A carrier plate forming groove 3, a group of material flow channels 4 and a group of exhaust channels 5 are provided on the matching surface of the movable mold 2 and the fixed mold 1. A group of first columns 3a, a group of second columns 3b, a group of third columns 3c and a fourth column 3d are vertically extended in the carrier plate forming groove 3.

[0028] The first column 3a and the second column 3b are arranged in a matrix and staggered in the carrier molding groove 3. The first column 3a corresponds to the circuit installation hole a of the finished amorphous SMT carrier, and the second column 3b corresponds to the magnet installation hole b of the finished amorphous SMT carrier.

[0029] The third column 3c is distributed at both end portions of the carrier forming groove 3, corresponding to the positioning hole c of the finished amorphous SMT carrier. The fourth column is distributed on one side of the length side of the carrier forming groove 3, corresponding to the laser QR code carrier installation hole d of the finished amorphous SMT carrier.

[0030] The material flow channel 4 includes main flow grooves 4a distributed on both sides of the carrier plate forming groove 3. One end of the two main flow grooves 4a is connected to the injection barrel 6 of the die casting machine located below the fixed mold 1. The diameter of the main flow groove 4a at this end is relatively large, and then the diameter of the main flow groove 4a gradually decreases toward the other end. A water drop-shaped groove body 4c is extended from the top of the other end so that a part of the residual gas can be pressed into it during die casting. Three branch flow grooves 4b connected to the carrier plate forming groove 3 are distributed on one side of the main flow groove 4a. A push rod 6a is provided in the injection barrel 6, and an injection plug 6b is connected to the end of the push rod 6a. The push rod drives the injection plug to move and press the liquid material flowing into the injection barrel into the main flow groove.

[0031] The set of exhaust channels 5 includes a pair of first exhaust channels 5a and a pair of second exhaust channels 5b. The first exhaust channels 5a are respectively distributed at the upper and lower ends of the carrier plate forming groove 3 and are connected to the carrier plate forming groove 3. The second exhaust channels 5b are distributed on the other side of each main groove 4a and are connected to the main groove 4a. Since the apertures of the first exhaust channels 5a and the pair of second exhaust channels 5b are small, materials cannot enter.

[0032] A group of ejector holes 4d corresponding to the ejector pins of the die-casting machine are also provided at the bottom of the main groove 4a, so that after the fixed mold and the movable mold are separated, the ejector pins of the die-casting machine can extend from the ejector holes to eject the die-cast amorphous SMT carrier blank from the carrier molding groove 3 so that it can be taken out by tools.

[0033] A method for using a mold for producing an amorphous SMT carrier board comprises the following steps: installing a fixed mold 1 and a movable mold 2 on a die-casting machine, connecting the fixed mold and the movable mold with a mold temperature controller through a pipeline, and controlling the mold temperature of the fixed mold and the movable mold at 160-240°C through the mold temperature controller.

[0034] The alloy material put into the vacuum melting system of the die-casting machine is heated and melted into liquid, and the material temperature is maintained at 900~980℃, and then the liquid material is poured into the casting barrel. At the same time, the movable mold is closed with the fixed mold under the push of the die-casting machine.

[0035] The injection plug in the injection barrel pushes the liquid material into the material flow channel at a speed of 1.5-2.5m / s under the action of the push rod, and then the liquid material passes through the main channel and the branch channel to fill the carrier molding groove. Since the mold temperature is much lower than the material temperature, the liquid material becomes liquid metal, which is quickly cooled and solidified to form an amorphous SMT carrier blank.

[0036] Then the fixed die and the movable die are separated, and the ejector pin on the die-casting machine extends from the ejector pin through hole to eject the amorphous SMT carrier blank out of the movable die. Then the SMT carrier blank can be taken out by tools.

[0037] Finally, the residual material formed on both sides of the amorphous SMT carrier is cut off. The residual material includes two parts x and z corresponding to the shape of the material flow channel and the shape of the discharge end of the injection barrel. After the cut-off part is polished and smoothed, the amorphous SMT carrier is obtained. The cut-off part is the connection between the branch groove and the carrier molding groove.

Claims

1. A mold for producing an amorphous SMT carrier board: it comprises a corresponding fixed mold (1) and a movable mold (2), characterized in that: A carrier plate forming groove (3) is provided on the movable mold (2), and the carrier plate forming groove (3), a group of material flow channels (4) and a group of exhaust channels (5) are provided, and one end of the material flow channel (4) is connected to the injection barrel (6) of the die-casting machine; the group of material flow channels (4) includes main flow channels (4a) distributed on both sides of the carrier plate forming groove (3), and a group of branch flow channels (4b) are distributed between the main flow channel (4a) and the carrier plate forming groove (3), and one end of the main flow channel (4a) is connected to the injection barrel (6) of the die-casting machine; the group of exhaust channels (5) includes two main flow channels (4a) distributed on the upper and lower sides of the carrier plate forming groove (3) and a group of branch flow channels (4b) are distributed between the main flow channel (4a) and the carrier plate forming groove (3). A first exhaust channel (5a) is provided at the end portion, and a second exhaust channel (5b) is also provided outside each material flow channel (4); a group of first columns (3a), a group of second columns (3b), a group of third columns (3c) and a fourth column (3d) are also provided in the carrier plate forming groove (3); the group of first columns (3a) and the group of second columns (3b) are arranged in a matrix-like staggered manner in the carrier plate forming groove (3); the third columns (3c) are provided at both end portions of the carrier plate forming groove (3), and the fourth columns are provided on one side of the length edge of the carrier plate forming groove (3).

2. A mold for producing an amorphous SMT carrier according to claim 1, characterized in that: The diameter of one end of the main groove (4a) is larger than that of the other end, a teardrop-shaped groove body (4c) extends from the other end of the main groove (4a), and a group of ejector pin through holes (4d) corresponding to the ejector pins of the die-casting machine are provided at the bottom of the main groove (4a).

3. A method for processing a mold for producing an amorphous SMT carrier according to claim 1 or 2, comprising the following steps: The fixed mold (1) and the movable mold (2) are mounted on the die casting machine, and the fixed mold and the movable mold are connected to the mold temperature controller through pipelines, characterized in that: the mold temperature of the fixed mold and the movable mold is controlled at 160-240°C by the mold temperature controller; the alloy material placed in the vacuum melting system of the die casting machine is heated and melted into liquid, and the material temperature is maintained at 900-980°C, and then the liquid material is poured into the casting barrel, and after the fixed mold and the movable mold are closed, the push rod in the casting barrel is pushed at a speed of 1.5-2.5m / The liquid material is pushed into the material flow channel at a speed of s, and then enters the carrier forming tank. As the temperature drops rapidly, it cools and solidifies to form an amorphous SMT carrier blank. Then the fixed mold and the movable mold are separated, and the ejector on the die-casting machine extends to push the amorphous SMT carrier blank out of the movable mold. The SMT carrier blank can be taken out by tools, and then the residual materials formed on both sides of the amorphous SMT carrier are cut off, and then the cut-off part is polished and smoothed to obtain the amorphous SMT carrier.

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