Method for pairing temperature-sensing elements in a heating device and method for determining heating area

Abstract

The application discloses a pairing method of temperature sensing elements in a heating device and a heating area determination method. The heating device comprises a plurality of heating zones, each of which is provided with a heating module and a temperature sensing element. The pairing method comprises: monitoring the temperature change of each heating zone through each temperature sensing element when any heating module of the heating device is working; determining whether the temperature change of any heating zone meets a preset condition according to the temperature change of each heating zone; and if yes, binding the temperature sensing element of the heating zone with the working heating module. According to the pairing method of temperature sensing elements in the heating device, the temperature sensing elements and the corresponding heating modules are paired and bound again in the case that the temperature sensing elements are connected to the circuit board interface incorrectly, so that the problems of temperature control error and untimely overheat protection of the heating device can be prevented, and the repair working hours can be reduced and the production efficiency can be improved.

Description

Technical Field

[0001] This invention relates to the field of kitchen utensils, and more specifically, to a method for matching temperature sensing elements in a heating device and a method for determining the heating area. Background Technology

[0002] Typically, induction cookers require thermistors to detect the temperature of the heating zone in order to adjust functions such as heat dissipation and overheat protection. However, for multi-burner induction cookers with multiple heating zones, thermistors in each heating zone need to be connected to corresponding interfaces on the circuit board of the multi-burner induction cooker. However, during the manufacturing process of multi-burner induction cookers, it is easy to encounter the problem of thermistors being connected to the wrong circuit board interfaces. For example, if the second thermistor is connected to the circuit board interface corresponding to the first thermistor, when the first heating zone heats up, the temperature read by the multi-burner induction cooker for the first heating zone is actually the temperature of the second heating zone fed back by the second thermistor. This leads to temperature control errors and untimely overheat protection in the multi-burner induction cooker. Summary of the Invention

[0003] The present invention aims to at least partially solve one of the aforementioned technical problems in the prior art. Therefore, a first objective of the present invention is to provide a method for pairing temperature sensing elements in a heating device, which allows for the re-pairing and binding of the temperature sensing element with its corresponding heating module.

[0004] The second objective of this invention is to provide a method for determining the heating area of ​​a heating device.

[0005] A third objective of this invention is to provide a computer-readable storage medium.

[0006] The fourth objective of this invention is to provide a computer-readable storage medium.

[0007] The fifth objective of this invention is to provide a heating device.

[0008] The sixth objective of this invention is to provide a heating device.

[0009] The seventh objective of this invention is to provide a pairing device for temperature sensing elements in a heating device.

[0010] To achieve the above objectives, a first aspect of the present invention provides a pairing method for temperature sensing elements in a heating device. The heating device includes multiple heating zones, each heating zone corresponding to a heating module and a temperature sensing element. The pairing method includes: when any heating module of the heating device is working, monitoring the temperature change of each heating zone through each temperature sensing element; determining whether there is a heating zone whose temperature change meets a preset condition based on the temperature change of each heating zone; if so, binding the temperature sensing element of that heating zone to the working heating module.

[0011] According to the pairing method of temperature sensing elements in the heating device of the present invention, when any heating module of the heating device is working, the temperature change of each heating zone is monitored by each temperature sensing element, and it is determined whether the temperature change of a heating zone meets the preset conditions based on the temperature change of each heating zone. If so, the temperature sensing element of that heating zone is bound to the working heating module. In the event of an error in the interface of the temperature sensing element connected to the circuit board, the temperature sensing element is re-paired and bound to its corresponding heating module. This helps to prevent problems such as temperature control errors and untimely overheat protection in the heating device, and also helps to reduce rework time and improve production efficiency.

[0012] According to some embodiments of the present invention, when it is determined that no heating zone has a temperature change that satisfies the preset condition, it is further confirmed whether the temperature of each heating zone has not changed. If so, the heating zone is marked as not having a temperature sensing element; if not, all temperature sensing elements corresponding to heating zones with the same temperature change are recorded, and each heating module is controlled to work sequentially so as to complete the binding of all temperature sensing elements according to all temperature sensing elements corresponding to heating zones with the same temperature change and the already bound temperature sensing elements.

[0013] According to some embodiments of the present invention, when the heating device leaves the factory, each heating module is controlled to work sequentially to complete the binding of all temperature sensing elements.

[0014] According to some embodiments of the present invention, when the heating device is powered on for the first time, the corresponding heating module is controlled to work according to the user's heating command, so as to complete the binding between the working heating module and the corresponding temperature sensing element, until each heating module has worked for a round, and the binding of all temperature sensing elements is completed.

[0015] To achieve the above objectives, a second aspect of the present invention provides a method for determining the heating area of ​​a heating device, comprising: determining the position of each temperature sensing element by performing the pairing method described above; determining the operating status of each heating module based on the position of each temperature sensing element and the temperature change information monitored by each temperature sensing element; and confirming the heating area of ​​the heating device based on the operating status of each heating module.

[0016] According to the heating area determination method of the heating device of the present invention, the position of each temperature sensing element is determined by performing the pairing method described above, and the working status of each heating module is determined based on the position of each temperature sensing element and the temperature change information monitored by each temperature sensing element. Then, the heating area of ​​the heating device is confirmed based on the working status of each heating module, thereby obtaining the size and shape of the heating pot. Furthermore, the heating pot can be heated more evenly through power control.

[0017] To achieve the above objectives, a third aspect of the present invention provides a computer-readable storage medium storing a pairing program for a temperature sensing element in a heating device. When the pairing program for the temperature sensing element in the heating device is executed by a processor, it implements the pairing method for the temperature sensing element in the heating device as described above.

[0018] According to the computer-readable storage medium of the present invention, the pairing method of the temperature sensing element in the heating device described above can re-pair and bind the temperature sensing element to its corresponding heating module when the interface of the temperature sensing element on the circuit board is incorrect. This helps to prevent problems such as temperature control errors and untimely overheat protection in the heating device, and also helps to reduce rework time and improve production efficiency.

[0019] To achieve the above objectives, a fourth aspect of the present invention provides a computer-readable storage medium storing a heating area determination program for a heating device, wherein the heating area determination program for the heating device, when executed by a processor, implements the heating area determination method for the heating device as described above.

[0020] According to the computer-readable storage medium of the present invention, the size and shape of the heating pot are determined by the heating area determination method of the heating device described above, and the heating pot can be heated more evenly by power control.

[0021] To achieve the above objectives, a fifth aspect of the present invention provides a heating device, including a memory, a processor, and a pairing program for a temperature sensing element in the heating device stored in the memory and executable on the processor. When the processor executes the pairing program, it implements the pairing method for the temperature sensing element in the heating device as described above.

[0022] According to the heating device of the present invention, by means of the above-described pairing method of the temperature sensing element in the heating device, in the case of an error in the interface of the temperature sensing element connected to the circuit board, the temperature sensing element and its corresponding heating module are re-paired and bound, which helps to prevent the occurrence of problems such as temperature control errors and untimely overheat protection in the heating device, and also helps to reduce rework time and improve production efficiency.

[0023] To achieve the above objectives, a sixth aspect of the present invention provides a heating device, including a memory, a processor, and a heating area determination program for the heating device stored in the memory and executable on the processor. When the processor executes the heating area determination program, it implements the heating area determination method for the heating device as described above.

[0024] According to the heating device of the present invention, the size and shape of the heating pot are determined by the heating area determination method of the heating device described above, and the heating pot can be heated more evenly by power control.

[0025] To achieve the above objectives, a seventh aspect of the present invention provides a pairing device for temperature sensing elements in a heating device. The heating device includes multiple heating zones, each heating zone corresponding to a heating module and a temperature sensing element. The pairing device includes: a monitoring module, used to monitor the temperature change of each heating zone through each temperature sensing element when any heating module of the heating device is working; and a pairing module, used to determine whether the temperature change of a heating zone meets a preset condition based on the temperature change of each heating zone, and when it is determined that the temperature change of a heating zone meets the preset condition, to bind the temperature sensing element of that heating zone to the working heating module.

[0026] According to the present invention, the pairing device for the temperature sensing element in the heating equipment can re-pair and bind the temperature sensing element to its corresponding heating module when the interface of the temperature sensing element on the circuit board is incorrect. This helps to prevent problems such as temperature control errors and untimely overheat protection in the heating equipment, and also helps to reduce rework time and improve production efficiency.

[0027] Additional aspects and advantages of the invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0028] Figure 1 This is a schematic diagram of a heating device according to an embodiment of the present invention;

[0029] Figure 2 This is a flowchart of a pairing method for temperature sensing elements in a heating device according to an embodiment of the present invention;

[0030] Figure 3 This is a flowchart of a pairing method for temperature sensing elements in a heating device according to another embodiment of the present invention;

[0031] Figure 4 This is a block diagram of a pairing device for a temperature sensing element in a heating device according to an embodiment of the present invention.

[0032] Figure label:

[0033] Heating equipment 10, heating zone 1, heating module 2, temperature sensing element 3, connecting wire 31, circuit board 4, microcrystalline panel 5, pairing device 20, monitoring module 201, pairing module 202. Detailed Implementation

[0034] Embodiments of the present invention are described in detail below, examples of which are illustrated in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain the present invention, and should not be construed as limiting the present invention.

[0035] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this invention, "a plurality of" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0036] In this invention, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection, an electrical connection, or a connection that allows communication between them; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0037] The following describes in detail, with reference to the accompanying drawings, the method for pairing temperature sensing elements and the method for determining the heating area in the heating device according to an embodiment of the present invention.

[0038] Reference Figure 1 As shown, in some embodiments of the present invention, the heating device 10 includes a plurality of heating zones 1, each heating zone 1 is provided with a heating module 2 and a temperature sensing element 3, and each temperature sensing element 3 is connected to the corresponding interface of the circuit board 4 of the heating device 10 through its respective connecting line 31.

[0039] In some embodiments of the present invention, the heating device 10 is a multi-burner stove, such as a multi-burner induction cooker or a multi-burner infrared cooker, with multiple heating zones 1 distributed on the microcrystalline panel 5, the heating module 2 being a coil, and the temperature sensing element 3 being a thermistor, such as an NTC (Negative Temperature Coefficient) thermistor.

[0040] Figure 2 This is a flowchart of a pairing method for temperature sensing elements in a heating device according to an embodiment of the present invention. The pairing method for temperature sensing elements in the heating device includes:

[0041] Step S102: When any heating module of the heating device is working, the temperature change of each heating zone is monitored by each temperature sensing element.

[0042] When the heating module is working, it will heat up the pot in its corresponding heating zone. At the same time, the heating zone corresponding to the heating module will also heat up. Each temperature sensing element can monitor the temperature change of its corresponding heating zone. Each temperature sensing element is connected to the corresponding interface on the circuit board of the heating device through its own connecting wire.

[0043] Step S104: Determine whether there is a heating zone whose temperature change meets the preset conditions based on the temperature change of each heating zone.

[0044] Among them, the existence of a heating zone whose temperature change meets the preset conditions can be either the existence of a heating zone with the highest temperature among all heating zones, or the existence of a heating zone with the fastest heating rate among all heating zones.

[0045] Step S106: If yes, then bind the temperature sensing element of the heating zone to the heating module that is in operation.

[0046] In other words, when any heating module of the heating equipment is working, if a temperature sensing element measures a temperature change that meets a preset condition, it means that the temperature sensing element and the working heating module are located in the same heating zone. The temperature sensing element in that heating zone is then bound to the working heating module. This allows the temperature sensing element to be re-paired and bound to its corresponding heating module if the circuit board interface of the heating equipment is connected incorrectly. This ensures that the heating equipment does not make mistakes in detecting the temperature of the heating zone through the temperature sensing element, thereby helping to prevent problems such as temperature control errors and untimely overheat protection.

[0047] In addition, when the temperature sensing element is connected to the wrong interface during the production process of the heating equipment, the above-mentioned pairing method can be used to re-pair and bind the temperature sensing element to its corresponding heating module without having to re-repair and adjust the interface of the temperature sensing element connecting the circuit board. This helps to reduce rework time and improve production efficiency.

[0048] According to the pairing method of temperature sensing elements in the heating device of the present invention, when any heating module of the heating device is working, the temperature change of each heating zone is monitored by each temperature sensing element, and it is determined whether the temperature change of a heating zone meets the preset conditions based on the temperature change of each heating zone. If so, the temperature sensing element of that heating zone is bound to the working heating module. In the event of an error in the interface of the temperature sensing element connected to the circuit board, the temperature sensing element is re-paired and bound to its corresponding heating module. This helps to prevent problems such as temperature control errors and untimely overheat protection in the heating device, and also helps to reduce rework time and improve production efficiency.

[0049] In some embodiments of the present invention, when it is determined that no temperature change in a heating zone meets the preset conditions, it is further confirmed whether the temperature of each heating zone has not changed. If so, it is marked that the heating zone is not equipped with a temperature sensing element. That is, if the temperature of each heating zone is not changed by the temperature sensing element, it indicates that the temperature sensor in the heating zone corresponding to the heating module is malfunctioning or not connected to the circuit board. Therefore, it is marked that the heating zone is not equipped with a temperature sensing element and an error is reported to prompt the temperature sensor in the heating zone to be repaired.

[0050] If not, record all temperature sensing elements corresponding to heating zones with the same temperature change, and control each heating module to work sequentially so as to complete the binding of all temperature sensing elements according to all temperature sensing elements corresponding to heating zones with the same temperature change and the already bound temperature sensing elements. When multiple heating zones heat a pot at the same time, after recording all temperature sensing elements corresponding to heating zones with the same temperature change, delete the temperature sensing elements that have been paired and bound, and finally determine the pairing and binding of each temperature sensing element with the heating element in its corresponding heating zone.

[0051] In some embodiments of the present invention, when the heating device leaves the factory, each heating module is controlled to work sequentially to complete the binding of all temperature sensing elements, so that if the interface of the temperature sensing element on the circuit board is incorrect, the temperature sensing element and its corresponding heating module can be re-paired and bound.

[0052] In some embodiments of the present invention, when the heating device is powered on for the first time, the corresponding heating module is controlled to operate according to the user's heating command to complete the binding between the operating heating module and the corresponding temperature sensing element. This process continues until each heating module has completed one round of operation, thus completing the binding of all temperature sensing elements. This allows for the re-pairing and binding of temperature sensing elements with their corresponding heating modules in case of incorrect connection interfaces on the circuit board. It should be noted that "first power-on operation of the heating device" refers to the user's first activation and use of the heating device.

[0053] In some embodiments of the present invention, the heating device has a pairing function. This pairing function can be triggered by one or more buttons on the heating device. These buttons can be physical or virtual. When the user triggers the pairing function, the corresponding heating module is controlled to operate according to the user's heating command, thus completing the binding between the operating heating module and its corresponding temperature sensing element. This process continues until each heating module has completed one round of operation, completing the binding of all temperature sensing elements. This allows for re-pairing and binding of temperature sensing elements with their corresponding heating modules should errors occur in the temperature sensing element connection circuit board interface. Possible errors in the temperature sensing element connection circuit board interface include, but are not limited to, aging of the heating device's connection wiring circuits after disassembly and repair.

[0054] Figure 3 This is a flowchart of a pairing method for a temperature sensing element in a heating device according to another embodiment of the present invention. When the heating device is manufactured or used for the first time by a user, the pairing method for the temperature sensing element in the heating device is executed, including:

[0055] Step S202: Control each heating module to work sequentially for a period of time and monitor the temperature changes of all temperature sensing elements.

[0056] Step S204: Determine whether there is a temperature sensing element with the highest temperature or a temperature sensing element with the fastest heating rate. If yes, proceed to S206; otherwise, proceed to S208.

[0057] Step S206: Record the temperature sensing element, calibrate the temperature sensing element to bind it to the current heating module, and write it into EEPROM (Electrically Erasable Programmable Read Only Memory) or FLASH memory.

[0058] In step S208, determine whether the temperature of the temperature sensing element has not changed at all. If yes, proceed to step S210; otherwise, proceed to step S212.

[0059] Step S210: Certify that the heating module is not connected to the corresponding temperature sensing element and report an error.

[0060] Step S212: Record all temperature sensing elements that change in the same way, delete the temperature sensing elements that have been paired and bound, and finally determine the pairing and binding of each temperature sensing element with the heating element in its corresponding heating zone.

[0061] S214 is executed after S206, S210, and S212.

[0062] Step S214: Determine whether the detection is complete. If yes, end the process; otherwise, return to S202.

[0063] By performing the pairing method of the temperature sensing element in the heating equipment in steps S202-S214 above, the temperature sensing element can be paired and bound to its corresponding heating module. This helps to prevent problems such as temperature control errors and untimely overheat protection in the heating equipment, and also helps to reduce rework time and improve production efficiency.

[0064] An embodiment of the present invention also provides a method for determining the heating area of ​​a heating device, comprising: determining the position of each temperature sensing element by performing the pairing method described above; determining the working status of each heating module based on the position of each temperature sensing element and the temperature change information monitored by each temperature sensing element; and confirming the heating area of ​​the heating device based on the working status of each heating module.

[0065] Specifically, when multiple heating zones heat a pot simultaneously, the more the pot comes into contact with the heating zones, the more heating modules are in operation. Thus, the working status of each heating module is determined based on the position of each temperature sensing element and the temperature change information monitored by each temperature sensing element. Furthermore, the heating area of ​​the heating device is determined based on the working status of each heating module. For heating devices that use electromagnetic heating, the heating area is the same as or similar to the area of ​​the pot being heated. Therefore, the size and shape of the pot being heated are determined based on the heating area.

[0066] According to the heating area determination method of the heating device of the present invention, the position of each temperature sensing element is determined by performing the pairing method described above, and the working status of each heating module is determined based on the position of each temperature sensing element and the temperature change information monitored by each temperature sensing element. Then, the heating area of ​​the heating device is confirmed based on the working status of each heating module, thereby obtaining the size and shape of the heating pot. Furthermore, the heating pot can be heated more evenly through power control.

[0067] In other embodiments of the present invention, the heating device may be a cookware with multiple heating zones, such as a rice cooker. The side wall of the rice cooker is provided with multiple heating modules and corresponding temperature sensing elements. The working status of each heating module is determined based on the position of each temperature sensing element and the temperature change information monitored by each temperature sensing element. The water level in the rice cooker can be obtained, which is beneficial to control only the heating modules below the water level line to work, so as to accurately control the heating temperature of the rice cooker and prevent the rice cooker from dry burning.

[0068] Embodiments of the present invention also provide a computer-readable storage medium storing a pairing program for a temperature sensing element in a heating device. When the pairing program for the temperature sensing element in the heating device is executed by a processor, it implements the pairing method for the temperature sensing element in the heating device as described in the above embodiments. In the event of an error in the interface of the temperature sensing element connected to the circuit board, the temperature sensing element is re-paired and bound to its corresponding heating module. This helps to prevent problems such as temperature control errors and untimely overheat protection in the heating device, and also helps to reduce rework time and improve production efficiency.

[0069] Embodiments of the present invention also provide a computer-readable storage medium storing a heating area determination program for a heating device. When the heating area determination program for a heating device is executed by a processor, it implements the heating area determination method for a heating device as described in the above embodiments, thereby determining the size and shape of the heating pot, and then making the heating pot more evenly heated through power control.

[0070] Embodiments of the present invention also provide a heating device, including a memory, a processor, and a pairing program for a temperature-sensing element in the heating device, stored in the memory and executable on the processor. When the processor executes the pairing program, it implements the pairing method for the temperature-sensing element in the heating device as described above. This allows for the re-pairing and binding of the temperature-sensing element with its corresponding heating module in the event of an error in the circuit board interface of the temperature-sensing element. This helps prevent problems such as temperature control errors and untimely overheat protection in the heating device, and also helps reduce rework time and improve production efficiency.

[0071] Embodiments of the present invention also provide a heating device, including a memory, a processor, and a heating area determination program for the heating device stored in the memory and executable on the processor. When the processor executes the heating area determination program, it implements the heating area determination method of the heating device as described in the above embodiments, thereby determining the size and shape of the heating pot, and then making the heating pot more evenly heated through power control.

[0072] Reference Figure 4As shown, embodiments of the present invention also provide a pairing device 20 for temperature sensing elements in a heating device. The heating device includes multiple heating zones, each corresponding to a heating module and a temperature sensing element. The pairing device 20 includes a monitoring module 201 and a pairing module 202. The monitoring module 201 is used to monitor the temperature change of each heating zone through each temperature sensing element when any heating module of the heating device is working. The pairing module 202 is used to determine whether the temperature change of a heating zone meets a preset condition based on the temperature change of each heating zone, and when it is determined that the temperature change of a heating zone meets the preset condition, it binds the temperature sensing element of that heating zone to the working heating module. This allows for re-pairing and binding of the temperature sensing element with its corresponding heating module in case of an error in the circuit board interface of the temperature sensing element, thereby helping to prevent problems such as temperature control errors and untimely overheat protection in the heating device, and also helps to reduce rework time and improve production efficiency.

[0073] It should be noted that the specific implementation of the pairing device for the temperature sensing element in the heating device of the present invention is similar to the specific implementation of the pairing method for the temperature sensing element in the heating device of the present invention. For details, please refer to the description in the method section. To reduce redundancy, it will not be described again here.

[0074] It should be noted that the processor may be an integrated circuit chip with signal processing capabilities. The aforementioned processor can be a general-purpose processor, including a Central Processing Unit (CPU), a Network Processor (NP), etc.; it can also be a Digital Signal Processor (DSP), an Application-Specific Integrated Circuit (ASIC), a Field-Programmable Gate Array (FPGA), or other programmable logic devices, discrete gate or transistor logic devices, or discrete hardware components. It can implement or execute the methods, steps, and logic block diagrams disclosed in the embodiments of this invention.

[0075] Additionally, logic and / or steps represented in the flowchart or otherwise described herein, for example, can be considered as a sequenced list of executable instructions for implementing logical functions, and can be embodied in any computer-readable medium for use by, or in conjunction with, an instruction execution system, apparatus, or device (such as a computer-based system, a processor-included system, or other system that can fetch and execute instructions from, an instruction execution system, apparatus, or device). For the purposes of this specification, "computer-readable medium" can be any means that can contain, store, communicate, propagate, or transmit programs for use by, or in conjunction with, an instruction execution system, apparatus, or device. More specific examples (a non-exhaustive list) of computer-readable media include: an electrical connection having one or more wires (electronic device), a portable computer disk drive (magnetic device), random access memory (RAM), read-only memory (ROM), erasable and editable read-only memory (EPROM or flash memory), fiber optic devices, and portable optical disc read-only memory (CDROM). Alternatively, the computer-readable medium may be paper or other suitable media on which the program can be printed, since the program can be obtained electronically, for example, by optically scanning the paper or other medium, followed by editing, interpreting, or otherwise processing as necessary, and then stored in a computer memory.

[0076] It should be understood that various parts of the present invention can be implemented in hardware, software, firmware, or a combination thereof. In the above embodiments, multiple steps or methods can be implemented in software or firmware stored in memory and executed by a suitable instruction execution system. For example, if implemented in hardware, as in another embodiment, it can be implemented using any one or a combination of the following techniques known in the art: discrete logic circuits having logic gates for implementing logical functions on data signals, application-specific integrated circuits (ASICs) having suitable combinational logic gates, programmable gate arrays (PGAs), field-programmable gate arrays (FPGAs), etc.

[0077] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. In addition, those skilled in the art can combine and integrate the different embodiments or examples described in this specification.

[0078] Although embodiments of the present invention have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present invention. Those skilled in the art can make changes, modifications, substitutions and variations to the above embodiments within the scope of the present invention.

Claims

1. A method for pairing temperature sensing elements in a heating device, characterized in that, The heating device includes multiple heating zones, each heating zone corresponding to a heating module and a temperature sensing element, and the pairing method includes: When any one of the heating modules of the heating device is working, the temperature change of each heating zone is monitored by each temperature sensing element. Based on the temperature change of each heating zone, determine whether there is a heating zone whose temperature change meets the preset conditions; If so, the temperature sensing element of the heating zone is bound to the heating module that is in operation; If it is determined that no heating zone has a temperature change that meets the preset condition, it is further confirmed whether the temperature of each heating zone has not changed. If so, it is marked that the heating zone is not equipped with a temperature sensing element. If not, record all temperature sensing elements corresponding to heating zones with the same temperature change, and control each heating module to work sequentially so as to complete the binding of all temperature sensing elements according to all temperature sensing elements corresponding to heating zones with the same temperature change and the already bound temperature sensing elements. When multiple heating zones heat a pot at the same time, after recording all temperature sensing elements corresponding to heating zones with the same temperature change, delete the temperature sensing elements that have been paired and bound, and finally determine the pairing and binding of each temperature sensing element with the heating element in its corresponding heating zone.

2. The method for pairing temperature sensing elements in the heating device as described in claim 1, characterized in that, When the heating device leaves the factory, each heating module is controlled to work sequentially to complete the binding of all temperature sensing elements.

3. The method for pairing temperature sensing elements in the heating device as described in claim 1, characterized in that, When the heating device is powered on for the first time or when the user triggers the pairing function, the corresponding heating module is controlled to work according to the user's heating command, so as to complete the binding between the working heating module and the corresponding temperature sensing element. This process continues until each heating module has completed one round of operation, thus completing the binding of all temperature sensing elements.

4. A method for determining the heating area of ​​a heating device, characterized in that, include: The position of each temperature sensing element is determined by performing the pairing method as described in any one of claims 1-3; The operating status of each heating module is determined based on the location of each temperature sensing element and the temperature change information monitored by each temperature sensing element. The heating area of ​​the heating device is determined based on the working status of each heating module.

5. A computer-readable storage medium, characterized in that, It stores a pairing program for the temperature sensing element in the heating device, which, when executed by the processor, implements the pairing method for the temperature sensing element in the heating device as described in any one of claims 1-3.

6. A computer-readable storage medium, characterized in that, It stores a heating area determination program for the heating device, which, when executed by the processor, implements the heating area determination method for the heating device as described in claim 4.

7. A heating device, characterized in that, The device includes a memory, a processor, and a pairing program for a temperature-sensing element in a heating device stored in the memory and executable on the processor. When the processor executes the pairing program, it implements the pairing method for the temperature-sensing element in a heating device as described in any one of claims 1-3.

8. A heating device, characterized in that, The device includes a memory, a processor, and a heating area determination program for the heating device stored in the memory and executable on the processor. When the processor executes the heating area determination program, it implements the heating area determination method for the heating device as described in claim 4.

9. A pairing device for temperature sensing elements in a heating device, characterized in that, The heating device includes multiple heating zones, each heating zone corresponding to a heating module and a temperature sensing element; the pairing device includes: The monitoring module is used to monitor the temperature change of each heating zone through each temperature sensing element when any heating module of the heating equipment is working. The pairing module is used to determine whether the temperature change of one heating zone meets a preset condition based on the temperature change of each heating zone. When it is determined that the temperature change of one heating zone meets the preset condition, the temperature sensing element of that heating zone is bound to the working heating module. When it is determined that the temperature change of no heating zone meets the preset condition, it is further confirmed whether the temperature of each heating zone has no change. If so, it is marked that no temperature sensing element is set in that heating zone; if not, it records all temperature sensing elements corresponding to heating zones with the same temperature change, and controls each heating module to work sequentially so as to complete the binding of all temperature sensing elements according to all temperature sensing elements corresponding to heating zones with the same temperature change and the already bound temperature sensing elements. When multiple heating zones heat a pot at the same time, after recording all temperature sensing elements corresponding to heating zones with the same temperature change, the temperature sensing elements that have been paired and bound are deleted from them, and finally the pairing and binding of each temperature sensing element with the heating element in its corresponding heating zone is determined.

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