Low-thermal-resistance test socket pressure measurement device
Through the design of the low-thermal resistance test seat pressure measurement device, the screwing of the inner ring and the shell drives the axial movement of the thermal pressure block, reducing the thermal resistance of the contact interface, solving the problem of excessive thermal resistance of the existing manual test cover, and achieving effective control of the chip temperature and heat dissipation effect.
Patent Information
- Application Number
- CN202011616676.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2020-12-31
- Publication Date
- 2025-07-25
- Estimated Expiration
- 2040-12-31
AI Technical Summary
The thermal resistance of the existing manual test cover is too high, causing the chip temperature to rise and the chip to fail to meet the test specifications, and may even cause the chip to burn. The existing heat dissipation device is huge in size and has limited heat dissipation effect.
The test seat pressure measurement device with low thermal resistance is adopted, including the shell, inner sleeve, thermal press, bearing sleeve and locking parts. The thermal press is driven to move the axial direction through the screwing of the inner sleeve and the shell, reducing the thermal resistance of the contact interface, and combining with the temperature control module to achieve effective heat conduction.
Significantly reduce the thermal resistance of the contact interface, ensure that the chip temperature is within a reasonable range, provide excellent heat transfer effect, meet test specification requirements and avoid chip damage.
Smart Images

Figure CN114690020B_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to a test socket pressure measurement device with low thermal resistance, and particularly to a test socket pressure measurement device with low thermal resistance that is suitable for being directly coupled to a test socket, can move along with the test socket, and apply a downward pressure to a device under test. Background Art
[0002] For chip detection jigs, detection equipment, or even detection methods, they are all developing towards diversification to meet various demands. Among them, the manual test cover is also a very important test jig. It is used in combination with a test socket for manual test engineering verification. Mainly, by manually or automatically rotating the knob of the manual test cover by a machine, a downward pressure is applied to the chip under test in the test socket to ensure that all contacts on the chip can be completely electrically contacted with all probes in the test socket.
[0003] For further illustration, please refer to Figure 1A , which is a schematic cross-sectional view when the existing manual test cover 10 is engaged with the test socket S. Among them, when the hook 11 of the existing manual test cover 10 is latched into the locking grooves S1 on both sides of the test socket S, the knob 12 is manually rotated. Since the knob 12 and the body 13 are screwed together with internal and external threads, and a rotary bearing 15 is provided between the lower end surface of the knob 12 and the pressure plate 14. Therefore, as the knob 12 rotates, the knob 12 will descend relative to the body 13 and push the pressure plate 14, and then the pressure block 16 below the pressure plate 14 will push the chip C1 to ensure that the chip C1 can be completely electrically contacted with the probes of the test socket C.
[0004] However, as the functions of the chip C1 under test become more and more powerful, and the heat generated during the operation of the chip C1 increases greatly, which will cause the temperature of the chip C1 to rise. At this time, the heat dissipation mechanism of the manual test cover 1 becomes very important. In the prior art field, heat dissipation fins and fans have been directly configured on the manual test cover. For example, in the Taiwan, China New Patent Publication No. M340550, "Manual Test Device for Semiconductor Test Socket". However, this existing device is too large in volume and has limited heat dissipation effect.
[0005] Furthermore, for Figure 1A the existing manual test cover 10 shown, a better way is to directly connect a temperature control module 17 above the knob 12, which can be a heat exchange module through which cooling water or a cold medium flows. However, in terms of the requirements of general test specifications, the heat generated by the chip C1 is 500W, and the maximum temperature shall not exceed 125°C; on the other hand, if the temperature of the fluid flowing through the temperature control module 17 is 15°C, the thermal resistance of the existing manual test cover 10 must be less than 0.22 K / W. That is to say, once the thermal resistance of the existing manual test cover 10 is greater than 0.22 K / W, the temperature of the chip C1 will be higher than 125°C. At this time, in addition to not meeting the requirements of the test specifications, in severe cases, it may even cause the chip C1 to burn out.
[0006] However, looking again at Figure 1B the schematic diagram of the thermal resistance model of the existing manual test cover 1 shown, the entire set of existing manual test covers 10 has a total of four contact interfaces, namely the contact interface thermal resistances R1 to R4 shown in the figure, including the contact interface thermal resistance R1 between the temperature control module 17 and the knob 12, the contact interface thermal resistance R2 between the knob 12 and the pressing plate 14 (i.e., the rotary bearing 15), the contact interface thermal resistance R3 between the pressing plate 14 and the pressing block 16, and the interface thermal resistance R4 between the pressing block 16 and the chip C1. However, according to the general theoretical value, the contact interface thermal resistance between metal and metal is about 0.2 °C / W. Therefore, the thermal resistance value of the existing manual test cover 10 will be as high as 0.8 °C / W, which far exceeds the 0.22 °C / W mentioned in the previous paragraph. Therefore, it is obvious that it cannot provide good heat transfer performance, that is, it cannot effectively suppress the temperature rise of the chip C1. Summary of the Invention
[0007] The main object of the present invention is to provide a test socket pressing device with low thermal resistance, which can provide excellent heat conduction effect to cooperate with the temperature control module to effectively heat up or cool down the device under test.
[0008] To achieve the above object, a test socket pressing device with low thermal resistance of the present invention is used to be joined to a test socket, which accommodates a device under test. The device mainly includes a housing, an inner sleeve ring, a heat-conducting pressing block, a bearing sleeve ring, and at least one locking member; wherein, the housing includes a through shaft hole that penetrates the upper and lower surfaces of the housing, and the through shaft hole includes an internal thread; and the inner sleeve ring is accommodated in the through shaft hole, and the inner sleeve ring includes an external thread that is screwed to the internal thread of the housing; the heat-conducting pressing block penetrates through the inner sleeve ring and protrudes from the upper and lower surfaces of the housing; in addition, the bearing sleeve ring is interposed between the inner sleeve ring and the heat-conducting pressing block; at least one locking member is disposed on the housing. Wherein, when the locking member is locked to the test socket, and the inner sleeve ring is rotated, the lower surface of the heat-conducting pressing block will be driven to contact the device under test, and an axial force will be generated on the heat-conducting pressing block, and then the axial force will be applied to the device under test through the heat-conducting pressing block.
[0009] As described above, by the screwing between the external thread of the inner sleeve ring and the internal thread of the housing, when the inner sleeve ring is rotated, the inner sleeve ring will generate an axial displacement relative to the housing through the internal and external threads, and then push the bearing sleeve ring and the heat-conducting pressing block to approach or move away from the device under test in the test socket; wherein, the bearing sleeve ring is used to isolate the rotational movement, that is, the heat-conducting pressing block will not rotate with the inner sleeve ring, but only perform an axial displacement. However, since the heat-conducting pressing block protrudes from the upper and lower surfaces of the housing, one end can contact the temperature control component, and the other end can contact the device under test. In this way, the contact interface thermal resistance can be reduced to the minimum to greatly improve the heat transfer effect.
[0010] On the other hand, the present invention may further include an outer rotating ring and a force - applying pressure ring. The outer rotating ring may be coupled to the upper surface of the inner sleeve ring; the force - applying pressure ring may be accommodated within the inner sleeve ring and be between the bearing sleeve ring and the heat - conducting pressure block; the heat - conducting pressure block may pass through the outer rotating ring and the force - applying pressure ring. In other words, the outer rotating ring can serve as a connection interface for coupling to a cap, hand tool, or power tool for applying force to rotate, and the force - applying pressure ring can serve as a component for applying force to the heat - conducting pressure block. Among them, the heat - conducting pressure block may include a coaxial portion and an arc - shaped gradually expanding portion. The coaxial portion may pass through the force - applying pressure ring, the bearing sleeve ring, the inner sleeve ring, and the outer rotating ring; and the force - applying pressure ring includes an inner ring arc surface, which may abut against the arc - shaped gradually expanding portion.
[0011] Preferably, the present invention may further include an upper snap ring and a lower snap ring. The upper snap ring may be sleeved on the heat - conducting pressure block and abut against the upper surface of the inner sleeve ring; and the lower snap ring may be disposed on the lower surface of the inner sleeve ring and be used to lock the force - applying pressure ring. That is to say, the present invention can prevent the heat - conducting pressure block from coming out of the force - applying pressure ring, the bearing sleeve ring, and the inner sleeve ring through the upper snap ring and the lower snap ring.
[0012] In addition, the bearing sleeve ring of the present invention may be a thrust bearing, which can not only isolate the rotational movement of the inner sleeve ring but also bear axial loads. In addition, a specific clearance may be maintained between the coaxial portion of the heat - conducting pressure block and the force - applying pressure ring, the bearing sleeve ring, and the inner sleeve ring. By this setting, it will be allowed for the heat - conducting pressure block to conform to the contact interface between it and the test piece and tilt a specific angle relative to the force - applying pressure ring, the bearing sleeve ring, the inner sleeve ring, and the outer rotating ring. Therefore, the force exerted by the heat - conducting pressure block on the test piece can be maintained in a positive and uniform manner. More simply, this specific clearance will allow the heat - conducting pressure block to adaptively adjust its own angle according to the flatness of the contact interface between it and the test piece, so as to maintain complete contact between the heat - conducting pressure block and the test piece, and thus maintain uniform force application and consistent heat exchange on the surface of the test piece.
[0013] Furthermore, the heat - conducting pressure block of the present invention may also include a coaxial portion, a step portion, and an inclined - line gradually expanding portion, and the step portion is between the coaxial portion and the inclined - line gradually expanding portion. In addition, the present invention may further include a fixing ring, which may be sleeved on the coaxial portion of the heat - conducting pressure block; and the bearing sleeve ring may be a spherical - eye bearing, which may include a bearing inner convex ring and a bearing outer concave ring. Among them, the bearing inner convex ring may be sleeved on the coaxial portion, one end of the bearing inner convex ring may abut against the fixing ring, the other end may press against the step portion, and the bearing outer concave ring may be coupled to the bearing inner convex ring and connected to the inner sleeve ring. Accordingly, the present invention can also bear axial loads and isolate the rotational movement of the inner sleeve ring through the spherical - eye bearing, and the fixing ring can be used to fix the bearing inner convex ring of the spherical - eye bearing on the heat - conducting pressure block.
[0014] Moreover, the fixing ring of the present invention can be accommodated in the inner sleeve ring, and a specific clearance can be maintained between the fixing ring and the inner sleeve ring, thereby absorbing the error of the contact interface between the heat-conducting pressing block and the device under test. Further explanation, due to the characteristic of the spherical plain bearing that allows the inner convex ring of the bearing to axially swing relative to the outer concave ring of the bearing, and the clearance between the fixing ring and the inner sleeve ring provides the space for axial swing; therefore, once there is an angular error in the contact interface between the heat-conducting pressing block and the device under test, the spherical plain bearing can adaptively adjust the axial swing angle of the heat-conducting pressing block, so that the force exerted by the heat-conducting pressing block on the device under test remains positive and uniform, and can also maintain good heat exchange with the surface of the device under test.
[0015] In addition, the bearing sleeve ring of the present invention can be a spherical roller thrust bearing, which includes an upper seat ring, a lower seat ring and a plurality of inclined rollers. The upper seat ring and the lower seat ring can be sleeved on the coaxial part of the heat-conducting pressing block. In addition, the upper seat ring is connected to the inner sleeve ring, and the lower seat ring presses against the step part. The plurality of inclined rollers are arranged between the upper seat ring and the lower seat ring. In other words, the present invention can also use a spherical roller thrust bearing to bear the axial load and isolate the rotational movement of the inner sleeve ring, and can use the self-aligning angle of the spherical roller thrust bearing to adaptively adjust the angle of the contact interface between the heat-conducting pressing block and the device under test, so that the force exerted by the heat-conducting pressing block on the device under test remains positive and uniform.
[0016] In addition, the present invention may further include a temperature control module, which is arranged above the housing and contacts the heat-conducting pressing block. In short, through the present invention, only the heat-conducting pressing block is separated between the temperature control module and the device under test, so the contact interface thermal resistance can be reduced to the minimum, thereby significantly improving the heat conduction effect to realize effective heating or cooling of the device under test. Brief Description of the Drawings
[0017] Figure 1A It is a schematic cross-sectional view showing the use of the existing manual test cover.
[0018] Figure 1B It is a schematic diagram of the thermal resistance model of the existing manual test cover.
[0019] Figure 2A It is a perspective view of the first embodiment of the present invention.
[0020] Figure 2B It is a cross-sectional view of the first embodiment of the present invention.
[0021] Figure 2C It is an exploded view of the first embodiment of the present invention.
[0022] Figure 3A It is a perspective view of the second embodiment of the low thermal resistance test seat pressing device of the present invention.
[0023] Figure 3BIt is a cross-sectional view of the second embodiment of the low thermal resistance test socket pressure measurement device of the present invention.
[0024] Figure 3C It is an exploded view of the second embodiment of the low thermal resistance test socket pressure measurement device of the present invention.
[0025] Figure 4A It is a perspective view of the third embodiment of the low thermal resistance test socket pressure measurement device of the present invention.
[0026] Figure 4B It is a cross-sectional view of the third embodiment of the low thermal resistance test socket pressure measurement device of the present invention.
[0027] Figure 4C It is an exploded view of the third embodiment of the low thermal resistance test socket pressure measurement device of the present invention. Detailed Description of the Invention
[0028] Before the low thermal resistance test socket pressure measurement device of the present invention is described in detail in this embodiment, it should be particularly noted that in the following description, similar components will be denoted by the same component symbols. Furthermore, the drawings of the present invention are only for illustrative purposes, and they are not necessarily drawn to scale, and all details may not be fully presented in the drawings.
[0029] Please refer to Figure 2A , Figure 2B and Figure 2C , Figure 2A is a perspective view of the first embodiment of the present invention, Figure 2B is a cross-sectional view of the first embodiment of the present invention, Figure 2C is an exploded view of the first embodiment of the present invention. As shown in the figure, the temperature control module 9 can be connected above the low thermal resistance test socket pressure measurement device 1 of this embodiment. In order to clearly show the connection relationship between various components, the temperature control module 9 and the test socket pressure measurement device 1 are separated in these drawings; however, the temperature control module 9 of this embodiment can be a heat exchanger with a temperature-controlled fluid circulating or an evaporator with a refrigerant circulating. In addition, the lower part of the low thermal resistance test socket pressure measurement device 1 can be joined to the test socket S, and the test piece C is accommodated in the test socket S.
[0030] Furthermore, as shown in the figure, the low thermal resistance test socket pressure measurement device 1 of the first embodiment of the present invention mainly includes a housing 2, an inner collar 3, a heat conducting pressure block 4, a bearing collar 5, a locking member 6, an outer rotating ring 7, a force applying pressure ring 8, an upper snap ring 32 and a lower snap ring 33; wherein, the housing 2 has a through hole 21 that penetrates the upper and lower surfaces of the housing 2, and an internal thread 211 is provided in the through hole 21; furthermore, the inner collar 3 is accommodated in the through hole 21, and an external thread 31 is arranged on the outer surface of the inner collar 3, which is screwed into the internal thread 211 of the through hole 21 of the housing 2.
[0031] In addition, an outer rotating ring 7 is connected above the inner sleeve ring 3. The outer rotating ring 7 is screwed to the inner sleeve ring 3, and six jacks 71 are provided on the upper surface of the outer rotating ring 7, which are mainly for inserting a rotating tool (not shown in the figure). That is to say, a hand tool or a power tool can be directly connected to the outer rotating ring 7 through the jacks 71, and the outer rotating ring 71 is driven to rotate by these tools, thereby driving the inner sleeve ring 3 to rotate.
[0032] Furthermore, a bearing sleeve ring 5 and a force-applying pressure ring 8 are installed inside the inner sleeve ring 3. The bearing sleeve ring 5 in this embodiment is a thrust bearing, whose upper end surface is connected to the inner sleeve ring 3 and the lower end surface is connected to the force-applying pressure ring 8. On the other hand, the heat-conducting pressure block 4 of this embodiment includes a coaxial part 41 and an arc-shaped gradually expanding part 42, and the coaxial part 41 sequentially passes through the force-applying pressure ring 8, the bearing sleeve ring 5, the inner sleeve ring 3 and the outer rotating ring 7; and the force-applying pressure ring 8 includes an inner arc surface 81, which abuts against the arc-shaped gradually expanding part 42.
[0033] In addition, the upper snap ring 32 of this embodiment is sleeved on the heat-conducting pressure block 4 and abuts against the upper surface of the inner sleeve ring 3, while the lower snap ring 33 is arranged on the lower surface of the inner sleeve ring 3 and is used to lock the force-applying pressure ring 8. Accordingly, in this embodiment, the upper snap ring 32 and the lower snap ring 33 are used to prevent the heat-conducting pressure block 4 from slipping out of the force-applying pressure ring 8, the bearing sleeve ring 5 and the inner sleeve ring 3. In addition, the lower snap ring 33 can also prevent the force-applying pressure ring 8 and the bearing sleeve ring 5 from slipping out of the inner sleeve ring 3.
[0034] In addition, as shown in the figure, two locking members 6 are respectively arranged on the corresponding two sides of the housing 2. Each locking member 6 is hinged to the housing 2, one end of which can be held and pressed by a person, and the other end can be selectively snapped into or disengaged from the locking grooves S1 on both sides of the test seat S according to whether it is pressed or not.
[0035] The operation mode of this embodiment is described below. First, the low thermal resistance test seat pressing device 1 is engaged with the test seat S, and the two locking members 6 are respectively snapped into the locking grooves S1 on both sides of the test seat S. Furthermore, a hand tool or a power tool (not shown in the figure) is coupled to the outer rotating ring 7 and the outer rotating ring 7 is driven to rotate; at this time, the outer rotating ring 7 will drive the inner sleeve ring 3 to rotate relative to the housing 2, and drive the bearing sleeve ring 5, the force-applying pressure ring 8 and the heat-conducting pressure block 4 to approach the test seat S, thereby driving the lower surface of the heat-conducting pressure block 4 to contact the workpiece under test C and generate an axial force, and applying this axial force to the workpiece under test C through the heat-conducting pressure block 4, and increasing the axial force applied to the workpiece under test C as the outer rotating ring 7 rotates. However, as a thrust bearing of the bearing sleeve ring 5, in addition to bearing the downward pressure from the inner sleeve ring 3, it also blocks the rotational movement of the inner sleeve ring 3, that is, the force-applying pressure ring 8 and the heat-conducting pressure block 4 will not rotate with the inner sleeve ring 3.
[0036] In addition, it should be specifically noted that in this embodiment, the outer ring surface of the coaxial part 41 of the heat conducting block 4 is specifically set to have a specific clearance g with the inner ring surfaces of the force applying pressure ring 8, the bearing collar 5, and the inner collar 3. Therefore, the heat conducting block 4 can have a slight yaw; the purpose is to allow the heat conducting block 4 to conform to the contact interface between it and the device under test C and tilt a specific angle relative to the force applying pressure ring 8 and the bearing collar 5 and the inner collar 3. In this embodiment, the design allows a yaw of about 1 degree. In other words, through the design of the specific clearance g, the heat conducting block 4 is allowed to adaptively adjust its angle according to the surface condition of the contact surface between it and the device under test C, so as to maintain full contact between the heat conducting block 4 and the device under test C. Even if there are flatness errors on the upper surface of the device under test C or the lower surface of the heat conducting block 4, they can still be in flat contact to provide a uniform heat exchange effect and a consistent downward pressure to the device under test C.
[0037] Furthermore, to prove that the thermal resistance of this embodiment is extremely low and can provide an excellent temperature control effect for the device under test, the simulation analysis data and related simulation parameters are provided as follows; among them, the heat generation of the device under test C is 500 Watt, the temperature of the circulating water in the temperature control module 9 is 15 °C, and the flow rates of the circulating water are respectively set to 0.1 LPM, 0.11 LPM, 0.15 LPM, 0.5 LPM, the ambient temperature is 25 °C, and the material of the heat conducting block 4 is pure copper.
[0038] Through simulation analysis, when the circulating water volume is 0.1 LPM, the average surface temperature of the upper surface of the heat conducting block 4 (i.e., the surface in contact with the temperature control module 9) is 87.7 °C, and the average surface temperature of the upper surface of the device under test C (i.e., the surface in contact with the heat conducting block 4) is 106.9 °C; through calculation, the contact interface thermal resistance between the device under test C and the heat conducting block 4 is 0.0384 °C / W, and the contact interface thermal resistance between the heat conducting block 4 and the temperature control module 9 is 0.1603 °C / W, and the sum of the two is still less than 0.22 °C / W. Therefore, this embodiment can effectively suppress the working temperature of the device under test C below 125 °C. As for other simulation parameters and the obtained results, please refer to the following table. However, it can be seen from the following table that when the circulating water volume of 0.11 LPM is applied, a rather good thermal resistance can be obtained, and the pressure loss of the temperature control module (evaporator) is still within an acceptable range.
[0039]
[0040] Please also refer to Figure 3A 、 Figure 3B and Figure 3C , Figure 3A which is a perspective view of the second embodiment of the test seat pressure measurement device with low thermal resistance of the present invention, Figure 3B which is a sectional view of the second embodiment of the test seat pressure measurement device with low thermal resistance of the present invention, Figure 3CThis is an exploded view of the second embodiment of the low thermal resistance test seat pressure measuring device of the present invention. The main difference between this embodiment and the first embodiment is the form of the bearing ring 5. This embodiment adopts a fisheye bearing.
[0041] Further explanation, the heat-conducting pressing block 4 of this embodiment is slightly different from the above-mentioned embodiment, and includes a coaxial portion 41, a step portion 44 and an oblique gradually expanding portion 43, and the step portion 44 is between the coaxial portion 41 and the oblique gradually expanding portion 43. Moreover, this embodiment also includes a fixing ring 34, which is sleeved on the coaxial portion 41 of the heat-conducting pressing block 4 and is used to fix the bearing sleeve ring 5. However, as described in the previous paragraph, the bearing sleeve ring 5 is a fisheye bearing, which includes a bearing inner convex ring 51 and a bearing outer concave ring 52, and the bearing inner convex ring 51 is sleeved on the coaxial portion 41, the upper end of the bearing inner convex ring 51 abuts the fixing ring 34, and the lower end thereof presses against the step portion 44, and the bearing outer concave ring 52 is coupled to the bearing inner convex ring 51 and connected to the inner sleeve ring 3. In general, the fisheye bearing in this embodiment bears the axial load, that is, transmits the force from the inner ring 3 and isolates the rotation of the inner ring 3 , and the fixing ring 34 can be used to fix the inner convex ring 51 of the fisheye bearing on the heat conductive pressure block 4 .
[0042] In addition, the fixing ring 34 of the present embodiment is accommodated in the inner sleeve ring 3, and a specific clearance g can be maintained between the fixing ring 34 and the inner sleeve ring 3, thereby absorbing the flatness error of the contact interface between the heat-conducting pressing block 4 and the test piece C. Further explanation, due to the characteristics of the fisheye bearing, the inner convex ring 51 of the bearing is allowed to swing axially relative to the outer concave ring 52 of the bearing, and the specific clearance g between the fixing ring 34 and the inner sleeve ring 3 provides space for axial swinging. Therefore, once there is a flatness (angle) error in the contact interface between the heat-conducting pressing block 4 and the test piece C, the fisheye bearing can adaptively adjust the angle, thereby maintaining the force applied by the heat-conducting pressing block 4 to the test piece C in a positive and uniform direction, while maintaining excellent heat exchange efficiency. In the present embodiment, the heat-conducting pressing block 4 can be allowed to swing about 3 to 4 degrees.
[0043] Please also see Figure 4A , Figure 4B and Figure 4C , Figure 4A is a three-dimensional diagram of a third embodiment of a low thermal resistance test seat pressure measuring device of the present invention, Figure 4B is a cross-sectional view of a third embodiment of a low thermal resistance test seat pressure measuring device of the present invention, Figure 4C This is an exploded view of the third embodiment of the low thermal resistance test seat pressure measuring device of the present invention. The main difference between this embodiment and the first and second embodiments is still the form of the bearing ring 5. This embodiment adopts a thrust spherical roller bearing.
[0044] In detail, the present embodiment also includes a fixed ring 34, which is sleeved on the coaxial portion 41 of the heat-conducting pressure block 4; and as described in the previous paragraph, the bearing ring 5 of the present embodiment is a thrust spherical roller bearing, which includes an upper seat ring 53, a lower seat ring 54 and a plurality of oblique rollers 55; wherein, the upper seat ring 53 and the lower seat ring 54 are sleeved on the coaxial portion 41 of the heat-conducting pressure block 4, and the upper seat ring 53 is connected to the inner ring 3, the lower seat ring 54 is pressed against the step portion 44, and the plurality of oblique rollers 55 are arranged between the upper seat ring 53 and the lower seat ring 54.
[0045] As in the first and second embodiments described above, this embodiment can also utilize a thrust spherical roller bearing to bear the axial load (i.e., the downward pressure to be applied to the test piece C) and isolate the rotational movement of the inner ring 3. Furthermore, the self-aligning angle of the thrust spherical roller bearing can be utilized to adaptively adjust the flatness (angle) of the contact interface between the thermally conductive pressure block and the test piece, thereby maintaining the force applied by the thermally conductive pressure block to the test piece in a positive and uniform direction.
[0046] In summary, this embodiment has at least the following advantages:
[0047] (1) Using an integrated thermally conductive pressure block can reduce the number of overall contact interfaces and form a minimum layer structure for heat conduction, which can significantly reduce thermal resistance, that is, greatly improve the heat exchange effect, so as to effectively heat up or cool down the DUT;
[0048] (2) The thermally conductive pressure block can adaptively adjust its own swing angle according to the flatness (angle) of the contact interface between it and the DUT, so as to maintain the lower surface of the thermally conductive pressure block in full contact with the DUT, thereby providing uniform downward pressure and consistent heat exchange effect;
[0049] (3) The external thread of the inner ring and the internal thread of the housing have a self-locking mechanism, that is, when a radial torque is applied to the inner ring to cause it to rotate, an axial force is generated due to the extrusion of the object. However, this axial force will make the thread mechanism self-locking and will not cause the inner ring to reverse along the thread. In addition, the internal and external threads also have the characteristics of repeated assembly and disassembly and repeated use;
[0050] The above embodiments are merely examples for the convenience of description. The scope of rights claimed by the present invention should be based on the scope of the claims, but not limited to the above embodiments.
[0051] Explanation of symbols
[0052] 1: Low thermal resistance test seat pressure test device
[0053] 2: Shell
[0054] 3: Inner ring
[0055] 4: Thermally conductive block
[0056] 5: Bearing collar
[0057] 6: Locking fastener
[0058] 7: Outer rotating ring
[0059] 8: Force - applying pressure ring
[0060] 9: Temperature control module
[0061] 10: Existing hand - testing cover
[0062] 11: Pull hook
[0063] 12: Knob
[0064] 13: Body
[0065] 14: Pressure plate
[0066] 15: Rotating bearing
[0067] 16: Pressing block
[0068] 17: Temperature control module
[0069] 21: Through - shaft hole
[0070] 31: External thread
[0071] 32: Upper retaining ring
[0072] 33: Lower retaining ring
[0073] 34: Fixed ring
[0074] 41: Coaxial part
[0075] 42: Arc - shaped gradually expanding part
[0076] 43: Oblique - line gradually expanding part
[0077] 44: Step part
[0078] 51: Bearing inner convex ring
[0079] 52: Bearing outer concave ring
[0080] 53: Upper seat ring
[0081] 54: Lower seat ring
[0082] 55: Oblique roller
[0083] 71: Jack
[0084] 81: Inner ring arc surface
[0085] 211: Internal thread
[0086] C: Component under test
[0087] S: Test socket
[0088] C1: Chip.
Claims
1. A test socket pressure testing device with low thermal resistance, which is used to be joined to a test socket that houses a device under test. The device includes: A housing, including a through-axis hole that penetrates the upper and lower surfaces of the housing. The through-axis hole includes internal threads. An inner collar, which is accommodated in the through-axis hole. The inner collar includes external threads that are screwed to the internal threads of the housing. A heat-conducting pressure block, which penetrates through the inner collar and protrudes from the upper and lower surfaces of the housing. A bearing collar, which is between the inner collar and the heat-conducting pressure block. And At least one locking member, which is arranged on the housing. Wherein, when the locking member is locked to the test socket, rotating the inner collar will drive the lower surface of the heat-conducting pressure block to contact the device under test and generate an axial force on the heat-conducting pressure block, and then apply the axial force to the device under test through the heat-conducting pressure block.
2. The test socket pressure testing device with low thermal resistance according to claim 1, which further includes an outer rotating ring and a force-applying pressure ring. The outer rotating ring is coupled to the upper surface of the inner collar; the force-applying pressure ring is accommodated in the inner collar and is between the bearing collar and the heat-conducting pressure block; the heat-conducting pressure block passes through the outer rotating ring and the force-applying pressure ring.
3. The test socket pressure measurement device with low thermal resistance according to claim 2, wherein, The heat-conducting pressure block includes a coaxial portion and an arc-shaped gradually expanding portion. The coaxial portion passes through the force-applying pressure ring, the bearing collar, the inner collar, and the outer rotating ring; the force-applying pressure ring includes an inner ring arc surface that abuts against the arc-shaped gradually expanding portion.
4. The test socket pressure testing device with low thermal resistance according to claim 3, wherein, The bearing collar is a thrust bearing; a specific clearance is maintained between the coaxial portion of the heat-conducting pressure block and the force-applying pressure ring, the bearing collar, and the inner collar.
5. The test socket pressure testing device with low thermal resistance according to claim 2, which further includes an upper snap ring and a lower snap ring. The upper snap ring is sleeved on the heat-conducting pressure block and abuts against the upper surface of the inner collar; the lower snap ring is arranged on the lower surface of the inner collar and is used to lock the force-applying pressure ring.
6. The test socket pressure measurement device with low thermal resistance according to claim 1, wherein, The heat-conducting pressure block includes a coaxial portion, a step portion, and an inclined line gradually expanding portion. The step portion is between the coaxial portion and the inclined line gradually expanding portion.
7. The test socket pressure testing device with low thermal resistance according to claim 6, which further includes a fixing ring that is sleeved on the coaxial portion of the heat-conducting pressure block; the bearing collar is a spherical roller bearing, which includes a bearing inner convex ring and a bearing outer concave ring. The bearing inner convex ring is sleeved on the coaxial portion. One end of the bearing inner convex ring abuts against the fixing ring, and the other end presses against the step portion. The bearing outer concave ring is coupled to the bearing inner convex ring and is connected to the inner collar.
8. The test socket pressure measurement device with low thermal resistance according to claim 7, wherein, The fixing ring is accommodated in the inner collar, and a specific clearance is maintained between the fixing ring and the inner collar.
9. The test socket pressure measurement device with low thermal resistance according to claim 6, wherein, The bearing collar is a thrust self-aligning roller bearing, which includes an upper seat ring, a lower seat ring, and a plurality of inclined rollers. The upper seat ring and the lower seat ring are sleeved on the coaxial portion of the heat-conducting pressure block. The upper seat ring is connected to the inner collar, the lower seat ring presses against the step portion, and the plurality of inclined rollers are arranged between the upper seat ring and the lower seat ring.
10. The test socket pressure testing device with low thermal resistance according to claim 1, which further includes a temperature control module that is arranged above the housing and contacts the heat-conducting pressure block.
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