A solder ball manufacturing device for wafer packaging chip

Abstract

The present invention relates to the field of semiconductor packaging technology, and specifically to a tin ball manufacturing device for wafer packaging chips, comprising a clamp pot, a cooling tank is arranged below the clamp pot, a plurality of thin tubes are arranged on the lower side of the clamp pot, and a lifting frame is connected to one side of the clamp pot; a rotating cylinder is rotatably arranged on the upper half of the cooling tank, the rotating cylinder is an I-shaped structure, and sedimentation tubes are penetrated on the lateral parts around the rotating cylinder, and the distribution structure of the sedimentation tubes corresponds to the distribution structure of the thin tubes. In the present invention, the tin liquid in the clamp pot can be dripped into the sedimentation tube on the cooling tank through the thin tubes, and the tin liquid dripped from each thin tube each time enters a single sedimentation tube respectively, and each tin droplet is isolated by the sedimentation tube to prevent the tin droplets from disturbing each other, thereby preventing the problems of extrusion and aggregation caused by the particles of the partially formed tin balls from being of different sizes, reduced roundness, large ball diameter tolerance and poor mechanical connection performance.

Description

Technical Field

[0001] The invention relates to the technical field of semiconductor packaging, in particular to a solder ball manufacturing device for a wafer packaging chip. Background Art

[0002] Semiconductor packaging refers to the process of processing the tested wafers into independent chips according to the product model and functional requirements. The packaging process is as follows: the wafers from the wafer front-end process are cut into small chips through the dicing process, and then the cut chips are glued to the corresponding islands of the substrate rack, and then the bonding pads of the chips are connected to the corresponding pins of the substrate using ultra-fine metal wires or conductive resins to form the required circuit; then the independent chips are packaged and protected with plastic shells, and a series of operations are required after the plastic packaging. After the packaging is completed, the finished product is tested, usually after inspection, testing and packaging, and finally shipped.

[0003] The prior art has the following problems:

[0004] As an indispensable and important material in chip packaging, solder balls are used to replace the pins in the IC component packaging structure to meet the requirements of electrical interconnection and mechanical connection. High-quality solder balls must have the characteristics of roundness, brightness, good conductivity and mechanical connection performance, and small ball diameter tolerance. In the droplet molding manufacturing method, the tin droplets will disturb each other after entering the coolant, causing some droplets to merge with each other, resulting in different sizes of molded particles, reduced roundness, large ball diameter tolerance, and poor mechanical connection performance. Summary of the invention

[0005] The object of the present invention is to provide a solder ball manufacturing device for wafer packaging chips to solve the problems raised in the above background technology.

[0006] The technical solution of the present invention is: a solder ball manufacturing device for wafer packaging chips, comprising a clamp pot, a cooling tank is arranged below the clamp pot, a plurality of thin tubes are arranged on the lower side of the clamp pot, and a lifting frame is connected to one side of the clamp pot;

[0007] The upper half of the cooling tank is rotatably provided with a rotating drum, which is an I-shaped structure, and sedimentation pipes are penetrated in the transverse parts around the rotating drum, and the distribution structure of the sedimentation pipes corresponds to the distribution structure of the capillary tubes.

[0008] Furthermore, a sedimentation control electrostatic strip is provided on the side of the sedimentation tube, the sedimentation control electrostatic strip is connected to the output end of the electrostatic generator, a counterweight seat is provided at one end of the sedimentation control electrostatic strip, one side of the counterweight seat is connected to a slide bar, a gas cylinder is provided on the sliding sleeve at the lower end of the slide bar, the gas cylinder is fixedly arranged on the rotating cylinder, and a gas valve is provided on one side of the lower end of the gas cylinder;

[0009] The side of the rotating drum is provided with an arc-shaped guide rail, the arc center of the guide rail is the same as the center of the rotating drum, and the guide rail is an inclined structure, and a stand is supported on one side of the guide rail, and a pulley is provided on one side of the counterweight seat, and the pulley matches the structure of the guide rail;

[0010] The capillary is connected to the output end of the electrostatic generator.

[0011] Furthermore, the sedimentation tubes are arranged in several groups around the rotating drum, and each group is arranged with multiple tubes, and the arrangement structure of the thin tubes on the lower side of the clamp pot is the same as the arrangement structure of each group of sedimentation tubes.

[0012] Further, each set of the settling tubes is provided with a settling control electrostatic strip on both sides;

[0013] A shielding plate is arranged between each settling tube group, a distance is arranged between the shielding plate and the settling control electrostatic strip, and the shielding plate is fixedly connected to the rotating drum.

[0014] Furthermore, the side wall of the tongs pot is provided with an interlayer, and an electric heating tube is arranged around the interlayer;

[0015] A feeding port is provided on one side of the upper end of the tongs pot, and a valve plate is provided in the tongs pot. The outer periphery of the valve plate is slidably connected to the inner wall of the tongs pot, and an electric push rod is provided on the top of the valve plate. The output end of the electric push rod is fixedly connected to the valve plate, and the electric push rod is fixedly installed on the lifting frame.

[0016] Furthermore, a transmission arm is hinged on one side of the lifting frame, and an end of the transmission arm away from the lifting frame is rotatably connected to an eccentric wheel, the eccentric part of the eccentric wheel is rotatably connected to the transmission arm, and a support shaft is connected to the middle part of the eccentric wheel, the support shaft is rotatably connected to the frame, and one end of the support shaft is connected to a motor, and the motor is fixedly arranged on the frame.

[0017] Furthermore, at least two sets of transmission arms, eccentric wheels and support shafts are provided at both ends of the lifting frame, and the support shafts in the two sets are connected by belt transmission;

[0018] Limit rods are slidably penetrated through the two ends of the lifting frame respectively, and the limit rods are fixedly connected to the frame.

[0019] Furthermore, the lifting frame is transmission-connected to the rotating cylinder.

[0020] Furthermore, the lifting frame and the rotating cylinder are connected via a one-way transmission mechanism;

[0021] The one-way transmission mechanism includes a rack, which is fixedly connected to the lifting frame, and one side of the rack is meshed with the first gear, a horizontal shaft is passed through the middle of the first gear, the horizontal shaft is connected to the first gear through a one-way bearing, and one end of the horizontal shaft is rotatably connected to a support, and a first bevel gear is fixedly sleeved on the horizontal shaft, one side of the first bevel gear is vertically meshed with the second bevel gear, the second bevel gear is connected to the second gear through a vertical shaft transmission, one side of the second gear is meshed with a gear ring, and the gear ring is fixedly sleeved outside the rotating cylinder.

[0022] Furthermore, the lower end of the cooling tank is connected to a discharge pipe, and the upper end of the rotating cylinder is connected to a liquid inlet pipe via a rotating joint.

[0023] The present invention provides a solder ball manufacturing device for wafer packaged chips through improvement, which has the following improvements and advantages compared with the prior art:

[0024] First, in the present invention, the tin liquid in the tongs pot can be dripped into the settling tube on the cooling tank through the capillary tube, and the tin liquid dripped from each capillary tube each time enters a single settling tube respectively, and each tin droplet is isolated by the settling tube to prevent the tin droplets from disturbing each other and causing problems of extrusion and aggregation, thereby avoiding the situation that the particles of partially formed tin balls are of different sizes, the roundness is reduced, the ball diameter tolerance is large, and the mechanical connection performance is poor;

[0025] Second, in the present invention, the telescopic length of the movable push rod is accurate, and the push rod pushes the valve plate to squeeze out the tin liquid in the tongs pot, so that the amount of tin liquid dripping each time is more accurate and uniform, thereby making the size of each tin ball more uniform;

[0026] Thirdly, in the present invention, the motor drives the eccentric wheel to rotate through the supporting shaft, and then the transmission arm pushes and pulls the lifting frame up and down, so that the lifting frame can move up and down quickly. After the lifting frame moves down to the limit position, it suddenly rises, so that the tongs pot produces a vibration effect, so that the tin liquid at the lower end of the capillary tube under the tongs pot drips under the vibration, ensuring the stability of each drip;

[0027] Fourthly, in the present invention, the lifting frame is connected to the rotating drum by transmission, and the rotating drum is driven to rotate synchronously by the action of the lifting frame, so that the sedimentation tube on the rotating drum can be accurately docked with the capillary tube. When the rack moves up, it drives the first gear to rotate, and the first gear drives the second gear to rotate through the first bevel gear and the second bevel gear. The second gear then drives the rotating drum to rotate, so that the rotating drum can maintain a relatively synchronous frequency with the lifting of the tongs pot, ensuring the accuracy of the dripping liquid entering the sedimentation tube;

[0028] Fourthly, in the present invention, the electrostatic generator can make the tin droplets passing through the capillary carry positive or negative charges. When the sedimentation control electrostatic bar and the tin droplets carry the same charge, they repel each other. Under the action of the electrostatic field, the tin droplets can be suspended in the sedimentation tube. As the sedimentation control electrostatic bar moves downward, the tin droplets can gradually settle downward. The downward movement speed of the sedimentation control electrostatic bar is controlled, so that the descending speed of the tin droplets in the coolant in the sedimentation tube is controllable, thereby preventing the true roundness of the tin droplets from decreasing due to the unbalanced surface tension of the rapid fall. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] The present invention will be further explained below in conjunction with the accompanying drawings and Examples:

[0030] Figure 1 is a front view of the present invention;

[0031] Figure 2 The present invention Figure 1 The enlarged structural diagram at A in the middle;

[0032] Figure 3 The present invention Figure 1 The enlarged structural diagram at B in the middle;

[0033] Figure 4 The present invention Figure 1 The enlarged structural diagram at C in the middle;

[0034] Figure 5 is a side view of the one-way transmission mechanism of the present invention;

[0035] Figure 6 is a front view of the rotating drum of the present invention;

[0036] Figure 7 is a top view of the rotating drum of the present invention;

[0037] Figure 8 is a top view of the guide rail of the present invention;

[0038] Fig. 9 is a front view of the guide rail of the present invention;

[0039] Fig.10 is a top view of the eccentric wheel, transmission arm and support shaft of the present invention;

[0040] Fig.11 is a bottom view of the tongs pot of the present invention;

[0041] Fig.12 It is a side view of a tongs pan of the present invention.

[0042] Explanation of the reference numerals in the accompanying drawings: 1. cooling tank; 11. rotating drum; 12. sedimentation tube; 13. liquid inlet pipe; 14. discharge pipe; 15. gear ring; 16. shielding plate; 2. clamp pot; 21. electric heating tube; 22. capillary tube; 23. feeding port; 24. valve plate; 25. electric push rod; 3. sedimentation control electrode strip; 31. counterweight seat; 32. pulley; 33. guide rail; 34. stand; 35. slide bar; 36. air cylinder; 37. air valve; 4. lifting frame; 41. eccentric wheel; 42. transmission arm; 43. limit rod; 44. support shaft; 45. belt; 46. motor; 5. frame; 6. one-way transmission mechanism; 61. rack; 62. first gear; 63. first bevel gear; 64. vertical axis; 65. second bevel gear; 66. second gear; 67. support; 68. horizontal axis; 7. electrostatic generator. DETAILED DESCRIPTION

[0043] The present invention is described in detail below, and the technical solutions in the embodiments of the present invention are clearly and completely described. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0044] The present invention provides a solder ball manufacturing device for wafer packaging chips through improvement. Figure 1-Figure 12 As shown, a solder ball manufacturing device for wafer packaging chips includes a clamp pot 2, a cooling tank 1 is arranged below the clamp pot 2, a plurality of thin tubes 22 are arranged on the lower side of the clamp pot 2, and a lifting frame 4 is connected to one side of the clamp pot 2;

[0045] A rotating drum 11 is rotatably arranged in the upper half of the cooling tank 1. The rotating drum 11 is an I-shaped structure. The upper and lower ends of the rotating drum 11 are provided with wider outer flanges to form an I-shaped structure, and a settling tube 12 is penetrated through the lateral parts around the rotating drum 11. The distribution structure of the settling tube 12 corresponds to the distribution structure of the capillary 22. Coolant, such as silicone oil, is added into the cooling tank 1, and the coolant overflows upward from the lower half of the cooling tank 1 into the settling tube 12.

[0046] The tin liquid in the tongs pot 2 can drip into the sedimentation tube 12 on the cooling tank 1 through the capillary tube 22. The tin liquid dripping from each capillary tube 22 enters a single sedimentation tube 12 each time. The sedimentation tube 12 is used to isolate each tin droplet to prevent the tin droplets from disturbing each other and causing problems such as extrusion and aggregation, thereby avoiding the situation where the particles of some formed tin balls are of different sizes, the roundness is reduced, the ball diameter tolerance is large, and the mechanical connection performance is poor.

[0047] A sedimentation control electrostatic strip 3 is arranged on the side of the sedimentation tube 12, and the sedimentation control electrostatic strip 3 is connected to the output end of the electrostatic generator 7. The model of the electrostatic generator 7 can be LX-268D, and a counterweight seat 31 is arranged at one end of the sedimentation control electrostatic strip 3, and a sliding rod 35 is connected to one side of the counterweight seat 31. The lower end sliding sleeve of the sliding rod 35 is provided with an air cylinder 36, and the air cylinder 36 is fixedly arranged on the rotating cylinder 11, and an air valve 37 is arranged on one side of the lower end of the air cylinder 36; the electrostatic generator 7 can make the sedimentation control electrostatic strip 3 carry positive or negative charge, and the sedimentation control electrostatic strip 3 can temporarily store static electricity; the sedimentation control electrostatic strip 3 can move with the counterweight seat 31, and the counterweight seat 31 is supported by the sliding rod 35. When the sliding rod 35 moves down and is inserted into the air cylinder 36, the air valve 37 on one side of the air cylinder 36 has a limited rate of exhausting gas, so that the downward movement speed of the sliding rod 35 is controllable;

[0048] An arc-shaped guide rail 33 is arranged on the side of the rotating cylinder 11, and the arc center of the guide rail 33 is the same as the center of the rotating cylinder 11, and the guide rail 33 is an inclined structure, and a stand 34 is arranged on one side of the guide rail 33, and a pulley 32 is arranged on one side of the counterweight seat 31, and the structure of the pulley 32 matches that of the guide rail 33; when the sedimentation control electrostatic strip 3 drops to the height of the guide rail 33, the pulley 32 of the counterweight seat 31 can move along the guide rail 33, so that the counterweight seat 31 and the sedimentation control electrostatic strip 3 rise and return to their original height;

[0049] The capillary 22 is connected to the output end of the electrostatic generator 7; the electrostatic generator 7 can allow the tin droplets passing through the capillary 22 to carry positive or negative charges. When the sedimentation control electrostatic bar 3 and the tin droplets carry the same charge, they repel each other. Under the action of the electrostatic field, the tin droplets can be suspended in the sedimentation tube 12. As the sedimentation control electrostatic bar 3 moves downward, the tin droplets can gradually settle downward. The downward movement speed of the sedimentation control electrostatic bar 3 is controlled, so that the descending speed of the tin droplets in the coolant in the sedimentation tube 12 is controllable, thereby preventing the tin droplets from losing roundness due to unbalanced surface tension due to rapid falling.

[0050] There are several groups of sedimentation tubes 12 arranged around the rotating cylinder 11, and each group has multiple tubes arranged. The arrangement structure of the thin tubes 22 on the lower side of the clamp pot 2 is the same as the arrangement structure of each group of sedimentation tubes 12; the sedimentation tubes 12 and the thin tubes 22 are arranged in a line, which can quickly produce multiple solder balls at the same time.

[0051] A settling control electrostatic strip 3 is disposed on both sides of each settling tube 12; the two settling control electrostatic strips 3 work together to make the electrostatic field support force on both sides of the solder ball more stable.

[0052] A shielding plate 16 is provided between each settling tube 12. A spacing is provided between the shielding plate 16 and the settling control electrostatic strip 3, and the shielding plate 16 is fixedly connected to the rotating cylinder 11. The shielding plate 16 is made of a metal conductive material and is grounded through a conductive slip ring.

[0053] The side wall of the tongs pot 2 is provided with an interlayer, and an electric heating tube 21 is arranged around the interlayer; the electric heating tube 21 can maintain the temperature of the tongs pot 2;

[0054] A feeding port 23 is provided on one side of the upper end of the tongs pot 2, and a valve plate 24 is provided in the tongs pot 2. The outer periphery of the valve plate 24 is slidably connected to the inner wall of the tongs pot 2, and an electric push rod 25 is provided on the top of the valve plate 24. The output end of the electric push rod 25 is fixedly connected to the valve plate 24, and the electric push rod 25 is fixedly installed on the lifting frame 4; the electric push rod 25 has a precise telescopic length, and the tin liquid in the tongs pot 2 is squeezed out by pushing the valve plate 24, so that the amount of tin liquid dripping is more accurate, thereby making the size of each tin ball more uniform.

[0055] A transmission arm 42 is hinged on one side of the lifting frame 4, and the end of the transmission arm 42 away from the lifting frame 4 is rotatably connected to the eccentric wheel 41, the eccentric part of the eccentric wheel 41 is rotatably connected to the transmission arm 42, and the middle part of the eccentric wheel 41 is connected to a support shaft 44, the support shaft 44 is rotatably connected to the frame 5, and one end of the support shaft 44 is connected to a motor 46, and the motor 46 is fixedly arranged on the frame 5; the motor 46 drives the eccentric wheel 41 to rotate through the support shaft 44, and then the transmission arm 42 pushes and pulls the lifting frame 4 up and down, so that the lifting frame 4 can move up and down quickly, and the lifting frame 4 moves down to the extreme position and then suddenly rises, so that the tongs pot 2 produces a vibration effect, so that the tin liquid at the lower end of the capillary 22 on the lower side of the tongs pot 2 drips under the vibration, thereby ensuring the stability of each drip.

[0056] At least two sets of transmission arms 42, eccentric wheels 41 and support shafts 44 are provided at both ends of the lifting frame 4, and the support shafts 44 in the two sets are connected by belts 45;

[0057] Limit rods 43 are slidably penetrated at both ends of the lifting frame 4, and the limit rods 43 are fixedly connected to the frame 5; the two sets of transmission arms 42, the eccentric wheel 41 and the support shaft 44 can apply uniform upward and downward pushing and pulling forces to the lifting frame 4.

[0058] The lifting frame 4 is in transmission connection with the rotating drum 11 ; the movement of the lifting frame 4 drives the rotating drum 11 to rotate synchronously, so that the sedimentation tube 12 on the rotating drum 11 can be accurately docked with the capillary 22 .

[0059] The lifting frame 4 and the rotating cylinder 11 are connected to each other through a one-way transmission mechanism 6;

[0060] The one-way transmission mechanism 6 includes a rack 61, which is fixedly connected to the lifting frame 4, and one side of the rack 61 is meshed with a first gear 62, a transverse shaft 68 is passed through the middle of the first gear 62, the transverse shaft 68 is connected to the first gear 62 through a one-way bearing, and one end of the transverse shaft 68 is rotatably connected to a support 67, and a first bevel gear 63 is fixedly sleeved on the transverse shaft 68, one side of the first bevel gear 63 is vertically meshed with a second bevel gear 65, the second bevel gear 65 is transmission-connected to a second gear 66 through a vertical shaft 64, and one side of the second gear 66 is meshed with a gear ring 15, which is fixedly sleeved outside the rotating cylinder 11; when the rack 61 moves up, it drives the first gear 62 to rotate, the first gear 62 drives the second gear 66 to rotate through the first bevel gear 63 and the second bevel gear 65, and the second gear 66 drives the rotating cylinder 11 to rotate, so that the rotating cylinder 11 can maintain a relatively synchronous frequency with the lifting and lowering of the tongs pot 2, thereby ensuring the accuracy of the dripping liquid entering the sedimentation tube 12;

[0061] The first gear 62 is connected to the transverse shaft 68 via a one-way bearing, which is specifically a one-way ratchet bearing. Therefore, when the gear ring 15 moves downward, it will not drive the first gear 62 to rotate.

[0062] The lower end of the cooling tank 1 is connected with a discharge pipe 14, and the upper end of the rotating cylinder 11 is connected with a liquid inlet pipe 13 through a rotating joint; the coolant enters the cooling tank 1 from the liquid inlet pipe 13, and then is discharged from the discharge pipe 14, so that the circulation of the coolant is realized. When the coolant is discharged from the discharge pipe 14, the cooled and formed solder balls are also discharged. The coolant with the solder balls can be filtered through a filter to remove the solder balls.

[0063] Working principle: Add tin material into the tongs pot 2, the electric heating tube 21 heats the tongs pot 2 to melt the tin material into liquid, the valve plate 24 blocks the inner cavity of the upper half of the tongs pot 2, so that the tin liquid inside does not flow out directly, the tongs pot 2 is installed on the lifting frame 4, and the lifting frame 4 drives the up and down displacement. Specifically, the motor 46 drives the eccentric wheel 41 to rotate through the support shaft 44, and then the transmission arm 42 pushes and pulls the lifting frame 4 up and down, so that the lifting frame 4 can move up and down quickly. After the lifting frame 4 moves down to the limit position and then suddenly rises, the tongs pot 2 can produce a vibration effect, so that the tin liquid at the lower end of the capillary 22 on the lower side of the tongs pot 2 drips under the vibration, ensuring stable dripping each time, and allowing the tin liquid to drop into the sedimentation tube 12;

[0064] The tin liquid dripped from each capillary 22 enters a single settling tube 12 respectively, and each tin droplet is isolated by the settling tube 12 to prevent the tin droplets from disturbing each other and causing problems of extrusion and aggregation, thereby avoiding the situation where the particles of partially formed tin balls are of different sizes, the roundness is reduced, the ball diameter tolerance is large, and the mechanical connection performance is poor;

[0065] After the tin droplets enter the sedimentation tube 12, the electrostatic generator 7 can make the tin droplets passing through the capillary 22 carry positive or negative charges. When the sedimentation control electrostatic strip 3 and the tin droplets carry the same charge, they repel each other. Under the action of the electrostatic field, the tin droplets can be suspended in the sedimentation tube 12. As the sedimentation control electrostatic strip 3 moves downward, the tin droplets can gradually settle downward. The downward movement speed of the sedimentation control electrostatic strip 3 is controlled, so that the descending speed of the tin droplets in the coolant in the sedimentation tube 12 is controllable, preventing the true roundness of the tin droplets from decreasing due to the unbalanced surface tension of the rapid fall.

[0066] The sedimentation control electrostatic strip 3 can move with the counterweight seat 31. The counterweight seat 31 is supported by a slide bar 35. When the slide bar 35 moves downward and is inserted into the gas cylinder 36, the gas valve 37 on one side of the gas cylinder 36 has a limited rate of exhausting gas, so that the downward movement speed of the slide bar 35 is controllable, so that the sedimentation control electrostatic strip 3 can move slowly downward. When the sedimentation control electrostatic strip 3 drops to the height of the guide rail 33, the pulley 32 of the counterweight seat 31 can move along the guide rail 33, so that the counterweight seat 31 and the sedimentation control electrostatic strip 3 rise and return to their original height;

[0067] During the up and down movement of the tongs pot 2, when the rack 61 moves upward, it drives the first gear 62 to rotate, and the first gear 62 drives the second gear 66 to rotate through the first bevel gear 63 and the second bevel gear 65, and the second gear 66 drives the rotating cylinder 11 to rotate, so that the rotating cylinder 11 can maintain a relatively synchronous frequency with the lifting and lowering of the tongs pot 2, ensuring the accuracy of the dripping liquid entering the sedimentation tube 12;

[0068] Moreover, the coolant enters the cooling tank 1 from the liquid inlet pipe 13 and is then discharged from the discharge pipe 14, which can realize the circulation of the coolant. When the coolant is discharged from the discharge pipe 14, the cooled and formed solder balls are also discharged. The formed solder balls can be taken out by filtering the coolant containing the solder balls through the filter.

Claims

1. A solder ball manufacturing device for wafer packaging chips, comprising a clamp pot (2), a cooling tank (1) is arranged below the clamp pot (2), Features: A plurality of thin tubes (22) are arranged in an array on the lower side of the tongs pot (2), and a lifting frame (4) is connected to one side of the tongs pot (2); The upper half of the cooling tank (1) is rotatably provided with a rotating drum (11), the rotating drum (11) being an I-shaped structure, and settling pipes (12) are penetrated in the transverse parts around the rotating drum (11), and the distribution structure of the settling pipes (12) corresponds to the distribution structure of the capillary tubes (22); A sedimentation control electrostatic strip (3) is arranged on the side of the sedimentation tube (12), the sedimentation control electrostatic strip (3) is connected to the output end of the electrostatic generator (7), a counterweight seat (31) is arranged at one end of the sedimentation control electrostatic strip (3), one side of the counterweight seat (31) is connected to a slide bar (35), a lower end sliding sleeve of the slide bar (35) is provided with an air cylinder (36), the air cylinder (36) is fixedly arranged on the rotating cylinder (11), and an air valve (37) is arranged on one side of the lower end of the air cylinder (36); An arc-shaped guide rail (33) is arranged on the side of the rotating cylinder (11), the arc center of the guide rail (33) is the same as the arc center of the rotating cylinder (11), the guide rail (33) is an inclined structure, and a stand (34) is arranged on one side of the guide rail (33), and a pulley (32) is arranged on one side of the counterweight seat (31), and the structure of the pulley (32) matches that of the guide rail (33); The capillary tube (22) is connected to the output end of the electrostatic generator (7).

2. A solder ball manufacturing device for wafer packaged chips according to claim 1, Features: The sedimentation tubes (12) are arranged in a plurality of groups around the rotating cylinder (11), and each group is arranged with a plurality of the sedimentation tubes (12). The arrangement structure of the thin tubes (22) at the lower side of the clamp pot (2) is the same as the arrangement structure of each group of sedimentation tubes (12).

3. The solder ball manufacturing equipment for wafer packaged chips according to claim 2, Features: Each set of the sedimentation tubes (12) is provided with a sedimentation control electrostatic strip (3) on both sides; A shielding plate (16) is provided between each settling tube group (12), a spacing is provided between the shielding plate (16) and the settling control electrostatic strip (3), and the shielding plate (16) is fixedly connected to the rotating drum (11).

4. The solder ball manufacturing equipment for wafer packaged chips according to claim 1, Features: The side wall of the tongs pot (2) is provided with an interlayer, and an electric heating pipe (21) is arranged around the interlayer; A feeding port (23) is provided on one side of the upper end of the tongs pot (2), and a valve plate (24) is provided in the tongs pot (2), the outer periphery of the valve plate (24) is slidably connected to the inner wall of the tongs pot (2), and an electric push rod (25) is provided on the top of the valve plate (24), the output end of the electric push rod (25) is fixedly connected to the valve plate (24), and the electric push rod (25) is fixedly mounted on the lifting frame (4).

5. The solder ball manufacturing equipment for wafer packaged chips according to claim 1, Features: A transmission arm (42) is hingedly connected to one side of the lifting frame (4); an end of the transmission arm (42) away from the lifting frame (4) is rotatably connected to an eccentric wheel (41); an eccentric portion of the eccentric wheel (41) is rotatably connected to the transmission arm (42); a middle portion of the eccentric wheel (41) is connected to a support shaft (44); the support shaft (44) is rotatably connected to a frame (5); one end of the support shaft (44) is connected to a motor (46); and the motor (46) is fixedly arranged on the frame (5).

6. The solder ball manufacturing equipment for wafer packaged chips according to claim 5, Features: At least two groups of transmission arms (42), eccentric wheels (41) and support shafts (44) are provided at both ends of the lifting frame (4), and the support shafts (44) in the two groups are connected by belts (45); Limit rods (43) are slidably inserted through the two ends of the lifting frame (4), and the limit rods (43) are fixedly connected to the frame (5).

7. The solder ball manufacturing equipment for wafer packaged chips according to claim 1, Features: The lifting frame (4) is transmission-connected to the rotating cylinder (11).

8. The solder ball manufacturing equipment for wafer packaged chips according to claim 7, Features: The lifting frame (4) and the rotating cylinder (11) are connected in transmission via a one-way transmission mechanism (6); The one-way transmission mechanism (6) comprises a rack (61), the rack (61) is fixedly connected to the lifting frame (4), and one side of the rack (61) is meshedly connected to a first gear (62), a transverse shaft (68) is passed through the middle of the first gear (62), the transverse shaft (68) is connected to the first gear (62) via a one-way bearing, one end of the transverse shaft (68) is rotatably connected to a support (67), and a first bevel gear (63) is fixedly sleeved on the transverse shaft (68), one side of the first bevel gear (63) is vertically meshedly connected to a second bevel gear (65), the second bevel gear (65) is transmission-connected to a second gear (66) via a vertical shaft (64), one side of the second gear (66) is meshedly connected to a gear ring (15), and the gear ring (15) is fixedly sleeved outside the rotating cylinder (11).

9. The solder ball manufacturing equipment for wafer packaged chips according to claim 1, Features: The lower end of the cooling tank (1) is connected to a discharge pipe (14), and the upper end of the rotating cylinder (11) is connected to a liquid inlet pipe (13) via a rotating joint.

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