Bonding alignment device, flip chip bonding machine and bonding method

Abstract

The present invention relates to a bonding alignment device, a flip chip bonding machine and a bonding method, wherein the bonding alignment device is used to assist in the bonding between a chip and a substrate. The bonding alignment device comprises a bonding head assembly, a first carrier for carrying the chip and a second carrier for carrying the substrate, wherein the bonding head assembly can pick up the chip, and the bonding head assembly can drive the chip to approach the substrate along a first direction, wherein the first carrier and the second carrier are sequentially distributed along the first direction. The bonding alignment device can improve the accuracy of the bonding between the chip and the substrate. The flip chip bonding device comprises the above-mentioned bonding alignment device, which can improve the accuracy of the bonding between the chip and the substrate. The bonding method is applied to the above-mentioned flip chip new product bonding device, which can improve the accuracy of the bonding between the chip and the substrate.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor packaging, and in particular to a bonding alignment device, a flip chip bonding machine and a bonding method. Background Art

[0002] Flip chip bonder (FCB) is a key equipment in the back-end packaging process of flip chip production line. Its function is to complete the surface array bump interconnection between the chip inside the package and the substrate. Flip chip is a packaging method in which the front side of the chip (the side where the IC circuit is made) is connected to the substrate downward.

[0003] With the development of semiconductor technology, the number of bumps on the chip has increased, and the requirements for the alignment accuracy of the chip and the substrate have also increased. It is difficult to achieve high-precision alignment between the chip and the substrate with traditional technology, and it is difficult to achieve high-precision bonding between the chip and the substrate. Summary of the invention

[0004] Based on this, it is necessary to provide a bonding alignment device, a flip chip bonding machine and a bonding method to address the problem of chip and substrate alignment accuracy.

[0005] A bonding alignment device is used to assist in bonding a chip to a substrate. The bonding alignment device includes a bonding head assembly, a first carrier for carrying the chip, and a second carrier for carrying the substrate. The bonding head assembly can pick up the chip and drive the chip to approach the substrate along a first direction. The first carrier and the second carrier are distributed in sequence along the first direction.

[0006] In one embodiment, the first carrier is made of a light-transmitting material, the bonding alignment device further includes a first visual detection component, and the first carrier, the first visual detection component and the second carrier are sequentially distributed along the first direction.

[0007] In one of the embodiments, the bonding alignment device also includes a driving component, which is connected to the first carrier and / or the second carrier, and the driving component can drive the first carrier and / or the second carrier to move along a second direction, and the second direction intersects with the first direction.

[0008] In one embodiment, the first stage is disposed on the first visual detection component, and the driving component is connected to the first visual detection component to drive the first visual detection component to move between the detection station and the avoidance station;

[0009] When the first visual inspection component is at the inspection station, the first stage, the first visual inspection component and the second stage are sequentially distributed along the first direction;

[0010] When the first visual inspection component is at the avoidance position, there is a gap between the projection of the first visual inspection component on the second stage along the first direction and the second stage.

[0011] In one embodiment, the driving assembly includes a driving member, a guide rail, and a slide table slidably engaged with the guide rail, the guide rail extends along the second direction, and the first visual detection assembly is disposed on the slide table.

[0012] In one embodiment, the first visual inspection component includes a first camera and a first prism group, the first camera faces the first prism group, the first carrier, the first prism group and the second carrier are distributed in sequence along the first direction, and the first prism group is used to refract the light of the first camera so that the first camera can simultaneously photograph the chip and the substrate.

[0013] In one embodiment, the number of the first cameras is two, the number of the first prism groups is also two, and the two first cameras and the two first prism groups are arranged opposite to each other in a one-to-one correspondence, so that the two first cameras can simultaneously and cooperate with each other to photograph the chip and the substrate.

[0014] In one embodiment, the bonding alignment device also includes a second visual detection component, and the first carrier, the second carrier and the second visual detection component are distributed in sequence along a first direction, and the second visual detection component can simultaneously detect the positions of the chip and the substrate.

[0015] In one embodiment, the second visual detection component includes a second camera and a second prism group, the second camera faces the second prism group, the second prism group is used to refract the light of the second camera, and the first carrier, the second carrier and the second prism group are distributed in sequence along the first direction.

[0016] In one embodiment, a heating component is disposed on the second carrier, and the heating component is capable of heating the substrate to a eutectic temperature.

[0017] A flip chip bonding machine, used for bonding a chip to a substrate, comprising:

[0018] A bonding alignment device as described in any one of the above embodiments;

[0019] A position control device is connected to the bond head assembly, and the position control device can adjust the spatial position of the bond head assembly.

[0020] A bonding method applied to the flip chip bonding machine described in the above embodiment, the bonding method comprising:

[0021] Mounting the chip on the first stage, and mounting the substrate on the second stage;

[0022] The first visual detection component detects the relative position of the first marking point on the chip and the second marking point on the substrate;

[0023] The bonding head picks up the chip;

[0024] The adjusting component adjusts the positions of the bonding head and the chip according to the detection result of the first visual detection component;

[0025] The position control device drives the chip to approach the substrate so that the chip is bonded to the substrate.

[0026] In the above-mentioned bonding alignment device, the bonding head assembly can drive the chip to approach the substrate along the first direction, and the first carrier and the second carrier are distributed in sequence along the first direction. That is, the first carrier and the second carrier are distributed along the bonding direction. With such a configuration, the bonding head assembly can pick up the chip on the first carrier and directly bond the chip to the substrate along the first direction, thereby avoiding the overly complicated movement of the bonding head assembly when adjusting the chip position. It is understandable that the more complicated the movement of the bonding head assembly is, the more difficult it is to control the position of the chip relative to the substrate. In other words, it is difficult to ensure the positional accuracy between the chip and the substrate, and it is difficult to achieve high-precision bonding between the chip and the substrate. In other words, such a configuration can facilitate the high-precision bonding between the chip and the substrate. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1 It is a schematic axial view of a flip chip bonding machine according to an embodiment;

[0028] Figure 2 for Figure 1 An axial schematic diagram of a bonding alignment device in a flip chip bonding machine shown;

[0029] Figure 3 for Figure 2 The axial schematic diagram of the bonding alignment device when the first visual inspection component is in the avoidance position;

[0030] Figure 4 for Figure 2 A simplified schematic diagram of a first carrier, a second carrier, a first detection component and a second detection component in the bonding alignment device shown;

[0031] Figure 5 for Figure 2 A schematic axial view of a first visual inspection component in the bonding alignment device shown;

[0032] Figure 6 for Figure 5 An axial schematic diagram of a first camera and a first prism group in the first visual inspection assembly is shown;

[0033] Figure 7 for Figure 2 A partial enlarged view of the middle A;

[0034] Figure 8 for Figure 2 A schematic diagram of the axial view of the second visual inspection component and the second carrier in the bonding alignment device shown;

[0035] Fig. 9 for Figure 2 An axial schematic diagram of the second visual inspection component in the bonding alignment device is shown.

[0036] Figure numerals: 10, flip chip bonding machine; 100, bonding alignment device; 110, first carrier; 120, second carrier; 130, first visual inspection component; 131, first camera; 132, first prism group; 132a, first horizontal prism; 132b, first vertical prism; 133, first fine-tuning mechanism; 140, driving component; 141, guide rail; 142, slide; 150, second visual inspection component; 151, second camera; 152, second prism group; 152a, second vertical prism; 153, second fine-tuning mechanism; 160, bonding head assembly; 161, bonding head; 162, adjustment assembly; 200, position control device; 300, base; 20, chip; 30, substrate. DETAILED DESCRIPTION

[0037] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, the specific embodiments of the present invention are described in detail below in conjunction with the accompanying drawings. In the following description, many specific details are set forth to facilitate a full understanding of the present invention. However, the present invention can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without violating the connotation of the present invention, so the present invention is not limited by the specific embodiments disclosed below.

[0038] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as limiting the present invention.

[0039] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In the description of the present invention, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0040] In the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0041] In the present invention, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, a first feature being "above", "above" or "above" a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. A first feature being "below", "below" or "below" a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0042] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it may be directly on the other element or there may be a central element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. The terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used herein are for illustrative purposes only and are not intended to be the only implementation method.

[0043] See also Figure 1 , Figure 1 The schematic diagram of the axial side of a flip chip bonding machine in one embodiment of the present invention is shown. The flip chip bonding machine 10 provided in one embodiment of the present invention is used to bond a chip 20 to a substrate 30. It can be understood that the chip 20 includes a bonding surface for bonding with the substrate 30. The substrate 30 includes a mating surface for bonding with the bonding surface. The flip chip bonding machine 10 is used to make the bonding surface contact and bond with the mating surface.

[0044] The flip chip bonding machine 10 comprises a base 300 , a position control device 200 and a bonding alignment device 100 . The position control device 200 and the bonding alignment device 100 are both disposed on the base 300 .

[0045] See also Figures 2 to 4 In one embodiment, the bonding alignment device 100 is used to assist the bonding of the chip 20 and the substrate 30. Specifically, the bonding alignment device 100 includes a bonding head assembly 160, a first carrier 110 for carrying the chip 20, and a second carrier 120 for carrying the substrate 30. The bonding head assembly 160 can pick up the chip 20, and the bonding head assembly 160 can drive the chip 20 along a first direction (the first direction is referred to as Figures 2 to 4 The first stage 110 and the second stage 120 are sequentially distributed along the first direction.

[0046] In the above-mentioned bonding alignment device 100, the bonding head assembly 160 can drive the chip 20 to approach the substrate 30 along the first direction, and the first carrier 110 and the second carrier 120 are distributed in sequence along the first direction. That is, the first carrier 110 and the second carrier 120 are distributed along the bonding direction. In this way, the bonding head assembly 160 can pick up the chip 20 on the first carrier 110 and directly bond the chip 20 to the substrate 30 along the first direction, avoiding the bonding head assembly 160 from moving too complicatedly when adjusting the position of the chip 20. It can be understood that the more complex the movement of the bonding head assembly 160 and the chip 20, the more difficult it is to control the position of the chip 20 relative to the substrate 30. That is, it is difficult to ensure the position accuracy between the chip 20 and the substrate 30, and it is difficult to bond the chip 20 to the substrate 30 with high precision. In other words, such a setting can facilitate the high-precision bonding between the chip 20 and the substrate 30.

[0047] Combination Figure 4 Furthermore, since the bonding head assembly 160 can drive the chip 20 to approach the substrate along the first direction, and the first carrier 110 and the second carrier 120 are sequentially distributed along the first direction, it can be arranged that when the chip 20 and the substrate 30 are respectively located on the first carrier 110 and the second carrier 120, the bonding surface and the matching surface are arranged opposite to each other. Figure 4 In the middle mark, Q, the mating surface is Figure 4 The number O in the middle. Such a configuration can further facilitate the bonding head 161 to control the bonding of the chip 20 and the substrate 30. Specifically, each embodiment adopts a flip-chip bonding method to bond the chip 20 to the substrate 30. In this embodiment, by setting the bonding surface and the mating surface to be opposite to each other, there is no need to flip the chip 20 to make the bonding surface and the mating surface opposite to each other. Therefore, on the one hand, it can avoid the flipping action affecting the position accuracy of the chip 20 relative to the substrate 30. On the other hand, since the bonding surface and the mating surface are set opposite to each other, the chip 20 can be directly bonded to the substrate 30 along the first direction, thereby improving the bonding efficiency.

[0048] In one embodiment, the bond head assembly 160 includes a bond head 161 and an adjustment assembly 162. The bond head 161 is used to pick up the chip 20. The adjustment assembly 162 is connected to the bond head 161 and is used to drive the bond head 161 to move along the first direction to drive the chip 20 to move along the first direction. In addition, the adjustment assembly 162 is also used to provide pressure when the chip 20 is bonded to the substrate 30.

[0049] In one embodiment, the position control device 200 is connected to the bond head assembly 160 , and the position control device 200 can adjust the spatial position of the bond head assembly 160 to adjust the spatial position of the chip 20 .

[0050] See also Figure 5 Combined with Figure 2 and Figure 3, the first carrier 110 is a light-transmitting material, and the bonding alignment device 100 also includes a first visual detection component 130. The first carrier 110, the first visual detection component 130 and the second visual detection component 150 are distributed in sequence along the first direction. In combination with the above embodiment, the first carrier 110, the first visual detection component 130 and the second visual detection component 150 are distributed in sequence along the Z axis, that is, the first visual detection component 130 is arranged between the first carrier 110 and the second carrier 120. In combination with the above embodiment, when the chip 20 and the substrate 30 are placed in a preset position, the bonding surface and the matching surface are arranged oppositely, so that the first visual detection component 130 can perform visual detection on the bonding surface and the matching surface at the same time. Thus, the position information between the bonding surface and the matching surface can be obtained by the first visual detection component 130. When the bonding head 161 picks up the chip 20, the position of the chip 20 can be adjusted according to the position information detected by the above-mentioned first visual detection component 130. Thereby, the chip 20 and the substrate 30 can be bonded with high precision.

[0051] It is understandable that the first carrier 110 is made of a light-transmitting material. Thus, the first visual detection component 130 can detect the position information of the chip 20 through the first carrier 110. The first carrier 110 can be made of, for example, sapphire glass or other light-transmitting materials, which are not limited here.

[0052] Further, a plurality of first marking points (not shown in the figure, the same below) are provided on the bonding surface, and a plurality of second marking points (not shown in the figure, the same below) are provided on the substrate 30. The number of the first marking points corresponds to the number of the second marking points. Moreover, the positions of the plurality of second marking points on the substrate 30 correspond to the positions of the plurality of first marking points on the chip 20. In other words, when the chip 20 is bonded to the substrate 30, all the first marking points can overlap with all the second marking points in a one-to-one correspondence.

[0053] In the above embodiment, the first visual detection component 130 can detect all the first marking points and all the second marking points at the same time. In this way, the positions of the first marking points and the corresponding second marking points can be compared to obtain the position of the chip 20 relative to the substrate 30. Therefore, the position control device 200 adjusts the positions of the bonding head 161 and the chip 20 and the substrate 30 in a targeted manner according to the relative positions of the first marking points and the second marking points, so that the chip 20 and the substrate 30 are aligned.

[0054] It is understandable that the number of the first marking points can be 3, 4, 5, etc. The number of the first marking points can be increased or decreased according to the shape of the chip 20 or the number of array bumps on the chip 20 and the substrate 30, and is not limited here. It is understandable that the number of the second marking points corresponds to the number of the first marking points, and no further details are given.

[0055] In one embodiment, the first carrier 110 is hollow, so that it is easy for the bonding head assembly 160 to pick up the chip 20 and prevent the first carrier 110 from hindering the bonding head assembly 160 from driving the chip 20 to move along the first direction. In this embodiment, the first carrier 110 can vacuum absorb the chip 20 so that the chip 20 and the substrate 30 remain relatively fixed.

[0056] Alternatively, please refer to Figure 2 and Figure 3 In other embodiments, the bonding alignment device 100 also includes a driving component 140. The driving component 140 is connected to the first carrier 110 and / or the second carrier 120. The driving component 140 can drive the first carrier 110 and / or the second carrier 120 to move along the second direction. The second direction intersects with the first direction, that is, the first direction and the second direction are not arranged parallel to each other. In this way, when the first visual inspection component 130 completes the position detection of the chip 20 and the substrate 30, the first carrier 110 can be controlled by the driving component 140 to move in the second direction. In this way, the first carrier 110 is prevented from restricting the bonding head 161 from driving the chip 20 to move along the first direction.

[0057] The first direction and the second direction may be in a perpendicular relationship. Figure 2 and Figure 3 The X-axis direction.

[0058] Please continue reading Figure 2 and Figure 3 In one embodiment, a specific description is given by taking the example that the driving component 140 is connected to the first carrier 110 to drive the first carrier 110 to move along the second direction. The first carrier 110 is arranged on the first visual detection component 130. The driving component 140 is connected to the first visual detection component 130 to drive the first visual detection component 130 to move between the detection station and the avoidance station. It can be understood that the first carrier 110 can also move between the detection station and the avoidance station with the first visual detection component 130.

[0059] When the first visual inspection component 130 is at the inspection station, the first stage 110, the first visual inspection component 130 and the second stage 120 are sequentially distributed along the first direction. That is, when the first visual inspection component 130 is at the inspection station. The first visual inspection component 130 is disposed between the first stage 110 and the second stage 120, and the first visual inspection component 130 can inspect the bonding surface and the matching surface at the same time.

[0060] When the first visual inspection component 130 is in the avoidance position, there is a gap between the projection of the first visual inspection component 130 on the second stage 120 along the first direction and the second stage 120. In this way, it is possible to avoid collision and interference between the bonding head 161 and the first visual inspection component 130 when the position control device 200 controls the chip 20 to approach the substrate 30. In other words, such a setting can ensure that the chip 20 has the simplest path when bonding, that is, directly approaching and bonding with the substrate 30 along the first direction without avoiding any other structures, thereby ensuring the movement accuracy of the chip 20 when moving toward the substrate 30.

[0061] It should be understood that Figure 2 The first visual inspection component 130 is shown in the inspection station. Figure 3 The first visual inspection component 130 is shown in the avoidance position. Figure 2 and Figure 3 The first visual inspection component 130 can move from the inspection station to the avoidance station, and vice versa, under the action of the driving component 140, which will not be repeated.

[0062] Of course, the driving assembly 140 can also be connected to the second stage 120 according to actual needs, and the driving assembly 140 drives the second stage 120 to move along the second direction to prevent the first stage 110 from interfering with the movement of the bonding head assembly 160 and the chip 20. The driving assembly 140 is connected to the first stage 110 and the second stage 120 in the same way, which will not be repeated.

[0063] See also Figure 2 In one embodiment, the driving assembly 140 includes a driving member (not shown in the figure, the same below), a guide rail 141, and a slide 142 that slidably cooperates with the guide rail 141. The guide rail 141 extends along the second direction. The first visual detection assembly 130 is disposed on the slide 142. Figure 2 and Figure 3 , the guide rail 141 extends along the X-axis direction.

[0064] With such arrangement, the first visual inspection component 130 and the first carrier 110 can move along the guide rail 141 with the slide 142 under the action of the driving component 140 , so that the movement path of the chip 20 is single, which facilitates controlling the position accuracy of the chip 20 relative to the substrate 30 .

[0065] See also Figure 6 , and combined with Figure 2In one embodiment, the first visual inspection component 130 includes a first camera 131 and a first prism group 132. The first camera 131 faces the first prism group 132, and the first stage 110, the first prism group 132 and the second stage 120 are sequentially distributed along the first direction, that is, the first prism group 132 is disposed between the first stage 110 and the second stage 120. The first prism group 132 is used to refract the light of the first camera 131 so that the first camera 131 can simultaneously photograph the chip 20 and the substrate 30. That is, the first prism group 132 is used to refract the light of the first camera 131 so that the first camera 131 can simultaneously photograph the bonding surface and the matching surface.

[0066] It is understandable that the chip 20 and the substrate 30 are both high-precision structures, and the structural dimensions of the two are relatively small. At the same time, the distance between the first stage 110 and the second stage 120 is not large. The first camera 131 includes structures such as a light source and a lens, and its structural dimensions are relatively large relative to the chip 20 and the substrate 30. In this embodiment, the first prism group 132 is arranged between the first stage 110 and the second stage 120, and the light of the first camera 131 is refracted by the first prism group 132, so that the first camera 131 can simultaneously detect the chip 20 located above the first prism group 132 and the substrate 30 located below the first prism group 132. At the same time, the arrangement of the first prism group 132 also facilitates reducing the distance between the first stage 110 and the second stage 120, and facilitates shortening the bonding stroke of the chip 20. It is understandable that the shorter the stroke, the smaller the error accumulation.

[0067] It should be understood that the above-mentioned large and small are relative to the first camera 131. The upper and lower parts mentioned in each embodiment refer to the upper and lower parts in the Z-axis direction.

[0068] See also Figure 5 , the first camera 131 can be along Figure 5 Extends in the X-axis direction.

[0069] See also Figure 5 The first visual inspection component 130 may further include a first fine-tuning mechanism 133. The first fine-tuning mechanism 133 is used to adjust the position of the first camera 131 so that the first camera 131 can clearly inspect the complete structure of the chip 20 and the substrate 30.

[0070] See also Figure 6 and Figure 7 In one embodiment, the first carrier 110 may be directly disposed on the first prism group 132 .

[0071] See also Figure 6In the above embodiment, specifically, the first prism group 132 includes a first horizontal prism 132a and a first vertical prism 132b facing the first horizontal prism 132a. The first vertical prism 132b enables the first camera 131 to simultaneously detect the chip 20 located above the first prism group 132 and the substrate 30 located below the first prism group 132. The first horizontal prism 132a can adjust the angle of the light of the first camera 131 so that the first camera 131 can accurately face the vertical camera, which facilitates the flexible setting of the installation space of the first camera 131. The paths of the refracted light of the first horizontal prism 132a and the first vertical prism 132b are shown in FIG. Figure 4 and Figure 6 Middle dotted line K.

[0072] Please continue reading Figure 6 and Figure 7 In one embodiment, the chip 20 is in the shape of a long strip. At this time, the number of the first cameras 131 is two, and the number of the first prism groups 132 is also two. The two first cameras 131 and the two first prism groups 132 are arranged relative to each other in a one-to-one correspondence, so that the two first cameras 131 can simultaneously and mutually cooperate to shoot the chip 20 and the substrate 30. That is, the two first cameras 131 can simultaneously and mutually cooperate to shoot the fitting surface and the matching surface. In this way, it is possible to ensure that the chip 20 as a whole is within the detection range of the first camera 131 while ensuring that the detection result of the first camera 131 is clear. It can be understood that in this embodiment, the two first prism groups 132 both include the first horizontal prism 132a and the first vertical prism 132b as described in the above embodiment.

[0073] See also Figure 8 and Figure 3 In one embodiment, the bonding alignment device 100 further includes a second visual inspection component 150. The first stage 110, the second stage 120 and the second visual inspection component 150 are sequentially distributed along the first direction, and the second visual inspection component 150 can simultaneously inspect the positions of the chip 20 and the substrate 30. In this embodiment, the first stage 110 is disposed above the second stage 120, and the second visual inspection component 150 is disposed below the second stage 120.

[0074] It is understandable that in this embodiment, the second stage 120 and the substrate 30 are made of light-transmitting materials. In this way, the second visual detection component 150 can detect the relative position of the chip 20 and the substrate 30 through the second stage 120. It should be noted that the fact that the substrate 30 is made of light-transmitting material does not mean that the second marking point on the substrate 30 cannot be detected by the second visual detection component 150.

[0075] Specifically, the second visual detection component 150 can detect the position information of multiple first marking points and multiple second marking points. In addition, since the first stage 110, the second stage 120 and the second visual detection component 150 are sequentially distributed along the first direction, and the first direction is the bonding direction of the chip 20. Therefore, the second visual detection component 150 can directly detect whether the first marking points and the second marking points corresponding to each other overlap. If they overlap, when the chip 20 moves along the first direction to bond with the substrate 30, the first marking point can overlap with the second marking point.

[0076] In other words, by detecting whether the first mark point and the second mark point coincide with each other through the second visual inspection component 150, it is possible to determine whether the chip 20 and the substrate 30 are accurately aligned. In this way, the position of the chip 20 relative to the substrate 30 can be further adjusted based on the detection result of the second visual inspection component 150, which can further improve the bonding accuracy of the chip 20 and the substrate 30.

[0077] See also Figure 1 and Figure 3 It should be noted that the second visual inspection component 150 does not directly inspect the chip 20 located on the first carrier 110 and the substrate 30 located on the second carrier 120. The second visual inspection component 150 is used to inspect the chip 20 and the substrate 30 after the bonding head 161 picks up the chip 20. That is, when the second visual inspection component 150 inspects the chip 20 and the substrate 30, the first visual inspection component 130 and the first carrier 110 are in the avoidance position, and the chip 20 is located on the bonding head 161. Therefore, the first carrier and the first visual inspection component 130 will not block the light of the second visual inspection component 150.

[0078] See also Figure 8 and Fig. 9 In one embodiment, the second visual inspection component 150 includes a second camera 151 and a second prism group 152. The second camera 151 faces the second prism group 152. The second prism group 152 is used to refract the light of the second camera 151, and the first stage 110, the second stage 120 and the second prism group 152 are sequentially distributed along the first direction. Similar to the first prism group 132, the refraction of the light of the second camera 151 by the second prism group 152 can avoid the second camera 151 being directly arranged in the Z-axis direction, thereby reducing the size of the bonding alignment device 100 in the Z-axis direction.

[0079] The second prism group 152 includes a second vertical prism 152a. The second vertical prism 152a is used to refract the light of the second camera 151 from horizontal extension to vertical extension. In order to facilitate the flexible setting of the second camera 151, the second prism group 152 can also include a second horizontal prism (not shown, the same below).

[0080] It can be understood that the number of the second cameras 151 is two, and the number of the second prism groups 152 is also two. The two second cameras 151 and the two second prism groups 152 are arranged one by one to ensure that the second visual detection component 150 can completely detect the relative position of the chip 20 and the substrate 30. Figure 4 and Fig. 9 Middle dotted line M.

[0081] See also Figure 3 , the second camera 151 may extend along the Y-axis direction.

[0082] See also Figure 8 and Fig. 9 In one embodiment, the second visual inspection component 150 may further include a second fine-tuning mechanism 153. The second fine-tuning mechanism 153 is used to adjust the position of the second camera 151 so that the second camera 151 can clearly inspect the complete structure of the chip 20 and the substrate 30.

[0083] See also Figure 8 In a specific embodiment, the second carrier 120 can be directly disposed on the second prism group 152 .

[0084] In one embodiment, a heating component is provided on the second stage 120. The heating component is used to heat the substrate 30 to the eutectic temperature. A heating component is also provided on the bonding head 161, and the heating component on the bonding head 161 is used to heat the chip 20 to the eutectic temperature. At the eutectic temperature, the chip 20 can be bonded to the substrate 30.

[0085] In combination with the above embodiment, due to the refraction of the second camera 151 through the second prism group 152, the chip 20 and the substrate 30 can be detected at the same time. It can be understood that the refractive index of light is determined by the density of the optical medium, that is, it is determined by the second prism group 152 and the air density around it, and the above density is related to the temperature. For example, if the chip 20 and the substrate 30 are detected respectively by two different visual detection components, since the optical media of the two visual detection components are affected by temperature differently, the refractive index of light is different, so the detection results of the two visual detection components have different errors. In this embodiment, the chip 20 and the substrate 30 can be detected simultaneously only by the second visual detection component 150, which will not be affected by temperature. Thereby, the bonding accuracy of the chip 20 and the substrate 30 can be further improved.

[0086] The above embodiment is described by only taking the second visual inspection component 150 as an example. Since the first visual inspection component 130 can also inspect the chip 20 and the substrate 30 at the same time, it is the same as the above and will not be described again.

[0087] In one embodiment, a bonding method is provided. The bonding method can be used in the flip chip bonding machine 10 described in the above embodiments. The bonding method includes:

[0088] The chip 20 is mounted on the first stage 110, and the substrate 30 is mounted on the second stage 120;

[0089] The first visual inspection component 130 detects the positions of the first marking point on the chip and the second marking point on the substrate; that is, the first visual inspection component 130 detects the positions of the first marking point on the bonding surface and the second marking point on the matching surface, thereby determining the relative positions of the bonding surface and the matching surface.

[0090] The bonding head assembly 160 picks up the chip 20;

[0091] The position control device 200 adjusts the position of the chip 20 according to the detection result of the first visual detection component 130;

[0092] The bonding head assembly 160 drives the chip 20 to approach the substrate 30 so that the chip 20 is bonded to the substrate 30 .

[0093] Further, in one embodiment, after the position control device 200 adjusts the position of the chip 20 according to the detection result of the first visual detection component 130 and before the position control device 200 drives the chip 20 to approach the substrate 30, the bonding method further includes an avoidance step:

[0094] The driving assembly 140 drives the first stage 110 and the first visual inspection assembly 130 to move from the inspection station to the avoidance station.

[0095] Furthermore, in one embodiment, after the avoidance step and before the adjustment component 162 drives the chip 20 close to the substrate 30, the bonding method further includes a secondary adjustment step of the adjustment component 162:

[0096] The second visual inspection component 150 detects the positions of the first marking point on the fitting surface and the second marking point on the matching surface;

[0097] The position control device 200 further adjusts the positions of the bonding head 161 and the chip 20 according to the detection result of the second visual inspection component 150 .

[0098] In this way, by using the two detection results of the first visual detection component 130 and the second visual detection component 150 and cooperating with the position control device 200 to adjust the position of the chip 20 relative to the substrate 30 twice, the bonding accuracy of the chip 20 and the substrate 30 can be improved.

[0099] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0100] The above-mentioned embodiments only express several implementation methods of the present invention, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the invention patent. It should be pointed out that, for ordinary technicians in this field, several variations and improvements can be made without departing from the concept of the present invention, and these all belong to the protection scope of the present invention. Therefore, the protection scope of the patent of the present invention shall be subject to the attached claims.

Claims

1. A bonding alignment device for assisting the bonding of a chip and a substrate, characterized in that: The bonding alignment device comprises a bonding head assembly, a first carrier for carrying the chip, and a second carrier for carrying the substrate, wherein the bonding head assembly can pick up the chip and drive the chip to approach the substrate along a first direction; Wherein, the bonding alignment device further includes a driving component, a first visual detection component and a second visual detection component, the first carrier and the second carrier are made of light-transmitting materials, the first carrier is arranged on the first visual detection component, the first carrier, the first visual detection component, the second carrier and the second visual detection component are sequentially distributed along the first direction, the second visual detection component is used to detect the chip and the substrate after the bonding head picks up the chip, and the second visual detection component can detect the positions of the chip and the substrate at the same time; the driving component is connected to the first visual detection component to drive the first visual detection component to move between the detection station and the avoidance station; When the first visual inspection component is at the inspection station, the first stage, the first visual inspection component and the second stage are sequentially distributed along the first direction; When the first visual inspection component is at the avoidance position, there is a gap between the projection of the first visual inspection component on the second stage along the first direction and the second stage.

2. The bonding alignment device according to claim 1, characterized in that: The driving component is connected to the first carrier and / or the second carrier, and the driving component can drive the first carrier and / or the second carrier to move along a second direction, and the second direction intersects with the first direction.

3. The bonding alignment device according to claim 2, characterized in that: The first direction is perpendicular to the second direction.

4. The bonding alignment device according to claim 2, characterized in that: The driving assembly includes a driving member, a guide rail, and a slide table slidably matched with the guide rail, the guide rail extends along the second direction, and the first visual detection assembly is arranged on the slide table.

5. The bonding alignment device according to claim 1, characterized in that: The first visual inspection component includes a first camera and a first prism group. The first camera faces the first prism group. The first carrier, the first prism group and the second carrier are distributed in sequence along the first direction. The first prism group is used to refract the light of the first camera so that the first camera can simultaneously photograph the chip and the substrate.

6. The bonding alignment device according to claim 5, characterized in that: There are two first cameras and two first prism groups. The two first cameras and the two first prism groups are arranged in a one-to-one correspondence with each other, so that the two first cameras can simultaneously and cooperatively photograph the chip and the substrate.

7. The bonding alignment device according to claim 5, characterized in that: The first carrier is arranged on the first prism group.

8. The bonding alignment device according to claim 1, characterized in that: The first carrier is hollow.

9. The bonding alignment device according to claim 1, characterized in that: The second visual detection component includes a second camera and a second prism group. The second camera faces the second prism group. The second prism group is used to refract the light of the second camera. The first stage, the second stage and the second prism group are distributed in sequence along the first direction.

10. The bonding alignment device according to claim 1, characterized in that: The second carrier is provided with a heating component, and the heating component can heat the substrate to the eutectic temperature.

11. A flip chip bonding machine for bonding a chip to a substrate, characterized in that: include: The bonding alignment device according to any one of claims 2 to 10; A position control device is connected to the bond head assembly, and the position control device can adjust the spatial position of the bond head assembly.

12. A bonding method of a flip chip bonder according to claim 11, characterized in that: The bonding method comprises: Mounting the chip on the first stage and mounting the substrate on the second stage; The first visual detection component detects the relative position of the first marking point on the chip and the second marking point on the substrate; The bonding head picks up the chip; The adjusting component adjusts the positions of the bonding head and the chip according to the detection result of the first visual detection component; The position control device drives the chip to approach the substrate so that the chip is bonded to the substrate.

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