Substrate bonding apparatus and substrate bonding method

Abstract

The present application provides a substrate bonding apparatus and a substrate bonding method, and more particularly to a substrate bonding apparatus and a substrate bonding method for reducing bonding failure of a substrate when bonding substrates to each other.

Description

Technical Field

[0001] The present invention relates to a substrate bonding device and a substrate bonding method, and more particularly to a substrate bonding device and a substrate bonding method for reducing bonding defects of substrates when bonding substrates to each other. Background Art

[0002] With recent technological and industrial advancements, the demand for higher integration in semiconductor devices and substrates (hereinafter referred to as "substrates") has increased. This situation presents challenges in increasing wiring length, impedance, and delay when these highly integrated substrates are arranged horizontally and connected via wiring.

[0003] Therefore, a three-dimensional integration technology using three-dimensionally stacked substrates has been proposed. In this three-dimensional integration technology, for example, a bonding device is used to bond two upper and lower substrates.

[0004] In order to bond the upper substrate and the lower substrate, it is important to align the upper substrate and the lower substrate, and for this purpose, in the case of a related art device, there are an upper camera and a lower camera.

[0005] The upper camera recognizes the lower substrate and calculates its coordinates. The lower camera recognizes the upper substrate and calculates its coordinates. The upper and lower substrates are moved along the coordinates and arranged.

[0006] However, in conventional devices, when the upper and lower cameras are precisely aligned on a vertical line, no coordinate error occurs between the upper and lower substrates. However, in conventional devices, repeated horizontal and vertical movement of the upper and lower cameras can cause misalignment or distortion in their vertical arrangement, leading to frequent coordinate errors.

[0007] Furthermore, in the prior art device, the vertical arrangement of the upper camera and the lower camera depends on the manual operation of the operator, and the deviation of the vertical arrangement may occur greatly depending on the operator's proficiency. Moreover, the efficiency of the joining device is greatly reduced by manual vertical arrangement. Summary of the Invention

[0008] Technical problem to be solved by the invention

[0009] The present invention is designed to solve the above-mentioned problem, and its purpose is to provide a substrate bonding device and a substrate bonding method. In the substrate bonding device for bonding substrates to each other, a vertical arrangement step of a camera unit for vertically arranging and identifying sorting keys of the substrates is performed to reduce the coordinate error of the sorting keys.

[0010] Technical solutions to solve problems

[0011] The object of the present invention as described above is achieved by a substrate bonding device, which includes: a cavity; a first chuck, which is arranged inside the cavity and adsorbs the first substrate; a second chuck, which is arranged inside the cavity so as to face the first chuck and is arranged to move relative to the first chuck in vertical and horizontal directions so as to adsorb the second substrate; and an arrangement module, which has a camera unit for identifying a first sorting key of the first substrate and a second sorting key of the second substrate, and is provided with a frame that can move up and down.

[0012] In this case, the camera unit is arranged so as to be movable relative to the frame.

[0013] Furthermore, the camera unit can be moved horizontally and tilted in the frame.

[0014] Moreover, the frame includes: a pair of vertical components, which are arranged at a predetermined interval; a pair of horizontal components, which connect the upper and lower ends of the vertical components to each other and are used to set the camera unit, wherein at least one of the pair of horizontal components can be moved up and down relative to the vertical component.

[0015] In addition, the camera unit includes: a first camera unit, which recognizes the second sort key; and a second camera unit, which recognizes the first sort key and is arranged opposite to the first camera unit.

[0016] Also, the pair of horizontal members includes a first horizontal member and a second horizontal member, the first camera unit is disposed at the first horizontal member, and the second camera unit is disposed at the second horizontal member.

[0017] In addition, the camera unit is provided with: a movable plate capable of being moved horizontally relative to the frame; an identification camera provided on the movable plate to identify the first sorting key or the second sorting key; and a sorting camera for arranging the movable plate.

[0018] Furthermore, the movable plate can be arranged obliquely relative to the frame.

[0019] Furthermore, the movable plate is provided with a camera sorting key for identifying cameras by sorting the relative camera units.

[0020] Furthermore, a hollow portion is formed in the center of the frame so that the first chuck and the second chuck can move.

[0021] In addition, the object of the present invention as described above relates to a substrate bonding method including a frame; a substrate bonding device in which a first camera unit and a second camera unit are arranged on the frame, the substrate bonding method including the following steps: using the second camera unit to identify the first sorting key of the first substrate; using the first camera unit to identify the second sorting key of the second substrate; and arranging the first substrate and the second substrate for bonding, and in addition, before the step of identifying the first sorting key, or between the step of identifying the first sorting key and the step of identifying the second sorting key, or after the step of identifying the second sorting key, a vertical arrangement step of arranging the first camera unit and the second camera unit in a vertical direction is included.

[0022] Furthermore, the first camera unit and the second camera unit can be arranged in a horizontally movable and tilted manner relative to the frame. In the vertical arrangement step, the first camera unit and the second camera unit are arranged in a vertical direction by horizontally moving or tilting the first camera unit and the second camera unit.

[0023] Moreover, between the step of identifying the first sort key and the step of identifying the second sort key, a step of moving the first camera unit and the second camera unit up and down is included.

[0024] Furthermore, between the step of identifying the first sort key and the step of identifying the second sort key, the method further includes moving at least one of the first camera unit and the second camera unit up and down.

[0025] Effects of the Invention

[0026] According to the present invention having the above-described structure, in a substrate bonding apparatus for bonding substrates to each other, a vertical aligning step of vertically aligning camera units for recognizing sort keys of substrates is performed to reduce coordinate errors of sort keys. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1 A side view of a substrate bonding apparatus according to an embodiment of the present invention;

[0028] Figure 2 To display Figure 1 A perspective view of the internal structure of the substrate bonding device shown;

[0029] Figure 3 A plan view showing a first substrate;

[0030] Figure 4 It is the front view and three-dimensional view of the arrangement module;

[0031] Figure 5a perspective view showing a state of the camera unit installed in the frame;

[0032] Figure 6 a perspective view showing a state of the camera unit of another embodiment;

[0033] Figure 7 a side view showing a state of identifying a first sorting key of a first substrate;

[0034] Figure 8 a side view showing a state of vertically arranging the first camera unit and the second camera unit to transfer the first substrate;

[0035] Figure 9 and Figure 10 a perspective view showing a method of vertically arranging the camera unit;

[0036] Figure 11 a side view showing a state of moving the arrangement module upward to identify a second substrate;

[0037] Figure 12 a side view showing a state of identifying a second sorting key of the second substrate;

[0038] Figure 13 a side view showing a case where the first horizontal member is raised;

[0039] Figure 14 a side view showing a state of joining the first substrate and the second substrate to transfer the second substrate.

[0040] BRIEF DESCRIPTION OF DRAWINGS

[0041] 100: cavity

[0042] 200: joining module

[0043] 210: frame

[0044] 300: camera unit

[0045] 410, 420: driving part

[0046] 1000: joining apparatus DETAILED DESCRIPTION

[0047] Hereinafter, the structure of a substrate joining apparatus and a substrate joining method according to an embodiment of the present application will be described in detail with reference to the accompanying drawings.

[0048] Figure 1 a side view of a substrate joining apparatus 1000 according to an embodiment of the present application, Figure 2 a perspective view showing Figure 1 an internal structure of the substrate joining apparatus 1000.

[0049] Referring to Figure 1 and Figure 2 , the substrate bonding apparatus 1000 includes: a cavity 100; a first chuck 520 provided inside the cavity 100 to attract a first substrate 10; a second chuck 510 provided inside the cavity 100 in a manner to face the first chuck 520, provided to relatively move in a vertical and horizontal direction with respect to the first chuck 520, and to attract a second substrate 20; and an alignment module 200 having a camera unit 300A, 300B, 300C, 300D to recognize a first alignment key 12 of the first substrate 10 and a second alignment key 22 of the second substrate 20, and including a frame 210 provided to be vertically movable.

[0050] The cavity 100 provides a space 102 to accommodate the first substrate 10 and the second substrate 20 inside. The cavity 100 is composed of, for example, a cavity main body (not shown) and a cavity guide (not shown) to seal an upper portion of an opening of the cavity main body. The structure of the cavity 100 is merely for illustration, and can be appropriately modified.

[0051] The first chuck 520 and the second chuck 510 are provided inside the cavity 100 to attract and fix the substrates 10, 20 to be bonded to each other. The first chuck 520 and the second chuck 510 are implemented by a vacuum chuck, an electrostatic chuck, a mechanical clamping chuck, etc., and hereinafter, a case where the first chuck 520 and the second chuck 510 are composed of a vacuum chuck will be described.

[0052] The first chuck 520 is disposed inside the cavity 100 at an inner lower portion of the alignment module 200, and attracts and fixes the first substrate 10 introduced into the inside of the cavity 100 by a robot (not shown) or the like.

[0053] Figure 3 to show a plan view of the first substrate 10.

[0054] Referring to Figure 3 , the first substrate 10 is formed with a pattern 14 on an upper surface or a first surface, and is formed with a first alignment key 12 to be bonded to the second substrate 20. The first alignment key 12 is provided in a plurality of numbers, and is symmetrically disposed about a central portion of the substrate in order to accurately align the substrates. The number and the position of the first alignment key 12 can be appropriately modified. In addition, the second substrate 20 is omitted from repeated description because it has the same structure as the first substrate 10.

[0055] Referring again to Figure 1 and Figure 2 , the first chuck 520 attracts and fixes a second surface of the first substrate 10, i.e., a second surface on which the pattern 14 is not formed, by negative pressure.

[0056] Furthermore, a second chuck 510 is disposed within the chamber 100 at the inner upper portion of the alignment module 200. The second chuck 510 is disposed toward the first chuck 520. Specifically, the second chuck 510 is disposed opposite the first chuck 520 and is movable vertically and horizontally relative to the first chuck 520. For example, both the first chuck 520 and the second chuck 510 are movable vertically and horizontally.

[0057] The second substrate 20 is introduced into the cavity 100 upside down, with the first surface of the second substrate 20, which forms the second sorting key 22, facing downward. The second chuck 510 suction-holds the second surface of the second substrate 20, which does not form the second sorting key 22. In this case, the second sorting key 22 of the second substrate 20 is positioned toward the first substrate 10.

[0058] In addition, an arrangement module 200 including camera units 300A, 300B, 300C, and 300D is provided inside the cavity 100 .

[0059] The camera units 300A, 300B, 300C, and 300D recognize the first sort key 12 of the first substrate 10 and the second sort key 22 of the second substrate 20. In this case, the arrangement module 200 includes a frame 210 on which the camera units 300A, 300B, 300C, and 300D are mounted.

[0060] That is, in the present invention, the camera units 300A, 300B, 300C, and 300D are arranged on the frame 210 to prevent misalignment or twisting of the camera units 300A, 300B, 300C, and 300D to the greatest extent possible.

[0061] Furthermore, the frame 210 is arranged to move up and down. To this end, driving parts 410 and 420 are arranged inside the cavity 100, and the driving parts 410 and 420 are connected to the frame 210 to move up and down.

[0062] When the frame 210 moves up and down, the camera units 300A, 300B, 300C, and 300D mounted on the frame 210 move together, thereby minimizing misalignment between the camera units 300A, 300B, 300C, and 300D.

[0063] In this case, the camera units 300A, 300B, 300C, and 300D include: first camera units 300A and 300B, which identify the second sorting key 22 of the second substrate 20; second camera units 300C and 300D, which identify the first sorting key 12 of the first substrate 10 and are configured opposite to the first camera units 300A and 300B.

[0064] The first camera units 300A and 300B are provided as a pair and are positioned at the bottom of the frame 210 and facing upward, as shown in the drawings. Furthermore, the second camera units 300C and 300D are also provided as a pair and are positioned at the top of the frame 210 and facing downward, as shown in the drawings.

[0065] Figure 4 2 are a front view and a three-dimensional view of the arrangement module 200 . Figure 4 (A) is a front view of the arrangement module 200, Figure 4 (B) is a three-dimensional diagram of the arrangement module 200.

[0066] Reference Figure 4 The frame 210 of the arrangement module 200 includes a pair of vertical members 213 and 214 spaced apart at a predetermined interval, and a pair of horizontal members 211 and 212 interconnecting the upper and lower ends of the vertical members 213 and 214. In this case, at least one of the horizontal members 211 and 212 is movable vertically relative to the vertical members 213 and 214.

[0067] For example, the first horizontal member 212 at the bottom can be arranged to be vertically movable relative to the pair of vertical members 213 and 214, or the second horizontal member 211 at the top can be arranged to be vertically movable relative to the pair of vertical members 213 and 214. Furthermore, both the first horizontal member 212 and the second horizontal member 211 can be arranged to be vertically movable relative to the pair of vertical members 213 and 214. The following description assumes that the first horizontal member 212 is arranged to be vertically movable.

[0068] Furthermore, the first camera units 300A and 300B are mounted on the first horizontal member 212, and the second camera units 300C and 300D are mounted on the second horizontal member 211. The first camera units 300A and 300B are positioned upward on the first horizontal member 212. The pair of first camera units 300A and 300B are spaced apart by a predetermined distance.

[0069] Furthermore, the second camera units 300C and 300D are disposed downwardly on the lower surface of the second horizontal member 211. The pair of second camera units 300C and 300D are spaced apart from each other by a predetermined interval.

[0070] As described above, the frame 210 itself moves vertically to adjust the focal length of the first camera units 300A, 300B or the second camera units 300C, 300D. However, the interior of the substrate bonding apparatus 1000 is generally relatively small, and due to other components, the vertical movement distance of the frame 210 is insufficient. In this case, the horizontal members 211, 212 move vertically in conjunction with the vertical movement of the frame 210 to adjust the focal length.

[0071] Furthermore, the distance between the pair of first camera units 300A and 300B is the same as the distance between the pair of second camera units 300C and 300D. Since the first camera units 300A and 300B and the second camera units 300C and 300D are arranged perpendicular to each other, the coordinates of the first sort key 12 and the second sort key 22 can be accurately recognized.

[0072] Furthermore, an opening 220 is formed in the center of the alignment module 200. Specifically, the opening 220 is formed in the center of the pair of vertical members 213, 214 and the horizontal members 211, 212. The first chuck 520 and the second chuck 510 are arranged to move horizontally through the opening 220.

[0073] Furthermore, as described above, when the first camera units 300A, 300B and the second camera units 300C, 300D are mounted on the frame 210, repeated vertical movement of the frame 210 or the vertical movement of the horizontal members 211, 212 may cause vertical positional errors or twisting of the first camera units 300A, 300B, 300C, 300D. In this case, errors may occur in the coordinate values ​​of the sort keys on the first and second substrates 10, 20, ultimately leading to misalignment of the first and second substrates 10, 20 and resulting in bonding failure.

[0074] Therefore, in the present invention, to address this issue, the camera units 300A, 300B, 300C, and 300D are configured to be movable relative to the frame 210. For example, the camera units 300A, 300B, 300C, and 300D are configured to be horizontally movable and tilted relative to the frame 210. When the camera units 300A, 300B, 300C, and 300D are configured to be movable relative to the frame 210, the first camera units 300A, 300B and the second camera units 300C, 300D can be arranged vertically, thereby addressing the aforementioned issue.

[0075] Figure 5 It is a perspective view showing a state where the first camera units 300A and 300B are mounted on the frame 210 . Figure 5 (A) shows a pair of first camera units 300A, 300B provided on the frame 210, Figure 5 (B) shows one first camera unit 300A of the pair of first camera units 300A, 300B.

[0076] Reference Figure 5 The first camera unit 300A includes: a movable plate 310A, which can be moved in a horizontal direction relative to the frame 210; a first recognition camera 320A, which is set on the movable plate 310A to recognize the second sorting key 22; and a first sorting camera 330A, which is used for the arrangement of the movable plate 310A.

[0077] The movable plate 310A is disposed inside the recessed portion 210A of the first horizontal member 212. The movable plate 310A can also protrude from the first horizontal member 212, but in this embodiment, the movable plate 310A is inserted into the recessed portion 210A. In this case, the top surface of the movable plate 310A is flush with the top surface of the first horizontal member 212.

[0078] Furthermore, the movable plate 310A is arranged to be movable horizontally relative to the frame 210. For example, the movable plate 310A is arranged within the recessed portion 210A so as to be linearly movable horizontally along the x-axis and the y-axis. To this end, the recessed portion 210A is further formed in a planar direction relative to the movable plate 310A, with the x-axis and the y-axis being the orientations. This provides the movable plate 310A with sufficient space for movement along the x-axis and the y-axis.

[0079] The movable plate 310A is moved in the horizontal direction by a horizontal direction driving unit (not shown) composed of a linear motor, a piezo actuator, etc. The structure of the horizontal direction driving unit can be implemented in various forms.

[0080] In addition, the movable plate 310A can be tilted relative to the frame 210. For example, the movable plate 310A can be tilted about at least one of the x-axis and the y-axis.

[0081] The movable plate 310A can be tilted by a rotation drive unit (not shown). The rotation drive unit can be implemented in various forms.

[0082] In addition, a first recognition camera 320A for recognizing the second sort key 22 is provided on the moving plate 310A.

[0083] The first recognition camera 320A recognizes the second sort key 22 of the second substrate 20. Figure 4 As shown, the second recognition cameras 320C, 320D of the second camera units 300C, 300D recognize the first sort key 12 of the first substrate 10 .

[0084] Furthermore, when bonding the first substrate 10 and the second substrate 20, extremely high precision is required, and therefore the magnification of the recognition cameras 320A, 320B, 320C, and 320D is relatively high. In this case, the higher the magnification, the shorter the focal length.

[0085] Therefore, if Figure 4 As shown, when the first camera units 300A, 300B and the second camera units 300C, 300D are arranged vertically, it is difficult for the recognition cameras 320A, 320B, 320C, 320D to recognize the opposing camera units and arrange them.

[0086] Therefore, in this embodiment, sorting cameras 330A, 330B, 330C, and 330D are provided in the camera units 300A, 300B, 300C, and 300D. These sorting cameras 330A, 330B, 330C, and 330D are used to vertically align the first camera units 300A, 300B and the second camera units 300C and 300D. In this case, the sorting cameras 330A, 330B, 330C, and 330D have a relatively lower magnification than the recognition cameras 320A, 320B, 320C, and 320D, and recognize the opposing camera units with a longer focal length.

[0087] For example, Figure 4 and Figure 5 As shown, the first sequencing cameras 330A, 330B are arranged opposite to the second sequencing cameras 330C, 330D of the corresponding second camera units 300C, 300D. In this case, the first sequencing cameras 330A, 330B and the second sequencing cameras 330C, 330D recognize each other, thereby allowing at least one of the first camera units 300A, 300B and the second camera units 300C, 300D to be horizontally moved or tilted so that the first camera units 300A, 300B and the second camera units 300C, 300D are accurately aligned vertically.

[0088] The second camera units 300C and 300D, which are opposite to the first camera units 300A and 300B, have the same structure as the first camera units 300A and 300B described above, and therefore repeated descriptions thereof will be omitted.

[0089] in addition, Figure 6 A first camera unit 3000A according to another embodiment is shown. Figure 6 (A) is a plan view of the first camera unit 3000A, Figure 6 (B) is a side view showing the configuration of the first camera unit 3000A and the second camera unit 3000B.

[0090] Reference Figure 6 Compared with the above embodiments, the first camera unit 3000A of this embodiment further provides a first camera sort key 3400A.

[0091] That is, the first camera unit 3000A is provided with a first recognition camera 3200A, a first sorting camera 3300A, and a first camera sorting key 3400A on a movable plate 3100A.

[0092] The first camera ranking key 3400A is identified by the second ranking camera 3300B of the second camera unit 3000B, which is the opposite camera unit. Furthermore, the second camera ranking key 3400B of the second camera unit 3000B is identified by the first ranking camera 3300A of the first camera unit 3000A.

[0093] like Figure 6 As shown in (B), the first ranking camera 3300A of the first camera unit 3000A is arranged opposite to the second ranking camera key 3400B of the second camera unit 3000B. In addition, the first ranking camera key 3400A of the first camera unit 3000A is arranged opposite to the second ranking camera 3300B of the second camera unit 3000B.

[0094] Therefore, the first sorting camera 3300A recognizes the second camera sorting key 3400B to detect coordinates, and the second sorting camera 3300B recognizes the first camera sorting key 3400A to detect coordinates.

[0095] After detecting the coordinates of the first camera sort key 3400A and the second camera sort key 3400B, at least one of the first camera unit 3000A or the second camera unit 3000B is horizontally moved or tilted to align the vertical directions of the first camera unit 3000A and the second camera unit 3000B.

[0096] Next, a method of bonding substrates using the substrate bonding apparatus 1000 having the above-described structure will be studied.

[0097] First, the substrate bonding method includes the following steps: using the second camera units 300C and 300D to identify the first sorting key 12 of the first substrate 10; using the first camera units 300A and 300B to identify the second sorting key 22 of the second substrate 20; and arranging the first substrate 10 and the second substrate 20 for bonding.

[0098] In this case, the substrate bonding method includes a vertical alignment step of aligning the first camera units 300A and 300B and the second camera units 300C and 300D in a vertical direction. This vertical alignment step is performed before the step of identifying the first sort key 12, between the step of identifying the first sort key 12 and the step of identifying the second sort key 22, or after the step of identifying the second sort key 22. The following discusses the case where the vertical alignment step is performed between the step of identifying the first sort key 12 and the step of identifying the second sort key 22.

[0099] Figure 7 1 is a side view showing the state of the first sort key 12 for identifying the first substrate 10. Figure 7 As shown, within the cavity 100, with the alignment module 200 as a reference, the right side corresponds to the loading area 106 of the first chuck 520 and the second chuck 510, where the first substrate 10 and the second substrate 20 are loaded, respectively. The left side of the alignment module 200 corresponds to the bonding area 104 where the first substrate 10 and the second substrate 20 are bonded. This area division is for convenience only and is subject to change.

[0100] Reference Figure 7 In the loading area 106, the first substrate 10 is sucked and fixed on the upper portion of the first chuck 520. Furthermore, the first chuck 520 is inserted into the hollow portion 220 of the alignment module 200. In this case, the second chuck 510 is separated from the alignment module 200 and waits in the bonding area 104.

[0101] In addition, when the first chuck 520 is inserted into the hollow portion 220 , the first sort key 12 of the first substrate 10 is recognized by the second camera unit 300C.

[0102] Furthermore, if Figure 8 As shown, the first chuck 520 is moved in a horizontal direction in the arrangement module 200 to the bonding area 104 .

[0103] After the first chuck 520 is separated from the alignment module 200 , a vertical alignment step of aligning the first camera unit 300A and the second camera unit 300C in a vertical direction is performed.

[0104] In this case, the first sorting camera 330A of the first camera unit 300A and the second sorting camera 330C of the second camera unit 300C recognize each other and detect coordinates to move the first camera unit 300A and the second camera unit 300C horizontally or tilt them to arrange them vertically.

[0105] Figure 9 and Figure 10 FIG. 1 is a diagram showing a step of vertically arranging the first camera unit 300A and the second camera unit 300C.

[0106] like Figure 9 As shown in (A), in the case where the first camera unit 300A and the second camera unit 300C recognize each other, the first camera unit 300A and the second camera unit 300C deviate from the vertical line and a distance error occurs along the horizontal plane.

[0107] In this case, at least one of the first camera unit 300A and the second camera unit 300C is moved horizontally. Figure 9 As shown in (B), the first camera unit 300A and the second camera unit 300C are arranged on a vertical line and arranged in the vertical direction.

[0108] And, as Figure 10 As shown in (A), in the case where the first camera unit 300A and the second camera unit 300C recognize each other, at least one of the first camera unit 300A and the second camera unit 300C is twisted on the vertical line and an angular error occurs in the vertical direction.

[0109] In this case, at least one of the first camera unit 300A and the second camera unit 300C is tilted, such as Figure 10 As shown in (B), the first camera unit 300A and the second camera unit 300C are arranged on a vertical line and arranged in the vertical direction.

[0110] In addition, the first sort key 12 is identified and the coordinates are detected. Before identifying the second sort key 22, the coordinate errors of the first sort key 12 and the second sort key 22 are reduced by performing a vertical arrangement of the first camera unit 300A and the second camera unit 300C when detecting the coordinates of the second sort key 22.

[0111] Furthermore, if Figure 11 As shown, the second chuck 510 moves to the loading area 106 and sucks and fixes the second substrate 20. In this case, the second substrate 20 is turned upside down and the second sort key 22 is arranged downward.

[0112] Then, a vertical movement step is performed in which the frame 210 moves up and down by a predetermined distance.

[0113] That is, as shown above, the first recognition camera 320A of the first camera unit 300A and the second recognition camera 320B of the second camera unit 300C have relatively short focal lengths and recognize the first sort key 12 . Thereafter, in order to recognize the second sort key 22 , the first camera unit 300A needs to rise toward the second substrate 20 .

[0114] In this case, the first camera unit 300A and the second camera unit 300C provided on the frame 210 move up and down together with the frame 210 .

[0115] After the frame 210 moves up and down, as shown in FIG. Figure 12As shown, the second chuck 510 is inserted into the hollow portion 220 of the arrangement module 200 .

[0116] When the second chuck 510 is inserted into the hollow portion 220 , the second sort key 22 of the second substrate 20 is recognized by the first camera unit 300A.

[0117] in addition, Figure 13 The first horizontal component 212 is shown to be moving upward.

[0118] Reference Figure 13 When the frame 210 moves up and down and cannot match the focal length of the first recognition camera 320A of the first camera unit 300A, the first horizontal member 212 moves up and down to match the focal length.

[0119] In this embodiment, the vertical movement of the first horizontal member 212 is described. As shown above, at least one of the first horizontal member 212 and the second horizontal member 211 is moved vertically. Therefore, at least one of the first camera units 300A, 300B and the second camera units 300C, 300D is moved vertically to match the focal lengths.

[0120] Furthermore, if Figure 14 As shown, the second chuck 510 is transferred to the bonding area 104. In this case, the first chuck 520 is already waiting in the bonding area.

[0121] Therefore, after the second chuck 510 is moved to the upper part of the first chuck 520, the first chuck 520 and the second chuck 510 are precisely arranged by the coordinates of the first sort key 12 and the second sort key 22, and then the second chuck 510 is moved downward to join the first substrate 10 and the second substrate 20.

[0122] In addition, when the vertical arrangement step is performed before the step of identifying the first sort key 12 , the coordinate error between the first sort key 12 and the second sort key 22 can also be reduced.

[0123] Furthermore, in the case where the vertical alignment step is performed after the step of identifying the second sort key 22, the vertical alignment step is performed after the coordinates of the first sort key 12 and the second sort key 22 are detected in advance. Therefore, in this case, the vertical alignment step calculates the accurate coordinates of the first sort key 12 and the second sort key 22 by correcting the coordinates of the first sort key 12 and the second sort key 22 based on the horizontal movement or tilt of the first camera unit 300A, 300B or the second camera unit 300C, 300D.

[0124] In summary, the present invention has been described with reference to preferred embodiments. However, those skilled in the art will be able to make various modifications and variations to the present invention without departing from the spirit and scope of the present invention as set forth in the claims. Therefore, to the extent that such variations substantially encompass the constituent elements of the present invention as set forth in the claims, they should be deemed to be fully encompassed within the technical scope of the present invention.

Claims

1. A substrate bonding device, characterized in that: include: cavity; A first chuck is disposed inside the cavity to absorb the first substrate; A second chuck is disposed inside the cavity in a manner facing the first chuck and is disposed to move relative to the first chuck in vertical and horizontal directions to adsorb the second substrate; and an arrangement module, provided with a camera unit for identifying the first sorting key of the first substrate and the second sorting key of the second substrate, and comprising a frame capable of moving up and down, The camera unit settings: A movable plate capable of being moved horizontally relative to the frame; an identification camera, disposed on the movable plate and configured to identify the first sort key or the second sort key; and A sorting camera is used for the arrangement of the moving plates.

2. The substrate bonding device according to claim 1, wherein: The camera unit is movably arranged relative to the frame.

3. The substrate bonding device according to claim 1, wherein: The camera unit can be moved horizontally and tilted on the frame.

4. The substrate bonding device according to claim 3, wherein: The framework includes: A pair of vertical components, separated and arranged at a predetermined interval; A pair of horizontal members interconnecting the upper and lower ends of the vertical members and for mounting the camera unit. At least one of the pair of horizontal members is arranged to be movable up and down relative to the vertical member.

5. The substrate bonding apparatus according to any one of claims 1 to 4, wherein: The camera unit comprises: a first camera unit that identifies the second sort key; The second camera unit recognizes the first sort key and is arranged opposite to the first camera unit.

6. The substrate bonding device according to claim 5, wherein: The pair of horizontal members includes a first horizontal member and a second horizontal member, The first camera unit is disposed on the first horizontal member, and the second camera unit is disposed on the second horizontal member.

7. The substrate bonding device according to claim 1, wherein: The movable plate can be arranged obliquely relative to the frame.

8. The substrate bonding device according to claim 7, wherein: The mobile plate is also provided with: Camera sort key, identifies the camera by sorting it relative to the camera unit.

9. The substrate bonding device according to claim 4, wherein: A hollow portion is formed in the center of the frame so that the first chuck and the second chuck can move.

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