A chip packaging structure and a manufacturing method thereof

Abstract

An embodiment of the present invention provides a chip packaging structure and a manufacturing method thereof. The manufacturing method of the chip packaging structure includes: attaching a chip-glass combined structure to a substrate; interconnecting the chip-glass combined structure and the substrate through a metal lead circuit; and performing plastic encapsulation to form a plastic encapsulation layer that wraps the chip-glass combined structure and the metal lead. An embodiment of the present invention provides a chip packaging structure and a manufacturing method thereof, which increase the chip encapsulation volume, extend the path for water vapor to enter the photosensitive area chamber, reduce the possibility of device failure caused by vibration, reduce the possibility of water vapor entering the photosensitive area chamber, and increase the reliability of the chip packaging structure.

Description

Technical Field

[0001] The present invention relates to chip packaging technology, and in particular to a chip packaging structure and a manufacturing method thereof. Background Art

[0002] With the continuous development of driverless technology, the demand for in-vehicle image sensors is increasing day by day, and high-reliability image sensors are in short supply. As a key chip in vehicles, an image sensor can convert image signals during driving into electrical signals, and a central module analyzes and processes the electrical signals to meet the requirements of in-vehicle driverless driving. Since the in-vehicle image sensor chip is closely related to human safety, its reliability is crucial. It is necessary to provide reliable packaging protection for the image sensor to prevent water vapor from entering the cavity structure of the photosensitive area, causing corrosion of metal bumps and contamination of the photosensitive area, which will affect the imaging performance and reliability of the image sensor.

[0003] In the known technology, glass and a wafer are bonded together by using an epoxy resin adhesive, and the material of the dam is a negative photoresist. For in-vehicle chips, vibration is an important cause of device failure. However, the cured physical properties of the epoxy resin adhesive are brittle and it has poor resistance to mechanical shock. During continuous mechanical vibration, cracks are likely to occur between the epoxy resin adhesive and the negative photoresist. In addition, since in-vehicle chips are in a low-humidity environment for a long time, water vapor will enter the cavity of the photosensitive area along the cracks, resulting in poor imaging effects or even damage. Summary of the Invention

[0004] An embodiment of the present invention provides a chip packaging structure and a manufacturing method thereof, which increase the chip coating volume, extend the path for water vapor to enter the photosensitive area chamber, reduce the possibility of device failure caused by vibration, reduce the possibility of water vapor entering the photosensitive area chamber, and increase the reliability of the chip packaging structure.

[0005] In a first aspect, an embodiment of the present invention provides a manufacturing method of a chip packaging structure, including:

[0006] Attaching a chip-glass combined structure to a substrate;

[0007] Interconnecting the chip-glass combined structure and the substrate through a metal lead circuit;

[0008] Performing plastic packaging to form a plastic packaging layer that wraps the chip-glass combined structure and the metal lead.

[0009] Optionally, before performing plastic packaging to form a plastic packaging layer that wraps the chip-glass combined structure and the metal lead, it further includes:

[0010] Installing a light-transmitting area protection frame on one side of the substrate where the chip-glass combined structure is attached.

[0011] Optionally, after encapsulation is performed to form an encapsulation layer that wraps the chip - glass combined structure and the metal leads, the following steps are further included:

[0012] Thin the side of the encapsulation layer away from the substrate to expose the chip - glass combined structure.

[0013] Optionally, after encapsulation is performed to form an encapsulation layer that wraps the chip - glass combined structure and the metal leads, the following steps are further included:

[0014] Ball - attach on the side of the substrate away from the chip - glass combined structure.

[0015] Optionally, before attaching the chip - glass combined structure to the substrate, the following steps are further included:

[0016] Provide a finished wafer, where the finished wafer includes at least one chip;

[0017] Attach a photosensitive dry film to the side of the chip where the photosensitive area is provided;

[0018] Lithograph the photosensitive dry film to form a cofferdam support, exposing the photosensitive area;

[0019] Attach the finished glass in a manner that covers the photosensitive area to the cofferdam support.

[0020] Optionally, after attaching the finished glass in a manner that covers the photosensitive area to the cofferdam support, the following steps are further included:

[0021] Thin the side of the chip away from the photosensitive area.

[0022] Optionally, after attaching the finished glass in a manner that covers the photosensitive area to the cofferdam support, the following steps are further included:

[0023] Attach a DAF film to the side of the chip away from the photosensitive area.

[0024] Optionally, after attaching the finished glass in a manner that covers the photosensitive area to the cofferdam support, the following steps are further included:

[0025] Cut the chip along the scribe line to form a single chip - glass combined structure.

[0026] Optionally, before attaching the photosensitive dry film to the side of the chip where the photosensitive area is provided, the following steps are further included:

[0027] Thin the side of the chip away from the photosensitive area.

[0028] In a second aspect, an embodiment of the present invention provides a chip packaging structure, including:

[0029] A substrate;

[0030] A chip - glass combined structure is located on one side of the substrate and is interconnected with the substrate through a metal lead circuit;

[0031] A plastic encapsulation layer is located on the side of the substrate where the chip - glass combined structure is provided, and wraps the chip - glass combined structure and the metal leads.

[0032] Optionally, it further includes a light - transmissive area protection frame. The light - transmissive area protection frame is located on the side of the chip - glass combined structure away from the substrate and is at least partially wrapped by the plastic encapsulation layer.

[0033] Optionally, it further includes a connection structure. The connection structure is located on the side of the substrate away from the chip - glass combined structure.

[0034] Optionally, the chip - glass combined structure includes: a chip, a dam - type support, and a finished glass;

[0035] The chip is provided with a photosensitive area;

[0036] The dam - type support is arranged around the photosensitive area and is located between the chip and the finished glass.

[0037] Optionally, the chip - glass combined structure further includes a DAF film. The DAF film is located between the chip and the substrate.

[0038] A method for manufacturing a chip packaging structure provided by an embodiment of the present invention includes attaching a chip - glass combined structure to a substrate, interconnecting the chip - glass combined structure and the substrate through a metal lead circuit, and performing plastic encapsulation to form a plastic encapsulation layer that wraps the chip - glass combined structure and the metal leads. By combining the wafer - level and system - level methods, it increases the chip - coating volume, extends the path of water vapor entering the photosensitive area chamber, reduces the possibility of device failure caused by vibration, decreases the possibility of water vapor entering the photosensitive area chamber, increases the reliability of the chip packaging structure, reduces the process of manufacturing the chip packaging structure, and lowers the manufacturing cost. Description of the Drawings

[0039] Figure 1 It is a flowchart of a method for manufacturing a chip packaging structure provided by an embodiment of the present invention;

[0040] Figures 2 - 14 It is a schematic diagram of the manufacturing process of a chip packaging structure provided by an embodiment of the present invention;

[0041] Figure 15 It is a flowchart of another method for manufacturing a chip packaging structure provided by an embodiment of the present invention;

[0042] Figure 16 It is a flowchart of another method for manufacturing a chip packaging structure provided by an embodiment of the present invention;

[0043] Figures 17 - 23 Schematic diagram of the manufacturing process of another chip packaging structure provided by an embodiment of the present invention. Detailed implementation manners

[0044] The present invention will be further described in detail below with reference to the accompanying drawings and embodiments. It can be understood that the specific embodiments described herein are only used to explain the present invention, rather than limiting the present invention. Additionally, it should be noted that for the sake of description, only parts related to the present invention rather than all structures are shown in the accompanying drawings.

[0045] Figure 1 Flowchart of a manufacturing method of a chip packaging structure provided by an embodiment of the present invention, Figures 2 - 13 Schematic diagram of the manufacturing process of a chip packaging structure provided by an embodiment of the present invention. With reference to Figures 1 - 13 , the manufacturing method of the chip packaging structure includes:

[0046] S101. Attach the chip - glass combination structure 10 to the substrate 20.

[0047] With reference to Figure 9 , the chip - glass combination structure 10 is attached to the substrate 20.

[0048] S102. Electrically interconnect the chip - glass combination structure 10 and the substrate 20 through the metal lead 22.

[0049] With reference to Figure 10 , exemplarily, the substrate 20 includes a substrate metal bump 21, and the substrate metal bump 21 is located on the side of the substrate 20 where the chip - glass combination structure 10 is provided. The chip - glass combination structure 10 includes a chip metal bump 16. The substrate metal bump 21 and the chip metal bump 16 are electrically interconnected through the metal lead 22, thereby realizing the electrical interconnection between the chip - glass combination structure 10 and the substrate 20.

[0050] S103. Perform plastic encapsulation to form a plastic encapsulation layer 23 that wraps the chip - glass combination structure 10 and the metal lead 22.

[0051] With reference to Figure 12 , through the plastic encapsulation process, the plastic encapsulation material is injected on the side of the substrate 20 where the chip - glass combination structure 10 is provided, and the formed plastic encapsulation layer 23 wraps the chip - glass combination structure 10 and the metal lead 22.

[0052] The manufacturing method of the chip packaging structure provided by the embodiment of the present invention is to attach the chip glass combination structure 10 to the substrate 20, electrically interconnect the chip glass combination structure 10 and the substrate 20 through metal leads 22, and perform plastic encapsulation to form a plastic encapsulation layer that wraps the chip glass combination structure and the metal leads. By combining the wafer level and the system level, the chip encapsulation volume is increased, the path for water vapor to enter the photosensitive area chamber is extended, the possibility of device failure due to vibration is reduced, the possibility of water vapor entering the photosensitive area chamber is reduced, the reliability of the chip packaging structure is increased, the process of manufacturing the chip packaging structure is reduced, and the manufacturing cost is lowered.

[0053] Figure 15 The flowchart of another manufacturing method of the chip packaging structure provided by the embodiment of the present invention is shown in conjunction with reference to Figures 2 - 15 , and this manufacturing method includes:

[0054] S201. Provide a finished wafer, and the finished wafer includes at least one chip 11.

[0055] Refer to Figure 2 , and provide a finished wafer. Specific function circuits can be formed on the wafer through processes such as etching to form the chip 11.

[0056] Among them, in the usual manufacturing process, the finished wafer can include multiple chips 11 to improve the manufacturing efficiency of the chips 11. The chip 11 is provided with a photosensitive area ( Figure 2 not shown in ). The chip 11 can be a sensor chip for realizing the function of light sensing.

[0057] Exemplarily, the sensor chip can be an image sensor chip.

[0058] S202. Attach a photosensitive dry film 120 to the side of the chip 11 where the photosensitive area is provided.

[0059] Refer to Figure 3 , and attach a photosensitive dry film 120 to the side of the chip 11 where the photosensitive area is provided.

[0060] Among them, the photosensitive dry film 120 is a three-layer sandwich structure composed of a polyester film, a polyolefin film, and a photosensitive adhesive film, and has certain adhesiveness and good photosensitivity.

[0061] Exemplarily, the photosensitive dry film 120 can be attached to the side of the chip 11 where the photosensitive area is provided through an adhesive layer.

[0062] Exemplarily, the thickness of the photosensitive dry film 120 is greater than or equal to 30 μm and less than or equal to 60 μm.

[0063] S203. Lithographically pattern the photosensitive dry film 120 to form a cofferdam support 12, exposing the photosensitive area 110.

[0064] Exemplarily, referring to Figure 4 , by means of photolithography, the photosensitive dry film 120 is etched to form the cofferdam support 12. Since the photosensitive dry film 120 on the photosensitive area 110 is removed, after photolithography, the photosensitive area 110 is exposed. In the direction perpendicular to the substrate 20, the thickness of the cofferdam support 12 is greater than or equal to 30 μm and less than or equal to 60 μm.

[0065] S204. The finished glass 13 is attached to the cofferdam support 12 in a manner covering the photosensitive area 110.

[0066] Exemplarily, referring to Figure 5 , above the photosensitive area 110, the finished glass 13 is attached to the cofferdam support 12. The finished glass 13, the cofferdam support 12 and the chip 11 together form a photosensitive area chamber.

[0067] Exemplarily, the finished glass 13 can be attached to the cofferdam support 12 through an adhesive layer.

[0068] Exemplarily, the thickness of the finished glass 13 is greater than or equal to 300 μm and less than or equal to 400 μm.

[0069] Exemplarily, as Figure 5 shown, the finished wafer includes two chips 11, and each chip 11 is provided with at least one photosensitive area 110. The finished glass 13 with the same number as the photosensitive areas 110 can be respectively attached to the cofferdam supports 12 surrounding the photosensitive areas 110. In this way, on the one hand, the step of cutting the finished glass is omitted, no glass debris is generated, and the situation that the glass debris damages the chip 11 is avoided. On the other hand, the thickness of the finished glass 13 is small and the size is also relatively small, and the process difficulty of cutting the finished glass 13 on the chip 11 is large. In the embodiment of the present invention, by respectively attaching the cut multiple finished glasses 13 to the corresponding cofferdam supports 12, the manufacturing difficulty of the chip packaging structure is reduced.

[0070] S205. The side of the chip 11 facing away from the photosensitive area 110 is thinned.

[0071] Exemplarily, referring to Figure 6 , the side of the chip 11 facing away from the photosensitive area 110 is thinned, and the thickness of the thinned chip 11 is greater than or equal to 80 μm and less than or equal to 300 μm.

[0072] S206. A DAF film 14 is attached to the side of the chip 11 facing away from the photosensitive area 110.

[0073] Referring to Figure 7, a DAF film 14 is attached to the thinning surface. Among them, the DAF film 14 can be composed of a first adhesive surface, a second adhesive surface, and an intermediate high thermal conductivity resin layer, and the DAF film 14 can replace the die bonding glue.

[0074] S207. Cut the chip 11 along the scribe line 15 to form a single-chip glass combination structure 10.

[0075] Reference Figure 7 and Figure 8 , the finished wafer includes at least two chips 11. Thus, when the finished wafer is provided with at least two photosensitive areas 110, the chips 11 can be cut along the scribe line 15 to form a plurality of single-chip glass combination structures 10.

[0076] S208. Attach the chip glass combination structure 10 to the substrate 20.

[0077] S209. Electrically interconnect the chip glass combination structure 10 and the substrate 20 through the metal lead 22.

[0078] S210. Install a light-transmitting area protection frame 24 on one side of the substrate 20 where the chip glass combination structure 10 is attached.

[0079] Reference Figure 11 , install the light-transmitting area protection frame 24, and the light-transmitting area protection frame 24 covers the chip glass combination structure 10 and the metal lead 22. That is, the chip glass combination structure 10 and the metal lead 22 are located in the space formed by the light-transmitting area protection frame 24 and the substrate 20.

[0080] In this step, the light-transmitting area protection frame 24 is provided. The mechanical strength of the light-transmitting area protection frame 24 is relatively good, and the light-transmitting area protection frame 24 plays a role in fixing and strengthening. Setting the light-transmitting area protection frame 24 is particularly beneficial to increasing the strength in the direction perpendicular to the substrate 20.

[0081] S211. Perform plastic encapsulation to form a plastic encapsulation layer 23 that wraps the chip glass combination structure 10 and the metal lead 22.

[0082] Exemplarily, reference Figure 12 , when installing the light-transmitting area protection frame 24 on one side of the substrate 20 where the chip glass combination structure 10 is attached, the plastic encapsulation layer 23 can also wrap the light-transmitting area protection frame 24.

[0083] S212. Thin the side of the plastic encapsulation layer 23 away from the substrate 20 to expose the chip glass combination structure 10.

[0084] Exemplarily, reference Figure 13 , through a grinding process, thin the side of the plastic encapsulation layer 23 away from the substrate 20 until the photosensitive area 110 is exposed, so that the photosensitive area 110 can better receive external light signals.

[0085] Exemplarily, referring to Figure 13 , when the light-transmitting area protection frame 24 is installed on the side of the substrate 20 where the chip-glass combined structure 10 is attached, the side of the light-transmitting area protection frame 24 away from the substrate 20 can also be thinned, the light-transmitting area protection frame 24 above the photosensitive area 110 can be removed, and the photosensitive area 110 can be exposed.

[0086] It can be understood that by providing the light-transmitting area protection frame 24, the light-transmitting area protection frame 24 can prevent the chip 11 from being damaged during grinding, thereby protecting the chip 11 from mechanical damage and improving the imaging effect of the chip 11.

[0087] S213. Provide a connection structure 25 on the side of the substrate 20 away from the chip-glass combined structure 10.

[0088] Referring to Figure 14 , solder balls are implanted on the side of the substrate 20 away from the chip-glass combined structure 10. In other embodiments, solder paste can also be printed on the side of the substrate 20 away from the chip-glass combined structure 10.

[0089] Exemplarily, after step S213, the formed chip packaging structure can also be tested to ensure that the electrical and / or mechanical parameters of the formed chip packaging structure meet the preset requirements.

[0090] In the embodiment of the present invention, on the basis of the above embodiment, a photosensitive dry film 120 is attached to the side of the chip 11 where the photosensitive area is provided, the photosensitive dry film 120 is lithographed to form a cofferdam support 12, the photosensitive area 110 is exposed, the finished glass 13 is attached to the cofferdam support 12 in a manner covering the photosensitive area 110, the side of the chip 11 away from the photosensitive area 110 is thinned, a DAF film 14 is attached to the side of the chip 11 away from the photosensitive area 110, and the chip 11 is cut along the scribe line 15 to form a single chip-glass combined structure 10.

[0091] In other embodiments, the order of the above one or more steps can be interchanged.

[0092] Figure 16 It is a flowchart of another method for manufacturing a chip packaging structure provided by an embodiment of the present invention. Figures 17 - 23 It is a schematic diagram of the manufacturing process of another chip packaging structure provided by an embodiment of the present invention. Referring to Figures 16 - 23 , the manufacturing method includes:

[0093] S301. Provide a finished wafer, and the finished wafer includes at least one chip 11.

[0094] Referring to Figure 16, a finished wafer is provided. Specific functional circuits can be formed on the wafer through processes such as etching to form chip 11.

[0095] S302. Thin the side of chip 11 away from photosensitive area 110.

[0096] Reference Figure 17 , thin the side of chip 11 away from photosensitive area 110.

[0097] S303. Attach photosensitive dry film 120 to the side of chip 11 where the photosensitive area is provided.

[0098] Reference Figure 18 , attach photosensitive dry film 120 to one side of the thinned chip 11.

[0099] S304. Lithographically pattern photosensitive dry film 120 to form dam support 12, exposing photosensitive area 110.

[0100] Reference Figure 19 , lithographically pattern photosensitive dry film 120 on the thinned chip 11 to form dam support 12.

[0101] S305. Attach finished glass 13 to dam support 12 in a manner that covers photosensitive area 110.

[0102] Reference Figure 20 , attach finished glass 13 to one side of photosensitive dry film 120 on the thinned chip 11.

[0103] S306. Attach DAF film 14 to the side of chip 11 away from photosensitive area 110.

[0104] Reference Figure 21 , attach DAF film 14 to the thinned chip 11.

[0105] S307. Cut chip 11 along scribe lane 15 to form single-chip glass composite structure 10.

[0106] Reference Figure 21 and Figure 22 , cut the thinned chip 11 along scribe lane 15 to form single-chip glass composite structure 10.

[0107] In the embodiment of the present invention, on the basis of the above embodiment, the process of thinning chip 11 is set before the step of attaching photosensitive dry film 120 to the side of chip 11 where the photosensitive area is provided, thereby optimizing the process flow and avoiding yield loss during the preparation process.

[0108] Exemplarily, after step S307, the method for manufacturing a chip package structure may further include the step of attaching the chip-glass combination structure 10 to the substrate 20, and the steps after attaching the chip-glass combination structure 10 to the substrate 20, that is, steps S208 to S213.

[0109] Based on the same inventive concept, an embodiment of the present invention further provides a chip package structure, which includes a substrate 20, a chip-glass combination structure 10, and a molding compound layer 23. The chip-glass combination structure 10 is located on one side of the substrate 20, and the chip-glass combination structure 10 and the substrate 20 are electrically interconnected through metal leads 22. The molding compound layer 23 is located on the side of the substrate 20 where the chip-glass combination structure 10 is provided, and the molding compound layer 23 encapsulates the chip-glass combination structure 10 and the metal leads 22.

[0110] The chip package structure provided by the embodiment of the present invention can be manufactured by the method for manufacturing a chip package structure provided by the above embodiment. By combining the wafer level and the system level, the chip encapsulation volume is increased, the path for water vapor to enter the photosensitive area chamber is extended, the possibility of device failure due to vibration is reduced, the possibility of water vapor entering the photosensitive area chamber is reduced, and the reliability of the chip package structure is increased.

[0111] Optionally, referring to Figure 14 , the chip package structure further includes a light-transmitting area protection frame 24, which is located on the side of the chip-glass combination structure 10 away from the substrate 20, and at least part of the light-transmitting area protection frame 24 is encapsulated by the molding compound layer 23. After installing the light-transmitting area protection frame 24, the light-transmitting area protection frame 24 covers the chip-glass combination structure 10 and the metal leads 22, that is, the chip-glass combination structure 10 and the metal leads 22 are located in the space formed by the light-transmitting area protection frame 24 and the substrate 20. In the embodiment of the present invention, by setting the light-transmitting area protection frame 24, the mechanical strength of the light-transmitting area protection frame 24 is relatively good, and the light-transmitting area protection frame 24 plays a role in fixing and strengthening. Setting the light-transmitting area protection frame 24 is particularly beneficial to increasing the strength in the direction perpendicular to the substrate 20. By setting the light-transmitting area protection frame 24, the light-transmitting area protection frame 24 can prevent the chip 11 from being damaged during grinding, so that the chip 11 is protected from mechanical damage and the imaging effect of the chip 11 is improved.

[0112] Optionally, referring to Figure 14 , the chip package structure further includes a connection structure 25, which is located on the side of the substrate 20 away from the chip-glass combination structure 10.

[0113] Optionally, the connection structure 25 includes solder balls or solder paste.

[0114] Optionally, referring to Figure 14, the chip - glass combined structure 10 includes a chip 11, a cofferdam support 12, and a finished glass 13. The chip 11 is provided with a photosensitive area 110. The cofferdam support 12 is arranged around the photosensitive area 110, and the cofferdam support 12 is located between the chip 11 and the finished glass 13. In the direction perpendicular to the substrate 20, the finished glass 13 covers the photosensitive area 110. The finished glass 13, the cofferdam support 12, and the chip 11 together form a photosensitive area chamber.

[0115] Optionally, referring to Figure 14 , the chip - glass combined structure 10 further includes a DAF film 14. The DAF film 14 is located between the chip 11 and the substrate 20 and is used for bonding and fixing the chip 11 and the substrate 20. Among them, the DAF film 14 can be composed of a first adhesive surface, a second adhesive surface, and an intermediate - layer high - thermal - conductivity resin layer, and the DAF film 14 can replace the die - bonding glue.

[0116] Note that the above is only the preferred embodiment of the present invention and the applied technical principles. Those skilled in the art will understand that the present invention is not limited to the specific embodiments described here. Various obvious changes, re - adjustments, combinations with each other, and substitutions can be made by those skilled in the art without departing from the protection scope of the present invention. Therefore, although the present invention has been described in detail through the above embodiments, the present invention is not limited to the above embodiments. Without departing from the concept of the present invention, more other equivalent embodiments can be included, and the scope of the present invention is determined by the scope of the appended claims.

Claims

1. A manufacturing method of a chip packaging structure, characterized in that Including: Attach the chip - glass combined structure to the substrate; Interconnect the chip - glass combined structure and the substrate through a metal lead circuit; Install a light - transmitting area protection frame on the side of the substrate where the chip - glass combined structure is attached; Perform plastic encapsulation to form a plastic encapsulation layer that wraps the light - transmitting area protection frame, the chip - glass combined structure, and the metal leads; Thin the side of the light - transmitting area protection frame away from the substrate to expose the chip - glass combined structure; Wherein, the light - transmitting area protection frame includes a groove structure, the groove structure is located on the side of the light - transmitting area protection frame close to the photosensitive area, and overlaps with the chip - glass combined structure in the direction perpendicular to the substrate.

2. The manufacturing method according to claim 1, characterized in that, After performing plastic encapsulation to form a plastic encapsulation layer that wraps the chip - glass combined structure and the metal leads, it further includes: Thin the side of the plastic encapsulation layer away from the substrate to expose the chip - glass combined structure.

3. The manufacturing method according to claim 1, characterized in that, Before attaching the chip - glass combined structure to the substrate, it further includes: Provide a finished wafer, the finished wafer includes at least one chip; Attach a photosensitive dry film to the side of the chip where the photosensitive area is provided; Lithograph the photosensitive dry film to form a cofferdam support, exposing the photosensitive area; Attach the finished glass in a manner that covers the photosensitive area to the cofferdam support.

4. The manufacturing method according to claim 3, characterized in that, After attaching the finished glass in a manner that covers the photosensitive area to the cofferdam support, it further includes: Thin the side of the chip away from the photosensitive area.

5. The manufacturing method according to claim 3, characterized in that After attaching the finished glass in a manner that covers the photosensitive area to the cofferdam support, it further includes: Attach a DAF film to the side of the chip away from the photosensitive area.

6. The manufacturing method according to claim 3, characterized in that After attaching the finished glass in a manner that covers the photosensitive area to the cofferdam support, it further includes: Cut the chip along the scribe line to form a single chip - glass combined structure.

7. The manufacturing method according to claim 3, characterized in that, Before attaching the photosensitive dry film to the side of the chip where the photosensitive area is provided, it further includes: Thin the side of the chip away from the photosensitive area.

8. A chip packaging structure, characterized in that, Manufactured according to the manufacturing method described in any one of claims 1 - 7, the chip package structure includes: A substrate; A chip - glass combined structure, located on one side of the substrate, interconnected with the substrate through a metal lead circuit; A plastic encapsulation layer, located on the side of the substrate where the chip - glass combined structure is provided, wrapping the chip - glass combined structure and the metal leads; A light - transmitting area protection frame, located on the side of the substrate where the chip - glass combined structure is attached, and the plastic encapsulation layer wraps the light - transmitting area protection frame.

9. The chip packaging structure according to claim 8, wherein The chip - glass combined structure includes: a chip, a cofferdam support, and a finished glass; The chip is provided with a photosensitive area; The cofferdam support is arranged around the photosensitive area and is located between the chip and the finished glass.

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