A curved circuit connection structure for a lidar radome and its fabrication method

Abstract

This invention belongs to the field of lidar radome technology, and provides a curved circuit connection structure and manufacturing method for a lidar radome. The lidar radome has a curved concave surface and a flexible circuit board. An ITO film layer is present on the curved concave surface, and conductive silver paste lines are deposited on the ITO film layer. The ITO film layer and the conductive silver paste lines are electrically connected. Anisotropic conductive adhesive is used at the connection point between the flexible circuit board and the conductive silver paste lines. The two connecting pins of the flexible circuit board are connected to the conductive silver paste lines through the anisotropic conductive adhesive. The advantage of this invention is that the flexible circuit board can be directly electrically connected to the curved conductive silver paste lines using a bonding machine, which ensures adhesion and conductivity between the flexible circuit board and the conductive silver paste lines, simplifies the process, improves the yield rate, and enables stable production.

Description

Technical Field

[0001] This invention belongs to the field of lidar radome technology, and relates to a curved surface circuit connection structure and manufacturing method of lidar radome. Background Technology

[0002] With the development of connected and intelligent vehicles, the demand for LiDAR, millimeter-wave radar, and cameras in intelligent driving vehicles is increasing. Correspondingly, LiDAR covers and other components require de-icing and defogging functions. To achieve de-icing and defogging, ITO (Indium Tin Oxide) is typically heated by electricity. This heating is achieved by energizing the ITO through conductive silver paste lines. The connection between the flexible printed circuit board (FPC) and the silver paste lines is currently generally achieved by adding conductive pins during injection molding. These pins are connected to the conductive silver lines of the ITO, and the other end is soldered to the FPC. This method, which adds pins during injection molding and then solders the wires to the pins using soldering equipment, requires masking at the solder joints to prevent oxidation. This process suffers from low yield, complex processes, and a relatively low pass rate, and is prone to wire breakage. Summary of the Invention

[0003] The technical problem to be solved by the present invention is to provide a curved circuit connection structure and manufacturing method for a lidar radome, which can achieve the requirement of adhering a flexible circuit board to the silver paste circuit of the curved lidar radome and conducting the circuit.

[0004] The technical solution adopted by the present invention to solve the above-mentioned technical problems is as follows: a curved circuit connection structure for a lidar radome, characterized in that the lidar radome has a curved concave surface and a flexible circuit board, an ITO film layer is provided on the curved concave surface, conductive silver paste lines are plated on the ITO film layer, the ITO film layer is electrically connected to the conductive silver paste lines, anisotropic conductive adhesive is provided at the connection between the flexible circuit board and the conductive silver paste lines, and the two connecting pins of the flexible circuit board are connected to the conductive silver paste lines through the anisotropic conductive adhesive.

[0005] In the aforementioned curved circuit connection structure of a lidar radome, the conductive silver paste line has two connection points, which are located on the same horizontal line.

[0006] In the aforementioned curved circuit connection structure of a lidar radome, the thickness of the ITO film is 100 nm, and the resistance of the ITO film is 100 Ω.

[0007] In the aforementioned curved circuit connection structure of a lidar radome, the thickness of the conductive silver paste line is 10µm, and the resistance of the conductive silver paste line is 5Ω.

[0008] In the aforementioned curved circuit connection structure of a lidar cover, the lidar cover also includes an attachment machine and a contouring base that matches the shape of the concave surface of the curved surface. The attachment machine has a curved pressure head. The lidar cover is placed on the contouring base so that the two connection points on the conductive silver paste circuit are on the same horizontal line. After the anisotropic conductive adhesive is attached to the conductive silver paste circuit, the curved pressure head connects the two connecting feet of the flexible circuit board with the two connection points of the conductive silver paste circuit.

[0009] A method for fabricating a curved circuit connection structure for a lidar radome, characterized by the following steps:

[0010] Step 1: First, deposit an ITO film on the radome material using sputtering or evaporation deposition. The ITO film thickness is approximately 100 nm, and the conductivity of the ITO film is less than 100 Ω.

[0011] Step 2: Using a 250-mesh screen, conductive silver paste is used to print conductive silver paste lines on the ITO film layer of the lidar cover. The thickness of the conductive silver paste lines is about 10um, and the resistance of the conductive silver paste lines is about 5Ω.

[0012] Step 3: Place the laser radar cover processed in Step 2 into the contour base of the bonding machine. When designing the contour base, ensure that the two ends of the two connection points of the conductive silver paste circuit are on the same horizontal line.

[0013] Step 4: After the lidar cover is placed, use low-temperature anisotropic conductive adhesive to attach it to the conductive silver paste circuit of the lidar cover. The attachment pressure is about 0.4 MPa and the temperature is about 115°C.

[0014] Step 5: Place the lidar cover into the contour base of the constant temperature hot press and use the curved pressure head of the bonding machine to connect it to the flexible circuit board. The pressure is about 2 MPa and the temperature is about 130°C.

[0015] Step 6: After connecting, use a multimeter to measure whether the positive and negative terminals of the flexible circuit board are in a conductive state.

[0016] In the above-mentioned method for manufacturing a curved circuit connection structure for a lidar radome, the curved pressure head of the bonding machine has an arc similar to the shape of the concave surface of the curved surface, and the contour base makes the two contact points on the conductive silver paste circuit at the same horizontal line.

[0017] Compared with the prior art, the advantages of the present invention are that the flexible circuit board can be directly electrically connected to the curved conductive silver paste line by the bonding machine, which not only ensures the adhesion and conduction between the flexible circuit board and the conductive silver paste line, but also simplifies the process, improves the yield rate, and can stabilize production. Attached Figure Description

[0018] Figure 1 This is a schematic diagram of the curved circuit connection structure of the lidar radome;

[0019] Figure 2 This is a schematic diagram of the attachment state of the curved circuit connection structure of the lidar radome. Detailed Implementation

[0020] The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without creative effort are within the scope of protection of the present invention.

[0021] In the description of this invention, it should be understood that the terms "center," "lateral," "longitudinal," "front," "rear," "left," "right," "upper," "lower," "vertical," "horizontal," "top," "bottom," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limiting the scope of protection of this invention.

[0022] In the figure: LiDAR cover 100; curved concave surface 101; flexible circuit board 200; connecting foot 201; ITO film layer 300; conductive silver paste circuit 400; connecting contact point 401; anisotropic conductive adhesive 500; bonding machine 600; curved pressure head 700.

[0023] like Figure 1 and Figure 2As shown, this lidar radome has a curved circuit connection structure. The lidar radome 100 has a curved concave surface 101 and a flexible circuit board 200. The curved concave surface 101 has an ITO film layer 300, which is actually indium tin oxide. To enable heating and conduction, conductive silver paste lines 400 are plated on the surface of the ITO film layer 300. The ITO film layer 300 and the conductive silver paste lines 400 are electrically connected. To prevent breakage after connection, the conductive silver paste lines 400 have two connection contact points 401, which are on the same horizontal line. Here, in this patent, anisotropic conductive adhesive 500 is used at the connection between the flexible circuit board 200 and the conductive silver paste lines 400. The two connecting pins 201 of the flexible circuit board 200 are connected to the conductive silver paste through the anisotropic conductive adhesive 500. The circuit 400 is connected. To achieve a more efficient heating effect, the ITO film 300 has a thickness of 100nm and a resistance of 100Ω. The conductive silver paste circuit 400 has a thickness of 10µm and a resistance of 5Ω. The lidar cover 100 also includes an attachment machine 600 and a contouring base that matches the shape of the concave surface 101. The attachment machine 600 has a curved pressure head 700. The lidar cover 100 is placed on the contouring base so that the two connection points 401 on the conductive silver paste circuit 400 are on the same horizontal line. After the anisotropic conductive adhesive 500 is attached to the conductive silver paste circuit 400, the two connecting pins 201 of the flexible circuit board 200 are connected to the two connection points 401 of the conductive silver paste circuit 400 through the curved pressure head 700.

[0024] In the manufacturing process, an ITO film 300 is first deposited on the radome material using sputtering or evaporation deposition. The ITO film 300 is approximately 100 nm thick and has a conductivity resistance of less than 100 Ω. Then, a conductive silver paste line 400 is printed onto the ITO film 300 surface of the lidar 100 using a 250-mesh screen. The conductive silver paste line 400 is approximately 10 μm thick and has a resistance of approximately 5 Ω. The lidar 100 processed in step two is then placed into the contouring base of the mounting machine 600. When designing the contouring base, it is ensured that the two endpoints of the two contact points 401 of the conductive silver paste line 400 are on the same horizontal line. Here, the curved pressure head 700 of the mounting machine 600 has an arc similar to the shape of the concave surface 101. The contouring base allows the conductive silver paste line 400 to be properly aligned with the surface. Two contact points 401 on the electroplated silver paste line 400 are on the same horizontal line. After the lidar cover 100 is placed, a low-temperature anisotropic conductive adhesive 500 is applied to the conductive silver paste line 400 of the lidar cover 100. The application pressure is about 0.4 MPa and the temperature is about 115°C. The lidar cover 100 is placed in the contour base of the constant temperature hot press and connected to the flexible circuit board 200 using the curved pressure head 700 of the application machine 600. The pressure is about 2 MPa and the temperature is about 130°C. After connection, a multimeter is used to measure whether the positive and negative terminals of the flexible circuit board are conductive. This achieves direct electrical connection of the flexible circuit board to the curved conductive silver paste line 400, which not only ensures the adhesion and conductivity between the flexible circuit board and the conductive silver paste line 400, but also simplifies the process, improves the yield rate, and enables stable production.

[0025] It should be noted that in this invention, the use of terms such as "first," "second," and "a" is for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this invention, "a plurality of" means at least two, such as two, three, etc., unless otherwise explicitly specified. The terms "connection," "fixed," etc., should be interpreted broadly. For example, "fixed" can mean a fixed connection, a detachable connection, or an integral part; it can mean a mechanical connection or an electrical connection; it can mean a direct connection or an indirect connection through an intermediate medium; it can mean the internal communication of two elements or the interaction between two elements, unless otherwise explicitly specified. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0026] Furthermore, the technical solutions of the various embodiments of the present invention can be combined with each other, but only if they are feasible for those skilled in the art. If the combination of technical solutions is contradictory or cannot be implemented, it should be considered that such combination of technical solutions does not exist and is not within the scope of protection claimed by the present invention.

[0027] The specific embodiments described herein are merely illustrative of the spirit of the invention. Those skilled in the art to which this invention pertains may make various modifications or additions to the described specific embodiments or use similar methods to substitute them, without departing from the spirit of the invention or exceeding the scope defined by the appended claims.

Claims

1. A curved circuit connection structure for a lidar radome, characterized in that, The lidar cover has a curved concave surface and a flexible circuit board. An ITO film layer is present on the curved concave surface, and conductive silver paste lines are deposited on the ITO film layer. The ITO film layer and the conductive silver paste lines are electrically connected. Anisotropic conductive adhesive is used at the connection point between the flexible circuit board and the conductive silver paste lines. The two connecting feet of the flexible circuit board are connected to the conductive silver paste lines through the anisotropic conductive adhesive. The lidar cover also includes an attachment machine and a contouring base that matches the shape of the curved concave surface. The conductive silver paste lines have two connection points, which are at the same horizontal level. The attachment machine has a curved pressure head. The lidar cover is placed on the contouring base so that the two connection points on the conductive silver paste lines are at the same horizontal level. After the anisotropic conductive adhesive is attached to the conductive silver paste lines, the curved pressure head connects the two connecting feet of the flexible circuit board to the two connection points of the conductive silver paste lines.

2. The curved circuit connection structure of a lidar radome according to claim 1, characterized in that, The thickness of the ITO film is 100 nm, and the resistance of the ITO film is 100 Ω.

3. The curved circuit connection structure of a lidar radome according to claim 1, characterized in that, The conductive silver paste circuit has a thickness of 10 μm and a resistance of 5 Ω.

4. A method for fabricating a curved circuit connection structure for a lidar radome, characterized in that, The steps are as follows: Step 1: First, deposit an ITO film on the radome material using sputtering or evaporation deposition. The ITO film thickness is 100 nm, and the conductivity of the ITO film is less than 100 Ω. Step 2: Using a 250-mesh screen, conductive silver paste is used to print conductive silver paste lines on the ITO film layer of the lidar cover. The thickness of the conductive silver paste lines is 10µm and the resistance of the conductive silver paste lines is 5Ω. Step 3: Place the laser radar cover processed in Step 2 into the contour base of the bonding machine. When designing the contour base, ensure that the two ends of the two connection points of the conductive silver paste circuit are on the same horizontal line. Step 4: After the lidar cover is placed, use low-temperature anisotropic conductive adhesive to attach it to the conductive silver paste circuit of the lidar cover, with an attachment pressure of 0.4 MPa and a temperature of 115℃. Step 5: Place the lidar cover into the contour base of the constant temperature hot press and use the curved pressure head of the bonding machine to connect it to the flexible circuit board. The pressure is 2 MPa and the temperature is 130℃. Step 6: After connecting, use a multimeter to measure whether the positive and negative terminals of the flexible circuit board are in a conductive state.

5. The method for manufacturing a curved circuit connection structure for a lidar radome according to claim 4, characterized in that, The curved pressure head of the bonding machine has an arc similar to the shape of the concave surface of the curved surface, and the contour base makes the two contact points on the conductive silver paste line at the same horizontal line.

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