A preheating device for soldering a glass material wiring board
By using a preheating device to slowly and evenly heat the circuit board, the problem of welding defects caused by high temperature during the circuit board welding process is solved, thus improving welding quality and efficiency.
Patent Information
- Application Number
- CN202211660210.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2022-12-23
- Publication Date
- 2026-05-22
- Estimated Expiration
- 2042-12-23
AI Technical Summary
During the soldering process, the sudden exposure to high temperatures causes accelerated thermal expansion and contraction of circuit boards, resulting in soldering defects such as incomplete soldering, cold soldering, and empty soldering, which affect product quality and increase production costs.
A preheating device is used to preheat the circuit board. By setting up a heat-conducting plate and a stirring rod in the preheating chamber, the temperature is slowly increased and the molten solder is heated evenly, avoiding direct high-temperature baking of the circuit board. Combined with the fan blades, uniform hot air is provided for preheating to prevent thermal expansion and contraction.
It effectively prevents weld defects, improves welding quality and efficiency, and reduces production costs.