A preheating device for soldering a glass material wiring board

Abstract

The application discloses a preheating device for glass material circuit board welding and belongs to the technical field of circuit board processing and welding. The preheating device for glass material circuit board welding comprises a workbench and further comprises a rotary table rotatably arranged on the workbench, a motor one fixedly connected to the top of the workbench and used for driving the rotary table to rotate, wherein a preheating bin is formed in the top of the workbench, a first heating wire is fixedly arranged in the preheating bin, and a heat conduction plate is slidably arranged in the preheating bin; a storage rack for placing the circuit board is slidably arranged on the rotary table, a driving part for driving the storage rack to slide is arranged on the rotary table, and the storage rack is matched with the heat conduction plate; the preheating bin is arranged in the welding process to preheat the circuit board, sudden high-temperature bearing of the circuit board can be prevented, thermal expansion and cold contraction are intensified, welding defects such as false welding, cold welding and empty welding are generated at the welding points, the product quality is affected, and the production cost is increased.

Description

Technical Field

[0001] This invention relates to the field of circuit board processing and welding technology, and in particular to a preheating device for welding glass material circuit boards. Background Technology

[0002] A circuit board, also known as a flexible circuit board or flexible circuit board, is an important component of electrical or electronic devices made from a copper foil substrate. The substrate is a composite material composed of a dielectric layer such as resin or glass fiber and a high-purity conductor such as copper foil. This gives the circuit board the characteristics of high wiring density, light weight, thinness, and good flexibility. Circuit boards are a basic component in electronic products. In electronic devices such as LCD TVs and computers, which are widely used in people's daily lives, circuit boards are an indispensable basic component.

[0003] In the production of circuit boards, electrical components are usually soldered onto the circuit board. During soldering, when molten solder is applied to the surface of the circuit board, the circuit board is suddenly subjected to high temperature, and the thermal expansion and contraction are aggravated, which can cause soldering defects such as cold solder joints, poor solder joints, and open solder joints, affecting product quality and increasing production costs. Summary of the Invention

[0004] The purpose of this invention is to solve the problem in the prior art that when circuit boards are suddenly subjected to high temperatures, the thermal expansion and contraction are aggravated, which will cause welding defects such as incomplete soldering, cold soldering, and empty soldering at the solder joints. Therefore, a preheating device for welding glass material circuit boards is proposed.

[0005] To achieve the above objectives, the present invention adopts the following technical solution:

[0006] A preheating device for welding glass material circuit boards includes a worktable and a turntable rotatably mounted on the worktable. A motor for driving the turntable to rotate is fixedly connected to the top of the worktable. A preheating chamber is provided on the top of the worktable, and a first heating wire is fixedly mounted inside the preheating chamber. A heat-conducting plate is slidably mounted inside the preheating chamber. A shelf for placing circuit boards is slidably mounted on the turntable, and a driving part for driving the shelf to slide is provided on the turntable. The shelf cooperates with the heat-conducting plate.

[0007] In order to deliver the circuit boards to the various compartments, preferably, the drive unit includes four sets of first cylinders, which are evenly and fixedly connected to the circumference of the turntable. The storage racks are provided in four sets, which are respectively fixedly connected to the output end of the first cylinders. The bottom of the storage racks is symmetrically provided with storage slots for fixing the circuit boards, and guide rollers that abut against the left and right sides of the circuit boards are rotatably arranged in the storage slots.

[0008] To facilitate stirring of the molten tin, the system preferably further includes: a molten tin pool located within the workbench, situated below the preheating chamber, with a heating chamber at its bottom. A second heating wire is fixedly connected within the heating chamber. A stirring rod is rotatably mounted within the molten tin pool, with a spiral sleeve fixedly connected to its top. A connecting rod is fixedly connected to the bottom of the heat-conducting plate, extending into the stirring rod where a spiral block is fixedly mounted. The spiral sleeve engages with the spiral block. A spring is installed within the spiral sleeve, with its two ends abutting against the spiral block and the stirring rod, respectively.

[0009] In order to ensure that the circuit board is heated evenly, the stirring rod extends into the preheating chamber and is fixedly connected to multiple sets of fan blades. The multiple sets of fan blades are evenly distributed on the stirring rod in a circle, and the fan blades are located below the first heating wire. The heat-conducting plate is provided with multiple heat dissipation holes for ventilation.

[0010] To improve the soldering efficiency of the solder spray gun, a soldering chamber for soldering circuit boards is further provided at the bottom of the workbench. The solder spray gun is installed inside the soldering chamber, and a pump body is fixedly connected inside the solder bath. The input end of the pump body is connected to the solder bath through a pipe, and the output end of the pump body is connected to the solder spray gun through a pipe. A drive assembly for moving the solder spray gun is installed inside the soldering chamber.

[0011] To enable the solder spray gun to reach any position on the circuit board, the driving assembly further includes a transverse screw rotatably connected within the soldering chamber. A second motor for driving the transverse screw is fixedly installed within the worktable. A first slider is threaded onto the transverse screw, and a third motor is fixedly connected to the first slider. A longitudinal screw is fixedly connected to the output end of the third motor, and a second slider is threaded onto the longitudinal screw. A second cylinder is fixedly connected to the second slider, and the solder spray gun is fixedly connected to the output end of the second cylinder.

[0012] In order to further extract fumes during soldering, the top of the solder spray gun is fixedly connected to an air suction hood, the air suction hood is provided with a negative pressure channel, and a vacuum pump connected to the negative pressure channel is fixedly installed in the workbench.

[0013] In order to generate negative pressure more quickly, the vacuum pump input end is connected to the negative pressure channel through pipe three, a drying chamber is provided on the top of the workbench, a filter block is fixedly installed in the drying chamber, and the vacuum pump output end is connected to the filter block through pipe four.

[0014] In order to clean the circuit board, a push rod two is slidably arranged inside the drying chamber. A sealing plate is fixedly connected to the bottom of the push rod two. A nozzle for cleaning the solder joints is slidably connected inside the drying chamber. The bottom of the nozzle is fixedly connected to the sealing plate, and an air inlet is opened at the bottom of the nozzle. A spring three is sleeved on the push rod two, and the two ends of the spring three abut against the push rod two and the drying chamber, respectively.

[0015] To improve welding quality, preferably, a flux chamber is provided on the top of the workbench, and a spray pipe for spraying flux is fixedly connected inside the flux chamber. A piston plate is slidably arranged inside the flux chamber, and a push rod is fixedly connected to the piston plate. A spring is provided outside the flux chamber, and the two ends of the spring are respectively pushed against the flux chamber. A return pipe is provided inside the workbench, and the return pipe is connected to the flux chamber. A valve is fixedly connected to the return pipe.

[0016] Compared with the prior art, the present invention provides a preheating device for welding glass material circuit boards, which has the following beneficial effects:

[0017] 1. The preheating device for welding glass material circuit boards can preheat the circuit board by setting up a preheating chamber during the welding process. This can prevent the circuit board from being subjected to high temperature suddenly, which would exacerbate thermal expansion and contraction and cause welding defects such as incomplete welding, cold welding, and empty welding at the solder joints, affecting product quality and increasing production costs.

[0018] 2. The preheating device for welding glass circuit boards uses a heat-conducting plate that slides within the preheating chamber. This prevents the circuit board from being directly heated by the first heating wire, thus avoiding problems caused by excessively rapid heating. Furthermore, the heat-conducting plate can drive the stirring rod to rotate and stir within the molten solder pool during its downward and upward movements, ensuring uniform heating of the molten solder and improving welding quality.

[0019] The parts not covered in this device are the same as or can be implemented using existing technologies. This invention preheats the circuit board by setting a preheating chamber during the welding process, which can prevent the circuit board from being subjected to high temperatures suddenly. This can exacerbate thermal expansion and contraction, which can cause welding defects such as incomplete soldering, cold soldering, and empty soldering at the solder joints, affecting product quality and increasing production costs. Attached Figure Description

[0020] Figure 1 This is a front view of a preheating device for welding glass material circuit boards according to the present invention;

[0021] Figure 2 This invention proposes a preheating device for welding glass material circuit boards. Figure 1 Enlarged view of section A;

[0022] Figure 3This invention proposes a preheating device for welding glass material circuit boards. Figure 1 Enlarged view of section B;

[0023] Figure 4 This is a left view of a preheating device for welding glass material circuit boards according to the present invention.

[0024] Figure 5 This invention proposes a preheating device for welding glass material circuit boards. Figure 4 Enlarged view of section C;

[0025] Figure 6 This is a schematic diagram of the structure of a preheating device workbench for welding glass material circuit boards according to the present invention;

[0026] Figure 7 This is a schematic diagram of the structure of a preheating device shelf for welding glass material circuit boards proposed in this invention.

[0027] In the diagram: 1. Workbench; 101. Flux chamber; 102. Preheating chamber; 103. Welding chamber; 104. Drying chamber; 2. Motor 1; 201. Turntable; 202. First cylinder; 3. Shelf; 301. Storage trough; 302. Guide roller; 4. First heating wire; 401. Heat-conducting plate; 402. Connecting rod; 403. Spiral block; 5. Solder bath; 501. Stirring rod; 502. Second heating wire; 503. Spiral sleeve; 504. Spring 1 505. Fan blades; 6. Pump body; 601. Pipe 1; 602. Pipe 2; 7. Solder gun; 701. Second cylinder; 702. Longitudinal screw; 703. Transverse screw; 8. Nozzle; 801. Piston plate; 802. Push rod 1; 9. Push rod 2; 901. Sealing plate; 902. Nozzle; 903. Air inlet; 10. Vacuum pump; 1001. Pipe 3; 1002. Pipe 4; 11. Suction hood; 1101. Negative pressure channel. Detailed Implementation

[0028] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments.

[0029] In the description of this invention, it should be understood that the terms "upper", "lower", "front", "rear", "left", "right", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.

[0030] Example:

[0031] Reference Figures 1-7 A preheating device for welding glass circuit boards includes a worktable 1 with four stations: a material loading and accelerator spraying area, a preheating area, a welding area, and a drying and unloading area. The four areas are arranged in a circular pattern on the worktable 1. When welding electrical components onto the circuit board, the operation is streamlined. The circular arrangement saves space, reduces waiting time during welding, and shortens the transfer distance between stations, thus improving welding efficiency. The device also includes a turntable 201 rotatably mounted on the worktable 1, with a drive mechanism fixedly connected to the top of the worktable 1. 01 The rotating motor 2, wherein the top of the workbench 1 is provided with a preheating chamber 102, a first heating wire 4 is fixedly installed in the preheating chamber 102, and a heat-conducting plate 401 is slidably installed in the preheating chamber 102, the heat-conducting plate 401 is positioned above the first heating wire 4; a shelf 3 for placing circuit boards is slidably installed on the turntable 201, and a driving part for driving the shelf 3 to slide is provided on the turntable 201. When the shelf 3 slides downward in the preheating chamber 102, the shelf 3 will abut against the top of the heat-conducting plate 401 and push the heat-conducting plate 401 to slide downward together.

[0032] When using the circuit board, the electrical components are placed on the circuit board in advance as required. Then, the circuit board is inserted into the storage slot 301 at the bottom of the storage rack 3 located in the feeding and spraying flux area. The storage slot 301 can hold the circuit board in place to prevent it from moving and causing soldering errors, which would affect production quality. After the circuit board is placed, the first cylinder 202 slides the storage rack 3 down along the flux chamber 101. The storage rack 3 will press against the top of the push rod 802 and push the push rod 802 down. The push rod 802 will slide and compress the piston plate 801 down in the flux chamber 101, which can spray the flux stored in the flux chamber 101 through the spray pipe 8, so that the flux is sprayed on the connection between the circuit board and the pins of the electrical components.

[0033] After the coating is completed, the first cylinder 202 rises, and then the motor 2 drives the turntable 201 to rotate 90 degrees, so that the circuit board coated with flux moves above the preheating zone. When it is above the preheating zone, the first cylinder 202 is activated to extend the shelf 3 into the preheating chamber 102. At this time, the pins of the electrical components on the circuit board will first abut against the heat-conducting plate 401, which can correct the tilted electrical components and prevent the pins of the electrical components from being stuck, or a pin not passing through the mounting hole of the circuit board, which would lead to failure to solder and cause abnormal phenomena such as poor contact. This helps to improve the soldering quality between the electrical components and the circuit board. As the shelf 3 continues to slide downward, the bottom of the shelf 3 will also press against the heat-conducting plate 401 and push the heat-conducting plate 401 downward. During this process, the heat-conducting plate 401 will gradually be heated by the first heating wire 4 as it descends. The temperature of the heat-conducting plate 401 rises, which can transfer heat. Upon reaching the circuit board, the temperature of the circuit board rises slowly, preheating it and preventing it from being directly baked by the first heating wire 4, which could cause problems due to excessively rapid temperature rise. During the descent of the heat-conducting plate 401, it carries the connecting rod 402 and the spiral block 403 down. As the spiral block 403 slides down, it drives the stirring rod 501 to rotate in the molten solder pool 5 through the spiral sleeve 503, stirring the molten solder in the pool 5. This ensures that the molten solder in the molten solder pool 5 is heated evenly. When the stirring rod 501 rotates, it carries the fan blades 505 to rotate in the preheating chamber 102. The air generated by the fan blades 505 becomes hot air after passing through the first heating wire 4, and then is blown onto the circuit board through the heat dissipation holes on the heat-conducting plate 401 to preheat the circuit board. This prevents the circuit board from being subjected to sudden high temperatures, which could exacerbate thermal expansion and contraction and cause welding defects such as cold solder joints, poor solder joints, and empty solder joints, affecting product quality and increasing production costs.

[0034] After the circuit board reaches the soldering temperature, the first cylinder 202 lifts the shelf 3 upwards, and the motor 2 drives the turntable 201 to rotate 90 degrees, placing the preheated circuit board above the soldering chamber 103. The first cylinder 202 then lowers the shelf 3 into the soldering chamber 103, and the soldering gun 7 solders the pins according to the pre-set route. After soldering, the first cylinder 202 lifts the shelf 3 upwards, and the motor 2 drives the turntable 201 to rotate 90 degrees, moving it to the last station. At this point, the soldered circuit board is above the drying chamber 104. The first cylinder 202 then slides the shelf 3 downwards into the drying chamber 104, where the shelf 3 will press against the push rod. In the second drying chamber 104, the gas enters the nozzle 902 through the air inlet 903. The nozzle 902 can blow and cool the pins. Here, when soldering the pins in the soldering chamber 103, the vacuum pump 10 can be started to draw the welding fumes into the filter block through the negative pressure channel 1101. After being adsorbed and filtered by the filter block, the fumes enter the drying chamber 104 and can be sprayed out through the nozzle 902 to blow and cool the soldered pins. After cooling is completed, the first cylinder 202 rises. At this time, the circuit board can be removed. Then, the motor 12 is started to drive the turntable 201 to rotate 90 degrees above the soldering chamber 101. This cycle can improve the soldering efficiency.

[0035] Reference Figure 1 , Figure 6 and Figure 7 The drive unit includes four sets of first cylinders 202, which are evenly fixedly connected to the circumference of the turntable 201. There are four sets of shelves 3, which are fixedly connected to the output end of the first cylinders 202. The bottom of the shelf 3 is symmetrically provided with a storage slot 301 for fixing the circuit board. The guide rollers 302 are rotatably arranged in the storage slot 301 and abut against the left and right sides of the circuit board. The rotating guide rollers 302 can make the circuit board more smoothly inserted or removed from the storage slot 301, and can also avoid scratching the left and right sides of the circuit board, thus improving the surface quality of the circuit board.

[0036] Reference Figure 1 and Figure 2A preheating device for soldering glass circuit boards further includes: a molten solder pool 5 located within a workbench 1, below a preheating chamber 102, which helps to keep the molten solder pool 5 warm and prevents the molten solder in the pool 5 from cooling and solidifying; a heating chamber is provided at the bottom of the molten solder pool 5, and a second heating wire 502 is fixedly connected inside the heating chamber; a stirring rod 501 is rotatably installed inside the molten solder pool 5 to stir the molten solder and ensure uniform heating; a spiral sleeve 503 is fixedly connected to the top of the stirring rod 501; a connecting rod 402 is fixedly connected to the bottom of a heat-conducting plate 401, and the connecting rod 402 extends into the stirring rod 501 and is fixedly installed with a spiral sleeve 503. The spiral block 403 and the spiral sleeve 503 mesh with the spiral block 403. A spring 504 is installed inside the spiral sleeve 503. The two ends of the spring 504 abut against the spiral block 403 and the stirring rod 501, respectively. The spring 504 can reset the heat-conducting plate 401. The stirring rod 501 extends into the preheating chamber 102 and is fixedly connected to multiple sets of fan blades 505. The multiple sets of fan blades 505 are evenly distributed on the stirring rod 501 in a circle, and the fan blades 505 are located below the first heating wire 4. The heat-conducting plate 401 has multiple heat dissipation holes for ventilation. The hot air is blown onto the circuit board by the wind, which can make the circuit board heat up evenly and help improve the preheating effect.

[0037] Reference Figure 1 , Figure 3 The bottom of the workbench 1 is provided with a soldering chamber 103 for soldering circuit boards. A soldering gun 7 is installed in the soldering chamber 103. A pump body 6 is fixedly connected in the solder bath 5. The input end of the pump body 6 is connected to the solder bath 5 through a pipe 601, and the output end of the pump body 6 is connected to the soldering gun 7 through a pipe 602. A drive component is provided in the soldering chamber 103 for driving the movement of the soldering gun 7. In use, under the drive of the drive component, the soldering gun 7 can solder the pins according to the designed route.

[0038] Reference Figure 1 The drive assembly includes a transverse screw 703 rotatably connected within the soldering chamber 103. A second motor for driving the transverse screw 703 is fixedly installed within the worktable 1. A slider 1 is threaded onto the transverse screw 703, and a third motor is fixedly connected to the slider 1. A longitudinal screw 702 is fixedly connected to the output end of the third motor, and a second slider 2 is threaded onto the longitudinal screw 702. A second cylinder 701 is fixedly connected to the slider 2. A solder spray gun 7 is fixedly connected to the output end of the second cylinder 701. Driven by the transverse screw 703, the longitudinal screw 702, and the second cylinder 701, the solder spray gun 7 can reach any position on the circuit board, improving soldering efficiency.

[0039] Reference Figure 1 , Figure 3 and Figure 4The top of the solder spray gun 7 is fixedly connected to an air suction hood 11, and a negative pressure channel 1101 is opened inside the air suction hood 11. A vacuum pump 10 connected to the negative pressure channel 1101 is fixedly installed inside the workbench 1. The input end of the vacuum pump 10 is connected to the negative pressure channel 1101 through pipe three 1001. A filter block is fixedly installed inside the drying chamber 104. The output end of the vacuum pump 10 is connected to the filter block through pipe four 1002. When in use, the fumes generated by soldering can be sucked into the filter block through the air suction hood 11, and then filtered by the filter block before being discharged into the drying chamber 104, which can reduce the impact of the fumes generated by soldering on the health of the workers.

[0040] Reference Figure 4 The top of the workbench 1 is provided with a drying chamber 104. A push rod 2 9 is slidably installed in the drying chamber 104. A sealing plate 901 is fixedly connected to the bottom of the push rod 2 9. A nozzle 902 for blowing on the solder joints is slidably connected in the drying chamber 104. The bottom of the nozzle 902 is fixedly connected to the sealing plate 901, and an air inlet 903 is provided at the bottom of the nozzle 902. A spring 3 for resetting the push rod 2 9 is sleeved on the push rod 2 9. The two ends of the spring 3 abut against the push rod 2 9 and the drying chamber 104 respectively. In use, when the soldered circuit board is transferred into the drying chamber 104, the nozzle 902 can blow on the soldered pins. On the one hand, it can blow away the unsolidified solder slag. On the other hand, it can cool down the circuit board during the blowing process to prevent the circuit board from overheating and burning the staff.

[0041] Reference Figure 1 The top of the workbench 1 is provided with a flux chamber 101, which stores flux. A spray nozzle 8 for spraying flux is fixedly connected inside the flux chamber 101, which can remove oxides on the welding surface, prevent the solder and the welding surface from re-oxidizing during welding, reduce the surface tension of the solder, and improve the welding quality. A piston plate 801 is slidably arranged inside the flux chamber 101, and a push rod 802 is fixedly connected to the piston plate 801. The push rod 802 extends out of the flux chamber 101 and is fitted with a spring 2. The two ends of the spring 2 push the push rod 802 and the flux chamber 101 respectively. A return pipe is provided inside the workbench 1, which is connected to the flux chamber 101. A valve is fixedly connected to the return pipe. The flux can only flow back into the flux chamber 101 from the outside through the return pipe. Excess flux can be returned to the flux chamber 101 through the return pipe to avoid flux waste.

[0042] The above description is only a preferred embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any equivalent substitutions or modifications made by those skilled in the art within the scope of the technology disclosed in the present invention, based on the technical solution and inventive concept of the present invention, should be covered within the scope of protection of the present invention.

Claims

1. A preheating device for welding glass material circuit boards, comprising a workbench (1), characterized in that, Also includes: Rotate the turntable (201) mounted on the workbench (1), and the top of the workbench (1) is fixedly connected to a motor (2) for driving the turntable (201) to rotate. The workbench (1) has a preheating chamber (102) on top, a first heating wire (4) is fixedly installed in the preheating chamber (102), and a heat-conducting plate (401) is slidably installed in the preheating chamber (102). The turntable (201) is slidably provided with a shelf (3) for placing circuit boards, and the turntable (201) is provided with a driving part for driving the shelf (3) to slide. The shelf (3) cooperates with the heat-conducting plate (401). Also includes: A molten tin pool (5) is set inside the workbench (1). The molten tin pool (5) is located below the preheating chamber (102). A heating chamber is set at the bottom of the molten tin pool (5). A second heating wire (502) is fixedly connected inside the heating chamber. The tin bath (5) is rotatably equipped with a stirring rod (501), the top of the stirring rod (501) is fixedly connected with a spiral sleeve (503), the bottom of the heat-conducting plate (401) is fixedly connected with a connecting rod (402), and the connecting rod (402) extends into the stirring rod (501) and is fixedly equipped with a spiral block (403), and the spiral sleeve (503) meshes with the spiral block (403); A spring (504) is provided inside the spiral sleeve (503), and the two ends of the spring (504) abut against the spiral block (403) and the stirring rod (501) respectively. The stirring rod (501) extends into the preheating chamber (102) and is fixedly connected to multiple sets of fan blades (505). The multiple sets of fan blades (505) are evenly distributed on the stirring rod (501) in a circle, and the fan blades (505) are located below the first heating wire (4). The heat-conducting plate (401) is provided with multiple heat dissipation holes for ventilation. The bottom of the workbench (1) is provided with a soldering chamber (103) for soldering circuit boards. A solder spray gun (7) is provided in the soldering chamber (103). A pump body (6) is fixedly connected in the solder bath (5). The input end of the pump body (6) is connected to the solder bath (5) through a pipe (601). The output end of the pump body (6) is connected to the solder spray gun (7) through a pipe (602). A drive component for driving the solder spray gun (7) to move is provided in the soldering chamber (103). The drive assembly includes a transverse screw (703) rotatably connected within the welding chamber (103). The workbench (1) is equipped with a motor 2 for driving the horizontal screw (703) to rotate. A slider 1 is threaded onto the horizontal screw (703). A motor 3 is fixedly connected to the slider 1. A longitudinal screw (702) is fixedly connected to the output end of the motor 3. A slider 2 is threaded onto the longitudinal screw (702). A second cylinder (701) is fixedly connected to the slider 2. The solder spray gun (7) is fixedly connected to the output end of the second cylinder (701).

2. The preheating device for welding glass material circuit boards according to claim 1, characterized in that, The drive unit includes four sets of first cylinders (202), which are evenly and fixedly connected to the circumference of the turntable (201). Among them, the shelf (3) is provided in four sets, and the four sets of shelf (3) are respectively fixedly connected to the output end of the first cylinder (202). The bottom of the shelf (3) is symmetrically provided with a storage groove (301) for fixing the circuit board. The storage groove (301) is rotatably provided with guide rollers (302) that abut against the left and right sides of the circuit board.

3. The preheating device for welding glass material circuit boards according to claim 2, characterized in that, The top of the solder spray gun (7) is fixedly connected to an air suction hood (11), and a negative pressure channel (1101) is opened inside the air suction hood (11). A vacuum pump (10) connected to the negative pressure channel (1101) is fixedly installed inside the workbench (1).

4. The preheating device for welding glass material circuit boards according to claim 3, characterized in that, The input end of the vacuum pump (10) is connected to the negative pressure channel (1101) through pipe three (1001). The top of the workbench (1) is provided with a drying chamber (104). A filter block is fixedly installed in the drying chamber (104). The output end of the vacuum pump (10) is connected to the filter block through pipe four (1002).

5. A preheating device for welding glass material circuit boards according to claim 4, characterized in that, A push rod two (9) is slidably disposed inside the drying chamber (104). A sealing plate (901) is fixedly connected to the bottom of the push rod two (9). A nozzle (902) for blowing the welding point is slidably connected inside the drying chamber (104). The bottom of the nozzle (902) is fixedly connected to the sealing plate (901), and an air inlet (903) is opened at the bottom of the nozzle (902). A spring three is sleeved on the push rod two (9). The two ends of the spring three abut against the push rod two (9) and the drying chamber (104) respectively.

6. The preheating device for welding glass material circuit boards according to claim 1, characterized in that, The workbench (1) has a flux chamber (101) on top. A spray pipe (8) for spraying flux is fixedly connected inside the flux chamber (101). A piston plate (801) is slidably arranged inside the flux chamber (101). A push rod (802) is fixedly connected to the piston plate (801). A spring (2) extends out of the flux chamber (101) and is fitted around it. The two ends of the spring (2) abut against the push rod (802) and the flux chamber (101) respectively. A return pipe is provided inside the workbench (1). The return pipe is connected to the flux chamber (101). A valve is fixedly connected to the return pipe.

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