A relay module

By using multiple PCBs distributed along the height direction and three-dimensionally positioned in the relay module, the problems of excessive relay module size and insufficient insulation strength are solved, achieving the effect of smaller installation size and higher insulation strength.

CN114709111BActive Publication Date: 2025-12-16XIAMEN HONGFA ELECTROACOUSTIC CO LTD
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Patent Information

Application Number
CN202210334915.0
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2022-03-31
Publication Date
2025-12-16
Estimated Expiration
2042-03-31

AI Technical Summary

Technical Problem

When multiple relays are installed side by side, existing relay modules have large length and/or width dimensions, making it difficult to meet the requirements for smaller installation sizes. In addition, the air gap between contact groups is small, making it difficult to use in environments with high insulation strength requirements.

Method used

Multiple PCBs are distributed along the height direction, with external terminals staggered in the height direction. The PCBs are connected by electrical connectors and are three-dimensionally positioned by the shell and base to achieve multi-layer distribution.

Benefits of technology

The overall length and width dimensions were reduced, the insulation strength was improved to meet the requirements of overvoltage category III, and the shock resistance and dustproof capability were also improved.

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Abstract

The application discloses a relay module, which comprises a base and a plurality of PCBs, at least one relay and an external terminal are arranged on each of the PCBs, the plurality of PCBs are arranged on the base, and the plurality of PCBs are arranged in sequence along the height direction of the base, the external terminals on the adjacent PCBs in the height direction are staggered, and the external terminals on each of the PCBs are visible in the top view. The relay module realizes the multi-layer distribution of the plurality of relays, solves the problem that the overall length and / or width of the plurality of relays arranged in a single layer is large and inconvenient to install without affecting the plugging of the wires of the external terminals. Meanwhile, the multi-layer distribution of the plurality of relays greatly reduces the density of the relays on each layer of the PCBs, so that the air gap between the relay contact groups is larger, the insulation strength is higher, and the requirement of overvoltage category III is met.
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Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of relays, in particular to a relay module. BACKGROUND

[0002] The relay module, also known as IO module, guide rail type relay, etc., generally includes a base, a PCB board, a plurality of relays arranged on the PCB board, a plurality of external terminals, etc. The plurality of relays are arranged along the length direction and / or width direction of the base on the PCB, resulting in that when the number of relays is large, the overall length and / or width size is large. With the reduction of the cabinet in the industry, the relay module is required to have smaller installation size (narrower length and / or width), but the relay module products in the prior art cannot meet the requirement of further reducing the length and / or width due to the limitation of the number and size of components. At the same time, since the plurality of relays are installed side by side on the same PCB board, the air gap between the contact groups is small, which is difficult to be applied in the environment with high insulation strength requirement (such as overvoltage category III). SUMMARY

[0003] The present application provides a relay module which adopts the mode of distributing a plurality of PCB boards in the height direction, thereby greatly reducing the overall length and / or width size.

[0004] The technical scheme adopted by the present application to solve the technical problem is: a relay module, comprising a base, and a plurality of PCB boards, at least one relay and an external terminal are arranged on each PCB board, the plurality of PCB boards are respectively mounted on the base, and the plurality of PCB boards are sequentially distributed along the height direction of the base, the external terminals on the upper and lower adjacent PCB boards are staggered in the height direction, and the external terminals on each PCB board are visible in the top view state.

[0005] Further, the external terminals on the bottom PCB board include input terminals and output terminals, the external terminals on the remaining PCB boards are output terminals, and the upper and lower adjacent PCB boards are electrically connected to each other by using an electrical connecting piece; or, the external terminals on each PCB board respectively include input terminals and output terminals.

[0006] Further, the base includes a base and two support walls which are arranged on the base and extend upward, the two support walls are oppositely distributed in the width direction of the base; the bottom PCB board is arranged on the base, and the remaining PCB boards are arranged on the two support walls, and the two support walls are respectively provided with a positioning structure matched with the remaining PCB boards; the relays and the external terminals on each PCB board are respectively distributed along the length direction of the base.

[0007] Further, the shell is connected to the base and covers at least the top PCB and the relays and external terminals thereon, and the shell is provided with openings allowing the corresponding external terminals to be visible in a top view.

[0008] Further, the shell is provided with a plurality of downward extending limiting structures, the top surface of each PCB is pressed by at least one limiting structure, and each limiting structure is a limiting wall or a limiting rib; and / or, the top end of each external terminal on the PCB is limited by the shell.

[0009] Further, the bottom PCB is snap-connected to the base, and / or the bottom PCB is glued to the base.

[0010] Further, the top PCB is glued to the two support walls, the top end of each support wall is provided with an upward extending lip, and the lip and the top surface of the support wall form a glue dispensing area; the two support walls are provided with a positioning structure matched with the remaining PCBs.

[0011] Further, a plurality of status indicator lights are arranged on the top PCB, and the upper and lower adjacent PCBs are electrically connected by an electrical connector; further comprising a plurality of light guide columns, the shell is provided with a plurality of light guide column mounting tubes penetrating upward and downward, the plurality of light guide columns are respectively arranged in the corresponding light guide column mounting tubes, and the lower end of each light guide column corresponds to one of the status indicator lights.

[0012] Further, the shell is snap-connected to the base; the base is provided with a guide rail buckle at the bottom end, and a reset spring is arranged between the shell and the base.

[0013] Further, the number of relays on each PCB is two, and the relays are distributed along the width direction of the base; the number of PCBs is at least two.

[0014] Compared with the prior art, the present application has the following advantages:

[0015] 1. Since the present application further comprises a plurality of PCBs, the PCBs are arranged in sequence along the height direction of the base, and the external terminals on the upper and lower adjacent PCBs are staggered in the height direction, and the external terminals on each PCB are visible in a top view, so that the present application realizes a multi-layer distribution of multiple relays, and solves the problem of large overall length and / or width of single layer distribution of multiple relays without affecting the pluggable wires of the external terminals. At the same time, the multi-layer distribution of multiple relays greatly reduces the density of relays on each layer of PCBs, so that the air gap between the relay contact groups (loops) is larger and the insulation strength is higher, meeting the requirements of overvoltage category III.

[0016] 2. The outer shell, together with the base, can perform three-dimensional positioning of each PCB board, thereby providing good shock resistance and stable operation for each PCB board. At the same time, the outer shell can also serve as a dustproof function.

[0017] The present invention will be further described in detail below with reference to the accompanying drawings and embodiments; however, the relay module of the present invention is not limited to the embodiments. Attached Figure Description

[0018] Figure 1 This is a three-dimensional structural schematic diagram of the present invention as shown in Embodiment 1;

[0019] Figure 2 This is a top view of the present invention in Embodiment 1;

[0020] Figure 3 This is a cross-sectional view of the present invention, Embodiment 1;

[0021] Figure 4 This is a schematic diagram showing the distribution of several PCB boards according to Embodiment 1 of the present invention;

[0022] Figure 5 This is a three-dimensional structural diagram of the base of the present invention in Embodiment 1;

[0023] Figure 6 This is a three-dimensional structural diagram of the guide rail buckle of the present invention in Embodiment 1;

[0024] Figure 7 This is a three-dimensional structural diagram of several PCB boards of the present invention assembled on the base, as shown in Embodiment 1.

[0025] Figure 8 This is a three-dimensional structural schematic diagram of the outer shell of the present invention in Embodiment 1;

[0026] Figure 9 This is a top view of the outer casing of the present invention in Embodiment 1;

[0027] Figure 10 This is a bottom view of the outer casing of the present invention in Embodiment 1;

[0028] Figure 11 This is Example 1 Figure 9 AA section view;

[0029] Figure 12 This is Example 1 Figure 11 Enlarged schematic diagram of part B in the middle;

[0030] Figure 13 This is a three-dimensional structural schematic diagram of the present invention as shown in Embodiment 2;

[0031] Figure 14 This is a cross-sectional view of the present invention in Embodiment 2;

[0032] Figure 15 is a schematic view of the three-dimensional structure of the present application of Example 3;

[0033] Figure 16 is a sectional view of the present application of Example 3;

[0034] Figure 17 is a schematic view of the distribution of several PCBs of the present application of Example 3. DETAILED DESCRIPTION

[0035] In the description of the present application, unless otherwise specified, "several", "at least two" means two or more. The association relationship of "and / or" describing the associated objects means that there can be three relationships, for example, A, and / or B, which can mean: A exists alone, A and B exist together, and B exists alone.

[0036] Example 1

[0037] Please see Figures 1-12 As shown in the figure, the relay module of the present application comprises a base 1 and several PCBs, at least one relay and an external terminal are respectively arranged on each PCB, the several PCBs are respectively mounted on the base 1, and the external terminals on the upper and lower adjacent PCBs are staggered in the height direction, and the external terminals on each PCB are visible in the top view. Therefore, the several PCBs realize a multi-layer distribution form, and at least one relay is arranged on each PCB, which also realizes a multi-layer distribution form of the relays, solving the problem of large overall length and / or width when a plurality of relays are distributed in a single layer, which is not convenient for installation.

[0038] In the present embodiment, the number of PCBs is specifically two, but is not limited thereto, and in other embodiments, the number of PCBs is more than two. In order to facilitate distinction, the two PCBs are sequentially named as a top layer PCB 3 and a bottom layer PCB 2, the top layer PCB 3 being the PCB at the top layer, and the bottom layer PCB 2 being the PCB at the bottom layer. The number of relays on each PCB is specifically at least two, specifically two, but is not limited thereto, and in other embodiments, the number of relays on each PCB is one or more than two. The two relays 21 / 31 on each PCB are distributed along the width direction of the base 1, and the relays 21 / 31 on each PCB and the external terminals are distributed along the length direction of the base 1.

[0039] In the present embodiment, as Figure 4As shown, the external terminals on the bottom PCB 2 include input terminals 23 and output terminals 22, and the external terminals on the rest of the PCBs (i.e. the top PCB 3) are output terminals 32. The PCBs are electrically connected to each other by electrical connectors between the adjacent PCBs, so that the input terminals 23 of the bottom PCB 2 are shared by two PCBs, and the relay 21 on the bottom PCB 2 is located between the input terminal 23 and the output terminal 22 thereof. The input terminal corresponds to the coil part of the relay, and the two are electrically connected through the PCB. The output terminal corresponds to the contact part of the relay, and the two are electrically connected through the PCB. The output terminals on each PCB are respectively in close contact with the corresponding relay, so that the copper foil width of the output terminal can be maximized and the length thereof can be minimized, so that a larger current can be carried, and the current passing capacity of the relay module is increased while the installation size is reduced. The electrical connector is specifically a pin header 8, but is not limited thereto. In other embodiments, the electrical connector is any one of a wire (including a hard wire and a soft wire), a wire harness including a connector, an FPC, a directly connected connector, etc.

[0040] In this embodiment, as shown in Figure 5 The base 1 includes a base 11 and two support walls 12 extending upward from the base 11 and oppositely distributed in the width direction of the base 11. The bottom PCB 2 is arranged on the base 11, and the freedom degrees of the bottom PCB 2 in the length direction and the width direction of the base 1 are limited by the base 11. The rest of the PCBs (i.e. the top PCB 3) are arranged on the two support walls 12, and the two support walls 12 are respectively provided with a positioning structure matched with the rest of the PCBs to limit the freedom degrees of the rest of the PCBs (i.e. the top PCB 3) in the length direction and / or the width direction of the base 1. The positioning structure specifically includes a plurality of positioning holes arranged on the top PCB 3 and a plurality of positioning protrusions 121 arranged on the top surfaces of the two support walls 12, and the positioning protrusions 121 are one-to-one inserted into the positioning holes.

[0041] In this embodiment, the application further includes a shell 4 connected to the base 1 and covering at least the top PCB 3, the relay 31 and the external terminals thereon, and the shell 4 is provided with a gap opening through which the corresponding external terminals can be seen in a top view. As shown in Figures 8-12 The shell 4 is provided with a plurality of limiting structures extending downward, and the top surfaces of the PCBs are respectively pressed by at least one limiting structure to limit the upward freedom degrees of the PCBs. Each limiting structure is a limiting wall or a limiting rib. Specifically, the shell 4 is provided with three limiting walls and two limiting ribs 46. The three limiting walls are respectively located in the width direction of the base 1. For the sake of distinction, the three limiting walls are respectively named as a first limiting wall 41, a second limiting wall 42 and a third limiting wall 43.Figure 8 As shown in the figure, the first limiting wall 41 presses the left end of the top layer PCB board 3, the second limiting wall 42 and the third limiting wall 43 press the left end and the right end of the bottom layer PCB board 2 respectively, the first limiting wall 41 and the second limiting wall 42 are on the same side of the shell 4 and staggered vertically. The two limiting ribs 46 and the third limiting wall 43 are on the same side of the shell 4 and press the right end of the top layer PCB board 3. Thus, under the cooperation of the shell 4 and the base 1, each PCB board is effectively positioned in three dimensions, so that each PCB board has good shockproof effect and stable working state.

[0042] In this embodiment, the top layer PCB board 3 can also be bonded to the two support walls 12 by using glue, and the outer side of the top end of the two support walls 12 is respectively provided with an upwardly extending lip 122, which forms a glue dispensing area with the top surface of the support wall 12. The bottom layer PCB board 2 can also be bonded to the base 1 by using glue, and when bonding by using glue, glue can be applied on the base first and / or glue can be applied on the back surface of the bottom layer PCB board before the bottom layer PCB board is placed on the base.

[0043] In this embodiment, a plurality of state indicator lights 33 are arranged on the top layer PCB board 3. Since the PCB boards adjacent to each other are electrically connected by using electrical connecting members, the working state of the relay 21 on the bottom layer PCB board 2 and above can be indicated by a part of the state indicator lights on the top layer PCB board 3. The present application also includes a plurality of light guide columns 5, the inside of the shell 4 is provided with a plurality of light guide column mounting cylinders 44 which are vertically through, the plurality of light guide columns 5 are respectively arranged in the corresponding light guide column mounting cylinders 44, and the lower end of each of the plurality of light guide columns 5 corresponds to one of the plurality of state indicator lights. The arrangement of the light guide column mounting cylinders 44 can reduce light leakage and effectively position the light guide columns 5. The upper end of the light guide column mounting cylinder 44 is provided with a recess 441, which not only helps to position the light guide column 5 (the upper end of the light guide column 5 is provided with an outer flange 51 which can be lapped in the recess 441), but also makes the visible area of the upper end of the light guide column 5 larger, so that the light guide area of the upper end of the light guide column 5 is larger and the light guide effect is better.

[0044] In this embodiment, the shell 4 is snap connected with the base 1. Specifically, the two opposite shell walls of the shell 4 in the width direction of the base 1 are respectively snap connected with the base 1: the bottom end of each of the two shell walls is provided with a plurality of snap square holes 45, the base 1 is provided with a snap boss 111 at the position corresponding to each of the snap square holes 45, and the snap square hole 45 and the snap boss 111 are snap fitted one by one. The two shell walls are respectively formed with arcuate notches for avoiding the two support walls 12 of the base 1.

[0045] In this embodiment, the base 1 is provided with a guide rail snap 6 at the bottom end, and a reset spring 7 is arranged between the guide rail snap 6 and the base 1, and the structure of the guide rail snap 6 is as shown inFigure 6 As shown. This makes the invention suitable for installation on a guide rail, and during installation, the guide rail latch 6 and the return spring 7 cooperate to be installed into the latch mounting groove of the guide rail.

[0046] This invention discloses a relay module that integrates multiple relays in a multi-layer distribution. This solves the problem of large overall length and / or width, which is inconvenient for installation when multiple relays are distributed in a single layer, without affecting the insertion and removal of external terminal wires. Simultaneously, the multi-layer distribution of multiple relays significantly reduces the density of relays on each PCB layer, thereby allowing for larger air gaps and higher insulation strength between relay contact groups (circuit connections), meeting the requirements of overvoltage category III.

[0047] Example 2

[0048] Please see Figure 13 , Figure 14 As shown, the relay module of the present invention differs from the above-described embodiment in that the bottom PCB board 2 is snap-fitted to the base 1. Specifically, the bottom PCB board 2 has several locking holes 24, and the base 11 of the base 1 has several hooks 112, each hook 112 corresponding to a locking hole 24. Each hook 112 passes upward through the corresponding locking hole 24 and hooks onto the top surface of the bottom PCB board 2. The top PCB board 3 can also be glued to the two support walls 12. Therefore, the outer shell 4 does not need to be provided with the limiting wall.

[0049] In this embodiment, the electrical connector is a wire harness 9 containing a connector, but it is not limited to this. In other embodiments, the electrical connector is any one of pin headers, wires (including rigid wires and flexible wires), FPCs, direct-connection connectors, etc.

[0050] In this embodiment, the top ends of the external terminals on each PCB board are respectively constrained by the outer casing 4. Specifically, the top wall of the outer casing 4 presses against or approaches the output terminal 32 on the top PCB board 3, and the bottom ends of the two shell walls of the outer casing 4 along the length direction of the base 1 respectively press against or approach the input terminal 23 and the output terminal 22 on the bottom PCB board 2, as shown below. Figure 10 As shown. In this way, by using the outer casing 4 to restrict the upward degree of freedom of each external terminal, the state of the external terminals on each PCB board is more stable when they are inserted or removed under force.

[0051] Example 3

[0052] Please see Figures 15-17As shown, the relay module of the present application is different from the second embodiment in that the external terminals on the top PCB 3 include input terminals 34 and output terminals 32, and the relay 31 on the top PCB 3 is located between the input terminals 34 and the output terminals 32, and the three are distributed along the length direction of the base 1.

[0053] In this embodiment, the bottom PCB 2 is also snap-connected to the base 1: the bottom PCB 2 is provided with a plurality of snap holes 24, and the base 11 of the base 1 is provided with a plurality of snap hooks 112, which correspond one-to-one to the snap holes 24, and each snap hook 112 passes through the corresponding snap hole 24 upward and hooks the top surface of the bottom PCB 2. The top PCB 3 is also glued to the two support walls 12.

[0054] In this embodiment, the electrical connection is also a wire harness 9 containing a connector, but it is not limited to this, and in other embodiments, the electrical connection is any one of a pin header, a wire (including a hard wire and a soft wire), an FPC, a directly connected connector, etc.

[0055] In this embodiment, the top ends of the external terminals on each PCB are respectively limited by the shell 4. Specifically, the top wall of the shell 4 presses or approaches the input terminals 34 and the output terminals 32 on the top PCB 3, and the bottom ends of the two shell walls of the shell 4 in the length direction of the base 1 press or approach the input terminals 23 and the output terminals 22 on the bottom PCB 2, as shown. Figure 12 In this way, the shell 4 limits the upward freedom of each external terminal, making the state of each PCB more stable when the external terminals are inserted and pulled.

[0056] The relay module of the present application is not involved in the same or can be realized by using the prior art.

[0057] The above embodiments are only used to further illustrate the relay module of the present application, but the present application is not limited to the embodiments, and any simple modification, equivalent change and modification made according to the technical essence of the present application to the above embodiments all fall within the protection scope of the technical scheme of the present application.

Claims

1. A relay module, comprising a base, characterized in that: It also includes several PCB boards, each PCB board is provided with at least one relay and an external terminal, the several PCB boards are respectively mounted on the base, and the several PCB boards are distributed sequentially along the height direction of the base, the external terminals on the adjacent PCB boards are staggered in the height direction, and the external terminals on each PCB board are visible in the top view. The external terminals on the bottom PCB include input terminals and output terminals, while the external terminals on the remaining PCBs are output terminals. The PCBs on adjacent floors are electrically connected to each other using electrical connectors; or, the external terminals on each PCB include input terminals and output terminals respectively.

2. The relay module according to claim 1, characterized in that: The base includes a base and two support walls disposed on the base and extending upward therefrom, the two support walls being distributed opposite each other in the width direction of the base; the bottom PCB board is disposed on the base, and the remaining PCB boards are disposed on the two support walls; the relays and external terminals on each PCB board are respectively distributed along the length direction of the base.

3. The relay module according to claim 1 or 2, characterized in that: It also includes a housing that is connected to the base and at least covers the top PCB board and the relays and external terminals thereon, and the housing has clearance openings that make the corresponding external terminals visible from a top view.

4. The relay module according to claim 3, characterized in that: The outer casing is provided with several downwardly extending limiting structures, and the top surface of each PCB board is pressed by at least one limiting structure, each limiting structure being a limiting wall or a limiting rib; and / or, the top ends of the external terminals on each PCB board are respectively constrained by the outer casing.

5. The relay module according to claim 1 or 2, characterized in that: The bottom PCB board is snapped to the base, and / or the bottom PCB board is glued to the base.

6. The relay module according to claim 2, characterized in that: The top PCB board is glued to the two support walls. The top outer sides of the two support walls are respectively provided with upwardly extending lips, and the lip and the top surface of the support wall form a glue application area. The two support walls are respectively equipped with positioning structures to cooperate with the other PCB boards.

7. The relay module according to claim 3, characterized in that: Several status indicator lights are set on the top PCB board, and the PCB boards above and below are electrically connected by electrical connectors; it also includes several light guide pillars, and several vertically penetrating light guide pillar mounting cylinders are provided inside the housing. The several light guide pillars are respectively inserted into the corresponding light guide pillar mounting cylinders, and the lower ends of the several light guide pillars correspond one-to-one with the several status indicator lights.

8. The relay module according to claim 3, characterized in that: The outer shell is snapped together with the base; the bottom of the base is equipped with a guide rail snap, and a return spring is fitted between the two.

9. The relay module according to claim 1 or 2, characterized in that: The number of relays on each PCB is at least two, and they are distributed along the width direction of the base; the number of PCB boards is at least two.

Citation Information

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