A uniform coating system

Abstract

The application provides a uniform glue system and relates to the technical field of photoetching processes. The uniform glue system comprises a light source, a projection fixture and a base. The light source is used for projecting light. The projection fixture is located below the light source. The base is located directly below the projection fixture and is used for fixing and rotating the substrate with the central straight line as the axis. The projection of the light source after the projection fixture is projected on the upper surface of the base, and the shape and size of the projection profile correspond to the substrate respectively, and are used for positioning the substrate. The central straight line passes through the center of the base and is perpendicular to the upper surface of the base. The technical scheme can realize non-contact and rapid centering operation of the substrate, and can solve the technical problem that the substrate needs to use a clamp when being centered and is easy to scratch.

Description

Technical Field

[0001] This application relates to the field of photolithography technology, and in particular to a spin coating system. Background Technology

[0002] Photolithography is an important basic process in semiconductor manufacturing. Its technical quality affects product performance and yield. As the first key step in the photolithography process, the coating of photoresist has a particularly important impact on subsequent processes.

[0003] Coating photoresist, also known as spin coating, typically employs a spin coating method. The photoresist is centrifuged, forming a relatively uniform thin film on the substrate. For transparent optical devices, if the photoresist layer is uneven, the device's uniformity is poor, resulting in inconsistent transmittance and reflectivity, and hindering effective quality control. Therefore, in the spin coating process, to improve the uniformity of the photoresist layer, the photoresist is dropped into the center of the optical device before being rotated.

[0004] However, existing optical devices require alignment clamps for alignment. During the operation, the optical device needs to be inserted into the alignment clamp, and then the clamp is removed after alignment. This process may scratch and contaminate the optical device to be processed, affecting the production quality of the optical device. Severe scratches may even lead to the scrapping of the optical device, reducing production efficiency and increasing production costs. Summary of the Invention

[0005] The purpose of this application is to provide a spin coating system to avoid contamination and scratches on the substrate during the centering and positioning process of the substrate in the spin coating process.

[0006] To address the aforementioned technical problems, this application provides the following technical solutions:

[0007] This application provides a spin coating system for spin coating of a substrate, the spin coating system comprising:

[0008] A light source, used to project light;

[0009] The projection fixture is located below the light source;

[0010] The base, located directly below the projection fixture, is used to fix the substrate and rotate it around the central line as an axis;

[0011] The projection of the light source onto the projection fixture is projected onto the upper surface of the base, and the shape and size of the projection outline correspond to the substrate, which is used for positioning the substrate.

[0012] The central line passes through the center of the base and is perpendicular to the upper surface of the base.

[0013] In some modified embodiments of this application, the base includes: a boss and a mounting platform;

[0014] The boss is located at the upper center of the mounting platform, and its upper surface is the first surface;

[0015] The mounting platform is used to rotate the boss, and its upper surface is a second surface. The second surface is arranged around the boss, and the projection of the projection fixture after the light source illuminates it is projected onto the second surface.

[0016] A vacuum through hole is provided at the center of the boss and the mounting platform to provide a vacuum to hold the substrate.

[0017] In some modified embodiments of this application, a cleaning channel is provided on the upper outer periphery of the boss;

[0018] The cleaning channel includes: a liquid storage tank and at least one drain channel;

[0019] The first end of the drainage channel is connected to the storage tank, and the second end of the drainage channel extends to the outer periphery of the boss.

[0020] In some modified embodiments of this application, the number of liquid storage tanks is one, and they are arranged in a ring on the first surface, with the center of the ring located on the central straight line.

[0021] In some modified embodiments of this application, the number of the liquid storage tanks is at least two, and they are symmetrically distributed about the central axis.

[0022] In some modified embodiments of this application, the drainage channel is an inclined groove, and its second end is offset by a certain angle from the first end in the same direction as the rotation direction of the base.

[0023] In some modified embodiments of this application, the projection fixture includes: a projection element and a first mounting element;

[0024] The first mounting component is located on the side of the projection component and is used to mount the projection component;

[0025] The projection element is ring-shaped and located directly below the light source. The shape of its inner or outer contour is the same as that of the substrate.

[0026] In some modified embodiments of this application, the first mounting member is a telescopic member, and its telescopic direction is a first direction, used to adjust the position of the projection member in the first direction;

[0027] Wherein, the first direction is parallel to the central straight line.

[0028] In some modified embodiments of this application, it further includes: a second mounting component, which is a telescopic component, and its telescopic direction is a first direction, used to install and adjust the position of the light source in the first direction;

[0029] Wherein, the first direction is parallel to the central straight line.

[0030] In some modified embodiments of this application, a rubber ring is further included, which is disposed on the first surface and located between the cleaning channel and the vacuum through hole.

[0031] Compared to existing technologies, the photoresist coating system provided in this application positions the substrate by projecting the projection onto the base using a light source. This enables safe and rapid substrate alignment, solving the technical problem of easily scratching the substrate when using jigs for alignment, affecting the substrate's processing quality, or even scrapping the substrate and increasing production costs. Furthermore, the first surface of the boss is equipped with cleaning channels, which can discharge the developer when the boss rotates. The developer is used to clean the lower surface of the substrate, preventing photoresist backflow caused by improper use of photoresist and leaving residual photoresist on the lower surface of the substrate. This eliminates the need for subsequent cleaning of the lower surface of the substrate, shortens processing time, and increases production efficiency. Attached Figure Description

[0032] The above and other objects, features, and advantages of exemplary embodiments of this application will become readily understood by reading the following detailed description with reference to the accompanying drawings. In the drawings, several embodiments of this application are illustrated by way of example and not limitation, with the same or corresponding reference numerals denoteing the same or corresponding parts, wherein:

[0033] Figure 1 A schematic diagram of the spin coating system provided in an embodiment of this application is shown.

[0034] Figure 2 A schematic top view of the base provided in an embodiment of this application is shown.

[0035] The reference numerals in the attached diagram are as follows: 1. Light source; 2. Projection fixture; 21. Projection component; 22. First mounting component; 3. Base; 31. Mounting platform; 32. Boss; 33. Vacuum through hole; 34. First surface; 35. Second surface; 36. Drainage channel; 361. Storage tank; 362. Drainage passage; 37. Rubber ring; 4. Substrate; 4. Center line a; First direction b. Detailed Implementation

[0036] Exemplary embodiments of the present disclosure will now be described in more detail with reference to the accompanying drawings. While exemplary embodiments of the present disclosure are shown in the drawings, it should be understood that the present disclosure may be implemented in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the disclosure to those skilled in the art.

[0037] It should be noted that, unless otherwise stated, the technical or scientific terms used in this application shall have the ordinary meaning as understood by one of ordinary skill in the art to which this application pertains.

[0038] Example

[0039] Reference Appendix Figure 1 and attached Figure 2 An embodiment of the present invention provides a coating system comprising: a light source 1, a projection fixture 2, and a base 3; the light source is used to project light; the projection fixture 2 is located below the light source 1; the base 3 is located directly below the projection fixture 2 and is used to fix and rotate the substrate 4 around a central straight line a; the projection of the light source 1 onto the projection fixture 2 is projected onto the upper surface of the base 3, and the shape and size of the projection outline correspond to the substrate 4, for positioning the substrate 4; wherein, the central straight line a passes through the center of the base 3 and is perpendicular to the upper surface of the base 3.

[0040] Specifically, the substrate 4 can be, but is not limited to, an optical device in the shape of a disc to be processed; the light source 1 can be, but is not limited to, an LED lamp that emits yellow light, because the photoresist is not sensitive to yellow light, thus preventing the photoresist from being exposed to other light and causing changes in its properties; the specific structure of the projection fixture 2 is described below; the base 3 can be, but is not limited to, a vacuum suction cup base 3, which can adsorb the substrate 4 and rotate it around the central straight line a as an axis, driving the substrate 4 to perform a homogenization operation; wherein, refer to the attached... Figure 1As shown in the figure, the central straight line a is a straight line that passes through the center of the base 3 and is perpendicular to the upper surface of the base 3. The light source 1 emits yellow light towards the side where the projection element 21 of the projection fixture 2 is located. Due to the blocking of the light by the projection element 21, the resulting projection is mapped onto the base 3. The outline shape and size of the projection are the same as those of the substrate 4. When placing the substrate 4, it can be aligned and positioned by referring to the projection, so that the photoresist can be dropped at the center of the substrate 4 during the dispensing operation. This avoids the photoresist being skewed when it drops, which would cause uneven dispersion of the photoresist during the rotation of the substrate 4 for uniform dispensing, affecting the uniformity of the photoresist film. Positioning and centering the substrate 4 by projection eliminates the need for inserting and removing the alignment fixture, increasing work efficiency. It also avoids the contamination and scratches caused by the existing alignment fixture to the substrate 4, which would affect the production quality of the substrate 4, or even lead to the scrapping of the substrate 4, reducing production efficiency and increasing production costs.

[0041] In the specific operation process, first turn on the light source 1, and use the outline of the projection on the upper surface of the base 3 to center and place the substrate 4 on the base 3. Then, use the vacuum adsorption function of the base 3 to adsorb the substrate 4 onto the base 3. Then, use the dispensing device to dispense the photoresist to the center of the substrate 4. After the dispensing is completed, the base 3 drives the substrate 4 to rotate to perform the uniform dispensing operation, so that the photoresist is formed on the substrate 4 with good uniformity due to centrifugal force.

[0042] Based on the above, this embodiment of the invention proposes a photoresist coating system that positions the substrate 4 by illuminating the projection of the projector onto the base with a light source. This enables safe and rapid centering of the substrate 4, solving the technical problem that using a jig for centering can easily contaminate and scratch the substrate 4, affecting the processing quality of the substrate 4 or even scrapping it, thus increasing production costs. Furthermore, the first surface of the boss is provided with a cleaning channel, which can discharge the developing solution when the boss rotates. The developing solution is used to clean the lower surface of the substrate 4, avoiding photoresist backflow caused by improper use of photoresist, leaving residual photoresist on the lower surface of the substrate 4. This eliminates the need for subsequent cleaning of the lower surface of the substrate 4, shortens processing time, and increases production efficiency.

[0043] Further, see attached document. Figure 2 In a specific implementation, the base 3 includes a mounting platform 31 and a boss 32; the boss 32 is disposed at the upper center of the mounting platform 31, and its upper surface is a first surface 34; the mounting platform 31 is used to rotate the boss 32, and its upper surface is a second surface 35, which surrounds the boss 32, and the projection of the projection fixture 2 after the light source 1 illuminates it is projected onto the second surface 35; a vacuum through hole 33 is provided through the center of the boss 32 and the mounting platform 31 to provide a vacuum to hold the substrate 4.

[0044] Specifically, the boss 32 can be cylindrical, but is not limited to a cylindrical shape. The diameter of the boss 32 is smaller than the diameter of the substrate 4. The mounting platform 31 can be cylindrical, but is not limited to a cylindrical shape. The diameter of the mounting platform 31 is larger than the diameter of the substrate 4. The boss 32 is mounted on the mounting platform 31. The diameter of the boss 32 is smaller than the diameter of the mounting platform 31, and the axes of both coincide with the central line a. When the mounting platform 31 rotates about the central line a, it can drive the boss 32 to rotate. The boss 32 drives the substrate 4 to rotate, completing the uniform coating operation. The projection is mapped onto the second surface 35 of the mounting platform 31. By observing the outline of the projection, the substrate 4 can be aligned. The vacuum through-hole 33 passes through the boss 32 and the mounting platform 31 and can be connected to an external air compressor. The vacuum adsorption of the substrate 4 onto the first surface 34 of the boss 32 avoids mechanical fixing, such as snap-fit ​​or crimping, which can scratch the substrate 4.

[0045] Further, see attached document. Figure 2 In a specific implementation, a cleaning channel 36 is provided on the upper outer periphery of the boss 32; the cleaning channel 36 includes: a liquid storage tank 361 and at least one drain channel 362; the first end of the drain channel 362 is connected to the liquid storage tank 361, and the second end of the drain channel 362 extends to the outer periphery of the boss 32.

[0046] Specifically, the structure of the storage tank 361 is described below. It is located on the first surface 34 of the boss 32 and can store the developer when the boss 32 is stationary. The drain channel 362 can be, but is not limited to, a straight channel with the same depth as the storage tank 361. The first end of the drain channel 362 is connected to the storage tank 361, and the second end extends to the outer periphery of the boss 32. When the boss 32 rotates, the developer can be discharged from the drain channel 362. Specifically, during the spin coating process, the developer is discharged from the drain channel 362 under the action of centrifugal force and reaches the edge of the substrate 4 together with the photoresist. The developer can clean the photoresist on the lower surface of the substrate 4, avoiding the problem of photoresist backflow to the lower surface of the substrate 4 and sputtering spots caused by improper photoresist usage during the spin coating process. This eliminates the need for subsequent cleaning processes on the lower surface of the substrate 4, shortens production time, and increases production efficiency.

[0047] Further, see attached document. Figure 2 In a specific implementation, the number of liquid storage tanks 361 is one, and they are arranged in a ring on the first surface 34, with the center of the ring located on the central straight line a.

[0048] Specifically, the storage tank 361 can be, but is not limited to, an annular tank, which is arranged around the first surface 34 of the boss 32 and is on the same central line a as the center of the boss 32. When the boss 32 is stationary, the developing solution can be dripped into the storage tank 361, and when the boss 32 rotates, the developing solution is discharged through the drain channel 362.

[0049] Further, see attached document. Figure 2 In specific implementation, the number of the liquid storage tanks 361 is at least two, and they are symmetrically distributed with the central straight line a as the axis.

[0050] Specifically, there can be multiple liquid storage tanks 361, and their shape can be, but is not limited to, rectangular tanks. They are symmetrically distributed on the first surface 34 of the boss 32 with the central straight line a as the axis, so that multiple liquid storage tanks 361 can simultaneously discharge developing solution when the boss 32 rotates.

[0051] Further, see attached document. Figure 2 In a specific implementation, the drainage channel 362 is an inclined groove, and its second end is offset by a certain angle from the first end in the same direction as the rotation direction of the base 3.

[0052] Specifically, the drain channel 362 is an inclined through-slot with its first end connected to the storage tank 361 and its second end extending to the outer periphery of the boss 32. It can drain the developer from the storage tank 361 when the base 3 rotates. Moreover, when the base 3 rotates counterclockwise, the second end deflects at a certain angle counterclockwise relative to the first end. In contrast, the drain channel 362 is a straight through-slot, and its second end does not deflect. This structure allows the developer to drain from the storage tank 361 more smoothly under the action of centrifugal force.

[0053] Further, see attached document. Figure 1 In a specific implementation, the projection fixture 2 includes a projection element 21 and a first mounting element 22; the first mounting element 22 is located on the side of the projection element 21 and is used to mount the projection element 21; the projection element 21 is ring-shaped and located directly below the light source 1, and the shape of its inner or outer contour is the same as that of the substrate 4.

[0054] Specifically, the projection element 21 can be circular, such as a disc or ring. The projection element 21 is positioned directly below the light source 1. When the projection element 21 is ring-shaped, the light from the light source 1 will project a ring-shaped projection onto the second surface 35 of the mounting platform 31. Aligning the inner or outer contour of the ring projection allows for centering of the substrate 4. The projection element 21 is mounted on the first mounting element 22, and the mounting positions of the first mounting element 22 and the projection element 21 are on the side of the projection element 21. This avoids the projection of the first mounting element 22 under the illumination of the light source 1 affecting the centering operation.

[0055] Further, see attached document. Figure 1 In a specific implementation, the first mounting component 22 is a telescopic component, and its telescopic direction is the first direction b, which is used to adjust the position of the projection component 21 in the first direction b; wherein, the first direction b is parallel to the central straight line a.

[0056] Specifically, the first mounting component 22 can be, but is not limited to, an electric push rod with its telescopic end at the upper end for mounting the projection component 21. The first mounting component 22 can extend and retract along the first direction b, thereby moving the projection component 21 and adjusting its position in the first direction b. This changes the relative distance between the projection component 21 and the light source 1, thereby changing the size of the projection on the second surface 35 of the mounting platform 31. This allows for the alignment of substrates 4 of different sizes and specifications.

[0057] Further, see attached document. Figure 1 In a specific implementation, the second mounting component is a telescopic component, and its telescopic direction is a first direction b, which is used to install and adjust the position of the light source 1 in the first direction b; wherein, the first direction b is parallel to the central straight line a.

[0058] Specifically, the second mounting component can be, but is not limited to, an electric push rod. The light source 1 is mounted on the second mounting component, and its position in the first direction b changes as the second mounting component extends and shortens in the first direction b. By changing the position of the light source 1, the distance between the light source 1 and the projection component 21 in the first direction b can be adjusted, thereby changing the size of the projection and enabling the projection to adapt to the centering operation of substrates 4 of different sizes.

[0059] Further, see attached document. Figure 2 In a specific implementation, a rubber ring 37 is disposed on the first surface 34 and located between the cleaning channel 36 and the vacuum through hole 33.

[0060] Specifically, the rubber ring 37 is annular and can be, but is not limited to, a nitrile rubber ring 37. Its diameter is larger than that of the vacuum through hole 33 and does not interfere with the cleaning channel 36. It is set between the cleaning channel 36 and the vacuum through hole 33. When the substrate 4 is adsorbed through the vacuum through hole 33 set in the middle of the boss 32, the rubber ring 37 is sandwiched between the boss 32 and the substrate 4, which can improve the airtightness between the boss 32 and the substrate 4 and improve the adsorption effect of the vacuum through hole 33.

[0061] It should be noted that in the description of this specification, the terms "upper," "lower," etc., indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the present invention; the terms "connection," "installation," "fixing," etc., should be interpreted broadly. For example, "connection" can be a fixed connection, a detachable connection, or an integral connection; it can be a direct connection or an indirect connection through an intermediate medium. For those skilled in the art, the specific meaning of the above terms in the present invention can be understood according to the specific circumstances.

[0062] In the description of this specification, the terms "one embodiment," "some embodiments," "specific embodiment," etc., refer to a specific feature, structure, material, or characteristic described in connection with that embodiment or example, which is included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0063] The above description is merely a specific embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in the present invention should be included within the scope of protection of the present invention. Therefore, the scope of protection of the present invention should be determined by the scope of the claims.

Claims

1. A spin coating system for spin coating of substrates, characterized in that, include: A light source, used to project light; The projection fixture is located below the light source; The base, located directly below the projection fixture, is used to fix the substrate and rotate it around the central line as an axis; The base includes a boss and a mounting platform. The diameter of the boss is smaller than the diameter of the substrate, the diameter of the mounting platform is larger than the diameter of the substrate, and the diameter of the boss is smaller than the diameter of the mounting platform. The boss is located at the upper center of the mounting platform, and its upper surface is the first surface; The mounting platform is used to rotate the boss, and its upper surface is a second surface. The second surface is arranged around the boss, and the projection of the projection fixture after the light source illuminates it is projected onto the second surface. The projection of the light source onto the projection fixture is projected onto the upper surface of the base, and the shape and size of the projection outline correspond to the substrate, which is used for positioning the substrate. The central line passes through the center of the base and is perpendicular to the upper surface of the base; A vacuum through hole is provided through the center of the boss and the mounting platform to provide a vacuum to hold the substrate; A cleaning channel is provided on the upper outer periphery of the boss; The cleaning channel includes: a liquid storage tank and at least one drain channel; The first end of the drain channel is connected to the liquid storage tank, and the second end of the drain channel extends to the outer periphery of the boss; The liquid storage tank can store developer when the boss is stationary, and when the boss rotates, the developer can be discharged from the drain channel. The developer can clean the photoresist on the lower surface of the substrate.

2. The spin coating system according to claim 1, characterized in that, The number of liquid storage tanks is one, and they are arranged in a ring on the first surface, with the center of the ring located on the central straight line.

3. The spin coating system according to claim 2, characterized in that, The number of liquid storage tanks is at least two, and they are symmetrically distributed with the central straight line as the axis.

4. The spin coating system according to claim 1, characterized in that, The drainage channel is an inclined groove, and its second end is offset by a certain angle from the first end in the same direction as the rotation direction of the base.

5. The spin coating system according to claim 1, characterized in that, The projection fixture includes: a projection component and a first mounting component; The first mounting component is located on the side of the projection component and is used to mount the projection component; The projection element is ring-shaped and located directly below the light source. The shape of its inner or outer contour is the same as that of the substrate.

6. The spin coating system according to claim 5, characterized in that, The first mounting component is a telescopic component, and its telescopic direction is a first direction, used to adjust the position of the projection component in the first direction; Wherein, the first direction is parallel to the central straight line.

7. The spin coating system according to claim 1, characterized in that, Also includes: The second mounting component is a telescopic component, and its telescopic direction is a first direction, used to install and adjust the position of the light source in the first direction; Wherein, the first direction is parallel to the central straight line.

8. The spin coating system according to claim 1, characterized in that, Also includes: A rubber ring is disposed on the first surface and located between the cleaning channel and the vacuum through hole.

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