Wafer cleaning feeding device

Abstract

This invention relates to the semiconductor manufacturing industry and provides a wafer cleaning and loading device, including a base, a support fixedly connected to one side of the base, a sliding component, and a cleaning unit. The sliding component is slidably engaged with the support, and a driving component facing the base is fixed on the sliding base. A rod assembly unit is provided at the output end of the driving component, with a friction component on the rod assembly unit and an adsorption component at the other end. The driving component drives the friction component and adsorption component on the rod assembly unit to rotate. The cleaning unit is mounted on the base, and a drive telescopic component is fixedly connected to the support facing the cleaning unit. A guide component is fixedly connected to the other end of the drive telescopic component, extending laterally along the length of the base. Its advantages are: it closely matches the actual cleaning process requirements, saves time that would otherwise require repeated wafer fixing, effectively improves conveying efficiency, and thus enhances the overall working efficiency of the cleaning device.

Description

Technical Field

[0001] This invention belongs to the field of semiconductor manufacturing, and particularly relates to a wafer cleaning and feeding device. Background Technology

[0002] A wafer is a silicon wafer used to fabricate silicon semiconductor circuits; its raw material is silicon. High-purity polycrystalline silicon is dissolved, doped with silicon crystal seeds, and then slowly pulled out to form a cylindrical single-crystal silicon ingot. After grinding, polishing, and slicing, the silicon crystal ingot is formed into a silicon wafer, or crystal.

[0003] After wafer processing and polishing, some organic particles from the original material or metal scraps from the processing machinery will adhere to the surface, so cleaning is necessary, which is a very important step.

[0004] Existing wafer cleaning equipment requires a loading mechanism to place the wafers on a rotating platform for rinsing. After rinsing, the loading mechanism is also responsible for unloading the wafers. This frequent reciprocating movement, similar to a robotic arm gripping the wafers, results in a large working interval for the cleaning equipment and prolongs the overall processing time. Summary of the Invention

[0005] The purpose of this invention is to provide a wafer cleaning and loading device to address the problems mentioned in the background section.

[0006] The present invention is implemented as follows: a wafer cleaning and loading device includes a base, a bracket fixedly connected to one side of the base, and also includes a sliding component and a cleaning unit.

[0007] The sliding member is slidably engaged with the bracket. The sliding member slides along the length of the base. A driving member facing the base is fixed on the sliding base. A rod group unit is provided at the output end of the driving member. A friction member is provided on the rod group unit. An adsorption member is provided at the other end of the rod group unit. The driving member is used to drive the friction member and the adsorption member on the rod group unit to rotate.

[0008] The cleaning unit is mounted on the base, and a drive telescopic component is fixedly connected to the bracket facing the cleaning unit. The other end of the drive telescopic component is fixedly connected to a guide component that is arranged laterally along the length of the base. The drive telescopic component is used to drive the guide component to move laterally and make contact with the friction component.

[0009] Preferably, the guide member consists of a main guide plate and a secondary guide plate. The main guide plate is connected to the drive telescopic member, and the secondary guide plate is fixed at both ends of the main guide plate. The secondary guide plate is inclined, and the end of the secondary guide plate away from the main guide plate is close to the base. Both the main guide plate and the secondary guide plate have slides facing the friction member side. The rod group unit includes an elastic telescopic member disposed at the output end of the drive member. A straight rod is fixed at the other end of the elastic telescopic member, and the adsorption member is fixed at the other end of the straight rod.

[0010] Preferably, a conveying mechanism is provided on both sides of the cleaning unit along the length direction on the base, and the conveying mechanism is used to transport the wafer.

[0011] Preferably, the adsorption component includes a box fixed to one end of the rod assembly unit, a baffle with an opening facing the base is fixedly connected to the side of the box, a suction cup facing the base is provided on the box, and a suction pump connected to the suction cup is provided inside the box.

[0012] Preferably, a ring pipe is provided on the outside of the box body, and several conveying pipes located outside the enclosure are fixed on the ring pipe. The other end of the conveying pipe is connected to a spray pipe fixed on the side wall of the enclosure. The spray pipe is inclined and the other end of the spray pipe is located inside the enclosure, and this end is close to the opening side of the enclosure.

[0013] Preferably, the cleaning unit includes a mounting base fixedly connected to the base, a receiving box with an opening facing the adsorption element on the mounting base, a nozzle inside the receiving box, a delivery pump connected to the nozzle fixed inside the mounting base, and a discharge pipe at the bottom of the receiving box.

[0014] Preferably, the mounting base is provided with a telescopic pipe fitting connected to the receiving box, one end of the telescopic pipe fitting is connected to the output end of the delivery pump, and the other end of the telescopic pipe fitting is connected to the nozzle.

[0015] Preferably, the diameter of the discharge pipe is larger than the diameter of the output end of the delivery pump.

[0016] Preferably, both ends of the guide member are fixedly connected to limit members.

[0017] The wafer cleaning and loading device provided in this invention has the following advantages: This loading device utilizes the motion characteristics of wafers during cleaning. Since the wafers need to rotate during cleaning, an adsorption element is used to fix them, and then a driving element drives them to rotate. During rotation, the contact between the guide element and the friction element can be controlled by a driving telescopic element, allowing the sliding element to move laterally or stop on the support. When the guide element contacts the friction element, it can drive the structure with the fixed wafer to move as a whole. When the guide element separates from the friction element, there is no interaction between them, and the structure with the fixed wafer cannot move; the wafer can only rotate at that position. Therefore, this motion method closely matches the actual cleaning process requirements and saves the time required for repeated wafer fixing, effectively improving conveying efficiency and thus enhancing the overall working efficiency of the cleaning device. Attached Figure Description

[0018] Figure 1 This is a front view of a wafer cleaning and loading device provided in an embodiment of the present invention;

[0019] Figure 2 This is a side view of a wafer cleaning and loading device provided in an embodiment of the present invention;

[0020] Figure 3 A three-dimensional structural diagram of the guide component provided in an embodiment of the present invention;

[0021] Figure 4 This is an internal structural diagram of the adsorption element provided in an embodiment of the present invention;

[0022] Figure 5 This is a schematic diagram of the structure of the cleaning unit provided in an embodiment of the present invention;

[0023] Figure 6 This is a schematic diagram of another form of cleaning unit provided in an embodiment of the present invention;

[0024] In the attached diagram: 1-base; 2-bracket; 3-sliding component; 4-cleaning unit; 401-mounting seat; 402-receiving box; 403-nozzle; 404-transfer pump; 405-discharge pipe; 406-telescopic fitting; 5-adsorption component; 501-box body; 502-enclosure; 503-suction cup; 504-suction pump; 505-ring pipe; 506-transfer pipe; 507-spray pipe; 6-drive telescopic component; 7-guide component; 701-main guide plate; 702-secondary guide plate; 703-slide rail; 8-limiting slide groove; 9-conveying mechanism; 10-limiting component; 11-rod group unit; 1101-elastic telescopic component; 1102-straight rod. Detailed Implementation

[0025] To make the objectives, technical solutions, and advantages of this invention clearer, the invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the invention.

[0026] The specific implementation of the present invention will be described in detail below with reference to specific embodiments. Figure 1 and Figure 2 The diagram shown illustrates the structure of a wafer cleaning and loading device according to an embodiment of the present invention, comprising:

[0027] The base 1 has a bracket 2 fixedly connected to one side, and also includes a sliding part 3 and a cleaning unit 4.

[0028] The sliding member 3 is slidably engaged with the bracket 2. The sliding member 3 slides along the length direction of the base 1. A driving member facing the base 1 is fixed on the sliding seat. A rod group unit 11 is provided at the output end of the driving member. A friction member is provided on the rod group unit 11. An adsorption member 5 is provided at the other end of the rod group unit 11. The driving member is used to drive the friction member and the adsorption member 5 on the rod group unit 11 to rotate.

[0029] The cleaning unit 4 is mounted on the base 1. A drive telescopic component 6 is fixedly connected to the bracket 2 facing the cleaning unit 4. A guide component 7 is fixedly connected to the other end of the drive telescopic component 6 along the length direction of the base 1 and arranged laterally. The drive telescopic component 6 is used to drive the guide component 7 to move laterally and come into contact with the friction component.

[0030] In one embodiment of the present invention, the feeding device utilizes the motion characteristics during wafer cleaning. Since the wafer needs to rotate during cleaning, an adsorption element 5 is used to fix the wafer, and then a driving element drives its rotation. During rotation, the contact between the guide element 7 and the friction element can be controlled by the drive telescopic element 6, thus enabling the sliding element 3 to move laterally or stop on the support 2. When the guide element 7 contacts the friction element, it can drive the structure with the fixed wafer to move as a whole. When the guide element 7 separates from the friction element, there is no interaction between them, and the structure with the fixed wafer cannot move; the wafer can only rotate at that position. Therefore, this motion method closely matches the actual cleaning process requirements and saves the time required for repeated wafer fixing, effectively improving the conveying efficiency and thus enhancing the overall working efficiency of the cleaning device.

[0031] In one embodiment of the present invention, the support 2 includes a column and a crossbar. A limiting groove 8 is formed on the crossbar. The sliding member 3 can be a moving disk or a slider, but it needs to be engaged within the limiting groove 8. The driving member can be a motor, or a hydraulic motor, as long as it can output rotational motion. The friction member can be a friction wheel or a friction ball. The adsorption member 5 can be a piston structure, capable of adsorbing and fixing the wafer during continuous operation. The driving telescopic member 6 can be an electric push rod, or a hydraulic telescopic rod, as long as it can drive the guide member 7 to move laterally. Both ends of the guide member 7 are fixedly connected to limiting members 10, which can be baffles or blocks to restrict the travel of the friction member.

[0032] like Figure 1 and Figure 3 As shown, in a preferred embodiment of the present invention, the guide member 7 is composed of a main guide plate 701 and a secondary guide plate 702. The main guide plate 701 is connected to the drive telescopic member 6. The secondary guide plate 702 is fixed at both ends of the main guide plate 701. The secondary guide plate 702 is inclined, and the end of the secondary guide plate 702 away from the main guide plate 701 is close to the base 1. Both the main guide plate 701 and the secondary guide plate 702 have slides 703 facing the friction member side. The rod group unit 11 includes an elastic telescopic member 1101 disposed at the output end of the drive member. A straight rod 1102 is fixed at the other end of the elastic telescopic member 1101, and the adsorption member 5 is fixed at the other end of the straight rod 1102.

[0033] In one embodiment, the base 1 has conveying mechanisms 9 on both sides of the cleaning unit 4 along its length. The conveying mechanisms 9 are used to transport wafers. The elastic telescopic member 1101 can be a telescopic rod with an internal spring. The rod group unit 11 adopts the above structure and, in conjunction with the guide member 7, enables the wafer on the adsorption member 5 to descend when the sliding member 3 moves to both sides. This facilitates the adsorption member 5 to pick up and fix the wafer from one side of the conveying mechanism 9. When the friction member passes the main guide plate 701, the wafer rises and then cooperates with the cleaning unit 4 for cleaning. Subsequently, when the friction member passes the auxiliary guide plate 702 on the other side, the wafer descends, making it convenient for the adsorption member 5 to place the cleaned wafer on the other side of the conveying mechanism 9.

[0034] like Figure 4 As shown, in a preferred embodiment of the present invention, the adsorption member 5 includes a box 501 fixed to one end of the rod assembly unit 11, a side enclosure 502 with an opening facing the base 1 is fixedly connected to the side of the box 501, a suction cup 503 facing the base 1 is provided on the box 501, and a suction pump 504 connected to the suction cup 503 is provided inside the box 501.

[0035] In one embodiment, a ring pipe 505 is provided on the outer side of the housing 501. Several conveying pipes 506 located outside the enclosure 502 are fixed on the ring pipe 505. The other end of each conveying pipe 506 is connected to a nozzle 507 fixed to the side wall of the enclosure 502. The nozzle 507 is inclined, with its other end located inside the enclosure 502 and close to the opening side of the enclosure 502. In practice, the wafer is mostly in close contact with the conveying mechanism 9 during transport. In particular, in order to ensure that the liquid sprayed on the upward rotating wafer does not splash, the present invention sets a barrier 502 on the outside of the suction cup 503, so that the suction cup 503 cannot adhere to the wafer directly on the conveying mechanism 9. Therefore, when the suction pump 504 works, the suction from the suction cup 503 side can adsorb the wafer, and the suction pump 504 will also cause the airflow to be blown out from the nozzle 507 side, which can make the wafer on the conveying mechanism 9 rise more easily, thus improving the overall adsorption and fixation effect of the adsorption component 5.

[0036] like Figure 5 and Figure 6 As shown, in a preferred embodiment of the present invention, the cleaning unit 4 includes a mounting base 401 fixedly connected to the base 1, a receiving box 402 with an opening facing the adsorption element 5 on the mounting base 401, a nozzle 403 inside the receiving box 402, a delivery pump 404 connected to the nozzle 403 fixed inside the mounting base 401, and a discharge pipe 405 at the bottom of the receiving box 402.

[0037] In one embodiment, the mounting base 401 is provided with a telescopic tube 406 connected to the receiving box 402. One end of the telescopic tube 406 is connected to the output end of the delivery pump 404, and the other end is connected to the nozzle 403. Compared with the implementation of the cleaning unit 4 mentioned above, the telescopic tube 406 can raise the receiving box 402 as a whole when the delivery pump 404 is working, making the distance between it and the enclosure 502 smaller, thereby reducing the occurrence of liquid splashing. When the cleaning work stops, the receiving box 402 can automatically fall back, so as not to affect the adsorption element 5 to drive the wafer to move laterally. The diameter of the discharge pipe 405 is larger than the diameter of the output end of the delivery pump 404. According to the actual requirements of wafer cleaning, a high degree of cleanliness is required, so pure water is needed for rinsing. The discharge pipe 405 can discharge the cleaning waste liquid in the receiving box 402 in time, without affecting the operation of the nozzle 403 and avoiding contamination of the liquid sprayed from the nozzle 403.

[0038] It will be apparent to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above, and that the invention can be implemented in other specific forms without departing from its spirit or essential characteristics. Therefore, the embodiments should be considered in all respects as exemplary and non-limiting, and the scope of the invention is defined by the appended claims rather than the foregoing description. Thus, all variations falling within the meaning and scope of equivalents of the claims are intended to be included within the present invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

[0039] Furthermore, it should be understood that although this specification describes embodiments, not every embodiment contains only one independent technical solution. This narrative style is merely for clarity. Those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

Claims

1. A wafer cleaning and loading device, comprising a base, wherein a bracket is fixedly connected to one side of the base, characterized in that, It also includes sliding parts and a cleaning unit; The sliding member is slidably engaged with the bracket. The sliding member slides along the length of the base. A driving member facing the base is fixed on the sliding member. A rod group unit is provided at the output end of the driving member. A friction member is provided on the rod group unit. An adsorption member is provided at the other end of the rod group unit. The driving member is used to drive the friction member and the adsorption member on the rod group unit to rotate. The cleaning unit is mounted on the base. A drive telescopic component is fixedly connected to the bracket facing the cleaning unit. A guide component is fixedly connected to the other end of the drive telescopic component along the length of the base and arranged laterally. The drive telescopic component is used to drive the guide component to move laterally and make contact with the friction component. The guide component consists of a main guide plate and a secondary guide plate. The main guide plate is connected to the drive telescopic component, and the secondary guide plate is fixed at both ends of the main guide plate. The secondary guide plate is inclined, and the end of the secondary guide plate away from the main guide plate is close to the base. Both the main guide plate and the secondary guide plate have slides facing the friction component side. The rod assembly unit includes an elastic telescopic member disposed at the output end of the drive member, and a straight rod is fixed to the other end of the elastic telescopic member, with an adsorption member fixed to the other end of the straight rod.

2. The wafer cleaning and feeding device according to claim 1, characterized in that, The base is equipped with conveying mechanisms on both sides of the cleaning unit along its length, which are used to transport wafers.

3. The wafer cleaning and feeding device according to claim 1, characterized in that, The adsorption component includes a box fixed to one end of the rod assembly unit, a side panel with an opening facing the base is fixedly connected to the side of the box, a suction cup facing the base is provided on the box, and a suction pump connected to the suction cup is provided inside the box.

4. The wafer cleaning and feeding device according to claim 3, characterized in that, The outer side of the box is provided with a ring pipe, and several conveying pipes located outside the enclosure are fixed on the ring pipe. The other end of the conveying pipe is connected to a spray pipe fixed on the side wall of the enclosure. The spray pipe is inclined and the other end of the spray pipe is located inside the enclosure, and this end is close to the opening side of the enclosure.

5. The wafer cleaning and loading device according to claim 1, characterized in that, The cleaning unit includes a mounting base fixedly connected to the base, a receiving box with an opening facing the adsorption element on the mounting base, a nozzle inside the receiving box, a delivery pump connected to the nozzle fixed inside the mounting base, and a discharge pipe at the bottom of the receiving box.

6. The wafer cleaning and loading device according to claim 5, characterized in that, The mounting base is equipped with a telescopic pipe that is connected to the receiving box. One end of the telescopic pipe is connected to the output end of the delivery pump, and the other end of the telescopic pipe is connected to the nozzle.

7. The wafer cleaning and feeding device according to claim 5, characterized in that, The diameter of the discharge pipe is larger than the diameter of the output end of the delivery pump.

8. The wafer cleaning and loading device according to claim 1, characterized in that, Both ends of the guide are fixedly connected to limiters.

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