Chip cover suction device, chip placement machine and related systems, methods and applications

Abstract

The present invention proposes a chip cover suction device, a chip placement machine, and related systems, methods, and applications. The chip cover suction device comprises: a nozzle rod and a nozzle that can be assembled on the nozzle rod; the nozzle rod comprises a rod body and a nozzle base, the rod body is a hollow structure to form a rod body airway, and the rod body airway is connected to the center hole of the nozzle base; a nozzle airway and an airway partition plate provided in the nozzle airway are provided in the nozzle base; the distance between the airway partition plate and the center hole of the nozzle base is greater than the distance between the airway partition plate and the side wall of the nozzle base; the nozzle comprises a nozzle body and at least two circles of nozzle air holes evenly distributed along the periphery of the nozzle body, the area between each two adjacent circles of nozzle air holes corresponds to the position of the airway partition plate; each circle of nozzle air holes comprises a plurality of nozzle air holes arranged at intervals, and the distance between two adjacent nozzle air holes is greater than the aperture of the nozzle air holes. This method avoids insufficient nozzle air pressure and is suitable for suctioning chip covers with hollowed-out middle areas.

Description

Technical Field

[0001] The present invention relates to a chip cover suction device, a chip placement machine and related systems, methods and applications. Background Art

[0002] Chip-on-lid packaging is a common method of chip packaging, primarily designed to protect bonded wires from damage. Existing nozzle devices for chip-on-lid packaging are prone to insufficient nozzle air pressure, resulting in the nozzle being unable to lift the chip lid. Furthermore, current chip-on-lid packaging technologies typically utilize jigs to assist with manual placement, resulting in low automation, poor precision, and inefficiency. Summary of the Invention

[0003] The inventors of this application have discovered that the middle area of existing chip covers usually has a hollow design. Since the currently used suction nozzle device cannot fit well with the hollowed-out chip cover in the middle, it is easy to cause the suction nozzle of the suction nozzle device to deform or break, resulting in insufficient air pressure and inability to effectively suck the chip cover. In view of the above problems, it is necessary to propose a chip cover suction device, a placement machine and related systems, methods and applications in the embodiment of the present invention to cooperate with the placement machine to realize the automated production of chip cover packaging. The technical solutions proposed by the present invention are as follows:

[0004] As a first aspect of an embodiment of the present invention, an embodiment of the present invention provides a chip cover suction device, comprising: a nozzle rod and a nozzle that can be assembled on the nozzle rod;

[0005] The nozzle rod comprises a rod body and a nozzle base, wherein the rod body is a hollow structure to form a rod body air passage, and the rod body air passage is connected to the central hole of the nozzle base;

[0006] The nozzle base is provided with a nozzle airway and an airway partition plate provided in the nozzle airway;

[0007] The distance between the airway partition plate and the central hole of the nozzle base is greater than the distance between the airway partition plate and the side wall of the nozzle base;

[0008] The nozzle comprises a nozzle body and at least two circles of nozzle air holes evenly distributed along the periphery of the nozzle body, wherein the area between each two adjacent circles of nozzle air holes corresponds to the position of the airway partition plate;

[0009] Each circle of nozzle air holes includes a plurality of nozzle air holes arranged at intervals, and the distance between two adjacent nozzle air holes is greater than the aperture of the nozzle air holes.

[0010] In one or some optional embodiments, the nozzle air passage includes an outer ring air passage and a connecting air passage. The connecting air passage connects the central hole of the nozzle base and the outer ring air passage, and the air passage partition plate is arranged in the outer ring air passage.

[0011] In one or some optional embodiments, the shapes of the nozzle and the nozzle base are both rectangular, and the nozzle base is in interference fit with the nozzle.

[0012] In one or some optional embodiments, the shape of the nozzle base is square. The nozzle base includes a substrate and side walls fixedly connected to the base. There is a preset interval between two adjacent side walls.

[0013] In one or some optional embodiments, the nozzle air passage is arranged on the substrate, and the corners of the substrate are chamfered.

[0014] In one or some optional embodiments, the side walls of the nozzle base include wedge-shaped inlet portions.

[0015] In one or some optional embodiments, the side length of the nozzle is less than the corresponding side length of the chip cover to be picked up.

[0016] In one or some optional embodiments, the end face of the nozzle away from the nozzle base is a roughened plane.

[0017] In one or some optional embodiments, the end face of the nozzle that fits the nozzle air passage is a smoothed plane.

[0018] In one or some optional embodiments, any nozzle air hole of the nozzle is a smoothed through hole.

[0019] In one or some optional embodiments, the material of the nozzle is a soft material, such as ethylene propylene diene monomer (EPDM).

[0020] As the second aspect of the embodiments of the present invention, the embodiments of the present invention provide a chip mounter, including the sucking device for the chip cover described above.

[0021] As the third aspect of the embodiments of the present invention, the embodiments of the present invention provide a chip cover pasting and encapsulation system, including a carrier for the chip cover and the chip mounter described above;

[0022] The carrier is provided with a plurality of cover placing grooves. The difference between the side length of the cover placing groove and the corresponding side length of the nozzle is 3 mm to 4 mm, and any side length of the cover placing groove satisfies the following formula:

[0023] 1 < X / (X - 3.5) < 2, where X represents the side length of the cover placing groove, and the unit is mm.

[0024] As a fourth aspect of the embodiments of the present invention, the embodiments of the present invention provide a chip cover packaging method, which uses the above-mentioned chip cover suction device or the above-mentioned chip placement machine.

[0025] As a fifth aspect of the embodiments of the present invention, the embodiments of the present invention provide an application of the above-mentioned chip cover suction device or the above-mentioned chip mounter in chip cover packaging.

[0026] Based on the above technical solution, the present invention has the following beneficial effects compared with the prior art:

[0027] 1. The chip cover suction device provided by the embodiment of the present invention connects the rod body airway and the nozzle airway respectively through the central hole of the nozzle base, and an airway partition plate is arranged in the nozzle airway, so that the distance between the airway partition plate and the central hole of the nozzle base is greater than the distance between the airway partition plate and the side wall of the nozzle base, so that the air path passes through the area corresponding to the outer circle of the nozzle, ensuring smooth airway; during the vacuuming process, the vacuum negative air pressure runs along the separated preset air path, reducing the negative pressure reaction time of vacuum suction, and the negative pressure reaction is faster and more direct. The negative air pressure can be transmitted in real time, and the negative pressure state of the chip cover suction device is quickly realized, so that the suction force can be evenly dispersed and smoothly transmitted, avoiding deformation or damage of the nozzle due to uneven air pressure transmission, and is suitable for the suction of chip covers with hollowed-out middle areas.

[0028] 2. The chip cover suction device provided by the embodiment of the present invention has at least two circles of nozzle air holes evenly distributed on the periphery of the nozzle body, and the area between each two adjacent circles of nozzle air holes corresponds to the position of the airway partition plate, so that when the nozzle device draws vacuum to generate negative pressure to suck the chip cover, the vacuum negative pressure is evenly released at the nozzle air holes, so that the suction force of each nozzle air hole acts evenly on the chip cover, and the suction force is symmetrically distributed along the center line of the nozzle base, ensuring that the vacuum negative pressure generated by the center point of the nozzle is released on the product, thereby enhancing the suction effect of the nozzle and the stability of the nozzle in sucking the chip cover.

[0029] 3. The chip cover suction device provided by the embodiment of the present invention has a simple and practical suction nozzle structure, a small size and is easy to process. At least two circles of suction nozzle air holes are evenly distributed along the periphery of the suction nozzle body, each circle of suction nozzle air holes includes a plurality of suction nozzle air holes arranged at intervals, and the distance between two adjacent suction nozzle air holes is greater than the aperture of the suction nozzle air holes. The suction nozzle air holes are evenly distributed along the periphery of the suction nozzle. Through the reasonable arrangement of the suction nozzle air holes, the chip cover can be smoothly sucked out during the chip cover suction process; moreover, the distance between the suction nozzle air holes is greater than the aperture of the suction nozzle air holes, and the nozzle size tolerance is reasonably matched, which can enhance the structural stability of the suction nozzle, and the suction nozzle is not easily deformed or damaged, thereby avoiding the phenomenon of insufficient air pressure and facilitating the maintenance of the suction nozzle device.

[0030] Other features and advantages of the present invention will be described in the following description, and in part will become apparent from the description, or understood by practicing the present invention. The purposes and other advantages of the present invention are realized and obtained by the structures particularly pointed out in the description, claims and drawings.

[0031] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, preferred embodiments are given below and described in detail with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] In order to more clearly illustrate the specific embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the specific embodiments or the description of the prior art. Obviously, the drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0033] Figure 1 Schematic diagram of the structure of the chip cover suction device provided by the embodiment of the present invention Figure 1 ;

[0034] Figure 2 Schematic diagram of the structure of the chip cover suction device provided by the embodiment of the present invention Figure 2 ;

[0035] Figure 3 A schematic structural diagram of a nozzle rod of a chip cover suction device according to an embodiment of the present invention;

[0036] Figure 4 A schematic structural diagram of a nozzle of a chip cover suction device according to an embodiment of the present invention;

[0037] Figure 5 Schematic diagram of the structure of the carrier provided in the embodiment of the present invention Figure 1 ;

[0038] Figure 6 Schematic diagram of the structure of the carrier provided in the embodiment of the present invention Figure 2 ;

[0039] Figure 7 for Figure 6 An enlarged schematic diagram of the local structure of section A of the vehicle is shown;

[0040] Figure 8 A schematic diagram of the process flow of chip-on-cap packaging provided by an embodiment of the present invention.

[0041] in:

[0042] 1 nozzle rod, 101 rod body, 102 nozzle base, 1021 side wall, 1022 base plate, 1023 wedge-shaped inlet, 103 rod body air channel, 104 center hole, 105 nozzle air channel, 1051 outer ring air channel, 1052 connecting air channel, 106 air channel partition plate, 2 nozzles, 201 nozzle body, 202 nozzle air hole, 100 placement machine, 200 carrier, 2001 cover placement slot, 300 chip cover. DETAILED DESCRIPTION

[0043] Exemplary embodiments of the present disclosure will be described in more detail below with reference to the accompanying drawings. Although exemplary embodiments of the present disclosure are shown in the accompanying drawings, it should be understood that the present disclosure can be implemented in various forms and should not be limited by the embodiments set forth herein. Rather, these embodiments are provided to enable a more thorough understanding of the present disclosure and to fully convey the scope of the present disclosure to those skilled in the art.

[0044] Exemplary embodiments will be described in detail herein, examples of which are illustrated in the accompanying drawings. In the following description, when referring to the drawings, like numbers in different figures represent like or similar elements unless otherwise indicated. The embodiments described in the following exemplary embodiments are not intended to represent all possible embodiments consistent with the present invention. Rather, they are merely examples of apparatus and methods consistent with certain aspects of the present invention, as detailed in the appended claims.

[0045] In the description of the present invention, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings and are intended solely to facilitate and simplify the description of the present invention. They are not intended to indicate or imply that the devices or components referred to must have, be constructed, or operate in a specific orientation, and therefore should not be construed as limitations on the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0046] In the description of the present invention, it should be noted that, unless otherwise expressly specified or limited, the terms "mounted," "connected," and "connected" should be understood in a broad sense. For example, they may refer to fixed connections, detachable connections, or integral connections; mechanical connections or electrical connections; direct connections or indirect connections through an intermediate medium; and internal connections between two components. Those skilled in the art will understand the specific meanings of the above terms in the present invention based on the specific circumstances.

[0047] Reference Figure 1-Figure 4 As shown, an embodiment of the present invention provides a chip cover suction device, comprising: a nozzle rod 1 and a nozzle 2 that can be assembled on the nozzle rod 1;

[0048] The nozzle rod 1 includes a rod body 101 and a nozzle base 102. The rod body 101 is a hollow structure to form a rod body air channel 103. The rod body air channel 103 is connected to the central hole 104 of the nozzle base 102.

[0049] The nozzle base 102 is provided with a nozzle airway 105 and an airway partition plate 106 provided in the nozzle airway 105;

[0050] The nozzle air passage 105 is connected to the central hole 104 of the nozzle base 102;

[0051] The distance between the airway partition plate 106 and the central hole 104 of the nozzle base 102 is greater than the distance between the airway partition plate 106 and the side wall 1021 of the nozzle base 102;

[0052] The nozzle 2 includes a nozzle body 201 and at least two circles of nozzle air holes 202 evenly distributed along the outer circumference of the nozzle body 201. The area between each two adjacent circles of nozzle air holes 202 corresponds to the position of the airway partition plate 106.

[0053] Each circle of nozzle air holes 202 includes a plurality of nozzle air holes 202 that are spaced apart from each other, and the distance between two adjacent nozzle air holes 202 is greater than the aperture of the nozzle air holes 202 .

[0054] Reference Figure 1 and Figure 2 As shown, the chip cover suction device provided by the embodiment of the present invention, when assembled, pushes the suction nozzle 2 forcefully to the inner side of the suction nozzle base 102 of the suction nozzle rod 1, so that the suction nozzle 2 is flush with the suction nozzle base 102; the assembled chip cover suction device can be connected to the air valve of the placement machine through the rod body 101 of the suction nozzle rod 1; vacuum is drawn through the vacuum device of the placement machine to generate negative air pressure, and the negative air pressure is transmitted to the suction nozzle air hole 202 of the suction nozzle 2 through the rod body air channel 103 and the suction nozzle air channel 105, generating suction in the suction nozzle air hole 202 to achieve the suction of the chip cover (also known as picking up).

[0055] The chip cover suction device provided by the embodiment of the present invention is connected to the rod body airway 103 and the nozzle airway 105 respectively through the central hole 104 of the nozzle base 102, and an airway partition plate 106 is arranged in the nozzle airway 105, so that the distance between the airway partition plate 106 and the central hole 104 of the nozzle base 102 is greater than the distance between the airway partition plate 106 and the side wall 1021 of the nozzle base 102, so that the air path is connected in the area corresponding to the outer circle of the nozzle, ensuring smooth airway; during the vacuuming process, the vacuum negative air pressure runs along the separated preset air path, reducing the negative pressure reaction time of vacuum suction, and the negative pressure reaction is faster and more direct. The negative air pressure can be transmitted in real time, and the negative pressure state of the chip cover suction device is quickly realized, so that the suction force can be evenly dispersed and smoothly transmitted, avoiding deformation or damage of the nozzle 2 due to uneven air pressure transmission, and is suitable for the suction of chip covers with hollowed-out middle areas.

[0056] The chip cover suction device provided by the embodiment of the present invention has at least two circles of nozzle air holes 202 evenly distributed on the periphery of the nozzle body 201, and the area between each two adjacent circles of nozzle air holes 202 corresponds to the position of the airway partition plate 106, so that when the nozzle 2 device draws vacuum to generate negative pressure to suck the chip cover 200, the vacuum negative pressure is evenly released at the nozzle air holes 202, so that the suction force of each nozzle air hole 202 is evenly applied to the chip cover, and the suction force is symmetrically distributed along the center line of the nozzle base 102, ensuring that the vacuum negative pressure generated by the center point of the nozzle 2 is released on the product, thereby enhancing the suction effect of the nozzle 2 and the stability of the nozzle 2 in sucking the chip cover.

[0057] The chip cover suction device provided by the embodiment of the present invention has a simple and practical structure of the suction nozzle 2, which is small and easy to process. At least two circles of suction nozzle holes 202 are evenly distributed along the periphery of the suction nozzle body 201, and each circle of suction nozzle holes 202 includes a plurality of suction nozzle holes 202 set at intervals, and the distance between two adjacent suction nozzle holes 202 is greater than the aperture of the suction nozzle holes 202. The suction nozzle holes 202 are evenly distributed along the periphery of the suction nozzle 2. Through the reasonable arrangement of the suction nozzle holes 202, the chip cover is ensured to be smoothly sucked out during the core suction process; and the distance between the suction nozzle holes 202 is greater than the aperture of the suction nozzle holes 202, the size tolerance of the suction nozzle 2 is reasonable, which can enhance the structural stability of the suction nozzle 2, and the suction nozzle 2 is not easily deformed or damaged, thereby avoiding the phenomenon of insufficient air pressure, and facilitating the maintenance of the suction nozzle 2 device.

[0058] In the embodiment of the present invention, the size and number of the nozzle air holes 202 can be set according to the actual requirements of the chip cover packaging. Figure 4As shown, the nozzle air holes 202 have a diameter of 0.5 mm, the center-to-center distance between adjacent nozzle air holes 202 is approximately 1.25 mm, and the number of nozzle air holes 202 can be adjusted between 50 and 70. Of course, in the embodiment of the present invention, the diameter and spacing of the nozzle air holes 202 can be adjusted according to actual needs, as long as the spacing between the nozzle air holes 202 is greater than the diameter of the nozzle air holes 202. In the embodiment of the present invention, this is not specifically limited.

[0059] The chip cover suction device provided in the embodiment of the present invention has nozzle air holes 202 arranged on the outer ring of the nozzle 2. The nozzle size is reasonably set so that the nozzle 2 can accommodate chip covers of different sizes. The nozzle 2 has a wide range of applications. Therefore, the chip cover sizes applicable to the suction device using the nozzle 2 are as follows: length: 10mm-26mm; width: 8mm-22mm. Therefore, it is possible to avoid redesigning the nozzle 2 of the corresponding size when sucking chip covers of different sizes, thereby saving production costs.

[0060] In one embodiment, it may be, with reference to Figure 3 As shown, the nozzle air channel 105 includes an outer ring air channel 1051 and a connecting air channel 1052 . The connecting air channel 1052 connects the central hole 104 of the nozzle base 102 and the outer ring air channel 1051 . The air channel partition plate 106 is arranged on the outer ring air channel 1051 .

[0061] The chip cover suction device provided by the embodiment of the present invention is provided with an outer ring air channel 1051 on the outer ring of the suction nozzle 2, and the outer ring air channel 1051 and the central hole 104 of the suction nozzle base 102 are connected by a connecting air channel 1052. In addition, an air channel partition plate 106 is provided in the outer ring air channel 1051. When vacuuming, the air in the outer ring air channel 1051 is extracted along the rod body air channel 103 through the connecting air channel 1052. Since the path from the central hole 104 of the suction nozzle base 102 to each side of the outer ring air channel is the same, the suction force can be evenly dispersed, thereby quickly forming a negative air pressure in the outer ring air channel 1051; and, by providing the air channel partition plate 106 in the outer ring air channel 1051, the negative air pressure at each point of the outer ring air channel 1051 is balanced, and the suction force of each suction nozzle air hole 202 connected to the outer ring air channel 1051 is balanced, thereby further ensuring the smooth suction of the chip cover.

[0062] In one embodiment, it may be, with reference to Figure 1-Figure 4 As shown, the suction nozzle 2 and the suction nozzle base 102 are both rectangular in shape, and the suction nozzle base 102 is interference fit with the suction nozzle 2.

[0063] In the chip cover suction device provided by the embodiment of the present invention, the assembly state of the suction nozzle 2 and the suction nozzle base 102 is an interference fit, so that the suction nozzle 2 is placed in the suction nozzle base 102 and maintained in a clamped state, while ensuring that the suction nozzle 2 does not deform, so that when the suction nozzle 2 is placed in the suction nozzle base 102, the suction nozzle air holes 202 do not deform, ensuring the consistency and stability of the suction force of each suction nozzle air hole 202 under negative pressure.

[0064] In one specific embodiment, in order to ensure balanced force on the nozzle 2 when placed on the nozzle base 102, the difference between the side length of the nozzle 2 and the inner side length of the nozzle base 102 needs to be within an appropriate range. For example, the single-sided interference fit of the nozzle 2 when placed on the nozzle base 102 can be set to 0.05 mm. Of course, those skilled in the art can also select an appropriate interference fit size based on actual conditions, as long as the nozzle 2 and the nozzle base 102 are able to achieve an interference fit and the nozzle 2 does not deform when placed on the nozzle base 102.

[0065] In one embodiment, it may be, with reference to Figure 2 As shown, the nozzle base 102 is square in shape and includes a base plate 1022 and side walls 1021 fixedly connected to the base, with a preset interval between two adjacent side walls 1021 .

[0066] The chip cover suction device provided in the embodiment of the present invention provides a gap between the side walls 1021 of the nozzle base 102. When the nozzle 2 is placed on the nozzle base 102, the corners of the nozzle 2 will not be squeezed, thereby ensuring that when the nozzle 2 and the nozzle base 102 are interfered with, the nozzle 2 will not be squeezed and deformed due to the corners of the nozzle 2.

[0067] In a specific embodiment, referring to Figure 3 As shown, the nozzle air channel 105 is provided on the substrate 1022, and the corners of the substrate 1022 are chamfered. By chamfering the substrate 1022, the overall structure of the nozzle 2 device is made more compact, which facilitates the nozzle 2 to suck the chip cover.

[0068] In one embodiment, it may be, with reference to Figure 3 As shown, the side wall 1021 of the nozzle base 102 includes a wedge-shaped entrance portion 1023 .

[0069] In the chip cover suction device provided by an embodiment of the present invention, the side wall 1021 of the nozzle base 102 includes a wedge-shaped entrance portion 1023, so that the opening size of the nozzle base 102 is larger than the size of the nozzle 2. When the nozzle 2 is installed, it is convenient for the nozzle 2 to align with the nozzle base 102, thereby realizing rapid installation of the nozzle 2 and avoiding deformation of the nozzle 2 during the installation process.

[0070] In one embodiment, the side length of the suction nozzle 2 may be smaller than the corresponding side length of the cover of the chip to be sucked.

[0071] In the chip cover suction device provided by an embodiment of the present invention, the side length of the suction nozzle 2 is smaller than the corresponding side length of the chip cover to be sucked. By making the size of the suction nozzle 2 smaller than the size of the chip cover, it is convenient for the suction nozzle 2 to align with the chip cover, so as to avoid the center of the suction nozzle 2 deviating from the center of the chip cover due to the size of the suction nozzle 2 being larger than the size of the chip cover, resulting in the chip cover being unable to be picked up, or the sucked chip cover deviating from the preset suction area.

[0072] In one embodiment, the end surface of the nozzle 2 away from the nozzle base 102 may be a roughened surface.

[0073] In the chip cover suction device provided by the embodiment of the present invention, the end surface of the nozzle 2, which faces away from the nozzle base 102, is roughened. This roughening of the surface of the nozzle 2, which holds the chip cover, prevents liquid from condensing between the nozzle 2 and the chip cover 200 due to high humidity, potentially causing adhesion between the nozzle 2 and the chip cover 200 and preventing the chip cover from being removed from the nozzle 2.

[0074] In one embodiment, the end surface of the nozzle 2 that is in contact with the nozzle air passage 105 may be a smooth surface.

[0075] In the chip cover suction device provided by the embodiment of the present invention, one end surface of the suction nozzle 2 that fits into the suction nozzle air channel 105 is a smooth plane, so that the suction nozzle 2 and the suction nozzle air channel 105 fit tightly, thereby preventing air from being sucked into the gap between the suction nozzle 2 and the suction nozzle base 102 when the suction nozzle 2 sucks the chip cover, thereby destroying the negative pressure state of the suction nozzle 2 device and causing insufficient air pressure in the suction nozzle 2.

[0076] In one embodiment, any nozzle air hole 202 of the nozzle 2 may be a smooth through hole.

[0077] The chip cover suction device provided in the embodiment of the present invention ensures smooth ventilation of the nozzle air hole 202 by smoothing the nozzle air hole 202. The smooth inner wall of the nozzle air hole 202 is conducive to the removal of foreign matter. During the vacuuming process, dust and impurities in the air are not easy to adhere to the inner wall of the nozzle air hole 202, preventing dust and impurities from adhering to the inner wall of the nozzle air hole 202. As dust and impurities accumulate, the nozzle air hole 202 becomes blocked.

[0078] In one embodiment, the nozzle 2 may be made of a soft material. The soft material described in the embodiment of the present invention is a material with a certain elasticity and not easy to break. As a preferred embodiment of the embodiment of the present invention, the nozzle 2 may be made of a rubber material with good wear resistance and corrosion resistance, such as EPDM rubber.

[0079] In the chip cover suction device provided by the embodiment of the present invention, the material of the suction nozzle 2 can be selected from EPDM rubber. Since EPDM rubber has good wear resistance, and the wear condition is directly related to the service life of the suction nozzle 2 device, selecting EPDM rubber can effectively extend the service life and reduce the degree of wear of the suction nozzle 2; since EPDM rubber has good corrosion resistance, the suction nozzle 2 device can be used normally in alkaline, grease, and alcohol environments; and since the suction nozzle 2 made of EPDM rubber material has high formability and moderate hardness (HS70-HS80), it is easy to process and not easy to deform. Therefore, the suction nozzle 2 is not easily damaged, thereby extending the service life of the suction nozzle 2.

[0080] The inventors of the present invention discovered that the damage of the suction nozzle 2 used in the prior art is due to the poor performance of the selected material. The suction nozzle 2 is in contact with air for a long time, and chemically reacts with alkaline or acidic substances in the air, causing the suction nozzle 2 to gradually harden, resulting in brittleness. After thousands of uses, stress concentration will cause the suction nozzle 2 to break after a collision. The key to solving this problem lies in the selection of materials. The inventors of the present invention found that using EPDM rubber to make the suction nozzle 2 can effectively avoid this problem. Through subsequent maintenance, regular inspection and replacement, the problem of insufficient suction nozzle air pressure caused by nozzle 2 damage can be avoided.

[0081] Of course, those skilled in the art may also select other wear-resistant and corrosion-resistant rubber materials to prepare the nozzle 2 according to the teachings in the embodiments of the present invention. The specific material selection is not specifically limited in the embodiments of the present invention.

[0082] In the experiments, the inventors of the present invention also found that insufficient air pressure in the nozzle 2 is partly due to problems with the material selection and processing of the nozzle rod 1. To ensure the service life of the chip cover body suction device, the rod body 101 of the nozzle rod 1 and the nozzle base 102 can be made of a metal or alloy material with high hardness and corrosion resistance, such as SUS304 stainless steel. By using a metal or alloy material with high hardness and corrosion resistance, it is possible to avoid airway blockage caused by part corrosion, thereby avoiding insufficient air pressure in the nozzle 2. When manufacturing the rod body 101 and the nozzle base 102, the machining accuracy should also be ensured, and the dimensional consistency of the four sides of the nozzle base 102 should be guaranteed. In this way, after the nozzle 2 is placed on the nozzle base 102, the nozzle 2 can be centered within the nozzle base 102 and will not shift to one side. At the same time, during the manufacturing process, the parallelism and smoothness of the nozzle base 102 should meet the requirements, and there should be no defects such as deformation or burrs on the rod body 101 of the nozzle rod 1 and the nozzle base 102. Preferably, the surface roughness of the rod body 101 of the nozzle rod 1 and the nozzle base 102 should be lower than Ra3.2.

[0083] Based on the same inventive concept, an embodiment of the present invention further provides a chip mounter, including the chip cover body suction device described in the above embodiment.

[0084] The specific implementation manner of the chip mounter provided in the embodiment of the present invention can refer to the detailed description of the chip cover body suction device in the above embodiment. For the implementation manners of other structures of the chip mounter, such as the machine table, machine table camera, vacuum pumping device, air valve, etc., those skilled in the art can refer to the detailed description in the prior art, and repeated parts will not be elaborated.

[0085] Based on the same inventive concept, an embodiment of the present invention further provides a chip cover pasting and encapsulation system, including a carrier 100 for the chip cover body 200 and the chip mounter described in the above embodiment;

[0086] Refer to Figure 5-Figure 7 As shown, the carrier 100 is provided with a plurality of cover body placement slots 1001, the difference between the side length of the cover body placement slot 1001 and the corresponding side length of the to-be-sucked chip cover body 200 is 3 mm to 4 mm, and any side length of the cover body placement slot 1001 satisfies the following formula:

[0087] 1 < X / (X - 3.5) < 2, where X represents the side length of the cover body placement slot 1001, and the unit is mm.

[0088] In the embodiment of the present invention, by setting the size of the cover body placement slot 1001 of the carrier 100 of the chip cover pasting and encapsulation system to be larger than the size of the chip cover body 200, it is possible to prevent jamming during the process of sucking the chip cover body 200 from the cover body placement slot 1001.

[0089] In the embodiment of the present invention, by cooperating with the chip mounter equipped with the chip cover suction device and the carrier 100, the automation level of the chip cover packaging system can be improved, and the machine can be automated, thereby improving the chip cover packaging accuracy and efficiency.

[0090] In a specific embodiment, in order to avoid wear between the chip cover 200 and the carrier 100 , the surface of the cover placement groove 1001 of the carrier 100 may also be smoothed.

[0091] In the embodiment of the present invention, when performing the chip capping packaging process, refer to Figure 5-Figure 7 As shown, the chip covers 200 need to be placed in the cover placement slots 1001 of the carrier 100 first, so that the plurality of chip covers 200 are regularly distributed on the carrier 100 .

[0092] In the embodiment of the present invention, after the chip mounter is equipped with the above-mentioned chip cover suction device, refer to Figure 8 As shown, the specific steps of implementing the chip-on-cap packaging process may include:

[0093] S11: Place the PCBA (integrated circuit board with electronic components) in the packaging position and pre-apply glue;

[0094] S12: The machine camera identifies the position of the chip cover 200 to be picked up, and the chip cover suction device sucks the chip cover 200 from the corresponding cover placement slot 1001 of the carrier 100 to the machine camera for position calibration, and then attaches it to the corresponding position on the PCBA to be packaged;

[0095] S13: Bake the 30 cover receiving groove at a high temperature of 60 to 120 degrees Celsius for 120 minutes to complete the chip cover packaging.

[0096] The specific implementation of the chip cover packaging system provided by the embodiment of the present invention can refer to the detailed description of the chip cover suction device in the above embodiment. The detailed execution process of each step of the chip cover packaging process can refer to the relevant description in the prior art, and the repeated parts will be omitted.

[0097] Based on the same inventive concept, an embodiment of the present invention further provides a chip cover packaging method, which uses the above-mentioned chip cover suction device or the above-mentioned chip placement machine.

[0098] Based on the same inventive concept, an embodiment of the present invention further provides an application of the above-mentioned chip cover suction device or the above-mentioned chip mounter in chip cover packaging.

[0099] In this document, relational terms such as first and second, etc., are used only to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "comprises", "includes" or any other variations thereof are intended to cover non-exclusive inclusion, so that a process, method, article or apparatus comprising a series of elements includes not only those elements, but also other elements not explicitly listed, or elements inherent to such process, method, article or apparatus. The orientation or positional relationship indicated by the terms "upper", "lower", etc. is based on the orientation or positional relationship shown in the accompanying drawings, and is only for the convenience of describing the present invention and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operate in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0100] Each embodiment in this specification is described in a progressive manner, and the same or similar parts between the embodiments can be referred to each other. Each embodiment focuses on the differences from other embodiments. It should be noted that, in the absence of conflict, the embodiments of the present invention and the features in the embodiments can be combined with each other. The present invention is not limited to any single aspect, nor to any single embodiment, nor to any combination and / or permutation of these aspects and / or embodiments. Each aspect and / or embodiment of the present invention can be used alone or in combination with one or more other aspects and / or other embodiments.

[0101] Finally, it should be noted that the above-described embodiments are only specific implementation methods of the present invention, which are used to illustrate the technical solutions of the present invention, rather than to limit them. The scope of protection of the present invention is not limited thereto. Although the present invention has been described in detail with reference to the above-described embodiments, those skilled in the art should understand that any person skilled in the art can modify or easily conceive of changes to the technical solutions described in the above-described embodiments within the technical scope disclosed by the present invention, or replace some of the technical features therein with equivalents. Such modifications, changes, or replacements do not deviate from the spirit and scope of the technical solutions of the embodiments of the present invention, and should be included in the scope of protection of the present invention. Therefore, the scope of protection of the present invention shall be subject to the scope of protection of the claims.

Claims

1. A chip cover suction device, characterized in that: Comprising: A nozzle rod and a nozzle that can be assembled to the nozzle rod; The nozzle rod includes a rod body and a nozzle base. The rod body is a hollow structure to form a rod body air passage, and the rod body air passage communicates with the central hole of the nozzle base; A nozzle air passage is provided in the nozzle base and an air passage separator is provided in the nozzle air passage; The nozzle air passage communicates with the central hole of the nozzle base; The distance between the air passage separator and the central hole of the nozzle base is greater than the distance between the air passage separator and the side wall of the nozzle base; The nozzle air passage includes an outer ring air passage and a connecting air passage. The connecting air passage communicates the central hole of the nozzle base and the outer ring air passage, so that the path from the central hole of the nozzle base to each side of the outer ring air passage is the same; The nozzle includes a nozzle body and at least two circles of nozzle air holes evenly distributed along the outer periphery of the nozzle body. The area between every two adjacent circles of nozzle air holes corresponds to the position of the air passage separator. The air passage separator is arranged in the outer ring air passage to make the negative air pressure at each place in the outer ring air passage balanced, so as to realize the suction force balance of each nozzle air hole communicating with the outer ring air passage; Each circle of nozzle air holes includes a plurality of nozzle air holes arranged at intervals, and the distance between two adjacent nozzle air holes is greater than the diameter of the nozzle air hole.

2. The chip cover suction device according to claim 1, wherein: The shapes of the nozzle and the nozzle base are both rectangular, and the nozzle base and the nozzle are in interference fit.

3. The chip cover suction device according to claim 2, wherein: The shape of the nozzle base is square. The nozzle base includes a substrate and side walls fixedly connected to the substrate, and there is a preset interval between two adjacent side walls.

4. The chip cover suction device according to claim 3, wherein: The nozzle air passage is arranged on the substrate, and the corners of the substrate are chamfered.

5. The chip cover suction device according to claim 2, wherein: The side wall of the nozzle base includes a wedge-shaped inlet part.

6. The chip cover suction device according to claim 2, wherein: The side length of the nozzle is less than the corresponding side length of the chip cover to be picked up.

7. The chip cover suction device according to claim 1, wherein: The end face of the nozzle away from the nozzle base is a roughened plane.

8. The chip cover suction device according to claim 7, wherein: The end face of the nozzle fitting the nozzle air passage is a smoothed plane.

9. The chip cover suction device according to claim 1, wherein: Any nozzle air hole of the nozzle is a smoothed through hole.

10. The chip cover suction device according to claim 1, wherein: The material of the nozzle is a soft material.

11. A chip mounter, characterized in that: A picking device for a chip cover according to any one of claims 1-10.

12. A chip-on-cap packaging system, characterized in that: A carrier for a chip cover and a chip mounter according to claim 11; The carrier is provided with a plurality of cover placement grooves. The difference between the side length of the cover placement groove and the corresponding side length of the nozzle is 3 mm to 4 mm, and any side length of the cover placement groove satisfies the following formula: 1 < X / (X - 3.5) < 2, where X represents the side length of the cover placement groove, and the unit is mm.

13. A chip cover packaging method, characterized in that: Applying the picking device for a chip cover according to any one of claims 1-10, or the chip mounter according to claim 11.

14. An application of a picking device for a chip cover according to any one of claims 1-10 or a chip mounter according to claim 11 in chip cover pasting and encapsulation.

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