Display panel and display device

Abstract

The present invention describes a display panel and a display device. The display panel provided by the present invention includes a substrate; an array layer located on the substrate; an optical layer located on a side of the array layer away from the substrate; and a plurality of light-emitting devices; wherein the optical layer is located in the spaces between the light-emitting devices. The present invention also provides a display device including the above-described display panel. This application can improve the display quality of a display panel.

Description

Technical Field

[0001] The present invention relates to the field of display technology, and in particular to a display panel and a display device. Background Art

[0002] With the continuous development of display technology, display panels have been widely used in people's production and life. However, there are still some technical problems in the display panels of the prior art that need to be solved, such as how to provide a display effect of the display panels. Summary of the Invention

[0003] In view of this, the present invention provides a display panel and a display device.

[0004] The display panel provided by the present invention includes:

[0005] substrate;

[0006] an array layer located on the substrate;

[0007] an optical layer and a plurality of light-emitting devices located on a side of the array layer away from the substrate;

[0008] The optical layer is located in the intervals between the light emitting devices.

[0009] The present invention also provides a display device comprising the display panel.

[0010] The present application can improve the display effect of the display panel. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] Figure 1 is a top view of a display panel provided in an embodiment of the present invention;

[0012] Figure 2 It is along Figure 1 Local cross-section along the AA direction;

[0013] Figure 3 The display panel provided by the embodiment of the present invention is Figure 1 Another partial cross-section view in the AA direction;

[0014] Figure 4 The display panel provided by the embodiment of the present invention is Figure 1 Another partial cross-section view in the AA direction;

[0015] Figure 5 is a partial top view of a display panel provided in an embodiment of the present invention;

[0016] Figure 6 The display panel provided by the embodiment of the present invention is Figure 1 Another partial cross-section view in the AA direction;

[0017] Figure 7 The display panel provided by the embodiment of the present invention is Figure 1 Another partial cross-section view in the AA direction;

[0018] Figure 8 The display panel provided by the embodiment of the present invention is Figure 1 Another partial cross-section view in the AA direction;

[0019] Figure 9 The display panel provided by the embodiment of the present invention is Figure 1 Another partial cross-section view in the AA direction;

[0020] Figure 10 The display panel provided by the embodiment of the present invention is Figure 1 Another partial cross-section view in the AA direction;

[0021] Figure 11 The display panel provided by the embodiment of the present invention is Figure 1 Another partial cross-section view in the AA direction;

[0022] Figure 12 The display panel provided by the embodiment of the present invention is Figure 1 Another partial cross-section view in the AA direction;

[0023] Figures 13 to 20 The display panel provided by the embodiment of the present invention is Figure 1 Several different local cross-sections in the AA direction

[0024] Figure 21 It is an experimental data diagram provided by the present invention.

[0025] Figure 22 It is a structural schematic diagram of a display device provided by an embodiment of the present invention. DETAILED DESCRIPTION

[0026] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, the present invention will be further described below with reference to the accompanying drawings and embodiments.

[0027] It should be noted that the following description sets forth specific details to facilitate a full understanding of the present invention. However, the present invention can be implemented in a variety of other ways than those described herein, and those skilled in the art may make similar generalizations without departing from the scope of the present invention. Therefore, the present invention is not limited to the specific embodiments disclosed below.

[0028] The terms used in the embodiments of the present invention are only for the purpose of describing specific embodiments and are not intended to limit the present invention. The singular forms "a", "an", "the" and "the" used in the embodiments of the present invention and the appended claims are also intended to include plural forms unless the context clearly indicates otherwise.

[0029] It should be noted that the directional terms such as "upper," "lower," "left," and "right" described in the embodiments of the present invention are described from the perspectives shown in the accompanying drawings and should not be construed as limiting the embodiments of the present invention. Furthermore, in the context, it should be understood that when an element is referred to as being formed "on" or "under" another element, it can be formed not only directly "on" or "under" the other element, but also indirectly "on" or "under" the other element through an intermediate element.

[0030] Furthermore, the example embodiments can be implemented in a variety of forms and should not be construed as being limited to the embodiments described herein; on the contrary, these embodiments are provided to make the present invention more comprehensive and complete, and to fully convey the concepts of the example embodiments to those skilled in the art. The same reference numerals in the figures represent the same or similar structures, and therefore their repeated descriptions will be omitted. The words expressing position and direction described in the present invention are all explained using the accompanying drawings as examples, but can be changed as needed, and all changes are included in the scope of protection of the present invention. The drawings of the present invention are only used to illustrate relative positional relationships, and the layer thicknesses of certain parts are exaggerated for ease of understanding. The layer thicknesses in the drawings do not represent the proportional relationship of the actual layer thicknesses. In addition, the embodiments of the present invention and the features in the embodiments can be combined with each other unless there is a conflict. The drawings of the embodiments in this application use the same reference numerals as the drawings. In addition, the similarities between the embodiments are not repeated.

[0031] Please refer to Figure 1 and Figure 2 As shown, Figure 1 A top view of a display panel provided by an embodiment of the present invention, Figure 2 For the Figure 1 A partial cross-sectional view along the AA direction, wherein the cross-section is perpendicular to the plane where the display panel is located.

[0032] Optionally, the display panel 100 is divided into a display area AA and a non-display area NA surrounding the display area AA. It can be understood that Figure 1 The midpoint line frame illustrates the boundary between the display area AA and the non-display area NA. The display area AA is the area of ​​the display panel used to display images and typically includes a plurality of pixels arranged in an array. The pixels SP include corresponding light-emitting devices (e.g., diodes) and control elements (e.g., thin-film transistors that constitute the pixel drive circuit). The non-display area NA surrounds the display area AA and typically includes peripheral drive elements, peripheral wiring, and a fan-out area.

[0033] Optionally, the display panel 100 includes a substrate 110 .

[0034] Alternatively, the substrate 110 may be formed of a polymer material such as glass, polyimide (PI), polycarbonate (PC), polyethersulfone (PES), polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polyarylate (PAR), or fiberglass reinforced plastic (FRP). The substrate 110 may be transparent, translucent, or opaque.

[0035] Optionally, the substrate 110 may be flexible or rigid. It should be noted that, in the embodiments of the present application, when a film layer is "on" a reference film layer, it can be understood as being "on the side of the reference film layer away from the substrate." Furthermore, unless otherwise specified, "on" merely indicates a positional relationship and does not necessarily mean that the two film layers are adjacent or in contact.

[0036] The array layer 200 is located on the side of the substrate 110 facing the display surface or touch surface of the display panel 100. The array layer 200 may include a plurality of thin film transistors (TFTs) 210 and pixel circuits formed by the TFTs for light emitting devices in the display layer.

[0037] The embodiment of the present invention uses a top-gate thin film transistor as an example to illustrate the structure. The thin film transistor layer 210 includes: an active layer 211 located on the substrate 110. The active layer 211 can be an amorphous silicon material, a polycrystalline silicon material, or a metal oxide material. When the active layer 211 is made of polycrystalline silicon material, it can be formed using low-temperature amorphous silicon technology, that is, the amorphous silicon material is melted by the laser to form a polycrystalline silicon material. In addition, various methods such as rapid thermal annealing (RTA), solid phase crystallization (SPC), excimer laser annealing (ELA), metal induced crystallization (MIC), metal induced lateral crystallization (MILC) or continuous lateral solidification (SLS) can also be used. The active layer 211 also includes a source region and a drain region formed by doping N-type impurity ions or P-type impurity ions, and a channel region is formed between the source region and the drain region.

[0038] A gate insulating layer 212 is located on the active layer 211. The gate insulating layer 212 includes an inorganic layer such as silicon oxide or silicon nitride, and may include a single layer or multiple layers.

[0039] A gate electrode 213 is located on the gate insulating layer 212. The gate electrode 213 may include a single layer or multiple layers of gold (Au), silver (Ag), copper (Cu), nickel (Ni), platinum (Pt), palladium (Pd), aluminum (Al), molybdenum (MO), or chromium (Cr), or an alloy such as an aluminum (Al):neodymium (Nd) alloy and a molybdenum (MO):tungsten (W) alloy.

[0040] An interlayer insulating layer 214 is located on the gate 213. The interlayer insulating layer 214 may be formed of an inorganic insulating layer such as silicon oxide or silicon nitride. Of course, in other optional embodiments of the present invention, the interlayer insulating layer may be formed of an organic insulating material.

[0041] The source electrode and the drain electrode are located on the interlayer insulating layer 214. The source electrode and the drain electrode are electrically connected (or coupled) to the source region and the drain region respectively through contact holes formed by selectively removing the gate insulating layer 212 and the interlayer insulating layer 214.

[0042] The array layer 200 may further include a passivation layer 220. Optionally, the passivation layer 220 is located at the source electrode and the drain electrode of the thin film transistor 210. The passivation layer 220 may be formed of an inorganic material such as silicon oxide or silicon nitride, or may be formed of an organic material.

[0043] The display panel 100 may further include a planarization layer 230. Optionally, the planarization layer 230 is located on the passivation layer 220. The planarization layer 230 includes an organic material such as acrylic, polyimide (PI), or benzocyclobutene (BCB), and has a planarization function.

[0044] Optionally, the display panel 100 further includes an optical layer 500 and a light emitting device 400 located on a side of the array layer 200 facing away from the substrate 110 . Optionally, the optical layer 500 and the light emitting device 400 are located on the planarization layer 230 .

[0045] Optionally, the light-emitting devices 400 are spaced apart from each other, the optical layer 500 is spaced apart corresponding to the light-emitting devices 400 , and at least a portion of the optical layer 500 is located in the space between two adjacent light-emitting devices 400 .

[0046] Optionally, in a direction parallel to the plane where the display panel 100 is located (i.e., the first direction X), the projection of the optical layer 500 overlaps with that of the light-emitting device 400; in a direction perpendicular to the plane where the display panel 100 is located (i.e., the second direction Y), the projection of the optical layer 500 and the light-emitting device 400 do not overlap, that is, the orthographic projection of the optical layer 500 on the plane where the display panel 100 is located does not overlap with the orthographic projection of the light-emitting device 400 on the plane where the display panel 100 is located.

[0047] It should be noted that in the present application, the first direction X is a direction parallel to the plane where the display panel is located, and the second direction Y is a direction perpendicular to the direction where the display panel is located.

[0048] Optionally, the optical layer 500 is a whole layer structure, that is, the optical layers 500 in the intervals between different light emitting devices 400 are connected into an integral structure. In other words, the continuous optical layer 500 has an opening, and the light emitting device 400 is disposed in the opening.

[0049] Through the above embodiments, the light extraction effect of the display panel can be improved.

[0050] Optionally, the optical layer 500 is made of a material with low light transmittance.

[0051] Optionally, the OD value of the optical layer 500 is greater than 1, that is, the transmittance of the optical layer 500 is less than 10%.

[0052] This design can avoid reducing the reflection of ambient light by the display panel, thereby playing a role in reducing reflection; it can also avoid crosstalk between adjacent pixels.

[0053] Optionally, the optical layer 500 is a combination of one or more of an ink layer and an adhesive layer. For example, in some optional embodiments of the present application, the optical layer 500 is formed of an ink material, that is, the ink is printed onto corresponding locations on the array layer 200, that is, the spaces between the light-emitting devices 400, through a printing technique. Of course, in some other optional embodiments of the present application, the optical layer 500 is formed of an adhesive film, which can be attached to the array layer 200 by lamination.

[0054] Of course, when the optical layer is composed of multiple sub-layers, different sub-layers can be selected from one of the ink layer and the glue layer, for example, one of the two sub-layers is an ink layer and the other is a glue layer.

[0055] like Figure 3 As shown, Figure 3 The display panel provided by the embodiment of the present invention is Figure 1 Another partial cross-sectional view along the AA direction. The similarities between this embodiment and the above embodiment will not be repeated.

[0056] Optionally, the optical layer 500 includes a first optical layer 510 and a second optical layer 520 stacked in sequence along a direction from the array layer 200 to the substrate 110 .

[0057] That is, the second optical layer 520 and the first optical layer 510 are sequentially stacked on the array layer 200. The first optical layer 510 is located on the side of the second optical layer 520 facing away from the substrate 110. The first optical layer 510 is located on the side of the second optical layer 520 facing the light emitting surface of the display panel 100.

[0058] The reflectivity of the first optical layer 510 is lower than that of the second optical layer 520 .

[0059] Optionally, the reflectivity of the first optical layer 510 is less than 10%, and the reflectivity of the second optical layer 520 is greater than 50%.

[0060] In this embodiment, the optical layer 500 is configured as two sub-layers with matching reflectivity performance: a first optical layer 510 and a second optical layer 520. Since the second optical layer 520 has a strong reflective capability, the light from the side and bottom of the light-emitting device 400 can be focused toward the front viewing angle by reflection through the second optical layer 520, thereby improving the utilization rate of light. On the other hand, the first optical layer 510 has a low reflectivity and has a strong absorption capacity for light. Since the first optical layer 510 is located closer to the light-emitting surface of the display panel 100, it can absorb the light reflected by the film layer formed by the metal material below it (such as the metal film layer used for the circuit or electrode structure in the array layer) and the second optical layer 520, while also avoiding the reflection of external ambient light, thereby achieving the effect of reducing reflection.

[0061] Optionally, the total OD of the first optical layer 510 and the second optical layer 520 after being superimposed is greater than 1, that is, the total transmittance of the two after being superimposed is less than 10%.

[0062] Of course, in some other optional embodiments of the present application, the first optical layer 510 and the second optical layer 520 are both made of low-transmittance materials. The OD values ​​of the first optical layer 510 and the second optical layer 520 are both greater than 1, that is, the transmittance of both is less than 10%.

[0063] This prevents the light reflected by the film layer formed by the metal material below the optical layer from passing through the optical layer and being emitted from the light-emitting surface of the display panel, affecting the display effect.

[0064] Optionally, the first optical layer 510 is a black layer; and the second optical layer 520 is a white layer.

[0065] This design can reduce reflection while improving light utilization. On the one hand, the white layer can reflect a large amount of light of various colors. The white layer has strong reflectivity for all colors, reflecting the light from the sides and bottom of the light-emitting devices 400 corresponding to the different color pixels, converging these lights toward the front viewing angle, thereby improving light utilization and the consistency of light output from different light-emitting devices. On the other hand, the white layer of this embodiment, or the second optical layer, also effectively shields the underlying metal film layer. The black layer, or the first optical layer, has strong light absorption, absorbing reflected light from the underlying metal film layer and the white layer, thereby reducing reflection.

[0066] Optionally, white nanoparticles, such as titanium dioxide (TiO 2 ), exist in the second optical layer 520 .

[0067] Through such a design, the probability of diffuse reflection of light emitted by the light-emitting device 400 in the second optical layer 520 can be increased, thereby changing the propagation direction of more light emitted laterally from the light-emitting device 400, so that the propagation direction of these light rays is more deflected toward the light-emitting surface of the display panel 100 (that is, the direction in which the second optical layer points to the first optical layer).

[0068] Optionally, when the optical layer includes white and black adhesive films, the white and black adhesive films can be attached at one time or in two times.

[0069] Optionally, when the optical layer includes white ink and black ink, the white ink and the black ink are printed twice.

[0070] Alternatively, the optical layer may be formed by photolithography using a photoresist in two steps.

[0071] like Figure 4 As shown, Figure 4 The display panel provided by the embodiment of the present invention is Figure 1 Another partial cross-sectional view along the AA direction. The similarities between this embodiment and the above embodiment will not be repeated.

[0072] Optionally, a first gap 310 is provided between the first optical layer 510 and the light emitting device 400.

[0073] The first gap 310 exposes at least a portion of the second optical layer 520 .

[0074] That is, the first optical layer 510 is not in contact with the light emitting device 400 , and a gap therebetween is the first gap 310 .

[0075] Optionally, the orthographic projection of the first optical layer 510 on the plane where the display panel 100 is located does not overlap with the orthographic projection of the light-emitting device 400 on the plane where the display panel 100 is located, and a gap is retained. This gap is equivalent to the orthographic projection of the first gap 310 on the plane where the display panel 100 is located.

[0076] Optionally, the orthographic projection of the first gap 310 on the plane of the display panel 100 overlaps with the orthographic projection of the second optical layer 520 on the plane of the display panel 100. The area of ​​the second optical layer 520 exposed by the first gap 310 is closer to the light emitting device 400 and may even be in direct contact with it.

[0077] This embodiment utilizes a design that reduces reflection while improving light utilization. The second optical layer can significantly reflect light of various colors. Its strong reflectivity allows it to reflect light from the sides and bottom of the light-emitting device, converging it toward the front viewing angle, thereby improving light utilization. Furthermore, the second optical layer effectively shields the underlying metal film. The first optical layer, on the other hand, strongly absorbs light, absorbing reflected light from the underlying metal film and white layer, thereby reducing reflection.

[0078] Furthermore, in this embodiment, the second optical layer itself has a low transmittance, so light emitted laterally from the light-emitting device does not propagate very far in the first direction within the second optical layer. However, the second optical layer has high reflectivity, so most of the lateral light is diffusely reflected in areas near the light-emitting device. The arrows in the figure illustrate the propagation of lateral light within the optical layer. Therefore, the second optical layer emits a higher amount of forward light near the light-emitting device. Light in areas of the second optical layer farther from the light-emitting device is mostly reflected from the underlying metal, and the lateral light emitted by the light-emitting device is essentially negligible. Therefore, the reflected light problem in this area may be more urgent to address. Therefore, the second optical layer utilizes its inherent characteristics to promptly correct lateral light. The first gap is located precisely near the light-emitting device, providing an exit path for the corrected light from the second optical layer. Furthermore, by blocking the light reflected from the underlying metal, the first optical layer helps prevent the sidewall light of the light-emitting device, which is transmitted from the second optical layer, from emitting too far from the light-emitting device itself, causing crosstalk or haloing. As a result, the first optical layer and the second optical layer each play a role in areas with different key issues, ultimately achieving multiple effects of reducing reflection while improving light utilization and improving the light output type of the light-emitting device.

[0079] Optionally, the total OD of the first optical layer 510 and the second optical layer 520 after being superimposed is greater than 1, that is, the total transmittance of the two after being superimposed is less than 10%.

[0080] Optionally, both the first optical layer 510 and the second optical layer 520 are made of low-transmittance materials. The OD values ​​of the first optical layer 510 and the second optical layer 520 are both greater than 1, meaning their transmittances are both less than 10%. This prevents light reflected from the metal film below the optical layer from passing through the optical layer and exiting from the light-emitting surface of the display panel, affecting the display effect.

[0081] Optionally, white nanoparticles, such as titanium dioxide (TiO 2 ), exist in the second optical layer 520 .

[0082] Through such a design, the probability of diffuse reflection of light emitted by the light-emitting device 400 in the second optical layer 520 can be increased, thereby changing the propagation direction of more light emitted laterally from the light-emitting device 400, so that the propagation direction of these light rays is more deflected toward the light-emitting surface of the display panel 100 (that is, the direction in which the second optical layer points to the first optical layer).

[0083] Optionally, in some optional embodiments of the present application, the first gap is a closed ring or a non-closed ring (e.g., a ring with a breakpoint) gap surrounding the light-emitting device. This can improve the light output effect of the light-emitting device in all directions and avoid the appearance of halo. It should be noted that the radius of the outer ring contour minus the radius of the inner ring contour is the width of the ring.

[0084] like Figure 4 and Figure 5 As shown, Figure 5 A partial top view of a display panel provided by an embodiment of the present invention; Figure 5 The local cross-section diagram in the AA direction can be referred to Figure 4 shown.

[0085] Optionally, the maximum size of the first gap 310 is Lmax,

[0086] Wherein, Lmax=log (light intensity of the light emitting device) / unit OD value of the second optical layer.

[0087] That is, a dimension L of the first gap 310 in a direction from the light emitting device 400 to the first optical layer 510 (ie, a width of the first gap 310 ) is 0 to Lmax.

[0088] Optionally, the brightness of the light-emitting device mentioned in the above formula is the brightness of the side surface of the light-emitting device.

[0089] Optionally, the unit OD value mentioned in the above formula refers to the OD value per micron thickness of the second optical layer.

[0090] Through this embodiment, the inventors calculated the distance over which the second optical layer effectively alters the light emitted by the light-emitting device based on experimental data, based on the distance that the light-emitting device can penetrate in the second optical layer. In other words, the radiation range of the lateral light emitted by the light-emitting device in the second optical layer is limited. Therefore, in the second optical layer at a distance from the light-emitting device, there is no sidewall light emitted by the light-emitting device, or such light is basically negligible. However, the problem of reflected light in this area may be more urgent to solve. Therefore, through the above-mentioned design of the size of the first gap, the first optical layer and the second optical layer complement each other, which can not only avoid the mutual influence between the two film layers, but also help each other to compensate for the shortcomings of each other.

[0091] For example, a first optical layer with sufficient area can prevent the appearance of reflected light. It is also necessary to leave a certain width of a first gap between the first optical layer and the light-emitting device to enable the function of the second optical layer to be exerted. Therefore, when the first gap satisfies 0 to Lmax, the utility of the optical layer formed by the first optical layer and the second optical layer can be maximized. At the same time, the second optical layer with low transmittance can also assist in improving the shielding of the reflected light from the underlying metal by the first optical layer. The first optical layer can assist in preventing the light-emitting position of the side light emission of the light-emitting device conducted by the second optical layer from being too far from the light-emitting device itself, resulting in crosstalk or halos.

[0092] Optionally, the total OD of the first optical layer 510 and the second optical layer 520 after superposition is greater than 1, that is, the total transmittance after their superposition is less than 10%.

[0093] Certainly, in some other optional embodiments of the present application, the OD value of the second optical layer is greater than 1, that is, their transmittances are both less than 10%; and the reflectance of the second optical layer 520 is greater than 50%.

[0094] With such a design of the second optical layer with high reflectivity and low transmittance, the optical path of the lateral light emission of the light-emitting device can be changed within a range relatively close to the side wall of the light-emitting device, reducing the width of the first gap, increasing the shielding area of the first optical layer, and ensuring the anti-reflection effect of the optical layer; at the same time, it can also change the direction of the lateral light emission of the light-emitting device as soon as possible, making the position where the light changes closer to the light-emitting device itself, making the light-emitting position of this kind of light closer to other normal forward light emissions, and better avoiding the problems of pixel crosstalk and halos.

[0095] Certainly, in some other optional embodiments of the present application, in the direction of the width of the first gap, the maximum size of the second optical layer exposed by the first optical layer is the above-mentioned Lmax. Where Lmax = log (light intensity of the light-emitting device) / unit OD value of the second optical layer. This can ensure that the second optical layer exposed by the first optical layer has sufficient space to improve the optical path.

[0096] Please continue to refer to Figure 5 As shown, optionally, the light-emitting device 400 includes a first light-emitting device 4110 and a second light-emitting device 420;

[0097] The size of the first gap corresponding to the first light-emitting device 410 is L1;

[0098] The size of the first gap corresponding to the second light-emitting device 420 is L2;

[0099] Among them, L1 < L2; the wavelength of the color light corresponding to the first light-emitting device 410 is less than the wavelength of the color light corresponding to the second light-emitting device 420.

[0100] It should be noted that the size of the first gap 310 refers to the size of the first gap 310 in the direction from its corresponding light-emitting device 400 to its corresponding first optical layer 510, that is, the width of the first gap 310.

[0101] The inventors of the present application have found through research that the transmittance of light with different wavelengths in the second optical layer 520 is different. Therefore, through the above design, the first gap can be matched with light-emitting devices of different colors, avoiding excessive differences in the light patterns of light-emitting devices of different colors.

[0102] Optionally, the second optical layer 520 is a white film layer. As Figure 21 shown, Figure 21 are the data measured by the inventors of the present application according to experiments. Among them, Figure 22 the abscissa of the line graph is the wavelength of light, and the ordinate is the transmittance of light in the second optical layer. It can be seen that the transmittance of light with wavelengths in the range of 400 nm to 460 nm in the second optical layer is low. That is to say, the propagation distance of light with wavelengths in the range of 400 nm to 460 nm in the white film layer is shorter than that of light in other wavelength bands. Therefore, for light-emitting devices that emit light exceeding this wavelength band, a relatively wider first gap needs to be set to compensate for the difference in light patterns between the light-emitting devices that emit light in this wavelength band. For light-emitting devices that emit light in the wavelength range of 400 nm to 460 nm, the width of the first gap can be appropriately reduced, so that while not losing the light quantity of the second optical layer to improve forward light emission, a first optical layer with a sufficient shielding area can also be obtained, thereby ensuring the anti-reflection effect.

[0103] Optionally, the first light-emitting device 410 is a blue light-emitting device, and the second light-emitting device 420 is a green light-emitting device or a red light-emitting device. Because the wavelength range of blue light basically coincides with 400 nm to 460 nm. Optionally, L_blue < L_green, or L_blue < L_red.

[0104] It should be noted that in some optional embodiments of the present application, as Figure 6 shown, Figure 6 is another partial cross-sectional view of the display panel provided by the embodiment of the present invention along the Figure 1 A-A direction in. The light-emitting device 400 can be an organic light-emitting diode (Organic Light Emitting Diode, abbreviated as OLED).

[0105] Of course, in some optional embodiments, the light-emitting device may be a micro light-emitting diode (Micro-LED). The size of the Micro-LED is less than 100 μm. Using Micro-LED as the light-emitting device 400 can effectively increase the lifespan of the display panel, reduce the power consumption of the display panel, shorten the response time of the display panel, and increase the viewing angle of the display panel.

[0106] Furthermore, by using Micro-LEDs as the light-emitting devices 400, the Micro-LEDs can be used to shape the optical layer 500, thereby achieving patterning of the optical layer 500. In particular, when the optical layer 500 is formed by applying ink, film, or PR photoresist to corresponding locations on the array layer 200 through printing, scraping, or PR coating techniques, the Micro-LEDs used as the light-emitting devices 400 can serve to block and shape the optical layer.

[0107] The following embodiments of this application are described using the light-emitting device 400 as a Micro-LED. It should be noted that this application describes the light-emitting device as a flip-chip Micro-LED chip. In other optional embodiments of this application, the light-emitting device is a vertical Micro-LED chip.

[0108] Optionally, the array layer is provided with a connection electrode connected to the pixel circuit. Typically, the connection electrode is a metal connection portion, which is provided on the outermost layer of the array substrate or exposed by the insulating layer on the array substrate, so as to contact and connect with the electrode layer of the Micro-LED transferred to the array substrate. Optionally, the metal connection portion of the array layer can be melted to form a eutectic structure (also called a eutectic layer) with the electrode layer of the Micro-LED, thereby achieving electrical connection between the Micro-LED and the array layer (the pixel circuit).

[0109] Optionally, the optical layer at least covers the metal connection portions on the array layer that are exposed by the light-emitting devices.

[0110] The inventors of this application have discovered that the Micro-LED crystals are bonded to the metal connections on the array layer 200 through the eutectic layer. However, the metal connections and metal lines on the array layer have a high reflectivity to external ambient light, which can cause light crosstalk, form halos, and affect the display effect.

[0111] The embodiments provided herein demonstrate that, as light-emitting devices, Micro-LEDs, due to their inherent resistance to water and oxygen, can be formed first on the array layer and then incorporated into the optical layer. Micro-LEDs can assist in the patterning of the optical layer, for example, by intercepting excess optical layer material. Furthermore, the aforementioned analysis demonstrates that the optical layer prevents light reflected from metal connections from being emitted from the light-emitting surface of the display panel, impacting the display quality.

[0112] like Figure 7 As shown, Figure 7 The display panel provided by the embodiment of the present invention is Figure 1 Another partial cross-section view in the AA direction.

[0113] Optionally, the optical layer 500 slopes along the sidewalls of the light-emitting device 400. The height of the optical layer (which may be a sublayer within the optical layer) where the slope exists is greater at the sloped portion than at the non-sloped portion. That is, the distance from the top surface of the optical layer in the sloped portion to the substrate 110 in the second direction Y is greater than the distance from the top surface of the optical layer in the non-sloped portion to the substrate 110 in the second direction Y.

[0114] Through this embodiment, by utilizing surface tension and the Micro-LED light-emitting device, the optical layer at the side wall of the Micro-LED can easily form a slope, and the slope can play the role of bank light collection in the side direction of the Micro-LED, which is beneficial to improving the lighting efficiency.

[0115] Optionally, the optical layer 500 includes a first optical layer 510 and a second optical layer 520 stacked sequentially along a direction from the array layer 200 to the substrate 110. Other features of the first optical layer 510 and the second optical layer 520 in this embodiment can be referred to other embodiments of the present application and will not be repeated here.

[0116] Optionally, the second optical layer 520 slopes along the sidewall of the light-emitting device 400 . For example, the position circled by the dotted line in the figure is the slope 521 in the second optical layer 520 .

[0117] The first optical layer 510 overlaps with the second optical layer 520 at the slope 521 .

[0118] Optionally, the first optical layer 510 overlaps with the second optical layer 520 at the slope 521 in the first direction X and also in the second direction Y.

[0119] Optionally, the second optical layer 520 gradually decreases in height from the side wall of the light emitting device 400 toward the direction away from the optical layer of the light emitting device 400, forming a downward slope; the first optical layer 510 at least partially covers the slope.

[0120] Optionally, the thickness of the first optical layer 510 covering the slope 521 in the second direction Y is reduced.

[0121] Optionally, the first optical layer 510 is a black layer; and the second optical layer 520 is a white layer.

[0122] By attaching the white second optical layer 520 to the sidewalls of the Micro-LEDs, the second optical layer 520 itself forms a slope angle, which can indirectly thin the black first optical layer 510 in the area near the Micro-LEDs. The second optical layer 520 in the area near the Micro-LEDs redirects a higher amount of light that is close to being emitted in the forward direction. Therefore, this embodiment can allow more light near the Micro-LEDs to be emitted after the optical path has been improved, thereby significantly reducing reflectivity and increasing the amount of light emitted in the forward direction.

[0123] like Figure 2 or Figure 4 As shown, optionally, the top surface of the optical layer 500 is higher than the top surface of the light-emitting device 400. In other words, the opening formed by the optical layer 500 accommodates the light-emitting device, and the light-emitting device 400 is embedded in the opening, and the height of the top surface of the optical layer 500 is higher than the height of the top surface of the light-emitting device 400. The top surface of the optical layer 500 is closer to the light-emitting surface of the display panel 100 than the top surface of the light-emitting device 400. It should be noted that the height of a certain structure mentioned above refers to the distance from the structure to the plane of the substrate in a direction perpendicular to the plane of the display panel. Through this embodiment, the light-emitting device can be embedded in the opening of the optical layer, which will not block the top surface of the light-emitting device and can improve the wide-angle light or side light emitted from the top surface of the light-emitting device, further improve the front light output of the light-emitting device, and reduce crosstalk and halo.

[0124] Optionally, the upper surface of the optical layer 500 is flush with or higher than the upper surface of the light emitting device.

[0125] Optionally, along a direction perpendicular to the plane where the display panel 100 is located, the total thickness of the second optical layer 520 is 10-15 μm.

[0126] Optionally, the optical layer 500 is an organic material, preferably an ink layer or an adhesive layer. This is because such materials can be formed into a film layer with a certain thickness requirement. Furthermore, since the ink layer and the adhesive layer have a certain degree of fluidity and thus a certain surface tension, the top surface of the material layer can be slightly higher than the top surface of the light-emitting device while intercepting the overflow of the ink layer. This better meets the structural requirements for improving the optical effect of the optical layer.

[0127] like Figure 8 As shown, Figure 8The display panel provided by the embodiment of the present invention is Figure 1 Another partial cross-section view in the AA direction.

[0128] Optionally, the optical layer 500 includes the first optical layer 510 and the second optical layer 520 described in the above embodiment.

[0129] Optionally, the height of the second optical layer 520 is greater than the height of the light emitting device 400 .

[0130] In other words, the opening formed by the second optical layer accommodates the light-emitting device, and the light-emitting device is embedded in the opening, and the height of the top surface of the second optical layer is higher than the height of the top surface of the light-emitting device. The top surface of the second optical layer is closer to the light-emitting surface of the display panel than the top surface of the light-emitting device. It should be noted that the height of a certain structure mentioned above refers to the distance from the structure to the plane of the substrate in a direction perpendicular to the plane of the display panel. Through this embodiment, the side light emission of the light-emitting device can be fully improved by the second optical layer, further increasing the amount of light emitted from the front of the light-emitting device.

[0131] Optionally, the total thickness of the second optical layer 520 is 10-15 μm, which can better reduce reflection while improving light utilization, and will not cause excessive light leakage to cause crosstalk.

[0132] Of course, in some optional embodiments, along a direction perpendicular to the plane of the display panel 100, the distance from the top surface of the second optical layer 520 to the plane of the substrate 110 is 10 μm to 15 μm greater than the distance from the light-emitting device 400 to the plane of the substrate 110. This can better reduce reflection while improving light utilization, and will not cause excessive light leakage to cause crosstalk.

[0133] Optionally, the second optical layer 520 is an organic material, preferably an ink layer or an adhesive layer. This is because such materials can form a film layer with a desired thickness. Furthermore, since the ink and adhesive layers have a certain degree of fluidity and thus a certain surface tension, the top surface of the material layer can be slightly higher than the top surface of the light-emitting device while intercepting the overflow. This better meets the structural requirements for improving the optical effect of the second optical layer.

[0134] like Figure 9 As shown, Figure 9 The display panel provided by the embodiment of the present invention is Figure 1 Another partial cross-section view in the AA direction.

[0135] Optionally, a second gap 320 is provided between the optical layer 500 and the light emitting device 400 .

[0136] Optionally, the optical layer 500 and the light-emitting device 400 are not in direct contact, and the gap between them is the second gap 320. The second gap 320 extends through the optical layer 500 in a direction perpendicular to the plane of the display panel 100; that is, the optical layer 500 terminates at the edge of the second gap 320, with the optical layer 500 and the light-emitting device 400 forming two sides of the second gap 320, respectively.

[0137] Optionally, in some optional embodiments of the present application, the second gap is a closed ring or a non-closed ring (eg, a ring with a breakpoint) gap surrounding the light emitting device, which can improve the light emission effect of the light emitting device in all directions.

[0138] Please continue to refer to Figure 9 As shown, optionally, the optical layer 500 is a single film layer structure. That is, along a direction perpendicular to the plane where the display panel is located, the optical layer 500 is a single layer, and the film layer material is consistent.

[0139] Optionally, the optical layer 500 is made of a material with low light transmittance and low reflectivity; its OD value is greater than 1, that is, its transmittance is less than 10%; and its reflectivity is less than 10%.

[0140] Optionally, the optical layer 500 is a black film layer.

[0141] This design creates a second gap 320 between the optical layer 500 and the light-emitting device 400. This allows for proper lateral light emission through the second gap, thus compensating for the lack of lateral light output. This allows the optical layer 500 to be constructed entirely of black material to enhance the anti-reflection effect, thereby achieving both improved light extraction and reduced crosstalk while maintaining the desired anti-reflection effect.

[0142] like Figure 10 As shown, Figure 10 The display panel provided by the embodiment of the present invention is Figure 1 Another partial cross-section view in the AA direction.

[0143] Optionally, the top surface of the optical layer 500 has a concavo-convex structure. That is, the surface of the optical layer facing the light emitting surface of the display panel is a rough surface with a concavo-convex structure.

[0144] Optionally, the upper surface of the optical layer 500 can be patterned and embossed to form a concave-convex structure 700 to reduce specular reflection. In some optional embodiments of the present application, the optical layer is a single-layer structure, and the concave-convex structure is formed on its entire top surface.

[0145] Of course, in some other optional embodiments of the present application, the optical layer may include multiple sub-layers, and the concave-convex structure may be formed on the top surface of the entire optical layer. In other words, the concave-convex structure may be formed on the top surface of the sub-layer on the side of the optical layer closest to the light emitting surface of the display panel. Figure 11 As shown, Figure 11 The display panel provided by the embodiment of the present invention is Figure 1 Another partial cross-section view in the AA direction.

[0146] Optionally, the optical layer 500 includes a first optical layer 510 and a second optical layer 520 stacked in sequence along a direction from the array layer 200 to the substrate 110 .

[0147] Optionally, a concave-convex structure is formed on the first optical layer 510. In this way, the concave-convex structure can reduce the specular reflection while not affecting the mutual auxiliary effect of the sub-film layers inside the optical layer.

[0148] Furthermore, the first optical layer 510 and the second optical layer 520 in this embodiment can refer to the first optical layer 510 and the second optical layer 520 described in the above embodiment.

[0149] Optionally, the first optical layer 510 and the second optical layer 520 are both made of low-transmittance materials. The OD values ​​of the first optical layer 510 and the second optical layer 520 are both greater than 1, that is, the transmittance of both is less than 10%.

[0150] Optionally, the first optical layer 510 is a black layer; and the second optical layer 520 is a white layer.

[0151] Optionally, a concave-convex structure forms the top surface of the black layer, thereby further reducing the reflectivity.

[0152] Optionally, the first optical layer 510 is ink / film, which can be formed by printing / photolithography and lamination. The black film can be patterned and embossed to form a concave-convex structure to reduce specular reflection.

[0153] like Figure 12 As shown, Figure 12 The display panel provided by the embodiment of the present invention is Figure 1 Another partial cross-section view in the AA direction.

[0154] In some embodiments of the present application, the display panel 100 further includes a covering layer 800 , which is made of a transparent material; and the covering layer 800 covers the light-emitting device 400 .

[0155] Optionally, the covering layer 800 is equivalent to a packaging layer that encapsulates the light-emitting device 400 .

[0156] Optionally, the light emitting device 400 is formed before the optical layer 500 , thereby playing the role of intercepting the optical layer.

[0157] Optionally, the cover layer 800 is formed before the optical layer 500. That is, in a direction perpendicular to the plane of the display panel, the optical layer is not covered by the cover layer, but may be partially covered by the optical layer. This avoids the problem of the optical layer remaining directly above the light-emitting device.

[0158] It should be noted that, in the two structures A and B mentioned here, A covering B means that A is located on the side of B facing the substrate, or B is located below A.

[0159] In some embodiments of the present application, the cover layer 800 optionally encapsulates the light emitting device 400. That is, the cover layer at least covers the top surface and side walls of the light emitting device, and wraps the surfaces of the light emitting device in multiple directions.

[0160] Optionally, the material of the cover layer 800 may reuse the material of the encapsulation layer.

[0161] Optionally, the cover layer uses pixel-level packaging of light-emitting devices, that is, one light-emitting device corresponds to one cover layer unit, a single cover layer only covers one light-emitting device, and the cover layers corresponding to different light-emitting devices are discontinuous. In this way, the unitized cover layer can be used to further assist in defining the optical layer.

[0162] Optionally, the cover layer 800 is made of a transparent material, and its refractive index is between that of the light-emitting device (e.g., Micro-LED) and the protective layer (e.g., glass). This allows the light pattern of the Micro-LED to be adjusted and the viewing angle brightness to be adjusted by using a cover layer with a specific refractive index.

[0163] Optionally, the height of the optical layer 500 is greater than that of the cover layer 800. That is, the top surface of the optical layer 500 is higher than that of the cover layer 800. The top surface of the optical layer 500 is closer to the light emitting surface of the display panel 100 than the top surface of the cover layer 800.

[0164] Optionally, the light-emitting device 400 is a Micro-LED, the cover layer 800 is an encapsulant, and the total height of the optical layer 500 (which can be a single layer or a combination of black / white films) is ≥ the total height of the Micro-LED + encapsulant. The height of the optical layer and the cover layer can be adjusted to adjust the light pattern of the Micro-LED and the brightness of the viewing angle.

[0165] Optionally, the optical layer 500 includes the first optical layer 510 and the second optical layer 520 described in the above embodiment.

[0166] Optionally, the height of the top surface of the second optical layer 520 is higher than the height of the top surface of the cover layer 800. The top surface of the second optical layer is closer to the light-emitting surface of the display panel than the top surface of the cover layer. It should be noted that the height of a certain structure mentioned above refers to the distance from the structure to the plane of the substrate in a direction perpendicular to the plane of the display panel. Through this embodiment, the light type and viewing angle brightness of the Micro-LED can be adjusted by adjusting the height of the black and white film and the cover layer, and the second optical layer can be further better matched with the cover layer, further improving the front light output of the light-emitting device.

[0167] Furthermore, after the Micro-LEDs are encapsulated with the cover layer, the top layer of white ink can be flush with or higher than the top surface of the Micro-LEDs to maximize the light efficiency of the Micro-LEDs. The black film layer located above the Micro-LEDs can constrain the light pattern and viewing angle brightness of the Micro-LEDs, and the height of the white and black film layers can be used to effectively design the light output angle.

[0168] Optionally, the distance between the edge of the transparent encapsulant and the edge of the chip is defined as d, where d ≤ L. That is, the sidewalls of the light-emitting device 400 are also covered by a covering layer. For example, the covering layer 800 encapsulates the sidewalls of the light-emitting device 400, and the thickness of the covering layer 800 at the sidewalls of the light-emitting device 400 is d (it should be noted that the thickness here is parallel to the thickness in the first direction X); the spacing between the optical layer 500 and the light-emitting device 400 is L. Optionally, L is the size of the first gap between the first optical layer and the light-emitting device in the above embodiment. This ensures that the second optical layer exposed by the first optical layer has sufficient space to improve the light path.

[0169] Optionally, the thickness of the covering layer on the side wall of the light emitting device is 5 μm to 10 μm. The thickness here refers to the dimension of the covering layer attached to the side wall of the light emitting device in the first direction X. This can ensure both the encapsulation effect and the effect of the optical layer.

[0170] like Figures 13 to 16 As shown, Figures 13 and 14 The display panel provided by the embodiment of the present invention is respectively Figure 1 Several different local cross-sectional views in the AA direction.

[0171] Optionally, the covering layer 800 includes a first region 810 and a second region 820 .

[0172] Optionally, the first region 810 covers the light emitting device 400 . That is, in a direction perpendicular to the plane where the display panel 100 is located (ie, the second direction Y), the projection of the first region 810 covers the projection of the light emitting device 400 .

[0173] Optionally, the second area 820 is covered by the optical layer 500. That is, in a direction perpendicular to the plane where the display panel 100 is located (ie, the second direction Y), the projection of the second area 820 overlaps with the projection of the optical layer 500.

[0174] Optionally, the first region 810 and the second region 820 are continuous structures, and together they form a pixel-level packaging structure to encapsulate a light-emitting device and the surrounding area of ​​the light-emitting device.

[0175] Optionally, the orthographic projection of the second region 820 on the substrate 110 surrounds the orthographic projection of the first region 810 on the substrate 110 .

[0176] Optionally, the first region 810 is higher than the second region 820. That is, the top surface of the first region 810 is higher than the top surface of the second region 820. In other words, this embodiment does not require that the first region 810 and the second region 820 have different thicknesses in the second direction Y. Instead, the top surface of the first region 810 is higher than the top surface of the second region 820. In other words, the top surface of the first region 810 is closer to the light-emitting surface of the display panel 100 than the top surface of the second region 820. It should be noted that the height of a certain structure described above refers to the distance from the structure to the plane of the substrate in a direction perpendicular to the plane of the display panel.

[0177] Alternatively, the cover layer may be patterned using a Halftone process, so that the first region and the second region of different heights can be formed in one patterning step. Of course, the step can also be formed by encapsulating the cover layer twice.

[0178] Through this embodiment, the light-emitting device is first arranged on the array layer before the optical layer is formed. In order to avoid the influence of the process technology of the optical layer (i.e., black and white ink / film) on the light-emitting device and to improve reliability, the Halftone process can be used to not only encapsulate the light-emitting device, but also protect other metal film layers exposed on the array layer through the second region, such as the metal connection part on the array layer that supports the light-emitting device; and at the same time, the first region and the second region can form a secondary step difference at the intersection of the two (it can be understood that the primary step difference is the step difference formed by the second region and the film layer below it) to leave sufficient thickness for the black / white ink or film. In other words, because the optical layer material has a certain degree of fluidity, it is placed in accordance with the spacing between the light-emitting devices during manufacturing. The material's inherent fluidity allows it to autonomously fill the gaps between the light-emitting devices. However, due to the uncontrollable nature of this autonomous filling process, the second optical layer may not meet the required thickness or may even be missing material in some areas. Therefore, in this embodiment, the second region elevates the optical layer, reducing the amount of material required in this area and preventing optical layer missing due to insufficient material in areas close to the light-emitting devices. Furthermore, the higher portion of the first region than the second region forms a step, with the sidewalls of the step intercepting the optical layer and preventing it from overflowing. Furthermore, this secondary step effectively reduces the amount of adhesive film remaining on the upper surface of the light-emitting devices, and any slight residue can be removed along with the encapsulant by ashing.

[0179] Of course, in other optional embodiments of the present application, optionally, the second area can be obtained by extending the covering layer from the first area to the periphery of the light-emitting device. Since the first area is located on the light-emitting device, when the covering layer extends from the first area to the periphery of the light-emitting device, it will naturally adhere to the side wall of the light-emitting device, forming undulations at this location following the outline of the light-emitting device, and naturally forming the above-mentioned secondary steps.

[0180] Optionally, the end position of the first step, that is, the coverage range of the second area can be freely selected as needed to play a packaging role, for example, the second area covers the TFT device, the metal connection part on the array layer and the light-emitting device.

[0181] Please continue to refer to Figure 14As shown, optionally, the array layer 200 includes a light-transmitting area 600. It can be understood that the display panel uses an in-screen hole-digging technology, that is, a light-transmitting area for corresponding light-sensing devices such as cameras and fingerprint recognition sensors is set in the effective display area. For example, an opening is cut in the array layer so that the camera originally located in the border area can be set in an overlapping area with the display area, thereby achieving the purpose of compressing the border and realizing full display. Optionally, the insulating layer in the light-transmitting area of ​​the array layer (such as the gate insulating layer 212, the interlayer insulating layer 214, the passivation layer 220, the passivation layer 220, etc.) is hollowed out, and the hollowing can extend to the substrate 110, so as to have a higher light transmittance to form a light-transmitting area 600. Of course, in some embodiments of the present application, the hollowing can also open up the substrate, which will not be repeated here. Of course, in some other embodiments of the present application, the display area can be processed with the above-mentioned light-transmitting area in each area or in the entire area except for the necessary retained areas, thereby forming a transparent display panel, which will not be repeated here.

[0182] Optionally, the light-transmitting area 600 is filled with a light-transmitting material, which can also be understood as the material filled in the above-mentioned hollow area being a light-transmitting material.

[0183] Optionally, the covering layer 800 is made of the same layer and material as the light-transmitting material filled in the light-transmitting area 600. That is, the step of filling the light-transmitting area with the material is the same as the step of filling the covering layer.

[0184] Optionally, the light-transmitting material filled in the cover layer 800 and the light-transmitting area 600 is a transparent packaging glue.

[0185] Optionally, the covering layer 800 is continuous with the light-transmitting material filled in the light-transmitting area 600 and is integrally formed.

[0186] The inventors of this application have discovered that for under-screen cameras or transparent display technologies, the formation of the light-transmitting area involves a process of hollowing out the array layer. The hollowed-out array layer is prone to residual ink or film used to make the optical layer due to the step difference between the hollowed-out position and the non-hollowed-out position. Therefore, after the light-emitting device is set up, for example, after the Micro-LED is bonded, the light-transmitting area and the Micro-LED package are first protected by a transparent encapsulation glue, and then white and black ink / film are made to form the optical layer, thereby avoiding the problem of material residue. At the same time, since the materials in the two structures are the same steps and materials, the production process of the display panel can be simplified and the cost can be reduced.

[0187] like Figures 15-20 As shown, Figures 15 to 20 The display panel provided by the embodiment of the present invention is respectively Figure 1 Several local cross-sectional views in the AA direction.

[0188] Optionally, the top surface of the light emitting device 400 has a concavo-convex structure 700. Specifically, the concavo-convex structure 700 is formed on a surface of the light emitting device 400 facing the light emitting surface of the display panel 100.

[0189] Optionally, the light-emitting device 400 is a Micro-LED.

[0190] Optional, such as Figures 15-19 In any of the corresponding embodiments shown, the display panel 100 further includes a covering layer 800, which covers at least the top surface of the light-emitting device 400 and the concave-convex structure 700. In other words, the orthographic projection of the covering layer 800 on the plane where the display panel is located covers the orthographic projection of the light-emitting device 400 on the plane where the display panel is located.

[0191] Optionally, the cover layer 800 is formed before the optical layer 500. That is, in a direction perpendicular to the plane of the display panel, the optical layer is not covered by the cover layer, but the optical layer may partially cover the optical layer. In the two structures A and B mentioned here, "A covering B" means that A is located on the side of B facing the substrate, or B is located below A.

[0192] In order to improve the light extraction efficiency of Micro-LED, this embodiment sets a concave-convex structure, namely a PSS structure or a micro-prism structure, on the upper surface of Micro-LED, so that the light-emitting device has a rough surface and breaks the total reflection of the surface. However, the inventors of this application have found that the optical layer formed by the black / white film is easy to remain on the PSS structure, resulting in reduced light efficiency. Therefore, covering the light-emitting device with a covering layer can optimize the patterning step of the optical film layer, avoid the optical layer from remaining on the PSS structure, and ensure light efficiency. In addition, due to the raised cover layer, the optical layer can be better shaped or intercepted to prevent the optical layer from overflowing.

[0193] Please refer to Figures 13 to 16 as well as Figure 19 In any embodiment of the present invention, optionally, the display panel 100 further includes a protective layer 900 located on a side of the optical layer 500 away from the array layer 200 .

[0194] Optionally, the covering layer 800 is in contact with the protective layer 900 .

[0195] Optionally, the difference between the refractive index of the covering layer 800 and the refractive index of the protective layer 900 is less than 0.5.

[0196] Optionally, the refractive index of the covering layer and the refractive index of the protective layer are both about 1 to 1.7 (preferably 1.5).

[0197] Optionally, the protective layer 900 is a glass cover plate, ie, Cover Glass; then the refractive index of the cover layer 800 is equal to the refractive index of the protective layer.

[0198] This allows the light pattern of the Micro-LED to be adjusted and the viewing angle brightness to be adjusted through a covering layer with a specific refractive index.

[0199] In addition, if Figure 19 As shown, due to the glass-encapsulated Micro-LED, there is no air gap, and the wide-angle light is fully reflected inside the glass ( Figure 19 At the same time, the optical layer prevents the reflected light from hitting the array layer or being scattered again or reflected again by the mirror.

[0200] In some embodiments of the present application, optionally, the gap between the optical layer 500 and the light-emitting device 400 is filled with air or a filling material having a refractive index lower than that of glass or a refractive index lower than 1.5.

[0201] Specifically, a third gap 330 is defined between the optical layer 500 and the light emitting device 400 . The third gap 330 is filled with air or a filling material having a refractive index lower than that of glass or a filling material having a refractive index lower than 1.5.

[0202] Optionally, the third gap 330 may include the first gap 310 in the above embodiment.

[0203] Optionally, the third gap 330 may also include the second gap 320 in the above embodiment.

[0204] Of course, in some other embodiments, such as Figure 17 and Figure 18 shown.

[0205] Optionally, the sidewalls of the light-emitting device 400 are also covered with a cover layer. For example, the cover layer 800 encapsulates the sidewalls of the light-emitting device 400, and the thickness of the cover layer 800 at the sidewalls of the light-emitting device 400 is d (it should be noted that the thickness here is parallel to the thickness in the first direction X). The distance between the optical layer 500 and the light-emitting device 400 is L. Optionally, L>d. Therefore, even if the cover layer 800 is separated from the light-emitting device 400 and the optical layer 500, there is still space between them to be filled with a medium to meet the requirements of the third gap 330. In this case, the third gap 330 is more specifically located between the cover layer 800 and the optical layer 500 in the first direction X, and is defined by the optical layer 500 and the cover layer 800.

[0206] In this embodiment, taking the third gap 330 as an example where air is filled and the protective layer 900 is a glass cover, a certain air gap is set around the Micro-LED chip or the packaged Micro-LED chip. After passing through the upper cover glass, the path of the wide-angle Micro-LED light changes, the light pattern is converged, and the total internal reflection of the wide-angle light inside the glass is improved.

[0207] Optionally, in the above embodiment, a first optical layer, such as black ink / film, can be formed on the upper cover glass (i.e., the protective layer), and a height difference is formed between the position of the array layer corresponding to the optical layer and the top of the light-emitting device or the top of the covering layer. After the upper cover glass and the array layer are paired, a third gap, i.e., an air gap, can be formed.

[0208] like Figure 20 As shown, Figure 20 The display panel provided by the embodiment of the present invention is Figure 1 Another partial cross-section view in the AA direction.

[0209] Optionally, the display panel 100 further includes a protection layer 900 located on a side of the optical layer 500 away from the array layer 200 .

[0210] The space between the light emitting device and the protective layer 900 is filled with air or a filling material having a refractive index lower than that of glass or a filling material having a refractive index lower than 1.5.

[0211] Optionally, the light emitting device 400 further includes a third gap 330. That is, the light emitting device is covered on multiple sides by a medium having a similar refractive index, such as air.

[0212] Optionally, no covering layer is provided on the top surface of the light emitting device 400 .

[0213] Optionally, a second gap 320 is provided between the optical layer 500 and the light emitting device 400 .

[0214] Optionally, the second gap 320 forms a portion of the third gap 330 ; the third gap 330 may further include a gap between the protective layer 900 and the light emitting device 400 .

[0215] Need to explain, Figures 18 to 20 Some arrow lines in the figure represent light paths.

[0216] The present invention also provides a display device, including the display panel provided by the present invention. Figure 22 As shown, Figure 22 FIG1 is a schematic diagram of a display device according to an embodiment of the present invention. The display device 1000 includes a display panel 100 according to any one of the above embodiments of the present invention. Figure 22The embodiment only uses a mobile phone as an example to illustrate the display device 1000. It is understood that the display device provided in the embodiment of the present invention can be a computer, a television, an in-vehicle display device, or other display device with a display function, and the present invention does not specifically limit this. The display device provided in the embodiment of the present invention has the beneficial effects of the display panel provided in the embodiment of the present invention. For details, please refer to the detailed description of the display panel in the above embodiments, and this embodiment will not be repeated here.

[0217] The above is a further detailed description of the present invention in conjunction with specific preferred embodiments, and the specific implementation of the present invention should not be considered to be limited to these descriptions. For those skilled in the art of the present invention, without departing from the concept of the present invention, several simple deductions or substitutions can be made, which should be considered to fall within the scope of protection of the present invention.

Claims

1. A display panel, characterized in that: include: substrate; an array layer located on the substrate; an optical layer and a plurality of light-emitting devices located on a side of the array layer away from the substrate; Wherein, the optical layer is arranged corresponding to the intervals between the light emitting devices; The optical layer includes a first optical layer and a second optical layer stacked in sequence along the direction from the array layer to the substrate, the reflectivity of the first optical layer is lower than the reflectivity of the second optical layer; the second optical layer climbs along the side wall of the light-emitting device, and the first optical layer overlaps with the second optical layer at the climbing position.

2. The display panel according to claim 1, wherein The first optical layer is a black layer; the second optical layer is a white layer.

3. The display panel according to claim 1, wherein A top surface of the optical layer is higher than a top surface of the light emitting device.

4. The display panel according to claim 1, wherein: The optical layer is 10 μm to 15 μm higher than the light emitting device.

5. The display panel according to claim 1, wherein The optical layer is an ink layer, a glue layer, or a combination of multiple layers.

6. The display panel according to claim 1, wherein: The top surface of the light emitting device has a concave-convex structure.

7. The display panel according to claim 1, wherein: The light-emitting device is a Micro-LED.

8. A display panel, characterized in that: include: substrate; an array layer located on the substrate; an optical layer and a plurality of light-emitting devices located on a side of the array layer away from the substrate; Wherein, the optical layer is arranged corresponding to the intervals between the light emitting devices; The display panel also includes a covering layer, which covers the light-emitting device; the covering layer includes a first area and a second area; the first area covers the light-emitting device; the second area is covered by the optical layer; wherein the first area is higher than the second area; the display panel also includes a connecting electrode, which is located on the array layer and electrically connected to the light-emitting device, and the covering layer is in contact with the connecting electrode.

9. The display panel according to claim 8, wherein: The optical layer includes a first optical layer and a second optical layer sequentially stacked along a direction from the array layer to the substrate, wherein the reflectivity of the first optical layer is lower than that of the second optical layer.

10. The display panel according to claim 9, wherein: The first optical layer is a black layer; the second optical layer is a white layer.

11. The display panel according to claim 9, wherein There is a first gap between the first optical layer and the light emitting device, The first gap exposes at least a portion of the second optical layer.

12. The display panel according to claim 11, wherein: The size of the first gap is L, Wherein, Lmax=log (light intensity of the light emitting device) / unit OD value of the second optical layer.

13. The display panel according to claim 11, wherein: The light emitting device includes a first light emitting device and a second light emitting device; The first gap corresponding to the first light emitting device is L1; The first gap corresponding to the second light-emitting device is L2; where, L1 < L2; the wavelength of the color light corresponding to the first light-emitting device is less than the wavelength of the color light corresponding to the second light-emitting device.

14. The display panel according to claim 8, wherein the top surface of the optical layer is higher than the top surface of the light-emitting device.

15. The display panel according to claim 8, wherein the optical layer is 10 μm to 15 μm higher than the light-emitting device.

16. The display panel according to claim 8, wherein a second gap is provided between the optical layer and the light-emitting device.

17. The display panel according to claim 16, wherein the optical layer is a single-layer black film layer.

18. The display panel according to claim 8, wherein the optical layer is a combination of one or more of an ink layer and an adhesive layer.

19. The display panel according to claim 8, wherein a third gap is provided between the optical layer and the light-emitting device, and a filling material with a refractive index less than that of glass is filled in the third gap.

20. The display panel according to claim 8, wherein the array layer includes a light-transmitting region, a light-transmitting material is filled in the light-transmitting region, and the covering layer is of the same layer and the same material as the light-transmitting material.

21. The display panel according to claim 8, wherein the display panel further includes a protective layer on a side of the optical layer away from the array layer, the covering layer contacts the protective layer, and the difference in refractive index between the covering layer and the protective layer is less than 0.

5.

22. The display panel according to claim 8, wherein the top surface of the light-emitting device has a concavo-convex structure.

23. The display panel according to claim 8 or 22, wherein the light-emitting device is a Micro-LED.

24. A display device, characterized in that: Comprising: the display panel according to any one of claims 1-23.

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