Cover tape and electronic component packaging

Abstract

The cover tape (10) is sequentially stacked with a base layer (1), an intermediate layer (2) and a sealant layer (3), and the cover tape (10) is used to seal a carrier tape (20) through the sealant layer (3), wherein the sealant layer (3) contains (A) a styrene resin and (B) a poly(meth)acrylic acid derivative, and the styrene content in the component (A) is greater than 15% by mass.

Description

Technical Field

[0001] The invention relates to a cover tape and an electronic component packaging body. Background Art

[0002] After the electronic components such as semiconductor IC chips are manufactured, they are packaged with packaging materials to prevent contamination before they are provided to the installation process. They are stored and transported in a state of being wound on a paper or plastic reel. In the packaging of the electronic components, a strip-shaped packaging material is used in a manner corresponding to the installation process of installing them on a substrate using an automatic installation device. The packaging material is composed of a carrier tape with a plurality of concave storage grooves formed at predetermined intervals on a long sheet and a cover tape heat-sealed on the carrier tape. After the electronic components are stored in the storage grooves of the carrier tape, the cover tape as a cover material is overlapped on the upper surface of the carrier tape, and the two ends of the cover tape are continuously heat-sealed along the length direction with a heated sealing strip, thereby forming an electronic component package.

[0003] The transported electronic component package is transported to an installation process where it is installed on a semiconductor substrate, where the cover tape is peeled off from the carrier tape, the stored electronic components are taken out, and installed on the semiconductor substrate. Therefore, it is important to peel off the cover tape smoothly. In addition, with the recent high-speed installation, the peeling speed of the cover tape has increased, and it is required to improve the peeling strength of the cover tape. For example, Patent Document 1 discloses a cover tape from the viewpoint of obtaining a cover tape whose peeling strength is not easily affected by the peeling speed and whose peeling strength does not increase abnormally during high-speed installation even in the previous peeling strength management method. The cover tape comprises: a base material layer having a predetermined thickness and tensile elastic modulus; and a heat sealing layer containing a polystyrene resin, a polyethylene resin, and a fatty acid amide, and having a predetermined thickness and tensile elastic modulus.

[0004] Prior art literature

[0005] Patent Literature

[0006] Patent Document 1: Japanese Patent Application Publication No. 2005-263257 Summary of the invention

[0007] Technical issues to be solved by the invention

[0008] However, in the technique described in Patent Document 1, when the cover tape is peeled off, the sealant layer of the cover tape remains on the carrier tape side, and sometimes peeling occurs between the sealant layer and the intermediate layer. As a result, it is not possible to obtain a sufficiently high peel strength of the cover tape.

[0009] Means for solving technical problems

[0010] According to the present invention, there is provided a cover tape, which is sequentially laminated with a base material layer, an intermediate layer and a sealant layer, and the cover tape is used to seal a carrier tape through the sealant layer, wherein:

[0011] The sealant layer contains the following components (A) and (B):

[0012] (A) styrene resin;

[0013] (B) poly(meth)acrylic acid derivatives,

[0014] The styrene content in the component (A) is 15% by mass or more.

[0015] Furthermore, according to the present invention, there is provided an electronic component package comprising:

[0016] a carrier tape storing electronic components; and

[0017] The cover tape is sealed on the carrier tape by the sealant layer.

[0018] Effects of the Invention

[0019] According to the present invention, a cover tape having improved peel strength can be obtained. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 It is a cross-sectional view schematically showing the structure of the cover tape in this embodiment.

[0021] Figure 2 This is a perspective view showing an example of a state in which the cover tape for electronic component packaging in the present embodiment is sealed on the carrier tape.

[0022] Figure 3 It is a cross-sectional view schematically showing a modified example of the cover tape in the present embodiment. DETAILED DESCRIPTION

[0023] Hereinafter, the embodiments are described using the accompanying drawings. In addition, in all the accompanying drawings, the same reference numerals are used for the same constituent elements, and the description is appropriately omitted. Moreover, the drawings are schematic diagrams and are not necessarily consistent with the actual size ratios. Moreover, in the present embodiment, the composition can contain each component alone or in combination of two or more.

[0024] <Cover tape 10>

[0025] Figure 1 1 is a diagram schematically showing an example of a cover tape 10 for electronic component packaging (also simply referred to as “cover tape 10”) according to the present embodiment. Figure 1As shown, the cover tape 10 is laminated with a base material layer 1, an intermediate layer 2, and a sealant layer 3 in this order. That is, the sealant layer 3 is the outermost surface and constitutes one surface of the cover tape 10, thereby being able to adhere closely to the carrier tape 20 described later.

[0026] In the present embodiment, the base material layer 1 , the intermediate layer 2 , and the sealant layer 3 all have substantially the same width and length, and exist without interruption or division.

[0027] And, if Figure 2 As shown, the cover tape 10 is used to seal the carrier tape 20, which has a groove 21 for accommodating electronic components. That is, the sealant layer 3 in the cover tape 10 and the carrier tape 20 are heat-sealed in a manner that they are in contact with each other.

[0028] Hereinafter, the form, material, etc. of each layer of the cover tape 10 will be described.

[0029] [Base material layer 1]

[0030] The material constituting the base material layer 1 is not particularly limited. Typically, a material having a mechanical strength sufficient to withstand the application of external force when the cover tape 10 is produced, when the cover tape 10 is bonded to the carrier tape, etc. is preferably used. In addition, a material having heat resistance sufficient to withstand the heat when the cover tape 10 is bonded to the carrier tape is preferably used.

[0031] From the viewpoint of ease of processing, the form of the material constituting the base material layer 1 is preferably a film.

[0032] Specific examples of the material constituting the base material layer 1 include polyester resins, polyamide resins, polyolefin resins, polyacrylate resins, polymethacrylate resins, polyimide resins, polycarbonate resins, and ABS resins.

[0033] Among them, polyester resins are preferred from the viewpoint of improving the mechanical strength of the cover tape 10. In addition, nylon 6 can be used as a material constituting the base material layer 1 from the viewpoint of improving the mechanical strength and / or flexibility of the cover tape 10.

[0034] Furthermore, the base material layer 1 may contain additives such as a lubricant.

[0035] The base material layer 1 may be composed of only one layer or may have two or more layers (for example, the base material layer 1 may be formed of a multilayer film in which the above-mentioned materials are stacked).

[0036] The film used to form the base layer 1 may be an unstretched film or a film stretched in a uniaxial direction or a biaxial direction. From the viewpoint of further improving the mechanical strength of the cover tape 10, a film stretched in a uniaxial direction or a biaxial direction is preferred.

[0037] The thickness of the substrate layer 1 is not particularly limited. The thickness of the substrate layer 1 is preferably 5 μm or more, more preferably 10 μm or more. The thickness of the substrate layer 1 is preferably 50 μm or less, more preferably 40 μm or less, and further preferably 30 μm or less.

[0038] By setting the thickness of base layer 1 to 50 μm or less, the rigidity of cover tape 10 does not become too high. Therefore, even when torsional stress is applied to the sealed carrier tape, cover tape 10 can easily follow the deformation of the carrier tape, thereby preventing cover tape 10 from being accidentally peeled off from the carrier tape.

[0039] By setting the thickness of base material layer 1 to be 5 μm or more, the mechanical strength of cover tape 10 can be sufficiently improved. Therefore, even when cover tape 10 is peeled off from a carrier tape at high speed, for example, it is possible to suppress the cover tape 10 from being broken.

[0040] The total light transmittance of the base material layer 1 is preferably 80% or more, more preferably 85% or more.

[0041] Thus, in the electronic component package composed of the cover tape 10 and the carrier tape, the required transparency can be ensured to enable checking whether the electronic components are correctly housed. In other words, by setting the total light transmittance of the base material layer 1 to be 80% or more, it is easy to visually confirm from the outside the electronic components housed in the package composed of the cover tape 10 and the carrier tape.

[0042] The total light transmittance can be measured in accordance with JIS-K-7361.

[0043] [Middle layer 2]

[0044] The intermediate layer 2 is located between the base material layer 1 and the sealant layer 3 , and can improve the cushioning property, impact resistance, and the like of the cover tape 10 .

[0045] Examples of the material for forming the intermediate layer 2 include one or more selected from ethylene-(meth)acrylate copolymers, ethylene-vinyl acetate copolymers, polystyrene-based resins, and polyethylene.

[0046] Among them, ethylene-(meth)acrylate copolymer, ethylene-vinyl acetate copolymer, polyethylene and polystyrene resin are preferably contained from the viewpoint of improving the cushioning property of the entire cover tape 10. As polyethylene, low-density polyethylene (LDPE) or linear low-density polyethylene (L-LDPE) is more preferable.

[0047] Furthermore, the intermediate layer 2 may contain various additives.

[0048] From the viewpoint of improving the cushioning properties of the entire cover tape 10 , the thickness of the intermediate layer 2 is preferably 10 to 50 μm, more preferably 15 to 45 μm, and even more preferably 20 to 40 μm.

[0049] [Sealing agent layer 3]

[0050] The sealant layer 3 contains (A) a styrene-based resin and (B) a (meth)acrylate polymer. This can provide good heat-sealing properties.

[0051] (A) Styrene resin

[0052] The styrene content in the (A) styrene resin is 15% by mass or more, preferably 20% by mass or more, and more preferably 30% by mass or more. On the other hand, the upper limit of the styrene content in the (A) styrene resin is not particularly limited, but from the viewpoint of maintaining the adhesion of the sealant layer 3, it is preferably 90% by mass or less, and more preferably 80% by mass or less.

[0053] In the cover tape 10 of the present embodiment, by setting the styrene content of the sealant layer 3 to be greater than the above lower limit, the adhesion between the intermediate layer 2 and the sealant layer 3 is improved, and the peel strength can be improved. The details of this mechanism are not yet clear, but it is speculated that this is because the affinity between the intermediate layer 2 and the sealant layer 3 is improved.

[0054] Here, the styrene content refers to the ratio (mass %) of the structural units derived from styrene contained in the (A) styrene resin. When the (A) styrene resin contains two or more copolymers, the average of the styrene contents of the copolymers is the styrene content of the (A) styrene resin.

[0055] Examples of the (A) styrene resin include (A-1) polystyrene, styrene-(meth)acrylate copolymers, styrene-olefin copolymers, hydrogenated styrene block copolymers, high impact polystyrene (HIPS), and general purpose polystyrene resins (GPPS); and (A-2) styrene polymers, α-methylstyrene polymers, styrene-(α-methylstyrene) copolymers, styrene-aliphatic hydrocarbon copolymers, styrene-(α-methylstyrene)-aliphatic hydrocarbon copolymers, and styrene-aromatic hydrocarbon copolymers. These may be used alone or in combination of two or more.

[0056] Among them, from the viewpoint of effectively improving the peel strength, it is preferred to contain a styrene-(meth)acrylate copolymer and / or a styrene-olefin copolymer.

[0057] The styrene-olefin copolymer is a copolymer having units derived from olefins and units derived from styrene. Specific examples of olefins include monoolefins represented by α-olefins such as ethylene, propylene, and butene; and dienes (conjugated dienes) such as butadiene and isoprene.

[0058] The polymerization method of the styrene-olefin copolymer is not limited, but from the viewpoint of improving the peel strength between the cover tape 10 and the carrier tape 20 , the styrene-olefin copolymer is preferably a block copolymer.

[0059] Examples of the styrene-olefin copolymer include styrene / butadiene / styrene block copolymer (SBS), styrene / ethylene / butadiene / styrene block copolymer (SEBS), styrene / isoprene / styrene block copolymer (SIS), and styrene / ethylene / propylene / styrene block copolymer (SEPS).

[0060] From the viewpoint of making the peel strength between the cover tape 10 and the carrier tape 20 more preferable, the styrene content in the styrene-olefin copolymer is preferably 15% by mass or more, more preferably 20% by mass or more, and further preferably 25% by mass or more relative to the entire styrene-olefin copolymer. Also, from the same viewpoint, the styrene content in the styrene-olefin copolymer is preferably 90% by mass or less, and more preferably 85% by mass or less relative to the entire styrene-olefin copolymer.

[0061] From the viewpoint of improving the peel strength between the cover tape 10 and the carrier tape 20, the content of the styrene resin (A) is preferably 5% by mass or more, and more preferably 8% by mass or more, relative to 100% by mass of the resin composition for forming the sealant layer 3. Also, from the same viewpoint, the content of the styrene resin (A) is preferably 90% by mass or less, more preferably 80% by mass or less, and further preferably 70% by mass or less, relative to 100% by mass of the resin composition for forming the sealant layer 3.

[0062] When the styrene polymer (A-1) is used among the styrene resins (A), the melt flow rate (MFR) at 200°C and 5 kg is 0.05 g / 10 min to 200 g / 10 min, preferably 0.1 g / 10 min to 100 g / 10 min.

[0063] By making MFR more than the above lower limit, it is easy to improve the peel strength.

[0064] On the other hand, by making MFR below the above upper limit, workability is improved and high peel strength can be stably obtained.

[0065] Here, MFR of the (A) styrene-based resin was measured under the conditions of 200° C. and 5 kg in accordance with JIS-K-7210.

[0066] (A) When the styrene-based oligomer (A-1) is used among the styrene-based resins, the number average molecular weight is, for example, 300 or more and 5000 or less, and preferably 500 or more and 3000 or less.

[0067] (B) Poly(meth)acrylic acid derivatives

[0068] The poly(meth)acrylic acid derivative of the component (B) refers to a polymer containing either (B-1) (meth)acrylic acid or (B-2) (meth)acrylic acid ester or both.

[0069] Examples of the (meth)acrylic acid of the component (B-1) include acrylic acid and methacrylic acid.

[0070] Examples of the (meth)acrylate of component (B-2) include one or more (meth)acrylates selected from methyl (meth)acrylate, ethyl (meth)acrylate, propyl (meth)acrylate, butyl (meth)acrylate, isobutyl (meth)acrylate, hexyl (meth)acrylate, and ethylhexyl (meth)acrylate.

[0071] The (B) poly(meth)acrylate polymer may be a copolymer with other monomers as long as it does not conform to the above-mentioned component (A). For example, it may be a copolymer containing one or more selected from the group consisting of ethylene-methyl (meth)acrylate copolymers, ethylene-ethyl (meth)acrylate copolymers, ethylene-(meth)acrylate copolymers, and ethylene-vinyl acetate copolymers.

[0072] The (meth)acrylate polymer contains, for example, 5% by mass or more, preferably 10% by mass or more, and more preferably 15% by mass or more, of a structural unit derived from a (meth)acrylate.

[0073] The content of the (B) poly(meth)acrylate polymer is 1% by mass or more, preferably 10% by mass or more, and more preferably 20% by mass or more, relative to 100% by mass of the resin composition for forming the sealant layer 3. On the other hand, the content of the (B) poly(meth)acrylate polymer may be 100% by mass or less, or 98% by mass or less, relative to 100% by mass of the resin composition for forming the sealant layer 3. Thus, good adhesion resistance can be obtained.

[0074] The content of component (A) relative to the content of component (B), i.e., [(A) / (B)] (weight ratio), is preferably 0.015 or more, more preferably 0.02 or more. On the other hand, [(A) / (B)] (weight ratio) is preferably 5 or less, more preferably 4 or less.

[0075] By setting (A) / (B) within the numerical range, the balance between the peelability and the adhesion can be improved.

[0076] The sealant layer 3 may further contain the following components.

[0077] (C) Antistatic agent

[0078] The sealant layer 3 may contain an antistatic agent, thereby improving the antistatic ability.

[0079] As the antistatic agent, for example, an antistatic agent containing lithium ions can be cited. A polymer antistatic agent in which lithium ions are present in a resin can be used. In this way, excellent antistatic performance can be continuously and stably exerted.

[0080] Lithium ions can be contained in the antistatic agent in the form of lithium salts, for example. Examples of the lithium salts include lithium chloride, lithium fluoride, lithium bromide, lithium iodide, lithium perchlorate, lithium acetate, lithium fluorosulfonate, lithium methanesulfonate, lithium trifluoromethanesulfonate, and lithium pentafluoroethanesulfonate.

[0081] The lithium ions contained in the antistatic agent can be confirmed by measuring the amount of metal elements. The amount of lithium ions contained in the antistatic agent is preferably 50 μg / g or more (50 ppm or more), for example.

[0082] Of course, as the antistatic agent, in addition to the antistatic agent containing lithium ions, a known antistatic agent can be used. Furthermore, an antistatic agent containing lithium ions and an antistatic agent not containing lithium ions can also be used in combination.

[0083] Examples of the antistatic agent that does not contain lithium ions include the following.

[0084] Polymers containing a polyether structure (for example, polyamide-based copolymers such as polyetheresteramide, block polymers of polyolefin and polyether, polymers composed of polyethylene ether and glycol, etc.), polymers containing carboxylate groups such as potassium ionomers, copolymers containing quaternary ammonium salt groups, etc.

[0085] Metal fillers such as tin oxide, zinc oxide, and titanium oxide.

[0086] Conductive polymers such as polyethylene dioxythiophene / polystyrene sulfonic acid (PEDOT / PSS), polyacetylene, and polyaniline.

[0087] Conductive carbon

[0088] When the sealant layer 3 contains an antistatic agent, the amount thereof (the total amount when containing two or more) is, for example, 1% by mass or more, preferably 5% by mass or more, more preferably 8% by mass or more, and further preferably 10% by mass or more relative to the entire sealant layer 3. Thus, appropriate antistatic ability can be obtained.

[0089] Furthermore, the content of the antistatic agent is preferably 95% by mass or less, more preferably 90% by mass or less, further preferably 80% by mass or less, and particularly preferably 70% by mass or less relative to the entire sealant layer 3. Antistatic agents are usually expensive. Therefore, by setting the content of the antistatic agent in this way, the cost of making the cover tape 10 can be reduced.

[0090] ·Thickener

[0091] The sealant layer 3 may contain a tackifier.

[0092] Examples of the tackifier include petroleum resins, rosin resins, terpene resins, styrene resins, courmaron / indene resins, etc. Among them, petroleum resins and styrene resins are preferred in view of resistance to adhesion of electronic components, heat sealability to carrier tapes, gas barrier properties, etc.

[0093] Examples of petroleum resin tackifiers include aliphatic petroleum resins, aromatic petroleum resins, aliphatic-aromatic copolymerized petroleum resins, etc. Commercially available products include hydrogenated petroleum resins from Arakawa Chemical Industries, Ltd., under the trade name "ARKON" series.

[0094] When using a thickener, one type may be used alone, or two or more types may be used in combination.

[0095] When sealant layer 3 contains a tackifier, the lower limit of the content of the tackifier is preferably greater than 0.5% by mass, more preferably 1% by mass or more, based on the entire sealant layer 3 in order to achieve an appropriate seal strength with the carrier tape.

[0096] Furthermore, from the viewpoint of preventing electronic components from being easily attached or heat-sealing properties to the carrier tape, the upper limit of the content of the tackifier is, for example, 5 mass % or less, specifically 4 mass % or less, based on the entire sealant layer.

[0097] Other added ingredients

[0098] The sealant layer 3 may contain any additives such as anti-blocking agent, slip agent, lubricant, plasticizer, antioxidant, ultraviolet absorber, colorant, surfactant, inorganic filler, etc., in addition to the above-mentioned components, within the range that does not impair its characteristics. And / or, the surface of the sealant layer 3 may be subjected to a coating treatment of these.

[0099] Examples of the anti-blocking agent include silicon dioxide, aluminosilicate (zeolite, etc.), etc. When the sealant layer 3 contains the anti-blocking agent, blocking of the sealant layer 3 is alleviated.

[0100] Examples of the slip agent include various amides such as palmitic acid amide, stearic acid amide, behenic acid amide, oleic acid amide, erucic acid amide, oleyl palmitamide, stearyl palmitamide, methylene bisstearamide, methylene bisoleamide, ethylene bisoleamide, and ethylene biserucic acid amide; polyalkylene glycols such as polyethylene glycol and polypropylene glycol; and hydrogenated castor oil. When the sealant layer 3 contains the slip agent, the processability of extrusion processing, roll release, and film sliding properties can be improved.

[0101] The amount of other additive components in the sealant layer 3 may be appropriately adjusted according to the purpose of addition, and typically may be adjusted within a range of about 0.01 to 10% by mass relative to the entire sealant layer 3 .

[0102] The thickness of the sealant layer 3 is, for example, 0.01 to 30 μm, preferably 0.02 to 20 μm, more preferably 0.05 to 10 μm, and further preferably 0.1 to 5 μm.

[0103] By setting the thickness of the sealant layer 3 to be 0.01 μm or more, more sufficient sealing properties can be ensured.

[0104] By setting the thickness of sealant layer 3 to 30 μm or less, the rigidity of cover tape 10 does not become too high. Therefore, even when torsional stress is applied to the sealed carrier tape, cover tape 10 can easily follow the deformation of the carrier tape, thereby preventing cover tape 10 from being accidentally peeled off from the carrier tape.

[0105] Furthermore, by setting the thickness of the sealant layer 3 to 20 μm or less, there is also an advantage that “bleeding out” of the molten resin during heat sealing can be suppressed.

[0106] Furthermore, the thickness of the sealant layer 3 is preferably 0.001 to 0.05, and more preferably 0.002 to 0.03, relative to the thickness of the entire cover tape 10.

[0107] [Other layers]

[0108] In addition to the above-mentioned layers, the cover tape 10 may include additional layers.

[0109] For example, a reinforcement layer for improving the mechanical strength of the cover tape 10 may be provided, or an adhesive layer may be provided between the base layer 1 and the intermediate layer 2 and / or between the intermediate layer 2 and the sealant layer 3 .

[0110] [Reinforcement layer 4]

[0111] The cover tape 10 may further include a reinforcement layer 4 at any position on the surface of the sealant layer 3 on the side of the intermediate layer 2 (see Figure 3 ). By providing the reinforcement layer 4, the mechanical strength of the cover tape 10 can be further improved.

[0112] Specific examples of the material constituting the reinforcing layer 4 include polyester resins, polyamide resins, polyolefin resins, polyacrylate resins, polymethacrylate resins, polyimide resins, polycarbonate resins, and ABS resins.

[0113] Among them, polyester resin is preferred from the viewpoint of improving the mechanical strength of the cover tape 10. In addition, polyamide resin, particularly nylon 6, can be used as a material constituting the reinforcement layer 4 from the viewpoint of improving the mechanical strength and / or flexibility of the cover tape 10.

[0114] Furthermore, the reinforcement layer 4 may contain additives such as a lubricant.

[0115] The reinforcing layer 4 may be located at any position as long as it is on the surface of the sealant layer 3 on the intermediate layer 2 side. Figure 3 In the illustrated cover tape, the reinforcement layer 4 is located between the base layer 1 and the intermediate layer 2, but the present invention is not limited thereto. For example, the reinforcement layer 4 may be located on the surface of the base layer 1 opposite to the surface on the intermediate layer 2 side.

[0116] The reinforcement layer 4 may be composed of only one layer or may have two or more layers (for example, the reinforcement layer 4 may be formed of a multilayer film in which the above-mentioned materials are stacked).

[0117] The film used to form the reinforcement layer 4 may be an unstretched film or a film stretched in a uniaxial direction or a biaxial direction. From the viewpoint of further improving the mechanical strength of the cover tape 10, a film stretched in a uniaxial direction or a biaxial direction is preferred.

[0118] The thickness of the reinforcement layer 4 is not particularly limited. The thickness of the reinforcement layer 4 is preferably 5 μm or more, more preferably 10 μm or more. The thickness of the reinforcement layer 4 is preferably 50 μm or less, more preferably 40 μm or less, and further preferably 30 μm or less.

[0119] By setting the thickness of reinforcement layer 4 to 50 μm or less, the rigidity of cover tape 10 does not become too high. Therefore, even when torsional stress is applied to the sealed carrier tape, cover tape 10 can easily follow the deformation of the carrier tape, thereby preventing cover tape 10 from being accidentally peeled off from the carrier tape.

[0120] By setting the thickness of the reinforcing layer 4 to be 5 μm or more, the mechanical strength of the cover tape 10 can be sufficiently improved. Therefore, even when the cover tape 10 is peeled off from the carrier tape at high speed, for example, it is possible to suppress the cover tape 10 from being broken.

[0121] The thickness of the reinforcing layer 4 may be the same as the thickness of the base layer 1 , but is preferably thicker than the base layer 1 from the viewpoint of effectively improving the strength.

[0122] The total light transmittance of the reinforcement layer 4 is preferably 80% or more, more preferably 85% or more.

[0123] Thus, in the electronic component package composed of the cover tape 10 and the carrier tape, the required transparency can be ensured to enable checking whether the electronic components are correctly housed. In other words, by setting the total light transmittance of the reinforcement layer 4 to 80% or more, it is easy to visually check the electronic components housed inside the package composed of the cover tape 10 and the carrier tape from the outside.

[0124] The total light transmittance can be measured in accordance with JIS-K-7361.

[0125] [Adhesive layer]

[0126] As the material forming the adhesive layer, various known solvent-based or water-based adhesion coating agents can be used. More specifically, adhesion coating agents such as isocyanate-based, polyurethane-based, polyester-based, polyethyleneimine-based, polybutadiene-based, polyolefin-based, and alkyl titanate-based can be cited.

[0127] Furthermore, the adhesion between the base material layer 1 and other layers can be improved by subjecting the base material layer 1 to a corona treatment or a plasma treatment. The corona treatment or the plasma treatment may be performed under appropriately selected known conditions.

[0128] Furthermore, the cover tape 10 for electronic component packaging according to the present embodiment may further include a conductive layer (antistatic layer) in addition to the base material layer 1 , the intermediate layer 2 , and the sealant layer 3 .

[0129] [Thickness, Width, and Length of Cover Tape 10]

[0130] The thickness of the cover tape 10 can be appropriately set, and is preferably 20 to 80 μm, and more preferably 25 to 70 μm.

[0131] The width and length of the cover tape 10 can be appropriately set mainly according to the width and length of the carrier tape.

[0132] Typically, the cover tape 10 has a width of about 1 to 100 mm and a length of about 100 to 30,000 m.

[0133] <Method for Manufacturing Cover Tape 10>

[0134] The method for manufacturing the cover tape 10 of the present embodiment is not particularly limited, and can be manufactured by, for example, applying a known extrusion method, a lamination method, a coating method, or the like.

[0135] As an example, the cover tape 10 of the present embodiment can be manufactured by an extrusion lamination method.

[0136] More specifically, the cover tape 10 of the present embodiment can be manufactured through the following steps (1) to (4).

[0137] (1) A film corresponding to the base material layer 1 is prepared.

[0138] (2) A laminating agent is applied to one side of the film prepared in (1), and a layer corresponding to the intermediate layer 2 is formed thereon by extrusion lamination. Thus, a film having a two-layer structure of the base material layer 1 and the intermediate layer 2 is obtained.

[0139] (3) A layer corresponding to the sealant layer 3 is formed by gravure coating on the surface of the two-layer film of (2) where the intermediate layer 2 is exposed. Thus, a three-layer film is obtained.

[0140] (4) The obtained three-layer film is cut into appropriate lengths and widths as required.

[0141] In the extrusion lamination of step (2), a resin material in a molten state is formed into a film on one side of the film corresponding to the substrate layer 1. As the resin material, the resins or various additives listed in the above-mentioned [intermediate layer 2] column can be cited. In the case where the resin material contains two or more materials, it is preferred to mix them appropriately (in a molten state) before film formation. The extrusion temperature in step (2) can be adjusted appropriately. For example, it can be adjusted between 150 and 350°C.

[0142] <Electronic component packaging>

[0143] The electronic component package 100 can be obtained from the cover tape 10 and the carrier tape 20 in which the electronic components are stored in the groove 21 (recess). Figure 2 Provide explanation.

[0144] exist Figure 2 In the embodiment, the cover tape 10 is used as a cover material of a tape-shaped carrier tape 20 , and the tape-shaped carrier tape 20 is continuously provided with concave grooves 21 corresponding to the shape of the electronic component.

[0145] Specifically, cover tape 10 is bonded (usually heat-sealed) to the surface of carrier tape 20 so as to cover the entire opening of recessed groove 21 of carrier tape 20. Hereinafter, a structure obtained by bonding cover tape 10 and carrier tape 20 is referred to as electronic component package 100.

[0146] The electronic component package 100 can be produced, for example, through the following steps.

[0147] First, electronic components are housed in the grooves 21 of the carrier tape 20 .

[0148] Next, the cover tape 10 is bonded to the surface of the carrier tape 20 by heat sealing so as to cover the entire opening of the groove 21 of the carrier tape 20. At this time, the sealant layer 3 in the cover tape 10 is in contact with the carrier tape 20 (i.e., Figure 2 The “back side” of the cover tape 10 in the embodiment is heat-sealed as the sealant layer 3). Thus, a structure (electronic component package 100) in which electronic components are sealed and accommodated can be obtained.

[0149] The specific operation method and conditions of heat sealing are not particularly limited as long as the cover tape 10 and the carrier tape 20 are sufficiently firmly bonded. Typically, it can be performed using a known taping machine at a temperature of 100 to 240°C, a load of 0.1 to 10 kgf, and a time of 0.0001 to 1 second.

[0150] The material of the carrier tape 20 is not particularly limited as long as it can be bonded to the cover tape 10 by heat sealing, and may be made of resin or paper such as a material containing a polystyrene resin, a material containing a polycarbonate resin, or a material containing a polyethylene terephthalate resin. Among them, a resin is preferred from the viewpoint of effectively improving the peel strength.

[0151] By heat-sealing the cover tape 10 to a carrier tape made of these materials to form an electronic component package, it is easy to further reduce the sealant layer remaining on the carrier tape side.

[0152] The electronic component package 100 is wound around a reel, for example, and then conveyed to a work area where the electronic component is mounted on a circuit board, etc. The reel may be made of metal, paper, plastic, or the like.

[0153] After the electronic component package 100 is conveyed to the work area, the cover tape 10 is peeled off from the carrier tape 20 to take out the stored electronic components.

[0154] The electronic components housed in the electronic component package 100 are not particularly limited and may include all components used to manufacture electrical and electronic equipment, such as semiconductor chips, transistors, diodes, capacitors, piezoelectric elements, optical elements, LED-related components, connectors, electrodes, and the like.

[0155] The embodiments of the present invention are described above, but these are only examples of the present invention, and various structures other than the above can be adopted. In addition, the present invention is not limited to the above embodiments, and modifications and improvements within the scope of achieving the purpose of the present invention are included in the present invention.

[0156] [Example]

[0157] Hereinafter, the present invention will be described using Examples and Comparative Examples, but the present invention is not limited thereto.

[0158] <Raw materials>

[0159] (A) Styrene resin

[0160] Styrene-butadiene copolymer: manufactured by Asahi Kasei Corporation, "Tuftec H1221" (styrene content (PS ratio): 12%, MFR (230°C, 2.16 kg): 4.5 g / 10 min)

[0161] Styrene-butadiene copolymer: manufactured by Asahi Kasei Corporation, "Tuftec H1062" (styrene content (PS ratio): 18%, MFR (230°C, 2.16 kg): 4.5 g / 10 min)

[0162] Styrene-butadiene copolymer: manufactured by Asahi Kasei Corporation, "Tuftec H1041" (styrene content (PS ratio): 30%, MFR (230°C, 2.16 kg): 5 g / 10 min)

[0163] Styrene-butadiene copolymer: manufactured by Asahi Kasei Corporation, "Tuftec H1517" (styrene content (PS ratio): 43%, MFR (230°C, 2.16 kg): 3 g / 10 min)

[0164] Styrene-butadiene copolymer: manufactured by Denka Company Limited, “CLEAREN 730L” (styrene content (PS ratio): 75%, MFR (200°C, 5 kg): 8 g / 10 min)

[0165] Styrene oligomer: manufactured by Mitsui Chemicals, Inc., "FTR8100", molecular weight (Mn): 820

[0166] (B) Poly(meth)acrylic acid derivatives

[0167] · "A450A" manufactured by Dainippon Ink Co., Ltd. (formerly DIC Corporation)

[0168] (C) antistatic agent,

[0169] Tin oxide (Mitsubishi Materials Corporation, T-1)

[0170] 〔Middle layer〕

[0171] ·Sumitomo Chemical Co., Ltd., "SUMIKATHENE L705" low-density polyethylene (LDPE)

[0172] · Dupont-Mitsui Polychemicals Co., Ltd., "Elvalloy AC1820" EMA (ethylene-methyl acrylate copolymer resin)

[0173] 〔Reinforcement layer〕

[0174] Biaxially stretched polyester film (TOYOBO CO., LTD., trade name: E5202)

[0175] Biaxially stretched polyamide film (TOYOBO CO., LTD., trade name: N1202)

[0176] <Manufacturing of Cover Tape 1>

[0177] (Examples 1 to 10, Comparative Examples 1 to 2)

[0178] A biaxially stretched polyester film with a film thickness of 12 μm (TOYOBO CO., LTD., trade name: T6140) was used as the base layer, on which a laminating agent (TAKELAC A-520 manufactured by Mitsui Chemicals, Inc.) was coated, and the resins used as the raw materials for the intermediate layer shown in Table 1 were laminated by an extrusion lamination method (extrusion temperature: 280°C), thereby forming an intermediate layer (thickness 25 μm) on the base layer.

[0179] On the intermediate layer side of the obtained laminated film, a sealant layer consisting of 60 mass % of (C) antistatic agent and 40 mass % of component (A) and component (B) having a blend ((A) / (B)) shown in Table 1 was formed by gravure coating with a film thickness of 0.5 μm.

[0180] As described above, cover tapes of the respective examples and comparative examples were manufactured.

[0181] <Manufacturing of Cover Tape 2>

[0182] (Example 11)

[0183] A biaxially stretched polyester film with a film thickness of 12 μm (TOYOBO CO., LTD., trade name: T6140) was used as the base layer, on which a laminating agent (TAKELAC A-520 manufactured by Mitsui Chemicals, Inc.) was coated, and the resins used as the raw materials for the intermediate layer shown in Table 1 were laminated by an extrusion lamination method (extrusion temperature: 280°C), thereby forming an intermediate layer (thickness 40 μm) on the base layer.

[0184] On the intermediate layer side of the obtained laminated film, a sealant layer consisting of 60 mass % of (C) antistatic agent and 40 mass % of component (A) and component (B) having a blend ((A) / (B)) shown in Table 1 was formed by gravure coating with a film thickness of 0.5 μm.

[0185] (Example 12)

[0186] A biaxially stretched polyester film (TOYOBO CO., LTD., trade name: T6140) with a film thickness of 12 μm was used as the base layer, a laminating agent (TAKELAC A-520 manufactured by Mitsui Chemicals, Inc.) was applied thereon, and a film to be a reinforcement layer shown in Table 1 was laminated by dry lamination, thereby forming a reinforcement layer (thickness 16 μm) on the base layer. A laminating agent (TAKELAC A-520 manufactured by Mitsui Chemicals, Inc.) was further applied thereon, and a resin to be a raw material of the intermediate layer shown in Table 1 was laminated by extrusion lamination (extrusion temperature: 280° C.), thereby forming an intermediate layer (thickness 25 μm) on the reinforcement layer.

[0187] On the intermediate layer side of the obtained laminated film, a sealant layer consisting of 60 mass % of (C) antistatic agent and 40 mass % of component (A) and component (B) having a blend ((A) / (B)) shown in Table 1 was formed by gravure coating with a film thickness of 0.5 μm.

[0188] (Example 13)

[0189] A biaxially stretched polyester film (TOYOBO CO., LTD., trade name: T6140) with a film thickness of 12 μm was used as the base layer, a laminating agent (TAKELAC A-520 manufactured by Mitsui Chemicals, Inc.) was applied thereon, and a film to be a reinforcement layer shown in Table 1 was laminated by dry lamination, thereby forming a reinforcement layer (15 μm thick) on the base layer. A laminating agent (TAKELAC A-520 manufactured by Mitsui Chemicals, Inc.) was further applied thereon, and a resin to be a raw material of the intermediate layer shown in Table 1 was laminated by extrusion lamination (extrusion temperature: 280° C.), thereby forming an intermediate layer (25 μm thick) on the reinforcement layer.

[0190] On the intermediate layer side of the obtained laminated film, a sealant layer consisting of 60 mass % of (C) antistatic agent and 40 mass % of component (A) and component (B) having a blend ((A) / (B)) shown in Table 1 was formed by gravure coating with a film thickness of 0.5 μm.

[0191] <Evaluation / Measurement>

[0192] The following evaluations and measurements were performed using the cover tapes obtained in the respective Examples and Comparative Examples.

[0193] [Peel strength]

[0194] (Peel strength relative to carrier tape)

[0195] The peel strength was evaluated according to the peel test in accordance with JIS C 0806-3. The cover tape obtained by the above method was made into a size of 9.5 mm in width, and heat-sealed on a carrier tape (conductive polystyrene carrier tape, "CEL-E980A" manufactured by Sumitomo Bakelite Co., Ltd.) with a width of 12 mm using a heat sealer under the conditions of heat sealing temperature of 180°C, iron size of 0.4 mm wide × 32 mm long, 2 rows and 4 impacts, load of 1 kg, and sealing time of 100 milliseconds, thereby adjusting the sample. For the obtained sample, the peel strength (gf) when the cover tape was peeled off from the carrier tape was measured under the conditions of peeling speed of 300 mm / min, peeling angle of 170°, and peeling time of 10 seconds.

[0196] [Tensile strength (breaking point load: MPa)]

[0197] The tensile strength was evaluated by a method in accordance with JIS K6734.

[0198]

[0199] This application claims priority based on Japanese Patent Application No. 2019-207149 filed on November 15, 2019 and Japanese Patent Application No. 2020-146683 filed on September 1, 2020, and all the disclosed contents are incorporated into this specification.

[0200] Description of Reference Numerals

[0201] 1-Base layer

[0202] 2- Middle layer

[0203] 3- Sealant layer

[0204] 4-Reinforcement layer

[0205] 10-Cover tape

[0206] 20-Carrier tape

[0207] 21-Groove

[0208] 100-Electronic component packaging.

Claims

1. A cover tape, wherein: The cover tape is sequentially stacked with a base material layer, an intermediate layer, and a sealant layer, and the cover tape is used to seal the carrier tape through the sealant layer. The thickness of the sealant layer is 0.01 to 5 μm, and the thickness of the sealant layer is 0.001 to 0.03 relative to the thickness of the entire cover tape, and the unit of the thickness of the entire cover tape is μm. The sealant layer is formed of a sealant layer-forming resin composition containing a styrene resin and a poly(meth)acrylic acid derivative. The styrene content in the styrene-based resin is 15% by mass or more.

2. The cover tape according to claim 1, wherein: The styrenic resin is a styrenic polymer.

3. The cover tape according to claim 2, wherein: The styrenic polymer is a styrene-olefin copolymer.

4. The cover tape according to claim 1 or 2, wherein: The poly(meth)acrylic acid derivative is a polymer using at least one of acrylic acid or methacrylic acid, (meth)acrylic acid ester, and these.

5. The cover tape according to claim 4, wherein: The (meth)acrylate is one or more selected from methyl (meth)acrylate, ethyl (meth)acrylate, propyl (meth)acrylate, butyl (meth)acrylate, isobutyl (meth)acrylate, hexyl (meth)acrylate and ethylhexyl (meth)acrylate.

6. The cover tape according to any one of claims 1 to 3, wherein: The ratio of the content of the styrene-based resin to the content of the poly(meth)acrylic acid derivative is 0.015 or more, The unit of the content is mass %.

7. The cover tape according to any one of claims 1 to 3, wherein: The sealant layer also contains an antistatic agent.

8. The cover tape according to any one of claims 1 to 3, wherein: The sealant layer further includes a reinforcement layer at an arbitrary position on the surface of the intermediate layer side.

9. The cover tape according to any one of claims 1 to 3, wherein: The content of the styrene-based resin is 5% by mass or more and 90% by mass or less relative to 100% by mass of the sealant layer-forming resin composition.

10. The cover tape according to any one of claims 1 to 3, wherein: The content of the poly(meth)acrylic acid derivative is 1% by mass or more and 100% by mass or less relative to 100% by mass of the sealant layer-forming resin composition.

11. The cover tape according to any one of claims 1 to 3, wherein: The thickness of the substrate layer is 5 μm or more and 50 μm or less.

12. The cover tape according to any one of claims 1 to 3, wherein: The intermediate layer has a thickness of 10 μm or more and 50 μm or less.

13. The cover tape according to any one of claims 1 to 3, wherein: The sealant layer has a thickness of 0.01 μm or more and 30 μm or less.

14. An electronic component package, wherein: have: a carrier tape storing electronic components; and The cover tape according to any one of claims 1 to 3, wherein the cover tape is sealed on the carrier tape by the sealant layer.

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