Electronic assembly and method of manufacturing thereof

Abstract

The present disclosure relates to an electronic component and a method of manufacturing the same, and more particularly, to a surface mount type electronic component disposed on an electronic device and a method of manufacturing the same. An electronic component according to an exemplary embodiment includes a main body part having a polyhedral shape and including a recessed portion formed such that at least a portion of edges where two mutually adjacent surfaces meet is recessed, an insulating part disposed on a surface of the main body part to cover the recessed portion, and an electrode part separately disposed on an area of the surface of the main body part other than an area on which the insulating part is disposed.

Description

Technical Field

[0001] This disclosure relates to an electronic component and a method of manufacturing the same, and more specifically to a surface-mount electronic component disposed on an electronic device and a method of manufacturing the same. Background Technology

[0002] All types of electronic devices (e.g., portable devices and home appliances) use multiple electronic components. Electronic devices have operating frequency bands, which are gradually expanding into higher frequency ranges due to developments such as multi-functionality and digital communication, and the response to high frequencies is also an important issue for the electronic components used in electronic devices.

[0003] Power inductors, as electronic components, are used in power circuits or converter circuits where high current flows. Due to the trend towards higher frequencies and miniaturization in power circuits, power inductors are increasingly being used to replace typical wound-type choke coils. Furthermore, due to the need for small and multifunctional electronic devices, power inductors that meet the requirements of miniaturization, high current applications, and low resistance are being developed.

[0004] Power inductors are mounted on printed circuit boards (PCBs) and electrically connected to the PCB via electrodes. However, the electrodes of power inductors generally have a structure that exposes a portion of the bottom surface of the power inductor, and even the top and side surfaces, with the bottom surface facing the PCB due to the manufacturing process. However, when the electrodes of the power inductor are exposed on the top surface, a short circuit may occur with the shielding that covers the power inductor, and when the electrodes are exposed on the side surfaces, a short circuit may occur with other electronic components adjacent to the side surfaces.

[0005] [Existing Technical Documents]

[0006] Korean Patent Publication No. 10-2016-0092543 Summary of the Invention

[0007] Technical challenges

[0008] This disclosure provides an electronic component capable of preventing short circuits with adjacent components, and a method for manufacturing the same.

[0009] Problem-solving methods

[0010] According to an exemplary embodiment, an electronic component includes: a body component having a polyhedral shape and including a recessed portion, the recessed portion being formed such that at least a portion of a plurality of edges is recessed at the intersection of two mutually adjacent surfaces; an insulating component disposed on a surface of the body component to cover the recessed portion; and an electrode component disposed separately on the surface of the body component other than the area on which the insulating component is disposed.

[0011] The bottom surface of the main body component may form a mounting surface to which the electronic components are mounted, and the recessed portion may be defined along at least two edges, wherein the top surface of the main body component and each of the two opposing side surfaces of the main body component intersect at the at least two edges.

[0012] The recessed portion may be formed as at least a portion of the edge of the top surface of the main body component that is recessed to a predetermined depth along the side surface of the main body component.

[0013] The depth of the recessed portion may be 1 / 5 to 1 / 2 of the length from the top surface of the main body component to the bottom surface of the main body component.

[0014] The insulating component may include a first insulating component configured to cover the recessed portion and the top surface of the body component.

[0015] The insulating component may further include: a second insulating component disposed on the bottom surface of the body component, excluding the area adjacent to the two opposing side surfaces of the body component; and a third insulating component disposed on other side surfaces of the body component, excluding the two opposing side surfaces of the body component, and the electrode component may extend from below the first insulating component to the bottom surface of the body component on each of the two opposing side surfaces of the body component.

[0016] The electronic component may also include an insulating layer disposed on each of the two opposing side surfaces of the body component to cover the electrode component.

[0017] The main component may include: a body; and a spiral coil pattern disposed in the body and connected to the electrode component.

[0018] According to another exemplary embodiment, a method of manufacturing an electronic component includes: a process of recessing at least a portion of a plurality of edges of a body component having a polyhedral shape and forming an insulating component on a surface of the body component to cover the recessed area of ​​the body component; and a process of forming an electrode component on the surface of the body component.

[0019] The process of forming the insulating component may include: a process of preparing a laminate having a plurality of unit regions; a process of recessing at least a portion of a surface of the laminate along a boundary line configured to divide the plurality of unit regions; a process of forming a first insulating layer on the surface of the laminate; and a process of cutting the laminate having the first insulating layer formed thereon along the boundary line.

[0020] The boundary line may include a first boundary line extending in a direction intersecting the laminate and a second boundary line extending in a direction intersecting the first boundary line, and the process of recessing the one surface of the laminate may cause the one surface of the laminate to be recessed along at least one of the first boundary line and the second boundary line.

[0021] The process of recessing one surface of the stack may include a process of cutting the stack along at least a portion of the boundary lines configured to divide the plurality of unit regions.

[0022] The process of preparing the laminate and the process of recessing one surface of the laminate can be performed simultaneously.

[0023] The process of preparing the laminate and the process of recessing one surface of the laminate can be performed by pressing a plurality of sheets for forming the laminate onto a template having at least one receiving member.

[0024] The plurality of sheets may include a first body sheet, a coil pattern sheet having a plurality of coil patterns, and a second body sheet, wherein the coil pattern sheet may be stacked such that the plurality of coil patterns overlap with the receiving component.

[0025] The pressing process can be performed to press such that a portion of the laminate is filled into the receiving component.

[0026] The process of forming the first insulating layer can form the first insulating layer on the entire surface of the stack including the recessed region.

[0027] The method may further include: performing a process of forming a second insulating layer on another surface of the stack opposite to one of the surfaces prior to the process of cutting the stack along the boundary line.

[0028] The method may further include: after the process of cutting the stack along the boundary line, performing a process of forming a third insulating layer on the remaining side surfaces of the side surfaces configured to connect one surface of the cut stack with the other surface, excluding the two side surfaces that are opposite to each other.

[0029] The process of forming the electrode component may include a process of plating the surface of the cut stack, and the method may further include: after the process of forming the electrode component, performing a process of forming an insulating layer on two opposing side surfaces of the cut stack to cover the electrode component.

[0030] The effect of this application

[0031] According to an exemplary embodiment, short circuits with adjacent components can be prevented by limiting the area in the electronic component where electrodes are formed.

[0032] That is, when an insulating layer is formed on the top surface of an electronic component and in a region extending a predetermined length from the top surface along the side surfaces, the electrode formation height can be reduced, and short circuits with the shielding that covers the electronic component can be effectively prevented. Furthermore, the manufacturing process for electronic components with an insulating layer formed on them, as described above, can be simplified to improve manufacturing efficiency and productivity.

[0033] Furthermore, since electrodes are exposed via the bottom surface of the main body component that is mounted only to the electronic device or circuit board, surface-mount electronic components with high reliability can be realized. Attached Figure Description

[0034] Figure 1 This is a schematic diagram illustrating the appearance of an electronic component according to an exemplary embodiment.

[0035] Figure 2 This describes the intercept along a plane extending in the X and Z axes. Figure 1 The cross-sectional view of the electronic component shown.

[0036] Figure 3 This is a view illustrating various shapes of the recessed portion according to an exemplary embodiment.

[0037] Figure 4 This describes the intercept along a plane extending in the X and Y axes. Figure 1 The cross-sectional view of the electronic component shown.

[0038] Figure 5 This is a schematic diagram illustrating the appearance of an electronic component according to another exemplary embodiment.

[0039] Figure 6This is a view illustrating the state of preparation of the laminate according to an exemplary embodiment.

[0040] Figure 7 This is a view illustrating the state of a surface depression in a stacked body according to an exemplary embodiment.

[0041] Figure 8 This is a schematic diagram illustrating the appearance of the mold used in a method of manufacturing an electronic component according to an exemplary embodiment.

[0042] Figures 9 to 16 This is a view that sequentially describes a method for manufacturing an electronic component according to an exemplary embodiment. Detailed Implementation

[0043] Exemplary embodiments of the invention will be described in detail below with reference to the accompanying drawings. However, the invention may be embodied in different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that the invention will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art. In the drawings, the thickness of layers and regions is enlarged for clarity. In the figures, similar reference numerals refer to similar elements throughout.

[0044] Figure 1 This is a schematic diagram illustrating the appearance of an electronic component according to an exemplary embodiment. Furthermore, Figure 2 This describes the intercept along a plane extending in the X and Z axes. Figure 1 A cross-sectional view of the electronic components shown. Figure 3 These are views illustrating various shapes of the recessed portion according to exemplary embodiments, and Figure 4 This describes the intercept taken along a plane extending in the X and Y axes. Figure 1 The cross-sectional view of the electronic component shown.

[0045] refer to Figures 1 to 4 An electronic component according to an exemplary embodiment includes: a body component 100 having a polyhedral shape and including a recessed portion 112, the recessed portion 112 being formed as at least a portion of a plurality of edges, two mutually adjacent surfaces meeting at the plurality of edges; an insulating component 200 disposed on a surface of the body component 100 to cover the recessed portion 112; and an electrode component 300 disposed separately on the surface of the body component 100 other than the area on which the insulating component 200 is disposed.

[0046] Electronic components can include all kinds of components used in various electronic devices. Furthermore, electronic components can be passive elements that perform various functions in an electronic device when power is applied. For example, electronic components can include noise filters, diodes, rheostats, radio frequency (RF) inductors, power inductors, and composite elements thereof.

[0047] Here, a power inductor is a component that stores electricity in the form of a magnetic field and maintains the output voltage to stabilize power. A power inductor can be defined as an inductor that has high efficiency and a smaller inductance variation than that of a general inductor when direct current (DC) is applied. That is, in addition to the functions of a general inductor, a power inductor may also include DC bias characteristics (inductance change when DC is applied).

[0048] The following section will illustrate the detailed structure of an electronic component as a power inductor. However, electronic components are not limited to this. For example, when electronic components are installed in electronic devices and powered, they can include all kinds of components that perform various functions.

[0049] The main body component 100 may have a polyhedral shape. For example, the main body component 100 may have a hexahedral shape. That is, the main body component 100 may have a generally hexahedral shape with a predetermined length in the X-axis direction, a predetermined width in the Y-axis direction, and a predetermined height in the Z-axis direction. In this case, the main body component 100 may have a top surface 110A, a bottom surface 110B, and four side surfaces 110C1, 110C2, 110C3, and 110C4, and the bottom surface 110B of the main body component 100 may form a mounting surface for mounting electronic components. That is, electronic components can be mounted to an electronic device or a circuit board included in an electronic device by arranging the bottom surfaces of the main body component facing the electronic device or the circuit board included in the electronic device. Here, the circuit board may include a printed circuit board (PCB) on which all kinds of wiring for operating the electronic device is printed.

[0050] Furthermore, the main body component 100 may have multiple edges. Here, each of the edges represents a line segment where two adjacent surfaces intersect. When the main body component 100 has a hexahedral shape, each of the edges is formed between the top surface 110A of the main body component and the four side surfaces 110C1, 110C2, 110C3 and 110C4, between the bottom surface 110B of the main body component and the four side surfaces 110C1, 110C2, 110C3 and 110C4, and between the four side surfaces 110C1, 110C2, 110C3 and 110C4.

[0051] The main body component 100 has a recessed portion 112, which is formed such that at least a portion of the plurality of edges is recessed. For example, the recessed portion 112 may be formed such that at least a portion of the plurality of edges disposed along the periphery of the top surface of the main body component 100 is recessed. The recessed portion 112 is an assembly in which an insulating member 200 formed on the top surface of the main body component 100 extends downward along at least a portion of the side surface of the main body component 100. When the insulating member 200 extends downward from the top surface of the main body component 100 to the recessed portion 112, plating is prevented from extending into the area where the insulating member 200 is disposed during the formation of the electrode component. Detailed features regarding this will be described later when the electrode component is described.

[0052] The recessed portion 112 may be formed on at least a portion of the plurality of edges where the top surface of the body member 100 intersects with the four side surfaces 110C1, 110C2, 110C3, and 110C4. For example, the recessed portion 112 may be defined along the four edges where the top surface 110A of the body member 100 intersects with the four side surfaces 110C1, 110C2, 110C3, and 110C4, or along the two edges where the top surface 110A of the body member 100 intersects with two opposing side surfaces 110C1 and 110C2. When the recessed portion 112 is defined along the four edges, the insulating member 200 may extend downward along all the side surfaces of the body member 100. When the recessed portion 112 is defined along two edges, the insulating member 200 may extend downward only from the side surface on which the electrode member is formed.

[0053] The recessed portion 112 can be formed as at least a portion of the edge of the top surface 110A of the main body member 100 recessed to a predetermined depth along the side surfaces 110C1, 110C2, 110C3, and 110C4 of the main body member 100. Here, the recessed portion 112 can have various shapes obtained by recessing at least a portion of the edge of the top surface 110A of the main body member 100 along the side surfaces 110C1, 110C2, 110C3, and 110C4 of the main body member 100. For example, such as... Figure 3 As described in (a), the recessed portion 112 may have a shape that recesses such that the edge of the top surface 110A of the main body member 100 is stepped. However, the shape of the recessed portion 112 is not limited to this. For example, the recessed portion 112 may have various shapes, such as a shape in which the top surface 110A of the main body member 100 is chamfered, such as... Figure 3 As described in (b); or the top surface 110A of the main body 100 is recessed into a curved surface shape, as shown in (b). Figure 3 As explained in (c).

[0054] Here, the recessed portion 112 may have a depth of 1 / 5 to 1 / 2 of the height of the main body component 100 (i.e., the length from the bottom surface 110B to the top surface 110A of the main body component 100). That is, the recessed portion 112 may be formed with a depth of 1 / 5 to 1 / 2 of the length of each of the side surfaces 110C1, 110C2, 110C3 and 110C4 of the main body component 100 in the Y-axis direction. Here, when the recessed portion 112 is formed to a depth less than 1 / 5 of the length of each of the side surfaces 110C1, 110C2, 110C3 and 110C4 in the Y-axis direction, the insulating member 200 covering the top surface 110A of the main body member 100 may not extend downward to a sufficient length, and when the recessed portion 112 is formed to a depth greater than 1 / 2 of the length of each of the side surfaces 110C1, 110C2, 110C3 and 110C4 in the Y-axis direction, the lead-out portion may not be electrically connected to the electrode member, because generally the lead-out portion exposed from the central portion of the two opposing side surfaces 110C1 and 110C2 of the main body member 100 is covered.

[0055] In addition, the main body component 100 may include a body 110 and a spiral coil pattern 130, which is disposed in the body 110 and connected to the electrode component 300, which will be described later.

[0056] The body 110 can form the outer shape of the main component 100. Therefore, the body 110 can have a polyhedral shape with multiple edges, just like the main component 100, and the aforementioned recessed portion 112 can be formed on at least a portion of the multiple edges of the body 110. The body 110 can be formed by mixing metal powder with an insulating material.

[0057] The metal powder can use one or at least two particles of the same size, or it can use one or at least two particles of multiple sizes. Here, the metal powder can be made of the same material or different materials. When the metal powders have different average particle sizes, the metal powders can be uniformly mixed and distributed throughout the entire body 110 to maintain uniform permeability. Furthermore, when at least two metal powders of different sizes are used, the filling rate of the body 110 can be increased, and thus the capacity can be maximized.

[0058] The metal powder can be a metal material based on iron (Fe) with added Si, B, Nb, and Cu. For example, the metal powder may include at least one metal selected from the group consisting of free iron-silicon (Fe-Si), iron-nickel-silicon (Fe-Ni-Si), iron-silicon-boron (Fe-Si-B), iron-silicon-chromium (Fe-Si-Cr), iron-silicon-aluminum (Fe-Si-Al), iron-silicon-chromium-boron (Fe-Si-Cr-B), iron-aluminum-chromium (Fe-Al-Cr), iron-silicon-boron-niobium-copper (Fe-Si-B-Nb-Cu), and iron-silicon-chromium-boron-niobium-copper (Fe-Si-Cr-B-Nb-Cu). That is, the metal powder can be formed from a metal alloy containing iron to have a magnetic structure or magnetic properties, thereby having a predetermined magnetic permeability.

[0059] Insulating materials can be mixed with metal powder to insulate the metal powder particles from each other. That is, the eddy current and hysteresis losses of the metal powder can increase at high frequencies, leading to material loss. To reduce material loss, the body 110 may contain insulating materials to insulate the metal powder particles from each other. The insulating material may include at least one selected from the group consisting of free epoxy resins, polyimides, and liquid crystal polymers (LCPs). However, exemplary embodiments are not limited thereto. Alternatively, the insulating material may be made of a thermosetting resin, such as epoxy resin, to provide insulating properties between the metal powder particles.

[0060] The coil pattern 130 has a spiral shape and is disposed in the body 110. The coil pattern 130 may be formed on at least one surface of the support layer 120, preferably on both surfaces of the support layer 120. The coil pattern 130 may be formed on a predetermined area of ​​the support layer 120, for example, forming a spiral shape from the central portion of the support layer 120 outwards, and two coil patterns 130 formed on the two surfaces of the support layer 120 may be connected to form a coil. That is, each of the coil patterns 130 may have a spiral shape starting from the outside of a perforation defined in the central portion of the support layer 120. Furthermore, the coil patterns 130 may be connected to each other via a conductive path 122 defined in the support layer 120. Here, the upper coil pattern 132 and the lower coil pattern 134 may have the same shape and the same height.

[0061] Here, the support layer 120 may have a shape in which metal foil is adhered to each of the top and bottom surfaces of a substrate having a predetermined thickness. The substrate may include glass-reinforced fibers, plastic, and ferrous oxide. For example, the support layer 120 may include a copper clad lamination (CCL) in which copper foil is bonded to glass-reinforced fibers.

[0062] When the coil pattern 130 is formed on at least one surface of the support layer 120 described above, an inner insulating layer may be provided to cover the top and bottom surfaces of the coil pattern 130 to insulate the coil pattern 130 from the metal powder in the body. The inner insulating layer may be formed to cover the support layer 120 in addition to covering the top and bottom surfaces of the coil pattern 130, and the support layer 120 and the coil pattern 130 may be formed over the entire exposed area of ​​the body 110.

[0063] An insulating member 200 may be provided on the surface of the main body component to cover the recessed portion 112. Here, the insulating member 200 may include a first insulating member 210, which is configured to cover the entire recessed portion 112 and top surface 110A of the main body component 100.

[0064] As described above, the recessed portion 112 may be formed on at least a portion of the plurality of edges, where the top surface of the main body member 100 intersects with the four side surfaces 110C1, 110C2, 110C3, and 110C4 at the plurality of edges. In this case, the first insulating member 210 may be configured to cover the top surface 110A of the main body member 100 and the recessed portion 112 formed along the perimeter of the top surface 110A of the main body member 100 across the entire edge, such as... Figure 4 As explained in (a).

[0065] Furthermore, the recessed portion 112 may be formed on two edges, at which the top surface 110A of the main body member 100 contacts each of the two opposing side surfaces of the main body member 100. In this case, the first insulating member 210 may be configured to cover the recessed portion 112 formed on the two edges where the top surface 110A of the main body member 100 contacts each of the two opposing side surfaces of the main body member 100, such as... Figure 4 As illustrated in (b). Although the first insulating member 210 covering the top surface 110A and the recessed portion 112 of the main body member 100 has the same height in the drawings, the first insulating member 210 may have various shapes that cover the entire top surface 110A and the recessed portion 112 of the main body member 100.

[0066] Here, the first insulating component 210 may be made of a material having excellent insulating properties, excellent coating properties, and excellent adhesive properties. For example, the first insulating component 210 may be made of a material containing epoxy resin. However, the exemplary embodiments are not limited to the material of the first insulating component 210. For example, the first insulating component 210 may be made of various materials having insulating properties.

[0067] The insulating member 200 may further include a second insulating member 220, which is disposed on the bottom surface 110B of the main body member, excluding the area adjacent to the two opposing side surfaces 110C1 and 110C2 of the main body member 100. Furthermore, the insulating member 200 may also include a third insulating member 230, which is disposed on the other side surfaces 110C3 and 110C4 of the main body member 100, excluding the two opposing side surfaces 110C1 and 110C2 of the main body member 100.

[0068] As described above, when the electronic assembly also includes a second insulating member 220 and a third insulating member 230, only the area of ​​the first insulating member 210 extending in the two opposing side surfaces 110C1 and 110C2 of the body member 100 and the area of ​​the bottom surface 110B adjacent to the two side surfaces 110C1 and 110C2 can be exposed.

[0069] The electrode component 300 can be configured to be separate from the surface of the main component 100, excluding the area where the insulating component 200 is provided, to apply electricity to the main component 100. Here, the electrode component 300 may include a first electrode 310 and a second electrode 320, which are respectively disposed on the two opposing side surfaces 110C1 and 110C2 of the main component 100. The first electrode 310 may have an "L" shape extending from one side surface 110C1 of the main component 100 to the bottom surface 110B of the main component 100, and the second electrode 320 may have an "L" shape extending from the other side surface 110C2 of the main component 100 to the bottom surface 110B of the main component 100.

[0070] The electrode component 300 may be made of a conductive metal. For example, the electrode component 300 may be made of at least one metal selected from the group consisting of gold, silver, platinum, copper, nickel, palladium, and alloys thereof. Furthermore, the electrode component 300 may include a first electrode layer formed on the surface of the body component 100 and a second electrode layer formed on the first electrode layer. Here, the first electrode layer may be made of a copper-containing material, and the second electrode layer may be made of a nickel- or tin-containing material.

[0071] Here, the electrode component 300 can be formed via a plating process. Plating is performed simultaneously with the formation of a metal layer along the metal material. As described above, the body 110 contains metal powder. Therefore, the electrode component 300 can be extended along the surface of the body 110 via the plating process. However, the electrode component 300 is hardly formed on the area where the insulating component 200 is formed. Therefore, when the electrode component 300 is formed via the plating process, the electrode component does not extend from the two side surfaces 110C1 and 110C2 of the body component 100 that are opposite each other in the X-axis direction to the area where the first insulating component 210 is formed. That is, the electrode component 300 is formed downwards on the two side surfaces 110C1 and 110C2 of the body component 100 at a certain height from the top surface 110A of the body component 100. Therefore, short circuits with other components (e.g., shielding that can cover electronic components) can be effectively prevented. Although the electrode component 300 is not formed entirely on the first insulating component 210 in the accompanying drawings, the electrode component 300 may extend partially onto the first insulating component 210.

[0072] Furthermore, when the second insulating member 220 is disposed on a portion of the bottom surface 110B of the main body member and the third insulating member 230 is disposed on the other side surfaces 110C3 and 110C4 of the main body member 100, the first electrode 310 may have an "L" shape extending from one side surface 110C1 of the main body member 100 to the bottom surface 110B of the main body member 100, and the second electrode 320 may have an "L" shape extending from the other side surface 110C2 of the main body member 100 to the bottom surface 110B of the main body member 100. Therefore, when the electronic component is mounted via its surface, it can be securely soldered and connected to the circuit board via its bottom surface and two side surfaces.

[0073] Figure 5 This is a schematic diagram illustrating the appearance of an electronic component according to another exemplary embodiment.

[0074] As described above, when the electrode component 300 is formed in an "L" shape, the electronic component can be securely connected to the circuit board via the bottom surface and two side surfaces of the electrode component. Here, when multiple electronic components are integrated on the circuit board and arranged adjacent to each other, short circuits may occur between the electronic components. Therefore, according to another exemplary embodiment, the electronic component may further include an insulating layer 400 disposed on the two opposing side surfaces 110C1 and 110C2 of the body component 100 to cover each of the first electrode 310 and the second electrode 320. In this case, short circuits with other components adjacent to the electronic component in the lateral direction of the body component 100 can be prevented, and the first electrode 310 and the second electrode 320 are exposed only via the bottom surface 110B of the body component 100 facing the electronic device or circuit board, enabling a surface-mount electronic component with high reliability. Although the insulating layer 400 has the same height as the first insulating component 210 in the figures, the insulating layer 400 may extend partially onto the first insulating component 210.

[0075] The method of manufacturing an electronic component according to an exemplary embodiment will be described below. The method of manufacturing an electronic component according to an exemplary embodiment is a method of manufacturing the electronic component described above, and features that are repeated with the features associated with the electronic component will be omitted.

[0076] Figure 6 This is a view illustrating the state of fabrication of a laminate according to an exemplary embodiment, and Figure 7 This is a view illustrating the state of a surface depression in a stacked body according to an exemplary embodiment.

[0077] A method of manufacturing an electronic component according to an exemplary embodiment includes: a process of recessing at least a portion of a plurality of edges of a body component 100 having a polyhedral shape and forming an insulating component 200 on the surface of the body component 100 to cover the recessed areas of the body component 100; and a process of forming an electrode component 300 on the surface of the body component 100.

[0078] For example, the process of forming the insulating member 200 can be achieved by recessing at least a portion of the edge of the body member 100 having a polyhedral shape to form a recessed portion, and forming the insulating member 200 on the surface of the body member 100 to cover the recessed portion 112. Here, the insulating member 200 may include a first insulating member 210 configured to cover the entire top surface 110A of the body member 100 and the recessed portion 112, and in addition to the first insulating member 210, may also include: a second insulating member 220 disposed on the bottom surface 110B of the body member 100, excluding the area adjacent to the two opposing side surfaces 110C1 and 110C2 of the body member 100; and a third insulating member 230 disposed on other side surfaces 110C3 and 110C4 of the body member 100, excluding the two opposing side surfaces 110C1 and 110C2.

[0079] As described above, although the process of forming the insulating component 200 can be performed by recessing a portion of the edge of each main component 100 and forming an insulating component 200 to cover the recessed area, the process can be performed by using a stack comprising multiple unit regions for forming the main component 100 and then cutting the stack into Figure 6 and Figure 7 Each unit region described herein is used to simultaneously perform the process of forming the insulating component 200.

[0080] Therefore, the process of forming the insulating component 200 may include: a process of preparing a laminate comprising multiple unit regions; a process of recessing one surface of the laminate along at least a portion of the boundary lines E1 and E2 used to divide the multiple unit regions; a process of forming a first insulating layer 212 on one surface of the laminate; and a process of cutting the laminate on which the first insulating layer 212 is formed along the boundary lines E1 and E2.

[0081] like Figure 6 As described herein, a stacked body refers to a structure in which multiple unit regions for forming multiple electronic components (e.g., multiple body parts 100) are arranged in an XY plane. A unit region refers to a portion of the stacked body on which a body part 100 is formed when the stacked body is cut. The multiple unit regions may be arranged in a plurality of arrangements along the X-axis and Y-axis directions, wherein multiple first boundary lines E1 intersect the stacked body and extend in the X-axis direction, and multiple second boundary lines E2 intersect the stacked body and extend in the Y-axis direction to divide each unit region located between the first boundary lines E1 and the second boundary lines E2.

[0082] The process of preparing a laminate can be performed by preparing multiple sheets for forming the laminate and pressing the multiple sheets together. That is, the process of preparing a laminate can be performed by arranging and stacking coil pattern sheets having multiple coil patterns between at least two body sheets for forming the body 110 of the main body component 100 and then pressing the laminate together. Here, the boundaries between adjacent body sheets can be integrated together, and therefore it is difficult to inspect without using a scanning electron microscope (SEM).

[0083] The process of recessing one surface of the laminate causes at least a portion of one surface of the laminate to be recessed along the boundary lines E1 and E2 used to divide the plurality of unit regions. That is, as Figure 7 As described, the process of recessing one surface of the laminate can be achieved by recessing one surface of the laminate along at least a portion of the first boundary line E1 and at least a portion of the second boundary line E2 to form a notch 114 along at least a portion of the first boundary line E1 and at least a portion of the second boundary line E2.

[0084] As described above, although the process of recessing one surface of the laminate can be achieved by cutting a surface of the laminate to a predetermined depth along at least a portion of the first boundary line E1 and at least a portion of the second boundary line E2 after the laminate is fabricated, the process of fabricating the laminate and the process of recessing one surface of the laminate can be performed simultaneously to simplify the manufacturing process. This is accomplished by using a mold 10, in which at least one receiving member 12 is formed in the region other than the region facing at least one of the first boundary line E1 and the second boundary line E2, which will be described in detail below.

[0085] Figure 8 This is a schematic diagram illustrating the appearance of the mold used in a method of manufacturing an electronic component according to an exemplary embodiment, and Figures 9 to 16 This is a view that sequentially describes a method for manufacturing an electronic component according to an exemplary embodiment.

[0086] like Figure 8 As described, the frame 10 includes at least one receiving member 12, which is formed in the region other than the region facing at least one of the first boundary line E1 and the second boundary line E2. For example, as Figure 8 As described in (a), the frame 10 may include a plurality of receiving members 12 formed in the remaining region except for the region facing each of the first boundary line E1 extending in the X-axis direction and the second boundary line E2 extending in the Y-axis direction. Furthermore, as... Figure 8As described in (b), the frame may include a plurality of receiving members 12 formed in the region other than the region facing the second boundary line E2 extending in the Y-axis direction. Here, when using Figure 8 When the mold 10 described in (a) is used, an electronic component in which the recessed portion 112 is disposed along the four edges where the top surface 110A of the main body component 100 intersects with each of the four side surfaces 110C1, 110C2, 110C3 and 110C4 of the main body component 100, i.e. Figure 4 The electronic components described in (a). Furthermore, when using... Figure 8 When the mold 10 described in (b) is used, an electronic component in which the recessed portion 112 is disposed along the two edges where the top surface 110A of the main body component 100 intersects with each of the two opposing side surfaces 110C1 and 110C2 of the main body component 100, i.e. Figure 4 The electronic components described in (b).

[0087] The process of preparing the laminate and the process of recessing one surface of the laminate can be performed simultaneously by sequentially stacking and pressing the first body sheet 114, the coil pattern sheet 140 having a plurality of coil patterns 130 and the second body sheet 116 onto the mold 10. At least one receiving member 12 is formed in the mold 10 in the area other than the area facing at least one of the first boundary line E1 and the second boundary line E2.

[0088] More specifically, in the process of preparing the laminate, a first body sheet 114 is positioned on a mold 10, a coil pattern sheet 140 having the plurality of coil patterns 130 is positioned on the first body sheet 114, and a second body sheet 116 is positioned on the coil pattern sheet 140, as follows. Figure 9 As explained in the description. Here, each of the first body sheet 114 and the second body sheet 116, as an assembly pressed in the following process to form the body layer 118, can be a magnetic sheet containing metal powder and insulating material and having a predetermined thickness. Furthermore, the coil pattern sheet 140, as an assembly having the plurality of coil patterns 130 respectively arranged on the plurality of unit regions, has a structure in which the plurality of coil patterns 130 are arranged in a plurality in the X-axis direction and the Y-axis direction by a support layer 120 and lead-out portions 136.

[0089] Here, the coil pattern sheet 140 can be positioned such that the plurality of coil patterns 130 overlap with the receiving member 12 formed in the mold 10. That is, when preparing... Figure 8When the frame 10 described in (a) is used, the coil pattern sheet 140 can be positioned such that the plurality of coil patterns 130 overlap with the plurality of receiving members 12 formed in the frame 10, and when preparing Figure 8 When the frame 10 is as described in (b), the coil pattern sheet 140 can be positioned such that the plurality of coil patterns 130 arranged in the Y-axis direction overlap with a receiving member 12 formed in the frame 10. As described above, when the coil pattern sheet 140 is positioned such that the plurality of coil patterns 130 overlap with the receiving member 12 formed in the frame 10, the arrangement of the coil patterns can be accurately adjusted and the position of the coil patterns can be prevented from being distorted when the first body sheet 114, the coil pattern sheet 140 and the second body sheet 116 are pressed onto the frame 10.

[0090] like Figure 10 As described, the process involves sequentially stacking and pressing a first body sheet 114, a coil pattern sheet 140 having the plurality of coil patterns 130, and a second body sheet 116 onto a mold 10, such that a portion of the stack fills the receiving member 12 formed in the mold 10. This pressing can be performed using warm isostatic pressing (WIP). WIP is a pressing method that uses water or oil as the pressing medium. Because uniform pressure is applied when using WIP, the first body sheet 114, the coil pattern sheet 140, and the second body sheet 116 can be pressed evenly.

[0091] By pressing as described above, a notch 114 can be formed along at least a portion of the first boundary line E1 and at least a portion of the second boundary line E2. That is, the area along at least a portion of the first boundary line E1 and at least a portion of the second boundary line E2 contacts the portion of the frame 10 that does not have a receiving member 12 and is pressed with relatively large pressure, while other areas contact the receiving member 12 of the frame 10 and are pressed with relatively small pressure to fill the receiving member 12. Therefore, the first body sheet 114 and the second body sheet 116 can be integrated together to form a body layer 118 in which a coil pattern sheet 140 is provided between the first body sheet 114 and the second body sheet 116, and at the same time, a notch 114 can be formed along at least a portion of the first boundary line E1 and at least a portion of the second boundary line E2.

[0092] The process of forming the first insulating layer 212 involves forming the first insulating layer 212 on one surface of the laminate. Here, when the laminate is cut along the boundary line, the first insulating layer 212 forms a first insulating member 210 on the main body member 100. The template 10 can be removed from the laminate before the formation of the first insulating layer 212, and can be... Figure 11Similarly, the stacked bodies are flipped and arranged so that the surface with the notch 114 faces upward to facilitate the formation of the first insulating layer 212.

[0093] The process of forming the first insulating layer 212 involves forming the first insulating layer 212 on one surface of the laminate. Here, as... Figure 12 As described, the process of forming the first insulating layer 212 is performed on an entire surface of the laminate, the surface including a recessed region (i.e., notch 114) formed along at least one of the first boundary line E1 and the second boundary line E2.

[0094] Although not shown in the accompanying drawings, after the process of forming the first insulating layer 212, a process of forming a second insulating layer on the other surface of the laminate opposite to the first surface can be performed. Here, the process of forming the second insulating layer can be performed by forming the insulating layer on the entire other surface of the laminate and patterning the insulating layer to remove the region along the second boundary line E2 from the insulating layer formed on the entire other surface. The second insulating layer is then separated by a cutting process to form the second insulating component 220, which will be described later.

[0095] When the first insulating layer 212 is formed on one surface of the laminate via the above-described process, a process is performed to cut the laminate on which the first insulating layer 212 is formed along the boundary line, such as... Figure 13 As shown in the figure. When the stack is cut along a first boundary line extending in the X-axis direction and a second boundary line extending in the Y-axis direction, a plurality of intermediate components are recessed and a first insulating member 210 is disposed on the surface of the main body member 100 to cover the recessed portion 112, each of the plurality of intermediate components including a main body member 100 having a recessed portion 112 formed as at least a portion of the plurality of edges.

[0096] Subsequently, although not shown, a process can be performed to form a third insulating layer on the remaining side surfaces 110C3 and 110C4, excluding the two opposing side surfaces 110C1 and 110C2, among the side surfaces connecting the one surface to the other surfaces. Here, the third insulating layer may correspond to the third insulating member 230, and when the third insulating layer is formed, only the area excluding the region where the first insulating member 210 extends along the two opposing side surfaces 110C1 and 110C2 of the body member 100 and the area of ​​the bottom surface 110B adjacent to the two side surfaces 110C1 and 110C2 can be exposed.

[0097] The process of forming the electrode component 300 involves forming the electrode component 300 on the surface of the main component 100, excluding the area where the insulating layer is provided, such as... Figure 15As explained above, the first insulating layer 212, the second insulating layer, and the third insulating layer can only expose areas other than the regions of the first insulating member 210 extending along the two opposing side surfaces 110C1 and 110C2 of the body member 100, and the regions of the bottom surface 110B adjacent to the two side surfaces 110C1 and 110C2. Therefore, when the electrode member 300 is formed by the plating process, the electrode member 300 is individually configured to have an "L" shape, which extends along the exposed surface of the body member 100 from the two opposing side surfaces 110C1 and 110C2 in the X-axis direction to the bottom surface 110B of the body member 100.

[0098] After the process of forming the electrode component 300, a further process can be performed to form an insulating layer 400 on two opposing side surfaces 110C1 and 110C2 to cover the electrode component 300, such as... Figure 16 As explained in the text, when the electrode component 300 is formed in an "L" shape, short circuits may occur between the electronic components because multiple electronic components are integrated together and arranged close to each other. Therefore, insulating layers 400 can be provided on the two opposing side surfaces 110C1 and 110C2 of the main body component 100 to cover the first electrode 310 and the second electrode 320, respectively.

[0099] As described above, according to an exemplary embodiment, short circuits with adjacent components can be prevented by limiting the area in the electronic component where electrodes are formed.

[0100] That is, when the insulating layer, in addition to the top surface of the electronic component, is also formed to extend along the side surface from the top surface to a predetermined length, the electrode formation height can be reduced, and short circuits with the shielding that covers the electronic component can be effectively prevented. Furthermore, the manufacturing process of the electronic component with the insulating layer formed on it, as described above, can be simplified to improve manufacturing efficiency and productivity.

[0101] Furthermore, since the electrodes are exposed only through the bottom surface of the main body component mounted to the electronic device or circuit board, surface-mount electronic components with high reliability can be realized.

[0102] Although specific terminology is used to describe and illustrate specific embodiments, the terminology is merely illustrative of examples of the embodiments, and therefore those skilled in the art will understand that embodiments and technical terms may be implemented in other specific forms and with modifications, without altering the technical concept or essential characteristics. Therefore, it should be understood that simple modifications to embodiments of the present invention are within the spirit of the invention.

Claims

1. A method of manufacturing an electronic component, comprising: a process of recessing at least a portion of a plurality of edges of a main body member having a polyhedral shape and forming an insulating member on a surface of the main body member to cover a recessed area of the main body member; and a process of forming an electrode member on the surface of the main body member, wherein the process of forming the insulating member includes: a process of preparing a laminate having a plurality of unit areas; a process of recessing one surface of the laminate along an entire boundary line configured to divide the plurality of unit areas; a process of forming a first insulating layer on the one surface of the laminate; and a process of cutting the laminate on which the first insulating layer is formed along the entire boundary line, wherein the process of recessing the one surface of the laminate is performed by a process of pressing a plurality of sheets used to form the laminate on a mold in which a plurality of receiving members are formed in an area other than an area in contact with the entire boundary line.

2. The method according to claim 1, wherein the entire boundary line includes a first boundary line extending in one direction intersecting the laminate and a second boundary line extending in a direction intersecting the first boundary line, and the process of recessing the one surface of the laminate recesses the one surface of the laminate along at least one of the first boundary line and the second boundary line.

3. The method according to claim 1, wherein the process of preparing the laminate and the process of recessing the one surface of the laminate are performed simultaneously.

4. The method according to claim 1, wherein the plurality of sheets include a first body sheet, a coil pattern sheet having a plurality of coil patterns, and a second body sheet, and the coil pattern sheet is laminated such that the plurality of coil patterns overlap the receiving members.

5. The method according to claim 1, wherein the process of pressing is performed such that a portion of the laminate fills in the receiving members.

6. The method according to claim 2, wherein the process of forming the first insulating layer forms the first insulating layer on the entire one surface of the laminate including the recessed area. a process of forming a second insulating layer on another surface of the laminate opposite the one surface is performed before the process of cutting the laminate along the boundary line.

7. The method of claim 2, further comprising: a process of forming a third insulating layer on side surfaces of the laminate configured to connect the one surface and the another surface of the cut laminate except for two side surfaces opposite each other is performed after the process of cutting the laminate along the boundary line.

8. The method of claim 7, further comprising: a process of plating surfaces of the cut laminate, and 9. The method of claim 6, wherein the process of forming the electrode component comprises: the method further includes, after the process of forming the electrode member, a process of forming an insulating layer on two side surfaces of the cut laminate opposite each other to cover the electrode member. ​

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