Input device with force sensor

Abstract

The present invention discloses an input device with a force sensor, which can be integrated into an electronic device and / or operably connected to the electronic device via a wired connection or a wireless connection. The input device can include one or more force sensors, which are positioned under a cover element of the input device or an input surface of the electronic device. The input device can include other components and / or functions, such as a biometric sensor and / or a switch element.

Description

[0001] This application is a divisional application of an invention patent application with an international application date of March 27, 2017, a national application number of 201780014481.3, and an invention name of “Input device with force sensor”.

[0002] CROSS-REFERENCE TO RELATED APPLICATIONS

[0003] This Patent Cooperation Treaty patent application claims priority to U.S. Non-Provisional Patent Application No. 15 / 087,306, filed on March 31, 2016, and entitled “Force Sensor in an Input Device,” the contents of which are hereby incorporated by reference in their entirety. Technical Field

[0004] Embodiments of the present invention generally relate to force sensing. More particularly, embodiments of the present invention relate to force sensors in input devices. Background Art

[0005] Many electronic devices include one or more input devices for receiving user input. Devices such as smart phones, tablet computing devices, laptop computers, wearable communication and health devices, navigation devices, and displays may include or be connected to input devices. For example, an input device may provide information about a user's interaction with a graphical user interface (GUI) to a computing system, such as selecting an element, returning to a home page, and other GUI features. In another embodiment, an input device may capture or receive biometric data associated with a user and provide such biometric data to a computing system.

[0006] Generally speaking, the operation of input devices is binary. For example, a keyboard key can be pressed sufficiently to collapse a dome switch and generate an output signal, or not. An input button can be pressed sufficiently to close a switch and select an icon, or not.

[0007] Binary inputs are inherently limited in that they can only occupy two states (present or absent, on or off, etc.). In some cases, it may be advantageous to also detect and measure the input force applied to the input device. Furthermore, when the force is measured through a series of values, the detected force can serve as a non-binary input. Summary of the invention

[0008] The input device may be included in the electronic device or operably connected to the electronic device using a wired connection or a wireless connection. One or more force sensors in the input device are configured to detect force input applied to the cover element. The cover element may be part of the housing of the electronic device or an input surface of the input device disposed in a hole of the housing.

[0009] The force sensor may employ any suitable force sensing technology, such as capacitive, piezoelectric, piezoresistive, ultrasonic and magnetic sensing technology. In one embodiment, the force sensor is a capacitive force sensor. The force sensor is formed by a first circuit layer including a first group of one or more electrodes and a second circuit layer including a second group of one or more electrodes. The second group of one or more electrodes is separated from the first group of one or more electrodes by a compliant material (e.g., air, silicon layer). Each electrode in the first group is aligned with a corresponding electrode in the second group in at least one direction (e.g., vertically) to generate one or more capacitors. When a force is applied to the cover element, the cover element bends or deflects so that at least one electrode in the first group moves closer to a corresponding electrode in the second group. The capacitance of the capacitor formed by the two electrodes changes as the distance between the electrodes shortens. The force signal sensed from each capacitor represents a capacitance measurement value of the capacitor. The processing device is configured to receive one or more force signals and associate the one or more force signals with the amount of force applied to the cover element.

[0010] In one aspect, the input device includes a fingerprint sensor positioned below the cover element. The fingerprint sensor is configured to capture a fingerprint of a finger when the finger approaches or contacts the cover element. A force sensor is positioned below the fingerprint sensor and above the support element. The force sensor is configured to detect a force input applied to the cover element.

[0011] On the other hand, the input device includes a cover element, one or more first force sensors positioned around the peripheral edge of the cover element, and a second force sensor positioned below the cover element. Each first force sensor is configured to detect a first force input applied to the cover element. The second force sensor is configured to detect a second force input applied to the cover element. One or more first force sensors and second force sensors are operable to detect force inputs in parallel, in series, or with a time offset. For example, one force sensor may initially be used to detect the amount of force applied. As the amount of force applied increases, the force sensor reaches a maximum detectable force. At this point, another force sensor may be used to detect the applied force. Alternatively, in some embodiments, both the first force sensor and the second force sensor may be used to detect a force input that reaches a given amount of force, and then one of the force sensors may be used to detect a force input greater than a given amount of force.

[0012] In another aspect, an input device for use with an electronic device may include a cover element, a fingerprint sensor positioned below the cover element, and a force sensor positioned below the fingerprint sensor and above a support element. The fingerprint sensor may be configured to capture a fingerprint of a finger when the finger approaches or contacts the cover element. The force sensor may be configured to detect a force input applied to the cover element. The input device may also include a compliant layer positioned below the cover element and surrounding at least a portion of the fingerprint sensor.

[0013] In some embodiments, the input device may include additional components that receive one or more inputs from the user in addition to the force input. For example, in one embodiment, the input device includes a biometric sensor. Additionally or alternatively, the input device may include a switch element that detects user input when the force input applied to the cover element exceeds a given amount of force. The switch element may generate or transmit a signal based on the detected user input, and the processing device may register the user input based on the signal received from the switch element. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] The present disclosure will be readily understood by the following detailed description taken in conjunction with the accompanying drawings, wherein like reference numerals refer to like structural elements, and wherein:

[0015] Figure 1 One embodiment of an electronic device that may include a force sensor in one or more input devices is shown;

[0016] Figure 2A-2B Shown is suitable for Figure 1 An exploded view of a first input device of an electronic device shown in ;

[0017] Figure 3 shows when the input device is assembled Figure 2B A cross-sectional view of the input device shown in ;

[0018] Figure 4 Shows Figure 3 An exploded view of one embodiment of a compliant layer shown in;

[0019] Figure 5 Shows Figure 3 An exploded view of another embodiment of a compliant layer shown in;

[0020] Figure 6 Shows Figure 3 One embodiment of a top view of an input device shown in;

[0021] Figure 7 Shows Figure 3 Another embodiment of a top view of an input device shown in;

[0022] Figure 8 Shown is suitable for Figure 1 An exploded view of a second input device of the electronic device shown in ;

[0023] Fig. 9 shows when the input device is assembled Figure 8 A cross-sectional view of a second input device shown in ;

[0024] Fig.10 Shown is suitable for Figure 1 An exploded view of a third input device of the electronic device shown in ;

[0025] Fig.11 shows when the input device is assembled Fig.10 A cross-sectional view of a third input device shown in ; and

[0026] Fig.12 A block diagram of one embodiment of an electronic device that may include a force sensor in one or more input devices is shown.

[0027] Cross-hatching is provided in the figures to distinguish elements or components from each other. Cross-hatching is not intended to indicate the type of one or more materials or the properties of one or more materials. DETAILED DESCRIPTION

[0028] Reference will now be made specifically to the representative embodiments shown in the accompanying drawings. It should be understood that the following description is not intended to limit the embodiments to a preferred embodiment. On the contrary, it is intended to cover alternatives, modifications and equivalent forms that may be included in the essence and scope of the embodiments defined by the appended claims.

[0029] The following disclosure relates to an input device including one or more force sensors. The input device may be included in an electronic device and / or may be operably connected to the electronic device via a wired connection or a wireless connection. In one embodiment, the input device is an input button, but any suitable input device may include a force sensor.

[0030] In a particular embodiment, the force sensor includes two circuit layers in a stack of components that form an input device. The circuit layers are spaced apart from each other, and a compliant material or air is disposed between the circuit layers. Each circuit layer includes a set of one or more electrodes, and each electrode in a set is aligned with a corresponding electrode in another set in at least one direction (e.g., vertically) to produce one or more capacitors. When a force is applied to a cover element of the input device, the cover element bends or deflects, which causes at least one electrode in one circuit layer to move closer to a corresponding electrode in another circuit layer. The capacitance of the capacitor formed by the two electrodes changes as the distance between the electrodes changes. The force signal sensed from each capacitor represents a capacitance measurement of the capacitor. The processing device is configured to receive one or more force signals and associate the one or more force signals with the amount of force applied to the cover element.

[0031] In another embodiment, the force sensor is included in a compliant layer positioned at one or more locations within the input device. In a non-limiting embodiment, when the input device is an input button, the compliant layer may be positioned around the input button. The compliant layer may be formed by a compliant material disposed between two circuit layers. Each circuit layer includes a set of one or more electrodes, and each electrode in a set is aligned with a corresponding electrode in another set in at least one direction (e.g., vertically) to produce one or more capacitors. When a force is applied to the input surface of the input device, the compliant material is compressed or deformed, which causes at least one electrode in one circuit layer to move closer to a corresponding electrode in another circuit layer. The capacitance of the capacitor formed by the two electrodes changes as the distance between the electrodes shortens. The processing device is configured to receive a force signal from one or more capacitors and associate the force signal with the amount of force applied.

[0032] In some embodiments, the input device may include additional components that receive one or more inputs from the user in addition to the force input. For example, in one embodiment, the input device includes a biometric sensor. In a non-limiting example, the biometric sensor is a fingerprint sensor that captures at least one fingerprint when a finger (or multiple fingers) of the user approaches and / or contacts the input surface.

[0033] Additionally or alternatively, the input device may include a switch element that detects user input when the force input exceeds a given amount of force. Any suitable switch element may be used. For example, the input device may include a dome switch that collapses when the force applied to the input surface exceeds a given amount. When collapsed, the dome switch completes a circuit that is detected by the processing device and recognized as an input (e.g., selection of an icon, function, or application).

[0034] In many embodiments, force can act as a non-binary input. The force sensor can be configured to detect different amounts of force, and different amounts of force can be associated with different inputs, applications, and / or functions of the electronic device. For example, increasing the amount of force applied to the input device can be used to improve the sound output level of the speaker in the electronic device. In addition or alternatively, the amount of a first force can be associated with a first input for the electronic device, and a different amount of a second force can be associated with a second input. For example, the amount of a first force can be used to wake up the electronic device from a sleep state, and the larger amount of a second force can be used to turn off the electronic device. In addition or alternatively, increasing or decreasing the amount of force can be used to control operations in game applications. For example, increasing the amount of force can increase the speed of a moving object in a game (e.g., a car), while reducing the amount of force can reduce the speed of the moving object. No force input can be used as a braking function to prevent the movement of an object.

[0035] Directional terms, such as "top," "bottom," "front," "rear," "head," "trailing," and the like, are used with reference to the orientation of the one or more Figures described. Because components of the embodiments described herein can be positioned in a number of different orientations, the directional terms are used for illustrative purposes only and are not limiting in any way. When used in conjunction with a layer of input buttons or sensors, the directional terms are intended to be interpreted broadly, and thus should not be interpreted to exclude the presence of one or more intervening layers or other intervening features or elements. Thus, a given layer that is described as being formed on, positioned on, or disposed on or above another layer or as being formed on, positioned on, disposed under, or below another layer may be separated from the latter layer by one or more additional layers or elements.

[0036] The following references Figure 1-Figure 12 However, those skilled in the art will readily appreciate that the detailed description given herein with respect to these drawings is for illustrative purposes only and should not be construed as limiting.

[0037] Figure 1 One embodiment of an electronic device that may include a force sensor in one or more input devices is shown. In the illustrated embodiment, the electronic device 100 is implemented as a smart phone. Other embodiments may implement the electronic device in different ways. For example, the electronic device may be a laptop computer, a tablet computing device, a wearable computing device (such as a smart watch or a health assistant), a digital music player, a display input device, a remote control device, and other types of electronic devices that include one or more input devices.

[0038] The electronic device 100 includes a housing 102 surrounding a display 104 and an input device 106. In some embodiments, the input device 106 can be configured as an input / output device. As used herein, the phrase "input device" is intended to include both input devices and input / output devices.

[0039] The housing 102 may form an exterior surface or part of an exterior surface for the internal components of the electronic device 100 and may at least partially surround the display 104 and / or the input device 106. The housing 102 may be formed of one or more parts, such as a front piece and a rear piece, that are operably connected together. Alternatively, the housing 102 may be formed of a single piece that is operably connected to the display 104.

[0040] The display 104 can provide visual output for the electronic device 100 and / or can be used to receive user input to the electronic device. For example, the display 104 can be a multi-touch capacitive sensing touch screen that can detect one or more user touches and / or force inputs. The display 104 can be substantially any size and can be positioned substantially anywhere on the electronic device 100. The display 104 can be implemented using any suitable display, including but not limited to multi-touch sensing touch screen devices using liquid crystal display (LCD) elements, light emitting diode (LED) elements, organic light emitting display (OLED) elements, or organic electroluminescent (OEL) elements.

[0041] In some embodiments, the input device 106 can take the form of a home button, which can be a mechanical button, a soft button (e.g., a button that cannot be physically moved but still accepts input), an icon or image on a display, etc. In addition, in some embodiments, the input device 106 can be integrated as part of a cover layer 108 and / or housing of the electronic device. Figure 1 Not shown, the electronic device 100 may include one or more other input devices (such as a microphone, a speaker), other input buttons (e.g., volume, on-off), a camera, and one or more ports (such as a network communication port and / or a power cord port).

[0042] The cover layer 108 can be positioned over the front surface of the electronic device 100. At least a portion of the cover layer 108 can receive touch input and / or force input. In one embodiment, the cover layer 108 covers the display 104 and the input device 106. The touch and force input can be received by the portion of the cover layer 108 covering the display 104 and / or by the portion of the cover layer 108 covering the input device 106. In another embodiment, the cover layer 108 covers the display 104, but does not cover the input device 106. In such an embodiment, the input device 106 can be positioned in an opening or hole 110 formed in the cover layer 108. The input device 106 can receive touch input and / or force input, and the portion of the cover layer 108 covering the display 104 can also receive touch input and / or force input.

[0043] In other embodiments, the input surface of the input device can be integrated into the housing 102. For example, the input surface can be part of the housing 102, with the force sensor and other components of the input device disposed below the housing 102. A depression or recess in the housing 102 can indicate the location of the input device (e.g., an input button).

[0044] Force sensors may be included in one or more locations of the electronic device 100. For example, in one embodiment, one or more force sensors may be included in the input device 106 (and / or other input buttons or areas of the electronic device 100). One or more force sensors may be used to measure the amount of force and / or changes in force applied to the input device 106. Additionally or alternatively, one or more force sensors may be positioned below at least a portion of the housing 102 to detect forces and / or changes in forces applied to the housing 102. Additionally or alternatively, one or more force sensors may be included in the display stack of the display 104. One or more force sensors may be used to measure the amount of force and / or changes in force applied to the display 104 or a portion of the display 104.

[0045] The embodiments described herein include one or more force sensors in the input device 106. As previously described, the input device 106 may also include additional operations or devices, such as biometric sensors, other circuits, support elements, and / or switch elements. In one embodiment, the various components and devices may be arranged in a device stack positioned below the cover element.

[0046] Figure 2A-2B Shown is suitable for Figure 1 An exploded view of a first input device of an electronic device is shown. Figure 2A , the input device stack 200 includes a cover member 202 and a trim 204. In the illustrated embodiment, the trim 204 completely surrounds the sides of the cover member 202 and the perimeter of the top surface of the cover member 202. Other embodiments are not limited to this configuration. For example, in one embodiment, the sides and / or top surface of the cover member 202 may be partially surrounded by the trim 204. Alternatively, the trim 204 may be omitted in other embodiments.

[0047] Both the cover element 202 and the rim 204 can be formed of any suitable opaque, transparent, and / or translucent material. For example, the cover element 202 can be formed of glass, plastic, or sapphire, while the rim 204 can be formed of metal or plastic. In some embodiments, one or more additional layers (not shown) can be positioned below the cover element 202. For example, when the cover element 202 is made of a transparent material, an opaque ink layer can be disposed below the cover element 202. The opaque ink layer can hide other components in the input device stack 200 so that the other components cannot be seen through the transparent cover element 202.

[0048] The first circuit layer 206 may be disposed below the cover element 202. Any suitable circuit layer may be used. For example, the first circuit layer 206 may be a circuit board or a flexible circuit. The first circuit layer 206 may include one or more circuits, signal lines, and / or integrated circuits. In one embodiment, the first circuit layer 206 includes a biometric sensor 208. Any suitable type of biometric sensor may be used. For example, in one embodiment, the biometric sensor is a capacitive fingerprint sensor that captures at least one fingerprint when a user's finger (or fingers) approaches and / or contacts the cover element 202.

[0049] The first circuit layer 206 can be attached to the bottom surface of the cover element 202 by an adhesive layer 210. Any suitable adhesive can be used for the adhesive layer. For example, a pressure-sensitive adhesive layer can be used as the adhesive layer 210.

[0050] The compliant layer 212 is disposed below the first circuit layer 206. In one embodiment, the compliant layer 212 includes an opening 214 formed in the compliant layer 212. When the device stack 200 is assembled, the opening 214 exposes the top surface of the first circuit layer 206 and / or the biometric sensor 208. In the illustrated embodiment, the compliant layer 212 is positioned around the inner perimeter of the trim 204 and / or around the outer peripheral edge of the cover element 202 (see Figure 3 ). Although illustrated in a circular shape, the compliant layer 212 may have any given shape and / or size, such as a square or an oval. The compliant layer 212 is shown in FIG. 2 as a continuous compliant layer, but other embodiments are not limited to this configuration. In some embodiments, multiple discrete compliant layers may be used in the device stack 200. In addition, in some embodiments, the compliant layer 212 does not include the opening 214, and the compliant layer 212 extends across at least a portion of the input device stack 200. For example, the compliant layer 212 may extend across the bottom surface of the cover element 202, the bottom surface of the first circuit layer 206, or the bottom surface of the cover element 202 (e.g., around the peripheral edge of the cover element) and a portion of the bottom surface of the first circuit layer 206.

[0051] The second circuit layer 218 is positioned below the first circuit layer 206. Flexible circuits and circuit boards are examples of circuit layers that can be used in the second circuit layer 218. In some embodiments, the second circuit layer 218 can include a first circuit section 220 and a second circuit section 222. The first circuit section 220 and the second circuit section 222 can be electrically connected to each other.

[0052] The first circuit section 220 may include a first set of one or more force sensor components included in the force sensor. In some embodiments, the first circuit section 220 may be electrically connected to the first circuit layer 206. For example, when the first circuit layer 206 includes the biometric sensor 208, the biometric sensor 208 may be electrically connected to the first circuit section 220 of the second circuit layer 218.

[0053] The second circuit section 222 may include additional circuits, such as signal lines, circuit components, integrated circuits, and the like. In one embodiment, the second circuit section 222 may include a board-to-board connector 224 for electrically connecting the second circuit layer 218 to other circuits in the electronic device. For example, the second circuit layer 218 may be operably connected to a processing device using the board-to-board connector 224. Additionally or alternatively, the second circuit layer 218 may be operably connected to a circuit that transmits a signal (e.g., a sense signal) received from one or more force sensor components in the first circuit section 220 to a processing device. Additionally or alternatively, the second circuit layer 218 may be operably connected to a circuit that provides a signal (e.g., a drive signal, a reference signal) to one or more force sensor components in the first circuit section 220.

[0054] In some embodiments, first circuit section 220 of second circuit layer 218 can be attached to the bottom surface of first circuit layer 206 using adhesive layer 216. In one non-limiting example, first circuit section 220 can be attached to the bottom surface of first circuit layer 206 using a die attach film.

[0055] The third circuit layer 226 is disposed below the first circuit section 220 of the second circuit layer 218. The third circuit layer 226 may include a second set of one or more force sensor components included in the force sensor. The third circuit layer 226 is supported by and / or attached to a support element 228. In one embodiment, the support element 228 is attached to the trim 204 to create a housing for other components in the device stack 200. The support element 228 may be attached to the trim 204 using any suitable attachment mechanism.

[0056] The first set of one or more force sensor components in the first circuit section 220 and the second set of one or more force sensor components in the third circuit layer 226 together form a force sensor. The force sensor can use any suitable force sensing technology. Example sensing technologies include, but are not limited to, capacitive, piezoelectric, piezoresistive, ultrasonic, and magnetic.

[0057] In the embodiments described herein, the force sensor is a capacitive force sensor. For a capacitive force sensor, the first set of one or more force sensor components may include a first set of one or more electrodes 230, and the second set of one or more force sensor components may include a second set of one or more electrodes 232. Figure 2A and Figure 2B , each electrode in the first and second groups of one or more electrodes 230, 232 may have any given shape (e.g., rectangular, circular). In addition, the one or more electrodes in the first and second groups 230, 232 may be arranged in any given pattern (e.g., one or more rows and one or more columns).

[0058] Figure 2A and Figure 2B Two electrodes in the first group and the second group of one or more electrodes 230, 232 are shown. However, other embodiments are not limited to this configuration. The first group and the second group of one or more electrodes 230, 232 can both be a single electrode or a plurality of discrete electrodes. For example, if the first group of one or more electrodes are single electrodes, the second group of one or more electrodes include a plurality of discrete electrodes. In some embodiments, the second group of one or more electrodes can be a single electrode, and the first group includes a plurality of discrete electrodes. Alternatively, the first group and the second group of one or more electrodes can both include a plurality of discrete electrodes.

[0059] Each electrode in the first set of one or more electrodes 230 is aligned with a corresponding electrode in the second set of one or more electrodes 232 in at least one direction (e.g., vertically) to create one or more capacitors. When a force input is applied to the cover element 202 (e.g., an input surface of an input device), at least one electrode in the first set 230 moves closer to a corresponding electrode in the second set 232, which changes the capacitance of the one or more capacitors. The force signal sensed from each capacitor represents a capacitance measurement of the capacitor. A processing device (not shown) is configured to receive the one or more force signals and associate the one or more force signals with the amount of force applied to the cover element 202.

[0060] In some embodiments, the force sensor is configured to detect a series of force inputs having at least two force inputs representing different user inputs. For example, a first force input may select an icon, and a different second force input may turn off the electronic device. Additionally or alternatively, in another embodiment, a first force input may produce a scrolling operation that scrolls at a first speed, and a different second force input may produce a scrolling operation that scrolls at a different second speed (e.g., faster). Additionally or alternatively, in some embodiments, the force sensor may replace other components in the input device. For example, the force sensor may replace a switch element.

[0061] In other embodiments, such as Figure 2B In the illustrated embodiment, the switch element 234 can be positioned below the support element 228. When the force input applied to the cover element 202 exceeds a given amount of force (e.g., a force threshold associated with shortening the distance between the first circuit section 220 and the third circuit layer 226; see Figure 3 ), the switch element 234 registers the user input. Any suitable switch element may be used. For example, the switch element 234 may be a dome switch that collapses when the force input applied to the cover element 202 exceeds a force threshold. When collapsed, the dome switch completes a circuit that is detected by the processing device and recognized as a user input (e.g., selecting an icon, function, or application). In one embodiment, the dome switch is arranged so that the apex of the collapsible dome is adjacent to the bottom surface of the support plate 228. In another embodiment, the base of the collapsible dome may be adjacent to the bottom surface of the support plate 228.

[0062] Figure 3 shows when the input device is assembled Figure 2B In some embodiments, trim 204 is positioned within a hole (e.g., Figure 1 1010 in the housing 102 in the cover element 202). In the illustrated embodiment, the trim 204 includes a shelf 300 extending inwardly from the trim 204 to the input device stack. The compliant layer 212 is positioned between the shelf 300 and the peripheral edge of the cover element 202. The compliant layer 212 can be made of any suitable material or materials. For example, in one embodiment, the compliant layer 212 is a silicon layer.

[0063] In another embodiment, the compliant layer 212 may be Figure 4 The compliant material 400 may be positioned between two intermediate layers 402, 404. An outer layer 406, 408 may be disposed over each intermediate layer 402, 404. In one non-limiting embodiment, the compliant material 400 may be formed of silicon, the intermediate layers 402, 404 may be formed of polyimide, and the outer layers 406, 408 may be formed of a heat activated film.

[0064] Figure 5 Shows Figure 3 004. An exploded view of another embodiment of a compliant layer is shown in FIG. 500. The compliant material 500 can be positioned between two circuit layers 502, 504. A first set of one or more force sensor components 506 is formed in or on the first circuit layer 502. Similarly, a second set of one or more force sensor components 508 is formed in or on the second circuit layer 504. In the illustrated embodiment, both the first set and the second set of one or more force sensor components include one or more electrodes.

[0065] An outer layer 510, 512 may be disposed over each circuit layer 502, 504. In one non-limiting embodiment, the compliant material 500 may be formed of silicon, each circuit layer 502, 504 may be formed of a flexible circuit including a set of one or more electrodes (e.g., 230, 232), and each outer layer 510, 512 may be formed of a heat activated film.

[0066] Circuit layers 502, 504 allow compliant layer 212 to act as a second force sensor. The second force sensor can be used in series, in parallel, or in a time-shifted manner with the first force sensor formed by second circuit layer 218 and third circuit layer 226. For example, one force sensor (e.g., the second force sensor) can initially be used to detect the amount of force applied. As the amount of force applied increases, the force sensor reaches a maximum detectable force. At this point, another force sensor (e.g., the first force sensor) can be used to detect the applied force. Alternatively, in some embodiments, both the first force sensor and the second force sensor can be used to detect a force input that reaches a given amount of force, and then one of the force sensors can be used to detect a force input greater than the given amount of force.

[0067] The second capacitive force sensor operates similarly to the first capacitive force sensor. Each electrode in the first set of one or more electrodes 506 is aligned with a corresponding electrode in the second set of one or more electrodes 508 in at least one direction (e.g., vertically) to generate one or more capacitors 514. As previously described, when a user applies force to the cover element 202, the capacitance of at least one capacitor 514 changes because the electrodes in at least one capacitor 514 move closer. The user can apply force to the cover element 202 using a device such as a stylus or using a body part (e.g., one or more fingers). The force signal generated by the one or more capacitors 514 represents one or more capacitance measurements of the one or more capacitors 514. The processing device that receives the one or more force signals is configured to associate the one or more force signals with the amount of force applied to the cover element 202.

[0068] return Figure 3 , the compliant layer 212 can seal the interface between the bottom surface of the cover element 202 and the top surface of the shelf 300. In some embodiments, the compliant layer 212 can act as an environmental seal that prevents contaminants such as water, chemicals, and dirt from entering the input device stack and / or the electronic device.

[0069] The first circuit layer 206 (with the biometric sensor 208) is positioned under the cover element 202, and the second circuit layer 218 is positioned under the first circuit layer 206. The third circuit layer 226 is disposed under the second circuit layer 218 and over the support element 228. In the illustrated embodiment, the support element 228 is attached to the trim 204 using fasteners 302. Any suitable type of fastener may be used, such as screws, solder, and adhesives.

[0070] In the illustrated embodiment, gap 304 is defined between second circuit layer 218 and third circuit layer 226. Gap 304 is formed at least in part by downward step 305 in support element 228. As previously described, when the force sensor is a capacitive force sensor, one or more electrodes in the first and second groups of one or more electrodes form a capacitor. Gap 304 separates the electrodes in the first and second groups and includes insulating material for one or more capacitors. Any suitable insulating material may be used. For example, the insulating material may include, but is not limited to, air, a compliant gel, a compliant material, and / or one or more compliant elements disposed between second circuit layer 218 and third circuit layer 226.

[0071] In the illustrated embodiment, the cover element 202 and trim 204 are fixed in place and do not move when a force is applied to the cover element 202. When a force input is applied to the cover element 202, the gap 304 allows the first circuit section 220 of the second circuit layer 218 to bend or deflect relative to the third circuit layer 226. The deflection varies with the capacitance of the one or more capacitors formed by the one or more electrodes in the first circuit section 220 and the third circuit layer 226.

[0072] In some embodiments, additional circuits and / or components may be attached and electrically connected to the second circuit layer 218. For example, the second integrated circuit 306 may be attached and electrically connected to the second circuit layer 218. In some embodiments, some additional circuits may be encapsulated using protective and / or insulating materials 308. The protective and / or insulating materials 308 may filter noise from signals and circuits in or on the second circuit layer 218. In the illustrated embodiment, the protective and / or insulating materials 308 extend into the openings 236 formed in the support element 228 (see FIG. 2 ). Figure 2A-2B ).

[0073] As previously discussed, the switch element 234 may be disposed beneath the support element 228. The switch element 234 is depicted as Figure 3 As shown, the dome switch is arranged so that the base of the collapsible dome is adjacent to (e.g., attached to) the bottom surface of the support plate 228. In other embodiments, the apex of the collapsible dome may be adjacent to or contact the bottom surface of the support plate 228.

[0074] Figure 6 Shows Figure 3 204. An example of a top view of an input device is shown in FIG. 204. For clarity, cover element 202 is omitted. In this example embodiment, compliant layer 212 is formed as a continuous ring of compliant material positioned around trim 204 (e.g., at Figure 3 As previously described, the compliant layer 212 can act as an environmental seal that prevents contaminants such as water, chemicals, and dirt from entering the input device stack and / or the electronic device. In such embodiments, the corners 600 of the first circuit layer 206 (and / or the biometric sensor 208) can be notched to ensure that the compliant layer 212 meets all criteria of the environmental seal, such as width requirements.

[0075] Adhesive layer 210 is used to attach first circuit layer 206 to the bottom surface of cover element. In addition, in some embodiments, second circuit layer 218 extends beyond trim 204 and folds over itself to provide a circuit layer. For example, in some embodiments, third circuit layer 226 can be a portion of second circuit layer 218 that is folded and positioned above support element 228.

[0076] Figure 7 Shows Figure 3 . Again, for clarity, cover element 202 is omitted. In this example embodiment, compliant layer 212 is formed as discrete compliant layers 700, 702, 704, 706 that are positioned at different locations around trim 204 (e.g., at Figure 3 In such embodiments, the edges and corners of the first circuit layer 206 do not need to be modified or notched. Additionally or alternatively, in some embodiments, when a separate compliant layer is included in the input device, the size or dimensions of the biometric sensor may be larger. Figure 7 Only four discrete compliant layers are shown in FIG. 1 , but other embodiments may include any number of discrete compliant layers.

[0077] The environmental seal can be formed using a material that fills the gap 708 around the discrete compliant layers 700, 702, 704, 706 and between the cover element 202 and the trim 204. In one embodiment, the material is a water and chemical resistant material and is compliant with respect to the discrete compliant layers 700, 702, 704, 706. The environmental seal can prevent contaminants such as liquids, dirt, and dust from entering the input device stack and / or the electronic device. In one non-limiting example, a gel can be used to form the environmental seal.

[0078] Figure 8 Shown is suitable for Figure 1 An exploded view of a second input device of an electronic device shown in FIG. The input device stack 800 is Figure 8 802 is inverted in the figure, where the cover element 802 is shown at the bottom of the figure. As previously described, one or more additional layers 804 may be positioned below the cover element 802. The one or more additional layers may include, but are not limited to, an ink layer and / or an adhesive layer.

[0079] The first circuit layer 806 can be positioned below the cover element 802 (or below one or more additional layers 804 when the first circuit layer 806 is included in the input device stackup 800). The first circuit layer 806 can be any suitable circuit layer, such as a circuit board or a flexible circuit. In one embodiment, the first circuit layer 806 includes a biometric sensor 808 formed in or on the first circuit layer 806 and operably connected to the first circuit layer 806. In one non-limiting embodiment, the biometric sensor 808 is a fingerprint sensor.

[0080] In some embodiments, the first circuit layer 806 and the biometric sensor 808 can be molded into a plastic mold or housing 809. The plastic housing 809 can serve as an environmental seal for the first circuit layer 806 and the biometric sensor 808.

[0081] The support layer 810 can be disposed below the first circuit layer 806. The support layer 810 can include circuits 812, 814, 816 electrically connected to a second circuit layer 818. The second circuit layer 818 can be a flexible circuit or a circuit board. In the illustrated embodiment, the second circuit layer 818 is a flexible circuit that includes a second circuit layer tail 820 extending into an opening 822 in the trim 824.

[0082] In some embodiments, the circuits 812, 814, and / or 816 can be electrically connected to contacts 826, 828 on the first circuit layer 806. In some embodiments, at least a portion of the circuit 812 can extend into the opening 830 in the trim 824. The circuits 812, 814, and / or 816 can be encapsulated with an insulating material and / or a protective material (not shown).

[0083] The compliant layer 832 is positioned below the support layer 810. In the illustrated embodiment, the compliant layer 832 includes an opening 833 that allows the compliant layer 832 to reside around the inner perimeter of the rim 824 and / or the peripheral edge of the cover element 802. Although illustrated in a circular shape, the compliant layer 832 may have any given shape and / or size, such as a square or an oval. As previously described, the compliant layer 832 may include multiple discrete compliant layers in the device stack 800. Additionally or alternatively, the compliant layer 832 may not include the opening 833, so that the compliant layer 832 extends across at least a portion of the input device stack 800. For example, the compliant layer 832 may extend across the bottom surface of the cover element 802, the bottom surface of the first circuit layer 806, or the bottom surface of the cover element 802 (e.g., around the peripheral edge of the cover element) and a portion of the bottom surface of the first circuit layer 806.

[0084] The compliant layer 832 may be made of any suitable material or combination of materials. For example, in one embodiment, the compliant layer 832 may be formed of silicon. In other embodiments, the compliant layer 832 may be formed of Figure 4 or Figure 5 When the compliant layer 832 is as shown in Figure 5 When configured as shown in , the compliant layer 832 can act as an additional force sensor.

[0085] The third circuit layer 834 can be disposed below the support layer 810. The third circuit layer 834 can be any suitable circuit layer, such as a circuit board or a flexible circuit. In the illustrated embodiment, the third circuit layer 834 is a flexible circuit that includes a circuit layer tail 836 extending into the opening 822 in the trim 824.

[0086] The trim 824 forms a container or holder, wherein the trim 824 includes a cavity defined by a bottom surface and sides of the trim 824. When constructed, the cover element 802, the optional one or more additional layers 804, the first circuit layer 806, the support layer 810, the second circuit layer 818, the compliant layer 832, and the third circuit layer 834 all reside within the cavity of the trim 824. The bottom surface of the trim 824 acts as a support element for the third circuit layer 834.

[0087] In one embodiment, the second circuit layer 818 and the third circuit layer 834 each include a set of one or more force sensor components included in a force sensor. The force sensor may use any suitable sensing technology. For example, using a capacitive force sensor, the second circuit layer 818 and the third circuit layer 834 each include one or more electrodes (not shown) for sensing capacitance changes. The one or more electrodes may be configured to combine Figure 2A-2BAs shown and described. A processing device (not shown) receives a force signal representing a capacitance value for one or more capacitors formed by the electrodes. A processing device (not shown) receives the force signal from the one or more capacitors and correlates the force signal with an amount of force applied to the cover element 802.

[0088] Fig. 9 shows when the input device is assembled Figure 8 In the illustrated embodiment, the trim 824 is positioned within a hole 900 (e.g., Figure 1 824). Disposed within trim piece 824 are cover element 802 and various layers of input device stack 800 (e.g., optional one or more additional layers 804, first circuit layer 806, support layer 810, second circuit layer 818, third circuit layer 834, and compliant layer 832). Second circuit layer tail 820 and third circuit layer tail 836 extend out of trim 824 through opening 822. Second circuit layer tail 820 and third circuit layer tail 836 may be operably connected to other circuits, such as a processing device and / or a signal generator.

[0089] As previously described, the second circuit layer 818 and the third circuit layer 834 may be included in a force sensor. The second circuit layer 818 and the third circuit layer 834 may each include a set of one or more force sensor components included in a force sensor. For example, using a capacitive force sensor, the second circuit layer 818 and the third circuit layer 834 may each include a set of one or more electrodes (not shown). The one or more electrodes may be configured to combine Figure 2A-2B Shown and described.

[0090] As previously described, the second circuit layer tail 820 and the third circuit layer tail 836 can be operably connected to one or more processing devices (not shown). The force signal received from the force sensor (e.g., one or more capacitors formed by the electrodes) can be transmitted to the processing device using one circuit layer tail (e.g., the second circuit layer tail 820). In addition, the other circuit layer tail (e.g., the third circuit layer tail 836) can be used to transmit the drive signal or reference signal to the force sensor (e.g., one or more capacitors formed by the electrodes).

[0091] A gap 912 is defined between the second circuit layer 818 and the third circuit layer 834. As previously described, when the force sensor is a capacitive force sensor, the gap 912 includes insulating material for a capacitor formed by multiple sets of one or more electrodes in the second circuit layer 818 and the third circuit layer 834. When a force input is applied to the cover element 802, the gap 912 allows the second circuit layer 818 to move, bend, or deflect relative to the third circuit layer 834. The deflection varies with the capacitance of the one or more capacitors formed by the one or more electrodes in the second circuit layer 818 and the third circuit layer 834.

[0092] In the illustrated embodiment, the second circuit layer 818 is electrically connected to the first circuit layer 806 via bond wires 904. The bond wires 904 may be covered or encapsulated by a protective and / or insulating material 906.

[0093] In some embodiments, a seal 908 can be disposed between the trim 824 and the housing 902. In one embodiment, the seal is an O-ring positioned within an indentation 910 formed along an outer surface of the trim 824. The seal 908 can act as an environmental seal that prevents contaminants such as liquids, dirt, and dust from entering the input device stack and / or the electronic device.

[0094] Fig.10 Shown is suitable for Figure 1 An exploded view of a third input device of an electronic device shown in FIG. Figure 8 Similar to the illustrated embodiment, the input device stack 1000 is shown inverted, with the cover element 1002 shown at the bottom of the figure. In some embodiments, one or more additional layers 1004 may be positioned below the cover element 1002. The one or more additional layers may include, but are not limited to, an ink layer and / or an adhesive layer.

[0095] The first circuit layer 1006 can be positioned below the cover element 1002 (or below one or more additional layers 1004 when the first circuit layer 1006 is included in the input device stack 1000). The first circuit layer 1006 can be any suitable circuit layer, such as a circuit board or a flexible circuit. In one embodiment, the first circuit layer 1006 includes a biometric sensor 1008 formed in or on the first circuit layer 1006 and operably connected to the first circuit layer 1006. In one non-limiting embodiment, the biometric sensor 1008 is a fingerprint sensor.

[0096] Similar to Figure 8 In the embodiment shown in FIG. 1 , the first circuit layer 1006 and the biometric sensor 1008 can be molded into a plastic mold or housing 1009. The plastic housing 1009 can serve as an environmental seal for the first circuit layer 1006 and the biometric sensor 1008.

[0097] The support layer 1010 can be disposed below the first circuit layer 1006. The support layer 1010 can include circuits 1012, 1014, 1016 electrically connected to the second circuit layer 1018. The second circuit layer 1018 can be a flexible circuit or a circuit board. In some embodiments, the circuits 1012, 1014, and / or 1016 can be electrically connected to one or two contacts 1020 and / or 1022 on the first circuit layer 1006. In some embodiments, at least a portion of the circuits 1012, 1014, and / or 1016 can extend into the opening 1024 in the trim 1026.

[0098] The compliant layer 1028 is disposed below the support layer 1010. In the illustrated embodiment, the compliant layer 1028 includes an opening 1030 that allows the compliant layer 1028 to reside around the inner perimeter of the trim 1026 and / or the peripheral edge of the cover element 1002. Although illustrated in a circular shape, the compliant layer 1028 may have any given shape and / or size, such as a square or an oval. As previously described, in some embodiments, the compliant layer 1028 may be configured as a plurality of discrete compliant layers in the device stack 1000. Additionally or alternatively, the compliant layer 1018 may not include the opening 1024, so that the compliant layer 1028 extends across at least a portion of the input device stack 1000. For example, the compliant layer 1028 may extend across the bottom surface of the cover element 1002, the bottom surface of the first circuit layer 1006, or a portion of the bottom surface of the cover element 1002 (e.g., around the peripheral edge of the cover element) and the bottom surface of the first circuit layer 1006.

[0099] The compliant layer 1028 may be made of any suitable material or combination of materials. For example, in the illustrated embodiment, the compliant layer 1028 acts as a force sensor and Figure 5 The compliant layer 1028 includes a compliant layer tail 1032 extending out of the opening 1024 (see Fig.11 ). Combined Fig.11 The compliant layer tail 1032 is described in more detail.

[0100] When constructed, the cover element 1002 and the various layers of the input device stack 1000 (eg, the optional one or more additional layers 1004 , the first circuit layer 1006 , the support layer 1010 , and the compliant layer 1028 ) all reside within the trim 1026 . Fig.11 shows when the input device is assembled Fig.10 In the illustrated embodiment, the trim 1026 is positioned within an aperture 1100 (e.g., Figure 1Disposed within the trim 1026 are the cover element 1002, the first circuit layer 1006, the biometric sensor 1008, the support layer 1010, the second circuit layer 1018, and the compliant layer 1028. The compliant layer tail 1032 extends out of the trim 1026 through the opening 1024.

[0101] In the illustrated embodiment, the compliant layer 1028 is Figure 5 The compliant layer tail 1032 includes a first flexible circuit 1104 and a second flexible circuit 1106. The first flexible circuit 1104 and the second flexible circuit 1106 each include one or more electrodes located in at least a portion of the compliant layer 1028, wherein the compliant layer is disposed around the inner periphery of the edging layer 1026. For example, in one embodiment, the one or more electrodes may be configured to be combined with Figure 5 Shown and described.

[0102] The flexible circuits 1104, 1106 are operably connected to a processing device (not shown). The processing device is adapted to cause a reference signal or a drive signal to be transmitted by one of the flexible circuits (e.g., 1104) to one or more electrodes in the flexible circuit. The other flexible circuit (e.g., 1106) receives a force signal from one or more capacitors formed by the electrodes and transmits the force signal to the processing device (not shown). The processing device is adapted to correlate the force signal with the amount of force applied to the cover element 1002.

[0103] In some embodiments, a seal 1108 can be disposed between the trim 1026 and the housing 1102. In one embodiment, the seal is an o-ring positioned within an indentation 1110 formed along an outer surface of the trim 1026. The seal 1108 can act as an environmental seal that prevents contaminants such as liquids, dirt, and dust from entering the input device stack and / or the electronic device.

[0104] It should be noted that Figures 2 and Figure 3 , Figure 8 and Fig. 9 as well as Fig.10 and Fig.11 The embodiments shown in the figures are exemplary only. In other embodiments, the input device may include fewer or more components than those described or shown in the figures. For example, in some embodiments, the first circuit layer 206, 806, 1006 and the biometric sensors 208, 808 and 1008 may be omitted. In addition or alternatively, the switch element 234 may be Figure 2B and Figure 3 In the embodiment shown in FIG. 1 , the switch element 234 may be omitted, or the switch element 234 may be included in the Figure 8 and Fig. 9 and / or Fig.10 and Fig.11 In the embodiment shown.

[0105] Although the input device 106 is Figure 1 2- is shown as a circular input device, but other embodiments are not limited to this configuration. The input device may have any given shape and / or size. Similarly, FIG. Fig.11 The shapes and / or sizes of the components shown are for illustration only. Each component may have any given shape and / or size.

[0106] Fig.12 A block diagram of one embodiment of an electronic device that may include a force sensor in one or more input devices is shown. The electronic device 1200 may include one or more processing devices 1202, a memory 1204, one or more input / output devices 1206, a power source 1208, one or more sensors 1210, a network / communication interface 1212, a display 1214, and one or more input devices 1216 (including at least one force sensor 1218). Each of these components is discussed in more detail below.

[0107] One or more processors 1202 may control some or all operations of the electronic device 1200. One or more processing devices 1202 may communicate directly or indirectly with substantially all components of the device. For example, one or more system buses 1220 or other communication mechanisms may provide communication between one or more processing devices 1202, memory 1204, one or more input / output devices 1206, power supply 1208, one or more sensors 1210, network / communication interface 1212, display 1214, input device 1216, and / or one or more force sensors 1218. One or more processing devices 1202 may be implemented as any electronic device capable of processing, receiving, or transmitting data or instructions. In addition, the processing device 1202 may be configured to receive a force signal from the force sensor 1218 and associate the force signal with the amount of force. For example, one or more processing devices 1202 may be a microprocessor, a central processing unit (CPU), an application specific integrated circuit (ASIC), a digital signal processor (DSP), or a combination of multiple such devices. As used herein, the term "processing device" is intended to encompass a single processor or processing unit, multiple processors, multiple processing units, or other suitably configured one or more computing elements.

[0108] The memory 1204 can store electronic data that can be used by the electronic device 1200. For example, the memory 1204 can store electronic data or content, such as audio files, document files, timing and control signals, and image data. The memory 1204 can be configured as any type of memory. By way of example only, the memory 1204 can be implemented as any combination of random access memory, read-only memory, flash memory, removable memory, or other types of storage elements.

[0109] One or more input / output devices 1206 can transmit data to or receive data from a user or another electronic device. Example input / output devices 1206 include, but are not limited to, a touch sensing input device (such as a touch screen or trackpad), a microphone, a vibration or haptic device, and / or a speaker.

[0110] The power source 1208 may be implemented using any device capable of providing energy to the electronic device 1200. For example, the power source 1208 may be one or more batteries or rechargeable batteries, or a connection cable that connects the electronic device to another power source, such as a wall outlet.

[0111] The electronic device 1200 may also include one or more sensors 1210 positioned substantially anywhere on or in the electronic device 1200. The one or more sensors 1210 may be configured to sense substantially any type of characteristic, such as, but not limited to, image, air pressure, light, contact, temperature, heat, movement, relative motion, biometric data, etc. For example, the one or more sensors 1210 may be an image sensor, a temperature sensor, a light or optical sensor, an accelerometer, a gyroscope, a magnet, a barometer, a health monitoring sensor, etc.

[0112] The network communication interface 1212 can facilitate data transmission to or from other electronic devices. For example, the network communication interface can transmit electronic signals via a wireless network and / or a wired network connection. For example, in one embodiment, the communication signal is transmitted to a transmitter device and / or a receiver device to allow the transmitter and receiver devices to communicate with each other. Examples of wireless and wired network connections include, but are not limited to, cellular networks, Wi-Fi, Bluetooth, infrared (IR), Ethernet, and near field communication (NFC).

[0113] The display 1214 can provide visual output to the user. The display 1214 can be implemented using any suitable technology, including but not limited to a multi-touch sensing touch screen using a liquid crystal display (LCD) element, a light emitting diode (LED) element, an organic light emitting display (OLED) element, an organic electroluminescent (OEL) element, or another type of display element. In some embodiments, the display 1214 can act as an input device that allows the user to interact with the electronic device 1200. For example, the display can be a multi-touch touch screen display.

[0114] The electronic device 1200 also includes one or more input devices 1216. Each input device 1216 may include a force sensor 1218 configured as shown in FIG. Figure 3 , Figure 8 and Fig. 9 or Fig.10 and Fig.11 As previously described, processing device 1202 may process force signals received from one or more force sensors 1218 and associate the force signals with an amount of force.

[0115] It should be noted that Fig.11 This is merely exemplary. In other embodiments, the electronic device may include Fig.11 In addition or alternatively, electronic devices may be included in the system, and Fig.11 One or more components shown in are separate from the electronic device but communicate with the electronic device. For example, the electronic device may be operably connected or communicate with a separate display. As another embodiment, one or more applications or data may be stored in a memory separate from the electronic device. As another embodiment, a processing device that communicates with the electronic device may control various functions in the electronic device and / or process data received from the electronic device. In some embodiments, an independent memory and / or processing device may be located in a cloud-based system or in an associated electronic device.

[0116] In the above description, for the purpose of explanation, the specific nomenclature used provides a thorough understanding of the embodiments. However, it will be apparent to those skilled in the art that these specific details are not required to practice the embodiments. Therefore, for the purpose of illustration and description, the foregoing description of the specific embodiments described herein is presented. They are not intended to be exhaustive or to limit the embodiments to the disclosed precise form. It will be apparent to those of ordinary skill in the art that many modifications and variations are possible based on the above teachings.

Claims

1. An electronic device, comprising: shell; a cover layer attached to the housing and forming at least a portion of a front surface of the electronic device; a display at least partially surrounded by the housing and disposed below the cover; an input device, the input device comprising an image displayed by the display; a set of one or more force sensors positioned about a peripheral edge of the opening in the cover layer and configured to detect force input applied to the input device; as well as A fingerprint sensor is positioned in a stack of components including the cover layer and the display and at least partially in the opening, the fingerprint sensor being configured to capture a fingerprint when a finger is pressed against the cover layer over the input device. 2 . The electronic device of claim 1 , wherein the set of one or more force sensors comprises a set of one or more capacitive force sensors. 3 . The electronic device of claim 2 , wherein the fingerprint sensor comprises a capacitive fingerprint sensor.

4. The electronic device according to claim 1, further comprising: A device stack; wherein: the set of one or more force sensors includes at least one force sensor in the device stack; and The device stack includes the display.

5. The electronic device according to claim 1, further comprising: Flexible circuits; as well as a connector electrically connected to the flexible circuit; wherein: The fingerprint sensor is electrically connected to the flexible circuit and is electrically connected to the connector via the flexible circuit.

6. The electronic device of claim 1, wherein the display comprises a liquid crystal display (LCD) element.

7. An electronic device comprising: shell; a display at least partially surrounded by the housing and configured to detect touch input; a cover layer positioned over the display and configured to receive touch input and force input applied to the electronic device over the display; Input devices, including: an image displayed by the display; a set of one or more force sensors disposed beneath the display; and A fingerprint sensor is positioned below the display and above the set of one or more force sensors and is configured to capture a fingerprint when a finger is pressed against the cover layer over the fingerprint sensor.

8. The electronic device according to claim 7, further comprising: A device stack; wherein: the set of one or more force sensors includes at least one force sensor in the device stack; and The device stack includes the display.

9. The electronic device according to claim 7, further comprising: A support member; wherein: At least one force sensor of the group of one or more force sensors is positioned between the fingerprint sensor and the support element.

10. The electronic device of claim 7, wherein the fingerprint sensor comprises a capacitive fingerprint sensor.

11. The electronic device according to claim 7, further comprising: A compliant layer having a central opening; wherein: The fingerprint sensor is positioned in the central opening.

12. The electronic device according to claim 7, further comprising: Flexible circuits; as well as a connector electrically connected to the flexible circuit; wherein: The fingerprint sensor is electrically connected to the flexible circuit and is electrically connected to the connector via the flexible circuit.

13. An electronic device comprising: shell; Equipment stack-up, including: a display at least partially surrounded by the housing and configured to detect touch input; and a set of one or more force sensors; Input devices, including: an image displayed by the display; and Biometric sensors; a cover layer disposed over the display and the biometric sensor; wherein: at least one force sensor of the set of one or more force sensors is disposed below the biometric sensor, wherein the at least one force sensor is configured to measure an amount of force applied to the input device; and The biometric sensor is configured to capture biometric data associated with a user of the electronic device touching the displayed image.

14. The electronic device of claim 13, wherein the at least one force sensor forms part of the input device.

15. The electronic device of claim 13, wherein the biometric sensor is disposed in the device stack.

16. The electronic device of claim 13, wherein the biometric sensor comprises a fingerprint sensor. 17 . The electronic device of claim 16 , wherein the fingerprint sensor is configured to capture a fingerprint when a finger presses the cover layer over the input device.

18. The electronic device of claim 13, wherein the set of one or more force sensors comprises a plurality of force sensors positioned around a center of the input device.

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