Electronic device, circuit board, secondary battery, and electric device

Abstract

The application discloses an electronic device, a circuit board, a secondary battery and a power utilization device. The electronic device comprises a semiconductor wafer, a first electrode, a second electrode, a first component and a conductive piece. The first end of the first electrode and the second end of the second electrode are respectively used for electrical connection with an external circuit. The second end of the first electrode, the semiconductor wafer and the first end of the second electrode are accommodated in the first component. The conductive piece is arranged in the first component, the second end of the first electrode, the conductive piece, the semiconductor wafer and the first end of the second electrode are electrically connected, and the conductive piece is configured to be fused to disconnect the first electrode and the semiconductor wafer in response to the temperature of the electronic device being higher than a temperature threshold. The electronic device provided by the application can cut off abnormal current flowing through the electronic device when the temperature of the electronic device is too high, thereby improving the safety performance of the electronic device.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of display, in particular to an electronic device, a circuit board, a secondary battery and a power utilization device. BACKGROUND

[0002] A secondary battery is a device that converts external energy into electrical energy and stores it inside, to supply power to external power utilization equipment (such as portable electronic devices, electric two-wheelers, drones, power tools, etc.) when needed. In addition to battery cells that can store and output electrical energy, the secondary battery also includes a battery management system (BMS) circuit board that responds to the control of the charging and discharging of the secondary battery. The BMS circuit board is provided with various electronic devices, and the electronic devices have a high failure probability under abuse conditions. The failed electronic devices are prone to ablation, and even ignite the entire secondary battery, causing great safety hazards.

[0003] In summary, it is necessary to design an electronic device, a circuit board, a secondary battery and a power utilization device to solve the above technical problems. SUMMARY

[0004] The electronic device, the circuit board, the secondary battery and the power utilization device provided by the embodiments of the present application can cut off abnormal current flowing through the electronic device when the temperature of the electronic device is too high, thereby improving the safety performance of the electronic device.

[0005] In a first aspect, the embodiments of the present application provide an electronic device, including a semiconductor wafer, a first electrode, a second electrode, a first member and a conductive piece; a first end of the first electrode and a second end of the second electrode are respectively used to be electrically connected with an external circuit; the second end of the first electrode, the semiconductor wafer and the first end of the second electrode are accommodated in the first member; the conductive piece is arranged in the first member, the second end of the first electrode, the conductive piece, the semiconductor wafer and the first end of the second electrode are electrically connected, and the conductive piece is configured to be fused to disconnect the first electrode and the semiconductor wafer in response to the temperature of the electronic device being higher than a temperature threshold.

[0006] In some embodiments, the first member includes oppositely arranged first and second surfaces, and a recess recessed from the first surface towards the second surface, and at least part of the conductive piece is arranged in the recess.

[0007] In some embodiments, the recess includes a bottom surface oppositely spaced from the second surface, and at least part of the conductive piece is arranged on the bottom surface.

[0008] In some embodiments, the conductive piece includes a first material layer and a second material layer connected with each other, the first material layer is electrically connected with the first electrode and the semiconductor wafer, and the second material layer is a fluxing material.

[0009] In some embodiments, the first material layer comprises a third surface and a fourth surface, at least part of the third surface is in contact with the bottom surface, and the fourth surface is arranged on a side of the first material layer away from the bottom surface, and the second material layer is connected to the fourth surface.

[0010] In some embodiments, the semiconductor wafer comprises a third electrode and a wafer body, and the second end of the first electrode, the conductive member, the third electrode, the wafer body, and the first end of the second electrode are sequentially electrically connected.

[0011] In some embodiments, the first end of the third electrode is connected to the conductive member, and the first member comprises an opening arranged on the bottom surface, and the second end of the first electrode and the first end of the third electrode are connected to the first material layer through the opening, respectively.

[0012] In some embodiments, the first member comprises an insulating portion filled between the second end of the third electrode and the conductive member.

[0013] In some embodiments, the conductive member and the wafer body are oppositely arranged, a side of the wafer body close to the conductive member is connected to the second end of the third electrode, and a side of the wafer body away from the conductive member is connected to the first end of the second electrode.

[0014] In some embodiments, the melting temperature of the conductive member is 280-320℃.

[0015] In a second aspect, the embodiments of the present application further provide a circuit board comprising the electronic device provided in the first aspect.

[0016] In a second aspect, the embodiments of the present application further provide a secondary battery comprising a cell module and the circuit board provided in the second aspect, and the cell module is electrically connected to the circuit board.

[0017] In a fourth aspect, the embodiments of the present application further provide a power consumption device comprising a power consumption body and the secondary battery provided in the third aspect, and the secondary battery is used to provide electric energy for the power consumption body.

[0018] Compared with the prior art, in the electronic device, the circuit board, the secondary battery, and the power consumption device provided in the embodiments of the present application, the conductive member is arranged on the first member, so that when the electronic device works abnormally and the temperature of the electronic device rises to a temperature threshold, the conductive member is fused, the first electrode and the semiconductor wafer are disconnected, and the electronic device is disabled, thereby forming an open circuit on the circuit where the electronic device is located, avoiding the burning of the electronic device to a certain extent, avoiding the safety accidents such as the burning of other components near the electronic device and the carbonization of the circuit board, and improving the safety performance of the electronic device. The safety performance of the circuit board, the secondary battery, and the power consumption device provided with the conductive member is improved. BRIEF DESCRIPTION OF DRAWINGS

[0019] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings needed to be used in the embodiments of the present application will be briefly introduced as follows. Obviously, the drawings described below only constitute some embodiments of the present application, and other drawings can be obtained by those skilled in the art without any creative effort on the basis of these drawings.

[0020] Figure 1 is a schematic diagram of a perspective structure of an electronic device provided by the embodiments of the present application;

[0021] Figure 2 is a schematic diagram of an exploded structure of an electronic device provided by the embodiments of the present application;

[0022] Figure 3 is a schematic diagram of a cross-sectional structure along the line A-A shown in the figure. Figure 1

[0023] In the drawings:

[0024] 100, electronic device; 1, semiconductor wafer; 11, third electrode; 11a, first end of the third electrode; 11b, second end of the third electrode; 12, wafer body;

[0025] 2, first electrode; 2a, first end of the first electrode; 2b, second end of the first electrode;

[0026] 3, second electrode; 3a, first end of the second electrode; 3b, second end of the second electrode;

[0027] 4, first member; 41, first surface; 42, second surface; 43, recess; 431, bottom surface; 432, side surface; 44, opening; 45, insulating portion;

[0028] 5, conductive member; 51, first material layer; 511, third surface; 512, fourth surface; 52, second material layer. DETAILED DESCRIPTION

[0029] The features and exemplary embodiments of various aspects of the present application will be described in detail below. In the following detailed description, numerous specific details are set forth in order to provide a thorough understanding of the present application. However, it will be apparent to those skilled in the art that the present application can be practiced without some or all of these specific details. The description of the embodiments is merely intended to provide a better understanding of the present application by showing examples of the present application.

[0030] It should be noted that the embodiments in the present application and the features in the embodiments can be combined with each other without conflict. The embodiments will be described in detail below with reference to the drawings.

[0031] ​In a secondary battery, in addition to the battery cell capable of storing and outputting electric energy, a battery management system (BMS) circuit board responsive to the control of the charging and discharging of the secondary battery is also included. The BMS circuit board is provided with various electronic devices, and the electronic devices have a high failure probability under abuse conditions. The failed electronic devices are prone to ablation, and even ignite the entire secondary battery, causing great safety hazards. The inventors found that a current fuse can be connected in series with the electronic device with a high failure rate. The current fuse will automatically melt and cut off the current in an abnormal current state, preventing the electronic device from ablation. However, some abnormal currents within the allowable range of the current fuse cannot be effectively cut off, so that the part of the abnormal current may still cause the electronic device to fail. The impedance of the failed electronic device has certain randomness, which is easy to cause the electronic device to heat up sharply, thereby causing the electronic device to ablation, and even ignite the entire secondary battery.

[0032] In a first aspect, the application provides an electronic device. In order to better understand the technical solutions and technical effects of the application, specific embodiments will be described in detail below with reference to the drawings.

[0033] Please refer to Figures 1 to 3 The electronic device 100 includes a semiconductor wafer 1, a first electrode 2, a second electrode 3, a first member 4, and a conductive member 5. The first end 2a of the first electrode and the second end 3b of the second electrode are respectively used for electrical connection with an external circuit. The second end 2b of the first electrode, the semiconductor wafer 1, and the first end 3a of the second electrode are accommodated in the first member 4. The conductive member 5 is provided in the first member 4. The second end 2b of the first electrode, the conductive member 5, the semiconductor wafer 1, and the first end 3a of the second electrode are electrically connected. The conductive member 5 is configured to melt to disconnect the first electrode 2 and the semiconductor wafer 1 in response to the temperature of the electronic device 100 being higher than a temperature threshold.

[0034] The semiconductor wafer 1 is a wafer made of semiconductor material, and the electronic device 100 with different functions has different semiconductor wafers 1. The electronic device 100 can be a diode, a transient voltage suppressor (TVS), or other high-power electronic device 100. The first end 2a of the first electrode and the second end 3b of the second electrode can extend outside the first member 4, and an external circuit can be electrically connected to the first end 2a of the first electrode and the second end 3b of the second electrode, respectively, so that the external circuit, the first electrode 2, the conductive member 5, the semiconductor wafer 1, and the first electrode 2 form a loop. Alternatively, the first end 2a of the first electrode and the second end 3b of the second electrode are led out from the same side of the first member 4 to facilitate the mounting of the electronic device 100 on a substrate of a BMS circuit board and the electrical connection of the first end 2a of the first electrode and the second end 3b of the second electrode to conductive lines on the substrate.

[0035] The first member 4 is at least partially made of insulating material, which can support the first electrode 2, the conductive member 5, and the semiconductor wafer 1, and the insulating material in the first member 4 can be filled between components to isolate components that do not need to be directly connected, such as the first electrode 2 and the second electrode 3, the first electrode 2 and the semiconductor wafer 1, etc. The semiconductor wafer 1 is arranged in the first member 4, so that the first member 4 can also protect the semiconductor wafer 1, to some extent, to avoid or reduce the contact of the semiconductor wafer 1 with external air and water vapor. Alternatively, the first member 4 is made of epoxy resin, polyimide, or other packaging materials.

[0036] The conductive member 5 can be made of a single conductive material or an alloy composed of multiple materials. For example, the conductive member 5 can be made of lead, aluminum-magnesium alloy, aluminum-antimony alloy, etc. By selecting different conductive materials, adjusting the ratio of the materials, and setting different sizes of the conductive member 5, the conductive member 5 can be melted and broken when the temperature of the electronic device 100 is higher than a temperature threshold, so that the first electrode 2 and the semiconductor wafer 1 are disconnected, thereby avoiding the ablation of the electronic device 100. Those skilled in the art can understand that the melting temperature of the conductive member 5 is lower than the melting temperature of the first electrode 2, lower than the melting temperature of the second electrode 3, lower than the melting temperature of the semiconductor wafer 1, and lower than the melting temperature of the first member 4. It can be understood that the temperature threshold is the highest safe temperature obtained by those skilled in the art according to the specific function and material of the electronic device 100. Alternatively, the melting temperature of the conductive member 5 is 280-320°C.

[0037] The melting temperature of the conductive member 5 is lower than the melting temperature of the first electrode 2, the second electrode 3, the semiconductor wafer 1 and the first component 4. In some embodiments, the first electrode 2, the second electrode 3, the semiconductor wafer 1 and the first component 4 are prepared first, and then the conductive member 5 is connected to the first component 4, so as to avoid the melting of the prepared conductive member 5 in the process of preparing the first electrode 2, the second electrode 3, the semiconductor wafer 1 and the first component 4. It can be understood that, since the conductive member 5 is connected to the first component 4 last, at least part of the surface of the conductive member 5 is exposed relative to the first component 4 in the electronic device 100.

[0038] In the present application, by arranging the conductive member 5 on the first component 4, when the electronic device 100 works abnormally and the temperature of the electronic device 100 rises to the temperature threshold, the conductive member 5 is melted, the first electrode 2 and the semiconductor wafer 1 are disconnected, so that the electronic device 100 forms an open circuit on the circuit where the electronic device 100 is located when the electronic device 100 fails, to a certain extent, avoiding the ablation of the electronic device 100, avoiding the safety accidents such as the ablation of other components near the electronic device 100 and the carbonization of the circuit board, and improving the safety performance of the electronic device 100.

[0039] In an embodiment, the first component 4 includes a first surface 41 and a second surface 42 arranged oppositely, the conductive member 5 is arranged on the first surface 41, and the first end 2a of the first electrode and the second end 3b of the second electrode extend from the second surface 42.

[0040] Please continue to refer to Figures 1 to 3 In another embodiment, the first component 4 includes a first surface 41 and a second surface 42 arranged oppositely, and a recess 43 recessed from the first surface 41 to the direction close to the second surface 42, and at least part of the conductive member 5 is arranged in the recess 43.

[0041] The conductive member 5 can be entirely accommodated in the recess 43, or part of the conductive member 5 can be accommodated in the recess 43 and part of the conductive member 5 can protrude from the first surface 41. By accommodating at least part of the conductive member 5 in the recess 43, the overall size of the electronic device 100 is reduced, and the compactness of the layout of the electronic device 100 is improved. At the same time, by accommodating at least part of the conductive member 5 in the recess 43, the external impact directly acting on the conductive member 5 can be reduced to a certain extent, and the stability of the connection between the conductive member 5 and the first component 4 is improved. In addition, in the case of melting of the conductive member 5, the melted conductive member 5 can be accommodated in the recess 43, which can avoid the melted conductive member 5 from dropping onto other components and causing the failure of the other components to a certain extent.

[0042] The recess 43 includes a bottom surface 431 arranged oppositely spaced from the second surface 42, and at least part of the conductive member 5 is arranged on the bottom surface 431.

[0043] The bottom surface 431 can effectively support the conductive member 5. In an embodiment, the conductive member 5 is shaped to match the shape of the recess 43, so that the conductive member 5 can fill the entire recess 43. When the electronic device 100 is manufactured, the first member 4 with the recess 43 can be prepared first, and then a conductive material can be injected into the recess 43, and the conductive material after solidification forms the conductive member 5 matching the recess 43. Of course, the conductive member 5 shaped to match the recess 43 can also be prepared first, and then the conductive member 5 is installed in the recess 43. The recess 43 can also include a side surface 432 connected to the second surface 42, one end of the side surface 432 being connected to the first surface 41, and the other end being connected to the bottom surface 431. In Figure 2 In the embodiment shown, the recess 43 is rectangular when viewed in the direction from the first surface 41 to the second surface 42, and the conductive member 5 is also rectangular.

[0044] The conductive member 5 includes a first material layer 51 and a second material layer 52 connected to each other, the first material layer 51 being electrically connected to the first electrode 2 and the semiconductor wafer 1, and the second material layer 52 being a fluxing material. The first material layer 51 is a conductive material, and the second material layer 52 can lower the softening, melting or liquidizing temperature of the first material layer 51, so that the conductive member 5 is easier to melt. The second material layer 52 can be an inorganic fluxing agent and / or an organic fluxing agent, such as rosin, rosin doped with dimethyl silicone oil, rosin doped with diethylamine hydrochloride, etc.

[0045] In some embodiments, the first material layer 51 has a plurality of spaced recesses (not shown) formed therein, and the second material layer 52 is arranged in the recesses. In other embodiments, the first material layer 51 includes a third surface 511 and a fourth surface 512, at least part of the third surface 511 being in contact with the bottom surface 431, and the fourth surface 512 being arranged on the side of the first material layer 51 away from the bottom surface 431, and the second material layer 52 is connected to the fourth surface 512.

[0046] When the electronic device 100 is manufactured, a conductive material can be injected into the recess 43, and then a fluxing material can be injected into the recess 43 after the conductive material is solidified, so that the first material layer 51 and the second material layer 52 arranged in layers can be formed. The first material layer 51 and the second material layer 52 arranged in layers are continuously prepared, which improves the production efficiency of the electronic device 100.

[0047] The semiconductor wafer 1 includes a third electrode 11 and a wafer body 12, and the second end 2b of the first electrode, the conductive member 5, the third electrode 11, the wafer body 12 and the first end 3a of the second electrode are sequentially electrically connected.

[0048] The specific structure of the third electrode 11 can be set according to the relative position relationship between the conductive piece 5 and the wafer body 12. The wafer body 12 is connected through the third electrode 11 and the conductive piece 5, so that the distribution of the wafer body 12 in the first component 4 is more flexible. The wafer body 12 can be completely packaged by the first component 4, and the third electrode 11 extends out of the first component 4 to be connected with the conductive piece 5. The third electrode 11 can be the same as part of the material of the wafer body 12, that is, the third electrode 11 is formed by extending from the wafer body 12. Of course, the third electrode 11 with a complex structure can also be prepared by processes such as deposition and etching.

[0049] The first end 11a of the third electrode is connected with the conductive piece 5; the first component 4 includes an opening 44 arranged on the bottom surface 431, and the second end 2b of the first electrode and the first end 11a of the third electrode are respectively connected with the first layer through the opening 44.

[0050] In Figure 2 In the embodiment shown, the number of openings 44 is two, the second end 11b of the third electrode is connected with the wafer body 12, and the second end 2b of the first electrode and the first end 11a of the third electrode are respectively embedded in the two openings 44, so that after the conductive material is injected into the recess 43, the solidified conductive material can be directly attached to the second end 2b of the first electrode and the first end 11a of the third electrode, realizing electrical connection. The conductive piece 5 can also be directly connected with the second end 2b of the first electrode and the first end 11a of the third electrode by welding, bonding or other methods to realize electrical connection. Those skilled in the art can understand that the conductive piece 5 can be bonded with the first electrode 2 and the third electrode 3 respectively by using conductive glue with conductive particles.

[0051] In another embodiment, the second end 2b of the first electrode and the first end 11a of the third electrode extend out of the first component 4 from the opening 44, so that after the conductive material is injected into the recess 43, the solidified conductive material can directly wrap the second end 2b of the first electrode and the first end 11a of the third electrode, realizing electrical connection.

[0052] The first component 4 includes an insulating portion 45 filled between the second end 11b of the third electrode and the conductive piece 5, so that the second end 11b of the third electrode and the conductive piece 5 are insulated.

[0053] The conductive piece 5 and the wafer body 12 are arranged oppositely, the side of the wafer body 12 close to the conductive piece 5 is connected with the second end 11b of the third electrode, and the side of the wafer body 12 away from the conductive piece 5 is connected with the first end 3a of the second electrode.

[0054] The conductive piece 5 and the wafer body 12 are arranged oppositely, and the first end 11a of the third electrode and the second end 11b of the third electrode are also arranged oppositely, so as to increase the compactness of the conductive piece 5 and the wafer body 12 and reduce the overall size of the electronic device 100.

[0055] In a second aspect, the present application also provides a circuit board comprising the electronic device 100 as described above.

[0056] The related structure of the electronic device 100 in the circuit board described above can refer to the electronic device 100 provided in the above embodiments, which will not be repeated here.

[0057] In a third aspect, the present application also provides a secondary battery comprising the circuit board as described above and a cell module, the cell module comprising a plurality of battery cells, and the cell module being electrically connected with the circuit board.

[0058] The plurality of battery cells can be connected in series, in parallel or in a mixed manner to form a cell module, and the cell module is used to charge or discharge externally, wherein the mixed connection means that the plurality of battery cells are connected in series and in parallel. The circuit board can be used to control the charge and discharge of the cell module. The related structure of the circuit board in the secondary battery described above can refer to the circuit board provided in the above embodiments, which will not be repeated here.

[0059] In a fourth aspect, the present application also provides a power consumption device comprising a power consumption body and the secondary battery as described above, and the secondary battery is used to provide electric energy for the power consumption body.

[0060] The power consumption device can be a vehicle, a mobile phone, a portable device, a notebook computer, a ship, a spacecraft, an electric toy and an electric tool, etc. The above power consumption device is not specially limited in the embodiments of the present application. The related structure of the secondary battery in the power consumption device described above can refer to the secondary battery provided in the above embodiments, which will not be repeated here.

[0061] It should be noted that the embodiments and features in the embodiments of the present application can be combined with each other without conflict.

[0062] In addition, the term "and / or" in this paper is only to describe the association relationship between the associated objects, which means that there can be three kinds of relationships, for example, A and / or B can represent the following three cases: A exists alone, A and B exist together, and B exists alone. In addition, the character " / " in this paper generally represents an "or" relationship between the front and rear associated objects.

[0063] It should be understood that in the embodiments of the present application, "B corresponding to A" means that B is associated with A, and B can be determined according to A. However, it should also be understood that the determination of B according to A does not mean that B is determined only according to A, but B can also be determined according to A and / or other information.

[0064] The above merely provides the specific implementation of the present application, but the protection scope of the present application is not limited to this. Any person skilled in the art can easily think of various equivalent modifications or replacements within the technical scope disclosed by the present application, and these modifications or replacements should be covered in the protection scope of the present application. Therefore, the protection scope of the present application should be subject to the protection scope of the claims.

Claims

1. An electronic device, characterized in that, include: Semiconductor wafers; First electrode and second electrode, wherein the first end of the first electrode and the second end of the second electrode are respectively used for electrical connection with an external circuit; A first component, wherein the second end of the first electrode, the semiconductor wafer, and the first end of the second electrode are housed in the first component; A conductive element is disposed on the first component, wherein a second end of the first electrode, the conductive element, the semiconductor wafer, and a first end of the second electrode are electrically connected, and the conductive element is configured to melt to disconnect the first electrode and the semiconductor wafer in response to the temperature of the electronic device being higher than a temperature threshold. The first component includes a first surface and a second surface disposed opposite to each other, and a recessed portion recessed from the first surface toward the second surface. At least a portion of the conductive element is disposed in the recessed portion. The recessed portion includes a bottom surface disposed at a distance from the second surface. The first component also includes an opening disposed on the bottom surface. The second end of the first electrode and a portion of the semiconductor wafer are respectively connected to the conductive element through the opening.

2. The electronic device according to claim 1, characterized in that, The recess includes a bottom surface that is spaced apart from the second surface, and at least a portion of the conductive element is disposed on the bottom surface.

3. The electronic device according to claim 2, characterized in that, The conductive element includes a first material layer and a second material layer connected together. The first material layer is electrically connected to the first electrode and the semiconductor wafer, and the second material layer is a fluxing material.

4. The electronic device according to claim 3, characterized in that, The first material layer includes a third surface and a fourth surface, at least a portion of the third surface is in contact with the bottom surface, the fourth surface is disposed on the side of the first material layer opposite to the bottom surface, and the second material layer is connected to the fourth surface.

5. The electronic device according to claim 3, characterized in that, The semiconductor wafer includes a third electrode and a wafer body, and the second end of the first electrode, the conductive element, the third electrode, the wafer body and the first end of the second electrode are electrically connected in sequence.

6. The electronic device according to claim 5, characterized in that, The first end of the third electrode is connected to the conductive component; the first component includes an opening disposed on the bottom surface, and the second end of the first electrode and the first end of the third electrode are respectively connected to the first material layer through the opening.

7. The electronic device according to claim 5, characterized in that, The first component includes an insulating portion that fills the space between the second end of the third electrode and the conductive element.

8. The electronic device according to claim 5, characterized in that, The conductive element and the wafer body are disposed opposite to each other. The side of the wafer body closer to the conductive element is connected to the second end of the third electrode, and the side of the wafer body away from the conductive element is connected to the first end of the second electrode.

9. The electronic device according to claim 1, characterized in that, The melting temperature of the conductive component is 280℃~320℃.

10. A circuit board, characterized in that, Includes the electronic device as described in any one of claims 1-9.

11. A secondary battery, characterized in that, include: The circuit board according to claim 10; A cell module includes multiple individual battery cells, and the cell module is electrically connected to the circuit board.

12. An electrical appliance, characterized in that, It includes a power-consuming main body and a secondary battery according to claim 11, the secondary battery being used to provide electrical energy to the power-consuming main body.

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