Flexible optoelectronic device assembly and manufacturing method thereof

Abstract

The present invention discloses a flexible optoelectronic device assembly and a method for preparing the same. The assembly includes a plurality of optoelectronic device units, wherein one optoelectronic device unit includes a bottom electrode, a functional layer, and a top electrode. The bottom electrode includes a light-transmitting insulating substrate, a first, a second, and a third electrode arranged on both sides of the substrate. The first electrode is a transparent electrode, the second and the first electrodes are in electrical contact, and the second and the third electrodes are electrically connected via a conductive path that penetrates the substrate in the thickness direction. The third electrode in one optoelectronic device unit is electrically connected to the top electrode or the first electrode in another optoelectronic device unit, thereby allowing the two optoelectronic device units to be arranged in series or in parallel. The present invention can greatly simplify the manufacturing process of large-area flexible optoelectronic device assemblies, reduce costs, and improve the utilization rate of their effective area and ensure their photoelectric conversion efficiency. For example, it can realize the preparation of high-efficiency large-area assembly solar cells.

Description

Technical Field

[0001] The present invention relates to a photoelectric device, and in particular to a flexible photoelectric device assembly and a manufacturing method thereof. Background Art

[0002] Flexible optoelectronic devices, such as organic solar cells, have attracted widespread attention due to their lightweight, translucent nature, and the ability to be cheaply printed on large areas. In recent years, thanks to the tireless efforts of scientists, the photoelectric conversion efficiencies of rigid and flexible organic solar cells have reached 18% and 14%, respectively, essentially meeting commercialization requirements. However, truly realizing the commercialization of organic solar cells requires the fabrication of large-area modules while minimizing the sacrifice in photoelectric conversion efficiency.

[0003] Taking flexible organic solar cells as an example, due to the poor conductivity of transparent substrate electrodes (such as ITO, silver nanowires, etc.), when the area of ​​flexible organic solar cells is increased, the surface resistance of the cells will inevitably increase. Various series-parallel structure designs will not only increase the series resistance of the device, but also reduce the effective area of ​​the battery module, ultimately leading to a significant degradation of the performance of large-module organic solar cells. Currently reported rigid organic solar modules (200cm 2 ) has a maximum efficiency of 11.7%, while flexible large-area component cells have lower efficiency.

[0004] On the other hand, large-area components of flexible optoelectronic devices are currently mainly realized by roll-to-roll printing of large-area batteries combined with substrate electrode circuit design in a series-parallel structure. Its disadvantages include: 1. The design of various complex circuits on the substrate will increase the difficulty and cost of preparation; 2. The circuit with a longer substrate will increase the series resistance and reduce the photoelectric conversion efficiency of the battery; 3. The series-parallel structure design of various complex circuit connections will sacrifice a large effective area of ​​the device, resulting in waste. Summary of the Invention

[0005] The main purpose of the present invention is to provide a flexible optoelectronic device assembly and a manufacturing method thereof to overcome the deficiencies in the prior art.

[0006] To achieve the aforementioned object of the invention, the technical solutions adopted by the present invention include:

[0007] An embodiment of the present invention provides a flexible optoelectronic device assembly, which includes at least two optoelectronic device units, one of which includes a bottom electrode, a functional layer, and a top electrode arranged in sequence along a set direction, the bottom electrode includes a light-transmitting insulating substrate, a first electrode and a second electrode arranged on the first surface of the light-transmitting insulating substrate, and a third electrode arranged on the second surface of the light-transmitting insulating substrate, the first surface and the second surface are arranged opposite to each other, the first electrode is a transparent electrode, the second electrode is electrically in contact with the first electrode, and the second electrode is electrically connected to the third electrode through a conductive channel, the conductive channel includes a through hole penetrating the light-transmitting insulating substrate along the thickness direction and a conductor arranged in the through hole, and the third electrode in one optoelectronic device unit is electrically connected to the top electrode or the first electrode in the other optoelectronic device unit, thereby connecting the two optoelectronic device units in series or in parallel.

[0008] In some embodiments, a window cooperating with the through hole is further provided on the second electrode and / or the third electrode, and the conductive paste or metal used to form the conductor can be filled into the through hole through the window.

[0009] An embodiment of the present invention also provides a flexible optoelectronic device assembly, which includes two optoelectronic device units, one of which includes a bottom electrode, a functional layer, and a top electrode arranged in sequence along a set direction, the bottom electrode includes a first electrode arranged on the first surface of a light-transmitting insulating substrate, a conductive channel is formed in the light-transmitting insulating substrate, the conductive channel includes a through hole penetrating the light-transmitting insulating substrate along the thickness direction and a conductor arranged in the through hole, the first electrode is electrically connected to the top electrode or bottom electrode of another optoelectronic device unit coupled to the second surface of the light-transmitting insulating substrate through the conductive channel, so that the two optoelectronic device units are connected in series or in parallel, and the first surface and the second surface are arranged opposite to each other.

[0010] An embodiment of the present invention provides a method for manufacturing the flexible optoelectronic device assembly, comprising:

[0011] respectively fabricating at least two optoelectronic device units, and

[0012] Arranging the at least two photovoltaic device units in series and / or in parallel;

[0013] The method for manufacturing the photoelectric device unit includes the steps of sequentially manufacturing a bottom electrode, a functional layer, and a top electrode on a first surface of a light-transmitting insulating substrate;

[0014] Furthermore, the steps of manufacturing the bottom electrode specifically include:

[0015] Disposing a first electrode and a second electrode on the first surface of the light-transmitting insulating substrate, and making the second electrode electrically contact with the first electrode;

[0016] A third electrode is provided on a second surface of the light-transmitting insulating substrate opposite to the first surface;

[0017] Forming at least one through hole penetrating the light-transmitting insulating substrate along the thickness direction in the region corresponding to the second electrode and the third electrode on the light-transmitting insulating substrate;

[0018] When a conductive paste is applied or metal is deposited on the first or second surface of the light-transmitting insulating substrate, and at least a portion of the conductive paste or metal is filled into the through hole to form a conductor, a conductive path can be formed through the light-transmitting insulating substrate, thereby electrically connecting the second electrode and the third electrode.

[0019] In some embodiments, the preparation method comprises:

[0020] Processing the through hole in the area corresponding to the second electrode and the third electrode on a light-transmitting insulating substrate of a photoelectric device unit;

[0021] Disposing a second electrode and a third electrode on the first surface and the second surface of the light-transmitting insulating substrate respectively, and forming a window matching the through hole on any one of the second electrode and the third electrode;

[0022] placing the fabricated optoelectronic device unit into a positioning template;

[0023] Applying conductive paste or depositing metal at the windows of the second electrode and / or the third electrode of the optoelectronic device unit, and filling part of the conductive paste or metal into the corresponding through-holes to form the conductive channel;

[0024] The photoelectric device unit is bonded to another photoelectric device unit using the conductive paste remaining on the second electrode and / or the third electrode, and the third electrode in the photoelectric device unit is electrically connected to the top electrode or the first electrode in another photoelectric device unit through the conductive paste.

[0025] An embodiment of the present invention provides a method for manufacturing the flexible optoelectronic device assembly, comprising:

[0026] respectively fabricating at least two optoelectronic device units, and

[0027] Arranging the at least two photovoltaic device units in series and / or in parallel;

[0028] The method for manufacturing the photoelectric device unit includes the steps of sequentially manufacturing a bottom electrode, a functional layer, and a top electrode on a first surface of a light-transmitting insulating substrate;

[0029] Furthermore, the steps of manufacturing the bottom electrode specifically include:

[0030] Disposing a first electrode on the first surface of the light-transmitting insulating substrate;

[0031] Forming at least one through hole penetrating the light-transmitting insulating substrate along the thickness direction in a region corresponding to the first electrode on the light-transmitting insulating substrate;

[0032] When a conductive paste is applied or metal is deposited on the first or second surface of the light-transmitting insulating substrate, and at least a portion of the conductive paste or metal is filled into the through hole to form a conductor, a conductive path can be formed through the light-transmitting insulating substrate, and the conductive path is electrically connected to the first electrode.

[0033] In some embodiments, the conductive paste includes silver paste or conductive glue, preferably conductive glue.

[0034] In some embodiments, metal may be deposited into the through hole to form a conductor by magnetron sputtering, evaporation, or the like.

[0035] Compared with the prior art, the technical solution of the embodiments of the present invention can greatly simplify the manufacturing process of large-area flexible organic solar cell modules, reduce costs, and significantly improve the utilization rate of the effective area of ​​the flexible organic solar cell modules, thereby reducing the loss of their photoelectric conversion efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0036] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following briefly introduces the drawings required for use in the embodiments. It should be understood that the following drawings only illustrate certain embodiments of the present invention and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other relevant drawings can be obtained based on these drawings without paying any creative work.

[0037] Figure 1 This is a schematic diagram of the manufacturing process of a first flexible organic solar cell module in a typical embodiment of the present invention;

[0038] Figure 2 is a schematic diagram of the manufacturing process of a second flexible organic solar cell module in a typical embodiment of the present invention;

[0039] Figure 3a 、 Figure 3b They are respectively a top view and a bottom view of a bottom electrode 100 in a battery unit U in a typical embodiment of the present invention.

[0040] Figure 4a 、 Figure 4b They are respectively a top view and a bottom view of a battery unit U in a typical embodiment of the present invention.

[0041] Figure 5a 、 Figure 5b They are respectively a top view and a bottom view of a device structure formed by connecting multiple battery cells in series in a typical embodiment of the present invention;

[0042] Figure 6a 、 Figure 6b They are respectively a top view and a bottom view of a device structure formed by connecting a plurality of battery cells in parallel in a typical embodiment of the present invention;

[0043] Figure 7 Schematic diagram of the structure of a flexible organic solar cell module manufactured in Example 6 of the present invention;

[0044] Figure 8 is a schematic structural diagram of a flexible organic solar cell assembly manufactured in Example 7 of the present invention;

[0045] Figure 9 is a schematic diagram of a manufacturing process of a third flexible organic solar cell module in a typical embodiment of the present invention;

[0046] Figure 10 is a schematic diagram of a manufacturing process of a fourth flexible organic solar cell module according to a typical embodiment of the present invention;

[0047] Figure 11 is a schematic diagram of a manufacturing process of a fifth flexible organic solar cell module according to a typical embodiment of the present invention;

[0048] Figure 12 is a schematic diagram of a manufacturing process of a sixth flexible organic solar cell module in a typical embodiment of the present invention;

[0049] Figure 13 is a schematic diagram of a manufacturing process of a seventh flexible organic solar cell module according to a typical embodiment of the present invention;

[0050] Figure 14 This is a schematic structural diagram of a flexible organic solar cell assembly manufactured in Example 13 of the present invention. DETAILED DESCRIPTION

[0051] It should be noted that the following detailed descriptions are exemplary and are intended to provide further explanation of the present invention. Unless otherwise specified, all technical and scientific terms used in this specification have the same meanings as those commonly understood by those skilled in the art to which the present invention belongs.

[0052] It should be noted that the terms used herein are only for describing specific embodiments and are not intended to limit the exemplary embodiments according to the present invention. As used herein, unless the context clearly indicates otherwise, the singular form is intended to include the plural form. In addition, it should be understood that when the terms "comprise" and / or "include" are used in this specification, they indicate the presence of features, steps, operations, devices, components and / or combinations thereof.

[0053] One aspect of an embodiment of the present invention provides a flexible organic solar cell assembly, which includes at least two photoelectric device units, wherein the photoelectric device units include a bottom electrode, a functional layer, and a top electrode arranged in sequence along a set direction, the bottom electrode includes a light-transmitting insulating substrate, a first electrode and a second electrode arranged on the first surface of the light-transmitting insulating substrate, and a third electrode arranged on the second surface of the light-transmitting insulating substrate, the first surface and the second surface are arranged opposite to each other, the first electrode is a transparent electrode, the second electrode is in electrical contact with the first electrode, and the second electrode is electrically connected to the third electrode through a conductive channel, the conductive channel includes a through hole penetrating the light-transmitting insulating substrate along the thickness direction and a conductor arranged in the through hole, and the third electrode in one photoelectric device unit is electrically connected to the top electrode or the first electrode in the other photoelectric device unit, thereby connecting the two photoelectric device units in series or in parallel.

[0054] In some embodiments, the second electrode is one or more, wherein at least a partial area of ​​the one or more second electrodes is covered by the first electrode, and / or, wherein at least a partial area of ​​the one or more second electrodes is covered on the first electrode, and / or, wherein the one or more second electrodes are distributed around the first electrode, and / or, wherein at least a partial area of ​​the one or more second electrodes is surrounded by the first electrode.

[0055] In some embodiments, the second electrode is disposed to surround or semi-surround the first electrode.

[0056] In some embodiments, the second electrode is generally frame-shaped (the shape of the frame includes but is not limited to regular shapes such as circles and squares, or other irregular shapes), and at least the inner edge of the frame is in continuous electrical contact with the first electrode. Thus, by providing a second electrode with low resistance as a conductive path around the first electrode (transparent electrode), and utilizing the circuit's inherent "short-circuit effect," a low-cost, high-performance "bypass highway" can be provided for large-area transparent electrodes without changing the conductivity of the transparent electrode itself, thereby effectively improving the overall performance of the product (including but not limited to charge collection efficiency, etc.).

[0057] Furthermore, the functional layer is formed on the first electrode.

[0058] In some embodiments, the second electrode is a conductive line.

[0059] Furthermore, the width of the conductive line is ≤5 mm, preferably ≤1 mm.

[0060] Furthermore, compared with the first electrode, the protrusion height of the highest point of the second electrode is less than 5 μm, preferably less than 1 μm.

[0061] Furthermore, the equivalent sheet resistance of the conductive lines is ≤5Ω / sq, preferably ≤1Ω / sq.

[0062] In some embodiments, one or more local regions of the second electrode overlap the first electrode.

[0063] In some embodiments, the through hole continuously penetrates the light-transmitting insulating substrate and the second electrode and / or the third electrode along a set direction.

[0064] In some embodiments, the conductor is formed of a conductive paste filled into the through-hole.

[0065] In some embodiments, the conductive paste includes silver paste or conductive glue, or may be a suitable type of conductive ink or fluid containing a conductive substance known in the art, preferably conductive glue.

[0066] In some embodiments, a window cooperating with the through hole is further provided on the second electrode and / or the third electrode, and the conductive paste or deposited metal used to form the conductor can be filled into the through hole through the window.

[0067] Furthermore, the area of ​​the window is larger than the opening area of ​​the through hole on the first surface or the second surface.

[0068] In some embodiments, the windows are formed on both the second electrode and the third electrode.

[0069] In some embodiments, the transparent electrode includes but is not limited to a silver nanowire electrode, ITO, AZO, a carbon nanotube film, a graphene film, a PEDOT:PSS film, and the like.

[0070] In some embodiments, the light-transmitting insulating substrate may be made of organic, inorganic, or organic / inorganic composite materials, for example, a flexible transparent film of polyester (PET), polyurethane (PU), polyimide (PI), or glass.

[0071] In some embodiments, the second electrode and the third electrode include any one or more combinations of metal electrodes, conductive polymer electrodes, and metal oxide electrodes, and are not limited thereto. For example, they can be formed of various metals with good conductivity, such as Au, Ag, Cu, etc.

[0072] In some embodiments, the second surface of the light-transmitting insulating substrate in one optoelectronic device unit is further connected to the top electrode or the bottom electrode in another optoelectronic device unit via a conductive adhesive layer.

[0073] In some embodiments, the flexible optoelectronic device assembly includes a flexible thin-film light emitting diode, a flexible thin-film photovoltaic cell, or a flexible thin-film photodetector, but is not limited thereto.

[0074] Taking a flexible thin-film solar cell as an example, its functional layer may be an active layer, and it may also include an electron transport layer, a hole transport layer, and an interface modification layer, etc. The materials of these structural layers may be known in the art.

[0075] Taking a flexible thin film light emitting diode as an example, its functional layer may be a light emitting layer.

[0076] Another aspect of the embodiments of the present invention provides a method for manufacturing the flexible optoelectronic device assembly, comprising:

[0077] respectively fabricating at least two optoelectronic device units, and

[0078] Arranging the at least two photovoltaic device units in series and / or in parallel;

[0079] The method for manufacturing the photoelectric device unit includes the steps of sequentially manufacturing a bottom electrode, a functional layer, and a top electrode on a first surface of a light-transmitting insulating substrate;

[0080] Furthermore, the steps of manufacturing the bottom electrode specifically include:

[0081] Disposing a first electrode and a second electrode on the first surface of the light-transmitting insulating substrate, and making the second electrode electrically contact with the first electrode;

[0082] A third electrode is provided on a second surface of the light-transmitting insulating substrate opposite to the first surface;

[0083] Forming at least one through hole penetrating the light-transmitting insulating substrate along the thickness direction in the region corresponding to the second electrode and the third electrode on the light-transmitting insulating substrate;

[0084] When a conductive paste is applied or metal is deposited on the first or second surface of the light-transmitting insulating substrate, and at least a portion of the conductive paste or metal is filled into the through hole to form a conductor, a conductive path can be formed through the light-transmitting insulating substrate, thereby electrically connecting the second electrode and the third electrode.

[0085] In some embodiments, the step of making the bottom electrode specifically includes: setting a second electrode on the first surface of the light-transmitting insulating substrate and / or setting a third electrode on the second surface of the light-transmitting insulating substrate, and processing the second electrode and / or the third electrode and the light-transmitting insulating substrate to form the through hole that continuously passes through the second electrode and / or the third electrode and the light-transmitting insulating substrate.

[0086] In some embodiments, the step of manufacturing the bottom electrode specifically includes:

[0087] Processing the through holes in the areas corresponding to the second electrode and the third electrode on the light-transmitting insulating substrate;

[0088] Disposing a second electrode and a third electrode on the first surface and the second surface of the light-transmitting insulating substrate respectively, and forming a window matching the through hole on any one of the second electrode and the third electrode;

[0089] The conductive path can be formed when a conductive paste is applied or metal is deposited at the windows of the second electrode and / or the third electrode, and at least a portion of the conductive paste or metal is filled into the through hole to form a conductor.

[0090] The operation of forming the through hole on the light-transmitting insulating substrate may be performed before or after the operation of providing the second electrode and the third electrode on the light-transmitting insulating substrate.

[0091] For example, the through hole may be formed on the light-transmitting insulating substrate first, and then the second electrode and the third electrode having windows are disposed on the light-transmitting insulating substrate.

[0092] Alternatively, the second electrode and the third electrode having windows may be provided on the light-transmitting insulating substrate first, and then the through hole may be formed on the light-transmitting insulating substrate through the windows.

[0093] In some embodiments, the step of manufacturing the bottom electrode specifically includes: forming windows on both the second electrode and the third electrode to match the through hole.

[0094] In some embodiments, the preparation method specifically includes:

[0095] Placing the manufactured optoelectronic device unit into the positioning template;

[0096] Applying conductive paste or depositing metal at the windows of the second electrode and / or the third electrode of the optoelectronic device unit, and filling part of the conductive paste or metal into the corresponding through-holes to form the conductive channel;

[0097] The photoelectric device unit is bonded to another photoelectric device unit using the conductive paste remaining on the second electrode and / or the third electrode, and the third electrode in the photoelectric device unit is electrically connected to the top electrode or the first electrode in another photoelectric device unit through the conductive paste.

[0098] In the aforementioned manner, the conductive paste can be filled into the through-hole by itself under the action of gravity, or other external forces can be used to fill the conductive paste or deposited metal into the through-hole.

[0099] In the aforementioned embodiments, the through-holes may be formed in the light-transmitting insulating substrate or the light-transmitting insulating substrate and the second and / or third electrodes by known methods, such as mechanical processing, laser ablation, or other physical or chemical methods. However, if mechanical processing or laser ablation is used, in many cases, an annular protrusion may form at the edge of the through-hole.

[0100] Furthermore, the shape and size of the through hole can be arbitrarily selected according to actual needs, for example, it can be circular, polygonal or other irregular shapes.

[0101] In some embodiments, the opening area of ​​the through hole on the first surface or the second surface of the light-transmitting insulating substrate is 0.13 mm 2 Below, preferably 0.03mm 2 the following.

[0102] In some embodiments, the perimeter of the opening of the through hole on the first surface or the second surface of the light-transmitting insulating substrate is 10-800 μm, preferably 60-400 μm.

[0103] In some embodiments, the protrusion height of the edge portion of the opening of the through hole on the first surface or the second surface of the light-transmitting insulating substrate relative to the first surface or the second surface is less than 5 μm, preferably less than 1 μm.

[0104] In some embodiments, the conductive paste includes silver paste, conductive glue, a suitable type of conductive ink known in the art, or other fluid containing a conductive substance. Under certain conditions (such as heating, natural drying, or light irradiation), some volatile components (solvents, diluents, etc.) in these conductive pastes may be volatilized and removed, or a rapid cross-linking reaction may occur due to light irradiation, thereby converting the conductive paste into a conductive solid (i.e., the aforementioned conductor). Alternatively, some components in these conductive pastes may react with substances in the environment or other components in the conductive paste, thereby converting the conductive paste into the aforementioned conductor.

[0105] In some embodiments, the conductive paste has a viscosity of 20-100,000 cP, preferably 100-10,000 cP.

[0106] In some embodiments, the conductive paste is applied to the light-transmitting insulating substrate or the light-transmitting insulating substrate and the second electrode and / or the third electrode by any one or more combinations of printing, coating, or dispensing, but is not limited thereto.

[0107] In some embodiments, the second and third electrodes can be formed on the light-transmitting insulating substrate by physical and / or chemical deposition, such as, but not limited to, any one or a combination of printing, coating, dispensing, vacuum evaporation, or magnetron sputtering. More specifically, for example, the second and third electrodes can be formed by any one of inkjet printing, air jet printing, gravure printing, screen printing, flexographic printing, and mask spraying.

[0108] In some other implementations, the second electrode and the third electrode may be fabricated in advance and then fixed to the light-transmitting insulating substrate.

[0109] In some embodiments, the thickness of the second electrode and the third electrode is respectively greater than the protrusion height of the edge portion of the opening of the through hole on the first surface and the second surface of the light-transmitting insulating substrate relative to the first surface and the second surface.

[0110] In some embodiments, the second electrode and the third electrode respectively cover the openings of the through hole on the first surface and the second surface of the light-transmitting insulating substrate and extend radially outward from the edge of the opening by more than 20 μm, preferably more than 50 μm.

[0111] In some embodiments, the second electrode and the third electrode are made of various metal or non-metal materials with good electrical conductivity, such as Au, Ag, and Cu.

[0112] In some embodiments, the method further comprises: connecting the second surface of the light-transmitting insulating substrate in one of the optoelectronic device units to the top electrode or the bottom electrode in another optoelectronic device unit via a conductive adhesive layer.

[0113] In the above embodiments of the present invention, by forming a conductive channel in a light-transmitting insulating substrate and setting a second electrode, a third electrode, etc., a plurality of optoelectronic device units can be simply and quickly connected in series or in parallel by using conductive glue, etc., thereby effectively simplifying the preparation process of such flexible optoelectronic device components (especially large-area components), reducing its production cost, and increasing the component area without sacrificing the effective area of ​​the device, and can also ensure or even improve its photoelectric conversion efficiency.

[0114] Another aspect of an embodiment of the present invention provides a flexible optoelectronic device assembly including two optoelectronic device units, one of which includes a bottom electrode, a functional layer, and a top electrode arranged in sequence along a set direction, the bottom electrode including a first electrode arranged on the first surface of a light-transmitting insulating substrate, a conductive channel formed in the light-transmitting insulating substrate, the conductive channel including a through hole penetrating the light-transmitting insulating substrate along the thickness direction and a conductor arranged in the through hole, the first electrode is electrically connected to the top electrode or bottom electrode of another optoelectronic device unit coupled to the second surface of the light-transmitting insulating substrate through the conductive channel, thereby connecting the two optoelectronic device units in series or in parallel, and the first surface and the second surface are arranged opposite to each other.

[0115] In some embodiments, a fourth electrode is further disposed on the first surface of the light-transmitting insulating substrate, and the fourth electrode is in electrical contact with the first electrode.

[0116] In some embodiments, the first electrode covers the entire first surface of the light-transmitting insulating substrate. The material of the first electrode is as described above and will not be repeated here.

[0117] At least a portion of the fourth electrode overlaps the first electrode, or at least a portion of the first electrode overlaps the fourth electrode. That is, the first and fourth electrodes may overlap, or the first electrode overlaps the fourth electrode, or the fourth electrode is disposed on the first electrode. The fourth electrode may comprise the aforementioned conductive line. Furthermore, the fourth electrode may also perform a similar function to the aforementioned second electrode.

[0118] In some embodiments, a fifth electrode is further provided on the second surface of the light-transmitting insulating substrate, the fifth electrode being electrically connected to the first electrode via a conductive path. The material of the fifth electrode can be similar to that of the third electrode.

[0119] In some embodiments, the conductor is formed by a conductive paste filled into the through hole, and the material of the conductive paste is as described above.

[0120] In some embodiments, a sixth electrode formed from the conductive paste or deposited metal is further disposed on the first electrode, and the sixth electrode is integrally formed with the conductor. The sixth electrode can be in the form of the aforementioned conductive line. Furthermore, the sixth electrode can also perform functions similar to those of the aforementioned second and fourth electrodes.

[0121] In some embodiments, the second surface of the light-transmitting insulating substrate in one optoelectronic device unit is connected to the top electrode or the bottom electrode in another optoelectronic device unit through a conductive adhesive layer.

[0122] In the aforementioned embodiment, the photoelectric device unit can be various types of solar cell devices, wherein the functional layers include upright structures, inverted structures, multi-interface modified organic thin film photovoltaic devices, stacked quantum dot devices, perovskite photovoltaic devices or other types of stacked cells, etc., and are not limited thereto.

[0123] Another aspect of an embodiment of the present invention provides a method for manufacturing the flexible optoelectronic device assembly, comprising:

[0124] respectively fabricating at least two optoelectronic device units, and

[0125] Arranging the at least two photovoltaic device units in series and / or in parallel;

[0126] The method for manufacturing the photoelectric device unit includes the steps of sequentially manufacturing a bottom electrode, a functional layer, and a top electrode on a first surface of a light-transmitting insulating substrate;

[0127] Furthermore, the steps of manufacturing the bottom electrode specifically include:

[0128] Disposing a first electrode on the first surface of the light-transmitting insulating substrate;

[0129] Forming at least one through hole penetrating the light-transmitting insulating substrate along the thickness direction in a region corresponding to the first electrode on the light-transmitting insulating substrate;

[0130] When a conductive paste is applied or metal is deposited on the first or second surface of the light-transmitting insulating substrate, and at least a portion of the conductive paste or metal is filled into the through hole to form a conductor, a conductive path can be formed through the light-transmitting insulating substrate, and the conductive path is electrically connected to the first electrode.

[0131] Furthermore, the method may further include the step of forming a fourth electrode or a sixth electrode on the first surface of the light-transmitting insulating substrate, and / or the step of forming a fifth electrode on the second surface of the light-transmitting insulating substrate. The corresponding operations can be referred to in the aforementioned methods for forming the second and third electrodes, and will not be further described here.

[0132] See also Figure 1 As shown, in a typical embodiment of the present invention, a first method for manufacturing a flexible organic solar cell module includes:

[0133] S1: forming a continuous transparent electrode 12 (defined as a first electrode) on the first surface 111 of the flexible light-transmitting insulating substrate 11;

[0134] S2: Processing one or more through holes 113 in a selected area on the flexible light-transmitting insulating substrate 11, wherein the through holes 113 penetrate the flexible light-transmitting insulating substrate 11 along the thickness direction. The selected area may be an edge area or other suitable area of ​​the flexible light-transmitting insulating substrate 11, and the transparent electrode 12 may or may not be distributed in this area;

[0135] S3: A second electrode 13 and a third electrode 14 are respectively formed on the first surface 111 and the second surface 112 of the flexible light-transmitting insulating substrate 11 by printing, coating, dispensing, vacuum evaporation or magnetron sputtering. The second electrode 13 and the third electrode 14 are both provided with windows 131 and 141 corresponding to the through hole 113, thereby forming a bottom electrode 100 of a battery cell;

[0136] S4: Using methods known in the art, an electron transport layer 200, an active layer 300, a hole transport layer 400, a top electrode 500, etc. are sequentially formed on the transparent electrode 12 of the bottom electrode 100, thereby forming a complete battery unit U;

[0137] S5: Apply an appropriate amount of conductive paste or the like on the second electrode 13 and the third electrode 14 (particularly at the windows 131 and 141 ) of a battery cell, and partially fill the through hole 113 with the conductive paste, thereby forming a conductive channel 15 between the second electrode 13 and the third electrode 14 ;

[0138] S6: Laminating the battery cell to another battery cell, and bonding the third electrode 14 of the battery cell to the top electrode 500 of the other battery cell using the conductive paste remaining on the third electrode 14, so that the two battery cells are arranged in series;

[0139] S7: Repeat the operation of the aforementioned step S6 until a plurality of battery units are bonded together to form the desired flexible organic solar cell assembly.

[0140] Furthermore, the operations of the aforementioned steps S1 to S7 can be performed in a glove box or other clean, anhydrous, and oxygen-free environment.

[0141] Furthermore, the operation of the aforementioned step S6 can be performed with the aid of auxiliary fixtures such as a positioning template.

[0142] Furthermore, in the aforementioned step S6 , the third electrode 14 of one battery cell may be bonded to the top electrode 500 of another battery cell through a conductive adhesive layer to form an electrical connection.

[0143] For further information, see Figure 2 As shown, the second method for manufacturing a flexible organic solar cell module in a typical embodiment of the present invention is Figure 1Similarly, in step S6 , the conductive paste remaining on the third electrode 14 can be used to bond the third electrode 14 of the battery cell to the first electrode 12 of another battery cell, so that the two battery cells are arranged in parallel.

[0144] Furthermore, the manufacturing method may further include further packaging the formed flexible organic solar cell assembly, and these operations may be performed in a manner known in the art.

[0145] Furthermore, in this typical embodiment, the top view and bottom view of the bottom electrode 100 in a battery cell U can be referred to respectively. Figure 3a-Figure 3b shown.

[0146] Furthermore, in this typical embodiment, the top view and bottom view of a battery unit U can be referred to as Figure 4a-4b As shown (where 600 indicates the effective area of ​​the battery).

[0147] Furthermore, in this typical embodiment, the top view and bottom view of the assembly structure formed by multiple battery cells in series can be referred to respectively. Figure 5a-5b shown.

[0148] Furthermore, in this typical embodiment, the top view and bottom view of the assembly structure formed by multiple battery cells connected in parallel can be referred to respectively. Figure 6a-6b shown.

[0149] See also Figure 9 As shown, in a typical embodiment of the present invention, a third method for manufacturing a flexible organic solar cell module includes:

[0150] S1: forming a continuous transparent electrode 12 ′ (also defined as a first electrode) on the first surface 111 of the flexible light-transmitting insulating substrate 11 ;

[0151] S2: processing one or more through holes 113 in a selected area on the flexible light-transmitting insulating substrate 11, wherein the through holes 113 penetrate the flexible light-transmitting insulating substrate 11 along the thickness direction. The selected area may be an edge area or other suitable area of ​​the flexible light-transmitting insulating substrate 11, where the transparent electrode 12' is distributed, thereby forming a bottom electrode 100a of a battery cell;

[0152] S3: Using methods known in the art, a functional layer 300', a top electrode 500, etc. are sequentially formed on the transparent electrode 12' of the bottom electrode 100a, thereby forming a complete battery unit U1, wherein the functional layer 300' may include an electron transport layer, a hole transport layer and an active layer or a stacked battery, etc.;

[0153] S4: applying an appropriate amount of conductive paste or the like on the first surface or the second surface of the flexible light-transmitting insulating substrate 11 of a battery cell, and filling the conductive paste into the through hole 113 to form a conductive channel 15;

[0154] S5: The battery cell is laminated to another battery cell, and the second surface 112 of the flexible light-transmitting insulating substrate 11 of the battery cell is bonded to the top electrode 500 of the other battery cell using a conductive adhesive layer 16. The transparent electrode 12' in the battery cell is electrically connected to the top electrode of the other battery cell through the conductive channel and the conductive adhesive layer 16, so that the two battery cells are arranged in series, thereby forming the desired flexible organic solar cell module.

[0155] Furthermore, the operations of the aforementioned steps S1 to S5 can be performed in a glove box or other clean, anhydrous, and oxygen-free environment. Furthermore, the operation of the aforementioned step S5 can be performed with the aid of auxiliary fixtures such as a positioning template.

[0156] See also Figure 10 As shown, in a typical embodiment of the present invention, the fourth method for manufacturing a flexible organic solar cell module is similar to the third method for manufacturing a flexible organic solar cell module, and the main difference is:

[0157] S4: Apply an appropriate amount of conductive paste to the first surface of the flexible light-transmitting insulating substrate 11 of a battery cell, and fill part of the conductive paste into the through hole 113 to form a conductive channel 15, and the remaining conductive paste forms a sixth electrode 17 on the transparent electrode 12'. The sixth electrode 17 is a conductive line.

[0158] See also Figure 11 As shown, in a typical embodiment of the present invention, a fifth method for manufacturing a flexible organic solar cell module includes:

[0159] S1: forming a continuous transparent electrode 12 ′ (defined as a first electrode) on the first surface 111 of the flexible light-transmitting insulating substrate 11 ;

[0160] S2: processing one or more through holes 113 in a selected area on the flexible light-transmitting insulating substrate 11, wherein the through holes 113 penetrate the flexible light-transmitting insulating substrate 11 along the thickness direction. The selected area may be an edge area or other suitable area of ​​the flexible light-transmitting insulating substrate 11, where the transparent electrode 12' is distributed;

[0161] S3: A fourth electrode 18 is formed on the transparent electrode 12 ′ by printing, coating, dispensing, vacuum evaporation, or magnetron sputtering. The fourth electrode 18 is provided with a window 181 corresponding to the through hole 113 , thereby forming a bottom electrode 100 b of a battery cell.

[0162] S4: Using methods known in the art, a functional layer 300', a top electrode 500, etc. are sequentially formed on the transparent electrode 12' of the bottom electrode 100b, thereby forming a complete battery unit U2, wherein the functional layer 300' may include an electron transport layer, a hole transport layer and an active layer or a stacked battery, etc.;

[0163] S5: Applying an appropriate amount of conductive paste or the like on the fourth electrode 18 (particularly at the window 181 ) of one battery cell, and allowing the conductive paste to fill the through hole 113 , thereby forming a conductive channel 15 ;

[0164] S6: The battery cell is laminated to another battery cell, and the second surface 112 of the flexible light-transmitting insulating substrate 11 of the battery cell is bonded to the top electrode 500 of the other battery cell using the conductive adhesive layer 16. The transparent electrode 12' and the fourth electrode 18 in the battery cell are electrically connected to the top electrode of the other battery cell through the conductive channel 15 and the conductive adhesive layer 16, so that the two battery cells are arranged in series, thereby forming the desired flexible organic solar cell module.

[0165] See also Figure 12 As shown, in a typical embodiment of the present invention, a sixth method for manufacturing a flexible organic solar cell module includes:

[0166] S1: forming a continuous transparent electrode 12 ′ on the first surface 111 of the flexible light-transmitting insulating substrate 11 ;

[0167] S2: processing one or more through holes 113 in a selected area on the flexible light-transmitting insulating substrate 11, wherein the through holes 113 penetrate the flexible light-transmitting insulating substrate 11 along the thickness direction. The selected area may be an edge area or other suitable area of ​​the flexible light-transmitting insulating substrate 11, where the transparent electrode 12' is distributed;

[0168] S3: A fourth electrode 18 is formed on the transparent electrode 12', and a fifth electrode 19 is formed on the second surface 112 of the flexible light-transmitting insulating substrate 11 by printing, coating, dispensing, vacuum evaporation, or magnetron sputtering. Windows 181 and 191 corresponding to the through-hole 113 are formed on the fourth electrode 18 and the fifth electrode 19, thereby forming a bottom electrode 100c of a battery cell.

[0169] S4: Using methods known in the art, a functional layer 300', a top electrode 500, etc. are sequentially formed on the transparent electrode 12' of the bottom electrode 100c, thereby forming a complete battery unit U3, wherein the functional layer 300' may include an electron transport layer, a hole transport layer and an active layer or a stacked battery, etc.;

[0170] S5: Apply an appropriate amount of conductive paste or the like on the fourth electrode 18 or the fifth electrode 19 (particularly at the windows 181 and 191 ) of one battery cell, and fill the conductive paste into the through hole 113 , thereby forming a conductive channel 15 between the fourth electrode 18 and the fifth electrode 19 ;

[0171] S6: Laminating the battery cell to another battery cell, bonding the fifth electrode 19 of the battery cell to the top electrode 500 of the other battery cell using the conductive adhesive layer 16, and electrically connecting the transparent electrode 12' and the fourth electrode 18 in the battery cell to the top electrode of the other battery cell through the conductive channel 15 and the conductive adhesive layer 16, so that the two battery cells are arranged in series, thereby forming the desired flexible organic solar cell module.

[0172] See also Figure 13 As shown, in a typical embodiment of the present invention, the seventh method for manufacturing a flexible organic solar cell module is similar to the fifth method for manufacturing a flexible organic solar cell module, except that:

[0173] S1: forming a continuous transparent electrode 12 on the first surface 111 of the flexible light-transmitting insulating substrate 11;

[0174] S2: processing one or more through holes 113 in a selected area on the flexible light-transmitting insulating substrate 11, wherein the through holes 113 penetrate the flexible light-transmitting insulating substrate 11 along the thickness direction. The selected area may be an edge area or other suitable area of ​​the flexible light-transmitting insulating substrate 11, where no transparent electrode 12 is distributed;

[0175] S3: An electrode 18' (also defined as a fourth electrode) is formed on the first surface 111 of the flexible light-transmitting insulating substrate 11 by printing, coating, dispensing, vacuum evaporation, or magnetron sputtering. The electrode 18' has a window 181' corresponding to the through hole 113, thereby forming a bottom electrode 100d of a battery cell.

[0176] S4: Using methods known in the art, a functional layer 300', a top electrode 500, etc. are sequentially formed on the transparent electrode 12 of the bottom electrode 100d, thereby forming a complete battery unit U4, wherein the functional layer 300' may include an electron transport layer, a hole transport layer and an active layer or a stacked battery, etc.;

[0177] S5: Apply an appropriate amount of conductive paste or the like on the electrode 18 ′ (particularly at the window 181 ′) of a battery cell, and fill the conductive paste into the through hole 113 to form a conductive channel 15 ;

[0178] S6: The battery cell is bonded to another battery cell, and the second surface 112 of the flexible light-transmitting insulating substrate 11 of the battery cell is bonded to the top electrode 500 of the other battery cell using the conductive adhesive layer 16. The transparent electrode 12 and the electrode 18' in the battery cell are electrically connected to the top electrode of the other battery cell through the conductive channel 15 and the conductive adhesive layer 16, so that the two battery cells are arranged in series, thereby forming the desired flexible organic solar cell module.

[0179] In this embodiment, the functional layer 300 ′ may also completely cover the electrode 18 ′ and the transparent electrode 12 .

[0180] The technical solutions of the present invention are described in more detail below with reference to several embodiments and accompanying drawings. It should be noted that, unless otherwise specified, the raw materials, chemical reagents, and equipment used in the following embodiments can be obtained commercially, and operations such as printing, spraying, spin coating, and magnetron sputtering can be performed in accordance with methods known in the art.

[0181] Example 1 A method for manufacturing a flexible thin film solar cell module can be found in Figure 1 , which includes the following steps:

[0182] S1. Fabricating a light-transmitting silver nanowire electrode (i.e., the aforementioned first electrode) on the front side (first side) of a polyimide (PI) film having a thickness of approximately 300 μm;

[0183] S2. One or more through holes are processed in the edge area of ​​the PI film by mechanical processing or laser ablation. Each through hole continuously penetrates the PI film in the thickness direction. Each through hole can be circular, polygonal or other irregular shapes. The circumference of a single through hole can be about 10-50 μm, and the opening area on the front side of the PI film or the opening area on the back side (second side) can be about 0.03 mm. 2 Furthermore, the protrusion height of the edge of each through hole opening on the front and back sides of the PI film can be controlled to be less than 1 μm;

[0184] S3. Two silver wire electrodes (i.e., the second electrode and the third electrode) are respectively made on the front and back of the PI film by screen printing or other methods. The second electrode can be arranged around the first electrode and contact or overlap with the first electrode at the edge. These silver wire electrodes can be arranged in the form of conductive lines, and their width can be set to ≤5mm, preferably ≤1mm, and the equivalent square resistance is ≤5Ω / sq, preferably ≤1Ω / sq. In addition, compared with the first electrode, the protrusion height of the highest point of the second electrode and the third electrode is less than 5 microns, preferably less than 1 micron. Furthermore, continuous windows or discrete windows are opened on these silver wire electrodes corresponding to each through hole, and the area of ​​these windows is larger than the opening area of ​​the through hole on the surface of the PI film;

[0185] S4. According to methods known in the art, an electron transport layer (such as a zinc oxide thin film layer with a thickness of about 50 nm), an active layer (such as a PM6:Y6 active layer with a thickness of about 100 nm), a hole transport layer (such as a MoO3 thin film with a thickness of about 10 nm), and a metal top electrode (such as metal Al with a thickness of about 100 nm) are sequentially formed on the first electrode to form a thin-film solar cell unit;

[0186] S5. Apply an appropriate amount of conductive silver paste or the like to the second electrode and the third electrode of a battery cell, and allow part of the conductive silver paste to pass through the windows opened on the second electrode and the third electrode and fill into the through hole, thereby forming a conductive channel between the second electrode and the third electrode;

[0187] S6: Laminating the battery cell to another battery cell, and bonding the third electrode of the battery cell to the top electrode of the other battery cell using the conductive silver paste remaining on the second electrode and the third electrode, so that the two battery cells are arranged in series;

[0188] S7: Repeat the operation of the aforementioned step S6 until a plurality of battery units are bonded together to form the desired flexible organic solar cell assembly, and then perform operations such as packaging.

[0189] In the aforementioned step S5 , metal may be deposited into the windows and the through-holes provided on the second electrode and the third electrode by magnetron sputtering, metal evaporation, or the like, thereby forming a conductive channel.

[0190] In the aforementioned step S6 , the third electrode 14 of one battery cell may be bonded to the top electrode 500 of another battery cell through a conductive adhesive layer to form an electrical connection.

[0191] Example 2 A method for manufacturing a flexible thin-film solar cell module comprises the following steps:

[0192] S1. Forming an ITO transparent conductive layer (first electrode) on the front side (first side) of a polyester (PET) film having a thickness of about 150 μm;

[0193] S2. Process multiple through holes on the PET film. Each through hole vertically penetrates the PET film. Each through hole can be circular, polygonal or other irregular shapes. The circumference of a single through hole is about 500-800 μm, and the opening area on the front or back of the PET film is about 0.13 mm. 2 Below, and the protrusion height of the edge of each through hole opening on the front and back (second surface) of the PET film is less than 5 μm;

[0194] S3. Two Ag electrodes (second electrode and third electrode) are formed by magnetron sputtering Ag in the areas where the aforementioned through holes are distributed on the front and back of the PET film. The thickness of each Ag electrode is higher than the protrusion height of the opening edge of each through hole on the front and back of the PET film. The Ag electrode deposition area covers and exceeds the opening edge of each through hole on the surface of the PET film by more than 50 μm. The second electrode is arranged around the ITO transparent conductive layer and contacts or overlaps with the ITO transparent conductive layer at the edge. Each Ag electrode can be set to the form of a conductive line, and its width can be set to ≤5 mm, preferably ≤1 mm, and the equivalent square resistance ≤5Ω / sq, preferably ≤1Ω / sq. In addition, compared with the ITO transparent conductive layer, the protrusion height of the highest point of the second electrode is less than 5 microns, preferably less than 1 micron.

[0195] S4-S5, the operation is the same as in Example 1;

[0196] S6: Laminating the battery cell to another battery cell, and bonding the third electrode of the battery cell to the top electrode of the other battery cell using the conductive silver paste remaining on the second electrode and the third electrode or applying another conductive adhesive layer, so that the two battery cells are arranged in series;

[0197] S7. The operation is the same as in Example 1.

[0198] Example 3 is a method for manufacturing a flexible thin-film solar cell module, which is essentially the same as Example 1, except that step S3 is performed first, followed by step S2. Specifically, the PI film is processed through the windows formed in the second and third electrodes to form the through-holes. This embodiment is more difficult to operate than Example 1.

[0199] Example 4 A method for manufacturing a flexible thin-film solar cell module is basically the same as Example 1, except that:

[0200] In step S3, no window is formed on the second electrode, but a window is formed on the third electrode;

[0201] In step S5, the battery cell is turned upside down and conductive silver paste is applied on the third electrode so that part of the conductive silver paste fills the through hole through the window on the third electrode, thereby forming a conductive channel between the second electrode and the third electrode.

[0202] This embodiment can avoid problems such as local short circuit of the transparent electrode caused by the conductive silver paste flowing onto the transparent electrode.

[0203] Example 5 is a method for fabricating a flexible thin-film solar cell module, which is essentially the same as Example 1, except that step S3 is performed first, but without openings in the second and third electrodes. Then, step S2 is performed to form a through-hole that continuously penetrates the second electrode, the PI film, and the third electrode. This embodiment is more difficult to operate than Example 1.

[0204] The advantages of the technical solutions provided in the above embodiments 1-5 of the present invention include:

[0205] First, it can significantly simplify the manufacturing process of large-area flexible organic solar cell modules and reduce costs;

[0206] Second, it is possible to achieve almost 100% utilization of the effective area of ​​organic solar cells;

[0207] Third, compared with monolithic cell modules, the photoelectric conversion efficiency of the prepared solar cell modules has almost no attenuation, so the preparation of high-efficiency large-area module solar cells can be achieved.

[0208] Example 6 A method for manufacturing a flexible thin film solar cell module is basically the same as Example 1, except that: Figure 7 As shown, the second electrode 13 is at least partially stacked on the first electrode 12 and is electrically connected to the third electrode 14 through a conductive channel 15 ′.

[0209] Example 7 A method for manufacturing a flexible thin film solar cell module is basically the same as Example 1, except that: Figure 8 As shown, the second electrode 13 is partially covered by the electrode 12 (also defined as the first electrode) and is electrically connected to the third electrode 14 through the conductive channel 15.

[0210] Example 8 A method for manufacturing a flexible thin film solar cell module can be found in Figure 9 , which includes the following steps:

[0211] S1. A light-transmitting silver nanowire electrode is fabricated on the front surface (first surface) of a polyimide (PI) film having a thickness of about 300 μm. The silver nanowire electrode covers the entire front surface of the PI film.

[0212] S2. One or more through holes are machined in the edge region of the PI film by mechanical processing or laser ablation. Each through hole continuously penetrates the silver nanowire electrode and the PI film along the thickness direction. Each through hole can be circular, polygonal, or other irregular shape.

[0213] S3. According to methods known in the art, an electron transport layer (such as a zinc oxide thin film layer with a thickness of about 50 nm), an active layer (such as a PM6:Y6 active layer with a thickness of about 100 nm), a hole transport layer (such as a MoO3 thin film with a thickness of about 10 nm), a metal top electrode (such as metal Al with a thickness of about 100 nm), etc. are sequentially fabricated on the silver nanowire electrode to form a thin film solar cell unit.

[0214] S4. Applying an appropriate amount of conductive silver paste to the area on the front side of the PI film where the through holes are located, and filling the conductive silver paste into the through holes, thereby forming a conductive channel between the front and back sides of the PI film;

[0215] S5: Use a conductive adhesive layer to bond the back side of one battery cell to the metal top electrode of another battery cell, so that the silver nanowire electrode of the battery cell is bonded to the top electrode of the other battery cell through the conductive channel and the conductive adhesive layer, so that the two battery cells are arranged in series to form the required flexible organic solar cell module, which can then be packaged and other operations can be performed.

[0216] The manufacturing process of the flexible thin-film solar cell assembly of this embodiment is simple, easy to operate and low in cost.

[0217] In the aforementioned step S4 , metal may also be deposited into the through hole by magnetron sputtering, metal evaporation, or the like, thereby forming a conductive channel.

[0218] Example 9, please refer to Figure 10 The manufacturing method of a flexible thin-film solar cell module provided in this embodiment is similar to that of embodiment 8, except that:

[0219] In step S4, conductive silver paste can be applied to the through-holes in the front of the PI film using methods such as screen printing or gravure printing. A portion of the conductive silver paste fills the through-holes, forming a conductive channel between the front and back surfaces of the PI film. The remaining conductive silver paste remains on the front of the PI film to form a silver wire electrode (the aforementioned sixth electrode). This silver wire electrode preferably has a structure similar to the second electrode in Example 1. This silver wire electrode can provide a low-cost, high-performance "bypass highway" for large-area transparent electrodes without changing the conductivity of the transparent silver nanowire electrodes themselves, thereby effectively improving the overall performance of the product.

[0220] Example 10, please refer to Figure 11 The manufacturing method of a flexible thin-film solar cell module provided in this embodiment is similar to that of embodiment 1, except that:

[0221] The silver nanowire electrode formed in step S1 covers the entire front surface of the PI film.

[0222] In step S3, a silver wire electrode (ie, a fourth electrode) is fabricated on the surface of the silver nanowire electrode by screen printing or other methods. The structure of the fourth electrode may be the same as or similar to that of the second electrode.

[0223] In this embodiment, the order of step S3 and step S2 can be reversed, that is, the fourth electrode is formed first, and then a through hole is formed continuously penetrating the fourth electrode and the PI film, and then steps S4 to S6 are performed.

[0224] Example 11, please refer to Figure 12 The manufacturing method of a flexible thin-film solar cell module provided in this embodiment is similar to that of embodiment 1, except that:

[0225] The silver nanowire electrode formed in step S1 covers the entire front surface of the PI film.

[0226] In step S3, two silver wire electrodes 18 and 19 (i.e., the fourth electrode and the fifth electrode) are respectively made on the surface of the silver nanowire electrode and the back of the PI film by screen printing or other methods. The structures of the fourth electrode and the fifth electrode can be the same or similar to the second electrode and the third electrode mentioned above.

[0227] In this embodiment, the order of step S3 and step S2 can also be reversed, that is, the fourth electrode and the fifth electrode are formed first, and then a through hole is made that continuously penetrates the fourth electrode, the PI film, and the fifth electrode, and then the operations of steps S4-S6 are performed.

[0228] Example 12, please refer to Figure 13 The manufacturing method of a flexible thin-film solar cell module provided in this embodiment is similar to that of embodiment 7, except that:

[0229] In step S3, a silver wire electrode (also defined as a fourth electrode) is produced on the surface of the silver nanowire electrode by screen printing or other methods. The silver wire electrode may have a structure similar to the second electrode in Example 1, but the inner edge of the silver wire electrode is superimposed on the silver nanowire electrode.

[0230] In this embodiment, the order of step S3 and step S2 can also be reversed, that is, the fourth electrode is formed first, and then a through hole is formed continuously penetrating the fourth electrode and the PI film, and then steps S4 to S6 are performed.

[0231] Example 13 The method for manufacturing a flexible thin-film solar cell module provided in this example is similar to that of Example 11, except that:

[0232] In step S3, the fourth electrode 18 and the fifth electrode 19 are first formed on the surface of the silver nanowire electrode 12' and the back of the PI film, respectively. Then, a through hole is formed that continuously penetrates the fourth electrode, the PI film, and the fifth electrode. Then, a functional layer 300' is formed on the surface of the silver nanowire electrode. The functional layer 300' completely covers the fourth electrode 18 and the silver nanowire electrode 12'. Then, the operations of steps S4-S6 are performed. The structure of a flexible thin-film solar cell module formed in this embodiment is as follows. Figure 14 shown.

[0233] In addition, those skilled in the art may also refer to Examples 1-13 and combine them with other conventional operations in the art to manufacture flexible thin film light emitting diode components and flexible thin film photodetector components.

[0234] It should be understood that the embodiments described above are some, rather than all, embodiments of the present invention. The detailed description of the embodiments of the present invention is not intended to limit the scope of the invention as claimed, but rather merely represents selected embodiments of the present invention. All other embodiments derived by persons of ordinary skill in the art based on the embodiments of the present invention without creative effort are also within the scope of protection of the present invention.

Claims

1. A flexible optoelectronic device assembly, comprising at least two optoelectronic device units, wherein one of the optoelectronic device units comprises a bottom electrode (100), a functional layer (300), and a top electrode (500) sequentially arranged along a set direction; characterized in that: The bottom electrode (100) comprises a light-transmitting insulating substrate (11), a first electrode (12) and a second electrode (13) arranged on the first surface (111) of the light-transmitting insulating substrate, and a third electrode (14) arranged on the second surface (112) of the light-transmitting insulating substrate, wherein the first surface (111) and the second surface (112) are arranged opposite to each other; the first electrode (12) is a transparent electrode, and the second electrode (13) is a conductive line with an equivalent square resistance of ≤5Ω / sq and a width of ≤5mm; the second electrode (13) is arranged to surround or semi-surround the first electrode (12). and is in electrical contact with the first electrode (12), and the second electrode (13) and the first electrode (12) do not overlap each other; the second electrode (13) and the third electrode (14) are electrically connected via a conductive path (15), the conductive path comprising a through hole (113) penetrating the light-transmitting insulating substrate in a thickness direction and a conductor disposed in the through hole, and the third electrode (14) in one photoelectric device unit is electrically connected to the top electrode (500) or the first electrode (12) in another photoelectric device unit, thereby connecting the two photoelectric device units in series or in parallel; The through hole continuously penetrates the light-transmitting insulating substrate and the second electrode (13) and the third electrode (14) along a set direction; The second electrode (13) and the third electrode (14) are also provided with windows that match the through hole (113), so that the conductive paste or metal used to form the conductor can be filled into the through hole (113) through the windows.

2. The flexible optoelectronic device assembly according to claim 1, characterized in that: The width of the conductive line is ≤1 mm.

3. The flexible optoelectronic device assembly according to claim 1, characterized in that: Compared with the first electrode (12), the protrusion height of the highest point of the second electrode (13) is less than 5 μm.

4. The flexible optoelectronic device assembly according to claim 3, characterized in that: Compared with the first electrode (12), the protrusion height of the highest point of the second electrode (13) is less than 1 μm.

5. The flexible optoelectronic device assembly according to claim 1, characterized in that: The equivalent sheet resistance of the conductive line is ≤1Ω / sq.

6. The flexible optoelectronic device assembly according to claim 1, characterized in that: The conductor is formed by a conductive paste filled in the through hole or a metal deposited in the through hole, and the conductive paste includes silver paste or conductive glue.

7. The flexible optoelectronic device assembly according to any one of claims 1 to 6, characterized in that: The flexible optoelectronic device assembly includes a flexible thin film light emitting diode, a flexible thin film photovoltaic cell or a flexible thin film photodetector.

8. The flexible optoelectronic device assembly according to any one of claims 1 to 6, characterized in that: The second surface of the light-transmitting insulating substrate in one of the photoelectric device units is also connected to the top electrode or the bottom electrode in another photoelectric device unit through a conductive adhesive layer.

9. A method for manufacturing a flexible optoelectronic device assembly according to any one of claims 1 to 8, comprising: respectively manufacturing at least two optoelectronic device units, Arranging the at least two photovoltaic device units in series and / or in parallel; The method for manufacturing the photoelectric device unit comprises the steps of sequentially manufacturing a bottom electrode, a functional layer, and a top electrode on a first surface of a light-transmitting insulating substrate (11); It is characterized in that the steps of manufacturing the bottom electrode specifically include: At least one through hole (113) is machined on the light-transmitting insulating substrate (11) in areas corresponding to the second electrode (13) and the third electrode (14), penetrating the light-transmitting insulating substrate in a thickness direction; A first electrode (12) and a second electrode (13) are arranged on the first surface (111) of the light-transmitting insulating substrate, and the second electrode (13) is arranged to surround or semi-surround the first electrode (12), and the second electrode (13) and the first electrode (12) are electrically in contact with each other but do not overlap each other, wherein the first electrode (12) is a transparent electrode, and the second electrode (13) is a conductive line with an equivalent square resistance of ≤5Ω / sq and a width of ≤5mm; A third electrode (14) is provided on a second surface (112) of the light-transmitting insulating substrate opposite to the first surface; forming windows on the second electrode (13) and the third electrode (14) to match the through hole (113); A conductive paste is applied or a metal is deposited at the window of the second electrode (13) and / or the third electrode (14), and at least a portion of the conductive paste or metal is filled into the through hole to form a conductor, thereby forming a conductive channel (15) that passes through the light-transmitting insulating substrate, and the second electrode (13) and the third electrode (14) are electrically connected through the conductive channel (15).

10. The manufacturing method according to claim 9, characterized in that: Specifically include: Placing the manufactured optoelectronic device unit into the positioning template; Applying conductive paste or depositing metal at the windows of the second electrode (13) and / or the third electrode (14) of the photoelectric device unit, and allowing part of the conductive paste or metal to fill the corresponding through-hole (113) to form the conductive channel (15); The photoelectric device unit is bonded to another photoelectric device unit using the conductive paste remaining on the second electrode (13) and / or the third electrode (14), and the third electrode (14) in the photoelectric device unit is electrically connected to the top electrode (500) or the first electrode (12) in the other photoelectric device unit through the conductive paste.

11. The production method according to any one of claims 9 to 10, characterized in that: Also includes: The second surface (112) of the light-transmitting insulating substrate (11) in one of the photoelectric device units is connected to the top electrode or the bottom electrode in another photoelectric device unit through a conductive adhesive layer.

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