Power supply module and electronic equipment

Abstract

The present invention provides a power supply module and an electronic device. The power supply module includes: a busbar mounted on a first side surface of a first printed circuit board (PCB); an input pin header mounted on a second side surface of the first PCB board, wherein the output end of the input pin header is connected to a mainboard of the electronic device to be powered by plugging; and a voltage conversion module mounted on a second PCB board, wherein the second PCB board is mounted on the first side surface of the first PCB board. Thus, since the output end of the input pin header is connected to the mainboard of the electronic device to be powered by plugging, the power supply module is equivalent to being connected to the mainboard by plugging. When the power supply module fails, the power supply module can be conveniently removed, thereby improving maintenance efficiency and thus improving the working efficiency of the electronic device.

Description

Technical Field

[0001] The present invention relates to the technical field of liquid cooling and heat dissipation power supply, and in particular to a power supply module and electronic equipment. Background Art

[0002] Currently, the heat dissipation power consumption of information technology equipment is increasing. The traditional air cooling mode has great limitations on the power density of information technology equipment. Liquid cooling technology is becoming more and more popular in the market due to its powerful heat dissipation capacity.

[0003] Liquid cooling technologies include cold plate cooling and immersion cooling. Immersion cooling supports a much higher power density than cold plate cooling. However, in immersion cooling mode, if the connection between the power supply module and the electronic device to be powered does not meet the airtightness requirements, coolant can easily enter the power supply module, causing damage.

[0004] In the prior art, since the power supply module is welded to the electronic device to be powered, when the power supply module is damaged, it is very difficult to disassemble, resulting in reduced maintenance efficiency, which in turn affects the working efficiency of the electronic device. Summary of the Invention

[0005] In response to the problems existing in the prior art, an embodiment of the present invention provides a power supply module and a server module, which are used to solve the technical problem in the prior art that if the power supply module fails, it is difficult to remove it from the power supply equipment, resulting in the inability to repair it in time, affecting the working efficiency of the power supply equipment.

[0006] The present invention provides a power supply module, comprising:

[0007] A busbar is mounted on a first side of a first printed circuit board (PCB);

[0008] An input pin header is mounted on the second side surface of the first PCB board, and an input end of the input pin header is connected to the mainboard of the electronic device to be powered by plugging;

[0009] The voltage conversion module is mounted on a second PCB board, and the second PCB board is mounted on the first side surface of the first PCB board.

[0010] In the above solution, the busbar includes: a first side and a second side, and the first side and the second side form an L-shaped structure.

[0011] In the above solution, the first side of the busbar is mounted on the first side surface of the first PCB board;

[0012] A mounting hole is reserved on the second side, and the second side is mounted on the mainboard of the electronic device to be powered by screw connection.

[0013] In the above solution, the input end of the input pin header is connected to the high-voltage DC port of the mainboard of the electronic device to be powered.

[0014] In the above solution, the voltage conversion module includes:

[0015] A main control chip is mounted on the first PCB board;

[0016] A power inductor is mounted on the first PCB board;

[0017] A field effect transistor is mounted on the first PCB board;

[0018] The resistor is mounted on the first PCB board.

[0019] In the above solution, the power supply module further includes:

[0020] The fuse is mounted on the second side surface of the second PCB board.

[0021] In the above solution, the power supply module further includes:

[0022] The filter capacitor is mounted on the first side surface of the second PCB board.

[0023] In the above solution, protective coating is applied on the exposed solder joints of the power supply module.

[0024] The present invention further provides an electronic device, comprising:

[0025] case;

[0026] a mainboard, the mainboard being located inside the housing;

[0027] A power supply module as described above is connected to the mainboard.

[0028] In the above solution, when there are multiple power supply modules, the multiple power supply modules are installed in parallel at preset positions on the mainboard.

[0029] The present invention provides a power supply module and an electronic device. The power supply module includes: a busbar mounted on a first side surface of a first printed circuit board (PCB); an input pin header mounted on a second side surface of the first PCB board, wherein the output end of the input pin header is connected to a mainboard of the electronic device to be powered by plugging; and a voltage conversion module mounted on a second PCB board, wherein the second PCB board is mounted on the first side surface of the first PCB board. Thus, since the output end of the input pin header is connected to the mainboard of the electronic device to be powered by plugging, the power supply module is equivalent to being connected to the mainboard by plugging. When the power supply module fails, the power supply module can be conveniently removed, thereby improving maintenance efficiency and thus improving the working efficiency of the electronic device. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] Various other advantages and benefits will become apparent to those skilled in the art upon reading the detailed description of the preferred embodiment below. The accompanying drawings are for illustration purposes only and are not to be considered as limiting the present invention. The same reference symbols are used throughout the drawings to represent the same components. In the drawings:

[0031] Figure 1 A schematic diagram of the overall structure of a power supply module provided in an embodiment of the present invention;

[0032] Figure 2 Another structural schematic diagram of a power supply module provided in an embodiment of the present invention;

[0033] Figure 3 A schematic diagram of the overall structure of an electronic device provided by an embodiment of the present invention;

[0034] Figure 4 This is a schematic diagram of an enlarged partial structure of an electronic device provided by an embodiment of the present invention.

[0035] Description of reference numerals:

[0036] 11-bus; 12-first PCB board; 13-input pin header; 14-second PCB board; 15-main control chip; 16-power inductor; 17-field effect transistor; 18-fuse; 19-filter capacitor; 31-housing; 32-mainboard; 33-power supply module. DETAILED DESCRIPTION

[0037] Exemplary embodiments of the present disclosure will be described in more detail below with reference to the accompanying drawings. Although exemplary embodiments of the present disclosure are shown in the accompanying drawings, it should be understood that the present disclosure can be implemented in various forms and should not be limited by the embodiments set forth herein. Rather, these embodiments are provided to enable a more thorough understanding of the present disclosure and to fully convey the scope of the present disclosure to those skilled in the art.

[0038] An embodiment of the present invention provides a power supply module, such as Figure 1 and Figure 2 As shown, the power supply module includes:

[0039] The busbar 11 is mounted on a first side surface of a first printed circuit board PCB 12;

[0040] The input pin header 13 is mounted on the second side surface of the first PCB board 12, and the input end of the input pin header 13 is connected to the mainboard of the electronic device to be powered by plugging;

[0041] The voltage conversion module is mounted on the second PCB board 14. The second PCB board 14 is mounted on the first side surface of the first PCB board 12. The first PCB board 12 and the second PCB board 14 are electrically connected.

[0042] The power supply module in this embodiment draws high-voltage power (380V DC) from the motherboard of the electronic device to be powered. The voltage conversion module on the power supply module then converts the 380V DC power into a low-voltage DC12V power supply. This low-voltage power is then delivered to the electronic device to power components (such as the CPU) that require low-voltage power. The electronic device to be powered can include servers and other devices.

[0043] Specifically, the second PCB board of this embodiment is mainly installed with a voltage conversion module for converting high voltage electricity into low voltage electricity. The first PCB board 12 is equivalent to an adapter board, which is mainly used to allow the second PCB board 14 to be vertically plugged into the main board of the electronic device, thereby saving installation space.

[0044] The input end of the input pin 13 is connected to the high-voltage DC port of the mainboard of the electronic device to be powered by plugging. After the high-voltage electricity is converted into low-voltage electricity by the voltage conversion module, it is output through the bus 11.

[0045] The voltage conversion module mainly includes:

[0046] The main control chip 15 is mounted on the second PCB board 14;

[0047] A power inductor 16 is mounted on the second PCB board 14;

[0048] Field effect transistor 17, mounted on the second PCB board 14;

[0049] The resistor is mounted on the first PCB 12 .

[0050] A fuse 18 is mounted on the second side of the first PCB board 12 and is used to protect the entire power supply module in the event of a short circuit;

[0051] The filter capacitor 19 is mounted on the first side surface of the first PCB board 12 and is used to filter the current.

[0052] Furthermore, the busbar 11 of this embodiment includes a first side and a second side, and the first side and the second side form an L-shaped structure.

[0053] The first side of the busbar (the long side of L) is mounted on the first side of the first PCB board 12; the second side (the short side of L) is reserved with a mounting hole, and the second side is mounted on the mainboard of the electronic device to be powered by screws.

[0054] Compared with the existing method of using gold fingers to connect the power supply module to the motherboard, since the coolant in the confined space is under high pressure, it is easier for the coolant to flow out from the gap of the gold finger connection. This method of connection by screws can not only improve the stability of the connection between the power supply module and the bottom plate of the electronic device, but also reduce the gap at the connection and improve the airtightness.

[0055] In practice, the power supply module is enclosed and immersed in an insulating coolant, typically an electronic fluoride liquid. This insulating material is completely non-conductive and has excellent thermal conductivity. Therefore, the power supply module itself needs to be sealed. Sealing solutions include encapsulation, gluing, and conformal coating. Encapsulation involves soldering the electronic components of the power supply module to their corresponding positions on the PCB. This typically involves both direct-insert soldering and surface-mount soldering.

[0056] Furthermore, since the voltage conversion module is a PCB circuit module, the exposed solder joints of the power supply module need to be coated with a protective coating. Specifically, the exposed solder joints of the high-voltage electronic components of the voltage conversion module are coated with conformal coating to prevent arcing.

[0057] Finally, during the long-term use of the power supply module, insulating glue is applied to the roots of components that are easy to fall off or break for reinforcement.

[0058] It's worth noting that this embodiment incorporates a high-voltage DC power supply solution, utilizing input pin headers to directly direct the high-voltage DC power to the voltage conversion module for conversion. This improves current transmission efficiency, increases transmission power, and thus increases the overall power density of the electronic device. Furthermore, this embodiment utilizes input pin headers and a busbar to eliminate power cable connections, further increasing power density.

[0059] Based on the same inventive concept, this embodiment also provides an electronic device, such as Figure 3 As shown, the electronic equipment includes:

[0060] Housing 31;

[0061] Mainboard 32, said mainboard 3 is located inside the housing 31;

[0062] The power supply module 33 is connected to the mainboard 32 .

[0063] The specific structure of the power supply module 33 and the connection method with the mainboard 32 have been described in detail above and will not be repeated here.

[0064] In this embodiment, Figure 3It can be seen that the number of power supply modules 33 can be determined according to actual power supply requirements. When there are multiple power supply modules 33 , the multiple power supply modules 33 are installed in parallel at preset positions on the mainboard 32 .

[0065] It can be seen that the power supply module 33 of this embodiment can be vertically plugged into the mainboard 32, thereby reducing the occupied space.

[0066] The power supply module and electronic device provided by the embodiments of the present invention can bring at least the following beneficial effects:

[0067] An embodiment of the present invention provides a power supply module and an electronic device. The power supply module includes: a busbar mounted on a first side surface of a first printed circuit board (PCB); an input pin header mounted on a second side surface of the first PCB, wherein the output end of the input pin header is connected to the mainboard of the electronic device to be powered by plugging; and a voltage conversion module mounted on a second PCB, wherein the second PCB is mounted on the first side surface of the first PCB. Thus, since the output end of the input pin header is connected to the mainboard of the electronic device to be powered by plugging, the power supply module is equivalent to being connected to the mainboard by plugging. When the power supply module fails, the power supply module can be easily removed, improving maintenance efficiency and thus improving the operating efficiency of the electronic device. Furthermore, compared to the prior art method of connecting the power supply module to the mainboard using gold fingers, since the coolant in the enclosed space is more likely to flow out through the gaps in the gold finger connection when it is under high pressure, this screw connection method can not only improve the stability of the connection between the power supply module and the bottom plate of the electronic device, but also reduce the gaps at the connection, thereby improving the airtightness.

[0068] The above description is only a preferred embodiment of the present invention and is not intended to limit the scope of protection of the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. A power supply module, characterized in that: The power supply module includes: A busbar is mounted on a first side of a first printed circuit board (PCB); An input pin header is mounted on the second side surface of the first PCB board, and an input end of the input pin header is connected to the mainboard of the electronic device to be powered by plugging; The voltage conversion module is mounted on a second PCB board, which is mounted on a first side surface of the first PCB board. The first PCB board is configured as an adapter board for vertically plugging the second PCB board into a mainboard of an electronic device, thereby saving installation space. The busbar comprises: a first side and a second side, wherein the first side and the second side form an L-shaped structure; The first side of the busbar is mounted on the first side of the first PCB board; The second side is provided with a mounting hole, and the second side is mounted on the mainboard of the electronic device to be powered by screw connection, so as to reduce the gap at the connection and improve the airtightness; The input end of the input pin header is connected to the high-voltage DC port of the mainboard of the electronic device to be powered; The voltage conversion module includes: A main control chip is mounted on the second PCB board; A power inductor is mounted on the second PCB board; A field effect transistor is mounted on the second PCB board; The power supply module further includes: a fuse, mounted on the second side surface of the first PCB; A filter capacitor is mounted on the first side of the first PCB board; Protective coating is applied on the exposed solder joints of the power supply module.

2. An electronic device, characterized in that: The electronic device comprises: case; a mainboard, the mainboard being located inside the housing; The power supply module as described in claim 1 is connected to the mainboard.

3. The electronic device according to claim 2, wherein: When there are multiple power supply modules, the multiple power supply modules are installed in parallel at preset positions on the mainboard.

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