Substrate transport device, substrate transport method, and substrate processing system

Abstract

The present disclosure provides a substrate transport device, a substrate transport method, and a substrate processing system. The substrate transport device comprises: a transport unit having a substrate holding portion for holding a substrate, a base having a plurality of magnets inside for moving the substrate holding portion, and a connecting rod component connecting the substrate holding portion and the base; and a planar motor having a main body, a plurality of electromagnetic coils arranged inside the main body, and a linear drive component for supplying power to the electromagnetic coils to cause the base to be magnetically suspended and to linearly drive the base. The base comprises a first member and a second member rotatably arranged inside the first member, magnets being arranged inside the first member and the second member, a connecting rod component rotatably connected to the second member, and a linear drive component for rotating the second member relative to the first member to extend and retract the substrate holding portion via the connecting rod component.

Description

Technical Field

[0001] The present disclosure relates to a substrate transporting device, a substrate transporting method, and a substrate processing system. Background Art

[0002] For example, in semiconductor manufacturing processes, when processing semiconductor wafers as substrates, a substrate processing system including a plurality of processing chambers, a vacuum transfer chamber connected to the processing chambers, and a substrate transfer device installed in the vacuum transfer chamber is used.

[0003] As such a substrate transport device, a transport robot having a multi-jointed arm structure has been conventionally used (for example, Patent Document 1).

[0004] In addition, as a technology that can solve the problems of gas intrusion from vacuum seals and the problem of limited rotation and telescopic movement of the transport robot in the technology using a transport robot, a substrate transport device using a planar motor utilizing magnetic levitation has been proposed (for example, Patent Document 2).

[0005] Prior art literature

[0006] Patent Literature

[0007] Patent Document 1: Japanese Patent Application Laid-Open No. 2017-168866

[0008] Patent Document 2: Japanese Patent Application No. 2018-504784 Summary of the Invention

[0009] Problems to be solved by the invention

[0010] The present disclosure provides a substrate transporting device, a substrate transporting method, and a substrate processing system capable of reducing the occupied area of ​​a transport unit including a substrate holding portion in transporting a substrate using a planar motor.

[0011] Solutions for solving problems

[0012] The substrate conveying device involved in one embodiment of the present invention is a device for conveying a substrate to a substrate conveying position, wherein the substrate conveying device comprises: a conveying unit, which has a substrate holding part for holding the substrate, a base having a plurality of magnets inside for moving the substrate holding part, and a connecting rod component connecting the substrate holding part and the base; and a planar motor, which has a main body, a plurality of electromagnetic coils arranged in the main body, and a linear drive part for supplying power to the electromagnetic coils to make the base magnetically levitated and linearly drive the base, wherein the base has a first member and a second member rotatably arranged in the first member, the magnets are arranged inside the first member and the second member, the connecting rod component is rotatably connected to the second member, and the linear drive part is used to rotate the second member relative to the first member to extend and retract the substrate holding part via the connecting rod component.

[0013] Effects of the Invention

[0014] According to the present disclosure, a substrate transporting apparatus, a substrate transporting method, and a substrate processing system are provided, which are capable of reducing the occupied area of ​​a transport unit including a substrate holding portion in transporting a substrate using a planar motor. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a schematic plan view showing an example of a substrate processing system.

[0016] Figure 2 It is a partial cross-sectional side view for explaining the transfer unit and the planar motor of the substrate transfer device.

[0017] Figure 3 This is a perspective diagram used to explain the driving principle of a planar motor.

[0018] Figure 4 It is a diagram for explaining the rotation of the second member relative to the first member in the base.

[0019] Figure 5 It is a plan view showing a state where the transport unit is retracted.

[0020] Figure 6 It is a side view showing a state where the transport unit is extended.

[0021] Figure 7 It is a plan view showing a state where the transport unit is extended.

[0022] Figure 8 It is a diagram for explaining the extension operation of the end effector.

[0023] Figure 9It is a diagram for explaining the extension operation of the end effector when a guide member is provided.

[0024] Figure 10 It is a schematic plan view showing another example of a substrate processing system.

[0025] Figure 11 It is a plan view showing another example of the transport unit.

[0026] Figure 12 It is a plan view showing still another example of the transport unit. DETAILED DESCRIPTION

[0027] Hereinafter, embodiments will be described with reference to the accompanying drawings.

[0028] <Example of a Substrate Processing System>

[0029] Figure 1 It is a schematic plan view showing an example of a substrate processing system.

[0030] The substrate processing system 100 of this embodiment is used to continuously process multiple substrates. The substrate processing is not particularly limited, and examples thereof include film formation, etching, ashing, and cleaning. While the substrate is not particularly limited, the following description uses a semiconductor wafer (hereinafter referred to as a wafer) as an example.

[0031] like Figure 1 As shown, the substrate processing system 100 is a cluster structure (multi-chamber type) system including a plurality of processing apparatuses 110 , a vacuum transfer chamber 120 , a load lock chamber 130 , an atmospheric transfer chamber 140 , a substrate transfer apparatus 150 , and a control unit 160 .

[0032] The planar shape of the vacuum transfer chamber 120 is rectangular. The interior of the vacuum transfer chamber 120 is decompressed to a vacuum atmosphere. The multiple processing chambers 110 are connected to the opposite walls of the long side of the vacuum transfer chamber 120 via gate valves G. In addition, a load lock chamber 130 is connected to a wall of a short side of the vacuum transfer chamber 120 via gate valve G1. The atmospheric transfer chamber 140 is connected to the side of the load lock chamber 130 opposite to the vacuum transfer chamber 120 via gate valve G2. Figure 1 In FIG, the arrangement direction of the processing chamber 110 is the X direction, and the direction perpendicular to the X direction is the Y direction. Figure 1 , although the case where there is one load lock chamber 130 is shown, there may be a plurality of load lock chambers 130 .

[0033] A substrate transfer apparatus 150 within the vacuum transfer chamber 120 transfers wafers W, serving as substrates, to and from the processing chamber 110 and the load-lock chamber 130. The substrate transfer apparatus 150 includes a transfer unit 20 having an end effector 50 as a wafer holding portion that actually holds the wafers W. Details of the substrate transfer apparatus 150 will be described later.

[0034] By opening the gate valve G, the processing chamber 110 and the vacuum transfer chamber 120 are connected, allowing the substrate transfer device 150 to transfer wafers W between the processing chamber 110 and the vacuum transfer chamber 120. By closing the gate valve G, the processing chamber 110 and the vacuum transfer chamber 120 are isolated from each other. Furthermore, by opening the gate valve G1, the load lock chamber 130 and the vacuum transfer chamber 120 are connected, allowing the substrate transfer device 150 to transfer wafers W between the load lock chamber 130 and the vacuum transfer chamber 120. By closing the gate valve G1, the load lock chamber 130 and the vacuum transfer chamber 120 are isolated from each other.

[0035] The processing chamber 110 includes a mounting table 111 for mounting a wafer W. The processing chamber 110 performs desired processing (film formation, etching, ashing, cleaning, etc.) on the wafer W mounted on the mounting table 111 while the interior of the processing chamber 110 is decompressed to a vacuum atmosphere.

[0036] The load lock chamber 130 includes a mounting table 131 for mounting the wafer W. When the wafer W is transferred between the atmospheric transfer chamber 140 and the vacuum transfer chamber 120 , the pressure of the load lock chamber 130 is controlled between atmospheric pressure and vacuum.

[0037] Atmospheric transfer chamber 140 maintains an atmospheric atmosphere, for example, by forming a downflow of clean air. Furthermore, a loading port (not shown) is provided on a wall surface of atmospheric transfer chamber 140. The loading port is configured to receive a carrier (not shown) containing wafers W or an empty carrier. For example, a FOUP (Front Opening Unified Pod) can be used as the carrier.

[0038] Furthermore, an atmospheric transfer device (not shown) for transferring wafers W is provided within the atmospheric transfer chamber 140. The atmospheric transfer device removes wafers W received in a load port (not shown) and places them on the loading platform 131 of the load lock chamber 130, or removes wafers W placed on the loading platform 131 of the load lock chamber 130 and places them in the load port. Opening gate valve G2 establishes communication between the load lock chamber 130 and the atmospheric transfer chamber 140, enabling the atmospheric transfer device to transfer wafers W between the load lock chamber 130 and the atmospheric transfer chamber 140. Closing gate valve G2 isolates the load lock chamber 130 from the atmospheric transfer chamber 140.

[0039] The control unit 160 is composed of a computer and includes an input device, an output device, a display device, a storage device (storage medium), and a main control unit with a CPU. The main control unit is used to control the operation of each component of the substrate processing system 100. For example, it controls the processing of wafers W in each processing chamber 110, the transportation of wafers W by the substrate transport device 150, and the opening and closing of gate valves G, G1, and G2. The main control unit controls each component based on a processing recipe, which is a control program stored in a storage medium (hard disk, optical disk, semiconductor memory, etc.) built into the storage device.

[0040] Next, an example of the operation of the substrate processing system 100 will be described. Here, as an example of the operation of the substrate processing system 100, the following operation is described: after processing a wafer W housed in a carrier mounted on a load port in the processing chamber 110, the wafer W is placed on an empty carrier mounted on the load port. Furthermore, the following operation is executed based on a processing recipe controlled by the control unit 160.

[0041] First, the atmospheric transfer device (not shown) in the atmospheric transfer chamber 140 removes the wafer W from the carrier connected to the load port, and opens the gate valve G2 to move the wafer W into the load lock chamber 130 in the atmospheric atmosphere. Then, after closing the gate valve G2, the load lock chamber 130 into which the wafer W has been moved is set to a vacuum state corresponding to the vacuum transfer chamber 120. Next, the corresponding gate valve G1 is opened, and the end effector 50 of the transfer unit 20 removes the wafer W from the load lock chamber 130, and then the gate valve G1 is closed. Next, after opening the gate valve G corresponding to any processing chamber 110, the end effector 50 moves the wafer W into the processing chamber 110 and places it on the mounting table 111. Then, the end effector 50 is retracted from the processing chamber 110, and after closing the gate valve G, film formation processing and other processes are performed in the processing chamber 110.

[0042] After processing in the processing chamber 110 is completed, the corresponding gate valve G is opened, and the end effector 50 of the transfer unit 20 removes the wafer W from the processing chamber 110. Then, after the gate valve G is closed, the gate valve G1 is opened to transfer the wafer W held by the end effector 50 to the load lock chamber 130. After that, the gate valve G1 is closed, and after the load lock chamber 130 with the wafer W is brought into the atmospheric atmosphere, the gate valve G2 is opened, and the atmospheric transfer device (not shown) removes the wafer W from the load lock chamber 130 and stores the wafer W in the carrier of the load port (both not shown).

[0043] The above-mentioned processes are performed on a plurality of wafers W simultaneously and in parallel, and all wafers W in the carrier are processed.

[0044] Furthermore, the above description describes a case of parallel transport in which the substrate transport device 150 transports a wafer W to any one processing chamber 110, and while the wafer W is being processed in the processing chamber 110, other wafers W are transported to other processing chambers 110. However, the present invention is not limited to parallel transport. For example, serial transport in which one wafer W is sequentially transported to a plurality of processing chambers 110 is also possible.

[0045] <An example of a substrate transfer device>

[0046] Next, in addition to the above Figure 1 In addition, based on Figures 2 to 7 An example of a substrate transport device will be described in detail. Figure 2 This is a partial cross-sectional side view for explaining the transport unit and planar motor of the substrate transport device. Figure 3 This is a three-dimensional diagram used to illustrate the driving principle of the planar motor. Figure 4 is a diagram for explaining the rotation of the second member relative to the first member in the base. Figure 5 is a top view showing the state where the transport unit is retracted. Figure 6 is a side view showing the state where the transport unit is extended. Figure 7 It is a plan view showing a state where the transport unit is extended.

[0047] like Figure 1 、 Figure 2 As shown, the substrate transfer device 150 includes a planar motor (linear unit) 10 and a transfer unit 20 .

[0048] The planar motor (linear unit) 10 linearly drives the transport unit 20. The planar motor (linear unit) 10 includes a main body 11 formed by the bottom wall 121 of the vacuum transport chamber 120, a plurality of electromagnetic coils 12 disposed throughout the main body 11, and a linear drive unit 13 that linearly drives the transport unit 20 by supplying power to the electromagnetic coils 12 individually. The linear drive unit 13 is controlled by a control unit 160. Supplying current to the electromagnetic coils 12 generates a magnetic field.

[0049] The transport unit 20 includes two bases 31 and 32, link members 41 and 42, and the aforementioned end effector 50. The base 31 includes a first member 33 and a cylindrical second member 34 rotatably disposed within the first member 33. Similarly, the base 32 includes a first member 35 and a cylindrical second member 36 rotatably disposed within the first member 35. While three transport units 20 are depicted in the drawings, the number of transport units 20 may be one or more.

[0050] The bases 31 and 32 are configured to have a plurality of permanent magnets arranged therein, and to move the end effector 50 via the link members 41 and 42. Specifically, a plurality of permanent magnets 37 are arranged on the first members 33 and 35 of the bases 31 and 32, and a plurality of permanent magnets 38 are arranged on the second members 34 and 36.

[0051] Furthermore, the current supplied to the electromagnetic coil 12 of the planar motor (linear unit) 10 is directed in such a way that the generated magnetic field repels the permanent magnets 37 and 38, thereby magnetically levitating the bases 31 and 32 from the surface of the main body 11. By stopping the current supplied to the electromagnetic coil 12, the bases 31 and 32 cease levitation and are placed on the floor of the vacuum transfer chamber 120, i.e., on the surface of the main body 11 of the planar motor 10.

[0052] In addition, by individually controlling the current supplied from the linear drive unit 13 to the electromagnetic coil 12, the bases 31 and 32 can be moved (rotated) in the X direction, Y direction, or θ direction along the surface of the main body 11 of the planar motor 10 while the bases 31 and 32 are in magnetic levitation, thereby controlling the position of the bases 31 and 32. In addition, the amount of levitation can also be controlled by controlling the current. In addition, by individually controlling the current supplied from the linear drive unit 13 to the electromagnetic coil 12, for example, Figure 4 (a) to the state Figure 4 The second members 34 and 36 are rotated relative to the first members 33 and 35 as in the state (b).

[0053] The link members 41 and 42 are connected to the second members 34 and 36 via rotation shafts 43 and 44, respectively, and the link members 41 and 42 rotate in accordance with the rotation of the second members 34 and 36. Thus, the end effector 50 can be extended and retracted relative to the bases 31 and 32.

[0054] Figure 2 and Figure 5 The end effector 50 is in a retracted state, and the end effector 50 and the link members 41, 42 are folded and overlapped on the bases 31, 32. Furthermore, in this state, when viewed from above, the bases 31, 32 and the link members 41, 42 are included in the region where the wafer W is located on the end effector 50. This retracted state is maintained while the transfer unit 20 moves within the vacuum transfer chamber 120.

[0055] Figure 6 and Figure 7The end effector 50 and the link members 41 and 42 are extended from the bases 31 and 32. When the transfer unit 20 accesses the processing chamber 110, which is the wafer transfer position, by extending the end effector 50 and the link members 41 and 42 in this manner, the end effector 50 can access the processing chamber 110 to transfer the wafer W.

[0056] Next, the operation of the substrate transport device 150 configured as described above will be described.

[0057] In substrate transport device 150, control unit 160 controls the current supplied from linear drive unit 13 of planar motor (linear unit) 10 to electromagnetic coil 12 to generate a magnetic field that repels permanent magnets 37 and 38, thereby magnetically levitating bases 31 and 32. The amount of levitation at this time can be controlled by controlling the current.

[0058] In the magnetic levitation state, the current supplied from the linear drive unit 13 to the electromagnetic coil 12 is individually controlled, thereby enabling the bases 31 and 32 to move along the surface of the main body 11 of the planar motor 10 (the floor surface of the vacuum transfer chamber 120) to transport the wafer W on the end effector 50.

[0059] As described above, such substrate transport using a planar motor solves the problem of gas intrusion from the vacuum seal and the problem of limited rotation and telescopic movement of the transport robot in the technology using the transport robot.

[0060] In particular, the limitation of the rotation and telescopic movement of the transfer robot causes the overall installation area of ​​the substrate processing system to be large, making it difficult to reduce the cost of the clean room. However, the transfer technology using a planar motor can alleviate this problem.

[0061] Specifically, in a substrate processing system with multiple processing chambers, the loading position of the processing chamber is limited by the loading position of the transfer robot. Furthermore, the vacuum transfer chamber requires the area required for the rotation and extension of the robot arm, and multiple such vacuum transfer chambers are required. Consequently, the overall system installation area increases. In contrast, in substrate transfer systems using planar motors, as described in Patent Document 2, the loading position of the processing chamber is more flexible, and the area of ​​the vacuum transfer chamber can be reduced to some extent.

[0062] However, recently, there is a demand for a substrate processing system having a plurality of processing chambers to have a further reduced installation area.

[0063] Therefore, in this embodiment, the bases 31 and 32 of the transport unit 20 include first members 33 and 35 and second members 34 and 36 rotatable relative to the first members 33 and 35 . The second members 34 and 36 are connected to the end effector 50 via link members 41 and 42 .

[0064] Thus, the current supplied from the linear drive unit 13 to the electromagnetic coil 12 can be individually controlled to rotate the second members 34 and 36 relative to the first members 33 and 35 , thereby extending and retracting the end effector 50 via the link members 41 and 42 .

[0065] like Figure 2 and Figure 5 As shown, when the end effector 50 is retracted, the end effector 50 and the link members 41, 42 can be folded and overlapped on the bases 31, 32. In this state, the bases 31, 32 and the link members 41, 42 are included in the area where the wafer W is located on the end effector 50 when viewed from above, thereby minimizing the area occupied by the transfer unit 20.

[0066] Furthermore, in this state, the transfer unit 20 can be linearly driven to move within the vacuum transfer chamber 120 to transfer the wafer W, thereby reducing the space required for the transfer unit 20 to move within the vacuum transfer chamber 120. Therefore, the vacuum transfer chamber 120 can be further miniaturized, and the installation area of ​​the substrate processing system 100 itself can be further reduced.

[0067] When the wafer W is transferred from the transfer unit 20 to the processing chamber 110, which is the wafer transfer position, the movement of the bases 31 and 32 is stopped while the end effector 50 is facing the processing chamber 110. Then, the second members 34 and 36 are rotated relative to the first members 33 and 35, thereby Figure 6 and Figure 7 As shown, the end effector 50 and the link members 41 , 42 are extended from the bases 31 , 32 to allow the end effector 50 to access the processing chamber 110 .

[0068] Reference Figure 8 The extension operation of the end effector 50 at this time will be described. (a) shows the retracted state of the end effector 50. In a plan view, the bases 31 and 32 and the link members 41 and 42 are within the region where the wafer W is located on the end effector 50. The current supplied from the linear drive unit 13 to the electromagnetic coil 12 is individually controlled to move the first members 33 and 35 and the second members 34 and 36 of the bases 31 and 32. From this state, the bases 31 and 32 are rotated outward as shown in (b) and further as shown in (c), thereby causing the end effector 50 to move linearly. The bases 31 and 32 are then further rotated, causing the end effector 50 to move linearly, ultimately reaching a state where the end effector 50 and the link members 41 and 42 are extended from the bases 31 and 32, as shown in (d).

[0069] like Figure 9As shown in FIG. 1 , a guide member may be provided to stabilize the movement of the end effector 50. In this case, when the bases 31 and 32 are rotated outward from the retracted state of the end effector 50 in (a), and further rotated outward as shown in (b) and (c) to advance the end effector 50, the end effector 50 is guided by the guide member 60. The bases 31 and 32 are then further rotated to advance the end effector 50 along the guide member 60, and finally, as shown in (d), the end effector 50 and the link members 41 and 42 are extended from the bases 31 and 32.

[0070] As described above, in the substrate transfer apparatus 150 of this embodiment, the end effector 50 can be easily moved linearly simply by individually controlling the current supplied from the linear drive unit 13 to the electromagnetic coil 12 to move the first members 33, 35 and the second members 34, 36 of the bases 31, 32. Furthermore, the end effector 50 is extended toward the processing chamber 110 only when transferring a wafer W to or from the processing chamber 110. Therefore, the extension of the end effector 50 does not affect the installation area of ​​the vacuum transfer chamber 120 for the wafer W.

[0071] <Other Examples of Substrate Processing Systems>

[0072] Figure 10 It is a schematic plan view showing another example of a substrate processing system.

[0073] The substrate processing system 100 ′ of this embodiment is Figure 1 The substrate processing system 100 ′ is similar to the substrate processing system 100 and is used to continuously perform desired processing on a plurality of substrates. The basic structure of the substrate processing system 100 ′ is similar to that of the substrate processing system 100 , and thus the same components as those of the substrate processing system 100 are denoted by the same reference numerals and their description is omitted.

[0074] The substrate processing system 100 ′ of this embodiment is different from the substrate processing system 100 in that a buffer chamber 170 is provided at a position of the vacuum transfer chamber 120 facing the load lock chamber 130 .

[0075] By providing the buffer chamber 170 , when a plurality of transfer units 20 are provided, one of the transfer units 20 can be retracted into the buffer chamber 170 , thereby preventing interference between the transfer units 20 . This allows wafers W to be transferred more smoothly.

[0076] <Other Applications>

[0077] While the embodiments have been described above, the embodiments disclosed herein are illustrative in all respects and should not be construed as restrictive. The embodiments described above may be omitted, replaced, or modified in various ways without departing from the scope of the appended claims and their spirit.

[0078] For example, in the above embodiment, a conveying unit including the end effector 50, the two bases 31, 32, and the link members 41, 42 connecting them is used as the conveying unit 20 of the substrate conveying device, but the present invention is not limited thereto. Figure 11 In this way, the transport unit 20' may be provided with one base 30 and one link member 40. Figure 11 In the conveying unit 20', the base 30 also has a first member 30a for XY movement and a second member 30b for the end effector extension. In addition, a guide member 60 is provided for stably moving the end effector 50. Figure 12 As shown, a conveying unit 20 may be provided with articulated link members 45 and 46 having joints 47 and 48, respectively, instead of the link members 41 and 42. By using the articulated link members 45 and 46, a so-called frog-leg telescopic movement can be performed. In addition, a link mechanism that displaces in the horizontal direction and a link mechanism that changes in the height direction may be combined.

[0079] In addition, although a semiconductor wafer (wafer) is used as the substrate, the present invention is not limited to a semiconductor wafer and may be another substrate such as an FPD (Flat Panel Display) substrate or a ceramic substrate.

[0080] Description of Reference Numerals

[0081] 10: Planar motor; 11: Main body; 12: Electromagnetic coil; 13: Linear drive unit; 20, 20', 20": Transfer unit; 30, 31, 32: Base; 33, 35, 30a: First component; 34, 36, 30b: Second component; 37, 38: Permanent magnet; 41, 42, 45, 46: Link component; 50: End effector (substrate holding unit); 60: Guide component; 100, 100': Substrate processing system; 110: Processing chamber; 120: Vacuum transfer chamber; 130: Load lock chamber; 140: Atmospheric transfer chamber; 150: Substrate transfer device; 160: Control unit; 170: Buffer chamber; G, G1, G2: Gate valve; W: Semiconductor wafer (substrate).

Claims

1. A substrate transporting device for transporting a substrate to a substrate transporting position, the substrate transporting device comprising: a transport unit including a substrate holding portion for holding a substrate, a base portion having a plurality of magnets therein for moving the substrate holding portion, and a link member connecting the substrate holding portion and the base portion; and A planar motor includes a main body, a plurality of electromagnetic coils arranged in the main body, and a linear drive unit for supplying power to the electromagnetic coils to magnetically levitate the base and linearly drive the base. in, The base has a first member and a second member rotatably provided inside the first member, and the magnet is provided inside the first member and the second member. The link member is rotatably connected to the second member. The linear drive unit is used to rotate the second member relative to the first member to extend and retract the substrate holding portion via the link member. When the substrate holding portion retracts, the base, the link member, and the substrate holding portion are vertically overlapped, and the base is linearly driven in this state. When the substrate holding portion is caused to access the substrate transfer position, the substrate holding portion is extended from the base portion.

2. The substrate transport device according to claim 1, wherein: The substrate holding portion is configured such that, in a plan view, the base portion and the link member are included in a presence region of the substrate held by the substrate holding portion when the substrate holding portion is in a retracted state.

3. The substrate transport device according to claim 1 or 2, wherein: The transport unit includes two bases and two link members, and each link member connects the second member of each base to the substrate holding portion.

4. The substrate transport device according to claim 3, wherein: The connecting rod member has a joint and performs a frog-leg-like telescopic movement.

5. The substrate transporting device according to claim 1 or 2, wherein: The transport unit further includes a guide member for guiding the substrate holding portion.

6. The substrate transport device according to claim 1 or 2, wherein: The transfer unit is provided in a transfer chamber connected to a processing chamber for processing a substrate. The substrate transfer position is the processing chamber. The main body of the planar motor constitutes a bottom wall of the transfer chamber.

7. A substrate transport method for transporting a substrate to a substrate transport position, the substrate transport method using a substrate transport device comprising: a transport unit having a substrate holding portion for holding the substrate, a base having a plurality of magnets therein for moving the substrate holding portion, and a link member connecting the substrate holding portion and the base; and a planar motor having a main body, a plurality of electromagnetic coils arranged in the main body, and a linear drive unit for supplying power to the electromagnetic coils to magnetically levitate the base and linearly drive the base, wherein: The base includes a first member and a second member rotatably disposed within the first member, the magnets being disposed within the first and second members, the link member being rotatably connected to the second member, and the linear drive unit being capable of rotating the second member relative to the first member. The substrate transport method includes: retracting the substrate holding portion holding the substrate, and linearly driving the base portion in a state where the base portion, the link member, and the substrate holding portion are vertically overlapped to transport the substrate; as well as When the substrate is transported to a position corresponding to the substrate transport position, the linear drive unit rotates the second member relative to the first member to extend the substrate holding portion holding the substrate from the base via the link member to transfer the substrate to the substrate transport position.

8. The substrate transporting method according to claim 7, wherein: The substrate holding portion is configured such that, in a plan view, the base portion and the link member are included in a presence region of the substrate held by the substrate holding portion when the substrate holding portion is in a retracted state.

9. The substrate transporting method according to claim 7 or 8, wherein: The transfer unit is provided in a transfer chamber connected to a processing chamber for processing a substrate. The substrate transfer position is the processing chamber. The main body of the planar motor constitutes a bottom wall of the transfer chamber.

10. A substrate processing system comprising: a processing chamber for processing a substrate; a transfer chamber connected to the processing chamber; and A substrate transport device transports the substrate within the transport chamber and delivers the substrate to the processing chamber. in, The substrate transport device comprises: a transport unit having a substrate holding portion for holding a substrate, a base portion having a plurality of magnets therein for moving the substrate holding portion, and a link member connecting the substrate holding portion and the base portion; as well as A planar motor includes a main body, a plurality of electromagnetic coils arranged in the main body, and a linear drive unit for supplying power to the electromagnetic coils to magnetically levitate the base and linearly drive the base. The base has a first member and a second member rotatably disposed within the first member, and the magnet is disposed inside the first member and the second member. The link member is rotatably connected to the second member. The linear drive unit is used to rotate the second member relative to the first member to extend and retract the substrate holding portion via the link member. When the substrate holding portion retracts, the base, the link member, and the substrate holding portion are in a vertically overlapping state, and the base is linearly driven in this state. When the substrate held by the substrate holding portion is delivered to the processing chamber, the substrate holding portion is extended from the base portion.

11. The substrate processing system according to claim 10, wherein: The substrate holding portion is configured such that, in a plan view, the base portion and the link member are included in a presence region of the substrate held by the substrate holding portion when the substrate holding portion is in a retracted state.

12. The substrate processing system according to claim 10 or 11, characterized in that: The main body of the planar motor constitutes a bottom wall of the transfer chamber.

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