An intelligent adhesive spreading device and adhesive spreading process for wafer

Abstract

The present invention discloses an intelligent glue spreading device and glue spreading process for wafers, belonging to the field of semiconductor technology, comprising a machine body, a control component arranged on the machine body, a carrier and an adsorption drive component for adsorbing and driving the carrier to rotate, wherein a mounting groove is opened at the center of the top surface of the machine body, the adsorption drive component is installed at the inner center of the mounting groove, the carrier is installed at the top of the adsorption drive component, a carrying tray is rotatably installed inside the mounting groove, a center sleeve is arranged at the center of the carrying tray, the center sleeve is sleeved on the outer surface of the adsorption drive component, and the four corners of the machine body are provided with a limiting mechanism for adjusting the position of the wafer and a liquid supply mechanism for cleaning the edge of the wafer and the inner wall of the carrying tray; it can realize that the formed photolithography glue layer is more uniform, and the side edge of the wafer and the inner wall of the carrying container can be cleaned, so that the output quality of the wafer is higher.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor technology, and more specifically, to an intelligent adhesive spreading device and adhesive spreading process applied to wafers. Background Art

[0002] The main processing methods for wafers are sheet processing and batch processing, that is, processing one or more wafers at the same time. As the feature size of semiconductors becomes smaller and smaller, and the processing and measurement equipment becomes more and more advanced, new data characteristics have emerged in wafer processing. In the process of processing semiconductor wafers into chips, photolithography is one of the main processes, and the photolithography operation is one of the basic steps of the photolithography process, also known as spin coating or spinning. After the base film is processed, the silicon wafer is immediately coated with liquid photoresist material by spin coating. The silicon wafer is fixed on a vacuum stage, which is a flat metal or polytetrachloroethylene disk with many vacuum holes on the surface to fix the silicon wafer.

[0003] In order to obtain a uniform photoresist coating, the wafer must be placed in the center of the carrier. However, existing photoresist spreaders are prone to errors when placing the wafer, resulting in uneven coating of the photoresist liquid. In addition, since the photoresist liquid is coated under the action of centrifugation, some photoresist liquid will adhere to the side edges of the wafer. If it is not cleaned, it will affect the output quality of the wafer. At the same time, some of it will adhere to the inner wall of the carrying container, which may affect the subsequent wafer coating process. Summary of the invention

[0004] 1. Technical problems to be solved

[0005] In view of the problems existing in the prior art, the purpose of the present invention is to provide an intelligent glue spreading device and glue spreading process for wafers, which can accurately push the wafer to the center position of the carrier, so that the formed photolithography coating layer is more uniform. At the same time, after the glue coating is completed, the side edges of the wafer and the inner wall of the carrying container can be cleaned, so that the wafer output quality is higher, and at the same time it will not affect the subsequent wafer glue spreading process.

[0006] 2. Technical solution

[0007] To solve the above problems, the present invention adopts the following technical solutions.

[0008] An intelligent glue spreading device for wafers comprises a body, a control component arranged on the body, a carrier and an adsorption drive component for adsorbing and driving the carrier to rotate, a mounting groove is opened at the center of the top surface of the body, the adsorption drive component is installed at the inner center of the mounting groove, the carrier is installed at the top of the adsorption drive component, a carrying tray is rotatably installed inside the mounting groove, a center sleeve is arranged at the center of the carrying tray, the center sleeve is sleeved on the outer surface of the adsorption drive component, a rotation mechanism for driving the carrying tray to rotate is arranged between the carrying tray and the adsorption drive component, a sealing top cover is arranged on the body to match the carrying tray, and a limiting mechanism for adjusting the position of a wafer and a liquid supply mechanism for cleaning the edge of the wafer and the inner wall of the carrying tray are arranged at the four corners of the body.

[0009] Furthermore, the rotation mechanism includes a first driven gear fixedly mounted on the outer side surface of the bottom end of the center sleeve and a rotating motor installed inside the mounting groove, a first driving gear fixedly mounted on the power output end of the rotating motor, the first driving gear meshes with the first driven gear, and the center sleeve and the outer surface of the adsorption drive assembly are rotatably connected via a sealed bearing.

[0010] Furthermore, the limiting mechanism includes limiting slide grooves evenly opened at the opposite corners of the body, a support slide rod is slidably connected inside the limiting slide groove, a first driving mechanism for driving the support slide rod to slide is arranged inside the body, a connecting support is fixedly installed on the top of the support slide rod, the connecting support is rotatably connected to a support swing arm through a second driving mechanism, a mounting seat is fixedly installed on one end of the support swing arm away from the connecting support, a support tube shaft is symmetrically installed on the bottom end of the mounting seat, and an adsorption cotton roller is rotatably connected to the outer surface of the support tube shaft.

[0011] Furthermore, the first driving mechanism includes a slideway opened at the bottom end of the limiting slide groove and a threaded slider arranged at the bottom end of the supporting slide rod, the threaded slider is slidably embedded in the slideway, a second driving motor is fixedly installed inside the slideway, a screw rod is fixedly installed at the power output end of the second driving motor, and the screw rod is threadedly connected to the inside of the threaded slider.

[0012] Furthermore, the second driving mechanism includes a support shaft rotatably installed inside the connecting support and a first driving motor fixedly installed inside the connecting support, the end of the supporting arm is fixedly installed on the support shaft, a second driven gear is fixedly installed on one end of the support shaft close to the first driving motor, a second driving gear is fixedly installed on the power output end of the first driving motor, and the second driving gear is meshed with the second driven gear.

[0013] Furthermore, the angle between two adjacent limiting slide grooves is ninety degrees, and the extending direction of the two opposite limiting slide grooves passes through the central axis of the carrier.

[0014] Furthermore, the liquid supply mechanism includes micro through holes evenly opened on the surface of the supporting tube shaft and micro water pumps symmetrically installed on both sides of the top surface of the body. The supporting tube shaft is provided with a liquid inlet port on the top surface of the mounting seat, and the liquid inlet port is connected to the liquid outlet of the micro water pump by a universal hose.

[0015] Furthermore, the liquid inlet of the micro water pump is connected to a liquid storage device through a pipeline, and chemical reagents for cleaning the photolithography liquid are placed inside the liquid storage device.

[0016] A coating process for wafers, applied to the above-mentioned intelligent coating device for wafers, comprises the following steps:

[0017] Step S1, placing the wafer on the top surface of the carrier manually or by a robot arm, and then controlling the second drive motor to start at the same time through the control component, driving the screw rod to rotate forward, thereby driving the support slide bar to move toward one side of the carrier tray, and then pushing the wafer from the four corners to the center position of the carrier through the outer support tube shaft and the adsorption cotton roller, and then the second drive motor rotates in the reverse direction to reset;

[0018] Step S2, controlling the first drive motor to rotate forward by the control component, meshing the second driven gear with the second drive gear, and driving the support arm to rotate by the support shaft, so as to gradually rotate the adsorption cotton roller out of the inside of the carrying tray, until the support arm rotates ninety degrees, at which time the adsorption cotton roller is completely out of the inside of the carrying tray;

[0019] Step S3, manually or by a robot, dripping photoresist onto the surface of the wafer, then closing the sealing cover, and simultaneously starting the adsorption drive assembly to drive the carrier and the wafer to rotate at a specified speed, using centrifugal force to evenly coat the photoresist until the coating is uniform;

[0020] Step S4, after the wafer is coated with photoresist, the sealing top cover can be opened, the adsorption cotton roller is reset, and the adsorption cotton roller is pushed to the side of the wafer again through the control component, and the micro water pump is started to supply chemical reagents to the inside of the support tube shaft, and the adsorption drive component is started to drive the wafer to transport and rotate, so as to use the chemical reagent to remove excess photoresist at the edge of the wafer;

[0021] Step S5, after the photoresist liquid on the edge of the wafer is cleaned and taken out, the adsorption cotton roller can be reset so that the inner adsorption cotton roller is attached to the side wall surface of the carrying tray, and the rotating motor is started at the same time, and the first driven gear and the first driving gear are engaged to drive the carrying tray to rotate, so that the photoresist liquid adhered to the surface of the carrying tray can be cleaned by the adsorption cotton roller.

[0022] 3. Beneficial effects

[0023] Compared with the prior art, the advantages of the present invention are:

[0024] (1) This solution is provided with a first driving mechanism that cooperates with a supporting slide rod, a supporting rotary arm, and a supporting tube shaft, which can push the wafer from the circumference of the wafer to the center of the carrier, so that it can be accurately placed at the center of the carrier, thereby ensuring the uniformity of the photolithography coating layer of the wafer.

[0025] (2) This solution is provided with a second driving mechanism, which can separate the supporting tube shaft and the adsorption cotton roller from the inside of the supporting tray during the glue spreading process, thereby facilitating the central sleeve to seal the inside of the supporting tray, thereby preventing the high-speed glue spreading process from being affected by the external environment, making the glue spreading process more stable and reliable, and ensuring the uniformity of glue spreading.

[0026] (3) This solution is equipped with a liquid supply mechanism that cooperates with two groups of supporting tube shafts and adsorption cotton rollers arranged inside and outside. Chemical reagents can be used to clean the excess photoresist liquid from the side edges of the wafer and the inner wall of the supporting tray, respectively, so that the wafer output quality is higher. At the same time, there is no photoresist liquid on the inner wall of the supporting tray, which will not affect the subsequent wafer coating process, so that the output quality of the photoresist coating layer is higher. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1 It is a schematic diagram of the three-dimensional structure of the present invention;

[0028] Figure 2 It is a schematic diagram of the body structure of the present invention;

[0029] Figure 3 It is a schematic diagram of a partial three-dimensional structure of the present invention;

[0030] Figure 4 for Figure 3 A local enlarged structural schematic diagram;

[0031] Figure 5 for Figure 3 Exploded diagram of

[0032] Figure 6 It is a schematic diagram of the bottom structure of the carrying tray of the present invention;

[0033] Figure 7It is a schematic diagram of the internal structure of the load-bearing tray of the present invention;

[0034] Figure 8 It is a schematic diagram of the diagonal cross-sectional structure of the present invention.

[0035] Description of the numbers in the figure:

[0036] 1. Machine body; 2. Control component; 3. Mounting slot; 4. Adsorption drive component; 5. Carrier; 6. Carrying tray; 7. Center sleeve; 8. Sealed bearing; 9. First driven gear; 10. First drive gear; 11. Rotating motor; 12. Limiting slide groove; 13. Slideway; 14. Support slide bar; 15. Threaded slider; 16. Connecting support; 17. Supporting swing arm; 18. Mounting seat; 19. Supporting tube shaft; 20. Micro through hole; 21. Adsorption cotton roller; 22. Support shaft; 23. Second driven gear; 24. First drive motor; 25. Second drive gear; 26. Micro water pump; 27. Universal hose; 28. Second drive motor; 29. ​​Screw; 30. Sealed top cover. DETAILED DESCRIPTION

[0037] The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention; it is obvious that the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments, and all other embodiments obtained by ordinary technicians in this field based on the embodiments of the present invention without making creative work are within the scope of protection of the present invention.

[0038] Example:

[0039] See also Figure 1-8 , an intelligent glue spreading device for wafers, comprising a body 1, a control component 2 arranged on the body 1, a carrier 5 and an adsorption driving component 4 for adsorbing and driving the carrier 5 to rotate, a mounting groove 3 is opened at the center of the top surface of the body 1, the adsorption driving component 4 is installed at the inner center of the mounting groove 3, the carrier 5 is installed at the top of the adsorption driving component 4, a carrying tray 6 is rotatably installed inside the mounting groove 3, a center sleeve 7 is arranged at the center of the carrying tray 6, the center sleeve 7 is sleeved on the outer surface of the adsorption driving component 4, a rotation mechanism for driving the carrying tray 6 to rotate is arranged between the carrying tray 6 and the adsorption driving component 4, a sealing top cover 30 is arranged on the body 1 to match the carrying tray 6, and a limiting mechanism for adjusting the position of the wafer and a liquid supply mechanism for cleaning the edge of the wafer and the inner wall of the carrying tray 6 are arranged at the four corners of the body 1.

[0040] See also Figure 6-8The rotation mechanism includes a first driven gear 9 fixedly mounted on the outer side surface of the bottom end of the center sleeve 7 and a rotating motor 11 installed inside the mounting groove 3. A first driving gear 10 is fixedly mounted on the power output end of the rotating motor 11. At the same time, the first driving gear 10 is meshed with the first driven gear 9. The center sleeve 7 and the outer surface of the adsorption driving component 4 are rotatably connected by a sealed bearing 8. The rotating motor 11 can be used to drive the carrying tray 6 to rotate, which is convenient for the subsequent cleaning of the photolithography liquid on its inner wall.

[0041] See also Figure 2 and Figure 3 The limiting mechanism includes limiting slide grooves 12 evenly opened at the top corners of the body 1, and a support slide rod 14 is slidably connected inside the limiting slide groove 12. A first driving mechanism for driving the support slide rod 14 to slide is arranged inside the body 1, and a connecting support 16 is fixedly installed on the top of the support slide rod 14. At the same time, the connecting support 16 is rotatably connected to a support swing arm 17 through a second driving mechanism, and a mounting seat 18 is fixedly installed at one end of the support swing arm 17 away from the connecting support 16, and a supporting tube shaft 19 is symmetrically installed at the bottom of the mounting seat 18. The outer surface of the supporting tube shaft 19 is rotatably connected to an adsorption cotton roller 21, so that the supporting slide rod 14 can be used to push the supporting tube shaft 19 and the adsorption cotton roller 21 through the supporting swing arm 17, so that the supporting tube shaft 19 and the adsorption cotton roller 21 can be conveniently adjusted to the position of the wafer and the cleaning of the photolithography liquid by the supporting tube shaft 19 and the adsorption cotton roller 21.

[0042] See also Figure 3 and Figure 4 The first driving mechanism includes a slide 13 opened at the bottom end of the limiting slide groove 12 and a threaded slider 15 arranged at the bottom end of the supporting slide rod 14. By sliding the threaded slider 15 into the slide 13, the sliding direction can be limited, and the sliding is stable and will not tilt. At the same time, a second driving motor 28 is fixedly installed inside the slide 13, and a screw rod 29 is fixedly installed at the power output end of the second driving motor 28, and the screw rod 29 is threadedly connected to the threaded slider 15, so that the second driving motor 28 can be used to drive the screw rod 29 to rotate to drive the supporting slide rod 14 to slide inside the limiting slide groove 12.

[0043] See also Figure 3 and Figure 4The second driving mechanism includes a support shaft 22 rotatably installed inside the connecting support 16 and a first driving motor 24 fixedly installed inside the connecting support 16. The end of the supporting swing arm 17 is fixedly installed on the support shaft 22, and a second driven gear 23 is fixedly installed on one end of the supporting shaft 22 close to the first driving motor 24. A second driving gear 25 is fixedly installed on the power output end of the first driving motor 24, and the second driving gear 25 is meshed with the second driven gear 23, so that the first driving motor 24 can be used to drive the supporting swing arm 17 to rotate in a circle around the support shaft 22.

[0044] See also Figure 1 and Figure 2 , wherein the angle between two adjacent limiting slide grooves 12 is ninety degrees, and the extension direction of the two opposite limiting slide grooves 12 passes through the central axis of the carrier 5, so that the adsorption cotton roller 21 can accurately push the wafer to the center of the top surface of the carrier 5 from the four corners.

[0045] See also Figure 1 and Figure 5 The liquid supply mechanism includes micro through holes 20 evenly opened on the surface of the support tube shaft 19 and micro water pumps 26 symmetrically installed on both sides of the top surface of the body 1. At the same time, the support tube shaft 19 is provided with a liquid inlet port on the top surface of the mounting seat 18, and the liquid inlet port is connected to the liquid outlet of the micro water pump 26 by a universal hose 27. The micro water pump 26 can be used to supply liquid to the inside of the support tube shaft 19 through the liquid inlet port, and penetrate into the inside of the adsorption cotton roller 21 through the micro through holes 20, so that the adsorption cotton roller 21 can clean the photolithography liquid.

[0046] See also Figure 1 The liquid inlet of the micro water pump 26 is connected to a liquid storage device through a pipeline, and chemical reagents for cleaning the photolithography liquid are placed inside the liquid storage device, which can facilitate the continuous supply of chemical reagents when cleaning the photolithography liquid.

[0047] See also Figure 1-8 A coating process for wafers, applied to the above-mentioned intelligent coating device for wafers, comprises the following steps:

[0048] Step S1, placing the wafer on the top surface of the carrier 5 manually or by a robot, then controlling the second drive motor 28 to start at the same time through the control component 2, driving the screw rod 29 to rotate forward, thereby driving the support slide bar 14 to move toward the side of the carrying tray 6, and then pushing the wafer from the four corners to the center position of the carrier 5 through the outer support tube shaft 19 and the adsorption cotton roller 21, and then the second drive motor 28 rotates in the reverse direction to reset;

[0049] Step S2, controlling the first driving motor 24 to rotate forward by the control component 2, and utilizing the second driven gear 23 to mesh with the second driving gear 25, so as to utilize the support shaft 22 to drive the support arm 17 to rotate, and gradually rotating the adsorption cotton roller 21 out of the inside of the carrying tray 6, until the support arm 17 rotates ninety degrees, at which time the adsorption cotton roller 21 is completely out of the inside of the carrying tray 6;

[0050] Step S3, manually or by a robot, dripping photoresist onto the surface of the wafer, then closing the sealing cover 30, and simultaneously starting the adsorption drive assembly 4 to drive the carrier 5 and the wafer to rotate at a specified speed, and using centrifugal force to evenly coat the photoresist until the coating is uniform;

[0051] Step S4, after the wafer is coated with photoresist, the sealing top cover 30 can be opened, and the adsorption cotton roller 21 can be reset, and the adsorption cotton roller 21 can be pushed to the side of the wafer again through the control component 2, and the micro water pump 26 can be started to supply chemical reagents to the inside of the support tube shaft 19, and the adsorption drive component 4 can be started to drive the wafer to transport and rotate, so as to use the chemical reagent to remove the excess photoresist at the edge of the wafer;

[0052] Step S5, after the photoresist liquid on the edge of the wafer is cleaned and taken out, the adsorption cotton roller 21 can be reset so that the inner adsorption cotton roller 21 is attached to the side wall surface of the carrying tray 6, and the rotating motor 11 is started at the same time, and the first driven gear 9 and the first driving gear 10 are engaged to drive the carrying tray 6 to rotate, so that the photoresist liquid adhered to the surface of the carrying tray 6 is cleaned by the adsorption cotton roller 21.

[0053] The above is only a preferred specific implementation of the present invention; however, the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes according to the technical solution and its improved conception within the technical scope disclosed by the present invention, which should be covered by the protection scope of the present invention.

Claims

1. An intelligent coating device for wafers, comprising a body (1), a control component (2) arranged on the body (1), a carrier (5), and an adsorption drive component (4) for adsorbing and driving the carrier (5) to rotate, characterized in that: A mounting groove (3) is provided at the center of the top surface of the machine body (1), the adsorption drive assembly (4) is installed at the center of the mounting groove (3), the carrier (5) is installed at the top of the adsorption drive assembly (4), a carrying tray (6) is rotatably installed inside the mounting groove (3), a center sleeve (7) is provided at the center of the carrying tray (6), the center sleeve (7) is sleeved on the outer surface of the adsorption drive assembly (4), a rotation mechanism for driving the carrying tray (6) to rotate is provided between the carrying tray (6) and the adsorption drive assembly (4), a sealing top cover (30) is provided on the machine body (1) to match the carrying tray (6), and a limiting mechanism for adjusting the position of a wafer and a liquid supply mechanism for cleaning the edge of the wafer and the inner wall of the carrying tray (6) are provided at the four corners of the machine body (1); The limiting mechanism comprises a limiting slide groove (12) evenly arranged at the opposite corners of the body (1), a supporting slide rod (14) is slidably connected inside the limiting slide groove (12), a first driving mechanism for driving the supporting slide rod (14) to slide is arranged inside the body (1), a connecting support (16) is fixedly installed at the top end of the supporting slide rod (14), the connecting support (16) is rotatably connected to a supporting swing arm (17) by being provided with a second driving mechanism, a mounting seat (18) is fixedly installed at one end of the supporting swing arm (17) away from the connecting support (16), a supporting tube shaft (19) is symmetrically installed at the bottom end of the mounting seat (18), and an adsorption cotton roller (21) is rotatably connected to the outer surface of the supporting tube shaft (19); The first driving mechanism comprises a slideway (13) opened at the bottom end of the limiting slide groove (12) and a threaded slider (15) arranged at the bottom end of the supporting slide rod (14), the threaded slider (15) is slidably embedded in the slideway (13), a second driving motor (28) is fixedly installed in the slideway (13), a screw rod (29) is fixedly installed at the power output end of the second driving motor (28), and the screw rod (29) is threadedly connected to the inside of the threaded slider (15); The second driving mechanism comprises a support shaft (22) rotatably mounted inside the connecting support (16) and a first driving motor (24) fixedly mounted inside the connecting support (16); the end of the supporting arm (17) is fixedly mounted on the support shaft (22); a second driven gear (23) is fixedly mounted on one end of the support shaft (22) close to the first driving motor (24); a second driving gear (25) is fixedly mounted on the power output end of the first driving motor (24); and the second driving gear (25) is meshed with the second driven gear (23); The liquid supply mechanism comprises micro through holes (20) uniformly arranged on the surface of the support tube shaft (19) and micro water pumps (26) symmetrically mounted on both sides of the top surface of the body (1); the support tube shaft (19) is provided with a liquid inlet port on the top surface of the mounting seat (18); the liquid inlet port is connected to the liquid outlet of the micro water pump (26) via a universal hose (27).

2. The intelligent coating device for wafers according to claim 1 is characterized in that: The self-rotation mechanism comprises a first driven gear (9) fixedly mounted on the outer side surface of the bottom end of the central sleeve (7) and a rotating motor (11) mounted inside the mounting groove (3); a first driving gear (10) is fixedly mounted on the power output end of the rotating motor (11); the first driving gear (10) is meshed with the first driven gear (9); and the central sleeve (7) and the outer surface of the adsorption drive assembly (4) are rotationally connected via a sealed bearing (8).

3. The intelligent coating device for wafers according to claim 1 is characterized in that: The angle between two adjacent limiting sliding grooves (12) is ninety degrees, and the extending direction of the two opposite limiting sliding grooves (12) passes through the central axis of the carrier (5).

4. The intelligent coating device for wafers according to claim 1 is characterized in that: The liquid inlet of the micro water pump (26) is connected to a liquid storage device through a pipeline, and a chemical reagent for cleaning the photolithography liquid is placed inside the liquid storage device.

5. A process for coating a wafer, characterized in that: The process is applied to an intelligent coating device for wafers as described in claim 2, comprising the following steps: Step S1, placing the wafer on the top surface of the carrier (5) manually or by a mechanical arm, then controlling the second drive motor (28) to start simultaneously through the control component (2), driving the screw rod (29) to rotate in the forward direction, thereby driving the support slide bar (14) to move toward one side of the carrier tray (6), and then pushing the wafer from the four corners to the center position of the carrier (5) through the outer support tube shaft (19) and the adsorption cotton roller (21), and then the second drive motor (28) rotates in the reverse direction to reset; Step S2, controlling the first drive motor (24) to rotate in the forward direction through the control component (2), utilizing the second driven gear (23) and the second drive gear (25) to mesh, thereby utilizing the support shaft (22) to drive the support rotary arm (17) to rotate, and gradually rotating the adsorption cotton roller (21) out of the interior of the carrying tray (6), until the support rotary arm (17) rotates ninety degrees, at which time the adsorption cotton roller (21) is completely out of the interior of the carrying tray (6); Step S3, manually or by a robot, dripping photoresist onto the surface of the wafer, then closing the sealing top cover (30), and simultaneously starting the adsorption drive assembly (4) to drive the carrier (5) and the wafer to rotate at a specified speed, and using centrifugal force to evenly coat the photoresist until the coating is uniform; Step S4, after the wafer is coated with photoresist, the sealing top cover (30) is opened, the adsorption cotton roller (21) is reset, and the adsorption cotton roller (21) is pushed to the side of the wafer again through the control component (2), and the micro water pump (26) is started to supply chemical reagents to the inside of the support tube shaft (19), and the adsorption drive component (4) is started to drive the wafer to transport and rotate, so as to use the chemical reagent to remove excess photoresist at the edge of the wafer; Step S5, after the photolithography liquid at the edge of the wafer is cleaned and removed, the adsorption cotton roller (21) is reset so that the inner adsorption cotton roller (21) is attached to the side wall surface of the carrier tray (6), and the rotating motor (11) is started at the same time, and the first driven gear (9) and the first driving gear (10) are meshed to drive the carrier tray (6) to rotate, so that the adsorption cotton roller (21) is used to clean the photolithography liquid adhering to the surface of the carrier tray (6).

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