An ultra-thin high-density lead frame material box carrier

Abstract

The present invention provides an ultra-thin high-density lead frame material box carrier. The ultra-thin high-density lead frame material box carrier includes a material box carrier body, a lead frame and an aluminum box cover. A support groove is provided between the two sides of the inner wall of the material box carrier body, and an installation port is provided at the input end of the support groove. Limiting slide grooves are provided on both sides of the material box carrier body, including: a protective groove is provided at the bottom of the aluminum box cover. The ultra-thin high-density lead frame material box carrier provided by the present invention has an anti-collision groove formed between the extended carrier plate and the support groove, which will not cause a collision between the semiconductor chip and the material box carrier body. The protective groove is provided at the bottom of the aluminum box cover to prevent the functional area of ​​the semiconductor packaging lead frame from being collided with the material box cover, thereby improving the stability and safety of the aluminum box cover during installation, reducing the economic losses and workload caused by operating errors, and improving the processing quality of the ultra-thin high-density semiconductor packaging lead frame.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor processing equipment, and in particular to an ultra-thin high-density lead frame material box carrier. Background Art

[0002] With the development of electronic products towards lighter, smaller, more multifunctional and higher capacity, the package is required to be thinner, smaller, with more pins and higher density. This poses a challenge to the package structure and packaging technology. An ultra-thin high-sealing lead frame is used to load semiconductors for processing. The ultra-thin high-sealing lead frame includes functional areas and non-functional areas, and is loaded into the interior of the material box carrier when in use.

[0003] In the prior art, the mounting structure on the existing material box carrier cannot provide good protection and load-bearing after the ultra-thin high-sealing lead frame is installed, which may easily cause the semiconductor semi-finished products loaded with the lead frame to fall inside. At the same time, after the ultra-thin high-sealing lead frame is installed, the box cover thereon is installed from top to bottom, and the box cover is easily in direct contact with the functional area of ​​the ultra-thin high-sealing lead frame during installation.

[0004] Therefore, it is necessary to provide an ultra-thin high-density lead frame material box carrier to solve the above technical problems. Summary of the invention

[0005] The invention provides an ultra-thin high-density lead frame material box carrier, which solves the problem that the semiconductor semi-finished products loaded with the lead frame are easy to fall off inside.

[0006] In order to solve the above technical problems, the ultra-thin high-density lead frame material box carrier provided by the present invention includes a material box carrier body, a lead frame and an aluminum box cover, a support groove is opened between the two sides of the inner wall of the material box carrier body, an installation port is opened at the input end of the support groove, and limiting slide grooves are opened on both sides of the material box carrier body, including: a protective groove is opened at the bottom of the aluminum box cover, connecting card plates are fixedly connected on both sides of the aluminum box cover, and the top of the aluminum box cover is fixedly connected to the limiting card plate; two extended supporting plates, the surfaces of the two extended supporting plates are respectively fixed on the two sides of the inner wall of the material box carrier body, and an anti-collision groove is formed between the bottom of the extended supporting plate and the surface of the material box carrier body.

[0007] Preferably, the lead frame is installed inside the supporting groove, the aluminum box cover is arranged on the surface of the material box carrier body, and the interior of the installation port is connected to the interior of the supporting groove.

[0008] Preferably, the width of the inner wall of the protection groove is 73 cm, and the width between the inner walls of the two support grooves is 79 cm.

[0009] Preferably, the width of the inner wall of the material box carrier body is 73 cm, and the height of the protective groove is 5 cm.

[0010] Preferably, the two extended supporting plates are symmetrically distributed and on the same horizontal plane, and the top of the extended supporting plate and the bottom of the inner wall of the supporting groove are on the same horizontal plane.

[0011] Preferably, the anti-collision groove is located above the supporting groove, and the interior of the anti-collision groove is communicated with the interior of the supporting groove.

[0012] Preferably, the bottom length of the inner wall of the support groove is 6.1 cm.

[0013] Preferably, the surface of the connecting card plate is matched with the inner surface of the limiting slide groove, and the surface of the limiting card plate is vertically distributed with the surface of the aluminum box cover.

[0014] Preferably, it also includes: a mounting groove is opened on one side of the material box carrier body, a first connecting magnet is embedded on one side of the inner wall of the mounting groove, a connecting shaft is fixedly connected to one side of the extended supporting plate, a second connecting magnet is embedded at one end of the connecting shaft, the surface of the second connecting magnet is magnetically attracted to the surface of the first connecting magnet, and the surface of the connecting shaft is slidably connected to the inner surface of the mounting groove.

[0015] Preferably, it also includes: a contraction groove is provided on the top of the aluminum box cover, a telescopic plate is slidably connected inside the contraction groove, a telescopic groove, a connecting groove and an adjusting slot are respectively provided on the telescopic plate, a supporting slide shaft is slidably connected inside the contraction groove, the supporting slide shaft is a T-shaped structure, the top end of the supporting slide shaft passes through the telescopic plate and extends to the top of the telescopic plate, the top end of the supporting slide shaft is fixedly connected to the top of the inner wall of the contraction groove, a buffer spring is sleeved on the outer surface of the supporting slide shaft, the bottom of the buffer spring is fixed to the top of the telescopic plate, and a positioning box is fixedly connected to the top of the inner wall of the contraction groove.

[0016] Compared with the related art, the ultra-thin high-density lead frame magazine carrier provided by the present invention has the following beneficial effects:

[0017] The present invention provides an ultra-thin high-density lead frame material box carrier. The load-bearing length of the ultra-thin high-density semiconductor package lead frame is lengthened inside the material box carrier body, so that the lead frame is not easy to fall. After the material box carrier body is added with an extended load plate, the anti-collision groove formed between the extended load plate and the support groove will not cause the semiconductor chip to collide with the material box carrier body. A protective groove is arranged at the bottom of the aluminum box cover to prevent the functional area of ​​the semiconductor package lead frame from being collided with the material box cover, thereby improving the stability and safety of the aluminum box cover during installation, reducing the economic loss and workload caused by operating errors, and improving the processing quality of the ultra-thin high-density semiconductor package lead frame. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a structural schematic diagram of a material box carrier body in the prior art;

[0019] Figure 2 It is a structural schematic diagram of an aluminum box cover in the prior art;

[0020] Figure 3 A schematic structural diagram of a material box carrier body of an ultra-thin high-density lead frame material box carrier provided by the present invention;

[0021] Figure 4 A schematic diagram of the structure of an aluminum box cover of an ultra-thin high-density lead frame material box carrier provided by the present invention;

[0022] Figure 5 for Figure 3 A three-dimensional diagram of the cartridge carrier body shown;

[0023] Figure 6 for Figure 5 An enlarged schematic diagram of part A is shown;

[0024] Figure 7 It is a schematic diagram of the overall structure of the first embodiment of the ultra-thin high-density lead frame magazine carrier provided by the present invention;

[0025] Figure 8 for Figure 7 An enlarged schematic diagram of part B is shown;

[0026] Fig. 9 It is a schematic diagram of the overall structure of the second embodiment of the ultra-thin high-density lead frame magazine carrier provided by the present invention;

[0027] Fig.10 for Fig. 9 An enlarged schematic diagram of part C is shown;

[0028] Fig.11 It is a schematic diagram of the overall structure of the third embodiment of the ultra-thin high-density lead frame magazine carrier provided by the present invention;

[0029] Fig.12 for Fig.11 An enlarged schematic diagram of the D portion shown;

[0030] Fig.13 for Fig.11 Schematic diagram of the structure of the positioning box part shown.

[0031] Numbers in the figure: 1. Material box carrier body, 11. Support groove, 12. Mounting port, 13. Limiting slide groove, 14. Mounting groove, 2. Lead frame, 3. Aluminum box cover, 31. Protective groove, 32. Connecting card plate, 33. Limiting card plate, 34. Shrinkage groove, 4. Extended bearing plate, 41. Anti-collision groove, 5. First connecting magnet, 6. Connecting shaft, 61. Second connecting magnet, 7. Telescopic plate, 71. Telescopic groove, 72. Connecting groove, 73. Adjusting card slot, 8. Support sliding shaft, 81. Buffer spring, 9. Positioning box, 91. Limiting sliding shaft, 92. Positioning spring, 93. Sliding plate, 94. Positioning plate. DETAILED DESCRIPTION

[0032] The present invention will be further described below in conjunction with the accompanying drawings and implementation modes.

[0033] Please refer to Figure 1 , Figure 2 , Figure 3 , Figure 4 , Figure 5 , Figure 6 , Figure 7 and Figure 8 ,in, Figure 1 It is a structural schematic diagram of a material box carrier body in the prior art; Figure 2 It is a structural schematic diagram of an aluminum box cover in the prior art; Figure 3 A schematic structural diagram of a material box carrier body of an ultra-thin high-density lead frame material box carrier provided by the present invention; Figure 4 A schematic diagram of the structure of an aluminum box cover of an ultra-thin high-density lead frame material box carrier provided by the present invention; Figure 5 for Figure 3 A three-dimensional diagram of the cartridge carrier body shown; Figure 6 for Figure 5 An enlarged schematic diagram of part A is shown; Figure 7 It is a schematic diagram of the overall structure of the first embodiment of the ultra-thin high-density lead frame magazine carrier provided by the present invention; Figure 8 for Figure 7An enlarged schematic diagram of part B is shown. An ultra-thin high-density lead frame material box carrier comprises a material box carrier body 1, a lead frame 2 and an aluminum box cover 3, a support groove 11 is provided between the two sides of the inner wall of the material box carrier body 1, a mounting port 12 is provided at the input end of the support groove 11, and a limiting slide groove 13 is provided on both sides of the material box carrier body 1, including: a protective groove 31 is provided at the bottom of the aluminum box cover 3, a connecting card plate 32 is fixedly connected to both sides of the aluminum box cover 3, and a limiting card plate 33 is fixedly connected to the top of the aluminum box cover 3; two extended bearing plates 4, the surfaces of the two extended bearing plates 4 are respectively fixed to the two sides of the inner wall of the material box carrier body 1, and an anti-collision groove 41 is formed between the bottom of the extended bearing plate 4 and the surface of the material box carrier body 1.

[0034] Figure 1 and Figure 2 The existing material box carrier body 1 and aluminum box cover 3 structure cannot provide good protection and load-bearing, which may easily cause the semiconductor semi-finished product loaded with the lead frame to bend and fall inside.

[0035] The lead frame 2 is an ultra-thin high-density semiconductor packaging lead frame, on which a semiconductor semi-finished product functional area is arranged and semiconductor chips are evenly laid.

[0036] After redesigning the material box carrier body 1 and the aluminum box cover 3, it has a better protective effect on the ultra-thin high-density semiconductor packaging lead frame:

[0037] ① The carrying length of the ultra-thin high-density semiconductor package lead frame is lengthened inside the material box carrier body 1, so that the lead frame 2 is not easy to fall;

[0038] ② After the extended carrier plate 4 is added to the material box carrier body 1, the anti-collision groove 41 formed between the extended carrier plate 4 and the support groove 11 will not cause the semiconductor chip to collide with the material box carrier body 1;

[0039] ③ A protective groove 31 is provided at the bottom of the aluminum box cover 3 to prevent the functional area of ​​the semiconductor package lead frame from being hit by the material box cover, thereby improving the stability and safety of the aluminum box cover 3 during installation, reducing the economic losses and workload caused by operational errors, and improving the processing quality of the ultra-thin high-density semiconductor package lead frame.

[0040] The lead frame 2 is installed inside the supporting groove 11 , the aluminum box cover 3 is disposed on the surface of the material box carrier body 1 , and the interior of the installation opening 12 is communicated with the interior of the supporting groove 11 .

[0041] The lead frame 2 includes a functional area for loading a semiconductor chip and a non-functional area for mounting and connection.

[0042] When in use, the lead frame 2 is laid flat between two groups of support grooves 11 on the same plane. The bottom of the inner wall of the support groove 11 plays a major supporting role for the lung function area of ​​the lead frame 2. The protective groove 31 on the aluminum box cover 3 can effectively prevent the aluminum box cover 3 from colliding with the functional area during the downward movement.

[0043] The width of the inner wall of the protection groove 31 is 73 cm, and the width between the inner walls of the two support grooves 11 is 79 cm.

[0044] The width of the protective groove 31 is the same as the width of the inner wall of the material box carrier body 1, so that the bottom of the aluminum box cover 3 will preferentially contact the non-functional area on the lead frame 2 when moving downward. After contact, the aluminum box cover 3 is blocked and cannot continue to move downward. At this time, the functional area on the lead frame 2 is located directly below the protective groove 31, which prevents the aluminum box cover 3 from directly colliding with the semiconductor chip in the functional area when it contacts the lead frame 2.

[0045] The width of the inner wall of the material box carrier body 1 is 73 cm, and the height of the protection groove 31 is 5 cm.

[0046] The two extended supporting plates 4 are symmetrically distributed and on the same horizontal plane, and the top of the extended supporting plate 4 and the bottom of the inner wall of the supporting groove 11 are on the same horizontal plane.

[0047] The anti-collision groove 41 is located above the supporting groove 11 , and the interior of the anti-collision groove 41 is communicated with the interior of the supporting groove 11 .

[0048] The extended carrier plate 4 is used to increase the support and load-bearing range of the support groove 11 to improve the load-bearing range and stability of the lead frame 2 during installation. Due to the setting of the extended carrier plate 4, the protruding part is prone to contact with the functional area, and the anti-collision groove 41 at the bottom of the extended carrier plate 4 effectively avoids this situation to ensure the stability of the lead frame 2 during installation and use.

[0049] The bottom length of the inner wall of the supporting groove 11 is 6.1 cm.

[0050] The surface of the connecting clamping plate 32 is matched with the inner surface of the limiting sliding groove 13 , and the surface of the limiting clamping plate 33 is vertically distributed with the surface of the aluminum box cover 3 .

[0051] Compared with the related art, the ultra-thin high-density lead frame magazine carrier provided by the present invention has the following beneficial effects:

[0052] The load-bearing length of the ultra-thin high-density semiconductor package lead frame is lengthened inside the material box carrier body 1, so that the lead frame 2 is not easy to fall. After the extended load plate 4 is added to the material box carrier body 1, the anti-collision groove 41 formed between the extended load plate 4 and the support groove 11 will not cause the semiconductor chip to collide with the material box carrier body 1. A protective groove 31 is set at the bottom of the aluminum box cover 3 to prevent the functional area of ​​the semiconductor package lead frame from being collided with the material box cover, thereby improving the stability and safety of the aluminum box cover 3 during installation, reducing the economic losses and workload caused by operational errors, and improving the processing quality of the ultra-thin high-density semiconductor package lead frame.

[0053] Second embodiment:

[0054] See also Fig. 9 and Fig.10 Based on the ultra-thin high-density lead frame magazine carrier provided by the first embodiment of the present application, the second embodiment of the present application proposes another ultra-thin high-density lead frame magazine carrier. The second embodiment is only a preferred embodiment of the first embodiment, and the implementation of the second embodiment will not affect the independent implementation of the first embodiment.

[0055] Specifically, the difference of the ultra-thin high-density lead frame material box carrier provided in the second embodiment of the present application is that the ultra-thin high-density lead frame material box carrier also includes: a mounting groove 14 is opened on one side of the material box carrier body 1, and a first connecting magnet 5 is embedded on one side of the inner wall of the mounting groove 14, and a connecting shaft 6 is fixedly connected to one side of the extended supporting plate 4, and a second connecting magnet 61 is embedded at one end of the connecting shaft 6, and the surface of the second connecting magnet 61 is magnetically attracted to the surface of the first connecting magnet 5, and the surface of the connecting shaft 6 is slidably connected to the inner surface of the mounting groove 14.

[0056] The extended carrying plate 4 and the material box carrier body 1 adopt a detachable structure, which is convenient for modification and upgrading through the existing material box carrier body 1, and there is no need to re-purchase a new version of the material box carrier body 1, saving a lot of equipment replacement costs. Through the upgrade of existing equipment, the installation and connection structure of the extended carrying plate 4 is simple and easy to operate;

[0057] When installation is required, it is only necessary to align the connecting shaft 6 on the extended supporting plate 4 with the inside of the mounting groove 14 and insert it. When the connecting shaft 6 is fully inserted into the inside of the mounting groove 14, the second connecting magnet 61 at the top of the connecting shaft 6 and the first connecting magnet 5 are magnetically attracted to each other, so that the connecting shaft 6 is stably fixed inside the mounting groove 14, and the extended supporting plate 4 is stably installed inside the material box carrier body 1, and the top of the extended supporting plate 4 is kept in the same plane as the bottom of the inner wall of the support groove 11;

[0058] When the extended loading plate 4 needs to be removed, it is only necessary to pull the extended loading plate 4 out horizontally to the side away from the support groove 11, thereby facilitating the installation and removal of the extended loading plate 4 and allowing users to choose whether to use the extended loading plate 4, thereby providing users with different usage needs and options.

[0059] Third embodiment:

[0060] See also Fig.11 , Fig.12 and Fig.13 Based on the ultra-thin high-density lead frame magazine carrier provided in the first embodiment of the present application, the third embodiment of the present application proposes another ultra-thin high-density lead frame magazine carrier. The third embodiment is only a preferred embodiment of the first embodiment, and the implementation of the third embodiment will not affect the independent implementation of the first embodiment.

[0061] Specifically, the difference of the ultra-thin high-density lead frame material box carrier provided in the third embodiment of the present application is that the ultra-thin high-density lead frame material box carrier also includes: a shrinkage groove 34 is provided on the top of the aluminum box cover 3, and a telescopic plate 7 is slidably connected inside the shrinkage groove 34, and a telescopic groove 71, a connecting groove 72 and an adjustment slot 73 are respectively provided on the telescopic plate 7, and a support slide shaft 8 is slidably connected inside the telescopic groove 71, and the support slide shaft 8 is a T-shaped structure, and the top of the support slide shaft 8 passes through the telescopic plate 7 and extends to the top of the telescopic plate 7, and the top of the support slide shaft 8 is fixedly connected to the top of the inner wall of the shrinkage groove 34, and the outer surface of the support slide shaft 8 is sleeved with a buffer spring 81, and the bottom of the buffer spring 81 is connected to the top of the telescopic plate 7 Fixed, a positioning box 9 is fixedly connected to the top of the inner wall of the shrinkage groove 34, and two limit sliding shafts 91 are fixedly connected to the inner wall of the positioning box 9, and the two limit sliding shafts 91 are distributed in parallel, and a positioning spring 92 is fixedly connected to one side of the inner wall of the positioning box 9, and one end of the positioning spring 92 is fixedly connected to a sliding plate 93, and the surface of the sliding plate 93 is slidingly connected to the surfaces of the two limit sliding shafts 91, and one side of the sliding plate 93 is fixedly connected to a positioning plate 94, and one side of the positioning plate 94 passes through one side of the positioning box 9 and extends to the outside of the positioning box 9, and the bottom of the positioning plate 94 is an arc structure, and the size of the positioning plate 94 is adapted to the inner surface of the adjusting slot 73, and the surface of the positioning box 9 is adapted to the inner surface of the connecting slot 72.

[0062] A telescopic plate 7 with telescopic adjustment is provided at the bottom of the aluminum box cover 3. When the telescopic plate 7 is fully retracted, it is convenient to open and use the protective groove 31 at the bottom of the aluminum box cover 3 normally. When the telescopic plate 7 is fully unfolded, it is convenient to use the aluminum box cover 3 after installation. At the same time, it is convenient for the transportation and loading and unloading of the aluminum box cover 3, avoiding collision and damage of the inner wall of the protective groove 31 on the aluminum box cover 3 during transportation and loading and unloading, thereby improving the stability and safety of the transportation of the aluminum box cover 3.

[0063] The positioning structure on the positioning box 9 is adapted to the connecting groove 72 and the adjusting slot 73 on the telescopic plate 7. When the positioning structure is engaged with the inside of the adjusting slot 73, the telescopic plate 7 is conveniently fixed in a fully retracted state to facilitate the normal use of the telescopic plate 7.

[0064] When in use, the telescopic plate 7 is in an extended state, and the telescopic plate 7 can be stably slidably adjusted on the supporting slide shaft 8, and the buffer spring 81 applies pressure to the telescopic plate 7 to maintain the stability of the telescopic plate 7 after extension;

[0065] The telescopic plate 7 is pushed upward, and the telescopic plate 7 slides stably on the supporting slide shaft 8. When the top of the telescopic plate 7 contacts the arc surface at the bottom of the positioning plate 94, the positioning plate 94 is forced to retract toward the inside of the positioning box 9. When the telescopic plate 7 continues to be pushed upward, the connecting groove 72 on the telescopic plate 7 is sleeved on the outside of the positioning box 9.

[0066] When the adjusting slot 73 on the telescopic plate 7 rises to the horizontal position of the positioning plate 94, the positioning spring 92 pushes the sliding plate 93 to move, and the sliding plate 93 stably moves horizontally on the surfaces of the two limiting sliding shafts 91, and the sliding plate 93 pushes the positioning plate 94 to move to the outside of the positioning box 9 and snaps into the inside of the adjusting slot 73, so as to facilitate the contraction adjustment and automatic snap-fitting and fixing of the telescopic plate 7. At this time, the bottom of the telescopic plate 7 is located above the protective groove 31;

[0067] When the telescopic plate 7 needs to be unfolded, the positioning plate 94 is pushed toward the interior of the positioning box 9 through the interior of the connecting groove 72. When the positioning plate 94 is completely separated from the interior of the connecting groove 72, the telescopic plate 7 slides downward under the elastic force of the buffer spring 81 and returns to its initial state.

[0068] The above descriptions are merely embodiments of the present invention and are not intended to limit the patent scope of the present invention. Any equivalent structure or equivalent process transformation made using the contents of the present invention specification and drawings, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present invention.

Claims

1. An ultra-thin high-density lead frame material box carrier, comprising a material box carrier body, a lead frame and an aluminum box cover, a support groove is provided between the two sides of the inner wall of the material box carrier body, an installation port is provided at the input end of the support groove, and limited sliding grooves are provided on both sides of the material box carrier body, characterized in that: include: A protective groove is provided at the bottom of the aluminum box cover, connecting clamps are fixedly connected to both sides of the aluminum box cover, and a limiting clamp is fixedly connected to the top of the aluminum box cover; Two extended carrying plates, the surfaces of the two extended carrying plates are respectively fixed to the two sides of the inner wall of the magazine carrier body, and an anti-collision groove is formed between the bottom of the extended carrying plate and the surface of the magazine carrier body; The lead frame is installed inside the support groove, the aluminum box cover is arranged on the surface of the material box carrier body, and the inside of the installation port is connected with the inside of the support groove; The two extended bearing plates are symmetrically distributed and on the same horizontal plane, and the top of the extended bearing plate and the bottom of the inner wall of the supporting groove are on the same horizontal plane; The anti-collision groove is located above the supporting groove, and the interior of the anti-collision groove is communicated with the interior of the supporting groove; It also includes: a mounting groove is opened on one side of the material box carrier body, a first connecting magnet is embedded on one side of the inner wall of the mounting groove, a connecting shaft is fixedly connected to one side of the extended carrying plate, a second connecting magnet is embedded on one end of the connecting shaft, the surface of the second connecting magnet is magnetically attracted to the surface of the first connecting magnet, and the surface of the connecting shaft is slidably connected to the inner surface of the mounting groove; It also includes: a contraction groove is provided on the top of the aluminum box cover, a telescopic plate is slidably connected inside the contraction groove, a telescopic groove, a connecting groove and an adjusting slot are respectively provided on the telescopic plate, a supporting slide shaft is slidably connected inside the contraction groove, the supporting slide shaft is a T-shaped structure, the top end of the supporting slide shaft passes through the telescopic plate and extends to the top of the telescopic plate, the top end of the supporting slide shaft is fixedly connected to the top of the inner wall of the contraction groove, a buffer spring is sleeved on the outer surface of the supporting slide shaft, the bottom of the buffer spring is fixed to the top of the telescopic plate, and a positioning box is fixedly connected to the top of the inner wall of the contraction groove.

2. The ultra-thin high-density lead frame magazine carrier according to claim 1, characterized in that: The width of the inner wall of the protection groove is 73 cm, and the width between the inner walls of the two support grooves is 79 cm.

3. The ultra-thin high-density lead frame magazine carrier according to claim 1, characterized in that: The width of the inner wall of the material box carrier body is 73 cm, and the height of the protective groove is 5 cm.

4. The ultra-thin high-density lead frame magazine carrier according to claim 1, characterized in that: The bottom length of the inner wall of the support groove is 6.1 cm.

5. The ultra-thin high-density lead frame magazine carrier according to claim 1, characterized in that: The surface of the connecting card plate is matched with the inner surface of the limiting sliding groove, and the surface of the limiting card plate is vertically distributed with the surface of the aluminum box cover.

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