Display panel and display device

Abstract

The application discloses a display panel and a display device, and belongs to the technical field of display. The display panel comprises a display area and a non-display area arranged at least partially around the display area, and the non-display area at least comprises a first non-display area. The first non-display area comprises a cutting edge and a retaining wall. The display panel comprises a first substrate, and the first substrate at least comprises a first substrate, a first conductive layer, a second substrate arranged in a stack. A first insulating layer is located on a side of the second substrate away from the first substrate, and a first metal layer is located on a side of the first insulating layer away from the first substrate. In the first non-display area, the first metal layer comprises at least one first part, and along a direction of the first non-display area pointing to the display area, the first part is located between the cutting edge and the retaining wall. The display device comprises the above display panel. The application can effectively slow down the speed of static electricity entering the screen body, improve the static protection capability, and is beneficial to improving the product yield and display quality.

Description

Technical Field

[0001] This invention relates to the field of display technology, and more specifically, to a display panel and a display device. Background Technology

[0002] With the rapid development of flat panel display technology, organic light-emitting display panels (OLEDs) are becoming increasingly widely used due to their excellent characteristics such as self-illumination, high brightness, wide viewing angle, and fast response.

[0003] In existing technologies, organic light-emitting diode (OLED) display panels generally include an array substrate, multiple organic light-emitting diodes (OLEDs) located on the array substrate, and an encapsulation layer disposed on the side of the OLEDs facing away from the array substrate and covering the OLEDs. During the fabrication of these structures, such as the cutting process, and during testing or use of the OLED panel, static electricity is generated. This static electricity can adversely affect the display of the OLED panel, potentially damaging the OLEDs and affecting its normal operation. For example, before the display leaves the factory, it needs to undergo electrostatic discharge (ESD) protection testing or copper rod friction experiments. These tests can easily generate negative charges, which can enter the screen through the edge of the cover plate, affecting the electrical properties of the transistors inside the display (e.g., the transistor threshold voltage is easily forward biased), resulting in bright spots around the screen edges and affecting the display effect. Furthermore, during these tests, when static electricity strikes the display, it can also damage the panel, causing encapsulation failure and further affecting product yield.

[0004] Therefore, providing a display panel and display device that can improve electrostatic protection capabilities, effectively slow down the rate at which static electricity enters the screen, and enable the static electricity to be quickly dispersed, thereby improving product yield and display quality, is a technical problem that urgently needs to be solved by those skilled in the art. Summary of the Invention

[0005] In view of this, the present invention provides a display panel and a display device to solve the problem that in the product testing process of the prior art, charge is easily generated, which affects the electrical properties of the transistors inside the display screen, resulting in bright edges of the screen and poor display effect.

[0006] This invention discloses a display panel, comprising: a display area and a non-display area at least partially surrounding the display area, the non-display area including at least a first non-display area, the first non-display area including a cut edge and a barrier, the cut edge being located on the side of the first non-display area away from the display area; the display panel comprising: a first substrate, in a direction perpendicular to the light-emitting surface of the display panel, the first substrate including at least a first substrate, a first conductive layer, and a second substrate stacked thereon, the first conductive layer being located between the first substrate and the second substrate; a first insulating layer, the first insulating layer being located on the side of the second substrate away from the first substrate; a first metal layer, the first metal layer being located on the side of the first insulating layer away from the first substrate; within the first non-display area, the first metal layer includes at least one first portion, in a direction from the first non-display area to the display area, the first portion being located between the cut edge and the barrier.

[0007] Based on the same inventive concept, the present invention also discloses a display device, which includes the above-described display panel.

[0008] Compared with the prior art, the display panel and display device provided by the present invention achieve at least the following beneficial effects:

[0009] In the display panel of the present invention, a first non-display area is disposed, and a first metal layer includes at least one first part, such that in a direction perpendicular to the light-emitting surface of the display panel, the first part overlaps with the first conductive layer of the first substrate to form a first storage capacitor. The first part is one electrode of the first storage capacitor, and the portion of the first conductive layer overlapping with the first part is the other electrode of the first storage capacitor. When external charge enters, for example, during the cutting process or electrostatic testing, charge enters from the cutting edge of the display panel. The charge storage capacity of the first storage capacitor formed by the overlap between the first part and the first conductive layer of the first substrate can be utilized to prevent the charge from rapidly entering the display area, effectively slowing down the speed at which static electricity enters the display panel screen, avoiding affecting the electrical performance of the thin-film transistors in the driving circuit layer within the display area, and thus helping to reduce the probability of display defects. Furthermore, in this invention, the first part is positioned between the cutting edge and the retaining wall along the direction from the first non-display area to the display area. That is, the first part is located on the side of the retaining wall away from the display area. Compared to related technologies where the electrostatic ring with electrostatic protection function is designed on the side of the retaining wall closer to the display area, or where the electrostatic ring is designed to overlap with the retaining wall, this invention, by first positioning the first part of the metal material on the side of the retaining wall away from the display area, can prevent excessive static electricity from damaging the encapsulation structure of the retaining wall and the display panel. Thus, through the dual protection of the first part and the retaining wall, it can more effectively prevent crack propagation, thus improving product yield and display quality. Therefore, the first part of this invention, positioned on the side of the retaining wall away from the display area, not only prevents rapid charge entry into the display area through the first storage capacitor formed by the overlap between the first part and the first conductive layer of the first substrate, but also prevents excessive static electricity from damaging the encapsulation structure of the retaining wall and the display panel. Thus, through the dual protection of the first part and the retaining wall, it can more effectively provide electrostatic protection and prevent crack propagation, thereby improving product yield and display quality.

[0010] Of course, any product implementing this invention need not necessarily achieve all of the technical effects described above at the same time.

[0011] Other features and advantages of the invention will become clear from the following detailed description of exemplary embodiments of the invention with reference to the accompanying drawings. Attached Figure Description

[0012] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments of the invention and, together with their description, serve to explain the principles of the invention.

[0013] Figure 1 This is a schematic diagram of a planar structure of a display panel provided in an embodiment of the present invention;

[0014] Figure 2 yes Figure 1 A schematic diagram of the cross-sectional structure of line A-A';

[0015] Figure 3 yes Figure 1 Another cross-sectional structural diagram along the A-A' direction;

[0016] Figure 4 This is a schematic diagram of another planar structure of the display panel provided in an embodiment of the present invention;

[0017] Figure 5 This is a schematic diagram of another planar structure of the display panel provided in an embodiment of the present invention;

[0018] Figure 6 yes Figure 1 Another cross-sectional structural diagram along the A-A' direction;

[0019] Figure 7 yes Figure 1 Another cross-sectional structural diagram along the A-A' direction;

[0020] Figure 8 This is a schematic diagram of another planar structure of the display panel provided in an embodiment of the present invention;

[0021] Figure 9 yes Figure 8 Schematic diagram of the cross-sectional structure along the C-C' direction;

[0022] Figure 10 This is a schematic diagram of another planar structure of the display panel provided in an embodiment of the present invention;

[0023] Figure 11 This is a schematic diagram of another planar structure of the display panel provided in an embodiment of the present invention;

[0024] Figure 12 This is a schematic diagram of another planar structure of the display panel provided in an embodiment of the present invention;

[0025] Figure 13 yes Figure 12 A magnified view of a portion of region M in the middle;

[0026] Figure 14 This is a schematic diagram of another planar structure of the display panel provided in an embodiment of the present invention;

[0027] Figure 15 yes Figure 14 Schematic diagram of the cross-sectional structure along the D-D' direction;

[0028] Figure 16 yes Figure 15 A magnified view of a portion of region N in the middle;

[0029] Figure 17 yes Figure 15 Another magnified view of region N in the middle;

[0030] Figure 18 yes Figure 15 Another magnified view of region N in the middle;

[0031] Figure 19 This is a schematic diagram of the planar structure of a display device provided in an embodiment of the present invention. Detailed Implementation

[0032] Various exemplary embodiments of the present invention will now be described in detail with reference to the accompanying drawings. It should be noted that, unless otherwise specifically stated, the relative arrangement, numerical expressions, and values ​​of the components and steps set forth in these embodiments do not limit the scope of the invention.

[0033] The following description of at least one exemplary embodiment is merely illustrative and is in no way intended to limit the invention or its application or use.

[0034] Techniques, methods, and equipment known to those skilled in the art may not be discussed in detail, but where appropriate, such techniques, methods, and equipment should be considered part of the specification.

[0035] In all the examples shown and discussed herein, any specific values ​​should be interpreted as merely exemplary and not as limitations. Therefore, other examples of exemplary embodiments may have different values.

[0036] It should be noted that similar labels and letters in the following figures indicate similar items; therefore, once an item is defined in one figure, it does not need to be discussed further in subsequent figures.

[0037] Please refer to the reference. Figure 1 and Figure 2 , Figure 1 This is a schematic diagram of a planar structure of a display panel provided in an embodiment of the present invention. Figure 2 yes Figure 1 A cross-sectional structural diagram of A-A'. The display panel 000 provided in this embodiment includes: a display area AA and a non-display area NA that is at least partially arranged around the display area AA. The non-display area NA includes at least a first non-display area NA1. The first non-display area NA1 includes a cutting edge Q and a retaining wall B. The cutting edge Q is located on the side of the first non-display area NA1 away from the display area AA.

[0038] Display panel 000 includes:

[0039] The first substrate 10, in the direction Z perpendicular to the light-emitting surface of the display panel 000, includes at least a first substrate 101, a first conductive layer 102, and a second substrate 103 stacked together, with the first conductive layer 102 located between the first substrate 101 and the second substrate 103.

[0040] The first insulating layer 20 is located on the side of the second substrate 103 opposite to the first substrate 101;

[0041] The first metal layer 30 is located on the side of the first insulating layer 20 that is away from the first substrate 101;

[0042] Within the first non-display area NA1, the first metal layer 30 includes at least one first part 301, which is located between the cutting edge Q and the retaining wall B along the direction from the first non-display area NA1 toward the display area AA.

[0043] Specifically, the display panel 000 provided in this embodiment can be an organic light-emitting display panel. The display principle of an organic light-emitting display panel is that, under the drive of a certain electric field, electrons and holes are injected from the cathode and anode into the electron and hole transport layers, respectively. The electrons and holes migrate through the electron and hole transport layers to the light-emitting layer of the light-emitting device, where they meet to form excitons and excite the light-emitting molecules. When the power supply reaches an appropriate voltage, the anode holes and cathode charges combine in the light-emitting layer to produce light. Depending on the formula, red, green, and blue primary colors are produced, constituting the basic colors and forming the display image. Optionally, the display area AA of the display panel 000 in this embodiment can include multiple sub-pixels P of different colors (not filled in the figure). The specific structure of each sub-pixel P can be fabricated using film layers such as the driving circuit layer 001, planarization layer 002, anode layer 003, pixel definition layer 004, organic light-emitting layer 005, cathode layer 006, and thin film encapsulation layer 007 disposed on the first substrate 10. Figure 2 This is merely a simplified illustration of the film layer structure of the display panel 000. This embodiment does not elaborate on the specific film layer structure within the display area AA of the display panel 000. For details, please refer to the design structure of organic light-emitting display panels in related technologies for understanding.

[0044] The display panel 000 in this embodiment includes a display area AA and a non-display area NA that is at least partially surrounding the display area AA. Optionally, the non-display area NA may surround only a portion of the display area AA, or it may surround the entire display area AA. This embodiment does not specifically limit the shape of the non-display area NA. The non-display area NA may be a closed ring shape surrounding the display area AA (not illustrated in the accompanying drawings), that is, the non-display area NA may completely surround the display area AA. Alternatively, the non-display area NA may be an open arc shape surrounding the display area AA, that is, the non-display area NA may surround only a portion of the display area AA (e.g., ...). Figure 1 As shown in the figure, the specific implementation can be designed according to actual needs.

[0045] In this embodiment, the non-display area NA of the display panel 000 includes at least a first non-display area NA1. The first non-display area NA1 includes a cutting edge Q, which is located on the side of the first non-display area NA1 away from the display area AA. The first non-display area NA1 can be understood as the outermost part of the non-display area NA of the display panel 000. Since the manufacturing process of a typical display panel 000 is generally carried out by cutting a large display substrate containing multiple display panels to improve process efficiency, static electricity is easily generated during the cutting process of the large display substrate along the cutting line. This static electricity can have a certain impact on the display effect of the cut display panel 000. After the large display substrate is cut along the cutting line, the outermost edge of each display panel 000 can be understood as the cutting edge Q included in the first non-display area NA1 of the display panel 000 in this embodiment. In this embodiment, at least one barrier wall B is also provided within the first non-display area NA1 of the display panel 000. Optionally, the barrier wall B can be stacked using film layer structures inherent in the display panel 000 itself, to form a barrier wall B with a certain height within the first non-display area NA1. For example, the barrier wall B may include multiple stacked first insulating parts B1, second insulating parts B2, third insulating parts B3, and fourth insulating parts B4. The first insulating part B1 can be disposed in the same layer and with the same material as the bend protection layer 008 (Bend protection layer BPL refers to an organic layer used to fill and bind the bending area, utilizing the bend resistance of the filled organic material to protect the film layer structure on the display panel when the bound flexible circuit board is bent to the backlight side of the display panel) included in the display panel 000 itself. The second insulating part B2 can be disposed in the same layer and with the same material as the planarization layer 002 (PLN) included in the display panel 000 itself. The third insulating part B3 can be disposed in the same layer and with the pixel definition layer 004 (Pixel Definition Layer PDL) included in the display panel 000 itself. Multiple openings can be provided to define the placement position of the organic light-emitting material of each sub-pixel P. That is, the anode and organic light-emitting material of each sub-pixel P can be placed in the same layer and with the same material within the opening of the pixel definition layer 004. The fourth insulating part B4 can be placed in the same layer and with the same material as the isolation support pillar (PS) included in the display panel 000 itself. This allows the structure of the barrier wall B of the first non-display area NA1 to be formed by stacking multiple film layers included in the display panel 000 itself. This is beneficial for improving process efficiency, reducing manufacturing difficulty and cost. At the same time, the barrier wall B structure with a certain height can also prevent the extension of cracks generated during the cutting process of the display panel 000, thereby affecting product yield and display effect. It is understood that the stacking structure of the barrier wall B in this embodiment is only an example. The material of the stacking structure of the barrier wall B can be various, and it can also be formed by stacking other different film layers included in the display panel 000. This embodiment does not make specific limitations on this.

[0046] Further optionally, along the direction from the first non-display area NA1 to the display area AA, the first non-display area NA1 may include two or more partitions B (e.g., ...) spaced apart. Figure 2 As shown), optionally, in this embodiment, the first non-display area NA1 can be provided with two baffles B. The two baffles B are arranged in the direction from the first non-display area NA1 to the display area AA. The baffle B on the side closer to the display area AA can be used as a cutoff mark for the organic encapsulation layer within the display area AA, that is, the organic encapsulation layer within the display area AA is cut off at the position of the baffle B. The other baffle B on the side farther from the display area AA can be used to prevent the cracks generated during the cutting process from extending towards the display area AA. This can be beneficial for narrow bezel design and can also better prevent the extension of cracks generated during the cutting process of the display panel 000.

[0047] It should be noted that in this embodiment... Figure 2 This illustration only shows the cross-sectional structure of the non-display area NA and part of the display area AA of the display panel 000. In a specific implementation, the film layer structure on the first substrate 10 within the non-display area NA includes, but is not limited to, this, and may also include other film layer structures such as power signal lines disposed around the display area AA. This embodiment will not elaborate on these details. Regarding the film layer structure of the display area AA of the display panel 000, this embodiment... Figure 2 This is merely an example; for a more detailed understanding, please refer to the film structure of the display area in related technologies for organic light-emitting display panels. This embodiment will not elaborate further.

[0048] The display panel 000 of this embodiment includes a first substrate 10. Optionally, the first substrate 10 can be used as a substrate of the display panel 000 for fabricating other film layer structures of the display panel 000 on the first substrate 10. In the direction Z perpendicular to the light-emitting surface of the display panel 000, the first substrate 10 includes at least a first substrate 101, a first conductive layer 102, and a second substrate 103 stacked together. The first conductive layer 102 is located between the first substrate 101 and the second substrate 103. The first substrate 101 and the second substrate 103 can be made of at least one organic material such as polyimide, polyethylene terephthalate, or polyurethane. The first substrate 101 and the second substrate 103 made of organic materials such as polyimide, polyethylene terephthalate, or polyurethane have excellent thermal properties, mechanical properties, electrical properties, and dimensional stability, good film-forming properties, high optical transparency, and low moisture absorption. As a result, the first substrate 10 can have good planarization and adhesion properties. The first conductive layer 102 between the first substrate 101 and the second substrate 103 can act as a buffer. During the fabrication of the first substrate 10, the film layers are usually fabricated layer by layer. Optionally, the first substrate 101 is usually fabricated on a rigid substrate first (which can be fabricated by coating), and then the first conductive layer 102 is fabricated. The setting of the first conductive layer 102 can make the bonding force between the first substrate 101 and the second substrate 103 higher, avoiding the problem of film peeling. Thus, the first conductive layer 102 can be used to increase the adhesion force between the first substrate 101 and the second substrate 103, reduce the risk of film peeling, enhance the bending resistance of the first substrate 10, and facilitate its application in the fabrication of flexible display devices.

[0049] Optionally, a driving circuit layer 001 including multiple thin-film transistors T0 may also be provided within the display area AA on the first substrate 10. The provision of the first conductive layer 102 in the first substrate 10, that is, by providing the first conductive layer 102 on the side of the second substrate 103 away from the driving circuit layer 001, can be used to further absorb the light during laser stripping, reduce the influence of the bottom laser on the channel of the thin-film transistors T0 in the driving circuit layer 001 when the first substrate 10 is stripped from the hard substrate by laser, and help improve the electrical uniformity of the thin-film transistors T0, thereby improving the display effect of the display panel 000. Furthermore, since the first substrate 10 of the display panel 000 provided in this embodiment is located on the side away from the driving circuit layer 001 after being peeled off from the rigid substrate in actual use, and the first substrate 101, as the backlight side, is prone to attracting charged dirt particles, this embodiment can block the influence of such charges on the channels of each thin film transistor T0 in the driving circuit layer 001 by providing the first conductive layer 102, thereby improving the electrical reliability of the thin film transistor T0 and further improving the display quality of the display panel 000.

[0050] It is understood that this embodiment does not specifically limit the material of the first conductive layer 102. It only needs to be a conductive material and have a certain roughness to increase the bonding force between the first substrate 101 and the second substrate 103. In specific implementation, the material of the first conductive layer 102 can be selected and set according to actual needs.

[0051] It should be noted that this embodiment is merely an example illustrating the film structure that the first substrate 10 may include. In specific implementations, the design structure of the first substrate 10 includes, but is not limited to, this, and may also include other film structures, such as... Figure 3 As shown, Figure 3 yes Figure 1 Another cross-sectional view along the A-A' direction shows that an inorganic material layer 104 can also be disposed between the first substrate 101 and the first conductive layer 102. Figure 3 (Unfilled) Since the inorganic material layer 104 is usually made on the organic material first substrate 101 using chemical vapor deposition, the inorganic material layer 104 and the first substrate 101 made by this method can have a higher bonding force, which is beneficial to further improve the bending resistance and firmness of the first substrate 10.

[0052] like Figure 1 and Figure 2 As shown, in the display panel 000 of this embodiment, a first insulating layer 20 located on the side of the second substrate 103 facing away from the first substrate 101, and a first metal layer 30 located on the side of the first insulating layer 20 facing away from the first substrate 101 are also provided on the first substrate 10. The first insulating layer 20 can be used to insulate the first conductive layer 102 and the first metal layer 30 of the first substrate 10. Alternatively, when other metal conductive layers are provided between the first substrate 10 and the first insulating layer 20, the first insulating layer 20 can be used to insulate the first metal layer 30 from other metal conductive layers on the first substrate 10. Optionally, the first metal layer 30 can be a metal film layer of each thin-film transistor T0 used to fabricate the driving circuit layer 001 in the display panel 000, that is, the first part 301 can be fabricated with the same layer and material as a certain structure of the thin-film transistor T0. Figure 2 (This example only illustrates the case of the first part 301 and the thin film transistor T0 having the same material and layer as the source and drain.) This helps to reduce manufacturing costs, lower the overall thickness of the display panel 000, and facilitate the thinning design of the panel.

[0053] In this embodiment, the first metal layer 30 is located within the first non-display area NA1, and includes at least one first portion 301, such as... Figure 1 , Figure 4 and Figure 5 As shown, Figure 4 This is a schematic diagram of another planar structure of the display panel provided in an embodiment of the present invention. Figure 5 This is a schematic diagram of another planar structure of the display panel provided in an embodiment of the present invention. Optionally, the first part 301 can be a long strip structure (such as...). Figure 1 (as shown) or a semi-surround structure set in part of the surrounding display area AA (such as...) Figure 4 (as shown) or a segmented, spaced structure (such as...) Figure 5 (as shown) or other shapes, this embodiment does not specifically limit this; further optionally, the first metal layer 30 in the first non-display area NA1 is provided with at least one first part 301 (such as... Figure 1As shown in the figure, two or more first parts 301 (not shown in the figure) can also be provided. The specific arrangement can be determined according to the space of the non-display area NA. This embodiment does not limit this, only requiring that the first parts 301 are arranged within the first non-display area NA1, so that in the direction Z perpendicular to the light-emitting surface of the display panel 000, the first parts 301 and the first conductive layer 102 of the first substrate 10 overlap to form a first storage capacitor Cst1. The first parts 301 are one plate of the first storage capacitor Cst1, and the part of the first conductive layer 102 that overlaps with the first parts 301 is the first... When external charge enters the other plate of the storage capacitor Cst1, such as during the cutting process or electrostatic testing, charge enters from the cutting edge Q of the display panel 000. The storage capacity of the first storage capacitor formed by the overlap between the first part 301 and the first conductive layer 102 of the first substrate 10 can be utilized to prevent the charge from rapidly entering the display area AA. This effectively slows down the speed at which static electricity enters the display panel 000 screen and avoids affecting the electrical performance of the thin film transistor T0 in the driving circuit layer 001 within the display area AA, thereby helping to reduce the probability of display defects. Furthermore, in this embodiment, the first part 301 is positioned between the cutting edge Q and the barrier wall B along the direction from the first non-display area NA1 to the display area AA. That is, the first part 301 is located on the side of the barrier wall B away from the display area AA. Compared to related technologies where the electrostatic ring with electrostatic protection function is designed on the side of the barrier wall closer to the display area, or compared to related technologies where the electrostatic ring is designed to overlap with the barrier wall, this embodiment can first prevent damage to the barrier wall B and the packaging structure of the display panel when the static electricity is too high by setting the first part 301 of the metal material on the side of the barrier wall B away from the display area AA. Thus, through the dual protection of the first part 301 and the barrier wall B, crack propagation can be more effectively prevented, thus avoiding impact on product yield and display effect. Therefore, the arrangement of the first part 301 on the side of the barrier wall B away from the display area AA in this embodiment can not only prevent the charge from rapidly entering the display area AA through the first storage capacitor formed by the overlap between the first part 301 and the first conductive layer 102 of the first substrate 10, but also prevent the barrier wall B and the packaging structure of the display panel 000 from being damaged by excessive static electricity when the first part 301 is provided on the side of the barrier wall B away from the display area AA. Thus, the dual protection of the first part 301 and the barrier wall B can more effectively play the role of static electricity protection and prevent crack propagation, thereby helping to improve product yield and display quality.

[0054] It should be noted that in this embodiment... Figure 1 and Figure 2The structure of the display panel 000 is only illustrated as an example. In specific implementations, the structure of the display panel 000 includes, but is not limited to, this. It may also include other structures that can achieve the display effect. Optionally, the display panel 000 may also include a cover plate, a protective layer, a touch function layer, etc. This embodiment does not limit this. In specific implementations, you can refer to the structure of organic light-emitting display panels in related technologies for understanding.

[0055] It should be further noted that the figures in this embodiment are only for clearly illustrating the relevant structure of the display panel in this embodiment, and do not represent the actual size, thickness, etc. In specific implementation, the figures can be set according to the actual design requirements of the display panel.

[0056] In some alternative embodiments, please continue to refer to the references. Figure 1 and Figure 2 In this embodiment, the display panel 000 further includes a thin-film encapsulation layer 007; the thin-film encapsulation layer 007 includes a first inorganic encapsulation layer 007A, a second inorganic encapsulation layer 007C, and an organic encapsulation layer 007B located between the first inorganic encapsulation layer 007A and the second inorganic encapsulation layer 007C; the first inorganic encapsulation layer 007A and the second inorganic encapsulation layer 007C cover the barrier wall B, and the first inorganic encapsulation layer 007A and the second inorganic encapsulation layer 007C are in direct contact on the side of the barrier wall B away from the display area AA.

[0057] This embodiment explains that the thin-film encapsulation layer 007 in the display panel 000 may include multiple thin films, such as a three-layer or five-layer structure of inorganic, organic, or inorganic materials. Optionally, the thin-film encapsulation layer 007 in this embodiment may include at least a first inorganic encapsulation layer 007A, a second inorganic encapsulation layer 007C, and an organic encapsulation layer 007B located between the first inorganic encapsulation layer 007A and the second inorganic encapsulation layer 007C. The thin-film encapsulation layer 007 is used to block moisture and oxygen, preventing moisture and oxygen from corroding the organic light-emitting device and causing it to fail. The display panel 000 in this embodiment can be encapsulated using Thin Film Encapsulation (TFE) technology, thereby simultaneously meeting the dual requirements of flexibility and encapsulation of organic light-emitting devices in the display panel 000. The first inorganic encapsulation layer 007A and the second inorganic encapsulation layer 007C serve to block water and oxygen, while the organic encapsulation layer 007B serves to alleviate bending stress. The first inorganic encapsulation layer 007A and the second inorganic encapsulation layer 007C can be made of silicon nitride or silicon oxide, etc., and can be formed using a coating process (such as PECVD). The organic encapsulation layer 007B can be made of organosilicon compounds, aromatic compounds, diphenylene, styrene, etc., and can be formed using an inkjet printing process. It should be noted that this embodiment does not limit the material and thickness of the thin film encapsulation layer 007; in specific implementations, it can be set according to actual needs. In this embodiment, the first inorganic encapsulation layer 007A and the second inorganic encapsulation layer 007C cover the barrier wall B, and the first inorganic encapsulation layer 007A and the second inorganic encapsulation layer 007C are in direct contact on the side of the barrier wall B away from the display area AA. This allows the organic encapsulation layer 007B to be omitted in the non-display area NA outside the display area AA, which helps to ensure effective isolation of water, oxygen, etc. in the non-display area NA. Furthermore, since the first inorganic encapsulation layer 007A and the second inorganic encapsulation layer 007C are in direct contact on the side of the barrier wall B away from the display area AA, the inorganic material encapsulation layer can further slow down the rate at which cracks extend to the barrier wall B, thereby improving product yield.

[0058] In some alternative embodiments, please refer to the references. Figure 1 and Figure 6 , Figure 6 yes Figure 1 Another cross-sectional structural diagram along the A-A' direction. In this embodiment, within the first non-display area NA1, the first insulating layer 20 includes a plurality of first openings 20K. In the direction Z perpendicular to the light-emitting surface of the display panel 000, the first openings 20K penetrate the first insulating layer 20.

[0059] The orthographic projection of the first part 301 onto the light-emitting surface of the display panel 000 is located within the orthographic projection range of the first opening 20K onto the light-emitting surface of the display panel 000.

[0060] This embodiment explains that within the first non-display area NA1, the first insulating layer 20 can be provided with multiple first openings 20K penetrating the thickness of the first insulating layer 20. Optionally, such as... Figure 6As shown, each first opening 20K can be a long strip structure surrounding a portion of the display area AA, and multiple first openings 20K can be arranged sequentially at intervals along the direction from the first non-display area NA1 to the display area AA. In this embodiment, by opening multiple first openings 20K in the first non-display area NA1 on the side of the barrier wall B away from the display area AA, the possibility of cracks extending into the display area AA during the panel cutting process can be reduced by using multiple first openings 20K, thereby helping to prevent crack extension. In this embodiment, the orthographic projection of the first part 301 on the light-emitting surface of the display panel 000 is located within the orthographic projection range of the first opening 20K on the light-emitting surface of the display panel 000. That is, the orthographic projection of the first opening 20K on the light-emitting surface of the display panel 000 covers the orthographic projection of the first part 301 on the light-emitting surface of the display panel 000. Optionally, in the direction Z perpendicular to the light-emitting surface of the display panel 000, the first part 301 and the first opening 20K overlap each other. And when the first opening 20K is a structure that penetrates the thickness of the first insulating layer 20, the first part 301 can be precisely embedded in the first opening 20K. Thus, by the orthographic projection of the first part 301 on the light-emitting surface of the display panel 000 being located within the orthographic projection range of the first opening 20K on the light-emitting surface of the display panel 000, it is possible to achieve the desired effect. The first part 301 can be precisely embedded within the first opening 20K, which helps to reduce the distance between the first part 301 and the first conductive layer 102 in the direction Z perpendicular to the light-emitting surface of the display panel 000. Since the capacitance of a capacitor mainly depends on the facing area, the distance between the plates, and the dielectric itself, that is, according to the capacitance calculation formula C=εS / 4πkd (where ε is a constant, S is the facing area of ​​the capacitor plates, d is the distance between the capacitor plates, and k is the electrostatic constant), when the distance between the first part 301 and the first conductive layer 102 in the direction Z perpendicular to the light-emitting surface of the display panel 000 decreases, the capacitance value of the first storage capacitor Cst1 formed by the first part 301 and the first conductive layer 102 is larger, and thus the ability to store charge is stronger. Therefore, in this embodiment, the orthographic projection of the first part 301 on the light-emitting surface of the display panel 000 is located within the orthographic projection range of the first opening 20K on the light-emitting surface of the display panel 000. This avoids increasing the width of the non-display area NA to achieve a narrow bezel, while also increasing the capacitance value of the first storage capacitor Cst1 formed by the first part 301 and the first conductive layer 102, thereby improving electrostatic discharge protection and further slowing down the rate at which static electricity enters the display panel 000, thus improving display quality. Optionally, considering the process factors in actual manufacturing, the side surface of the first opening 20K may be an inclined surface or other shapes, and the orthographic projection of the first opening 20K on the light-emitting surface of the display panel 000 is matched with the maximum opening area of ​​the first opening 20K.

[0061] Understandably, in order to improve the ability to prevent crack propagation, in the direction from the first non-display area NA1 to the display area AA, the first insulating layer 20 may include a plurality of sequentially arranged first openings 20K. When the first metal layer 30 includes a first portion 301, the orthographic projection of the first portion 301 on the light-emitting surface of the display panel 000 is located within the orthographic projection range of the first opening 20K on the light-emitting surface of the display panel 000. When the first metal layer 30 includes a plurality of first portions 301 (not shown in the figure), the orthographic projection of each first portion 301 on the light-emitting surface of the display panel 000 may be located within the orthographic projection range of the first opening 20K on the light-emitting surface of the display panel 000. Within the orthographic projection range of the light-emitting surface, one first part 301 is correspondingly set with one first opening 20K, thereby reducing the distance between each first part 301 and the first conductive layer 102. This allows multiple first parts 301 to form multiple first storage capacitors Cst1 with the first conductive layer 102. The multiple first storage capacitors Cst1 used to store static charge work together to further slow down the speed at which static electricity enters the display panel 000 screen and improve the anti-static effect of the display panel. In this embodiment, the number of first openings 20K and first parts 103 is not specifically limited. In specific implementation, the number can be selected and set according to actual needs.

[0062] In some alternative embodiments, please continue to refer to the references. Figures 1-6 In this embodiment, the first conductive layer 102 includes one or more of amorphous silicon or composite metal oxide.

[0063] This embodiment explains that the material used to fabricate the first conductive layer 102 in the first substrate 10 may include one or more of amorphous silicon or composite metal oxides. Optionally, the amorphous silicon may be A-Si, and the composite metal oxide may be indium tin oxide (ITO), indium gallium zinc oxide (IGZO), or other composite metal oxides. The Si:H bandgap of amorphous silicon contains both acceptor and donor localized bands, exhibiting a dual function of recombination of positive and negative ions. This allows it to shield the electric field generated by moving charges within the first substrate 101 from the influence of this field on the thin-film transistor T0 of the driving circuit layer 001 during laser stripping of the first substrate 10. Simultaneously, it can absorb light across the entire wavelength range, achieving a light-shielding effect on the active layer of the thin-film transistor T0 in the driving circuit layer 001, without issues such as metal reflection or heating, thus contributing to improved reliability. Indium tin oxide or indium gallium zinc oxide in the composite metal oxide is a transparent metal oxide semiconductor material, which has a similar function to amorphous silicon semiconductor material. It can block the influence of possible mobile charges inside the first substrate 101 on the upper layer. At the same time, it can block some of the influence of ambient light at the bottom or the heat energy in the laser lift-off process in the flexible manufacturing process on the thin film transistor T0 in the driving circuit layer 001. Moreover, since indium tin oxide has high light transmittance, it can also avoid reducing the overall light transmittance of the display panel 000.

[0064] It is understood that in this embodiment, the first part 301 of the first metal layer 30 and the first conductive layer 102 form a first storage capacitor Cst1 in the first non-display area NA1, which can store electrostatic charge. The first conductive layer 102 in the first non-display area NA1 can be in a floating state, that is, the first conductive layer 102 is not connected to any potential. The capacitor formed by the first part 301 of the first metal layer 30 and the first conductive layer 102 can be understood as a parallel plate capacitor. The overlapping area of ​​the first part 301 and the first conductive layer 102 is the area S of the capacitor plates facing each other in the formula C = εS / 4πkd for calculating the capacitance value. ε is the dielectric constant of the medium between the first part 301 and the first conductive layer 102. Therefore, even if the first conductive layer 102 is in a floating state, the first part 301 only needs to have an overlapping area with the first conductive layer 102 to form the first storage capacitor Cst1. In this embodiment, the facing area of ​​the first part 301 and the first conductive layer 102 is not specifically limited. While meeting the requirement of narrow bezel, the facing area of ​​the first part 301 and the first conductive layer 102 can be designed to be as large as possible, which is beneficial to better improve the electrostatic protection capability of the display panel 000.

[0065] In some alternative embodiments, please refer to the references. Figure 1 and Figures 7-9 , Figure 7 yes Figure 1 Another cross-sectional structural diagram along the A-A' direction. Figure 8 This is a schematic diagram of another planar structure of the display panel provided in an embodiment of the present invention. Figure 9 yes Figure 8 A cross-sectional view along the C-C' direction is shown in this embodiment. In the first non-display area NA1, the second substrate 103 includes at least one first groove 1031 on the side away from the first substrate 101. In the direction Z perpendicular to the light-emitting surface of the display panel 000, the first groove 1031 does not penetrate the second substrate 103. The first groove 1031 is a long strip structure arranged around the display area AA.

[0066] The orthographic projection of the first part 301 onto the light-emitting surface of the display panel 000 is located within the orthographic projection range of the first groove 1031 onto the light-emitting surface of the display panel 000, and the first part 301 is in contact with the first groove 1031.

[0067] This embodiment explains that at least one first groove 1031 can be formed on the side of the second substrate 10 of the first substrate 10 facing the first insulating layer 20. Optionally, the number of first grooves 1031 can match the number of first portions 301 of the first metal layer 30, such as... Figure 1 and Figure 7 As shown, taking the first metal layer 30 including a first part 301 as an example, the second substrate 103 has a first groove 1031 on the side opposite to the first substrate 101, or as shown in the figure. Figure 8 and Figure 9 As shown, if the first metal layer 30 includes a plurality of first portions 301, then the second substrate 103 has a plurality of first grooves 1031 on the side away from the first substrate 101, and the plurality of first grooves 1031 can be arranged sequentially along the direction from the first non-display area NA1 to the display area AA.

[0068] In this embodiment, in the direction Z perpendicular to the light-emitting surface of the display panel 000, the first groove 1031 does not penetrate the thickness of the second substrate 103, and the first groove 1031 is a long strip structure surrounding the display area AA, such as... Figure 1 and Figure 8As shown, the first groove 1031 is arranged around a portion of the display area AA, such that the orthographic projection of the first part 301 on the light-emitting surface of the display panel 000 is located within the orthographic projection range of the first groove 1031 on the light-emitting surface of the display panel 000. The first part 301 can be embedded in the bottom of the groove 1031. The surface of the first part 301 facing the first substrate 101 is in direct contact with the first groove 1031. Thus, by opening the first groove 1031 on the second substrate 103, the distance between the first part 301 and the first conductive layer 102 in the direction perpendicular to the light-emitting surface of the display panel 000 is further reduced. This can further enhance the charge storage capacity of the first storage capacitor formed by the first part 301 and the first conductive layer 102, more effectively slow down the speed at which static electricity enters the display panel 000 screen, and improve the anti-static effect of the display panel.

[0069] Optionally, in this embodiment, the first groove 1031 opened on the side of the second substrate 103 away from the first substrate 101 is a whole elongated structure, which can reduce the manufacturing difficulty of the first groove 1031 and help simplify the manufacturing process of the first groove 1031. The projections of the first part 301 onto the light-emitting surface of the display panel 000, the first opening 20K in the first insulating layer 20 onto the light-emitting surface of the display panel 000, and the first groove 1031 on the side of the second substrate 103 away from the first substrate 101 onto the light-emitting surface of the display panel 000 can overlap each other. Furthermore, the projections of the first opening 20K in the first insulating layer 20 onto the light-emitting surface of the display panel 000 and the first groove 1031 on the side of the second substrate 103 away from the first substrate 101 onto the light-emitting surface of the display panel 000 can cover the projection of the first part 301 onto the light-emitting surface of the display panel 000. This allows the first part 301 to be completely embedded in the groove formed by the first opening 20K and the first groove 1031. This, in turn, helps to further reduce the distance between the first part 301 and the first conductive layer 102 through the arrangement of the first opening 20K and the first groove 1031, thereby further enhancing the charge storage capacity of the storage capacitor.

[0070] It is understood that the first opening 20K and the first groove 1031 in this embodiment can both be elongated structures surrounding a portion of the display area AA. The first part 301 in this embodiment can be an elongated structure or a segmented structure located at the same position of the first groove 1031. This embodiment does not specifically limit the shape of the first part 301. In specific implementation, the shape can be selected according to actual needs.

[0071] In some alternative embodiments, please refer to Figure 10 , Figure 10This is a schematic diagram of another planar structure of the display panel provided in an embodiment of the present invention. In this embodiment, the first part 301 of the first metal layer 30 in the first non-display area NA1 is a long strip structure surrounding the display area AA; the first part 301 is connected to a fixed potential signal terminal.

[0072] This embodiment explains a plate of the first storage capacitor Cst1 formed by the first part 301 and the first conductive layer 102, which is used to slow down the transmission speed of electrostatic charge to the display area AA. Specifically, the first part 301 can be an elongated structure, thereby maximizing the area of ​​the first storage capacitor Cst1 facing the first conductive layer 102, which enhances the capacitor's charge storage capacity and slows down the transmission speed of electrostatic charge. This embodiment also provides a fixed potential signal connected to the elongated first part 301. Optionally, the elongated first part 301 can extend to the bonding area BA of the display panel 000. The bonding area BA is provided with multiple conductive pads 009, which are used to bond a driver chip or flexible circuit board to the bonding area BA. This allows the drive signal of the driver chip or flexible circuit board to be transmitted to the display panel 000 through the conductive pads 009, thereby achieving the driving display effect of the display panel 000. In this embodiment, at least one of the multiple conductive pads 009 includes a first conductive pad 0091 connected to the first part 301. That is, the first conductive pad 0091 can be understood as a fixed potential signal terminal, thereby enabling the first part 301 to receive a fixed potential signal via a driver chip or flexible circuit board. This embodiment's provision of a fixed potential signal to the first part 301 avoids the problem of static electricity accumulation caused by the floating state of the elongated first part 301 (long straight wires are prone to static charge accumulation when floating). Furthermore, by connecting a fixed potential signal (which can be a positive or negative potential signal, not limited in this embodiment) to the first part 301, a capacitor for storing charge can be formed between the first part 301 and the first conductive layer 102. This slows down the transmission of static electricity to the display area AA and, during the slow transmission of static electricity, gradually guides the static charge to the bonding area BA via the elongated first part 301. This more effectively prevents static charge from entering the display area AA and affecting the display quality of the display panel 000.

[0073] In some alternative embodiments, please refer to Figure 11 , Figure 11 This is a schematic diagram of another planar structure of the display panel provided in an embodiment of the present invention. In this embodiment, the first metal layer 30 includes a plurality of first parts 301, which are arranged at intervals along the direction from the first non-display area NA1 to the display area AA.

[0074] This embodiment explains that the first metal layer 30 can be provided with multiple first parts 301 within the first non-display area NA1. The multiple first parts 301 are arranged at intervals along the direction from the first non-display area NA1 to the display area AA. Optionally, the first metal layer 30 can be provided with 2-5 first parts 301 within the first non-display area NA1. Further optionally, the first part 301 in this embodiment can be a long strip structure arranged around part of the display area AA. This can avoid the problem of too many first parts 301 being detrimental to the narrow bezel design of the display panel 000, while also avoiding the problem of too few first parts 301 causing the area facing the first conductive layer 102 to be too small, which would affect the charge storage capacity of the capacitor and thus hinder the slowing down of static electricity transmission.

[0075] It is understood that in this embodiment Figure 11 The example given is five first parts 301 arranged at intervals along the direction from the first non-display area NA1 to the display area AA. In actual implementation, the number of multiple first parts 301 arranged at intervals along the direction from the first non-display area NA1 to the display area AA includes, but is not limited to, this, and can also be other configuration structures.

[0076] In some alternative embodiments, please continue to refer to Figure 11 In this embodiment, along the direction from the first non-display area NA1 to the display area AA, among two adjacent first parts 301, one first part 301 is connected to the positive voltage signal terminal, and the other first part 301 is connected to the negative voltage signal terminal.

[0077] This embodiment explains that among a plurality of first parts 301 arranged at intervals along the direction from the first non-display area NA1 to the display area AA, any two adjacent first parts 301 are connected to different fixed potential signals. Optionally, along the direction from the first non-display area NA1 to the display area AA, one of two adjacent first parts 301 is connected to a positive voltage signal terminal, and the other is connected to a negative voltage signal terminal. The positive voltage signal terminal and the negative voltage signal terminal can be understood as two different conductive pads 009 in the bonding area BA. Taking five first parts 301 arranged at intervals along the direction from the first non-display area NA1 to the display area AA as an example, these five first parts 301 are first part 301A, first part 301B, first part 301C, first part 301D, and first part 301E. If first part 301A is connected to a positive potential signal terminal, that is, connected to a positive potential signal through the conductive pad 009, then first part 301B is connected to a negative potential signal terminal, and first part 301C is connected to a positive voltage signal terminal. The first part 301D is connected to the negative potential signal terminal, and the first part 301E is connected to the positive potential signal terminal. If the first part 301A is connected to the negative potential signal terminal, that is, the negative potential signal is connected through the conductive pad 009, then the first part 301B is connected to the positive potential signal terminal, the first part 301C is connected to the negative potential signal terminal, the first part 301D is connected to the positive potential signal terminal, and the first part 301E is connected to the negative potential signal terminal. Thus, by setting multiple long strip structures of the first part 301, the static charge can be conducted away sequentially. For example, if the static charge is not completely conducted away when it is transmitted to A by the first part 301A, then the first part 301B continues to conduct the static charge away until the first part 301E. This helps to slow down the speed of static charge transmission to the display area AA by the capacitance formed by the first part 301 and the first conductive layer 102, and at the same time, the static charge can be gradually conducted away to the bonding area BA by multiple first parts 301 connected to different fixed potential signals, so that the static charge is conducted away more fully and the static protection effect of the display panel 000 is further improved.

[0078] In some alternative embodiments, please refer to the references. Figure 12 and Figure 13 , Figure 12 This is a schematic diagram of another planar structure of the display panel provided in an embodiment of the present invention. Figure 13 yes Figure 12 A partial enlarged view of the M region. In this embodiment, the first part 301 includes a plurality of first sub-parts 3011, which are spaced apart along the first direction X. In the direction parallel to the light-emitting surface of the display panel 000, the first direction X intersects with the direction from the first non-display area NA1 to the display area AA.

[0079] This embodiment explains that the first part 301 of the first metal layer 30 can also be a segmented structure. Specifically, the first part 301 includes a plurality of first sub-parts 3011, which are spaced apart along a first direction X. The first direction X can be understood as the direction parallel to the light-emitting surface of the display panel 000 and intersecting the direction from the first non-display area NA1 to the display area AA. For example, when the first non-display area NA1 is... Figure 12 When the schematic display area AA is shown within the left and right borders, the first direction X can then be... Figure 12 The indicated direction, when the first non-display area NA1 is Figure 12 When the illustrated display area AA is within the upper border, the first direction X can then be... Figure 12 The horizontal direction is shown in the figure (not shown in the figure). In this embodiment, the first part 301 is provided with a segmented structure including a plurality of first sub-parts 3011 arranged at intervals along the first direction X, which can avoid the accumulation of electrostatic charge on the first part 301.

[0080] Optional, such as Figure 12 and Figure 13 As shown, the first part 301 in this embodiment may include multiple parts. The multiple first parts 301 may be arranged sequentially at intervals along the direction from the first non-display area NA1 to the display area AA. Each first part 301 may be a segmented structure including multiple first sub-parts 3011 arranged at intervals along the first direction X. This can avoid the accumulation of electrostatic charge on the first part 301. At the same time, the arrangement of multiple first parts 301 can enhance the charge storage capacity of the capacitor formed by the first part 301 and the first conductive layer 102, thereby better improving the electrostatic protection effect of the display panel 000.

[0081] Optional, such as Figure 12 As shown, along the direction from the first non-display area NA1 to the display area AA, two adjacent first parts 301 include the first part 301 of the Ath order (e.g., Figure 12 Article 301A) and Article A+1, Part 1, 301 (as in Figure 12 301B in the first part 301), where A is a positive integer; along the first direction X, there is an interval F between two adjacent first subparts 3011 of the same first part 301;

[0082] In the direction from the first non-display area NA1 to the display area AA, the first part of section A, 301 (as shown) Figure 12 The interval F (e.g., 301A) in the middle) Figure 12 The interval F1 in the middle) and the first part 301 of the A+1th article (as shown in the figure) Figure 12 The interval F (e.g., 301B) in the middle Figure 12 The interval F2 in the middle does not overlap.

[0083] This embodiment explains that the first part 301 within the first non-display area NA1 can be configured as a segmented structure including multiple first sub-parts 3011, which can avoid the accumulation of static electricity. Furthermore, by configuring the spacing F between adjacent first parts 301 along the direction from the first non-display area NA1 to the display area AA, the spacing areas F do not overlap. Figure 12 As shown, the first sub-parts 3011 of two adjacent first parts 301 are alternately staggered. In the direction from the first non-display area NA1 to the display area AA, a gap F1 of the first part 301A overlaps with a first sub-part 3011 of the first part 301B, but does not overlap with the gap F2 between two adjacent first sub-parts 3011 in the first part 301B. The staggered first sub-parts 3011 can prevent cracks from extending towards the display area AA. For example, Figure 13 As the crack G extends from a gap F1 in the first part 301A to the second part 301B, since the gap F2 and the gap F1 in the second part 301B do not overlap in the direction from the first non-display area NA1 to the display area AA, the crack G will be blocked by the first part 3011 of the first part 301B when it extends from the gap F1 to the display area AA, which helps to ensure product yield.

[0084] In some alternative embodiments, please continue to refer to the references. Figure 12 and Figure 13 In this embodiment, along the first direction X, that is, along the arrangement direction of multiple first sub-parts 3011 in the same first part 301, the length h of the first sub-part 3011 ranges from 50 to 100 μm.

[0085] This embodiment explains that the first part 301 within the first non-display area NA1 is configured as a segmented structure including multiple first sub-parts 3011. To avoid static electricity accumulation, the length h of each segmented first sub-part 3011 in the first direction X is in the range of 50-100um. This avoids static electricity accumulation caused by excessively long length h of the first sub-part 3011, which would affect display quality. It also avoids the increased manufacturing difficulty caused by setting the length h of the first sub-part 3011 to be too short. Therefore, in this embodiment, the length h of the first sub-part 3011 in the first direction X is set to be between 50-100um, which is beneficial to ensure the effect of electrostatic protection and also reduces the manufacturing difficulty.

[0086] It is understood that the lengths h of the multiple first sub-parts 3011 included in each first part 301 in this embodiment in the first direction X may be equal or unequal, as long as the length h of the first sub-parts 3011 in the first direction X is between 50-100um. This embodiment does not make specific limitations on whether the lengths of different first sub-parts 3011 are equal. In specific implementation, the setting can be selected according to actual needs.

[0087] In some alternative embodiments, please continue to refer to the references. Figure 12 and Figure 13 In this embodiment, the width n1 of the first part 301 is 3-5um along the direction from the first non-display area NA1 to the display area AA.

[0088] This embodiment explains that the width n1 of the first part 301 in the direction from the first non-display area NA1 to the display area AA of the first metal layer 30 can be between 3 and 5 μm. This avoids the first part 301 being too wide in the direction from the first non-display area NA1 to the display area AA, which would occupy too much space in the bezel area and be detrimental to achieving a narrow bezel design. It also avoids the first part 301 being too narrow in the direction from the first non-display area NA1 to the display area AA, which would affect the charge storage capacity of the first storage capacitor formed by the first part 301 and the first conductive layer 102. Therefore, in this embodiment, the width n1 of the first part 301 in the direction from the first non-display area NA1 to the display area AA is set to be between 3 and 5 μm. This not only facilitates the achievement of a narrow bezel but also enhances the charge storage capacity of the first storage capacitor formed by the first part 301 and the first conductive layer 102, thereby improving the electrostatic discharge protection effect.

[0089] Optionally, in this embodiment, the width n2 of the first opening 20K of the first insulating layer 20 in the direction from the first non-display area NA1 to the display area AA can be less than or equal to 7μm, and n2 can be greater than or equal to n1. Similarly, the width n3 of the first groove 1031 formed on the surface of the second substrate 103 away from the first substrate 101 in the direction from the first non-display area NA1 to the display area AA can also be less than or equal to 7μm, and n3 can be greater than or equal to n1. This allows the orthogonal projection of the first part 301 onto the light-emitting surface of the display panel 000 to be located at the first opening 20K or the first groove 1031 onto the display area AA. Within the projection range of the light-emitting surface of the display panel 000, the first part 301 can fall exactly into the first opening 20K and the first groove 1031, so that the side surface of the first part 301 facing the first substrate 101 can directly contact the bottom of the first groove 1031. This helps to avoid the width n2 of the first opening 20K and the width n3 of the first groove 1031 being too wide, which would affect the narrow bezel design. At the same time, it can also reduce the distance between the first part 301 and the first conductive layer 102, further improving the charge storage capacity of the first storage capacitor formed by the first part 301 and the first conductive layer 102.

[0090] In some alternative embodiments, please continue to refer to the references. Figure 1 and Figure 2In this embodiment, the display panel 000 of the display area AA also includes a plurality of thin film transistors T0. The thin film transistors T0 include at least a gate T0G, a source T0S, and a drain T0D; the source T0S and the drain T0D are located in the first metal layer 30.

[0091] This embodiment explains that the first part 301 within the first non-display area NA1 can be made of the same material as the source TOS and drain TOD of the thin-film transistor T0. Optionally, the thin-film transistor T0 can be any transistor set in the driving circuit layer 001 of the display panel 000. Since the metal film layer where the source TOS and drain TOD of the thin-film transistor T0 are located is generally made of a triple layer formed by Ti / Al / Ti (titanium / aluminum / titanium), while the metal film layer where the gate TOG of the thin-film transistor T0 is located is generally made of a Mo (molybdenum) layer, the flexibility of the metal film layer where the source TOS and drain TOD of the thin-film transistor T0 is better than that of the metal film layer where the gate TOG of the thin-film transistor T0 is located. Therefore, setting the first part 301 in the same layer as the source TOS and drain TOD of the thin-film transistor T0 is beneficial to relieve stress and thus better prevent crack propagation. Furthermore, in this embodiment, the first part 301 is disposed on the same layer as the source TOS and drain TOD of the thin-film transistor T0. This avoids the situation where, if the first part 301 is disposed on other metal film layers on the side of the metal film layer containing the source TOS and drain TOD of the thin-film transistor T0 that are far from the first substrate 10, the distance between the first part 301 and the first conductive layer 102 in the direction Z perpendicular to the light-emitting surface of the display panel would be too large, affecting the charge storage capacity of the first storage capacitor formed by the first part 301 and the first conductive layer 102. Therefore, in this embodiment, the first part 301 within the first non-display area NA1 is made of the same material and with the same process as the source TOS and drain TOD of the thin-film transistor T0. This is beneficial to improving the ability of the first part 301 to prevent crack propagation, while also ensuring the charge storage capacity of the first storage capacitor formed by the first part 301 and the first conductive layer 102, thereby improving the product yield and display quality of the display panel 000.

[0092] In some alternative embodiments, please refer to the references. Figure 14 , Figure 15 and Figure 16 , Figure 14 This is a schematic diagram of another planar structure of the display panel provided in an embodiment of the present invention. Figure 15 yes Figure 14 A schematic diagram of the cross-sectional structure along the D-D' direction. Figure 16 yes Figure 15A partial enlarged view of region N in this embodiment shows that in the display panel 000 provided in this embodiment, within the first non-display area NA1, the side of the second substrate 103 facing away from the first substrate 101 includes a plurality of second grooves 1032. The plurality of second grooves 1032 are arranged at intervals along the direction from the first non-display area NA1 to the display area AA. In the direction perpendicular to the light-emitting surface of the display panel 000, the second grooves 1032 do not penetrate the second substrate 103. Along the direction from the first non-display area NA1 to the display area AA, the plurality of second grooves 1032 are located between the first part 301 and the barrier wall B.

[0093] The second groove 1032 includes at least a first cavity 1032A and a second cavity 1032B. In the direction Z perpendicular to the light-emitting surface of the display panel 000, the first cavity 1032A is located on the side of the second cavity 1032B facing the first substrate 101.

[0094] Along the direction parallel to the light-emitting surface of the display panel 000, the inner diameter D1 of the first cavity 1032A is greater than the inner diameter D2 of the second cavity 1032B.

[0095] The display panel 000 also includes a thin film encapsulation layer 007 and a first inorganic layer 0010. The thin film encapsulation layer 007 is located on the side of the second substrate 103 away from the first substrate 101, and the first inorganic layer 0010 is located on the side of the thin film encapsulation layer 007 away from the first substrate 101.

[0096] The thin film encapsulation layer 007 and the first inorganic layer 0010 are in contact with at least the sidewall 10320 of the second groove 1032.

[0097] This embodiment explains that on the first substrate 10 of the display panel 000, within the first non-display area NA1, the side of the second substrate 103 facing away from the first substrate 101 may further include a plurality of second grooves 1032. Along the direction from the first non-display area NA1 to the display area AA, the plurality of second grooves 1032 are located between the first part 301 and the barrier wall B, that is, the plurality of second grooves 1032 are located on the side of the barrier wall B away from the display area AA, and the plurality of second grooves 1032 are located on the side of the first part 301 close to the display area AA. The plurality of second grooves 1032 are arranged at intervals along the direction from the first non-display area NA1 to the display area AA. In the direction perpendicular to the light-emitting surface of the display panel 000, the second grooves 1032 do not penetrate the thickness of the second substrate 103. Optionally, along the direction from the first non-display area NA1 to the display area AA, the number of second grooves 1032 located between the first part 301 and the barrier wall B may also be one. This embodiment does not limit the specific number of second grooves 1032. Optionally, as... Figure 14As shown, each second groove 1032 can be a strip structure arranged around a portion of the display area AA, which helps to simplify the manufacturing process of the second groove 1032 on the side surface of the second substrate 103 facing away from the first substrate 101.

[0098] In this embodiment, the second groove 1032 includes at least a first cavity 1032A and a second cavity 1032B. In the direction Z perpendicular to the light-emitting surface of the display panel 000, the first cavity 1032A is located on the side of the second cavity 1032B facing the first substrate 101. Furthermore, in the direction parallel to the light-emitting surface of the display panel 000, the inner diameter D1 of the first cavity 1032A is larger than the inner diameter D2 of the second cavity 1032B. That is, in this embodiment, the cross-section of the second groove 1032 formed on the side of the second substrate 103 away from the first substrate 101 (e.g., ...) Figure 15 and Figure 16 (Illustrative) This is a structure that is narrow at the top and wide at the bottom. During the manufacturing process of the organic light-emitting layer 005 in the display panel 000, the organic light-emitting material is made by vapor deposition. In order to achieve the narrow bezel design, the width of the non-display area NA of the display panel 000 is relatively small, which often makes the barrier wall B closer to the display area AA. As a result, when the organic light-emitting layer 005 is manufactured, the organic light-emitting material is easily vapor-deposited onto the area of ​​the barrier wall B away from the display area AA, that is, the organic light-emitting material is easily vapor-deposited onto the area where the second groove 1032 is located, which in turn has a certain impact on the realization of the narrow bezel design. Therefore, in this embodiment, a second groove 1032, which is narrower at the top and wider at the bottom, is provided on the side of the barrier wall B away from the display area AA. Even if the width of the non-display area NA is small and the barrier wall B is relatively close to the display area AA, the over-cut design with a larger inner diameter D1 of the first cavity 1032A of the second groove 1032 can prevent organic light-emitting materials from being deposited in the area where the second groove 1032 is located. This effectively isolates the deposited layer of organic light-emitting materials in this area, preventing the organic light-emitting materials from being deposited in the area where the second groove 1032 is located. This is beneficial for achieving a narrow bezel effect while ensuring the manufacturing yield of the display panel.

[0099] The display panel 000 of this embodiment further includes a thin-film encapsulation layer 007 and a first inorganic layer 0010. The thin-film encapsulation layer 007 is located on the side of the second substrate 103 away from the first substrate 101, and the first inorganic layer 0010 is located on the side of the thin-film encapsulation layer 007 away from the first substrate 101. The thin-film encapsulation layer 007 may include a first inorganic encapsulation layer 007A, a second inorganic encapsulation layer 007C, and an organic encapsulation layer 007B located between the first inorganic encapsulation layer 007A and the second inorganic encapsulation layer 007C. The first inorganic encapsulation layer 007A and the second inorganic encapsulation layer 007C cover the barrier wall B, and the first inorganic encapsulation layer 007A and the second inorganic encapsulation layer 007C are in direct contact on the side of the barrier wall B away from the display area AA. The thin-film encapsulation layer 007 is used to block moisture and oxygen, preventing moisture and oxygen from corroding the organic light-emitting device and causing it to fail. In this embodiment, the thin film encapsulation layer 007 and the first inorganic layer 0010 can be fabricated on one side of the first substrate 101 at the bottom of the second groove 1032 using a CVD (Chemical Vapor Deposition) process. Due to the large overcut design of the inner diameter D1 of the first cavity 1032A of the second groove 1032, the thin film encapsulation layer 007 and the first inorganic layer 0010 fabricated using the CVD process can at least contact the sidewall 10320 of the second groove 1032. That is, a multi-inorganic encapsulation structure of the first inorganic encapsulation layer 007A, the second inorganic encapsulation layer 007C, and the first inorganic layer 0010 of the thin film encapsulation layer 007 is formed on the sidewall 10320 of the second groove 1032. This is beneficial for better blocking moisture intrusion and improving the manufacturing yield of the display panel.

[0100] It is understood that in this embodiment Figures 14-16 This is merely an example illustrating the film structure that may be included on the side of the barrier B away from the display area AA in the first non-display area NA1. The film structure of the display panel 000 within the first non-display area NA1 includes, but is not limited to, this. It may also include other film structures such as those for making positive power signal lines, negative power signal lines, shift register circuits, etc. This embodiment will not elaborate on these details. In specific implementation, you can refer to the film structure of organic light-emitting display panels in related technologies for understanding.

[0101] In some alternative embodiments, please refer to the references. Figure 14 , Figure 15 and Figure 17 , Figure 17 yes Figure 15 Another enlarged view of the N region. In this embodiment, the display panel 000 also includes a second metal layer 40. In the direction Z perpendicular to the light-emitting surface of the display panel 000, the second metal layer 40 is located between the thin film encapsulation layer 007 and the first inorganic layer 0010.

[0102] The display panel 000 of the display area AA includes a first touch electrode TP1, which is located in the second metal layer 40.

[0103] Within the first non-display area NA1, the second metal layer 40 includes a plurality of second parts 401 (in this embodiment, the second metal layer 40 includes two second parts 401 as an example for illustration), and the plurality of second parts 401 are arranged at intervals along the direction from the first non-display area NA1 to the display area AA.

[0104] The orthographic projection of the second part 401 onto the light-emitting surface of the display panel 000 is located within the orthographic projection range of the second groove 1032 onto the light-emitting surface of the display panel 000.

[0105] This embodiment explains that the display panel 000 may further include a touch function layer. Optionally, the touch function layer may be disposed on the side of the thin film encapsulation layer 007 away from the first substrate 10. Within the display area AA of the display panel 000, the touch function layer may include a first touch electrode TP1, which can be used to realize the touch effect of the display panel. This embodiment does not elaborate on the working principle of the first touch electrode TP1. Touch driving signals can be provided through a driver chip or flexible circuit board bonded to the display panel 000. The first touch electrode TP1 of the display panel 000 can realize capacitive touch mode. For details, please refer to the structure of capacitive touch technology in related technologies. The touch function layer in this embodiment may include a second metal layer 40. In the direction Z perpendicular to the light-emitting surface of the display panel 000, the second metal layer 40 is located between the thin film encapsulation layer 007 and the first inorganic layer 0010. The first touch electrode TP1 in the touch function layer is disposed on the second metal layer 40, that is, the second metal layer 40 can be used as a touch function layer.

[0106] In this embodiment, multiple second portions 401 are provided in the second metal layer 40 within the first non-display area NA1. Optionally, the figures in this embodiment illustrate the example of the second metal layer 40 including two second portions 401. In specific implementation, the number of second portions 401 can also be other, and the multiple second portions 401 are arranged at intervals along the direction from the first non-display area NA1 to the display area AA. In this embodiment, the second portions 401 in the first non-display area NA1 can be manufactured in the same layer, with the same material and process as the first touch electrode TP1 in the display area AA, which helps to reduce process steps and improve process efficiency.

[0107] In this embodiment, the orthographic projection of the second part 401 on the light-emitting surface of the display panel 000 is located within the orthographic projection range of the second groove 1032 on the light-emitting surface of the display panel 000. That is, the orthographic projection of the second groove 1032 on the light-emitting surface of the display panel 000 can cover the orthographic projection of the second part 401 on the light-emitting surface of the display panel 000, so that the second part 401 can be precisely embedded in the second groove 1032. The conductive material of the second part 401 can form a second storage capacitor Cst2 with the second conductive layer 102. Optionally, the second part 401 can be a long strip structure, a semi-circular structure partially surrounding the display area AA, a segmented and spaced structure, or a structure of other shapes. This embodiment does not specifically limit this. The second part 401 overlaps with the first conductive layer 102 of the first substrate 10 to form a second storage capacitor Cst2. The second part 401 is one electrode of the second storage capacitor Cst2, and the part of the first conductive layer 102 that overlaps with the second part 401 is the other electrode of the second storage capacitor Cst2. When external charge enters, assuming that the first storage capacitor Cst1 formed by the first part 301 and the first conductive layer 102 is insufficient to slow down the transmission speed of static electricity, this embodiment further forms a second storage capacitor Cst2 by using the second part 401, which is on the same layer as the first touch electrode TP1, between the first part 301 and the barrier wall B, and by overlapping the second part 401 with the first conductive layer 102 of the first substrate 10. This further slows down the speed at which static electricity enters the display panel 000 screen, and can more effectively reduce the probability of display defects.

[0108] It is understandable that when the first non-display area NA1 of the display panel 000 is provided with the second groove 1032, during the process of fabricating the touch function layer on the side of the thin film encapsulation layer 007 away from the first substrate 10, such as when fabricating the first touch electrode TP1 of the second metal layer 40, the metal of the second metal layer 40 can easily remain inside the second groove 1032. This is determined by the structure of the second groove 1032, which is narrow at the top and wide at the bottom. Therefore, the second part 401 in this embodiment can be directly formed using the residual metal of the second metal layer 40 in the second groove 1032. That is, the fabrication of the second part 401 does not require additional processing steps. It is only necessary to use the residual metal of the second metal layer 40 in the second groove 1032 during the process of completing the first touch electrode TP1 to realize the fabrication of the second part 401. This not only avoids adding process steps, but also further slows down the transmission speed of static electricity to the display area AA through the second part 401, thereby improving the electrostatic protection effect.

[0109] In some alternative embodiments, please refer to the references. Figure 14 , Figure 15 and Figure 18 , Figure 18 yes Figure 15Another enlarged view of the N region. In this embodiment, the display panel 000 also includes a third metal layer 50. In the direction Z perpendicular to the light-emitting surface of the display panel 000, the third metal layer 50 is located on the side of the first inorganic layer 0010 away from the second metal layer 40.

[0110] The display panel 000 of the display area AA includes a second touch electrode TP2, which is located in the third metal layer 50.

[0111] Within the first non-display area NA1, the third metal layer 50 includes a plurality of third parts 501, which are arranged at intervals along the direction from the first non-display area NA1 to the display area AA.

[0112] The orthographic projection of the third part 501 onto the light-emitting surface of the display panel 000 is located within the orthographic projection range of the second groove 1032 onto the light-emitting surface of the display panel 000.

[0113] In the direction Z perpendicular to the light-emitting surface of the display panel 000, the second part 401 and the third part 501 at least partially overlap.

[0114] This embodiment explains that the touch function layer disposed on the side of the thin-film encapsulation layer 007 away from the first substrate 10 in the display panel 000 may include a first touch electrode TP1 and a second touch electrode TP2. The first touch electrode TP1 and the second touch electrode TP2 can be used to realize the touch effect of the display panel. This embodiment does not elaborate on the working principle of the first touch electrode TP1 and the second touch electrode TP2. Touch driving signals can be provided through a driver chip or flexible circuit board bonded to the display panel 000. The first touch electrode TP1 and the second touch electrode TP2 of the display panel 000 can realize a mutual capacitance touch mode. For details, please refer to the structure of capacitive touch technology in related technologies for understanding. This embodiment... Figure 14 This illustration merely demonstrates the positional relationship of the film layers of the first touch electrode TP1 and the second touch electrode TP2. In specific implementations, the first touch electrode TP1 and the second touch electrode TP2 may overlap in the direction Z perpendicular to the light-emitting surface of the display panel 000, or they may not overlap; this embodiment is not limited to this. The touch functional layer of this embodiment may further include a third metal layer 50, located on the side of the first inorganic layer 0010 away from the second metal layer 40 in the direction Z perpendicular to the light-emitting surface of the display panel 000. That is, the first inorganic layer 0010 serves as both an inorganic encapsulation effect and an insulating layer between the third metal layer 50 and the second metal layer 40. The first touch electrode TP1 in the touch functional layer is disposed on the second metal layer 40, and the second touch electrode TP2 is disposed on the third metal layer 50; that is, both the second metal layer 40 and the third metal layer 50 can be used as the touch functional layer.

[0115] In this embodiment, multiple third portions 501 are provided in the third metal layer 50 within the first non-display area NA1. Optionally, the figures in this embodiment illustrate the example of the third metal layer 50 including two third portions 501. In specific implementation, the number of third portions 501 can also be other, and the multiple third portions 501 are arranged at intervals along the direction from the first non-display area NA1 to the display area AA. In this embodiment, the third portions 501 in the first non-display area NA1 can be manufactured in the same layer, with the same material and process as the second touch electrode TP2 in the display area AA, which helps to reduce process steps and improve process efficiency.

[0116] In this embodiment, the orthographic projection of the third part 501 onto the light-emitting surface of the display panel 000 is located within the orthographic projection range of the second groove 1032 onto the light-emitting surface of the display panel 000. In the direction Z perpendicular to the light-emitting surface of the display panel 000, the second part 401 and the third part 501 at least partially overlap. That is, the orthographic projection of the second groove 1032 onto the light-emitting surface of the display panel 000 can cover the orthographic projection of the second part 401 onto the light-emitting surface of the display panel 000, and the orthographic projection of the second groove 1032 onto the light-emitting surface of the display panel 000 can also cover the orthographic projection of the third part 501 onto the light-emitting surface of the display panel 000. The orthographic projection of the light-emitting surface of panel 000 allows both the second part 401 and the third part 501 to be precisely embedded in the second groove 1032. The conductive material of the second part 401 can form a second storage capacitor Cst2 with the second conductive layer 102, and the conductive material of the second part 401 can also further form a third storage capacitor Cst3 with the third part 501. Optionally, the third part 501 can be a long strip structure, a semi-circular structure partially surrounding the display area AA, a segmented and spaced structure, or a structure of other shapes. This embodiment does not specifically limit this. The second part 401 overlaps with the first conductive layer 102 of the first substrate 10 to form a second storage capacitor Cst2. The second part 401 is one electrode of the second storage capacitor Cst2, and the overlapping portion of the first conductive layer 102 with the second part 401 is the other electrode of the second storage capacitor Cst2. The third part 501 overlaps with the second part 401 to form a third storage capacitor Cst3. The second part 401 is one electrode of the third storage capacitor Cst3, and the third part 501 is the other electrode of the third storage capacitor Cst3. When an external charge enters, it is assumed that the first part 301 and the first conductive layer 102 form... The first storage capacitor Cst1 is insufficient to slow down the transmission speed of static electricity. Therefore, in this embodiment, a second storage capacitor Cst2 can also be formed by the overlap between the second part 401 (which is on the same layer as the first touch electrode TP1) and the third part 501 (which is on the same layer as the second touch electrode TP2) between the first part 301 and the barrier wall B, and by the overlap between the second part 401 and the first conductive layer 102 of the first substrate 10, and by the overlap between the second part 401 and the third part 501, a third storage capacitor Cst3 can also be formed. This further slows down the speed at which static electricity enters the display panel 000 screen, and can more effectively reduce the probability of display defects.

[0117] It is understandable that when the first non-display area NA1 of the display panel 000 is provided with the second groove 1032, during the process of making the touch function layer on the side of the thin film encapsulation layer 007 away from the first substrate 10, such as when making the first touch electrode TP1 of the second metal layer 40 and the second touch electrode TP2 of the third metal layer 50, the metal of the second metal layer 40 and the third metal layer 50 can easily remain inside the second groove 1032. This is determined by the structure of the second groove 1032, which is narrow at the top and wide at the bottom. Therefore, in this embodiment, the second part 401 can be formed directly using the residual metal of the second metal layer 40 in the second groove 1032, and the third part 501 can be formed directly using the residual metal of the third metal layer 50 in the second groove 1032. That is, the fabrication of the second part 401 and the third part 501 does not require additional process steps. The second part 401 can be fabricated by using the residual metal of the second metal layer 40 in the second groove 1032 during the fabrication process of the first touch electrode TP1 and the second touch electrode TP2. The third part 501 can be fabricated by using the residual metal of the third metal layer 50 in the second groove 1032. This not only avoids adding process steps, but also further slows down the transmission speed of static electricity to the display area AA through the second part 401 and the third part 501, thereby improving the electrostatic protection effect.

[0118] In some alternative embodiments, please refer to Figure 19 , Figure 19 This is a schematic diagram of a planar structure of a display device provided in an embodiment of the present invention. The display device 111 provided in this embodiment includes the display panel 000 provided in the above embodiment of the present invention. Optionally, the display device 111 can be a flexible display device. Figure 19 This embodiment uses a mobile phone as an example to illustrate the display device 111. It is understood that the display device 111 provided in this embodiment can be any other display device 111 with display functions, such as a computer, television, or in-vehicle display device; this invention does not impose specific limitations on this. The display device 111 provided in this embodiment has the beneficial effects of the display panel 000 provided in this embodiment. For details, please refer to the specific descriptions of the display panel 000 in the above embodiments; these will not be repeated here.

[0119] As can be seen from the above embodiments, the display panel and display device provided by the present invention achieve at least the following beneficial effects:

[0120] In the display panel of the present invention, a first non-display area is disposed, and a first metal layer includes at least one first part, such that in a direction perpendicular to the light-emitting surface of the display panel, the first part overlaps with the first conductive layer of the first substrate to form a first storage capacitor. The first part is one electrode of the first storage capacitor, and the portion of the first conductive layer overlapping with the first part is the other electrode of the first storage capacitor. When external charge enters, for example, during the cutting process or electrostatic testing, charge enters from the cutting edge of the display panel. The charge storage capacity of the first storage capacitor formed by the overlap between the first part and the first conductive layer of the first substrate can be utilized to prevent the charge from rapidly entering the display area, effectively slowing down the speed at which static electricity enters the display panel screen, avoiding affecting the electrical performance of the thin-film transistors in the driving circuit layer within the display area, and thus helping to reduce the probability of display defects. Furthermore, in this invention, the first part is positioned between the cutting edge and the retaining wall along the direction from the first non-display area to the display area. That is, the first part is located on the side of the retaining wall away from the display area. Compared to related technologies where the electrostatic ring with electrostatic protection function is designed on the side of the retaining wall closer to the display area, or where the electrostatic ring is designed to overlap with the retaining wall, this invention, by first positioning the first part of the metal material on the side of the retaining wall away from the display area, can prevent excessive static electricity from damaging the encapsulation structure of the retaining wall and the display panel. Thus, through the dual protection of the first part and the retaining wall, it can more effectively prevent crack propagation, thus improving product yield and display quality. Therefore, the first part of this invention, positioned on the side of the retaining wall away from the display area, not only prevents rapid charge entry into the display area through the first storage capacitor formed by the overlap between the first part and the first conductive layer of the first substrate, but also prevents excessive static electricity from damaging the encapsulation structure of the retaining wall and the display panel. Thus, through the dual protection of the first part and the retaining wall, it can more effectively provide electrostatic protection and prevent crack propagation, thereby improving product yield and display quality.

[0121] While specific embodiments of the invention have been described in detail by way of examples, those skilled in the art should understand that the examples are for illustrative purposes only and not intended to limit the scope of the invention. Those skilled in the art should understand that modifications can be made to the above embodiments without departing from the scope and spirit of the invention. The scope of the invention is defined by the appended claims.

Claims

1. A display panel, characterized in that, include: A display area and a non-display area disposed at least partially surrounding the display area, the non-display area including at least a first non-display area, the first non-display area including a cutting edge and a barrier, the cutting edge being located on the side of the first non-display area away from the display area; The display panel includes: The first substrate, in a direction perpendicular to the light-emitting surface of the display panel, includes at least a first substrate, a first conductive layer, and a second substrate stacked together, with the first conductive layer located between the first substrate and the second substrate; A first insulating layer is located on the side of the second substrate opposite to the first substrate; A first metal layer is located on the side of the first insulating layer that is away from the first substrate; Within the first non-display area, the first metal layer includes at least one first portion, located between the cut edge and the retaining wall in a direction from the first non-display area toward the display area. Within the first non-display area, the first insulating layer includes a plurality of first openings, which penetrate the first insulating layer in a direction perpendicular to the light-emitting surface of the display panel. The orthographic projection of the first part onto the light-emitting surface of the display panel is located within the orthographic projection range of the first opening onto the light-emitting surface of the display panel.

2. The display panel according to claim 1, characterized in that, The display panel further includes a thin-film encapsulation layer; the thin-film encapsulation layer includes a first inorganic encapsulation layer, a second inorganic encapsulation layer, and an organic encapsulation layer located between the first inorganic encapsulation layer and the second inorganic encapsulation layer; the first inorganic encapsulation layer and the second inorganic encapsulation layer cover the barrier wall, and the first inorganic encapsulation layer and the second inorganic encapsulation layer are in direct contact on the side of the barrier wall away from the display area.

3. The display panel according to claim 1, characterized in that, The first conductive layer comprises one or more of amorphous silicon or composite metal oxides.

4. The display panel according to claim 1, characterized in that, Within the first non-display area, the second substrate includes at least one first groove on the side opposite to the first substrate. In a direction perpendicular to the light-emitting surface of the display panel, the first groove does not penetrate the second substrate. The first groove is an elongated structure arranged around the display area. The orthographic projection of the first part onto the light-emitting surface of the display panel is located within the orthographic projection range of the first groove onto the light-emitting surface of the display panel, and the first part is in contact with the first groove.

5. The display panel according to claim 1, characterized in that, The first part is a long strip structure arranged around the display area; the first part is connected to a fixed potential signal terminal.

6. The display panel according to claim 1, characterized in that, The first metal layer includes a plurality of first portions, which are arranged at intervals along the direction from the first non-display area to the display area.

7. The display panel according to claim 6, characterized in that, Along the direction from the first non-display area to the display area, in two adjacent first parts, one first part is connected to a positive voltage signal terminal, and the other first part is connected to a negative voltage signal terminal.

8. The display panel according to claim 1, characterized in that, The first part includes a plurality of first sub-parts, which are spaced apart along a first direction; wherein, in a direction parallel to the light-emitting surface of the display panel, the first direction intersects with the direction from the first non-display area to the display area.

9. The display panel according to claim 8, characterized in that, Along the direction from the first non-display area to the display area, two adjacent first parts include the Ath first part and the A+1th first part, where A is a positive integer; Along the first direction, there is a gap between two adjacent first sub-parts of the same first part; In the direction from the first non-display area to the display area, the interval area of ​​the first part of the first clause A does not overlap with the interval area of ​​the first part of the first clause A+1.

10. The display panel according to claim 8, characterized in that, Along the first direction, the length of the first sub-part ranges from 50 to 100 μm.

11. The display panel according to claim 1, characterized in that, Along the direction from the first non-display area to the display area, the width of the first part ranges from 3 to 5 μm.

12. The display panel according to claim 1, characterized in that, The display panel of the display area further includes a plurality of thin-film transistors, each thin-film transistor including at least a gate, a source, and a drain. The source and the drain are located in the first metal layer.

13. The display panel according to claim 1, characterized in that, Within the first non-display area, the side of the second substrate facing away from the first substrate includes a plurality of second grooves, which are spaced apart along the direction from the first non-display area to the display area; in the direction perpendicular to the light-emitting surface of the display panel, the second grooves do not penetrate the second substrate; along the direction from the first non-display area to the display area, the plurality of second grooves are located between the first part and the barrier. The second groove includes at least a first cavity and a second cavity. In a direction perpendicular to the light-emitting surface of the display panel, the first cavity is located on the side of the second cavity facing the first substrate. Along a direction parallel to the light-emitting surface of the display panel, the inner diameter of the first cavity is larger than the inner diameter of the second cavity; The display panel further includes a thin-film encapsulation layer and a first inorganic layer. The thin-film encapsulation layer is located on the side of the second substrate away from the first substrate, and the first inorganic layer is located on the side of the thin-film encapsulation layer away from the first substrate. The thin film encapsulation layer and the first inorganic layer are in contact with at least the sidewall of the second groove.

14. The display panel according to claim 13, characterized in that, The display panel further includes a second metal layer, which is located between the thin film encapsulation layer and the first inorganic layer in a direction perpendicular to the light-emitting surface of the display panel. The display panel of the display area includes a first touch electrode, which is located in the second metal layer; Within the first non-display area, the second metal layer includes a plurality of second portions, which are arranged at intervals along the direction from the first non-display area to the display area; The orthographic projection of the second part onto the light-emitting surface of the display panel is located within the orthographic projection range of the second groove onto the light-emitting surface of the display panel.

15. The display panel according to claim 14, characterized in that, The display panel further includes a third metal layer, which is located on the side of the first inorganic layer away from the second metal layer in a direction perpendicular to the light-emitting surface of the display panel. The display panel of the display area includes a second touch electrode, which is located in the third metal layer; Within the first non-display area, the third metal layer includes a plurality of third portions, which are arranged at intervals along the direction from the first non-display area to the display area. The orthographic projection of the third part onto the light-emitting surface of the display panel is located within the orthographic projection range of the second groove onto the light-emitting surface of the display panel; In a direction perpendicular to the light-emitting surface of the display panel, the second part and the third part at least partially overlap.

16. A display device, characterized in that, Includes the display panel as described in any one of claims 1-15.

Images