Measurement methods for housings used in electronic components

Abstract

This invention relates to a technique for measuring a housing (110) capable of accommodating electronic components (112) on a circuit board (114) that generate waste heat. According to one aspect of the counting method, the configuration of the electronic components (112) on the assembly side (116) of the circuit board (114) is detected. A plurality of functional regions (118) within the assembly side (116) are measured, in which at least one of the electronic components (112) is arranged according to the measured configuration. A thermal function (120) is assigned to each of the functional regions (118). Each of the thermal functions (120) includes a function (120) that generates waste heat during operation due to the power consumption of at least one electronic component (112) arranged in the corresponding functional region (118) according to the measured configuration, and the highest temperature at which the at least one electronic component (112) arranged in the corresponding functional region (118) operates without damage or power limitation. The housing (110) is measured to output waste heat generated during the operation of the electronic component (112) while maintaining the maximum temperature, according to the thermal function (120) allocated to the functional area (118). Alternatively or supplementarily, it is determined whether the selected housing (110) is able to output waste heat generated during the operation of the electronic component (112) while maintaining the maximum temperature, according to the thermal function (120) allocated to the functional area (118).

Description

Technical Field

[0001] The present invention relates to a method for measuring a housing capable of accommodating electronic components on a circuit board that generate waste heat. Background Technology

[0002] Today's digitally assisted product development also includes virtual product development, particularly in application areas and design. These development processes are often not the core competencies of the developers or designers. For example, a circuit developer may understand the circuit's purpose but use automated development tools as a digitally assisted example to develop the circuit. Details such as thermal requirements or circuit effects are not the focus of their work. Summary of the Invention

[0003] In view of this, the purpose of this invention is to provide a technology that assists developers in the product development process.

[0004] Embodiments of the present invention are described below in part with reference to the accompanying drawings.

[0005] One aspect of the present invention relates to a method for measuring a housing capable of accommodating electronic components on a circuit board that generate waste heat. The method includes the step of detecting the configuration of electronic components on the assembly side of the circuit board. Furthermore, the method includes the step of measuring a plurality of functional regions within the assembly side, in which at least one of the electronic components is arranged according to the measured configuration. Furthermore, the method includes the step of allocating a thermal function to each of the functional regions. Each of the functional regions includes a function that generates waste heat during operation due to the power consumption of at least one electronic component arranged in the corresponding functional region according to the measured configuration. Furthermore, each of the functional regions also includes a maximum temperature at which the at least one electronic component arranged in the corresponding functional region can operate without damage or power limitation. Furthermore, the method includes the step of measuring a housing capable of outputting the waste heat generated during the operation of the electronic components while maintaining the maximum temperature according to the thermal function allocated to the functional regions. Alternatively or supplementarily, the method includes the step of measuring whether a selected housing is capable of outputting the waste heat generated during the operation of the electronic components while maintaining the maximum temperature according to the thermal function allocated to the functional regions.

[0006] By detecting the configuration of components, embodiments of the method can digitally analyze or inspect the current in terms of the thermal requirements or impacts of the circuit under development. Specifically, this involves determining functional areas and reducing these areas to their thermal functionality. This allows for the determination of a housing that not only matches the circuit board geometrically but also thermally, thus meeting the conditions preset by the thermal functionality.

[0007] The assigned thermal function can be equivalent to the thermal effect and / or thermally dependent operating capability of at least one electronic component arranged in the corresponding functional area according to the measured configuration during operation. Specifically, the assigned thermal function (preferably substantially) represents or characterizes the thermal effect of at least one electronic component arranged in the corresponding functional area, for example, within a predetermined temperature range of the circuit board or electronic component. The thermal function can represent the thermally dependent operating capability of an electronic component, consisting of a circuit board and a housing, arranged in the corresponding functional area in a static (or quasi-static) state (e.g., in a static operating and / or thermodynamically static state).

[0008] A hot-pressure test can be performed by digitally checking the waste heat generated during the operation of the electronic component by outputting the thermal function assigned to the functional area to maintain the highest temperature, i.e., checking the suitability of the housing or the corresponding combination of housing and circuit board (optionally manually selected).

[0009] The housing can be measured in such a way that it limits the power consumption (aka: thermal load) generated by the electronic components during operation to an acceptable level and / or without damaging the components and / or affecting the power and / or operational capability of the electronic components. Based on stored or calculated values ​​(e.g., temperature distribution), the housing under test is constructed to limit the thermal load (e.g., power consumption and / or temperature distribution within the housing) of at least one component in a corresponding functional area by the thermal load (e.g., power consumption and / or temperature distribution within the housing) generated during the operation of all components on the circuit board below a threshold affecting the component (e.g., below the corresponding maximum temperature).

[0010] The maximum temperature can be an upper threshold of the operating temperature of the electronic component. Within the maximum temperature range, the electronic component can operate normally without damage or power limitations.

[0011] The power consumption during operation can be the waste heat rate generated in the corresponding functional area.

[0012] As an alternative or supplementary solution, waste heat output may include heat transfer, such as passive and / or active heat transfer. Outputting waste heat may include transferring waste heat from the housing to the surrounding environment.

[0013] The operation of electronic components can be either routine operation or restricted operation (e.g., for thermo-pressure testing).

[0014] The functional regions can be unit cells of a crystal lattice structure or inlaid sheets on the assembly side of a circuit board. Alternatively or supplementary, the at least two functional regions can be partitions on the assembly side of the circuit board.

[0015] Thermal functions can be thermal primitives (or simply primitives) of a thermal model (e.g., a thermodynamic model). All assigned thermal functions can be combined with the corresponding shell to define a thermal model, and the steps for measuring the shell are based on this thermal model. Optionally, the shell is represented in the thermal model through its inherent thermal functions.

[0016] In the step of measuring the housing, a single housing or multiple housings may be measured, preferably the single or multiple housings that can drain the waste heat generated by the electronic components during operation without causing the corresponding housing and / or electronic components to overheat.

[0017] The thermal function can be related to the operating state of the electronic component. The operation of the electronic component can include a first operating state and a second operating state different from the first operating state. In the first operating state, the first power consumption in the first functional area can be greater than the first power consumption in the second operating state. In the first operating state, the second power consumption in the second functional area can be less than the second power consumption in the second operating state.

[0018] The housing can be measured for a time-related operating state. The second operating state may correspond to a hot-press test and / or be present for a predetermined time or limited to a predetermined duration.

[0019] The thermal function may further include the function of heat transfer based on at least one electronic component arranged in the corresponding functional area and / or based on a coolant or vent (e.g., a vent and / or an exhaust vent) in the corresponding functional area or other functional areas.

[0020] The heat transfer function can represent passive heat transfer (e.g., heat conduction and / or convection, preferably in a heat pipe, and / or heat radiation). Alternatively or supplementary, the heat transfer function can represent active heat transfer (e.g., by means of an electrothermal converter and / or a heat pump). Heat transfer can occur within the housing, for example, parallel to the circuit board. Alternatively or supplementary, heat can be transferred from the housing to the surrounding environment, preferably to the outside of the housing or to a coolant that exchanges heat with the surrounding environment.

[0021] One or each of the thermal functions may include the function of a heat source in the corresponding functional area and / or the function of a radiator in the corresponding functional area and / or the function of heat transfer in the corresponding functional area. The function of heat transfer preferably corresponds to or represents the function of thermal bridging or thermal insulation between the corresponding functional area and the surrounding environment of the housing.

[0022] Optionally, the "heat source" includes a negative heat source, i.e., a radiator. The exposure of the heat source can be achieved, for example, through a radiator. Similarly, the "waste heat" can include negative "waste heat." Waste heat can be generated, for example, by dissipating heat (e.g., from the casing) or by converting heat into another form of energy (e.g., by converting it into light or electricity via the Seebeck effect).

[0023] In addition, the corresponding housing and / or circuit board may be equipped with thermal functions, such as thermal functions at the interface for heat convection.

[0024] The function of a heat sink can be analogous to a Peltier element, with its hotter side exchanging heat with the surrounding environment and its cooler side arranged within a corresponding functional area in the housing. Similarly, the function of a heat source can be analogous to a Peltier element, with its cooler side exchanging heat with the surrounding environment and its hotter side arranged within a corresponding functional area in the housing.

[0025] The thermal functions of heat transfer may include heat conduction, heat radiation, and / or heat convection.

[0026] The thermal function of the heat transfer can include passive heat transfer. The thermal function of the heat transfer can be equivalent to the thermal function of a heat pipe, or can be represented digitally by the heat pipe. In technical terms, this heat pipe can also be called a "Heat-Pipe".

[0027] The thermal function of the heat transfer can include active heat transfer. This thermal function can be equivalent to, for example, the thermal effect of a Peltier element or represented digitally by the Peltier element. During operation, the Peltier element can have a hotter side and a colder side. The Peltier element can release additional heat on the hotter side beyond the heat transferred from the colder side to the hotter side.

[0028] The hotter side exchanges heat with the surrounding environment, while the cooler side has Peltier elements arranged in the corresponding functional areas within the housing, which can correspond to the function of a heat sink. The cooler side exchanges heat with the surrounding environment, while the hotter side has Peltier elements arranged in the corresponding functional areas within the housing, which can correspond to the function of a heat source.

[0029] The measuring housing may include measuring multiple housings, which are preferably capable of outputting waste heat generated during the operation of the electronic component while maintaining the highest temperature, according to the thermal function assigned to the functional area.

[0030] Furthermore, the housing with the smallest space requirement or width among multiple housings can be determined. Here, the size comparison (“minimum”) may refer to the volume and / or cross-sectional and / or linear dimensions of the housing, for example, to the housing with the smallest space requirement and / or the smallest width along the direction of arrangement on the mounting rails (e.g., retaining rails or cap rails), i.e., along the longitudinal direction of the mounting rails or fixing rails.

[0031] Each of the multiple housings can be constructed to be fixed on a mounting rail (preferably on a cap-shaped rail). The smallest housing to be tested can be the narrowest housing among the multiple housings in the longitudinal direction of the mounting rail.

[0032] Measuring the housing may include calculating or querying the temperature or temperature distribution in multiple housings based on the thermal functions assigned to the functional areas. Optionally, the housing with the temperature or temperature distribution within a predetermined range and / or the lowest temperature or temperature distribution among the multiple housings may be measured.

[0033] The plurality of shells may include user-preset shells, such as shells manually selected from a database. The plurality of shells may also include variations of the user-selected shells, such as shells that are identical to and / or similar to the user-preset shell in terms of at least one parameter stored in the database. In this case, similarity can be determined by a measure of the parameter space spanned by the parameters. If the measure values ​​of two shells are less than a threshold, then the two shells are likely similar.

[0034] Calculating the temperature distribution may include calculating the distribution (or curve) of the temperature gradient, for example, through the shell surface of the shell and / or the volume surrounded or covered by the shell.

[0035] Calculating the temperature or temperature distribution may include digitally simulating the thermodynamic process (also known as: thermal simulation), preferably including digitally simulating heat transfer within and / or originating from the corresponding housing, wherein the combination of the corresponding housing and the thermal functions assigned to the functional areas of the circuit board determines the boundary conditions of the thermodynamic process.

[0036] The digital simulation of thermodynamic processes can be a digital simulation of a model of a housing and a circuit board, wherein the circuit board is represented by thermal functions assigned to the functional areas, and the housing is represented by inherent thermal functions. The digital simulation of thermodynamic processes can also be an implementation of a thermo-pressure test, i.e., a test of the thermal adaptability of the combination of the housing and the circuit board.

[0037] Thermodynamic processes within and / or originating from the respective housing include cooling media, preferably air into the respective housing, and convection and / or flow within and / or originating from the respective housing.

[0038] Determining a housing may include querying a database. This database may store the following for multiple housings: (i) boundary conditions, preferably the simulated boundary conditions and / or the boundary conditions of the thermodynamic process and / or the boundary conditions for manufacturing the housing; and / or (ii) the interconnection rules of the housings; and / or (iii) the materials of the housings; and / or (iv) temperature and / or temperature distribution, for example, related to the configuration of thermal functions within the respective housings. When a circuit board is housed in a respective housing, a query (e.g., a query message sent to a database) may provide or determine the configuration of thermal functions assigned to the functional areas.

[0039] This database can store temperature distributions (also known as thermal profiles or thermal curves) for multiple combinations of thermal functional configurations within the housing. With the corresponding thermal functional configuration for the circuit board already stored in the database, multiple simulations are unnecessary due to database queries. The thermal functional configuration can be an abstraction of the circuit board for calculating or querying temperature distributions and / or for determining the housing, thermal model, and / or performing thermal simulations. The temperature distributions stored in the database for combinations of housing and thermal functional configurations can be empirically measured and / or can be the results of previous numerical simulations.

[0040] For example, a digital simulation of the thermal function is performed only for the measured configuration if the temperature distribution for the measured configuration is not stored in the database. For each implemented digital simulation, the database of temperature distributions can be supplemented or detailed as a characteristic of the corresponding housing.

[0041] As an alternative or supplementary approach, the temperature distribution for each of the plurality of housings can be stored in the database in a flexible and / or adaptable manner for different configurations of the thermal functions. For example, with respect to the detected thermal function configurations among two or more configurations of these thermal functions stored in the database, the temperature distribution for the detected thermal function configuration can be calculated as a weighted average of the temperature distributions for the stored configurations of these thermal functions.

[0042] Temperatures and / or temperature distributions generated from previous digital simulations can be stored in a database. Temperatures and / or temperature distributions stored in the database for similar or most similar configurations of the assigned thermal functions can serve as initial values ​​for digital simulations of thermodynamic processes.

[0043] A database query yields an initial shell. The temperature distribution stored or calculated for the initial shell is such that, at a certain location, such as within a functional area of ​​the initial shell, the highest temperature cannot be maintained. Furthermore, the method (e.g., measuring the shell) may also include a step of modifying the shell at the location where the temperature distribution does not maintain the highest temperature. Alternatively or supplementarily, the method (e.g., measuring the shell) may also include a step of calculating the temperature distribution in the modified initial shell based on the thermal functions allocated to the functional areas.

[0044] The shell determination based on the initial shell can be iteratively implemented through modification and calculation steps until the highest temperature is maintained.

[0045] The initial housing may be a housing preset by the user. Determining the housing may include adjusting (i.e. modifying) the initial housing and / or selecting another (preferably larger) housing (e.g., from a database).

[0046] The determination of the shell based on the initial shell may include multi-stage modification and calculation steps. In the first stage of the multi-stage implementation, the shell may be modified in a first region. In the second stage based on the modification in the first stage, the shell may be modified in a second region. The second region is smaller than the first region and is entirely located within the first region. In other words, the multi-stage modification may include a coarse first modification of the shell and a refined second modification based on the first modification.

[0047] As an alternative or supplementary solution, modifying the housing may include adding a thermal bridge between the location of the housing and the external area of ​​the housing, and / or preferably adding a vent at the location.

[0048] The shell can be represented by its inherent thermal functions. These thermal functions determine the geometry of the shell, such as a cuboid. The temperature distribution and / or flow profile of the cooling medium can be assigned to the surfaces and / or portions of the shell. Alternatively or supplementarily, the surfaces and / or portions of the shell can define the boundary conditions for thermodynamic processes, such as the boundary conditions for cooling medium convection. In the step of modifying the shell, modified thermal functions (preferably with modified temperature distribution and / or modified flow profile) can be loaded from a database as a representation of the modified shell.

[0049] Modifying the housing may include altering the thermal conductivity of the housing at least at that location. Preferably, the altered thermal conductivity may correspond to an altered wall thickness and / or an altered wall material of the housing.

[0050] Modification of the housing may be subject to at least one additional condition, such as the minimum internal dimensions of the housing for accommodating the circuit board, the preset fixing points in the housing for fixing the circuit board, the preset fixing points for fixing the housing to the mounting rail, the boundary conditions for manufacturing the housing, and / or the maximum external dimensions of the housing.

[0051] The corresponding housing, preferably the geometry or surface of the corresponding housing, can be digitally represented by Delaunay triangulation, hierarchical data structure, octree network or hexahedral network, preferably as part of the thermal function of the housing.

[0052] Each of the functional areas can be a rectangular area within the assembly side of the circuit board and / or a non-intersecting partition of the assembly side.

[0053] The assigned thermal function, preferably at least one or each of the heat sources, can be digitally represented by non-intersecting conductive path segments, the length of which within the corresponding functional region is greater than the perimeter of the corresponding functional region. Each conductive path segment can be an ohmic conductor and / or zigzag-shaped.

[0054] The ohmic resistance of a conductive path segment, the current intensity through this conductive path segment, and / or the power consumption of this conductive path segment can be equivalent to the ohmic resistance, current intensity, or power consumption of at least one electronic component arranged in the corresponding functional area according to the measured configuration during operation.

[0055] Furthermore, the detection of the configuration of the electronic components may also include the detection of the interconnection of the electronic components.

[0056] Furthermore, the allocation of thermal functions may also include digital simulation (preferably electrical simulation) of electronic components detected by the interconnect. This digital simulation can determine the thermal function of at least one electronic component in a corresponding functional area during operation. Digital simulation of the detected electronic components based on the interconnect may include determining the power consumption of each of the electronic components during operation.

[0057] In addition, measuring the housing, preferably by digital simulation based on interconnects, may also include measuring electrical clearances and / or creepage distances, preferably as a function of the rated voltage of the circuit board.

[0058] The steps for detecting the configuration of electronic components may include detecting the circuit board using a camera or scanning the circuit board using a scanner. Alternatively or supplementary, the steps may include determining the electronic components and / or conductive paths in the camera image or scan using image recognition, and determining the configuration of electronic components and / or interconnections on the circuit board based on the location of electronic components detected in the camera image or scan and / or the direction of conductive paths detected in the camera image or scan of the circuit board. The circuit board may exist as a physical component.

[0059] As an alternative or supplementary solution, the configuration of the detection component may include receiving a digital design drawing of the circuit board. Alternatively or supplementary, the configuration of the detection component may include reading the configuration of the electronic components and / or the interconnections of the electronic components from the digital design drawing of the circuit board. In the allocation step, the allocated thermal function may be used instead of the electronic components, preferably represented digitally.

[0060] Digital design drawings of circuit boards can exist as digital representations of computer-aided design (CAD) or CAD models.

[0061] Alternatively, the initial shell can be received, for example, uploaded, for iterative modification.

[0062] The method may further include providing a webpage for retrieval. The webpage may include an input area or interface configured to create and / or upload digital design drawings. The input area of ​​the webpage may be implemented as a web interface or a web application (also known as a Web-App).

[0063] In addition, the method may include at least one of the following steps: selecting a housing that is determined to be able to output waste heat generated during the operation of the electronic component (preferably after the measurement); selecting a housing that is to be determined to output waste heat generated during the operation of the electronic component (preferably before the measurement); and measuring and / or providing a circuit board based on the selected housing (preferably after the selection).

[0064] The configuration of the electronic components on the circuit board can also be referred to as the layout or circuit of the circuit board. The electronic components on the circuit board can also be referred to as actual components.

[0065] According to another aspect, an apparatus for measuring a housing capable of accommodating electronic components on a circuit board that generate waste heat is provided. The apparatus includes a configuration detection unit configured to detect the configuration of electronic components on an assembly side of the circuit board. Furthermore, the apparatus includes a region measurement unit configured to measure a plurality of functional regions within the assembly side, in which at least one of the electronic components is arranged according to the measured configuration. Additionally, the apparatus includes a thermal function allocation unit configured to allocate a thermal function to each of the functional regions. Each of the thermal functions generates waste heat during operation due to the power consumption of at least one electronic component arranged in the corresponding functional region according to the measured configuration. Furthermore, each of the thermal functions also includes a maximum temperature at which the at least one electronic component arranged in the corresponding functional region can operate without damage or power limitation. Furthermore, the apparatus includes a housing measurement unit configured to measure the housing capable of outputting the waste heat generated during the operation of the electronic components while maintaining the maximum temperature, according to the thermal function allocated to the functional regions.

[0066] Furthermore, the apparatus may include any features mentioned in the context of the method. The apparatus may also be constructed as or include dedicated units configured to implement each step disclosed in the context of the method. Attached Figure Description

[0067] The present invention will now be described in detail with reference to the accompanying drawings and preferred embodiments.

[0068] In the picture:

[0069] Figure 1 The flowchart is a method for measuring the housing in the first embodiment, the housing being capable of accommodating electronic components on a circuit board that generate waste heat;

[0070] Figure 2 This is a schematic diagram of the steps in the method for measuring the shell in the second embodiment.

[0071] Figure 3 A schematic diagram of an apparatus for implementing or controlling the method for measuring the shell in the third embodiment; and

[0072] Figure 4 This is a schematic diagram of an exemplary database that can be applied to each embodiment. Detailed Implementation

[0073] Figure 1This is a schematic flowchart of a first embodiment of a method for measuring a housing, generally indicated by reference numeral 100, capable of accommodating electronic components on a circuit board that generate waste heat. In step 102, the arrangement of electronic components on the assembly side of the circuit board is detected. In step 104, multiple functional regions within the assembly side are measured. For this purpose, the electronic components are grouped according to their functional associations (e.g., the impedance of transistors or RC elements in an H-bridge) and / or according to their electrical connection density (e.g., also by means of detected conductive paths) and / or by means of group analysis of their positions in the assembly side. Preferably, at least one of these electronic components is arranged in each functional region of the measured configuration. Optionally, additional functional regions for heat-related functions, such as coolants, can be measured.

[0074] In step 106, at least one thermal function is assigned to each functional region. This thermal function can be a digital representation of the thermal effect of the corresponding functional region. Thermal simulations can include these thermal functions.

[0075] One example of a thermal function is the function that generates waste heat during operation due to the power consumption of at least one electronic component arranged in a corresponding functional area, based on a measured configuration. This function may, for example, provide an average power consumption or a correlation between power consumption in different functional areas. Another example of a thermal function is the highest temperature at which the at least one electronic component arranged in the corresponding functional area operates without damage or power limitation.

[0076] In step 108, at least one housing is determined to be capable of outputting waste heat generated during the operation of electronic components while maintaining a maximum temperature, based on the thermal function assigned to the functional areas. This maintenance is preferably determined by means of the thermal state of matter (TDZ) within the corresponding housing when the components on the circuit board arranged in the housing are in (preferably) operation. The TDZ can be calculated digitally using thermal simulation and / or retrieved from a database.

[0077] The configuration of electronic components and the conductive paths that electrically connect them (e.g., on the mounting side and / or opposite side and / or on a layer within the circuit board) can be collectively referred to as the circuitry or layout of the circuit board.

[0078] Thermal functionality can be a circuit design element and / or a thermal simulation element (abbreviated as: element).

[0079] Figure 2 This is a schematic diagram of steps 102, 104, 106, and 108 of the method 100 for measuring the housing 110 in the second embodiment. The second embodiment can be combined with the first embodiment, for example, as a supplement to the latter.

[0080] In step 102, electronic components 112 on the assembly side 116 of the circuit board 114 can be detected from the digital design drawing by manual input and / or by means of image recognition.

[0081] In step 104, the circuit board 114, such as the entire assembly side 116 or the assembled portion of the assembly side 116, is divided into several functional regions 118. Preferably, the functional regions 118 include non-intersecting and / or defined partitions of the assembly side 116.

[0082] The impact of electronic components 112 (and optionally the circuit board 114 itself) on TDZ is digitally represented using thermal functions 120, which are assigned to functional areas 118 in step 106. Alternatively, another thermal function 120 may be assigned to the circuit board 114 or the mounting side 116.

[0083] Each of these thermal functions may provide a thermal effect (such as a heat source, radiator, and / or heat transfer) and / or at least one threshold (such as a maximum temperature). This thermal effect and / or threshold may relate to the at least one electronic component 112 within the functional area. For example, the type name of the electronic component 112 may be detected in step 102, and the thermal effect and / or the at least one threshold may be retrieved from a database if the type name is given.

[0084] In step 108, a TDZ 122 is measured for each of at least two candidate housings 110, which is generated from the laws of thermodynamics by the thermal functions 120 assigned to functional regions 118. For example, in step 108, the temperature distribution and / or convective flow in and / or into and / or out of housing 110 are calculated according to the laws of thermodynamics, preferably according to Planck's law of radiation and / or the heat conduction equation and / or the Navier-Stokes equation. Further functional regions 119 through housing 110 can be measured. These further functional regions 119 may, for example, be assigned thermal functions such as vents 125 and / or exhaust vents 125 and / or (preferably with heat exchange with the surrounding environment of the housing) coolants 124.

[0085] Figure 3 The diagram shows an apparatus for measuring a housing 110, generally indicated by reference numeral 150, which is capable of housing electronic components 112 on a circuit board 114 that generate waste heat. The apparatus 150 can be configured to implement or control method 100.

[0086] As an alternative or supplementary solution, device 150 may include a configuration detection unit configured to detect the configuration of electronic components 112 on the assembly side 116 of circuit board 114 or to implement step 102. This configuration detection unit may be implemented by a design interface 152 configured to determine the configuration of electronic components 112 (and optionally their interconnections).

[0087] The design interface 152 can also be configured to output the at least one housing 110 under test, as illustrated in the figure.

[0088] Design interface 152 can be implemented using a web server, which configures electronic component 112 on a webpage in step 102 and / or outputs the tested housing 110 on a webpage in step 108. This webpage or another communication interface for steps 102 and / or 108 can be invoked via network 153. Network 153 may include network components such as network adapters (i.e., switches) and / or base stations enabling radio access to design interface 152.

[0089] The configuration of electronic component 112 can be detected using a user device 160, such as a mobile device (preferably a tablet computer with a touch-sensitive screen) or a workstation device (preferably a CAD workstation). For example, a camera can be connected to or integrated into the user device 160. The camera can detect views of the assembled side (and optionally conductive paths on the opposite side). An image recognition unit (e.g., implemented in the user device 160 and / or design interface 152 and / or device 150) can determine the object on the printed circuit board in step 102. The object being measured may include electronic component 112 and optionally conductive paths.

[0090] As an alternative or supplementary solution, user device 160 may include a design component 162 for configuring electronic component 112 and / or for inputting the configuration of electronic component 112. Design component 162 may include an input pen for a touch-sensitive screen and / or a CAD application. The CAD application may be executed (e.g., locally) by user device 160 or (remotely) by design interface 152, wherein data from the graphical user interface is transferred from design interface 152 to user device 160 and displayed by user device.

[0091] The steps of detection 102 may include, for example, directly inputting element 120 (such as data for selecting element 120) and / or measuring specific electronic components 112. Alternatively or supplementary, the steps of detection 102 may include uploading data indicating the configuration of electronic components 112 on circuit board 114 (such as circuit layout data).

[0092] As an alternative or supplementary solution, device 150 may include a region measurement unit configured to measure a plurality of functional regions 118 within assembly side 116, in which at least one of electronic components 112 is arranged according to the measured configuration, or to implement step 104. Device 150 also includes a thermal function allocation unit configured to allocate at least one thermal function 120 to each functional region 118, or to implement step 106. Thermal function 120 may be a function that generates waste heat during operation due to the power consumption of at least one electronic component arranged in the corresponding functional region according to the measured configuration. Alternatively or supplementary, thermal function 120 may also be the highest temperature at which the at least one electronic component 112 arranged in the corresponding functional region 118 operates without damage or power limitation.

[0093] The device 150 also includes a housing measurement unit configured to perform step 108 or measure housing 110, which is capable of outputting waste heat generated during the operation of electronic components while maintaining a maximum temperature, based on the thermal function assigned to the functional area. To this end, the housing measurement unit measures the thermal state of matter (TDZ) based on thermal function 120 and the corresponding housing 110 (e.g., for candidates of the housing 110 under test). The housing measurement unit can also determine whether the TDZ maintains (i.e., satisfies) the maximum temperature according to thermal function 120.

[0094] If the maximum temperature (or other conditions of thermal function 120) is maintained, the corresponding housing is output by device 150 as housing 110 under test, for example for illustration on user device 160. Device 150 may, for example (preferably in response to confirmation of housing 110 under test input by user device 160), send a digital order to the warehouse to send housing 110 under test.

[0095] The housing measurement unit can calculate and / or retrieve the TDZ from the database 154 using thermal simulation 158 (also referred to in technical terms as a simulation unit or "engine" for thermal simulation). The database 154 preferably stores datasets 156 for multiple housings 110. With the circuit board 114 housed within the housing 110, each dataset 156 for the housing provides a different TDZ based on the configuration of the thermal functions 120 within the housing 110, i.e., based on the configuration of the functional areas 118 on the mounting side 116 of the circuit board 114 (which are assigned to the thermal functions 120).

[0096] Thermal simulation 158 can be used to check, adjust, and / or optimize the configuration of electronic component 112 (i.e., the layout of circuit board 114) or the configuration of the corresponding thermal function 120. For example, in step 106, in the digital representation of circuit board 114 (such as the configuration of electronic component 112), electronic component 112 is replaced or converted into thermal function 120. Thermal function 120 can be a primitive of thermal simulation 158. This allows for better performance of thermal simulation 158.

[0097] Figure 4 This is a schematic diagram of the structure of database 154. Database 154 can store datasets 156 related to multiple housings 110. Depending on the configuration of the thermal function, each dataset 156 related to the housing 110 under test can include multiple TDZs 122.

[0098] The initial housing is preferably determined based on the dimensions of the circuit board 114 and / or by means of input from the user device 160. The TDZ can be read from the dataset 156' of this initial housing. Therefore, method 100 can be implemented in different directions and the housing 110 can be modified (i.e., altered) based on the initial housing to, for example, optimize hardware settings. A metric gives the similarity between two housings 110. The dataset 156 can be assigned to group 155 using the metric. Modifications can be performed within each group based on the initial housing (i.e., the corresponding dataset 156'). For example, if conditions (such as maximum temperature) determined by the thermal function 120 are not met, the housing 110 is iteratively modified based on the determined TDZ 122 (preferably for datasets 156 adjacent to dataset 156' according to the metric). This modification is achieved through… Figure 4 One of the arrows shown is illustrated schematically.

[0099] After balancing the heat load, i.e., while maintaining the conditions (e.g., maximum temperature) measured by the heat function 120 for the modified housing 110 as retrieved from the database 154 or calculated by means of thermal simulation 158, the modified housing 110 can be output as the housing under test 110, for example via network 153 and / or on user device 160. Optionally, multiple housings 110 can be measured, and one housing can be selected from them by means of user device 160. For this purpose, for example, it can be given what kind of heat reserve each housing under test has, for example, how much the difference is between the temperature of the TDZ and the maximum temperature. The housings 110 in group 155 may, for example, have the same shape factor and different protrusions and / or cooling bodies 124 and / or vents and / or exhaust vents 125.

[0100] In other words, an embodiment of method 100 can digitally check the suitability combination of circuit board 114 (more precisely, the configuration of components) and housing 110 under thermal or thermodynamic standards (e.g., maximum temperature) and then output the housing 110 under test as a recommendation.

[0101] As an alternative or supplementary solution, the initial housing can be determined using the user device 160 and / or design interface 152, and the method 100 modifies the initial housing by automatically adjusting (e.g., housing replacement) or modifying the layout of the housing 110 and / or circuit board 114.

[0102] In step 108, the modification of housing 110 (and optionally circuit board 114) can be implemented iteratively or in multiple stages. In this case, thermal simulation 158 and database 154 are preferably used in combination, for example, by retrieving the initial housing from the database, digitally modifying this initial housing, and storing it as a new dataset 156 in database 154. This allows device 100 to respond more quickly to future requests through design interface 152 and / or network 153.

[0103] In each dataset 156 and / or for thermal simulation 158, the corresponding housing 110 can be digitally represented by at least one thermal function, for example, as a boundary condition for convective flow. The thermal function of the housing preferably includes primitives such as sides, corner elements, fixing elements, and / or vents and exhaust vents.

[0104] Inspection 102 may include input by a user on user device 160 and / or via design interface 152 using an editor. This editor may be a CAD application. Alternatively or supplementary, inspection 102 may include uploading (i.e., uploading via network 153) a camera image or (preferably non-contact) scan (i.e., a scanned image) of the actual circuit board 114 (e.g., the actual assembly side 116) or the actual configuration (e.g., layout) of the electronic components 112 of the circuit board 114. Alternatively or supplementary, a simplified representation of the configuration of the electronic components 112 may be uploaded or entered into the editor.

[0105] To accelerate the thermal simulation 158, the input in step 102 is reduced or simplified by allocating thermal function 120 (preferably by using primitives) instead of actual electronic components 112 in step 106. The thermal simulation 158 can be performed using primitives as proxies or by reducing the configuration to thermal function 120 or a real representation. For example, this can be achieved through tortuous conductive paths and / or...

[0106] Complex components can be represented by one or more primitives adjacent to each other in a plane or superimposed on each other in multiple planes, these primitives having the same impedance and / or power consumption as the real electronic component 112. Preferably, whether the heat flow is generated by Joule heating of the conductive path or whether it is generated within the barrier layer of the semiconductor is independent of the simulated thermodynamic process.

[0107] The inspection 102 of electronic component 112, the determination 104 of functional area 118, and / or the allocation 106 of thermal function 120 can be preprocessing or model preparation (also known as "preprocessing" in technical terms) for the product development of the combination of housing and circuit board. As an alternative or supplementary option, the determination 108 of housing 110 can preferably be iterative or multi-stage modification of the initial housing, post-processing or model post-processing for the product development of the combination of housing and circuit board.

[0108] In each embodiment, after iterative or multi-stage modification of the initial housing, the measurement 108 of housing 110 preferably includes post-processing, such as converting the numerical results into a perspective or view of housing 110 and / or circuit board 114.

[0109] Although the invention has been described with reference to exemplary embodiments, it will be apparent to those skilled in the art that various changes can be made and equivalents can be used as substitutions. Furthermore, multiple modifications can be made to adapt specific situations or materials to the technical principles of the invention. Therefore, the invention is not limited to the disclosed embodiments, but includes all embodiments falling within the scope of the appended claims.

[0110] Explanation of reference numerals in the attached figures

[0111] Method 100

[0112] Detection configuration 102

[0113] Measured functional areas 104

[0114] Heat distribution function 106

[0115] Determination of the shell 108

[0116] Casing 110

[0117] Electronic component 112

[0118] Circuit Board 114

[0119] Assembly side 116

[0120] Functional area 118

[0121] Thermal functionality, including the selection of thermal primitives for the thermal model, the design primitives for the circuit, and / or the thermal model.

[0122] Proposed primitive 120

[0123] Thermal state (TDZ), preferably the temperature distribution within or around the shell and / or

[0124] Cooling medium flow in or originating from the casing 122

[0125] Cooling body 124

[0126] Ventilation / Exhaust Vent 125

[0127] Apparatus 150 for implementing or controlling the method

[0128] Design Interface 152

[0129] Network, preferably the Internet or a wireless access network 153

[0130] Database 154 on multiple shells

[0131] The assembly of the housing, preferably the same as housing 155

[0132] Regarding the dataset for the shell, it is preferable to include TDZ 156.

[0133] The dataset regarding the initial shell preferably includes TDZ 156'.

[0134] TDZ Thermal Simulation 158

[0135] User device, preferably a mobile device or workstation device 160

[0136] Design component 162

Claims

1. A method (100) for determining a housing (110) which is capable of accommodating electronic components (112) on a circuit board (114) which generate waste heat, the method comprising: - detecting (102) a configuration of electronic components (112) on an assembly side (116) of the circuit board (114); - determining a plurality of functional areas (118) within the assembly side (116) in which at least one of the electronic components (112) is respectively arranged according to the detected configuration; - assigning (106) to each of the functional areas (118) a thermal function (120), wherein each of the thermal functions (120) comprises: (i) a thermal function (120) which generates waste heat during operation as a result of the power consumption of at least one electronic component (112) arranged in the respective functional area (118) according to the detected configuration, and (ii) a maximum temperature at which the at least one electronic component (112) arranged in the respective functional area (118) is operated without damage and power limitation; and - determining (108) a housing which is capable of outputting the waste heat generated during operation of the electronic components (112) according to the thermal functions (120) assigned to the functional areas (118) while maintaining the maximum temperatures, and / or determining whether a selected housing (110) is capable of outputting the waste heat generated during operation of the electronic components (112) according to the thermal functions (120) assigned to the functional areas (118) while maintaining the maximum temperatures.

2. The method according to claim 1, wherein the thermal functions (120) are related to an operating state of the electronic components (112), the operation of which comprises a first operating state and a second operating state which is different from the first operating state, wherein a first power consumption in a first functional area (118) is greater in the first operating state than in the second operating state, and a second power consumption in a second functional area (118) is smaller in the first operating state than in the second operating state.

3. The method according to claim 1 or 2, wherein the thermal functions (120) further comprise in at least one of the functional areas (118) of the circuit board (114) or in a further functional area (119) of the housing (110): (iii) a thermal function (120) for heat transfer according to at least one electronic component arranged in the respective functional area (118) and / or according to a cooling body (124) or a vent (125) in the respective functional area (118) or in a further functional area (119), and / or wherein one or each of the thermal functions (120) comprises: - a thermal function (120) of a heat source in the respective functional area (118) and / or - a thermal function (120) of a heat sink in the respective functional area (118) and / or - a thermal function (120) of heat transfer in the respective functional area (118).

4. The method according to claim 3, wherein the heat transport heat functions (120) - comprise heat conduction and / or heat radiation and / or heat convection, and / or - represent a thermal bridge or thermal insulation between the respective functional area (118) and the surroundings of the housing, and / or - comprise passive heat transport, and / or - comprise active heat transport.

5. The method according to claim 1, wherein the determination of the housing (108) comprises determining a plurality of housings which are able to output waste heat generated in the course of operation of the electronic component (112) at the highest temperature according to the configuration of the heat functions (120) assigned to the functional areas (118).

6. The method according to claim 5, wherein the housing of the plurality of housings which is smallest in terms of spatial requirement or width is also determined.

7. The method according to claim 5, wherein the determination of the housing (108) comprises: - calculating or querying a temperature or temperature distribution in the plurality of housings according to the heat functions (120) assigned to the functional areas (118).

8. The method according to claim 7, wherein the housing of the plurality of housings whose temperature or temperature distribution is in a predetermined value range and / or whose temperature or temperature distribution is lowest is determined.

9. The method according to claim 7, wherein the calculation of the temperature or temperature distribution comprises numerically simulating a thermodynamic process in and / or from the respective housing, wherein the combination of the respective housing (110) and the heat functions (120) assigned to the functional areas (118) of the circuit board (114) determines the boundary conditions of the thermodynamic process.

10. The method according to claim 9, wherein the thermodynamic process in and / or from the respective housing (110) comprises a convection and / or flow (122) of a cooling medium in and / or from the respective housing (110).

11. The method according to claim 1, wherein the determination of the housing (108) comprises querying a database in which for a plurality of housings: - boundary conditions; and / or - interconnection rules of the housings; and / or - materials of the housings; and / or - temperatures and / or temperature distributions which are related to a configuration of the heat functions (120) in the respective housing are stored, wherein the querying gives a configuration of the heat functions (120) assigned to the functional areas (118) when the circuit board is accommodated in the respective housing.

12. The method according to claim 11, wherein a temperature or temperature distribution in the plurality of housings is calculated according to the heat functions (120) assigned to the functional areas (118), wherein the calculation of the temperature or temperature distribution comprises numerically simulating a thermodynamic process in and / or from the respective housing, wherein the boundary conditions comprise the boundary conditions of the simulation and / or the boundary conditions of the thermodynamic process.

13. The method according to claim 11, wherein the boundary conditions comprise boundary conditions of manufacturing the housings.

14. The method according to claim 11, wherein the temperature or temperature distribution in the plurality of housings is calculated from the thermal functions (120) assigned to the functional areas (118), wherein the calculation of the temperature or temperature distribution comprises a digital simulation of a thermodynamic process in and / or from the respective housing, wherein temperatures and / or temperature distributions resulting from previous digital simulations are stored in the database, and wherein the temperatures and / or temperature distributions stored in the database for similar or most similar configurations of the assigned thermal functions (120) are initial values for the digital simulation of the thermodynamic process.

15. The method according to claim 11, wherein the database is queried to derive an initial housing, and wherein the stored or calculated temperature distribution for the initial housing does not hold the highest temperature at a location, wherein the method further comprises: - modifying the housing at the location where the temperature distribution does not hold the highest temperature, and - calculating a temperature distribution in the modified initial housing from the thermal functions (120) assigned to the functional areas (118).

16. The method according to claim 15, wherein the determination (108) of the housing based on the initial housing iteratively implements the modification step and the calculation step until the highest temperature is held.

17. The method according to claim 15, wherein the determination (108) of the housing based on the initial housing comprises a multi-stage implementation of the modification step and the calculation step, wherein in a first stage of the multi-stage implementation the housing is modified in a first area, and in a second stage based on the modification in the first stage the housing is modified in a second area, which is smaller than and completely located within the first area.

18. The method according to claim 15, wherein the modification of the housing comprises adding a thermal bridge and / or a ventilation opening between the location of the housing and an outer area of the housing; and / or wherein the modification of the housing comprises changing the thermal conductivity of the housing at least at the location.

19. The method according to claim 18, wherein the modification of the housing comprises changing the thermal conductivity of the housing at least at the location, wherein the changed thermal conductivity corresponds to a changed wall thickness and / or a changed wall material of the housing.

20. The method according to claim 15, wherein the modification of the housing is subject to a minimum inner dimension of the housing for accommodating the circuit board, a pre-defined fixation point in the housing for fixing the circuit board, a pre-defined fixation point for fixing the housing on a mounting rail, a boundary condition for manufacturing the housing, and / or a maximum outer dimension of the housing.

21. The method according to claim 1, wherein the respective housing is digitally represented by a Delaunay triangulation, a hierarchical data structure, an octree network, or a hexahedral network.

22. The method according to claim 1, wherein each of the functional areas (118) is a rectangular area within an assembly side of the circuit board and / or a disjointed partition of the assembly side.

23. The method according to claim 1, wherein at least one or each of the assigned thermal functions (120) is digitally represented by a disjointed conductive path segment, the conductive path segment having a length within the respective functional area (118) that is greater than a perimeter of the respective functional area (118).

24. The method according to claim 23, wherein an ohmic resistance, a current strength passing through the conductive path segment, and / or a power consumption of the conductive path segment is / are equivalent to an ohmic resistance, a current strength, or a power consumption, respectively, of at least one electronic component (112) arranged in the respective functional area (118) during operation according to the configuration.

25. The method according to claim 1, wherein the detection (102) of the configuration of the electronic components (112) further comprises a detection of interconnections of the electronic components (112).

26. The method according to claim 25, wherein the assignment (106) of the thermal functions (120) further comprises a digital simulation of the electronic components (112) detected according to the interconnections, wherein the digital simulation determines the thermal functions (120) of at least one electronic component (112) in the respective functional area (118) during operation.

27. The method according to claim 1, wherein the determination (108) of the housing further comprises a determination of electrical clearances and / or creepage distances.

28. The method according to claim 1, wherein the detection (102) of the configuration of the electronic components (112) comprises: - detecting a camera image of the circuit board by means of a camera; and - determining the configuration of the electronic components (112) and / or interconnections on the circuit board by means of image recognition from the electronic components (112) detected in the camera image of the circuit board and / or from a course of the conductive paths detected in the camera image of the circuit board and / or from a position of the electronic components (112) detected in the camera image of the circuit board.

29. The method according to claim 1, wherein the detection (102) of the configuration of the electronic components (112) comprises: - receiving a digital design drawing of the circuit board; and - reading out the configuration of the electronic components (112) and / or interconnections of the electronic components (112) from the digital design drawing of the circuit board.

30. The method of claim 29, wherein, replacing the electronic components (112) by digital representations.

31. The method according to claim 29, wherein the detection (102) of the configuration of the electronic components (112) further comprises: - providing a web page for retrieval, the web page comprising an input area or interface, the input area or interface being configured to create and / or upload the digital design drawing.

32. The method according to claim 1, further comprising at least one of the following steps: - providing a web page for retrieval, the web page comprising an input area or interface, the input area or interface being configured to create and / or upload the digital design drawing. - providing a web page for retrieval, the web page comprising an input area or interface, the input area or interface being configured to create and / or upload the digital design drawing. - providing a web page for retrieval, the web page comprising an input area or interface, the input area or interface being configured to create and / or upload the digital design drawing. - providing a web page for retrieval, the web page comprising an input area or interface, the input area or interface being configured to create and / or upload the digital design drawing. - providing a web page for retrieval, the web page comprising an input area or interface, the input area or interface being configured to create and / or upload the digital design drawing. - providing a web page for retrieval, the web page comprising an input area or interface, the input area or interface being configured to create and / or upload the digital design drawing. - providing a web page for retrieval, the web page comprising an input area or interface, the input area or interface being configured to create and / or upload the digital design drawing. - providing a web page for retrieval, the web page comprising an input area or interface, the input area or interface being configured to create and / or upload the digital design drawing. - providing a web page for retrieval, the web page comprising an input area or interface, the input area or interface being configured to create and / or upload the digital design drawing. - providing a web page for retrieval, the web page comprising an input area or interface, the input area or interface being configured to create and / or upload the digital design drawing. - providing a web page for retrieval, the web page comprising an input area or interface, the input area or interface being configured to create and / or upload the digital design drawing. - providing a web page for retrieval, the web page comprising an input area or interface, the input area or interface being configured to create and / or upload the digital design drawing. - providing a web page for retrieval, the web page comprising an input area or interface, the input area or interface being configured to create and / or upload the digital design drawing. - providing a web page for retrieval, the web page comprising an input area or interface, the input area or interface being configured to create and / or upload the digital design drawing. - providing a web page for retrieval, the web page comprising an input area or interface, the input area or interface being configured to create and / or upload the digital design drawing. - providing a web page for retrieval, the web page comprising an input area or interface, the input area or interface being configured to create and / or upload the digital design drawing. - providing a web page for retrieval, the web page comprising an input area or interface, the input area or interface being configured to create and / or upload the digital design drawing. - providing a web page for retrieval, the web page comprising an input area or interface, the input area or interface being configured to create and / or upload the digital design drawing. - providing a web page for retrieval, the web page comprising an input area or interface, the input area or interface being configured to create and / or upload the digital design drawing. - providing a web page for retrieval, the web page comprising an input area or interface, the input area or interface being configured to create and / or upload the digital design drawing. - providing a web page for retrieval, the web page comprising an input area or interface, the input area or interface being configured to create and / or upload the digital design drawing. - providing a web page for retrieval, the web page comprising an input area or interface, the input area or interface being configured to create and / or upload the digital design drawing. - providing a web page for retrieval, the web page comprising an input area or interface, the input area or interface being configured to create and / or upload the digital design drawing. - providing a web page for retrieval, the web page comprising an input area or interface, the input area or interface being configured to create and / or upload the digital design drawing. - providing a web page for retrieval, the web page comprising an input area or interface, the input area or interface being configured to create and / or upload the digital design drawing. - providing a web page for retrieval, the web page comprising an input area or interface, the input area or interface being configured to create and / or upload the digital design drawing. - providing a web page for retrieval, the web page comprising an input area or interface, the input area or interface being configured to create and / or upload the digital design drawing. - providing a web page for retrieval, the web page comprising an input area or interface, the input area or interface being configured to create and / or upload the digital design drawing. - providing a web page for retrieval, the web page comprising an input area or interface, the input area or interface being configured to create and / or upload the digital design drawing. - providing a web page for retrieval, the web page comprising an input area or interface, the input area or interface being configured to create and / or upload the digital design drawing. - providing a web page for retrieval, the web page comprising an input area or interface, the input area or interface being configured to create and / or upload the digital design drawing. - providing a web page for retrieval, the web page comprising an input area or interface, the input area or interface being configured to create and / or upload the digital design drawing. - providing a web page for retrieval, the web page comprising an input area or interface, the input area or interface being configured to create and / or upload the digital design drawing. - providing a web page for retrieval, the web page comprising an input area or interface, the input area or interface being configured to create and / or upload the digital design drawing. - providing a web page for retrieval, the web page comprising an input area or interface, the input area or interface being configured to create and / or upload the digital design drawing. - providing a web page for retrieval, the web page comprising an input area or interface, the input area or interface being configured to create and / or upload the digital design drawing. - providing a web page for retrieval, the web page comprising an input area or interface, the input area or interface being configured to create and / or upload the digital design drawing. - providing a web page for retrieval, the web page comprising an input area or interface, the input area or interface being configured to create and / or upload the digital design drawing. - providing a web page for retrieval, the web page comprising an input area or interface, the input area or interface being configured to create and / or upload the digital design drawing. - providing a web page for retrieval, the web page comprising an input area or interface, the input area or interface being configured to create and / or upload the digital design drawing. - providing a web page for retrieval, the web page comprising an input - selecting a housing which is determined to be able to output waste heat generated during operation of the electronic component (112) after the determination is made; - selecting a housing to be determined as to whether it is able to output waste heat generated during operation of the electronic component (112) before the determination is made; - determining and / or providing the circuit board (114) based on the selected housing determination.

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