Packaging apparatus and packaging method

Abstract

This invention relates to a packaging apparatus and a packaging method, which can encapsulate a semiconductor chip in a packaged body by placing a cover film between a thermoforming tool and a semiconductor chip and using an adhesive material, and allows the thermoforming tool to be easily peeled off from the cover film after packaging. In a packaging apparatus (10) for encapsulating a semiconductor chip (100) in a substrate (104), a control unit (50) includes: a packaging device that, with a cover film (110) between the semiconductor chip (100) and the thermoforming tool (16), presses the semiconductor chip (100) onto the substrate (104), heats and cools the thermoforming tool (16), and encapsulates the semiconductor chip (100) in the substrate (104); and a peeling device that, after encapsulating the semiconductor chip (100), heats the thermoforming tool (16) and raises the encapsulation head (17) to peel it off from the cover film (110).

Description

Technical Field

[0001] The present invention relates to the structure of a packaging device and a packaging method for packaging a semiconductor chip onto a substrate or other semiconductor chip via an adhesive material. Background Technology

[0002] The flip chip bonder technology described below has long been well-known: encapsulating a semiconductor chip onto a substrate or other semiconductor chip without wires. The flip chip bonder pre-coats the substrate with an adhesive material containing a thermosetting resin. A thermoforming tool heats and presses the semiconductor chip, melting the solder on the electrodes and hardening the adhesive material on the substrate. The thermoforming tool is then cooled to solidify the solder, bonding the semiconductor chip to the substrate. During the heating and pressing process, sometimes adhesive material extruded from the semiconductor chip spreads upwards and adheres to the encapsulation head.

[0003] To prevent the adhesion of such adhesive material to the heat-pressing tool, an encapsulation device is disclosed that covers the bottom surface of the heat-pressing tool with a membrane component (cover film). For example, Patent Document 1 describes a membrane component conveying mechanism that provides a heat-pressing tool at the joint and sequentially feeds membrane components, thereby preventing the adhesive material from adhering to the heat-pressing tool.

[0004] Existing technical documents

[0005] Patent documents

[0006] Patent Document 1: Japanese Patent Application Publication No. 2015-35493 Summary of the Invention

[0007] The problem that the invention aims to solve

[0008] Furthermore, in the packaging apparatus described in Patent Document 1, if a thermoforming tool is used to heat and pressurize the semiconductor chip when packaging it into the packaged object, the cover film between the thermoforming tool and the semiconductor chip may thermally expand. Then, if the thermoforming tool is cooled, the cover film shrinks due to the cooling and adheres to the side or bottom surface of the thermoforming tool. Thus, if the cover film adheres to the side or bottom surface of the thermoforming tool, it may not detach from the thermoforming tool.

[0009] Therefore, the object of the present invention is to provide a packaging device in which a cover film is placed between a thermoforming tool and a semiconductor chip and the semiconductor chip is encapsulated in the packaged body via an adhesive material, and the thermoforming tool is easily peeled off from the cover film after encapsulation.

[0010] Methods for solving problems

[0011] The packaging apparatus of the present invention encapsulates a semiconductor chip onto a packaged body via an adhesive material, and is characterized by comprising: a packaging head for holding the semiconductor chip and moving in a direction relative to or away from the packaged body, equipped with a thermoforming tool for pressing the semiconductor chip onto the packaged body, and a tool heating and cooling mechanism for heating and cooling the thermoforming tool; a film placement mechanism for moving a cover film and placing the cover film between the semiconductor chip pressed onto the packaged body and the thermoforming tool; and a control unit for controlling the movement of the packaging head and the film placement mechanism, and controlling the temperature of the thermoforming tool via the tool heating and cooling mechanism, the control unit comprising: a packaging device for pressing the semiconductor chip onto the packaged body with the cover film between the semiconductor chip and the thermoforming tool, and for heating and cooling the thermoforming tool to encapsulate the semiconductor chip onto the packaged body; and a peeling device for peeling off the cover film by heating the thermoforming tool and raising the packaging head after encapsulating the semiconductor chip.

[0012] In this way, after the semiconductor chip is packaged, the thermoforming tool is heated to a predetermined temperature, causing the cover film attached to the side or bottom of the thermoforming tool to thermally expand and reduce the adhesion force on the side or bottom of the thermoforming tool. Then, the packaging head is raised, so the thermoforming tool can be easily peeled off from the cover film when the packaging head is raised.

[0013] In the packaging apparatus of the present invention, the stripping device may, after packaging the semiconductor chip into the packaged body, raise the packaging head slightly by heating and cooling the hot pressing tool to a predetermined temperature through a tool heating and cooling mechanism.

[0014] Therefore, the formation of a tiny gap between the thermoforming tool and the cover film can reduce the temperature rise of the encapsulated semiconductor chip or the hardened adhesive material when the thermoforming tool is heated, thereby suppressing the deterioration or damage of the encapsulated semiconductor chip or adhesive material.

[0015] In the packaging apparatus of the present invention, the thermoforming tool can also adsorb and hold the semiconductor chip. The packaging equipment causes the thermoforming tool to adsorb and hold the semiconductor chip, lowers the packaging head and temporarily presses the semiconductor chip onto the packaged body via the bonding material, and places the cover film between the semiconductor chip and the thermoforming tool. The semiconductor chip is then packaged in the packaged body by pressing the temporarily pressed semiconductor chip.

[0016] Therefore, instead of encapsulating the semiconductor chip by setting vent holes in the cover film as described in Patent Document 1, the cycle time can be shortened.

[0017] The packaging method of the present invention encapsulates a semiconductor chip onto a packaged body via an adhesive material, and is characterized by comprising: a preparation step, wherein a packaging apparatus is prepared, the packaging apparatus including a packaging head, a tool heating and cooling mechanism, and a film placement mechanism, the packaging head holding the semiconductor chip and moving in a direction relative to the packaged body towards or away from it, a thermoforming tool for pressing the semiconductor chip onto the packaged body is mounted at its top end, the tool heating and cooling mechanism is mounted on the packaging head for heating and cooling the thermoforming tool, and the film placement mechanism placing a cover film between the semiconductor chip and the thermoforming tool; a film placement step, wherein, when encapsulating the semiconductor chip onto the packaged body, the cover film is positioned between the semiconductor chip and the thermoforming tool by the film placement mechanism; a packaging step, wherein, with the cover film positioned between the semiconductor chip and the thermoforming tool, the semiconductor chip is pressed onto the packaged body, and the thermoforming tool is heated and then cooled to encapsulate the semiconductor chip onto the packaged body; and a peeling step, wherein, after the packaging step, the thermoforming tool is heated and the packaging head is raised to peel off the cover film.

[0018] The effects of the invention

[0019] The present invention provides a packaging device in which a cover film is placed between a thermoforming tool and a semiconductor chip and the semiconductor chip is encapsulated in the packaged body via an adhesive material, and the thermoforming tool can be easily peeled off from the cover film after encapsulation. Attached Figure Description

[0020] Figure 1 This is a system diagram illustrating the structure of the packaging device according to an embodiment.

[0021] Figure 2 This is a schematic plan view of the packaging device according to the embodiment.

[0022] Figure 3 A side view showing the temporary pressing action of a semiconductor chip.

[0023] Figure 4 A side view showing the state in which the cover film is positioned between a temporarily pressed semiconductor chip and a thermoforming tool.

[0024] Figure 5 This is a side view illustrating the heating process during semiconductor chip packaging.

[0025] Figure 6 To indicate Figure 5 A side view showing details of part A.

[0026] Figure 7 This is a side view illustrating the cooling process during semiconductor chip packaging.

[0027] Figure 8 To indicate Figure 7 A side view showing details of Part B.

[0028] Figure 9 This is a side view showing the heating action after packaging.

[0029] Figure 10 To indicate Figure 9 A side view showing details of section C.

[0030] Figure 11 This is a side view showing the state of the package head rising after the heating action.

[0031] Figure 12 A graph showing the temperature change of the hot pressing tool.

[0032] Figure 13 A graph showing the change in the adhesion force of the cover film to the heat-pressing tool.

[0033] Figure 14 A graph showing the change in the height of the hot pressing tool.

[0034] [Explanation of Symbols]

[0035] 10: Packaging device

[0036] 11: Ontology

[0037] 12: Insulation block

[0038] 13: Airflow path

[0039] 14: Heater

[0040] 15: Cooling tank

[0041] 16: Hot pressing tools

[0042] 16a: Protrusion

[0043] 17: Packaging Head

[0044] 18: Suction hole

[0045] 19: Fan

[0046] 20: Joining Platform

[0047] 21: Abutment

[0048] 22: Membrane configuration mechanism

[0049] 24: Membrane delivery mechanism

[0050] 28: Feed roller

[0051] 28a: Feed roller

[0052] 28b: Take-up roller

[0053] 30: Membrane moving mechanism

[0054] 32: Track

[0055] 34: Moving Block

[0056] 50: Control Department

[0057] 100: Semiconductor chip

[0058] 102: Bump

[0059] 104: Substrate

[0060] 105: Electrode

[0061] 106: Encapsulation Block

[0062] 108: Continuing with the materials

[0063] 110: Cover film Detailed Implementation

[0064] The following refers to the appendix. Figure 1 The packaging device 10 of the embodiment will be described in detail. Figure 1 As shown, the packaging apparatus 10 is an apparatus for manufacturing a semiconductor device by packaging a plurality of semiconductor chips 100 on a substrate 104, which serves as the packaged object. The semiconductor chips 100 are packaged on the substrate 104 using flip-chip bonding technology. Specifically, after forming a protrusion containing a conductive material, called a bump 102, on the bottom surface of each semiconductor chip 100, the semiconductor chip 100 is flipped, and the bump 102 is bonded to an electrode 105 formed on the surface of the substrate 104, thereby electrically connecting the semiconductor chip 100 to the substrate 104.

[0065] like Figure 2 As shown, on substrate 104, packaging blocks 106 for packaging semiconductor chips 100 are defined in a two-dimensional array. In the example shown, 15 packaging blocks 106 are defined in 3 rows and 5 columns on a substrate 104. Multiple electrodes 105 electrically connected to bumps 102 of the semiconductor chip 100 are formed on the surface of each packaging block 106. Additionally, an adhesive material 108, referred to as non-conductive paste (NCP) or non-conductive film (NCF), is pre-coated onto each packaging block 106. The adhesive material 108 comprises a thermosetting resin that is both insulating and thermosetting. By placing the semiconductor chip 100 on the adhesive material 108, pressing it against the substrate 104, and heating the semiconductor chip 100, the adhesive material 108 hardens, mechanically bonding and fixing the semiconductor chip 100 to the substrate 104. Furthermore, this method of pre-coating the adhesive material 108 onto the substrate 104 is generally referred to as a "pre-coating method."

[0066] The packaging apparatus 10 temporarily presses each semiconductor chip 100 together and then encapsulates it onto a substrate 104. Temporary pressing involves temporarily placing the semiconductor chip 100 in a corresponding packaging block 106 (attachment material 108) within the substrate 104. Encapsulation is then performed by heating and pressurizing the temporarily pressed semiconductor chip 100, thereby mechanically and electrically connecting it to the substrate 104. During encapsulation, the semiconductor chip 100 is heated to a temperature above the hardening temperature of the attachment material 108 and above the melting temperature of the bump 102. In this example, after continuously performing temporary pressing of the semiconductor chips 100 in multiple packaging blocks 106, the encapsulation of the temporarily pressed semiconductor chips 100 is performed continuously.

[0067] The packaging apparatus 10 is an apparatus for packaging semiconductor chips 100 onto a substrate 104 in the aforementioned sequence. The packaging apparatus 10 includes a bonding platform 20, a packaging head 17, a base 21, a film placement mechanism 22, and a control unit 50 for controlling the movement of these components.

[0068] The bonding platform 20 is a platform for placing the substrate 104. The bonding platform 20 may include, for example, a suction hole (not shown) for holding the substrate 104, or a heater (not shown) for heating the substrate 104. The bonding platform 20 is supported by a base 21.

[0069] The encapsulation head 17 is disposed facing the bonding platform 20 and includes: a body 11; a heat insulation block 12 mounted on the lower side of the body 11; a heater 14 mounted on the lower side of the heat insulation block 12; and a heat pressing tool 16 mounted on the lower side of the heater 14.

[0070] The body 11 can move vertically relative to the substrate 104 adsorbed on the bonding platform 20 by means of an internal drive mechanism, and can also move horizontally relative to the substrate 104.

[0071] The heat insulation block 12 is a ceramic plate-shaped component sandwiched between the body 11 and the heater 14 to prevent heat from the heater 14 from being transferred to the body 11. The heater 14 is made by embedding a heating resistor made of platinum or tungsten inside a ceramic such as aluminum nitride.

[0072] On the upper surface of heater 14, there is a groove along the edge. Figure 1Two cooling grooves 15 extend vertically from the paper surface. Furthermore, an airflow path 13 is provided in the heat insulation block 12, extending in an L-shape from the side and connecting the side to the cooling grooves 15 provided in the heater 14. When power is input to the heater 14 from the control unit 50, the heating resistor heats up and its temperature rises, heating the heat-pressing tool 16 mounted on the lower side of the heater 14. Conversely, if air from the fan 19 flows through the airflow path 13 of the heat insulation block 12, the heater 14 is cooled, thereby cooling the heat-pressing tool 16. Therefore, the heat insulation block 12, the heater 14, and the fan 19 constitute a tool heating and cooling mechanism for heating and cooling the heat-pressing tool 16.

[0073] Regarding the thermoforming tool 16, its upper surface is approximately the same size as the heater 14, and it has a protrusion 16a on its lower side for adsorbing and pressing the semiconductor chip 100. The size of the protrusion 16a is approximately the same as the size of the semiconductor chip 100. The thermoforming tool 16 is made of ceramic.

[0074] In the thermoforming tool 16, a suction hole 18 is formed for suction and holding the semiconductor chip 100. The suction hole 18 passes through the heater 14 and the heat insulation block 12 and is connected from the body 11 to a suction pump (not shown). The negative pressure generated by the suction pump suctions and holds the semiconductor chip 100 on the lower surface of the protrusion 16a of the thermoforming tool 16.

[0075] A film placement mechanism 22 is provided on the base 21 of the packaging device 10. During the packaging of the semiconductor chip 100, the film placement mechanism 22 places a cover film 110 between the temporarily pressed semiconductor chip 100 and the thermoforming tool 16. In this example, a strip-shaped cover film 110 that is elongated in one direction is used. Materials with excellent heat resistance and high peelability of the adhesive material 108 are suitable for the cover film 110. Therefore, fluoropolymers such as polytetrafluoroethylene (PTFE) and polyfluoroalkoxy (PFA) can be used as materials for the cover film 110.

[0076] The film placement mechanism 22 includes a film delivery mechanism 24 that sequentially feeds a strip of cover film 110 upwards onto a substrate 104. The film delivery mechanism 24 includes a delivery roller 28a and a take-up roller 28b (hereinafter, without distinguishing between the delivery roller 28a and the take-up roller 28b, they are simply referred to as "feed rollers 28") on both sides of a spacer bonding platform 20. The cover film 110 is positioned between the pair of feed rollers 28. It is fed in a predetermined delivery direction by the delivery roller 28a. Figure 1The new cover film 110 is sequentially fed out by rotating the take-up roller 28b in the direction of arrow 29. Additionally, the used cover film 110 is wound onto the take-up roller 28b and retrieved by rotating the take-up roller 28b in the same direction as the feed roller 28a. That is, the cover film 110 is fed by rotating a pair of feed rollers 28 in the same direction.

[0077] The membrane placement mechanism 22 further includes a membrane moving mechanism 30, which moves the cover film 110 together with the membrane delivery mechanism 24 in a horizontal direction. The membrane moving mechanism 30 has a pair of tracks 32 extending along a first direction (in the example, the elongated direction of the rectangular substrate 104); and a moving block 34 sliding along the tracks 32. Additionally, the membrane placement mechanism 22 includes a membrane lifting mechanism (not shown), which raises and lowers the cover film 110 together with the membrane delivery mechanism 24. The membrane lifting mechanism is not particularly limited as long as it allows the height of the feed roller 28 to be variable.

[0078] The control unit 50 is connected to the body 11 of the encapsulation head 17, the heater 14, the fan 19, the film placement mechanism 22, and the bonding platform 20. It controls the movement of the encapsulation head 17 and the film placement mechanism 22, and controls the temperature of the heat-pressing tool 16 via the heater 14 and the fan 19. The control unit 50 includes, for example, a central processing unit (CPU) for performing various calculations, and a memory for storing various data and programs. The control unit 50 receives detection results from various sensors and performs drive control and temperature control on each component based on these results. For example, the control unit 50 controls the movement of the encapsulation head 17, the temperature of the heat-pressing tool 16 and the bonding platform 20, and the drive control of the suction mechanism. Additionally, the control unit 50 also controls the movement of the film placement mechanism 22 to position the cover film 110 appropriately.

[0079] The following refers to, on the one hand, Figures 3 to 14 The operation of the packaging apparatus 10 in this embodiment will be explained. When packaging the semiconductor chip 100, a substrate 104 is placed on the bonding platform 20. For example... Figure 2 As shown, the bonding material 108 is pre-coated on the packaging area 106 of the substrate 104, or the bonding material 108 is coated after being placed on the bonding platform 20.

[0080] The control unit 50 temporarily presses the semiconductor chip 100 onto each packaging block 106 of the substrate 104. Specifically, the control unit 50 moves the packaging head 17 to a chip supply source (not shown), and uses the protrusion 16a of the thermoforming tool 16 mounted on the top to draw and hold the semiconductor chip 100. Then, the control unit 50 drives the body 11 of the packaging head 17, moving the packaging head 17 directly above the corresponding packaging block 106.

[0081] Then, control unit 50, as Figure 3 As shown, the encapsulation head 17 descends towards the substrate 104 as indicated by arrow 90, pressing the semiconductor chip 100, held by the protrusion 16a of the hot-pressing tool 16 at its tip, onto the corresponding encapsulation block 106 (and subsequently the bonding material 108). This temporarily presses the semiconductor chip 100 onto the substrate 104 and the bonding material 108. After temporarily pressing one semiconductor chip 100, the encapsulation head 17 releases the suction of the semiconductor chip 100 and rises. Then, the encapsulation head 17 gradually performs temporary pressing of all semiconductor chips 100 in the same sequence.

[0082] During the temporary bonding process, the control unit 50 drives the film moving mechanism 30 to move the cover film 110 to the retracted position. The retracted position is a position that is horizontally away from the packaging block 106 where the semiconductor chip 100 is temporarily bonded.

[0083] After the temporary pressing process is completed, the control unit 50 executes the membrane preparation steps. The control unit 50, as follows... Figure 4 As shown, the drive film moving mechanism 30 moves the cover film 110 horizontally to a position directly above the temporarily pressed semiconductor chip 100 and between the semiconductor chip 100 and the thermoforming tool 16. Then, the control unit 50 lowers the cover film 110 via the film lifting mechanism, bringing it to approximately the same height as the upper surface of the semiconductor chip 100.

[0084] Control unit 50 Figure 14 The packaging process begins at time t0. The control unit 50... Figure 14 At time t0, the body 11 of the encapsulation head 17 descends, as... Figure 5 As shown, the protrusion 16a of the thermoforming tool 16 presses the temporarily bonded semiconductor chip 100 from above the cover film 110. Due to the pressing, material 108 then seeps out around the semiconductor chip 100, and a portion of the material 108 spreads along the sides of the semiconductor chip 100, reaching the lower surface of the cover film 110. Furthermore, due to the pressing, the bumps 102 formed on the semiconductor chip 100 contact the electrodes 105 of the substrate 104.

[0085] Control unit 50 Figure 12 At time t1, power is supplied to heater 14, which heats the thermoforming tool 16. As the temperature of the thermoforming tool 16 rises, the semiconductor chip 100 is heated, and the material 108 softens. If the temperature is further increased to above the melting temperature of the bump 102, the bump 102 of the semiconductor chip 100 melts. At this time, the control unit 50... Figure 14As shown, the height of the packaging head 17 is controlled such that the height of the semiconductor chip 100 from the substrate 104 becomes a certain height after packaging. Furthermore, if the temperature rises to the hardening temperature of the adhesive material 108, the adhesive material 108 begins to thermally harden. Thus, the control unit 50 heats the hot-pressing tool 16 to a temperature T1 that is above the hardening temperature of the adhesive material 108 and above the melting temperature of the bump 102. The temperature T1 may, for example, be around 300°C.

[0086] During the heating process, the cover film 110 is heated by the hot pressing tool 16, and... Figure 5 , Figure 6 As shown by arrow 91, the self-heating crimping tool 16 gradually expands outwards due to thermal expansion. Additionally, the cover film 110 deforms slightly downwards due to the pressure. Therefore, as... Figure 6 As shown, the cover film 110 is deformed such that it extends obliquely upward at the corner of the bottom surface of the protrusion 16a of the self-heating pressing tool 16.

[0087] Control unit 50 Figure 12 At time t2, fan 19 is started, as follows: Figure 7 As indicated by arrow 92, cooling air begins to flow in the airflow path 13 of the heat insulation block 12. The cooling air flows from the airflow path 13 into the cooling tank 15 of the heater 14, and from the cooling tank 15 towards... Figure 7 The paper flows out vertically. As a result, the heater 14 is cooled and its temperature decreases, and consequently, the temperature of the heat-pressing tool 16 also decreases. The molten bump 102 hardens, and bonding with the electrode 105 of the substrate 104 is completed at time t3. Additionally, the temperature of the heat-cured adhesive material 108 also decreases. Thus, the control unit 50 ends the encapsulation process.

[0088] If the temperature of the heat-pressing tool 16 gradually decreases due to cooling during the encapsulation process, the temperature of the cover film 110 also gradually decreases. Therefore, Figure 6 The portion of the bottom surface of the protrusion 16a of the self-heating crimping tool 16 extending obliquely upwards from the corner is cooled down as... Figure 7 , Figure 8 As indicated by arrow 93, it gradually tapers towards the side of the protrusion 16a of the heat-pressing tool 16. Furthermore, upon further cooling, it adheres to the side or bottom surface of the protrusion 16a of the heat-pressing tool 16. The adhesion force f... Figure 13 The adhesion force f gradually increases from time t2 to time t3, and reaches f3 at time t3. Thus, if the cover film 110 is attached to the side or bottom surface of the protrusion 16a of the heat-pressing tool 16, the cover film 110 may not fall off the heat-pressing tool 16 when the encapsulation head 17 is raised.

[0089] The control unit 50 cools the heater 14 by flowing cooling air from the fan 19 through the airflow path 13, thereby cooling the heat-pressing tool 16. Furthermore, in Figure 12 When the temperature of the thermoforming tool 16 drops to temperature T3 at time t3, the fan 19 stops, and the flow of cooling air into the airflow path 13 ceases. This completes the packaging of the semiconductor chip 100. Temperature T3 can also be set below, for example, the temperature at which the adhesive material 108 begins to soften. This prevents the adhesive material 108 from softening and shifting the position of the temporarily pressed semiconductor chip 100 when the protrusion 16a of the thermoforming tool 16 adheres to and holds the semiconductor chip 100 on the adhesive material 108.

[0090] Control unit 50 Figure 14 As shown, from the start time t0 of packaging to the end time t3 of packaging of semiconductor chip 100, the height of the packaging head 17 is controlled in a constant manner by ensuring that the height of the thermoforming tool 16 is constant. If the packaging step ends... Figure 14 At time t3, the control unit 50 begins the stripping process. At time t3, the control unit 50 drives the body 11 of the encapsulation head 17 to slightly raise the height of the heat-pressing tool 16 by a height Δh, and maintains its height.

[0091] like Figure 9 As shown, if the height of the heat-pressing tool 16 increases by Δh, the cover film 110, which is attached to the side or bottom surface of the protrusion 16a of the heat-pressing tool 16, remains attached to the side or bottom surface of the protrusion 16a and rises slightly together with the heat-pressing tool 16. Thus, a small gap is formed between the cover film 110 and the upper surface of the packaged semiconductor chip 100.

[0092] While maintaining the height of the heat-pressing tool 16, the control unit 50... Figure 12 At time t3, power is supplied to heater 14, which heats the hot pressing tool 16 to a predetermined temperature T2. Thus, as... Figure 8 As shown, the cover film 110 attached to the side or bottom surface of the protrusion 16a of the heat-pressing tool 16 is as follows: Figure 9 , Figure 10 As shown by arrow 94, thermal expansion occurs, moving away from the side or bottom surface of protrusion 16a. Furthermore, as... Figure 12 , Figure 13 As the temperature of the heat-pressing tool 16 rises from time t3 to time t4, the adhesion force f of the cover film 110 to the heat-pressing tool 16 decreases. Moreover, if the temperature of the heat-pressing tool 16 rises to a predetermined temperature T2 at time t4, the adhesion force f of the cover film 110 decreases to f2.

[0093] If the temperature of the heat-pressing tool 16 reaches a predetermined temperature T2, the control unit 50 stops supplying power to the heater 14 at time t4, driving the body 11 of the encapsulation head 17, as... Figure 11 Arrow 95 indicates that the encapsulation head 17 is raised. At this time, the cover film 110, which is positioned between a pair of feed rollers 28, remains in its original position and does not rise. As the adhesion force f on the heat-pressing tool 16 decreases to f2, the heat-pressing tool 16 peels off from the cover film 110 and rises together with the body 11. Thus, the peeling step ends.

[0094] After the control unit 50 raises the encapsulation head 17, it restarts the fan 19 to cool the heater 14 and the hot pressing tool 16 to temperature T3.

[0095] Here, the predetermined temperature T2 can be freely set as long as it is the temperature at which the adhesion force f of the cover film 110 is reduced to the point where the cover film 110 leaves the heat-pressing tool 16 when the encapsulation head 17 is raised. For example, it can be set to a temperature of about 50% of the temperature T1, or it can be set to about 150°C to 200°C.

[0096] As explained above, after encapsulating the semiconductor chip 100, the encapsulation apparatus 10 in the embodiment heats the thermoforming tool 16 to a predetermined temperature T2, causing the cover film 110 attached to the side or bottom surface of the thermoforming tool 16 during the encapsulation of the semiconductor chip 100 to thermally expand and reduce the adhesion force f on the side or bottom surface of the thermoforming tool 16. Then, the encapsulation head 17 is raised, so that the thermoforming tool 16 can be easily peeled off from the cover film 110 when the encapsulation head 17 is raised.

[0097] Furthermore, in this embodiment, after encapsulating the semiconductor chip 100, the encapsulation head 17 is slightly raised in the encapsulation apparatus 10. While a small gap is formed between the thermoforming tool 16 and the cover film 110, the thermoforming tool 16 is heated. Therefore, the temperature rise of the encapsulated semiconductor chip 100 or the hardened adhesive material 108 is reduced when the thermoforming tool 16 is heated, thus suppressing the deterioration or damage of the encapsulated semiconductor chip 100 or the adhesive material 108. Moreover, the heat from the heater 14 is not transferred to the semiconductor chip 100 or the adhesive material 108, so the temperature of the thermoforming tool 16 and the cover film 110 can rise to the predetermined temperature T2 in a short time. Therefore, the cycle time remains constant, and the thermoforming tool 16 can be easily peeled off from the cover film 110.

[0098] In addition, the packaging apparatus 10 of the embodiment uses a thermoforming tool 16 to hold the semiconductor chip 100, temporarily presses the semiconductor chip 100 onto the bonding material 108 on the substrate 104, and then places a cover film 110 between the temporarily pressed semiconductor chip 100 and the thermoforming tool 16, heats and presses the semiconductor chip 100 to encapsulate the semiconductor chip 100 onto the substrate 104. Therefore, it is not necessary to open a vent hole in the cover film 110 as in the prior art packaging apparatus described in Patent Document 1, and the cycle time can be further shortened compared to the prior art packaging apparatus.

[0099] Furthermore, in the packaging apparatus 10, after packaging the semiconductor chip 100, the thermoforming tool 16 can be heated without raising the packaging head 17. Similarly, as explained above, the adhesion force f can be reduced by the thermal expansion of the cover film 110, allowing the thermoforming tool 16 to easily peel off from the cover film 110. However, the predetermined temperature T2 can be set slightly lower than in the previous example, for example, around 100°C to 150°C, to suppress thermal degradation of the packaged semiconductor chip 100 or the hardened adhesive material 108.

[0100] In the above description, it was assumed that the packaging device 10 packages the semiconductor chip 100 onto the substrate 104, but it is not limited to this. The semiconductor chip 100 may also be packaged onto other semiconductor chips 100. In this case, the other semiconductor chips 100 and the substrate 104 also constitute the packaged body.

Claims

1. A packaging apparatus for encapsulating a semiconductor chip in a packaged body via an adhesive material, characterized in that... include: The packaging head holds the semiconductor chip and moves it in a direction relative to the packaged body, and is equipped with a thermoforming tool for pressing the semiconductor chip onto the packaged body, and a tool heating and cooling mechanism for heating and cooling the thermoforming tool. A membrane placement mechanism moves a cover film to position it between the semiconductor chip pressed against the encapsulated body and the thermoforming tool; and The control unit controls the movement of the encapsulation head and the film placement mechanism, and controls the temperature of the heat-pressing tool via the tool heating and cooling mechanism. The control unit has: The packaging equipment, with the cover film between the semiconductor chip and the thermoforming tool, presses the semiconductor chip onto the packaged body, and heats the thermoforming tool to a first temperature and then cools it to encapsulate the semiconductor chip in the packaged body; as well as The peeling device, after encapsulating the semiconductor chip, heats the thermoforming tool to a predetermined temperature lower than the first temperature, causing the encapsulation head to rise and peel off from the cover film.

2. The packaging device according to claim 1, characterized in that... After the stripping device encapsulates the semiconductor chip into the encapsulated body, with the encapsulation head slightly raised, the hot pressing tool is heated to the predetermined temperature by the tool heating and cooling mechanism, and then the encapsulation head is raised.

3. The packaging device according to claim 1 or 2, characterized in that... The thermoforming tool adsorbs and holds the semiconductor chip. The packaging equipment uses the thermoforming tool to hold the semiconductor chip, lowers the packaging head, and temporarily presses the semiconductor chip onto the packaged object via the adhesive material. The cover film is placed between the semiconductor chip and the thermoforming tool, and the semiconductor chip, which has been temporarily pressed, is pressed to encapsulate the semiconductor chip in the encapsulated body.

4. A packaging method for encapsulating a semiconductor chip in a packaged body via an adhesive material, characterized in that... Include: Preparation steps: Prepare the packaging device, which includes a packaging head, a tool heating and cooling mechanism, and a film placement mechanism. The packaging head holds the semiconductor chip and moves in a direction relative to the packaged object, approaching or moving away from it. A thermoforming tool is installed at the top to press the semiconductor chip onto the packaged object. The tool heating and cooling mechanism is installed on the packaging head to heat and cool the thermoforming tool. The film placement mechanism places a cover film between the semiconductor chip and the thermoforming tool. In the membrane configuration step, when the semiconductor chip is encapsulated in the encapsulated body, the membrane configuration mechanism places the cover film between the semiconductor chip and the thermoforming tool. In the encapsulation step, with the cover film between the semiconductor chip and the thermoforming tool, the semiconductor chip is pressed onto the encapsulated body, and the thermoforming tool is heated to a first temperature and then cooled to encapsulate the semiconductor chip in the encapsulated body. as well as In the peeling step, after the encapsulation step, the thermoforming tool is heated to a predetermined temperature lower than the first temperature, causing the encapsulation head to rise and peel off from the cover film.

Images