Identification of buffer components in personal audio devices

Abstract

This disclosure relates to a personal audio device (e.g., headphones, earbuds) that may have an earpiece (e.g., an ear cup or earbud) having a removable cushioning member (e.g., a headphone cushioning pad or the earpiece end of an earbud). The cushioning member may include an identification tag encoding identification data of the cushioning member. When the cushioning member is attached to the earpiece, the identification tag is brought into proximity to a tag sensor in the earpiece, and the earpiece can read the identification tag to determine the identification data of the cushioning member. The identification data can be used to modify the behavior of the earpiece and / or a host device communicatively coupled to the earpiece.

Description

[0001] Cross-reference to related applications

[0002] This application claims priority to the following applications: U.S. Application No. 62 / 902,239, filed September 18, 2019; U.S. Application No. 62 / 906,624, filed September 26, 2019; U.S. Application No. 62 / 925,952, filed October 25, 2019; and U.S. Application No. 17 / 023,237, filed September 16, 2020. The disclosures of these applications are incorporated herein by reference in their entirety. Background Technology

[0003] This disclosure relates generally to personal audio devices such as earbuds and headphones, and more particularly to the identification of removable buffering components such as headphone ends and cushioning pads by a personal audio device, which can support adaptive behavior based on the presence of a particular buffering component.

[0004] A "personal audio device" is a device that generates sound to be heard by an individual user while limiting the audibility of that sound in the user's surrounding environment. Examples of personal audio devices include headphones and earbuds. Headphones typically include one or two earpieces (also called "earcups") designed to be worn above or on the ears to generate audio. The earcups are usually connected to a headband, which helps hold the earcups in place and also provides electrical connection between the earcups. The earcups are designed to be worn in such a way that the audio-generating speakers housed in each earcup direct sound to the wearer's ears. Cushioning pads made of compliant material are typically placed around the periphery of the earcups to provide spacing between the speakers and the user's ears and to provide user comfort when wearing headphones. The cushioning pads also provide sound insulation, preventing sound generated by the earcups from leaking into the environment and / or preventing external sounds from reaching the user's ears. Earbuds typically include one or two earpieces (also called “earbuds”) that generate audio, and these earpieces are designed to insert into the user’s ear (into the ear canal or against the concha) such that the audio-generating speakers housed within the earpieces (or earbuds) are oriented towards the ear canal. Earbud tips (sometimes referred to herein as “ends”) made of a soft material may be provided to cover at least a portion of the earbud against the user’s skin. Similar to the cushioning pads of an ear cup, the earbud tips can increase user comfort and provide at least a degree of noise isolation. Summary of the Invention

[0005] This document discloses various embodiments of one or more inventions relating to personal audio devices (e.g., headphones, earbuds) having an earpiece (e.g., an ear cup or earbud) with a removable cushioning member (e.g., a headphone cushioning pad or an earbud end). The cushioning member may include an identification tag encoding identification data indicating one or more characteristics or features of the cushioning member (e.g., size, material, color, manufacturer, etc.). When the cushioning member is attached to the earpiece, the earpiece can read the identification data from the identification tag. For example, the earpiece may include a tag sensor and identification (ID) logic circuitry, wherein the tag sensor generates a signal in response to electrical, magnetic, electromagnetic, optical, geometric, or mechanical characteristics of the identification tag, and the identification (ID) logic circuitry decodes the signal from the tag sensor to extract the identification data. In some embodiments, based on the identification data, a controller of the personal audio device may modify the behavior of the earpiece. In some implementations, the earpiece can transmit identification data to a host device (e.g., a telephone, computer, media player, gaming device, or other device that can provide audio output to the personal audio device) that is communicatively coupled to the personal audio device, and the host device can modify its behavior and / or the earpiece's behavior based on the identification data.

[0006] According to some embodiments, a buffer member for an earpiece of a personal audio device may include: a body having a first surface and a second surface, wherein the first surface is positioned to contact a user's ear region, and at least the first surface is made of a compliant material; an attachment structure disposed on the second surface and configured to attach the buffer member to the earpiece of the personal audio device; and an identification tag disposed on or near the second surface such that when the buffer member is attached to the earpiece, the identification tag approaches a tag sensor disposed in the earpiece. The identification tag may encode identification data of the buffer member. The body may be shaped, for example, as an ear cushion for headphones or an earpiece end for in-ear headphones.

[0007] Identification tags can be implemented using a variety of different structures and technologies. For example, in some embodiments, an identification tag may include any or all of the following: an arrangement of one or more magnets encoding identification data; a magnetic shunt having a shape for encoding identification data; an induction coil tuned to a resonant frequency, wherein the resonant frequency maps to the identification data; a surface optically encoded with the identification data; a passive near-field communication (NFC) or radio frequency identification (RFID) tag encoded with the identification data; a pattern of metallic and / or non-metallic regions, wherein metal may or may not be present in each region to encode the identification data; a feature affecting the acoustic properties of the cushioning member; one or more electrical contacts coupled to identification circuit elements (e.g., resistors or coupled to or uncoupled to ground). In some embodiments, the identification tag is disposed within or on an attachment structure of the cushioning member.

[0008] According to some embodiments, an earpiece for a personal audio device may include: a housing having a proximal surface; a speaker disposed within the housing; an attachment structure disposed on the proximal surface and configured to attach to a buffer member; a tag sensor disposed at or near the proximal surface and configured to generate a signal in response to an identification tag on the buffer member; identification logic coupled to the tag sensor and configured to determine identification data of the buffer member based on the signal from the tag sensor; and a controller coupled to the identification logic and configured to modify device behavior of the earpiece in response to the identification data. In some embodiments, the earpiece may further include a communication interface configured to transmit identification data to a host device. The housing may be shaped as, for example, an ear cup or an earbud. In some embodiments, the tag sensor may be disposed within or on the attachment structure.

[0009] Tag sensors can be implemented using many different sensors and techniques. For example, in some embodiments, a tag sensor may include a magnetic sensor configured to determine the magnetic orientation of each of one or more magnets in the identification tag. In some embodiments, the attachment structure may include one or more magnets, and the tag sensor may include a magnetic sensor (e.g., a Hall sensor) configured to determine the geometry of a shunt element attached to one or more magnets, wherein the geometry of the shunt element can encode identification information and thus be used as an identification tag. In some embodiments, a tag sensor may include a tuner circuit, and an ID logic component may be configured to operate the tuner circuit to determine the resonant frequency of a resonant circuit for identifying the tag. In some embodiments, a tag sensor may include a light source and a photodetector configured to read the optically encoded surface of the identification tag. In some embodiments, a tag sensor may include an active near-field reader circuit configured to read the passive near-field tag of the identification tag. In some embodiments, a tag sensor may include one or more electrical contacts coupled to a circuit that can measure electrical parameters (e.g., resistance and / or ground state versus ungrounded state) associated with the corresponding contact of the identification tag. In some embodiments, the tag sensor may include an array of resonant coils, and the identification logic unit is configured to detect the effect of the identified tag on each of the resonant coils. In some embodiments, the tag sensor may include NFC or RFID reader circuitry configured to read an identified tag implemented as an NFC or RFID tag circuit. In some embodiments, the tag sensor may include a microphone, and the identification logic unit may be configured to drive a speaker to generate sound and analyze the acoustic response from the microphone, wherein the acoustic response is affected by the identified tag.

[0010] According to some embodiments, a buffer member for an earpiece of a personal audio device may include: a body having a first surface and a second surface, wherein the first surface is positioned to contact a user's ear region, and at least the first surface is made of a compliant material; and a first magnetic attachment structure disposed on the second surface and configured to attach the buffer member to the earpiece of the personal audio device. The geometric characteristics (e.g., shape and / or size) of the first magnetic attachment structure may encode identification data for the buffer member. For example, the first magnetic attachment structure may include a metal plate that shunts a magnetic field, and the geometric characteristics include the size of the first magnetic attachment structure and / or the presence or absence of gaps or cracks in the first magnetic attachment structure. In some embodiments, a plurality of magnetic attachment structures, including the first magnetic attachment structure, may be disposed on the second surface of the buffer member, and the corresponding geometry of each of the plurality of magnetic attachment structures may encode at least one bit of identification data. These magnetic attachment structures may be positioned as needed. For example, the body of the buffer member may have corner regions, wherein one of the magnetic attachment structures is positioned in each of these corner regions.

[0011] According to some embodiments, a handset for a personal audio device may include: a housing having a proximal surface; a speaker disposed in the housing; a first magnetic attachment structure disposed on the proximal surface and configured to be attached to a buffer member; a first tag sensor disposed at or near the proximal surface and configured to generate a signal in response to magnetic flux affected by the attachment to the buffer member; identification logic coupled to the first tag sensor and configured to determine identification data of the buffer member based at least in part on the signal from the first tag sensor; and a controller coupled to the identification logic and configured to receive identification data from the identification logic. In some embodiments, the first magnetic attachment structure may include a magnet array configured to form a magnetic flux loop when a magnetic shunt element of the buffer member approaches the magnet array. The magnet array may be configured such that, depending on the geometry of the magnetic shunt element, the magnetic flux loop is directed through or away from the first tag sensor. For example, the first tag sensor may include a Hall effect sensor placed adjacent to the magnet array and / or a Hall effect sensor placed between two magnets in the magnet array. In some embodiments, multiple magnetic attachment structures, including the first magnetic attachment structure, may be disposed on a proximal surface, and each of the magnetic attachment structures may have an associated tag sensor; each of these tag sensors may provide at least one bit of identification data to the identification logic unit.

[0012] According to some embodiments, an earpiece system for a personal audio device may include a buffer member and an earpiece. The buffer member may have: a body having a first surface and a second surface, wherein the first surface is positioned to contact a user's ear region, and at least the first surface is made of a compliant material; and a first buffer-side magnetic attachment structure disposed on the second surface and configured to attach the buffer member to the earpiece of the personal audio device, wherein the geometry (e.g., size and / or shape) of the first buffer-side magnetic attachment structure encodes identification data of the buffer member. The earpiece may include: a housing having a proximal surface; a speaker disposed within the housing; a first earpiece-side magnetic attachment structure disposed on the proximal surface and configured to attach to a first buffer pad-side magnetic attachment structure; a first tag sensor disposed at or near the proximal surface and configured to generate a signal in response to magnetic flux affected by the attached buffer member; an identification logic component coupled to the first tag sensor and configured to determine identification data of the buffer member based at least in part on the signal from the first tag sensor; and a controller coupled to the identification logic component and configured to receive identification data from the identification logic component. In some embodiments, the first buffer pad-side magnetic attachment structure includes a metal plate that shunts a magnetic field. In some embodiments, geometric characteristics include the dimensions of the first buffer pad-side magnetic attachment structure and / or the presence or absence of gaps or cracks in the first buffer pad-side magnetic attachment structure. In some embodiments, the first earpiece-side magnetic attachment structure may include a magnet array configured to form a magnetic flux loop when the first buffer pad-side magnetic attachment structure of the buffer member approaches the magnet array, and the first tag sensor may include a Hall effect sensor placed adjacent to one or more magnets in the magnet array. The geometry of the buffer pad-side magnetic attachment structure can shape the magnetic flux loop to shunt magnetic flux toward or away from the tag sensor. In some embodiments, a plurality of buffer pad-side magnetic attachment structures, including the first buffer pad-side magnetic attachment structure, may be disposed on a second surface of the buffer member, and the corresponding geometry of each of the plurality of buffer pad-side magnetic attachment structures can encode at least one bit of identification data; similarly, a plurality of earpiece-side magnetic attachment structures, including the first earpiece-side magnetic attachment structure, may be disposed on a proximal surface, and each of the plurality of earpiece-side magnetic attachment structures may have an associated tag sensor, wherein each tag sensor can provide at least one bit of identification data to the identification logic unit.

[0013] Given a specific encoding structure, various types of identification data can be encoded in identification tags within the buffer component and read by a tag sensor and identification logic unit in the earpiece. For example, the identification data may indicate one or more of the following: the size of the buffer component; the color of the buffer component; the device category of the buffer component; the manufacturer of the buffer component; the model identifier of the buffer component; the unique identifier of the buffer component; and / or the active capabilities supported by the buffer component. In some embodiments, the identification data may be a parameter value that can be mapped to a tag of one or more attributes of the buffer component (e.g., size, color, device category, manufacturer, model, unique identifier, etc.).

[0014] According to some embodiments, a method for identifying a buffer component for a personal audio device may include: detecting the presence of the buffer component via the earpiece of the personal audio device; operating a reader circuitry system via the earpiece of the personal audio device to read identification data from an identification tag located on the buffer component; and modifying device behavior based at least in part on the identification data. In some embodiments, the earpiece of the personal device may modify its own behavior in response to the identification data. Additionally or alternatively, the earpiece of the personal device may transmit the identification data to a host device with which the personal audio device interacts, and the host device may modify its own behavior and / or the behavior of the personal audio device in response to the identification data.

[0015] Various types of behavioral modifications can be implemented in response to identification data. For example, modifying device behavior may include modifying audio characteristics, which include any or all of the following: modifying the equalizer settings of the personal audio device; modifying the active noise cancellation profile of the personal audio device; applying a sound filtering algorithm to the personal audio device; modifying the volume limit of the personal audio device; and / or applying stored user preferences associated with the identification data. In some embodiments where the personal audio device interacts with a host device, the host device may modify the image of the personal audio device in the host device's graphical user interface based at least in part on the identification data. In some embodiments where the identification data includes data indicating whether a buffer supports advanced capabilities, modifying device behavior includes enabling or disabling advanced capabilities based on the identification data. In some embodiments where the identification data includes data indicating the size of a buffer, modifying device behavior includes using the size of the buffer during buffer adaptation.

[0016] The following detailed description, together with the accompanying drawings, will provide a better understanding of the spirit and advantages of the invention protected by the claims. Attached Figure Description

[0017] Figure 1 A first example of a personal audio device according to some implementation schemes is shown.

[0018] Figure 2 A second example of a personal audio device according to some implementation schemes is shown.

[0019] Figure 3 A simplified block diagram of a handset system according to some implementation schemes is shown.

[0020] Figures 4A to 4C A simplified cross-sectional view of the earpiece and headphone end according to some embodiments is shown.

[0021] Figure 5 A simplified cross-sectional view through the earpiece and cushioning pad is shown according to some embodiments.

[0022] Figure 6A and Figure 6B A simplified cross-sectional view through the earpiece and cushioning pad is shown according to some embodiments.

[0023] Figure 7A A partial exploded view of a handset system according to some embodiments is shown.

[0024] Figure 7B A partial transparent view of a portion of a handset according to some embodiments is shown.

[0025] Figure 8A and Figure 8B This is a simplified perspective view illustrating an example of magnetic cushioning pad identification according to some implementation schemes.

[0026] Figure 9A and Figure 9B This is a simplified perspective view illustrating another example of magnetic cushioning pad identification according to some implementation schemes.

[0027] Figure 10 A simplified cross-sectional view of an ear cup and a cushioning pad that incorporate magnetic cushioning pad identification, according to some embodiments, is shown.

[0028] Figure 11 A simplified view of an ear cup and cushioning pad incorporating NFC circuitry, according to some implementation schemes, is shown.

[0029] Figure 12A and Figure 12B A simplified cross-sectional view of the earbud and headphone end incorporating NFC circuitry according to various embodiments is shown.

[0030] Figure 13A A simplified view of an ear cup incorporating a sensor coil array according to some embodiments is shown, and Figure 13BA more detailed view of the layout of the sensor coil array is shown.

[0031] Figure 13C A schematic circuit diagram of a sensor coil array and ID logic circuit according to some embodiments is shown.

[0032] Figure 14 A simplified view of a cushioning pad incorporating a tag element readable using a sensor coil array, according to some embodiments, is shown.

[0033] Figure 15 A more detailed view of the tag elements stacked on top of a sensor coil array according to some embodiments is shown.

[0034] Figure 16 A simplified view of an ear cup and cushioning pad that combine resonant circuit-based identification is shown according to some embodiments.

[0035] Figure 17A and Figure 17B Examples of resonant circuits and reader circuits that can be used according to some implementation schemes are shown.

[0036] Figure 18A and Figure 18B An arrangement of optical sensors for use in an ear cup according to some implementation schemes is shown.

[0037] Figure 19A and Figure 19B Examples of optical encoding of identification data in a cushioning pad according to various implementation schemes are shown.

[0038] Figure 20 Examples of earbuds and headphone ends according to some implementation schemes are shown.

[0039] Figure 21 A flowchart of a process for acoustic recognition according to some implementation schemes is shown.

[0040] Figure 22 A simplified view of the ear cup and cushioning pad based on resistance identification data is shown according to some implementation schemes.

[0041] Figure 23 A simplified view of the ear cup and cushioning pad based on contact recognition data is shown according to some implementation schemes.

[0042] Figure 24 A flowchart is shown of a buffer pad identification process that can be performed in a handset system according to some implementation schemes.

[0043] Figure 25 A table is shown as an example of a feature that maps ID values ​​to buffer components according to some implementation schemes.

[0044] Figure 26 A flowchart of an adaptation process for an earphone end is shown according to some implementation schemes. Detailed Implementation

[0045] This document discloses various embodiments of one or more inventions relating to personal audio devices (e.g., headphones, earbuds) having an earpiece (e.g., an ear cup or earbud) with a removable cushioning member (e.g., a headphone cushioning pad or an earbud end). The cushioning member may include an identification tag encoding identification data indicating one or more characteristics or features of the cushioning member (e.g., size, material, color, manufacturer, etc.). When the cushioning member is attached to the earpiece, the earpiece can read the identification data from the identification tag. For example, the earpiece may include a tag sensor and identification (ID) logic circuitry, wherein the tag sensor generates a signal in response to electrical, magnetic, electromagnetic, optical, geometric, or mechanical characteristics of the identification tag, and the identification (ID) logic circuitry decodes the signal from the tag sensor to extract the identification data. In some embodiments, based on the identification data, a controller of the personal audio device may modify the behavior of the earpiece. In some implementations, the earpiece can transmit identification data to a host device (e.g., a telephone, computer, media player, gaming device, or other device that can provide audio output to the personal audio device) that is communicatively coupled to the personal audio device, and the host device can modify its behavior and / or the earpiece's behavior based on the identification data.

[0046] In various implementations, the identification tag within the buffer member can be a "passive" tag that requires no power to be read by the earpiece. For example, the identification tag can be implemented using a piece of magnetic material or a magnetic shunt, the presence and / or geometry of which can be detected using a magnetic sensor (e.g., a Hall effect sensor) located within the earpiece. Alternatively, the identification tag can be implemented using an optical pattern (e.g., alternating high-reflectivity and low-reflectivity regions) that can be scanned using a tag sensor comprising a light source and a photodetector located within the earpiece. Furthermore, the identification tag can be implemented as a passive NFC or RFID tag, and the tag sensor within the earpiece can include a compatible NFC or RFID reader. Still further, the identification tag can be implemented as an induction coil or other circuitry with a specific resonant frequency, and the tag sensor within the earpiece can include a tuner operable to determine the resonant frequency of the coil. Moreover, identification data can be encoded in the acoustic characteristics of a particular buffer member, and the tag sensor can measure the acoustic characteristics or other characteristics associated with the acoustic characteristics, such as the load impedance of an amplifier. The foregoing is an example of a "contactless" identification technology that does not require a conductive connection between the handset and the buffer component. In other embodiments, passive identification tags can be implemented using one or more electrical contacts. For example, the identification tag may include a set of contacts, each of which may or may not be connected to a ground contact, and the reader circuitry in the handset can connect to these contacts and read identification data by detecting the connection pattern of the contacts in the identification tag. Alternatively, the identification tag can be implemented using a resistor with a specific resistance value coupled between two electrical contacts, and the reader circuitry in the handset can read the identification data by measuring the resistance value. In other embodiments, the identification tag can be active, and the tag can draw sufficient power from the handset to transmit identification data to the reader circuitry via a wired or wireless communication channel.

[0047] In various implementations, the identification data obtained from the identification tag may include or represent any information that distinguishes one buffer component from another. For example, the identification data may represent any or all of the following: manufacturer identifier; model identifier; size identifier; color identifier; device category identifier (e.g., indicating the presence or absence of various capabilities or features); unique serial number; and / or other information as needed. In some implementations, the identification tag may encode a numerical value that can be mapped by an ID logic component in the handset (or in the connected host device) to a specific set of characteristics of the buffer component.

[0048] In various implementations, the handset and / or host device can modify different aspects of its behavior based on identification data. For example, equalizer settings can be selected or modified based on identification data. Hearing protection settings can be modified, including, for example, limiting the handset's speaker volume, modifying the handset's active noise cancellation profile, and so on. User interface behavior can also be modified. For example, if the host device has a display showing an image of the personal audio device, the displayed image can be modified to match the currently attached buffer.

[0049] In various implementations, the earpiece and / or main unit can combine monitoring the condition of the buffer components to use identification data. For example, the main unit can track the service life or total lifespan of a specific buffer component and recommend replacement at appropriate intervals.

[0050] In various implementations, the earpiece and / or host device can use identification data to assist in determining the size of the buffer component. For example, the earphone end that fits into a user's ear can have several sizes to accommodate variations in human ear size. During the fitting of the earphone end, an audio leakage test can be performed to evaluate the fit of a particular end. Based on the results of the leakage test and the identification data indicating the size of the end tested, the earpiece (or host device) can suggest a specific end size to try next.

[0051] In various implementations, the earpiece and / or host device can use identification data to activate or deactivate advanced capabilities that may be supported by certain cushioning components. For example, it is conceivable that an advanced cushioning pad or earpiece end (or other cushioning component) may include one or more biometric monitoring devices, such as a pulse sensor, temperature sensor, or humidity (e.g., perspiration) sensor, which can provide sensor data to the earpiece, which can then transmit the sensor data to the host device or use the data internally (e.g., to generate an audible indication associated with the sensor data). Based on whether the identification data indicates that the cushioning component supports a specific monitoring capability, the earpiece can automatically enable or disable its receiver for monitoring data.

[0052] 1. Personal audio device with removable buffer components

[0053] Figure 1A first example of a personal audio device in the form of a headset 100 according to some embodiments is shown. The headset 100 includes a pair of earpieces 102 and a strap 104 mechanically connecting the earpieces 102. In some embodiments, the strap 104 may also provide an electrical connection between the earpieces 102. The earpieces 102 (also referred to as ear cups) may be made of rigid materials such as rigid plastics and / or metals. The earpieces 102 may be designed and shaped to fit over or around the auricle of a user's ear, thereby covering the concha. The earpieces 102 may incorporate one or more speakers for generating sound directed towards the user's ear, control electronics for operating the speakers, a signal interface for receiving audio signals in digital or analog format, one or more user input controls (e.g., one or more touch-sensitive areas on the surface of one or both earpieces 102), and other components that may have a generally conventional design.

[0054] To provide user comfort, the cushioning pad 106 can be detachably attached to the earpiece 102. For example, the cushioning pad 106 may have one or more protruding attachment structures (e.g., on the side facing the earpiece 102) that snap into complementary slots, openings, clips, or other attachment structures in the earpiece 102, or the earpiece 102 may have one or more protruding attachment structures that snap into complementary slots, openings, or other attachment structures in the cushioning pad 106. In some embodiments, in addition to or instead of mechanical attachment structures, magnetic attachment structures may be provided. For example, the earpiece 102 may have magnets disposed at various locations on the interface surface facing the cushioning pad 106. Such magnets may be disposed, for example, near the periphery of the earpiece 102. The cushioning pad 106 may include metal shunts, magnets, etc., at corresponding locations on the interface surface; any structure that uses magnets attracted into the earpiece 102 can be used. These examples are illustrative, and a particular attachment structure or combination of attachment structures is not essential to understanding this disclosure.

[0055] The cushioning pad 106 can be formed as a core of foam or other compressible material surrounded by a compliant structural layer that helps define the shape of the periphery of the cushioning pad 106 without imparting rigidity. If desired, for example, for user comfort, durability, and / or aesthetics, one or more additional textile layers can be applied. In some embodiments, the cushioning pad 106 can incorporate rigid structural elements in areas that do not come into contact with the user's skin during use. For example, the cushioning pad 106 can include a rigid frame that may be made of plastic or the like, and the rigid frame can facilitate the attachment and replacement of the cushioning pad 106. For example, the frame can incorporate mechanical attachment structures and / or magnetic attachment structures.

[0056] For the purposes of this disclosure, it is assumed that multiple types of cushioning pads 106 exist that are compatible with the same headset 102. In various embodiments, different types of cushioning pads 106 may differ from each other in size, color, material, audio performance (e.g., the effectiveness of a particular cushioning pad in blocking ambient sound), and / or other characteristics. It is also assumed that the different types of cushioning pads 106 are user-interchangeable; that is, a user may attach different types of cushioning pads 106 to the same earpiece 102 at different times. To facilitate identification of which cushioning pads 106 are currently attached to the earpiece 102, each cushioning pad 106 may include an identification tag 108 that encodes identification data indicating the type of cushioning pad. The identification tag 108 can be read by the earpiece 102, thereby allowing the behavior of the headset 100 to automatically adapt based on the specific type of cushioning pad 106 attached at any given time. Specific examples are described below.

[0057] In some embodiments, the headset 100 may operate as an accessory to the host device 120. The host device 120 may be, for example, a smartphone, tablet computer, laptop computer, desktop computer, wearable device (e.g., smartwatch), game console or portable gaming device, or any other electronic device that provides audio output. The headset 100 may be connected to the host device 120 via a wired or wireless communication channel that supports the transmission of audio data (in digital and / or analog formats) from the host device to a personal audio device. In some embodiments, the communication channel may be bidirectional, allowing the headset 100 to transmit information to the host device 120. For example, the headset 100 may transmit pad identification data read from an identification tag 108 to the host device 120, and the host device 120 may modify its behavior based on the pad identification data received from the headset 100. Specific examples are described below. It should be understood that information other than audio signals and pad identification data may also be transmitted between the headset 100 and the host device 120. For example, the headset 100 may provide a user input interface including, for example, tactile controls (buttons, touch-sensitive surfaces, etc.) and / or a microphone for voice input, and the headset 100 may transmit user input to the host device 120. This interaction is irrelevant to understanding this disclosure.

[0058] Figure 2A second example of a personal audio device in the form of an earphone 200 according to some embodiments is shown. The earphone 200 includes a pair of earpieces 202. The earpieces 202 (also referred to as earbuds) may be made of rigid materials such as plastic and / or metal, and may incorporate one or more speakers to produce sound, control electronics to operate the speakers, one or more user input controls (e.g., one or more touch-sensitive areas on the surface of one or both earpieces 202), and so on. In this example, each earpiece 202 has an end portion 204 designed to be disposed within an external portion of the user's ear canal, and in some embodiments, the speaker may be located in or adjacent to the end portion 204.

[0059] To provide user comfort, the earphone tip (also referred to herein as the "tip") 206 may be detachably attached to the end portion 204. For example, the tip 206 may include a base portion that can slide over and fit snugly with the end portion 204. Figure 1 Like the ear cup 102 and the cushioning pad 106, various mechanical attachment structures and / or magnetic attachment structures can be used, and the specific attachment mechanism is not critical to understanding this disclosure.

[0060] In some embodiments, the earphone end 206 may be formed of silicone rubber or other compressible elastic material. The body of the earphone end 206 may be shaped to approximate the dimensions of the ear canal or other part of the ear, and the body may include an attachment portion compatible with the shape factor of the end portion 204, such that the earphone end 206 can be attached to (and removed from) the earbud 202 at the end portion 204. The body of the earphone end 206 may also include compliant external rounded protrusions or cups extending outward from the attachment portion, thereby providing a flexible surface for contact with the user's ear canal.

[0061] For the purposes of this disclosure, it is assumed that multiple types of headphone ends 206 are compatible with the same earpiece 202. In various embodiments, different types of headphone ends 206 may differ from each other in size, color, material, audio performance (e.g., the effectiveness of a particular headphone end in blocking external sounds), and / or other characteristics. It is also assumed that different types of headphone ends 206 are user-interchangeable; that is, a user can attach different types of headphone ends 206 to the same earpiece 202 at different times. To facilitate identification of which headphone ends 206 are currently attached to the earpiece 202, each headphone end 206 may include an identification tag 208 that encodes information data indicating the type of headphone end. The identification tag 208 can be read by the earpiece 202, thereby allowing the behavior of the earphone 200 to automatically adapt based on the specific type of headphone end 206 attached at any given time. Specific examples are described below.

[0062] Similar to the headset 100, the earbud assembly 200 can operate as an accessory to the host device 220. The host device 220 can be, for example, a smartphone, tablet computer, laptop computer, desktop computer, wearable device (e.g., smartwatch), game console or portable gaming device, or any other electronic device that provides audio output. The earbuds 202 can be connected to the host device 220 via a wired or wireless communication channel that supports the transmission of audio data (in digital and / or analog formats) from the host device to a personal audio device. In some embodiments, the communication channel can be bidirectional, allowing the earbuds 202 to transmit information to the host device 220. For example, the earbuds 202 can transmit end-user identification data read from the identification tag 208 to the host device 220, and the host device 220 can modify its behavior based on the end-user identification data received from the earbuds 202. Specific examples are described below. It should be understood that information other than audio signals and end-user identification data can also be transmitted between the earbuds 202 and the host device 220. For example, earbud 202 may provide a user input interface including, for example, tactile controls (buttons, touch-sensitive surfaces, etc.) and / or a microphone for voice input, and earbud 200 may transmit user input to host device 120. This interaction is irrelevant to understanding this disclosure.

[0063] It should be understood that the headphones 100 and earbud assembly 200 are examples of personal audio devices having earpieces and buffer members suitable for embodiments of the invention protected by the claims. The identification tag described herein can be incorporated into any buffer pad, earphone end, or other replaceable user contact part (referred to as the “buffer member”) of the personal audio device and can be read by any compatible earpiece to which the buffer member is attached. The earpiece and compatible buffer member can have a variety of form factors and attachment structures.

[0064] In some implementations, buffer component identification data can be used locally within a personal audio device to modify one or more of its behaviors. Additionally or alternatively, the personal audio device can transmit buffer component identification data to a host device communicatively coupled to the personal audio device, and the host device can modify one or more of its behaviors in response to the buffer component identification data.

[0065] 2. Identification of buffer components

[0066] According to various embodiments, identification of the cushioning component can be based on an identification tag disposed in or on the cushioning component, which can be read using a reader circuitry system (or tag sensor) in the earpiece. Examples will now be described. In the following description, reference is made to the ear cup and cushioning pad (e.g., Figure 1 The following examples are described using the ear cup 102 and cushioning pad 106 of the over-ear headphones 100 as examples, and reference is made to the ear tips and headphone ends (e.g., Figure 2 Examples are described using the earbud 202 and the headphone end 206. It should be understood that the examples described with reference to the ear cup and the cushioning pad can be applied to the earbud and the headphone end, and vice versa.

[0067] 2.1. Handpiece system with ID tag and tag sensor

[0068] Figure 3 This is a simplified block diagram of a handset system 300 according to some embodiments. The handset system 300 includes a handset 302 and a removable buffer member 306. The handset 302 (which may be, for example...) Figure 1 Ear cup 102 or Figure 2 The earpiece 202 may include a controller 310, a speaker 312, a tag sensor 314, and a communication interface 316. The controller 310 may be implemented, for example, using one or more microprocessors, microcontrollers, field-programmable gate arrays (FPGAs), or other logic circuitry of a generally conventional design. In some embodiments, the controller 310 may be entirely housed within the earpiece 302 (e.g., in...). Figure 1 Ear cup 102 or Figure 2 (Earplugs 202).

[0069] Removable buffer member 306 (which may be, for example) Figure 1 106 or the cushioning pad Figure 2 The earpiece end 206 may include an identification (ID) tag 308. The ID tag 308 may include any storage medium or structure capable of encoding identification data of the cushioning member in a physical form that can affect the signal generated by the tag sensor 314 of the earpiece 302. The ID tag 308 may be passive or active and may operate with or without electrical connection. Exemplary specific implementations of the ID tag 308 and the corresponding tag sensor 314 are described below.

[0070] The speaker 312 may be a conventionally designed audio speaker located within the earpiece 302 and may include, for example, an amplifier and a transducer to convert electrical signals into motion of a vibrating element (e.g., a diaphragm). The tag sensor 314 may be disposed within the earpiece 302 and configured to generate a signal in response to identification data encoded in an identification tag 308 in the buffer member 306; examples are described below. The communication interface 316 may include hardware and / or firmware components to enable communication with the host device 350 (e.g., ...). Figure 1 The host device 120 or Figure 2Communication with the host device 220. For example, communication interface 316 can implement standard wireless communication protocols, such as Bluetooth, Wi-Fi, etc. Additionally or alternatively, wired communication interfaces or other communication interfaces that support standard or custom communication protocols can be supported.

[0071] The controller 310 may combine multiple logic modules implemented using any suitable combination of hardware and / or software components. For example, the audio input module 322 may receive audio data (in digital or analog format) from an audio source. The audio source may be, for example, an internet connection, a radio receiver, a microphone positioned to detect ambient sounds in the environment, an analog audio input jack, a host device 350 communicating with the handset 302 via the communication interface 316, or any other audio source. The signal processing module 324 may perform signal processing operations on the audio data, including decoding, digital-to-analog conversion, equalization (e.g., selectively adjusting amplitude associated with different frequency bands), volume control (e.g., adjusting analog signal amplitude), generating audio data associated with active noise cancellation operations, mixing audio data from multiple audio sources (e.g., mixing noise-cancelled audio with audio input such as music or speech data), and / or any other type of audio signal processing that may be required. The audio driver 326 may drive the speaker 312 based on the audio signal output from the signal processing module 324. The user input module 328 may support user interaction. For example, user input module 328 can be configured to receive and interpret voice commands from a user and / or detect operations of user controls located on a personal audio device or other location. Based on the received user input, user input module 328 can provide instructions to other modules of controller 310, such as selecting an audio source, controlling volume, or adjusting other settings, or sending instructions or data to a host device via communication interface 316. In some embodiments, controller 310 may also include user output module 330 to provide information or prompts to the user, for example, using auditory indicators, visual indicators, or tactile indicators. Configuration module 332 can store configuration settings (e.g., one or more equalizer profiles, volume limiting, noise cancellation profiles, etc.). In some embodiments, some or all of the configuration settings may be associated with identification data of a specific type of buffer 306 or with characteristics of the buffer 306 that can be determined from the identification data. Therefore, configuration module 332 can modify the behavior of signal processing module 324 and / or other components of controller 310 based on identification data obtained from ID tag 308 of buffer 306. ID logic module 334 can respond to signals received from tag sensor 314 by ID tag 308 and can decode these signals to “read” the identification data encoded in ID tag 308. ID logic module 304 can provide the identification data read from ID tag 308 to configuration module 332, to other modules or components of controller 310, and / or to host device 350 via communication interface 316.

[0072] It should be understood that the handset system 300 is exemplary, and variations and modifications are possible. The handset system may include... Figure 3Other components, such as a microphone or touch sensor, not shown, are used to receive user input. In the presence of a host device, some or all of the signal processing, user input, user output, and configuration operations described above, performed by controller 310, may alternatively be performed by appropriate components of the host device (including one or more appropriately programmed processors). It should also be understood that although a single earpiece system 300 is shown, a personal audio device may include a pair of earpiece systems 300 (e.g., as shown in the diagram). Figure 1 and Figure 2 (As shown). In some embodiments, one instance of the earpiece system 300 may act as a master earpiece that communicates with the host device and forwards signals and / or other information to and from another (secondary) earpiece; in other embodiments, each instance of the earpiece system 300 may communicate directly with the host device, and the earpiece systems may also communicate directly with each other or not directly with each other.

[0073] Furthermore, although the handset system 300 is described with reference to specific blocks, it should be understood that these blocks are defined for descriptive convenience and are not intended to imply a specific physical arrangement of the constituent components. Moreover, the blocks do not necessarily correspond to physically different components. Blocks can be configured to perform various operations, for example, by programming a processor or providing appropriate control circuitry, and individual blocks may be reconfigurable or non-reconfigurable depending on how the initial configuration is obtained. Embodiments of the invention protected by the claims can be implemented in a variety of devices, including electronic devices implemented using different combinations of circuit systems and software.

[0074] According to various embodiments, when the tag sensor 314 is brought close to the ID tag 308, the earpiece 302 can read the ID tag 308. The term "reading" an identification tag is used herein to refer to the process of obtaining signals from the tag sensor 302 in response to physical characteristics of a particular ID tag 308 and interpreting these signals (e.g., using ID logic unit 334) to extract identification data. The extracted identification data may be, for example, numerical values ​​(or bit strings) representing identification information such as cushion size, color, material composition, manufacturer, and / or other characteristics. To enable the earpiece 302 to read the ID tag 308, the ID tag 308 and the tag sensor 314 may be positioned at corresponding locations on or within the cushioning member 306 and the earpiece 302, such that attaching the cushioning member 304 to the earpiece 302 causes the ID tag 308 and the tag sensor 314 to be brought close to the tag sensor 314, thereby causing the signal generated by the tag sensor 314 to be influenced by the specific characteristics of the ID tag 308, which vary depending on the type of cushioning.

[0075] For example, Figure 4A and Figure 4B A simplified cross-sectional view of the earpiece 402 and the earphone end 406 according to some embodiments is shown. The earpiece 402 and the earphone end 406 may correspond to Figure 2 The earbud 202 and the headphone end 206, and can achieve Figure 3 The earpiece system 300. In Figure 4A In the image, the earphone end 406 is shown attached to the earpiece 402, and... Figure 4B In the image, the earphone end 406 is shown as being separated from the earpiece 402.

[0076] The earpiece 402 may have a proximal surface 403 oriented toward the earphone end 406. A central portion of the proximal surface 403 may project forward to form an end portion 404, which may be shaped as a circular or elliptical cylinder extending from the proximal surface 403. (In some embodiments, the end portion 404 may taper along its length; other shapes may also be used.) In some embodiments, the end portion 404 (or other portions of the proximal surface 403) may include mechanically retaining features (not shown) for holding the earphone end 406 in place when attached to the end portion 404; examples include resilient rings or springs, lips, protrusions, or notches. In some embodiments, magnetically retaining features may be provided. In some embodiments, the earphone end 406 may be made of a resilient material, and the resilient nature of the earphone end 406 may hold the earphone end 406 in place above the end portion 404. The end portion 404 may include a tag sensor 414 disposed near a sidewall surface of the end portion 404. Tag sensor 414 may include various electrical, magnetic, electromagnetic, optical, mechanical, acoustic, or other components; examples are described below. Depending on the specific implementation, tag sensor 414 may extend a portion or all of the circumference of end portion 404. Tag sensor 414 may be coupled to ID logic circuitry 434, which does not need to be close to the surface of end portion 404 and can be located anywhere within earpiece 402. ID logic circuitry 434 may be configured to interpret signals from tag sensor 414 and output buffer pad member identification data.

[0077] The earphone end 402 may include a sidewall 416 that defines a central opening 407 complementary to the end portion 404 of the earbud 402. For example, the inner surface of the sidewall 416 may be shaped as a circular or elliptical cylinder. A flexible circular protrusion or cap 420 may extend outward from the front end of the sidewall 416. The flexible circular protrusion 420 may be designed to fit into the user's ear canal and is flexible to conform to the shape of the ear canal. The sidewall 416 may be more rigid than the flexible circular protrusion 420 and may include retaining features (such as an elastic ring or spring, a lip, a protrusion, or a notch), magnetic retaining features, etc., and the retaining features of the sidewall 416 may be complementary to the corresponding retaining features of the end portion 404 of the earphone end 402. In some embodiments, the elasticity and static friction of the sidewall 416 may be used as retaining features.

[0078] The sidewall 416 may include an ID tag 408, which may be embedded within the sidewall 416 or disposed on the inner surface of the sidewall 416. The ID tag 408 may be or include one or more physical features that differ depending on the type of cushioning pad. These physical features may encode identification information specific to a particular type of earphone end 406; examples are described below. Depending on the specific implementation, the ID tag 408 may have a cylindrical or curved shape extending partially or entirely around the circumference of the sidewall 416. This facilitates reading the ID tag 408 when the sidewall 416 is circularly symmetrical or does not have a preferred attachment orientation.

[0079] like Figure 4AAs shown, when the earphone end 406 is attached to the earpiece 402, the tag sensor 414 is sufficiently close to the ID tag 408 of the earphone end 406 to allow the tag sensor 414 to generate a signal in response to the distinguishing physical features of the identification tag 408; in other words, the tag sensor 414 can generate different signals in response to ID tags 408 with different physical features. The arrangement of the identification tag 408 and the tag sensor 414 also depends on the specific implementation. For example, if the earphone end 406 has a preferred rotational orientation, the identification tag 408 can be positioned such that the identification tag is close to the tag sensor 414 when the earphone end 406 is in the preferred rotational orientation. (In such cases, failure to read identification data can trigger a notification to the user that the earphone end 406 may not be correctly oriented.) In embodiments where the earphone end 406 does not have a preferred rotational orientation, the identification tag 408 and the tag sensor 414 can be arranged to allow the tag sensor 414 to read the identification tag 408 regardless of the rotational orientation. For example, identification tag 408 may extend around the circumference of sidewall 416, or multiple copies of identification tag 408 may be arranged around the circumference of sidewall 416, such that one copy is within proximity for tag sensor 414 to read, regardless of rotational orientation. Similarly, tag sensor 414 may extend around the periphery of end portion 404, or multiple copies of tag sensor 414 may be arranged around the periphery of end portion 404, such that one copy is within proximity of ID tag 408, regardless of rotational orientation. Other arrangements providing proximity between ID tag 408 and tag sensor 414 may also be used. For example, such as... Figure 4C As shown, the tag sensor 414 can be disposed at or near the peripheral portion of the proximal surface 403, and the identification tag 408 can be disposed at or near the corresponding position on the rear surface of the sidewall 416.

[0080] In various implementations, proximity-based identification tags can be implemented in buffer components with other shape factors. For example, Figure 5 A simplified cross-sectional view through the earpiece 502 and the cushioning pad 506 is shown according to some embodiments. The earpiece 502 and the cushioning pad 506 may correspond to Figure 1The ear cup 102 and the cushioning pad 106 are included. In this example, the earpiece 502 includes magnets 510 disposed at various locations around the periphery of the earpiece 502 near the interface surface 503. The magnets 510 may be, for example, rare-earth magnets, such as NdFeB magnets, and may be polarized in a desired orientation. A tag sensor 514 may be disposed in the region between the magnets 510, near or on the interface surface 507. The tag sensor 514 may be coupled to an ID logic circuit 534, which does not need to be near the interface surface 503 and may be disposed anywhere within the earpiece 502. The ID logic circuit 534 may be configured to interpret signals from the tag sensor 514 and output cushioning pad component identification data.

[0081] The buffer pad 506 may include an attachment structure 512 aligned with the magnet 510. The attachment structure 512 may be a magnet polarized to be attracted to the magnet 510, or it may be a shunt made of the material attracted to the magnet 510. An ID tag 508 may be disposed in the region between the attachment structures 512, near or on the interface surface 507, positioned such that when the attachment structures 512 become magnetically attached to the magnet 510, the ID tag 508 approaches the tag sensor 514, allowing the tag sensor 514 to read the ID tag 508. In various embodiments, the ID tag 508 and the tag sensor 514 may be at any distance from the attachment structures 512 and the magnet 510. Additionally, in some embodiments, the shape of the attachment structure 512 may be used to represent buffer pad identification data, and a physically distinct ID tag 508 is not required. (An example of encoding identification data in a magnetic attachment structure is described below.)

[0082] In some implementations, mechanical attachment structures can be used to attach the ear cup to the cushioning pad, in addition to or in place of magnetic structures. Figure 6A and Figure 6B A simplified cross-sectional view through the earpiece 602 and the cushioning pad 606 is shown according to some embodiments. The earpiece 602 and the cushioning pad 606 may correspond to Figure 1 The ear cup 102 and the cushioning pad 106. Figure 6A In the image, the buffer pad 606 is shown as separate from the earpiece 602, and... Figure 6BIn the image, a cushioning pad 606 is shown attached to an earpiece 602. The earpiece 602 has a proximal surface 603 oriented toward the cushioning pad 606. The proximal surface 603 may include a recess 605, and a tag sensor 614 may be disposed adjacent to (or on the surface of) the recess 605. The cushioning pad 606 has a protrusion 616 extending outward from a rear surface 617 of the cushioning pad 606. An ID tag 608 may be positioned within or on the surface of the protrusion 616. In some embodiments, the protrusion 616 and / or the recess 605 may include additional mechanical retaining features (not shown) for holding the cushioning pad 606 in place when attached to the earpiece 602.

[0083] like Figure 6B As shown, when the buffer pad 606 is attached to the earpiece 602, the tag sensor 614 approaches the ID tag 608. (This arrangement is consistent with...) Figure 4A and Figure 4B The arrangement shown is complementary because Figure 4A and Figure 4B In this arrangement, the protrusion is on the earpiece and holds the tag sensor, while the recess is in the buffer member and holds the ID tag. It should be understood that a reverse arrangement may also be provided, wherein the recess is formed in the buffer pad 606, and the stud or other protrusion extends from the proximal surface 603 of the earpiece 602 into the recess.

[0084] It should be understood that these examples of the positioning of ID tags and corresponding tag sensors are illustrative, and many variations are possible. The interface surface may be curved or flat as needed. Mechanical or magnetic retaining features for attaching the buffer member to the earpiece may be located at various positions on the earpiece or buffer member, and the ID tag and tag sensor may be located within, adjacent to, or spaced apart from the retaining feature as needed. Depending on the specific identification technology, the ID tag and / or tag sensor may be visible on the interface surface, or they may be covered by a surface material.

[0085] An identification tag (or ID tag) can be or includes any physical structure that encodes identification data. In other words, an ID tag can be or includes any physical structure that can be constructed or formed in multiple ways such that the distinguishable structural form present in each type of buffer component differs from the structural forms present in other types in a way that can be detected by a sensor (i.e., this causes the sensor to generate a distinct signal for each structural form). Sections 2.2 through 2.9 describe examples of physical structures that can be used to encode identification data and corresponding tag sensors and ID logic components that can read the identification data.

[0086] 2.2. Magnetic Identification

[0087] As referenced above Figure 5 The cushioning pad can be magnetically attached to the earpiece. In some embodiments, the magnetic attachment element in the cushioning pad can be used to provide an identification tag. An example will now be described.

[0088] Figure 7A A partially exploded view of a handset system 700 according to some embodiments is shown. The handset system 700 incorporates a handset 702 (e.g., Figure 1 (specific implementation of the ear cup 102) and the cushioning member 706 (e.g., Figure 1 (Specific implementation of the buffer pad 106). The earpiece 702 has a housing 710 and a cover 712 attached to the housing 710. The cover 712 may have a peripheral annular shelf 716 and sidewalls 718 surrounding a central recessed surface 713. The cover 712 may be made of plastic and / or other rigid materials. The buffer member 706 includes an annular buffer pad element 720 and an annular frame 722 attached to the buffer pad 720. The frame 722 may have a peripheral annular shelf 726 and sidewalls 727, the shape and size of which are determined such that the frame 722 can be nested in the cover 712, with the sidewalls 727 of the frame 722 abutting the sidewalls 718 of the cover 712, and the lower side of the annular shelf 726 of the frame 722 abutting the upper surface of the annular shelf 716 of the cover 712.

[0089] When the frame 722 is nested within the cover 712, one or more magnetic attachment structures can be used to detachably couple (e.g., magnetically couple) the cover 712 and the frame 722. For example, when the frame 722 is positioned in the cover 712, a retaining mechanism can prevent the frame 722 from being removed until a certain force threshold has been reached. In various embodiments, the magnetic attachment structures can be or include multiple components that engage with each other to attach the frame 722 to the cover 712. For example, a "shunt" element 708, such as a metal plate, can be positioned in one or more corner regions of the frame 722, and a magnet array 728 can be positioned in each corresponding region of the cover 712. The shunt element 708 can be or include magnets and / or metal plates, which can be made of steel, iron, nickel, cobalt, stainless steel, aluminum, gold, and / or any other material that can be magnetically coupled to the magnet array 728. The magnet array 728 may include one or more magnets, which may be permanent magnets made of ferromagnetic materials such as rare-earth magnets (e.g., NdFeB magnets, etc.). The magnets of the magnet array 728 may have magnetic polarities oriented in a specific direction. For example, the magnets may be arranged in a Helbeck array (e.g., a rotating magnetic orientation), an alternating array (e.g., adjacent magnets have opposite magnetic orientations), and / or a monopole orientation (e.g., all magnets have the same magnetic orientation). The magnet array 728 may generate a magnetic flux that can act on the shunt element 708 to hold the frame 722 in place when nested within the cover 712. In some embodiments, the magnet array 728 may be positioned at each of the four (circular) corner regions of the annular shelf 716. In some embodiments, the magnet array 728 and / or the shunt element 708 can be arranged such that the magnet array 728 applies a sufficiently large force to hold the frame 722 in place only when the buffer pad 706 is inserted in the “correct” orientation. In embodiments where the buffer pad 706 should be attached in a specific orientation, this arrangement helps the user to correctly orient the buffer pad.

[0090] Figure 7B A partial transparent view of a portion of an earpiece system 700 with a frame 722 nested within a cover 712 is shown, illustrating the operation of the attachment mechanism. A shunt element 708 on the annular shelf 726 of the cushioning pad 706 is close to a magnet array 728 on the annular shelf 716 of the earpiece 702. In some embodiments, an additional metal shunt 730 may be positioned on the cover 712 (e.g., between the magnet array 728 and electronic components located within the earpiece housing 710). The metal shunt 730 can prevent or reduce magnetic flux interference from the magnet array 728 to the electronic components housed in the earpiece 702.

[0091] In some implementations, the magnet array 728 and the shunt element 708 can be used to provide identification data for the buffer pad 706. Figure 8A and Figure 8B This is a simplified perspective view illustrating one example of magnetic cushioning pad identification according to some embodiments. The identification system 800 includes a magnet array 728 (such as...) disposed on a portion of the annular shelf 716 of the cover 712. Figure 7A (As shown). Tag sensor 834 is disposed on the annular shelf 716 adjacent to magnet array 728. Tag sensor 834 may be, for example, a Hall effect sensor or other sensor capable of detecting magnetic flux from magnet array 728.

[0092] By changing the geometry (size and / or shape) of the shunt element 708 to encode information data, identification labels can be provided to distinguish different types of cushioning pads 704. Figure 8A A first shunt element 808a, which can be used to indicate the type of a first buffer pad, is shown, and Figure 8B A second shunt element 808b, which can be used to indicate the type of a second buffer pad, is shown. (See example...) Figure 8A As shown, when the buffer pad with the first shunt element 808a is attached to the magnet array 728, the magnetic flux (indicated by the ring arrow 805a) is shunt away from the tag sensor 834. Figure 8B As shown, when the buffer pad with the second shunt element 808b is attached to the magnet array 728, the magnetic flux (indicated by the ring arrow 805b) is shunted through the tag sensor 834. Therefore, the tag sensor 834 can generate different signals depending on whether the first shunt element 808a or the second shunt element 808b is present. Thus, shunt elements 808a and 808b of different lengths can provide identification data encoding schemes to distinguish between the two types of buffer pads.

[0093] Figure 9A and Figure 9B This is a simplified perspective view illustrating another example of magnetic cushion identification according to some embodiments. The identification system 900 includes a magnet array 728 (as shown in Figure 7) disposed on a portion of an annular shelf 716 of a cover 712. A tag sensor 934 is disposed on the annular shelf 716 between the magnets of the magnet array 728. The tag sensor 934 may be, for example, a Hall effect sensor or other sensor capable of detecting magnetic flux from the magnet array 728.

[0094] By changing the size and / or shape of the shunt element, an identification label can be provided for a specific cushioning pad 704. Figure 9A A first shunt element 908a, which can be used to indicate the type of a first buffer pad, is shown, and Figure 9BA second shunt element 908b, which can be used to indicate the type of a second buffer pad, is shown. (See example...) Figure 9A As shown, when the buffer pad with the first shunt element 908a is attached to the magnet array 728, magnetic flux (indicated by the ring arrow 905a) is shunted around the tag sensor 934. Figure 9B As shown, when the buffer pad with the second shunt element 908b (which splits or has a gap at position 910 along its length) is attached to the magnet array 728, magnetic flux (indicated by the ring arrow 905b) is shunted through the tag sensor 934. Therefore, the tag sensor 934 can generate different signals depending on whether the first shunt element 908a or the second shunt element 908b is present. Thus, the shunt elements 908a and 908b can also provide an identification data encoding scheme to distinguish between the two types of buffer pads.

[0095] exist Figures 8A to 8B and Figures 9A to 9B In the example, two types of cushioning pads can be distinguished based on whether the magnetic flux is shunted away from or shunted through tag sensor 834 or tag sensor 934. In some embodiments, it may be desirable to increase the number of cushioning pad types that can be distinguished. To increase the number of cushioning pad types that can be distinguished, some embodiments may include multiple instances of magnet array 728 (e.g., one instance at each corner of earpiece 702), where each instance of magnet array 728 has an associated tag sensor (e.g., tag sensor 834 or tag sensor 934). Each tag sensor can provide one bit of information depending on whether the corresponding shunting element shunts the magnetic flux through or away from that sensor. The shapes of the various instances of shunting element 708 can vary independently of each other. Therefore, if there are N instances of magnet array 728 and N instances of shunting element 708, N bits of identification data can be provided, thereby allowing the distinction of 2 N There are several types of buffer pads. In another approach, each instance of the magnet array 728 may include multiple tag sensors disposed between adjacent magnets, and the shunt element 708 may be split or not split at various locations (e.g., Figures 9A to 9B (As shown), this allows a single shunt element to encode multiple bits of information. Both methods can be combined with multiple magnet arrays, each with multiple tag sensors, to further increase the number of distinguishable buffer pad types.

[0096] In some implementations, the magnet array may be included in the buffer pad, either in addition to being included in the earpiece or instead of being included in the earpiece. Figure 10An example of a cushioning pad 1006 including a magnet array 1008 according to some embodiments is shown. The magnet array 1008 includes a plurality of individual permanent magnets 1010 (or ferromagnetic material regions), each permanent magnet having a specific magnetic orientation (indicated by arrows). The ear cup 1002 may have a tag sensor 1014 including an array of Hall effect sensors 1016. The Hall effect sensors 1016 may be positioned such that they are adjacent to the magnet array 1008 when the cushioning pad 1006 is attached to the ear cup 1002. The magnetic orientation pattern of the magnet array 1008 may encode cushioning pad identification data. The Hall effect sensors 1016 may respond to the magnetic orientation, enabling an ID logic unit 1018 to extract identification data from the magnetic orientation pattern. In some embodiments, each magnet 1010 may encode one bit of identification data. Therefore, the identification tag for the cushioning pad may include a magnet array, and the corresponding tag sensor may include a sensor for detecting the magnetic orientation pattern of the magnet array.

[0097] It should be understood that the foregoing examples of magnetically based identification of the buffer member are illustrative, and variations and modifications are possible. Magneticly based identification can be implemented in any handset system in which the buffer member is magnetically attached to the handset, including a buffer pad attached to the ear cup and an earphone end attached to the earbud. Alternatively, magnetic features similar to those described above can be provided for identifying the buffer member, regardless of whether a magnetic attachment structure is used.

[0098] 2.3. RF-based identification

[0099] Another proximity-based identification technology that can be utilized according to some implementations is near-field communication (NFC) or radio frequency identification (RFID). In some implementations, the identification tag in the buffer component may include a passive near-field communication (NFC) or radio frequency identification (RFID) tag encoded using identification data. The corresponding tag sensor may be combined with a compatible NFC or RFID coil coupled to a circuitry implementing an NFC or RFID tag reader. As used herein, the terms “NFC” and “RFID” generally refer to communication protocols that use “reader” circuitry to generate a time-varying electromagnetic field in a first antenna (e.g., a first coil) and sense field fluctuations caused by passive “tag” circuitry coupled to a second antenna (e.g., a second coil) placed in the near-field range of the first coil. Various protocols for NFC and RFID have been defined and can be used, or custom protocols can be designed by those skilled in the art.

[0100] Figure 11A simplified view of an ear cup 1102 and a cushioning pad 1106 incorporating an NFC reader, according to some embodiments, is shown. The ear cup 1102 may include a magnet array 1128 disposed around its periphery. The cushioning pad 1106 may include a shunt element 1108 disposed at a position corresponding to the magnet array 1128, such that the cushioning pad 1106 can be securely attached to the ear cup 1102. The magnet array 1128 and the shunt element 1108 may be similar to the examples described above; however, the magnet array 1128 and the shunt element 1106 do not need to support cushioning pad identification. In other embodiments, mechanical attachment features or other attachment features may be used in addition to or in place of the magnet array 1128 and the shunt element 1108.

[0101] The cushioning pad 1106 may also include an NFC coil 1112 coupled to the NFC tag circuitry 1114 to provide passive identification tags. The ear cup 1102 may include an NFC coil 1116 (tag sensor) coupled to an ID logic circuitry 1118, which may include NFC reader circuitry. In some embodiments, the NFC coil and circuitry may conform to existing NFC standards and may be of a conventional design. When the cushioning pad 1106 is attached to the ear cup 1102, the NFC coil 1112 is brought close to the NFC coil 1116. The ID logic circuitry 1118 may be triggered to supply current to the NFC coil 1116, thereby energizing the NFC coil 1112 and the tag circuitry 1114, and enabling the ID logic circuitry 1118 to read data stored in the tag circuitry 1114. Any NFC or RFID protocol may be used to store data and transfer data from the tag circuitry 1114 to the ID logic circuitry 1118.

[0102] NFC identification (or other RFID-based identification) can also be implemented in the earbuds and headphone ends. Figure 12A A simplified cross-sectional view of an earbud 1202 and an earphone end 1206 according to some embodiments is shown. The earbud 1202 and earphone end 1206 may be similar to... Figure 4CThe earbud 1202 and earphone end 1206 utilize NFC technology to identify tags and tag sensors. The earbud 1202 may include an NFC coil 1216 (tag sensor) disposed adjacent to a proximal surface 1203 surrounding the end portion 1204. The NFC coil 1216 may be coupled to ID logic circuitry 1218 incorporating an NFC reader circuitry system. The earphone end 1206 may include an NFC coil 1212 disposed within an annular sidewall 1215 surrounding a central opening 1207. The NFC coil 1212 may be coupled to NFC tag circuitry 1214 disposed within the sidewall 1215. The NFC tag circuitry 1214 may encode identification data for the earphone end 1206. In some embodiments, the NFC coil and circuitry may conform to existing NFC standards and may be of a conventional design. When the earphone end 1206 is attached to the earbud 1202, the NFC coil 1212 is brought close to the NFC coil 1216. ID logic circuit 1218 can be triggered to supply current to NFC coil 1216, thereby energizing NFC coil 1212 and tag circuit 1214, and enabling ID logic circuit 1218 to read data stored in tag circuit 1214. Any NFC or RFID protocol (including traditional protocols) can be used to store data and transfer data from tag circuit 1214 to ID logic circuit 1218. Figure 12B An alternative arrangement of the NFC coils is shown, wherein the NFC coil 1216 in the earbud 1202 and the NFC coil 1212 in the earphone end 1206 are arranged concentrically. Other arrangements are also possible, provided that the NFC coils are brought close enough to read data stored in the NFC tag 1214 when the earphone end 1206 is positioned around the front portion 1204 of the earbud 1202.

[0103] It should be understood that the NFC-based identification tag and reader circuitry system is exemplary, and variations and modifications are possible. The specific arrangement and geometry of the coils can be modified. Depending on the specific construction and communication protocol, NFC or RFID tag circuitry (e.g., tag circuitry 1114 or tag circuitry 1214) can store multiple bytes or even kilobytes of information, which can support a very large number of unique identifiers for pad-type devices. In some implementations, the ID tag can encode a unique identifier for a single pad (or a pair of pads).

[0104] 2.4. Identification using a resonant circuit

[0105] Some NFC or RFID protocols allow tag circuitry to encode large amounts of data. In some implementations, it may be desirable to distinguish a smaller number of buffer pad types, thus a simplified NFC or RFID protocol can be used. For example, the reader circuitry may include a small number of resonant coils, each of which can be individually energized to detect the presence or absence of a nearby metallic element; the ID tag may encode the identification data as a pattern of the metallic element.

[0106] Figure 13A A simplified view of an ear cup 1302 incorporating an RFID sensor, according to some embodiments, is shown. The ear cup 1302 may be similar to other ear cups described above and may include an attachment element 1328 for attaching a cushioning pad. A coil array 1308 (implementing a tag sensor) may be disposed within the ear cup 1302, adjacent to the surface to which the cushioning pad is to be attached. The coil array 1308 may include a sensor coil array coupled to an ID logic circuit 1310. Figure 13B A more detailed view of the layout of a coil array 1308 according to some embodiments is shown. The coil array 1308 may include a plurality of individual coils 1312a-1312d. Although four coils are shown arranged in a 2×2 array, it should be understood that any number and arrangement of coils can be used. It should be understood that the resonant characteristics of each of the coils 1312a-1312d can be affected by placing conductive or non-conductive objects adjacent to the coils 1312a-1312d.

[0107] Figure 13C A simplified schematic circuit diagram of a coil array 1308 and an ID logic circuit 1310 according to some embodiments is shown. Each coil 1312a to 1312d is represented as an equivalent circuit with an inductor and a capacitor. Coils 1312a to 1312d are coupled to a resonant circuit driver 1314 and a sensing core 1316. The resonant circuit driver 1314 can be operated to drive each coil 1312a to 1312d at various frequencies, and the sensing core 1316 can sense a response. Based on the signal generated by the sensing core 1316, a logic module 1318 can determine whether a conductive object is present or absent in the vicinity of each coil, and a digital encoding module 1320 can generate a four-bit digital output based on the output of the logic module 1318. This four-bit output may include, for example, one bit corresponding to each coil of coils 1312a to 1312d, where a value "1" indicates the presence of a conductive object, and a value "0" indicates the absence of a conductive object. A communication interface 1322 (e.g., implementing I...) is also provided. 2 (C or other standard communication protocols) can receive control signals to control the operation of ID logic circuit 1310.

[0108] The buffer pad designed for identification by the coil array 1308 may include an arrangement of conductive regions encoding a four-bit identifier. For example, Figure 14 A simplified view of a cushioning pad 1406 according to some embodiments is shown. The cushioning pad 1406 may include features enabling attachment to... Figure 13A The attachment element 1408 of the ear cup 1302 is attached to the attachment element 1328. The tag element 1410 can be positioned on or below the surface of the cushioning pad 1406 adjacent to the ear cup 1302. The tag element 1410 can include four demarcated regions 1412a to 1412d, and the identification data of the cushioning pad can be represented by a suitable pattern of a conductive plate spanning these four regions. Figure 14 In the example shown, regions 1412a and 1412d have conductive plates, while regions 1412a and 1412d do not. Different patterns can be used to distinguish different types of cushioning pads.

[0109] Figure 15 A tag element 1410, according to some embodiments, is shown stacked on a coil array 1308. Coils 1312a and 1312d are aligned with regions 1412a and 1412d of the tag element 1410 having stacked conductive plates, while coils 1312b and 1312c are aligned with regions 1412b and 1412c without stacked conductive plates. Therefore, the ID logic circuit 1310 can generate an identification pattern, such as "1001". Different arrangements of the conductive plates can produce different identification patterns, thus allowing differentiation of different cushioning pad types.

[0110] Figure 15 The resonant coil arrangement shown is exemplary, and variations and modifications are possible. Resonant coil arrays can be implemented with various form factors and arrangements. Furthermore, although the resonant coil array is shown in the context of ear cups and cushioning pads, it should be understood that similar principles can be applied to earbuds and headphone ends, although space constraints may limit the number of coils. In some implementations, a tag sensor using an array of N resonant coils can support 2... N Identifier for the type of cushioning pad.

[0111] In the example described above, each resonant circuit provides one bit of identification data. In other implementations, a single resonant circuit can provide a much larger amount of identification data. Figure 16A simplified view of an ear cup 1602 and a buffer pad 1606 incorporating a resonant circuit for tag identification, according to some embodiments, is shown. The ear cup 1602 may include a magnet array 1628 disposed around its periphery. The buffer pad 1606 may include a shunt element 1608 disposed at a position corresponding to the magnet array 1628, such that the buffer pad 1606 can be securely attached to the ear cup 1602. The magnet array 1628 and the shunt element 1608 may be similar to the examples described above; however, the magnet array 1628 and the shunt element 1606 do not need to support buffer pad identification. In other embodiments, mechanical attachment features or other attachment features may be used in addition to or in place of the magnet array 1628 and the shunt element 1608.

[0112] The cushioning pad 1606 may have a "tag" circuit 1612 located at a specific position. The ear cup 1602 may have a tag sensor 1616 located near the tag circuit 1612 when the cushioning pad 1606 is attached to the ear cup 1602. The tag sensor 1616 may be coupled to an ID logic circuit 1618, which may be located elsewhere within the ear cup 1602.

[0113] Tag circuit 1612 can be a resonant circuit (“RC”), and ID logic circuit 1618 can be combined with a tuner circuit system. In operation, ID logic circuit 1618 can drive tag sensor 1616 at various frequencies and detect the resonant frequency of tag circuit 1612. For example, Figure 17AA resonant circuit 1712 and a reader circuit 1716 according to some embodiments are shown. The resonant circuit 1712 can implement a tag circuit 1612. In this example, the resonant circuit 1712 includes a capacitor 1720 and an inductor 1722 connected in a loop. The reader circuit 1716 can implement a tag sensor 1616 and an ID logic circuit 1618. In this example, the reader circuit 1716 includes an inductor 1732 coupled to a tuner 1734. The resonant circuit 1712 and the reader circuit 1716 can be arranged such that when a buffer pad in which the resonant circuit 1712 is located is attached to an ear cup in which the reader circuit 1716 is located, the inductor 1722 approaches (at a fixed distance from) the inductor 1732. The tuner 1734 can determine a resonant frequency that depends on the inductance of the inductor 1732, as well as the specific inductance of the inductor 1722 and the specific capacitance of the capacitor 1720. Therefore, identification data for the buffer pads can be encoded in the resonant circuit 1712 by configuring it to have a resonant frequency assigned to a specific buffer pad type. In some embodiments, capacitor 1720 has the same capacitance (within manufacturing tolerances) for all buffer pad types, and buffer pad type information can be encoded by selecting the inductance of inductor 1722. In other embodiments, inductor 1722 may have the same inductance (again, within manufacturing tolerances) for all buffer pad types, and buffer pad type information can be encoded by selecting the capacitance of capacitor 1720. The number of buffer pad types that can be distinguished in this way depends on the frequency range of tuner 1732 and the accuracy that tuner 1732 can achieve in measuring a specific resonant frequency. In some embodiments, a low-complexity tuner circuit can distinguish, for example, up to about 10 different frequencies, each of which can be mapped to a specific value of the buffer pad identification parameter.

[0114] Other resonant circuit configurations can also be implemented. Figure 17B Another example of a tag circuit 1752 and a tag sensor 1756 according to some embodiments is shown. In this example, the tag circuit 1752 includes a resistor 1760 and an inductor 1762. Similar to Figure 17A The resonant circuit 1712 can encode identification data in the resonant circuit 1752 by configuring the resonant circuit 1752 to have a resonant frequency assigned to a specific buffer pad type. In some embodiments, this configuration can be achieved by changing one of the resistor 1760 or the inductor 1762 while keeping the other constant. Those skilled in the art will appreciate that a variety of other resonant circuit configurations can be used.

[0115] It should be understood that the specific implementation of the resonant circuit shown herein is illustrative and not limiting. Furthermore, although the example is shown in the context of identifying cushioning pads attached to an ear cup, similar techniques can be adapted to identify earphone ends attached to earbuds or other types of cushioning components attached to the earpiece. As mentioned above, the number of different cushioning pad types that can be identified using resonant circuits as ID tags depends on the ability of the sensor circuitry to distinguish different resonant frequencies. To increase the number of different cushioning pad types that can be identified, multiple resonant tag circuits and corresponding sensor circuits can be positioned at various locations around the cushioning pads and ear cups, and different combinations of the resonant frequencies of the tag circuits can be used to encode different cushioning pad identifiers. For example, if each reader circuit can distinguish M different frequencies, and there are N tag / reader circuit combinations, then M*N cushioning pad types can be distinguished.

[0116] 2.5. Optical Recognition

[0117] In some embodiments, the identification tag may include an area of ​​material (e.g., plastic, metal, textile) disposed on the surface of the cushioning member to optically encode identification data, and the tag sensor in the earpiece may include an active optical sensor that directs light (e.g., infrared light) onto the optical identification tag and senses reflected light from the tag. The amount of encoded identification data can vary depending on the specific sensor and encoding scheme. In the simplest case, a binary optical sensor can be used to distinguish cushioning pads made of two different textiles with different reflectivities to provide one bit of identification data. In other embodiments, the optical sensor can distinguish multiple reflectivity levels, thereby increasing the amount of identification data. In still other embodiments, the optical sensor may include an imaging sensor (or sensor array) capable of detecting reflectivity patterns across regions, and the arrangement of high-reflectivity and low-reflectivity regions on the surface of the cushioning member can be used to encode two or more bits of identification data.

[0118] In some implementations, an optical tag sensor can be provided by utilizing an optical sensor for detecting whether the earpiece is being worn. Figure 18A and Figure 18B An arrangement of optical sensors for use in an ear cup according to some implementation schemes is shown. Figure 18A A cross-sectional view of the front cover of the ear cup and the attached cushioning pad is shown, and Figure 18B A perspective view of the ear cup front cover and cushioning pad in a separated state is shown. In this illustrated embodiment, an optical sensor is configured to detect whether the ear cup is on the user's ear.

[0119] First see Figure 18AThe ear cup 1802 may include a housing 1801 (partially shown) and a cover 1804 attached to the housing 1801. The cover 1804 may include multiple perforations to allow sound from a speaker positioned within the housing 1801 to be directed out of the housing 1801 toward the user's ear. The earpiece cushion assembly 1806 may be detachably attached to the housing 1801 and the cover 1802, for example, using magnetic attachment and / or mechanical attachment as described above.

[0120] An optical sensor 1820 may be attached to a housing 1801 (or cover 1804) and oriented to detect a portion of a region 1805 (e.g., the user's ear) within the inner periphery of the ear cup 1802 and the cushioning assembly 1806. For example, the sensor 1820 may have a relatively wide conical field of view (FOV) 1822 (where light is emitted from the sensor and where the sensor can detect reflected light) to cover a large area within region 1805, but confined to the inner periphery of the ear cup assembly. The sensor 1820 may be an electro-optical device comprising one or more emitters (e.g., one or more vertical-cavity surface-emitting lasers (VCSELs)) and a light receiver (e.g., an array of light sensors). In some embodiments, the sensor 1820 includes a single nanosecond pulse VCSEL laser in the infrared wavelength range and a beam-directing device that can guide the laser pulse at different individual fields of view within the larger FOV 1822 of the sensor 1820.

[0121] In some embodiments, sensor 1820 also includes a single-photon avalanche diode (SPAD) array as a receiver that can detect reflected beams from within FOV 1822. When the ear cup 1802 with attached cushioning pad 1806 is placed on a user's head, sensor 1820 emits collimated beams of pulsed radiation at different locations within FOV 1822. The pulsed laser beam can be reflected from the user (e.g., from the user's ear or a portion of the user's skull surrounding the ear) and detected by the SPAD array photoreceiver of sensor 1820. A processor or similar control circuitry (not shown) within ear cup 1802 can be coupled to sensor 1820 to control the timing of the laser pulses and receive the detection signal generated by the photoreceiver. The processor can use the known timing of the laser pulses and other known information to determine the distance to the user's ear (or other reflective object) using time-of-flight calculation techniques. For example, the time of flight can be determined by emitting a beam at the object and measuring the time taken for the receiver to detect the light reflected away from the object. In some implementations, sensor 1820 can detect objects located between approximately zero and at least approximately 300 mm from sensor 1820. For example, sensor 1820 can detect objects positioned between approximately 1 mm and approximately 100 mm from sensor 1820.

[0122] Sensor 1820 can be electrically coupled to a processor for processing the data detected by the SPAD array. The processor can determine whether the intensity of the reflected light meets a certain threshold and whether the distance to the object indicates it is within region 1805. In some cases, SPADs are highly sensitive devices capable of detecting radiation as small as a single photon. Due to the sensitivity of the SPAD light receiver array and the ability of sensor 1820 to both detect the intensity of reflected radiation and determine the distance from the sensor to the object from which the pulse beam reflects, either or both of the intensity and distance can be used to determine whether the ear cup assembly is on the user's head.

[0123] like Figure 18A As shown in the illustration, sensor 1820 can be positioned behind an opening 1808 formed in the sidewall portion 1810 of housing 1801 and cover 1804, so that sensor 1820 can both project radiation into region 1805 and receive radiation reflected back to the optical sensor from one or more surfaces within region 1805.

[0124] In various embodiments, sensor 1820 may be positioned on a bracket 1821, which may be coupled to sidewall portion 1810 and span the width of aperture 1808. Bracket 1821 may provide mounting angles to guide sensor 1820, allowing FOV 1822 to span desired areas and avoid unwanted areas (such as the surface of cushioning pad 1806). Anti-reflective coatings and optically clear windows may be used to further optimize the performance of sensor 1820. In some embodiments, a second optical sensor 1820a may be positioned relative to sensor 1820.

[0125] Figure 18B A perspective view of the cover 1804 and the buffer pad assembly 1806 is shown. The cover 1804 may include an aperture 1808 as described above to allow light from sensors 1820, 1820a to pass through. The buffer pad 1806 may include a region 1830 corresponding to the location of the aperture 1808 (one such region in...). Figure 18B (The image is visible in the image; although the other is not shown, its location can be inferred). In some embodiments, one region 2530 of the relative regions may be an aperture to facilitate the detection of whether the ear cup is on the user's head using one of the sensors 1820, 1820a, while the other region 1830 of these regions may be an opaque region encoding identification data. The opaque region 1830 may be read by sensor 1820 or 1820a (depending on the orientation of the cushion 1806 relative to the earpiece 1804) to determine cushion identification information.

[0126] Figures 19A to 19C illustrates examples of encoding identification data into region 1830 of buffer pad 1806 according to various embodiments. For example... Figure 19A As shown, the removable cushioning pad 1806 may include a sidewall 1906 extending above the aperture 1808, such that a region of the sidewall is exposed to the optical sensor 1820a. The sidewall 1906 may have a target pattern 1908 printed on its surface, located within the exposed area, such that the target pattern can be detected by the optical sensor 1820a. For example, to distinguish between two cushioning pad types, the target pattern 1908 may be a high-reflectivity region of a first cushioning pad type or a low-reflectivity region of a second cushioning pad type, and the sensor 1820a may use a threshold test to determine the cushioning pad type. To distinguish a larger number of cushioning pad types, multiple reflectivity levels may be defined, where the upper limit is based on the sensor 1820a's ability to reliably distinguish these levels. Alternatively, an imaging method may be used, wherein the printed pattern comprises a fixed number of regions (or pixels), each of which has either high or low reflectivity, and the sensor 1820a may interrogate each region (e.g., using a photoelectric sensor array and / or beam steering techniques) to individually determine the reflectivity of each pixel. The number of pixels can be selected based on the number of buffer pad types to be distinguished.

[0127] Figure 19B Another example of a removable cushioning pad 1806 is shown, which includes a sidewall 1906 extending above the aperture 1808, such that a region of the sidewall is exposed to the optical sensor 1820a. In this example, a target pattern 1928 is injected into the sidewall 1906, for example, using a secondary injection molding process with a material having the desired reflectivity. Similar to... Figure 19A The implementation scheme can distinguish two or more types of cushioning pads based on the reflectivity level and / or the pattern of high reflectivity and low reflectivity regions within the target pattern 1928.

[0128] It should be understood that the optical sensor implementations described herein are exemplary, and variations and modifications are possible. For example, multiple optical sensors may be positioned at various aperture locations around the earcup sidewall, and identification data may be encoded using any or all of the following: the presence or absence of cushioning material above each aperture; the reflectivity of the cushioning material above each aperture; and / or a pattern of areas with different reflectivities at each aperture. The amount of identification data that can be encoded depends on the number of different areas and / or reflectivity levels that can be independently sensed by the optical sensors in the earcup. In some implementations, particularly when the number of cushioning types to be distinguished is small, the material of the sidewall 1906 itself may encode cushioning identification information without the need for any additional patterns attached or injected. It should also be understood that similar techniques can be applied to the earphone end and earbud.

[0129] 2.6. Acoustic Recognition

[0130] In some implementations, different cushioning pad types can have different acoustic characteristics. In this case, the cushioning pad itself can encode identification information, and acoustic techniques (such as electromechanical impedance spectroscopy) can be used to read the cushioning pad identification data.

[0131] Figure 20 Examples of earbud 2002 and headphone end 2006 according to some embodiments are shown. Earbud 2002 defines a sound chamber 2008 and has an acoustic driver 2010. For example, driver 2010 may include a diaphragm 2014 that can be induced to oscillate by a transducer (not shown) coupled to amplifier 2016. When diaphragm 2014 oscillates, as indicated by dashed line 2010a, air in sound chamber 2008 can be excited, thereby generating sound waves exiting through acoustic port 2018 (e.g., an opening) in front portion 2004. In some embodiments, microphone 2020 may be placed within acoustic port 2018 to receive sound.

[0132] Similar to the embodiments described above, the front portion 2004 may receive and attach the earphone end 2006. The earphone end 2006 has sidewalls 2022 surrounding the front portion 2004. As described above, various mechanical attachment structures, magnetic attachment structures, or friction-based attachment structures may be used to detachably attach the earphone end 2006 to the earbud 2002. The earphone end 2006 may also have an compliant circular protrusion or top cover 2024 that conforms to the user's ear canal, as described above. The earphone end 2006 may also include a tag element 2028, which may be disposed, for example, within the sidewall 2022. The tag element 2028 may incorporate a passive circuit system, such as a metal strip, coil, board, etc., which may provide resistance, capacitance, and / or inductance depending on a specific configuration.

[0133] The earbud 2002 may also include an ID logic unit 2030. The ID logic unit 2030 may communicate with the amplifier 2016 and the microphone 2020 to perform acoustic recognition of the earphone end 2006. Figure 21 A flowchart of a process 2100 for acoustic recognition, which can be implemented in ID logic unit 2030 according to some embodiments, is shown. At block 2102, ID logic unit 2030 can drive an acoustic transducer at a target frequency. For example, ID logic unit 2030 can operate amplifier 2016 to drive diaphragm 2014. At block 2104, ID logic unit 2030 can measure output parameters. For example, ID logic unit 2030 can receive a detected (acoustic) response from microphone 2020 and determine the load impedance on amplifier 2016. Alternatively, ID logic unit 2030 can incorporate a meter connected to amplifier 2016 to measure the load impedance independently of microphone 2020. At block 2106, ID logic unit 2030 can compare the measured output parameters with parameter values ​​associated with a specific cushion type, and at block 2108, ID logic unit 2030 can determine recognition data for earphone end 2006 based on this comparison.

[0134] In some implementations, multiple measurements can be used to determine identification data. For example, ID logic unit 2030 can drive amplifier 2016 at a target frequency in both current-driven (“HOR”) and voltage-driven (“ZOR”) modes. The acoustic response from microphone 2020 varies with load impedance in HOR mode but not in ZOR mode. Therefore, the difference between the acoustic response from microphone 2020 in HOR and ZOR modes can provide a measurement of load impedance. Measurements can be repeated across multiple target frequencies to generate a load impedance distribution. The load impedance distribution can be influenced by specific characteristics of tag element 2028, making it possible to distinguish different types of headphone ends.

[0135] In some implementations, a small amount of earphone end identification information can be encoded in this way. For example, the presence or absence of the earphone end may be detected based on a load impedance distribution, which could be useful information, for example, regarding earbuds designed to be used with or without earphone ends. As another example, two or three configurations of the tag element 2028 may be distinguishable based on load impedance distributions, and these configurations may be used to encode earphone end sizes (e.g., small, medium, large, or only small and large).

[0136] Depending on the frequency used, the headphone end recognition using electromechanical impedance spectroscopy may be audible to the user, which may be undesirable. To avoid or minimize audible sounds, some implementations use ultrasonic frequencies (above the range of normal human hearing). Some implementations can use frequencies within the range of human hearing, at amplitudes close to the noise threshold, utilizing modulation or keying schemes to improve signal quality.

[0137] It should be understood that this acoustic recognition technology is exemplary, and variations and modifications are possible. Many different tag circuit configurations can be implemented, including those with... Figure 17A and Figure 17B The circuits shown are similar. Acoustic recognition technology can also be applied to identify the cushioning pads attached to the ear cup. For example, cushioning pads made of different materials can produce different frequency response distributions (e.g., the low-frequency response can be affected by the material composition of a particular cushioning pad), and in this case, the acoustic spectrum can be used to distinguish different types of cushioning pads.

[0138] 2.7. Capacitive Sensor

[0139] Another recognition technology can be implemented in handsets with touch-sensitive interfaces. For example, some existing headphones and earbuds allow users to touch specific areas on the outer surface of the handset to adjust the volume, start or stop music playback, answer or end a phone call, or control other operations. The touch-sensitive interface can be implemented using capacitive sensor logic that receives and interprets capacitance measurements from sensor points located in various areas on the handset surface.

[0140] In some implementations, capacitive sensor logic components can be used to identify the buffer member attached to the earpiece. For example, in Figure 5 In one embodiment, the earcup 502 may have a touch-sensitive interface with sensor points disposed on an outer surface 501 (on which a user can touch when wearing the earcup 502). Additional sensor points of the touch-sensitive interface may be positioned on an interface surface 503. The interface surface 507 of the cushioning pad 506 (which contacts the interface surface 503 of the earcup 502) may be patterned as a surface deviation with encoded identification data. When the cushioning pad 506 is attached to the earcup 502, the capacitive sensor logic unit in the earcup 502 can read the obtained signal pattern from the sensor points on the interface surface 503 and decode the identification data.

[0141] It should be understood that capacitive sensing can be used for earpiece end identification in earbuds, and more generally, for buffer member identification in any earpiece equipped with a touch-sensitive interface. In some implementations, the touch-sensitive interface can be specifically used for buffer member identification.

[0142] 2.8. Electrical contacts used for identification

[0143] The aforementioned implementation incorporates contactless identification tags, meaning that identification data can be transmitted without a conductive path connecting the ID tag and the tag sensor. Contactless ID tags may be desirable in some situations, such as where there are concerns about moisture corroding the electrical contacts. However, in some implementations, electrical contacts can be used to couple the tag sensor to the identification tag.

[0144] Figure 22 A simplified view of an ear cup 2202 and a cushioning pad 2206 according to some embodiments is shown. The cushioning pad 2206 can be removably attached to the ear cup 2202 using attachment structures 2208, 2228, similar to other embodiments described above. The cushioning pad 2206 also includes an identification tag 2210, which can be implemented using a resistor 2212 coupled between two electrical contacts 2214. The ear cup 2202 includes a tag sensor 2216, which can be implemented using electrical contacts 2218 coupled to an ID logic circuit 2220. When the cushioning pad 2206 is attached to the ear cup 2202, the electrical contacts 2214 and 2218 contact each other, thereby allowing current to flow. The ID logic circuit 2220 may include a circuit system (e.g., a conventional voltage divider circuit, etc.) that can be used to determine the resistance of the resistor 2210, and the resistance of the resistor 2210 can provide identification data for the cushioning pad 2206. In these embodiments, the number of unique identifiers corresponds to the number of distinguishable resistance values. In some implementations, the number of unique identifiers can be further increased by providing additional contacts and additional resistors, where a specific combination of resistors encodes the identification data.

[0145] For example, Figure 23A simplified view of the ear cup 2302 and the cushioning pad 2306 according to some embodiments is shown. The cushioning pad 2306 can be removably attached to the ear cup 2302 using attachment structures 2308, 2328, similar to other embodiments described above. The cushioning pad 2306 also includes an identification tag 2310, which can be implemented using a set of electrical contacts 2314. One electrical contact 2314g can be a designated ground contact, and some electrical contacts 2314 can be connected to the ground contact 2314g, while others are not connected (floating). The ear cup 2302 includes a tag sensor 2316, which can be implemented using a set of electrical contacts 2318 coupled to an ID logic circuit 2320. The electrical contacts 2318g can be grounded as shown. When the cushioning pad 2306 is attached to the ear cup 2302, the electrical contacts 2314 and 2318 are in contact with each other, thereby allowing current to flow. Ground contact 2314g can contact ground contact 2318g, so that ground contact 2314g is also grounded. ID logic circuitry 2320 may include a circuitry for determining whether each of the electrical contacts 2318 is grounded (grounded if the corresponding one of the electrical contacts 2314 is coupled to ground contact 2314g) or floating (floating if the corresponding one of the electrical contacts 2314 is not coupled to ground contact 2314g). The state of each contact (grounded or not grounded) can provide one bit of identification data. If there are N active contacts 2314 (excluding ground contact 2314g), then 2n can be distinguished. N There are several types of cushioning pads.

[0146] It should be understood that the foregoing examples of identification technology using electrical contacts are illustrative, and variations and modifications are possible. Any number and arrangement of contacts can be provided. It should also be understood that electrical contacts enabling the transmission of tag information can be implemented in the earpiece end and earbud, or in any other type of buffer and earpiece.

[0147] 2.9. Active Identification Tag

[0148] In the foregoing example, the identification tag can be a passive component that does not require power or logic circuitry within the buffer component. In other embodiments, the identification tag within the buffer component (e.g., Figure 1 Identification tag 108 or Figure 2 The identification tag 208 may include an active element (e.g., a transceiver) that can communicate via a bidirectional communication channel with a corresponding earpiece (e.g., a...). Figure 1 Ear cup 102 or Figure 2The reader circuitry communicates with the earpiece (202). Depending on the implementation, the communication channel can be wired or wireless. When the identification tag is an active element, the identification tag can be configured to receive operating power from the earpiece, and the earpiece can be configured to supply operating power to the identification tag. For example, power contacts can be provided to transfer power from the earpiece to the identification tag. Alternatively, inductive power transfer can be used to supply power from the earpiece to the identification tag without requiring a wired connection. In some embodiments, the active identification tag can be supported in combination with additional active components within a buffer member.

[0149] 3. The process used to identify buffer components

[0150] 3.1. Overview of the Identification Process

[0151] See you again Figure 3 Regardless of the specific implementation of the identification tag 308, the associated tag sensor 314, and the identification logic unit 334, the earpiece 302 (e.g., ear cup or earbud) can read the identification tag 308 of the buffer member 306 (e.g., buffer pad or earphone end) and adjust some aspects of its behavior accordingly.

[0152] Figure 24 It is possible to use a handset system (such as...) according to some implementation schemes. Figure 3 The flowchart illustrates the process 2400 performed in the earpiece system 300. At block 2402, process 2400 may detect the presence of the buffer member 304. For example, earpiece 302 may include a proximity sensor or presence sensor to detect when the buffer member 306 is attached by a user. Examples of proximity sensors are known in the art and include, for example, Hall effect sensors that may respond to a magnetic element disposed within the buffer member 306, optical sensors that may detect obstruction caused by the buffer member 306, mechanical switches that may deflect into different positions when the buffer member 306 is attached, and so on. Alternatively, earpiece 302 may periodically poll a tag sensor 314 to determine the presence of the buffer member. No specific presence detection mechanism or process is required.

[0153] At box 2404, process 2400 can obtain identification data (or identification information) from buffer member 306, for example, by operating tag sensor 314 and ID logic unit 334 to read identification tag 308. Identification tag 308 can encode identification data using a variety of physical structures, including any of the magnetic, RF-based, resonant, optical, acoustic, capacitive, or electrical structures described above, or any other structure. As used herein, identification data can provide at least some additional information, not just an indication of the presence or absence of buffer member. For example, identification data can represent any or all of the following: manufacturer identifier; model identifier; size identifier; color identifier; device category identifier (e.g., indicating the presence or absence of various capabilities or features); unique serial number; etc. Identification data can be encoded in or on identification tag 308 in any way that enables earpiece 302 to read or receive identification data when buffer member 306 is attached, including any or all of the examples described above.

[0154] In an embodiment where the handset system 300 operates as an accessory to the host device 350, at block 2406, process 2400 may transmit identification data to the host device, for example, via communication interface 316. Transmission of identification data to the host device is not required, and in some embodiments, the host device may not be present.

[0155] At box 2408, the earpiece system 300 and / or the host device 350 can modify device behavior based on identification data. In some embodiments, this modification applies to the earpiece. For example, the equalizer settings of the earpiece 302 can be selected or modified ( wholly or partially) based on the identification data. Similarly, settings related to hearing protection, such as volume limiting, active noise cancellation profiles, etc., can be modified. In some embodiments where the earpiece 302 is used as an accessory to the host device 350, the behavior of the host device 350 can be modified. The modified behavior of the host device 350 may involve, but does not necessarily involve, providing audio to the earpiece 302. For example, the host device can provide a graphical user interface that includes an image of the personal audio device with which the host device is currently interacting. In some embodiments, this image can be modified based on identification data, for example, by changing other aspects of the color, shape, or appearance of a buffer element in the image to resemble multiple aspects of a particular buffer element currently attached.

[0156] It should be understood that process 2400 is exemplary, and variations and modifications are possible. For example, in some embodiments, the operation of detecting the presence of a buffer member and the operation of obtaining identification data from the buffer member can be combined. In some embodiments, a personal audio device may include two instances of the earpiece system 300 (one for each ear). In this case, each earpiece 302 may read the ID tag 308 of its attached buffer member 304 and may transmit the identification data to the other earpiece 302 and / or the host device 305. (If the identification data read by the two earpieces is inconsistent, for example, the buffer pads are of two different types, various actions can be taken. For example, the user may be warned of a mismatch. In some embodiments, the host device 350 may determine which identification data to use to modify device behavior.) In some embodiments, the ID tag 308 may be included in only one of the pair of buffer members, in which case only one earpiece 302 will read the ID tag 308. In some embodiments, the identification data may be used for purposes other than (or instead of) modifying device behavior.

[0157] 3.2. Using identification data

[0158] Depending on the specific identification data available in a given implementation scheme, the handset and / or host device can use the identification data in a variety of ways. For example, regarding identification data... Figure 25 Table 2500 illustrates an example of mapping ID values ​​(column 2502) to features of a buffer member according to some embodiments. In this example, the buffer member is an earphone end attached to an earbud. Different earphone ends may differ in size, color, material, and / or manufacturer. Each ID value in column 2502 maps to a different combination of size, color, material, and manufacturer. An ID tag 308 for a given earphone end may encode one of the defined ID values, and ID logic unit 334 may use tag sensor 314 to determine which ID value is encoded in a particular ID tag 308. The earpiece 302 or host device 350 may decode the ID value, for example, by referring to table 2500, which implements a lookup table, to determine the corresponding features of size, color, material, and manufacturer. It should be understood that table 2500 is an example. Depending on the amount of identification data (e.g., number of bits) available in a particular tag, more or fewer features may be distinguished and / or a given feature may have more or fewer different values.

[0159] 3.2.1. Behavior Modification

[0160] As referenced above Figure 24The handset 302 and / or host device 350 may modify their behavior based on identification data of the attached buffer member 306. In various embodiments, specific modifications to behavior may depend on the type of information available and the capabilities of the handset 302 and / or host device 350. Examples will now be described.

[0161] In some implementations, the earpiece 302 and / or the host device 350 can modify their behavior by altering audio output characteristics based on the type of buffer identified by buffer identification data. For example, it is known in the art that equalizer settings can be used to improve the perceived sound quality of a speaker. The audible spectrum can be subdivided into multiple frequency bands, and the relative response in different frequency bands can be increased or decreased according to the equalizer settings. The optimal equalizer setting can depend in part on the characteristics of the speaker. In the case of personal audio devices such as in-ear headphones and headphones, buffers made of different materials and / or with different geometries (size and / or shape) can have different effects on the sound waves produced by the speaker; therefore, the optimal equalizer setting can differ for different types of buffers.

[0162] Therefore, in some embodiments, the identification data may include device category identifiers that differentiate buffer types based on material and / or geometry. The handset or host device may store a lookup table that maps each device category identifier to a recommended equalizer setting, and the equalizer setting may be selected at least in part based on the device category identifier. In some embodiments, the recommended equalizer setting based on the device category identifier may indicate adjustments to a baseline equalizer setting, which is determined based on other factors such as the type of audio being produced (e.g., music relative to spoken language, a specific music genre, etc.) and / or information about the environment.

[0163] For example, some handsets (or main unit devices) can provide active noise cancellation. In active noise cancellation, an auxiliary audio signal is generated to cancel out ambient sounds (e.g., aircraft engine noise) that may leak into the user's ears, and this auxiliary audio signal can be played in isolation or in combination (mixed) with the main audio signal the user is listening to. The effectiveness of noise cancellation in a given handset can depend on the characteristics of the buffering components; for example, different buffering components can allow different amounts of ambient sound, and the amount of sound allowed can depend on the frequency.

[0164] Therefore, in some implementations, the noise cancellation profile used to generate the auxiliary audio signal for the earpiece can be modified based on identification data (e.g., device category identifier) ​​obtained from the buffer component. In some cases, modifying the noise cancellation profile may include enabling or disabling active noise cancellation, or increasing or decreasing the strength of the auxiliary audio signal globally or within a specific frequency band.

[0165] For example, some buffer components may belong to a category of devices designed for use in environments where it is desirable to reduce ambient noise without suppressing specific sounds (e.g., human speech). In some implementations, when identification data indicates that a buffer component belongs to that device category, an appropriate sound filtering algorithm or active noise cancellation algorithm can be automatically applied.

[0166] For example, some buffer components can be designed for use by children, who may be particularly vulnerable to hearing damage from prolonged exposure to loud noise. In some implementations, volume limiting can be automatically applied to the speakers of a personal audio device when identification data indicates that the buffer component is designed for use by a child, which can help protect the user's ears. It should be understood that volume limiting operation is not limited to children, and volume limiting can be associated with any device category.

[0167] Furthermore, some of the embodiments described above use buffer pad identification to determine whether a buffer element is attached to the earpiece. A specific example has been described above in the context of acoustic recognition technology, but any of the techniques described above for reading identification tags can also indicate the presence of an identification tag (and possibly a buffer element). In some embodiments, the earpiece can be designed to be used with or without a buffer element, and the audio characteristics can be modified based on whether a buffer element is attached. In other embodiments, the earpiece can be designed to be used only with a buffer element, and modifications to behavior when a buffer element is not detected can include, for example, notifying the user to attach a buffer element or not generating sound in the earpiece (or generating only a low level of sound) when a buffer element is not present.

[0168] Other behavioral modifications may involve user interface features. For example, the host device with which a personal audio device interacts may have a graphical user interface that displays an icon or image representing the personal audio device. In some implementations, the icon or image may be modified based on identification data. For example, if the identification data identifies the shape, color, or other visual characteristics of the currently attached buffer, the icon or image may be modified to reflect the actual shape, color, or other visual characteristics of the buffer.

[0169] It should be understood that these examples of device behavior modification are illustrative. Other behavior modifications can be implemented, and different sets of behavior modifications can be associated with different identification data. In some implementations, users may have the option to override behavior modifications, for example, via the host device's user interface or via voice commands.

[0170] It should also be understood that in some cases, due to various factors such as the absence or damage of the identification tag, or transient errors in the tag sensor, the pad identification process may fail to read pad identification data. Therefore, some implementations may enforce a default behavior mode when pad identification fails. The default behavior mode may include, for example: operating using a default equalizer profile and / or active noise cancellation profile; displaying a default pad image in the graphical user interface; and so on.

[0171] 3.2.2. Assist users in selecting cushioning pads.

[0172] In some implementations, the identification information of the buffer currently attached to the earpiece can be used to assist the user in selecting the buffer to optimize the user's audio experience.

[0173] For example, in some implementations where the size of the buffer component is a characteristic that can be determined from the ID tag 308, the identification data can be used to assist the user in selecting a buffer component with the optimal size. Figure 26 A flowchart of an adaptation process 2600 according to some embodiments is shown. The adaptation process 2600 can, for example, be performed on a host device interacting with a handset (such as one interacting with handset system 300). Figure 3 Implemented in the host device 350).

[0174] At block 2602, process 2600 may prompt the user to attach a cushioning component (e.g., the earphone end) to the earpiece (e.g., the earbud) to perform a size test. For example, the host device may provide the prompt via a graphical user interface or voice prompts. Once the user has attached the earphone end, at block 2604, process 2600 can obtain identification data from the earphone end. In some embodiments, block 2604 may be similar to block 2404 of process 2400 described above, and may use the identification tag described above, as well as any of the compatible tag sensor and identification logic components. The identification data may vary as needed, provided that the identification data enables the determination of the size parameters of the earphone end.

[0175] At box 2606, process 2600 can determine the size parameters of the earphone end based on the identification data. In some embodiments, the identification data may include numerical values ​​directly mapped to sizes (e.g., values ​​0, 1, and 2 may map to small, medium, and large sizes). In other embodiments, this can be achieved by performing a lookup operation on the identification data (e.g., using...). Figure 25 The dimensions are determined using Table 2500.

[0176] At box 2608, process 2600 may perform an audio leakage test. Examples of earpiece leakage tests are known in the art and may include detecting external sound leaking in through the earpiece and / or detecting sound leaked into the environment by the earpiece. Specific tests are not relevant to understanding this disclosure. At box 2610, process 2600 may determine whether the leakage test was successful. For example, the success or failure of the leakage test may be defined based on whether the sound leakage level is below or above a certain preset threshold. In the event of failure, at box 2612, process 2600 may recommend trying another size next time. Because process 2600 has determined the size of the earpiece end being tested, this recommendation may be more specific than a general suggestion to try different sizes. For example, based on the current size and the leakage test results, process 2600 may recommend trying a larger (or smaller) size or trying a specific size. If the leakage test is successful at box 2610, then at box 2614, process 2600 may confirm that the currently attached size provides adequate protection against sound leakage.

[0177] It should be understood that process 2600 is exemplary and can be modified. Process 2600 can be used with a variety of leakage tests and a variety of earpieces and buffer components (including cushioning pads for ear cups). Similar processes can also be used to evaluate whether a particular buffer component provides satisfactory audio performance and to recommend different buffer components that can provide improved performance. For example, in addition to having different sizes, or instead of having different sizes, different types of buffer components can be made of different materials that provide different levels of isolation from external sounds, and buffer components made of specific materials can be recommended based on leakage tests and / or user feedback regarding subjective audio experience. In some implementations, processes such as process 2600 can be implemented entirely within the earpiece, for example, using indicator lights or voice prompts to convey test results and recommendations.

[0178] 3.2.3. Additional uses of buffer component identification data

[0179] The above-described embodiments can utilize various data encoding and reading techniques to encode and read the identification data of the cushioning pad. As mentioned above, different techniques can enable the encoding of varying amounts of information, ranging from 1 or 2 bits to up to several kilobytes. Therefore, many types of information can be encoded, including materials, manufacturer names, manufacturing dates, and / or unique identifiers for the cushioning pad (e.g., serial numbers). Where available, detailed identification data (such as unique identifiers for the cushioning pad) can be used for a variety of purposes. For example, in some embodiments, the cushioning component may be ( wholly or partially) made of foam and / or elastic materials that may degrade due to material aging after prolonged use or even in the absence of use (e.g., becoming rigid or excessively flexible). In embodiments where the identification data uniquely identifies a particular cushioning component (e.g., by a serial number), the personal audio device or associated host device can monitor and track the usage history of the cushioning component, for example, by tracking cumulative usage hours. In some embodiments, the personal audio device or associated host device can generate a notification to the user when the usage history indicates that the cushioning component may need maintenance (e.g., cleaning) or replacement. Similarly, if the identification data provides information that can be used to determine the lifespan of the cushioning component (e.g., manufacturing date), the personal audio device or associated host device can determine whether the cushioning component should be replaced due to its lifespan (with or without referencing any usage history information). In some implementations, usage monitoring can be performed using cushioning pad identification data at a finer granularity. For example, see... Figure 25 It can be assumed that a particular user only has a set of large red earpiece ends from the manufacturer MFR 1, and monitoring can be based on this assumption.

[0180] For example, where the identification data uniquely identifies a specific buffer, the behavior of a personal audio device can be modified based on specific user preferences when the specific buffer is identified as attached. For instance, when a specific buffer is attached, the user can adjust equalizer settings, noise cancellation preferences, volume settings, volume limits, or other operating parameters of the personal audio device. In some embodiments, the personal audio device (or the host device with which the personal audio device interacts) can store user preferences in association with the buffer's identification data. The next time the same buffer is identified by the personal audio device (or by the host device, as appropriate), the stored user preferences can be automatically retrieved and applied. In other embodiments, user preferences can be stored in association with identification data at a smaller granularity; for example, user preferences can be stored in association with a specific device category rather than an identifier of a specific buffer, and the stored preferences can be applied whenever the buffer is identified as having that device category. In some embodiments, the host device storing user preferences associated with a specific buffer (or device category) can share the stored preferences with other devices that can act as host devices (e.g., other personal electronic devices belonging to the same user). Therefore, users can easily transfer user preferences associated with a specific buffer component (or device category) to another host device.

[0181] In some implementations, the buffer component (referred to herein as an "advanced" buffer component) may include an active circuitry system that enables additional capabilities beyond cushioning and / or sound insulation. For example, one or more sensors may be embedded in the buffer component to detect a user's pulse, temperature, perspiration, or other biometric information. (The specific type or capability of the sensors embedded in the buffer component may vary as needed.) Identification data for the advanced buffer component may include data indicating specific capabilities of the advanced buffer component (e.g., the sensor type of the embedded sensor), and the earpiece (and / or host device) may modify its behavior accordingly. For example, the earpiece may enable power supply to the buffer component when an advanced buffer component is identified, and otherwise disable power supply. As another example, based on the identification data for a specific buffer component, the earpiece (or host device) may determine when to read sensor data from the buffer component and / or how to interpret the received sensor data. It should be understood that a wide variety of advanced capabilities may be selectively enabled or disabled based on identification data obtained from a specific buffer component.

[0182] 4. Additional Implementation Plan

[0183] Although the invention has been described in conjunction with specific embodiments, those skilled in the art will recognize that many modifications are possible. For example, while this specification refers to an earphone end that can be at least partially positioned within the user's ear canal and a cushioning pad that can be worn on or above the ear, similar principles can be applied to any cushioning component that can be detachably attached to a personal audio device. The specific size and shape of the cushioning component or earphone can be modified as needed.

[0184] The amount, content, and format of identification data or information can vary as needed. Identification data can range from small amounts of data (e.g., two or three bits) of a specified size or color to arbitrarily long numbers (e.g., represented as bit strings) that uniquely identify a particular buffer component. In some implementations, the identification data can be structured. For example, if the identification data is represented as a bit string, one part of the bit string might identify the device category, another part might identify the manufacturer, and so on. Lookup tables and similar methods can also be used to map arbitrary numerical identification data to specific combinations of buffer component characteristics.

[0185] As described above, the identification data can be used to modify device behavior, including sound generation by the earpiece, user interface features, and the interaction between the earpiece and the buffer components (e.g., reading sensor data). The identification data can also be used to monitor the condition of specific buffer components and notify the user when a buffer component may benefit from maintenance (e.g., cleaning) or replacement. Other behavioral modifications and / or user support operations can be implemented based on the identification data.

[0186] Some of the above-described embodiments involve a single earpiece and a single buffer component. It should be understood that a personal audio device may include a pair of earpieces with similar designs (e.g., such as...). Figure 1 and Figure 2 (As shown), and the buffer components can also be provided in pairs with a similar design. When buffer components are provided in pairs, an identification tag can be included in either or both of the buffer components, and a reader circuitry for reading the identification tag can be included in either or both handsets. If the reader circuitry in a pair of handsets detects a difference in identification data (e.g., identification data indicating different device categories or sizes) between their respective buffer components, various response actions can be taken. For example, the user can be notified of the difference; the audio settings of the two handsets can be modified differently based on the identification data of the respective buffer components of the two handsets; or the audio settings of the two handsets can be selected based on a mixed audio setting associated with the two buffer components.

[0187] The various functions described herein, such as methods, apparatuses, computer-readable media, etc., can be implemented using any combination of dedicated components and / or programmable processors and / or other programmable devices. The various processes described herein can be implemented on the same or different processors in any combination. Where a component is described as being configured to perform certain operations, such configuration can be implemented, for example, by designing electronic circuits to perform the operations, by programming programmable electronic circuits (such as microprocessors) to perform the operations, or any combination thereof. Furthermore, while the above embodiments may refer to specific hardware and software components, those skilled in the art will understand that different combinations of hardware and / or software components can also be used, and specific operations described as being implemented in hardware may also be implemented in software, and vice versa.

[0188] Computer programs incorporating the features described herein can be encoded and stored on a variety of computer-readable storage media; suitable media include magnetic disks or magnetic tapes, optical storage media such as optical discs (CDs) or DVDs (Digital Universal Optical Discs), flash memory, and other non-transitory media. The computer-readable medium encoded with program code can be packaged together with a compatible electronic device, or the program code can be provided independently of the electronic device (e.g., downloaded via the Internet or as a separately packaged computer-readable storage medium).

[0189] In some implementations, identification data can uniquely identify a specific buffer component belonging to a particular user; in this case, identification data can be considered personally identifiable information. It is well known that the use of personally identifiable information should comply with privacy policies and practices generally recognized as meeting or exceeding industry or governmental requirements for protecting user privacy. Specifically, personally identifiable information should be managed and processed to minimize the risk of unintentional or unauthorized access or use, and the nature of authorized use should be clearly indicated to the user. For example, in some implementations, it is not necessary to provide identification data for the buffer or end to any entity other than the handset or (optionally) the host device owned by the user with which the handset interacts. The user may be notified and prompted to opt into any data sharing that may occur.

[0190] Therefore, although the invention has been described with respect to specific embodiments, it should be understood that the invention is intended to cover all modifications and equivalents within the scope of the following claims.

Claims

1. A cushioning member for an earpiece of a personal audio device, the cushioning member comprising: a body having a first surface and a second surface, the first surface to be placed in contact with an ear region of a user, at least the first surface made of a compliant material; an attachment structure disposed on the second surface and configured to attach the cushioning member to an earpiece of a personal audio device; and an identification tag disposed at or near the second surface such that, when the cushioning member is attached to the earpiece, the identification tag is proximate to a tag sensor disposed in the earpiece, wherein the identification tag encodes identification data of the cushioning member, and wherein the identification tag comprises a magnetic shunt having a shape that encodes the identification data.

2. The cushioning member of claim 1, wherein the body is shaped as an ear cushion for a headphone.

3. The cushioning member of claim 1, wherein the body is shaped as an ear tip for an earbud headphone.

4. The cushioning member of claim 1, wherein the identification data comprises data indicative of one or more of: a size of the cushioning member; a color of the cushioning member; a device class of the cushioning member; a manufacturer of the cushioning member; a model identifier of the cushioning member; a unique identifier of the cushioning member; or an active capability supported by the cushioning member.

5. The cushioning member of claim 1, wherein the identification tag comprises an arrangement of one or more magnets that encode the identification data.

6. The cushioning member of claim 1, wherein the identification tag comprises an inductive coil tuned to a resonant frequency, wherein the resonant frequency maps to the identification data.

7. The cushioning member of claim 1, wherein the identification tag comprises a surface optically encoded with the identification data.

8. The cushioning member of claim 1, wherein the identification tag comprises a passive near field communication (NFC) or radio frequency identification (RFID) tag encoded with the identification data.

9. The cushioning member of claim 1, wherein the identification tag comprises a pattern of metallic or non-metallic regions, wherein the presence or absence of metal in each region encodes the identification data.

10. The cushioning member of claim 1, wherein the identification tag comprises a feature that affects an acoustic property of the cushioning member.

11. The cushioning member of claim 1, wherein the identification tag comprises one or more electrical contacts.

12. The cushioning member of claim 1, wherein the identification tag is disposed within or on the attachment structure.

13. An earpiece for a personal audio device, the earpiece comprising: a housing having a proximal surface; a speaker disposed in the housing; an attachment structure disposed on the proximal surface and configured to attach to a cushioning member; and an identification tag disposed at or near the proximal surface such that, when the earpiece is attached to the cushioning member, the identification tag is proximate to an identification tag sensor disposed in the cushioning member, wherein the identification tag encodes identification data of the earpiece, and wherein the identification tag comprises a magnetic shunt having a shape that encodes the identification data. a tag sensor disposed at or near the proximal surface and configured to generate a signal in response to an identification tag of the cushioning member; an identification logic component coupled to the tag sensor and configured to determine identification data of the cushioning member based on the signal from the tag sensor; and a controller coupled to the identification logic component and configured to receive the identification data from the identification logic component, wherein the attachment structure comprises one or more magnets, and the tag sensor comprises a magnetic sensor configured to determine a geometric feature of a shunt element attached to the one or more magnets.

14. The earpiece of claim 13, wherein the controller is further configured to modify a device behavior of the earpiece in response to the identification data.

15. The earpiece of claim 13, further comprising a communication interface, wherein the controller is further configured to communicate the identification data to a host device.

16. The earpiece of claim 13, wherein the housing is shaped as an ear cup.

17. The earpiece of claim 13, wherein the housing is shaped as an earbud.

18. The earpiece of claim 13, wherein the identification data comprises data indicative of one or more of: a size of the cushioning member; a color of the cushioning member; a device class of the cushioning member; a manufacturer of the cushioning member; a model identifier of the cushioning member; a unique identifier of the cushioning member; or an active capability supported by the cushioning member.

19. The earpiece of claim 13, wherein, the magnetic sensor is configured to determine a magnetic orientation of each of one or more magnets of the identification tag.

20. The earpiece of claim 13, wherein the tag sensor comprises a tuner circuit, and the identification logic component is configured to operate the tuner circuit to determine a resonant frequency of a resonant circuit of the identification tag.

21. The earpiece of claim 13, wherein the tag sensor comprises a light source and a light detector configured to read an optically encoded surface of the identification tag.

22. The earpiece of claim 13, wherein the tag sensor comprises an active near- field reader circuit configured to read a passive near-field tag of the identification tag.

23. The earpiece of claim 13, wherein the tag sensor comprises one or more electrical contacts.

24. The earpiece of claim 13, wherein the tag sensor comprises an array of resonant coils, and the identification logic component is configured to detect an influence of the identification tag on each of the resonant coils.

25. The earpiece of claim 13, wherein the tag sensor comprises a microphone, and the identification logic component is configured to drive the speaker to produce a sound and analyze an acoustic response from the microphone, wherein the acoustic response is influenced by the identification tag.

26. The earpiece of claim 13, wherein the tag sensor is disposed within or on the attachment structure.

27. A cushioning member for an earpiece of a personal audio device, the cushioning member comprising: a body having a first surface and a second surface, the first surface to be placed in contact with an ear region of a user, at least the first surface made of a compliant material; and a first magnetic attachment structure disposed on the second surface and configured to attach the cushioning member to an earpiece of a personal audio device, wherein a geometric property of the first magnetic attachment structure encodes identification data of the cushioning member.

28. The cushioning member of claim 27, wherein the first magnetic attachment structure comprises a metal plate that shunts a magnetic field.

29. The cushioning member of claim 27, wherein the geometric property comprises a size of the first magnetic attachment structure.

30. The cushioning member of claim 27, wherein the geometric property comprises a presence or absence of a gap or a slit in the first magnetic attachment structure.

31. The cushioning member of claim 27, wherein a plurality of magnetic attachment structures, including the first magnetic attachment structure, are disposed on the second surface, and wherein a respective geometry of each of the plurality of magnetic attachment structures encodes at least one bit of identification data.

32. The cushioning member of claim 31, wherein the body of the cushioning member has a corner region, and one of the plurality of magnetic attachment structures is positioned in each of the corner regions.

33. An earpiece for a personal audio device, the earpiece comprising: a housing having a proximal surface; a speaker disposed in the housing; a first magnetic attachment structure disposed on the proximal surface and configured to attach to a cushioning member, the cushioning member comprising a second magnetic attachment structure having a geometric property, the geometric property encoding identification data of the cushioning member; a first tag sensor disposed at or near the proximal surface and configured to generate a signal in response to being affected by a magnetic flux of the geometric property of the second magnetic attachment structure when the cushioning member is attached; an identification logic component coupled to the first tag sensor and configured to determine identification data of the cushioning member based at least in part on the signal from the first tag sensor; and a controller coupled to the identification logic component and configured to receive the identification data from the identification logic component.

34. The earpiece of claim 33, wherein the second magnetic attachment structure comprises a magnetic shunt element, and the first magnetic attachment structure comprises an array of magnets configured to form a magnetic flux loop when the magnetic shunt element is proximate to the array of magnets.

35. The earpiece of claim 34, wherein the array of magnets is configured such that, depending on a geometric property of the magnetic shunt element, the magnetic flux loop is directed through or away from the first tag sensor.

36. The earpiece of claim 35, wherein the first tag sensor comprises a Hall effect sensor placed adjacent to the array of magnets.

37. The earpiece of claim 35, wherein the first tag sensor comprises a Hall effect sensor placed between two magnets in the array of magnets.

38. The earpiece of claim 33, wherein the first tag sensor comprises a Hall effect sensor.

39. The earpiece of claim 33, wherein a plurality of magnetic attachment structures, including the first magnetic attachment structure, are disposed on the proximal surface, and each magnetic attachment structure of the plurality of magnetic attachment structures has an associated tag sensor.

40. The earpiece of claim 39, wherein each of the tag sensors provides at least one bit of identification data to the identification logic.

41. An earpiece system for a personal audio device, the earpiece system comprising: a cushioning member having: a body having a first surface and a second surface, the first surface to be placed in contact with an ear region of a user, at least the first surface made of a compliant material; and a first cushion pad side magnetic attachment structure disposed on the second surface and configured to attach the cushioning member to an earpiece of a personal audio device, wherein a geometric property of the first cushion pad side magnetic attachment structure encodes identification data of the cushioning member; and an earpiece having: a housing having a proximal surface; a speaker disposed in the housing; a first earpiece side magnetic attachment structure disposed on the proximal surface and configured to attach to the first cushion pad side magnetic attachment structure; a first tag sensor disposed at or near the proximal surface and configured to generate a signal in response to a magnetic flux affected by attachment of the cushioning member; an identification logic coupled to the first tag sensor and configured to determine identification data of the cushioning member based at least in part on the signal from the first tag sensor; and a controller coupled to the identification logic and configured to receive the identification data from the identification logic.

42. The earpiece system of claim 41, wherein the first cushion pad side magnetic attachment structure comprises a metal plate that shunts a magnetic field.

43. The earpiece system of claim 41, wherein the geometric property comprises a size of the first cushion pad side magnetic attachment structure.

44. The earpiece system of claim 41, wherein the geometric characteristic comprises the presence or absence of a gap or a split in the first cushion-side magnetic attachment structure.

45. The earpiece system of claim 41, wherein the first earpiece-side magnetic attachment structure comprises an array of magnets configured to form a magnetic flux loop when the first cushion-side magnetic attachment structure of the cushioning member is proximate to the array of magnets.

46. The earpiece system of claim 45, wherein the first tag sensor comprises a Hall effect sensor positioned adjacent to one or more of the magnets in the array of magnets.

47. The earpiece system of claim 41, wherein a plurality of cushion-side magnetic attachment structures, including the first cushion-side magnetic attachment structure, are disposed on the second surface of the cushioning member, and wherein a respective geometry of each of the plurality of cushion-side magnetic attachment structures encodes at least one bit of identification data; and a plurality of earpiece-side magnetic attachment structures, including the first earpiece-side magnetic attachment structure, are disposed on the proximal surface, and each of the plurality of earpiece-side magnetic attachment structures has an associated tag sensor.

48. A method of modifying device behavior, the method comprising: detecting, by an earpiece of a personal audio device, the presence of a cushioning member; operating, by the earpiece of the personal audio device, reader circuitry to read identification data from an identification tag located on the cushioning member; and modifying device behavior based at least in part on the identification data, wherein the identification tag comprises a magnetic shunt having a shape that encodes the identification data.

49. The method of claim 48, wherein the earpiece of the personal audio device transmits the identification data to a host device.

50. The method of claim 48, wherein modifying the device behavior comprises modifying behavior of a host device that interacts operatively with the personal audio device.

51. The method of claim 50, wherein the host device provides a graphical user interface, and modifying the device behavior comprises modifying an image of the personal audio device in the graphical user interface based at least in part on the identification data.

52. The method of claim 48, wherein modifying the device behavior comprises one or more of: modifying equalizer settings of the personal audio device; modifying active noise cancellation profiles of the personal audio device; applying a sound filtering algorithm to the personal audio device; modifying volume limits of the personal audio device; or applying saved user preferences associated with the identification data.

53. The method of claim 48, wherein the identification data comprises data indicating whether the cushioning member supports an advanced capability, and wherein modifying the device behavior comprises enabling or disabling the advanced capability based on the identification data.

54. The method of claim 48, wherein the identifying data includes data indicative of a size of the buffering member, and wherein modifying the device behavior includes using the size of the buffering member in a buffering member adaptation process.

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