Electrode defect detection method, device, electronic device and storage medium
By adjusting the magnetic flux value and detecting the coil position, the electrodes are scanned in multiple directions, which solves the problem of poor visual detection in specific scenarios, and realizes efficient detection of electrode surface defects, especially the fine cracks on the surface of the electrode ears .
Patent Information
- Application Number
- CN202210434501.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2022-04-24
- Publication Date
- 2025-01-03
- Estimated Expiration
- 2042-04-24
AI Technical Summary
During the production process of lithium batteries, visual detection is poor in some scenarios or cannot detect defects on the electrode surface, especially when the surface has occlusion, detection features are inside the gap, fine cracks, poor texture imaging quality or strong reflection.
The electrode is scanned in the first and second directions by using the initial flux value, and the magnetic flux value and the position of the detection coil are adjusted according to the initial defect parameters, so that the electrode surface defect is located in the target scanning area, and a secondary scan is performed to determine the surface defect. .
The ability to detect electrode surface defects that cannot be detected by traditional visual detection, especially fine cracks on the surface of the pole ear, improves the sensitivity and accuracy of the detection.
Smart Images
Figure CN114813914B_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the field of computer technology, and in particular to electrode defect detection methods, devices, electronic equipment and storage media. Background Art
[0002] At present, most of the quality inspections in the lithium battery production process adopt visual solutions, using 2D cameras with a variety of unique light sources to image, and then using complex algorithms to determine defective products. Alternatively, 3D cameras are used to scan the product surface and 3D algorithms are used to identify the defect location.
[0003] However, visual inspection is greatly limited in some scenarios, for example, the product surface is blocked, the inspection feature is inside the gap, the inspection surface is just a small crack, the surface texture imaging quality is poor, the surface produces strong reflections, the color of the defective part is consistent with the scene, etc. In the above scenarios, the effect of using visual inspection is relatively poor or it cannot be detected. Summary of the invention
[0004] The present application provides an electrode defect detection method, device, electronic device and storage medium to solve the problem that visual detection is poor or cannot be detected in some scenarios. The technical solution of the present application is as follows:
[0005] According to a first aspect of an embodiment of the present application, a method for detecting electrode defects is provided, the method comprising: scanning an electrode in a first direction and a second direction respectively with an initial magnetic flux value to obtain initial defect parameters for characterizing surface defects of the electrode; adjusting the initial magnetic flux value according to the initial defect parameters to obtain a target magnetic flux value; adjusting the relative position of the electrode and a detection coil according to the initial defect parameters so that the surface defect of the electrode is located within a target scanning area of the detection coil; scanning the electrode a second time with the target magnetic flux value; and determining the surface defect of the electrode based on a result of the second scan.
[0006] Furthermore, the first direction and the second direction are perpendicular to each other.
[0007] Furthermore, the initial defect parameters include the properties, shape and size of the defects initially detected. Accordingly, adjusting the initial magnetic flux value according to the initial defect parameters to obtain the target magnetic flux value includes: adjusting the initial magnetic flux value according to the properties, shape and size of the defects initially detected to obtain the target magnetic flux value.
[0008] Furthermore, the initial defect parameters include an initial defect position. Accordingly, adjusting the relative position of the electrode and the detection coil based on the initial defect parameters so that the surface defect of the electrode is located within the target scanning area of the detection coil includes: keeping the position of the detection coil unchanged, and moving the electrode according to the initial defect position so that the surface defect of the electrode is located within the target scanning area of the detection coil.
[0009] Furthermore, the initial defect parameters include an initial defect position. Accordingly, adjusting the relative position of the electrode and the detection coil based on the initial defect parameters so that the surface defect of the electrode is located within the target scanning area of the detection coil includes: keeping the position of the electrode unchanged, and moving the detection coil according to the initial defect position so that the surface defect of the electrode is located within the target scanning area of the detection coil.
[0010] Furthermore, scanning the electrode a second time with the target magnetic flux value includes: determining a scanning direction corresponding to when initial defect parameters of the surface defects of the electrode are obtained; and scanning the electrode a second time with the same scanning direction and with the target magnetic flux value.
[0011] Furthermore, determining the surface defect of the electrode according to the result of the secondary scan includes: comparing the result of the secondary scan with a preset standard pattern to determine the surface defect of the electrode.
[0012] According to a second aspect of an embodiment of the present application, an electrode defect detection device is provided, the device comprising: an electromagnetic scanning module, used to scan the electrode in a first direction and a second direction respectively with an initial magnetic flux value to obtain initial defect parameters for characterizing the surface defects of the electrode; a magnetic flux value adjustment module, used to adjust the initial magnetic flux value according to the initial defect parameters to obtain a target magnetic flux value; a position adjustment module, used to adjust the relative position of the electrode and the detection coil according to the initial defect parameters so that the surface defect of the electrode is located within a target scanning area of the detection coil; a secondary scanning module, used to scan the electrode for a secondary time with the target magnetic flux value; and a surface defect determination module, used to determine the surface defect of the electrode based on a result of the secondary scanning.
[0013] According to a third aspect of an embodiment of the present application, an electronic device is provided, comprising: a processor; and a memory for storing instructions executable by the processor; wherein the processor is configured to execute the instructions to implement a method as described in any one of the above-mentioned first aspects.
[0014] According to the fourth aspect of the embodiments of the present application, a computer-readable storage medium is provided. When the instructions in the storage medium are executed by a processor of an electronic device, the electronic device can execute any method described in the first aspect of the embodiments of the present application.
[0015] According to a fifth aspect of the embodiments of the present application, a computer program product comprising instructions is provided, which, when executed on a computer, enables the computer to execute any of the methods described in the first aspect of the embodiments of the present application.
[0016] The technical solution provided by the embodiments of the present application brings at least the following beneficial effects:
[0017] In an embodiment of the present application, the electrode is scanned in the first direction and the second direction respectively with the initial magnetic flux value to obtain the initial defect parameters for characterizing the surface defects of the electrode, the initial magnetic flux value is adjusted according to the initial defect parameters to obtain the target magnetic flux value, the relative position of the electrode and the detection coil is adjusted according to the initial defect parameters so that the surface defects of the electrode are located within the target scanning area of the detection coil, the electrode is scanned a second time with the target magnetic flux value, and the surface defects of the electrode are determined according to the result of the second scan. In this way, defects on the electrode surface that cannot be detected by traditional visual inspection can be detected, especially defects on the surface of the pole lug that cannot be detected by visual inspection can be detected, for example, fine cracks that may occur on the surface of the pole lug can be detected.
[0018] It should be understood that the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the present application. BRIEF DESCRIPTION OF THE DRAWINGS
[0019] The drawings herein are incorporated into the specification and constitute a part of the specification, illustrate embodiments consistent with the present application, and together with the specification are used to explain the principles of the present application, and do not constitute an improper limitation on the present application.
[0020] Figure 1 It is a flow chart of an electrode defect detection method provided in an embodiment of the present application;
[0021] Figure 2 is a schematic diagram of a system for performing eddy current detection on an electrode using a detection coil provided in an embodiment of the present application;
[0022] Figure 3 is a schematic diagram of applying a segmented excitation current to an electrode provided in an embodiment of the present application;
[0023] Figure 4 It is a schematic diagram comparing the eddy current test results of qualified products and abnormal products provided in the embodiment of the present application;
[0024] Figure 5 It is a schematic diagram of the relationship between electrode surface defects and eddy current detection results provided in an embodiment of the present application;
[0025] Figure 6 is a schematic diagram comparing eddy current detection results of surface defects of different depths provided in an embodiment of the present application;
[0026] Figure 7 It is a schematic diagram of the relationship between the crack direction and the eddy current flow direction and the difficulty of eddy current detection provided by the embodiment of the present application;
[0027] Figure 8 is a structural schematic diagram of an electrode defect detection device provided in an embodiment of the present application;
[0028] Fig. 9 It is a block diagram of an electronic device of the pole piece detection method provided in an embodiment of the present application. DETAILED DESCRIPTION
[0029] In order to enable ordinary persons in the art to better understand the technical solution of the present application, the technical solution in the embodiments of the present application will be clearly and completely described below in conjunction with the accompanying drawings.
[0030] It should be noted that the terms "first", "second", etc. in the specification and claims of the present application and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the data used in this way can be interchangeable where appropriate, so that the embodiments of the present application described herein can be implemented in an order other than those illustrated or described herein. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with the present application. On the contrary, they are merely examples of devices and methods consistent with some aspects of the present application as detailed in the attached claims.
[0031] It should be noted that the user information (including but not limited to user device information, user personal information, etc.) and data (including but not limited to data for display, data for analysis, etc.) involved in this application are all information and data authorized by the user or fully authorized by all parties.
[0032] At present, most of the quality inspections in the lithium battery production process adopt visual solutions, using 2D cameras with a variety of unique light sources to image, and then using complex algorithms to determine defective products. Alternatively, 3D cameras are used to scan the product surface and 3D algorithms are used to identify the defect location.
[0033] However, visual inspection is greatly limited in some scenarios, for example, the product surface is blocked, the inspection feature is inside the gap, the inspection surface is just a small crack, the surface texture imaging quality is poor, the surface produces strong reflections, the color of the defective part is consistent with the scene, etc. In the above scenarios, the effect of using visual inspection is relatively poor or it cannot be detected.
[0034] Based on this, the present application embodiment provides an electrode defect detection method, such as Figure 1 As shown, the method comprises the following steps:
[0035] S101: Scanning the electrode in a first direction and a second direction respectively with an initial magnetic flux value to obtain initial defect parameters for characterizing surface defects of the electrode;
[0036] In an embodiment of the present application, the initial magnetic flux value can be determined based on the thickness of the electrode and the distance between the detection coil and the electrode. Specifically, a relationship table can be established in advance, and the relationship table is used to characterize the corresponding relationship between the thickness of the electrode, the distance between the detection coil and the electrode, and the initial magnetic flux value. In actual testing, the thickness of the electrode and the distance between the detection coil and the electrode can be obtained first, and then the corresponding initial magnetic flux value can be determined according to the relationship table.
[0037] The surface defects may be surface impurities, surface cracks and other defects, and the initial defect parameters may include the nature, shape and size of the initially detected defects, as well as the initial defect position of the defects.
[0038] In the embodiments of the present application, Figure 2 As shown, the electrode (i.e., workpiece) can be subjected to eddy current testing (ET) by using a detection coil. The principle is that an eddy current is generated in the electrode by using a detection coil. Due to changes in various factors (such as defects, etc.) in the electrode, the eddy current will change. Therefore, the change in the eddy current can be measured with the help of the detection coil to detect surface defects of the electrode piece.
[0039] In actual testing, the detection coil does not need to contact the electrode, nor does it require a coupling agent, making it easy to achieve efficient automated testing, and has a high detection sensitivity for defects on the electrode surface and near the surface. Since the detection signal is an electrical signal, the detection result can be digitized, then stored, reproduced, and data processed and compared.
[0040] It should be noted that there should be no other metal materials (for example, metal pressure plates, metal shields, metal bottom shells) near the detection scene to avoid interference from other metal materials.
[0041] In a specific embodiment, the detection coil is used to apply the following to the two electrodes (qualified products and abnormal products) respectively: Figure 3 The segmented excitation current shown can be obtained as Figure 4 The test results shown in the figure are from Figure 4 It can be seen that for qualified products, the curve is generally stable, while for abnormal products, the curve fluctuates.
[0042] In a specific embodiment, Figure 5 As shown, changes in the height (at each step) and width (at φ1.5φ3) of metal materials such as electrodes will cause changes in the magnetic flux curve.
[0043] Based on this, taking defects with constant width and different depths as an example, ensuring that other parameters such as input excitation, material, boundary conditions, etc. are the same, the time-magnetic flux intensity curve at the center of the bottom of the detection coil is obtained (such as Figure 6 As shown in Figure 2, it can be seen that the depths of the surface defects of the three samples are different, and the fluctuation degrees of the corresponding curves are also different.
[0044] In the embodiment of the present application, the first direction is different from the second direction.
[0045] In actual testing, the relationship between the crack direction and the eddy current flow direction also affects the difficulty of testing. For example, Figure 7 As shown in the figure, when the direction of the crack is parallel to the eddy current flow direction, the crack will be difficult to detect, and when the direction of the crack is perpendicular to the eddy current flow direction, the crack is easy to detect. Therefore, by scanning from two directions, the situation where some defects cannot be detected due to detection from a single direction can be avoided.
[0046] Preferably, the first direction and the second direction are perpendicular to each other. For example, when the first direction is a horizontal direction, the second direction may be a vertical direction.
[0047] S103: adjusting the initial magnetic flux value according to the initial defect parameter to obtain a target magnetic flux value;
[0048] In the embodiment of the present application, the initial defect parameters may include the nature, shape and size of the initially detected defect. Accordingly, adjusting the initial magnetic flux value according to the initial defect parameters to obtain the target magnetic flux value (i.e., step S103) may include:
[0049] According to the properties, shapes and sizes of the defects initially detected, the initial magnetic flux value is adjusted to obtain a target magnetic flux value.
[0050] In the embodiment of the present application, a parameter library may be pre-established, wherein target magnetic flux values corresponding to various defects are pre-stored in the parameter library. For example, if the defect is initially detected to be a scratch, the target magnetic flux value corresponding to the scratch defect may be called from the parameter library.
[0051] The parameter library can be specifically established in the following manner: prepare a number of standard samples in advance, and for each standard sample, its defect parameters and the corresponding standard test curve are known; then, test each standard sample, and adjust the flux value during the test so that the test result is basically consistent with the situation reflected by each standard sample. At this time, the corresponding flux value is the flux value suitable for detecting the defects reflected by the standard sample; finally, the defects of the standard sample and the flux value suitable for detecting the corresponding defects are recorded in the parameter library in a one-to-one correspondence manner for subsequent calls.
[0052] S105: adjusting the relative position of the electrode and the detection coil according to the initial defect parameter so that the surface defect of the electrode is located within the target scanning area of the detection coil;
[0053] In the embodiment of the present application, by making the surface defect of the electrode located within the target scanning area of the detection coil, the surface defect of the electrode can be prevented from being eccentric when being detected by the detection coil.
[0054] In the embodiment of the present application, the initial defect parameter may include an initial defect position. Accordingly, adjusting the relative position of the electrode and the detection coil according to the initial defect parameter so that the surface defect of the electrode is located within the target scanning area of the detection coil (i.e., step S105) may include:
[0055] Keeping the position of the detection coil unchanged, the electrode is moved according to the initial defect position so that the surface defect of the electrode is located in the target scanning area of the detection coil; or,
[0056] The position of the electrode is kept unchanged, and the detection coil is moved according to the initial defect position, so that the surface defect of the electrode is located within the target scanning area of the detection coil.
[0057] Specifically, the movement of the electrode or the detection coil may be achieved through a mechanical transmission device, thereby achieving adjustment of the relative position of the electrode and the detection coil.
[0058] S107: scanning the electrode a second time with the target magnetic flux value;
[0059] In the embodiment of the present application, the detection coil can also scan the electrode surface through a mechanical transmission device. To ensure detection accuracy, when moving the mechanical transmission device, it is necessary to ensure that the electrode does not swing as much as possible when passing through the detection coil.
[0060] In an embodiment of the present application, the second scanning of the electrode with the target magnetic flux value (i.e., step S107) may include: determining the scanning direction corresponding to when the initial defect parameters of the surface defects of the electrode are obtained; and scanning the electrode for a second time with the same scanning direction and with the target magnetic flux value.
[0061] For example, in step S101, if a surface defect of the electrode is detected in the first direction, then in step S107, the electrode is scanned a second time in the first direction, thereby ensuring that the surface defect of the electrode can be detected and avoiding the inefficiency caused by scanning in two directions.
[0062] S109: Determine the surface defects of the electrode according to the result of the secondary scan.
[0063] In the embodiment of the present application, determining the surface defects of the electrode according to the result of the secondary scan (i.e., step S109) may include:
[0064] The result of the secondary scan is compared with a preset standard pattern to determine the surface defects of the electrode.
[0065] In the embodiment of the present application, the preset standard pattern may be a standard spectrum characterizing various surface defects of the electrode, and specifically may characterize the location, nature, shape, and size of various surface defects of the electrode. Based on this, by comparing the result of the secondary scan (such as the time-magnetic flux intensity curve) with the preset standard pattern, the specific parameters of the surface defects of the electrode may be determined.
[0066] In an embodiment of the present application, the magnetic flux size is adjusted according to the nature, shape and size of the defects on the surface of the electrode preliminarily detected, and it is ensured that the surface defects of the electrode will not be eccentric or change when passing through the detection coil, so that the surface defects of the electrode can be detected more accurately.
[0067] In the embodiments of the present application, defects on the electrode surface that cannot be detected by traditional visual inspection can be detected, especially defects on the lug surface that cannot be detected by traditional visual inspection can be detected. For example, small cracks that may occur on the lug surface can be detected.
[0068] Of course, the electrode defect detection method described in the embodiment of the present application can not only be used to detect surface defects of pole pieces and pole ears, but also to detect welding quality of welding connection components such as battery connecting pieces and poles, as well as to detect metal impurities generated in the production process.
[0069] The present application also provides an electrode defect detection device, such as Figure 8 As shown, the device may include:
[0070] An electromagnetic scanning module 810 is used to scan the electrode in a first direction and a second direction respectively with an initial magnetic flux value to obtain initial defect parameters for characterizing surface defects of the electrode;
[0071] A magnetic flux value adjustment module 820, configured to adjust the initial magnetic flux value according to the initial defect parameter to obtain a target magnetic flux value;
[0072] A position adjustment module 830, configured to adjust the relative position of the electrode and the detection coil according to the initial defect parameter, so that the surface defect of the electrode is located within the target scanning area of the detection coil;
[0073] A secondary scanning module 840, configured to perform a secondary scanning on the electrode with the target magnetic flux value;
[0074] The surface defect determination module 850 is used to determine the surface defects of the electrode according to the result of the secondary scanning.
[0075] In some embodiments, the initial defect parameters include the nature, shape and size of the initially detected defect, and accordingly, the magnetic flux value adjustment module may include:
[0076] The magnetic flux value adjustment unit is used to adjust the initial magnetic flux value according to the properties, shape and size of the defects initially detected to obtain a target magnetic flux value.
[0077] In some embodiments, the initial defect parameter includes an initial defect position, and accordingly, the position adjustment module may include:
[0078] The first position adjustment unit is used to keep the position of the detection coil unchanged and move the electrode according to the initial defect position so that the surface defect of the electrode is located within the target scanning area of the detection coil.
[0079] In some embodiments, the initial defect parameter includes an initial defect position, and accordingly, the position adjustment module may further include:
[0080] The second position adjustment unit is used to keep the position of the electrode unchanged and move the detection coil according to the initial defect position so that the surface defect of the electrode is located within the target scanning area of the detection coil.
[0081] In some embodiments, the secondary scanning module may include:
[0082] A scanning direction determining unit, used to determine a scanning direction corresponding to when initial defect parameters of a surface defect of the electrode are acquired;
[0083] The secondary scanning unit is used to perform a secondary scanning on the electrode in the same scanning direction and at the target magnetic flux value.
[0084] In some embodiments, the surface defect determination module may include:
[0085] The surface defect determination unit is used to compare the result of the secondary scanning with a preset standard pattern to determine the surface defects of the electrode.
[0086] Regarding the device in the above embodiment, the specific manner in which each module performs operations has been described in detail in the embodiment of the method, and will not be elaborated here.
[0087] Fig. 9 is a block diagram of an electronic device of the electrode defect detection method provided in an embodiment of the present application. The electronic device may be a terminal, and its internal structure diagram may be as shown in FIG. Fig. 9 As shown. The electronic device includes a processor, a memory, a model interface, a display screen and an input device connected via a system bus. Among them, the processor of the electronic device is used to provide computing and control capabilities. The memory of the electronic device includes a non-volatile storage medium and an internal memory. The non-volatile storage medium stores an operating system and a computer program. The internal memory provides an environment for the operation of the operating system and the computer program in the non-volatile storage medium. The model interface of the electronic device is used to communicate with an external terminal through a model connection. When the computer program is executed by the processor, the method in the embodiment of the present application is implemented. The display screen of the electronic device can be a liquid crystal display screen or an electronic ink display screen, and the input device of the electronic device can be a touch layer covering the display screen, or a button, trackball or touchpad provided on the housing of the electronic device, or an external keyboard, touchpad or mouse, etc.
[0088] Those skilled in the art will understand that Fig. 9 The structure shown in the figure is merely a block diagram of a partial structure related to the scheme of the present application, and does not constitute a limitation on the electronic device to which the scheme of the present application is applied. The specific electronic device may include more or fewer components than shown in the figure, or combine certain components, or have a different arrangement of components.
[0089] In an exemplary embodiment, an electronic device is also provided, comprising: a processor; and a memory for storing instructions executable by the processor; wherein the processor is configured to execute the instructions to implement the method in the embodiment of the present application.
[0090] In an exemplary embodiment, a computer-readable storage medium is also provided. When instructions in the storage medium are executed by a processor of an electronic device, the electronic device can execute the method in the embodiment of the present application.
[0091] In an exemplary embodiment, a computer program product including instructions is also provided. When the computer program product is run on a computer, the computer is enabled to execute the method in the embodiment of the present application.
[0092] Those skilled in the art can understand that all or part of the processes in the above-mentioned embodiment methods can be completed by instructing the relevant hardware through a computer program, and the computer program can be stored in a non-volatile computer-readable storage medium. When the computer program is executed, it can include the processes of the embodiments of the above-mentioned methods. Among them, any reference to memory, storage, database or other media used in the embodiments provided in this application can include non-volatile and / or volatile memory. Non-volatile memory may include read-only memory (ROM), programmable ROM (PROM), electrically programmable ROM (EPROM), electrically erasable programmable ROM (EEPROM) or flash memory. Volatile memory may include random access memory (RAM) or external cache memory. As an illustration and not limitation, RAM is available in many forms, such as static RAM (SRAM), dynamic RAM (DRAM), synchronous DRAM (SDRAM), double data rate SDRAM (DDRSDRAM), enhanced SDRAM (ESDRAM), synchronous link (Synchlink) DRAM (SLDRAM), memory bus (Rambus) direct RAM (RDRAM), direct memory bus dynamic RAM (DRDRAM), and memory bus dynamic RAM (RDRAM).
[0093] Those skilled in the art will readily appreciate other embodiments of the present application after considering the specification and practicing the invention disclosed herein. The present application is intended to cover any modification, use or adaptation of the present application, which follows the general principles of the present application and includes common knowledge or customary techniques in the art that are not disclosed in the present application. The specification and examples are intended to be exemplary only, and the true scope and spirit of the present application are indicated by the following claims.
[0094] It should be understood that the present application is not limited to the precise structures that have been described above and shown in the drawings, and that various modifications and changes may be made without departing from the scope thereof. The scope of the present application is limited only by the appended claims.
Claims
1. A method for detecting electrode defects, characterized in that: The method comprises: Scanning the electrode in a first direction and a second direction respectively with an initial magnetic flux value to obtain initial defect parameters for characterizing surface defects of the electrode; Adjust the initial magnetic flux value according to the initial defect parameter to obtain a target magnetic flux value; According to the initial defect parameter, adjusting the relative position of the electrode and the detection coil so that the surface defect of the electrode is located within the target scanning area of the detection coil; Scanning the electrode a second time with the target magnetic flux value; According to the result of the secondary scanning, the surface defects of the electrode are determined.
2. The electrode defect detection method according to claim 1, characterized in that: The first direction and the second direction are perpendicular to each other.
3. The electrode defect detection method according to claim 1, characterized in that: The initial defect parameters include the properties, shape and size of the initially detected defects. Accordingly, adjusting the initial magnetic flux value according to the initial defect parameters to obtain the target magnetic flux value includes: According to the properties, shapes and sizes of the defects initially detected, the initial magnetic flux value is adjusted to obtain a target magnetic flux value.
4. The electrode defect detection method according to claim 1, characterized in that: The initial defect parameter includes an initial defect position. Accordingly, adjusting the relative position of the electrode and the detection coil according to the initial defect parameter so that the surface defect of the electrode is located within the target scanning area of the detection coil includes: The position of the detection coil is kept unchanged, and the electrode is moved according to the initial defect position so that the surface defect of the electrode is located within the target scanning area of the detection coil.
5. The electrode defect detection method according to claim 1, characterized in that: The initial defect parameter includes an initial defect position. Accordingly, adjusting the relative position of the electrode and the detection coil according to the initial defect parameter so that the surface defect of the electrode is located within the target scanning area of the detection coil includes: The position of the electrode is kept unchanged, and the detection coil is moved according to the initial defect position, so that the surface defect of the electrode is located within the target scanning area of the detection coil.
6. The electrode defect detection method according to claim 1, characterized in that: The performing a second scanning on the electrode with the target magnetic flux value comprises: Determining a scanning direction corresponding to when initial defect parameters of the surface defect of the electrode are obtained; The electrode is scanned a second time in the same scanning direction and at the target magnetic flux value.
7. The electrode defect detection method according to claim 1, characterized in that: Determining the surface defects of the electrode according to the result of the secondary scanning includes: The result of the secondary scan is compared with a preset standard pattern to determine the surface defects of the electrode.
8. An electrode defect detection device, characterized in that: The device comprises: An electromagnetic scanning module, used to scan the electrode in a first direction and a second direction respectively with an initial magnetic flux value to obtain initial defect parameters for characterizing surface defects of the electrode; A magnetic flux value adjustment module, used for adjusting the initial magnetic flux value according to the initial defect parameter to obtain a target magnetic flux value; A position adjustment module, used for adjusting the relative position of the electrode and the detection coil according to the initial defect parameter, so that the surface defect of the electrode is located within the target scanning area of the detection coil; A secondary scanning module, used for performing a secondary scanning on the electrode with the target magnetic flux value; The surface defect determination module is used to determine the surface defects of the electrode according to the result of the secondary scanning.
9. An electronic device, characterized in that: include: processor; a memory for storing instructions executable by the processor; Wherein, the processor is configured to execute the instructions to implement the electrode defect detection method according to any one of claims 1 to 7.
10. A computer-readable storage medium, characterized in that: When the instructions in the storage medium are executed by a processor of an electronic device, the electronic device is enabled to execute the electrode defect detection method as described in any one of claims 1 to 7.