A computer case

Abstract

The application discloses a computer case, which comprises a case body with a first sidewall and a second sidewall; the first sidewall and the second sidewall are oppositely arranged; the first sidewall comprises a first heat dissipation position; the second sidewall comprises a second heat dissipation position; the proportion of the heat dissipation area of the ventilation and heat dissipation device installed on the first heat dissipation position and the second heat dissipation position is not less than 2:3, or the proportion of the projection area of the ventilation and heat dissipation device installed on the second heat dissipation position and the first heat dissipation position is not less than 2:3; wherein when the guide air flow direction of the ventilation and heat dissipation device installed on the first heat dissipation position and the second heat dissipation position is consistent, a high-efficiency through-type air guide channel can be formed inside the case body. The computer case of the application can increase the heat dissipation area by changing the case structure layout, adding a plurality of heat dissipation positions to install the ventilation and heat dissipation device, and due to the higher matching degree of the ventilation and heat dissipation corresponding position, a more efficient through-type air guide channel can be formed in the case.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of electronic equipment chassis, in particular to a computer chassis. BACKGROUND

[0002] The chassis of a desktop computer mainly bears the stable and fixed installation of the computer motherboard containing CPU, memory, graphics card, solid state disk and other core devices, switching power supply, mechanical hard disk and specific peripherals, while providing external operation ports such as operation keys, restart keys and USB interfaces, so its main function is to accommodate the system and provide protection.

[0003] With the development of electronic information technology, the computing power of desktop computers is becoming stronger and stronger, accompanied by the continuous increase of heat generated by CPU, GPU and other modules of the system, so the requirement for the heat dissipation capacity of the desktop computer system is also getting higher and higher. Therefore, the chassis of the desktop computer also bears the function of carrying the heat exchange device including the system ventilation fan and water cooling heat dissipation. The requirement for heat dissipation of the system also puts forward higher requirements for the ventilation and heat exchange capacity of the computer chassis and the carrying capacity of the water cooling system.

[0004] As shown in Figure 1 The existing technology takes the ATX motherboard specification chassis as an example, which is the most popular one at present. The main ventilation and heat dissipation device positions and specifications are as follows: the front part is provided with a large ventilation installation position, which can usually install three 120*120mm ventilation fans or a water cooling radiator with the above three ventilation fans; the upper part is provided with a ventilation installation position, which can also install three 120*120mm ventilation fans or a water cooling radiator with the above three ventilation fans, or be designed as two 140*140mm ventilation fans or a water cooling radiator with the above two ventilation fans; the rear part of the chassis panel is mainly provided with a mainboard IO port, a power supply heat dissipation port, an expansion card interface including a graphics card, etc. Although there is a fan installation position at the top, there is also a ventilation installation position, which can install a ventilation fan with a maximum size of 140*140mm or a water cooling radiator with the above one ventilation fan.

[0005] The ventilation and heat exchange devices of each ventilation position can provide ventilation and heat exchange power through the fan. According to different needs and design, cold air can be sucked from the outside of the chassis to the inside of the chassis, or hot air can be discharged from the inside of the chassis to the outside of the chassis.

[0006] However, the limited ventilation and heat dissipation positions and the formed air duct cannot form an efficient heat dissipation air duct and discharge the heat flow of the chassis to the outside in time due to the low matching degree of the size and specification of the ventilation and heat dissipation positions.

[0007] The information disclosed in this Background section is only for the purpose of increasing an understanding of the general context of the present application and should not be taken as an acknowledgement or any form of suggestion that this information forms the prior art that is already known in this field. SUMMARY

[0008] The present application aims to provide a computer case which can increase the heat dissipation area by changing the structure layout of the case and adding multiple heat dissipation position mounting ventilation heat dissipation devices without changing the overall volume of the case, and can form a more efficient through-type air guide channel in the case due to the increased ventilation heat dissipation corresponding positions with higher matching degree.

[0009] To achieve the above-mentioned purpose, the present application provides a computer case, which comprises a case main body having a first side wall and a second side wall; the first side wall and the second side wall are oppositely arranged, the first side wall comprises a first heat dissipation position, the second side wall comprises a second heat dissipation position, and the proportion of the heat dissipation area of the ventilation heat dissipation device mounted on the first heat dissipation position and the second heat dissipation position is not less than 2:3, or the proportion of the projection area of the ventilation heat dissipation device mounted on the second heat dissipation position and the first heat dissipation position is not less than 2:3; wherein when the guide air flow direction of the ventilation heat dissipation device mounted on the first heat dissipation position and the second heat dissipation position is set to be consistent, a high-efficiency through-type air guide channel can be formed inside the case main body.

[0010] In a preferred embodiment, the first side wall and the second side wall comprise a complete opening or multiple independent ventilation holes, and the edges of the complete opening or the independent ventilation holes are provided with mounting backing plates, the mounting backing plates are provided with mounting holes, and the mounting holes are used to form the first heat dissipation position and the second heat dissipation position.

[0011] In a preferred embodiment, the case main body further comprises a top wall, a bottom plate, a lower cabin cover, and a main mounting plate; the top wall is arranged at the top of the case main body; the bottom plate is arranged at the bottom of the case main body, and the bottom plate is detachably arranged on the bottom frame; the lower cabin cover is arranged between the top wall and the bottom plate; and the main mounting plate is arranged between the lower cabin cover and the rear edge of the same side of the top wall, the first side wall, and the second side wall.

[0012] In a preferred embodiment, the top wall comprises a complete opening or multiple independent ventilation holes, and the edges of the complete opening or the multiple independent ventilation holes are provided with mounting backing plates, the mounting backing plates are provided with mounting holes, and the mounting holes are used to form a third heat dissipation position which can be used to mount a ventilation heat dissipation device.

[0013] In a preferred embodiment, the lower chamber cover comprises a horizontal partition plate and a vertical stand plate; the horizontal partition plate is arranged between the top wall and the bottom plate in parallel with the bottom plate, and the two ends of the horizontal partition plate abut against the first side wall and the second side wall respectively; the horizontal partition plate comprises a rectangular avoiding opening arranged at the abutting position of the two ends of the horizontal partition plate and the first side wall and the second side wall, and the rectangular avoiding opening is used for avoiding the ventilation and heat dissipation device installed at the first heat dissipation position and the second heat dissipation position; the vertical stand plate is arranged between the same side edge of the horizontal partition plate and the bottom plate in perpendicular to the horizontal partition plate; and the edge of the horizontal partition plate away from the vertical stand plate is fixedly connected with the lower edge of the main mounting plate.

[0014] In a preferred embodiment, the horizontal partition plate comprises an IO hole, a ventilation and heat dissipation hole, and a plurality of PCIE expansion card mounting and fixing positions and a plurality of detachable baffles; the IO hole is arranged on the side of the horizontal partition plate close to the main mounting plate and is correspondingly arranged with the IO part of the computer motherboard; the ventilation and heat dissipation hole is arranged on the side of the horizontal partition plate close to the vertical stand plate, and the edge of the ventilation and heat dissipation hole has a plurality of mounting holes to form a fourth heat dissipation position, which can be used for mounting the ventilation and heat dissipation device; the plurality of PCIE expansion card mounting and fixing positions and the plurality of detachable baffles are arranged on the end of the horizontal partition plate away from the IO hole and the ventilation and heat dissipation hole; and the plurality of PCIE expansion card mounting and fixing positions, the fourth heat dissipation position and the IO hole are arranged on the same side of the main mounting plate facing the vertical stand plate.

[0015] In a preferred embodiment, the bottom plate comprises a power fan mounting position and a fifth heat dissipation position; the power fan mounting position is arranged at the end of the bottom plate close to the second side wall, and a ventilation hole is arranged at the power fan mounting position; the fifth heat dissipation position is arranged at the end of the bottom plate close to the first side wall and at the ventilation hole at the vertical projection position of the fourth heat dissipation position, and the periphery of the ventilation hole has a plurality of mounting holes to form the fifth heat dissipation position, which can be used for mounting the ventilation and heat dissipation device.

[0016] In a preferred embodiment, the case main body further comprises a front side wall, a rear side wall, a front panel, a rear panel, a first side panel, a second side panel and a top plate; the front side wall is arranged on the side of the case main body away from the main mounting plate; the rear side wall is arranged on the side of the case main body close to the main mounting plate; the front panel, the rear panel, the first side panel, the second side panel and the top plate are arranged at the front side wall, the rear side wall, the first side wall, the second side wall and the top wall of the case main body respectively.

[0017] In a preferred embodiment, the rear panel comprises a power ventilation avoiding opening and an IO adapter plate avoiding hole; the power ventilation avoiding opening is arranged at the lower part of the rear panel corresponding to the power ventilation and heat dissipation panel of the power supply, and the power ventilation and heat dissipation panel comprises a power cord socket and a key; the IO adapter plate avoiding hole is arranged at the lower part of the rear panel on the side of the power ventilation avoiding opening, and the IO adapter plate avoiding hole is used for exposing the IO adapter plate arranged on the case main body.

[0018] In a preferred embodiment, the lower part of the main mounting plate is arranged perpendicularly to the horizontal partition plate and forms a first vertical surface, and the lower end of the first vertical surface is fixedly connected to the horizontal partition plate; wherein the fourth heat dissipation position is arranged on one side of the first vertical surface of the main mounting plate, the IO hole is arranged on the other side of the first vertical surface, and the plurality of PCIE expansion card mounting and fixing positions are arranged in parallel on both sides of the first vertical surface respectively; the upper part of the main mounting plate is inclinedly extended to the front side wall to form an inclined plate, the angle between the inclined plate and the first vertical surface is not less than 90 degrees, and a wire passing hole is formed in the inclined plate; the upper end of the inclined plate is bent upward to form a second vertical surface, and the second vertical surface is parallel to the first vertical surface, and the main mounting plate is fixedly connected to the frame of the case body through the second vertical surface.

[0019] Compared with the prior art, the computer case has the following beneficial effects: firstly, the front large and rear small weak effect air duct horizontally arranged in the existing case is retained and changed to vertical arrangement. Further, after being changed to vertical arrangement, the lower cabin with ventilation conditions is formed between the horizontal partition plate and the bottom plate. In addition, the water-cooled radiator assembly of 120*120mm (or 140*140mm) specification fan which cannot be installed with the adjacent 360*120 specification water cooling at the same time in the prior art is installed in the lower cabin on the lower side of the horizontal partition plate, so that the water cooling device and the adjacent 360 water-cooled radiator at a 90-degree angle can be installed and work at the same time under the condition of approximately the size of the case itself, and finally, more water-cooled cooling devices can be installed and used at the same time, thereby increasing the heat dissipation capacity of the system. In addition, the detachable bottom plate of the case corresponding to the fan or water-cooled cooling fan installation position of the horizontal partition plate is also designed with a corresponding cooling installation position, and another corresponding ventilation fan can be installed. Under the joint action of the fans installed on the upper and lower surfaces of the lower cabin, the air flow rate entering or discharged from the bottom of the case can be increased, thereby strengthening the ventilation and heat dissipation effect. At the same time, compared with the traditional technology, the computer case of the present application also increases a complete side wall opening ventilation surface which can install up to three 120*120mm (or two 140*140mm) fans or water-cooled radiator assemblies with the above-mentioned specification fans, so that a through-type horizontal reinforced air duct can be formed with the ventilation and heat dissipation device installed in the opening position corresponding to the side wall of the other case. Since the opening rates of the left and right side walls of the case at the water square position are highly matched, the specifications and the number of the ventilation and heat dissipation devices that can be installed are highly matched, thereby ensuring higher ventilation efficiency. Further, in the current situation of increasing demand for water-cooled cooling, the computer case of the present application can increase a set of water-cooled cooling devices with a maximum specification of 120*360, thereby greatly expanding the heat dissipation capacity of the system. At the same time, the computer case of the present application changes the front and rear layout of the traditional case, and the length direction of the case can be arranged along the length direction of the computer desk when the case is arranged on the desktop, and the case can be placed on the left or right side of the user according to the user's habits or needs, thereby greatly saving the desktop space of the user and improving the visual effect and use experience. BRIEF DESCRIPTION OF DRAWINGS

[0020] Figure 1 is a schematic diagram of the front, rear and top cooling position arrangement of the computer case according to an embodiment of the prior art;

[0021] Figure 2 is a schematic diagram of the top structure of the computer case according to an embodiment of the prior art;

[0022] Figure 3 is a schematic diagram of the rear structure of the computer case according to an embodiment of the prior art;

[0023] Figure 4 is a structural schematic diagram of a front panel of a computer case according to an embodiment of the prior art;

[0024] Figure 5 is an exploded structural schematic diagram of a computer case according to an embodiment of the present application from one perspective;

[0025] Figure 6 is an exploded structural schematic diagram of a computer case according to an embodiment of the present application from another perspective;

[0026] Figure 7 is a three-dimensional structural schematic diagram of a case body according to an embodiment of the present application from one perspective;

[0027] Figure 8 is a three-dimensional structural schematic diagram of a case body according to an embodiment of the present application from another perspective;

[0028] Figure 9 is a rear structural schematic diagram of a case body according to an embodiment of the present application;

[0029] Figure 10 is a front structural schematic diagram of a case body according to an embodiment of the present application;

[0030] Figure 11 is a partial enlarged structural schematic diagram of I of Figure 7

[0031] Figure 12 is a partial enlarged structural schematic diagram of II of Figure 8

[0032] Figure 13 is a front air flow guide schematic diagram of a computer case according to an embodiment of the present application;

[0033] Figure 14 is a back air flow guide schematic diagram of a computer case according to an embodiment of the present application;

[0034] Figure 15 is another back air flow guide schematic diagram of a computer case according to an embodiment of the present application;

[0035] Figure 16 is a horizontal partition layout schematic diagram (I) according to an embodiment of the present application;

[0036] Figure 17 is a horizontal partition layout schematic diagram (II) according to an embodiment of the present application;

[0037] Figure 18 is a structural schematic diagram of a rear panel of a computer case according to an embodiment of the present application;​​

[0038] Figure 19 is a schematic diagram of a detachable bottom plate layout structure according to an embodiment of the present application;

[0039] Figure 20 is a schematic diagram of a rear perspective structure of another embodiment of the main mounting plate according to an embodiment of the present application;

[0040] Figure 21 is a schematic diagram of a front perspective structure of another embodiment of the main mounting plate according to an embodiment of the present application;

[0041] Figure 22 is a schematic diagram of a right perspective structure of another embodiment of the main mounting plate according to an embodiment of the present application.

[0042] Explanation of main reference numerals:

[0043] 10 - computer case, 101 - case main body, 1011 - first heat dissipation position, 1012 - second heat dissipation position, 1013 - third heat dissipation position, 1014 - main mounting plate, 1015 - lower cabin cover, 10151 - fourth heat dissipation position, 10152 - IO hole, 10153 - PCIE expansion card mounting and fixing position, 10154 - horizontal partition plate, 10155 - vertical stand plate, 1016 - power supply assembly, 10161 - power supply ventilation and heat dissipation panel, 1017 - IO adapter plate, 1018 - first vertical surface, 1019 - inclined plate, 1020 - second vertical surface, 102 - front panel, 103 - rear panel, 1031 - power supply ventilation avoiding opening, 1032 - IO adapter plate avoiding hole, 1033 - display card ventilation hole, 104 - first side panel, 105 - second side panel, 1061 - bottom plate, 10611 - fifth heat dissipation position, 10612 - power supply fan mounting position, 1062 - bottom frame, 107 - top plate, 20 - ventilation and heat dissipation device. DETAILED DESCRIPTION

[0044] The specific embodiments of the present application will be described in detail below with reference to the accompanying drawings, but it should be understood that the scope of protection of the present application is not limited by the specific embodiments.

[0045] Unless otherwise clearly indicated, throughout the specification and claims, the term "comprise" or variations such as "comprises" or "comprising" will be understood to imply the inclusion of a stated element or group of elements but not the exclusion of any other element or group of elements.

[0046] It is known that if the fans in different relative positions in a heat dissipation system are driven in the same direction, a reinforced air duct in a certain direction can be formed in the case, the relatively hot air in the case will be more efficiently exhausted under the action of the air duct formed by the fan, and the relatively low-temperature external air will also be more efficiently introduced into the case system, ultimately forming a better air circulation. Under the same internal resistance (the resistance to air flow formed by the equipment in the case), the heat exchange efficiency of the air duct depends on the air volume and air pressure of the fan and the matching degree of the air inlet and outlet at both ends of the air duct.

[0047] As shown in Figures 2 to 4 , with reference to Figure 1 , the three 120*120mm specification fans in the front and the one 120*120mm (or 140*140mm specification) in the rear of the prior art ATX case are located on the two corresponding faces of the cuboid case, and under the action of the fans working in the same direction, a reinforced air duct can be formed. This is the only air duct that can form air suction and air supply in the prior art ATX case. However, at the same time, the matching degree of this air duct is very low, the three fans in the front can only match the position of the one fan in the rear, and only a weak air duct can be formed, the air exhaust efficiency of the air duct is low, and the heat exchange efficiency of the system is greatly affected.

[0048] In terms of the specification of the water-cooled heat sink that can be installed, the specification of the water-cooled heat sink that can be installed in the prior art ATX case can be two 360*120mm specifications (or two 140*280mm) and one 120 specification (or a maximum of 140mm). However, due to the volume of the conventional ATX case, the 120*120mm or 140*140mm specification water-cooled heat sink in the rear cannot be installed and used at the same time as the 360 or 280 specification water-cooled heat sink on the top because of the space required for the water chamber and the water inlet and outlet pipes. That is, the maximum heat dissipation combination that can be formed is the 360*120mm specification water-cooled heat sink in the front, the 360*120mm specification water-cooled heat sink on the top, and the 120*120mm or 140*140mm specification fan in the rear. In terms of the development of computer system heat dissipation needs, in addition to the current CPU and GPU card, the motherboard power supply device, solid state disk, and even the power supply heating device all have the need for water-cooled heat dissipation, and the specification of the water-cooled heat sink that can be installed provided by the prior art is difficult to meet the needs of future computer heat dissipation.

[0049] As shown in Figure 5 , Figure 6 and Figure 12 , Figure 13 , Figure 14 , Figure 15As shown, a computer case 10 according to a preferred embodiment of the present application includes a case body 101 having a first side wall (generally referred to as front side wall in the prior art) and a second side wall (generally referred to as rear side wall in the prior art). The first side wall is opposite to the second side wall, and the first side wall includes a first heat dissipation site 1011, and the second side wall includes a second heat dissipation site 1012. A ventilation and heat dissipation device 20 can be installed on the first heat dissipation site 1011 and the second heat dissipation site 1012, and if the fan of the ventilation and heat dissipation device 20 is arranged in the same direction, a through horizontal air duct can be formed inside the case body 101.

[0050] As shown in Figure 7 and Figure 10 in some embodiments, the first side wall and the second side wall include a complete opening or a plurality of independent ventilation holes, and the edges of the complete opening or the independent ventilation holes are provided with mounting liners having mounting holes for forming the first heat dissipation site 1011 and the second heat dissipation site 1012, and the ventilation and heat dissipation device 20 can be installed on the first heat dissipation site 1011 and the second heat dissipation site 1012. The ventilation and heat dissipation device 20 can generally include a water-cooled heat dissipation assembly and a fan assembly.

[0051] In some embodiments, the first side wall and the second side wall are provided with complete openings, that is, the first heat dissipation site 1011 and the second heat dissipation site 1012 can be formed on the first side wall and the second side wall, and the first heat dissipation site 1011 and the second heat dissipation site 1012 can occupy almost 100% of the area of the first side wall and the second side wall. The ventilation and heat dissipation device 20 can be installed on the first heat dissipation site 1011 and the second heat dissipation site 1012, and the projection heat dissipation area of the ventilation and heat dissipation device 20 can not occupy 100% of the heat dissipation area of the first heat dissipation site 1011 and the second heat dissipation site 1012, for example, but not limited to, 1 / 2 area or 2 / 3 area. However, if an effective through horizontal air duct is to be formed inside the case body 101, the projection heat dissipation area of the ventilation and heat dissipation device 20 installed on the first heat dissipation site 1011 and the second heat dissipation site 1012 is preferably not less than 1 / 2 of the entire heat dissipation area of the first heat dissipation site 1011 and the second heat dissipation site 1012, and the ratio of the projection heat dissipation area of the ventilation and heat dissipation device 20 installed on the first heat dissipation site 1011 to the projection heat dissipation area of the ventilation and heat dissipation device 20 installed on the second heat dissipation site 1012 is preferably not less than 2:3.

[0052] Please refer to Figure 7 and Figure 10In some embodiments, the chassis body 101 further comprises a top wall, a bottom plate 1061, a lower compartment cover 1015, and a main mounting plate 1014. The top wall is disposed at the top of the chassis body 101. The bottom plate 1061 is disposed at the bottom of the chassis body 101. The lower compartment cover 1015 is disposed between the top wall and the bottom plate 1061. The main mounting plate 1014 is disposed between the lower compartment cover 1015 and the rear edge of the same side of the top wall and the first side wall and the second side wall.

[0053] Referring to Figure 7 and Figure 10 In some embodiments, the top wall can also comprise a complete opening or a plurality of independent ventilation holes, the edges of the complete opening or the plurality of independent ventilation holes have mounting gussets with mounting holes for forming a third heat dissipation site 1013 capable of mounting the ventilation heat dissipation device 20. The third heat dissipation site 1013 of the present embodiment is illustrated with the ventilation heat dissipation device 20, but the third heat dissipation site 1013 can be determined according to actual needs whether to install the ventilation heat dissipation device 20, and the present application is not limited thereto.

[0054] As shown in Figure 11 and Figure 12 Referring to Figure 7 and Figure 10 In some embodiments, the lower compartment cover 1015 comprises a horizontal partition plate 10154 and a vertical stand plate 10155. The horizontal partition plate 10154 is disposed between the top wall and the bottom plate 1061 in parallel with the bottom plate 1061, and the two ends of the horizontal partition plate 10154 respectively abut against the first side wall and the second side wall. The horizontal partition plate 10154 comprises a rectangular avoidance opening disposed at the abutment of the two ends of the horizontal partition plate 10154 and the first side wall and the second side wall, and the rectangular avoidance opening is used to avoid the ventilation heat dissipation device 20 installed in the first heat dissipation site 1011 and the second heat dissipation site 1012. The vertical stand plate 10155 is disposed between the same side edge of the horizontal partition plate 10154 and the bottom plate 1061 in perpendicular to the horizontal partition plate 10154. The edge of the horizontal partition plate 10154 away from the vertical stand plate 10155 is fixedly connected to the lower edge of the main mounting plate 1014. The space between the horizontal partition plate 10154 and the bottom plate 1061 forms a lower compartment.

[0055] As shown in Figures 16 to 17As shown, in some embodiments, the horizontal partition plate 10154 includes IO holes 10152, ventilation holes, and a plurality of PCIE expansion card mounting positions 10153 and a plurality of detachable baffle plates. The IO holes 10152 are arranged on one side of the horizontal partition plate 10154 close to the main mounting plate 1014 and correspond to the IO holes of the computer motherboard. The ventilation holes are arranged on one side of the horizontal partition plate 10154 close to the vertical stand plate 10155, and the edges of the ventilation holes have a plurality of mounting holes to form a fourth heat dissipation position 10151, which can be used to mount a ventilation and heat dissipation device 20. The plurality of PCIE expansion card mounting positions 10153 and the plurality of detachable baffle plates are arranged on the end of the horizontal partition plate 10154 away from the IO holes 10152 and the ventilation holes. As shown in Figure 16 As shown, the plurality of PCIE expansion card mounting positions 10153, the fourth heat dissipation position 10151, and the IO holes 10152 are arranged on the same side of the main mounting plate 1014 facing the vertical stand plate 10155.

[0056] As shown in Figure 17 As shown, the fourth heat dissipation position 10151 is arranged on the same side of the main mounting plate 1014 facing the vertical stand plate 10155, the IO holes 10152 are arranged on the other side of the main mounting plate 1014 facing the vertical stand plate 10155, and the plurality of PCIE expansion card mounting positions are arranged in parallel on both sides of the vertical stand plate 10155. Therefore, the PCIE expansion card mounting positions 10153 can be arranged in parallel on both sides of the main mounting plate 1014, one side close to the front panel 102 and the other side close to the rear panel 103. The front panel 102 and the rear panel 103 form two separate vertical spaces with the main mounting plate 1014, and a graphics card can be arranged on the corresponding fixed position on both sides to form a double graphics card mounting to meet higher graphics processing requirements.

[0057] As shown in Figure 16 and Figure 17 In some embodiments, the horizontal partition plate 10154 arranged in the vertical direction can have various forms. The present embodiment only illustrates Figures 16 to 17 two forms, but the present application is not limited thereto. In some embodiments, the PCIE expansion card mounting positions 10153 and the IO holes 10152 are arranged in parallel in the length direction.

[0058] As shown in Figure 19As shown, in some embodiments, the bottom frame 1062 of the chassis body 101 is integrally fixed to the chassis body 101, and the base plate 1061 is detachably mounted on the bottom frame 1062. The base plate 1061 includes a power fan mounting position 10612 and a fifth heat dissipation position 10611. The power fan mounting position 10612 is located at one end of the base plate 1061 near the second side wall, and a ventilation hole is provided at the power fan mounting position 10612. The fifth heat dissipation position 10611 is located at one end of the base plate 1061 near the first side wall, at the ventilation hole located at the vertical projection position of the fourth heat dissipation position 10151. The ventilation hole has a plurality of mounting holes around it to form the fifth heat dissipation position 10611. The fifth heat dissipation position 10611 can be used to install a ventilation and heat dissipation device 20. The bottom frame 1062 and the base plate 1061 are fixedly connected to four bases, which can make the chassis body 101 be raised off the desktop, so as to form a ventilation channel under the base plate 1061 of the chassis body 101.

[0059] Please see Figures 5 to 10 In some embodiments, the chassis body 101 further includes a front sidewall, a rear sidewall, a front panel 102, a rear panel 103, a first side panel 104, a second side panel 105, and a top plate 107. The front sidewall is located on the side of the chassis body 101 away from the main mounting plate 1014. The rear sidewall is located on the side of the chassis body 101 closer to the main mounting plate 1014. The front panel 102, rear panel 103, first side panel 104, second side panel 105, and top plate 107 are respectively located on the front sidewall, rear sidewall, first sidewall, second sidewall, and top wall of the chassis body 101. Ventilation holes are generally provided on the front panel 102, rear panel 103, first side panel 104, second side panel 105, and top plate 107.

[0060] like Figure 18 As shown, in some embodiments, the rear panel 103 includes a power supply ventilation opening 1031 and an I / O adapter board recess hole 1032. The power supply ventilation opening 1031 is located at the lower part of the rear panel 103 corresponding to the power supply ventilation and heat dissipation panel, which includes a power cord connector and a power switch. The I / O adapter board recess hole 1032 is located at the lower part of the rear panel 103 and to one side of the power supply ventilation opening 1031, and is used to expose the I / O adapter board mounted on the chassis body 101. In some embodiments, the rear panel 103 has a vertically extending graphics card ventilation hole at the PCIe expansion card mounting position 10153 to facilitate the cooling of the graphics card mounted vertically at that position.

[0061] like Figures 20 to 22As shown, the chassis body 101' illustrates another embodiment of the chassis body 101', in some embodiments, the main mounting plate 1014' is not an integral flat structure, wherein the lower part of the main mounting plate 1014' is vertically arranged with the horizontal partition plate 10154 and forms a first vertical surface 1018, and the lower end of the first vertical surface 1018 is fixedly connected with the horizontal partition plate 10154. The fourth heat dissipation position 10151 and the plurality of PCIE expansion card mounting and fixing positions 10153 are arranged on the same side of the first vertical surface of the main mounting plate 1014', and the IO hole 10152 is arranged on the other side of the first vertical surface 1018. In addition, the upper part of the main mounting plate 1014' extends to the front side wall to form an inclined plate 1019, the angle between the inclined plate 1019 and the first vertical surface 1018 is not less than 90 degrees, and the inclined plate 1019 is provided with a wire passing hole. The upper end of the inclined plate 1019 is bent upward to form a second vertical surface 1020, and the second vertical surface 1020 is parallel to the first vertical surface 1018, and the main mounting plate 1014' is fixedly connected with the frame of the chassis body 101' through the second vertical surface 1020.

[0062] In summary, the computer chassis of the present application has the following advantages: first, the existing chassis is retained and changed to be vertically arranged. Further, after being changed to be vertically arranged, the lower cabin between the horizontal partition plate and the bottom plate has a ventilation condition. In addition, the water-cooled radiator assembly of the existing technology which cannot be installed with the adjacent 360*120 specification water cooling at the same time is installed in the lower cabin on the lower side of the horizontal partition plate, so that the water-cooled device of the ventilation and heat dissipation position and the adjacent 360 water-cooled radiator at a 90-degree angle can be installed and work at the same time under the condition of the approximate size of the chassis itself, and the final effect is that more water-cooled heat dissipation devices can be installed and used at the same time, and the heat dissipation capacity of the system is increased.

[0063] In addition, the chassis bottom plate corresponding to the fan or water cooling installation position of the horizontal partition plate is also designed with a corresponding fan installation position, and another corresponding ventilation fan can be installed, so that the air flow rate sucked or discharged from the bottom of the chassis is increased under the joint action of the fans installed on the upper and lower surfaces of the lower cabin, and the ventilation and heat dissipation effect is strengthened.

[0064] At the same time, compared with the conventional technology, the computer chassis of the present application also increases a complete side wall opening ventilation surface which can install up to three 120*120mm (or two 140*140mm) fans or water-cooled radiator assemblies with the above specification, so that the ventilation and heat dissipation device installed in the opening position corresponding to the other side wall of the chassis can form a reinforced through horizontal reinforced air guide.

[0065] Due to the high matching of the opening rates of the left and right side walls of the case, the specifications and the number of the installed ventilation and heat dissipation devices are highly matched, so that higher ventilation efficiency is ensured. Furthermore, in the current situation of higher and higher water cooling heat dissipation demand, the computer case of the present application can increase a set of water cooling heat dissipation devices with the highest specification of 120*360, which greatly expands the heat dissipation capacity of the system. Meanwhile, the computer case of the present application changes the front and back layout of the traditional case, and the length direction of the case can be arranged along the length direction of the computer desk when the case is arranged on the desktop, and the case can be placed on the left or right side of the user according to the user's habits or needs, which greatly saves the desktop space of the user and improves the visual effect and use experience.

[0066] The foregoing description of specific exemplary embodiments of the application is intended to be illustrative only and is not intended to limit the application to the precise forms described. Many modifications and variations are possible in light of the above teachings without departing from the spirit or essential characteristics of the application. The exemplary embodiments were chosen and described in order to explain the principles of the application and its practical application and to allow others skilled in the art to understand the application for various exemplary embodiments and with various modifications as are suited to the particular use contemplated. The scope of the application is intended to be defined by the claims and their equivalents.

Claims

1. A computer case, characterized by, The application relates to a computer case, comprising: a case body, which comprises a first side wall and a second side wall, the first side wall and the second side wall are oppositely arranged, the first side wall comprises a first heat dissipation position, the second side wall comprises a second heat dissipation position, and the proportion of the projection area of a ventilation and heat dissipation device arranged on the first heat dissipation position and the second heat dissipation position is not less than 2:3, or the proportion of the projection area of a ventilation and heat dissipation device arranged on the second heat dissipation position and the first heat dissipation position is not less than 2:3; wherein when the ventilation and heat dissipation devices arranged on the first heat dissipation position and the second heat dissipation position are arranged in the same air guiding direction, a through air guiding channel can be formed in the case body; the case body further comprises: a top wall arranged on the top of the case body; a bottom plate arranged on the bottom of the case body, and the bottom plate is detachably arranged on a bottom frame; a lower cabin cover arranged between the top wall and the bottom plate; a main mounting plate arranged between the lower cabin cover and the rear edge of the same side of the top wall, the first side wall and the second side wall; a front panel arranged on the side of the case body away from the main mounting plate; and a rear panel arranged on the side of the case body close to the main mounting plate; the lower cabin cover comprises: a horizontal partition plate arranged between the top wall and the bottom plate in parallel with the bottom plate, and the two ends of the horizontal partition plate are respectively abutted with the first side wall and the second side wall, the horizontal partition plate comprises a rectangular avoiding opening arranged at the abutted position of the two ends of the horizontal partition plate and the first side wall and the second side wall, and the rectangular avoiding opening is used for avoiding the ventilation and heat dissipation device arranged on the first heat dissipation position and the second heat dissipation position; and a vertical standing plate arranged between the same side edge of the horizontal partition plate and the bottom plate in perpendicular with the horizontal partition plate; wherein the edge of the side of the horizontal partition plate away from the vertical standing plate is fixedly connected with the lower edge of the main mounting plate; the horizontal partition plate comprises: an IO hole arranged on the side of the horizontal partition plate close to the main mounting plate and corresponding to the IO part of a computer mainboard; a ventilation and heat dissipation hole arranged on the side of the horizontal partition plate close to the vertical standing plate, the edge of the ventilation and heat dissipation hole has a plurality of mounting holes to form a fourth heat dissipation position, and the fourth heat dissipation position can be used for mounting a ventilation and heat dissipation device; and a plurality of PCIE expansion card mounting fixed positions and a plurality of detachable baffles arranged on the end of the horizontal partition plate away from the IO hole and the ventilation and heat dissipation hole; wherein the PCIE expansion card mounting fixed positions are arranged in parallel on the two sides of the main mounting plate; wherein the rear panel comprises vertically-extended graphics card ventilation holes corresponding to the PCIE expansion card mounting fixed positions, which are used for matching the graphics card heat dissipation vertically arranged at the positions.

2. The computer chassis of claim 1, wherein, the first side wall and the second side wall comprise complete openings or a plurality of independent ventilation holes, and the edges of the complete openings or the independent ventilation holes have mounting lining plates, the mounting lining plates have mounting holes to form the first heat dissipation position and the second heat dissipation position.

3. The computer chassis of claim 1, wherein, The top wall comprises a complete opening or a plurality of independent ventilation holes, edges of the complete opening or the plurality of independent ventilation holes are provided with mounting linings, the mounting linings are provided with mounting holes, and the mounting holes are used to form a third heat dissipation position, and the third heat dissipation position can be used to mount a ventilation heat dissipation device.

4. The computer chassis of claim 1, wherein, The plurality of PCIE expansion card mounting fixed positions, the fourth heat dissipation position and the IO hole are arranged on the same side of the main mounting plate facing the vertical stand plate.

5. The computer chassis of claim 1, wherein, The bottom plate comprises: A power supply fan mounting position is arranged at one end of the bottom plate close to the second side wall, and a ventilation hole is arranged at the power supply fan mounting position; and A fifth heat dissipation position is arranged at one end of the bottom plate close to the first side wall and at a ventilation hole at a vertical projection position of the fourth heat dissipation position, a periphery of the ventilation hole is provided with a plurality of mounting holes to form the fifth heat dissipation position, and the fifth heat dissipation position can be used to mount a ventilation heat dissipation device.

6. The computer chassis of claim 4, wherein, The cabinet body further comprises: A front side wall is arranged on a side of the cabinet body away from the main mounting plate; A rear side wall is arranged on a side of the cabinet body close to the main mounting plate; and A front panel, a rear panel, a first side panel, a second side panel and a top plate are arranged at the front side wall, the rear side wall, the first side wall, the second side wall and the top wall of the cabinet body respectively.

7. The computer chassis of claim 6, wherein, The rear panel comprises: A power supply ventilation avoiding opening is arranged at a lower part of the rear panel corresponding to a power supply ventilation heat dissipation panel of a power supply, the power supply ventilation heat dissipation panel comprises a power supply line socket and a key; and An IO adapter plate avoiding hole is arranged at a lower part of the rear panel and at one side of the power supply ventilation avoiding opening, and the IO adapter plate avoiding hole is used to expose an IO adapter plate arranged on the cabinet body.

8. The computer chassis of claim 1, wherein, A lower part of the main mounting plate is arranged perpendicularly to the horizontal partition plate and forms a first vertical surface, and a lower end edge of the first vertical surface is connected and fixed to the horizontal partition plate; The fourth heat dissipation position is arranged on one side of the first vertical surface of the main mounting plate, the IO hole is arranged on the other side of the first vertical surface, and the plurality of PCIE expansion card mounting fixed positions are arranged in parallel on both sides of the first vertical surface respectively; An upper part of the main mounting plate is inclined to extend to form an inclined plate towards the front side wall, an included angle between the inclined plate and the first vertical surface is not less than 90 degrees, and a wire passing hole is arranged on the inclined plate; An upper end edge of the inclined plate is bent upwards to form a second vertical surface, and the second vertical surface is parallel to the first vertical surface, and the main mounting plate is connected and fixed to a frame of the cabinet body through the second vertical surface.

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