A device for balancing a suction nozzle and a die bonder

Abstract

The application provides a device for balancing a suction nozzle and a die bonder, which comprises a base plate, a first module and a second module, the first module comprises a first platform, the second module comprises a second platform and a suction nozzle, the second platform is provided with the suction nozzle, the device further comprises a balancing mechanism for realizing dynamic balancing of the first platform and the second platform, the balancing mechanism is installed on the base plate, one end of the balancing mechanism is connected with the first platform, and the other end of the balancing mechanism is connected with the second platform. The beneficial effects of the application are as follows: the balancing mechanism is simple and sensitive to adjustment, the suction nozzle and the wafer are subjected to force, the force size can be adjusted by the weight size, the structure is simple, when the suction nozzle and the wafer are in contact and the force is too large, the suction nozzle is adjusted upward by the balancing mechanism, wafer damage and suction nozzle damage are avoided, and thus the die bonding pressure is ensured.

Description

Technical Field

[0001] This invention relates to the field of die bonding technology, and more particularly to a device for balancing a suction nozzle and a die bonding machine. Background Technology

[0002] Die bonders include die bonder arm systems, such as... Figure 1 As shown, the die-bonding arm system includes a rear swing arm 101, a front swing arm 102, an adjustment component 103, and a suction nozzle 104. When the suction nozzle 104 picks up and bonds the die, the force on the wafer is adjusted by the adjustment component 103. However, this adjustment can only be done visually, and the force on the wafer cannot be quantified. The specific pressure depends on the deformation of the spring, which is linear and unstable. Moreover, the deformation coefficient of the spring changes over time. The adjustment can only be done by feeling, which cannot guarantee the high precision between the suction nozzle 104 and the wafer tray 105. This can easily damage the wafer and affect the efficiency of the equipment. Summary of the Invention

[0003] This invention provides a device for balancing a suction nozzle, comprising a substrate, a first module, and a second module. The first module includes a first platform, and the second module includes a second platform and a suction nozzle. The suction nozzle is mounted on the second platform. The device further includes a balancing mechanism for achieving dynamic balance between the first platform and the second platform. The balancing mechanism is mounted on the substrate, with one end connected to the first platform and the other end connected to the second platform. The weight of the second module is greater than the weight of the first module. The weights of the first module and the second module are calculated based on the distance the substrate descends and the balancing principle.

[0004] As a further improvement of the present invention, the device also includes a counterweight and a weight. The counterweight is disposed on the first platform and the weight is disposed on the second platform. The first platform and the counterweight constitute a first module, and the second platform, the weight, and the suction nozzle constitute a second module.

[0005] As a further improvement of the present invention, the device further includes a locking mechanism for locking the second module, and the locking mechanism is detachable from the second module.

[0006] The locking mechanism includes an electromagnet and an electromagnet control module for controlling the electromagnet. The electromagnet is mounted on the substrate and is used to attract the second platform.

[0007] As a further improvement of the present invention, the locking mechanism further includes an air nozzle device for providing positive pressure air to the second module, causing the second module to move downward and align with the electromagnet.

[0008] As a further improvement of the present invention, the first platform is provided with a first guide rail, the substrate is provided with a first guide groove, and the first guide rail can slide within the first guide groove; the second platform is provided with a second guide rail, the substrate is provided with a second guide groove, and the second guide rail can slide within the second guide groove.

[0009] As a further improvement of the present invention, the balancing mechanism is a linkage mechanism, which includes a balance bar, a first link, and a second link. The balance bar is movably connected to the base plate. One end of the first link is movably connected to one end of the balance bar, and the other end of the first link is movably connected to the first platform. One end of the second link is movably connected to the other end of the balance bar, and the other end of the second link is movably connected to the second platform.

[0010] As a further improvement of the present invention, the balancing mechanism is a pulley mechanism, which includes a wheel and a rope. The wheel is mounted on the base plate and can rotate on the base plate. The rope is wound around the wheel, one end of the rope is connected to the first platform, and the other end of the rope is connected to the second platform.

[0011] As a further improvement of the present invention, the balancing mechanism is a gear mechanism, which includes a main gear, a first rack, and a second rack. The main gear is mounted on the base plate and is rotatable on the base plate. The first rack meshes with the main gear, and the second rack meshes with the main gear. The first rack is connected to the first platform, and the second rack is connected to the second platform.

[0012] The present invention also provides a die bonder, including a longitudinal drive mechanism and the device described in the present invention, wherein the longitudinal drive mechanism is used to drive the substrate to move up and down.

[0013] The beneficial effects of this invention are: the balancing mechanism of this invention is simple and sensitive to adjustment, which makes the force on the nozzle and the wafer uniform. The force can be adjusted by the size of the weight. The structure is simple. When the force on the nozzle and the wafer is too large, the balancing mechanism adjusts to make the nozzle return upward, avoiding damage to the wafer and the nozzle, thereby ensuring the die bonding pressure. Attached Figure Description

[0014] Figure 1 This is a schematic diagram of the die-bonding swing arm system structure in the background technology;

[0015] Figure 2 This is a schematic diagram of a device with a linkage mechanism;

[0016] Figure 3 This is a schematic diagram of a device with a pulley mechanism;

[0017] Figure 4 This is a schematic diagram of a device with a gear mechanism. Detailed Implementation

[0018] The present invention discloses a device for balancing a suction nozzle, comprising a substrate 1, a first module, and a second module. The first module includes a first platform 2, and the second module includes a second platform 3 and a suction nozzle 4. The suction nozzle 4 is mounted on the second platform 3. The device further includes a balancing mechanism for achieving dynamic balance between the first platform 2 and the second platform 3. The balancing mechanism is mounted on the substrate 1, with one end connected to the first platform 2 and the other end connected to the second platform 3.

[0019] The device also includes a counterweight 5 and a weight 6. The counterweight 5 is disposed on the first platform 2, and the weight 6 is disposed on the second platform 3. The first platform 2 and the counterweight 5 constitute a first module, and the second platform 3, the weight 6 and the suction nozzle 4 constitute a second module.

[0020] The weight of the second module is greater than that of the first module. The weights of the first and second modules are calculated based on the distance the substrate 1 falls and the principle of balance.

[0021] The principle of the balancing mechanism is similar to that of a balance scale. When the weight of the second module is equal to the weight of the first module, the first and second modules are at the same height; when the weight of the second module is greater than the weight of the first module, the second module is lower and the first module is higher.

[0022] To ensure an initial force on the nozzle 4 during die bonding, the weight of the second module is greater than that of the first module, thus placing the second platform 3 lower than the first platform 2. During die bonding, the nozzle 4 presses the die onto the PCB board. After bonding, the nozzle 4 is lifted, bringing the first and second modules to the same height. Because the PCB board may have uneven surfaces, and since the nozzle 4's descent distance is fixed, excessive force on the nozzle 4 when bonding to a protruding area of ​​the PCB board could damage both the die and the nozzle 4. To prevent this, a balancing mechanism raises the nozzle 4, placing the second module higher and the first module lower.

[0023] The weights of the first and second modules are calculated based on the distance the substrate 1 descends and the principle of balance. The implementation method is as follows: the weight of the second module (nozzle end) compared to the first module (balance end) is the force that the nozzle 4 exerts on the wafer within its effective travel distance. For example, if the second module (nozzle end) is 20g heavier than the first module (balance end), and the effective travel of the nozzle 4 is 5mm, then the pressure on the wafer within the 5mm effective travel range is 20g. If the pressure needs to be increased to 200g, only 180g of weight needs to be added accordingly.

[0024] When the nozzle 4 finishes picking up the wafer and moves it to the die bonding position, the balancing mechanism is rotating at high speed. To prevent the nozzle 4 from jumping up and down, a locking mechanism is used to lock the second module so that the nozzle 4 will not move. For example, the locking mechanism is a clamping mechanism. When the balancing mechanism is rotating at high speed, the clamping mechanism clamps the second module. When the nozzle 4 reaches the die bonding position, the clamping mechanism releases the second module.

[0025] In a preferred embodiment of the locking mechanism, the locking mechanism includes an electromagnet 7 and an electromagnet control module for controlling the electromagnet 7. The electromagnet 7 is mounted on the substrate 1 and is used to attract the second platform 3. When the balancing mechanism is rotating at high speed, the electromagnet control module energizes the electromagnet 7 to generate magnetism, thereby magnetically attracting the second platform 3. When the suction nozzle 4 reaches the solidification position, the electromagnet control module de-energizes the electromagnet 7, causing it to lose its magnetism and release the second platform 3.

[0026] After the chip is secured by the suction nozzle 4, the electromagnet 7 may not be able to quickly magnetically attract the second module when the first module and the second module are relatively balanced. Positive pressure air is provided by the air nozzle device 8 to move the second module downward, so that the second module is aligned with the electromagnet 7, and the suction nozzle 4 and the electromagnet 7 are quickly magnetically attracted.

[0027] The first platform 2 is provided with a first guide rail, and the substrate 1 is provided with a first guide groove, allowing the first guide rail to slide within the first guide groove; the second platform 3 is provided with a second guide rail, and the substrate 1 is provided with a second guide groove, allowing the second guide rail to slide within the second guide groove. The cooperation of the guide rails and guide grooves ensures smooth movement of the first platform 2 and the second platform 3.

[0028] like Figure 2 As shown, the balancing mechanism is a linkage mechanism, which includes a balance bar 11, a first link 12, and a second link 13. The balance bar 11 is movably connected to the base plate 1. One end of the first link 12 is movably connected to one end of the balance bar 11, and the other end of the first link 12 is movably connected to the first platform 2. One end of the second link 13 is movably connected to the other end of the balance bar 11, and the other end of the second link 13 is movably connected to the second platform 3.

[0029] like Figure 3As shown, the balancing mechanism is a pulley mechanism, which includes a wheel 21 and a rope 22. The wheel 21 is mounted on the base plate 1 and can rotate on the base plate 1. The rope 22 is wound around the wheel 21. One end of the rope 22 is connected to the first platform 2, and the other end of the rope 22 is connected to the second platform 3.

[0030] like Figure 4 As shown, the balancing mechanism is a gear mechanism, which includes a main gear 31, a first rack 32, and a second rack 33. The main gear 31 is mounted on the base plate 1 and can rotate on the base plate 1. The first rack 32 meshes with the main gear 31, and the second rack 33 meshes with the main gear 31. The first rack 32 is connected to the first platform 2, and the second rack 33 is connected to the second platform 3.

[0031] The balancing mechanism of this invention is simple and highly adjustable, which makes the force on the nozzle 4 and the wafer quantified. The force can be adjusted by the size of the weight 6. The structure is simple. When the force on the nozzle 4 is too great when it contacts the wafer, the balancing mechanism adjusts the nozzle 4 to pull it back upward, avoiding damage to the wafer and the nozzle 4, thereby ensuring the die bonding pressure.

[0032] The present invention also discloses a die bonder including a longitudinal drive mechanism and the device described in the present invention. The longitudinal drive mechanism is used to drive the substrate 1 to move up and down. The die picking and die bonding actions are realized through the balancing mechanism and the suction nozzle 4. When the suction nozzle 4 is subjected to excessive force when in contact with the wafer, the counterweight block 5 of the balancing mechanism adjusts the suction nozzle 4 to return upward, automatically adjusting the pressure on the wafer and the height of the suction nozzle, so as to avoid damage to the wafer and the suction nozzle.

[0033] The above description, in conjunction with specific preferred embodiments, provides a further detailed explanation of the present invention. It should not be construed that the specific implementation of the present invention is limited to these descriptions. For those skilled in the art, various simple deductions or substitutions can be made without departing from the concept of the present invention, and all such modifications and substitutions should be considered within the scope of protection of the present invention.

Claims

1. A device for balancing a mouthpiece, characterized in that: The device includes a substrate (1), a first module, and a second module. The first module includes a first platform (2), and the second module includes a second platform (3) and a suction nozzle (4). The suction nozzle (4) is installed on the second platform (3). The device also includes a balancing mechanism to achieve dynamic balance between the first platform (2) and the second platform (3). The balancing mechanism is installed on the substrate (1). One end of the balancing mechanism is connected to the first platform (2), and the other end of the balancing mechanism is connected to the second platform (3). The weight of the second module is greater than the weight of the first module. The weights of the first module and the second module are calculated based on the distance the substrate (1) falls and the balancing principle. The device also includes a counterweight (5) and a weight (6). The counterweight (5) is set on the first platform (2), and the weight (6) is set on the second platform (3). The first platform (2) and the counterweight (5) constitute the first module, and the second platform (3), the weight (6) and the suction nozzle (4) constitute the second module. The device also includes a locking mechanism for locking the second module, and the locking mechanism is detachable from the second module; The locking mechanism includes an electromagnet (7) and an electromagnet control module for controlling the electromagnet (7). The electromagnet (7) is mounted on the substrate (1) and is used to attract the second platform (3). The locking mechanism also includes an air nozzle device (8) for providing positive pressure air to the second module, causing the second module to move downward and align with the electromagnet (7).

2. The apparatus of claim 1, wherein: The first platform (2) is provided with a first guide rail, and the substrate (1) is provided with a first guide groove. The first guide rail can slide in the first guide groove. The second platform (3) is provided with a second guide rail, and the substrate (1) is provided with a second guide groove. The second guide rail can slide in the second guide groove.

3. The apparatus of any one of claims 1 to 2, wherein: The balancing mechanism is a linkage mechanism, which includes a balance bar (11), a first link (12), and a second link (13). The balance bar (11) is movably connected to the base plate (1). One end of the first link (12) is movably connected to one end of the balance bar (11), and the other end of the first link (12) is movably connected to the first platform (2). One end of the second link (13) is movably connected to the other end of the balance bar (11), and the other end of the second link (13) is movably connected to the second platform (3).

4. The apparatus of any one of claims 1 to 2, wherein: The balancing mechanism is a pulley mechanism, which includes a wheel (21) and a rope (22). The wheel (21) is mounted on the base plate (1) and can rotate on the base plate (1). The rope (22) is wound around the wheel (21). One end of the rope (22) is connected to the first platform (2) and the other end of the rope (22) is connected to the second platform (3).

5. The apparatus of any one of claims 1 to 2, wherein: The balancing mechanism is a gear mechanism, which includes a main gear (31), a first rack (32), and a second rack (33). The main gear (31) is mounted on the base plate (1) and can rotate on the base plate (1). The first rack (32) meshes with the main gear (31), and the second rack (33) meshes with the main gear (31). The first rack (32) is connected to the first platform (2), and the second rack (33) is connected to the second platform (3).

6. A die bonder characterized by: It includes a longitudinal drive mechanism and the apparatus according to any one of claims 1 to 5, wherein the longitudinal drive mechanism is used to drive the substrate (1) to move up and down.

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