Nickel metal clamp tool
By designing a nickel metal fixture, a sealing layer is formed by a nickel base plate, side nickel plates, and inner nickel plate, which solves the problem that the existing nickel mesh structure cannot isolate the carbon surface of the wafer, and realizes uniform etching and reusability of the wafer.
CN224303403UActive Publication Date: 2026-05-29湖南金博碳基材料研究院有限公司
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Patent Information
- Application Number
- CN202421416328.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-06-20
- Publication Date
- 2026-05-29
- Estimated Expiration
- 2034-06-20
AI Technical Summary
Technical Problem
Existing nickel mesh structures cannot effectively isolate the carbon surface of the wafer from the corrosive environment, resulting in uneven corrosion, affecting wafer quality, increasing costs, and making them unrecyclable.
Method used
Design a nickel metal fixture tooling, including a nickel crucible, a nickel base plate, side nickel plates and an inner nickel plate, forming a sealing layer to isolate the carbon surface of the wafer from the corrosion environment, and to perform corrosion only on the silicon surface.
Benefits of technology
Uniform etching of the wafer is achieved, ensuring that the wafer can be reused as a seed wafer, thus reducing costs.
✦ Generated by Eureka AI based on patent content.
Abstract
A nickel metal clamp tool comprises a nickel crucible, a nickel bottom plate is arranged in the nickel crucible, a side face nickel plate is arranged on the side edge of the nickel bottom plate, and an inner nickel plate is arranged on the inner side edge of the side face nickel plate. Therefore, a nickel metal clamp tool is formed by the nickel bottom plate, the side nickel plate and the inner nickel plate, the smooth nickel bottom plate and the lower surface of the wafer can form a sealing layer under the action of certain mechanical force, the carbon surface of the wafer is isolated from the external environment of the tool, high-temperature molten potassium hydroxide cannot make contact with the protected carbon surface, the corrosion effect is only generated on the exposed silicon surface, and the service life of the tool is prolonged. And the wafer can be used as a seed crystal again after being corroded.
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