A high-frequency light transmitter with stable output and its processing method

Abstract

This invention relates to the field of optical communication technology, specifically to a high-frequency optical transmitter with stable output and its manufacturing method. The high-frequency optical transmitter includes a base, signal pins, and connectors. The signal pins are mounted on the base. The connectors include a connecting rod, a metal connector, and a metal pad. The connecting rod includes an insulating base rod and a plurality of metal strips sequentially and spaced apart on the outer wall of the insulating base rod. One end of the metal connector has a first socket, and the other end has a second socket. The metal connector is inserted into the end of the signal pin near the base rod through the first socket and is fixed to one end of the connecting rod through the second socket. One end of the metal pad has a third socket, and the other end has a surface for soldering to the signal pins of a light-emitting chip. The metal pad is fixed to the other end of the connecting rod through the third socket. According to the solution of this invention, the connection and installation efficiency between the signal pins and the signal pins of the light-emitting chip can be improved.

Description

Technical Field

[0001] This invention relates to the field of optical communication technology, and in particular to a high-frequency optical transmitter with stable output and its processing method. Background Technology

[0002] Optical fiber communication has become one of the main communication methods due to its numerous advantages, such as large communication capacity, long transmission distance, and strong resistance to electromagnetic interference. The optical transmitter is the main light source used in optical fiber communication and is the core component. An optical transmitter typically includes a base, a cap, a light-emitting chip, and a lens. Currently, the pins of the light-emitting chip are directly connected to the pins of the base. However, due to the extremely small radial dimensions of the signal transmission pins and the base pins of the light-emitting chip, wiring is difficult; furthermore, it is impossible to connect multiple metal wires between the base pins and the pins of the light-emitting chip, limiting its application to low-frequency signals (e.g., 10G) and failing to meet the transmission requirements of high-frequency signals (e.g., 25G).

[0003] To address the aforementioned issues, the prior art provides a high-frequency optical emitter, comprising a cylindrical base, a light-emitting chip disposed on the base, a plurality of pins fixed to the base, a first pad vertically disposed on the base, and a second pad horizontally disposed on the base. The first pad has a first metal plating layer, which includes a first region located on the upper surface of the first pad and a second region located on the side of the first pad and connected to the first region. The second region is eutectic bonded to a signal transmission pin among the plurality of pins. The upper surface of the second pad has a second metal plating layer. The light-emitting chip is horizontally disposed on the upper surface of the second pad and electrically connected to the second metal plating layer. The second metal plating layer and the first region are electrically connected by a plurality of metal wires.

[0004] The aforementioned high-frequency optical transmitter has at least the following drawbacks: When electrically connecting the signal pins to the signal pins of the light-emitting chip, the signal pins are first soldered to the metal plating of the first pad, and then the signal pins of the light-emitting chip are soldered to the metal plating of the second pad; then, one end of multiple metal wires is soldered to the metal plating of the first pad, and the other end of the multiple metal wires is soldered to the metal plating of the second pad. The entire process is time-consuming and labor-intensive, therefore, improvements are urgently needed to address this issue. Summary of the Invention

[0005] In view of this, the present invention provides a high-frequency optical transmitter with stable output and its processing method. The main technical problem to be solved is: how to improve the connection and installation efficiency between the signal pins and the signal pins of the light-emitting chip.

[0006] To achieve the above objectives, the present invention mainly provides the following technical solutions:

[0007] On one hand, embodiments of the present invention provide a high-frequency optical emitter with stable output and its processing method, including a shell tube, a lens, an axial adjustment ring, a light-emitting chip, a cooling chip, a base, signal pins, and connectors. One end of the shell tube is fixed to the base, and the other end is used to connect to the axial adjustment ring. The lens, the light-emitting chip, and the cooling chip are all installed inside the shell tube, and the signal pins are installed on the base. The connectors include a connecting rod, a metal connector, and a metal pad. The connecting rod includes an insulating base rod and a plurality of metal strips that are sequentially fixed at intervals along the outer side wall of the insulating base rod. Each metal strip extends from one end of the insulating base rod to the other end. One end of the metal connector has a first socket, and the other end has a second socket. The metal connector is inserted into the end of the signal pin near the base through the first socket and is inserted into and fixed to one end of the connecting rod through the second socket. One end of the metal pad has a third socket, and the other end has a pad surface for soldering to the signal pins of the light-emitting chip. The metal pad is inserted into and fixed to the other end of the connecting rod through the third socket.

[0008] Optionally, the base is provided with a through hole for the signal pin to pass through, and a dielectric material sleeve is fitted between the signal pin and the through hole.

[0009] Optionally, the dielectric material sleeve has an annular flared groove on the side near the heating chip, and one end of the metal connector is inserted into the annular flared groove and transitions or is interference-fitted with the groove wall.

[0010] Optionally, the signal pin extends out of the housing.

[0011] Optionally, the metal strip is a metal foil attached to the outer wall of the insulating base rod; or, the metal strip is a metal plating.

[0012] Optionally, the shell tube includes a heat insulation cylinder, a heat insulation cylinder, and a sleeve. The shell tube is fixed to the base body through one end of the heat insulation cylinder. The other end of the heat insulation cylinder has a first constriction. The lens is used to be installed inside the sleeve. One end of the sleeve has a second constriction, and the other end has a through hole for light from the lens to pass through. One end of the heat insulation cylinder is connected to the first constriction, and the other end is connected to the second constriction. The shell tube is connected to an axial adjustment ring through the other end of the sleeve. The light-emitting chip and the cooling chip are both installed inside the heat insulation cylinder. The light emitted by the light-emitting chip is used to irradiate the lens through the inside of the heat insulation cylinder. The high-frequency light emitter also includes a heat sink. The heat sink includes a heat sink base and an annular cylindrical wall protruding from the heat sink base. The base body is used to be inserted into the inner side of the annular cylindrical wall and kept relatively fixed to the heat sink. The annular cylindrical wall is sleeved on the outer side of the heat insulation cylinder, and there is a gap between the two. The cooling chip is used to conduct the heat energy on the light-emitting chip to the heat sink.

[0013] On the other hand, embodiments of the present invention also provide a method for processing a high-frequency optical transmitter capable of stable output as described in any of the above claims, comprising the step of mounting a connector on a base, wherein the connector is a prefabricated component, the connector has multiple different models, each model of connector has a different number of metal strips, so that each model of connector has a different impedance, and a connector of a suitable model is selected according to the emission frequency of the high-frequency optical transmitter, so that the high-frequency optical transmitter can emit high-frequency light at a set frequency and cannot emit high-frequency light higher than the set frequency.

[0014] By employing the above technical solution, the high-frequency optical transmitter with stable output and its processing method of the present invention have at least the following beneficial effects:

[0015] 1. Since the metal connector and the metal pad are electrically connected by multiple metal strips, which are equivalent to metal wires in the prior art, when the connector is fixed to the signal pin through the metal connector and connected to the signal pin of the light-emitting chip through the metal pad, the transmission requirements of high-frequency signals (e.g., 25G) of the optical transmitter can be met; and because the cooling chip can control the temperature inside the shell tube, the stability of the output wavelength of the high-frequency optical transmitter is ensured.

[0016] 2. Furthermore, because the connector is an integrated structure, with the metal connector, metal pad, and connecting rod being relatively fixed, the connector can be a prefabricated component. When connecting the signal pins to the signal pins of the LED chip, the connector can be directly inserted into the signal pins, and the signal pins of the LED chip can be soldered to the metal pads through metal wires. Compared with the separate connection structure of the prior art, the integrated connection structure of the connector of the present invention can save installation procedures and space, and improve the connection and installation efficiency of the signal pins and the signal pins of the LED chip.

[0017] The above description is merely an overview of the technical solution of the present invention. In order to better understand the technical means of the present invention and to implement it in accordance with the contents of the specification, the preferred embodiments of the present invention are described in detail below with reference to the accompanying drawings. Attached Figure Description

[0018] Figure 1 This is a perspective view of a high-frequency optical transmitter capable of stable output provided in an embodiment of the present invention;

[0019] Figure 2 This is a three-dimensional structural diagram of the connector;

[0020] Figure 3 This is a cross-sectional structural diagram of a high-frequency optical transmitter capable of stable output provided in an embodiment of the present invention;

[0021] Figure 4 yes Figure 3 Enlarged diagram of point A in the middle.

[0022] Reference numerals: 1. Sleeve; 2. Insulation cylinder; 3. Support frame; 4. Heat sink; 5. Axial adjustment ring; 6. Lens; 7. Insulation cylinder; 8. Light-emitting chip; 9. Cooling chip; 10. Heat pipe; 11. Second constriction; 12. Base; 13. Signal pin; 14. Wiring component; 15. Dielectric material sleeve; 41. Heat dissipation base; 42. Annular cylinder wall; 61. Light-passing hole; 71. First constriction; 401. Heat dissipation hole; 141. Metal pad; 142. Metal strip; 143. Insulating base rod; 144. Metal connector; 151. Annular flared groove; 1441. First socket; 1442. Second socket; 1411. Third socket; 1412. Panel. Detailed Implementation

[0023] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. All other embodiments obtained by ordinary technicians in this field based on the embodiments of the present invention without making any creative efforts shall fall within the scope of protection of the present invention.

[0024] It should be noted that if the embodiments of the present invention involve directional indicators (such as up, down, left, right, front, back, etc.), the directional indicators are only used to explain the relative positional relationship and movement of the components in a certain specific posture (as shown in the figure). If the specific posture changes, the directional indicators will also change accordingly.

[0025] Furthermore, if the embodiments of this invention involve descriptions such as "first" or "second," these descriptions are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined with "first" or "second" may explicitly or implicitly include at least one of those features. Additionally, the technical solutions of the various embodiments can be combined with each other, but this must be based on the ability of those skilled in the art to implement them. If the combination of technical solutions is contradictory or impossible to implement, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection claimed by this invention.

[0026] like Figure 1 and Figure 3As shown, an embodiment of the present invention provides a high-frequency optical transmitter with stable output, comprising a shell tube, a lens 6, an axial adjustment ring 5, a light-emitting chip 8, a cooling chip 9, a base 12, signal pins 13, and a connector 14. One end of the shell tube is fixed to the base 12, and the other end is used to connect to the axial adjustment ring 5. The lens 6, the light-emitting chip 8, and the cooling chip 9 are all installed inside the shell tube. The signal pins 13 are installed on the base 12. Preferably, the base 12 has through holes for the signal pins 13 to pass through, and a dielectric material sleeve 15 is sleeved between the signal pins 13 and the through holes. The dielectric material sleeve 15 can be made of borosilicate glass, sealing glass for Kovar materials, or other sealing materials suitable for matching metals or alloys, etc. The dielectric material sleeve 15 can effectively fill the gaps between the signal pins 13 and the through holes, so that the signal pins 13 and the through holes maintain the same or approximately the same impedance matching, thereby not affecting the high-frequency characteristics of the optical transmitter and maintaining the high-frequency signal integrity of the optical transmitter.

[0027] like Figure 2 As shown, the aforementioned connector 14 may include a connecting rod, a metal connector 144, and a metal pad 141. The connecting rod includes an insulating base rod 143 and a plurality of metal strips 142 that are sequentially and spaced apart along the outer wall of the insulating base rod 143. Each metal strip 142 extends from one end of the insulating base rod 143 to the other end. The metal strips 142 may be metal foils, such as aluminum foil or copper foil, adhered to the outer wall of the insulating base rod 143. The metal strips 142 may also be metal plating, such as copper plating or aluminum plating.

[0028] like Figure 4 As shown, the aforementioned metal connector 144 has a first socket 1441 at one end and a second socket 1442 at the other end. The metal connector 144 is made of conductive material and can be a copper connector or an aluminum connector, etc. The metal connector 144 is inserted into the end of the signal pin 13 near the base 12 via the first socket 1441. The signal pin 13 and the inner wall of the first socket 1441 are in a transition or interference fit, achieving electrical connection through contact. The metal connector 144 is also inserted into and fixed to one end of a connecting rod via the second socket 1442. The connecting rod and the second socket 1442 are in a transition or interference fit, and the metal strip 142 on the connecting rod abuts against the inner wall of the second socket 1442, achieving electrical connection with the metal connector 144 through contact.

[0029] The aforementioned metal pad 141 has a third socket 1411 at one end and a disk surface 1412 at the other end for soldering to the signal pins (marked in the figure) of the light-emitting chip 8. The metal pad 141 is inserted and fixed to the other end of the connecting rod through the third socket 1411. The other end of the connecting rod is transition-fitted or interference-fitted with the inner wall of the third socket 1411. The metal strip 142 on the connecting rod abuts against the inner wall of the third socket 1411 to electrically connect with the metal pad 141 through contact.

[0030] In the above example, since the metal connector 144 and the metal pad 141 are electrically connected by multiple metal strips 142, the metal strips 142 are equivalent to metal wires in the prior art. When the connector 14 is inserted into the signal pin 13 through the metal connector 144 and connected to the signal pin of the light-emitting chip 8 through the metal pad 141, the transmission requirements of high-frequency signals (e.g., 25G) of the light emitter can be met. Furthermore, because the cooling chip 9 can control the temperature inside the housing, the stability of the output wavelength of the high-frequency light emitter is ensured.

[0031] Furthermore, since the connector 14 is an integral structure, with the metal connector 144, metal pad 141, and connecting rod fixed together, the connector 14 can be a prefabricated component. When connecting the signal pin 13 to the signal pin of the light-emitting chip 8, the connector 14 can be directly inserted into the signal pin 13, and the signal pin of the light-emitting chip 8 can be soldered together with the metal pad 141. Compared with the separate connection structure of the prior art, the integral connection structure of the connector 14 of the present invention can save installation steps and space, and improve the connection and installation efficiency of the signal pin 13 and the signal pin of the light-emitting chip 8.

[0032] like Figure 4 As shown, the aforementioned dielectric material sleeve 15 may have an annular flared groove 151 on the side near the heating chip. One end of the metal connector 144 is inserted into the annular flared groove 151 and transitions or presses against the groove wall. In this example, one end of the metal connector 144 is inserted into the annular flared groove 151, and one end of the signal pin 13 is inserted into the first socket 1441 of the metal connector 144. The engagement between the signal pin 13 and the inner wall of the annular flared groove 151 can clamp the metal connector 144, thereby improving the installation stability of the metal connector 144 and preventing the metal connector 144 from becoming loose from the signal pin 13.

[0033] Furthermore, such as Figure 4As shown, the aforementioned signal pin 13 extends out of the base 12, and the portion of the signal pin 13 extending out of the base 12 is also inserted into the first socket 1441 of the metal connector 144. This can increase the depth of the signal pin 13 inserted into the metal connector 144, thereby further improving the connection stability and electrical mating stability between the signal pin 13 and the metal connector 144.

[0034] In a specific application example, such as Figure 3 As shown, the aforementioned shell tube may include an insulation cylinder 7, a heat insulation cylinder 2, and a sleeve 1. The insulation cylinder 7 is made of heat insulation material, such as aluminum oxide ceramic, aluminum nitride ceramic, or beryllium oxide ceramic. The shell tube is fixed to the base 12 at one end of the insulation cylinder 7, which can be glued to the base 12. The other end of the insulation cylinder 7 has a first constriction 71, the diameter of which is smaller than the inner diameter of the insulation cylinder 7. The lens 6 is used to install inside the sleeve 1. One end of the sleeve 1 has a second constriction 11, the diameter of which is smaller than the inner diameter of the sleeve 1. The diameters of the first constriction 71 and the second constriction 11 can be the same. The other end of the sleeve 1 has a light-passing hole 61 for light from the lens 6 to pass through. The heat insulation cylinder 2 is made of heat insulation material, such as fiberglass, asbestos, rock wool, silicate, aerogel felt, vacuum plate, etc. One end of the heat insulation cylinder 2 is connected to the first constriction 71, for example, by adhesive bonding. The other end of the heat insulation cylinder 2 is connected to the second constriction 11, for example, by adhesive bonding. The heat insulation cylinder 2 is a straight cylinder with a uniform inner diameter throughout. The shell tube is connected to the axial adjustment ring 5 through the other end of the sleeve 1, and the axial adjustment ring 5 can be welded to the other end of the sleeve 1. The light-emitting chip 8 and the cooling chip 9 are both installed inside the heat insulation cylinder 7. The light emitted by the light-emitting chip 8 is used to illuminate the lens 6 through the inside of the heat insulation cylinder 2.

[0035] like Figure 3 As shown, the high-frequency light emitter of the present invention also includes a heat sink 4, which includes a heat sink base 41 and an annular cylindrical wall 42 protruding from the heat sink base 41. The heat sink base 41 and the annular cylindrical wall 42 can be integrally formed. The heat sink 4 can be a metal part, such as made of copper, aluminum, or other materials. The seat 12 is used to insert into the inner side of the annular cylindrical wall 42 and to maintain relative fixation with the heat sink 4. The annular cylindrical wall 42 is sleeved on the outer side of the heat insulation cylinder 7, and there is a gap between the two. The cooling chip 9 is used to conduct the heat energy on the light-emitting chip 8 to the heat sink 4.

[0036] In the above example, the cooling chip 9 can conduct the heat energy on the light-emitting chip 8 to the heat sink 4. The heat sink 4 is barrel-shaped and has a large heat dissipation area, which can help the cooling chip 9 dissipate heat quickly, thus greatly improving the heat dissipation performance of the light emitter of the present invention.

[0037] Taking a fiber optic gyroscope as an example, when the fiber optic gyroscope uses the aforementioned high-frequency optical transmitter, it can improve the stability of the gyroscope's center wavelength. The reason is explained as follows: In a traditional SLD optical transmitter sub-component, the SLD light-emitting chip 8 is located on the base 12, exposed inside the tube cavity. During operation, the SLD light-emitting chip 8 undergoes heat conduction and convection with the surrounding environment. For example, at high temperatures, the temperature of the SLD light-emitting chip 8 is 25.00℃, the temperature of the base 12 is 21.05℃, and the temperature inside the tube cavity is approximately 85℃. That is, the temperature inside the tube cavity is higher than the temperature of the SLD light-emitting chip 8, and the temperature of the base 12 is lower than the temperature of the SLD light-emitting chip 8. Under these circumstances, heat conduction occurs between the SLD light-emitting chip 8 and the base 12, and heat convection occurs between the internal environment of the tube cavity and the SLD light-emitting chip 8 and the base 12. In other words, the temperature change of the SLD light-emitting chip 8 is affected by many factors, making temperature control difficult. Since the center wavelength of an SLD light-emitting component depends on the temperature of the SLD light-emitting chip 8, the stability of the center wavelength of a traditional SLD light-emitting component is limited.

[0038] By adopting the above-mentioned solution, this invention, on the one hand, reduces heat exchange between the air inside and outside the insulation cylinder 7 by setting the insulation cylinder 7 on the base 12, thereby improving the stability of the temperature inside the insulation cylinder 7; on the other hand, this invention installs the lens 6 and the light-emitting chip 8 in different spaces. Specifically, the lens 6 is installed inside the sleeve 1, and the light-emitting chip 8 is installed inside the insulation cylinder 7, with the sleeve 1 and the insulation cylinder 7 separated by the heat insulation cylinder 2. This reduces heat transfer between the sleeve 1 and the insulation cylinder 7, further improving the stability of the temperature inside the insulation cylinder 7; additionally, by setting constrictions on the sleeve 1 and the insulation cylinder 7, airflow between them is reduced, further improving the stability of the temperature inside the insulation cylinder 7. Therefore, the factors affecting the temperature of the light-emitting chip 8 are reduced, and the temperature of the light-emitting chip 8 is controlled only by the cooling chip 9. Thus, the cooling chip 9 can more precisely control the temperature of the light-emitting chip 8, thereby enhancing the temperature control effect and improving the stability of the center wavelength of the light emitter of this invention.

[0039] like Figure 3 As shown, a support frame 3 can also be fitted onto the outer wall of the aforementioned heat insulation cylinder 2. The support frame 3 is fitted onto the inner side of the annular cylinder wall 42 to provide support for the annular cylinder wall 42. Specifically, the outer wall of the heat insulation cylinder 2 can have a recessed annular groove, and the support frame 3 is annular and is secured in the annular groove. The support frame 3 can also be made of heat insulation material to prevent heat from the heat dissipation component 4 from flowing back to the heat insulation cylinder 7.

[0040] In the above example, there is a gap between the annular cylindrical wall 42 of the heat sink 4 and the insulation cylinder 7, mainly to prevent heat from flowing back from the heat sink 4 to the insulation cylinder 7. By providing support for the annular cylindrical wall 42 with the support frame 3, the stability of the gap between the annular cylindrical wall 42 and the insulation cylinder 7 can be maintained.

[0041] like Figure 3 As shown, the aforementioned light emitter may further include a heat pipe 10, which passes through the base 12. The cold side of the heat pipe 10 contacts the hot side of the cooling chip 9, and the hot side of the heat pipe 10 contacts the heat dissipation base 41. The heat pipe 10 has high thermal conductivity, allowing it to quickly conduct heat out of the insulation cylinder 7, thus reducing the overall temperature inside the insulation cylinder 7 and further improving the heat dissipation efficiency of the light emitter of this invention.

[0042] In a specific application example, when the support frame 3 is included, the aforementioned heat pipe 10 is secured to the base 12. The annular cylindrical wall 42 has an internal thread on the side facing away from the heat dissipation base 41, and the outer side of the support frame 3 has an external thread adapted to the internal thread. The shell tube is threaded to the annular cylindrical wall 42 through the support frame 3, and the hot surface of the heat pipe 10 abuts against the heat dissipation base 41.

[0043] In the example above, the base 12 slides into the annular wall 42, and the heat pipe 10 remains relatively fixed to the base 12. The cold side of the heat pipe 10 contacts the hot side of the cooling chip 9. The base 12 is inserted into the annular wall 42, and then the shell tube is screwed on to connect the support frame 3 to the annular wall 42. This causes the hot side of the heat pipe 10 to continuously approach the heat dissipation base 41 until the hot side of the heat pipe 10 abuts against the heat dissipation base 41, preventing gaps from forming between the hot side of the heat pipe 10 and the heat dissipation base 41. This improves the stability of the contact between the hot side of the heat pipe 10 and the heat dissipation base 41, allowing the heat pipe 10 to stably transfer heat to the heat dissipation base 41 and dissipate heat through the entire heat dissipation component 4.

[0044] like Figure 3 As shown, there is a gap between the base 12 and the heat dissipation base 41 for accommodating the heat pipe 10. The annular cylindrical wall 42 may be provided with heat dissipation holes 401 that connect the gap, so that external air can flow into the gap and exchange heat with the base 12 and the inner side of the heat dissipation component 4, thereby further improving the heat dissipation efficiency of the light emitter of the present invention.

[0045] This invention also provides a method for manufacturing the aforementioned high-frequency optical transmitter with stable output, comprising the step of mounting a connector 14 on a base 12, wherein the connector 14 is a prefabricated part and has various different models. Each model of connector 14 has a different number of metal strips 142, resulting in different impedances for each model. A connector 14 model compatible with the transmission frequency of the high-frequency optical transmitter is selected, enabling the high-frequency optical transmitter to transmit high-frequency light at a set frequency and preventing the transmission of high-frequency light higher than that set frequency. For example, if a customer requires a high-frequency signal of 20-25 GHz from the optical transmitter, a connector 14 matching this frequency can be selected, eliminating the need to select a connector 14 capable of transmitting higher frequency signals, thus saving costs.

[0046] In addition, since the connector 14 is a prefabricated component, during assembly, it is only necessary to insert the connector 14 into the signal pin 13. This can save the process of soldering the metal wires and pins, thereby improving the connection and installation efficiency between the signal pin 13 and the signal pin of the light-emitting chip 8.

[0047] The working principle and preferred embodiments of the present invention are described below.

[0048] The present invention relates to the design of a high-frequency optical transmitter with stable output, which is achieved by designing the connector 14 as an integral structure, thereby keeping the metal connector 144, the connecting rod, and the metal pad 141 relatively fixed. Specifically, the connector 14 is inserted into one end of the signal pin 13 through the metal connector 144, and the signal pins of the light-emitting chip 8 are soldered to the surface 1412 of the metal pad 141.

[0049] Furthermore, the high-frequency light emitter of this invention features a split-structure design for the housing, allowing the lens 6 and the light-emitting chip 8 to be installed in different spaces. Specifically, the lens 6 is installed inside the sleeve 1, and the light-emitting chip 8 is installed inside the insulation cylinder 7. The sleeve 1 and the insulation cylinder 7 are connected by a heat insulation cylinder 2. This reduces heat transfer between the sleeve 1 and the insulation cylinder 7, thereby improving the temperature stability within the insulation cylinder 7. Additionally, by incorporating constrictions in the sleeve 1 and the insulation cylinder 7, airflow between them is reduced, further enhancing the temperature stability within the insulation cylinder 7. With fewer factors influencing the temperature of the light-emitting chip 8, its temperature is controlled solely by the cooling chip 9. This allows for more precise temperature control by the cooling chip 9, thereby strengthening the temperature control effect and improving the stability of the center wavelength of the light emitter of this invention.

[0050] It should be noted that, where there is no conflict, those skilled in the art can combine the relevant technical features in the above examples according to the actual situation to achieve the corresponding technical effects. Specific details of the various combinations will not be elaborated here.

[0051] The above description is merely a preferred embodiment of the present invention. The scope of protection of the present invention is not limited to the above embodiments. All technical solutions falling within the scope of the present invention's concept are within the scope of protection of the present invention. It should be noted that for those skilled in the art, any improvements and modifications made without departing from the principles of the present invention should also be considered within the scope of protection of the present invention.

Claims

1. A high-frequency optical transmitter capable of stable output, characterized in that, The device includes a housing, a lens (6), an axial adjustment ring (5), a light-emitting chip (8), a cooling chip (9), a base (12), signal pins (13), and a connector (14). One end of the housing is fixed to the base (12), and the other end is used to connect to the axial adjustment ring (5). The lens (6), the light-emitting chip (8), and the cooling chip (9) are all installed inside the housing, and the signal pins (13) are installed on the base (12). The connector (14) includes a connecting rod, a metal connector (144), and a metal pad (141). The connecting rod includes an insulating base rod (143) and a plurality of metal strips (142) fixedly at intervals along the outer side wall of the insulating base rod (143) in a circumferential direction. Each metal strip (142) extends from one end of the insulating base rod (143) to the other end. One end of the metal connector (144) has a first socket (1441), and the other end has a second socket (1442). The metal connector (144) is inserted into one end of the signal pin (13) near the base (12) through the first socket (1441) and is inserted into one end of the connecting rod through the second socket (1442). One end of the metal pad (141) has a third socket (1411) and the other end has a pad surface (1412) for soldering to the signal pin of the light-emitting chip (8). The metal pad (141) is inserted into the other end of the connecting rod through the third socket (1411). The connector (14) is an integral structure; The connector (14) is a prefabricated component. The connector (14) has a variety of different models. The number of metal strips (142) on each model of connector (14) is different, so that each model of connector (14) has a different impedance. The shell tube includes a heat insulation cylinder (7), a heat insulation cylinder (2), and a sleeve (1). The shell tube is fixed to the base (12) at one end of the heat insulation cylinder (7). The other end of the heat insulation cylinder (7) has a first constriction (71). The lens (6) is used to install inside the sleeve (1). One end of the sleeve (1) has a second constriction (11), and the other end has a light-passing hole (61) for light from the lens (6) to pass through. One end of the heat insulation cylinder (2) is connected to the first constriction (71), and the other end is connected to the second constriction (11). The shell tube is connected to the axial adjustment ring (5) at the other end of the sleeve (1). The light-emitting chip... Both (8) and the cooling chip (9) are installed inside the heat insulation cylinder (7). The light emitted by the light-emitting chip (8) is used to irradiate the lens (6) through the inside of the heat insulation cylinder (2). The high-frequency light emitter also includes a heat sink (4). The heat sink (4) includes a heat sink base (41) and an annular cylindrical wall (42) protruding from the heat sink base (41). The seat (12) is used to insert into the inner side of the annular cylindrical wall (42) and keep it relatively fixed with the heat sink (4). The annular cylindrical wall (42) is sleeved on the outer side of the heat insulation cylinder (7) and there is a gap between the two. The cooling chip (9) is used to conduct the heat energy on the light-emitting chip (8) to the heat sink (4).

2. The high-frequency optical transmitter with stable output according to claim 1, characterized in that, The base (12) is provided with a through hole (61) for the signal pin (13) to pass through, and a dielectric material sleeve (15) is sleeved between the signal pin (13) and the through hole (61).

3. The high-frequency optical transmitter with stable output according to claim 2, characterized in that, The dielectric material sleeve (15) has an annular flared groove (151) on the side near the heating chip. One end of the metal connector (144) is inserted into the annular flared groove (151) and transitions or interferes with the groove wall of the annular flared groove (151).

4. The high-frequency optical transmitter with stable output according to claim 3, characterized in that, The signal pin (13) extends out of the base (12).

5. A high-frequency optical transmitter capable of stable output according to any one of claims 1 to 4, characterized in that, The metal strip (142) is a metal foil attached to the outer wall of the insulating base rod (143); or, the metal strip (142) is a metal plating.

6. A method for processing a high-frequency optical emitter capable of stable output as described in any one of claims 1 to 5, characterized in that, The process includes the step of mounting the connector (14) on the base (12), wherein a connector (14) of a suitable model is selected according to the emission frequency of the high-frequency light transmitter, so that the high-frequency light transmitter can emit high-frequency light at a set frequency and cannot emit high-frequency light higher than the set frequency.

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