A high-energy composite surge protector

Abstract

The present invention relates to the technical field of surge protectors (SPDs), providing a high-energy composite SPD. This device is designed to fill a gap in high-energy composite SPDs by combining a MOV chip parallel module and a GDT parallel module in series. A thermal disconnect device and an alarm linkage device are connected to the MOV chip assembly via a temperature alloy, forming a short-circuit protection mechanism. Upon detecting a short circuit in the series branch, thermal disconnection and an alarm are simultaneously activated. A backup protection module is installed on the GDT parallel module. When the series branch opens, the high temperature generated by the discharge of the backup electrodes (upper and lower discharge electrodes) triggers the alarm device to sound an alarm. This device comprehensively protects against both short-circuit and open-circuit failures, boasting high sensitivity and maintaining grid safety. It also offers the advantages of low cost, long life, no freewheeling, and high reliability.

Description

Technical Field

[0001] The present invention relates to the technical field of surge protectors (SPDs), and in particular to a high-energy composite surge protector. Background Art

[0002] Surge protectors (SPDs) primarily consist of passive electronic components such as MOV (Metal Oxide Varistor) chips or GDTs. They exhibit unique nonlinear volt-ampere characteristics, i.e., a nonlinear relationship between current and voltage, typically characterized by a nonlinearity parameter. Under abnormal conditions, such as lightning strikes, electromagnetic interference, frequent power on / off cycles, or power system failures, the line voltage suddenly surges, exceeding the SPD's conduction voltage. The SPD enters its conduction region, where its nonlinearity parameter can reach tens or hundreds of ohms. The SPD's impedance decreases to just a few ohms, allowing the overvoltage to flow as a surge current, thereby protecting connected electronic products or expensive components. However, because MOVs are polycrystalline semiconductors, exposure to electric fields increases their leakage current, leading to aging and failure. Failure can result in a short circuit, compromising electrical safety.

[0003] Currently, high-energy SPDs primarily consist of gap-type modules, which are categorized into graphite gaps and GDTs. Graphite gap SPDs are significantly affected by climate; high and low air pressure and humidity levels can lead to unstable discharge voltages. GDTs (discharge tubes) are also more expensive. They share a common characteristic: a short circuit can cause continuous current flow, compromising power supply line safety. An open circuit can also render them ineffective, potentially damaging electronic equipment in the load. Summary of the Invention

[0004] The present invention provides a high-energy composite surge protector, which fills the gap in composite high-energy SPDs and solves the technical problems that existing high-energy SPDs are incompatible with cost and stability, and once a short circuit is formed, it will cause continuous current, thereby affecting the safety of the power supply line; once an open circuit occurs, it will lose its protective effect and cause damage to electronic equipment in the power supply load.

[0005] To solve the above technical problems, the present invention provides a high-energy composite surge protector, comprising an encapsulating shell and a pluggable module, a GDT module, and a backup protection module installed in the encapsulating shell and connected in sequence; the pluggable module comprises an MOV chip assembly, a thermal disconnect device, and an alarm linkage device, the MOV chip assembly and the thermal disconnect device are connected by temperature alloy welding, and the thermal disconnect device is mechanically connected to the alarm linkage device; the MOV chip assembly is connected in series with the GDT module; the backup protection module comprises an open circuit detection module and an alarm module, and the open circuit detection module is connected to the GDT module and the alarm module;

[0006] When the circuit is short-circuited, the MOV chip assembly generates heat and disconnects the welding connection with the thermal disconnection device. After the thermal disconnection device falls off, it pushes the alarm linkage device to trigger the alarm module to sound an alarm.

[0007] When the GDT module is open-circuited, the open-circuit detection module detects a temperature rise caused by the discharge arc, thereby triggering the alarm module to sound an alarm.

[0008] This basic solution designs a high-energy composite SPD, combining a parallel MOV chip module (i.e., a first MOV chip set and a second MOV chip set connected in parallel) with a parallel GDT module (i.e., multiple GDTs connected in parallel), filling a gap in high-energy composite SPDs. A thermal disconnect device and an alarm linkage mechanism are connected to the MOV chip assembly via a temperature alloy, creating a short-circuit protection mechanism. When a short circuit is detected in the series branch, thermal disconnection and an alarm are simultaneously activated. A backup protection module is provided on the GDT module. When an open circuit occurs in the series branch, the high temperature generated by the discharge of the backup electrodes (upper and lower discharge electrodes) triggers the alarm device. The dual short-circuit and open-circuit failure alarm mechanisms provided by this invention offer high sensitivity, safeguarding power grid safety, while also offering the advantages of low cost, long life, no freewheeling, and high reliability.

[0009] In a further embodiment, the MOV chip assembly includes a first MOV chip group and a second MOV chip group connected in parallel, and the first MOV chip group and the second MOV chip group have the same structure; the first MOV chip group includes a plug electrode, a first MOV chip, a first lead electrode, and a second MOV chip connected in sequence, and the second MOV chip is also connected to the plug electrode; the plug electrode is radially led out and connected in series with the GDT module; the first lead electrode is axially led out and welded to the thermal separation device through a temperature alloy; the first MOV chip and the second MOV chip are connected in parallel.

[0010] This solution sets up two identical MOV chip assemblies (i.e., MOV chip parallel modules) consisting of two high-energy chips (a first MOV chip and a second MOV chip) connected in parallel, and then connects them in series with the GDT module, thus filling the gap in high-energy composite SPDs. It has a passing capacity of 25KA under a 10 / 350us waveform and has the advantages of fast response speed and low residual voltage.

[0011] In a further embodiment, the GDT module includes a base plate, a lower discharge electrode, an upper plate, an upper discharge electrode, and two groups of connection sockets corresponding to the MOV chip components, a first wire pressing frame, and one GDT or more GDTs connected in parallel; the base plate and the upper plate are electrically connected to the two ends of each GDT respectively; one end of the connection socket is electrically connected to the MOV chip component, and the other end is connected to the upper plate, and each GDT is connected in series with the plug-in electrode through the connection socket; a mounting hole is provided on the outer side of the upper plate; one side of the base plate extends outward to form a second lead-out electrode, and the other side extends outward to form the lower discharge electrode; the second lead-out electrode is connected to the first wire pressing frame; the upper discharge electrode is fixed on the mounting hole and responds to the lower discharge electrode.

[0012] This solution uses multiple parallel GDTs and MOV chip components connected in series, achieving a pass-through capability of over 25K at 10 / 350µs waveforms. It offers the advantages of fast response and low residual voltage. It can effectively suppress or absorb surges in the circuit, extending product life and reliability.

[0013] In a further embodiment, the open circuit detection module includes a temperature fuse, the temperature fuse is closely attached to the lower discharge electrode and is connected in series with the alarm module;

[0014] When the GDT module is open-circuited, the discharge arc on the lower discharge electrode causes the temperature to rise, causing the thermal fuse to melt, thereby triggering the alarm module to sound an alarm.

[0015] This solution sets the temperature fuse close to the lower discharge electrode and the alarm module. It determines whether the circuit is open based on the temperature generated by the lower discharge electrode, and then triggers the alarm module to issue an alarm reminder.

[0016] In a further embodiment, the open circuit detection module includes a third spring and a buckle. The buckle is a plate-like structure with an upwardly bent middle portion. A rotating shaft is provided on the back of the middle portion. A second welding hole and a spring hole are provided on the left side from the inside to the outside. The right side bridges the switch handle and abuts against the alarm linkage device. The second welding hole is welded to the upper discharge electrode using a temperature alloy. One end of the third spring is fixed to the upper plate, and the other end is stretched and installed in the spring hole.

[0017] When the circuit is short-circuited, the MOV chip assembly generates heat and disconnects the welding connection with the thermal disconnection device. The thermal disconnection device rises and releases the alarm linkage device, causing the buckle to be lifted by the alarm module and rotate upward along the axis, thereby triggering the alarm module to sound an alarm.

[0018] When the GDT module is open-circuited, the discharge arc causes the temperature of the upper discharge electrode to rise, causing the temperature alloy to melt. The second welding hole is separated from the upper discharge electrode, and the third spring pulls the buckle to contract to the left, breaking away from the overlap with the alarm module, completing the triggering of the alarm.

[0019] This solution uses a fastener welded with a temperature alloy to perform real-time detection of whether the GDT module is open. After the GDT module is open, the temperature alloy melts and the fastener separates from the upper discharge electrode. At this time, the third spring elastically resets and pulls the fastener out of the connection with the switch handle, thereby triggering the micro switch to complete the open circuit alarm reminder; at the same time, when the circuit is short-circuited, the fastener is separated from the resistance of the alarm rod and, under the thrust generated by the upward bounce of the micro switch handle, it tilts upward along the axis and disengages from the connection with the switch handle, thereby issuing a short circuit alarm. The structure is simple and does not interfere with the short circuit alarm.

[0020] In a further embodiment, the alarm linkage device includes an assembly box, an alarm structure, and two sets of push plate structures symmetrically installed on both sides of the alarm structure; the alarm structure includes an alarm rod, a first spring, a stop plate, and a rocker plate, the stop plate is installed on the top of the alarm rod, the rocker plate is movably installed on the side of the stop plate, and the alarm rod is sleeved with the first spring and then movably passes through the assembly box; the push plate structure includes a second spring, a blocking push plate, and a lug, the blocking push plate is fixed to the assembly box by the second spring, and the lug is installed on the upper part of both sides of the blocking push plate and abuts against the rocker plate;

[0021] The assembly box is provided with a partition in the middle and symmetrical semi-enclosed box bodies on both sides. The partition extends outward to form a limiting protrusion. The middle of the box body is an inner cavity for fitting with the MOV chip assembly. The bottom is provided with a mounting notch for fitting with the extension of the plug-in electrode. A release hole for fitting with the first lead-out electrode is also provided on the side close to the push plate structure.

[0022] When the alarm linkage device is not triggered, the blocking push plate is pressed by the thermal disengagement device, and the second spring is in a compressed state; the rocker is pressed by the lug, the first spring is in a compressed state, and the alarm rod abuts against the alarm module;

[0023] After any of the alarm linkage devices is triggered, the blocking push plate is released from the pressure of the thermal disengagement device, the second spring is extended, and the blocking push plate rises; the rocker plate is tilted up to make way for release from the pressure of the lug, the stop plate is limited by the limiting protrusion, and the first spring is extended to separate the alarm rod from the alarm module to trigger the alarm. If both sets of the alarm linkage devices are triggered, the rocker plate moves simultaneously with the blocking push plates on both sides.

[0024] In a further embodiment, the thermal disconnect device includes a trip electrode sheet and an indicator plate, wherein the top of the trip electrode sheet is connected to the indicator plate, the upper portion is provided with a first welding hole, and the bottom portion passes through the assembly box and serves as a connection electrode connected to the external circuit; the first welding hole is engaged with the first lead-out electrode and is connected by temperature alloy welding;

[0025] When the circuit is short-circuited, the MOV chip assembly generates heat, causing the connection between the first lead-out electrode and the first welding hole to loosen. The upper portion of the tripping electrode sheet elastically resets outward, releasing the pressure on the blocking push plate. The blocking push plate elastically resets and pushes the indicator plate to swing outward, issuing a window alarm. At the same time, the blocking push plate cuts off the air connection between the first lead-out electrode and the tripping electrode sheet to prevent arcing that may be generated during the disconnection process.

[0026] This solution designs an alarm linkage device with an assembly box, an alarm structure, and a push plate structure, forming a sequential linkage mechanism of "MOV chip assembly-trip electrode sheet-push plate structure-alarm structure-alarm module". It can detect, feedback, and alarm circuit short circuits in a timely manner. It has a simple structure, low cost, and high equipment stability.

[0027] In a further embodiment, the alarm module includes a PCB board and a micro switch and a remote signal port mounted on the PCB board, a switch handle is provided on the top surface of the micro switch, the switch handle abuts against the alarm linkage device, and the switch handle overlaps with the open circuit detection module;

[0028] When the circuit is short-circuited, the MOV chip assembly generates heat and disconnects the welding connection with the thermal disconnect device, and the thermal disconnect device falls off, causing the alarm linkage device to separate from the switch handle, thereby triggering the micro switch to start the remote signal port alarm.

[0029] In a further embodiment, the present invention also includes installation accessories, which include a second wire pressing frame, a connecting plate and an electrode socket connected in sequence, the connecting plate is provided with an insertion through hole corresponding to the alarm rod, and the electrode socket is engaged with the connecting electrode; the second wire pressing frame is connected to the external circuit.

[0030] In a further embodiment, the packaging shell includes a base and a base box; one end of the base is provided with an upwardly protruding T-shaped partition, a first cavity is provided in the middle, and the other end is provided with an upwardly protruding socket slot, a second cavity, a card slot, and a third cavity from the inside out; the GDT module is embedded in the T-shaped partition and the first cavity; the mounting accessories are installed in the socket slot and the second cavity; the alarm module is embedded in the card slot and the third cavity;

[0031] The base box is concave in shape and is engaged with the plug-in module. The middle recess is provided with two groups of connection socket holes and electrode sockets corresponding to the MOV chip assembly and the thermal disconnect device respectively. The side is also provided with a port access hole for the remote signal port.

[0032] This solution provides a chimeric base and base box to perform integrated installation of the plug-in module, GDT module and backup protection module, further improving the stability of the device. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] Figure 1 This is an exploded view of a high-energy composite surge protector provided by Example 1 of the present invention;

[0034] Figure 2 is a three-dimensional structural diagram of the MOV chip assembly provided in Examples 1 to 4 of the present invention;

[0035] Figure 3 This is a partial structural diagram of the GDT module provided in Examples 1 to 4 of the present invention;

[0036] Figure 4 Schematic diagram of the assembly of the first MOV chipset and the GDT module provided in Examples 1 to 4 of the present invention;

[0037] Figure 5 The present invention provides embodiments 1 to 4 Figure 3 Equivalent circuit diagram of

[0038] Figure 6 is a three-dimensional structural diagram of the alarm linkage device provided in Examples 1 to 4 of the present invention before assembly;

[0039] Figure 7 is a three-dimensional structural diagram of the alarm linkage device provided in Examples 1 to 4 of the present invention after assembly;

[0040] Figure 8 Schematic diagram of the connection between the GDT module and the open circuit detection module in Example 1 or 3 provided by an embodiment of the present invention;

[0041] Figure 9 The present invention is provided in Example 1 or 3 Figure 7 Equivalent circuit diagram of

[0042] Figure 10 is a three-dimensional structural diagram of a fastener provided in Example 2 or 4 of the present invention;

[0043] Figure 11 This is a schematic diagram of the fastener provided by Embodiment 2 or 4 of the present invention when the circuit is operating normally;

[0044] Figure 12 This is a schematic diagram of a circuit short circuit failure provided by Embodiment 2 or 4 of the present invention;

[0045] Figure 13 Schematic diagram of a circuit open failure provided in Example 2 or 4 of the present invention;

[0046] Figure 14 This is a schematic diagram of the assembly of the plug-in module provided in Examples 1 to 4 of the present invention;

[0047] Figure 15 The present invention provides embodiments 1 to 4 Figure 13 The assembled three-dimensional structure diagram

[0048] Figure 16 is a three-dimensional structural diagram of the installation accessories provided in Examples 1 to 4 of the present invention;

[0049] Figure 17 is a three-dimensional structural diagram of the base provided in Example 1 or 2 of the present invention;

[0050] Figure 18 This is a schematic diagram of the assembly of the base provided in Example 1 or 2 of the present invention;

[0051] Figure 19 This is a schematic diagram of the assembly of the packaging shell A provided in Embodiment 1 or 2 of the present invention;

[0052] Figure 20 The present invention is provided in Example 1 or 2 Figure 18 Assembled three-dimensional structure diagram

[0053] Figure 21 This is a structural diagram of a four-in-one base provided by Example 3 or 4 of the present invention;

[0054] Figure 22 This is a schematic diagram of the assembly of the base 20 provided in Example 3 or 4 of the present invention;

[0055] Figure 23 This is a schematic diagram of a four-in-one base box provided by Embodiment 3 or 4 of the present invention;

[0056] Figure 24 This is a structural diagram of a four-in-one alarm module provided in Example 3 of the present invention;

[0057] Figure 25 The embodiment 3 of the present invention provides Figure 23 Equivalent circuit diagram.

[0058] Wherein: packaging shell A, base 1, T-shaped partition 11, first cavity 12, socket slot 13, second cavity 14, card slot 15, third cavity 16; base box 2, connecting socket hole 21, electrode jack 22, port access hole 23;

[0059] Plug-in module B, first MOV chip set 3, second MOV chip set 30, plug-in electrode 31, first MOV chip 32, first lead-out electrode 33, second MOV chip 34;

[0060] Thermal disconnect device 4, trip electrode sheet 41, indicator plate 42;

[0061] Alarm linkage device 5, alarm rod 50, first spring 51, stop plate 52, rocker 53; second spring 54, blocking push plate 55, lug 56; partition 57, semi-enclosed box body 58, upper box 59;

[0062] GDT module 6; bottom plate 61, second extraction electrode 611, lower discharge electrode 612, top plate 62, upper discharge electrode 63, connection socket 64, first pressing frame 65, GDT (gas discharge tube) 66;

[0063] Backup protection module C; open circuit detection module 7 (not shown), temperature fuse 71, third spring 72, buckle 73; alarm module 8, PCB board 81, micro switch 82, remote signal port 83, switch handle W1;

[0064] Install accessories 9, second wire pressing frame 91, connecting plate 92, and electrode socket 93. DETAILED DESCRIPTION

[0065] The following describes the embodiments of the present invention in detail with reference to the accompanying drawings. The embodiments are provided for illustrative purposes only and are not to be construed as limiting the present invention. The accompanying drawings are provided for reference and illustration only and do not constitute a limitation on the scope of protection of the present invention. Many changes may be made to the present invention without departing from the spirit and scope of the present invention.

[0066] Example 1

[0067] The embodiment of the present invention provides a high energy composite surge protector, such as Figures 1 to 8 、 Figures 13 to 19As shown, in this embodiment, it includes a packaging shell A and a plug-in module B, a GDT module 6, and a backup protection module C installed in the packaging shell A and connected in sequence; the plug-in module B includes an MOV chip assembly, a thermal disconnect device 4, and an alarm linkage device 5, the MOV chip assembly and the thermal disconnect device 4 are connected by temperature alloy welding, and the thermal disconnect device 4 is mechanically connected to the alarm linkage device 5; the MOV chip assembly and the GDT module 6 are connected in series; the backup protection module C includes an open circuit detection module 7 and an alarm module 8, and the open circuit detection module 7 is connected to the GDT module 6 and the alarm module 8;

[0068] When the circuit is short-circuited, the MOV chip component heats up and disconnects the solder connection with the thermal disconnect device 4. After the thermal disconnect device 4 falls off, it pushes the alarm linkage device 5 to trigger the alarm module 8 to sound an alarm.

[0069] When the GDT module 6 is open-circuited, the open-circuit detection module 7 detects the temperature rise caused by the discharge arc, and then triggers the alarm module 8 to sound an alarm.

[0070] In this embodiment, the MOV chip assembly includes a first MOV chip group 3 and a second MOV chip group 30 connected in parallel. The first MOV chip group 3 and the second MOV chip group 30 have the same structure. The first MOV chip group 3 includes a plug electrode 31, a first MOV chip 32, a first lead electrode 33, and a second MOV chip 34 connected in sequence. The plug electrode 31 is radially led out and connected in series with the GDT module 6. The first lead electrode 33 is axially led out and welded to the thermal release device 4 via a temperature alloy.

[0071] Specifically, one end of the plug-in electrode 31 is connected to the outer side wall of the first MOV chip 32 and the second MOV chip 34 respectively, and the other end is radially led out and connected in series with the GDT module 6; one end of the first lead-out electrode 33 is embedded in the gap between the first MOV chip 32 and the second MOV chip 34, and is electrically connected to the first MOV chip 32 and the second MOV chip 34 respectively, and the other end is axially led out and welded to the tripping electrode sheet 41 in the thermal disconnect device 4 through a temperature alloy.

[0072] The first MOV chip 32 and the second MOV chip 34 are connected in parallel.

[0073] This embodiment provides two identical MOV chip assemblies consisting of two high-energy chips (a first MOV chip 32 and a second MOV chip 34) connected in parallel (i.e., forming a MOV chip parallel module), which are then connected in series with a GDT module. This fills the gap in high-energy composite SPDs and has a flow rate capability of more than 25kA under a 10 / 350us waveform. It has the advantages of fast response, low residual voltage, and long service life.

[0074] In this embodiment, the GDT module 6 includes a base plate 61, a top plate 62, an upper discharge electrode 63, a connection socket 64 for two corresponding MOV chip assemblies (i.e., the first MOV chip set 3 and the second MOV chip set 30), a first wire pressing frame 65, and one GDT 66 or more parallel GDTs 66 (i.e., gas discharge tubes). The base plate 61 and the top plate 62 are electrically connected to both ends of the multiple GDTs 66, respectively. One end of the connection socket 64 is electrically connected to the MOV chip assembly and the other end is connected to the top plate 62. The multiple GDTs 66 are connected to form a GDT parallel module through the base plate 61 and the top plate 62, and are connected in series with the plug-in electrode through the corresponding connection socket. A mounting hole is defined on the outer side of the top plate 62. One side of the base plate 61 extends outward to form a second lead-out electrode 611, and the other side extends outward to form a lower discharge electrode 612. The second lead-out electrode 611 is connected to the first wire pressing frame 65. The upper discharge electrode 63 is fixed to the mounting hole and corresponds to the lower discharge electrode 612.

[0075] The first wire pressing frame 65 is connected to an external circuit.

[0076] See equivalent circuit Figure 5 , GDT66 (gas discharge tube) connected in parallel and in series with any MOV chip. Adjust the discharge distance from the discharge electrode tip on the upper discharge electrode 63 to the lower discharge electrode 612 so that the discharge voltage is 1.5 to 5 times higher than the GDT discharge voltage (the specific value can be adjusted according to actual conditions).

[0077] This embodiment provides multiple parallel-connected GDTs 66 connected in series with the MOV chip assembly, thereby effectively suppressing or absorbing surges in the circuit and protecting the power circuit from surge interference. Due to the presence of the GDT, the MOV does not withstand the grid voltage under normal operating conditions and no leakage current is generated, thereby extending the product life and improving the product cost-effectiveness.

[0078] In this embodiment, the open circuit detection module 7 includes a temperature fuse 71, which is closely attached to the lower discharge electrode 612, and its circuit is connected in series with the micro switch 82;

[0079] When the GDT module 6 is open, the lower discharge electrode 612 rises in temperature due to the discharged arc, causing the thermal fuse 71 to melt, disconnecting the electrical connection with the micro switch 82, and the micro switch 82 issues an alarm through the remote signal port 83.

[0080] In this embodiment, the temperature fuse 71 is set close to the lower discharge electrode 612 and the alarm module 8. The temperature generated by the lower discharge electrode 612 determines whether the circuit is open, and then triggers the alarm module 8 to issue an alarm reminder.

[0081] In this embodiment, the alarm linkage device 5 includes an assembly box, an alarm structure, and two sets of push plate structures symmetrically mounted on either side of the alarm structure. The alarm structure includes an alarm rod 50, a first spring 51, a stop plate 52, and a rocker plate 53. The stop plate 52 is mounted on the top of the alarm rod 50, and the rocker plate 53 is movably mounted on the side of the stop plate 52. The alarm rod 50 is sleeved with the first spring 51 and then movably penetrates the assembly box. The push plate structure includes a second spring 54, a blocking push plate 55, and a lug 56. The blocking push plate 55 is fixed to the assembly box by the second spring 54. The lugs 56 are mounted on the upper portions of the blocking push plate 55 on both sides and abut against the rocker plate 53.

[0082] The lower portion of the blocking push plate 55 is an open groove, and one end of the second spring is fixed in the open groove.

[0083] The alarm linkage device 5 also includes an upper box 59 that matches the assembly box. Active pages are also provided on both sides of the upper box 59. The active pages are provided with a combination of convex and concave grooves. When the plug-in module B is embedded and installed on the packaging shell A, the active pages on both sides of the upper box 59 are pushed inward to deform, which is convenient for inserting the plug-in module B. After the plug-in module B is in place, the active pages are released (the active pages are not completely elastically reset). At this time, the convex and concave grooves on the active pages are squeezed and positioned with the packaging shell A; similarly, when replacing the plug-in module B, first push the active pages on both sides of the upper box 59 to deform inward, loosen the packaging shell A, and facilitate the removal of the plug-in module B.

[0084] The assembly box is provided with a partition 57 in the middle and symmetrical semi-enclosed box bodies 58 on both sides. The partition 57 extends outward to form a limiting protrusion. The middle of the box body is an inner cavity for the MOV chip assembly (i.e., the first MOV chip group 3 and the second MOV chip group 30). The bottom is provided with a mounting notch for the extension of the plug electrode 31. A release hole for the first lead-out electrode 33 is also provided on the side near the push plate structure.

[0085] When the alarm linkage device 5 is not triggered, the blocking push plate 55 is pressed by the thermal disengagement device 4, and the second spring 54 is in a compressed state; the rocker 53 is pressed by the lug 56, the first spring 51 is in a compressed state, and the alarm rod 50 abuts against the alarm module 8;

[0086] After the alarm linkage device 5 is triggered, the blocking push plate 55 is separated from the pressure of the thermal separation device 4, the second spring 54 is extended, and the blocking push plate 55 rises; the rocker 53 is tilted up to make way for separation from the pressure of the lug 56, the stop plate 52 is limited by the limiting protrusion, and the first spring 51 is extended to separate the alarm rod 50 from the alarm module 8 to trigger the alarm.

[0087] In this embodiment, the thermal disconnect device 4 includes a trip electrode sheet 41 and an indicator plate 42. The top of the trip electrode sheet 41 is connected to the indicator plate 42. The top portion of the trip electrode sheet 41 is provided with a first welding hole. The bottom portion passes through the assembly box and serves as a connection electrode to the external circuit. The first welding hole is engaged with the first lead-out electrode 33 and is connected by temperature alloy welding.

[0088] When a short circuit occurs, the MOV chip assembly heats up, disconnecting the first lead-out electrode 33 from the first weld hole. The upper portion of the tripping electrode plate 41 elastically returns outward, releasing the pressure on the tripping push plate 55. The tripping push plate 55 elastically returns to its original position and pushes the indicator plate 42 to swing outward, triggering a window alarm. Simultaneously, the tripping push plate 55 cuts off the air connection between the first lead-out electrode 33 and the tripping electrode plate 41, preventing arcing that might otherwise occur during the disconnection process.

[0089] The indicator plate 42 may be coated with corresponding warning pigments to form a color-changing warning. The specific color selection may be set as needed, such as red or green.

[0090] In this embodiment, the alarm linkage device 5 is designed with an assembly box, an alarm structure, and a push plate structure, forming a sequential linkage mechanism of "MOV chip assembly-trip electrode sheet 41-push plate structure-alarm structure-alarm module 8", which can detect, feedback, and alarm circuit short circuits in a timely manner. It has a simple structure, low cost, and high equipment stability.

[0091] In this embodiment, the alarm module 8 includes a PCB board 81 and a micro switch 82 and a remote signal port 83 mounted on the PCB board 81. The top surface of the micro switch 82 is provided with a switch handle W1, which abuts against the alarm linkage device 5 and overlaps with the open circuit detection module 7.

[0092] When the circuit is short-circuited, the MOV chip assembly heats up and disconnects the welding connection with the thermal disconnect device 4. The thermal disconnect device 4 falls off, causing the alarm linkage device 5 to separate from the switch handle W1, thereby triggering the micro switch 82 to start the remote signal port 83 to alarm.

[0093] In this embodiment, the present invention also includes an installation accessory 9, which includes a second wire pressing frame 91, a connecting plate 92 and an electrode socket 93 connected in sequence. The connecting plate 92 is provided with an insertion hole corresponding to the alarm rod 50, and the electrode socket 93 is engaged with the connecting electrode; the second wire pressing frame 91 is connected to the external circuit.

[0094] In this embodiment, the packaging shell A includes a base 1 and a base box 2; one end of the base 1 is provided with an upwardly protruding T-shaped partition 11, a first cavity 12 is provided in the middle, and the other end is provided with an upwardly protruding socket slot 13, a second cavity 14, a card slot 15, and a third cavity 16 from the inside out; the first pressing frame 65 of the GDT module 6 is embedded in the two symmetrical cavities formed by the T-shaped partition 11, and the bottom plate 61 of the GDT module 6 is mounted on the first cavity 12; the electrode socket 93 of the mounting accessory 9 is mounted on the socket slot 13, and the second pressing frame 91 is mounted on the second cavity 14; the remote signal port 83 of the alarm module 8 is embedded in the card slot 15, and the PCB board 81 is placed on the third cavity 16;

[0095] The base box 2 is concave in shape and fits into the plug-in module B. The middle recess is provided with two groups of connection socket holes 21 and electrode sockets 22 corresponding to the MOV chip assembly and the thermal disconnect device 4, respectively. The side is also provided with a port access hole 23 for the remote signal port 83.

[0096] This embodiment provides a chimeric base 1 and a base box 2 to perform an integrated assembly installation of the plug module B, the GDT module 6 and the backup protection module C, further improving the stability of the device and the possibility of automated assembly.

[0097] This embodiment of the present invention employs a parallel MOV chip module (i.e., a first MOV chip 32 and a second MOV chip 34 connected in parallel) and a parallel GDT module (i.e., multiple GDTs connected in parallel) in series to form a high-energy composite SPD, filling a gap in high-energy composite SPDs. A thermal disconnect device 4 and an alarm linkage device 5 are connected to the MOV chip assembly via a temperature alloy, forming a short-circuit protection mechanism. When a short circuit is detected in the series branch, thermal disconnection and an alarm are simultaneously activated. A backup protection module C is provided on the GDT module 6. When an open circuit occurs in the series branch, the high temperature generated by the discharge of the backup electrodes (upper discharge electrode 612 and lower discharge electrode 63) triggers the alarm device to sound an alarm. The dual short-circuit and open-circuit failure alarm mechanisms provided by the present invention offer high sensitivity, safeguarding power grid safety, while also offering the advantages of low cost, long life, no freewheeling, and high reliability.

[0098] Example 2

[0099] The difference between this embodiment and embodiment 1 lies in the difference of the open circuit detection module 7, see Figures 9 to 12The open circuit detection module 7 in this embodiment includes a third spring 72 and a latch 73. The latch 73 is a plate-like structure with an upwardly bent middle portion. A rotating shaft is provided on the back of the middle portion of the plate-like structure. A second welding hole and a spring hole are provided on the left side from the inside outward. The right side overlaps the switch handle W1, and the alarm rod 50 is pressed against the top surface of the right side of the latch 73. The second welding hole is welded to the upper discharge electrode 63 using a temperature alloy. One end of the third spring 72 is fixed to the upper plate 62, and the other end is stretched and installed in the spring hole.

[0100] When the circuit is short-circuited, the MOV chip assembly heats up and disconnects the solder connection with the thermal disconnect device 4. The thermal disconnect device 4 rises and releases the alarm linkage device 5. The release elastic force of the micro switch 82 causes the switch handle W1 to tilt upward, pushing up the right side plane of the buckle 73, causing it to rotate upward along the axis, making way for the release of the micro switch 82, thereby activating the remote signal port 83 to alarm.

[0101] When the GDT module 6 is open, the discharge arc causes the temperature of the upper discharge electrode 63 to rise, causing the temperature alloy to melt. The second welding hole is separated from the upper discharge electrode 63, and the third spring 72 pulls the buckle 73 to retract to the left, breaking away from the overlap with the switch handle W1, thereby triggering the micro switch 82 and sounding an alarm through the remote signal port 83.

[0102] In this embodiment, a latch 73 welded with a temperature alloy performs real-time detection of whether the GDT module 6 is open-circuited. After the circuit is open, the temperature alloy melts, and the latch separates from the upper discharge electrode 63. At this time, the third spring 72 elastically resets and pulls the latch 73 out of contact with the switch handle W1, thereby triggering the microswitch 82 to provide an open-circuit alarm. At the same time, when the circuit is short-circuited, the latch 73 disengages from the resistance of the alarm rod 50, releasing the switch handle W1 of the microswitch 82 (i.e., the switch handle W1 tilts upward). At this time, the right side plane of the latch 73 rotates upward along the axis, thereby providing a short-circuit alarm. This structure is simple and does not interfere with the short-circuit alarm.

[0103] Example 3

[0104] The difference between this embodiment and embodiment 1 lies in the difference in the packaging box A: multiple sets of composite surge protectors are set as a multi-in-one, for example, see Figures 20 to 24 The base 1 of this embodiment is the four-in-one base 1 in embodiment 1. Similarly, the base box 2 is also the four-in-one base box 2 in embodiment 1.

[0105] In this embodiment, a remote signaling port 83 is used and connected in series with the PCB board 81, so that the remote signaling port 83 is connected in series with each micro switch 82; and the micro switches 82 are connected in parallel.

[0106] Example 4

[0107] The difference between this embodiment and embodiment 2 lies in the difference in the packaging box A: multiple sets of composite surge protectors are set as a multi-position integrated device, for example, see Figure 20 to Figure 22 The base 1 of this embodiment is the four-in-one base 1 in embodiment 1. Similarly, the base box 2 is also the four-in-one base box 2 in embodiment 1.

[0108] In this embodiment, a remote signaling port 83 is used and connected in series with the PCB board 81, so that the remote signaling port 83 is connected in series with each micro switch 82; and the micro switches 82 are connected in parallel.

[0109] The above embodiments are preferred implementation modes of the present invention, but the implementation modes of the present invention are not limited to the above embodiments. Any other changes, modifications, substitutions, combinations, and simplifications that do not deviate from the spirit and principles of the present invention should be considered as equivalent replacement methods and are included in the scope of protection of the present invention.

Claims

1. A high-energy composite surge protector, characterized by: It includes a packaging shell and a plug-in module, a GDT module and a backup protection module installed in the packaging shell and connected in sequence; The plug-in module includes an MOV chip assembly, a thermal disconnect device, and an alarm linkage device. The MOV chip assembly is connected to the thermal disconnect device by temperature alloy welding, and the thermal disconnect device is mechanically connected to the alarm linkage device. The MOV chip assembly is connected in series with the GDT module. The backup protection module includes an open circuit detection module and an alarm module. The open circuit detection module is connected to the GDT module and the alarm module. When the circuit is short-circuited, the MOV chip assembly generates heat and disconnects the welding connection with the thermal disconnection device. After the thermal disconnection device falls off, it pushes the alarm linkage device to trigger the alarm module to sound an alarm. When the GDT module is open, the open circuit detection module detects the temperature rise caused by the discharge arc, thereby triggering the alarm module to alarm; The MOV chip assembly includes a first MOV chip group and a second MOV chip group connected in parallel, and the first MOV chip group and the second MOV chip group have the same structure; the first MOV chip group includes a plug electrode, a first MOV chip, a first lead electrode, and a second MOV chip connected in sequence, and the second MOV chip is also connected to the plug electrode; the plug electrode is radially led out and connected in series with the GDT module; the first lead electrode is axially led out and welded to the thermal release device via a temperature alloy; The alarm linkage device includes an assembly box, an alarm structure, and two sets of push plate structures symmetrically installed on both sides of the alarm structure; the alarm structure includes an alarm rod, a first spring, a stop plate and a rocker plate, the stop plate is installed on the top of the alarm rod, the rocker plate is movably installed on the side of the stop plate, and the alarm rod is sleeved with the first spring and then movably passes through the assembly box; the push plate structure includes a second spring, a blocking push plate and a lug, the blocking push plate is fixed to the assembly box by the second spring, and the lug is installed on the upper part of both sides of the blocking push plate and abuts against the rocker plate; The assembly box is provided with a partition in the middle and symmetrical semi-enclosed box bodies on both sides. The partition extends outward to form a limiting protrusion. The middle of the box body is an inner cavity for fitting with the MOV chip assembly. The bottom is provided with a mounting notch for fitting with the extension of the plug-in electrode. A release hole for fitting with the first lead-out electrode is also provided on the side close to the push plate structure. When the alarm linkage device is not triggered, the blocking push plate is pressed by the thermal disengagement device and the second spring is in a compressed state; The seesaw is pressed by the lug, the first spring is in a compressed state, and the alarm rod abuts against the alarm module; After the alarm linkage device is triggered, the blocking push plate is released from the pressure of the thermal disengagement device, the second spring is extended, and the blocking push plate rises; the rocker plate is tilted and released from the pressure of the lug, the stop plate is limited by the limiting protrusion, and the first spring is extended to separate the alarm rod from the alarm module, triggering an alarm; The alarm module includes a PCB board and a micro switch and a remote signal port installed on the PCB board. The top surface of the micro switch is provided with a switch handle.

2. A high-energy composite surge protector according to claim 1, characterized in that: The GDT module includes a bottom plate, a lower discharge electrode, an upper plate, an upper discharge electrode, two sets of connection sockets corresponding to the MOV chip components, a first wire pressing frame, and one GDT or more GDTs connected in parallel; the bottom plate and the upper plate are electrically connected to the two ends of each GDT respectively; one end of the connection socket is electrically connected to the MOV chip component, and the other end is connected to the upper plate, and each GDT is connected in series with the plug-in electrode through the connection socket; a mounting hole is provided on the outer side of the upper plate; one side of the bottom plate extends outward to form a second lead-out electrode, and the other side extends outward to form the lower discharge electrode; the second lead-out electrode is connected to the first wire pressing frame; the upper discharge electrode is fixed on the mounting hole and corresponds to the lower discharge electrode.

3. A high-energy composite surge protector according to claim 2, characterized in that: The open circuit detection module includes a temperature fuse, which is closely attached to the lower discharge electrode and is connected in series with the alarm module; When the GDT module is open-circuited, the discharge arc on the lower discharge electrode causes the temperature to rise, causing the thermal fuse to melt, thereby triggering the alarm module to sound an alarm.

4. A high-energy composite surge protector according to claim 2, characterized in that: The open circuit detection module includes a third spring and a buckle. The buckle is a plate-like structure with an upwardly bent middle portion. A rotating shaft is provided on the back of the middle portion. A second welding hole and a spring hole are provided on the left side from the inside to the outside. The right side bridges the switch handle and abuts the alarm linkage device. The second welding hole is welded to the upper discharge electrode using a temperature alloy. One end of the third spring is fixed to the upper plate, and the other end is stretched and installed in the spring hole. When the circuit is short-circuited, the MOV chip assembly generates heat and disconnects the welding connection with the thermal disconnection device. The thermal disconnection device rises and releases the alarm linkage device, causing the buckle to be lifted by the alarm module and rotate upward along the axis, thereby triggering the alarm module to sound an alarm. When the GDT module is open-circuited, the discharge arc causes the temperature of the upper discharge electrode to rise, causing the temperature alloy to melt. The second welding hole is separated from the upper discharge electrode, and the third spring pulls the buckle to contract to the left, breaking away from the overlap with the alarm module, completing the triggering of the alarm.

5. The high-energy composite surge protector according to claim 1, characterized in that: The thermal disconnect device includes a trip electrode sheet and an indicator plate. The top of the trip electrode sheet is connected to the indicator plate. The top portion is provided with a first welding hole. The bottom portion passes through the assembly box and serves as a connection electrode to the external circuit. The first welding hole is engaged with the first lead-out electrode and is connected by temperature alloy welding. When the circuit is short-circuited, the MOV chip assembly generates heat and the temperature alloy melts, causing the connection between the first lead electrode and the first welding hole to loosen. The upper portion of the tripping electrode sheet elastically resets outward, releasing the pressure on the blocking push plate. The blocking push plate elastically resets and pushes the indicator plate to swing outward, issuing a window alarm.

6. The high-energy composite surge protector according to claim 1, characterized in that: The switch handle abuts against the alarm linkage device, and the switch handle is connected to the open circuit detection module; When the circuit is short-circuited, the MOV chip assembly generates heat and disconnects the welding connection with the thermal disconnect device, and the thermal disconnect device falls off, causing the alarm linkage device to separate from the switch handle, thereby triggering the micro switch to start the remote signal port alarm.

7. The high-energy composite surge protector according to claim 5, characterized in that: It also includes installation accessories, which include a second wire pressing frame, a connecting plate and an electrode socket connected in sequence, the connecting plate is provided with an insertion through hole corresponding to the alarm rod, and the electrode socket is engaged with the connecting electrode; the second wire pressing frame is connected to the external circuit.

8. The high-energy composite surge protector according to claim 7, characterized in that: The packaging shell includes a base and a base box; one end of the base is provided with an upwardly protruding T-shaped partition, a first cavity is provided in the middle, and the other end is provided with an upwardly protruding socket slot, a second cavity, a card slot, and a third cavity from the inside out; the GDT module is embedded in the T-shaped partition and the first cavity; the mounting accessories are installed in the socket slot and the second cavity; the alarm module is embedded in the card slot and the third cavity; The base box is concave in shape and is engaged with the plug-in module. The middle recess is provided with two groups of connection socket holes and electrode sockets corresponding to the MOV chip assembly and the thermal disconnect device respectively. The side is also provided with a port access hole for the remote signal port.

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