Photosensitive resin composition, cured film, and display device

Abstract

The photosensitive resin composition according to the first mode of the present invention can suppress post-development residue under high-temperature pre-baking conditions and can suppress post-development pattern peeling. In addition, a cured film that is suitably incorporated in an organic EL display having excellent light emission characteristics that can be driven at low voltage and excellent reliability of a light emission element can be provided. The photosensitive resin composition contains (A) an alkali-soluble resin and (C) a photosensitive agent, further contains (F1) a compound having a phosphorus atom and an aliphatic group having a valence of 1 to 2 and a carbon atom number of 6 to 30, and / or (FB) a trimethylammonium lactone compound having a phosphorus atom and a trimethylammonium lactone structure. The organic EL display according to the second mode of the present invention can provide an organic EL display having excellent light emission characteristics that can be driven at low voltage when a desired current density is obtained and excellent reliability of a light emission element. The organic EL display has a transparent conductive oxide film layer containing at least indium in a top layer of a first electrode, and a detection intensity of phosphorus ions (P-) at a position 3 nm in depth from a surface of the transparent conductive oxide film layer is a specific intensity.

Description

Technical Field

[0001] This invention relates to photosensitive resin compositions, cured films, organic EL displays, display devices, and methods for manufacturing cured films. Background Technology

[0002] In recent years, products using organic electroluminescent (hereinafter, "EL") displays have been widely developed for display devices with thin displays, such as smartphones, tablet PCs, and televisions.

[0003] To improve the light-emitting characteristics and reliability of organic EL displays, highly heat-resistant photosensitive compositions are used in the pixel segmentation layer, thin-film transistor (TFT) planarization layer, TFT protective layer, interlayer insulating layer, or gate insulating layer during TFT array formation. Particularly for the pixel segmentation layer, it is necessary to expose the first electrode, which becomes the anode, through photolithography, while simultaneously suppressing development residue on the anode surface (which becomes the opening) and ensuring pattern adhesion during development.

[0004] Examples of photosensitive compositions include negative photosensitive compositions containing a dispersant having a quaternary ammonium salt group and a tertiary amino group, and a dispersant having a phosphate group at the end as an adsorption group (see Patent Document 1); negative photosensitive compositions containing polyoxyethylene alkyl ether phosphate (see Patent Document 2); and negative photosensitive compositions containing a first resin such as polyimide and a second resin such as a polyimide precursor (see Patent Document 3).

[0005] In particular, to improve the light-emitting characteristics of organic EL displays, low-voltage driving allows for high brightness and energy savings because a high current flows at the desired voltage. Furthermore, high reliability of the light-emitting element improves the durability of the organic EL display. Therefore, in order to obtain the desired current density, in addition to excellent light-emitting characteristics that enable low-voltage driving, excellent reliability of the light-emitting element is also required.

[0006] Examples of organic EL displays include those where the total content of metal elements and / or halogen elements in the pixel segmentation layer and / or planarization layer is set within a specific range (see Patent Document 4).

[0007] Existing technical documents

[0008] Patent documents

[0009] Patent Document 1: Japanese Patent Application Publication No. 2018-205605

[0010] Patent Document 2: Japanese Patent Application Publication No. 1999-052563

[0011] Patent Document 3: International Publication No. 2017 / 057281

[0012] Patent Document 4: International Publication No. 2018 / 123853 Summary of the Invention

[0013] The problem that the invention aims to solve

[0014] In the coating process of photosensitive compositions, the thermal reaction during pre-baking sometimes reduces the alkali solubility of the components in the coating, leading to the dominant formation of development residue on the anode surface, which becomes the opening. Particularly when the photosensitive composition has negative photosensitivity, since the opening is equivalent to the unexposed area, the reduced alkali solubility during pre-baking becomes a major factor significantly worsening the development residue. Therefore, to improve the light-emitting characteristics and reliability of organic EL displays, materials with properties capable of suppressing post-development residue under high-temperature pre-baking conditions and suppressing pattern peeling after development are required as properties of the photosensitive composition. Furthermore, materials with properties that can provide a curing film suitable for use in organic EL displays with excellent light-emitting characteristics that can be driven at low voltage and with excellent reliability of the light-emitting elements are also required. However, none of the aforementioned properties of the photosensitive compositions described in the above-mentioned documents as materials for use in organic EL displays are sufficient.

[0015] Furthermore, none of the aforementioned characteristics of the display device described in the above-mentioned documents are sufficient. The object of the present invention is to provide a display device that, when achieving the desired current density, possesses excellent light-emitting characteristics that can be driven at low voltage and exhibits excellent reliability of the light-emitting element. Summary of the Invention

[0017] To address the aforementioned issues, the photosensitive resin composition of the first embodiment of the present invention comprises (A) an alkali-soluble resin and (C) a photosensitizer, and the photosensitive resin composition further comprises: (F1) a compound having a phosphorus atom and a 1- to 2-valent aliphatic group having 6 to 30 carbon atoms; and / or (FB) a trimethylammonium acetyl lactone compound having a phosphorus atom and a trimethylammonium acetyl lactone structure.

[0018] Furthermore, as a second aspect of the display device of the present invention, it is an organic EL display having at least a substrate, a first electrode, a second electrode, and a pixel segmentation layer, and also having an organic EL layer containing a light-emitting layer. The pixel segmentation layer is formed in a manner that overlaps with a portion of the first electrode. The organic EL layer containing the light-emitting layer is formed on the first electrode and between the first electrode and the second electrode. The outermost layer on the light-emitting layer side of the first electrode has a transparent conductive oxide film layer containing at least indium. Phosphorus ions (P2O3) at a depth of 3 nm from the surface of the transparent conductive oxide film layer on the side in contact with the light-emitting layer, measured by time-of-flight secondary ion mass spectrometry in the region on the transparent conductive oxide film layer where the organic EL layer containing the light-emitting layer is formed, are also included. - The detection intensity is set as (P) Dep / Anode When counting, (P Dep / Anode It satisfies the general formula (PA-1).

[0019] 4≤(P Dep / Anode ≤100(PA-1)

[0020] Invention Effects

[0021] According to the photosensitive resin composition of the first aspect of the present invention, residues after development under high-temperature pre-baking conditions and pattern peeling after development can be suppressed. Furthermore, a cured film suitable for use in organic EL displays having excellent light-emitting characteristics that can be driven at low voltage and excellent reliability of the light-emitting element can be provided.

[0022] According to the display device as a second aspect of the present invention, an organic EL display can be provided which, when the desired current density is obtained, has excellent light-emitting characteristics that can be driven at low voltage and excellent reliability of the light-emitting element. Attached Figure Description

[0023] [ Figure 1 ] Figure 1 This is a process diagram illustrating, with schematic cross-section, the manufacturing process of an organic EL display using a cured film of a photosensitive resin composition for processes 1 to 7.

[0024] [ Figure 2 ] Figure 2 This is a schematic diagram illustrating the manufacturing process of steps 1 to 4 of the substrate for an organic EL display used in evaluating light emission characteristics, shown from a top view.

[0025] [ Figure 3 ] Figure 3 The following is a schematic cross-sectional view of a flexible organic EL display without a polarizing layer. Detailed Implementation

[0026] <Photosensitive Resin Composition of the First Method>

[0027] Hereinafter, a photosensitive resin composition, which is a first aspect of the present invention, will be described.

[0028] The photosensitive resin composition of the first aspect of the present invention contains (A) an alkali-soluble resin and (C) a photosensitizer, and the photosensitive resin composition further contains: (F1) a compound having a phosphorus atom and a 1- to 2-valent aliphatic group having 6 to 30 carbon atoms; and / or (FB) a trimethylammonium acetyl lactone compound having a phosphorus atom and a trimethylammonium acetyl lactone structure.

[0029] <(A) Alkali-soluble resin>

[0030] The photosensitive resin composition of the present invention contains (A) an alkali-soluble resin. (A) An alkali-soluble resin refers to a resin that is soluble in an alkaline developing solution. As (A) an alkali-soluble resin, it is preferable to impart positive or negative photosensitivity to the composition by means of the (C) photosensitizer described later, and to have the solubility to form positive or negative patterns by development with an alkaline developing solution.

[0031] From the viewpoint of low-voltage driving of light-emitting properties and improved reliability of light-emitting elements, it is preferable to contain an alkali-soluble resin (A) containing nitrogen atoms as the (A) alkali-soluble resin. By forming a cured film of a photosensitive resin composition containing an alkali-soluble resin (A) containing nitrogen atoms, cyanide ions (CN) can be formed in the display device or organic EL display described later. - The detection intensity of the first electrode is a specific intensity. Furthermore, from the viewpoint of low-voltage driving of the luminescent properties and improving the reliability of the luminescent element, the photosensitive resin composition preferably contains one or more of the group consisting of an alkali-soluble resin containing nitrogen atoms (A), a nitrogen-containing black pigment (D1a) described later, and a nitrogen-containing dispersant (E) described later.

[0032] Examples of the above-mentioned (A) alkali-soluble resins include (A1-1) polyimide, (A1-2) polyimide precursor, (A1-3) polybenzoxazole, (A1-4) polybenzoxazole precursor, (A1-5) polyamide-imide, (A2-1) polysiloxane, (A2-2) resin containing polycyclic side chains, (A2-3) acid-modified epoxy resin, and (A2-4) acrylic resin.

[0033] As the above-mentioned alkali-soluble resin (A), it preferably contains one or more of the group consisting of (A1-1) polyimide, (A1-2) polyimide precursor, (A1-3) polybenzoxazole, (A1-4) polybenzoxazole precursor, (A1-5) polyamide-imide, and (A2-1) polysiloxane.

[0034] For the photosensitive resin composition of the present invention, from the viewpoints of suppressing residue after development under high-temperature pre-baking conditions, suppressing pattern peeling after development, low-voltage driving of luminescent properties, and improving the reliability of the luminescent element, (A) the alkali-soluble resin preferably contains one or more selected from the group consisting of (A1-1) polyimide, (A1-2) polyimide precursor, (A1-3) polybenzoxazole, (A1-4) polybenzoxazole precursor, (A1-5) polyamide-imide, (A2-1) polysiloxane, (A2-2) resin containing polycyclic side chains, and (A2-3) acid-modified epoxy resin, and more preferably contains one selected from (A1-1). The polyimide contains one or more of the following: (A1-2) polyimide precursor, (A1-3) polybenzoxazole, (A1-4) polybenzoxazole precursor, (A1-5) polyamide-imide, and (A2-1) polysiloxane. More preferably, the polyimide contains one or more of the following: (A1-1) polyimide, (A1-2) polyimide precursor, (A1-3) polybenzoxazole, (A1-4) polybenzoxazole precursor, and (A1-5) polyamide-imide. Particularly preferred, the polyimide contains one or more of the following: (A1-1) polyimide, (A1-3) polybenzoxazole, and (A1-5) polyamide-imide. On the other hand, from the viewpoint of suppressing pattern peeling after development, (A) the alkali-soluble resin preferably contains one or more of the group consisting of (A2-1) polysiloxane, (A2-2) resin containing polycyclic side chains, and (A2-3) acid-modified epoxy resin.

[0035] In this invention, (A1-1) polyimide, (A1-2) polyimide precursor, (A1-3) polybenzoxazole, (A1-4) polybenzoxazole precursor, (A1-5) polyamide-imide, (A2-1) polysiloxane, (A2-2) resin containing polycyclic side chains, and (A2-3) acid-modified epoxy resin can be any of a single resin or a copolymer thereof.

[0036] From the viewpoints of suppressing pattern peeling after development, achieving low-voltage driving of luminescence characteristics, and improving the reliability of the luminescent element, the content of (A) alkali-soluble resin in all solid components of the photosensitive resin composition of the present invention, excluding the solvent, is preferably 10% by mass or more, more preferably 15% by mass or more, further preferably 20% by mass or more, even more preferably 25% by mass or more, and particularly preferably 30% by mass or more. On the other hand, from the viewpoints of improving sensitivity during exposure and suppressing pattern peeling after development, the content of (A) alkali-soluble resin is preferably 85% by mass or less, more preferably 75% by mass or less, further preferably 65% ​​by mass or less, even more preferably 55% by mass or less, and particularly preferably 45% by mass or less.

[0037] The photosensitive resin composition of the present invention may also contain (B) free radical polymerizable compounds.

[0038] When the photosensitive resin composition of the present invention contains (A) an alkali-soluble resin and (B) a free radical polymerizable compound, and the total amount of (A) the alkali-soluble resin and (B) the free radical polymerizable compound is set to 100 parts by mass, from the viewpoints of suppressing pattern peeling after development, low-voltage driving of luminescence characteristics, and improving the reliability of the luminescent element, the content of (A) the alkali-soluble resin in the photosensitive resin composition of the present invention is preferably 25 parts by mass or more, more preferably 35 parts by mass or more, and even more preferably 45 parts by mass or more. On the other hand, from the viewpoints of improving sensitivity during exposure and suppressing pattern peeling after development, the content of (A) the alkali-soluble resin is preferably 85 parts by mass or less, more preferably 75 parts by mass or less, and even more preferably 65 parts by mass or less.

[0039] <(A1-1)polyimide and (A1-2)polyimide precursor>

[0040] Examples of (A1-2) polyimide precursors include diisocyanate compounds obtained by reacting tetracarboxylic acids, corresponding tetracarboxylic dianhydrides, tetracarboxylic diacyl chlorides, or tetracarboxylic acid active diesters with diamines, diamines, and carboxyl chlorides, or products obtained by reacting trimethylsilylated diamines, which have tetracarboxylic acid residues and / or tetracarboxylic acid derivative residues, and diamine residues and / or diamine derivative residues. Examples of (A1-2) polyimide precursors include polyamic acid, polyamic acid esters, polyamic acid amides, or polyisoimides.

[0041] As (A1-1) polyimide, examples include polyimides obtained by dehydrating and cyclizing the aforementioned polyamic acid, polyamic acid ester, polyamic acid amide, or polyisoimide through heating or by using an acid or alkali reaction.

[0042] From the viewpoint of suppressing residues after development under high-temperature pre-baking conditions, reducing the voltage driving of luminescence characteristics, and improving the reliability of luminescent elements, the (A1-1) polyimide used in this invention preferably contains structural units represented by general formula (1).

[0043] [Chemical Formula 1]

[0044]

[0045] In general formula (1), R 1 R represents a 4- to 10-valent organic group. 2 R represents an organic group with a valence of 2 to 10. 3 and R 4Each group independently represents a phenolic hydroxyl group, a sulfonic acid group, a mercapto group, or a substituent represented by general formula (5) or general formula (6). p represents an integer from 0 to 6, and q represents an integer from 0 to 8. Wherein, R 3 Or R 4 When representing a phenolic hydroxyl group, the R bonded to the phenolic hydroxyl group... 1 Or R 2 This indicates an aromatic structure.

[0046] R in general formula (1) 1 Represents tetracarboxylic acid residues and / or tetracarboxylic acid derivative residues, R 2 Represents a diamine residue and / or a diamine derivative residue. Examples of tetracarboxylic acid derivatives include tetracarboxylic dianhydrides, tetracarboxylic diacyl chlorides, or tetracarboxylic acid active diesters. Examples of diamine derivatives include diisocyanate compounds or trimethylsilyl diamines. In general formula (1), R... 1 Preferably, it has one or more 4- to 10-valent organic groups selected from the group consisting of an aliphatic structure with 2 to 20 carbon atoms, an alicyclic structure with 4 to 20 carbon atoms, and an aromatic structure with 6 to 30 carbon atoms. Furthermore, R 2 Preferably, it has one or more 2- to 10-valent organic groups selected from the group consisting of an aliphatic structure with 2 to 20 carbon atoms, an alicyclic structure with 4 to 20 carbon atoms, and an aromatic structure with 6 to 30 carbon atoms. q is preferably 1 to 8. The aforementioned aliphatic, alicyclic, and aromatic structures may contain heteroatoms and may be any of the unsubstituted or substituted derivatives.

[0047] [Chemical Formula 2]

[0048]

[0049] In general formulas (5) and (6), R 19 ~R 21 Each of these groups independently represents a hydrogen atom, an alkyl group with 1 to 10 carbon atoms, an acyl group with 2 to 6 carbon atoms, or an aryl group with 6 to 15 carbon atoms. In general formulas (5) and (6), R 19 ~R 21 Each of the following is preferably a hydrogen atom, an alkyl group having 1 to 6 carbon atoms, an acyl group having 2 to 4 carbon atoms, or an aryl group having 6 to 10 carbon atoms. The alkyl, acyl, and aryl groups mentioned above can also be any of the unsubstituted or substituted derivatives.

[0050] As a (A1-1) polyimide, it is preferable to contain structural units represented by general formula (1). In terms of the percentage of structural units represented by general formula (1) in all structural units in (A1-1) polyimide, from the viewpoints of forming a low-tapered pattern after development, suppressing residues after development under high-temperature pre-baking conditions, low-voltage driving of luminescence characteristics, and improving the reliability of luminescent elements, it is preferably 50 to 100 mol%, more preferably 60 to 100 mol%, and even more preferably 70 to 100 mol%.

[0051] As the (A1-2) polyimide precursor used in this invention, from the viewpoints of suppressing residues after development under high-temperature pre-baking conditions, low-voltage driving of luminescence characteristics, and improving the reliability of luminescent elements, it is preferable to contain structural units represented by general formula (3).

[0052] [Chemical Formula 3]

[0053]

[0054] In general formula (3), R 9 R represents a 4- to 10-valent organic group. 10 R represents an organic group with a valence of 2 to 10. 11 R represents the substituent represented by the above general formula (5) or general formula (6). 12 R represents a phenolic hydroxyl group, a sulfonic acid group, or a mercapto group. 13 R represents a phenolic hydroxyl group, a sulfonic acid group, a mercapto group, or a substituent represented by the above general formula (5) or general formula (6). t represents an integer from 2 to 8, u represents an integer from 0 to 6, v represents an integer from 0 to 8, and 2 ≤ t + u ≤ 8. 12 Or R 13 When representing a phenolic hydroxyl group, the R bonded to the phenolic hydroxyl group... 9 Or R 10 This indicates an aromatic structure.

[0055] R in general formula (3) 9 Represents tetracarboxylic acid residues and / or tetracarboxylic acid derivative residues, R 10 Represents a diamine residue and / or a diamine derivative residue. Examples of tetracarboxylic acid derivatives include tetracarboxylic dianhydrides, tetracarboxylic diacyl chlorides, or tetracarboxylic acid active diesters. Examples of diamine derivatives include diisocyanate compounds or trimethylsilyl diamines. In general formula (3), R... 9 Preferably, it has one or more 4- to 10-valent organic groups selected from the group consisting of an aliphatic structure with 2 to 20 carbon atoms, an alicyclic structure with 4 to 20 carbon atoms, and an aromatic structure with 6 to 30 carbon atoms. Furthermore, R 10Preferably, it has one or more 2- to 10-valent organic groups selected from the group consisting of an aliphatic structure with 2 to 20 carbon atoms, an alicyclic structure with 4 to 20 carbon atoms, and an aromatic structure with 6 to 30 carbon atoms. v is preferably 1 to 8. The aforementioned aliphatic, alicyclic, and aromatic structures may have heteroatoms and may be any of the unsubstituted or substituted derivatives.

[0056] As a (A1-2) polyimide precursor, it is preferable to contain structural units represented by general formula (3). In terms of the percentage of structural units represented by general formula (3) in all structural units in the (A1-2) polyimide precursor, from the viewpoint of improving sensitivity during exposure, suppressing residues after development under high-temperature pre-baking conditions, low-voltage driving of luminescence characteristics, and improving the reliability of luminescent elements, it is preferably 50 to 100 mol%, more preferably 60 to 100 mol%, and even more preferably 70 to 100 mol%.

[0057] As a precursor to (A1-2) polyimide, R in the structural unit represented by general formula (3) 11 In the case of substituents represented by general formula (5), R 19 The structural unit consisting of a hydrogen atom is called an ammonic acid structural unit. The ammonic acid structural unit in the (A1-2) polyimide precursor has a carboxyl group as a tetracarboxylic acid residue and / or a tetracarboxylic acid derivative residue. As the (A1-2) polyimide precursor, R in the structural unit represented by general formula (3) 11 In the case of substituents represented by general formula (5), R 19 Structural units consisting of alkyl groups with 1 to 10 carbon atoms, acyl groups with 2 to 6 carbon atoms, or aryl groups with 6 to 15 carbon atoms are called amide ester structural units. As a (A1-2) polyimide precursor, the R in the structural unit represented by general formula (3) is... 11 The structural unit when the substituent is represented by the general formula (6) is called the amide acid amide structural unit.

[0058] From the viewpoint of improved resolution after development and the formation of a low-tapered pattern after development, it is preferable that the (A1-2) polyimide precursor contains the aforementioned amyl acid structural unit, the aforementioned amyl ester structural unit, and / or the aforementioned amyl amide structural unit. From the viewpoint of low-voltage driving of luminescence properties, it is preferable that the (A1-2) polyimide precursor contains the aforementioned amyl ester structural unit and / or the aforementioned amyl amide structural unit. Furthermore, as the (D) colorant described later, especially when containing a (D1) pigment, the aforementioned amyl ester structural unit and / or the aforementioned amyl amide structural unit can significantly improve the dispersion stability of the (D1) pigment, suppress residues after development under high-temperature pre-baking conditions, and significantly improve the low-voltage driving of luminescence properties. The (A1-2) polyimide precursor containing the amyl acid structural unit, the amyl ester structural unit, and / or the amyl amide structural unit can be synthesized by esterification and / or amidation of a portion of the carboxyl group, which is an amyl acid structural unit, including a tetracarboxylic acid residue and / or a tetracarboxylic acid derivative residue.

[0059] <(A1-3) polybenzoxazole and (A1-4) polybenzoxazole precursor>

[0060] Examples of (A1-4) polybenzoxazole precursors include dicarboxylic acid diacyl chloride obtained by reacting dicarboxylic acid, dicarboxylic acid with thionyl chloride, or dicarboxylic acid active diester, with a diaminophenol compound as a diamine, which has dicarboxylic acid residues and / or dicarboxylic acid derivative residues, and diaminophenol compound residues and / or diaminophenol compound derivative residues. Examples of (A1-4) polybenzoxazole precursors include polyhydroxyamides.

[0061] Examples of (A1-3) polybenzoxazoles include: products obtained by dehydrating and cyclizing a dicarboxylic acid with a diaminophenol compound as a diamine through a reaction with polyphosphoric acid; and products obtained by dehydrating and cyclizing the above-mentioned polyhydroxyamide through heating or a reaction using a phosphoric anhydride, a base, or a carbodiimide compound, which have dicarboxylic acid residues and / or dicarboxylic acid derivative residues, and diaminophenol compound residues and / or diaminophenol compound derivative residues.

[0062] As for the (A1-3) polybenzoxazole used in this invention, from the viewpoints of suppressing residues after development under high-temperature pre-baking conditions, low-voltage driving of luminescence characteristics, and improving the reliability of luminescent elements, it is preferable to contain structural units represented by general formula (2).

[0063] [Chemical Formula 4]

[0064]

[0065] In general formula (2), R 5 Represents 2- to 10-valent organic groups, R 6 R represents a 4- to 10-valent organic group with an aromatic structure. 7 R represents a phenolic hydroxyl group, a sulfonic acid group, a mercapto group, or a substituent represented by the above general formula (5) or general formula (6). 8 This represents a phenolic hydroxyl group, a sulfonic acid group, a mercapto group, or a substituent represented by the above general formula (5) or general formula (6). r represents an integer from 0 to 8, and s represents an integer from 0 to 6. Wherein, R... 7 When representing a phenolic hydroxyl group, the R bonded to the phenolic hydroxyl group... 5 This indicates an aromatic structure.

[0066] R in general formula (2) 5 R represents dicarboxylic acid residues and / or dicarboxylic acid derivative residues. 6 This represents residues of diaminophenol compounds and / or residues of diaminophenol derivatives. Examples of dicarboxylic acid derivatives include dicarboxylic anhydrides, dicarboxylic acyl chlorides, dicarboxylic acid active esters, tricarboxylic anhydrides, tricarboxylic acyl chlorides, tricarboxylic acid active esters, and glyoxal compounds. In general formula (2), R... 5 Preferably, it has one or more 2- to 10-valent organic groups selected from the group consisting of an aliphatic structure with 2 to 20 carbon atoms, an alicyclic structure with 4 to 20 carbon atoms, and an aromatic structure with 6 to 30 carbon atoms. Furthermore, R 6 Preferably, it has a 4-10 valent organic group with an aromatic structure having 6-30 carbon atoms. s is preferably 1-6. The aforementioned aliphatic, alicyclic, and aromatic structures may contain heteroatoms and may be any of the unsubstituted or substituted derivatives.

[0067] As (A1-3) polybenzoxazole, it is preferable to contain the structural unit represented by general formula (2). In terms of the percentage of the structural unit represented by general formula (2) in all the structural units in (A1-3) polybenzoxazole, from the viewpoints of forming a low-tapered pattern after development, suppressing residues after development under high-temperature pre-baking conditions, low-voltage driving of luminescence characteristics, and improving the reliability of the luminescent element, it is preferably 50 to 100 mol%, more preferably 60 to 100 mol%, and even more preferably 70 to 100 mol%.

[0068] As the (A1-4) polybenzoxazole precursor used in this invention, from the viewpoints of suppressing residues after development under high-temperature pre-baking conditions, low-voltage driving of luminescence characteristics, and improving the reliability of luminescent elements, it is preferable to contain structural units represented by general formula (4).

[0069] [Chemical Formula 5]

[0070]

[0071] In general formula (4), R 14 R represents a divalent to a decavalent organic group. 15 R represents a 4- to 10-valent organic group with an aromatic structure. 16 R represents a phenolic hydroxyl group, a sulfonic acid group, a mercapto group, or a substituent represented by the above general formula (5) or general formula (6). 17 R represents a phenolic hydroxyl group. 18 This represents a sulfonic acid group, a mercapto group, or a substituent represented by the above general formula (5) or general formula (6). w represents an integer from 0 to 8, x represents an integer from 2 to 8, y represents an integer from 0 to 6, and 2 ≤ x + y ≤ 8. Wherein, in R... 16 When representing a phenolic hydroxyl group, the R bonded to the phenolic hydroxyl group... 14 This indicates an aromatic structure.

[0072] R in general formula (4) 14 R represents dicarboxylic acid residues and / or dicarboxylic acid derivative residues. 15 This represents residues of diaminophenol compounds and / or residues of diaminophenol derivatives. Examples of dicarboxylic acid derivatives include dicarboxylic anhydrides, dicarboxylic acyl chlorides, dicarboxylic acid active esters, tricarboxylic anhydrides, tricarboxylic acyl chlorides, tricarboxylic acid active esters, and glyoxal compounds. In general formula (4), R... 14 Preferably, it has one or more 2- to 10-valent organic groups selected from the group consisting of an aliphatic structure with 2 to 20 carbon atoms, an alicyclic structure with 4 to 20 carbon atoms, and an aromatic structure with 6 to 30 carbon atoms. Furthermore, R 15 Preferably, it has a 4-10 valent organic group with an aromatic structure having 6-30 carbon atoms. The above-mentioned aliphatic, alicyclic, and aromatic structures may have heteroatoms and may be any of the unsubstituted or substituted derivatives.

[0073] As a (A1-4) polybenzoxazole precursor, it is preferable to contain structural units represented by general formula (4). In terms of the percentage of structural units represented by general formula (4) in all structural units in the (A1-4) polybenzoxazole precursor, from the viewpoint of improving sensitivity during exposure, suppressing residues after development under high-temperature pre-baking conditions, low-voltage driving of luminescence characteristics, and improving the reliability of luminescent elements, it is preferably 50 to 100 mol%, more preferably 60 to 100 mol%, and even more preferably 70 to 100 mol%.

[0074] The tetracarboxylic acid, dicarboxylic acid, and carboxylic acid derivatives, as well as diamines and diamine derivatives used in the synthesis of the aforementioned (A1) first resin, for example, are compounds described in International Publication No. 2017 / 057281.

[0075] <(A1-5) Polyamide-imide>

[0076] Examples of (A1-5) polyamide-imides include resins obtained by reacting tricarboxylic acids or their corresponding tricarboxylic anhydrides with diamines or diisocyanate compounds. Resins obtained by dehydrating and ring-closing the resulting resin using further heating or a reaction with a catalyst are also examples.

[0077] From the viewpoints of suppressing residues after development under high-temperature pre-baking conditions, low-voltage driving of luminescence characteristics, and improving the reliability of luminescent elements, the (A1-5) polyamide-imide used in this invention preferably has a structural unit represented by general formula (9).

[0078] [Chemical Formula 6]

[0079]

[0080] In general formula (9), R 23 R represents an organic group with a valence of 3 to 10. 24 R represents an organic group with a valence of 2 to 10. 25 and R 26 Each group independently represents a phenolic hydroxyl group, a sulfonic acid group, a mercapto group, or a substituent represented by the above general formula (5) or general formula (6). m represents an integer from 0 to 7. n represents an integer from 0 to 8. Wherein, in R 25 Or R 26 When representing a phenolic hydroxyl group, the R bonded to the phenolic hydroxyl group... 23 Or R 24 This indicates an aromatic structure.

[0081] In general formula (9), R 23 Preferably, it has a trivalent to decavalent organic group having an aliphatic structure with 2 to 20 carbon atoms, an alicyclic structure with 4 to 20 carbon atoms, or an aromatic structure with 6 to 30 carbon atoms. 24 Preferably, it has a 2-10 valent organic group with an aliphatic structure having 2-20 carbon atoms, an alicyclic structure having 4-20 carbon atoms, or an aromatic structure having 6-30 carbon atoms. n is preferably an integer from 1 to 8. R 23 Represents a tricarboxylic acid residue or a tricarboxylic acid derivative residue. R 24 This indicates a diamine residue or a diamine derivative residue. Examples of tricarboxylic acid derivatives include tricarboxylic anhydrides, tricarboxylic acid acyl chlorides, or reactive tricarboxylic acid esters. Examples of diamine derivatives include diisocyanate compounds or trimethylsilylated diamines. The aforementioned aliphatic, alicyclic, and aromatic structures may contain heteroatoms and may be either unsubstituted or substituted.

[0082] As a (A1-5) polyamide-imide, it is preferable to contain structural units represented by general formula (9). In terms of the percentage of structural units represented by general formula (9) in all structural units of (A1-5) polyamide-imide, from the viewpoints of forming a low-tapered pattern after development, suppressing residues after development under high-temperature pre-baking conditions, low-voltage driving of luminescent properties, and improving the reliability of luminescent elements, it is preferably 50 to 100 mol%, more preferably 60 to 100 mol%, and even more preferably 70 to 100 mol%.

[0083] <Structural units containing fluorine atoms>

[0084] For (A1-1) polyimide, (A1-2) polyimide precursor, (A1-3) polybenzoxazole, (A1-4) polybenzoxazole precursor, and (A1-5) polyamide-imide, from the viewpoint of improving exposure sensitivity, suppressing pattern peeling after development, and improving the reliability of the light-emitting element, structural units containing fluorine atoms are preferred. Furthermore, as the (C1) photopolymerization initiator described later, when a (C1-1) oxime ester-based photopolymerization initiator containing a group substituted with a halogen atom is used, improving the compatibility of these resins with the photopolymerization initiator can improve exposure sensitivity and suppress pattern peeling after development. Here, exposure refers to irradiation with active chemical rays (radiation), such as irradiation with visible light, ultraviolet light, electron beams, or X-rays. From the viewpoint of a commonly used light source, an ultra-high pressure mercury lamp light source capable of irradiating, for example, visible light or ultraviolet light, is preferred; more preferably, it irradiates j-rays (wavelength 313 nm), i-rays (wavelength 365 nm), h-rays (wavelength 405 nm), or g-rays (wavelength 436 nm). Hereinafter, exposure refers to irradiation with reactive chemical rays (radiation).

[0085] In (A1-1) polyimide, (A1-2) polyimide precursor, (A1-3) polybenzoxazole, (A1-4) polybenzoxazole precursor, and (A1-5) polyamide-imide, among all the structural units of each resin, if fluorine atoms are present in all structural units derived from carboxylic acids and all structural units derived from carboxylic acid derivatives, and if fluorine atoms are present in all structural units derived from amines and all structural units derived from amine derivatives, from the viewpoint of improving sensitivity during exposure and suppressing pattern peeling after development, the content ratio of structural units containing fluorine atoms in all structural units of each resin is preferably 10 to 100 mol%, more preferably 30 to 100 mol%, and even more preferably 50 to 100 mol%.

[0086] In (A1-1) polyimide, (A1-2) polyimide precursor, (A1-3) polybenzoxazole, (A1-4) polybenzoxazole precursor, and (A1-5) polyamide-imide, when fluorine atoms are present only in structural units derived from all carboxylic acids and structural units derived from all carboxylic acid derivatives, from the viewpoint of improving exposure sensitivity and suppressing pattern peeling after development, the total percentage of structural units derived from tetracarboxylic acids containing fluorine atoms, structural units derived from tetracarboxylic acid derivatives containing fluorine atoms, structural units derived from dicarboxylic acids containing fluorine atoms, and structural units derived from dicarboxylic acid derivatives containing fluorine atoms is preferably 10 to 100 mol%, more preferably 30 to 100 mol%, and even more preferably 50 to 100 mol%.

[0087] In (A1-1) polyimide, (A1-2) polyimide precursor, (A1-3) polybenzoxazole, (A1-4) polybenzoxazole precursor, and (A1-5) polyamide-imide, when only structural units from all amines and structural units from all amine derivatives have fluorine atoms, from the viewpoint of improving exposure sensitivity and suppressing pattern peeling after development, the total percentage of structural units from diamines having fluorine atoms, structural units from diamine derivatives having fluorine atoms, structural units from diaminophenol compounds having fluorine atoms, and structural units from diaminophenol compound derivatives having fluorine atoms is preferably 10 to 100 mol%, more preferably 30 to 100 mol%, and even more preferably 50 to 100 mol%.

[0088] <Other structural units>

[0089] From the viewpoint of suppressing pattern peeling after development and improving the heat resistance of the cured film, (A1-1) polyimide, (A1-2) polyimide precursor, (A1-3) polybenzoxazole, (A1-4) polybenzoxazole precursor, and (A1-5) polyamide-imide preferably contain structural units derived from aromatic carboxylic acids and / or structural units derived from aromatic carboxylic acid derivatives. Similarly, structural units derived from aromatic amines and / or structural units derived from aromatic amine derivatives are also preferred. Furthermore, from the viewpoint of suppressing pattern peeling after development and improving the adhesion between the cured film and the substrate, structural units derived from diamines having silyl or siloxane bonds are also preferred; and / or structural units derived from diamine derivatives having silyl or siloxane bonds. It should be noted that, from the viewpoint of improving the mechanical properties of the cured film, structural units derived from amines having oxyalkylene structures and / or structural units derived from amine derivatives having oxyalkylene structures are also preferred.

[0090] <End-capping agent>

[0091] From the viewpoint of improving the storage stability of the coating solution of the composition, the ends of the preferred resins (A1-1) polyimide, (A1-2) polyimide precursor, (A1-3) polybenzoxazole, (A1-4) polybenzoxazole precursor, and (A1-5) polyamide-imide are capped by end-capping agents such as monoamines, dicarboxylic anhydrides, monocarboxylic acids, monocarboxylic acid acyl chlorides, or monocarboxylic acid reactive esters.

[0092] <Introduction of olefinic unsaturated double bond groups>

[0093] When the photosensitive resin composition of the present invention has negative photosensitivity, from the viewpoint of improving sensitivity during exposure, (A1-1) polyimide, (A1-2) polyimide precursor, (A1-3) polybenzoxazole, (A1-4) polybenzoxazole precursor, and (A1-5) polyamide-imide preferably have olefinically unsaturated double bond groups. Resins in which olefinically unsaturated double bond groups are introduced onto the side chains of these resins through a reaction of introducing olefinically unsaturated double bond groups are also preferred. Furthermore, resins obtained by reacting a portion of the phenolic hydroxyl groups and / or carboxyl groups of these resins with compounds having olefinically unsaturated double bond groups are also preferred. Through the above-described reaction, olefinically unsaturated double bond groups can be introduced onto the side chains of the resin.

[0094] From a reactivity point of view, compounds having olefinic unsaturated double bonds are preferred, especially electrophilic compounds having olefinic unsaturated double bonds. From the viewpoints of reactivity and compound usability, isocyanate compounds, epoxide compounds, alcohol compounds, aldehyde compounds, ketone compounds, or carboxylic anhydrides are preferred as electrophilic compounds, with isocyanate compounds or epoxide compounds being more preferred.

[0095] <Properties of (A1-1) polyimide, (A1-2) polyimide precursor, (A1-3) polybenzoxazole, (A1-4) polybenzoxazole precursor, and (A1-5) polyamide-imide>

[0096] From the viewpoint of improving the resolution after development and the reliability of the light-emitting element, the weight-average molecular weight (hereinafter "Mw") of (A1-1) polyimide, (A1-2) polyimide precursor, (A1-3) polybenzoxazole, (A1-4) polybenzoxazole precursor, and (A1-5) polyamide-imide, based on the polystyrene conversion determined by gel permeation chromatography (hereinafter "GPC"), is preferably 1,000 or more, more preferably 3,000 or more, and even more preferably 5,000 or more. On the other hand, from the viewpoint of forming a low-tapered pattern after thermosetting and improving the pattern processability using alkaline developer, Mw is preferably 100,000 or less, more preferably 50,000 or less, even more preferably 30,000 or less, and particularly preferably 20,000 or less. (A1-1) polyimide, (A1-2) polyimide precursor, (A1-3) polybenzoxazole, (A1-4) polybenzoxazole precursor, and (A1-5) polyamide-imide can be synthesized by known methods.

[0097] <(A2-1) Polysiloxane>

[0098] As the (A2-1) polysiloxane, examples include polysiloxanes obtained by hydrolyzing one or more selected from the group consisting of trifunctional organosilanes, tetrafunctional organosilanes, difunctional organosilanes, and monofunctional organosilanes, and then dehydrating and condensing them. From the viewpoint of improving the heat resistance of the cured film, the presence of a trifunctional organosilane is preferred. Furthermore, from the viewpoint of improving sensitivity during exposure and resolution after development, the presence of a tetrafunctional organosilane unit is preferred. Furthermore, from the viewpoint of improving the mechanical properties of the cured film, a difunctional organosilane unit may also be included. On the other hand, from the viewpoint of improving the storage stability of the coating solution of the composition, a monofunctional organosilane unit may also be included.

[0099] <Trifunctional organosilane units and tetrafunctional organosilane units>

[0100] As for the (A2-1) polysiloxane used in this invention, from the viewpoints of suppressing residues after development under high-temperature pre-baking conditions, achieving low-voltage driving of luminescence characteristics, and improving the reliability of the luminescent element, it is preferable to contain trifunctional organosilane units and / or tetrafunctional organosilane units. As a trifunctional organosilane, organosilane units represented by general formula (7) are preferred, and as a tetrafunctional organosilane unit, organosilane units represented by general formula (8) are preferred.

[0101] [Chemical Formula 7]

[0102]

[0103] In general formulas (7) and (8), R 22Represents a hydrogen atom, alkyl, cycloalkyl, alkenyl, or aryl group. In general formulas (7) and (8), R 22 Preferably, the atom is hydrogen, an alkyl group having 1 to 10 carbon atoms, a cycloalkyl group having 4 to 10 carbon atoms, an alkenyl group having 2 to 10 carbon atoms, or an aryl group having 6 to 15 carbon atoms. The alkyl, cycloalkyl, alkenyl, and aryl groups mentioned above may have heteroatoms and may be any of the unsubstituted or substituted derivatives.

[0104] Examples of the aforementioned organosilanes include, for instance, the compounds described in International Publication No. 2017 / 057281.

[0105] From the viewpoint of improving the heat resistance of the cured film, the content ratio of the organosilane unit represented by general formula (7) in the (A2-1) polysiloxane, in terms of the molar ratio of Si atoms (mol ratio), is preferably 50 to 100 mol%, more preferably 60 to 100 mol%, and even more preferably 70 to 100 mol%. As the organosilane unit represented by general formula (7), an organosilane unit having an epoxy group is preferred. By including an organosilane unit having an epoxy group in the (A2-1) polysiloxane, the pattern processing capability using alkaline developer can be improved.

[0106] From the viewpoint of improving sensitivity during exposure and improving resolution after development, the content ratio of the organosilane unit represented by general formula (8) in (A2-1) polysiloxane is preferably 0 to 40 mol% based on the molar ratio of Si atoms, more preferably 0 to 30 mol%, and even more preferably 0 to 20 mol%.

[0107] <(A2-1) Properties of Polysiloxanes>

[0108] (A2-1) In polysiloxanes, the aforementioned organosilane units can be any of a regular or irregular arrangement. Examples of regular arrangements include alternating copolymerization, periodic copolymerization, block copolymerization, or graft copolymerization. Examples of irregular arrangements include random copolymerization. Furthermore, the aforementioned organosilane units can be any of a two-dimensional or three-dimensional arrangement. Examples of two-dimensional arrangements include linear chains. Examples of three-dimensional arrangements include ladder-like, cage-like, or mesh-like structures.

[0109] As for the (A2-1) polysiloxane, from the viewpoint of suppressing pattern peeling after development and improving the heat resistance of the cured film, it is preferable to contain organosilane units having aromatic groups. From the viewpoint of improving the resolution after development and improving the reliability of the light-emitting element, the Mw of the (A2-1) polysiloxane is 500 or more, based on polystyrene as measured by GPC. On the other hand, from the viewpoint of forming a low-tapered pattern after thermosetting and improving the pattern processability using alkaline developer, the Mw is preferably 50,000 or less. The (A2-1) polysiloxane can be synthesized by known methods.

[0110] <(A2-2) Resins containing polycyclic side chains>

[0111] As a (A2-2) resin containing polycyclic side chains, examples of the following (I) to (IV) resins containing polycyclic side chains can be cited.

[0112] (I) A compound obtained by reacting a polyfunctional phenolic compound with a polyfunctional carboxylic acid dianhydride, and then reacting the compound with an epoxy compound to obtain a resin containing polycyclic side chains.

[0113] (II) A compound obtained by reacting a polyfunctional phenolic compound with an epoxy compound, and a resin containing polycyclic side chains obtained by reacting the compound with a polyfunctional carboxylic acid dianhydride.

[0114] (III) A compound obtained by reacting a polyfunctional epoxy compound and a polyfunctional carboxylic acid compound, and a resin containing polycyclic side chains obtained by reacting an epoxy compound.

[0115] (IV) A compound obtained by reacting a polyfunctional epoxy compound with a carboxylic acid compound, and a resin containing polycyclic side chains obtained by reacting the compound with a polyfunctional carboxylic acid dianhydride.

[0116] Examples of phenolic compounds, epoxy compounds, carboxylic anhydrides, and carboxylic acid compounds include, for example, the compounds described in International Publication No. 2017 / 057281.

[0117] (A2-2) The resin containing polycyclic side chains is a thermosetting resin and has a structure in which the main chain and bulky side chains are connected by a single atom. From the viewpoint of having a cyclic structure as the bulky side chains and improving the heat resistance of the cured film, a fused polycyclic framework such as a fluorene ring with high heat resistance is preferred. In the case that the photosensitive resin composition of the present invention has negative photosensitivity, from the viewpoint of improving the sensitivity during exposure, the resin containing polycyclic side chains (A2-2) preferably has olefinic unsaturated double bond groups.

[0118] From the viewpoints of suppressing residues after development under high-temperature pre-baking conditions, achieving low-voltage driving of luminescence characteristics, and improving the reliability of the luminescent element, the (A2-2) resin containing polycyclic side chains used in this invention preferably contains one or more structural units selected from the group consisting of structural units represented by general formula (47), general formula (48), general formula (49), and general formula (50). Furthermore, when the photosensitive resin composition of this invention has negative photosensitivity, from the viewpoint of improving sensitivity during exposure, it is preferable to have at least one olefinic unsaturated double bond group selected from the group consisting of the resin main chain, the resin side chain, and the resin terminal.

[0119] [Chemical Formula 8]

[0120]

[0121] In general formulas (47) to (50), X 69 X 70 X 72 X 73 X 75 X 76 X 78 and X 79 Each can be used independently to represent a monocyclic or fused polycyclic hydrocarbon ring. 71 X 74 X 77 and X 80 Each of these independently represents a divalent to decavalent organic group of a carboxylic acid residue and / or a carboxylic acid derivative residue. W 1 ~W 4 Each can be used independently to represent an organic group having two or more aromatic groups. R 160 ~R 167 Each independently represents an alkyl group having 1 to 6 hydrogen atoms or carbon atoms, R 170 ~R 175 R 177 and R 178 Each can independently represent an organic group having a hydrogen atom or an alkene unsaturated double bond. R 176 It represents an alkyl group with 1 to 10 hydrogen or carbon atoms. a, b, c, d, e, f, g, and h each independently represent an integer from 0 to 10, and α, β, γ, and δ each independently represent 0 or 1.

[0122] In general formulas (47) to (50), X 69 X 70 X 72 X 73 X 75 X 76 X 78 and X79 Each is preferably a monocyclic or fused polycyclic hydrocarbon ring with 6 to 15 carbon atoms and 2 to 10 valences. Furthermore, X 71 X 74 X 77 and X 80 Each of the components is preferably composed of one or more 2- to 10-valent organic groups selected from the group consisting of an aliphatic structure with 2 to 20 carbon atoms, an alicyclic structure with 4 to 20 carbon atoms, and an aromatic structure with 6 to 30 carbon atoms. Furthermore, from the viewpoint of suppressing pattern peeling after development and improving the reliability of the light-emitting element, W 1 ~W 4 Each substituent is preferably represented by any one of the general formulas (51) to (56). Furthermore, R 170 ~R 175 R 177 and R 178 Each substituent is preferably represented by the general formula (57). The alkyl, aliphatic, alicyclic, aromatic, monocyclic, or fused polycyclic aromatic hydrocarbon rings and organic groups having olefinic unsaturated double bond groups described above may have heteroatoms and may be any of the unsubstituted or substituted products.

[0123] [Chemical Formula 9]

[0124]

[0125] In general formulas (51) to (56), R 179 ~R 182 R 185 and R 188 Each can be used independently to represent an alkyl group having 1 to 10 carbon atoms. R 183 R 184 R 186 R 187 R 189 R 191 and R 193 ~R 196 Each can independently represent a hydrogen atom, an alkyl group with 1 to 10 carbon atoms, a cycloalkyl group with 4 to 10 carbon atoms, or an aryl group with 6 to 15 carbon atoms. R 190 and R 192 Each can independently represent a hydrogen atom, an alkyl group with 1 to 10 carbon atoms, a cycloalkyl group with 4 to 10 carbon atoms, or an aryl group with 6 to 15 carbon atoms, or can be represented by R. 190 and R 192 Forming a ring. As R 190 and R 192 The formed ring, for example, is a benzene ring or a cyclohexane ring. R 183 and R184 At least one of them is an aryl group having 6 to 15 carbon atoms. R 186 and R 187 At least one of them is an aryl group having 6 to 15 carbon atoms. R 189 and R 190 At least one of them is an aryl group having 6 to 15 carbon atoms, R 191 and R 192 At least one of them is an aryl group having 6 to 15 carbon atoms, or it can be represented by R. 190 and R 192 Forming a ring. R 193 and R 194 At least one of them is an aryl group having 6 to 15 carbon atoms, R 195 and R 196 At least one of them is an aryl group with 6 to 15 carbon atoms. i, j, k, l, m, and n each independently represent integers from 0 to 4. In general formulas (51) to (56), R 190 and R 192 Each is preferably a hydrogen atom, an alkyl group having 1 to 6 carbon atoms, a cycloalkyl group having 4 to 7 carbon atoms, or an aryl group having 6 to 10 carbon atoms, as the R 190 and R 192 The formed ring is preferably a benzene ring. The alkyl, cycloalkyl, and aryl groups mentioned above can also be any of the unsubstituted or substituted derivatives.

[0126] [Chemical Formula 10]

[0127]

[0128] In general formula (57), X 81 X represents a direct bond, an alkylene chain with 1 to 10 carbon atoms, a cycloalkylene chain with 4 to 10 carbon atoms, or an arylene chain with 6 to 15 carbon atoms. 82 Represents a direct bond or an aryl chain with 6 to 15 carbon atoms. R 197 This indicates vinyl, allyl, or (meth)acrylate. In general formula (57), X 81 Preferably, it is a direct bond, an alkylene chain with 1 to 6 carbon atoms, a cycloalkylene chain with 4 to 7 carbon atoms, or an arylene chain with 6 to 10 carbon atoms. Furthermore, X 82 Preferably, it is a direct bond or an arylene chain with 6 to 10 carbon atoms. The aforementioned alkylene chain, cycloalkylene chain, arylene chain, vinyl, allyl, and (meth)acrylate group can also be any of the unsubstituted or substituted derivatives.

[0129] From the viewpoints of suppressing residues after development under high-temperature pre-baking conditions, achieving low-voltage driving of luminescent properties, and improving the reliability of luminescent elements, the resin containing polycyclic side chains (A2-2) preferably comprises structural units with fused polycyclic skeletons. As structural units with fused polycyclic skeletons, structural units with fluorene skeletons and / or indene skeletons are preferred. 1 ~W 4 When it is a general formula (51) or a general formula (53), (A2-2) the resin containing polycyclic side chains contains structural units with a fluorene skeleton or structural units with an indene skeleton.

[0130] <Acidic groups derived from carboxylic acids and acidic groups derived from carboxylic acid derivatives>

[0131] From the viewpoint of improving the pattern processing properties of alkaline developing solutions and improving the resolution after development, the resin (A2-2) containing polycyclic side chains preferably contains structural units derived from carboxylic acids and / or structural units derived from carboxylic acid derivatives, and the alkali-soluble groups preferably have acidic groups. As acidic groups, carboxyl groups, carboxylic anhydride groups, sulfonic acid groups, phenolic hydroxyl groups, or hydroxyimide groups are preferred, carboxyl groups, carboxylic anhydride groups, or phenolic hydroxyl groups are more preferred, and carboxyl groups or carboxylic anhydride groups are even more preferred.

[0132] <Properties of capping agents and (A2-2) resins containing polycyclic side chains>

[0133] As for the (A2-2) resin containing polycyclic side chains, from the viewpoint of improving the storage stability of the coating solution, it is preferable that the resin ends are capped with end-capping agents such as tricarboxylic anhydride, dicarboxylic anhydride, or monocarboxylic acid. From the viewpoint of suppressing pattern peeling after development and improving the heat resistance of the cured film, the (A2-2) resin containing polycyclic side chains preferably contains structural units derived from aromatic carboxylic acids and / or structural units derived from aromatic carboxylic acid derivatives. From the viewpoint of improving resolution after development and improving the reliability of the light-emitting element, the Mw of the (A2-2) resin containing polycyclic side chains is preferably 500 or more, based on polystyrene as measured by GPC. On the other hand, from the viewpoint of forming a low-tapered pattern after thermosetting and improving the pattern processability using alkaline developer, the Mw is preferably 50,000 or less. The (A2-2) resin containing polycyclic side chains can be synthesized by known methods.

[0134] <(A2-2) Specific examples of resins containing polycyclic side chains>

[0135] Examples of resins containing polycyclic side chains (A2-2) include "ADEKA ARKLS" (registered trademark) WR-101 or "ADEKA ARKLS" WR-301 (both manufactured by ADEKA Corporation), OGSOL (registered trademark) CR-1030 (manufactured by Osaka Gas Chemical Co., Ltd.), or TR-B201 or TR-B202 (both manufactured by TRONLY Corporation).

[0136] <(A2-3) Acid-Modified Epoxy Resin>

[0137] As acid-modified epoxy resins (A2-3), examples of acid-modified epoxy resins (I) to (VI) are as follows.

[0138] (I) An acid-modified epoxy resin obtained by reacting a polyfunctional phenolic compound with a polyfunctional carboxylic acid dianhydride and reacting the compound with an epoxy compound.

[0139] (II) An acid-modified epoxy resin obtained by reacting a polyfunctional phenolic compound with an epoxy compound and reacting the compound with a polyfunctional carboxylic acid dianhydride.

[0140] (III) An acid-modified epoxy resin obtained by reacting a polyfunctional alcohol compound with a polyfunctional carboxylic acid dianhydride and reacting the compound with an epoxy compound.

[0141] (IV) A compound obtained by reacting a polyfunctional alcohol compound and an epoxy compound, and then reacting the compound with a polyfunctional carboxylic acid dianhydride to obtain an acid-modified epoxy resin.

[0142] (V) A compound obtained by reacting a polyfunctional epoxy compound and a polyfunctional carboxylic acid compound, and an acid-modified epoxy resin obtained by reacting the epoxy compound therewith.

[0143] (VI) A compound obtained by reacting a polyfunctional epoxy compound with a carboxylic acid compound, and an acid-modified epoxy resin obtained by reacting the compound with a polyfunctional carboxylic acid dianhydride.

[0144] Examples of phenolic compounds, alcoholic compounds, epoxy compounds, carboxylic anhydrides, and carboxylic acid compounds include, for example, the compounds described in International Publication No. 2017 / 057281.

[0145] (A2-3) Acid-modified epoxy resin is a thermosetting resin. Its main chain contains structural units with aromatic groups and / or alicyclic groups as a cyclic framework. From the viewpoint of improving the heat resistance of the cured film, tricyclic [5.2.1.0] is preferred. 2,6The fused polycyclic skeleton consists of decane rings, naphthalene rings, anthracene rings, or fluorene rings. In cases where the photosensitive resin composition of the present invention exhibits negative photosensitivity, from the viewpoint of improving sensitivity during exposure, the (A2-3) acid-modified epoxy resin preferably has olefinically unsaturated double bond groups.

[0146] From the viewpoints of suppressing residues after development under high-temperature pre-baking conditions, achieving low-voltage driving of luminescence characteristics, and improving the reliability of the luminescent element, the (A2-3) acid-modified epoxy resin used in this invention preferably contains one or more structural units selected from the group consisting of structural units represented by general formula (35), general formula (36), general formula (37), general formula (38), general formula (41), general formula (42), and general formula (43). Furthermore, when the photosensitive resin composition of this invention has negative photosensitivity, from the viewpoint of improving sensitivity during exposure, it is preferable to have at least one olefinically unsaturated double bond group selected from the group consisting of the resin main chain, the resin side chain, and the resin terminal.

[0147] [Chemical Formula 11]

[0148]

[0149] In general formulas (35) to (38), X 51 ~X 54 Each can independently represent an aliphatic structure with 1 to 6 carbon atoms. Z 53 This represents aromatic structures with 10–25 carbon atoms and valences of 3–16. R 71 ~R 75 Each can independently represent an alkyl group having 1 to 10 carbon atoms, a cycloalkyl group having 4 to 10 carbon atoms, or an aryl group having 6 to 15 carbon atoms, R 76 R represents an alkyl group having 1 to 10 carbon atoms. 78 ~R 81 Each can independently represent a halogen atom, an alkyl group having 1 to 10 carbon atoms, a cycloalkyl group having 4 to 10 carbon atoms, an aryl group having 6 to 15 carbon atoms, or a substituent represented by general formula (59). R 82 The following can represent a halogen atom, an alkyl group having 1 to 10 carbon atoms, a cycloalkyl group having 4 to 10 carbon atoms, an aryl group having 6 to 15 carbon atoms, a substituent represented by general formula (58), or a substituent represented by general formula (59). R 83 ~R 88Each of the substituents represented by the general formula (39) is independently represented. a, b, c, d, and e are each independently represented by integers from 0 to 10, f is an integer from 0 to 14, h, i, j, and k are each independently represented by integers from 0 to 3, and l is an integer from 0 to 4. The alkyl, cycloalkyl, aryl, aliphatic, and aromatic structures mentioned above may have heteroatoms and may be any of the unsubstituted or substituted compounds.

[0150] Z of general formula (38) 53 The aromatic structure contains one or more of the groups selected from the terphenyl skeleton, naphthalene skeleton, anthracene skeleton, and fluorene skeleton. Furthermore, Z, as a general formula (38) 53 Other aromatic structures include, for example, the 1,2,3,4-tetrahydroxynaphthalene skeleton, the 2,2-diphenylpropane skeleton, the diphenyl ether skeleton, the diphenyl ketone skeleton, or the diphenyl sulfone skeleton.

[0151] [Chemical Formula 12]

[0152]

[0153] In general formula (58), R 168 and R 169 Each can independently represent a hydrogen atom or an alkyl group having 1 to 10 carbon atoms. R 198 R represents an alkyl group having 1 to 10 carbon atoms, or a substituent represented by general formula (59). z represents an integer from 0 to 5. In general formula (59), R 199 This represents the substituent represented by general formula (39). In general formula (39), X 55 R represents an alkylene chain with 1 to 6 carbon atoms or a cycloalkylene chain with 4 to 10 carbon atoms. 89 ~R 91 Each can independently represent a hydrogen atom, an alkyl group having 1 to 10 carbon atoms, or an aryl group having 6 to 15 carbon atoms. R 92 Represents a hydrogen atom or a substituent represented by general formula (40). In general formula (39), R 89 and R 90 Each is preferably an alkyl group having 1 to 4 carbon atoms, and more preferably a hydrogen atom. R 91 Preferably, it is an alkyl group having 1 to 4 hydrogen atoms, more preferably a hydrogen atom or a methyl group. In general formula (40), X 56 This refers to an alkylene chain with 1 to 6 carbon atoms, an alkylene chain with 1 to 6 carbon atoms, a cycloalkylene chain with 4 to 10 carbon atoms, or a cycloalkylene chain with 4 to 10 carbon atoms. In general formula (40), X 56Preferably, the alkylene chain has 1 to 4 carbon atoms, the alkylene chain has 1 to 4 carbon atoms, the cycloalkylene chain has 4 to 7 carbon atoms, or the cycloalkylene chain has 4 to 7 carbon atoms. The alkylene chain, cycloalkylene chain, alkyl group, and aryl group mentioned above can also be any of the unsubstituted or substituted derivatives.

[0154] [Chemical Formula 13]

[0155]

[0156] In general formulas (41) to (43), X 57 ~X 61 Each independently represents an aliphatic structure with 1 to 6 carbon atoms, X 62 and X 63 Each can independently represent an alkylene chain with 1 to 6 carbon atoms or a cycloalkylene chain with 4 to 10 carbon atoms. R 93 ~R 97 Each can independently represent an alkyl group having 1 to 10 carbon atoms, a cycloalkyl group having 4 to 10 carbon atoms, or an aryl group having 6 to 15 carbon atoms, R 98 ~R 104 Each can independently represent a halogen atom, an alkyl group having 1 to 10 carbon atoms, a cycloalkyl group having 4 to 10 carbon atoms, an aryl group having 6 to 15 carbon atoms, or a substituent represented by general formula (59). R 105 R represents an alkyl group having 1 to 6 hydrogen atoms or carbon atoms. 106 and R 107 Each of the substituents represented by the general formula (39) is represented independently, R 108 The terms represent hydrogen atoms, substituents represented by general formula (39), or substituents represented by general formula (40). m, n, o, p, and q each independently represent integers from 0 to 10, r and s each independently represent integers from 0 to 3, and t, u, v, w, and x each independently represent integers from 0 to 4. The aforementioned alkylene chains, cycloalkylene chains, alkyl groups, cycloalkyl groups, aryl groups, and aliphatic structures may have heteroatoms and may be any of the unsubstituted or substituted derivatives.

[0157] Among the (A2-3) acid-modified epoxy resins used in this invention, the (A2-3) acid-modified epoxy resin having a structural unit represented by general formula (43) preferably has a substituent represented by general formula (44) and / or a substituent represented by general formula (45) at the end.

[0158] [Chemical Formula 14]

[0159]

[0160] In general formula (44), R 109This represents the substituent represented by general formula (39). In general formula (45), X 64 Represents aliphatic structures with 1 to 6 carbon atoms. R 110 R represents an alkyl group having 1 to 10 carbon atoms, a cycloalkyl group having 4 to 10 carbon atoms, or an aryl group having 6 to 15 carbon atoms. 111 and R 112 Each can independently represent a halogen atom, an alkyl group with 1 to 10 carbon atoms, a cycloalkyl group with 4 to 10 carbon atoms, or an aryl group with 6 to 15 carbon atoms. R 113 The substituents represented in general formula (39) are shown. α represents an integer from 0 to 10. β and γ represent integers from 0 to 4. In general formula (45), X 64 The preferred structure is an aliphatic structure with 1 to 4 carbon atoms. 110 Preferably, the carbon atom is an alkyl group with 1 to 6 carbon atoms, a cycloalkyl group with 4 to 7 carbon atoms, or an aryl group with 6 to 10 carbon atoms. 111 and R 112 Each of the atoms is preferably a halogen atom, an alkyl group having 1 to 6 carbon atoms, a cycloalkyl group having 4 to 7 carbon atoms, or an aryl group having 6 to 10 carbon atoms.

[0161] From the viewpoints of suppressing residues after development under high-temperature pre-baking conditions, achieving low-voltage driving of luminescent properties, and improving the reliability of the luminescent element, the (A2-3) acid-modified epoxy resin preferably contains structural units with a fused polycyclic backbone. As a structural unit with a fused polycyclic backbone, it is preferable to contain a tricyclic [5.2.1.0] 2,6 The structural unit is one or more of the following: a structural unit with a decane skeleton, a structural unit with a naphthalene skeleton, a structural unit with an anthracene skeleton, and a structural unit with a fluorene skeleton. In cases where the structural unit represented by the above general formula (37) is included, or in the above general formula (38), Z 53 In the case of containing a naphthalene skeleton, anthracene skeleton, or fluorene skeleton, (A2-3) acid-modified epoxy resin contains a tricyclic [5.2.1.0] 2,6 [Structural units with a decane skeleton, structural units with a naphthalene skeleton, structural units with an anthracene skeleton, or structural units with a fluorene skeleton.]

[0162] <Acidic groups derived from carboxylic acids and acidic groups derived from carboxylic acid derivatives>

[0163] (A2-3) The acid-modified epoxy resin contains structural units derived from carboxylic acids and / or carboxylic acid derivatives, and the alkali-soluble groups include carboxyl groups and / or carboxylic anhydride groups. The presence of carboxyl groups and / or carboxylic anhydride groups improves pattern processing properties using alkaline developing solutions and enhances resolution after development. Other acidic groups may also be present. The acidic groups are preferably sulfonic acid groups, phenolic hydroxyl groups, or hydroxyimide groups, more preferably phenolic hydroxyl groups.

[0164] <Properties of End-Capping Agents and (A2-3) Acid-Modified Epoxy Resins>

[0165] As for the (A2-3) acid-modified epoxy resin, from the viewpoint of improving the storage stability of the coating solution, it is preferable that the resin ends are capped with end-capping agents such as tricarboxylic anhydride, dicarboxylic anhydride, or monocarboxylic acid. From the viewpoint of suppressing pattern peeling after development and improving the heat resistance of the cured film, the (A2-3) acid-modified epoxy resin preferably contains structural units derived from aromatic carboxylic acids and / or structural units derived from aromatic carboxylic acid derivatives. From the viewpoint of improving the resolution after development and improving the reliability of the light-emitting element, the Mw of the (A2-3) acid-modified epoxy resin is preferably 500 or more, based on polystyrene conversion measured by GPC. On the other hand, from the viewpoint of forming a low-tapered pattern after thermosetting and improving the pattern processability using alkaline developer, the Mw is preferably 50,000 or less. The (A2-3) acid-modified epoxy resin can be synthesized by known methods.

[0166] <(A2-3) Specific Examples of Acid-Modified Epoxy Resins>

[0167] Examples of acid-modified epoxy resins (A2-3) used in this invention include "KAYARAD" (registered trademark) PCR-1222H, KAYARAD CCR-1171H, KAYARAD TCR-1348H, KAYARAD ZAR-1494H, KAYARAD ZFR-1401H, KAYARAD ZCR-1798H, KAYARAD ZXR-1807H, KAYARAD ZCR-6002H, or KAYARAD ZCR-8001H (all manufactured by Nippon Kayaku Co., Ltd.), or "NK OLIGO" (registered trademark) EA-6340, NK OLIGO EA-7140, or NK OLIGO EA-7340 (all manufactured by Shin-Nakamura Chemical Co., Ltd.).

[0168] <(A2-4) Acrylic Resin>

[0169] As an acrylic resin (A2-4), examples include acrylic resins obtained by free radical copolymerization of one or more copolymers selected from the group consisting of copolymers having acidic groups, copolymers derived from (meth)acrylates, and other copolymers.

[0170] As a copolymer component having an acidic group, a copolymer component derived from (meth)acrylates, and other copolymer components, examples include compounds described in International Publication No. 2017 / 057281.

[0171] As for the (A2-4) acrylic resin used in this invention, from the viewpoint of improving the sensitivity during exposure and improving the mechanical properties of the cured film, it is preferable to contain structural units represented by general formula (61) and / or structural units represented by general formula (62).

[0172] [Chemical Formula 15]

[0173]

[0174] In general formulas (61) and (62), Rd 1 and Rd 2 Each of these groups independently represents an alkyl group having 1 to 10 carbon atoms, a cycloalkyl group having 4 to 15 carbon atoms, or an aryl group having 6 to 15 carbon atoms, and possessing an olefinic unsaturated double bond. R 200 ~R 205 Each can independently represent a hydrogen atom, an alkyl group with 1 to 10 carbon atoms, a cycloalkyl group with 4 to 10 carbon atoms, or an aryl group with 6 to 15 carbon atoms. X 90 and X 91 Each can be used independently to represent a direct bond, an alkylene chain with 1 to 10 carbon atoms, a cycloalkylene chain with 4 to 10 carbon atoms, or an arylene chain with 6 to 15 carbon atoms.

[0175] In general formulas (61) and (62), Rd 1 and Rd 2 Each is preferably an alkyl group having 1 to 6 carbon atoms, a cycloalkyl group having 4 to 10 carbon atoms, or an aryl group having 6 to 10 carbon atoms, and each independently preferably has an olefinic unsaturated double bond group. Furthermore, R 200 ~R 205 Each is independently preferred to be a hydrogen atom, an alkyl group having 1 to 6 carbon atoms, a cycloalkyl group having 4 to 7 carbon atoms, or an aryl group having 6 to 10 carbon atoms. Furthermore, X 90 and X 91Each of the following is preferably a direct bond, an alkylene chain with 1 to 6 carbon atoms, a cycloalkylene chain with 4 to 7 carbon atoms, or an arylene chain with 6 to 10 carbon atoms. The alkyl, cycloalkyl, aryl, alkylene, cycloalkylene, and arylene chains mentioned above may have heteroatoms and may be any of the unsubstituted or substituted derivatives.

[0176] <Structural units derived from copolymer components with acidic groups>

[0177] As for the (A2-4) acrylic resin, from the viewpoint of improving pattern processing properties using alkaline developing solution and improving resolution after development, it is preferable to have structural units containing copolymer components having acidic groups, which serve as alkali-soluble groups. For example, carboxyl groups, carboxylic anhydride groups, sulfonic acid groups, phenolic hydroxyl groups, or hydroxyimide groups are preferred; more preferably, carboxyl groups, carboxylic anhydride groups, or phenolic hydroxyl groups are preferred; and even more preferably, carboxyl groups or carboxylic anhydride groups are preferred.

[0178] <(A2-4) Physical Properties of Acrylic Resins>

[0179] As for the (A2-4) acrylic resin, from the viewpoint of suppressing pattern peeling after development and improving the heat resistance of the cured film, structural units containing copolymer components having aromatic groups are preferred. Furthermore, from the viewpoint of improving the heat resistance of the cured film and improving the sensitivity during exposure, structural units containing copolymer components having alicyclic groups are also preferred. From the viewpoint of improving the resolution after development and improving the reliability of the light-emitting element, the Mw of the (A2-4) acrylic resin, converted to polystyrene by GPC measurement, is preferably 1,000 or more. On the other hand, from the viewpoint of forming a low-tapered pattern after thermosetting and improving the pattern processability using alkaline developer, the Mw is preferably 50,000 or less. The (A2-4) acrylic resin can be synthesized by known methods.

[0180] <(B) Free radical polymerizable compounds>

[0181] The photosensitive resin composition of the present invention further preferably contains a (B) radical polymerizable compound. A (B) radical polymerizable compound refers to a compound having multiple olefinic unsaturated double bond groups in its molecule. During exposure, the (B) radical polymerizable compound is subjected to free radical polymerization using free radicals generated by the (C1) photoinitiator described later. This makes the exposed portion of the film of the composition insoluble relative to the alkaline developer, thereby enabling the formation of a negative pattern. Furthermore, UV curing during exposure is promoted, improving the sensitivity during exposure.

[0182] By using (B) radical polymerizable compounds, the sensitivity during exposure and the suppression of pattern peeling after development can be improved. As (B) radical polymerizable compounds, compounds that readily undergo free radical polymerization and have (meth)acrylate groups are preferred. From the viewpoint of improving sensitivity during exposure and suppressing pattern peeling after development, compounds having two or more (meth)acrylate groups in the molecule are more preferred. Furthermore, from the viewpoint of suppressing pattern peeling after development, the double bond equivalent is preferably 80 g / mol or more, more preferably 90 g / mol or more. On the other hand, from the viewpoint of improving sensitivity during exposure and suppressing pattern peeling after development, the double bond equivalent is preferably 800 g / mol or less, more preferably 600 g / mol or less.

[0183] In the photosensitive resin composition of the present invention, when containing a (B) radical polymerizable compound, the (F) compound is selected from the group consisting of (F1) compound, (FB-1) compound, and (FB-2) compound described later, thereby significantly suppressing the generation of residues after development under high-temperature pre-baking conditions originating from the (B) radical polymerizable compound. Consequently, the effects of low-voltage driving of the luminescent properties and improved reliability of the luminescent element become significant. Furthermore, when the (B) radical polymeric compound contains one or more of the following groups: (B1) a free radical polymeric compound containing a fluorene backbone (described later), (B2) a free radical polymeric compound containing an indane backbone (described later), and (B3) a free radical polymeric compound containing a soft chain (described later), the generation of residues after development under high-temperature pre-baking conditions originating from these free radical polymeric compounds can be significantly suppressed when the (F) compound contains one or more of the following groups: (F1) a compound (described later), (FB-1) a compound (described later), and (FB-2) a compound (described later). This significantly improves the low-voltage driving effect of the light-emitting properties and enhances the reliability of the light-emitting element. As the (F) compound (described later), one or more of the following groups: (F1) a compound (described later), (FB-1) a compound (described later), and (FB-2) a compound (described later) are particularly preferred.

[0184] From the viewpoint of improving sensitivity during exposure and suppressing pattern peeling after development, the content of (B) free radical polymerizable compound in all solid components of the photosensitive resin composition of the present invention, excluding the solvent, is preferably 10% by mass or more, more preferably 15% by mass or more, further preferably 20% by mass or more, even more preferably 25% by mass or more, and particularly preferably 30% by mass or more. On the other hand, from the viewpoint of suppressing pattern peeling after development, low-voltage driving of luminescence characteristics, and improving the reliability of the luminescent element, the content of (B) free radical polymerizable compound is preferably 85% by mass or less, more preferably 75% by mass or less, further preferably 65% ​​by mass or less, even more preferably 55% by mass or less, and particularly preferably 45% by mass or less.

[0185] When the photosensitive resin composition of the present invention contains (A) an alkali-soluble resin and (B) a free radical polymerizable compound, and the total amount of (A) an alkali-soluble resin and (B) a free radical polymerizable compound is set to 100 parts by mass, from the viewpoint of improving sensitivity during exposure and suppressing pattern peeling after development, the content of (B) a free radical polymerizable compound in the photosensitive resin composition of the present invention is preferably 15 parts by mass or more, more preferably 25 parts by mass or more. On the other hand, from the viewpoint of suppressing pattern peeling after development, low-voltage driving of luminescence characteristics, and improving the reliability of the luminescent element, the content of (B) a free radical polymerizable compound is preferably 75 parts by mass or less, more preferably 65 parts by mass or less.

[0186] <(B1) Free radical polymerizable compounds containing hydrophobic framework>

[0187] The photosensitive resin composition of the present invention preferably contains (B1) a free radical polymerizable compound with a hydrophobic skeleton (hereinafter “(B1) compound”). The (B1) compound refers to a compound having the following structures or groups: (I-b1) comprising one or more structures selected from the group consisting of fluorene, indane, fused polycyclic alicyclic, indolinone, and isoindolinone structures (hereinafter “structures of (I-b1)(B1) compounds containing a specific hydrophobic skeleton”), and (II-b1) at least two organic groups having an olefinic unsaturated double bond group. The structure containing the specific hydrophobic skeleton of the (I-b1)(B1) compound is preferably a fluorene structure and / or an indane structure. The olefinic unsaturated double bond group preferably has a (meth)acrylate group.

[0188] By including the (B1) compound, it is possible to suppress pattern peeling after development, reduce the voltage driving of luminescent properties, and improve the reliability of the light-emitting element. From the viewpoint of suppressing pattern peeling after development, the (B1) compound preferably has 2 or more olefinic unsaturated double bond groups, more preferably 3 or more, and even more preferably 4 or more. On the other hand, from the viewpoint of suppressing residue after development under high-temperature pre-baking conditions and reducing the taper of the pattern shape, the number of olefinic unsaturated double bond groups is preferably 10 or less, more preferably 8 or less, and even more preferably 6 or less. Furthermore, from the viewpoint of suppressing pattern peeling after development, the double bond equivalent is preferably 150 g / mol or more, more preferably 190 g / mol or more. On the other hand, from the viewpoint of suppressing pattern peeling after development, the double bond equivalent is preferably 600 g / mol or less, more preferably 400 g / mol or less.

[0189] When the photosensitive resin composition of the present invention contains (A) an alkali-soluble resin and (B) a free radical polymerizable compound, and the total amount of (A) an alkali-soluble resin and (B) a free radical polymerizable compound is set to 100 parts by mass, from the viewpoint of suppressing pattern peeling after development, the content of compound (B1) in the photosensitive resin composition of the present invention is preferably 2 parts by mass or more, more preferably 5 parts by mass or more. On the other hand, from the viewpoint of improving sensitivity during exposure, the content of compound (B1) is preferably 25 parts by mass or less, more preferably 20 parts by mass or less.

[0190] <(B2) Free radical polymerizable compounds with a soft backbone>

[0191] The photosensitive resin composition of the present invention preferably contains (B2) a free radical polymerizable compound with a flexible backbone (hereinafter referred to as "(B2) compound"). (B2) compound refers to a compound having the following structure or groups (hereinafter referred to as "flexible backbone of (III-b2) (B2) compound"): (I-b2) a structure derived from a compound having at least two hydroxyl groups, (II-b2) at least two organic groups having an olefinic unsaturated double bond group, and (III-b2) one or more selected from the group consisting of alkylene, oxoalkylene, and alkylene carbonyl groups.

[0192] In compound (B2), from the viewpoint of suppressing residues after development under high-temperature pre-baking conditions and suppressing pattern peeling after development, the structure of the compound having at least two hydroxyl groups is more preferably (I-b2x) comprising one or more structures selected from the group consisting of structures derived from aliphatic polyfunctional alcohols, alicyclic structures, and heterocyclic structures (hereinafter referred to as "(I-b2x) comprising a specific aliphatic skeleton"). The olefinic unsaturated double bond group preferably has a (meth)acrylate group.

[0193] From the viewpoints of improving sensitivity during exposure, suppressing residue after development under high-temperature pre-baking conditions, and suppressing pattern peeling after development, the (B2) compound more preferably has one or more (III-b2x) groups selected from the group consisting of alkylene carbonyl, oxyalkylene carbonyl, and aminoalkylene carbonyl (hereinafter referred to as "specific soft skeleton of (III-b2x)(B2) compound"). The number of soft skeletons, such as the (III-b2)(B2) compound soft skeleton or the specific soft skeleton of the (III-b2x)(B2) compound, in the (B2) compound is preferably two or more, more preferably three or more, and even more preferably four or more. On the other hand, the number of soft skeletons is preferably 12 or less, more preferably 10 or less, and even more preferably 8 or less. The alkylene and oxyalkylene groups are preferably structures derived from epoxy compounds or from alkylene glycols. The specific soft skeleton of the (III-b2x)(B2) compound is preferably a structure derived from lactone compounds or from lactam compounds.

[0194] By containing the (B2) compound, pattern peeling after development can be suppressed. From the viewpoint of suppressing pattern peeling after development, the number of olefinic unsaturated double bond groups in the molecule is preferably 2 or more, more preferably 3 or more, and even more preferably 4 or more. On the other hand, from the viewpoint of suppressing pattern peeling after development, the number of olefinic unsaturated double bond groups in the molecule is preferably 12 or less, more preferably 10 or less, and even more preferably 8 or less. Furthermore, from the viewpoint of suppressing pattern peeling after development, the double bond equivalent is preferably 100 g / mol or more, more preferably 120 g / mol or more. On the other hand, from the viewpoint of improving sensitivity during exposure and suppressing pattern peeling after development, the double bond equivalent is preferably 600 g / mol or less, more preferably 400 g / mol or less.

[0195] When the photosensitive resin composition of the present invention contains (A) an alkali-soluble resin and (B) a free radical polymerizable compound, and the total amount of (A) an alkali-soluble resin and (B) a free radical polymerizable compound is set to 100 parts by mass, from the viewpoint of suppressing pattern peeling after development, the content of compound (B2) in the photosensitive resin composition of the present invention is preferably 5 parts by mass or more, more preferably 10 parts by mass or more. On the other hand, from the viewpoint of suppressing pattern peeling after development, the content of compound (B2) is preferably 40 parts by mass or less, more preferably 35 parts by mass or less.

[0196] <(C) Photosensitive agent>

[0197] The photosensitive resin composition of the present invention contains a (C) photosensitizer. The (C) photosensitizer is a compound that imparts positive or negative photosensitivity to the composition by generating other compounds through bond breaking, reaction, or structural change caused by exposure. The (C) photosensitizer preferably contains one or more selected from the group consisting of a (C1) photopolymerization initiator, a (C2) photoacid generator, and a (C3) naphthoquinone diazide compound. When imparting negative photosensitivity to the photosensitive resin composition of the present invention, it is preferable to contain a (C1) photopolymerization initiator, or a (C1) photopolymerization initiator and a (C2) photoacid generator. When imparting positive photosensitivity to the photosensitive resin composition of the present invention, it is preferable to contain a (C3) naphthoquinone diazide compound, or a (C3) naphthoquinone diazide compound and a (C2) photoacid generator.

[0198] From the viewpoint of improving sensitivity during exposure and suppressing pattern peeling after development, the content of (C) photosensitizer in all solid components of the photosensitive resin composition of the present invention, excluding the solvent, is preferably 0.1% by mass or more, more preferably 1.0% by mass or more, further preferably 2.0% by mass or more, even more preferably 2.5% by mass or more, and particularly preferably 3.0% by mass or more. On the other hand, from the viewpoint of improving sensitivity during exposure and improving resolution after development, the content of (C) photosensitizer is preferably 27% by mass or less, more preferably 22% by mass or less, further preferably 20% by mass or less, even more preferably 15% by mass or less, and particularly preferably 12% by mass or less.

[0199] <(C1) Photopolymerization Initiator>

[0200] The photosensitive resin composition of the present invention preferably contains a (C1) photopolymerization initiator as the (C) photosensitizer. The (C1) photopolymerization initiator refers to a compound that generates free radicals through bond breaking and / or reaction upon exposure. For the photosensitive resin composition of the present invention, from the viewpoint of forming a negative pattern, it is preferable that the (C) photosensitizer contains a (C1-1) oxime ester-based photopolymerization initiator as the (C1) photopolymerization initiator, and also contains a (B) free radical polymerizable compound. By containing the (C1) photopolymerization initiator, the free radical polymerization of the aforementioned (B) free radical polymerizable compound can occur, and the exposed portion of the film of the composition becomes insoluble in alkaline developing solution, thereby forming a negative pattern. Furthermore, UV curing during exposure can be promoted, and the sensitivity during exposure can be improved.

[0201] As (C1) photopolymerization initiators, benzoyl ketal photopolymerization initiators, α-hydroxy ketone photopolymerization initiators, α-amino ketone photopolymerization initiators, acylphosphine oxide photopolymerization initiators, imidazole photopolymerization initiators, oxime ester photopolymerization initiators, acridine photopolymerization initiators, dicofenectomycete photopolymerization initiators, benzophenone photopolymerization initiators, acetophenone photopolymerization initiators, aromatic ketone ester photopolymerization initiators, or benzoic acid ester photopolymerization initiators are preferred from the viewpoint of improving the sensitivity during exposure. α-hydroxy ketone photopolymerization initiators, α-amino ketone photopolymerization initiators, acylphosphine oxide photopolymerization initiators, imidazole photopolymerization initiators, or oxime ester photopolymerization initiators are more preferred from the viewpoint of improving the sensitivity during exposure, the low-voltage driving of the luminescence characteristics, and the reliability of the light-emitting element. Oxime ester photopolymerization initiators are even more preferred from the viewpoint of improving the sensitivity during exposure, the low-voltage driving of the luminescence characteristics, and the reliability of the light-emitting element.

[0202] When the photosensitive resin composition of the present invention contains a (C1) photopolymerization initiator as a (C) photosensitizer, by containing one or more compounds selected from the group consisting of (F1) compound, (FB-1) compound, and (FB-2) compound (described later) as the (F) compound, the generation of residue after development under high-temperature pre-baking conditions originating from the (C1) photopolymerization initiator can be significantly suppressed. This significantly improves the low-voltage driving effect of the luminescent properties and the reliability of the luminescent element. Furthermore, when the (C1-1) oxime ester photopolymerization initiator is contained as a (C1) photopolymerization initiator, by containing one or more compounds selected from the group consisting of (F1) compound, (FB-1) compound, and (FB-2) compound (described later) as the (F) compound, the generation of residue after development under high-temperature pre-baking conditions originating from the (C1-1) oxime ester photopolymerization initiator can be significantly suppressed. Therefore, the effects of low-voltage driving of light-emitting characteristics and improved reliability of light-emitting elements become significant. The (F) compound described later is particularly preferably one or more selected from the group consisting of the specific (F1) compound described later, the specific (FB-1) compound described later, and the specific (FB-2) compound described later.

[0203] When the photosensitive resin composition of the present invention contains (A) an alkali-soluble resin and (B) a free radical polymerizable compound, and the total amount of (A) the alkali-soluble resin and (B) the free radical polymerizable compound is set to 100 parts by mass, from the viewpoint of improving the sensitivity during exposure, the content of the (C1) photopolymerization initiator in the photosensitive resin composition of the present invention is preferably 0.5 parts by mass or more, more preferably 5 parts by mass or more. On the other hand, from the viewpoint of improving the sensitivity during exposure and improving the resolution after development, the content of the (C1) photopolymerization initiator is preferably 30 parts by mass or less, more preferably 20 parts by mass or less.

[0204] <(C1-1)oxime ester photopolymerization initiator>

[0205] For the photosensitive resin composition of the present invention, the (C) photosensitizer preferably contains a (C1-1) oxime ester photopolymerization initiator as the (C1) photopolymerization initiator. A (C1-1) oxime ester photopolymerization initiator refers to a compound having an oxime ester structure as its molecular backbone, which generates free radicals through bond breaking and / or reactions during exposure. By containing a (C1-1) oxime ester photopolymerization initiator, the sensitivity during exposure and the suppression of pattern peeling after development can be improved.

[0206] From the viewpoints of improving sensitivity during exposure, suppressing pattern stripping after development, enabling low-voltage driving of luminescence properties, and improving the reliability of luminescent elements, (C1-1) oxime ester photopolymerization initiators preferably have a fused polycyclic backbone, a fused polycyclic heterocyclic backbone, or a diphenyl sulfide backbone. Furthermore, the fused polycyclic backbone, fused polycyclic heterocyclic backbone, or diphenyl sulfide backbone preferably has a structure bonded with at least one oxime ester structure, or a structure bonded with at least one oxime ester carbonyl structure, and more preferably a structure bonded with at least one oxime ester structure. In addition, the fused polycyclic backbone, fused polycyclic heterocyclic backbone, or diphenyl sulfide backbone preferably has a structure bonded with two or more oxime ester structures, or a structure bonded with two or more oxime ester carbonyl structures. Furthermore, it is preferred to have a structure in which at least one oxime ester structure is bonded to a fused polycyclic skeleton, a fused polycyclic heterocyclic skeleton, or a diphenyl sulfide skeleton, or a structure with at least one oxime ester carbonyl group bonded to it.

[0207] The fused polycyclic heterocyclic skeleton is preferably a fluorene skeleton, a benzo[a]fluorene skeleton, a dibenzo[a]fluorene skeleton, an indene skeleton, an indane skeleton, a benzo[a]indene skeleton, or a benzo[a]indane skeleton, more preferably a fluorene skeleton, a benzo[a]fluorene skeleton, or a dibenzo[a]fluorene skeleton. As a fused polycyclic heterocyclic skeleton, the preferred skeletons are carbazole skeletons, dibenzofuran skeletons, dibenzothiophene skeletons, benzo[a]carbazole skeletons, indole skeletons, dihydroindole skeletons, benzo[a]indole skeletons, or benzo[a]dihydroindole skeletons, more preferably carbazole skeletons, benzo[a]carbazole skeletons, indole skeletons, or benzo[a]indole skeletons.

[0208] For the photosensitive resin composition of the present invention, the above-mentioned (C) photosensitizer contains a (C1-1) oxime ester-based photopolymerization initiator.

[0209] The (C1-1) compound preferably has one or more of the following structures: nitro, naphthyl carbonyl, trimethylbenzoyl, thiophene carbonyl, furanyl carbonyl, and at least two oxime ester structures.

[0210] (C) The photosensitizer preferably contains a (C1-1) oxime ester-based photopolymerization initiator. From the viewpoint of improving sensitivity during exposure and suppressing pattern peeling after development, it is preferable to contain the above-mentioned (C1-1) compound. Preferably, it has a structure in which one or more of the following groups are bonded to a fused polycyclic skeleton or a fused polycyclic heterocyclic skeleton: a nitro group, a naphthyl carbonyl group, a trimethylbenzoyl group, a thiophene carbonyl group, a furanyl carbonyl group, and at least two oxime ester structures.

[0211] From the viewpoint of improving exposure sensitivity and suppressing pattern peeling after development, (C1-1) oxime ester photopolymerization initiators preferably have groups substituted with halogen atoms. The halogen atom is preferably fluorine. Furthermore, when the aforementioned (A1-1) polyimide, (A1-2) polyimide precursor, (A1-3) polybenzoxazole, (A1-4) polybenzoxazole precursor, and (A1-5) polyamide-imide contain structural units with fluorine atoms, improving the compatibility of these resins with the photopolymerization initiator can enhance exposure sensitivity and suppress pattern peeling after development. Examples of halogen-substituted groups include trifluoromethyl, trifluoropropyl, trichloropropyl, tetrafluoropropyl, fluorocyclopentyl, fluorophenyl, pentafluorophenyl, trifluoropropoxy, tetrafluoropropoxy, or pentafluorophenoxy.

[0212] From the viewpoint of improving sensitivity during exposure and suppressing pattern stripping after development, (C1-1) oxime ester photopolymerization initiators are preferably compounds with the structure shown below.

[0213] [Chemical Formula 16]

[0214]

[0215] [Chemical Formula 17]

[0216]

[0217] [Chemical Formula 18]

[0218]

[0219] (C1-1) The preferred oxime ester photopolymerization initiator is a compound selected from one or more steps in the manufacturing method of the display device described below, namely, (3) irradiating the coating of the photosensitive resin composition with active chemical rays through a photomask, (4) developing the photosensitive resin composition with an alkaline solution to form a pattern of the photosensitive resin composition, and (5) heating the pattern to cure it to obtain a cured pattern of the photosensitive resin composition, and undergoing photodecomposition and / or thermal decomposition to change its structure to have the structure represented by the general formula (75), the general formula (76), the general formula (77), or the general formula (78) described below.

[0220] When the photosensitive resin composition of the present invention contains (A) an alkali-soluble resin and (B) a free radical polymerizable compound, and the total amount of (A) the alkali-soluble resin and (B) the free radical polymerizable compound is set to 100 parts by mass, from the viewpoint of improving sensitivity during exposure and suppressing pattern peeling after development, the content of the (C1-1) oxime ester photopolymerization initiator in the photosensitive resin composition of the present invention is preferably 0.5 parts by mass or more, more preferably 3 parts by mass or more, and even more preferably 5 parts by mass or more. On the other hand, from the viewpoint of improving sensitivity during exposure and improving resolution after development, the content of the (C1-1) oxime ester photopolymerization initiator is preferably 30 parts by mass or less, more preferably 25 parts by mass or less, and even more preferably 20 parts by mass or less.

[0221] <(C2) Photoacid Generator>

[0222] The photosensitive resin composition of the present invention may also contain a (C2) photoacid generator as a (C) photosensitizer. The (C2) photoacid generator refers to a compound that generates acid through bond breaking and / or reaction upon exposure. By containing a (C2) photoacid generator, crosslinking of acid-reactive compounds such as crosslinking agents (described later) with the resin and / or cationic polymerization of cationic polymerizable compounds can occur, and the exposed portion of the film of the composition becomes insoluble in alkaline developing solutions, thereby enabling the formation of negative patterns. Furthermore, UV curing during exposure can be promoted, and the sensitivity during exposure can be improved. By containing the aforementioned (C1) photopolymerization initiator and (C2) photoacid generator in the photosensitive resin composition of the present invention, UV curing during exposure can be promoted, and the sensitivity during exposure can be improved.

[0223] On the other hand, when the photosensitive resin composition of the present invention contains the (C3) naphthoquinone diazide compound and the (C2) photoacid-generating agent described later, acid can be generated by exposure after alkaline development and before thermal curing. Therefore, thermal crosslinking of the thermally reactive compounds such as the crosslinking agent described later with the resin can be promoted during subsequent thermal curing, thereby improving the heat resistance and chemical resistance of the cured film.

[0224] Examples of (C2) photoacid-generating agents include ionic or nonionic compounds. Ionic compounds are preferably triorganosulfonium salt compounds. Examples of nonionic compounds include halogen-containing compounds, diazomethane compounds, sulfone compounds, sulfonate compounds, carboxylic acid ester compounds, sulfonylimide compounds, phosphate ester compounds, or sulfonebenzotriazole compounds.

[0225] When the photosensitive resin composition of the present invention contains (A) an alkali-soluble resin and (B) a free radical polymerizable compound, and the total amount of (A) an alkali-soluble resin and (B) a free radical polymerizable compound is set to 100 parts by mass, from the viewpoint of improving the sensitivity during exposure, the content of the photoacid generator (C2) in the photosensitive resin composition of the present invention is preferably 0.1 parts by mass or more, more preferably 1 part by mass or more. On the other hand, from the viewpoint of improving the sensitivity during exposure and improving the resolution after development, the content of the photoacid generator (C2) is preferably 25 parts by mass or less, more preferably 15 parts by mass or less.

[0226] <(C3)naphthoquinone diazide compound>

[0227] The photosensitive resin composition of the present invention may also contain a (C3)naphthoquinone diazide compound as a (C) photosensitizer. The (C3)naphthoquinone diazide compound refers to a compound whose structure changes upon exposure, producing indica acid and / or sulfonated indica acid. By containing the (C3)naphthoquinone diazide compound, the exposed portion of the film of the composition becomes soluble in an alkaline developer, thereby enabling the formation of a positive pattern. Furthermore, the solubility of the exposed portion in the alkaline developer can be selectively increased, improving the resolution after development.

[0228] As a (C3)naphthoquinone diazide compound, a compound formed by ester bonding of naphthoquinone diazidesulfonic acid and a compound having a phenolic hydroxyl group is preferred. A compound obtained by esterification of a compound having a phenolic hydroxyl group with naphthoquinone diazidesulfonyl chloride is also preferred. Naphthoquinone diazidesulfonyl chloride is preferably 5-naphthoquinone diazidesulfonyl chloride or 4-naphthoquinone diazidesulfonyl chloride.

[0229] When the alkali-soluble resin (A) is set to 100 parts by mass, from the viewpoint of improving sensitivity during exposure and resolution after development, the content of (C3) naphthoquinone diazide compound in the photosensitive resin composition of the present invention is preferably 2 parts by mass or more, more preferably 5 parts by mass or more. On the other hand, from the viewpoint of improving sensitivity during exposure, the content of (C3) naphthoquinone diazide compound is preferably 30 parts by mass or less, more preferably 25 parts by mass or less.

[0230] In the photosensitive resin composition of the present invention, when one or more of the following are selected as the (A) alkali-soluble resin: (A1-1) polyimide, (A1-2) polyimide precursor, (A1-3) polybenzoxazole, (A1-4) polybenzoxazole precursor, (A1-5) polyamide-imide, (A2-1) polysiloxane, (A2-2) resin containing polycyclic side chains, and (A2-3) acid-modified epoxy resin, and when a compound represented by general formula (12b) is included as the (F1) compound described later, the inclusion of a (B) free radical polymerizable compound and a (C1-1) oxime ester photopolymerization initiator as a (C1) photopolymerization initiator significantly improves the sensitivity during exposure and inhibits pattern peeling after development.

[0231] Similarly, in the photosensitive resin composition of the present invention, when it contains one or more alkali-soluble resins selected from the group consisting of (A1-1) polyimide, (A1-2) polyimide precursor, (A1-3) polybenzoxazole, (A1-4) polybenzoxazole precursor, (A1-5) polyamide-imide, and (A2-1) polysiloxane, and further contains the (F1) compound described later, the effect of improving the sensitivity during exposure and suppressing pattern peeling after development becomes significant by containing a (B) free radical polymerizable compound and a (C1-1) oxime ester photopolymerization initiator as a (C1) photopolymerization initiator.

[0232] Furthermore, similarly, in the photosensitive resin composition of the present invention, when a compound represented by general formula (12b) is included as the (F1) compound described later, the presence of a (B) radical polymerizable compound and a (C1-1) oxime ester photopolymerization initiator as a (C1) photopolymerization initiator significantly improves the sensitivity during exposure and inhibits pattern peeling after development.

[0233] In the photosensitive resin composition of the present invention, when one or more of the following are selected as the (A) alkali-soluble resin: (A1-1) polyimide, (A1-2) polyimide precursor, (A1-3) polybenzoxazole, (A1-4) polybenzoxazole precursor, (A1-5) polyamide-imide, (A2-1) polysiloxane, (A2-2) resin containing polycyclic side chains, and (A2-3) acid-modified epoxy resin, and further containing (Da) black agent as (D) colorant, and (FB-1) compound and / or (FB-2) compound described later, the presence of (B) free radical polymerizable compound and (C1-1) oxime ester photopolymerization initiator as (C1) photopolymerization initiator significantly improves the sensitivity during exposure and inhibits pattern peeling after development.

[0234] Similarly, in the photosensitive resin composition of the present invention, when it contains one or more alkali-soluble resins selected from the group consisting of (A1-1) polyimide, (A1-2) polyimide precursor, (A1-3) polybenzoxazole, (A1-4) polybenzoxazole precursor, (A1-5) polyamide-imide, and (A2-1) polysiloxane, and further contains the (FB-1) compound and / or the (FB-2) compound described later, the presence of a (B) free radical polymerizable compound and a (C1-1) oxime ester photopolymerization initiator as a (C1) photopolymerization initiator significantly improves the sensitivity during exposure and inhibits pattern peeling after development.

[0235] Furthermore, similarly, in the photosensitive resin composition of the present invention, when containing the (FB-1) compound described later and / or the (FB-2) compound described later, the presence of a (B) radical polymerizable compound and a (C1-1) oxime ester photopolymerization initiator as a (C1) photopolymerization initiator significantly improves the sensitivity during exposure and inhibits pattern peeling after development.

[0236] Similarly, in the photosensitive resin composition of the present invention, when containing the (FB-1) compound described later and / or the (FB-2) compound described later, and the (FC-1) non-trimethylammonium acetyl lactone phospholipid described later, the presence of the (B) free radical polymerizable compound and the (C1-1) oxime ester photopolymerization initiator as the (C1) photopolymerization initiator significantly improves the sensitivity during exposure and inhibits pattern peeling after development.

[0237] In the photosensitive resin composition of the present invention, by containing one or more of the following as a (A) alkali-soluble resin: (A1-1) polyimide, (A1-2) polyimide precursor, (A1-3) polybenzoxazole, (A1-4) polybenzoxazole precursor, (A1-5) polyamide-imide, (A2-1) polysiloxane, (A2-2) resin containing polycyclic side chains, and (A2-3) acid-modified epoxy resin, and containing (B) a free radical polymerizable compound and (C1-1) oxime ester photopolymerization initiator as a (C1) photopolymerization initiator, the effect of improving the sensitivity during exposure and suppressing pattern peeling after development becomes significant.

[0238] Similarly, in the photosensitive resin composition of the present invention, when one or more of the group consisting of (A1-1) polyimide, (A1-2) polyimide precursor, (A1-3) polybenzoxazole, (A1-4) polybenzoxazole precursor, (A1-5) polyamide-imide, and (A2-1) polysiloxane are included as (A) alkali-soluble resin, the presence of (B) free radical polymerizable compound and (C1-1) oxime ester photopolymerization initiator as (C1) photopolymerization initiator significantly improves the sensitivity during exposure and inhibits pattern peeling after development.

[0239] Furthermore, similarly, in the photosensitive resin composition of the present invention, when it also contains the (F1) compound described later, by containing the (B) radical polymerizable compound and the (C1-1) oxime ester photopolymerization initiator as the (C1) photopolymerization initiator, the effect of improving the sensitivity during exposure and suppressing pattern peeling after development becomes significant.

[0240] Similarly, in the photosensitive resin composition of the present invention, when it also contains the (FC-1) non-trimethylammonium acetyl lactone type phospholipid described later, the (FC-1) non-trimethylammonium acetyl lactone type phospholipid has at least (II) an acidic group containing phosphorus atoms, and / or an anionic structure from the acidic group containing phosphorus atoms, and (III) a fatty acid ester structure from a fatty acid compound having 6 to 30 carbon atoms, and / or an aliphatic ether structure from an aliphatic alcohol having 6 to 30 carbon atoms. Wherein the (III) fatty acid ester structure and / or aliphatic ether structure contains one or more groups selected from the group consisting of alkyl, alkenyl, alkynyl, alkylene, alkenyl, and alynyl groups with straight-chain and / or branched structures, the presence of a (B) free radical polymerizable compound and a (C1-1) oxime ester photopolymerization initiator as a (C1) photopolymerization initiator significantly improves the sensitivity during exposure and inhibits pattern peeling after development.

[0241] As a photosensitive resin composition, when it contains one or more of the following compounds selected from (F1), (FB-1), and (FB-2) as the (F) compound, from the viewpoint of low-voltage driving of light emission characteristics and improving the reliability of light emission elements, it is preferable to contain one or more of the following free radical polymerizable compounds selected from (B1) a free radical polymerizable compound containing a fluorene skeleton, (B2) a free radical polymerizable compound containing an indane skeleton, and (B3) a free radical polymerizable compound containing a soft chain as the (B) free radical polymerizable compound, and an (C1-1) oxime ester photopolymerization initiator as the (C1) photopolymerization initiator.

[0242] <(D) colorant, (Da) black agent, and (Db) colorant other than black>

[0243] The photosensitive resin composition of the present invention preferably contains a (D) colorant. A (D) colorant is a compound that colors light by absorbing light of a wavelength (380–780 nm) of visible light. By containing a (D) colorant, light transmitted through the film of the composition, or light reflected from the film of the composition, can be colored to a desired color. Furthermore, the film of the composition can be endowed with light-blocking properties.

[0244] As a (D) colorant, (D1) pigments and (D2) dyes can be used. Especially when light-shielding properties to visible light are required, the photosensitive resin composition of the present invention preferably contains a (Da) black agent. A (Da) black agent is a compound that blackens by absorbing wavelengths of visible light. By containing a (Da) black agent, the film of the composition is blackened, thereby improving the light-shielding properties of the film and the reliability of the light-emitting element. Therefore, it is suitable for applications such as pixel dividing layers, electrode insulating layers, wiring insulating layers, TFT planarization layers, electrode planarization layers, wiring planarization layers, TFT protective layers, electrode protective layers, wiring protective layers, interlayer insulating layers, gate insulating layers, color filters, black matrices, or black columnar spacers. It is particularly suitable for applications requiring high contrast by suppressing external light reflection, and is preferably used as a light-shielding pixel dividing layer, TFT planarization layer, TFT protective layer, interlayer insulating layer, or gate insulating layer in an organic EL display as a display device. Furthermore, it is not mandatory to contain a (Da) black agent; it is also possible to contain colorants other than (Db) black. Colorants other than (Db) black refer to compounds that color light by absorbing wavelengths of visible light. By using colorants other than (Db) black, it is possible to adjust the film of the composition to the desired color coordinates.

[0245] (D) Black in colorant refers to a substance whose Colour Index Generic Name (hereinafter "CI Index Number") contains "BLACK". When a substance without a CI Index Number is present, it refers to a substance that is black when formed into a cured film. Blackness in a cured film means that, in the transmission spectrum of the cured film containing the (D) colorant, when the transmittance at 550 nm with a film thickness of 1.0 μm is converted using the Lambert-Beer formula to make the transmittance at 550 nm 10% for a film thickness range of 0.1 to 1.5 μm, the transmittance at wavelengths of 450 to 650 nm in the converted transmission spectrum is less than 25%. The transmission spectrum of the cured film can be determined using the method described in International Publication No. 2019 / 087985.

[0246] From the viewpoint of improving light-shielding properties and the reliability of the light-emitting element, the content of colorant (D) in all solid components of the photosensitive resin composition of the present invention, excluding the solvent, is preferably 5% by mass or more, more preferably 20% by mass or more, and even more preferably 30% by mass or more. On the other hand, from the viewpoint of improving sensitivity during exposure and the reliability of the light-emitting element, the content of colorant (D) is preferably 70% by mass or less, more preferably 55% by mass or less.

[0247] From the viewpoint of improving light-shielding properties, improving the reliability of light-emitting elements, and improving sensitivity during exposure, the preferred content ratio of (Da) black agent in the photosensitive resin composition of the present invention is the same as the preferred content ratio of (D) colorant described above.

[0248] (D2) dyes refer to compounds that color an object by chemical adsorption or other means on the surface structure of the object, and are usually soluble in solvents. Examples of (D2) dyes include anthraquinone dyes, azo dyes, azazine dyes, phthalocyanine dyes, methylene dyes, oxazine dyes, quinoline dyes, indigo dyes, indigo dyes, carbomon dyes, vat dyes, violet ketone dyes, perylene dyes, triarylmethane dyes, or xanthan dyes.

[0249] <(D1a) Black pigment, and (D1b) pigments other than black>

[0250] For the photosensitive resin composition of the present invention, the aforementioned (Da) black agent preferably contains a (D1a) black pigment. A (D1a) black pigment refers to a pigment that blackens by absorbing light of visible wavelengths. Furthermore, it is a pigment that blackens the object through physical adsorption to the surface of the object or through interaction with the surface of the object, and is generally insoluble in solvents. By containing a (D1a) black pigment, the light-shielding properties of the film in the composition can be improved, and the reliability of the light-emitting element can be enhanced.

[0251] From the viewpoint of low-voltage driving of luminescent properties and improved reliability of luminescent elements, (D1a) black pigments containing nitrogen atoms are preferred as (D1a) black pigments. By forming a cured film of a photosensitive resin composition containing a (D1a) black pigment containing nitrogen atoms, cyanide ions (CN) can be formed in the display device or organic EL display described later. - The detection intensity of the first electrode is a specific intensity.

[0252] As the photosensitive resin composition of the present invention, the aforementioned (Da) black agent is a (D1a) black pigment. This (D1a) black pigment is preferably selected from one or more of the group consisting of (D1a-1) black organic pigment, (D1a-2) black inorganic pigment, and (D1a-3) two- or more color pigment mixtures. From the viewpoint of low-voltage driving of light-emitting characteristics and improved reliability of the light-emitting element, it is more preferably (D1a-1) black organic pigment and / or (D1a-3) two- or more color pigment mixtures. As the photosensitive resin composition of the present invention, when the (D1a) black pigment is the (D1a-1) black organic pigment and / or (D1a-2) black inorganic pigment, it may also contain pigments other than (D1b) black. Pigments other than (D1b) black refer to pigments that color by absorbing light of visible wavelengths. By containing pigments other than (D1b) black, it becomes possible to adjust the film of the composition to the desired color coordinates. As a photosensitive resin composition of the present invention, the pigment other than (D1b) black is preferably selected from one or more of the group consisting of blue pigment, red pigment, yellow pigment, purple pigment, orange pigment and green pigment described below.

[0253] In the photosensitive resin composition of the present invention, from the viewpoint of improving light-blocking properties, improving the reliability of the light-emitting element, and improving the sensitivity during exposure, the preferred content ratio of the (D1a) black pigment is the same as the preferred content ratio of the (D) colorant described above.

[0254] <(D1a-1) Black organic pigment, (D1a-2) Black inorganic pigment, and (D1a-3) Mixture of two or more coloring pigments>

[0255] For the photosensitive resin composition of the present invention, the aforementioned (D1a) black pigment is preferably selected from one or more of the group consisting of (D1a-1) black organic pigment, (D1a-2) black inorganic pigment, and (D1a-3) two or more color pigment mixtures. From the viewpoint of suppressing residues after development under high-temperature pre-baking conditions, low-voltage driving of luminescence characteristics, and improving the reliability of luminescent elements, it is more preferably (D1a-1) black organic pigment and / or (D1a-3) two or more color pigment mixtures. From the viewpoint of improving sensitivity during exposure, it is even more preferably (D1a-1) black organic pigment.

[0256] Examples of (D1a-1) black organic pigments include anthraquinone-based black pigments, benzofuranone-based black pigments, perylene-based black pigments, aniline-based black pigments, azo-based black pigments, azomethine-based black pigments, or carbon black. Examples of carbon black include channel black, furnace black, thermal cracking black, acetylene black, or lamp black.

[0257] Examples of (D1a-2) black inorganic pigments include, for example, graphite or silver-tin alloys, or particles, oxides, complex oxides, sulfides, sulfates, nitrates, carbonates, nitrides, carbides, or nitrogen oxides of metals such as titanium, copper, iron, manganese, cobalt, chromium, nickel, zinc, calcium, or silver.

[0258] (D1a-3) A coloring pigment mixture of two or more colors refers to a coloring pigment mixture that is simulated to be blackened by combining two or more pigments selected from the group consisting of red, orange, yellow, green, blue, and purple pigments. Because two or more pigments are mixed, it becomes possible to adjust the film of the composition to the desired color coordinates. From the viewpoint of improving sensitivity during exposure, the (D1a-3) coloring pigment mixture of two or more colors in this invention is preferably (D1a-3a) a coloring pigment mixture containing blue, red, and yellow pigments; (D1a-3b) a coloring pigment mixture containing purple and yellow pigments; (D1a-3c) a coloring pigment mixture containing blue, red, and orange pigments; or (D1a-3d) a coloring pigment mixture containing blue, purple, and orange pigments.

[0259] Examples of pigments that color blue include Pigment Blue 15, 15:3, 15:4, 15:6, 22, 60, or 64 (all values ​​are CI index numbers). Examples of pigments that color red include Pigment Red 9, 48, 97, 122, 123, 144, 149, 166, 168, 177, 179, 180, 190, 192, 209, 215, 216, 217, 220, 223, 224, 226, 227, 228, 240, or 250 (all values ​​are CI index numbers). Examples of pigments that color yellow include pigments yellow 12, 13, 17, 20, 24, 83, 86, 93, 95, 109, 110, 117, 120, 125, 129, 137, 138, 139, 147, 148, 150, 151, 153, 154, 166, 168, 175, 180, 181, 185, 192, or 194 (all values ​​are CI index numbers). Examples of pigments that color purple include pigments purple 19, 23, 29, 30, 32, 37, 40, or 50 (all values ​​are CI index numbers). Examples of pigments that color orange include pigments orange 12, 36, 38, 43, 51, 55, 59, 61, 64, 65, 71, or 72 (all values ​​are CI index numbers). As pigments that color green, examples include pigments green 7, 10, 36, or 58 (all values ​​are CI index numbers).

[0260] As the photosensitive resin composition of the present invention, in the above-mentioned (D1a-3) two-color or more coloring pigment mixture, from the viewpoint of improving the sensitivity during exposure and improving the reliability of the light-emitting element, the above-mentioned blue pigment is preferably selected from one or more of the group consisting of CI pigment blue 15:4, CI pigment blue 15:6, and CI pigment blue 60; the above-mentioned red pigment is preferably selected from one or more of the group consisting of CI pigment red 123, CI pigment red 149, CI pigment red 177, CI pigment red 179, and CI pigment red 190; the above-mentioned yellow pigment is preferably selected from one or more of the group consisting of CI pigment yellow 120, CI pigment yellow 151, CI pigment yellow 175, CI pigment yellow 180, CI pigment yellow 181, CI pigment yellow 192, and CI pigment yellow 194; the above-mentioned purple pigment is preferably selected from one or more of the group consisting of CI pigment purple 19, CI pigment purple 29, and CI pigment purple 37; and the above-mentioned orange pigment is preferably selected from one or more of the group consisting of CI pigment orange 43, CI pigment orange 64, and CI pigment orange 72.

[0261] In the photosensitive resin composition of the present invention, from the viewpoint of improving light-blocking properties, improving the reliability of the light-emitting element, and improving the sensitivity during exposure, the preferred content ratio of one or more selected from the group consisting of (D1a-1) black organic pigment, (D1a-2) black inorganic pigment, and (D1a-3) a mixture of two or more coloring pigments is the same as the preferred content ratio of the (D) colorant described above.

[0262] <(D1a-1a) Benzofuranone black pigment, (D1a-1b) Perylene black pigment, and (D1a-1c) Azo black pigment>

[0263] The photosensitive resin composition of the present invention also contains (D1a-1) black organic pigment.

[0264] The (D1a-1) black organic pigment preferably contains one or more pigments selected from the group consisting of (D1a-1a) benzofuranone-based black pigments, (D1a-1b) perylene-based black pigments, and (D1a-1c) azo-based black pigments. From the viewpoints of suppressing residue after development under high-temperature pre-baking conditions, achieving low-voltage driving of luminescent properties, and improving the reliability of the light-emitting element, the (D1a-1) black organic pigment preferably contains one or more pigments selected from the group consisting of (D1a-1a) benzofuranone-based black pigments, (D1a-1b) perylene-based black pigments, and (D1a-1c) azo-based black pigments, and more preferably contains (D1a-1a) benzofuranone-based black pigments. Furthermore, from the viewpoints of improving sensitivity during exposure and suppressing pattern peeling after development, the (D1a-1a) benzofuranone-based black pigment is preferred. Compared to conventional organic pigments, the (D1a-1a) benzofuranone-based black pigment, (D1a-1b) perylene-based black pigment, and (D1a-1c) azo-based black pigment exhibit superior opacity per unit content of the pigment in the composition, thereby improving the opacity of the film and enhancing exposure sensitivity. Furthermore, the improved opacity of the film significantly enhances the reliability of the light-emitting element and the contrast ratio of the display device. Moreover, the superior insulation and low dielectric properties compared to conventional organic and inorganic pigments are considered effective in improving the reliability of the light-emitting element. These pigments are particularly suitable for use as opacity-enhancing pixel layers, TFT planarization layers, TFT protective layers, interlayer insulating layers, or gate insulating layers in organic EL displays, thereby improving the reliability of the light-emitting element.

[0265] In the photosensitive resin composition of the present invention, one or more of the following are selected as the (A) alkali-soluble resin: (A1-1) polyimide, (A1-2) polyimide precursor, (A1-3) polybenzoxazole, (A1-4) polybenzoxazole precursor, (A2-1) polysiloxane, (A2-2) resin containing polycyclic side chains, and (A2-3) acid-modified epoxy resin; and (D) a black agent is included as the (D) colorant, wherein the (D) black agent is a (D1a) black pigment, the (D1a) black pigment is a (D1a-1) black organic pigment, and / or a mixture of two or more coloring pigments (D1a-3). -1) When the black organic pigment contains one or more of the group consisting of (D1a-1a) benzofuranone black pigment, (D1a-1b) perylene black pigment, and (D1a-1c) azo black pigment, and (D1a-3) when the mixture of two or more coloring pigments contains two or more pigments consisting of red, orange, yellow, green, blue and purple pigments, the effect of suppressing residues after development under high temperature pre-baking conditions, suppressing pattern peeling after development, low voltage driving of light-emitting properties, and improving the reliability of light-emitting elements becomes significant when the compound represented by general formula (12b) is used as the (F1) compound described later.

[0266] Similarly, in the photosensitive resin composition of the present invention, an alkali-soluble resin containing one or more of the group consisting of (A1-1) polyimide, (A1-2) polyimide precursor, (A1-3) polybenzoxazole, (A1-4) polybenzoxazole precursor, and (A2-1) polysiloxane, contains a (Da) black agent as a (D) colorant, wherein the (Da) black agent is a (D1a) black pigment, the (D1a) black pigment is a (D1a-1) black organic pigment, and / or a mixture of two or more coloring pigments (D1a-3), and the (D1a-1) black organic... When the pigment contains one or more of the group consisting of (D1a-1a) benzofuranone black pigment, (D1a-1b) perylene black pigment, and (D1a-1c) azo black pigment, and the (D1a-3) two-color or more coloring pigment mixture contains two or more pigments selected from the group consisting of red, orange, yellow, green, blue, and purple pigments, the addition of the (F1) compound described later significantly enhances the effects of suppressing residues after development under high-temperature pre-baking conditions, suppressing pattern peeling after development, reducing the voltage driving of light-emitting properties, and improving the reliability of light-emitting elements.

[0267] Furthermore, similarly, in the photosensitive resin composition of the present invention, when it contains a (Da) black agent as a (D) colorant, the (Da) black agent is a (D1a) black pigment, the (D1a) black pigment is a (D1a-1) black organic pigment, and / or a mixture of two or more (D1a-3) coloring pigments, the (D1a-1) black organic pigment contains one or more pigments selected from the group consisting of (D1a-1a) benzofuranone black pigment, (D1a-1b) perylene black pigment, and (D1a-1c) azo black pigment, and the (D1a-3) mixture of two or more coloring pigments contains two or more pigments selected from the group consisting of red, orange, yellow, green, blue, and purple pigments, by containing a compound represented by general formula (12b) as the (F1) compound described later, the effects of suppressing residues after development under high-temperature pre-baking conditions, suppressing pattern peeling after development, low-voltage driving of luminescent properties, and improving the reliability of luminescent elements become significant.

[0268] Similarly, in the photosensitive resin composition of the present invention, there is a (B) radical polymerizable compound and a (C1-1) oxime ester photoinitiator as a (C1) photopolymerization initiator, and a (Da) black agent as a (D) colorant, wherein the (Da) black agent is a (D1a) black pigment, the (D1a) black pigment is a (D1a-1) black organic pigment, and / or a mixture of two or more (D1a-3) coloring pigments, and the (D1a-1) black organic pigment contains a benzofuranone-based pigment selected from (D1a-1a). When a mixture of two or more coloring pigments (D1a-3) comprising one or more pigments selected from the group consisting of black pigments, (D1a-1b) perylene black pigments, and (D1a-1c) azo black pigments, and (D1a-3) two or more pigments, including two or more pigments selected from the group consisting of red, orange, yellow, green, blue, and purple pigments, further contains the (F1) compound described later, the effects of suppressing residues after development under high-temperature pre-baking conditions, suppressing pattern peeling after development, low-voltage driving of light-emitting properties, and improving the reliability of light-emitting elements become significant.

[0269] In the photosensitive resin composition of the present invention, when a (Da) black agent is contained as a (D) colorant, the presence of the (FB-1) compound described later and / or the (FB-2) compound described later significantly enhances the effects of suppressing residues after development under high-temperature pre-baking conditions, suppressing pattern peeling after development, reducing the voltage driving of luminescent properties, and improving the reliability of the luminescent element.

[0270] Similarly, in the photosensitive resin composition of the present invention, when it contains a (Da) black agent as a (D) colorant, the (Da) black agent being a (D1a) black pigment, the (D1a) black pigment being a (D1a-1) black organic pigment, and / or a mixture of two or more (D1a-3) coloring pigments, the (D1a-1) black organic pigment containing one or more selected from the group consisting of (D1a-1a) benzofuranone-based black pigments, (D1a-1b) perylene-based black pigments, and (D1a-1c) azo-based black pigments, and the (D1a-3) mixture of two or more coloring pigments containing two or more pigments selected from the group consisting of red, orange, yellow, green, blue, and purple pigments, by also containing the (FB-1) compound described later and / or the (FB-2) compound described later, the effects of suppressing residue after development under high-temperature pre-baking conditions, suppressing pattern peeling after development, low-voltage driving of luminescent properties, and improving the reliability of luminescent elements become significant.

[0271] Furthermore, in the photosensitive resin composition of the present invention, when one or more of the following are selected as the (A) alkali-soluble resin: (A1-1) polyimide, (A1-2) polyimide precursor, (A1-3) polybenzoxazole, (A1-4) polybenzoxazole precursor, (A1-5) polyamide-imide, (A2-1) polysiloxane, (A2-2) resin containing polycyclic side chains, and (A2-3) acid-modified epoxy resin, and when a (Da) black agent is included as a (D) colorant, the inclusion of the (FB-1) compound and / or the (FB-2) compound described later significantly enhances the effects of suppressing residues after development under high-temperature pre-baking conditions, suppressing pattern peeling after development, low-voltage driving of luminescent properties, and improving the reliability of the luminescent element.

[0272] Similarly, in the photosensitive resin composition of the present invention, one or more alkali-soluble resins selected from the group consisting of (A1-1) polyimide, (A1-2) polyimide precursor, (A1-3) polybenzoxazole, (A1-4) polybenzoxazole precursor, (A1-5) polyamide-imide, (A2-1) polysiloxane, (A2-2) resin containing polycyclic side chains, and (A2-3) acid-modified epoxy resin, are included, and a (Da) black agent is used as a (D) colorant, wherein the (Da) black agent is a (D1a) black pigment, the (D1a) black pigment is a (D1a-1) black organic pigment, and / or a mixture of two or more coloring pigments (D1a-3). When the (D1a-1) black organic pigment contains one or more pigments selected from the group consisting of (D1a-1a) benzofuranone black pigments, (D1a-1b) perylene black pigments, and (D1a-1c) azo black pigments, and the (D1a-3) two-color or more coloring pigment mixture contains two or more pigments selected from the group consisting of red, orange, yellow, green, blue, and purple pigments, the addition of the (FB-1) compound and / or the (FB-2) compound described later significantly reduces the effects of suppressing residues after development under high-temperature pre-baking conditions, suppressing pattern peeling after development, reducing the voltage driving of light-emitting properties, and improving the reliability of light-emitting elements.

[0273] Furthermore, similarly, in the photosensitive resin composition of the present invention, one or more alkali-soluble resins selected from the group consisting of (A1-1) polyimide, (A1-2) polyimide precursor, (A1-3) polybenzoxazole, (A1-4) polybenzoxazole precursor, (A1-5) polyamide-imide, (A2-1) polysiloxane, (A2-2) resin containing polycyclic side chains, and (A2-3) acid-modified epoxy resin are included, and a (Da) black agent is included as a (D) colorant. a) When the black agent is (D1a) black pigment, (D1a) black pigment is (D1a-1) black organic pigment, and (D1a-1) black organic pigment includes (D1a-1a) benzofuranone-based black pigment, the presence of (FB-1) compound (described later) and / or (FB-2) compound (described later) significantly enhances the effects of suppressing residues after development under high-temperature pre-baking conditions, suppressing pattern peeling after development, reducing the voltage driving of light-emitting properties, and improving the reliability of light-emitting elements.

[0274] As a photosensitive resin composition, when it contains a (Da) black agent as a (D) colorant, by containing one or more of the (F) compounds selected from the group consisting of (F1) compounds, (FB-1) compounds, and (FB-2) compounds described later, the effects of low-voltage driving of the light-emitting properties and improved reliability of the light-emitting element become significant. When it contains one or more of the (F) compounds selected from the group consisting of (F1) compounds, (FB-1) compounds, and (FB-2) compounds described later, from the viewpoint of low-voltage driving of the light-emitting properties and improved reliability of the light-emitting element, as a (D) colorant, it is preferable to contain one or more of the group consisting of (D1a-1a) benzofuranone-based black pigments, (D1a-1b) perylene-based black pigments, and (D1a-1c) azo-based black pigments, and more preferably (D1a-1a) benzofuranone-based black pigments.

[0275] In the photosensitive resin composition of the present invention, particularly when containing a (D1a-1a) benzofuranone-based black pigment as the (D) colorant, development residues from the pigment are sometimes significantly generated under high-temperature pre-baking conditions due to the pigment's insufficient alkali resistance. The photosensitive resin composition of the present invention, by containing the (FB-1) compound described later and / or the (FB-2) compound described later, can significantly suppress the generation of residues after development under high-temperature pre-baking conditions from the (D1a-1a) benzofuranone-based black pigment. As a result, the effects of lower voltage driving of the luminescent properties and improved reliability of the luminescent element become significant. The (FB-1) compound and the (FB-2) compound described later are particularly preferred.

[0276] As a (D1a-1a) benzofuranone black pigment, it is preferred to have a benzofuran-2(3H)-one structure or a benzofuran-3(2H)-one structure in the molecule and be a benzofuranone compound, its geometric isomer, its salt, or a salt of its geometric isomer, represented by general formula (63) or general formula (64).

[0277] [Chemical Formula 19]

[0278]

[0279] In general formulas (63) and (64), R 206 R 207 R 214 and R 215 Each independently represents a hydrogen atom, a halogen atom, an alkyl group having 1 to 10 carbon atoms, or an alkyl group having 1 to 20 fluorine atoms having 1 to 10 carbon atoms. R208 R 209 R 216 and R 217 Each independently represents a hydrogen atom, a halogen atom, and R. 212 COOH, COOR 212 COO - CONH2, CONHR 212 CONR 212 R 213 CN, OH, OR 212 OCOR 212 OCONH2, OCONHR 212 OCONR 212 R 213 NO2, NH2, NHR 212 NR 212 R 213 , NHCOR 212 NR 212 COR 213 N=CH2, N=CHR 212 N = CR 212 R 213 SH, SR 212 SOR 212 SO2R 212 SO3R 212 SO3H, SO3 - SO2NH2, SO2NHR 212 or SO2NR 212 R 213 R 212 and R 213 Each can independently represent an alkyl group with 1 to 10 carbon atoms, a cycloalkyl group with 4 to 10 carbon atoms, an alkenyl group with 2 to 10 carbon atoms, a cycloalkenyl group with 4 to 10 carbon atoms, or an alkynyl group with 2 to 10 carbon atoms. Multiple R groups... 208 R 209 R 216 、or R 217 It can be connected via direct bonds, or oxygen bridges, sulfur bridges, NH bridges, or NR bridges. 212 The bridge forms a ring. 210 R 211 R 218 and R 219 Each of these groups independently represents a hydrogen atom, an alkyl group having 1 to 10 carbon atoms, or an aryl group having 6 to 15 carbon atoms. a, b, c, and d each independently represent an integer from 0 to 4. The aforementioned alkyl, cycloalkyl, alkenyl, cycloalkenyl, alkynyl, and aryl groups may have heteroatoms and may be any of the unsubstituted or substituted derivatives.

[0280] Examples of (D1a-1a) benzofuranone black pigments include "IRGAPHOR" (registered trademark) BLACKS0100CF (manufactured by BASF), the black pigment described in International Publication No. 2010 / 081624, or the black pigment described in International Publication No. 2010 / 081756.

[0281] (D1a-1b) Perylene-based black pigments have a perylene structure in their molecules, preferably perylene compounds represented by general formula (69).

[0282] [Chemical Formula 20]

[0283]

[0284] In general formula (69), X 92 and X 93 Each can independently represent a direct bond or an alkylene chain with 1 to 10 carbon atoms. Y 92 and Y 93 Each can independently represent a direct bond or an aryl chain with 6 to 15 carbon atoms. R 224 and R 225 Each of these groups independently represents a hydrogen atom, a hydroxyl group, an alkyl group with 1 to 10 carbon atoms, an alkoxy group with 1 to 6 carbon atoms, or an acyl group with 2 to 6 carbon atoms. R 226 This represents a hydrogen atom, a halogen atom, an alkyl group with 1 to 10 carbon atoms, or an alkyl group with 1 to 10 carbon atoms and 1 to 20 fluorine atoms. a and b each independently represent integers from 0 to 5. c represents integers from 0 to 8. In X 92 and X 93 For direct keys and Y 92 and Y 93 In the case of a direct key, R 224 and R 225 Each is preferably an alkyl group having 1 to 10 carbon atoms, with a and b being 1. In X 92 and X 93 It is an alkylene chain with 1 to 10 carbon atoms, and Y 92 and Y 93 In the case of a direct key, R 224 and R 225 Preferably, hydroxyl groups are present, and a and b are both 1. In X 92 and X 93 It is an alkylene chain with 1 to 10 carbon atoms, and Y 92 and Y 93 In the case of an arylene chain with 6 to 15 carbon atoms, R 224 and R 225Each is preferably a hydroxyl group, an alkoxy group having 1 to 6 carbon atoms, or an acyl group having 2 to 6 carbon atoms. a and b each independently represent an integer from 0 to 5. The alkylene chain, arylene chain, alkoxy group, acyl group, and alkyl group mentioned above may have heteroatoms and may be any of the unsubstituted or substituted derivatives.

[0285] Examples of (D1a-1b) perylene black pigments include Pigment Black 31 or 32 (both values ​​are CI index numbers). In addition to the above, examples include "PALIOGEN" (registered trademark) BLACK S0084, PALIOGEN K0084, PALIOGENL0086, PALIOGEN K0086, PALIOGEN EH0788, or PALIOGEN FK4281 (all manufactured by BASF).

[0286] (D1a-1c) Azo black pigments have an azo group in the molecule, preferably an azo compound represented by general formula (72).

[0287] [Chemical Formula 21]

[0288]

[0289] In general formula (72), X 96 Y represents an aryl chain with 6 to 15 carbon atoms. 96 R represents an aryl chain with 6 to 15 carbon atoms. 275 R 276 and R 277 Each can independently represent a halogen atom or an alkyl group having 1 to 10 carbon atoms. R 278 Represents a halogen atom, an alkyl group having 1 to 10 carbon atoms, an alkoxy group having 1 to 6 carbon atoms, or a nitro group. 279 Represents a halogen atom, an alkyl group with 1 to 10 carbon atoms, an alkoxy group with 1 to 6 carbon atoms, an acylamino group with 2 to 10 carbon atoms, or a nitro group. R 280 R 281 R 282 and R 283 Each of the following independently represents an alkyl group having 1 to 10 hydrogen atoms or carbon atoms. 'a' represents an integer from 0 to 4, 'b' represents an integer from 0 to 2, 'c' represents an integer from 0 to 4, 'd' and 'e' each independently represent an integer from 0 to 8, and 'n' represents an integer from 1 to 4. The aforementioned arylene chains, alkyl groups, alkoxy groups, and acylamino groups may have heteroatoms and may be any of the unsubstituted or substituted derivatives.

[0290] Examples of (D1a-1c) azo-based black pigments include "CHROMOFINE" (registered trademark) BLACKA1103 (manufactured by Dainippon Seika Kogyo Co., Ltd.), the black pigment described in Japanese Patent Application Publication No. 01-170601, or the black pigment described in Japanese Patent Application Publication No. 02-034664.

[0291] Besides the solvent, from the viewpoint of improving light-blocking properties and the reliability of the light-emitting element, the content of one or more selected from the group consisting of (D1a-1a) benzofuranone-based black pigment, (D1a-1b) perylene-based black pigment, and (D1a-1c) azo-based black pigment in the total solid components of the photosensitive resin composition of the present invention is preferably 5% by mass or more, more preferably 10% by mass or more, further preferably 20% by mass or more, and particularly preferably 30% by mass or more. On the other hand, from the viewpoint of improving sensitivity during exposure, the content of one or more selected from the group consisting of (D1a-1a) benzofuranone-based black pigment, (D1a-1b) perylene-based black pigment, and (D1a-1c) azo-based black pigment is preferably 70% by mass or less, more preferably 55% by mass or less.

[0292] <(DC) Cover>

[0293] For the photosensitive resin composition of the present invention, it is preferable that the above-mentioned (D1a-1) black organic pigment further contains a (DC) coating layer. The (DC) coating layer refers to a layer that coats the pigment surface, formed, for example, by surface treatment using a silane coupling agent, a silicate, a metal alkoxide, or a resin coating treatment. By including the (DC) coating layer, the surface state of the particles of the above-mentioned (D1a-1) black organic pigment can be modified by acidification, alkaliification, hydrophilicity, or hydrophobicity, thereby improving acid resistance, alkali resistance, solvent resistance, dispersion stability, or heat resistance. This significantly reduces the generation of residues after development under high-temperature pre-baking conditions originating from the pigment, lowers the voltage driving of the luminescent properties, and improves the reliability of the luminescent element. Furthermore, by forming an insulating coating layer on the particle surface, the leakage current is reduced due to the increased insulation of the cured film, thereby improving the reliability of the luminescent element. In the photosensitive resin composition of the present invention, especially when (D1a-1a) benzofuranone-based black pigment is used as the above-mentioned (D1a-1) black organic pigment, the presence of a (DC) coating layer significantly reduces the generation of residues after development under high-temperature pre-baking conditions originating from the pigment, lowers the voltage driving of the luminescent properties, and improves the reliability of the luminescent element.

[0294] From the viewpoint of suppressing residues after development under high-temperature pre-baking conditions, the average coverage of the (DC) coating layer relative to the aforementioned (D1a-1) black organic pigment is preferably 50% or more, more preferably 70% or more, more preferably 80% or more, and even more preferably 90% or more. The average coverage of the (DC) coating layer relative to the aforementioned (D1a-1) black organic pigment can be determined based on the method described in International Publication No. 2019 / 087985.

[0295] <(DC-1) Silica coating, (DC-2) Metal oxide coating, and (DC-3) Metal hydroxide coating>

[0296] The photosensitive resin composition of the present invention preferably contains one selected from the group consisting of a (DC-1) silica coating layer, a (DC-2) metal oxide coating layer, and a (DC-3) metal hydroxide coating layer as the (DC) coating layer. Silica, metal oxides, and metal hydroxides can impart alkali resistance to pigments and suppress the formation of residues after development under high-temperature pre-baking conditions originating from the pigments. Examples of silica include silica or its hydrates. Examples of metal oxides include metal oxides or their hydrates. Examples of metal oxides include aluminum oxide, such as aluminum oxide (Al₂O₃) or aluminum oxide hydrate (Al₂O₃·nH₂O). Examples of metal hydroxides include aluminum hydroxide (Al(OH)₃). Because silica has a low dielectric constant, even with an increase in the content of the (DC) coating layer, the increase in dielectric constant can be suppressed, thereby improving the reliability of the light-emitting element.

[0297] When the (DC) coating layer contains a (DC-1) silica coating layer, and the pigment particles are set to 100 parts by mass, from the viewpoint of suppressing the generation of residues after development due to the high-temperature pre-baking conditions of the pigment, the silica content is preferably 1 part by mass or more, more preferably 5 parts by mass or more. On the other hand, from the viewpoint of improving the resolution after development, the silica content is preferably 20 parts by mass or less, more preferably 10 parts by mass or less.

[0298] When the (DC) coating layer contains a (DC-2) metal oxide coating layer and / or a (DC-3) metal hydroxide coating layer, and the pigment particles are set to 100 parts by mass, from the viewpoint of suppressing the generation of residues after development under high-temperature pre-baking conditions originating from the pigment, the total content of the metal oxide and metal hydroxide is preferably 0.1 parts by mass or more, more preferably 0.5 parts by mass or more. On the other hand, from the viewpoint of improving the storage stability of the coating solution, the total content of the metal oxide and metal hydroxide is preferably 20 parts by mass or less, more preferably 10 parts by mass or less.

[0299] <(E) Dispersant>

[0300] The photosensitive resin composition of the present invention preferably contains an (E) dispersant. An (E) dispersant refers to a compound having surface-affinity groups that interact with the surface of the aforementioned (D1) pigment, and a dispersion-stabilizing structure that improves the dispersion stability of the (D1) pigment. Examples of dispersion-stabilizing structures for the (E) dispersant include polymer chains that utilize steric hindrance to facilitate dispersion stabilization, or ionic or polar substituents that utilize electrostatic repulsion to facilitate dispersion stabilization. Particularly when the number-average particle size of the (D1) pigment is 500 nm or less, the smaller the number-average particle size, the easier it is for particles to aggregate due to the increased surface area, thus sometimes resulting in significant development residue from the pigment under high-temperature pre-baking conditions. The photosensitive resin composition of the present invention, by containing an (E) dispersant, can improve the dispersion stability of the (D1) pigment, suppress the generation of residue after development under high-temperature pre-baking conditions originating from the pigment, improve the resolution after development, and improve the storage stability of the coating solution. Furthermore, the effects of lower voltage driving of the luminescent properties and improved reliability of the luminescent element become significant.

[0301] From the viewpoint of low-voltage driving of light-emitting properties and improved reliability of light-emitting elements, the (E) dispersant preferably contains a (E) dispersant comprising nitrogen atoms. By forming a cured film of a photosensitive resin composition containing a (E) dispersant comprising nitrogen atoms, cyanide ions (CN) can be formed in the display device or organic EL display described later. - The detection intensity of the first electrode is a specific intensity.

[0302] Examples of dispersants (E) include dispersants having only basic groups, dispersants having both basic and acidic groups, dispersants having only acidic groups, dispersants having a structure where a basic group forms a salt with an acid, dispersants having a structure where an acidic group forms a salt with a base, or dispersants lacking both basic and acidic groups. From the viewpoints of improving dispersion stability, suppressing residues after development under high-temperature pre-baking conditions, and improving resolution after development, as well as from the viewpoints of low-voltage driving of luminescent properties and improving the reliability of the luminescent element, dispersants having only basic groups, dispersants having both basic and acidic groups, dispersants having a structure where a basic group forms a salt with an acid, or dispersants having a structure where an acidic group forms a salt with a base are preferred; dispersants having only basic groups or dispersants having both basic and acidic groups are more preferred.

[0303] The basic group of the (E) dispersant is preferably a nitrogen-containing ring skeleton such as a tertiary amino group, a pyrrolidine skeleton, a pyrrole skeleton, an imidazole skeleton, a pyrazole skeleton, an imidazoline skeleton, a piperidine skeleton, a piperazine skeleton, a morpholine skeleton, or a pyridine skeleton, and more preferably a tertiary amino group. The acidic group of the (E) dispersant is preferably a carboxyl group, a carboxylic anhydride group, a sulfonic acid group, a phenolic hydroxyl group, or a hydroxyimide group, and more preferably a carboxyl group or a carboxylic anhydride group. The structure in which the basic group of the (E) dispersant forms a salt with an acid is preferably a quaternary ammonium salt structure or a structure in which the above-mentioned nitrogen-containing ring skeleton forms a salt, and more preferably a quaternary ammonium salt structure. In the structure in which the basic group forms a salt with an acid, the counter anion is preferably a carboxylic acid anion, a sulfonic acid anion, a phenoxy anion, a sulfate anion, a nitrate anion, a phosphate anion, or a halide anion, and more preferably a carboxylic acid anion.

[0304] From the viewpoint of improving dispersion stability, the amine value of the (E) dispersant is preferably 5 mg KOH / g or more, more preferably 10 mg KOH / g or more. On the other hand, from the viewpoint of suppressing residues after development under high-temperature pre-baking conditions, the amine value is preferably 150 mg KOH / g or less, more preferably 100 mg KOH / g or less. Here, the amine value refers to the mass of potassium hydroxide equivalent to the acid reacting with 1 g of (E) dispersant, expressed in mg KOH / g. The amine value can be determined by titrating 1 g of (E) dispersant with an acid and then titrating with an aqueous solution of potassium hydroxide. Based on the amine value, the mass of resin per 1 mol of basic groups such as amino groups, i.e., the amine equivalent (in g / mol), can be calculated, and the number of basic groups such as amino groups in the (E) dispersant can be determined.

[0305] From the viewpoint of improving dispersion stability, the acid value of the (E) dispersant is preferably 5 mg KOH / g or more, more preferably 10 mg KOH / g or more. On the other hand, from the viewpoint of suppressing residues after development under high-temperature pre-baking conditions, the acid value is preferably 150 mg KOH / g or less, more preferably 100 mg KOH / g or less. Here, the acid value refers to the mass of potassium hydroxide reacting with 1 g of (E) dispersant, expressed in mg KOH / g. The acid value can be determined by titrating 1 g of (E) dispersant with an aqueous potassium hydroxide solution. Based on the acid value, the mass of resin per 1 mol of acidic groups, i.e., the acid equivalent (in g / mol), can be calculated, and the number of acidic groups in the (E) dispersant can be determined.

[0306] As a (E) dispersant having a polymer chain, acrylic resin-based dispersants, polyoxyalkylene ether-based dispersants, polyester-based dispersants, polyurethane-based dispersants, polyol-based dispersants, polyoxyalkylene amine-based dispersants, polyethyleneimine-based dispersants, or polyallylamine-based dispersants are preferred. From the viewpoints of improving dispersion stability and suppressing residues after development under high-temperature pre-baking conditions, and from the viewpoints of low-voltage driving of luminescent properties and improving the reliability of luminescent elements, acrylic resin-based dispersants, polyoxyalkylene ether-based dispersants, polyurethane-based dispersants, polyoxyalkylene amine-based dispersants, or polyethyleneimine-based dispersants are preferred.

[0307] For the photosensitive resin composition of the present invention, it is more preferable to further contain a pigment dispersant having a basic group (E1), wherein the (E1) compound has one or more structures selected from the group consisting of general formulas (32) to (34) and has a polyoxyalkylene structure. From the viewpoints of suppressing the viscosity increase of the pigment dispersion during storage, improving the flatness of the cured film, and suppressing residues after development under high-temperature pre-baking conditions, and from the viewpoints of low-voltage driving of luminescent properties and improving the reliability of the luminescent element, the pigment dispersant having a basic group (E1) is further preferably having a structure represented by general formula (32) and a polyoxyalkylene structure.

[0308] [Chemical Formula 22]

[0309]

[0310] In general formulas (32) to (34), R 27 ~R 30 Each of these characters independently represents an alkyl group having 1 to 6 carbon atoms. n represents an integer from 1 to 9. * 1 ~* 6 Each independently represents a bonding site with the polyoxyalkylene structure.

[0311] When the photosensitive resin composition of the present invention contains pigment (D1), and the pigment (D1) is set to 100 parts by weight, from the viewpoint of improving dispersion stability and suppressing residues after development under high-temperature pre-baking conditions, the content of dispersant (E) in the photosensitive resin composition of the present invention is preferably 5 parts by weight or more, more preferably 15 parts by weight or more. On the other hand, from the viewpoint of suppressing pattern peeling after development and suppressing residues after development under high-temperature pre-baking conditions, the content ratio of dispersant (E) is preferably 50 parts by weight or less, more preferably 40 parts by weight or less.

[0312] <(F) Compounds containing phosphorus atoms>

[0313] The photosensitive resin composition of the present invention contains: (F1) a compound having a phosphorus atom and a 1- to 2-valent aliphatic group having 6 to 30 carbon atoms (hereinafter "(F1) compound"); and / or (FB) a trimethylammonium acetyl lactone compound having a phosphorus atom and a trimethylammonium acetyl lactone structure (hereinafter "(FB) compound"). By containing (F1) compound and / or (FB) compound, it is possible to suppress residue after development under high-temperature pre-baking conditions, suppress pattern peeling after development, achieve low-voltage driving of luminescent properties, and improve the reliability of luminescent elements.

[0314] The term "betaine" refers to a compound (intramolecular salt) that has positive and negative charges at non-adjacent positions within the same molecule, and whose positively charged atoms do not bond with hydrogen atoms that would dissociate (using cation structures such as quaternary ammonium, thionium, and phosphonium), and is uncharged as a whole.

[0315] It should be noted that the (F) compound containing phosphorus atoms (hereinafter "(F) compound") contained in the photosensitive resin composition of the present invention contains the above-mentioned (F1) compound and / or (FB) compound. Furthermore, as the (F) compound, it is preferable to contain a compound having phosphorus atoms and a 1- to 2-valent aliphatic group having 6 to 30 carbon atoms, (FB-1) trimethylammonium acetyl lactone type phospholipid (hereinafter "(FB-1) compound"), (FB-2) trimethylammonium acetyl lactone compound containing aliphatic groups (hereinafter "(FB-2) compound"), (FB-3) trimethylammonium acetyl lactone compound containing reactive groups (hereinafter "(FB-3) compound"), and (FB-4) trimethylammonium acetyl lactone type resin (hereinafter "(FB-4) compound"). The compound comprises one or more of the following compounds: (F1) compound, (FB-1) non-trimethylammonium ethoxylate (hereinafter referred to as "(FC-1) compound"), (F2) compound having a phosphorus atom and an aromatic group (hereinafter referred to as "(F2) compound"), and (F3) compound having a phosphorus atom and a reactive group (hereinafter referred to as "(F3) compound"), more preferably comprising one or more of the following compounds: (F1) compound, (FB-1) compound, (FB-2) compound, (FB-3) compound, and (FB-4) compound.

[0316] For the photosensitive resin composition of the present invention, the above-mentioned (F1) compound comprises one or more compounds having a structure selected from the group consisting of an acidic group containing phosphorus atoms and an acidic group containing phosphorus atoms forming a salt, and the above-mentioned (FB) compound comprises a trimethylammonium acetyl lactone compound having an anionic structure containing phosphorus atoms. The (F1) compound and the (FB) compound preferably have a 1- to 2-valent aliphatic group having 6 to 30 carbon atoms and / or a trimethylammonium acetyl lactone structure as substituents bonded to phosphorus atoms and / or as substituents bonded to oxygen atoms on the PO bond.

[0317] The photosensitive resin composition of the present invention more preferably contains the above-mentioned (F1) compound and the above-mentioned (FB) compound. The (F1) compound comprises one or more compounds having a structure formed by forming a salt with an acidic group containing a phosphorus atom and an acidic group containing a phosphorus atom. The (FB) compound comprises a trimethylammonium acetyl lactone compound having an anionic structure containing a phosphorus atom.

[0318] Examples of structures formed by forming salts from acidic groups containing phosphorus atoms include anionic structures of acidic groups containing phosphorus atoms and structures formed by forming salts from compounds with cationic structures. Examples of compounds with cationic structures include compounds having one or more of the following groups: cations selected from metal atoms, ammonium cations, phosphonium cations, and thionium cations. Preferably, compounds have one or more of the following groups: ammonium cations and phosphonium cations. More preferably, compounds have an ammonium cation. As an ammonium cation, monoalkylammonium cations, dialkylammonium cations, or trialkylquaternary ammonium cations are preferred, and trialkylquaternary ammonium cations are more preferred. As an ammonium cation, it is preferable to have at least one aliphatic group having 1 to 30 carbon atoms, more preferably an aliphatic group having 1 to 15 carbon atoms, further preferably an aliphatic group having 1 to 10 carbon atoms, and particularly preferably an aliphatic group having 1 to 6 carbon atoms. As an aliphatic group, a straight-chain and / or branched aliphatic group with a 1- or 2-valent structure is preferred, and a group selected from the group consisting of alkyl, alkenyl and alkynyl groups with a straight-chain structure is preferred, with a straight-chain alkyl group being even more preferred.

[0319] (FB) compounds preferably have an anionic structure with at least an acidic group from a phosphorus atom and a trimethylammonium ethoxylate structure containing an ammonium cation in the molecule. Examples of (FB) compounds preferably include α-glycerophosphate choline, α-glycerophosphate ethanolamine, α-glycerophosphate serine, phosphate choline, phosphate ethanolamine, or phosphate serine.

[0320] It should be noted that the trimethylammonium acetyl lactone compound having a phosphorus atom and a trimethylammonium acetyl lactone structure (FB) preferably contains one or more compounds selected from the group consisting of (FB-1), (FB-2), (FB-3), and (FB-4), and more preferably contains (FB-1) and / or (FB-2).

[0321] More preferably, for the photosensitive resin composition of the present invention, the above-mentioned (F1) compound comprises one or more compounds having a structure selected from acidic groups containing phosphorus atoms and salts formed from acidic groups containing phosphorus atoms, and the (F1) compound comprises one or more compounds selected from the group consisting of compounds represented by general formula (11a) and their salts.

[0322] The aforementioned (FB) compound comprises a trimethylammonium acetyl lactone compound having an anionic structure containing phosphorus atoms, and the (FB) compound comprises one or more selected from the group consisting of (FB-1) trimethylammonium acetyl lactone type phospholipids, (FB-2) trimethylammonium acetyl lactone compounds containing aliphatic groups, (FB-3) trimethylammonium acetyl lactone compounds containing reactive groups, and (FB-4) trimethylammonium acetyl lactone type resins.

[0323] The (FB-1) compound comprises compounds having anionic structures containing phosphorus atoms, ammonium cation structures, and aliphatic ester structures having 6 to 30 carbon atoms and / or aliphatic ether structures having 6 to 30 carbon atoms.

[0324] The (FB-2) compound comprises compounds represented by general formula (25a).

[0325] The (FB-3) compound comprises one or more compounds having a phosphorus-containing anionic structure, an ammonium cation structure, and selected from the group consisting of a photoreactive group, a thermally reactive group, an alkenyl group having 2 to 5 carbon atoms, and an alkynyl group having 2 to 5 carbon atoms.

[0326] The (FB-4) compound comprises a resin having structural units including anionic structures containing phosphorus atoms and ammonium cation structures.

[0327] [Chemical Formula 23]

[0328]

[0329] In general formula (11a), X 1 Represents an oxygen atom or a sulfur atom. Y 1 and Y 5 Each can independently represent a direct bond or an oxygen atom. Z 1 and Z 5Each independently represents a direct bond or a divalent aliphatic group with 6 to 30 carbon atoms. In Z 1 In the case of a direct key, the corresponding R 31 This refers to a monovalent aliphatic group, a photoreactive group, a thermally reactive group, or an alkenyl group with 2 to 5 carbon atoms, having 6 to 30 carbon atoms. In Z... 5 In the case of a direct key, the corresponding R 35 This refers to a hydrogen atom, a monovalent aliphatic group with 6 to 30 carbon atoms, a photoreactive group, a thermally reactive group, or an alkenyl group with 2 to 5 carbon atoms. It should be noted that in R... 31 In the case of a photoreactive group, a thermally reactive group, or an alkenyl group with 2 to 5 carbon atoms, the corresponding R 35 This represents a monovalent aliphatic group with 6 to 30 carbon atoms. In Z... 1 and Z 5 When at least one of them is a divalent aliphatic group with 6 to 30 carbon atoms, the corresponding R 31 and / or R 35 Each can independently represent a hydrogen atom, a hydroxyl group, or a monovalent organic group with 1 to 15 carbon atoms. 'a' represents 0 or 1. 'Z' represents... 1 and Z 5 The divalent aliphatic group with 6 to 30 carbon atoms in the R group has a straight-chain and / or branched structure and is selected from the group consisting of alkylene, alkenylene, and yntylide groups. 31 and R 35 The monovalent aliphatic group with 6 to 30 carbon atoms in the group is a straight-chain and / or branched-chain structure, selected from the group consisting of alkyl, alkenyl and alkynyl groups.

[0330] In general formula (25a), X 21 Represents an oxygen atom or a sulfur atom. Y 21 and Y 24 Each can independently represent a direct bond or an oxygen atom. Z 21 This indicates a direct bond, a divalent aliphatic group with 6 to 30 carbon atoms, or a group represented by general formula (10). In Z 21 In the case of a direct bond or a group represented by general formula (10), the corresponding R 121 This represents a monovalent aliphatic group with 6 to 30 carbon atoms. In Z... 21 When the R is a divalent aliphatic group with 6 to 30 carbon atoms, the corresponding R 121 This refers to a monovalent organic group consisting of a hydrogen atom, a hydroxyl group, or 1 to 15 carbon atoms. 24 Represents an aliphatic group with 1 to 6 carbon atoms and a valence of 2 to 6. R 124 R represents an alkyl group, an alkoxy group, a carboxyl group, or a hydroxyl group with 1 to 6 carbon atoms.127 ~R 129 Each can independently represent a hydrogen atom or an alkyl group having 1 to 6 carbon atoms. 'a' represents 0 or 1. 'c' represents an integer from 0 to 4. Z 21 The divalent aliphatic group with 6 to 30 carbon atoms in the R group has a straight-chain and / or branched structure and is selected from the group consisting of alkylene, alkenylene, and yntylide groups. 121 The monovalent aliphatic group with 6 to 30 carbon atoms in the group is a straight-chain and / or branched-chain structure, selected from the group consisting of alkyl, alkenyl and alkynyl groups.

[0331] In general formula (10), Y 27 R represents an alkylene group having 1 to 6 carbon atoms. 136 This indicates an alkyl group with 1 to 6 carbon atoms. m represents an integer from 1 to 15. p represents an integer from 0 to 4. * 1 This represents the phosphorus atom or Y in general formula (25a). 21 The bond point. * 2 R in general formula (25a) 121 The bonding point.

[0332] In general formula (11a), X 1 Preferably, it contains oxygen atoms. Z 1 Preferably, it is a direct bond or a divalent aliphatic group with 6 to 15 carbon atoms. 5 Direct bonds are preferred. a is preferably 1. Z 1 and Z 5 The divalent aliphatic group having 6 to 30 carbon atoms is preferably a straight-chain group selected from the group consisting of alkylene, alkenyl, and yntylide, more preferably a straight-chain alkylene group, and even more preferably a straight-chain alkylene group having 6 to 10 carbon atoms. R 31 and R 35 The monovalent aliphatic group having 6 to 30 carbon atoms is preferably a straight-chain group selected from the group consisting of alkyl, alkenyl, and alkynyl groups, preferably a straight-chain alkyl group, and more preferably a straight-chain alkyl group having 6 to 10 carbon atoms.

[0333] In general formula (25a), X 21 Preferably, it contains oxygen atoms. Z 21 Preferably, it has a direct bond or a divalent aliphatic group with 6 to 15 carbon atoms. 24 Preferably, the aliphatic group has a carbon number of 1 to 4 and a valence of 2 to 6. 124 Preferably, the carbon atom is an alkyl group, an alkoxy group, a carboxyl group, or a hydroxyl group, having 1 to 4 carbon atoms. 127 ~R 129 Each is independently preferred to have hydrogen atoms or alkyl groups having 1 to 4 carbon atoms.21 The divalent aliphatic group having 6 to 30 carbon atoms is preferably a straight-chain group selected from the group consisting of alkylene, alkenyl, and yntylide, more preferably a straight-chain alkylene group, and even more preferably a straight-chain alkylene group having 6 to 10 carbon atoms. R 121 The monovalent aliphatic group having 6 to 30 carbon atoms is preferably a straight-chain group selected from the group consisting of alkyl, alkenyl, and alkynyl groups, more preferably a straight-chain alkyl group, and even more preferably a straight-chain alkyl group having 6 to 10 carbon atoms.

[0334] <(F1) Compounds having phosphorus atoms and aliphatic groups with 6 to 30 carbon atoms in 1 to 2 valences>

[0335] The photosensitive resin composition of the present invention preferably contains a compound (F1) having a phosphorus atom and a 1- to 2-valent aliphatic group having 6 to 30 carbon atoms (hereinafter "(F1) compound"). As the (F1) compound, it is preferable to contain one or more compounds selected from the group consisting of compounds represented by the above general formula (11a) and their salts. Furthermore, as the (F1) compound, it is more preferable to contain one or more compounds selected from the group consisting of compounds represented by general formulas (11) to (13) and their salts. By containing the (F1) compound, it is possible to suppress residues after development under high-temperature pre-baking conditions, suppress pattern peeling after development, reduce the voltage driving of luminescent properties, and improve the reliability of the luminescent element. From the viewpoint of suppressing residues after development under high-temperature pre-baking conditions, reducing the voltage driving of luminescent properties, and improving the reliability of the luminescent element, the (F1) compound is also preferably containing two or more compounds selected from the group consisting of compounds represented by general formulas (11) to (13) and their salts.

[0336] (F1) The compound has: a straight-chain and / or branched-chain structure, a group selected from the group consisting of alkyl, alkenyl and ynyl groups as (I) a monovalent aliphatic group having 6 to 30 carbon atoms; and / or, a straight-chain and / or branched-chain structure, a group selected from the group consisting of alkylene, alkenyl and ynylene groups as (II) a divalent aliphatic group having 6 to 30 carbon atoms.

[0337] [Chemical Formula 24]

[0338]

[0339] In general formulas (11) to (13), X 1 ~X 3 Each can be represented independently as an oxygen atom or a sulfur atom. Z 1 ~Z 3 and Z 5 ~Z 7Each can independently represent a direct bond or a divalent aliphatic group with 6 to 30 carbon atoms. Z in general formula (11) 1 In the case of a direct key, the corresponding R 31 This refers to a monovalent aliphatic group, a photoreactive group, a thermally reactive group, or an alkenyl group with 2 to 5 carbon atoms, having 6 to 30 carbon atoms. Regarding Z in general formulas (12) and (13)... 2 and the corresponding R 32 and Z 3 and the corresponding R 33 Also, Z in general formula (11) 1 and the corresponding R 31 The relationship is the same. In general formula (11), Z... 5 In the case of a direct key, the corresponding R 35 This refers to a hydrogen atom, a monovalent aliphatic group with 6 to 30 carbon atoms, a photoreactive group, a thermally reactive group, or an alkenyl group with 2 to 5 carbon atoms. Regarding Z in general formulas (12) and (13)... 6 and the corresponding R 36 and Z 7 and the corresponding R 37 Also, Z in general formula (11) 5 and the corresponding R 35 The relationship is the same. It should be noted that R in general formula (11) 31 In the case of a photoreactive group, a thermally reactive group, or an alkenyl group with 2 to 5 carbon atoms, the corresponding R 35 This represents a monovalent aliphatic group with 6 to 30 carbon atoms. Regarding R in general formulas (12) and (13)... 32 and the corresponding R 36 and R 33 and the corresponding R 37 Also, R in general formula (11) 31 and the corresponding R 35 The relationship is the same. In general formula (11), Z... 1 and Z 5 When at least one of them is a divalent aliphatic group with 6 to 30 carbon atoms, the corresponding R 31 and / or R 35 Each of these groups independently represents a hydrogen atom, a hydroxyl group, or a monovalent organic group having 1 to 15 carbon atoms. Regarding Z in general formulas (12) to (13) 2 and Z 6 and the corresponding R 32 and R 36 and Z 3 and Z 7 and the corresponding R 33 and R 37Z is also in general formula (11) 1 and Z 5 and the corresponding R 31 and R 35 The relationship is the same. a and b each independently represent 0 or 1. Z 1 ~Z 3 and Z 5 ~Z 7 The divalent aliphatic group with 6 to 30 carbon atoms in the R group has a straight-chain and / or branched structure and is selected from the group consisting of alkylene, alkenylene, and yntylide groups. 31 ~R 33 and R 35 ~R 37 The monovalent aliphatic group with 6 to 30 carbon atoms in the group is a straight-chain and / or branched-chain structure, selected from the group consisting of alkyl, alkenyl and alkynyl groups.

[0340] In general formulas (11) to (13), X 1 ~X 3 Preferably, it contains oxygen atoms. Z 1 ~Z 3 Each is preferably a direct bond or a divalent aliphatic group with 6 to 15 carbon atoms. 5 ~Z 7 Each is preferably a direct bond, independently. In general formula (11), Z... 1 In the case of a direct key, the corresponding R 31 Preferably, it is a monovalent aliphatic group, a photoreactive group, a thermally reactive group, or an alkenyl group with 2 to 5 carbon atoms, having 6 to 15 carbon atoms. Regarding Z in general formulas (12) and (13) 2 and the corresponding R 32 and Z 3 and the corresponding R 33 Also, Z in general formula (11) 1 and the corresponding R 31 The relationship is the same. In general formula (11), Z... 5 In the case of a direct key, the corresponding R 35 Preferably, it is a hydrogen atom, a monovalent aliphatic group with 6 to 15 carbon atoms, a photoreactive group, a thermally reactive group, or an alkenyl group with 2 to 5 carbon atoms, and more preferably a hydrogen atom. Regarding Z in general formulas (12) and (13) 6 and the corresponding R 36 and Z 7 and the corresponding R 37 Also, Z in general formula (11) 5 and the corresponding R 35 The relationship is the same. In general formula (11), Z... 1 and Z5 When at least one of them is a divalent aliphatic group with 6 to 30 carbon atoms, the corresponding R 31 and / or R 35 Each of the following is preferably, independently, a hydrogen atom, a hydroxyl group, an aryl group with 6 to 15 carbon atoms, an alkoxy group with 1 to 6 carbon atoms, an aryloxy group with 6 to 15 carbon atoms, a haloalkyl group with 1 to 12 carbon atoms, a haloalkyloxy group with 1 to 12 carbon atoms, a haloaryl group with 6 to 15 carbon atoms, a haloaryloxy group with 6 to 15 carbon atoms, an alkoxy polyalkyleneoxy group with 2 to 10 carbon atoms, a hydroxy polyalkyleneoxy group with 2 to 10 carbon atoms, or a phthalimide group; more preferably, a hydrogen atom, a haloalkyl group with 1 to 12 carbon atoms, or a haloaryloxy group with 6 to 15 carbon atoms. Regarding Z in general formulas (12) to (13) 2 and Z 6 and the corresponding R 32 and R 36 and Z 3 and Z 7 and the corresponding R 33 and R 37 Also, Z in general formula (11) 1 and Z 5 and the corresponding R 31 and R 35 The relationship is the same. a and b are each independently preferred to be 1. Z 1 ~Z 3 and Z 5 ~Z 7 The divalent aliphatic group having 6 to 30 carbon atoms is preferably a straight-chain group selected from the group consisting of alkylene, alkenyl, and yntylide, more preferably a straight-chain alkylene group, and even more preferably a straight-chain alkylene group having 6 to 10 carbon atoms. 31 ~R 33 and R 35 ~R 37 The monovalent aliphatic group having 6 to 30 carbon atoms is preferably a straight-chain group selected from the group consisting of alkyl, alkenyl, and alkynyl groups, preferably a straight-chain alkyl group, and more preferably a straight-chain alkyl group having 6 to 10 carbon atoms.

[0341] For the photosensitive resin composition of the present invention, it is preferred that the above-mentioned (F1) compound comprises one or more selected from the group consisting of phosphonic acid containing aliphatic groups, phosphonic acid monoester containing aliphatic groups, phosphite monoester containing aliphatic groups, and phosphite diester containing aliphatic groups.

[0342] From the viewpoints of suppressing residue after development under high-temperature pre-baking conditions, suppressing pattern peeling after development, low-voltage driving of luminescent properties, and improving the reliability of luminescent elements, the (F1) compound preferably contains a phosphate monoester containing an aliphatic group, a phosphate diester containing an aliphatic group, a phosphite monoester containing an aliphatic group, a phosphite diester containing an aliphatic group, a phosphonic acid containing an aliphatic group, a phosphonic acid monoester containing an aliphatic group, hypophosphite containing an aliphatic group, hypophosphite monoester containing an aliphatic group, hypophosphite containing an aliphatic group, or a compound containing an aliphatic group. The sample contains one or more of the following: thiophosphate monoesters and thiophosphate diesters containing aliphatic groups; more preferably, it contains one or more of the following: phosphate monoesters containing aliphatic groups, phosphite monoesters containing aliphatic groups, phosphonic acids containing aliphatic groups, phosphonic acid monoesters containing aliphatic groups, hypophosphite containing aliphatic groups, and hypophosphite containing aliphatic groups; and even more preferably, it contains one or more of the following: phosphonic acids containing aliphatic groups, phosphonic acid monoesters containing aliphatic groups, phosphite monoesters containing aliphatic groups, and hypophosphite diesters containing aliphatic groups.

[0343] The photosensitive resin composition of the present invention preferably further contains propylene glycol monoalkyl ether acetate, and the above-mentioned (F1) compound has a 1- to 2-valent aliphatic group having 6 to 10 carbon atoms. The photosensitive resin composition of the present invention contains propylene glycol monoalkyl ether acetate as a solvent having an acetate bond as described later, and as the (F1) compound, preferably Z in the above general formulas (11) to (13) 1 ~Z 3 In the case of a direct key, R 31 ~R 33 In the above general formulas (11) to (13), each of the 6 to 30 carbon atoms in the monovalent aliphatic group is independently a monovalent aliphatic group with 6 to 10 carbon atoms. 5 ~Z 7 In the case of a direct key, R 35 ~R 37 R is a hydrogen atom or a monovalent aliphatic group with 6 to 30 carbon atoms. 35 ~R 37 In the above general formulas (11) to (13), each of the 6 to 30 carbon atoms in the monovalent aliphatic group is independently a monovalent aliphatic group with 6 to 10 carbon atoms. 1 ~Z 3 When each group is an independent divalent aliphatic group with 6 to 30 carbon atoms, Z 1 ~Z 3 Each is an independent aliphatic group with 6 to 10 carbon atoms in a divalent state. In the above general formulas (11) to (13), Z 5 ~Z 7When each group is an independent divalent aliphatic group with 6 to 30 carbon atoms, Z 5 ~Z 7 Each group is an aliphatic group with 6 to 10 carbon atoms in a divalent state. It should be noted that propylene glycol monoalkyl ether acetate is preferred, as is propylene glycol monomethyl ether acetate or propylene glycol monoethyl ether acetate, and more preferably propylene glycol monomethyl ether acetate.

[0344] By having a monovalent aliphatic group with a specific number of carbon atoms or a divalent aliphatic group with a specific number of carbon atoms as described above, the solubility of the (F1) compound in propylene glycol monomethyl ether acetate can be specifically and significantly improved. This results in significant effects on suppressing residues after development under high-temperature pre-baking conditions, suppressing pattern peeling after development, reducing the voltage driving of luminescent properties, and improving the reliability of the luminescent element. Therefore, it is particularly preferred that the photosensitive resin composition of the present invention contains propylene glycol monomethyl ether acetate as a solvent having acetate bonds as described later. Especially in the photosensitive resin composition of the present invention, when the (F1) compound has a monovalent aliphatic group with a specific number of carbon atoms or a divalent aliphatic group with a specific number of carbon atoms as described above, the content ratio of propylene glycol monomethyl ether acetate in the solvent is more preferably 30-100% by mass, more preferably 50-100% by mass, and particularly preferably 70-100% by mass.

[0345] As a (F1) compound, from the viewpoints of suppressing residues after development under high-temperature pre-baking conditions, suppressing pattern peeling after development, reducing the voltage driving of luminescent properties, and improving the reliability of the luminescent element, it is preferable to include one or more compounds selected from the group consisting of compounds represented by general formulas (11) to (13) and their salts, wherein in the above general formulas (11) to (13), Z 1 ~Z 3 and Z 5 ~Z 7 For direct keys, R 31 ~R 33 and R 35 ~R 37 Each is independently a monovalent aliphatic group having 6 to 30 carbon atoms. From the same point of view, for (F1) compounds, Z is more preferably found in the above general formulas (11) to (13). 1 ~Z 3 and Z 5 ~Z 7 For direct keys, R 31 ~R 33 Each is an independent monovalent aliphatic group with 6 to 30 carbon atoms, R 35 ~R 37 It is a hydrogen atom.

[0346] Among the compounds (F1), those represented by general formulas (11) to (13) include, for example, hexyl phosphate, 2-ethylhexyl phosphate, octyl phosphate, decyl phosphate, dodecyl phosphate, octadecyl phosphate, stearyl phosphate, tetradecyl phosphate, dihexyl phosphate, bis(2-ethylhexyl) phosphate, dioctyl phosphate, didecyl phosphate, tetradecyl phosphate, bis(octadecyl) phosphate, distearate, hexylphosphonic acid, (2-ethylhexyl)phosphonic acid, octylphosphonic acid, decylphosphonic acid, dodecylphosphonic acid, octadecylphosphonic acid, stearylphosphonic acid, tetradecylphosphonic acid, and hexylphosphonate. (2-Ethylhexyl)phosphonate 2-ethylhexyl ester, octylphosphonate octyl ester, decyl decyl ester, dodecylphosphonate dodecyl ester, octadecylphosphonate octadecyl ester, stearylphosphonate stearyl ester, hexyl hypophosphonic acid, (2-ethylhexyl)phosphonic acid, (trimethylpentyl)phosphonic acid, octyl hypophosphonic acid, decyl hypophosphonic acid, dodecyl hypophosphonic acid, octadecyl hypophosphonic acid, stearyl hypophosphonic acid, tetracosyl hypophosphonic acid, dihexyl hypophosphonic acid, bis(2-ethylhexyl)phosphonic acid, bis(trimethylpentyl)phosphonic acid, dioctyl hypophosphonic acid, didecyl hypophosphonic acid, tetracosyl hypophosphonic acid, dioctadecyl hypophosphonic acid, or distearate hypophosphonic acid.

[0347] As a (F1) compound, from the viewpoint of suppressing residues after development under high-temperature pre-baking conditions, suppressing pattern peeling after development, reducing the voltage driving of luminescent properties, and improving the reliability of the light-emitting element, it is preferable to contain one or more compounds selected from the group consisting of compounds represented by general formula (12b) and their salts (hereinafter referred to as "specific (F1) compounds"). As a (F1) compound, from the viewpoint of suppressing residues after development under high-temperature pre-baking conditions, reducing the voltage driving of luminescent properties, and improving the reliability of the light-emitting element, it is also preferable to contain one or more compounds selected from the group consisting of compounds represented by general formula (12b) and their salts, and further preferably to contain one or more compounds represented by general formulas (11) to (13) and their salts.

[0348] [Chemical Formula 25]

[0349]

[0350] In general formula (12b), Z 2 and Z 6 Each can independently represent a direct bond or a divalent aliphatic group with 6 to 30 carbon atoms. In general formula (12b), Z... 2 In the case of a direct key, the corresponding R 32 This indicates a monovalent aliphatic group, a photoreactive group, a thermally reactive group, or an alkenyl group with 2 to 5 carbon atoms, having 6 to 30 carbon atoms. Z in general formula (12b) 6 In the case of a direct key, the corresponding R36 This represents a hydrogen atom, a monovalent aliphatic group with 6 to 30 carbon atoms, a photoreactive group, a thermally reactive group, or an alkenyl group with 2 to 5 carbon atoms. It should be noted that R in general formula (12b) 32 In the case of a photoreactive group, a thermally reactive group, or an alkenyl group with 2 to 5 carbon atoms, the corresponding R 36 This represents a monovalent aliphatic group with 6 to 30 carbon atoms. Z in general formula (12b) 2 and Z 6 When at least one of them is a divalent aliphatic group with 6 to 30 carbon atoms, the corresponding R 32 and / or R 36 Each of these independently represents a hydrogen atom, a hydroxyl group, or a monovalent organic group having 1 to 15 carbon atoms. 2 and Z 6 The divalent aliphatic group with 6 to 30 carbon atoms in the R group has a straight-chain and / or branched structure and is selected from the group consisting of alkylene, alkenylene, and yntylide groups. 32 and R 36 The monovalent aliphatic group with 6 to 30 carbon atoms in the group is a straight-chain and / or branched-chain structure, selected from the group consisting of alkyl, alkenyl and alkynyl groups.

[0351] In general formula (12b), Z 2 and Z 6 Each group is independently preferred to have a direct bond or a divalent aliphatic group with 6 to 15 carbon atoms. 2 and Z 6 The divalent aliphatic group having 6 to 30 carbon atoms is preferably a straight-chain group selected from the group consisting of alkylene, alkenyl, and yntylide, more preferably a straight-chain alkylene group, and even more preferably a straight-chain alkylene group having 6 to 10 carbon atoms. 32 and R 36 The monovalent aliphatic group having 6 to 30 carbon atoms is preferably a straight-chain group selected from the group consisting of alkyl, alkenyl, and alkynyl groups, preferably a straight-chain alkyl group, and more preferably a straight-chain alkyl group having 6 to 10 carbon atoms.

[0352] In particular, in the photosensitive resin composition of the present invention, when the above-mentioned (A) alkali-soluble resin contains one or more selected from the group consisting of (A1-1) polyimide, (A1-2) polyimide precursor, (A1-3) polybenzoxazole, (A1-4) polybenzoxazole precursor, (A1-5) polyamide-imide, (A2-1) polysiloxane, (A2-2) resin containing polycyclic side chains, and (A2-3) acid-modified epoxy resin, from the viewpoints of suppressing residue after development under high-temperature pre-baking conditions, suppressing pattern peeling after development, low-voltage driving of luminescent properties, and improving the reliability of luminescent elements, the (F1) compound preferably contains one or more selected from the group consisting of compounds represented by general formula (12b) and their salts. As the (F1) compound, by containing aliphatic groups having a specific structure, the generation of residue after development under high-temperature pre-baking conditions originating from the above-mentioned resin can be significantly suppressed. As a result, the effects of lower voltage driving of light-emitting characteristics and improved reliability of light-emitting elements become significant. Furthermore, the effect of improved adhesion to the substrate becomes significant. As an alkali-soluble resin (A) obtained by combining with one or more of the group consisting of compounds selected from general formula (12b) and their salts, it preferably contains one or more of the group consisting of (A1-1) polyimide, (A1-2) polyimide precursor, (A1-3) polybenzoxazole, (A1-4) polybenzoxazole precursor, (A1-5) polyamide-imide, and (A2-1) polysiloxane, more preferably contains one or more of the group consisting of (A1-1) polyimide, (A1-2) polyimide precursor, (A1-3) polybenzoxazole, (A1-4) polybenzoxazole precursor, and (A1-5) polyamide-imide, and particularly preferably contains one or more of the group consisting of (A1-1) polyimide, (A1-3) polybenzoxazole, and (A1-5) polyamide-imide.

[0353] From the viewpoints of suppressing residues after development under high-temperature pre-baking conditions, reducing the voltage driving of luminescent properties, and improving the reliability of luminescent elements, the (F1) compound comprises one or more compounds selected from the group consisting of compounds represented by general formula (12b) and their salts, and more preferably one or more compounds selected from the group consisting of compounds represented by general formula (11b), compounds represented by general formula (13b), and their salts.

[0354] In the photosensitive resin composition of the present invention, when the above-mentioned (A) alkali-soluble resin contains one or more of the group consisting of (A1-1) polyimide, (A1-2) polyimide precursor, (A1-3) polybenzoxazole, (A1-4) polybenzoxazole precursor, (A1-5) polyamide-imide, (A2-1) polysiloxane, (A2-2) resin containing polycyclic side chains, and (A2-3) acid-modified epoxy resin, from the viewpoints of suppressing residues after development under high-temperature pre-baking conditions, low-voltage driving of luminescent properties, and improving the reliability of luminescent elements, the (F1) compound contains one or more of the group consisting of compounds represented by general formula (12b) and their salts, and more preferably contains one or more of the group consisting of compounds represented by general formula (11b), compounds represented by general formula (13b), and their salts.

[0355] [Chemical Formula 26]

[0356]

[0357] In general formulas (11b) and (13b), Z 1 Z 3 Z 5 and Z 7 Each can independently represent a direct bond or a divalent aliphatic group with 6 to 30 carbon atoms. Z in general formula (11b) 1 In the case of a direct key, the corresponding R 31 This refers to a monovalent aliphatic group, a photoreactive group, a thermally reactive group, or an alkenyl group with 2 to 5 carbon atoms, having 6 to 30 carbon atoms. In general formula (13b), Z... 3 and the corresponding R 33 Also related to Z in general formula (11b) 1 and the corresponding R 31 The relationship is the same. In general formula (11b), Z... 5 In the case of a direct key, the corresponding R 35 This represents a hydrogen atom, a monovalent aliphatic group with 6 to 30 carbon atoms, a photoreactive group, a thermally reactive group, or an alkenyl group with 2 to 5 carbon atoms. In general formula (13b), Z... 7 and the corresponding R 37 Also related to Z in general formula (11b) 5 and the corresponding R 35 The relationship is the same. It should be noted that R in general formula (11b) 31 In the case of a photoreactive group, a thermally reactive group, or an alkenyl group with 2 to 5 carbon atoms, the corresponding R 35 This represents a monovalent aliphatic group with 6 to 30 carbon atoms. In general formula (13b), R... 33and the corresponding R 37 Also related to R in general formula (11b) 31 and the corresponding R 35 The relationship is the same. In general formula (11b), Z... 1 and Z 5 When at least one of them is a divalent aliphatic group with 6 to 30 carbon atoms, the corresponding R 31 and / or R 35 Each of these independently represents a hydrogen atom, a hydroxyl group, or a monovalent organic group having 1 to 15 carbon atoms. In general formula (13b), Z... 3 and Z 7 and the corresponding R 33 and R 37 Also related to Z in general formula (11b) 1 and Z 5 and the corresponding R 31 and / or R 35 The relationship is the same. Z 1 Z 3 Z 5 and Z 7 The divalent aliphatic group with 6 to 30 carbon atoms in the R group has a straight-chain and / or branched structure and is selected from the group consisting of alkylene, alkenylene, and yntylide groups. 31 R 33 R 35 and R 37 The monovalent aliphatic group with 6 to 30 carbon atoms in the group is a straight-chain and / or branched-chain structure, selected from the group consisting of alkyl, alkenyl and alkynyl groups.

[0358] In general formulas (11b) and (13b), Z 1 Z 3 Z 5 and Z 7 Each is preferably a direct bond or a divalent aliphatic group with 6 to 15 carbon atoms. 1 Z 3 Z 5 and Z 7 The divalent aliphatic group having 6 to 30 carbon atoms is preferably a straight-chain group selected from the group consisting of alkylene, alkenyl, and yntylide, more preferably a straight-chain alkylene group, and even more preferably a straight-chain alkylene group having 6 to 10 carbon atoms. 31 R 33 R 35 and R 37The monovalent aliphatic group having 6 to 30 carbon atoms is preferably a straight-chain group selected from the group consisting of alkyl, alkenyl, and alkynyl groups, more preferably a straight-chain alkyl group, and even more preferably a straight-chain alkyl group having 6 to 10 carbon atoms.

[0359] As for the (F1) compound, from the viewpoints of suppressing residue after development under high-temperature pre-baking conditions, reducing the voltage driving of luminescence properties, and improving the reliability of the light-emitting element, it is preferable to have groups substituted with fluorine atoms. Furthermore, when the (A1-1) polyimide, (A1-2) polyimide precursor, (A1-3) polybenzoxazole, (A1-4) polybenzoxazole precursor, and (A1-5) polyamide-imide contain structural units with fluorine atoms, the generation of residue after development under high-temperature pre-baking conditions originating from the aforementioned resin can be significantly suppressed. Thus, the effects of reducing the voltage driving of luminescence properties and improving the reliability of the light-emitting element become significant.

[0360] As a way for (F1) compounds to have groups substituted with fluorine atoms, in the above general formulas (11) to (13), Z 1 ~Z 3 and Z 5 ~Z 7 When each bond is a direct bond independently, R is preferred. 31 ~R 33 and R 35 ~R 37 Each is independently a monovalent aliphatic group with 6 to 15 carbon atoms substituted by fluorine atoms. Similarly, in the above general formulas (11) to (13), in Z 1 ~Z 3 and Z 5 ~Z 7 In the case of divalent aliphatic groups with 6 to 30 carbon atoms each, R is preferred. 31 ~R 33 and R 35 ~R 37 Each is independently a haloalkyl group having 1 to 12 carbon atoms substituted with fluorine atoms, or a haloaryl group having 6 to 15 carbon atoms substituted with fluorine atoms.

[0361] Examples of groups substituted with fluorine atoms include fluoromethyl, trifluoromethyl, trifluoropropyl, pentafluoropentyl, nonafluorohexyl, tridecafluorooctyl, heptadecafluorodecyl, heptadecafluorodecyl, dodecyl fluorofluorocarbon, fluorocyclopentyl, tetrafluorocyclopentyl, fluorophenyl, difluorophenyl, pentafluorophenyl, trifluoromethylphenyl, trifluoropropoxy, tetrafluoropropoxy, nonafluorohexyloxy, tetrafluorocyclopentyloxy, pentafluorophenoxy, or trifluoromethylphenoxy.

[0362] As the aforementioned photoreactive group, (meth)acrylate, styrene, cinnamyl, or maleimide are preferred, and (meth)acrylate is more preferred. As the aforementioned thermally reactive group, epoxy, oxetyl, carboxyl, amino, or mercapto are preferred, and epoxy is more preferred. As the aforementioned alkenyl or alkynyl group having 2 to 5 carbon atoms, vinyl, allyl, 2-methyl-2-propenyl, 2-butenyl, 2-methyl-2-butenyl, 3-methyl-2-butenyl, ethynyl, or 2-propynyl are preferred, and vinyl, allyl, or vinyl are even more preferred.

[0363] As (F1) compounds, from the viewpoints of suppressing residues after development under high-temperature pre-baking conditions, suppressing pattern peeling after development, low-voltage driving of light-emitting properties, and improving the reliability of light-emitting elements, it is also preferable to use compounds having a straight-chain structure and / or a branched structure, selected from the group consisting of alkyl, alkenyl, and alkynyl groups, as (I) a monovalent aliphatic group having 6 to 10 carbon atoms, and (II) a photoreactive group or an alkenyl group having 2 to 5 carbon atoms (hereinafter, "(F1) compounds containing reactive groups"). Examples of (F1) compounds containing reactive groups include, for example, hexyl phosphate vinyl ester, octyl phosphate vinyl ester, decyl phosphate vinyl ester, octyl phosphate allyl ester, octyl phosphate styrene ester, hexylphosphonate vinyl ester, octylphosphonate vinyl ester, decylphosphonate vinyl ester, octylphosphonate allyl ester, octylphosphonate styrene ester, vinylphosphonate hexyl ester, vinylphosphonate octyl ester, vinylphosphonate decyl ester, allylphosphonate octyl ester, styrenephosphonate octyl ester, hexyl vinyl hypophosphite, and octyl ethylene phosphate. Phosphoric acid, decyl vinyl phosphoric acid, octyl allyl phosphoric acid, octyl styryl phosphoric acid, EO-modified octyl phosphate (meth)acrylate, EO-modified octyl phosphate (vinyl)acrylate, EO-modified octyl phosphate (allyl)acrylate, PO-modified octyl phosphate (meth)acrylate, PO-modified octyl phosphate (vinyl)acrylate, PO-modified octyl phosphate (allyl)acrylate, BO-modified octyl phosphate (meth)acrylate, BO-modified octyl phosphate (vinyl)acrylate, or BO-modified octyl phosphate (allyl)acrylate.

[0364] When the photosensitive resin composition of the present invention contains a (C1) photopolymerization initiator as a (C) photosensitizer, and the total amount of (A) alkali-soluble resin and (B) free radical polymerizable compound is set to 100 parts by mass, from the viewpoints of suppressing residues after development under high-temperature pre-baking conditions, low-voltage driving of luminescent properties, and improving the reliability of the luminescent element, the content of (F1) compound in the photosensitive resin composition of the present invention is preferably 0.05 parts by mass or more, more preferably 0.1 parts by mass or more, further preferably 0.3 parts by mass or more, and particularly preferably 0.5 parts by mass or more. On the other hand, from the viewpoint of suppressing pattern peeling after development, the content of (F1) compound is preferably 2 parts by mass or less, more preferably 1.5 parts by mass or less, further preferably 1.2 parts by mass or less, and particularly preferably 1 part by mass or less.

[0365] When the photosensitive resin composition of the present invention contains a (C3)naphthoquinone diazide compound as a (C) photosensitizer, and the total amount of (A) alkali-soluble resin is set to 100 parts by mass, from the viewpoints of suppressing residue after development under high-temperature pre-baking conditions, suppressing pattern peeling after development, low-voltage driving of luminescent properties, and improving the reliability of the luminescent element, the content of the (F1) compound in the photosensitive resin composition of the present invention is preferably 0.1 parts by mass or more, more preferably 0.2 parts by mass or more, further preferably 0.5 parts by mass or more, and particularly preferably 1 part by mass or more. On the other hand, from the viewpoint of suppressing pattern peeling after development, the content of the (F1) compound is preferably 4 parts by mass or less, more preferably 3 parts by mass or less, further preferably 2.5 parts by mass or less, and particularly preferably 2 parts by mass or less.

[0366] <(FB-1) Trimethylammonium acetyl lactone type phospholipids and (FB-2) Trimethylammonium acetyl lactone compounds containing aliphatic groups>

[0367] The photosensitive resin composition of the present invention preferably contains (FB-1) a trimethylammonium acetyl lactone type phospholipid (hereinafter "(FB-1) compound") and / or (FB-2) a trimethylammonium acetyl lactone compound containing an aliphatic group (hereinafter "(FB-2) compound"). As the (FB-1) compound, it is preferable to contain a compound having the above-described phosphorus-containing anionic structure, ammonium cation structure, and an aliphatic ester structure having 6 to 30 carbon atoms and / or an aliphatic ether structure having 6 to 30 carbon atoms. As the (FB-2) compound, it is preferable to contain a compound represented by the above-described general formula (25a). Furthermore, as the (FB-2) compound, it is more preferable to contain one or more compounds selected from the group consisting of compounds represented by general formulas (25) to (27). By containing the (FB-1) compound and / or the (FB-2) compound, it is possible to suppress residues after development under high-temperature pre-baking conditions, suppress pattern peeling after development, achieve low-voltage driving of luminescent properties, and improve the reliability of the luminescent element. From the viewpoints of suppressing residues after development under high-temperature pre-baking conditions, low-voltage driving of luminescence characteristics, and improving the reliability of luminescent elements, the (FB-1) compound and the (FB-2) compound preferably contain two or more (FB-1) trimethylammonium acetyl lactone type phospholipids, and more preferably contain two or more compounds represented by (FB-2) general formulas (25) to (27), and more preferably contain both (FB-1) compound and (FB-2) compound.

[0368] The (FB-1) compound has at least a trimethylammonium ethoxylate structure comprising (I) an anionic structure from an acidic group containing a phosphorus atom and an ammonium cation structure. Furthermore, it is preferable to have (III) a fatty acid ester structure from a fatty acid compound having 6 to 30 carbon atoms; and / or an aliphatic ether structure from an aliphatic alcohol having 6 to 30 carbon atoms. (III) The fatty acid ester structure; and / or the aliphatic ether structure comprising one or more groups selected from the group consisting of alkyl, alkenyl, alkynyl, alkylene, alkenyl, and alkynyl groups, which are linear and / or branched structures.

[0369] From the viewpoints of suppressing residues after development under high-temperature pre-baking conditions, suppressing pattern peeling after development, low-voltage driving of luminescent properties, and improving the reliability of luminescent elements, the photosensitive resin composition of the present invention contains a specific (F1) compound, and more preferably contains a specific (FB-1) compound and / or a specific (FB-2) compound.

[0370] The (FB-2) compound has at least a trimethylammonium acetyl lactone structure comprising (I) an anionic structure from an acidic group containing a phosphorus atom and an ammonium cation structure. Furthermore, as (IV) a monovalent aliphatic group having 6 to 30 carbon atoms, it is a straight-chain and / or branched group selected from the group consisting of alkyl, alkenyl, and ynyl groups; and / or, as (V) a divalent aliphatic group having 6 to 30 carbon atoms, it is preferably a group having a straight-chain and / or branched structure selected from the group consisting of alkylene, alkenyl, and ynylene groups.

[0371] [Chemical Formula 27]

[0372]

[0373] In general formulas (25) to (27), X 21 ~X 23 Each can be represented independently as an oxygen atom or a sulfur atom. Z 21 ~Z 23 Each can independently represent a direct bond, a divalent aliphatic group with 6 to 30 carbon atoms, or a group represented by general formula (10). Z in general formula (25) 21 When it is a direct bond or a group represented by general formula (10), the corresponding R 121 This represents a monovalent aliphatic group with 6 to 30 carbon atoms. In general formulas (26) and (27), Z... 22 and the corresponding R 122 and Z 23 and the corresponding R 123 Also with Z in general formula (25) 21 and the corresponding R 121 The relationship is the same. Z in general formula (25) 21 When it is a divalent aliphatic group with 6 to 30 carbon atoms, the corresponding R 121 This refers to a monovalent organic group consisting of a hydrogen atom, a hydroxyl group, or 1 to 15 carbon atoms. In general formulas (26) to (27), Z... 22 and the corresponding R 122 and Z 23 and the corresponding R 123 Also with Z in general formula (25) 21 and the corresponding R 121 The relationship is the same. Z 24 ~Z 26 Each of these groups independently represents an aliphatic group with 1 to 6 carbon atoms and a valence of 2 to 6. R 124 ~R 126 Each can independently represent an alkyl group, an alkoxy group, a carboxyl group, or a hydroxyl group having 1 to 6 carbon atoms. 127 ~R 135Each of the following independently represents a hydrogen atom or an alkyl group having 1 to 6 carbon atoms. a and b each independently represent 0 or 1. c, d, and e each independently represent an integer from 0 to 4. x and y each independently represent 0 or 1, where x + y = 1. Z 21 ~Z 23 The divalent aliphatic group with 6 to 30 carbon atoms in the R group has a straight-chain and / or branched structure and is selected from the group consisting of alkylene, alkenylene, and yntylide groups. 121 ~R 123 The monovalent aliphatic group with 6 to 30 carbon atoms in the group is a straight-chain and / or branched-chain structure, selected from the group consisting of alkyl, alkenyl and alkynyl groups.

[0374] In general formula (10), Y 27 R represents an alkylene group having 1 to 6 carbon atoms. 136 This indicates an alkyl group with 1 to 6 carbon atoms. m represents an integer from 1 to 15. p represents an integer from 0 to 4. * 1 This indicates the bonding point with the oxygen atom in general formula (25), the bonding point with the oxygen or phosphorus atom in general formula (26), or the bonding point with the phosphorus atom in general formula (27). * 2 R in general formula (25) 121 The bond point and R in general formula (26) 122 The bond point, or R in general formula (27) 123 The bonding point.

[0375] In general formulas (25) to (27), X 21 ~X 23 Preferably, it contains oxygen atoms. Z 21 ~Z 23 Each is preferably a direct bond or a divalent aliphatic group having 6 to 15 carbon atoms. Z in general formula (25) 21 When it is a direct key, the corresponding R 121 Preferably, it is a monovalent aliphatic group with 6 to 15 carbon atoms. In general formulas (26) and (27), Z... 22 and the corresponding R 122 and Z 23 and the corresponding R 123 Also with Z in general formula (25) 21 and the corresponding R 121 The relationship is the same. Z in general formula (25) 21 When it is a divalent aliphatic group with 6 to 30 carbon atoms, the corresponding R 121Preferably, it comprises hydrogen atom, hydroxyl group, aryl group with 6 to 15 carbon atoms, alkoxy group with 1 to 6 carbon atoms, aryloxy group with 6 to 15 carbon atoms, haloalkyl group with 1 to 12 carbon atoms, haloalkyloxy group with 1 to 12 carbon atoms, haloaryl group with 6 to 15 carbon atoms, haloaryloxy group with 6 to 15 carbon atoms, alkoxy polyalkyleneoxy group with 2 to 10 carbon atoms, hydroxy polyalkyleneoxy group with 2 to 10 carbon atoms, or phthalimide group. In general formulas (26) to (27), Z 22 and the corresponding R 122 and Z 23 and the corresponding R 123 Also with Z in general formula (25) 21 and the corresponding R 121 The relationship is the same. Z 24 ~Z 26 Each group is preferably an aliphatic group with 1 to 4 carbon atoms and a 2 to 6 valence. 124 ~R 126 Each group is preferably an alkyl group, an alkoxy group, a carboxyl group, or a hydroxyl group, each having 1 to 4 carbon atoms. 127 ~R 135 Each is preferably an alkyl group having 1 to 4 carbon atoms. 21 ~Z 23 The divalent aliphatic group having 6 to 30 carbon atoms is preferably a straight-chain group selected from the group consisting of alkylene, alkenyl, and yntylide, more preferably a straight-chain alkylene group, and even more preferably a straight-chain alkylene group having 6 to 10 carbon atoms. 121 ~R 123 The monovalent aliphatic group having 6 to 30 carbon atoms is preferably a straight-chain group selected from the group consisting of alkyl, alkenyl, and alkynyl groups, more preferably a straight-chain alkyl group, and even more preferably a straight-chain alkyl group having 6 to 10 carbon atoms.

[0376] As the (FB-1) compound, from the viewpoints of suppressing residues after development under high-temperature pre-baking conditions, suppressing pattern peeling after development, low-voltage driving of luminescent properties, and improving the reliability of luminescent elements, the anionic structure of the trimethylammonium ethoxylate structure described above, which is derived from an acidic group containing phosphorus atoms, is preferably selected from the group consisting of phosphodiester anions containing aliphatic groups, phosphite diester anions containing aliphatic groups, phosphonic acid monoester anions containing aliphatic groups, hypophosphite monoester anions containing aliphatic groups, hypophosphite anions containing aliphatic groups, and thiophosphate diester anions containing aliphatic groups. More preferably, it is a phosphodiester anion containing aliphatic groups and / or a phosphonic acid monoester anion containing aliphatic groups. Even more preferably, it is a phosphonic acid monoester anion containing aliphatic groups.

[0377] From the same point of view, the ammonium cation structure in the above-mentioned (I) trimethylammonium ethanolide structure is preferably an ammonium cation, a monoalkylammonium cation, a dialkylammonium cation, or a trialkylquaternary ammonium cation, more preferably a trialkylquaternary ammonium cation.

[0378] It should be noted that, in addition to the alkyl group in the ammonium cation structure, the anionic structure connecting the ammonium cation structure and the acidic group from the phosphorus atom also has a divalent aliphatic group with 1 to 6 carbon atoms. The preferred structure for connecting the ammonium cation structure and the anionic structure from the phosphorus atom is a divalent aliphatic group with 1 to 4 carbon atoms. The divalent aliphatic group with 1 to 6 carbon atoms may also have an alkyl group, an alkoxy group, a carboxyl group, or a hydroxyl group with 1 to 6 carbon atoms as substituents.

[0379] The structure comprising both the ammonium cation structure of (I) trimethylammonium ethoxylate structure described above and the structure connecting the ammonium cation structure and the anionic structure from an acidic group containing a phosphorus atom, is more preferably derived from a nitrogen-containing aliphatic alcohol compound having at least one hydroxyl group and at least one ammonium group or amino group with 1 to 6 carbon atoms. The nitrogen-containing aliphatic alcohol compound having at least one hydroxyl group and at least one ammonium group or amino group with 1 to 6 carbon atoms is preferably ethanolamine, propanolamine, butanolamine, pentanolamine, serine, threonine, tyrosine, or choline, more preferably ethanolamine, serine, or choline, and even more preferably choline.

[0380] The photosensitive resin composition of the present invention further comprises at least propylene glycol monoalkyl ether acetate, and also contains diethylene glycol dialkyl ether; and / or, selected from one or more of the group consisting of propylene glycol monoalkyl ether, alkyl lactate, alkyl glycol acetate, and alkyl glycol acetate, wherein the above (FB) compound preferably has an anionic structure containing phosphorus atoms and a trialkyl quaternary ammonium cationic structure.

[0381] The photosensitive resin composition of the present invention contains at least propylene glycol monoalkyl ether acetate as a solvent having an acetate bond as described later, and further contains diethylene glycol dialkyl ether as a solvent having three or more ether bonds in the molecule as described later; and / or, as a solvent having an alcoholic hydroxyl group as described later, contains one or more of the group selected from propylene glycol monoalkyl ether, alkyl lactate, alkyl glycolate, and alkyl hydroxyacetate (hereinafter referred to as "the case containing a specific solvent"). In the case of containing compound (FB-1), as compound (FB-1), from the viewpoint of suppressing residue after development under high-temperature pre-baking conditions, suppressing pattern peeling after development, low-voltage driving of luminescent properties, and improving the reliability of luminescent elements, as the above-mentioned (I) trimethylammonium acetone structure, it is preferable to contain at least a compound having a trialkyl quaternary ammonium cationic structure. As a trialkyl quaternary ammonium cationic structure, it is preferable to have three alkyl groups having one to six carbon atoms, more preferably three alkyl groups having one to four carbon atoms. As the (FB-1) compound, a compound having a trialkyl quaternary ammonium cationic structure is more preferably used as the (I) trimethylammonium ethoxylate structure described above. Similarly, in the case of containing the specific solvent described above, when packaging the (FB-2) compound, as the (FB-2) compound, R is preferably one of the above general formulas (25) to (27). 127 ~R 135Each alkyl group has 1 to 6 carbon atoms, more preferably 1 to 4 carbon atoms. Compounds (FB-1) and (FB-2) possess the aforementioned trialkyl quaternary ammonium cation structure, thereby significantly improving the specific solubility of compounds (FB-1) and (FB-2) in solvents. This results in significant effects on suppressing residues after development under high-temperature pre-baking conditions, suppressing pattern peeling after development, achieving low-voltage driving of luminescent properties, and improving the reliability of the luminescent element. Therefore, it is particularly preferred that the photosensitive resin composition of the present invention contains a specific solvent. It should be noted that propylene glycol monoalkyl ether acetate is preferably propylene glycol monomethyl ether acetate or propylene glycol monoethyl ether acetate, more preferably propylene glycol monomethyl ether acetate. Furthermore, diethylene glycol dialkyl ether is preferably diethylene glycol dimethyl ether, diethylene glycol diethyl ether, or diethylene glycol ethyl methyl ether, more preferably diethylene glycol ethyl methyl ether. Furthermore, the preferred materials are propylene glycol monoalkyl ether, propylene glycol monoethyl ether, methyl lactate, ethyl lactate, methyl glycolate, ethyl hydroxyacetate, ethyl acetate, 2-hydroxymethyl acetate, and 2-hydroxyethyl acetate, and more preferably propylene glycol monomethyl ether, ethyl lactate, ethyl hydroxyacetate, or 2-hydroxyethyl acetate.

[0382] In particular, in the photosensitive resin composition of the present invention, when compounds (FB-1) and (FB-2) have the above-described trialkyl quaternary ammonium cationic structure, the content of propylene glycol monomethyl ether acetate in the solvent is preferably 30% by mass or more, more preferably 40% by mass or more, and even more preferably 50% by mass or more. On the other hand, the content of propylene glycol monomethyl ether acetate is preferably 90% by mass or less, more preferably 80% by mass or less, and even more preferably 70% by mass or less.

[0383] In particular, in the photosensitive resin composition of the present invention, when compounds (FB-1) and (FB-2) have the above-described trialkyl quaternary ammonium cationic structure, the total content of diethylene glycol dimethyl ether, diethylene glycol diethyl ether, diethylene glycol ethyl methyl ether, propylene glycol monomethyl ether, methyl lactate, ethyl lactate, ethyl hydroxyacetate, and 2-hydroxyethyl acetate in the solvent is preferably 10% by mass or more, more preferably 20% by mass or more, and even more preferably 30% by mass or more. On the other hand, the total content of diethylene glycol dimethyl ether, diethylene glycol diethyl ether, diethylene glycol ethyl methyl ether, propylene glycol monomethyl ether, methyl lactate, ethyl lactate, ethyl hydroxyacetate, and 2-hydroxyethyl acetate is preferably 50% by mass or less, more preferably 40% by mass or less.

[0384] When the photosensitive resin composition of the present invention contains a (FB-1) compound, from the viewpoints of suppressing residue after development under high-temperature pre-baking conditions, suppressing pattern peeling after development, low-voltage driving of luminescence properties, and improving the reliability of the luminescent element, the (FB-1) compound preferably contains one or more groups selected from the group consisting of alkyl, alkenyl, and alkynyl groups, specifically the fatty acid ester structure derived from a fatty acid compound having 6 to 30 carbon atoms, and / or the aliphatic ether structure derived from an aliphatic alcohol having 6 to 30 carbon atoms. The alkyl, alkenyl, and alkynyl groups, which are linear and / or branched structures included in the (III) fatty acid ester structure and / or the aliphatic ether structure, preferably have 10 to 20 carbon atoms, more preferably 15 to 20 carbon atoms.

[0385] As the fatty acid ester structure (III) described above; and / or, the fatty acid compound having 6 to 30 carbon atoms in the aliphatic ether structure, similarly, a fatty acid compound having 10 to 20 carbon atoms is more preferred, and a fatty acid compound having 15 to 20 carbon atoms is even more preferred. As the fatty acid compound having 6 to 30 carbon atoms, hexanoic acid, caprylic acid, capric acid, lauric acid, myristic acid, palmitic acid, stearic acid, oleic acid, linoleic acid, α-linolenic acid, γ-linolenic acid, trans oleic acid, arachidic acid, arachidonic acid, eicosapentaenoic acid, behenic acid, docosahexaenoic acid, or erucic acid are preferred, and palmitic acid, stearic acid, oleic acid, linoleic acid, α-linolenic acid, γ-linolenic acid, trans oleic acid, arachidonic acid, or eicosapentaenoic acid are even more preferred.

[0386] When the photosensitive resin composition of the present invention contains a (FB-2) compound, from the viewpoints of suppressing residue after development under high-temperature pre-baking conditions, suppressing pattern peeling after development, low-voltage driving of luminescence characteristics, and improving the reliability of the luminescent element, Z in the above general formulas (25) to (27) is... 21 ~Z 23 For direct keys, R 121 ~R 123 Preferably, it is a monovalent aliphatic group with 6 to 15 carbon atoms, and more preferably, it is a monovalent aliphatic group with 6 to 10 carbon atoms.

[0387] As the (FB-1) compound, from the viewpoints of suppressing residues after development under high-temperature pre-baking conditions, suppressing pattern peeling after development, reducing the voltage driving of luminescent properties, and improving the reliability of the light-emitting element, it is particularly preferred to include a compound having the following structure (hereinafter referred to as "specific (FB-1) compound"): (VI) an ester structure of an aliphatic polyfunctional alcohol compound having at least 3 hydroxyl groups and 2 to 6 carbon atoms, or (VII) an ester structure of a nitrogen-containing aliphatic alcohol compound having at least 2 hydroxyl groups and at least 1 amino or alkyl amide group and 15 to 20 carbon atoms. As the (FB-1) compound, from the viewpoints of suppressing residues after development under high-temperature pre-baking conditions, reducing the voltage driving of luminescent properties, and improving the reliability of the light-emitting element, it is also preferred to contain a specific (FB-1) compound or more than one (FB-1) compound.

[0388] As the (VI) aliphatic polyfunctional alcohol ester structure described above, it is more preferably an ester structure derived from an aliphatic polyfunctional alcohol compound having at least 3 hydroxyl groups and having 2 to 4 carbon atoms. The aliphatic polyfunctional alcohol compound having at least 3 hydroxyl groups and having 2 to 6 carbon atoms is preferably 1,1,2-glycerol, glycerol, 1,2,4-butanetriol, 1,2,5-pentanetriol, 1,3,5-pentanetriol, 1,2,6-hexanetriol, 1,3,6-hexanetriol, erythritol, threitol, pentaerythritol, trimethylolpropane, trimethylolpropane, or more preferably glycerol.

[0389] As the nitrogen-containing aliphatic alcohol ester structure (VII) described above, it is more preferably an ester structure derived from a nitrogen-containing aliphatic alcohol compound having 17 to 20 carbon atoms, having at least 2 hydroxyl groups and at least 1 amino or alkyl amide group.

[0390] The preferred form is a nitrogen-containing aliphatic alcohol compound having at least two hydroxyl groups and at least one amino or alkylamide group with 15 to 20 carbon atoms, preferably sphingosine, dihydrosphingosine, phytosphingosine, ceramide, dihydroceramide, or phytoceramide, more preferably sphingosine or ceramide.

[0391] As for the specific (FB-1) compound mentioned above, from the viewpoints of suppressing residues after development under high-temperature pre-baking conditions, suppressing pattern peeling after development, low-voltage driving of luminescent properties, and improving the reliability of luminescent elements, it is particularly preferred to contain glycerophospholipids and / or sphingophospholipids.

[0392] For the photosensitive resin composition of the present invention, the above-mentioned (FB) compound preferably contains one or more of the group consisting of phosphatidylcholine, phosphatidylethanolamine, phosphatidylserine, sphingomyelin, hydrogenated phosphatidylcholine, hydrogenated phosphatidylethanolamine, hydrogenated phosphatidylserine, hydrogenated sphingomyelin, lecithin, hydrogenated lecithin, cephalin, hydrogenated cephalin, acetal phosphatidylcholine, and platelet-activating factor.

[0393] The (FB) compound more preferably comprises the specific (FB-1) compound described above. As the specific (FB-1) compound described above, from the viewpoints of suppressing residue after development under high-temperature pre-baking conditions, suppressing pattern peeling after development, low-voltage driving of luminescent properties, and improving the reliability of the luminescent element, it is further preferred to contain a compound selected from phosphatidylcholine, phosphatidylethanolamine, phosphatidylserine, sphingomyelin, hydrogenated phosphatidylcholine, hydrogenated phosphatidylethanolamine, hydrogenated phosphatidylserine, hydrogenated sphingomyelin, lysophosphatidylcholine, lysophosphatidylethanolamine, lysophosphatidylserine, lysophosphatidylserine, and lecithin. The compound contains one or more of the following: hydrogenated lecithin, lysophosphatidylcholine, cephalin, hydrogenated cephalin, lysophosphatidylcholine, acetal phosphatidylcholine, platelet-activating factor, and (trimethylammonium)ethylphosphonic acid ceramide. Particularly preferred are compounds containing one or more of the following: phosphatidylcholine, phosphatidylethanolamine, phosphatidylserine, sphingomyelin, hydrogenated phosphatidylcholine, hydrogenated phosphatidylethanolamine, hydrogenated phosphatidylserine, hydrogenated sphingomyelin, lecithin, hydrogenated lecithin, cephalin, hydrogenated cephalin, acetal phosphatidylcholine, and platelet-activating factor. Examples of specific (FB-1) compounds include those with the structures shown below.

[0394] [Chemical Formula 28]

[0395]

[0396] As a (FB-2) compound, from the viewpoints of suppressing residues after development under high-temperature pre-baking conditions, suppressing pattern peeling after development, low-voltage driving of luminescent properties, and improving the reliability of luminescent elements, it is preferable to contain one or more of the following: phosphodiester-type ammonium trimethylammonium acetate lactone containing aliphatic groups, phosphite diester-type ammonium trimethylammonium acetate lactone containing aliphatic groups, phosphonomonoester-type ammonium trimethylammonium acetate lactone containing aliphatic groups, hypophosphite monoester-type ammonium trimethylammonium acetate lactone containing aliphatic groups, and thiophosphate diester-type ammonium trimethylammonium acetate lactone containing aliphatic groups; more preferably, it contains phosphodiester-type ammonium trimethylammonium acetate lactone containing aliphatic groups and / or phosphonomonoester-type ammonium trimethylammonium acetate lactone containing aliphatic groups; and even more preferably, it contains phosphonomonoester-type ammonium trimethylammonium acetate lactone containing aliphatic groups.

[0397] As a (FB-2) compound, from the viewpoints of suppressing residues after development under high-temperature pre-baking conditions, suppressing pattern peeling after development, reducing the voltage driving of luminescent properties, and improving the reliability of the light-emitting element, it is particularly preferred to contain one or more compounds selected from the group consisting of compounds represented by general formulas (25b) to (26b) (hereinafter referred to as "specific (FB-2) compounds"). As a (FB-2) compound, from the viewpoints of suppressing residues after development under high-temperature pre-baking conditions, reducing the voltage driving of luminescent properties, and improving the reliability of the light-emitting element, it is also preferred to contain a compound that includes a specific (FB-2) compound and also contains one or more compounds represented by general formulas (25) to (27).

[0398] [Chemical Formula 29]

[0399]

[0400] In general formulas (25b) and (26b), Z 21 and Z 22 Each can independently represent a direct bond, a divalent aliphatic group with 6 to 30 carbon atoms, or a group represented by general formula (10). Z in general formula (25) 21 When it is a direct bond or a group represented by general formula (10), the corresponding R 121 This represents a monovalent aliphatic group with 6 to 30 carbon atoms. In general formula (26), Z... 22 and the corresponding R 122 Also with Z in general formula (25) 21 and the corresponding R 121 The relationship is the same. Z in general formula (25) 21 When it is a divalent aliphatic group with 6 to 30 carbon atoms, the corresponding R 121 This represents a monovalent organic group consisting of a hydrogen atom, a hydroxyl group, or 1 to 15 carbon atoms. In general formula (26), Z... 22 and the corresponding R 122 Also with Z in general formula (25) 21 and the corresponding R 121 The relationship is the same. Z 24 and Z 25 Each of these groups independently represents an aliphatic group with 1 to 6 carbon atoms and a valence of 2 to 6. R 124 and R 125 Each can independently represent an alkyl group, an alkoxy group, a carboxyl group, or a hydroxyl group having 1 to 6 carbon atoms. 127 ~R 132 Each of the following independently represents a hydrogen atom or an alkyl group having 1 to 6 carbon atoms. c and d each independently represent an integer from 0 to 4. x and y each independently represent 0 or 1, where x + y = 1. Z 21 and Z22 The divalent aliphatic group with 6 to 30 carbon atoms in the R group has a straight-chain and / or branched structure and is selected from the group consisting of alkylene, alkenylene, and yntylide groups. 121 and R 122 The monovalent aliphatic group with 6 to 30 carbon atoms in the group is a straight-chain and / or branched-chain structure, selected from the group consisting of alkyl, alkenyl and alkynyl groups.

[0401] In general formula (10), Y 27 R represents an alkylene group having 1 to 6 carbon atoms. 136 This indicates an alkyl group with 1 to 6 carbon atoms. m represents an integer from 1 to 15. p represents an integer from 0 to 4. * 1 This indicates the bonding site with the oxygen atom in general formula (25b), or with the oxygen or phosphorus atom in general formula (26b). * 2 R in general formula (25b) 121 The bond point, or R in general formula (26b) 122 The bonding point.

[0402] In general formulas (25b) and (26b), Z 21 and Z 22 Each group is preferably a direct bond or a divalent aliphatic group with 6 to 15 carbon atoms. 24 and Z 25 Each group is preferably a divalent to hexavalent aliphatic group with 1 to 4 carbon atoms. 124 and R 125 Each group is preferably an alkyl group, an alkoxy group, a carboxyl group, or a hydroxyl group, each having 1 to 4 carbon atoms. 127 ~R 132 Each is preferably an alkyl group having 1 to 4 carbon atoms. 21 and Z 22 The divalent aliphatic group having 6 to 30 carbon atoms is preferably a straight-chain group selected from the group consisting of alkylene, alkenyl, and yntylide, more preferably a straight-chain alkylene group, and even more preferably a straight-chain alkylene group having 6 to 10 carbon atoms. 121 and R 122 The monovalent aliphatic group having 6 to 30 carbon atoms is preferably a straight-chain group selected from the group consisting of alkyl, alkenyl, and alkynyl groups, more preferably a straight-chain alkyl group, and even more preferably a straight-chain alkyl group having 6 to 10 carbon atoms.

[0403] Apart from the solvent, the total percentage of (FB-1) compound and (FB-2) compound in all solid components of the photosensitive resin composition of the present invention is preferably 0.003% by mass or more, more preferably 0.01% by mass or more, further preferably 0.02% by mass or more, even more preferably 0.04% by mass or more, and particularly preferably 0.08% by mass or more, from the viewpoint of suppressing residue after development under high-temperature pre-baking conditions, low-voltage driving of luminescent properties, and improving the reliability of the luminescent element. On the other hand, the total percentage of (FB-1) compound and (FB-2) compound is preferably 1.3% by mass or less, more preferably 1.1% by mass or less, further preferably 0.9% by mass or less, even more preferably 0.7% by mass or less, and particularly preferably 0.5% by mass or less, from the viewpoint of suppressing pattern peeling after development.

[0404] When the photosensitive resin composition of the present invention contains (A) an alkali-soluble resin and (B) a free radical polymerizable compound, and when the photosensitive resin composition of the present invention contains (C1) a photopolymerization initiator as (C) a photosensitizer, the total content of compounds (FB-1) and (FB-2) in the photosensitive resin composition of the present invention, when the total content of (A) an alkali-soluble resin and (B) a free radical polymerizable compound is set to 100 parts by mass, is preferably 0.01 parts by mass or more, more preferably 0.03 parts by mass or more, further preferably 0.05 parts by mass or more, and particularly preferably 0.1 parts by mass or more, from the viewpoint of suppressing residue after development under high-temperature pre-baking conditions, low-voltage driving of luminescent characteristics, and improving the reliability of the luminescent element. On the other hand, the total content of compounds (FB-1) and (FB-2), from the viewpoint of suppressing pattern peeling after development, is preferably 1.5 parts by mass or less, more preferably 1.2 parts by mass or less, further preferably 1 part by mass or less, and particularly preferably 0.5 parts by mass or less.

[0405] When the photosensitive resin composition of the present invention contains a (C3) naphthoquinone diazide compound as a (C) photosensitizer, the total content of (FB-1) compound and (FB-2) compound in the photosensitive resin composition of the present invention, with the total amount of (A) alkali-soluble resin set to 100 parts by mass, is preferably 0.03 parts by mass or more, more preferably 0.05 parts by mass or more, further preferably 0.1 parts by mass or more, and particularly preferably 0.3 parts by mass or more, from the viewpoint of suppressing residue after development under high-temperature pre-baking conditions, suppressing pattern peeling after development, low-voltage driving of luminescent properties, and improving the reliability of the luminescent element. On the other hand, the total content of (FB-1) compound and (FB-2) compound, from the viewpoint of suppressing pattern peeling after development, is preferably 3 parts by mass or less, more preferably 2.5 parts by mass or less, further preferably 2 parts by mass or less, and particularly preferably 1 part by mass or less.

[0406] <(FC-1) Non-trimethylammonium acetyl lactone phospholipid>

[0407] The photosensitive resin composition of the present invention preferably contains a (FC-1) non-trimethylammonium acetylide phospholipid (hereinafter "(FC-1) compound"). As the (FC-1) compound, it is preferable to contain a compound having an acidic group containing phosphorus atoms and / or an anionic structure containing phosphorus atoms, and an aliphatic ester structure having 6 to 30 carbon atoms and / or an aliphatic ether structure having 6 to 30 carbon atoms. Furthermore, as the (FC-1) compound, it is also preferable to contain a compound having one or more structures selected from the group consisting of an acidic group containing phosphorus atoms and a salt formed by an acidic group containing phosphorus atoms, and an aliphatic ester structure having 6 to 30 carbon atoms and / or an aliphatic ether structure having 6 to 30 carbon atoms. By containing the (FC-1) compound, the effects of suppressing residue after development under high-temperature pre-baking conditions, low-voltage driving of luminescent properties, and improving the reliability of the luminescent element become significant. From the viewpoints of suppressing residues after development under high-temperature pre-baking conditions, low-voltage driving of luminescence characteristics, and improving the reliability of luminescent elements, it is also preferable that the (FC-1) compound contains two or more (FC-1) non-trimethylammonium acetyl lactone type phospholipids.

[0408] The (FC-1) compound has at least (II) an acidic group containing a phosphorus atom in its molecule; and / or an anionic structure derived from the acidic group containing a phosphorus atom. Furthermore, it is preferable to have (III) a fatty acid ester structure derived from a fatty acid compound having 6 to 30 carbon atoms; and / or an aliphatic ether structure derived from an aliphatic alcohol having 6 to 30 carbon atoms. The aforementioned (III) fatty acid ester structure; and / or aliphatic ether structure comprises one or more groups selected from the group consisting of alkyl, alkenyl, alkynyl, alkylene, alkenyl, and alkynyl groups, both linear and branched.

[0409] The photosensitive resin composition of the present invention preferably further comprises (FC-1) non-trimethylammonium acetyl lactone type phospholipid, wherein the (FC-1) compound comprises a compound having an acidic group containing phosphorus atoms and / or an anionic structure containing phosphorus atoms, and an aliphatic ester structure having 6 to 30 carbon atoms and / or an aliphatic ether structure having 6 to 30 carbon atoms.

[0410] From the viewpoints of suppressing residues after development under high-temperature pre-baking conditions, achieving low-voltage driving of luminescent properties, and improving the reliability of the luminescent element, the photosensitive resin composition of the present invention preferably comprises one or more compounds selected from the group consisting of a specific (F1) compound, a specific (FB-1) compound, and a specific (FB-2) compound, and further comprises a (FC-1) compound. From the same viewpoint, the photosensitive resin composition of the present invention further preferably comprises a specific (F1) compound, further comprises a specific (FB-1) compound and / or a specific (FB-2) compound, and also comprises a (FC-1) compound.

[0411] As the (FC-1) compound, from the viewpoints of suppressing residues after development under high-temperature pre-baking conditions, low-voltage driving of luminescence characteristics, and improving the reliability of the light-emitting element, the (III) fatty acid ester structure and / or aliphatic ether structure described above preferably includes one or more groups selected from the group consisting of alkyl, alkenyl, and alkynyl groups, comprising a straight-chain structure and / or a branched structure. The straight-chain structure and / or branched structure, alkyl, alkenyl, and alkynyl groups included in the (III) fatty acid ester structure and / or aliphatic ether structure described above preferably have 6 to 30 carbon atoms, more preferably 10 to 20 carbon atoms, and even more preferably 15 to 20 carbon atoms. Similarly, as a fatty acid compound with 6 to 30 carbon atoms in the (III) fatty acid ester structure and / or aliphatic ether structure described above, a fatty acid compound with 10 to 20 carbon atoms is more preferred, and a fatty acid compound with 15 to 20 carbon atoms is even more preferred. The above-described compounds can be cited as fatty acid compounds with 6 to 30 carbon atoms.

[0412] As the (FC-1) compound, from the viewpoints of suppressing residues after development under high-temperature pre-baking conditions, low-voltage driving of luminescence characteristics, and improving the reliability of the luminescent element, it is particularly preferred to include a compound having (VI) an ester structure from an aliphatic polyfunctional alcohol compound having at least 3 hydroxyl groups and having 2 to 6 carbon atoms, or (VII) an ester structure from a nitrogen-containing aliphatic alcohol compound having at least 2 hydroxyl groups and at least 1 amino or alkyl amide group and having 15 to 20 carbon atoms.

[0413] As for the (VI) aliphatic polyfunctional alcohol ester structure described above, an ester structure derived from an aliphatic polyfunctional alcohol compound having at least three hydroxyl groups and having 2 to 4 carbon atoms is more preferred. As for the aliphatic polyfunctional alcohol compound having at least three hydroxyl groups and having 2 to 6 carbon atoms, the above-described compound is preferred.

[0414] As the nitrogen-containing aliphatic alcohol ester structure (VII) described above, it is more preferably an ester structure derived from a nitrogen-containing aliphatic alcohol compound having 17 to 20 carbon atoms, having at least 2 hydroxyl groups and at least 1 amino or alkyl amide group.

[0415] The above-described compound is preferred as a nitrogen-containing aliphatic alcohol compound having at least two hydroxyl groups and at least one amino or alkylamide group with 15 to 20 carbon atoms.

[0416] As the (FC-1) compound, in addition to the (VI) aliphatic polyfunctional alcohol ester structure and (VII) nitrogen-containing aliphatic alcohol ester structure described above, it is also preferable to further have a (VIII) ester structure derived from an aliphatic polyfunctional alcohol compound having at least two hydroxyl groups and having 2 to 8 carbon atoms. The (VIII) other aliphatic polyfunctional alcohol ester structures include one or more groups selected from the group consisting of alkyl, alkenyl, cycloalkyl, and cycloalkenyl groups.

[0417] As an aliphatic polyfunctional alcohol compound with 2 to 8 carbon atoms having at least 2 hydroxyl groups in the other aliphatic polyfunctional alcohol ester structures described above (VIII), preferably glycerol, 1,2,4-butanetriol, 1,2,5-pentanetriol, 1,2,6-hexanetriol, erythritol, pentaerythritol, trimethylolpropane, glucose, mannose, galactose, bornesitol, inositol, 4-O-methyl meso-inositol, pinitol, pinpollitol, valienol, quercitol, quinic acid, or shikimic acid, more preferably glycerol or inositol.

[0418] From the viewpoints of suppressing residues after development under high-temperature pre-baking conditions, achieving low-voltage driving of luminescence properties, and improving the reliability of the light-emitting element, compounds containing one or more of the following groups are particularly preferred: phosphatidic acid, phosphatidylglycerol, lysophosphatidic acid, lysophosphatidylglycerol, phosphatidylinositol, lysophosphatidylglycerol, diphosphatidylglycerol, cardiolipin, sphingosine-1-phosphate, and phosphatidyl-cytidine monophosphate. Examples of compounds with the structures shown below can be cited as (FC-1) compounds.

[0419] [Chemical Formula 30]

[0420]

[0421] Apart from the solvent, the content of the (FC-1) compound in all solid components of the photosensitive resin composition of the present invention is preferably 0.003% by mass or more, more preferably 0.01% by mass or more, further preferably 0.02% by mass or more, even more preferably 0.04% by mass or more, and particularly preferably 0.08% by mass or more, from the viewpoint of suppressing residue after development under high-temperature pre-baking conditions, low-voltage driving of luminescent properties, and improving the reliability of the luminescent element. On the other hand, from the viewpoint of suppressing pattern peeling after development, the content of the (FC-1) compound is preferably 1.3% by mass or less, more preferably 1.1% by mass or less, further preferably 0.9% by mass or less, even more preferably 0.7% by mass or less, and particularly preferably 0.5% by mass or less.

[0422] When the photosensitive resin composition of the present invention contains (A) an alkali-soluble resin and (B) a free radical polymerizable compound, and the total amount of (A) the alkali-soluble resin and (B) the free radical polymerizable compound is set to 100 parts by mass, from the viewpoints of suppressing residue after development under high-temperature pre-baking conditions, low-voltage driving of luminescent properties, and improving the reliability of the luminescent element, the content of (FC-1) in the photosensitive resin composition of the present invention is preferably 0.01 parts by mass or more, more preferably 0.03 parts by mass or more, further preferably 0.05 parts by mass or more, and particularly preferably 0.1 parts by mass or more. On the other hand, from the viewpoint of suppressing pattern peeling after development, the content of the (FC-1) compound is preferably 1.5 parts by mass or less, more preferably 1.2 parts by mass or less, further preferably 1 part by mass or less, and particularly preferably 0.5 parts by mass or less.

[0423] <(F2) Compounds containing phosphorus atoms and aromatic groups>

[0424] The photosensitive resin composition of the present invention preferably contains a compound having a phosphorus atom and an aromatic group (hereinafter referred to as "(F2) compound"). As the (F2) compound, it is preferable to contain one or more compounds selected from the group consisting of compounds represented by general formulas (15) to (17) and their salts. By containing the (F2) compound, the effects of suppressing residues after development under high-temperature pre-baking conditions, reducing the voltage driving of luminescent properties, and improving the reliability of luminescent elements become significant. As the (F2) compound, from the viewpoint of suppressing residues after development under high-temperature pre-baking conditions, reducing the voltage driving of luminescent properties, and improving the reliability of luminescent elements, it is also preferable to contain two or more compounds represented by general formulas (15) to (17) and their salts.

[0425] From the viewpoints of suppressing residues after development under high-temperature pre-baking conditions, achieving low-voltage driving of luminescent properties, and improving the reliability of the luminescent element, the photosensitive resin composition of the present invention preferably contains one or more of a specific (F1) compound, a specific (FB-1) compound, and a specific (FB-2) compound, and further contains an (F2) compound. Similarly, from the viewpoint of the present invention, the photosensitive resin composition preferably contains one or more of a specific (F1) compound, a specific (FB-1) compound, and a specific (FB-2) compound, and further contains an (FC-1) compound, and also contains an (F2) compound.

[0426] (F2) The compound has one or more groups selected from the group consisting of (I) an aromatic group having 6 to 15 carbon atoms and valences of 1 to 4, (II) an aryl group having 6 to 15 carbon atoms, (III) a group represented by general formula (18), and (IV) a group represented by general formula (19).

[0427] [Chemical Formula 31]

[0428]

[0429] In general formulas (15) to (17), X 8 ~X 10 Each can be represented independently as an oxygen atom or a sulfur atom. Z 8 ~Z 10 Each can independently represent a direct bond, an aryl group with 6 to 15 carbon atoms, or a group represented by the general formula (18). 11 ~Z 13 Each can independently represent a direct bond, an aryl group with 6 to 15 carbon atoms, or a group represented by general formula (19). Z in general formula (15) 8 In the case of a direct key, the corresponding R 38This represents an aromatic group with 6 to 15 carbon atoms and a valence of 1 to 4. In general formulas (16) and (17), Z... 9 and the corresponding R 39 and Z 10 and the corresponding R 40 Also with Z in general formula (15) 8 and the corresponding R 38 The relationship is the same. Z in general formula (15) 11 In the case of a direct key, the corresponding R 41 This represents an aromatic group with 6 to 15 hydrogen atoms or carbon atoms and a valence of 1 to 4. In general formulas (16) and (17), Z... 12 and the corresponding R 42 and Z 13 and the corresponding R 43 Also with Z in general formula (15) 11 and the corresponding R 41 The relationship is the same. In general formula (15), Z... 8 and Z 11 When at least one of them is an arylene with 6 to 15 carbon atoms, the corresponding R 38 and / or R 41 Each of these groups independently represents a hydrogen atom, a hydroxyl group, or a monovalent organic group having 1 to 15 carbon atoms. In general formulas (16) and (17), Z... 9 and Z 12 and the corresponding R 39 and R 42 and Z 10 and Z 13 and the corresponding R 40 and R 43 Also with Z in general formula (15) 8 and Z 11 and the corresponding R 38 and R 41 The relationship is the same. In general formula (15), Z... 8 In the case of a basis represented by general formula (18), the corresponding R 38 This refers to an aromatic group having 6 to 15 carbon atoms and a valence of 1 to 4, or an aliphatic group having 6 to 15 carbon atoms and a valence of 1 to 4. In general formulas (16) and (17), Z... 9 and the corresponding R 39 and Z 10 and the corresponding R 40 Also with Z in general formula (15) 8 and the corresponding R 38 The relationship is the same. In general formula (15), Z... 11 In the case of a group represented by general formula (19), the corresponding R 41This represents an aromatic group with 6 to 15 carbon atoms and valences of 1 to 4, or an aliphatic group with 6 to 15 carbon atoms and valences of 1 to 4. In general formulas (16) and (17), Z... 12 and the corresponding R 42 and Z 13 and the corresponding R 43 Also with Z in general formula (15) 11 and the corresponding R 41 The relationship is the same. It should be noted that R in general formula (15) 38 and R 41 When at least one of the following is a hydrogen atom, a hydroxyl group, a monovalent aromatic group with 6 to 15 carbon atoms, a monovalent organic group with 1 to 15 carbon atoms, or a monovalent aliphatic group with 6 to 15 carbon atoms, the corresponding c and / or f is 0. In general formulas (16) and (17), R... 39 and R 42 and the corresponding d and g, and R 40 and R 43 And the corresponding e and h are also the same as R in general formula (15). 38 and R 41 The relationship between c and f is the same. R 48 ~R 53 Each of the following groups independently represents a monovalent aliphatic group with 6 to 15 carbon atoms. a and b each independently represent 0 or 1. c, d, e, f, g, and h each independently represent an integer from 0 to 4.

[0430] In general formulas (18) to (19), Y 8 and Y 11 Each can be used independently to represent an alkylene group having 1 to 6 carbon atoms. R 115 ~R 116 Each of the following characters independently represents an alkyl group having 1 to 6 carbon atoms. m and n each independently represent integers from 1 to 15. p and q each independently represent integers from 0 to 4. * 1 This indicates the bonding point with the oxygen atom in general formula (15), the bonding point with the phosphorus atom in general formula (16), or the bonding point with the phosphorus atom in general formula (17). * 2 R represents the general formula (15) 38 The bond point and R in general formula (16) 39 The bond point, or R in general formula (17) 40 The bond point. * 3 This indicates the bonding point with the oxygen atom in general formula (15), the bonding point with the oxygen atom in general formula (16), or the bonding point with the phosphorus atom in general formula (17). * 4 R represents the general formula (15) 41The bond point and R in general formula (16) 42 The bond point, or R in general formula (17) 43 The bonding point.

[0431] In general formulas (15) to (17), R 38 ~R 43 Each of the following is preferably a hydrogen atom, an aryl group having 6 to 15 carbon atoms, an alkoxy group having 1 to 6 carbon atoms, an aryloxy group having 6 to 15 carbon atoms, a haloalkyl group having 1 to 12 carbon atoms, a haloalkyloxy group having 1 to 12 carbon atoms, a haloaryl group having 6 to 15 carbon atoms, a haloaryloxy group having 6 to 15 carbon atoms, an alkoxy polyalkyleneoxy group having 2 to 10 carbon atoms, a hydroxy polyalkyleneoxy group having 2 to 10 carbon atoms, a hydroxyl group, or a phthalimide group; more preferably a hydrogen atom, a haloalkyl group having 1 to 12 carbon atoms, or a haloaryloxy group having 6 to 15 carbon atoms.

[0432] The aromatic group having 6 to 15 carbon atoms is preferably phenylene, biphenylene, naphthylene, phenyl, biphenyl, or naphthyl. The aryl group having 6 to 15 carbon atoms is preferably phenylene, biphenylene, or naphthyl. The aryl group having 6 to 15 carbon atoms is preferably phenyl, biphenyl, or naphthyl.

[0433] Among the compounds (F2), those represented by general formulas (15) to (17) include, for example, phenyl phosphate, biphenyl phosphate, naphthyl phosphate, diphenyl phosphate, bis(biphenyl) phosphate, dinaphthyl phosphate, phenylphosphonic acid, biphenylphosphonic acid, naphthylphosphonic acid, phenylphosphonic acid ester, biphenylphosphonic acid biphenyl ester, naphthylphosphonic acid naphthyl ester, phenylphosphine, biphenylphosphine, naphthylphosphine, diphenylphosphine, bis(biphenyl)phosphine, dinaphthylphosphine, ethylene oxide modified (hereinafter "EO modified") phenyl phosphate (hexyl) ester, EO modified phenyl phosphate (octyl) ester, EO modified phenyl phosphate (nonyl) ester, EO modified phenyl phosphate (decyl) ester, and EO modified phenyl phosphate (dodecyl) ester. EO modified (dihexyl) phenyl phosphate, EO modified (dioctyl) phenyl phosphate, EO modified (dinonyl) phenyl phosphate, EO modified (didecyl) phenyl phosphate, EO modified (docosyl) phenyl phosphate, propylene oxide modified (hereinafter "PO modified") (hexyl) phenyl phosphate, PO modified (octyl) phenyl phosphate, PO modified (decyl) phenyl phosphate, PO modified (dioctyl) phenyl phosphate, PO modified (dinonyl) phenyl phosphate, butane oxide modified (hereinafter "BO modified") (hexyl) phenyl phosphate, BO modified (octyl) phenyl phosphate, BO modified (decyl) phenyl phosphate, BO modified (dioctyl) phenyl phosphate, or BO modified (dinonyl) phenyl phosphate.

[0434] From the viewpoints of suppressing residues after development under high-temperature pre-baking conditions, reducing the voltage driving of luminescence characteristics, and improving the reliability of the light-emitting element, it is preferable to have a group substituted with a fluorine atom as the (F2) compound. As a way for the (F2) compound to have a group substituted with a fluorine atom, in the above general formulas (15) to (17), in Z... 8 ~Z 13 When each bond is a direct bond independently, R is preferred. 38 ~R 43 Each is independently a monovalent aromatic group with 6 to 15 carbon atoms substituted by fluorine atoms. Similarly, in the above general formulas (15) to (17), in Z 8 ~Z 13 In the case of arylene groups having 6 to 15 carbon atoms each independently, R is preferred. 38 ~R 43 Each is independently a haloalkyl group having 1 to 12 carbon atoms substituted with a fluorine atom, or a haloaryloxy group having 6 to 15 carbon atoms substituted with a fluorine atom. Furthermore, similarly, in the above general formulas (15) to (17), in Z... 8 ~Z 10 In the case of groups represented by general formula (18) independently, R is preferred. 38 ~R 40 Each is independently a monovalent aromatic group with 6 to 15 carbon atoms substituted with fluorine atoms, or a monovalent aliphatic group with 6 to 15 carbon atoms substituted with fluorine atoms. Similarly, in the above general formulas (15) to (17), in Z... 11 ~Z 13 When each group is independently represented by a general formula (19), R is preferred. 41 ~R 43 Each is independently a monovalent aromatic group with 6 to 15 carbon atoms substituted with fluorine atoms, or a monovalent aliphatic group with 6 to 15 carbon atoms substituted with fluorine atoms.

[0435] When the total amount of (A) alkali-soluble resin and (B) free radical polymerizable compound is set to 100 parts by mass, from the viewpoints of suppressing residues after development under high-temperature pre-baking conditions, low-voltage driving of luminescent properties, and improving the reliability of the luminescent element, the content of compound (F2) in the photosensitive resin composition of the present invention is preferably 0.05 parts by mass or more, more preferably 0.1 parts by mass or more, further preferably 0.3 parts by mass or more, and particularly preferably 0.5 parts by mass or more. On the other hand, from the viewpoint of suppressing pattern peeling after development, the content of compound (F2) is preferably 2 parts by mass or less, more preferably 1.5 parts by mass or less, further preferably 1.2 parts by mass or less, and particularly preferably 1 part by mass or less.

[0436] <(F3) Compounds having a phosphorus atom and a reactive group, (FB-3) Trimethylammonium acetyl lactone compounds containing a reactive group, and (FT) Ester compounds having a reactive group and an acidic group containing a phosphorus atom>

[0437] The photosensitive resin composition of the present invention preferably contains one or more compounds selected from the group consisting of (F3) compounds having phosphorus atoms and reactive groups (hereinafter "(F3) compounds"), (FB-3) trimethylammonium acetone compounds having reactive groups (hereinafter "(FB-3) compounds"), and (FT) ester compounds having reactive groups and phosphorus-containing acidic groups (hereinafter "(FT) compounds"). As the (F3) compound, it is preferable to contain one or more compounds selected from the group consisting of (F3) compounds represented by general formulas (20) to (22) and their salts. As the (FB-3) compound, it is preferable to contain one or more compounds having anionic structures or ammonium cation structures selected from the above-mentioned phosphorus-containing anionic structures, photoreactive groups, thermally reactive groups, alkenyl groups having 2 to 5 carbon atoms, and alkynyl groups having 2 to 5 carbon atoms. Furthermore, as the (FB-3) compound, it is more preferable to contain one or more compounds selected from the group consisting of compounds represented by general formulas (28) to (30). By containing one or more compounds selected from the group consisting of (F3) compounds, (FB-3) compounds, and (FT) compounds, the effects of suppressing residues after development under high-temperature pre-baking conditions and suppressing pattern peeling after development become significant. From the viewpoint of suppressing pattern peeling after development, it is also preferable that the (F3) compounds, (FB-3) compounds, and (FT) compounds contain two or more compounds represented by (F3) general formulas (20) to (22) and their salts, two or more compounds represented by (FB-3) general formulas (28) to (30), and two or more compounds as (FT) compounds. Furthermore, it is also preferable that the compounds contain two or more compounds selected from the group consisting of (F3) compounds, (FB-3) compounds, and (FT) compounds.

[0438] The photosensitive resin composition of the present invention preferably further comprises one or more compounds selected from the group consisting of (F3) compounds having phosphorus atoms and reactive groups, at least (FB-3) trimethylammonium acetone compounds having reactive groups as the above-mentioned (FB) compounds, and (FT) ester compounds having reactive groups and phosphorus atoms containing acidic groups.

[0439] The (F3) compound comprises one or more structures formed by a salt of an acidic group selected from phosphorus atoms and an acidic group containing phosphorus atoms.

[0440] And, a compound selected from one or more of the group consisting of a light-reactive group, a thermally reactive group, an alkenyl group having 2 to 5 carbon atoms, and an alkynyl group having 2 to 5 carbon atoms;

[0441] The (FB-3) compound comprises one or more compounds having an anionic structure containing phosphorus atoms, an ammonium cation structure, and selected from the group consisting of a photoreactive group, a thermally reactive group, an alkenyl group having 2 to 5 carbon atoms, and an alkynyl group having 2 to 5 carbon atoms.

[0442] The (FT) compound comprises one or more compounds selected from the group consisting of a photoreactive group, a thermally reactive group, an alkenyl group having 2 to 5 carbon atoms, and an alkynyl group having 2 to 5 carbon atoms.

[0443] The quantity of one or more of the following groups in the (FT) compound, selected from light-reactive groups, thermally reactive groups, alkenyl groups with 2 to 5 carbon atoms, and alkynyl groups with 2 to 5 carbon atoms, is designated as (X).

[0444] When the amount of one or more of the following groups selected from the group consisting of 1-2 valent aliphatic groups, 1-2 valent alicyclic groups, 1-2 valent aromatic groups, and oxyalkylene groups bonded with substituents is set as (Y), (X) and (Y) preferably satisfy the general formulas (α) to (γ).

[0445] X + Y = 3(α)

[0446] 1≤X≤3(β)

[0447] 0≤Y≤2(γ)

[0448] From the viewpoints of suppressing residue after development under high-temperature pre-baking conditions, suppressing pattern peeling after development, achieving low-voltage driving of luminescent properties, and improving the reliability of the luminescent element, the photosensitive resin composition of the present invention preferably comprises one or more compounds selected from the group consisting of specific (F1) compounds, specific (FB-1) compounds, and specific (FB-2) compounds, and further comprises one or more compounds selected from the group consisting of (F3) compounds, (FB-3) compounds, and (FT) compounds. Similarly, from the viewpoint of the present invention, the photosensitive resin composition preferably comprises one or more compounds selected from the group consisting of specific (F1) compounds, specific (FB-1) compounds, and specific (FB-2) compounds, and further comprises (FC-1) compounds, and further comprises one or more compounds selected from the group consisting of (F3) compounds, (FB-3) compounds, and (FT) compounds. Furthermore, from the same viewpoint, it is preferred to include one or more compounds selected from the group consisting of a specific (F1) compound, a specific (FB-1) compound, and a specific (FB-2) compound, and further include a (F2) compound, and also include one or more compounds selected from the group consisting of a (F3) compound, a (FB-3) compound, and a (FT) compound.

[0449] (F3) The compound preferably has one or more groups selected from the group consisting of a photoreactive group, a thermally reactive group, an alkenyl group having 2 to 5 carbon atoms, and an alkynyl group having 2 to 5 carbon atoms.

[0450] [Chemical Formula 32]

[0451]

[0452] In general formulas (20) to (22), X 14 ~X 16 Each can be represented independently as an oxygen atom or a sulfur atom. Z 14 ~Z 16 Each can independently represent a direct bond, an alkylene group having 1 to 5 carbon atoms, an aryl group having 6 to 15 carbon atoms, or a group represented by general formula (23). 17 ~Z 19 Each can independently represent a direct bond, an alkylene group having 1 to 5 carbon atoms, an aryl group having 6 to 15 carbon atoms, or a group represented by general formula (24). In general formula (20), Z... 14 In the case of a direct bond, an alkylene group with 1 to 5 carbon atoms, or an aryl group with 6 to 15 carbon atoms, the corresponding R 54 This indicates a photoreactive group, a thermally reactive group, or an alkenyl group having 2 to 5 carbon atoms. In general formulas (21) and (22), Z... 15 and the corresponding R 55 and Z16 and the corresponding R 56 Also with Z in general formula (20) 14 and the corresponding R 54 The relationship is the same. In general formula (20), Z... 17 In the case of a direct bond, an alkylene group with 1 to 5 carbon atoms, or an aryl group with 6 to 15 carbon atoms, the corresponding R 57 This indicates a hydrogen atom, an alkyl group having 1 to 5 carbon atoms, a photoreactive group, a thermally reactive group, or an alkenyl group having 2 to 5 carbon atoms. In general formulas (21) and (22), Z... 18 and the corresponding R 58 And Z 19 and the corresponding R 59 Also with Z in general formula (20) 17 and the corresponding R 57 The relationship is the same. In general formula (20), Z... 14 In the case of a group represented by general formula (23), the corresponding R 54 This indicates a photoreactive group, a thermally reactive group, an alkenyl group with 2 to 5 carbon atoms, an alkylene group with 1 to 5 carbon atoms, or an arylene group with 6 to 15 carbon atoms. In general formulas (21) and (22), Z... 15 and the corresponding R 55 and Z 16 and the corresponding R 56 Also with Z in general formula (20) 14 Z is the group represented by general formula (23) 14 and the corresponding R 54 The relationship is the same. In general formula (20), Z... 17 In the case of a group represented by general formula (24), the corresponding R 57 This represents a hydrogen atom, an alkyl group having 1 to 5 carbon atoms, a photoreactive group, a thermally reactive group, an alkenyl group having 2 to 5 carbon atoms, an alkylene group having 1 to 5 carbon atoms, or an arylene group having 6 to 15 carbon atoms. In general formulas (21) and (22), Z... 18 and the corresponding R 58 and Z 19 and the corresponding R 59 Also, when the group represented by general formula (24) in general formula (20) is Z 17 and the corresponding R 57 The relationship is the same. It should be noted that R in general formula (20) 54 When the group is a photoreactive group, a thermally reactive group, or an alkenyl group with 2 to 5 carbon atoms, the corresponding c is 0. In general formulas (21) and (22), R... 55 and the corresponding d, and R 56And the corresponding e is also the same as R in general formula (20) 54 The relationship with the corresponding c is the same. Furthermore, R in general formula (20) 57 When the group is a hydrogen atom, an alkyl group with 1 to 5 carbon atoms, a photoreactive group, a thermally reactive group, or an alkenyl group with 2 to 5 carbon atoms, the corresponding f is 0. In general formulas (21) and (22), R... 58 and the corresponding g, and R 59 And the corresponding h is also the same as R in general formula (20). 57 The relationship between R and the corresponding f is the same. 64 ~R 69 Each of the following groups independently represents an alkyl group with 1 to 5 carbon atoms, an aryl group with 6 to 15 carbon atoms, a photoreactive group, a thermally reactive group, or an alkenyl group with 2 to 5 carbon atoms. a and b each independently represent 0 or 1. c, d, e, f, g, and h each independently represent an integer from 0 to 4.

[0453] In general formulas (23) to (24), Y 14 and Y 17 Each can be used independently to represent an alkylene group having 1 to 6 carbon atoms. R 117 ~R 118 Each of the following characters independently represents an alkyl group having 1 to 6 carbon atoms. m and n each independently represent integers from 1 to 15. p and q each independently represent integers from 0 to 4. * 1 This indicates the bonding point with the oxygen atom in general formula (20), the bonding point with the phosphorus atom in general formula (21), or the bonding point with the phosphorus atom in general formula (22). * 2 R represents the general formula (20). 54 The bond point and R in general formula (21) 55 The bond point, or R in general formula (22) 56 The bond point. * 3 This indicates the bonding point with the oxygen atom in general formula (20), the bonding point with the oxygen atom in general formula (21), or the bonding point with the phosphorus atom in general formula (22). * 4 R represents the general formula (20). 57 The bond point and R in general formula (21) 58 The bond point, or R in general formula (22) 59 The bonding point.

[0454] The (FB-3) compound has at least (I) a trimethylammonium ethoxylate structure comprising an anionic structure and an ammonium cation structure, including an acidic group from a phosphorus atom. Furthermore, it is preferable to have one or more groups selected from the group consisting of a light-reactive group, a thermally reactive group, an alkenyl group having 2 to 5 carbon atoms, and an alkynyl group having 2 to 5 carbon atoms.

[0455] [Chemical Formula 33]

[0456]

[0457] In general formulas (28) to (30), X 37 ~X 39 Each can be represented independently as an oxygen atom or a sulfur atom. Z 37 ~Z 39 Each can independently represent a direct bond, an alkylene group having 1 to 5 carbon atoms, an arylene group having 6 to 15 carbon atoms, or a group represented by general formula (31). In general formula (28), Z... 37 In the case of a direct bond, an alkylene group with 1 to 5 carbon atoms, or an aryl group with 6 to 15 carbon atoms, the corresponding R 137 This indicates a photoreactive group, a thermally reactive group, or an alkenyl group having 2 to 5 carbon atoms. In general formulas (29) and (30), Z... 38 and the corresponding R 138 and Z 39 and the corresponding R 139 Also with Z in general formula (28) 37 and the corresponding R 137 The relationship is the same. In general formula (28), Z... 37 In the case of a group represented by general formula (31), the corresponding R 137 This indicates a photoreactive group, a thermally reactive group, an alkenyl group with 2 to 5 carbon atoms, an alkylene group with 1 to 5 carbon atoms, or an arylene group with 6 to 15 carbon atoms. In general formulas (29) and (30), Z... 38 and the corresponding R 138 and Z 39 and the corresponding R 139 Also with Z in general formula (28) 37 and the corresponding R 137 The relationship is the same. It should be noted that R in general formula (28) 137 When the group is a photoreactive group, a thermally reactive group, or an alkenyl group with 2 to 5 carbon atoms, the corresponding f is 0. In general formulas (29) and (30), R... 138 and the corresponding g, and R 139 And the corresponding h is also the same as R in general formula (28). 137 The relationship between R and the corresponding f is the same. 147 ~R 149 Each can independently represent an alkyl group with 1 to 5 carbon atoms, an aryl group with 6 to 15 carbon atoms, a photoreactive group, a thermally reactive group, or an alkenyl group with 2 to 5 carbon atoms. 40 ~Z 42Each of these groups independently represents an aliphatic group with 1 to 6 carbon atoms and a valence of 2 to 6. R 140 ~R 142 Each can independently represent an alkyl group, an alkoxy group, a carboxyl group, or a hydroxyl group having 1 to 6 carbon atoms. 151 ~R 159 Each of the following elements independently represents a hydrogen atom or an alkyl group having 1 to 6 carbon atoms. a and b each independently represent 0 or 1. c, d, and e each independently represent an integer from 0 to 4. f, g, and h each independently represent an integer from 0 to 4. x and y each independently represent 0 or 1, where x + y = 1.

[0458] In general formula (31), Y 37 R represents an alkylene group having 1 to 6 carbon atoms. 144 This indicates an alkyl group with 1 to 6 carbon atoms. m represents an integer from 1 to 15. p represents an integer from 0 to 4. * 1 This indicates the bonding point with the oxygen atom in general formula (28), the bonding point with the phosphorus atom or oxygen atom in general formula (29), or the bonding point with the phosphorus atom in general formula (30). * 2 R represents the general formula (28) 137 The bond point and R in general formula (29) 138 The bond point, or R in general formula (30) 139 The bonding point.

[0459] The (FT) compound is preferably composed of one or more groups selected from the group consisting of a photoreactive group, a thermally reactive group, an alkenyl group having 2 to 5 carbon atoms, and an alkynyl group having 2 to 5 carbon atoms; more preferably, it is composed of one or more groups selected from the group consisting of a photoreactive group and an alkenyl group having 2 to 5 carbon atoms. As the (FT) compound, it is preferably composed of two or more substituents bonded to a phosphorus atom and / or bonded to an oxygen atom on the PO bond, wherein the substituents are (I) one or more selected from the group consisting of a photoreactive group, a thermally reactive group, an alkenyl group having 2 to 5 carbon atoms, and an alkynyl group having 2 to 5 carbon atoms, and (II) one or more selected from the group consisting of aliphatic groups (1 to 2 valent), alicyclic groups (1 to 2 valent), aromatic groups (1 to 2 valent), and oxoalkylene groups bonded with substituents.

[0460] The quantity (X) of the (FT) compound comprising one or more groups selected from the group consisting of photoreactive groups, thermally reactive groups, alkenyl groups having 2 to 5 carbon atoms, and alkynyl groups having 2 to 5 carbon atoms, is preferably an integer from 1 to 3, more preferably 2 or 3, and even more preferably 3. Furthermore, the quantity (Y) of the (FT) compound comprising one or more groups selected from the group consisting of 1- to 2-valent aliphatic groups, 1- to 2-valent alicyclic groups, 1- to 2-valent aromatic groups, and oxoalkylene groups bonded with substituents, is preferably an integer from 0 to 2, more preferably 0 or 1.

[0461] As a monovalent or divalent aliphatic group, it is preferred to have 1 to 6 carbon atoms, more preferably 1 to 4 carbon atoms. Furthermore, as an aliphatic group, alkyl or alkylene groups are preferred. As a monovalent or divalent alicyclic group, it is preferred to have 4 to 10 carbon atoms, more preferably 4 to 7 carbon atoms. Furthermore, as an alicyclic group, cycloalkyl or cycloalkylene groups are preferred. As a monovalent or divalent aromatic group, it is preferred to have an aryl group with 6 to 15 carbon atoms, an arylalkyl group with 7 to 25 carbon atoms, an alkylaryl group with 7 to 25 carbon atoms, or an aryene group with 6 to 15 carbon atoms, more preferably an aryl group with 6 to 10 carbon atoms, an arylalkyl group with 7 to 15 carbon atoms, an alkylaryl group with 7 to 15 carbon atoms, or an aryene group with 6 to 10 carbon atoms. In the oxyalkylene group with a substituent, the substituent is preferably hydrogen, or a hydroxyl group, or one of the above-mentioned alkyl, arylalkyl, alkylaryl, aryl, or cycloalkyl groups. Among the oxoalkylene groups bonded with substituents, oxoalkylene groups with 1 to 6 carbon atoms are preferred, and oxoalkylene groups with 1 to 4 carbon atoms are more preferred.

[0462] Furthermore, as an (FT) compound, it is also preferred to include one or more of the following groups: having a photoreactive group, a thermally reactive group, an alkenyl group having 2 to 5 carbon atoms, and an alkynyl group having 2 to 5 carbon atoms, and having one or more of the following groups: phosphotriester compounds, phosphite triester compounds, phosphonate diester compounds, hypophosphite diester compounds, and hypophosphite monoester compounds.

[0463] As the aforementioned photoreactive group, (meth)acrylate, styrene, cinnamyl, or maleimide are preferred, and (meth)acrylate is more preferred. As the aforementioned thermally reactive group, epoxy, oxetyl, carboxyl, amino, or mercapto are preferred, and epoxy is more preferred. As the aforementioned alkenyl or alkynyl group having 2 to 5 carbon atoms, vinyl, allyl, 2-methyl-2-propenyl, 2-butenyl, 2-methyl-2-butenyl, 3-methyl-2-butenyl, ethynyl, or 2-propynyl are preferred, vinyl or allyl are more preferred, and vinyl is even more preferred.

[0464] Among the compounds (F3), those represented by general formulas (20) to (22) include, for example, vinyl phosphate, allyl phosphate, 3-methyl-2-butenyl phosphate, (meth)acrylate phosphate, styrene phosphate, cinnamic acid, divinyl phosphate, vinylphosphonic acid, allylphosphonic acid, (3-methyl-2-butenyl)phosphonic acid, (meth)acrylate phosphonic acid, styrylphosphonic acid, cinnamylphosphonic acid, vinylphosphonate vinyl ester, vinyl hypophosphite, allyl hypophosphite, (3-methyl-2-butenyl)hypophosphite, (meth)acrylate hypophosphite, styryl hypophosphite, cinnamic hypophosphite, divinyl hypophosphite, EO-modified phosphoric acid ( Methacrylate, EO-modified vinyl phosphate, EO-modified allyl phosphate, EO-modified di[(meth)acrylate] phosphate, EO-modified divinyl phosphate, EO-modified diallyl phosphate, PO-modified methacrylate phosphate, PO-modified vinyl phosphate, PO-modified allyl phosphate, PO-modified di[(meth)acrylate] phosphate, PO-modified divinyl phosphate, PO-modified diallyl phosphate, BO-modified methacrylate phosphate, BO-modified vinyl phosphate, BO-modified allyl phosphate, BO-modified di[(meth)acrylate] phosphate, BO-modified divinyl phosphate, or BO-modified diallyl phosphate.

[0465] Examples of (FT) compounds include tri(meth)acrylate phosphate, triethylene phosphate, triallyl phosphate, di(meth)acrylate ethyl phosphate, divinyl phosphate ethyl phosphate, diallyl phosphate ethyl phosphate, vinyl phosphate diethyl ester, tri(meth)acrylate phosphonate, triethylene phosphonate, triallyl phosphonate, diethyl phosphonate, di(meth)acrylate phosphonate di(meth)acrylate, divinyl phosphonate divinyl ester, allyl phosphonate diallyl ester, diethyl phosphonate di(meth)acrylate, dimethyl vinylphosphonate, diethyl vinylphosphonate, diphenyl vinylphosphonate, and allyl phosphonate diethyl ester. Diethyl phosphonate, vinyl divinyl hypophosphite, (meth)acrylate diethyl hypophosphite, vinyl diethyl hypophosphite, allyl diethyl hypophosphite, divinyl vinyl hypophosphite, (meth)acrylate-ethyl ethyl hypophosphite, vinyl ethyl ethyl hypophosphite, vinyl phenyl phosphite ethyl ester, allyl ethyl ethyl hypophosphite, EO-modified tri(meth)acrylate, EO-modified triethylene phosphate, EO-modified triallyl phosphate, EO-modified di(meth)acrylate-ethyl phosphate, PO-modified tri(meth)acrylate, or BO-modified tri(meth)acrylate.

[0466] As a (F3) compound, from the viewpoint of suppressing residue after development under high-temperature pre-baking conditions and suppressing pattern peeling after development, it is particularly preferred to include one or more compounds selected from the group consisting of compounds represented by general formula (21b) and their salts. In general formula (21b), from the viewpoint of suppressing pattern peeling after development, R... 55 R 58 R 65 and R 68 The group consisting of one or more groups is preferably a photoreactive group or an alkenyl group having 2 to 5 carbon atoms. As a (F3) compound, from the viewpoint of suppressing pattern stripping after development, it is also preferred to contain one or more compounds selected from the group consisting of compounds represented by general formula (21b) and their salts, and more preferably compounds containing one or more compounds represented by general formulas (20) to (22) and their salts.

[0467] As a (FB-3) compound, from the viewpoint of suppressing residue after development under high-temperature pre-baking conditions and suppressing pattern peeling after development, a compound comprising the general formula (28b) is particularly preferred. In general formula (28b), from the viewpoint of suppressing pattern peeling after development, a compound selected from R is preferred. 137 and R 147 One or more of the groups in the group are photoreactive groups or alkenyl groups having 2 to 5 carbon atoms. As a (FB-3) compound, from the viewpoint of suppressing pattern stripping after development, it is also preferable to include a compound represented by general formula (28b), and further to include one or more compounds represented by general formulas (28) to (30).

[0468] The photoreactive group described above is preferably (meth)acrylate. The alkenyl group having 2 to 5 carbon atoms is preferably vinyl or aryl, and more preferably vinyl.

[0469] From the viewpoints of suppressing residues after development under high-temperature pre-baking conditions, suppressing pattern peeling after development, low-voltage driving of luminescent properties, and improving the reliability of luminescent elements, the photosensitive resin composition of the present invention particularly preferably comprises one or more compounds selected from the group consisting of a specific (F1) compound, a specific (FB-1) compound, and a specific (FB-2) compound, and further comprises one or more compounds selected from the group consisting of a compound represented by general formula (21b) and its salt as a (F3) compound, and / or a compound represented by general formula (28b) as a (FB-3) compound.

[0470] [Chemical Formula 34]

[0471]

[0472] In general formula (21b), Z 15 This indicates a direct bond, an alkylene group having 1 to 5 carbon atoms, an aryl group having 6 to 15 carbon atoms, or a group represented by general formula (23). 18 This indicates a direct bond, an alkylene group having 1 to 5 carbon atoms, an arylene group having 6 to 15 carbon atoms, or a group represented by general formula (24). In general formula (21b), Z... 15 In the case of a direct bond, an alkylene group with 1 to 5 carbon atoms, or an aryl group with 6 to 15 carbon atoms, the corresponding R 55 This indicates a photoreactive group, a thermally reactive group, or an alkenyl group having 2 to 5 carbon atoms. In general formula (21b), Z... 18 In the case of a direct bond, an alkylene group with 1 to 5 carbon atoms, or an aryl group with 6 to 15 carbon atoms, the corresponding R 58 This represents a hydrogen atom, an alkyl group having 1 to 5 carbon atoms, a photoreactive group, a thermally reactive group, or an alkenyl group having 2 to 5 carbon atoms. Z in general formula (21b) 15 In the case of a group represented by general formula (23), the corresponding R 55 This indicates a photoreactive group, a thermally reactive group, an alkenyl group with 2 to 5 carbon atoms, an alkylene group with 1 to 5 carbon atoms, or an aryl group with 6 to 15 carbon atoms. In general formula (21b), Z... 18 In the case of a group represented by general formula (24), the corresponding R 58 This represents a hydrogen atom, an alkyl group with 1 to 5 carbon atoms, a photoreactive group, a thermally reactive group, an alkenyl group with 2 to 5 carbon atoms, an alkylene group with 1 to 5 carbon atoms, or an arylene group with 6 to 15 carbon atoms. It should be noted that R in general formula (21b) 55 In the case of a photoreactive group, a thermally reactive group, or an alkenyl group having 2 to 5 carbon atoms, the corresponding d is 0. Furthermore, in general formula (21b), R... 58 When the group is a hydrogen atom, an alkyl group with 1 to 5 carbon atoms, a photoreactive group, a thermally reactive group, or an alkenyl group with 2 to 5 carbon atoms, the corresponding g is 0. 65 Represents a photoreactive group, a thermally reactive group, or an alkenyl group with 2 to 5 carbon atoms. R 68 It represents an alkyl group with 1 to 5 carbon atoms, an aryl group with 6 to 15 carbon atoms, a photoreactive group, a thermally reactive group, or an alkenyl group with 2 to 5 carbon atoms. d and g each independently represent integers from 0 to 4.

[0473] In general formulas (23) to (24), Y 14 and Y 17 Each can be used independently to represent an alkylene group having 1 to 6 carbon atoms. R 117 ~R118 Each of the following characters independently represents an alkyl group with 1 to 6 carbon atoms. m and n each independently represent integers from 1 to 15. p and q each independently represent integers from 0 to 4. * 1 This indicates the bonding site with the phosphorus atom in general formula (21b). * 2 R in general formula (21b) 55 The bond point. * 3 This indicates the bonding site with the oxygen atom in general formula (21b). * 4 R in general formula (21b) 58 The bonding point.

[0474] [Chemical Formula 35]

[0475]

[0476] In general formula (28b), Z 37 This indicates a direct bond, an alkylene group having 1 to 5 carbon atoms, an arylene group having 6 to 15 carbon atoms, or a group represented by general formula (31). In general formula (28b), Z... 37 In the case of a direct bond, an alkylene group with 1 to 5 carbon atoms, or an aryl group with 6 to 15 carbon atoms, the corresponding R 137 This indicates a photoreactive group, a thermally reactive group, or an alkenyl group having 2 to 5 carbon atoms. In general formula (28b), Z... 37 In the case of a group represented by general formula (31), the corresponding R 137 This indicates a photoreactive group, a thermally reactive group, an alkenyl group with 2 to 5 carbon atoms, an alkylene group with 1 to 5 carbon atoms, or an aryl group with 6 to 15 carbon atoms. It should be noted that R in general formula (28b) 137 When the group is a photoreactive group, a thermally reactive group, or an alkenyl group with 2 to 5 carbon atoms, the corresponding f is 0. 147 This indicates an alkyl group having 1 to 5 carbon atoms, an aryl group having 6 to 15 carbon atoms, a photoreactive group, a thermally reactive group, or an alkenyl group having 2 to 5 carbon atoms. 40 Represents an aliphatic group with 1 to 6 carbon atoms and a valence of 2 to 6. R 140 R represents an alkyl group, an alkoxy group, a carboxyl group, or a hydroxyl group with 1 to 6 carbon atoms. 151 ~R 153 Each can independently represent a hydrogen atom or an alkyl group having 1 to 6 carbon atoms. c represents an integer from 0 to 4. f represents an integer from 0 to 4.

[0477] In general formula (31), Y 37 R represents an alkylene group having 1 to 6 carbon atoms. 144This indicates an alkyl group with 1 to 6 carbon atoms. m represents an integer from 1 to 15. p represents an integer from 0 to 4. * 1 This indicates the bonding site with the oxygen atom in general formula (28b). * 2 R in general formula (28b) 137 The bonding point.

[0478] As (F3) compounds, from the viewpoints of suppressing residues after development under high-temperature pre-baking conditions, suppressing pattern peeling after development, low-voltage driving of light-emitting properties, and improving the reliability of light-emitting elements, it is also preferred to have (I) a straight-chain structure and / or a branched structure of a monovalent aliphatic group having 1 to 5 carbon atoms, selected from the group consisting of alkyl, alkenyl, and alkynyl groups, and (II) a photoreactive group or an alkenyl group having 2 to 5 carbon atoms (hereinafter referred to as "specific (F3) compounds"). Examples of specific (F3) compounds include butyl phosphate·vinyl ester, butyl phosphate·allyl ester, butyl phosphate·styrene ester, butylphosphonate vinyl ester, butylphosphonate allyl ester, butylphosphonate styrene ester, vinylphosphonate butyl ester, allylphosphonate butyl ester, styrenephosphonate butyl ester, butyl vinyl hypophosphite, butyl allyl hypophosphite, butyl styrene hypophosphite, EO-modified butyl phosphate·(meth)acrylate, EO-modified butyl phosphate·vinyl ester, EO-modified butyl phosphate·allyl ester, PO-modified butyl phosphate·(meth)acrylate, PO-modified butyl phosphate·vinyl ester, PO-modified butyl phosphate·allyl ester, BO-modified butyl phosphate·(meth)acrylate, BO-modified butyl phosphate·vinyl ester, or BO-modified butyl phosphate·allyl ester.

[0479] Apart from the solvent, from the viewpoint of suppressing residues after development under high-temperature pre-baking conditions and suppressing pattern peeling after development, the total content of (F3) compound, (FB-3) compound, and (FT) compound in all solid components of the photosensitive resin composition of the present invention is preferably 0.003% by mass or more, more preferably 0.01% by mass or more, further preferably 0.02% by mass or more, even more preferably 0.04% by mass or more, and particularly preferably 0.08% by mass or more. On the other hand, from the viewpoint of suppressing residues after development under high-temperature pre-baking conditions, the total content of (F3) compound, (FB-3) compound, and (FT) compound is preferably 2.1% by mass or less, more preferably 1.7% by mass or less, further preferably 1.3% by mass or less, even more preferably 1.0% by mass or less, and particularly preferably 0.7% by mass or less.

[0480] When the photosensitive resin composition of the present invention contains (A) an alkali-soluble resin and (B) a free radical polymerizable compound, and the total amount of (A) an alkali-soluble resin and (B) a free radical polymerizable compound is set to 100 parts by mass, from the viewpoint of suppressing residues after development under high-temperature pre-baking conditions and suppressing pattern peeling after development, the total content of (F3) compound, (FB-3) compound, and (FT) compound in the photosensitive resin composition of the present invention is preferably 0.01 parts by mass or more, more preferably 0.03 parts by mass or more, further preferably 0.05 parts by mass or more, even more preferably 0.1 parts by mass or more, and particularly preferably 0.3 parts by mass or more. On the other hand, from the viewpoint of suppressing residues after development under high-temperature pre-baking conditions, the total content of (F3) compound, (FB-3) compound, and (FT) compound is preferably 2.5 parts by mass or less, more preferably 2 parts by mass or less, further preferably 1.5 parts by mass or less, even more preferably 1 part by mass or less, and particularly preferably 0.5 parts by mass or less.

[0481] <(FB-4) Trimethylammonium Acetylene Lactone Resin>

[0482] The photosensitive resin composition of the present invention preferably contains a (FB-4) trimethylammonium acetylide type resin (hereinafter referred to as "(FB-4) compound"). As the (FB-4) compound, it is preferable to contain a resin having a structural unit comprising an anionic structure containing phosphorus atoms and an ammonium cation structure as described above. Furthermore, as the (FB-4) compound, it is more preferable to contain one or more resins selected from the group consisting of resins having structural units represented by any one of the general formulas (28p) to (30p). By containing the (FB-4) compound, the effects of suppressing residue after development under high-temperature pre-baking conditions and suppressing pattern peeling after development become significant. From the viewpoint of suppressing residue after development under high-temperature pre-baking conditions, it is also preferable to contain two or more resins having structural units represented by any one of the general formulas (FB-4) (28p) to (30p).

[0483] From the viewpoints of suppressing residue after development under high-temperature pre-baking conditions, suppressing pattern peeling after development, achieving low-voltage driving of luminescent properties, and improving the reliability of the luminescent element, the photosensitive resin composition of the present invention preferably contains one or more compounds selected from the group consisting of a specific (F1) compound, a specific (FB-1) compound, and a specific (FB-2) compound, and further contains a (FB-4) compound. Similarly, from the same viewpoint, the photosensitive resin composition of the present invention preferably contains one or more compounds selected from the group consisting of a specific (F1) compound, a specific (FB-1) compound, and a specific (FB-2) compound, and further contains a (FC-1) compound, and also contains a (FB-4) compound. Furthermore, from the same viewpoint, it is also preferable to contain one or more compounds selected from the group consisting of a specific (F1) compound, a specific (FB-1) compound, and a specific (FB-2) compound, and further contains a (F2) compound, and also contains a (FB-4) compound.

[0484] (FB-4) compounds contain at least one structural unit in the molecule that has a trimethylammonium acetyl lactone structure having (I) an anionic structure comprising an acidic group from a phosphorus atom and an ammonium cation structure.

[0485] [Chemical Formula 36]

[0486]

[0487] In general formulas (28p) to (30p), X 37 ~X 39 Each can be represented independently as an oxygen atom or a sulfur atom. Z 37 ~Z 39 Each can independently represent a direct bond, an alkylene group having 1 to 5 carbon atoms, an arylene group having 6 to 15 carbon atoms, or a group represented by general formula (31). In general formula (28p), Z... 37 In the case of a direct bond, an alkylene group with 1 to 5 carbon atoms, or an aryl group with 6 to 15 carbon atoms, the corresponding R 137 Indicates a direct bond. In general formulas (29p) and (30p), Z... 38 and the corresponding R 138 and Z 39 and the corresponding R 139 Also related to Z in general formula (28p) 37 and the corresponding R 137 The relationship is the same. In the general formula (28p), Z... 37 In the case of a group represented by general formula (31), the corresponding R 137 This indicates an alkylene group having 1 to 5 carbon atoms, or an aryl group having 6 to 15 carbon atoms. In general formulas (29p) and (30p), Z... 38and the corresponding R 138 and Z 39 and the corresponding R 139 Also related to Z in general formula (28p) 37 and the corresponding R 137 The relationship is the same. Z 40 ~Z 42 Each of these groups independently represents an aliphatic group with 1 to 6 carbon atoms and a valence of 2 to 6. R 140 ~R 142 Each can independently represent an alkyl group, an alkoxy group, a carboxyl group, or a hydroxyl group having 1 to 6 carbon atoms. 151 ~R 159 Each can independently represent a hydrogen atom or an alkyl group having 1 to 6 carbon atoms. R 347 ~R 355 Each of the following characters independently represents a hydrogen atom or an alkyl group having 1 to 6 carbon atoms. a and b each independently represent 0 or 1. c, d, and e each independently represent an integer from 0 to 4. i, j, and k each independently represent 0 or 1. x and y each independently represent 0 or 1, where x + y = 1.

[0488] In general formula (31), Y 37 R represents an alkylene group having 1 to 6 carbon atoms. 144 This indicates an alkyl group with 1 to 6 carbon atoms. m represents an integer from 1 to 15. p represents an integer from 0 to 4. * 1 This indicates the bonding site with the oxygen atom in the general formula (28p), the bonding site with the phosphorus atom or oxygen atom in the general formula (29p), or the bonding site with the phosphorus atom in the general formula (30p). * 2 R represents the general formula (28p). 137 The bond point, and R in general formula (29p) 138 The bond point, or R in the general formula (30p) 139 The bonding point.

[0489] When the photosensitive resin composition of the present invention contains (A) an alkali-soluble resin and (B) a free radical polymerizable compound, and the total amount of (A) an alkali-soluble resin and (B) a free radical polymerizable compound is set to 100 parts by mass, from the viewpoints of suppressing residue after development under high-temperature pre-baking conditions, low-voltage driving of luminescent properties, and improving the reliability of the luminescent element, the content of (FB-4) in the photosensitive resin composition of the present invention is preferably 0.01 parts by mass or more, more preferably...

Claims

1. A display device having at least a substrate, a first electrode, a second electrode, and a pixel segmentation layer, and further having an organic EL layer containing a light-emitting layer, wherein, The pixel segmentation layer is formed in a manner that overlaps with a portion of the first electrode. The organic EL layer containing the light-emitting layer is formed on the first electrode and between the first electrode and the second electrode. The outermost layer on the light-emitting layer side of the first electrode has a transparent conductive oxide film layer containing at least indium. In the region where an organic EL layer containing a light-emitting layer is formed on the transparent conductive oxide film, indium oxide ions (InO2) will be present in the depth profile along the depth direction from the light-emitting layer side to the first electrode side, as measured by time-of-flight secondary ion mass spectrometry under the following measurement conditions. - The detection intensity of points exceeding 100 is set on the surface of the transparent conductive oxide film layer, and... Under the following measurement conditions, the point representing 30 cycles in the depth profile along the depth direction from the luminescent layer side to the first electrode side, measured by time-of-flight secondary ion mass spectrometry, is defined as a position with a depth of 3 nm from the surface of the transparent conductive oxide film layer on the side in contact with the luminescent layer. Phosphorus ions (P) at a depth of 3 nm from the surface of the transparent conductive oxide film layer on the side in contact with the luminescent layer, measured using time-of-flight secondary ion mass spectrometry. - The detection intensity is set to (P). Dep / Anode ) counts, indium oxide ions (InO2) - The detection intensity is set to (InO) Dep / Anode When counting, (P) Dep / Anode ) and (InO Dep / Anode It satisfies general formulas (PA-1), (PA-2), and (PA-3). 4≤(P Dep / Anode )≤100 (PA-1) 0.004≤(P Dep / Anode ) / (InO Dep / Anode )≤0.1 (PA-2) 1,000≤(InO Dep / Anode )≤10,000 (PA-3) [Measurement Conditions] ION-TOF Time-of-Flight Secondary Ion Mass Spectrometer (TOF.SIMS5) Etching ion species: Cs ＋ Etching ion acceleration energy: 0.25keV Etched area: 150μm□ Measurement area: 30μm□ Primary ionic species: Bi ＋ Primary ion energy: 25keV Secondary ion polarity: negative Mass decomposition energy: High Electrical compensation: electron gun.

2. A display device comprising at least a substrate, a first electrode, a second electrode, and a pixel segmentation layer, and further comprising a light extraction layer containing a light-emitting layer, or an organic EL layer containing a light-emitting layer and a light extraction layer containing a light-emitting layer, wherein, The pixel segmentation layer is formed in a manner that overlaps with a portion of the first electrode. The outermost layer on the light-emitting layer side of the first electrode has a transparent conductive oxide film layer containing at least indium. The light extraction layer containing the light-emitting layer, or the organic EL layer containing the light-emitting layer and the light extraction layer containing the light-emitting layer, are formed on the first electrode and between the first electrode and the second electrode. In the region where a light extraction layer containing a light-emitting layer is formed on the first electrode, or where an organic EL layer containing a light-emitting layer is formed on the first electrode and a light extraction layer containing a light-emitting layer is formed on the first electrode, indium oxide ions (InO2) will be present in the depth profile along the depth direction from the light-emitting layer side to the first electrode side, as measured by time-of-flight secondary ion mass spectrometry under the following measurement conditions. - The detection intensity of points exceeding 100 is set on the surface of the transparent conductive oxide film layer, and... Under the following measurement conditions, the point representing 30 cycles in the depth profile along the depth direction from the luminescent layer side to the first electrode side, measured by time-of-flight secondary ion mass spectrometry, is defined as a position with a depth of 3 nm from the surface of the transparent conductive oxide film layer on the side in contact with the luminescent layer. Phosphorus ions (P) at a depth of 3 nm from the surface of the transparent conductive oxide film layer on the side in contact with the luminescent layer, measured using time-of-flight secondary ion mass spectrometry. - The detection intensity is set to (P). Dep / Anode ) counts, indium oxide ions (InO2) - The detection intensity is set to (InO) Dep / Anode When counting, (P) Dep / Anode ) and (InO Dep / Anode It satisfies general formulas (PA-1), (PA-2), and (PA-3). 4≤(P Dep / Anode )≤100 (PA-1) 0.004≤(P Dep / Anode ) / (InO Dep / Anode )≤0.1 (PA-2) 1,000≤(InO Dep / Anode )≤10,000 (PA-3) [Measurement Conditions] ION-TOF Time-of-Flight Secondary Ion Mass Spectrometer (TOF.SIMS5) Etching ion species: Cs ＋ Etching ion acceleration energy: 0.25keV Etched area: 150μm□ Measurement area: 30μm□ Primary ionic species: Bi ＋ Primary ion energy: 25keV Secondary ion polarity: negative Mass decomposition energy: High Electrical compensation: electron gun.

3. The display device as claimed in claim 1 or 2, wherein, The pixel segmentation layer contains one or more of the following structures: phosphonic acid structure, phosphonic acid monoester structure, phosphonic acid diester structure, phosphite monoester structure, phosphite diester structure, or phosphite triester structure.

4. The display device as claimed in claim 1 or 2, wherein, Carbon ions (C2) at a depth of 3 nm from the surface of the transparent conductive oxide film layer on the side in contact with the light-emitting organic EL layer, measured by time-of-flight secondary ion mass spectrometry. - The detection intensity is set to (C). Dep / Anode When counting, (C Dep / Anode ) satisfies the general formula (CA-1). 20≤(C Dep / Anode )≤4,000 (CA-1).

5. The display device as claimed in claim 1 or 2, wherein, The cyanide ions (CN) at a depth of 3 nm from the surface of the transparent conductive oxide film layer on the side in contact with the light-emitting organic EL layer in the region where the transparent conductive oxide film layer containing the light-emitting layer is formed, as measured by time-of-flight secondary ion mass spectrometry. - The detection intensity is set to (CN). Dep / Anode When counting, (CN) Dep / Anode It satisfies the general formula (CNA-1). 20≤(CN Dep / Anode )≤4,000 (CNA-1).

6. The display device as claimed in claim 1 or 2, wherein, In the region on the pixel segmentation layer that does not overlap with the region where the organic EL layer containing the light-emitting layer is formed, the sum of the negative ion detection intensities measured by time-of-flight secondary ion mass spectrometry on the surface that is in contact with the second electrode or the surface exposed in the opening of the second electrode is phosphorus oxide (PO3) ions. - The proportion of the detection intensity of ) is set as (P) PDL ), In the region where an organic EL layer containing a light-emitting layer is formed on the transparent conductive oxide film layer, the sum of the negative ion detection intensities on the surface of the transparent conductive oxide film layer on the side in contact with the light-emitting layer, measured using time-of-flight secondary ion mass spectrometry, is measured for phosphorus oxide ions (PO3). - The proportion of the detection intensity of ) is set as (P) Anode )hour, (P) Anode ) and (P PDL ) satisfies the general formula (PD-1). 30≤(P Anode ) / (P PDL )≤5,000 (PD-1)。 7. The display device as claimed in claim 6, wherein, The (P) Anode ) and the aforementioned (P PDL It also satisfies general formulas (PD-2) and (PD-3). 0.003≤(P Anode )≤0.5 (PD-2) 0.0001≤(P PDL )≤0.01 (PD-3)。 8. The display device as claimed in claim 1 or 2, wherein, The pixel segmentation layer contains one or more resins selected from the group consisting of a resin having a structure represented by general formula (1), a resin having a structure represented by general formula (3), a resin having a structure represented by general formula (2), a resin having a structure represented by general formula (4), a resin having a structure represented by general formula (7), and a resin having a structure represented by general formula (8). In general formula (1), R 1 R represents a 4- to 10-valent organic group. 2 Represents a divalent to a decavalent organic group; R 3 and R 4 Each group independently represents a phenolic hydroxyl group, a sulfonic acid group, a mercapto group, or a substituent represented by general formula (5) or general formula (6); p represents an integer from 0 to 6, and q represents an integer from 0 to 8; wherein, R 3 or R 4 When representing a phenolic hydroxyl group, the R bonded to the phenolic hydroxyl group... 1 or R 2 Indicates aromatic structure, In general formulas (5) and (6), R 19 ~R 21 Each can independently represent a hydrogen atom, an alkyl group with 1 to 10 carbon atoms, an acyl group with 2 to 6 carbon atoms, or an aryl group with 6 to 15 carbon atoms. In general formula (3), R 9 R represents a 4- to 10-valent organic group. 10 Represents a divalent to a decavalent organic group; R 11 R represents the substituent represented by the above general formula (5) or general formula (6). 12 R represents a phenolic hydroxyl group, a sulfonic acid group, or a mercapto group. 13 R represents a phenolic hydroxyl group, a sulfonic acid group, a mercapto group, or a substituent represented by the above general formula (5) or general formula (6); t represents an integer from 2 to 8, u represents an integer from 0 to 6, v represents an integer from 0 to 8, and 2 ≤ t + u ≤ 8; where R 12 or R 13 When representing a phenolic hydroxyl group, the R bonded to the phenolic hydroxyl group... 9 or R 10 Indicates aromatic structure, In general formula (2), R 5 Represents 2- to 10-valent organic groups, R 6 R represents a 4- to 10-valent organic group with an aromatic structure. 7 Represents a phenolic hydroxyl group, a sulfonic acid group, a mercapto group, or a substituent represented by the above general formula (5) or general formula (6); R 8 The group represents a phenolic hydroxyl group, a sulfonic acid group, a mercapto group, or a substituent represented by the above general formula (5) or general formula (6); r represents an integer from 0 to 8, and s represents an integer from 0 to 6; wherein, R 7 When representing a phenolic hydroxyl group, the R bonded to the phenolic hydroxyl group... 5 Indicates aromatic structure, In general formula (4), R 14 R represents a divalent to a decavalent organic group. 15 R represents a 4- to 10-valent organic group with an aromatic structure. 16 R represents a phenolic hydroxyl group, a sulfonic acid group, a mercapto group, or a substituent represented by the above general formula (5) or general formula (6). 17 R represents a phenolic hydroxyl group. 18 R represents a sulfonic acid group, a mercapto group, or a substituent represented by the above general formula (5) or general formula (6); w represents an integer from 0 to 8, x represents an integer from 2 to 8, y represents an integer from 0 to 6, and 2 ≤ x + y ≤ 8; where R 16 When representing a phenolic hydroxyl group, the R bonded to the phenolic hydroxyl group... 14 Indicates aromatic structure, In general formulas (7) and (8), R 22 It represents a hydrogen atom, alkyl, cycloalkyl, alkenyl, or aryl.

9. The display device as claimed in claim 1 or 2, wherein, The pixel segmentation layer contains (D1a) black pigment.

10. The display device as claimed in claim 9, wherein, The pixel segmentation layer contains one or more of the following as a (D1a) black pigment: a compound represented by general formula (63) or general formula (64), their geometric isomers, their salts, and salts of their geometric isomers. In general formulas (63) and (64), R 206 R 207 R 214 and R 215 Each independently represents a hydrogen atom, a halogen atom, an alkyl group having 1 to 10 carbon atoms, or an alkyl group having 1 to 20 fluorine atoms and having 1 to 10 carbon atoms; R 208 R 209 R 216 and R 217 Each independently represents a hydrogen atom, a halogen atom, and R. 212 COOH, COOR 212 COO - CONH2, CONHR 212 CONR 212 R 213 CN, OH, OR 212 OCOR 212 OCONH2, OCONHR 212 OCONR 212 R 213 NO2, NH2, NHR 212 NR 212 R 213 , NHCOR 212 NR 212 COR 213 N=CH2, N=CHR 212 N = CR 212 R 213 SH, SR 212 SOR 212 SO2R 212 SO3R 212 SO3H, SO3 - SO2NH2, SO2NHR 212 or SO2NR 212 R 213 R 212 and R 213 Each of the following can independently represent an alkyl group having 1 to 10 carbon atoms, a cycloalkyl group having 4 to 10 carbon atoms, an alkenyl group having 2 to 10 carbon atoms, a cycloalkenyl group having 4 to 10 carbon atoms, or an alkynyl group having 2 to 10 carbon atoms; multiple R 208 R 209 R 216 、or R 217 It can be connected via direct bonds, or oxygen bridges, sulfur bridges, NH bridges, or NR bridges. 212 Bridges form a ring; R 210 R 211 R 218 and R 219 Each of the following can be independently represented as a hydrogen atom, an alkyl group having 1 to 10 carbon atoms, or an aryl group having 6 to 15 carbon atoms; a, b, c, and d can each be independently represented as an integer from 0 to 4.

11. The display device as claimed in claim 10, wherein, The pixel segmentation layer is black, and when the film thickness of the pixel segmentation layer is 1 μm, the optical density in the visible light region is 1.0–5.

0. The substrate is a flexible substrate, and the display device has a structure in which the pixel segmentation layer is stacked on the flexible substrate, but does not have a polarizing film.

12. The display device as claimed in claim 10, wherein, The arithmetic mean roughness of the surface of the pixel segmentation layer is 0.1 to 10.0 nm.

13. The display device as claimed in claim 1 or 2, wherein, The first electrode has a multilayer structure comprising at least the transparent conductive oxide film layer and the non-transparent conductive metal layer. The outermost layer on the light-emitting layer side of the first electrode has an amorphous conductive oxide film layer containing at least indium. The non-transparent conductive metal layer has an alloy layer containing at least silver. The display device is a top-emitting type.

14. The display device as claimed in claim 13, wherein, The silver-containing alloy layer in the non-transparent conductive metal layer further comprises one or more elements selected from the group consisting of indium, tin, sodium, potassium, magnesium, calcium, aluminum, and silicon.

15. The display device as claimed in claim 1 or 2, further comprising a color filter containing sub-dots.

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