Piezoelectric valve for spraying a wide range of viscosity glues

Abstract

The present application relates to a piezoelectric valve capable of jetting glue with a wide range of viscosity, comprising a glue injection module, the glue injection module comprising a piezoelectric driving mechanism and a glue injection mechanism, the piezoelectric driving mechanism being connected with the glue injection mechanism through a lever; the glue injection mechanism further comprising an upper striker, a large spring sleeved on the upper part of the upper striker, a striker arranged on the lower part of the upper striker and a nozzle arranged on the lower part of the striker; when the piezoelectric driving mechanism is powered on, the piezoelectric driving mechanism is adapted to push the upper striker through the lever and compress the large spring, the large spring is adapted to push the upper striker when the piezoelectric driving mechanism is powered off, and the striker is driven to hit the nozzle, so that the glue at the nozzle is extruded at high pressure. The present application can cope with glue with different viscosity by adjusting the compression amount of the large spring, and can meet the glue dispensing demand of different point diameters, so as to realize the effect of jetting glue with a wide range of viscosity and jetting glue with different point diameters.

Description

Technical Field

[0001] This invention relates to the field of piezoelectric injection valve technology, and in particular to a piezoelectric valve capable of injecting adhesives with a wide range of viscosities. Background Technology

[0002] Piezoelectric jet valve technology is an emerging valve body technology. When applied to dispensing equipment, it has the advantages of good stability and consistency, with minimal dispensing error, effectively avoiding various problems caused by manual dispensing.

[0003] Currently, commonly used piezoelectric jet valves mainly include jet valves, spiral valves, diaphragm valves, screw valves, and precision dispensing valves. Different types of dispensing equipment have different requirements for the adhesive, and the size of the sprayed adhesive dots also varies. For example, jet dispensing valves can be selected for high precision; two-component adhesives can be selected for two-component dispensing valves; and silicone dispensing valves are used for high-viscosity adhesives. However, for enterprise users, purchasing a large number of different models of dispensing equipment is not only costly and difficult to manage and maintain, but also seriously affects production efficiency, keeping product costs high. Summary of the Invention

[0004] Therefore, it is necessary to provide a piezoelectric valve that can spray adhesives with a wide range of viscosities to reduce the economic burden on enterprise users and effectively improve production efficiency.

[0005] To achieve the above-mentioned objectives, the present invention adopts the following technical solution.

[0006] This invention provides a piezoelectric valve capable of spraying adhesives with a wide range of viscosities, comprising a housing, an adhesive inlet module and a heating module located on the housing, and an adhesive injection module located inside the housing. The adhesive injection module includes a piezoelectric drive mechanism and an adhesive injection mechanism. The piezoelectric drive mechanism is connected to the adhesive injection mechanism via a lever. The adhesive injection mechanism further includes an upper impact pin, a large spring sleeved on the upper part of the upper impact pin, an impact pin located on the lower part of the upper impact pin, and a nozzle located on the lower part of the impact pin. When the piezoelectric drive mechanism is energized, it is adapted to push the upper impact pin and compress the large spring through the lever. When the piezoelectric drive mechanism is de-energized, the large spring is adapted to push the upper impact pin and drive the impact pin to strike the nozzle, thereby extruding the adhesive located at the nozzle under high pressure.

[0007] Preferably, the dispensing module further includes a displacement sensor, a sensor mounting block, and a sensor adjustment block. The displacement sensor is mounted inside the sensor mounting block, and the sensor adjustment block is adapted to adjust the mounting height of the displacement sensor mounting block to adjust the stroke of the upper impact pin.

[0008] Preferably, the piezoelectric valve further includes an electronic control module, which is connected to the piezoelectric drive mechanism and the displacement sensor respectively, and is adapted to adjust the input voltage of the piezoelectric drive mechanism so that the pushing stroke of the piezoelectric drive mechanism remains constant each time.

[0009] Preferably, the piezoelectric valve further includes an electronic control module, which is connected to the piezoelectric drive mechanism and the displacement sensor respectively, and is adapted to dynamically adjust the input voltage of the piezoelectric drive mechanism according to the installation height of the displacement sensor mounting block, so that the pushing stroke of the piezoelectric drive mechanism corresponds to the glue with different point diameters each time.

[0010] Preferably, the firing pin and the nozzle are coaxially arranged, and the upper firing pin and the firing pin are in a contact-type movable connection relationship.

[0011] Preferably, the glue dispensing module includes a glue tube holder fixed to one end of the housing and a glue dispensing connector at the opposite end. The glue dispensing connector is connected to a fluid channel, and glue is adapted to enter the glue dispensing connector from the glue tube and flow into the nozzle through the channel in the fluid channel.

[0012] Preferably, the piezoelectric valve further includes a quick-release locking bracket, which is adapted to fix the firing pin, the glue inlet connector, and the fluid groove, wherein the firing pin and the nozzle are detachably disposed within the fluid groove.

[0013] Preferably, the piezoelectric valve further includes an L-shaped adjusting bracket, and the quick-release locking bracket is fixed on the L-shaped adjusting bracket. The L-shaped adjusting bracket includes a knob portion and an L-shaped bracket that engages with the knob portion. When the knob portion is rotated, it is adapted to drive the L-shaped bracket and the striker to move up and down.

[0014] Preferably, the firing pin is mounted in the fluid tank via a guide post, and a small spring is provided between the firing pin and the guide post. The small spring is adapted to provide an upward force to push the firing pin away from the nozzle.

[0015] Preferably, the heating module is fixed to the quick-release locking bracket and is positioned close to the fluid tank and nozzle. It includes a heating block, a heating plate, a temperature sensor, and a probe assembly. The probe assembly is connected to a power source through the L-shaped adjustment bracket and supplies power to the heating plate.

[0016] This invention utilizes a piezoelectric drive mechanism to store energy in a large spring, which then provides the force required for dispensing the adhesive to the ejector pin. Compared to directly using a piezoelectric drive mechanism for dispensing, this method not only provides stable force and ensures consistent adhesive dot diameter, but also allows for adjustments to the compression of the large spring to accommodate adhesives of different viscosities and meet dispensing requirements for varying dot diameters. This enables the application of adhesives with a wide range of viscosities and different dot diameters. Users no longer need to purchase numerous dispensing devices of different models, reducing their financial burden and effectively improving production efficiency. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the overall structure of the piezoelectric valve capable of spraying adhesives with a wide range of viscosities in this embodiment.

[0018] Figure 2 This is a schematic diagram of the internal structure of the piezoelectric valve in this embodiment, which can spray adhesives with a wide range of viscosities.

[0019] Figure 3 This is a schematic diagram of the overall structure of the dispensing module in this embodiment;

[0020] Figure 4 This is a cross-sectional view of the dispensing module in this embodiment;

[0021] Figure 5 This is a schematic diagram of the connection structure between the quick-release locking bracket and the L-shaped adjusting bracket in this embodiment;

[0022] Figure 6 This is a schematic diagram of the overall structure of the heating module in this embodiment;

[0023] Figure 7 This is a cross-sectional view of the heating module in this embodiment.

[0024] The realization of the purpose of this invention, as well as its functions and principles, will be further explained in conjunction with the accompanying drawings in specific embodiments. Detailed Implementation

[0025] The following description, in conjunction with the accompanying drawings and specific embodiments, provides further details.

[0026] like Figure 1 and Figure 2 As shown, this embodiment provides a piezoelectric valve 100 capable of spraying adhesives with a wide range of viscosities. It mainly includes a housing 10, an adhesive inlet module 20 and a heating module 30 located on the housing 10, and an adhesive dispensing module 40 located inside the housing 10. The adhesive inlet module 20 is used to fix the adhesive tube and allow the adhesive to flow into the piezoelectric valve 100; the heating module 30 is used to heat the adhesive to prevent it from solidifying; and the adhesive dispensing module 40 is used to spray the adhesive onto the workpiece to perform the dispensing process.

[0027] The housing 10 is equipped with a self-locking plug 11 for connecting to the power supply. After the power supply passes through a circuit board, it is converted into the low-voltage DC power required by each electronic component. After each electronic component is powered on, it works normally and controls each module to complete the dispensing process.

[0028] Specifically, such as Figure 3 and Figure 4 As shown, the glue injection module 40 includes a piezoelectric drive mechanism 41 and a glue injection mechanism 42. The piezoelectric drive mechanism 41 is connected to the glue injection mechanism 42 via a lever 43, and the lever 43 can rotate around a lever axis 44. The piezoelectric drive mechanism 41 includes an upper piezoelectric wedge block 411, a lower piezoelectric wedge block 412, a piezoelectric stack 413, and a piezoelectric stack wedge block bolt 414. When the piezoelectric drive mechanism 41 is energized, the piezoelectric stack wedge block bolt 414 rotates. According to the principle of the screw and nut mechanism, the upper piezoelectric wedge block 411 presses the lower piezoelectric wedge block 412 through the inclined plane, and the piezoelectric stack 413 moves down, pushing the lever 43 to rotate. The dispensing mechanism 42 includes an upper striking pin 421, a large spring 422 sleeved on the upper part of the upper striking pin 421, a striking pin 423 disposed on the lower part of the upper striking pin 421, and a nozzle 424 disposed on the lower part of the striking pin 423. When the lever 43 rotates, it pushes the upper striking pin 421 and compresses the large spring 422. When the piezoelectric drive mechanism 41 is de-energized, the piezoelectric upper wedge block 411, the piezoelectric lower wedge block 412, and the piezoelectric stack 413 reset. At this time, the large spring 422, which is in a compressed state, pushes the upper striking pin 421 and drives the striking pin 423 to strike the nozzle 424, extruding the glue located at the nozzle 424 under high pressure, thereby achieving dispensing.

[0029] Furthermore, the dispensing module also includes a displacement sensor 425, a sensor mounting block 426, and a sensor adjustment block 427. The displacement sensor 425 is installed inside the sensor mounting block 426, and the sensor adjustment block 427 is adapted to adjust the installation height of the displacement sensor mounting block 426 to adjust the height at which the upper impact pin 421 can be "lifted". Specifically, the displacement sensor 425 can monitor the distance between itself and the top of the upper impact pin 421 in real time, that is, the distance between the impact pin 423 and the nozzle 424. For example, when the impact pin 423 contacts the nozzle 424, the distance between the displacement sensor 425 and the upper impact pin 421 is m. If the current distance is n, then the distance at which the impact pin 423 is "lifted" is mn. Then, by adjusting the input voltage of the piezoelectric drive mechanism 41, the pushing stroke of the piezoelectric drive mechanism 41 is kept constant each time, so that the distance at which the impact pin 423 is "lifted" can always be accurately maintained at mn. This improves the consistency and stability of dispensing in this embodiment.

[0030] In this embodiment, the piezoelectric valve 100 further includes an electronic control module 50. The electronic control module 50 is connected to the piezoelectric drive mechanism 41 and the displacement sensor 425, and is adapted to adjust the distance between the upper impact pin 421 and the nozzle 424 according to the installation height of the displacement sensor mounting block 426, so that the pushing stroke of the piezoelectric drive mechanism 41 corresponds to different nozzle diameters of glue. When it is necessary to spray glue with different nozzle diameters, the height of the displacement sensor mounting block 426 can be adjusted. At this time, the electronic control module 50 automatically memorizes the adjustment amount of the height and adaptively adjusts the voltage of the piezoelectric drive mechanism 41 so that its pushing stroke matches the height of the displacement sensor mounting block 426, thereby achieving the purpose of spraying glue with different nozzle diameters. Of course, when it is necessary to spray glue with different viscosities, the distance between the impact pin 423 and the nozzle 424 can also be automatically calculated based on the viscosity value input to the electronic control module 50, and then the voltage of the piezoelectric drive mechanism 41 can be adjusted so that its pushing stroke matches the distance between the impact pin 423 and the nozzle 424, which is very convenient.

[0031] In this embodiment, the impact pin 423 and the nozzle 424 are coaxially arranged, which makes the spraying of the nozzle 424 more stable and prevents glue from sticking to the nozzle opening. Since the lever 43 rotates around the lever axis 44, the movement trajectory of the upper impact pin 421 is slightly arc-shaped. In order to avoid disrupting the coaxiality between the impact pin 423 and the nozzle 424, a two-stage structure is adopted, that is, the upper impact pin 421 and the impact pin 423 are in a contact-type movable connection relationship. In this way, when the upper impact pin 421 moves up and down, only the contact position between the upper impact pin 421 and the impact pin 423 changes, without disrupting the coaxiality between the impact pin 423 and the nozzle 424, thus ensuring the stability of glue spraying and preventing glue from sticking to the nozzle opening.

[0032] In addition, refer to Figure 2 and Figure 5 As shown, the glue injection module 20 includes a glue tube holder 21 fixed to one end of the housing 10 and a glue injection connector 22 at the opposite end. The glue injection connector 22 is connected to a fluid channel 23. Glue is adapted to enter the glue injection connector 22 from the glue tube and flow into the nozzle 424 through the channel in the fluid channel 23.

[0033] The piezoelectric valve 100 also includes a quick-release locking bracket 60, which is adapted to fix the striker 423, the glue inlet connector 22, and the fluid channel 23. The striker 423 and the nozzle 424 are detachably disposed within the fluid channel 23. The glue inlet connector 22 is preferably a Luer connector. The glue enters the channel through the Luer connector and then flows into the gap between the nozzle 424 and the striker 423. When the striker 423 moves downward, it can force the glue in the gap out.

[0034] The piezoelectric valve 100 also includes an L-shaped adjusting bracket 70. A quick-release locking bracket 60 is fixed to the L-shaped adjusting bracket 70. The L-shaped adjusting bracket 70 includes a knob portion 71 and an L-shaped bracket 72 that engages with the knob portion 71. When the knob portion 71 rotates, it is adapted to move the L-shaped bracket 72 and the striker 423 up and down, adjusting the distance between the L-shaped bracket 72 and the housing 10, thereby adjusting the distance between the striker 423 and the nozzle 424. Since the striker 423, nozzle 424, glue inlet connector 22, and fluid groove 23 are all fixed to the L-shaped adjusting bracket 70 via the quick-release locking bracket 60, quick installation and quick removal can be achieved when replacing and disassembling the nozzle 424. Specific operation can be referred to as follows:

[0035] a. First, replace nozzle 424 and firing pin 423 with calibration nozzle and calibration firing pin respectively;

[0036] b. Rotate the knob 71 to adjust the height of the L-shaped bracket until the lower surfaces of the calibration nozzle and the calibration pin are flush. This is the optimal height of the L-shaped bracket 72. Rotate the scale ring on the knob 71 to the 0 mark for future reference. Finally, lock the L-shaped bracket 72.

[0037] c. Switch back to nozzle 424 and firing pin 423; the spacing at this point is the optimal spacing between the two.

[0038] For the initial installation of the striking pin 423, nozzle 424, or fluid tank 23, steps a to c above can be followed to easily calibrate the positions of the components. Subsequent disassembly and assembly can be performed using the quick-release locking bracket 60 to remove all three components simultaneously without changing their relative positions, thus eliminating the need for secondary adjustments. This saves time and effort and reduces the precision requirements on the parts.

[0039] Preferably, the impact pin 423 can be installed in the fluid channel 23 via a guide post (not shown), and a small spring is provided between the impact pin 423 and the guide post. The small spring is adapted to provide an elastic force to push the impact pin 423 upward so that it leaves the nozzle 424 to form the aforementioned gap.

[0040] Combination Figure 2 , Figure 5 , Figure 6 and Figure 7As shown, the heating module 30 is fixed to the quick-release locking bracket 60 and is positioned close to the fluid tank 23 and nozzle 424 to heat the adhesive and prevent it from solidifying. The heating module 30 mainly includes a heating block 31, a heating plate 32, a temperature sensor 33, and a probe assembly 34. The heating block 31, heating plate 32, and temperature sensor 33 are covered by a sealing plate 35. The heating block 31 transmits heat, the heating plate 32 generates heat, the temperature sensor 33 senses the heating temperature, and the probe assembly 34 connects to a power source via the L-shaped adjustment bracket 70 to supply power to the heating plate 32. The L-shaped adjustment bracket 70 connects to the electronic control module 50, which in turn connects to the self-locking plug 11. In traditional methods, the heating element and temperature sensor are connected to the outside of the heating block via cables and sockets. This type of cable is prone to damage and occupies a significant amount of space due to cable tangling, making it inconvenient to use. The heating module 30 in this embodiment has a compact structure, effectively reducing the failure rate. Meanwhile, the heating module 30 is fixed on the quick-release locking bracket 60, which can be removed together with the quick-release locking bracket 60, making it very convenient.

[0041] In summary, this invention utilizes a piezoelectric drive mechanism to store energy in a large spring, which then provides the force required for dispensing the adhesive to the ejector pin. Compared to directly using a piezoelectric drive mechanism for dispensing, this method not only provides stable force output and maintains consistent adhesive dot diameter, but also allows for adjustments to the compression of the large spring to accommodate adhesives of different viscosities and meet dispensing requirements for varying dot diameters. This enables the application of adhesives with a wide range of viscosities and different dot diameters. Users no longer need to purchase numerous dispensing devices of different models, reducing their financial burden and effectively improving production efficiency.

[0042] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0043] The embodiments described above are merely examples of several implementations of the present invention, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the present invention. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of the present invention, and these modifications and improvements all fall within the scope of protection of the present invention.

Claims

1. A piezoelectric valve capable of spraying adhesives with a wide range of viscosities, comprising a housing, an adhesive inlet module and a heating module located on the housing, and an adhesive dispensing module located inside the housing, characterized in that: The glue injection module comprises a piezoelectric driving mechanism and a glue injection mechanism, the piezoelectric driving mechanism is connected with the glue injection mechanism through a lever; the glue injection mechanism further comprises an upper punch, a large spring arranged on the upper part of the upper punch, a punch arranged on the lower part of the upper punch and a nozzle arranged on the lower part of the punch; when the piezoelectric driving mechanism is powered on, the piezoelectric driving mechanism is adapted to push the upper punch through the lever and compress the large spring, and the large spring is adapted to push the upper punch when the piezoelectric driving mechanism is powered off, and drive the punch to impact the nozzle, so as to extrude the glue at the nozzle under high pressure; The glue injection module further comprises a displacement sensor, a sensor mounting block and a sensor adjusting block, the displacement sensor is mounted in the sensor mounting block, and the sensor adjusting block is adapted to adjust the installation height of the displacement sensor mounting block to adjust the stroke of the upper punch; The piezoelectric valve further comprises an electric control module, the electric control module is connected with the piezoelectric driving mechanism and the displacement sensor respectively, and is adapted to dynamically adjust the input voltage of the piezoelectric driving mechanism according to the installation height of the displacement sensor mounting block, so that the pushing stroke of the piezoelectric driving mechanism corresponds to the glue with different diameters each time, and is adapted to automatically calculate the distance between the punch and the nozzle according to the viscosity value input into the electric control module, and then adjust the voltage of the piezoelectric driving mechanism, so that the pushing stroke of the piezoelectric driving mechanism matches the distance between the punch and the nozzle.

2. A piezoelectric valve as claimed in claim 1, characterized in that: The punch and the nozzle are coaxially arranged, and the upper punch and the punch are in a contact movable connection relationship.

3. The piezoelectric valve of claim 1, wherein: The glue injection module comprises a glue pipe holder fixed to one end of the shell and a glue injection connector opposite to the other end, the glue injection connector is connected with a fluid groove, the glue is adapted to enter the glue injection connector from the glue pipe, and flow into the nozzle through the channel in the fluid groove.

4. A piezoelectric valve as claimed in claim 3, characterised in that: The piezoelectric valve further comprises a quick-release locking support, the quick-release locking support is adapted to fix the punch, the glue injection connector and the fluid groove, and the punch and the nozzle are detachably arranged in the fluid groove.

5. A piezoelectric valve as claimed in claim 4, characterised in that: The piezoelectric valve further comprises an L-shaped adjusting support, the quick-release locking support is fixed on the L-shaped adjusting support, the L-shaped adjusting support comprises a knob part and an L-shaped support engaged with the knob part, and the knob part is adapted to drive the L-shaped support and the punch to move up and down when the knob part rotates.

6. A piezoelectric valve as claimed in claim 5, characterised in that: The punch is installed in the fluid groove through a guide column, a small spring is arranged between the punch and the guide column, and the small spring is adapted to provide an upward pushing force to the punch to make the punch away from the nozzle.

7. The piezoelectric valve of claim 5, wherein: The heating module is fixed to the quick-release locking support and closely arranged with the fluid groove and the nozzle, and comprises a heating block, a heating plate, a temperature sensor and a probe assembly, the probe assembly is connected with a power supply through the L-shaped adjusting support and supplies power to the heating plate.

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