Photosensitive composition

Abstract

The photosensitive composition of the present invention is a photosensitive composition comprising semiconductor particles (A), a photopolymerizable compound (C) and a photopolymerization initiator (D), and satisfies any one or more of the following (a) to (c). (a) It further comprises a stabilizer (E), and the content of the stabilizer (E) is 8% by mass or more relative to the total amount of the photosensitive composition. (b) The photopolymerizable compound (C) comprises a (meth)acrylate compound (C1) having a molecular weight of 180 or less. (c) The photopolymerizable compound (C) comprises a compound (C2) having a vinyl ether group and a (meth)acryloyl group in the same molecule.

Description

Technical Field

[0001] The present invention relates to a photosensitive composition, and particularly to a photosensitive composition suitable for ink for inkjet printers. Background Art

[0002] As a curable resin composition for forming a cured film such as a wavelength conversion film included in a display device such as an image display device, a curable resin composition containing semiconductor particles such as semiconductor quantum dots is known (Patent Document 1). In addition, a method of using an ink composition containing semiconductor quantum dots and using an inkjet method to produce a wavelength conversion film or the like has been studied (Patent Documents 2 and 3).

[0003] Prior art literature

[0004] Patent Literature

[0005] Patent Document 1: Japanese Patent Application Publication No. 2016-71362

[0006] Patent Document 2: International Publication No. 2018 / 123821

[0007] Patent Document 3: International Publication No. 2018 / 123103 Summary of the invention

[0008] Semiconductor particles such as semiconductor quantum dots are not heat-resistant, and it is sometimes required to improve the heat resistance of cured films such as wavelength conversion films formed from photosensitive compositions containing semiconductor particles. In addition, photosensitive compositions are also required to have better coating properties.

[0009] An object of the present invention is to provide a photosensitive composition containing semiconductor particles and having good heat resistance and / or coating properties.

[0010] The present invention is as follows.

[0011] [1] A photosensitive composition comprising semiconductor particles (A), a photopolymerizable compound (C), a photopolymerization initiator (D) and a stabilizer (E),

[0012] The content of the stabilizer (E) is 8% by mass or more based on the total amount of the photosensitive composition.

[0013] [2] A photosensitive composition comprising semiconductor particles (A), a photopolymerizable compound (C) and a photopolymerization initiator (D),

[0014] The photopolymerizable compound (C) contains a (meth)acrylate compound (C1) having a molecular weight of 180 or less.

[0015] [3] A photosensitive composition comprising semiconductor particles (A), a photopolymerizable compound (C) and a photopolymerization initiator (D),

[0016] The photopolymerizable compound (C) includes a compound (C2) having a vinyl ether group and a (meth)acryloyl group in the same molecule.

[0017] [4] The photosensitive composition according to any one of [1] to [3], wherein the photopolymerizable compound (C) contains a (meth)acrylate compound (C1) having a molecular weight of 180 or less.

[0018] [5] The photosensitive composition according to any one of [1] to [4], wherein the photopolymerizable compound (C) includes a compound (C2) having a vinyl ether group and a (meth)acryloyl group in the same molecule.

[0019] [6] The photosensitive composition according to any one of [1] to [5], further comprising a stabilizer (E),

[0020] The content of the stabilizer (E) is 8% by mass or more based on the total amount of the photosensitive composition.

[0021] [7] The photosensitive composition according to any one of [1] to [6], wherein the compound (C1) has a viscosity at 25° C. of 1.2 cP or less.

[0022] [8] The photosensitive composition according to any one of [1] to [7], wherein the content of the compound (C1) is 5% by mass to 50% by mass based on the total amount of the photosensitive composition.

[0023] [9] The photosensitive composition according to any one of [1] to [8], wherein the content of the compound (C2) is 5% by mass to 50% by mass based on the total amount of the photosensitive composition.

[0024]

[10] The photosensitive composition according to any one of [1] to [9], wherein the content of the stabilizer (E) is 16% by mass or more based on the total amount of the photosensitive composition.

[0025]

[11] The photosensitive composition according to any one of [1] to

[10] , wherein the content of the semiconductor particles (A) is 16% by mass to 45% by mass based on the total amount of the photosensitive composition.

[0026]

[12] The photosensitive composition according to any one of [1] to

[11] , wherein the photopolymerizable compound (C) includes a compound (C3) having a carboxyl group and three or more functional groups other than the carboxyl group in the same molecule.

[0027]

[13] The photosensitive composition according to

[12] , wherein the content of the compound (C3) is 25 to 100 parts by mass based on 100 parts by mass of the semiconductor particles (A).

[0028]

[14] The photosensitive composition according to any one of [1] to

[13] , wherein the viscosity of the photosensitive composition at 40° C. is 20 cP or less.

[0029]

[15] The photosensitive composition according to any one of [1] to

[14] , wherein the content of the photopolymerization initiator (D) is 8 to 50 parts by mass based on 100 parts by mass of the photopolymerizable compound (C).

[0030]

[16] The photosensitive composition according to any one of [1] to

[15] , further comprising a light scattering agent (B) having a volume-based median particle size of 0.15 μm or more.

[0031]

[17] The photosensitive composition according to any one of [1] to

[16] , further comprising a solvent (F),

[0032] The content of the solvent (F) is 3.5% by mass or less based on the total amount of the photosensitive composition.

[0033]

[18] The photosensitive composition according to any one of [1] to

[17] , which is an ink for an inkjet printer.

[0034]

[19] Use of the photosensitive composition described in

[18] , wherein the photosensitive composition is ejected from an inkjet printer head at a temperature of 40° C. or higher.

[0035]

[20] A cured film formed from the photosensitive composition according to any one of [1] to

[18] .

[0036]

[21] The cured film according to

[20] , wherein the vertical dimension is 9 μm or more and / or the horizontal dimension is 10 μm to 900 μm.

[0037] According to the present invention, a photosensitive composition having excellent heat resistance and / or coating properties can be provided. BRIEF DESCRIPTION OF THE DRAWINGS

[0038] Figure 1 1 is a schematic cross-sectional view showing an example of a display component.

[0039] Figure 2 FIG. 1 is a conceptual diagram of a device showing a first optical system used for measuring the external quantum yield.

[0040] Figure 3 This is a conceptual diagram showing a second optical system used for measuring the external quantum yield. DETAILED DESCRIPTION

[0041] <Photosensitive composition>

[0042] The photosensitive composition of the present invention comprises semiconductor particles (A), a photopolymerizable compound (C) and a photopolymerization initiator (D), and satisfies any one or more of the following (a) to (c).

[0043] (a) further contains a stabilizer (E), wherein the content of the stabilizer (E) is 8% by mass or more based on the total amount of the photosensitive composition.

[0044] (b) The photopolymerizable compound (C) contains a (meth)acrylate compound (C1) having a molecular weight of 180 or less.

[0045] (c) The photopolymerizable compound (C) includes a compound (C2) having a vinyl ether group and a (meth)acryloyl group in the same molecule.

[0046] The photosensitive composition of the present invention may satisfy any one of the above (a) to (c), any two of the above (a) to (c), or all of the above (a) to (c).

[0047] In addition, the compounds exemplified as the components contained or contained in the photosensitive composition in this specification can be used alone or in combination of two or more unless otherwise specified.

[0048] <Semiconductor particles (A)>

[0049] The semiconductor particles (A) are preferably luminescent (fluorescent) semiconductor particles. A cured film such as a wavelength conversion film formed from a photosensitive composition containing luminescent semiconductor particles can be a cured film having excellent color reproducibility of fluorescence in a desired wavelength region.

[0050] Semiconductor particles (A) can be red luminescent semiconductor particles that produce light with a luminescence peak wavelength in the range of 605 to 665 nm, green luminescent semiconductor particles that produce light with a luminescence peak wavelength in the range of 500 to 560 nm, and blue luminescent semiconductor particles that produce light with a luminescence peak wavelength in the range of 420 to 480 nm. In addition, the light absorbed by the semiconductor particles (A) can be, for example, light with a wavelength in the range of 400 nm or more and less than 500 nm (blue light) or light with a wavelength in the range of 200 nm to 400 nm (ultraviolet light). It should be noted that the luminescence peak wavelength of the semiconductor particles (A) can be confirmed, for example, in the luminescence spectrum measured using an ultraviolet-visible spectrophotometer.

[0051] In addition, the half-peak width of the luminescence spectrum of semiconductor particles (A) is preferably below 60nm, more preferably below 55nm, further preferably below 50nm, and particularly preferably below 45nm.Thus, it is possible to obtain light with higher color purity.In addition, the lower limit of the half-peak width of the luminescence spectrum of semiconductor particles (A) is not particularly limited, and can be more than 5nm, or more than 15nm.

[0052] The luminescent semiconductor particles are particles composed of semiconductor crystals, preferably nanoparticles composed of semiconductor crystals. Preferred examples of luminescent semiconductor particles include semiconductor quantum dots and compounds having a perovskite crystal structure (hereinafter referred to as "perovskite compounds"), and more preferably semiconductor quantum dots.

[0053] The average particle size of the semiconductor quantum dots is, for example, 0.5 nm to 20 nm, and preferably 1 nm to 15 nm (eg, 2 nm to 15 nm). The average particle size of the semiconductor quantum dots can be determined using a transmission electron microscope (TEM).

[0054] For example, semiconductor quantum dots can be composed of a semiconductor material containing one or more elements selected from Group IIA elements, Group IB elements, Group IIB elements, Group IIIA elements, Group IVA elements, Group VA elements and Group VIA elements of the periodic table.

[0055] Specific examples of semiconductor materials that can constitute semiconductor quantum dots include compounds of Group IVA elements and Group VIA elements such as SnS2, SnS, SnSe, SnTe, PbS, PbSe, PbTe; compounds of Group IIIA elements and Group VA elements such as GaN, GaP, GaAs, GaSb, InN, InP, InAs, InSb, InGaN, InGaP; compounds of Group IIIA elements and Group VIA elements such as Ga2O3, Ga2S3, Ga2Se3, Ga2Te3, In2O3, In2S3, In2Se3, In2Te3; compounds of Group IIIA elements and Group VIA elements such as ZnO, ZnS, ZnSe, ZnTe, CdO, CdS, CdSe, CdTe, HgO, HgS, HgSe, HgTe, Zn Compounds of IIB group elements and VIA group elements such as STe, ZnSeS, ZnSeTe, CdSTe, CdSeTe, HgSTe, HgSeS, HgSeTe; compounds of VA group elements and VIA group elements such as As2O3, As2S3, As2Se3, As2Te3, Sb2O3, Sb2S3, Sb2Se3, Sb2Te3, Bi2O3, Bi2S3, Bi2Se3, Bi2Te3; compounds of IIA group elements and VIA group elements such as MgS, MgSe, MgTe, CaS, CaSe, CaTe, SrS, SrSe, SrTe, BaS, BaSe, BaTe; single substances of IVA group elements, VA group elements or VIA group elements such as Si and Ge.

[0056] Semiconductor quantum dots can be a single-layer structure composed of a single semiconductor material, or a core-shell structure in which the surface of a core particle (core layer) composed of a single semiconductor material is coated with a coating layer (shell layer) composed of one or more semiconductor materials different from it. In the latter case, as the semiconductor material constituting the shell layer, a semiconductor material with a band gap energy greater than the semiconductor material constituting the core layer is generally used. Semiconductor quantum dots can have more than two shell layers. The shape of semiconductor quantum dots is not particularly limited, for example, it can be spherical or roughly spherical, rod-shaped, disc-shaped, etc.

[0057] The perovskite compound is a compound having A, B, and X as components and having a perovskite-type crystal structure.

[0058] A is a component located at each vertex of a hexahedron with B at the center in the perovskite crystal structure, and is a monovalent cation.

[0059] X represents a component located at each vertex of an octahedron centered at B in a perovskite crystal structure, and is at least one ion selected from a halide ion and a thiocyanate ion.

[0060] B is a component located at the center of a hexahedron having A at its vertices and an octahedron having X at its vertices in the perovskite crystal structure, and is a metal ion.

[0061] From the viewpoint of maintaining the crystal structure well, the average particle size of the perovskite compound is preferably 3 nm or more, more preferably 4 nm or more, and further preferably 5 nm or more. In addition, from the viewpoint of suppressing the precipitation of the perovskite compound in the photosensitive composition, the average particle size of the perovskite compound is preferably 5 μm or less, more preferably 500 nm or less, and further preferably 100 nm or less. The average particle size of the perovskite compound can be obtained using a transmission electron microscope (TEM).

[0062] The perovskite compound having A, B, and X as components is not particularly limited, and may be a compound having any of a three-dimensional structure, a two-dimensional structure, and a quasi-two-dimensional structure.

[0063] In the case of a three-dimensional structure, the perovskite compound consists of ABX (3+δ) express.

[0064] In the case of a two-dimensional structure, the perovskite compound consists of A2BX (4+δ) express.

[0065] Here, δ is a number that can be appropriately changed according to the charge balance of B, and is in the range of −0.7 to 0.7.

[0066] As a perovskite compound and composed of ABX (3+δ) Specific examples of compounds having a three-dimensional perovskite crystal structure represented by include:

[0067] CH3NH3PbBr3, CH3NH3PbCl3, CH3NH3PbI3, CH3NH3PbBr (3-y) I y (0<y<3), CH3NH3PbBr (3-y) Cl y (0<y<3), (H2N=CH-NH2)PbBr3, (H2N=CH-NH2)PbCl3, (H2N=CH-NH2)PbI3,

[0068] CH3NH3Pb (1-a) Ca a Br3(0<a≤0.7), CH3NH3Pb (1-a) Sr a Br3(0<a≤0.7), CH3NH3Pb (1-a) La a Br (3+δ)<h2 style=";text-align:left;direction:ltr">(0<a≤0.7,0<δ≤0.7)、CH3NH3Pb<h2 style=";text-align:left;direction:ltr"> (1-a) <h2 style=";text-align:left;direction:ltr"> Ba<h2 style=";text-align:left;direction:ltr"> a <h2 style=";text-align:left;direction:ltr"> Br3(0<a≤0.7)、CH3NH3Pb<h2 style=";text-align:left;direction:ltr"> (1-a) <h2 style=";text-align:left;direction:ltr"> Dy<h2 style=";text-align:left;direction:ltr"> a <h2 style=";text-align:left;direction:ltr"> Br<h2 style=";text-align:left;direction:ltr"> (3+δ) <h2 style=";text-align:left;direction:ltr"> (0<a≤0.7,0<δ≤0.7)、<h2 style=";text-align:left;direction:ltr"> <h2 style=";text-align:left;direction:ltr">

[0069] <h2 style=";text-align:left;direction:ltr"> CH3NH3Pb<h2 style=";text-align:left;direction:ltr"> (1-a) <h2 style=";text-align:left;direction:ltr"> Na<h2 style=";text-align:left;direction:ltr"> a <h2 style=";text-align:left;direction:ltr"> Br<h2 style=";text-align:left;direction:ltr"> (3+δ) <h2 style=";text-align:left;direction:ltr"> (0<a≤0.7,-0.7≤δ<0)、CH3NH3Pb<h2 style=";text-align:left;direction:ltr"> (1-a) <h2 style=";text-align:left;direction:ltr"> Li<h2 style=";text-align:left;direction:ltr"> a <h2 style=";text-align:left;direction:ltr"> Br<h2 style=";text-align:left;direction:ltr"> (3+δ) <h2 style=";text-align:left;direction:ltr"> (0<a≤0.7,-0.7≤δ<0)、<h2 style=";text-align:left;direction:ltr"> <h2 style=";text-align:left;direction:ltr">

[0070] <h2 style=";text-align:left;direction:ltr"> CsPb<h2 style=";text-align:left;direction:ltr"> (1-a) <h2 style=";text-align:left;direction:ltr"> Na<h2 style=";text-align:left;direction:ltr"> a <h2 style=";text-align:left;direction:ltr"> Br<h2 style=";text-align:left;direction:ltr"> (3+δ) <h2 style=";text-align:left;direction:ltr"> (0<a≤0.7,-0.7≤δ<0)、CsPb<h2 style=";text-align:left;direction:ltr"> (1-a) <h2 style=";text-align:left;direction:ltr"> Li<h2 style=";text-align:left;direction:ltr"> a <h2 style=";text-align:left;direction:ltr"> Br<h2 style=";text-align:left;direction:ltr"> (3+δ) <h2 style=";text-align:left;direction:ltr"> (0<a≤0.7,-0.7≤δ<0)、<h2 style=";text-align:left;direction:ltr"> <h2 style=";text-align:left;direction:ltr">

[0071] <h2 style=";text-align:left;direction:ltr"> CH3NH3Pb<h2 style=";text-align:left;direction:ltr"> (1-a) <h2 style=";text-align:left;direction:ltr"> Na<h2 style=";text-align:left;direction:ltr"> a <h2 style=";text-align:left;direction:ltr"> Br<h2 style=";text-align:left;direction:ltr"> (3+δ-y) <h2 style=";text-align:left;direction:ltr"> I<h2 style=";text-align:left;direction:ltr"> y <h2 style=";text-align:left;direction:ltr"> (0<a≤0.7,-0.7≤δ<0,0<y<3)、CH3NH3Pb<h2 style=";text-align:left;direction:ltr"> (1-a) <h2 style=";text-align:left;direction:ltr"> Li<h2 style=";text-align:left;direction:ltr"> a <h2 style=";text-align:left;direction:ltr"> Br<h2 style=";text-align:left;direction:ltr"> (3+δ-y) <h2 style=";text-align:left;direction:ltr"> I<h2 style=";text-align:left;direction:ltr"> y <h2 style=";text-align:left;direction:ltr"> (0<a≤0.7,-0.7≤δ<0,0<y<3)、CH3NH3Pb<h2 style=";text-align:left;direction:ltr"> (1-a) <h2 style=";text-align:left;direction:ltr"> Na<h2 style=";text-align:left;direction:ltr"> a <h2 style=";text-align:left;direction:ltr"> Br<h2 style=";text-align:left;direction:ltr"> (3+δ-y) <h2 style=";text-align:left;direction:ltr"> Cl<h2 style=";text-align:left;direction:ltr"> y <h2 style=";text-align:left;direction:ltr"> (0<a≤0.7,-0.7≤δ<0,0<y<3)、CH3NH3Pb<h2 style=";text-align:left;direction:ltr"> (1-a) <h2 style=";text-align:left;direction:ltr"> Li<h2 style=";text-align:left;direction:ltr"> a <h2 style=";text-align:left;direction:ltr"> Br<h2 style=";text-align:left;direction:ltr"> (3+δ-y) <h2 style=";text-align:left;direction:ltr"> Cl<h2 style=";text-align:left;direction:ltr"> y <h2 style=";text-align:left;direction:ltr"> (0<a≤0.7,-0.7≤δ<0,0<y<3)、<h2 style=";text-align:left;direction:ltr"> <h2 style=";text-align:left;direction:ltr">

[0072] <h2 style=";text-align:left;direction:ltr"> (H2N=CH-NH2)Pb<h2 style=";text-align:left;direction:ltr"> (1-a) <h2 style=";text-align:left;direction:ltr"> Na<h2 style=";text-align:left;direction:ltr"> a <h2 style=";text-align:left;direction:ltr"> Br<h2 style=";text-align:left;direction:ltr"> (3+δ) <h2 style=";text-align:left;direction:ltr"> (0<a≤0.7,-0.7≤δ<0)、(H2N=CH-NH2)Pb<h2 style=";text-align:left;direction:ltr"> (1-a) <h2 style=";text-align:left;direction:ltr"> Li<h2 style=";text-align:left;direction:ltr"> a <h2 style=";text-align:left;direction:ltr"> Br(3+δ) (0<a≤0.7,-0.7≤δ<0)、(H2N=CH-NH2)Pb (1-a) Na a Br (3+δ-y) I y (0<a≤0.7,-0.7≤δ<0,0<y<3)、(H2N=CH-NH2)Pb (1-a) Na a Br (3+δ-y) Cl y (0<a≤0.7,-0.7≤δ<0,0<y<3)、

[0073] CsPbBr3、CsPbCl3、CsPbI3、CsPbBr (3-y) I y (0<y<3)、CsPbBr (3-y) Cl y (0<y<3)、CH3NH3PbBr (3-y) Cl y (0<y<3)、

[0074] CH3NH3Pb (1-a) Zn a Br3(0<a≤0.7)、CH3NH3Pb (1-a) Al a Br (3+δ) (0<a≤0.7,0≤δ≤0.7)、CH3NH3Pb (1-a) Co a Br3(0<a≤0.7)、CH3NH3Pb (1-a) Mn a Br3(0<a≤0.7)、CH3NH3Pb (1-a) Mg a Br3(0<a≤0.7)、

[0075] CsPb (1-a) Zn a Br3(0<a≤0.7)、CsPb (1-a) Al a Br (3+δ) (0<a≤0.7,0<δ≤0.7)、CsPb (1-a) Co a Br3(0<a≤0.7)、CsPb (1-a) Mn a Br3(0<a≤0.7)、CsPb (1-a) Mg a Br3(0<a≤0.7)、

[0076] CH3NH3Pb(1-a) Zn a Br (3-y) I y (0<a≤0.7,0<y<3)、CH3NH3Pb (1-a) Al a Br (3+δ-y) I y (0<a≤0.7,0<δ≤0.7,0<y<3)、CH3NH3Pb (1-a) Co a Br (3-y) I y (0<a≤0.7,0<y<3)、CH3NH3Pb (1-a) Mn a Br (3-y) I y (0<a≤0.7,0<y<3)、CH3NH3Pb (1-a) Mg a Br (3-y) I y (0<a≤0.7,0<y<3)、CH3NH3Pb (1-a) Zn a Br (3-y) Cl y (0<a≤0.7,0<y<3)、CH3NH3Pb (1-a) Al a Br (3+δ-y) Cl y (0<a≤0.7,0<δ≤0.7,0<y<3)、CH3NH3Pb (1-a) Co a Br (3+δ-y) Cl y (0<a≤0.7,0<y<3)、CH3NH3Pb (1-a) Mn a Br (3-y) Cl y (0<a≤0.7,0<y<3)、CH3NH3Pb (1-a) Mg a Br (3-y) Cl y (0<a≤0.7,0<y<3)、

[0077] (H2N=CH-NH2)Zn a Br3(0<a≤0.7)、(H2N=CH-NH2)Mg a Br3(0<a≤0.7)、(H2N=CH-NH2)Pb (1-a) Zn a Br (3-y) I y(0<a≤0.7, 0<y<3), (H2N=CH-NH2)Pb (1-a) Zn a Br (3-y) Cl y (0<a≤0.7, 0<y<3) etc. are preferred examples.

[0078] As a perovskite compound and composed of A2BX (4+δ) Preferred specific examples of the compound having a two-dimensional perovskite crystal structure represented by include:

[0079] (C4H9NH3)2PbBr4, (C4H9NH3)2PbCl4, (C4H9NH3)2PbI4, (C7H 15 NH3)2PbBr4、(C7H 15 NH3)2PbCl4、(C7H 15 NH3)2PbI4, (C4H9NH3)2Pb (1-a) Li a Br (4+δ) (0<a≤0.7,-0.7≤δ<0), (C4H9NH3)2Pb (1-a) Na a Br (4+δ) (0<a≤0.7,-0.7≤δ<0), (C4H9NH3)2Pb (1-a) R a Br (4+δ) (0<a≤0.7, -0.7≤δ<0),

[0080] (C7H 15 NH3)2Pb (1-a) Na a Br (4+δ) (0<a≤0.7,-0.7≤δ<0), (C7H 15 NH3)2Pb (1-a) Li a Br (4+δ) (0<a≤0.7,-0.7≤δ<0), (C7H 15 NH3)2Pb (1-a) R a Br (4+δ) (0<a≤0.7, -0.7≤δ<0),

[0081] (C4H9NH3)2Pb (1-a) Na a Br (4+δ-y) I y (0<a≤0.7, -0.7≤δ<0, 0<y<4), (C4H9NH3)2Pb(1-a) Li a Br (4+δ-y) I y (0<a≤0.7,-0.7≤δ<0,0<y<4)、(C4H9NH3)2Pb (1-a) Rb a Br (4+δ-y) I y (0.a≤0.7,0.7≤δ<0,0<y<4)、

[0082] (C4H9NH3)2Pb (1-a) Ankle a Br (4+δ-y) Cl y (0<a≤0.7,-0.7≤δ<0,0<y<4)、(C4H9NH3)2Pb (1-a) Li a Br (4+δ-y) Cl y (0<a≤0.7,-0.7≤δ<0,0<y<4)、(C4H9NH3)2Pb (1-a) Rb a Br (4+δ-y) Cl y (0.a≤0.7,0.7≤δ<0,0<y<4)、

[0083] (C4H9NH3)2PbBr4、(C7H 15 NH3)2PbBr4、

[0084] (C4H9NH3)2PbBr (4-y) Cl y (0<y<4)、(C4H9NH3)2PbBr (4-y) I y (0<y<4)、

[0085] (C4H9NH3)2Pb (1-a) Zn a Br4(0<a≤0.7)、(C4H9NH3)2Pb (1-a) Mg a Br4(0<a≤0.7)、(C4H9NH3)2Pb (1-a) Co a Br4(0<a≤0.7)、(C4H9NH3)2Pb (1-a) Mn a Br4(0<a≤0.7)、

[0086] (C7H 15 NH3)2Pb (1-a) Zn aBr4(0 < a ≤ 0.7), (C7H 15 (NH3)2Pb (1-a) Mg a Br4(0 < a ≤ 0.7), (C7H 15 (NH3)2Pb (1-a) Co a Br4(0 < a ≤ 0.7), (C7H 15 (NH3)2Pb (1-a) Mn a Br4(0 < a ≤ 0.7),

[0087] (C4H9NH3)2Pb (1-a) Zn a Br (4-y) I y (0 < a ≤ 0.7, 0 < y < 4), (C4H9NH3)2Pb (1-a) Mg a Br (4-y) I y (0 < a ≤ 0.7, 0 < y < 4), (C4H9NH3)2Pb (1-a) Co a Br (4-y) I y (0 < a ≤ 0.7, 0 < y < 4), (C4H9NH3)2Pb (1-a) Mn a Br (4-y) I y (0 < a ≤ 0.7, 0 < y < 4),

[0088] (C4H9NH3)2Pb (1-a) Zn a Br (4-y) Cl y (0 < a ≤ 0.7, 0 < y < 4), (C4H9NH3)2Pb (1-a) Mg a Br (4-y) Cl y (0 < a ≤ 0.7, 0 < y < 4), (C4H9NH3)2Pb (1-a) Co a Br (4-y) Cl y (0 < a ≤ 0.7, 0 < y < 4), (C4H9NH3)2Pb (1-a) Mn a Br (4-y) Cl y (0 < a ≤ 0.7, 0 < y < 4), etc.

[0089] The semiconductor particles (A) may be ligand-containing semiconductor particles comprising organic ligands coordinated to the semiconductor particles. The organic ligands coordinated to the semiconductor particles may be, for example, organic compounds having polar groups that exhibit coordination ability to the semiconductor particles. The organic ligands contained in the ligand-containing semiconductor particles may be organic ligands added to consider the limitations on the synthesis of the ligand-containing semiconductor particles or for stabilization. For example, in the Japanese Patent Publication No. 2015-529698, the ligand-containing semiconductor particles include hexanoic acid as an organic ligand from the perspective of controlling the particle size, and in addition, the organic ligand is replaced with DDSA (dodecenyl succinic acid) for stabilization after synthesis.

[0090] The organic ligand can be coordinated to the surface of the semiconductor particle, for example.

[0091] The organic ligand coordinated to the semiconductor particles can be one ligand or more than two ligands. When the organic ligand is an organic compound with a polar group, the organic ligand is usually coordinated to the semiconductor particles via its polar group. The organic ligand is coordinated and can be confirmed by uniformly dispersing the semiconductor particles in a dispersion medium suitable for the organic ligand.

[0092] The polar group is preferably at least one group selected from a thiol group (-SH), a carboxyl group (-COOH) and an amino group (-NH2). The polar group selected therefrom can be advantageous in terms of improving the coordination to the semiconductor particles. High coordination can contribute to the improvement of the color unevenness of the cured film and / or the improvement of the patternability of the photosensitive composition. Among them, from the viewpoint of obtaining a cured film (wavelength conversion film, etc.) with better luminescent properties, the polar group is more preferably at least one group selected from a thiol group and a carboxyl group. The organic ligand may have one or more polar groups.

[0093] The molecular weight of the organic ligand coordinated to the semiconductor particles is not particularly limited, and is, for example, 50 to 500, preferably 80 to 400. When the molecular weight of the organic ligand is within this range, ligand-containing semiconductor particles can be prepared with excellent reproducibility.

[0094] The organic ligand may be, for example, an organic compound represented by the following formula.

[0095] Y-Z

[0096] In the formula, Y is the above-mentioned polar group, and Z is a monovalent hydrocarbon group that may contain heteroatoms (N, O, S, halogen atoms, etc.). The hydrocarbon group may have one or more unsaturated bonds such as carbon-carbon double bonds. The hydrocarbon group may have a linear, branched or cyclic structure. The number of carbon atoms in the hydrocarbon group is, for example, 1 to 40, or 1 to 30. The methylene group contained in the hydrocarbon group may be substituted by -O-, -S-, -C(=O)-, -C(=O)-O-, -O-C(=O)-, -C(=O)-NH-, -NH-, etc. From the perspective of the simplicity of preparation of ligand-containing semiconductor particles, the hydrocarbon group usually does not contain heteroatoms in most cases.

[0097] The organic ligand represented by Y-Z is preferably a saturated fatty acid having 5 to 12 carbon atoms or an unsaturated fatty acid having 5 to 12 carbon atoms.

[0098] The group Z may contain a polar group. Specific examples of the polar group are given in the above description of the polar group Y. In order to facilitate the preparation of the ligand-containing semiconductor particles, the group Z usually does not contain a polar group in most cases.

[0099] As specific examples of organic ligands having a carboxyl group as the polar group Y, in addition to formic acid, acetic acid, and propionic acid, saturated or unsaturated fatty acids can be cited. Specific examples of saturated or unsaturated fatty acids include saturated fatty acids such as butyric acid, valeric acid, caproic acid, caprylic acid, capric acid, lauric acid, myristic acid, pentadecanoic acid, palmitic acid, pearlic acid, stearate, arachidic acid, behenic acid, and lignoceric acid; monounsaturated fatty acids such as myristoleic acid, palmitoleic acid, oleic acid, eicosenoic acid, erucic acid, and nervonic acid; polyunsaturated fatty acids such as linoleic acid, α-linolenic acid, γ-linolenic acid, octadecatetraenoic acid, dihomo-γ-linolenic acid, arachidonic acid, eicosatetraenoic acid, docosadienoic acid, and adrenic acid (docosatetraenoic acid).

[0100] Specific examples of the organic ligand having a thiol group or an amino group as the polar group Y include organic ligands in which the carboxyl group of the organic ligand having a carboxyl group as the polar group Y exemplified above is substituted with a thiol group or an amino group.

[0101] The content of the semiconductor particles (A) is preferably 10% by mass or more, more preferably 16% by mass or more, further preferably 17% by mass or more, further preferably 18% by mass or more, particularly preferably 20% by mass or more, and most preferably 25% by mass or more, and preferably 45% by mass or less, more preferably 40% by mass or less, and further preferably 35% by mass or less, relative to the total amount of the photosensitive composition. When the content of the semiconductor particles (A) is within the above range, sufficient light conversion efficiency is obtained in the cured film (wavelength conversion film, etc.).

[0102] <Light scattering agent (B)>

[0103] The photosensitive composition of the present invention preferably contains a light scattering agent (B). By containing the light scattering agent (B), the scattering property of the light from the light source irradiated to the wavelength conversion film formed by the photosensitive composition is improved. As the light scattering agent (B), particles of metal or metal oxide, glass particles, etc. can be mentioned. As the metal oxide, TiO2, SiO2, BaTiO3, ZnO, etc. can be mentioned.

[0104] The volume-based median diameter of the light scattering agent (B) is, for example, 0.03 μm or more, preferably 0.10 μm or more, more preferably 0.15 μm or more, further preferably 0.20 μm or more, and for example, 20 μm or less, preferably 5 μm or less, further preferably 1 μm or less.

[0105] The content of the light scattering agent (B) is usually 0.001% by mass to 50% by mass, preferably 0.01% by mass or more, more preferably 0.1% by mass or more, further preferably 1% by mass or more, and preferably 30% by mass or less, more preferably 15% by mass or less, further preferably 10% by mass or less, relative to the total amount of the photosensitive composition.

[0106] <Photopolymerizable compound (C)>

[0107] As the photopolymerizable compound (C), there can be mentioned a photoradical polymerizable compound that is cured by a free radical polymerization reaction by irradiation with light, and a photocationic polymerizable compound that is cured by a cationic polymerization reaction by irradiation with light. As the photopolymerizable compound (C), a photoradical polymerizable compound is preferred. The weight average molecular weight of the photopolymerizable compound (C) is preferably 3000 or less.

[0108] As the photo-radical polymerizable compound, there can be mentioned compounds having polymerizable ethylenically unsaturated bonds, and among them, (meth)acrylate compounds are preferred. As the (meth)acrylate compound, there can be mentioned monofunctional (meth)acrylate monomers having one (meth)acryloyloxy group in the molecule, difunctional (meth)acrylate monomers having two (meth)acryloyloxy groups in the molecule, and polyfunctional (meth)acrylate monomers having three or more (meth)acryloyloxy groups in the molecule.

[0109] Examples of the monofunctional (meth)acrylate monomer include methyl (meth)acrylate, ethyl (meth)acrylate, propyl (meth)acrylate, butyl (meth)acrylate, pentyl (meth)acrylate, 2-ethylhexyl (meth)acrylate, octyl (meth)acrylate, nonyl (meth)acrylate, dodecyl (meth)acrylate, hexadecyl (meth)acrylate, octadecyl (meth)acrylate, cyclohexyl (meth)acrylate, methoxyethyl (meth)acrylate, butoxyethyl (meth)acrylate, phenoxyethyl (meth)acrylate, nonylphenoxyethyl (meth)acrylate, glycidyl (meth)acrylate, dimethylaminoethyl (meth)acrylate, Diethylaminoethyl (meth)acrylate, isobornyl (meth)acrylate, dicyclopentyl (meth)acrylate, dicyclopentenyl (meth)acrylate, dicyclopentenyloxyethyl (meth)acrylate, 2-hydroxy-3-phenoxypropyl (meth)acrylate, tetrahydrofurfuryl (meth)acrylate, 2-hydroxyethyl (meth)acrylate, benzyl (meth)acrylate, phenyl (meth)acrylate, mono(2-acryloyloxyethyl) succinate, N-[2-(acryloyloxy)ethyl]phthalimide, N-[2-(acryloyloxy)ethyl]tetrahydrophthalimide, 2-(2-vinyloxyethoxy)ethyl (meth)acrylate, ω-carboxy-polycaprolactone monoacrylate, and the like.

[0110] Examples of the difunctional (meth)acrylate monomer include 1,3-butylene glycol di(meth)acrylate, 1,4-butylene glycol di(meth)acrylate, 1,5-pentanediol di(meth)acrylate, 3-methyl-1,5-pentanediol di(meth)acrylate, 1,6-hexanediol di(meth)acrylate, neopentyl glycol di(meth)acrylate, 1,8-octanediol di(meth)acrylate, 1,9-nonanediol di(meth)acrylate, tricyclodecane dimethanol di(meth)acrylate, ethylene glycol di(meth)acrylate, polyethylene glycol di(meth)acrylate, propylene glycol di(meth)acrylate, dipropylene glycol di(meth)acrylate, tripropylene glycol di(meth)acrylate, polypropylene glycol di(meth)acrylate, neopentyl glycol hydroxypivalate di(meth)acrylate, tri(2-hydroxybutyric acid)acrylate, and polypropylene glycol di(meth)acrylate. The invention also includes a di(meth)acrylate in which two hydroxyl groups of 1,2-diol (2-hydroxyl group of 1-hydroxyethyl)isocyanurate are replaced by (meth)acryloyloxy groups, a di(meth)acrylate in which two hydroxyl groups of a diol obtained by adding 4 mol or more of ethylene oxide or propylene oxide to 1 mol of neopentyl glycol are replaced by (meth)acryloyloxy groups, a di(meth)acrylate in which two hydroxyl groups of a diol obtained by adding 2 mol of ethylene oxide or propylene oxide to 1 mol of bisphenol A are replaced by (meth)acryloyloxy groups, a di(meth)acrylate in which two hydroxyl groups of a triol obtained by adding 3 mol or more of ethylene oxide or propylene oxide to 1 mol of trimethylolpropane are replaced by (meth)acryloyloxy groups, and a di(meth)acrylate in which two hydroxyl groups of a diol obtained by adding 4 mol or more of ethylene oxide or propylene oxide to 1 mol of bisphenol A are replaced by (meth)acryloyloxy groups.

[0111] Examples of the multifunctional (meth)acrylate monomer include glycerol tri(meth)acrylate, trimethylolpropane tri(meth)acrylate, pentaerythritol tri(meth)acrylate, pentaerythritol tetra(meth)acrylate, dipentaerythritol penta(meth)acrylate, dipentaerythritol hexa(meth)acrylate, tripentaerythritol octa(meth)acrylate, tripentaerythritol hepta(meth)acrylate, tetrapentaerythritol deca(meth)acrylate, tetrapentaerythritol nona(meth)acrylate, tri(2-methylol ... hepta(meth)acrylate, -(meth)acryloyloxyethyl) isocyanurate, ethylene glycol modified pentaerythritol tetra(meth)acrylate, ethylene glycol modified dipentaerythritol hexa(meth)acrylate, propylene glycol modified pentaerythritol tetra(meth)acrylate, propylene glycol modified dipentaerythritol hexa(meth)acrylate, caprolactone modified pentaerythritol tetra(meth)acrylate, caprolactone modified dipentaerythritol hexa(meth)acrylate, pentaerythritol triacrylate succinic acid monoester, dipentaerythritol pentaacrylate succinic acid monoester, and the like.

[0112] Examples of photocationically polymerizable compounds include compounds having at least one oxetane ring (four-membered cyclic ether) in the molecule (hereinafter sometimes referred to as “oxetane compounds”), compounds having at least one oxirane ring (three-membered cyclic ether) in the molecule (hereinafter sometimes referred to as “epoxy compounds”), and vinyl ether compounds.

[0113] Examples of the oxetane compound include 3-ethyl-3-hydroxymethyloxetane, 1,4-bis[(3-ethyl-3-oxetanyl)methoxymethyl]benzene, 3-ethyl-3-(phenoxymethyl)oxetane, di[(3-ethyl-3-oxetanyl)methyl]ether, 3-ethyl-3-(2-ethylhexyloxymethyl)oxetane, and phenol novolac oxetane. These oxetane compounds are easily commercially available, and examples of commercially available products include trade names such as "Aron Oxetane (registered trademark) OXT-101", "Aron Oxetane (registered trademark) OXT-121", "Aron Oxetane (registered trademark) OXT-211", "Aron Oxetane (registered trademark) OXT-221", and "Aron Oxetane (registered trademark) OXT-212", all of which are sold by Toagosei Co., Ltd.

[0114] Examples of the epoxy compound include aromatic epoxy compounds, glycidyl ethers of polyols having an alicyclic ring, aliphatic epoxy compounds, and alicyclic epoxy compounds.

[0115] Examples of the aromatic epoxy compound include bisphenol-type epoxy resins such as diglycidyl ether of bisphenol A, diglycidyl ether of bisphenol F, and diglycidyl ether of bisphenol S; novolac-type epoxy resins such as phenol novolac epoxy resins, cresol novolac epoxy resins, and hydroxybenzaldehyde phenol novolac epoxy resins; and multifunctional epoxy resins such as glycidyl ether of tetrahydroxyphenylmethane, glycidyl ether of tetrahydroxybenzophenone, and epoxidized polyvinylphenol.

[0116] As the glycidyl ether of the polyol having an alicyclic ring, there can be mentioned compounds obtained by glycidyl etherification of a core hydrogenated polyol obtained by selectively hydrogenating the aromatic ring of an aromatic polyol in the presence of a catalyst under pressure. As the aromatic polyol, there can be mentioned bisphenol-type compounds such as bisphenol A, bisphenol F, and bisphenol S; novolac-type resins such as phenol novolac resins, cresol novolac resins, and hydroxybenzaldehyde phenol novolac resins; and polyfunctional compounds such as tetrahydroxydiphenylmethane, tetrahydroxybenzophenone, and polyvinylphenol. Glycidyl ethers can be prepared by reacting the alicyclic polyol obtained by hydrogenating the aromatic ring of these aromatic polyols with epichlorohydrin. As a preferred substance among the glycidyl ethers of the polyol having an alicyclic ring, diglycidyl ether of hydrogenated bisphenol A can be mentioned.

[0117] Examples of the aliphatic epoxy compound include polyglycidyl ethers of aliphatic polyols or alkylene oxide adducts thereof. Specifically, examples include diglycidyl ether of 1,4-butanediol; diglycidyl ether of 1,6-hexanediol; triglycidyl ether of glycerol; triglycidyl ether of trimethylolpropane; diglycidyl ether of polyethylene glycol; diglycidyl ether of propylene glycol; diglycidyl ether of neopentyl glycol; polyglycidyl ethers of polyether polyols obtained by adding one or more alkylene oxides (ethylene oxide, propylene oxide) to an aliphatic polyol such as ethylene glycol, propylene glycol or glycerol; and the like.

[0118] The alicyclic epoxy compound is a compound having at least one structure forming an oxirane ring together with carbon atoms of an alicyclic ring in the molecule, and “Celloxide” series and “Cyclomer” series (all manufactured by Daicel Co., Ltd.), “Cyracure UVR” series (manufactured by The Dow Chemical Company), and the like can be used.

[0119] Examples of the vinyl ether compound include 2-hydroxyethyl vinyl ether, triethylene glycol vinyl monoether, tetraethylene glycol divinyl ether, and trimethylolpropane trivinyl ether.

[0120] The photopolymerizable compound (C) preferably contains a (meth)acrylate compound (C1) having a molecular weight of 180 or less (hereinafter, sometimes referred to as "compound (C1)"). The compound (C1) is not particularly limited as long as it is a compound having a molecular weight of 180 or less and having a (meth)acryloyloxy group. By including the compound (C1) in the photosensitive composition, the viscosity of the composition can be reduced and the coating properties can be further improved.

[0121] Examples of the compound (C1) include a monofunctional (meth)acrylate monomer having one (meth)acryloyloxy group in the molecule and a molecular weight of 180 or less, and a difunctional (meth)acrylate monomer having two (meth)acryloyloxy groups in the molecule and a molecular weight of 180 or less. From the viewpoint of reducing the viscosity, a monofunctional (meth)acrylate monomer having a molecular weight of 180 or less is preferred.

[0122] As the monofunctional (meth)acrylate monomer having a molecular weight of 180 or less, for example, there can be mentioned compounds having a molecular weight of 180 or less among the compounds described as the above monofunctional (meth)acrylate monomers. As the monofunctional (meth)acrylate monomer having a molecular weight of 180 or less, it is preferably at least one compound selected from the group consisting of (meth)acrylate alkyl esters having a molecular weight of 180 or less, (meth)acrylate aryl esters having a molecular weight of 180 or less, and (meth)acrylate arylalkyl esters having a molecular weight of 180 or less.

[0123] Examples of the alkyl (meth)acrylate include methyl (meth)acrylate, ethyl (meth)acrylate, propyl (meth)acrylate, butyl (meth)acrylate, pentyl (meth)acrylate, and hexyl (meth)acrylate.

[0124] Examples of the aryl (meth)acrylate include phenyl (meth)acrylate and the like.

[0125] Examples of the aralkyl (meth)acrylate include benzyl (meth)acrylate and the like.

[0126] As long as the molecular weight of the compound does not exceed 180, the hydrogen atoms of the alkyl group in the above-mentioned alkyl (meth)acrylate, the hydrogen atoms of the aryl group in the above-mentioned aryl (meth)acrylate, and the hydrogen atoms of the aralkyl group in the above-mentioned aralkyl (meth)acrylate may be substituted with hydroxyl, amino, alkoxy (preferably C 1-4 alkoxy) etc., but is preferably unsubstituted.

[0127] As compound (C1), an alkyl (meth)acrylate having a molecular weight of 180 or less is preferred, and (meth)acrylate C is more preferred. 1-4 The alkyl ester is particularly preferably ethyl (meth)acrylate.

[0128] The molecular weight of the compound (C1) is preferably 160 or less, more preferably 150 or less, further preferably 140 or less, and for example, 86 or more.

[0129] The viscosity of the compound (C1) at 25°C is preferably 2.5 cP or less, more preferably 2.0 cP or less, further preferably 1.2 cP or less, particularly preferably 1.0 cP or less, most preferably 0.8 cP or less, and for example, 0.1 cP or more.

[0130] When the photopolymerizable compound (C) contains compound (C1), its content is preferably 5 mass % or more, more preferably 15 mass % or more, further preferably 25 mass % or more, particularly preferably 30 mass % or more, and is preferably 75 mass % or less, more preferably 60 mass % or less, further preferably 55 mass % or less, and particularly preferably 50 mass % or less, relative to the total amount of the photopolymerizable compound (C).

[0131] When the photopolymerizable compound (C) contains the compound (C1), its content is preferably 5% by mass or more, more preferably 8% by mass or more, further preferably 10% by mass or more, particularly preferably 13% by mass or more, and most preferably 17% by mass or more, relative to the total amount of the photosensitive composition. In addition, it is preferably 50% by mass or less, more preferably 40% by mass or less, and further preferably 30% by mass or less.

[0132] Preferably, the photopolymerizable compound (C) contains a compound (C2) having a vinyl ether group and a (meth) acryloyl group (preferably a (meth) acryloyloxy group) in the same molecule (hereinafter, sometimes referred to as "compound (C2)"). By including the compound (C2) in the photosensitive composition, the aggregation of semiconductor particles can be suppressed, and the dispersibility of the semiconductor particles is improved, and as a result, the light conversion efficiency of the cured film obtained from the photosensitive composition is further improved. In addition, by including the compound (C2) in the photosensitive composition, the viscosity of the photosensitive composition can be reduced, and the coating property is further improved.

[0133] The number of vinyl ether groups contained in the compound (C2) is preferably 1 to 4, more preferably 1 to 2, and particularly preferably 1.

[0134] The number of (meth)acryloyl groups in the compound (C2) is preferably 1 to 4, more preferably 1 to 2, and particularly preferably 1.

[0135] Examples of the compound (C2) include 2-vinyloxyethyl (meth)acrylate, 3-vinyloxypropyl (meth)acrylate, 2-vinyloxypropyl (meth)acrylate, 1-vinyloxypropyl (meth)acrylate, 1-methyl-2-vinyloxyethyl (meth)acrylate, 4-vinyloxybutyl (meth)acrylate, 3-vinyloxybutyl (meth)acrylate, 2-vinyloxybutyl (meth)acrylate, 1-methyl-3-vinyloxypropyl (meth)acrylate, 2-methyl-3-vinyloxypropyl (meth)acrylate, 1-methyl-2-vinyloxypropyl (meth)acrylate, 1,1-dimethyl-2-vinyloxyethyl ester, 6-vinyloxyhexyl (meth)acrylate, 4-vinyloxycyclohexyl (meth)acrylate, (4-vinyloxymethylcyclohexyl)methyl (meth)acrylate, (3-vinyloxymethylcyclohexyl)methyl (meth)acrylate, (2-vinyloxymethylcyclohexyl)methyl (meth)acrylate, (4-vinyloxymethylphenyl)methyl (meth)acrylate, (3-vinyloxymethylphenyl)methyl (meth)acrylate, 2-vinyloxymethylphenyl methyl (meth)acrylate, 2-(2-vinyloxymethyl)methacrylate isopropoxy)ethyl (meth)acrylate, 2-(2-vinyloxyethoxy)ethyl (meth)acrylate, 2-(2-vinyloxyethoxy)propyl (meth)acrylate, 2-(2-vinyloxyisopropoxy)propyl (meth)acrylate, 2-(2-vinyloxyethoxy)isopropyl (meth)acrylate, 2-(2-vinyloxyisopropoxy)isopropyl (meth)acrylate, 2-{2-(2-vinyloxyethoxy)ethoxy}ethyl (meth)acrylate, 2-{2-(2-vinyloxyisopropoxy)ethoxy}ethyl (meth)acrylate, 2- {2-(2-vinyloxyisopropoxy)isopropoxy}ethyl, 2-{2-(2-vinyloxyethoxy)ethoxy}propyl (meth)acrylate, 2-{2-(2-vinyloxyethoxy)isopropoxy}propyl (meth)acrylate, 2-{2-(2-vinyloxyisopropoxy)ethoxy}propyl (meth)acrylate, 2-{2-(2-vinyloxyisopropoxy)isopropoxy}propyl (meth)acrylate, 2-{2-(2-vinyloxyethoxy)ethoxy}isopropyl (meth)acrylate, 2-{2-(2-vinyloxyisopropoxy)isopropoxy}propyl (meth)acrylate, 2-{2-(2-vinyloxyethoxy)ethoxy}isopropyl (meth)acrylate, 2-{2-(2-vinyloxyethoxy)ethoxy}isopropyl (meth)acrylate 2-{2-(2-vinyloxyisopropoxy)ethoxy}isopropyl (meth)acrylate, 2-{2-(2-vinyloxyisopropoxy)ethoxy}isopropyl (meth)acrylate, 2-[2-{2-(2-vinyloxyethoxy)ethoxy}ethoxy]ethyl (meth)acrylate, 2-[2-{2-(2-vinyloxyisopropoxy)ethoxy}ethoxy]ethyl (meth)acrylate, 2-(2-[2-{2-(2-vinyloxyethoxy)ethoxy}ethoxy]ethoxy)ethyl (meth)acrylate, etc.

[0136] As compound (C2), vinyl (meth)acrylate C 1-6 Alkyl ester or (meth) acrylic acid (vinyloxy C 1-4 Alkoxy)C 1-4 Alkyl esters, more preferably (meth) acrylic acid (ethyleneoxy C 1-4 Alkoxy)C 1-4 The alkyl ester is particularly preferably 2-(2-vinyloxyethoxy)ethyl (meth)acrylate.

[0137] When the photopolymerizable compound (C) contains compound (C2), its content is preferably 5 mass % or more, more preferably 10 mass % or more, further preferably 20 mass % or more, relative to the total amount of the photopolymerizable compound (C), and is preferably 85 mass % or less, more preferably 75 mass % or less, further preferably 60 mass % or less, particularly preferably 50 mass % or less, and most preferably 40 mass % or less.

[0138] When the photopolymerizable compound (C) contains the compound (C2), its content is preferably 3% by mass or more, more preferably 5% by mass or more, and further preferably 8% by mass or more, relative to the total amount of the photosensitive composition, and is preferably 50% by mass or less, more preferably 35% by mass or less, and further preferably 25% by mass or less.

[0139] It is preferred that the photopolymerizable compound (C) contains a compound (C3) having a carboxyl group and three or more functional groups other than the carboxyl group in the same molecule (hereinafter, sometimes referred to as "compound (C3)"). By including the compound (C3) in the photosensitive composition, the aggregation of the semiconductor particles can be suppressed, and the dispersibility of the semiconductor particles is improved. As a result, the light conversion efficiency of the cured film obtained from the photosensitive composition is further improved. In addition, by including the compound (C3) in the photosensitive composition, the curability of the photosensitive composition is improved. In addition, by including the compound (C3) in the photosensitive composition, the heat resistance of the photosensitive composition is further improved. In particular, by including the compound (C3) in the photosensitive composition and a stabilizer (E) of 8% by mass or more relative to the total amount of the photosensitive composition, the heat resistance of the photosensitive composition is further improved.

[0140] Examples of the functional group include (meth)acryloyloxy, epoxy, and oxetanyl groups, among which (meth)acryloyloxy is preferred. The number of functional groups contained in one molecule of compound (C3) is preferably 3 to 5, more preferably 3. The number of carboxyl groups contained in one molecule of compound (C3) is preferably 1.

[0141] As compound (C3), compounds obtained by esterifying a compound having three or more functional groups (particularly (meth)acryloyloxy) and a hydroxyl group, such as pentaerythritol tri(meth)acrylate or dipentaerythritol penta(meth)acrylate, with a dicarboxylic acid. Specifically, for example, compounds obtained by monoesterifying pentaerythritol tri(meth)acrylate with succinic acid, compounds obtained by monoesterifying dipentaerythritol penta(meth)acrylate with succinic acid, compounds obtained by monoesterifying pentaerythritol tri(meth)acrylate with maleic acid, compounds obtained by monoesterifying dipentaerythritol penta(meth)acrylate with maleic acid, etc. can be mentioned. Among them, compounds obtained by monoesterifying pentaerythritol tri(meth)acrylate with succinic acid are preferred.

[0142] When the photopolymerizable compound (C) contains compound (C3), its content is preferably 5 mass % or more, more preferably 10 mass % or more, further preferably 20 mass % or more, relative to the total amount of the photopolymerizable compound (C), and is preferably 70 mass % or less, more preferably 60 mass % or less, further preferably 50 mass % or less, and particularly preferably 40 mass % or less.

[0143] In addition, when the photopolymerizable compound (C) contains the compound (C3), its content is preferably 20 parts by mass or more, more preferably 25 parts by mass or more, further preferably 30 parts by mass or more, and particularly preferably 40 parts by mass or more, and is preferably 110 parts by mass or less, more preferably 100 parts by mass or less, further preferably 85 parts by mass or less, and particularly preferably 70 parts by mass or less, relative to 100 parts by mass of the semiconductor particles (A).

[0144] The photopolymerizable compound (C) preferably contains at least one compound selected from the group consisting of compound (C1), compound (C2) and compound (C3), more preferably contains at least compound (C3), further preferably contains a combination of compound (C3) and compound (C2) or a combination of compound (C3) and compound (C1), and particularly preferably contains all of compound (C1), compound (C2) and compound (C3).

[0145] When the photopolymerizable compound (C) contains compound (C1) and compound (C3), the content of compound (C1) relative to 1 part by mass of compound (C3) is preferably 0.5 parts by mass or more, more preferably 0.8 parts by mass or more, and further preferably 1.0 parts by mass or more, and is preferably 5 parts by mass or less, more preferably 4 parts by mass or less, and further preferably 3 parts by mass or less.

[0146] When the photopolymerizable compound (C) contains compound (C2) and compound (C3), the content of compound (C2) relative to 1 part by mass of compound (C3) is preferably 0.3 parts by mass or more, more preferably 0.5 parts by mass or more, and further preferably 0.8 parts by mass or more, and is preferably 5 parts by mass or less, more preferably 3 parts by mass or less, and further preferably 1.5 parts by mass or less.

[0147] When the photopolymerizable compound (C) contains compound (C1), compound (C2) and compound (C3), the total amount of compound (C1) and compound (C2) relative to 1 part by mass of compound (C3) is preferably 0.5 parts by mass or more, more preferably 1.0 parts by mass or more, and further preferably 1.5 parts by mass or more, and is preferably 5 parts by mass or less, more preferably 4 parts by mass or less, and further preferably 3 parts by mass or less.

[0148] The total amount of compound (C1), compound (C2) and compound (C3) is preferably 30% by mass or more, more preferably 50% by mass or more, further preferably 70% by mass or more, particularly preferably 90% by mass or more, and may also be 100% by mass, relative to the total amount of the photopolymerizable compound (C).

[0149] In particular, when the photopolymerizable compound (C) contains compound (C1) and compound (C3), the total amount of compound (C1) and compound (C3) is preferably 30% by mass or more, more preferably 40% by mass or more, further preferably 60% by mass or more, particularly preferably 70% by mass or more, and may also be 100% by mass, relative to the total amount of the photopolymerizable compound (C).

[0150] In addition, when the photopolymerizable compound (C) contains compound (C2) and compound (C3), the total amount of compound (C2) and compound (C3) relative to the total amount of the photopolymerizable compound (C) is preferably 30% by mass or more, more preferably 40% by mass or more, further preferably 50% by mass or more, particularly preferably 60% by mass or more, and can also be 100% by mass, preferably 90% by mass or less, more preferably 80% by mass or less.

[0151] The content of the photopolymerizable compound (C) is preferably 10% by mass or more, more preferably 20% by mass or more, further preferably 30% by mass or more, particularly preferably 40% by mass or more, and is preferably 80% by mass or less, more preferably 70% by mass or less, further preferably 65% ​​by mass or less, and particularly preferably 60% by mass or less, relative to the total amount of the photosensitive composition.

[0152] <Photopolymerization initiator (D)>

[0153] The photopolymerization initiator (D) is not particularly limited as long as it is a compound that can generate active radicals, acids, etc. under the action of light to initiate polymerization, and a known photopolymerization initiator can be used.

[0154] Examples of the photopolymerization initiator (D) include oxime compounds such as O-acyl oxime compounds, alkylphenone compounds, biimidazole compounds, triazine compounds, and acylphosphine oxide compounds.

[0155] The O-acyl oxime compound is a compound having a structure represented by the following formula (d).

[0156]

[0157] Examples of such O-acyl oxime compounds include N-benzoyloxy-1-(4-phenylthiophenyl)butane-1-one-2-imine, N-benzoyloxy-1-(4-phenylthiophenyl)octane-1-one-2-imine, N-benzoyloxy-1-(4-phenylthiophenyl)-3-cyclopentylpropane-1-one-2-imine, N-acetoxy-1-[9-ethyl-6-(2-methylbenzoyl)-9H-carbazole-3-yl]ethane-1-imine, N-acetoxy-1-[9-ethyl-6-{2-methyl-4-(3,3-dimethyl-2,4-dioxolanylmethoxy)benzoyl}-9H-carbazole-3-

[0013] N-acetoxy-1-[4-(2-hydroxyethoxy)phenylthiophenyl]propane-1-one-2-imine, N-acetoxy-1-[4-(1-methyl-2-methoxyethoxy)-2-methylphenyl]-1-(9-ethyl-6-nitro-9H-carbazole-3-yl)methane-1-imine, and the like. Commercially available products such as Irgacure (registered trademark) OXE01, Irgacure OXE02, Irgacure OXE03 (all manufactured by BASF), N-1919, NCI-930, NCI-831 (all manufactured by ADEKA) may also be used. These O-acyl oxime compounds are advantageous in that they can improve lithographic performance.

[0158] The alkylphenone compound is a compound having a partial structure represented by the following formula (d4) or a partial structure represented by the following formula (d5). In these partial structures, the benzene ring may have a substituent.

[0159]

[0160] Examples of the compound having a structure represented by formula (d4) include 2-methyl-2-morpholino-1-(4-methylthiophenyl)propane-1-one, 2-dimethylamino-1-(4-morpholinophenyl)-2-benzylbutane-1-one, and 2-(dimethylamino)-2-[(4-methylphenyl)methyl]-1-[4-(4-morpholino)phenyl]butane-1-one. Commercially available products such as OMNIRAD (registered trademark) 369, OMNIRAD 907, and OMNIRAD 379 (all manufactured by IGM Resins) can also be used.

[0161] Examples of the compound having a structure represented by formula (d5) include 2-hydroxy-2-methyl-1-phenylpropane-1-one, 2-hydroxy-2-methyl-1-[4-(2-hydroxyethoxy)phenyl]propane-1-one, 1-hydroxycyclohexyl phenyl ketone, oligomers of 2-hydroxy-2-methyl-1-(4-isopropenylphenyl)propane-1-one, α,α-diethoxyacetophenone, and benzil dimethyl ketal.

[0162] In terms of sensitivity, the alkylphenone compound is preferably a compound having a structure represented by formula (d4).

[0163] Examples of the biimidazole compound include 2,2'-bis(2-chlorophenyl)-4,4',5,5'-tetraphenylbiimidazole, 2,2'-bis(2,3-dichlorophenyl)-4,4',5,5'-tetraphenylbiimidazole (see, for example, Japanese Patent Application Laid-Open Nos. 6-75372 and 6-75373), 2,2'-bis(2-chlorophenyl)-4,4',5,5'-tetraphenylbiimidazole, 2,2'-bis(2-chlorophenyl)-4,4',5,5'-tetraphenylbiimidazole, phenyl) biimidazole, 2,2'-bis(2-chlorophenyl)-4,4',5,5'-tetrakis(dialkoxyphenyl)biimidazole, 2,2'-bis(2-chlorophenyl)-4,4',5,5'-tetrakis(trialkoxyphenyl)biimidazole (for example, see Japanese Patent Publication No. 48-38403, Japanese Patent Application Laid-Open No. 62-174204, etc.), imidazole compounds in which the phenyl groups at the 4,4',5,5'-positions are substituted with carboalkoxy groups (for example, see Japanese Patent Application Laid-Open No. 7-10913, etc.). Among them, the compounds represented by the following formula or mixtures thereof are preferred.

[0164]

[0165] Examples of the triazine compound include 2,4-bis(trichloromethyl)-6-(4-methoxyphenyl)-1,3,5-triazine, 2,4-bis(trichloromethyl)-6-(4-methoxynaphthyl)-1,3,5-triazine, 2,4-bis(trichloromethyl)-6-piperonyl-1,3,5-triazine, 2,4-bis(trichloromethyl)-6-(4-methoxyphenyl)-1,3,5-triazine, and 2,4-bis(trichloromethyl)-6-[2- [(5-methylfuran-2-yl)vinyl]-1,3,5-triazine, 2,4-bis(trichloromethyl)-6-[2-(furan-2-yl)vinyl]-1,3,5-triazine, 2,4-bis(trichloromethyl)-6-[2-(4-diethylamino-2-methylphenyl)vinyl]-1,3,5-triazine, 2,4-bis(trichloromethyl)-6-[2-(3,4-dimethoxyphenyl)vinyl]-1,3,5-triazine, and the like.

[0166] Examples of the acylphosphine oxide compound include (2,4,6-trimethylbenzoyl)diphenylphosphine oxide and the like.

[0167] In addition, examples of the photopolymerization initiator (D) include benzoin compounds such as benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether, and benzoin isobutyl ether; benzophenone compounds such as benzophenone, methyl o-benzoylbenzoate, 4-phenylbenzophenone, 4-benzoyl-4'-methyldiphenyl sulfide, 3,3',4,4'-tetra(tert-butylperoxycarbonyl)benzophenone, and 2,4,6-trimethylbenzophenone; quinone compounds such as 9,10-phenanthrenequinone, 2-ethylanthraquinone, and camphorquinone; 10-butyl-2-chloroacridone, benzil, methyl benzoylformate, and titanocene compounds, etc. These are preferably used in combination with polymerization initiation aids such as amine compounds, alkoxyanthracene compounds, thioxanthone compounds, and carboxylic acid compounds.

[0168] The photopolymerization initiator (D) is preferably a photopolymerization initiator containing at least one selected from an alkylphenone compound, a triazine compound, an acylphosphine oxide compound, an O-acyloxime compound and a biimidazole compound. From the viewpoint of sensitivity, a photopolymerization initiator containing an alkylphenone compound is more preferred.

[0169] The content of the photopolymerization initiator (D) is preferably 3% by mass or more, more preferably 4% by mass or more, relative to the total amount of the photosensitive composition, and is preferably 40% by mass or less, more preferably 30% by mass or less, and may be 20% by mass or less, or 15% by mass or less.

[0170] The content of the photopolymerization initiator (D) is preferably 3 parts by mass or more, more preferably 8 parts by mass or more, and preferably 70 parts by mass or less, more preferably 55 parts by mass or less, further preferably 30 parts by mass or less, and may be 20 parts by mass or less, relative to 100 parts by mass of the photopolymerizable compound (C). When the content of the photopolymerization initiator (D) is within the above range, there is a tendency for high sensitivity to shorten the exposure time, and therefore there is a tendency for the productivity of cured films such as wavelength conversion films to increase.

[0171] In addition, the content of the photopolymerization initiator (D) is preferably 40 parts by mass or less, more preferably 30 parts by mass or less, and further preferably 25 parts by mass or less relative to 100 parts by mass of the photopolymerizable compound (C). When the content of the photopolymerization initiator (D) is within the above range, a photosensitive composition having a further reduced viscosity can be provided.

[0172] In addition, it is also preferred that the content of the photopolymerization initiator (D) is, for example, 15 to 40 parts by mass, more preferably 15 to 30 parts by mass, and further preferably 15 to 25 parts by mass relative to 100 parts by mass of the photopolymerizable compound (C). When the content of the photopolymerization initiator (D) is within the above range, a photosensitive composition that can provide a cured film with better heat resistance can be provided.

[0173] <Stabilizer (E)>

[0174] The photosensitive composition of the present invention may further contain a stabilizer (E). The stabilizer (E) is not particularly limited as long as it is a compound having a function of inactivating deterioration factors such as carbon radicals generated by the action of heat, light, etc., peroxy radicals generated by oxidation of the generated carbon radicals, and hydrogen peroxide generated from peroxy radicals. For example, antioxidants, light stabilizers, etc. may be mentioned.

[0175] The antioxidant is not particularly limited as long as it is an antioxidant generally used in industry, and phenol-based antioxidants, phosphorus-based antioxidants, sulfur-based antioxidants, and the like can be used.

[0176] Examples of the phenolic antioxidant include Irganox (registered trademark) 1010 (Irganox 1010: pentaerythritol tetrakis[3-(3,5-di-tert-butyl-4-hydroxyphenyl) propionate, manufactured by BASF Corporation), Irganox 1076 (Irganox 1076: octadecyl-3-(3,5-di-tert-butyl-4-hydroxyphenyl) propionate, manufactured by BASF Corporation), Irganox 1330 (Irganox 1330: 3,3',3",5,5',5"-hexa-tert-butyl-a,a',a"-(mesitylene-2,4,6-triyl)tri-p-cresol, manufactured by BASF Corporation), and Irganox 3114 (Irganox 3114: 1,3,5-tris(3,5-di-tert-butyl-4-hydroxybenzyl)-1,3,5-triazine-2,4,6(1H,3H,5H)-trione, manufactured by BASF Corporation), Irganox 3790 (Irganox 3790: 1,3,5-tris((4-tert-butyl-3-hydroxy-2,6-xylyl)methyl)-1,3,5-triazine-2,4,6(1H,3H,5H)-trione, manufactured by BASF Corporation), Irganox 1035 (Irganox 1035: thiodiethylene bis[3-(3,5-di-tert-butyl-4-hydroxyphenyl)propionate], manufactured by BASF Corporation), Irganox 1135 (Irganox 1135: Phenylpropane acid, 3,5-bis(1,1-dimethylethyl)-4-hydroxy, C7-C9 side chain alkyl ester, manufactured by BASF Corporation), Irganox 1520L (Irganox 1520L: 4,6-bis(octylthiomethyl)-o-cresol, manufactured by BASF Corporation), Irganox 3125 (Irganox 3125, manufactured by BASF Corporation), Irganox 565 (Irganox 565: 2,4-bis(n-octylthio)-6-(4-hydroxy 3',5'-di-tert-butylanilino)-1,3,5-triazine, manufactured by BASF Corporation), ADK STAB (registered trademark) AO-80 (ADK STAB AO-80: 3,9-bis(2-(3-(3-tert-butyl-4-hydroxy-5-methylphenyl)propionyloxy)-1,1-dimethylethyl)-2,4,8,10-tetraoxaspiro(5,5)undecane, manufactured by ADEKA Corporation), Sumilizer (registered trademark) BHT, Sumilizer GA-80, Sumilizer GS (all manufactured by Sumitomo Chemical Co., Ltd.), Cyanox (registered trademark) 1790 (Cyanox 1790, manufactured by Sitech Corporation), and vitamin E (manufactured by Eisai Corporation), etc.

[0177] As the phenolic antioxidant, an antioxidant having a hindered phenol structure in which a bulky organic group is bonded to at least one ortho position of the phenolic hydroxyl group is preferred. As the bulky organic group, a secondary or tertiary alkyl group is preferred, and specifically, isopropyl, sec-butyl, tert-butyl, sec-pentyl, tert-pentyl, etc. can be cited. Among them, a tertiary alkyl group is preferred, and a tert-butyl or tert-pentyl group is particularly preferred.

[0178] Examples of the phosphorus antioxidant include Irgafos (registered trademark) 168 (Irgafos 168: tris(2,4-di-tert-butylphenyl)phosphite, manufactured by BASF Corporation), Irgafos 12 (Irgafos 12: tris[2-[[2,4,8,10-tetra-tert-butyldibenzo[d,f][1,3,2]dioxaphosphin-6-yl]oxy]ethyl]amine, manufactured by BASF Corporation), Irgafos 38 (Irgafos 38: bis(2,4-bis(1,1-dimethylethyl)-6-methylphenyl)ethyl phosphite, manufactured by BASF Corporation), ADK STAB (registered trademark) 329K, ADK STAB PEP36, and ADK STAB PEP-8 (all manufactured by ADEKA Corporation), and Sandstab P-EPQ (manufactured by Clariant), Weston (registered trademark) 618, Weston 619G (all manufactured by GE), Ultranox 626 (manufactured by GE), and Sumilizer (registered trademark) GP (6-[3-(3-tert-butyl-4-hydroxy-5-methylphenyl)propoxy]-2,4,8,10-tetra-tert-butyldibenzo[d,f][1.3.2]dioxaphosphapin) (manufactured by Sumitomo Chemical Co., Ltd.), etc.

[0179] As the phosphorus-based antioxidant, an antioxidant having a group represented by the following formula (e1) is preferred.

[0180]

[0181] [In formula (e1), R e1 ~R e5 Each independently represents a hydrogen atom or an alkyl group, and * represents a bonding site.]

[0182] R e1 It is preferably a hydrogen atom or an alkyl group having 1 to 4 carbon atoms, and more preferably a hydrogen atom, a methyl group, an ethyl group or a tert-butyl group.

[0183] R e2 and R e4 It is preferably a methyl group or a hydrogen atom, and more preferably a hydrogen atom.

[0184] R e5 and R e3Each independently is preferably an alkyl group, more preferably a secondary or tertiary alkyl group, further preferably a tert-butyl group or a tert-pentyl group.

[0185] The two units enclosed in brackets can be represented by R e1 Bonded to each other to form a ring. e1 Bonding to each other means from R e1 The way in which the groups after removing the hydrogen atoms are bonded to each other, for example, in two R e1 When all of them are hydrogen atoms, it refers to R e1 The carbon atom is bonded to the R e1 Bonded The way carbon atoms are directly bonded to each other.

[0186] Examples of the sulfur-based antioxidant include dialkyl thiodipropionate compounds such as dilauryl thiodipropionate, dimyristyl thiodipropionate, and distearyl thiodipropionate; and β-alkylmercaptopropionate compounds of polyhydric alcohols such as tetrakis[methylene(3-dodecylthio)propionate]methane.

[0187] The light stabilizer is not particularly limited as long as it is a light stabilizer generally used industrially, and for example, a hindered amine-based light stabilizer can be used. Examples of the hindered amine light stabilizer include Adekastab (registered trademark) LA-52, Adekastab LA-57, Adekastab LA-63P, Adekastab LA-68, Adekastab LA-72, Adekastab LA-77Y, Adekastab LA-77G, Adekastab LA-81, Adekastab LA-82, Adekastab LA-87, Adekastab LA-402AF, Adekastab LA-40MP, and Adekastab LA-40Si (all manufactured by ADEKA Corporation), Chimassorb (registered trademark) 944FDL, Chimassorb 2020FDL, and TINUVIN 622SF (all manufactured by BASF Corporation).

[0188] As the stabilizer (E), an antioxidant is preferred, a phenolic antioxidant or a phosphorus antioxidant is more preferred, an antioxidant having at least one of the above-mentioned hindered phenol structure and the group represented by formula (e1) is more preferred, an antioxidant having both the above-mentioned hindered phenol structure and the group represented by formula (e1) is further preferred, and Sumilizer (registered trademark) GP is particularly preferred.

[0189] The content of the stabilizer (E) is, for example, 1% by mass or more, or 2% by mass or more, or, for example, 60% by mass or less, preferably 50% by mass or less, more preferably 40% by mass or less, and further preferably 30% by mass or less, relative to the total amount of the photosensitive composition.

[0190] From the viewpoint of improving heat resistance, the content of the stabilizer (E) is preferably 8% by mass or more, more preferably 9% by mass or more, further preferably 12% by mass or more, and particularly preferably 16% by mass or more, relative to the total amount of the photosensitive composition. In addition, from the viewpoint of reducing viscosity, the content of the stabilizer (E) may be, for example, 60% by mass or less, preferably 50% by mass or less, more preferably 40% by mass or less, further preferably 30% by mass or less, further preferably 20% or less, and particularly preferably 18% by mass or less, relative to the total amount of the photosensitive composition.

[0191] <Solvent (F)>

[0192] The photosensitive composition of the present invention may contain a solvent (F). When the solvent (F) is contained, the content thereof is preferably less. When the photosensitive composition contains a solvent (F), the content thereof is preferably 10% by mass or less, more preferably 5% by mass or less, further preferably 3.5% by mass or less, particularly preferably 3.2% by mass or less relative to the total amount of the photosensitive composition. In addition, the content thereof may be 0% by mass, 0.5% by mass or more, or 1% by mass or more. By reducing the content of the solvent (F), it is easy to control the film thickness when forming a cured film, and it is possible to reduce the manufacturing cost and the load on the global environment and the working environment due to the solvent.

[0193] Examples of the solvent (F) include ester solvents (solvents containing -C(=O)-O-), ether solvents other than ester solvents (solvents containing -O-), ether ester solvents (solvents containing -C(=O)-O- and -O-), ketone solvents other than ester solvents (solvents containing -C(=O)-), alcohol solvents, aromatic hydrocarbon solvents, amide solvents, and dimethyl sulfoxide.

[0194] Examples of the ester solvent include methyl lactate, ethyl lactate, butyl lactate, methyl 2-hydroxyisobutyrate, ethyl acetate, n-butyl acetate, isobutyl acetate, amyl formate, isoamyl acetate, butyl propionate, isopropyl butyrate, ethyl butyrate, butyl butyrate, methyl pyruvate, ethyl pyruvate, propyl pyruvate, methyl acetoacetate, ethyl acetoacetate, and γ-butyrolactone.

[0195] Examples of the ether solvent include ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, ethylene glycol monopropyl ether, ethylene glycol monobutyl ether, diethylene glycol monomethyl ether, diethylene glycol monoethyl ether, diethylene glycol monobutyl ether, propylene glycol monomethyl ether, propylene glycol monoethyl ether, propylene glycol monopropyl ether, propylene glycol monobutyl ether, 3-methoxy-1-butanol, 3-methoxy-3-methylbutanol, tetrahydrofuran, tetrahydropyran, 1,4-dihydrofu ... Alkane, diethylene glycol dimethyl ether, diethylene glycol diethyl ether, diethylene glycol methyl ethyl ether, diethylene glycol dipropyl ether, diethylene glycol dibutyl ether, anisole, phenethyl ether and methyl anisole, etc.

[0196] Examples of the ether ester solvent include methyl methoxyacetate, ethyl methoxyacetate, butyl methoxyacetate, methyl ethoxyacetate, ethyl ethoxyacetate, methyl 3-methoxypropionate, ethyl 3-methoxypropionate, methyl 3-ethoxypropionate, ethyl 3-ethoxypropionate, methyl 2-methoxypropionate, ethyl 2-methoxypropionate, propyl 2-methoxypropionate, methyl 2-ethoxypropionate, ethyl 2-ethoxypropionate, methyl 2-methoxy-2-methylpropionate, ethyl 2-ethoxy-2-methylpropionate, 3-methoxybutyl acetate, 3-methyl-3-methoxybutyl acetate, propylene glycol monomethyl ether acetate, propylene glycol monoethyl ether acetate, propylene glycol monopropyl ether acetate, ethylene glycol monomethyl ether acetate, ethylene glycol monoethyl ether acetate, diethylene glycol monoethyl ether acetate, diethylene glycol monobutyl ether acetate, and dipropylene glycol methyl ether acetate.

[0197] Examples of the ketone solvent include 4-hydroxy-4-methyl-2-pentanone, acetone, 2-butanone, 2-heptanone, 3-heptanone, 4-heptanone, 4-methyl-2-pentanone, cyclopentanone, cyclohexanone, and isophorone.

[0198] Examples of the alcohol solvent include methanol, ethanol, propanol, butanol, hexanol, cyclohexanol, ethylene glycol, propylene glycol, and glycerin.

[0199] Examples of the aromatic hydrocarbon solvent include benzene, toluene, xylene, and mesitylene.

[0200] Examples of the amide solvent include N,N-dimethylformamide, N,N-dimethylacetamide, and N-methylpyrrolidone.

[0201] As the solvent (F), an ester solvent, an ether ester solvent, an alcohol solvent or an amide solvent is preferred, and an ether ester solvent is more preferred.

[0202] <Leveling agent (G)>

[0203] The photosensitive composition of the present invention may further contain a leveling agent (G). Examples of the leveling agent (G) include silicone surfactants, fluorine surfactants, and silicone surfactants having fluorine atoms. These may have a polymerizable group in the side chain.

[0204] Examples of the silicone surfactant include surfactants having a siloxane bond in the molecule, and more specifically, Toray Silicone DC3PA, Toray Silicone SH7PA, Toray Silicone DC11PA, Toray Silicone SH21PA, Toray Silicone SH28PA, Toray Silicone SH29PA, Toray Silicone SH30PA, Toray Silicone SH8400 (trade name: manufactured by Dow Corning Toray Co., Ltd.), KP321, KP322, KP323, KP324, KP326, KP340, KP341 (manufactured by Shin-Etsu Chemical Co., Ltd.), TSF400, TSF401, TSF410, TSF4300, TSF4440, TSF4445, TSF4446, TSF4452, and TSF4460 (manufactured by Momentive Performance Materials Japan Co., Ltd.).

[0205] Examples of the fluorine-based surfactant include surfactants having a fluorine carbon chain in the molecule. Specifically, examples include FLUORAD (registered trademark) FC430, FLUORAD FC431 (manufactured by Sumitomo 3M Co., Ltd.), MEGAFAC (registered trademark) F142D, MEGAFAC F171, MEGAFAC F172, MEGAFAC F173, MEGAFAC F177, MEGAFAC F183, MEGAFAC F554, MEGAFAC R30, MEGAFAC RS-718-K (manufactured by DIC Corporation), F-top (registered trademark) EF301, F-top EF303, F-top EF351, F-top EF352 (manufactured by Mitsubishi Materials Electronic Chemicals Co., Ltd.), Surflon (registered trademark) S381, Surflon S382, Surflon SC101, Surflon SC105 (manufactured by AGC Corporation) and E5844 (manufactured by Daikin Fine Chemicals Laboratories, Ltd.), etc.

[0206] Examples of the organosilicon-based surfactant having a fluorine atom include surfactants having a siloxane bond and a fluorocarbon chain in the molecule, and more specifically, MEGAFAC (registered trademark) R08, MEGAFAC BL20, MEGAFAC F475, MEGAFAC F477, and MEGAFAC F443 (manufactured by DIC Corporation).

[0207] The content of the leveling agent (G) is usually 0.001 to 0.5% by mass, preferably 0.005 to 0.3% by mass, and more preferably 0.01 to 0.2% by mass, based on the total amount of the photosensitive composition.

[0208] The photosensitive composition of the present invention is a photosensitive composition comprising semiconductor particles (A), a photopolymerizable compound (C) and a photopolymerization initiator (D), wherein the photopolymerizable compound (C) comprises a compound (C1) and / or a compound (C2), or comprises a stabilizer (E) in an amount of 8% by mass or more relative to the total amount of the photosensitive composition. The photosensitive composition of the present invention preferably comprises all of the above-mentioned compound (C1), compound (C2) and a stabilizer (E) in an amount greater than a predetermined amount.

[0209] The photosensitive composition can have a low viscosity by including the compound (C1) and / or the compound (C2). In addition, when the photosensitive composition includes the compound (C1) and / or the compound (C2), the heat resistance is sometimes easily reduced, but the reduction in heat resistance can be suppressed by adding a stabilizer (E) in a predetermined amount or more.

[0210] The photosensitive composition preferably further comprises compound (C3). By including compound (C3) in the photosensitive composition, the aggregation of semiconductor particles can be suppressed, the dispersibility of semiconductor particles is improved, and as a result, the light conversion efficiency of the cured film obtained by the photosensitive composition is further improved. It should be noted that when the photosensitive composition includes compound (C3), the photosensitive composition sometimes becomes easy to have high viscosity, but since the photosensitive composition includes compound (C1) and / or compound (C2), the high viscosity is suppressed. In addition, compound (C1) and / or compound (C2) are included to reduce viscosity, so heat resistance sometimes becomes easy to reduce, but as mentioned above, since the stabilizer (E) is contained in a predetermined amount or more, the reduction in heat resistance can be suppressed.

[0211] The content of the semiconductor particles (A) in the photosensitive composition is preferably 16% to 45% by mass relative to the total amount of the photosensitive composition. When the content of the semiconductor particles (A) is within the above range, sufficient light conversion efficiency can be obtained in the cured film.

[0212] The viscosity of the photosensitive composition of the present invention at 40°C is preferably 20 cP or less, more preferably 15 cP or less, and further preferably 10 cP or less. The lower limit is not particularly limited, and may be 2 cP or more, 3 cP or more, or 5 cP or more. By making the viscosity of the photosensitive composition within the above range, the coating property is improved. In particular, by making the viscosity of the photosensitive composition within the above range, the photosensitive composition can be smoothly ejected from the nozzle of an inkjet printer, and can be appropriately used as ink for an inkjet printer.

[0213] When used as ink for inkjet printer, the photosensitive composition of the present invention can be ejected from the nozzle of the inkjet printer at a temperature of 40°C or above. The photosensitive composition of the present invention also has excellent heat resistance, and even when the photosensitive composition is ejected at a temperature of 40°C or above, the physical properties (especially light conversion efficiency) of the obtained cured film are good. The temperature of the photosensitive composition when ejected from the nozzle of the inkjet printer can be 50°C or above, 60°C or above, and 80°C or below.

[0214] The photosensitive composition of the present invention may contain additives such as a dispersant, a plasticizer, and a filler as other components as necessary.

[0215] As the above-mentioned dispersant, for example, cationic, anionic, nonionic, amphoteric, polyester, polyamine, acrylic surfactants and the like can be cited, but it is not limited thereto. The dispersant is preferably used together when the photosensitive composition contains a light scattering agent (B). When the photosensitive composition contains a dispersant, the dispersibility of the light scattering agent (B) in the photosensitive composition is improved.

[0216] When the photosensitive composition contains a dispersant, its content is preferably 10% by mass or less, more preferably 5% by mass or less, further preferably 3% by mass or less, particularly preferably 1% by mass or less, relative to the total amount of the photosensitive composition, and may also be 0% by mass, may also be 0.1% by mass or more, and may also be 0.3% by mass or more. In addition, from the viewpoint of reducing the viscosity, it is preferably 3% by mass or less, more preferably 2% by mass or less, and particularly preferably 1% by mass or less.

[0217] The content of the additive is preferably 10% by mass or less, more preferably 5% by mass or less, further preferably 3% by mass or less, particularly preferably 1% by mass or less, and may be 0% by mass, based on the total amount of the photosensitive composition.

[0218] <Method for producing photosensitive composition>

[0219] The photosensitive composition of the present invention can be prepared by mixing semiconductor particles (A), a photopolymerizable compound (C), a photopolymerization initiator (D), and, if necessary, a light scattering agent (B), a stabilizer (E), a solvent (F), a leveling agent (G), and other additives.

[0220] The order of mixing the components is not particularly limited, but it is preferred to prepare in advance a dispersion obtained by mixing semiconductor particles (A) and a photopolymerizable compound (C) and a light scattering agent solution obtained by mixing a light scattering agent (B) and a solvent (F), and mix the obtained dispersion, light scattering agent solution and other components.

[0221] As the ligand-containing semiconductor particles (A), for example, semiconductor particles coordinated with organic ligands can be prepared or prepared, and then a ligand reduction treatment is performed to reduce the coordination amount of the organic ligand relative to the above-mentioned semiconductor particles. The ligand reduction treatment can be, for example, a treatment to extract the organic ligand coordinated to the semiconductor particles into a suitable solvent.

[0222] <Cured film, patterned cured film, wavelength conversion film, and display device>

[0223] The cured film can be obtained by curing a film (layer) composed of a photosensitive composition. Specifically, the cured film can be obtained by coating a photosensitive composition on a substrate to form a coating film and exposing the obtained coating film to light.

[0224] As the substrate, glass plates such as quartz glass, borosilicate glass, aluminosilicate glass, soda-lime glass with a surface coated with silicon dioxide, resin plates such as polycarbonate, polymethyl methacrylate, polyethylene terephthalate, silicon, and substrates having aluminum, silver, silver / copper / palladium alloy films formed on the above substrates can be used.

[0225] The photosensitive composition can be applied by, for example, various printing methods such as gravure printing, offset printing, relief printing, screen printing, transfer printing, electrostatic printing, and plateless printing, gravure coating, roll coating, blade coating, air knife coating, rod coating, dip coating, kiss coating, spray coating, die coating, comma coating, inkjet, spin coating, slit coating, and the like, or a combination thereof.

[0226] As the light source used for exposure, a light source generating light with a wavelength of 250 nm to 450 nm is preferred. For example, light less than 350 nm can be cut off using a filter that cuts off this wavelength region, or light near 436 nm, near 408 nm, and near 365 nm can be selectively extracted using a bandpass filter that extracts these wavelength regions. Examples of the light source include mercury lamps, light emitting diodes, metal halide lamps, halogen lamps, and the like.

[0227] Alternatively, a patterned cured film may be formed from the photosensitive composition by patterning using methods such as photolithography, inkjet, and printing. In the photolithography method, since the expensive composition material is lost, the inkjet method is preferably used from the viewpoint of reducing the loss of the material.

[0228] As a method for producing a patterned cured film by inkjet method, for example, there is a method in which, after forming banks on a substrate, a photosensitive composition is selectively attached to regions on the substrate partitioned by the banks by inkjet method, and then the photosensitive composition is cured by exposing the region to light.

[0229] As the substrate, the base materials exemplified in the description of the method for producing the above cured film can be used.

[0230] Examples of a method for forming the bank include a photolithography method and an inkjet method, and the bank is preferably formed by an inkjet method.

[0231] Examples of the inkjet method include a bubble-jet (registered trademark) method using an electrothermal converter as an energy generating element, and a piezoelectric jet method using a piezoelectric element.

[0232] As the light source used for exposure, the light source exemplified in the description of the method for producing the above cured film can be used.

[0233] The unpatterned cured film or the patterned cured film can be appropriately used as a wavelength conversion film (wavelength conversion filter) that emits light of a wavelength different from the wavelength of light incident from the light-emitting portion such as the LED. In particular, the patterned cured film is preferably positioned above the light-emitting element such as the LED corresponding to each pattern. By performing wavelength conversion on each light-emitting element, the shape of the light-emitting spectrum such as red, green, and blue can be appropriately formed, which can bring high color reproducibility. The display component with the wavelength conversion film can be appropriately used in display devices such as liquid crystal display devices and organic EL devices.

[0234] Figure 1 is a schematic cross-sectional view of one embodiment of a display member formed by an inkjet method. Figure 1 The display component 10 has a bank 2 formed on a substrate 1 and a light-emitting element 3 such as an LED disposed between the bank 2, and has a cured film 4 (wavelength conversion film) obtained by attaching the photosensitive composition of the present invention to the light-emitting element 3 between the bank 2 by an inkjet method and then curing it (hereinafter, each cured film patterned to the size between the bank 2 is sometimes referred to as a "cured film pixel"). A color filter 5, a gas barrier layer 6, etc. may be located on each cured film pixel 4.

[0235] By forming the cured film pixel 4 by the inkjet method, patterning can be performed in a large size, and it can be applied to large displays such as digital signage.

[0236] Therefore, when the inkjet method is used, the vertical dimension (L1) of the cured film pixel 4 formed by the photosensitive composition of the present invention is preferably 9 μm or more, more preferably 12 μm or more, and further preferably 15 μm or more, and may be 40 μm or less, and may be 30 μm or less. It should be noted that the vertical dimension (L1) may be the same length as the horizontal dimension (L3) of the light-emitting element.

[0237] In addition, when the inkjet method is used, the horizontal size (L2) of the cured film pixel 4 formed by the photosensitive composition of the present invention is preferably 10 μm or more, more preferably 30 μm or more, further preferably 50 μm or more, further preferably 80 μm or more, particularly preferably 100 μm or more, and may be 900 μm or less, 800 μm or less, or 700 μm or less.

[0238] The vertical dimension (L1) of the cured film pixel 4 is a dimension in the substrate thickness direction on a cross section cut in a direction perpendicular to the substrate. The cross section is cut at a position where the vertical dimension of the cured film pixel 4 is the largest. Figure 1 The cross section cut in the direction perpendicular to the substrate at the position where the vertical dimension of the cured film pixel 4 is the largest is shown.

[0239] The horizontal dimension (L2) of the cured film pixel 4 is the maximum dimension of the cured film pixel 4 in the direction horizontal to the substrate, and is the dimension when the substrate is viewed from a vertical direction (a dimension in plan view).

[0240] The horizontal dimension (L3) of the light emitting element refers to the maximum dimension of the light emitting element in the direction horizontal to the substrate, and is the dimension when the substrate is viewed from a vertical direction (planar dimension).

[0241] It should be noted that the presence of the stabilizer (E) in the cured film can be confirmed by analyzing the cured film using thermal desorption GC / MS. The thermal desorption conditions and detection conditions of the stabilizer (E) can use the conditions described in the examples described later. When performing thermal desorption GC / MS on the cured film, it can be confirmed that the stabilizer (E) is contained in the cured film based on the appearance of an MS spectrum caused by a specific molecular structure of the stabilizer (E).

[0242] Example

[0243] Hereinafter, the present invention will be described in more detail by giving examples, and the present invention is not limited by the following examples, and can of course be implemented by appropriately adding changes in the scope that can be suitable for the aforementioned and later-described purports, and they are all included in the technical scope of the present invention. It should be noted that, below, "parts" means "parts by mass", and "%" means "% by mass", unless otherwise specified.

[0244] In Examples and Comparative Examples, the following materials were used.

[0245] Quantum dot dispersion 1: a toluene dispersion of quantum dots containing organic ligands and having an InP / ZnSeS structure (the maximum peak wavelength of the emission spectrum is 530 nm, and the half-peak width is 42 nm)

[0246] Quantum dot dispersion 2: a toluene dispersion of quantum dots containing organic ligands and having an InP / ZnSeS structure (the maximum peak wavelength of the emission spectrum is 630 nm, and the half-peak width is 42 nm)

[0247] · Photopolymerizable compound (C3-1): Pentaerythritol succinate

[0248] · Photopolymerizable compound (C-2): ω-carboxy-polycaprolactone (n≈2) monoacrylate (Aronix (registered trademark) M-5300 manufactured by Toagosei Co., Ltd.)

[0249] · Photopolymerizable compound (C-3): glyceryl triacrylate (Aronix (registered trademark) MT-3547 manufactured by Toagosei Co., Ltd.)

[0250] Photopolymerizable compound (C-4): Isobornyl acrylate

[0251] · Photopolymerizable compound (C2-5): 2-(2-vinyloxyethoxy)ethyl acrylate (VEEA (registered trademark) manufactured by Nippon Catalyst Co., Ltd.)

[0252] · Photopolymerizable compound (C1-6): ethyl methacrylate (LightEster E manufactured by Kyoeisha Chemical Co., Ltd., viscosity at 25° C. 0.7 cP)

[0253] Photopolymerization initiator (D-1): OMNIRAD (registered trademark) 907 manufactured by IGM Resins

[0254] Photopolymerization initiator (D-2): OMNIRAD (registered trademark) 369 manufactured by IGM Resins

[0255] Stabilizer (E-1): Sumilizer (registered trademark) GP manufactured by Sumitomo Chemical Co., Ltd.

[0256] Solvent (F-1): Propylene glycol monomethyl ether acetate (hereinafter referred to as PGMEA)

[0257] Leveling agent (G-1): MEGAFAC (registered trademark) F-554 manufactured by DIC Corporation

[0258] <Preparation of Quantum Dot 1>

[0259] Toluene was removed from the quantum dot dispersion 1 by distillation under reduced pressure, thereby obtaining a dried product of the quantum dots 1 .

[0260] <Preparation of Quantum Dot 2>

[0261] Toluene was removed from the quantum dot dispersion 2 by distillation under reduced pressure, thereby obtaining a dried product of the quantum dots 2 .

[0262] <Preparation of light scattering agent solution>

[0263] 10 parts (in terms of solid content) of a dispersant and 30 parts of PGMEA in total were mixed with 60 parts of titanium oxide particles (volume-based median diameter: 0.23 μm), and the titanium oxide particles were sufficiently dispersed using a bead mill.

[0264] <Example 1>

[0265] The photopolymerizable compound listed in Table 1 was added to the quantum dot 1, and stirred with an ultrasonic cleaner and a touch mixer until the solid content disappeared, thereby obtaining a quantum dot monomer dispersion. A light scattering agent solution, a photopolymerization initiator, a stabilizer, and a leveling agent were added to the obtained dispersion in a manner as described in Table 1, and stirred with a touch mixer, thereby obtaining a quantum dot ink.

[0266] <Examples 2 to 14, Comparative Examples 1 to 3>

[0267] A quantum dot ink was obtained by the same method as in Example 1 except that the types and amounts of semiconductor particles, light scattering agent, photopolymerizable compound, photopolymerization initiator, stabilizer, leveling agent and solvent were changed to the formulation described in Table 1.

[0268] [Table 1]

[0269]

[0270] <Evaluation test>

[0271] (1) Curing test

[0272] The quantum dot ink was applied onto a 5 cm square glass substrate (EAGLE2000; manufactured by CORNING) by spin coating, and then exposed to light at 200 mJ / cm in air using an exposure machine (TME-150RSK; manufactured by TOPCON Corporation). 2 The samples were irradiated with light at an exposure dose of 100 nm (based on 365 nm). The samples that obtained a cured film after the light irradiation were evaluated as ○, and the samples that remained liquid after the light irradiation were evaluated as ×. The results are shown in Table 1.

[0273] (2) Determination of external quantum yield

[0274] use Figure 2 The incident photon number (Incident photon number) is evaluated by using the optical system 10a described in the specification. In the optical system 10a, a light diffusion plate is provided on a substrate on which blue light emitting diodes having a maximum peak wavelength at 445 nm are arranged, and it is used as a backlight 11a. A glass substrate 12a before being coated with a cured film is placed on the backlight 11a, and an electronically cooled back-incident high S / N fiber multi-channel spectrometer QE65Pro (manufactured by Ocean Optics Co., Ltd.) with optical fibers is arranged vertically above the substrate surface to perform spectral measurement. The distance between the surface of the substrate 12a and the spectrometer detection unit 13a is fixed at 5 cm. The incident photon number is obtained from the obtained spectrum I(λ) according to Formula 1.

[0275]

[0276] Next, use Figure 3 The optical system 10b described in the specification is used to evaluate the number of emitted photons (Emittied photon number). In the optical system 10b, a light diffusion plate is set on a substrate on which blue light emitting diodes with a maximum peak wavelength at 445nm are arranged, and it is used as a backlight 11b. The substrate 12b with a cured film 14 produced in the above-mentioned curing test is placed on the backlight 11b, and an electronically cooled back-incident high S / N fiber multi-channel spectrometer QE65Pro (produced by Ocean Optics Co., Ltd.) with optical fibers is arranged vertically above the surface of the substrate to perform spectral measurement. The distance between the surface of the cured film 14 and the spectrometer detection unit 13b is fixed to 5 cm. The number of emitted photons is obtained from the obtained spectrum I(λ) according to Formula 2.

[0277]

[0278] The external quantum yield was obtained from the incident photon number and the emitted photon number according to Formula 3. The external quantum yield was evaluated as × when it was less than 20%, Δ when it was greater than 20% and less than 26%, and 0 when it was greater than 26%. The results are shown in Table 1.

[0279] External quantum yield = number of emitted photons / number of incident photons Formula 3 (3) Determination of conversion efficiency

[0280] The substrate with the cured film prepared in the above curing test was cut into 1 cm squares to obtain a sample for conversion efficiency evaluation. The conversion efficiency was measured using an absolute PL quantum yield measuring device (made by Hamamatsu Photonics, trade name C9920-02, excitation light 450nm, room temperature, atmosphere) for the sample for conversion efficiency evaluation. The conversion efficiency was evaluated as 0 for 45% or more, Δ for 35% or more and less than 45%, and × for less than 35%. The results are shown in Table 1.

[0281] (4) Determination of viscosity

[0282] The viscosity of the quantum dot ink at 40°C was measured using a Brookfield digital viscometer (model: DV2T). If the viscosity of the quantum dot ink was less than 14 cP, it was evaluated as ◎, if it was 14 cP or more and less than 16 cP, it was evaluated as 0, if it was 16 cP to 20 cP, it was evaluated as Δ, and if it exceeded 20 cP, it was evaluated as ×. The results are shown in Table 1.

[0283] (5) Heat resistance test

[0284] The cured film obtained in the curing test was heated in an oven at 80° C. for 3 days. The conversion efficiency after the heat resistance test was evaluated as S if it was 95% or more of the conversion efficiency before the heat resistance test, evaluated as A if it was 80% or more and less than 95%, evaluated as B if it was 50% or more and less than 80%, and evaluated as C if it was less than 50%. The results are shown in Table 1.

[0285] (6) Detection of stabilizers

[0286] The cured films of Examples 1 to 14 produced in the above curability test were analyzed by thermal desorption GC / MS under the following conditions.

[0287] Equipment: Agilent 7890B / 5977A (unit 2)

[0288] Column: DB-5 (0.25mm×30m, membrane thickness: 250mm)

[0289] Carrier gas: He, 1 mL / min

[0290] Column temperature: 50℃ (5 minutes) → 10℃ / min → 320℃ (8 minutes)

[0291] Detector: EI, m / z 20-600

[0292] Inlet temperature: 250℃

[0293] AuX temperature: 250℃

[0294] Split ratio: 50:1

[0295] Sample volume: 300~600mg

[0296] Thermal desorption conditions: 180°C (30 minutes)

[0297] At this time, the same spectrum shape as that observed when Sumilizer (registered trademark) GP was measured under the above conditions was observed in the cured films of Examples 1 to 14. From the appearance of the MS spectrum due to the specific molecular structure of Sumilizer (registered trademark) GP, it was confirmed that Sumilizer (registered trademark) GP sublimated from the cured films of Examples 1 to 14 under the above thermal desorption conditions.

[0298] Explanation of symbols

[0299] 10…Display components

[0300] 1...Substrate

[0301] 2…Embankment

[0302] 3…Light-emitting element

[0303] 4… Cured film (wavelength conversion film)

[0304] 5…Color Filters

[0305] 6…Gas barrier layer

[0306] L1…Vertical size

[0307] L2…Horizontal size

[0308] L3…Horizontal size of the light emitting element

[0309] 10a, 10b…Optical system

[0310] 11a, 11b…backlight

[0311] 12a, 12b...Substrate

[0312] 13a, 13b...Spectrometer detection unit

[0313] 14…cured film

Claims

1. A photosensitive composition comprising semiconductor particles (A), a photopolymerizable compound (C), a photopolymerization initiator (D) and a stabilizer (E), The content of the stabilizer (E) is 8% by mass or more relative to the total amount of the photosensitive composition. The photopolymerizable compound (C) includes a compound (C3) having a carboxyl group and three or more functional groups other than the carboxyl group in the same molecule, and the content of the compound (C3) is 5% by mass to 70% by mass based on the total amount of the photopolymerizable compound (C). 2 . The photosensitive composition according to claim 1 , wherein the photopolymerizable compound (C) comprises a (meth)acrylate compound (C1) having a molecular weight of 180 or less. 3 . The photosensitive composition according to claim 2 , wherein the compound (C1) has a viscosity at 25° C. of 1.2 cP or less.

4. The photosensitive composition according to claim 2 or 3, wherein The content of the compound (C1) is 5% by mass to 50% by mass based on the total amount of the photosensitive composition.

5. The photosensitive composition according to any one of claims 1 to 3, wherein The photopolymerizable compound (C) includes a compound (C2) having a vinyl ether group and a (meth)acryloyl group in the same molecule.

6. The photosensitive composition according to claim 5, wherein The content of the compound (C2) is 5% by mass to 50% by mass based on the total amount of the photosensitive composition.

7. The photosensitive composition according to any one of claims 1 to 3, wherein The content of the stabilizer (E) is 16% by mass or more based on the total amount of the photosensitive composition.

8. The photosensitive composition according to any one of claims 1 to 3, wherein The content of the semiconductor particles (A) is 16% by mass to 45% by mass based on the total amount of the photosensitive composition.

9. The photosensitive composition according to claim 1, wherein The content of the compound (C3) is 25 to 100 parts by mass based on 100 parts by mass of the semiconductor particles (A).

10. The photosensitive composition according to any one of claims 1 to 3, wherein The photosensitive composition has a viscosity at 40° C. of 20 cP or less.

11. The photosensitive composition according to any one of claims 1 to 3, wherein The content of the photopolymerization initiator (D) is 8 to 50 parts by mass based on 100 parts by mass of the photopolymerizable compound (C).

12. The photosensitive composition according to any one of claims 1 to 3, wherein The photosensitive composition further includes a light scattering agent (B) having a volume-based median particle size of 0.15 μm or more.

13. The photosensitive composition according to any one of claims 1 to 3, wherein The photosensitive composition further comprises a solvent (F), The content of the solvent (F) is 3.5% by mass or less based on the total amount of the photosensitive composition. 14 . The photosensitive composition according to claim 1 , which is an ink for an inkjet printer.

15. Use of the photosensitive composition according to claim 14, wherein the photosensitive composition is ejected from an inkjet printer head at a temperature of 40°C or above. 16 . A cured film formed from the photosensitive composition according to claim 1 .

17. The cured film according to claim 16, wherein The vertical dimension is 9 μm or more and / or the horizontal dimension is 10 μm to 900 μm, The cured film is obtained by coating a photosensitive composition on a substrate to form a coating film, and exposing the obtained coating film to light. The vertical dimension refers to the dimension in the thickness direction of the substrate on a cross section cut in a direction perpendicular to the substrate. The horizontal dimension refers to the maximum dimension of the cured film in the direction horizontal to the substrate and is a dimension when the substrate is viewed from a vertical direction, that is, a dimension in plan view.

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