Adhesive Tape for Cutting and Method for Manufacturing Semiconductor Chip

Abstract

The present invention provides an adhesive tape for cutting, which includes a substrate and an adhesive layer. The adhesive layer is composed of an adhesive composition, and the adhesive composition contains a silicone resin formed by mixing silicone rubber (G) and silicone resin (R), an organopolysiloxane having at least two or more hydrogen atoms bonded to silicon atoms in one molecule as a crosslinking agent, and a photosensitive platinum (Pt) catalyst. The mixing ratio of silicone rubber (G) and silicone resin (R) is in the range of 35.0 / 65.0 to 50.0 / 50.0. The silicone rubber (G alk ) includes silicone rubber (G alk ), which is composed of an organopolysiloxane containing an alkenyl group bonded to a silicon atom, and the content of the alkenyl group bonded to a silicon atom is in the range of 1.8×10 ‑6 mol / g or more and 1.0×10 ‑5 mol / g or less.

Description

Technical Field

[0001] The present invention relates to a dicing adhesive tape used in dicing a semiconductor material as a raw material for a semiconductor chip, and a method for manufacturing a semiconductor chip using the dicing adhesive tape. Background Art

[0002] Conventionally, as a dicing adhesive tape for manufacturing a semiconductor chip having an LED (Light Emitting Diode) or the like, an adhesive tape having an adhesive layer made of an acrylic resin has been known (see Patent Document 1).

[0003] In addition, as a dicing adhesive tape for manufacturing a semiconductor chip having an LED or the like, an adhesive tape having an adhesive layer made of a silicone resin has been known (see Patent Documents 2 and 3).

[0004] Furthermore, as a method for manufacturing a semiconductor chip using a dicing adhesive tape, a method is known in which the adhesive tape is adhered to the substrate side of a semiconductor element substrate on which a plurality of semiconductor elements are formed, and the semiconductor element substrate is cut with a dicing machine (see Patent Document 4).

[0005] Prior Art Documents

[0006] Patent Documents

[0007] Patent Document 1: Japanese Patent Application Laid-Open No. 2013-38408

[0008] Patent Document 2: Japanese Patent Application Laid-Open No. 2015-050216

[0009] Patent Document 3: Japanese Patent Application Laid-Open No. 2016-122812

[0010] Patent Document 4: Japanese Patent Application Laid-Open No. 2005-93503 Summary of the Invention

[0011] Problems to be Solved by the Invention

[0012] In addition, in recent years, as a method for manufacturing a semiconductor chip singulated by dicing, the following techniques have been proposed: a technique in which an adhesive tape is adhered to a semiconductor material coated with a sealing resin, a phosphor, or the like for a plurality of semiconductor elements and then diced; a technique corresponding to a so-called wafer-level CSP (chip-scale package) process.

[0013] Thus, when an adhesive tape is adhered to a semiconductor material coated with a coating material on a semiconductor element, the adhesive force may be insufficient due to the composition of the adhesive layer in the adhesive tape, the raw material of the coating material, etc., and the semiconductor chips singulated by dicing may fly off. Further, if the ball tack and adhesive force of the adhesive layer are designed to be high in order to suppress the flying off of the semiconductor chips, so-called residual adhesive may occur in a state where the adhesive adheres to the semiconductor chips when the obtained semiconductor chips are peeled off from the adhesive tape.

[0014] An object of the present invention is to provide an adhesive tape for dicing and a method for manufacturing a semiconductor chip using the adhesive tape for dicing, the adhesive tape for dicing having good adhesive force and cohesive force with respect to a semiconductor material having a plurality of semiconductor elements coated with a coating material, and being capable of suppressing residual adhesive on the semiconductor chips when the semiconductor chips singulated by dicing are peeled off.

[0015] Method for solving the problem

[0016] The inventors of the present invention conducted intensive studies on the adhesive layer of the adhesive tape for dicing for such an object, and as a result, found that if the adhesive layer is composed of an adhesive composition in which (3) a photosensitive platinum (Pt) catalyst is further added to a specific resin composition containing (1) a silicone-based resin containing a silicone gum composed of an organopolysiloxane having an alkenyl group bonded to a silicon atom and (2) a crosslinking agent having a hydrogen atom bonded to a silicon atom (SiH group), and the mixing ratio of the silicone gum and the silicone resin in the silicone-based resin and the content of the alkenyl group bonded to a silicon atom in the entire silicone-based resin are set within a predetermined range, good adhesive force is obtained with respect to a semiconductor material having a plurality of semiconductor elements coated with a coating material, and residual adhesive on the semiconductor chips can be suppressed when the semiconductor chips singulated by dicing are peeled off, thereby completing the present invention.

[0017] That is, it has been found that by forming the adhesive layer of a dicing adhesive tape from an adhesive composition obtained by adding a crosslinking agent and a photosensitive platinum (Pt) catalyst to a silicone resin having a predetermined ratio of silicone rubber and silicone resin and having a predetermined amount of alkenyl groups bonded to silicon atoms, the following effects are achieved. First, it has been found that when dividing a semiconductor material having a plurality of semiconductor elements covered with a covering material into a plurality of semiconductor chips, by forming the adhesive layer from an adhesive composition containing a silicone resin obtained by mixing silicone rubber and silicone resin at an appropriate ratio, due to the good adhesive force and tackiness brought about by this ratio, scattering of the singulated semiconductor chips during dicing can be suppressed. On the other hand, when peeling the singulated semiconductor chips from the dicing adhesive tape, by irradiating light such as ultraviolet light onto the adhesive layer, the photosensitive platinum (Pt) catalyst in the adhesive composition is activated, promoting the crosslinking reaction (addition reaction) between the alkenyl groups bonded to silicon atoms in the silicone rubber and the hydrogen atoms bonded to silicon atoms (SiH groups) in the crosslinking agent in the silicone resin, and the crosslinking density increases, so that the cohesive force of the adhesive composition becomes larger than before the light irradiation. As a result, the adhesive force of the adhesive layer is appropriately reduced, and furthermore, the failure mode in the holding force test is "interface peeling" or "not falling" in the holding force test. Thus, it has been found that the pick-up property of the semiconductor chips from the dicing adhesive tape is improved, and in addition, residual adhesive on the semiconductor chips can be suppressed.

[0018] The dicing adhesive tape of the present invention is a dicing adhesive tape having a base material and an adhesive layer laminated on the base material, and is used when dividing a semiconductor material having a plurality of semiconductor elements covered with a covering material into a plurality of semiconductor chips. It is characterized in that the adhesive layer is composed of an adhesive composition containing a silicone resin obtained by mixing silicone rubber (G) and silicone resin (R), an organopolysiloxane having at least two or more hydrogen atoms bonded to silicon atoms (SiH groups) in one molecule as a crosslinking agent for the silicone resin, and a photosensitive platinum (Pt) catalyst. The mixing ratio ((G) / (R)) of silicone rubber (G) and silicone resin (R) in the entire silicone resin is in the range of 35.0 / 65.0 to 50.0 / 50.0 by mass ratio. The silicone rubber (G) includes silicone rubber (G alk ), and the silicone rubber (G alk ) is composed of an organopolysiloxane containing an alkenyl group bonded to a silicon atom. The content of the alkenyl group bonded to a silicon atom in the entire silicone resin is in the range of 1.8×10 -6 mol / g or more and 1.0×10 -5 mol / g or less.

[0019] Here, it may be characterized in that, for the foregoing semiconductor material in which a plurality of the foregoing semiconductor elements are sealed with the foregoing coating material made of silicone resin, it is used by pasting from the coating material side.

[0020] In addition, it may be characterized in that, in the foregoing adhesive layer, the content of alkenyl groups bonded to silicon atoms in the whole of the foregoing organosilicon resin is in the range of 3.0×10 -6 mol / g or more and 1.0×10 -5 mol / g or less.

[0021] In addition, it may be characterized in that, in the foregoing adhesive layer, the molar ratio (SiH group / alkenyl group bonded to silicon atom) of the content (total amount) of hydrogen atoms bonded to silicon atoms (SiH groups) of the foregoing crosslinking agent contained in the foregoing adhesive composition to the content (total amount) of alkenyl groups bonded to silicon atoms in the whole of the foregoing organosilicon resin contained in the foregoing adhesive composition is in the range of 2.0 or more and 10.0 or less.

[0022] In addition, it may be characterized in that, in the foregoing adhesive layer, the content of the foregoing photosensitive platinum (Pt) catalyst in the foregoing adhesive composition is in the range of 0.10 parts by mass or more and 3.00 parts by mass or less in terms of solid content with respect to 100 parts by mass of the solid content of the whole of the foregoing organosilicon resin.

[0023] In addition, it may be characterized in that, in the adhesion characteristics according to JIS Z0237 (2009), all of the following conditions (a) to (c) are satisfied.

[0024] (a) The adhesive force to the BA-SUS test plate before light irradiation is in the range of 2.7 N / 10 mm or more and 4.1 N / 10 mm or less.

[0025] (b) Regarding the ball number value in the inclined ball tackiness test (inclination angle 30°, temperature 23°C, relative humidity 50% RH), when the ball number value before light irradiation is set as BN0 and the ball number value after light irradiation is set as BN1, the relationship is BN0 > BN1.

[0026] (c) In the holding force test after light irradiation (temperature 40°C, relative humidity 33% RH, standing time 2880 minutes), the failure phenomenon during dropping is interfacial peeling between the foregoing adhesive layer and the BA-SUS test plate, or it does not drop in this holding force test.

[0027] In addition, from other viewpoints, the manufacturing method of a semiconductor chip to which the present invention is applicable is a manufacturing method of a semiconductor chip including: a pasting step of pasting the above-described dicing adhesive tape from the side of the sealing resin to a semiconductor element substrate on which a plurality of the above-described semiconductor elements sealed with a sealing resin made of silicone resin are formed; a dicing step of dicing the semiconductor element substrate pasted with the above-described dicing adhesive tape into a plurality of semiconductor chips; an irradiation step of irradiating light to the above-described dicing adhesive tape of the semiconductor element substrate; and a peeling step of peeling the above-described dicing adhesive tape from the above-described plurality of semiconductor chips.

[0028] Advantages of the Invention

[0029] According to the present invention, it is possible to provide a dicing adhesive tape and a manufacturing method of a semiconductor chip using the dicing adhesive tape. Regarding the dicing adhesive tape, for a semiconductor material in which a plurality of semiconductor elements are covered with a covering material, it has good adhesive force and tackiness at a stage before light irradiation, and has good pick-up property of a semiconductor chip when peeling the semiconductor chips singulated by dicing after light irradiation, and can suppress residual adhesive on the semiconductor chips. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] Figure 1 is a diagram showing an example of the configuration of the dicing adhesive tape applied to the present embodiment.

[0031] Figure 2 (a) to (e) are diagrams showing a manufacturing method of a semiconductor chip using the adhesive tape of the present embodiment.

[0032] Figure 3 is a schematic diagram showing the relationship between the crosslinking density of the silicone-based resin in the adhesive layer and the result (falling time) of the holding force test of the adhesive tape 1. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0033] Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

[0034] [Configuration of Adhesive Tape]

[0035] Figure 1 is a diagram showing an example of the configuration of the dicing adhesive tape 1 (hereinafter, simply referred to as the adhesive tape 1) applied to the present embodiment. The adhesive tape 1 of the present embodiment is used, for example, in a manufacturing process of a semiconductor chip having semiconductor elements such as an LED (Light Emitting Diode) and a power semiconductor, for dicing a semiconductor material as a semiconductor chip raw material.

[0036] As Figure 1 ​​​As shown, the adhesive tape 1 has a structure in which an adhesive layer 3 is laminated on a base material 2.

[0037] It should be noted that, although not shown in the figure, the adhesive tape 1 may optionally have an anchor coat between the base material 2 and the adhesive layer 3 for improving the adhesion between the base material 2 and the adhesive layer 3. In addition, surface treatment may be performed on the surface of the base material 2 (the surface opposite to the surface facing the adhesive layer 3). Further, a release liner may be provided on the surface of the adhesive layer 3 (the surface opposite to the surface facing the base material 2).

[0038] <Base material>

[0039] The base material 2 of the present embodiment is made of a material that transmits light such as ultraviolet rays. As the material of the base material 2, there is no particular limitation as long as light such as ultraviolet rays can pass through, and for example, plastics that can transmit light such as ultraviolet rays can be used. It should be noted that here, the ability to transmit light such as ultraviolet rays does not mean that the transmittance of light such as ultraviolet rays is 100%, but only that light at least to the extent that it can promote the addition reaction of the silicone resin and the crosslinking agent by the photosensitive platinum (Pt) catalyst contained in the adhesive layer 3 can pass through.

[0040] As the material of the base material 2, resin films such as polyethylene terephthalate, polyethylene naphthalate, polyphenylene sulfide, biaxially oriented polypropylene, aliphatic polyimide (transparent polyimide), polycycloolefin, fluororesin, and polyolefin resin can be specifically used. In addition, depending on the use, the base material 2 may also be, for example, a composite film obtained by laminating polyethylene terephthalate and a polyolefin resin film, a composite film obtained by further laminating these composite films with a resin film, a resin film made into multiple layers by coextrusion, etc.

[0041] Among them, as the base material 2, a material mainly composed of polyethylene terephthalate is preferably used.

[0042] <Adhesive layer>

[0043] The adhesive layer 3 of the present embodiment is composed of an adhesive composition containing a silicone resin obtained by mixing silicone rubber (G) and silicone resin (R), a crosslinking agent for the silicone resin having at least two or more hydrogen atoms (SiH groups) bonded to silicon atoms in one molecule, and a photosensitive platinum (Pt) catalyst.

[0044] The silicone resin contains "silicone rubber (G alk ) containing silicone rubber (G alkA mixed resin formed by mixing "an organopolysiloxane containing an alkenyl group bonded to a silicon atom" and "a silicone resin (R) composed of an organopolysiloxane" at a predetermined ratio. Hereinafter, each component contained in the adhesive composition constituting the adhesive layer 3 will be described in turn.

[0045] (Organosilicon resin)

[0046] The organosilicon resin of this embodiment contains "a silicone rubber (G alk ) containing a silicone rubber (G alk ) composed of an organopolysiloxane containing an alkenyl group bonded to a silicon atom" and "a silicone resin (R) composed of an organopolysiloxane" are mixed in a range of 35.0 / 65.0 to 50.0 / 50.0. That is, it contains a mixed resin mixed in such a manner that the mixing ratio ((G) / (R)) of the silicone rubber (G) and the silicone resin (R) is in the range of 35.0 / 65.0 to 50.0 / 50.0 by mass ratio.

[0047] In addition, the organosilicon resin is configured such that the content of the alkenyl group bonded to a silicon atom in the whole organosilicon resin is in the range of 1.8×10 -6 mol / g or more and 1.0×10 -5 mol / g or less, and more preferably in the range of 3.0×10 -6 mol / g or more and 1.0×10 -5 mol / g or less. Here, the meaning of "mol / g" is "the amount of substance per 1 g of the solid content of the whole organosilicon resin".

[0048] If the content of the alkenyl group bonded to a silicon atom in the whole organosilicon resin is less than 1.8×10 -6 mol / g, when irradiating light such as ultraviolet rays on the adhesive tape 1, the increase in the crosslinking density caused by the crosslinking reaction (addition reaction) between the alkenyl group bonded to a silicon atom in the silicone rubber and the hydrogen atom bonded to a silicon atom (SiH group) in the crosslinking agent is insufficient, the adhesive is not easily cured, and the cohesion is difficult to improve. In this case, the desired reduction in adhesive force and the failure mode in the holding force test cannot be obtained. When the adhesive tape 1 is used for cutting a semiconductor element substrate or the like and then the obtained semiconductor chip or the like is peeled off from the adhesive tape 1, the pick-up property of the singulated semiconductor chip may be poor, and residual adhesive may easily occur on the semiconductor chip or the like.

[0049] On the other hand, if the content of the alkenyl group bonded to a silicon atom in the whole organosilicon resin is greater than 1.0×10 - 5If it is 0.1 mol / g, for example, when a release liner that has been release-treated with a fluoroalkyl-modified silicone is provided in the pressure-sensitive adhesive tape 1, the release force of the release liner with respect to the pressure-sensitive adhesive layer 3 may increase. In addition, the storage stability of the pressure-sensitive adhesive tape 1 with respect to light may deteriorate.

[0050] The content of the alkenyl group bonded to a silicon atom in the entire silicone resin can be calculated by performing 1 1H-NMR (nuclear magnetic resonance) spectroscopy on the non-volatile components of the silicone resin and obtaining the resonance signal area (integral value) of the alkenyl group. The detailed content will be described later.

[0051] It should be noted that as long as the "mixing ratio of silicone rubber (G) and silicone resin (R) ((G) / (R))" and the "content of the alkenyl group bonded to a silicon atom" of the silicone resin of the present embodiment are within the above ranges, it may further contain silicone rubber (G 0 ) composed of an organopolysiloxane that does not contain an alkenyl group bonded to a silicon atom. That is, the silicone rubber (G) can be a single substance of "silicone rubber (G alk )" composed of an organopolysiloxane containing an alkenyl group bonded to a silicon atom or a mixture of two or more of them, or can be a mixture of "silicone rubber (G alk )" composed of an organopolysiloxane containing an alkenyl group bonded to a silicon atom and "silicone rubber (G 0 )" composed of an organopolysiloxane that does not contain an alkenyl group bonded to a silicon atom or a mixture of two or more of them.

[0052] Hereinafter, "silicone rubber (G alk )" composed of an organopolysiloxane containing an alkenyl group bonded to a silicon atom, "silicone rubber (G 0 )" composed of an organopolysiloxane that does not contain an alkenyl group bonded to a silicon atom, and "silicone resin (R)" composed of an organopolysiloxane contained in the silicone resin will be further described in detail.

[0053] It should be noted that in the following description, sometimes "silicone rubber (G alk )" composed of an organopolysiloxane containing an alkenyl group bonded to a silicon atom is expressed as silicone rubber (G alk ) containing an alkenyl group bonded to a silicon atom or simply abbreviated as silicone rubber (G alk ). Similarly, sometimes "silicone rubber (G 0 )" composed of an organopolysiloxane that does not contain an alkenyl group bonded to a silicon atom is expressed as silicone rubber (G 0 ) that does not contain an alkenyl group bonded to a silicon atom or simply abbreviated as silicone rubber (G 0 ). Further, sometimes "silicone resin (R)" composed of an organopolysiloxane is simply abbreviated as silicone resin (R).

[0054] (The silicone rubber (G) composed of an organopolysiloxane containing an alkenyl group bonded to a silicon atom alk ))

[0055] The silicone rubber (G) composed of an organopolysiloxane containing an alkenyl group bonded to a silicon atom in the present embodiment alk ) may be any silicone rubber generally used as an addition reaction type organosilicon resin, that is, a silicone rubber containing at least 2 alkenyl groups bonded to silicon atoms per average 1 molecule, and is not particularly limited.

[0056] Specifically, as the silicone rubber (G alk ), a silicone rubber in the range of 1.0×10 - 6 mol / g or more and 1.0×10 -1 mol / g or less in the content of the alkenyl group bonded to the silicon atom can be used. In the present embodiment, from the viewpoints of controlling the adhesion characteristics of the adhesive layer 3 or the ease of obtaining when using a commercially available product, a silicone rubber in the range of 1.7×10 -6 mol / g or more and 1.0×10 -2 mol / g or less in the content of the alkenyl group bonded to the silicon atom is preferably used. This silicone rubber (G alk ) can be used alone or in combination of two or more so that the content of the alkenyl group in the whole organosilicon resin formed by mixing the above silicone rubber (G) and the silicone resin (R) is in the range of 1.8×10 -6 mol / g or more and 1.0×10 -5 mol / g or less.

[0057] As the molecular structure of the organopolysiloxane containing an alkenyl group bonded to a silicon atom that constitutes the silicone rubber (G alk ), for example, a linear structure in which the main chain part is composed of a repetition of diorganosiloxane units, a structure in which a part of the molecular structure contains a branch chain, a branched structure, or a cyclic structure can be cited. Among them, from the viewpoints of the mechanical strength and physical properties of the adhesive after irradiation with light such as ultraviolet rays, an organopolysiloxane having a linear structure is preferred.

[0058] The silicone rubber (G alk ) composed of an organopolysiloxane containing an alkenyl group bonded to a silicon atom can be either oily or raw rubber-like, and raw rubber-like is preferred. When it is oily, the viscosity of the silicone rubber (G alk ) composed of an organopolysiloxane is preferably 1,000 mPa·s or more at 25°C. When the viscosity is less than 1,000 mPa·s, the adhesive before and after irradiation with light such as ultraviolet rays may not exhibit the desired adhesion characteristics, and the adhesion between the adhesive layer 3 and the substrate 2 may deteriorate. When it is raw rubber-like, the silicone rubber (G alk) When dissolved in toluene to a concentration of 30% by mass, the viscosity is preferably 100,000 mPa·s or less at 25°C. If the viscosity is greater than 100,000 mPa·s, stirring during the preparation of the adhesive composition may become difficult. It should be noted that the viscosity of the silicone rubber (G alk ) composed of organopolysiloxane can be measured using a B-type rotational viscometer (using a BM-type rotor, the same below).

[0059] The silicone rubber (G alk ) composed of organopolysiloxane containing alkenyl groups bonded to silicon atoms includes, for example, substances represented by the following general formula (1) or general formula (2), but is not limited thereto.

[0060] [Chemical formula 1]

[0061] R 1 (3-a) X a SiO-(R 1 XSiO) m -(R 1 2 SiO) n -SiR 1 (3-a) X a General formula (1)

[0062] [Chemical formula 2]

[0063] R 1 2 (OH)SiO-(R 1 XSiO) m+2 -(R 1 2 SiO) n -SiR 1 2 (OH) General formula (2)

[0064] Here, in the above general formula (1) and general formula (2), R 1 are each independently a monovalent hydrocarbon group without aliphatic unsaturated bonds, and X is an organic group containing an alkenyl group. a is an integer from 0 to 3, m is an integer of 0 or more, n is an integer of 100 or more, where a and m are not both 0, and when a is 0, m is an integer of 2 or more. m + n is a value such that the viscosity of the silicone rubber (G alk ) composed of the above organopolysiloxane becomes 1,000 mPa·s or more at 25°C.

[0065] As R 1, preferably a monovalent hydrocarbon group having 1 to 10 carbon atoms, more preferably 1 to 7 carbon atoms and no aliphatic unsaturated bond. For example, alkyl groups such as methyl, ethyl, propyl and butyl can be cited; cycloalkyl groups such as cyclohexyl; and aryl groups such as phenyl and tolyl, etc. Particularly preferably, it is methyl or phenyl.

[0066] As X, an organic group containing an alkenyl group having 2 to 10 carbon atoms is preferred. For example, vinyl, allyl, hexenyl, octenyl, acryloylpropyl, acryloylmethyl, methacryloylpropyl, acryloyloxypropyl, acryloyloxymethyl, methacryloyloxypropyl, methacryloyloxymethyl, cyclohexenylethyl, vinyloxypropyl, etc. can be cited. Among them, lower alkenyl groups such as vinyl and allyl are preferred, and from an industrial perspective, vinyl is particularly preferred. The bonding position of the alkenyl group is not particularly limited and can be at the end of the molecular chain, on the side chain of the molecular chain, or both at the end of the molecular chain and on the side chain of the molecular chain.

[0067] The number of alkenyl groups varies within an appropriate range depending on the content of the silicone resin (R) composed of organopolysiloxane contained in the silicone-based adhesive, the type and addition amount of the crosslinking agent, and the balance with other additive components, etc., so it cannot be generalized. For example, relative to 100 organic groups of organopolysiloxane, it is usually preferably in the range of more than 0.1 and less than 3.0. And within this ratio range, the molecular weight is adjusted so as to be within the above viscosity range, and preferably adjusted so that the number of the above alkenyl groups in an average of one molecule of organopolysiloxane is at least 2. If the number of alkenyl groups is less than 0.1 relative to 100 organic groups of organopolysiloxane, when the adhesive tape 1 is irradiated with light such as ultraviolet rays, the crosslinking density increase caused by the crosslinking reaction (addition reaction) between the alkenyl group bonded to a silicon atom in the silicone rubber (G alk ) and the hydrogen atom (SiH group) bonded to a silicon atom in the crosslinking agent for the silicone-based resin is insufficient, the adhesive is not easily cured, and the cohesive force is difficult to increase. In this case, the desired decrease in adhesive force and the failure mode in the holding force test cannot be obtained. When the adhesive tape 1 is used for cutting a semiconductor element substrate, etc., when the obtained semiconductor chip, etc. is peeled off from the adhesive tape 1, the pick-up property of the singulated semiconductor chip may deteriorate, and residual adhesive may easily occur on the semiconductor chip, etc. On the other hand, if the number of alkenyl groups is more than 3.0 relative to 100 organic groups of organopolysiloxane, when a release liner treated with fluorinated alkyl-modified silicone is provided in the adhesive tape 1, the release force of the release liner relative to the adhesive layer 3 may become large.

[0068] As such a silicone rubber (G) containing an alkenyl group bonded to a silicon atom alkSpecific examples of () include dimethylpolysiloxane capped with dimethylvinylsiloxy groups at both ends of the molecular chain, dimethylsiloxane-methylvinylsiloxane copolymer capped with dimethylvinylsiloxy groups at both ends of the molecular chain, dimethylsiloxane-methylphenylsiloxane copolymer capped with dimethylvinylsiloxy groups at both ends of the molecular chain, methylphenylpolysiloxane capped with dimethylvinylsiloxy groups at both ends of the molecular chain, dimethylsiloxane-methylvinylsiloxane copolymer capped with trimethylsiloxy groups at both ends of the molecular chain, dimethylsiloxane-methylvinylsiloxane-methylphenylsiloxane copolymer capped with trimethylsiloxy groups at both ends of the molecular chain, dimethylsiloxane-methylhexenylsiloxane copolymer capped with trimethylsiloxy groups at both ends of the molecular chain, dimethylsiloxane-methylhexenylsiloxane copolymer capped with dimethylvinylsiloxy groups at both ends of the molecular chain, dimethylsiloxane-methylhexenylsiloxane copolymer capped with dimethylhexenylsiloxy groups at both ends of the molecular chain, and the like.

[0069] (The silicone rubber (G) composed of an organopolysiloxane that does not contain an alkenyl group bonded to a silicon atom 0 ))

[0070] The silicone rubber (G) composed of an organopolysiloxane that does not contain an alkenyl group bonded to a silicon atom in the present embodiment 0 ) may be any silicone rubber that is usually used as a peroxide-curable silicone resin, that is, a silicone rubber that does not contain an alkenyl group bonded to a silicon atom, and is not particularly limited.

[0071] As the molecular structure of the organopolysiloxane constituting such a silicone rubber (G 0 ), for example, a linear structure in which the main chain part is composed of a repetition of diorganosiloxane units, a structure in which a part of the molecular structure includes a branched chain, a branched structure, or a cyclic structure can be cited.

[0072] The silicone rubber (G) composed of an organopolysiloxane that does not contain an alkenyl group bonded to a silicon atom 0 ) can be either oily or gum-like, and is preferably gum-like. When it is oily, the viscosity of the silicone rubber (G 0 ) composed of an organopolysiloxane is preferably 1,000 mPa·s or more at 25°C. When the viscosity is less than 1,000 mPa·s, the adhesive may not exhibit the desired adhesive properties before and after irradiation with light such as ultraviolet rays, and the adhesion between the adhesive layer 3 and the substrate 2 may deteriorate. When it is gum-like, the viscosity when the silicone rubber (G 0 ) composed of an organopolysiloxane is dissolved in toluene to a concentration of 30% by mass is preferably 100,000 mPa·s or less at 25°C. If the viscosity is greater than 100,000 mPa·s, stirring during the preparation of the adhesive composition may become difficult. It should be noted that the silicone rubber (G) composed of an organopolysiloxane0 ) The viscosity can be measured using a B-type rotational viscometer.

[0073] The silicone rubber (G composed of an organopolysiloxane that does not contain an alkenyl group bonded to a silicon atom 0 ) For example, substances represented by the following general formula (3) or general formula (4) can be cited, but are not limited thereto.

[0074] [Chemical formula 3]

[0075] R 4 3 SiO-(R 4 2 SiO) t -SiR 4 3 General formula (3)

[0076] [Chemical formula 4]

[0077] R 4 2 (OH)SiO-(R 4 2 SiO) t -SiR 4 2 (OH) General formula (4)

[0078] Here, in the above general formula (3) and general formula (4), R 4 are each independently a monovalent hydrocarbon group without an aliphatic unsaturated bond, t is an integer of 100 or more, and is a value such that the viscosity of the silicone rubber (G0) composed of the above diorganopolysiloxane becomes 1,000 mPa·s or more at 25°C.

[0079] As R 4 , it is preferably a monovalent hydrocarbon group without an aliphatic unsaturated bond having 1 to 10 carbon atoms, preferably 1 to 7 carbon atoms. For example, alkyl groups such as methyl, ethyl, propyl, and butyl; cycloalkyl groups such as cyclohexyl; and aryl groups such as phenyl and tolyl can be cited, and methyl is particularly preferred.

[0080] (The silicone resin (R) composed of an organopolysiloxane)

[0081] The silicone resin (R) composed of an organopolysiloxane in the present embodiment is an organopolysiloxane having R 2 3 SiO 0.5 units (M units) and SiO 2 units (Q units), and is a substance called an MQ resin that is usually used in silicone adhesives. The above silicone resin (R) composed of an organopolysiloxane basically has no alkenyl group in the molecule, and a resin known in the past can be used. R 2is a monovalent hydrocarbon group having 1 to 10 carbon atoms, and examples of the above R include monovalent hydrocarbon groups 1 exemplified. The organopolysiloxane constituting the silicone resin (R) preferably contains R 2 3 SiO 0.5 units / SiO 2 units in a molar ratio of 0.5 or more and 1.7 or less, and contains R 2 3 SiO 0.5 units and SiO 2 units. When the molar ratio of R 2 3 SiO 0.5 units / SiO 2 units is less than 0.5, the adhesive strength and tackiness of the resulting adhesive layer 3 may decrease. On the other hand, if the molar ratio of R 2 3 SiO 0.5 units / SiO 2 units is greater than 1.7, the adhesive strength and holding power of the resulting adhesive layer 3 may decrease. It should be noted that the organopolysiloxane constituting the silicone resin (R) may have an OH group. In this case, the content of the OH group is preferably 4.0% by mass or less based on the total mass of the organopolysiloxane. If the content of the OH group is greater than 4.0% by mass, the curability of the adhesive may decrease.

[0082] Two or more of the above organopolysiloxanes may be used in combination. In addition, the above organopolysiloxane may have R 2 SiO 1.5 units (T units) and / or R 2 2 SiO units (D units) within a range that does not impair the characteristics of the present invention.

[0083] "The silicone rubber (G alk ) composed of an organopolysiloxane containing an alkenyl group bonded to a silicon atom", "the silicone rubber (G 0 ) composed of an organopolysiloxane not containing an alkenyl group bonded to a silicon atom", and "the silicone resin (R) composed of an organopolysiloxane" can usually be simply mixed and used. In addition, when the silicone rubber (G alk ) composed of an organopolysiloxane containing an alkenyl group bonded to a silicon atom contains the organopolysiloxane represented by the above general formula (2), and when the silicone rubber (G 0 ) composed of an organopolysiloxane not containing an alkenyl group bonded to a silicon atom contains the organopolysiloxane represented by the above general formula (4), as long as the characteristics of the present invention are not impaired, the silicone rubber (G alk) in the form of a (partial) condensation reactant obtained by pre-reacting with silicone resin (R) or silicone rubber (G 0 ) with silicone resin (R).

[0084] (Mixing ratio of silicone rubber (G) and silicone resin (R) in the entire silicone-based resin ((G) / (R)))

[0085] In the entire silicone-based resin contained in the adhesive layer 3 of the present embodiment, the mixing ratio of silicone rubber (G) and silicone resin (R) ((G) / (R)) is in the range of 35.0 / 65.0 to 50.0 / 50.0 by mass ratio. Here, when two or more silicone rubbers (G) are used in combination, the total amount of each silicone rubber (G) is regarded as the mass of silicone rubber (G) in the entire silicone-based resin. For example, as the silicone rubber (G), when silicone rubber (G alk ) and silicone rubber (G 0 ) are used in combination, the mass of silicone rubber (G) in the entire silicone-based resin is the total mass of silicone rubber (G alk ) and silicone rubber (G 0 ). Similarly, when two or more silicone resins (R) are used in combination, the total amount of each silicone resin is regarded as the mass of silicone resin (R) in the entire silicone-based resin.

[0086] In the entire silicone-based resin contained in the adhesive layer 3 of the present embodiment, if the mixing ratio of silicone rubber (G) and silicone resin (R) ((G) / (R)) is less than the lower limit value of the above range, when ultraviolet light or the like is irradiated on the adhesive tape 1, the contribution to the increase in crosslinking density caused by the crosslinking reaction (addition reaction) between the alkenyl group bonded to silicon atoms in the silicone rubber (G) and the hydrogen atom (SiH group) bonded to silicon atoms in the crosslinking agent for the silicone-based resin is insufficient, the adhesive is not easily cured, and it is difficult to improve the cohesive force. In this case, the desired reduction in adhesive force and the failure mode in the holding force test cannot be obtained. When the adhesive tape 1 is used for cutting a semiconductor element substrate or the like and then the obtained semiconductor chip or the like is peeled off from the adhesive tape 1, the pick-up property of the singulated semiconductor chip may deteriorate, and residual adhesive may easily occur on the semiconductor chip or the like.

[0087] On the other hand, in the entire silicone resin contained in the adhesive layer 3 of the present embodiment, if the mixing ratio ((G) / (R)) of the silicone rubber (G) and the silicone resin (R) is greater than the upper limit value of the above range, when cutting a semiconductor element substrate or the like in the uncured state of the adhesive before irradiation with light such as ultraviolet light, the vibration during cutting easily propagates to the adhesive layer 3 and the vibration amplitude becomes larger. For example, the semiconductor element substrate may shift from the reference position. Along with this, notches (chips) may be generated on the singulated semiconductor chips, and size deviations may occur for each individual semiconductor chip. In addition, the adhesive force and tackiness of the adhesive layer 3 may also decrease. In this case, when the adhesive tape 1 is used for cutting a semiconductor element substrate, a fluorescent substrate, etc., semiconductor chips, etc. as cut pieces may fly off.

[0088] In contrast, in the entire silicone resin contained in the adhesive layer 3 of the present embodiment, by setting the mixing ratio ((G) / (R)) of the silicone rubber (G) and the silicone resin (R) within the above range, the following effects can be achieved. That is, at the stage before irradiation with light such as ultraviolet light, an appropriate adhesive force and tackiness can be imparted to the uncured adhesive layer 3 so that semiconductor chips, etc. as cut pieces do not fly off during cutting. On the other hand, after irradiation with light such as ultraviolet light, since the silicone resin of the adhesive layer 3 is configured such that the content of alkenyl groups bonded to silicon atoms in the entire silicone resin is in the range of 1.8×10 -6 mol / g or more and 1.0×10 -5 mol / g or less, the crosslinking reaction (addition reaction) between the alkenyl groups bonded to silicon atoms in the silicone rubber (G) and the hydrogen atoms (SiH groups) bonded to silicon atoms in the crosslinking agent for the silicone resin proceeds sufficiently. As a result, the adhesive layer 3 is cured, the crosslinking density becomes high, and the cohesion is improved. Therefore, a desired decrease in tackiness and a failure mode in the holding force test are obtained. As a result, when the semiconductor chips, etc. obtained after using the adhesive tape 1 for cutting a semiconductor element substrate, etc. are peeled off from the adhesive tape 1, good pick-up properties can be achieved, and residual glue on the semiconductor chips, etc. can be suppressed.

[0089] In addition, as the silicone resin obtained by mixing the silicone rubber (G) and the silicone resin (R) of the present invention, a material obtained by appropriately combining and mixing commercially available materials exemplified below can also be used. Here, the meaning of "a material obtained by appropriately combining and mixing" is that "the content of alkenyl groups bonded to silicon atoms in the entire silicone resin of the adhesive layer 3 is 1.8×10 -6 mol / g or more and 1.0×10 -5a material prepared by appropriately combining and mixing various materials in such a way that the content of [substance] is in the range of [value] mol / g or less, and the mixing ratio of silicone rubber (G) to silicone resin (R), ((G) / (R)), is in the range of 35.0 / 65.0 to 50.0 / 50.0. As commercially available materials for appropriate combination and mixing, for example, the following materials (1) to (4) can be cited.

[0090] As an organosilicon resin containing an alkenyl group bonded to a silicon atom, there can be cited (1) a commercially available addition reaction type organosilicon adhesive obtained by mixing silicone rubber (G alk ) and silicone resin (R) at a predetermined ratio, (2) a commercially available addition reaction type organosilicon release agent having silicone rubber (G alk ) as the main component, etc. In addition, as an organosilicon resin not containing an alkenyl group bonded to a silicon atom, there can be cited (3) a commercially available peroxide curing type organosilicon adhesive obtained by mixing silicone rubber (G 0 ) and silicone resin (R) at a predetermined ratio, (4) a single substance of commercially available silicone resin (R), etc. In the present invention, when appropriately combining and mixing these commercially available materials, it is preferable to contain at least the addition reaction type organosilicon release agent of (2), and more preferably further contain the addition reaction type organosilicon adhesive of (1) on this basis.

[0091] As described above, as an organosilicon resin containing an alkenyl group bonded to a silicon atom, a commercially available addition reaction type organosilicon adhesive obtained by mixing silicone rubber (G alk ) and silicone resin (R) at a predetermined ratio, a commercially available addition reaction type organosilicon release agent having silicone rubber (G alk ) as the main component, etc. can be used. Hereinafter, specific commercially available materials are exemplified.

[0092] (1) Addition reaction type organosilicon adhesive

[0093] As the above-mentioned commercially available addition reaction type silicone-based adhesives, there is no particular limitation as long as they can generally be used as silicone-based adhesives for silicone-based adhesive tapes. Specifically, for example, KR-3700, KR-3701, X-40-3237-1, X-40-3240, X-40-3291-1, X-40-3229, X-40-3270, X-40-3306 (all are trade names) manufactured by Shin-Etsu Chemical Co., Ltd.; TSR1512, TSR1516, XR37-B9204 (all are trade names) manufactured by Momentive Performance Materials Inc.; SD4580, SD4584, SD4585, SD4560, SD4564, SD4565, SD4570, SD4574, SD4575, SD4600PFC, SD4593, DC7651ADHESIVE (all are trade names) etc. manufactured by Daw-Toray Co., Ltd. can be used, which are types without internal addition of platinum (Pt)-based catalysts and the crosslinking agents described later. It should be noted that types with internal addition of crosslinking agents can also be used. When the content of hydrogen atoms (SiH groups) bonded to silicon atoms in the internally added crosslinking agent is not clear, this content can be determined by analysis such as 1 H-NMR (nuclear magnetic resonance) spectroscopy measurement, etc.

[0094] (2) Addition reaction type silicone-based release agents

[0095] As the above-mentioned commercially available addition reaction type silicone-based release agents, there is no particular limitation as long as they can generally be used as release treatment agents for silicone-based release films for adhesive tapes. Specifically, for example, LTC750A, LTC310, LTC300B (all are trade names) manufactured by Daw-Toray Co., Ltd.; KS3600, KS778 (all are trade names) manufactured by Shin-Etsu Chemical Co., Ltd.; TPR6710, TPR6700 (all are trade names) manufactured by Momentive Performance Materials Inc. etc. can be used. In this case, both types without internal addition of crosslinking agents and types with internal addition of crosslinking agents can be used, and the content of hydrogen atoms (SiH groups) bonded to silicon atoms in the internally added crosslinking agent can be determined by 1 H-NMR (nuclear magnetic resonance) spectroscopy measurement, etc.

[0096] When the mixing ratio of silicone rubber (G) and silicone resin (R) in the above-mentioned commercially available addition reaction type silicone-based adhesives is not clear, this mixing ratio can be determined by 29 Si-NMR (nuclear magnetic resonance) spectroscopy measurement, from the peak area ratio of D unit and Q unit (silicone rubber: silicone resin = D unit: Q unit). In addition, it can also be determined according to the ratio of the peak areas measured by gel permeation chromatography (GPC).

[0097] In addition, as the silicone resin not containing an alkenyl group bonded to a silicon atom, a commercially available peroxide-curable silicone-based adhesive obtained by mixing silicone rubber (G 0 ) and silicone resin (R) at a predetermined ratio, a single product of commercially available silicone resin (R), etc. can be used. Hereinafter, specific commercially available materials are exemplified.

[0098] (3) Peroxide-curable silicone-based adhesive

[0099] As the above-mentioned commercially available peroxide-curable silicone-based adhesive, there is no particular limitation as long as it can be generally used as a silicone-based adhesive for a silicone-based adhesive tape. Specifically, for example, KR-100, KR-101-10 (both are trade names) manufactured by Shin-Etsu Chemical Co., Ltd.; YR3340, YR3286, PSA610-SM, XR37-B6722, YF3897 (all are trade names) manufactured by Momentive Performance Materials Inc.; SH4280, SH4282, SE4200, BY24-717, BY24-715, Q2-7735 (all are trade names) manufactured by Daw-Toray Co., Ltd., etc. can be cited.

[0100] (4) Silicone resin

[0101] As a single product of commercially available silicone resin (R), specifically, for example, YF3800, XF3905, YF3057, YF3807, YF3802, YF3897, XC96-723, 2D SILANOL FLUID (all are trade names) manufactured by Momentive Performance Materials Inc. can be cited.

[0102] When the mixing ratio of silicone rubber (G) and silicone resin (R) in the above-mentioned commercially available peroxide-curable silicone-based adhesive is not clear, the mixing ratio can be determined in the same manner as above by using 29 Si-NMR (nuclear magnetic resonance) spectroscopy, and obtained from the peak area ratio of the D unit and the Q unit (silicone rubber: silicone resin = D unit: Q unit). In addition, it can also be obtained from the ratio of the peak areas measured by gel permeation chromatography (GPC).

[0103] As long as the content of the alkenyl group bonded to a silicon atom in the total silicone resin of the adhesive layer 3 is 1.8×10 -6 mol / g or more and 1.0×10 -5It is only necessary to use it in a state where it is appropriately combined and mixed in such a manner that the range is below 0 mol / g and the mixing ratio ((G) / (R)) of silicone rubber (G) and silicone resin (R) is in the range of 35.0 / 65.0 to 50.0 / 50.0. As preferred examples when using these commercially available silicone-based resins, specifically, for example, as long as an organic silicone-based resin obtained by adding an addition reaction type silicone-based release agent to an addition reaction type silicone-based adhesive ((a)), and an organic silicone-based resin obtained by further adding a peroxide curing type silicone-based adhesive and / or silicone resin (R) to them ((b)) are used as the main components of the adhesive composition constituting the adhesive layer 3.

[0104] It should be noted that in the description of this embodiment, the meaning of "as the main component" is that when the solid content of the adhesive composition is set to 100 parts by mass, it accounts for 75 parts by mass or more, preferably 90 parts by mass or more, and more preferably 95 parts by mass or more.

[0105] (Crosslinking agent)

[0106] The crosslinking agent in this embodiment exhibits its function as a crosslinking agent for the silicone-based adhesive by irradiating light such as ultraviolet light on the adhesive layer 3. That is, the crosslinking agent in this embodiment is used to additively react with the alkenyl group bonded to a silicon atom possessed by the silicone rubber (G alk ) contained in the silicone-based resin when activating the photosensitive platinum (Pt) catalyst in the silicone-based adhesive by irradiating light such as ultraviolet light on the adhesive layer 3, thereby crosslinking the adhesive layer 3. Through the crosslinking agent, the silicone-based resin crosslinks, the adhesive layer 3 cures, and the crosslinking density increases. Therefore, the cohesion of the adhesive layer 3 increases compared to before irradiating light such as ultraviolet light.

[0107] As the crosslinking agent, an organopolysiloxane (organohydropolysiloxane) having at least 2, preferably 3 or more hydrogen atoms (SiH groups) bonded to silicon atoms in one molecule is used. In the following description, the organopolysiloxane containing a hydrogen atom (SiH group) bonded to a silicon atom may sometimes be abbreviated as organohydropolysiloxane.

[0108] As the molecular structure of the organohydropolysiloxane used as the crosslinking agent, for example, linear, partially branched linear, branched, and network structures can be exemplified. The viscosity of the organohydropolysiloxane at 25 °C is preferably in the range of 1 mPa·s or more and 5,000 mPa·s or less. It should be noted that the above viscosity can be measured using a B-type rotational viscometer.

[0109] The organohydropolysiloxane used as the crosslinking agent can be a conventionally known crosslinking agent. For example, as the organohydropolysiloxane, the organohydropolysiloxane represented by the following general formula (5) or general formula (6) can be cited, but it is not limited thereto.

[0110] [Chemical Formula 5]

[0111] H b R 3 (3-b) SiO-(HR 3 SiO) p -(R 3 2 SiO) q -SiR 3 (3-b) H b General formula (5)

[0112] [Chemical Formula 6]

[0113]

[0114] Among them, in general formula (5) and general formula (6), R 3 is a monovalent hydrocarbon group having 1 to 10 carbon atoms, b is 0 or 1, p and q are integers, the viscosity of the organohydrogenpolysiloxane at 25 °C is a value of 1 mPa·s or more and 5,000 mPa·s or less. r is an integer of 2 or more, s is an integer of 0 or more, and r + s ≥ 3, preferably 8 ≥ r + s ≥ 3. The organohydrogenpolysiloxane can be a mixture of two or more kinds.

[0115] R 3 is a monovalent hydrocarbon group having 1 to 10 carbon atoms, preferably 1 to 7 carbon atoms. For example, alkyl groups such as methyl, ethyl, propyl, and butyl can be mentioned; cycloalkyl groups such as cyclohexyl; and aryl groups such as phenyl and tolyl, and alkenyl groups such as vinyl and allyl. Particularly preferred are methyl or phenyl.

[0116] The content of the organohydrogenpolysiloxane used as a crosslinking agent in the adhesive layer 3 of the present embodiment varies within an appropriate range according to the balance between the content of the alkenyl bonded to a silicon atom of the silicone rubber (G alk ) and the content of the hydrogen atom bonded to a silicon atom of the organohydrogenpolysiloxane, so it cannot be generalized. Usually, for example, the molar ratio of the content (total amount) of the hydrogen atom (SiH group) bonded to a silicon atom of the crosslinking agent contained in the adhesive composition constituting the adhesive layer 3 to the content (total amount) of the alkenyl bonded to a silicon atom of the organosilicon resin contained in the adhesive composition is preferably an amount in the range of 2.0 or more and 10.0 or less.

[0117] When the content of the organohydropolysiloxane is less than the above lower limit value, when irradiating the adhesive tape 1 with light such as ultraviolet rays, the increase in the crosslinking density caused by the crosslinking reaction (addition reaction) between the alkenyl group bonded to a silicon atom in the silicone rubber and the hydrogen atom (SiH group) bonded to a silicon atom in the crosslinking agent is insufficient, the adhesive is not easily cured, and it is difficult to improve the cohesive force. In this case, the desired decrease in the adhesive force and the failure mode in the holding force test cannot be obtained. When the adhesive tape 1 is used for cutting a semiconductor element substrate or the like and then the obtained semiconductor chip or the like is peeled off from the adhesive tape 1, the pick-up property of the singulated semiconductor chip may deteriorate, and residual adhesive may easily occur on the semiconductor chip or the like.

[0118] On the other hand, when the content of the organohydropolysiloxane is greater than the above upper limit value, the unreacted organohydropolysiloxane may contaminate the semiconductor chip. In addition, the hydrogen atom (SiH group) bonded to a silicon atom in the unreacted organohydropolysiloxane reacts with oxygen and moisture in the air to be converted into SiOH, and the adhesive force of the adhesive layer 3 to the adherend becomes large, so that the pick-up property of the singulated semiconductor chip may deteriorate.

[0119] As long as the content of the crosslinking agent in the adhesive layer 3 of the present embodiment is adjusted so that the molar ratio of the content (total amount) of the hydrogen atom (SiH group) bonded to a silicon atom in the entire crosslinking agent in the adhesive layer 3 to the content (total amount) of the alkenyl group bonded to a silicon atom in the entire organosilicon resin is within the above range. As the content of the crosslinking agent that satisfies the above range, it varies depending on the number of hydrogen atoms (SiH groups) bonded to a silicon atom in the crosslinking agent. For example, with respect to 100 parts by mass of the solid content of the entire organosilicon resin contained in the adhesive composition constituting the adhesive layer 3, the crosslinking agent may be added in a range of 0.20 parts by mass or more and 20.00 parts by mass or less in terms of solid content.

[0120] By setting the content of the crosslinking agent in the adhesive layer 3 relative to the organosilicon resin within the above range, when the semiconductor chip is peeled off from the cutting adhesive tape, the photosensitive platinum (Pt) catalyst in the organosilicon adhesive is activated by irradiating the adhesive layer 3 with light such as ultraviolet rays, and the crosslinking reaction (addition reaction) between the alkenyl group bonded to a silicon atom in the silicone rubber (G alk ) in the organosilicon resin and the hydrogen atom (SiH group) bonded to a silicon atom in the crosslinking agent for the organosilicon resin is promoted, the crosslinking density becomes high, and the cohesive force of the adhesive becomes larger than before the irradiation with light such as ultraviolet rays. As a result, the adhesive force of the adhesive layer 3 is appropriately reduced, good pick-up property can be achieved when peeling off the semiconductor chip or the like from the adhesive tape 1, and residual adhesive on the semiconductor chip or the like can be suppressed.

[0121] As the crosslinking agent, any crosslinking agent that is usually used as a crosslinking agent for addition reaction type silicone adhesives, i.e., an organopolysiloxane (organohydrogenpolysiloxane) having at least two hydrogen atoms (SiH groups) bonded to silicon atoms in one molecule, is acceptable and there is no particular limitation. Specifically, for example, X-92-122 (trade name) manufactured by Shin-Etsu Chemical Co., Ltd., BY24-741 (trade name) manufactured by Daw-Toray Co., Ltd., etc. can be cited. It should be noted that when the content of the hydrogen atoms (SiH groups) bonded to silicon atoms in these crosslinking agents is not clear, this content can be determined by the analysis such as 1 H-NMR (nuclear magnetic resonance) spectroscopy measurement, etc.

[0122] (Photosensitive platinum (Pt) catalyst)

[0123] The photosensitive platinum (Pt) catalyst is used to promote the curing caused by the addition reaction (hydrosilylation) of the silicone resin and the crosslinking agent constituting the adhesive layer 3 by irradiation with light such as ultraviolet light. The wavelength of the light that can be used to promote the curing caused by the addition reaction of the alkenyl group bonded to silicon atoms in the silicone rubber (G alk ) in the silicone adhesive and the hydrogen atoms (SiH groups) bonded to silicon atoms in the crosslinking agent is preferably in the range of 240 nm or more and 400 nm or less.

[0124] As the photosensitive platinum (Pt) catalyst, considering good photosensitivity and reaction rate, a photoactive cyclopentadienylplatinum(IV) compound is preferably used.

[0125] As for the photoactive cyclopentadienyl platinum(IV) compound, there is no particular limitation. For example, (cyclopentadienyl)dimethyltrimethylsilylmethyl platinum, (cyclopentadienyl)diethyltrimethylsilylmethyl platinum, (cyclopentadienyl)dipropyltrimethylsilylmethyl platinum, (cyclopentadienyl)diisopropyltrimethylsilylmethyl platinum, (cyclopentadienyl)diallyltrimethylsilylmethyl platinum, (cyclopentadienyl)dibenzyltrimethylsilylmethyl platinum, (cyclopentadienyl)dimethyltriethylsilylmethyl platinum, (cyclopentadienyl)dimethyltripropylsilylmethyl platinum, (cyclopentadienyl)dimethyltriisopropylsilylmethyl platinum, (cyclopentadienyl)dimethyltriphenylsilylmethyl platinum, (cyclopentadienyl)dimethylmethyldiphenylsilylmethyl platinum, (cyclopentadienyl)dimethylmethyldiphenylsilylmethyl platinum, (cyclopentadienyl)dimethylbis(trimethylsiloxy)silylmethyl platinum, (cyclopentadienyl)dimethylbis(dimethylvinylsiloxy)silylmethyl platinum, [(1'-naphthyl)cyclopentadienyl]trimethylsilylmethyl platinum, [(2'-naphthyl)cyclopentadienyl]trimethylsilylmethyl platinum, [1-methyl-3-(1'-naphthyl)cyclopentadienyl]trimethylsilylmethyl platinum, [1-methyl-3-(2'-naphthyl)cyclopentadienyl]trimethylsilylmethyl platinum, [(4'-biphenyl)cyclopentadienyl]trimethylsilylmethyl platinum, [1-(4'-biphenyl)-3-methylcyclopentadienyl]trimethylsilylmethyl platinum, [(9'-phenanthryl)cyclopentadienyl]trimethylsilylmethyl platinum, [1-methyl-3-(9'-phenanthryl)cyclopentadienyl]trimethylsilylmethyl platinum, [1-(2'-anthryl)-3-methylcyclopentadienyl]trimethylsilylmethyl platinum, [(2'-anthryl)cyclopentadienyl]trimethylsilylmethyl platinum, [(1'-pyrenyl)cyclopentadienyl]trimethylsilylmethyl platinum, [1-methyl-3-(1'-pyrenyl)cyclopentadienyl]trimethylsilylmethyl platinum, etc. can be cited.

[0126] The cyclopentadienyl ring in the above compounds can be substituted by methyl, chlorine, fluorine, trimethylsilyl, triethylsilyl, dimethylphenylsilyl, methyldiphenylsilyl, triphenylsilyl, phenyl, fluorophenyl, chlorophenyl, methoxy, naphthyl, biphenyl, anthryl, pyrenyl, 2-benzoylnaphthalene, thioxanthone, 2-chlorothioxanthone, 2-isopropylthioxanthone, anthraquinone, 1-chloroanthraquinone, acetophenone, benzophenone, 9,10-dimethylanthracene, 9,10-dichloroanthracene, and a cyclopentadienyl ring substituted with one or more groups selected from these groups.

[0127] In addition, in the above compounds, the cyclopentadienyl ring can also be substituted by η5-fluorenyl.

[0128] As the cyclopentadienyl ring in the above compound, a cyclopentadienyl ring that is preferably unsubstituted, a cyclopentadienyl ring substituted with one or more aromatic organic groups, a cyclopentadienyl ring substituted with one or more aliphatic organic groups, or a cyclopentadienyl ring substituted with one or more aromatic organic groups and one or more aliphatic organic groups. In addition, as the organic group that can be substituted on the cyclopentadienyl ring, naphthyl, biphenyl, anthryl, phenanthryl, and pyrenyl are preferred.

[0129] The content of the photosensitive platinum (Pt) catalyst in the pressure-sensitive adhesive layer 3 of the present embodiment is not particularly limited as long as it can promote the addition reaction between the alkenyl group bonded to a silicon atom in the silicone-based pressure-sensitive adhesive and the hydrogen atom bonded to a silicon atom (SiH group) in the crosslinking agent by irradiation with light such as ultraviolet light. For example, the content of the photosensitive platinum (Pt) catalyst in the pressure-sensitive adhesive layer 3 of the present embodiment is preferably in the range of 0.10 parts by mass or more and 3.00 parts by mass or less in terms of solid content with respect to 100 parts by mass of the solid content of the entire silicone-based resin in the pressure-sensitive adhesive composition constituting the pressure-sensitive adhesive layer 3. When the content of the photosensitive platinum (Pt) catalyst is less than 0.10 parts by mass, when the adhesive tape 1 is irradiated with light such as ultraviolet light, the crosslinking reaction (addition reaction) between the alkenyl group bonded to a silicon atom in the silicone rubber and the hydrogen atom bonded to a silicon atom (SiH group) in the crosslinking agent will not proceed sufficiently, the increase in crosslinking density is insufficient, the pressure-sensitive adhesive is not easily cured, and the cohesion is difficult to improve. In this case, the desired reduction in adhesive force and the failure mode in the holding force test cannot be obtained. When the adhesive tape 1 is used for cutting a semiconductor element substrate or the like and then the obtained semiconductor chip or the like is peeled off from the adhesive tape 1, the pick-up property of the singulated semiconductor chip may deteriorate, and residual adhesive may easily occur on the semiconductor chip or the like. On the other hand, when the content of the photosensitive platinum (Pt) catalyst is greater than 3.00 parts by mass, the above crosslinking reaction (addition reaction) proceeds sufficiently. Therefore, for example, even at a content of 10.0 parts by mass, there are no particular problems as the characteristics of the adhesive tape 1, but it is not good from the economic point of view.

[0130] (Other components)

[0131] The silicone-based pressure-sensitive adhesive layer of the present embodiment is formed from a pressure-sensitive adhesive composition containing a silicone-based resin obtained by mixing silicone rubber (G) and silicone resin (R), an organopolysiloxane having at least two or more hydrogen atoms bonded to a silicon atom (SiH groups) in one molecule as a crosslinking agent for the silicone-based resin, and a photosensitive platinum (Pt) catalyst as the main components. However, within the range that does not impair the effects of the present invention, other components may also be contained. As other components, a cohesion enhancer, a reinforcing filler, a peeling controller, etc. can be cited.

[0132] (Cohesion enhancer)

[0133] The cohesion improver is used as needed to improve the cohesion of the adhesive layer 3. There is no particular limitation on the cohesion improver. For example, polyfunctional thiols can be used. Examples of the cohesion improver composed of polyfunctional thiols include KARENZ (registered trademark) MT-PE1, KARENZ MT-NR1, etc. manufactured by Showa Denko K.K.

[0134] However, since the silicone resin in the adhesive composition constituting the adhesive layer 3 is incompatible with the polyfunctional thiol, in order to use the polyfunctional thiol as the cohesion improver, a compatibilizer for the silicone resin and the polyfunctional thiol is required. There is no particular limitation on the compatibilizer. For example, KBM-802, KBM-803 (both are trade names) manufactured by Shin-Etsu Chemical Co., Ltd., SH6062 (trade name) manufactured by Daw-Toray Co., Ltd., etc., which are silane coupling agents having a mercapto group, can be cited.

[0135] When a cohesion improver is used in the adhesive layer 3, the addition amount of the cohesion improver is preferably in the range of 6 parts by mass or less in terms of solid content relative to 100 parts by mass of the solid content of the entire silicone resin. When the addition amount of the cohesion improver is more than 6 parts by mass in terms of solid content relative to 100 parts by mass of the solid content of the entire silicone resin, phase separation may occur between the silicone resin and the polyfunctional thiol as the cohesion improver even if a compatibilizer is added.

[0136] (Reinforcing filler)

[0137] The reinforcing filler is used as needed to improve the strength of the adhesive layer 3. There is no particular limitation on the reinforcing filler. For example, AEROSIL (registered trademark) 130, AEROSIL 200, AEROSIL 300 manufactured by Nippon Aerosil Co., Ltd.; REOLOSIL (registered trademark) QS-102, REOLOSIL QS-30 manufactured by Tokuyama Corporation; CARPLEX (registered trademark) 80 manufactured by DSL (Japan) Co., Ltd.; Hi-Sil (registered trademark)-233-D manufactured by PPG, etc. can be cited.

[0138] (Release control agent)

[0139] The release control agent is used as needed to further reduce the adhesive force of the adhesive layer 3 after light irradiation such as ultraviolet rays. There is no particular limitation on the release control agent. For example, light release additives such as silicone oil can be cited. However, when the addition amount of the release control agent is large, the surface of the adherend may be contaminated due to leakage, so it is preferably added within the range where the contamination level of the adherend surface is allowable.

[0140] <Thickness of the adhesive layer>

[0141] The thickness of the adhesive layer 3 is preferably in the range of 10 μm or more and 100 μm or less, more preferably in the range of 20 μm or more and 40 μm or less. When the thickness of the adhesive layer 3 is less than 10 μm, the thickness of the silicone-based adhesive contained in the adhesive layer 3 becomes thinner, so the adhesive strength of the adhesive tape 1 is likely to decrease. On the other hand, when the thickness of the adhesive layer 3 is thicker than 100 μm, cohesive failure of the adhesive layer 3 may easily occur. In addition, when the adhesive tape 1 is used for cutting a semiconductor element substrate or the like and then the obtained semiconductor chip or the like is peeled off from the adhesive tape 1, residual adhesive may easily be generated on the semiconductor chip or the like. Further, when cutting a semiconductor element substrate or the like, the vibration during cutting is easily transmitted to the adhesive layer 3 and the vibration amplitude becomes larger. For example, the semiconductor element substrate may shift from the reference position. Along with this, the singulated semiconductor chips are likely to have notches (chips), and size deviations may occur in each individual semiconductor chip.

[0142] <Anchor coat>

[0143] As described above, in the adhesive tape 1 of the present embodiment, an anchor coat matching the type of the base material 2 or a surface treatment such as corona treatment can be provided between the base material 2 and the adhesive layer 3 according to the manufacturing conditions of the adhesive tape 1, the usage conditions of the adhesive tape 1 after manufacturing, and the like. Thereby, the adhesion between the base material 2 and the adhesive layer 3 can be improved.

[0144] <Surface treatment>

[0145] A surface treatment such as a peelability improvement treatment can be performed on the surface of the base material 2 (the surface on the side opposite to the surface facing the adhesive layer 3). The treatment agent for the surface treatment of the base material 2 is not particularly limited. For example, non-silicone-based peel treatment agents such as long-chain alkyl vinyl monomer polymers, fluoroalkyl vinyl monomer polymers, polyvinyl alcohol urethanes, and amino alkyd resins can be used. As such non-silicone-based peel treatment agents, for example, PEELOIL (registered trademark) 1050 and PEELOIL 1200 manufactured by Lion Specialty Chemical Co., Ltd. can be cited.

[0146] <Release liner>

[0147] In addition, a release liner may be provided as needed on the surface of the adhesive layer 3 (the surface on the side opposite to the surface facing the base material 2). As the release liner, a release liner obtained by performing a release treatment for improving the releasability from the silicone-based adhesive contained in the adhesive layer 3 on a film such as paper, polyethylene, polypropylene, or polyethylene terephthalate can be used. The material used in the release treatment of the release liner is not particularly limited. For example, materials such as fluoroalkyl-modified silicone, long-chain alkyl vinyl monomer polymer, and amino alkyd resin can be used.

[0148] <Thickness of the adhesive tape>

[0149] The overall thickness of the adhesive tape 1 having the configuration as described above is preferably in the range of 20 μm or more and 200 μm or less.

[0150] When the thickness of the adhesive tape 1 is less than 20 μm, when the adhesive tape 1 is used for cutting a semiconductor element substrate or the like, it may be difficult to peel off the formed semiconductor chip or the like from the adhesive tape 1.

[0151] On the other hand, when the thickness of the adhesive tape 1 is greater than 200 μm, when the adhesive tape 1 is adhered to a semiconductor element substrate, the adhesive tape 1 is less likely to follow the unevenness formed on the adhesion surface of the semiconductor element substrate. In this case, the adhesion area between the adhesive tape 1 and the semiconductor element substrate or the like becomes smaller, and the semiconductor chip or the like may easily fly off during cutting.

[0152] [Manufacturing method of the adhesive tape]

[0153] Next, a manufacturing method of the adhesive tape 1 of the present embodiment will be described. It should be noted that the manufacturing method of the adhesive tape 1 described below is an example, and the manufacturing method of the adhesive tape 1 is not limited thereto.

[0154] When manufacturing the adhesive tape 1, first, components such as the above-described silicone-based adhesive, crosslinking agent, and photosensitive platinum (Pt) catalyst are dissolved in a general organic solvent such as toluene or ethyl acetate to obtain an adhesive solution. Then, the adhesive solution is applied to the surface of the base material 2 that has been surface-treated and anchor-coated as needed using a beveled wheel coater or the like so as to have a predetermined thickness.

[0155] Next, the substrate 2 coated with the adhesive solution is heated in a drying furnace, thereby drying the adhesive solution to form an adhesive layer 3. As the conditions for heating and drying, for example, the conditions disclosed in Japanese Patent Application Laid-Open No. 2012-107125 etc. can be referred to. Specifically, for example, an adhesive solution for the adhesive layer 3 can be coated on the substrate 2, and after initial drying by gradually raising the temperature to 40 to 90°C in the front half region of the drying furnace, heating and drying is performed at a temperature range of 120 to 200°C for 1 to 5 minutes in the rear half region of the drying furnace, and the original sheet material is wound into a roll shape.

[0156] Through the above steps, as Figure 1 shown, an adhesive tape 1 with an adhesive layer 3 laminated on a substrate 2 can be obtained.

[0157] [Usage method of the adhesive tape]

[0158] The adhesive tape 1 of the present embodiment is used for cutting a semiconductor material, which is a raw material of a semiconductor chip, in the manufacturing process of a semiconductor chip having semiconductor elements such as LEDs (Light Emitting Diodes) and power semiconductors.

[0159] Specifically, the adhesive tape 1 is used to cut a semiconductor element substrate on which a plurality of semiconductor elements such as LED elements and power semiconductor elements are formed on a substrate made of resin, ceramic, etc. to obtain singulated semiconductor chips. Here, for a semiconductor element substrate on which a plurality of semiconductor elements are formed, usually in order to protect the semiconductor elements from the influence of external environments such as temperature and humidity, a sealing resin, which is an example of a covering material, is sometimes provided in a manner of covering the semiconductor elements.

[0160] The adhesive tape 1 of the present embodiment can be more preferably used for cutting a semiconductor element substrate provided with a sealing resin in particular.

[0161] As a method for cutting a semiconductor element substrate provided with a sealing resin to obtain a plurality of semiconductor chips, for example, the following method has been conventionally known.

[0162] First, a cutting adhesive tape is pasted from the substrate side of the semiconductor element substrate, and the semiconductor element substrate is cut from the side where the semiconductor elements are formed using a cutting machine or the like. Then, each semiconductor chip formed by cutting is peeled off from the adhesive tape to obtain a plurality of semiconductor chips.

[0163] However, when cutting the semiconductor element substrate by pasting a cutting adhesive tape from the substrate side of the semiconductor element substrate in this way, there are problems such as so-called sag (ダレ) where peeling occurs on the cut surface (the substrate side surface of the semiconductor chip), or the cut surface becoming rough.

[0164] Therefore, in recent years, in order to solve such problems, the following methods have been proposed: for a semiconductor element substrate, a dicing adhesive tape is pasted not only from the substrate side but also from the side where the semiconductor element is formed, that is, from the side of the encapsulating resin that encapsulates the semiconductor element, and the semiconductor element substrate is cut.

[0165] Here, as an encapsulating resin for semiconductor elements such as LEDs and power semiconductors, epoxy resin with excellent electrical properties and heat resistance has been used in the past. However, epoxy resin has the following problems: when used for high-output LEDs, power semiconductors, short-wavelength LEDs, or due to the usage environment of semiconductor chips, etc., it is prone to discoloration.

[0166] On the contrary, for the reason that it is less likely to discolor due to heat and light compared with epoxy resin, in recent years, silicone resin has been mostly used as an encapsulating resin for semiconductor elements such as LEDs and power semiconductors. More specifically, silicone resin containing both or one of methyl and phenyl as functional groups is mostly used, that is, silicone resin containing methyl, silicone resin containing phenyl, and silicone resin containing both methyl and phenyl.

[0167] By using silicone resin as the encapsulating resin of semiconductor elements, discoloration of the encapsulating resin caused by heat and light can be suppressed. In addition, the light transmittance of silicone resin is as high as 88% or more (wavelength 400 - 800 nm), and the refractive index can be adjusted in the range of 1.41 or more and 1.57 or less. Therefore, when the semiconductor element is an LED, by using silicone resin with a higher refractive index as the encapsulating resin, the emitted light from the LED can be effectively extracted to the outside of the package. Among the above silicone resins, by using silicone resin containing phenyl, compared with the case of using silicone resin containing methyl, the refractive index of the sealing material can be further increased, and thus the efficiency of the emitted light can be further improved.

[0168] The silicone resin containing methyl is not particularly limited. For example, KER-2300, KER-2460, KER-2500N, KER-2600, KER-2700, KER-2900, X-32-2528 (all are trade names) manufactured by Shin-Etsu Chemical Co., Ltd.; IVS4312, IVS4312, XE14-C2042, IVS4542, IVS4546, IVS4622, IVS4632, IVS4742, IVS4752, IVSG3445, IVSG0810, IVSG5778, XE13-C2479, IVSM4500 (all are trade names) manufactured by Momentive Performance Materials Inc.; OE-6351, OE-6336, OE-6301 (all are trade names) manufactured by Daw-Toray Co., Ltd., etc. can be cited.

[0169] The silicone resin containing methyl and phenyl groups is not particularly limited. For example, KER-6075, KER-6150, KER-6020 (all are trade names) manufactured by Shin-Etsu Chemical Co., Ltd. can be cited.

[0170] The silicone resin containing phenyl groups is not particularly limited. For example, KER-6110, KER-6000, KER-6200, ASP-1111, ASP-1060, ASP-1120, ASP-1050P (all are trade names) manufactured by Shin-Etsu Chemical Co., Ltd.; XE14-C2508 (trade name) manufactured by Momentive Performance Materials Inc.; OE-6520, OE-6550, OE-6631, OE-6636, OE-6635, OE-6630 (all are trade names) manufactured by Daw-Toray Co., Ltd. etc. can be cited.

[0171] In addition, conventionally, as the dicing adhesive tape used for dicing semiconductor elements, for example, an adhesive tape having an adhesive layer composed of an acrylic resin-based adhesive is used.

[0172] However, if such a conventional adhesive tape is pasted from the side (sealing resin side) where semiconductor elements are formed on the semiconductor element substrate to perform dicing of the semiconductor element substrate, for example, when the adhesive force between the sealing resin and the adhesive tape is insufficient, problems such as scattering of semiconductor chips may occur during dicing.

[0173] In particular, the above silicone resin has, for example, a property of higher mold release property compared to epoxy resins and the like that have been conventionally used as sealing resins. Therefore, for a semiconductor element substrate using a silicone resin as the sealing resin, when an adhesive tape having an adhesive layer composed of an acrylic resin-based adhesive is pasted, the adhesive force between the silicone resin as the sealing resin and the adhesive tape tends to become small. As a result, problems such as scattering of semiconductor chips are more likely to occur during dicing of the semiconductor element substrate.

[0174] In contrast, the adhesive tape 1 of the present embodiment is configured such that the adhesive layer 3 is composed of an organosilicon resin-based adhesive composition containing silicone rubber (G) and silicone resin (R) mixed at an appropriate ratio as described above. Thus, when dicing the semiconductor element substrate, even when used by pasting from the sealing resin side composed of a silicone resin, the adhesive force and the tackiness force with the sealing resin of the semiconductor element substrate can be maintained well. In addition, compared with conventional adhesive tapes, when dicing the semiconductor element substrate, the occurrence of scattering of semiconductor chips and the like can be suppressed.

[0175] On the other hand, the adhesive composition constituting the adhesive layer 3 contains the above-mentioned silicone resin, a photosensitive platinum (Pt) catalyst, and a crosslinking agent. By irradiating light such as ultraviolet rays, the photosensitive platinum (Pt) catalyst in the adhesive composition is activated, promoting the crosslinking reaction (addition reaction) between the vinyl group bonded to a silicon atom in the silicone rubber (G alk ) in the silicone resin and the hydrogen atom (SiH group) bonded to a silicon atom in the crosslinking agent for the silicone resin. As the crosslinking density increases, the cohesive force of the adhesive becomes larger compared to before irradiation with light such as ultraviolet rays. As a result, the adhesive force of the adhesive layer 3 is appropriately reduced, and the failure mode in the holding force test becomes "interface peeling" or "not falling off" in the holding force test. Thereby, good pick-up property when peeling a semiconductor chip or the like from the adhesive tape 1 can be achieved, and residual adhesive on the semiconductor chip or the like can be suppressed.

[0176] Hereinafter, the method of using the adhesive tape 1 of the present embodiment and the manufacturing method of a semiconductor chip using the adhesive tape 1 of the present embodiment will be described in detail. Figure 2 (a) to (e) of FIG. are diagrams showing a manufacturing method of a semiconductor chip using the adhesive tape 1 of the present embodiment.

[0177] It should be noted that, here, an example of manufacturing a semiconductor chip having an LED element as a semiconductor element using the adhesive tape 1 will be described. In addition, the method described below is an example of the method of using the adhesive tape 1 and the manufacturing method of a semiconductor chip using the adhesive tape 1, and is not limited to the following method.

[0178] In the present embodiment, first, a plurality of semiconductor elements 102 are placed on a substrate 101 made of, for example, a resin material, ceramics, etc., to fabricate a semiconductor element substrate 100. It should be noted that the semiconductor element 102 is, for example, an LED element, and although not shown, it is composed of, for example, a plurality of semiconductor layers including a light-emitting layer that emits light when energized, and an electrode is formed on the upper part.

[0179] Next, a plurality of semiconductor elements formed on the substrate 101 of the semiconductor element substrate 100 are sealed with a sealing resin 103 made of a silicone resin (sealing step). It should be noted that in this example, a plurality of semiconductor elements 102 are sealed together with the sealing resin 103, but each semiconductor element 102 can also be individually sealed with the sealing resin 103.

[0180] Next, as shown in (a) of FIG. Figure 2 the adhesive tape 1 is attached to the semiconductor element substrate 100 so that the adhesive layer 3 of the adhesive tape 1 faces the sealing resin 103 of the semiconductor element substrate 100 (attachment step).

[0181] Next, as shown in (b) and (c) of Figure 2 , in a state where the adhesive tape 1 is attached to the semiconductor element substrate 100, the semiconductor element substrate 100 is cut along the cutting line X using a cutting machine or the like (cutting process). In this example, the semiconductor element substrate 100 to which the adhesive tape 1 is attached is cut from the substrate 101 side. In addition, as shown in (c) of Figure 2 , in this example, a so-called full cut is performed in which the semiconductor element substrate 100 is completely cut in the thickness direction.

[0182] Next, as shown in (d) of Figure 2 , light such as ultraviolet rays is irradiated onto the adhesive tape 1 attached to the semiconductor element substrate 100 from the base material 2 side (irradiation process). As described above, the base material 2 is made of a material that transmits light such as ultraviolet rays. Therefore, by irradiating light such as ultraviolet rays onto the adhesive tape 1 from the base material 2 side, the light such as ultraviolet rays passes through the base material 2 and irradiates the adhesive layer 3.

[0183] In the adhesive tape 1 of the present embodiment, the adhesive layer 3 has a photosensitive platinum (Pt) catalyst. Therefore, by irradiating light such as ultraviolet rays onto the adhesive layer 3, the photosensitive platinum (Pt) catalyst is activated, and the addition reaction between the organosilicon resin containing an alkenyl group bonded to a silicon atom and the crosslinking agent in the adhesive layer 3 is promoted. As a result, the crosslinking density, that is, the cohesive force in the adhesive layer 3 increases, and the adhesive force of the adhesive layer 3 decreases compared to before the irradiation of light such as ultraviolet rays.

[0184] Next, the semiconductor chip 200 formed by cutting the semiconductor element substrate 100 is peeled off (picked up) from the adhesive tape 1, so that as shown in (e) of Figure 2 , a singulated semiconductor chip 200 can be obtained (peeling process).

[0185] As described above, in the adhesive tape 1 of the present embodiment, the adhesive layer 3 is composed of an organosilicon resin in which silicone rubber (G) and silicone resin (R) are mixed at an appropriate ratio. Thus, when the adhesive tape 1 is used for cutting, the adhesive force and the adhesive strength of the adhesive tape 1 to the semiconductor element substrate 100 can be maintained well.

[0186] In particular, in recent years, as the sealing resin 103 for sealing the semiconductor element 102, a silicone resin with high mold release property is mostly used. In contrast, the adhesive tape 1 of the present embodiment has the above-described configuration, and thus has good adhesive force and adhesive strength even to the sealing resin 103 formed of a silicone resin.

[0187] As a result, when the adhesive tape 1 of the present embodiment is used for cutting the semiconductor element substrate 100, the scattering of the semiconductor chip 200 can be suppressed.

[0188] Furthermore, the adhesive composition containing a silicone resin that constitutes the adhesive layer 3 of the adhesive tape 1 according to the present embodiment has good adhesion to the sealing resin 103 as described above, and on the other hand, has a high releasability.

[0189] That is, the adhesive tape 1 according to the present embodiment contains a photosensitive platinum (Pt) catalyst, which promotes the addition reaction of a silicone resin containing an alkenyl group bonded to a silicon atom in the adhesive layer 3 with a crosslinking agent, for example, by irradiation with light such as ultraviolet light. Moreover, by irradiating the adhesive layer 3 with light such as ultraviolet light through the substrate 2 after the cutting step and before the peeling step, the photosensitive platinum (Pt) catalyst is activated, promoting the addition reaction of the silicone resin containing an alkenyl group bonded to a silicon atom in the adhesive layer 3 with the crosslinking agent, increasing the crosslinking density in the adhesive layer 3 compared to before irradiation with light such as ultraviolet light, that is, enabling an increase in cohesion and a decrease in the adhesive force of the adhesive layer 3. As a result, in the peeling step, when peeling off (picking up) the semiconductor chip 200 obtained by cutting the semiconductor element substrate 100 from the adhesive tape 1, it is possible to suppress the generation of so-called residual glue in which the adhesive adheres to the semiconductor chip 200. In addition, good pick-up properties when peeling the semiconductor chip 200 from the adhesive tape 1 can be achieved.

[0190] It should be noted that above, a method of obtaining a singulated semiconductor chip by pasting the adhesive tape 1 from the sealing resin side and cutting a semiconductor element substrate on which a plurality of semiconductor elements are formed has been described. However, the use of the adhesive tape 1 according to the present embodiment is not limited thereto.

[0191] The adhesive tape 1 according to the present embodiment can also be used, for example, in the manufacture of chip-scale packaged LEDs to cut a semiconductor material in which a plurality of LED elements are coated with a phosphor as an example of a coating material to obtain a singulated chip-scale packaged LED. It should be noted that the phosphor refers to a member in which a fluorescent material is dispersed in a resin material, ceramic, etc.

[0192] In recent years, with the miniaturization of chip-scale packaged LEDs, there has been a tendency for singulated chip-scale packaged LEDs to easily scatter during cutting. In contrast, by using the adhesive tape 1 according to the present embodiment having the above configuration, it is possible to satisfactorily maintain the adhesive force between the phosphor and the adhesive layer 3 and suppress the scattering of the singulated chip-scale packaged LEDs.

[0193] In addition, by irradiating the adhesive layer 3 with light such as ultraviolet light after cutting to reduce the adhesive force, it is easy to peel off the singulated chip-scale packaged LED from the adhesive tape 1, and it is possible to suppress the generation of residual glue on the peeled chip-scale packaged LED.

[0194] Examples

[0195] Next, examples and comparative examples are used to further specifically illustrate the present invention. It should be noted that the present invention is not limited by the following examples.

[0196] To prepare various adhesive compositions used in the examples and comparative examples, the following organosilicon resins (a) to (h) were used as the main components of the adhesive compositions, and the following organopolysiloxanes (organohydrogenated polysiloxanes) (m) and (n) having hydrogen atoms (SiH) bonded to silicon atoms were used as crosslinking agents.

[0197] The organosilicon resins (a) to (c) are all mixtures of silicone rubber (G alk ) and silicone resin (R) containing alkenyl groups bonded to silicon atoms, and their mixing ratios and the contents of alkenyl groups bonded to silicon atoms are different from each other. This silicone rubber (G alk ) uses a dimethylsiloxane-methylvinylsiloxane copolymer capped with dimethylethenylsiloxanyl groups at both ends of the molecular chain with a weight-average molecular weight (Mw) of about 500,000, and this silicone resin (R) uses an organopolysiloxane (MQ resin) with a weight-average molecular weight (Mw) of about 5,000 having R 2 3 SiO 0.5 units (M units) and SiO 2 units (Q units).

[0198] In addition, the organosilicon resins (d) and (e) are both single substances of silicone rubber (G alk ) containing alkenyl groups bonded to silicon atoms, and the contents of alkenyl groups bonded to silicon atoms are different from each other. The silicone rubber (G alk ) of the organosilicon resin (d) uses a dimethylsiloxane-methylhexenylsiloxane copolymer capped with dimethylhexenylsiloxanyl groups at both ends of the molecular chain with a weight-average molecular weight (Mw) of about 300,000, and the silicone rubber (G alk ) of the organosilicon resin (e) uses a dimethylsiloxane polymer capped with dimethylethenylsiloxanyl groups at both ends of the molecular chain with a weight-average molecular weight (Mw) of about 200,000.

[0199] Furthermore, the organosilicon resins (f) and (g) are both mixtures of silicone rubber (G 0 ) without alkenyl groups bonded to silicon atoms and silicone resin (R), and their mixing ratios are different from each other. This silicone rubber (G 0 ) uses a dimethylsiloxane polymer with a weight-average molecular weight (Mw) of about 500,000, and this silicone resin (R) uses an organopolysiloxane (MQ resin) with a weight-average molecular weight (Mw) of about 5,000 having R 2 3 SiO 0.5 units (M units) and SiO 2 units (Q units).

[0200] Furthermore, the silicone-based resin (h) is a single substance of a silicone resin (R), and the silicone resin (R) uses an organopolysiloxane (MQ resin) having an M unit of R with a weight average molecular weight (Mw) of about 5,000 and an SiO 2 3 SiO 0.5 unit (M unit) and an SiO 2 unit (Q unit).

[0201] · Silicone-based resin (a)

[0202] A mixture of silicone rubber (G alk ) and silicone resin (R)

[0203] (G alk ) / (R) = 40.0 mass% / 60.0 mass%

[0204] Vinyl (ethenyl) content: 2.0×10 -6 mol / g

[0205] · Silicone-based resin (b)

[0206] A mixture of silicone rubber (G alk ) and silicone resin (R)

[0207] (G alk ) / (R) = 35.0 mass% / 65.0 mass%

[0208] Vinyl (ethenyl) content: 1.8×10 -6 mol / g

[0209] · Silicone-based resin (c)

[0210] A mixture of silicone rubber (G alk ) and silicone resin (R)

[0211] (G alk ) / (R) = 50.0 mass% / 50.0 mass%

[0212] Vinyl (ethenyl) content: 2.5×10 -6 mol / g

[0213] · Silicone-based resin (d)

[0214] A single substance of silicone rubber (G alk )

[0215] Vinyl (hexenyl) content: 2.0×10 -4 mol / g

[0216] · Silicone-based resin (e)

[0217] Silicone rubber (G alk ) single substance

[0218] Vinyl (ethenyl) content: 2.7×10 -3 mol / g

[0219] · Silicone resin (f)

[0220] Silicone rubber (G 0 ) and silicone resin (R) mixture

[0221] (G 0 ) / (R) = 40.0 mass% / 60.0 mass%

[0222] Does not contain vinyl

[0223] · Silicone resin (g)

[0224] Silicone rubber (G 0 ) and silicone resin (R) mixture

[0225] (G 0 ) / (R) = 60.0 mass% / 40.0 mass%

[0226] Does not contain vinyl

[0227] · Silicone resin (h)

[0228] Silicone resin (R) single substance

[0229] Does not contain vinyl

[0230] · Crosslinking agent (m)

[0231] Organic hydrogenated polysiloxane

[0232] SiH group content: 2.0×10 -2 mol / g

[0233] · Crosslinking agent (n)

[0234] Organic hydrogenated polysiloxane

[0235] SiH group content: 2.4×10 -3 mol / g

[0236] It should be noted that the vinyl content of the silicone resin and the SiH group content of the crosslinking agent used above are quantified by measuring the 500 MHz 1 H-NMR (nuclear magnetic resonance) spectrum. Specifically, the non-volatile components of the above silicone resin are fully dissolved in deuterated chloroform containing dimethyl sulfoxide as an internal standard sample, and measured using the NMR device "JNM·ECA500" (product name) manufactured by JEOL Ltd.1 H-NMR (nuclear magnetic resonance) spectrum. Next, the resonance signal area (integral value) of dimethyl sulfoxide of the internal standard sample in the measured spectrum and the resonance signal area (integral value) of the alkenyl group are determined, and the content of the alkenyl group per 1 g (solid content) of the silicone resin is calculated from their ratio. In addition, for the SiH group content of the crosslinking agent, it is also measured in the same way 1 H-NMR spectrum, the resonance signal area (integral value) of dimethyl sulfoxide of the internal standard sample in the measured spectrum and the resonance signal area (integral value) of the SiH group are determined, and the content of the SiH group per 1 g (solid content) of the crosslinking agent is calculated from their ratio. It should be noted that in the case where the crosslinking agent is initially added internally to the silicone resin, as long as the 1 contents of the alkenyl group and the SiH group are calculated simultaneously from the H-NMR spectrum

[0237] 1. Production of the adhesive tape

[0238] (Example 1)

[0239] <Preparation of the silicone resin solution>

[0240] The silicone resin (S1) obtained by mixing the silicone resin (a) and the silicone resin (d) so that the mass ratio (a) / (d) is 96.85 / 3.15 is diluted with toluene and stirred to prepare a silicone resin (S1) solution (solid content concentration: 30% by mass). The mixing ratio ((G) / (R)) of the silicone rubber (G) and the silicone resin (R) in the silicone resin (S1) is 41.9 / 58.1, and the alkenyl group content is 8.2×10 -6 mol / g. Here, the total mass of the silicone rubber (G) is the sum of "the silicone rubber (G alk ) of the silicone resin (a)" and "the silicone rubber (G alk ) of the silicone resin (d)". In addition, the total mass of the silicone resin (R) is the amount of the silicone resin (R) of the silicone resin (a).

[0241] <Preparation of the crosslinking agent solution>

[0242] Next, the crosslinking agent (C1) obtained by mixing the crosslinking agent (m) and the crosslinking agent (n) so that the mass ratio (m) / (n) is 8.82 / 91.18 is diluted with toluene and stirred to prepare a crosslinking agent (C1) solution (solid content concentration: 20% by mass). The SiH group content of the crosslinking agent (C1) is 4.0×10 -3 mol / g

[0243] <Preparation of the adhesive solution>

[0244] Next, 3.50 parts by mass of a crosslinking agent (C1) solution (0.70 part by mass in terms of solid content, SiH group / vinyl molar ratio = 3.4) was added to 333.00 parts by mass of the above silicone resin (S1) solution (100 parts by mass in terms of solid content) using a disperser, and the mixture was stirred and mixed uniformly. Next, 5.13 parts by mass of a solution (0.77 part by mass in terms of solid content) obtained by diluting a photosensitive platinum (Pt) catalyst "trimethyl(methylcyclopentadienyl)platinum(IV)" manufactured by Sigma-Aldrich Japan K.K. with toluene to a solid content concentration of 15% by mass was added using a disperser, and the mixture was stirred and mixed uniformly to prepare an adhesive solution for coating.

[0245] Next, the above adhesive solution was coated on a substrate 2 made of a polyethylene terephthalate (PET) film with a thickness of 38 μm. Then, the adhesive solution coated on the substrate 2 was initially dried stepwise at a temperature of 40 to 90°C in the first half of a drying oven, and then heated for 3 minutes in a region where the maximum temperature of the heat treatment provided in the second half of the drying oven was 120°C to dry it, forming an adhesive layer 3 with a dried thickness of 20 μm. Next, a release liner that had been subjected to a release treatment with a fluorinated alkyl-modified silicone was bonded to the adhesive layer 3. Thus, an adhesive tape 1 with a total dried thickness of 58 μm was obtained.

[0246] (Example 2)

[0247] <Preparation of silicone resin solution>

[0248] A silicone resin (S2) obtained by mixing silicone resin (b), silicone resin (d), and silicone resin (h) such that the mass ratio (b) / (d) / (h) was 97.30 / 0.95 / 1.75 was diluted with toluene and stirred to prepare a silicone resin (S2) solution (solid content concentration: 30% by mass). In this silicone resin (S2), the mixing ratio of silicone rubber (G) to silicone resin (R) ((G) / (R)) was 35.0 / 65.0, and the vinyl content was 3.6×10 -6 mol / g. Here, the total mass of silicone rubber (G) was the sum of "silicone rubber (G alk ) of silicone resin (b)" and "silicone rubber (G alk ) of silicone resin (d)". In addition, the total mass of silicone resin (R) was the sum of "silicone resin (R) of silicone resin (b)" and "silicone resin (R) of silicone resin (h)".

[0249] <Preparation of crosslinking agent solution>

[0250] Next, a crosslinking agent (C2) obtained by mixing a crosslinking agent (m) and a crosslinking agent (n) such that the mass ratio (m) / (n) is 2.83 / 97.17 was diluted with toluene and stirred to prepare a crosslinking agent (C2) solution (solid content concentration: 20% by mass). The SiH group content of this crosslinking agent (C2) was 2.9×10 -3 mol / g.

[0251] <Preparation of Adhesive Solution>

[0252] Next, 3.30 parts by mass (0.66 parts by mass in terms of solid content, SiH group / vinyl molar ratio = 5.3) of the crosslinking agent (C2) solution was added to 333.00 parts by mass (100 parts by mass in terms of solid content) of the above-mentioned silicone resin (S2) solution using a disperser, and uniformly stirred and mixed. Next, 5.20 parts by mass (0.78 parts by mass in terms of solid content) of a solution obtained by diluting the photosensitive platinum (Pt) catalyst "trimethyl(methylcyclopentadienyl)platinum(IV)" manufactured by Sigma-Aldrich Japan K.K. with toluene to a solid content concentration of 15% by mass was added using a disperser, and uniformly stirred and mixed to prepare an adhesive solution for coating.

[0253] Next, the above-mentioned adhesive solution was coated on a substrate 2 made of a polyethylene terephthalate (PET) film with a thickness of 12 μm. Then, the adhesive solution coated on the substrate 2 was initially dried stepwise at a temperature of 40 to 90°C in the first half of a drying oven, and further heated for 3 minutes in a region where the maximum temperature of the heat treatment provided in the second half of the drying oven was 120°C to dry it, forming an adhesive layer 3 with a dried thickness of 10 μm. Next, a release liner that had been release-treated with a fluoroalkyl-modified silicone was adhered to the adhesive layer 3. Thus, an adhesive tape 1 with a total dried thickness of 22 μm was obtained.

[0254] (Example 3)

[0255] <Preparation of Silicone Resin Solution>

[0256] A silicone resin (S3) obtained by mixing a silicone resin (c), a silicone resin (d), and a silicone resin (h) such that the mass ratio (c) / (d) / (h) is 92.66 / 3.63 / 3.71 was diluted with toluene and stirred to prepare a silicone resin (S3) solution (solid content concentration: 30% by mass). In this silicone resin (S3), the mixing ratio of silicone rubber (G) and silicone resin (R) ((G) / (R)) was 50.0 / 50.0, and the vinyl group content was 9.6×10 -6 mol / g. Here, the total mass of the silicone rubber (G) was the silicone rubber (G alk)” and the total amount of the silicone rubber (G of the silicone resin-based resin (d)) alk )”. In addition, the total mass of the silicone resin (R) is the total amount of the silicone resin (R) of the silicone resin-based resin (c) and the silicone resin (R) of the silicone resin-based resin (h).

[0257] <Preparation of crosslinking agent solution>

[0258] Next, the crosslinking agent (C3) prepared by mixing the crosslinking agent (m) and the crosslinking agent (n) at a mass ratio of (m) / (n) of 10.43 / 89.57 was diluted with toluene and stirred to prepare a crosslinking agent (C3) solution (solid content concentration: 20% by mass). The SiH group content of this crosslinking agent (C3) is 4.2×10 -3 mol / g.

[0259] <Preparation of adhesive solution>

[0260] Next, 3.45 parts by mass of the crosslinking agent (C3) solution (0.69 part by mass in terms of solid content, SiH group / vinyl molar ratio = 3.0) was added to 333.00 parts by mass of the above silicone resin-based resin (S3) solution (100 parts by mass in terms of solid content) using a disperser, and uniformly stirred and mixed. Next, 4.93 parts by mass of a solution (0.74 part by mass in terms of solid content) obtained by diluting the photosensitive platinum (Pt) catalyst “trimethyl(methylcyclopentadienyl)platinum(IV)” manufactured by Sigma-Aldrich Japan K.K. with toluene to a solid content concentration of 15% by mass was added using a disperser, and uniformly stirred and mixed to prepare an adhesive solution for coating.

[0261] Next, the above adhesive solution was coated on a substrate 2 made of a polyethylene terephthalate (PET) film with a thickness of 50 μm. Then, the adhesive solution coated on the substrate 2 was initially dried stepwise at a temperature of 40 to 90°C in the first half of a drying furnace, and further heated for 3 minutes in a region where the maximum temperature of the heat treatment provided in the second half of the drying furnace is 120°C to dry it, forming an adhesive layer 3 with a dried thickness of 40 μm. Next, a release liner that had been subjected to a release treatment with a fluorine-substituted alkyl-modified silicone was adhered to the adhesive layer 3. Thus, an adhesive tape 1 with a total dried thickness of 90 μm was obtained.

[0262] (Example 4)

[0263] <Preparation of silicone resin-based resin solution>

[0264] The silicone resin (S4) obtained by mixing the silicone resin (a) and the silicone resin (d) in a mass ratio of (a) / (d) of 98.08 / 1.92 was diluted with toluene and stirred to prepare a silicone resin (S4) solution (solid content concentration: 30% by mass). In this silicone resin (S4), the mixing ratio of the silicone rubber (G) to the silicone resin (R) ((G) / (R)) was 41.2 / 58.8, and the vinyl group content was 5.8×10 -6 mol / g. Among them, the total mass of the silicone rubber (G) was the sum of "the silicone rubber (G alk ) of the silicone resin (a)" and "the silicone rubber (G alk ) of the silicone resin (d)". In addition, the total mass of the silicone resin (R) was the amount of the silicone resin (R) in the silicone resin (a).

[0265] <Preparation of crosslinking agent solution>

[0266] Next, the crosslinking agent (C4) obtained by mixing the crosslinking agent (m) and the crosslinking agent (n) in a mass ratio of (m) / (n) of 10.43 / 89.57 was diluted with toluene and stirred to prepare a crosslinking agent (C4) solution (solid content concentration: 20% by mass). The SiH group content of this crosslinking agent (C4) was 4.2×10 -3 mol / g.

[0267] <Preparation of adhesive solution>

[0268] Next, 1.80 parts by mass of the crosslinking agent (C4) solution (0.36 part by mass in terms of solid content, SiH group / vinyl group molar ratio = 2.6) was added to 333.00 parts by mass of the above silicone resin (S4) solution (100 parts by mass in terms of solid content) using a disperser, and uniformly stirred and mixed. Next, 5.20 parts by mass of a solution (0.78 part by mass in terms of solid content) obtained by diluting the photosensitive platinum (Pt) catalyst "trimethyl(methylcyclopentadienyl)platinum(IV)" manufactured by Sigma-Aldrich Japan K.K. with toluene to a solid content concentration of 15% by mass was added using a disperser, and uniformly stirred and mixed to prepare a coating adhesive solution.

[0269] Next, the above adhesive solution was coated on a substrate 2 made of a polyethylene terephthalate (PET) film with a thickness of 38 μm. Then, the adhesive solution coated on the substrate 2 was initially dried stepwise at a temperature of 40 to 90 °C in the first half of the drying furnace, and further dried by heating for 3 minutes in a region where the maximum temperature of the heat treatment provided in the second half of the drying furnace was 120 °C, to form an adhesive layer 3 with a dried thickness of 20 μm. Next, a release liner that had been subjected to a release treatment with a fluoroalkyl-modified silicone was adhered to the adhesive layer 3. Thus, an adhesive tape 1 with a total dried thickness of 58 μm was obtained.

[0270] (Example 5)

[0271] A crosslinking agent (C5) solution was prepared as follows. In the preparation of the adhesive solution, the crosslinking agent was changed from the crosslinking agent (C4) solution to the crosslinking agent (C5) solution, and the blending amount of the crosslinking agent (C5) solution was changed to 8.30 parts by mass (1.66 parts by mass in terms of solid content, SiH group / vinyl molar ratio = 8.0). Otherwise, the operation was the same as in Example 4, and an adhesive tape 1 with a total dried thickness of 58 μm was obtained.

[0272] <Preparation of crosslinking agent solution>

[0273] The crosslinking agent (C5) obtained by mixing a crosslinking agent (m) and a crosslinking agent (n) such that the mass ratio (m) / (n) was 2.28 / 97.72 was diluted with toluene and stirred to prepare a crosslinking agent (C5) solution (solid content concentration: 20 mass%). The SiH group content of this crosslinking agent (C5) was 2.8×10 -3 mol / g.

[0274] (Example 6)

[0275] A crosslinking agent (C6) solution was prepared as follows. In the preparation of the adhesive solution, the crosslinking agent was changed from the crosslinking agent (C4) solution to the crosslinking agent (C6) solution, the blending amount of the crosslinking agent (C6) solution was changed to 3.45 parts by mass (0.69 parts by mass in terms of solid content, SiH group / vinyl molar ratio = 4.0), and the blending amount of the photosensitive platinum (Pt) catalyst solution was changed to 1.93 parts by mass (0.29 parts by mass in terms of solid content). Otherwise, the operation was the same as in Example 4, and an adhesive tape 1 with a total dried thickness of 58 μm was obtained.

[0276] <Preparation of crosslinking agent solution>

[0277] The crosslinking agent (C6) obtained by mixing the crosslinking agent (m) and the crosslinking agent (n) in a mass ratio of (m) / (n) of 5.50 / 94.50 was diluted with toluene and stirred to prepare a crosslinking agent (C6) solution (solid component concentration: 20% by mass). The SiH group content of the crosslinking agent (C6) was 3.4×10 -3 mol / g.

[0278] (Example 7)

[0279] In the preparation of the adhesive solution, the compounding amount of the solution of the photosensitive platinum (Pt) catalyst was changed to 19.60 parts by mass (2.94 parts by mass in terms of solid components), and otherwise, the same operations as in Example 6 were carried out to obtain an adhesive tape 1 with a total dried thickness of 58 μm.

[0280] (Example 8)

[0281] The following is the preparation of the silicone resin (S5) solution. In the preparation of the adhesive solution, the compounding amount of the crosslinking agent (C6) solution was changed to 2.85 parts by mass (0.57 parts by mass in terms of solid components, SiH group / vinyl molar ratio = 3.7), the compounding amount of the solution of the photosensitive platinum (Pt) catalyst was changed to 4.40 parts by mass (0.66 parts by mass in terms of solid components), and the dried thickness of the adhesive layer 3 was changed to 30 μm. Otherwise, the same operations as in Example 6 were carried out to obtain an adhesive tape 1 with a total dried thickness of 68 μm.

[0282] <Preparation of silicone resin solution>

[0283] The silicone resin (S5) obtained by mixing the silicone resin (a), the silicone resin (d), and the silicone resin (f) in a mass ratio of (a) / (d) / (f) of 81.99 / 1.61 / 16.40 was diluted with toluene and stirred to prepare a silicone resin (S5) solution (solid component concentration: 30% by mass). In this silicone resin (S5), the mixing ratio of the silicone rubber (G) and the silicone resin (R) ((G) / (R)) was 49.2 / 50.8, and the vinyl group content was 5.3×10 -6 mol / g. Here, the total mass of the silicone rubber (G) was the sum of "the silicone rubber (G alk ) of the silicone resin (a)", "the silicone rubber (G alk ) of the silicone resin (d)", and "the silicone rubber (G 0 ) of the silicone resin (f)". In addition, the total mass of the silicone resin (R) was the sum of "the silicone resin (R) of the silicone resin (a)" and "the silicone resin (R) of the silicone resin (f)".

[0284] (Example 9)

[0285] <Preparation of silicone resin solution>

[0286] The silicone resin (S6) obtained by mixing silicone resin (a), silicone resin (d), silicone resin (f) and silicone resin (h) in a mass ratio of (a) / (d) / (f) / (h) of 66.49 / 0.26 / 26.60 / 6.65 was diluted with toluene and stirred to prepare a silicone resin (S6) solution (solid content concentration: 30% by mass). In this silicone resin (S6), the mixing ratio of silicone rubber (G) to silicone resin (R) ((G) / (R)) is 37.5 / 62.5, and the vinyl group content is 1.9×10 -6 mol / g. Here, the total mass of silicone rubber (G) is the total amount of "silicone rubber (G alk )" of silicone resin (a), "silicone rubber (G alk )" of silicone resin (d), and "silicone rubber (G 0 )" of silicone resin (f). In addition, the total mass of silicone resin (R) is the total amount of "silicone resin (R)" of silicone resin (a), "silicone resin (R)" of silicone resin (f), and "silicone resin (R)" of silicone resin (h).

[0287] <Preparation of crosslinking agent solution>

[0288] Next, the crosslinking agent (C7) obtained by mixing crosslinking agent (m) and crosslinking agent (n) in a mass ratio of (m) / (n) of 1.15 / 98.85 was diluted with toluene and stirred to prepare a crosslinking agent (C7) solution (solid content concentration: 20% by mass). The SiH group content of this crosslinking agent (C7) is 2.6×10 -3 mol / g.

[0289] <Preparation of adhesive solution>

[0290] Next, 2.20 parts by mass of the crosslinking agent (C7) solution (0.44 part by mass in terms of solid content, SiH group / vinyl group molar ratio = 6.2) was added to 333.00 parts by mass of the above silicone resin (S6) solution (100 parts by mass in terms of solid content) using a disperser, and stirred and mixed uniformly. Next, 3.53 parts by mass of a solution (0.53 part by mass in terms of solid content) obtained by diluting the photosensitive platinum (Pt) catalyst "trimethyl(methylcyclopentadienyl)platinum(IV)" manufactured by Sigma-Aldrich Japan K.K. with toluene to a solid content concentration of 15% by mass was added using a disperser, and stirred and mixed uniformly to prepare an adhesive solution for coating.

[0291] Next, the above-mentioned adhesive solution was coated on a substrate 2 made of a polyethylene terephthalate (PET) film with a thickness of 38 μm. Then, the adhesive solution coated on the substrate 2 was initially dried stepwise at a temperature of 40 to 90 °C in the first half of a drying furnace, and further dried by heating for 3 minutes in a region where the maximum temperature of the heat treatment provided in the second half of the drying furnace was 120 °C, thereby forming an adhesive layer 3 with a dried thickness of 30 μm. Next, a release liner that had been subjected to a release treatment with a fluorinated alkyl-modified silicone was bonded to the adhesive layer 3. Thus, an adhesive tape 1 with a total dried thickness of 68 μm was obtained.

[0292] (Example 10)

[0293] <Preparation of silicone resin solution>

[0294] The silicone resin (S7) obtained by mixing the silicone resin (c), the silicone resin (d), and the silicone resin (f) in a mass ratio of (c) / (d) / (f) of 71.18 / 0.35 / 28.47 was diluted with toluene and stirred to prepare a silicone resin (S7) solution (solid content concentration: 30% by mass). The mixing ratio of the silicone rubber (G) to the silicone resin (R) in this silicone resin (S7) was 47.3 / 52.7, and the vinyl group content was 2.5×10 -6 mol / g. Here, the total mass of the silicone rubber (G) was the total amount of "the silicone rubber (G alk ) of the silicone resin (c)" and "the silicone rubber (G alk ) of the silicone resin (d)". In addition, the total mass of the silicone resin (R) was the total amount of "the silicone resin (R) of the silicone resin (c)" and "the silicone resin (R) of the silicone resin (f)".

[0295] <Preparation of crosslinking agent solution>

[0296] Next, the crosslinking agent (C8) obtained by mixing the crosslinking agent (m) and the crosslinking agent (n) in a mass ratio of (m) / (n) of 1.44 / 98.56 was diluted with toluene and stirred to prepare a crosslinking agent (C8) solution (solid content concentration: 20% by mass). The SiH group content of this crosslinking agent (C8) was 2.7×10 -3 mol / g.

[0297] <Preparation of adhesive solution>

[0298] Next, 2.35 parts by mass of a crosslinking agent (C8) solution (0.47 parts by mass in terms of solid content, molar ratio of SiH group / vinyl group = 5.1) was blended into 333.00 parts by mass of the above silicone resin (S7) solution (100 parts by mass in terms of solid content), and uniformly stirred and mixed. Next, 3.80 parts by mass of a solution (0.57 parts by mass in terms of solid content) obtained by diluting the photosensitive platinum (Pt) catalyst "trimethyl(methylcyclopentadienyl)platinum(IV)" manufactured by Sigma-Aldrich Japan K.K. with toluene to a solid content concentration of 15% by mass was blended using a disperser, and uniformly stirred and mixed to prepare an adhesive solution for coating.

[0299] Next, the above adhesive solution was coated on a substrate 2 formed of a polyethylene terephthalate (PET) film with a thickness of 38 μm. Then, the adhesive solution coated on the substrate 2 was initially dried stepwise at a temperature of 40 to 90°C in the first half of a drying furnace, and further dried by heating for 3 minutes in a region where the maximum temperature of the heat treatment provided in the second half of the drying furnace was 120°C, to form an adhesive layer 3 with a dried thickness of 30 μm. Next, a release liner that had been subjected to a release treatment with a fluorinated alkyl-modified silicone was laminated to the adhesive layer 3. Thus, an adhesive tape 1 with a total dried thickness of 68 μm was obtained.

[0300] (Comparative Example 1)

[0301] An silicone resin (S8) solution was prepared as follows. In the preparation of the adhesive solution, the silicone resin was changed from the silicone resin (S4) solution to the silicone resin (S8) solution, the crosslinking agent was not blended, the dried thickness of the adhesive layer 3 was set to 35 μm, and otherwise, the same operations as in Example 4 were performed to obtain an adhesive tape 1 with a total dried thickness of 73 μm.

[0302] <Preparation of silicone resin solution>

[0303] The silicone resin (S8) obtained by mixing the silicone resin (a) and the silicone resin (e) so that the mass ratio (a) / (e) was 99.75 / 0.25 was diluted with toluene and stirred to prepare a silicone resin (S8) solution (solid content concentration: 30% by mass). In this silicone resin (S8), the mixing ratio of the silicone rubber (G) and the silicone resin (R) ((G) / (R)) was 40.1 / 59.9, and the vinyl group content was 8.7×10 -6 mol / g. Here, the total mass of the silicone rubber (G) was "the silicone rubber (G alk ) of the silicone resin (a)" and "the silicone rubber (G alk) The total amount of

[0304] (Comparative Example 2)

[0305] In the preparation of the adhesive solution, instead of 1.93 parts by mass of a solution of the photosensitive platinum (Pt) catalyst "trimethyl(methylcyclopentadienyl)platinum(IV)" manufactured by Sigma-Aldrich Japan K.K., 5.88 parts by mass (1.47 parts by mass in terms of solid content) of a solution of the platinum (Pt) metal-based catalyst "NC-25" (trade name, solid content concentration 25 mass%) manufactured by Daw-Toray Co., Ltd. was used, and the dried thickness of the adhesive layer 3 was set to 20 μm. Otherwise, the operation was the same as in Example 6, and an adhesive tape 1 with a total dried thickness of 58 μm was obtained.

[0306] (Comparative Example 3)

[0307] <Preparation of organosilicon resin solution>

[0308] An organosilicon resin solution (solid content concentration 30 mass%) was prepared by diluting and stirring an organosilicon resin (S9) obtained by mixing organosilicon resins (d), (f), and (h) in a mass ratio of (d) / (f) / (h) of 0.18 / 90.75 / 9.07 with toluene. In this organosilicon resin (S9), the mixing ratio of silicone rubber (G) to silicone resin (R) ((G) / (R)) was 36.5 / 63.5, and the vinyl group content was 3.6×10 -7 mol / g. Here, the total mass of silicone rubber (G) was the total amount of "silicone rubber (G alk )" of organosilicon resin (d) and "silicone rubber (G 0 )" of organosilicon resin (f). In addition, the total mass of silicone resin (R) was the total amount of "silicone resin (R)" of organosilicon resin (f) and "silicone resin (R)" of organosilicon resin (h).

[0309] <Preparation of crosslinking agent solution>

[0310] Next, a crosslinking agent solution (solid content concentration 20 mass%) was prepared by diluting and stirring a crosslinking agent (C9) obtained by mixing crosslinking agents (m) and (n) in a mass ratio of (m) / (n) of 0.58 / 99.42 with toluene. The SiH group content of this crosslinking agent (C9) was 2.5×10 -3 mol / g.

[0311] <Preparation of adhesive solution>

[0312] Next, 3.00 parts by mass of a crosslinking agent (C9) solution (0.60 parts by mass in terms of solid content, SiH group / vinyl molar ratio = 42.4) was added to 333.00 parts by mass of the above silicone resin (S9) solution (100 parts by mass in terms of solid content) using a disperser, and uniformly stirred and mixed. Next, 4.87 parts by mass of a solution (0.73 parts by mass in terms of solid content) obtained by diluting the photosensitive platinum (Pt) catalyst "trimethyl(methylcyclopentadienyl)platinum(IV)" manufactured by Sigma-Aldrich Japan K.K. with toluene to a solid content concentration of 15% by mass was added using a disperser, and uniformly stirred and mixed to prepare an adhesive solution for coating.

[0313] Next, the above adhesive solution was coated on a substrate 2 made of a polyethylene terephthalate (PET) film with a thickness of 38 μm. Then, the adhesive solution coated on the substrate 2 was initially dried stepwise at a temperature of 40 to 90 °C in the first half of a drying oven, and further dried by heating for 3 minutes in a region where the maximum temperature of the heat treatment provided in the second half of the drying oven was 120 °C to form an adhesive layer 3 with a dried thickness of 30 μm. Next, a release liner that had been release-treated with a fluorinated alkyl-modified silicone was adhered to the adhesive layer 3. Thus, an adhesive tape 1 with a total dried thickness of 68 μm was obtained.

[0314] (Comparative Example 4)

[0315] <Preparation of silicone resin solution>

[0316] A silicone resin (S10) obtained by mixing a silicone resin (d) and a silicone resin (g) such that the mass ratio (d) / (g) was 5.56 / 94.44 was diluted with toluene and stirred to prepare a silicone resin (S10) solution (solid content concentration: 30% by mass). In this silicone resin (S10), the mixing ratio of silicone rubber (G) to silicone resin (R) ((G) / (R)) was 62.2 / 37.8, and the vinyl content was 1.1×10 -5 mol / g. Here, the total mass of the silicone rubber (G) was the total amount of "the silicone rubber (G alk ) of the silicone resin (d)" and "the silicone rubber (G 0 ) of the silicone resin (g)". In addition, the total mass of the silicone resin (R) was the amount of the silicone resin (R) of the silicone resin (g).

[0317] <Preparation of crosslinking agent solution>

[0318] Next, the crosslinking agent (C10) obtained by mixing the crosslinking agent (m) and the crosslinking agent (n) in a mass ratio of (m) / (n) of 14.88 / 85.12 was diluted with toluene and stirred to prepare a crosslinking agent (C10) solution (solid content concentration: 20% by mass). The SiH group content of this crosslinking agent (C10) was 5.0×10 -3 mol / g.

[0319] <Preparation of Adhesive Solution>

[0320] Next, 3.65 parts by mass of the crosslinking agent (C10) solution (0.73 parts by mass in terms of solid content, SiH group / vinyl molar ratio = 3.3) was added to 333.00 parts by mass of the above-mentioned silicone resin (S10) solution (100 parts by mass in terms of solid content) using a disperser, and uniformly stirred and mixed. Next, 5.07 parts by mass of a solution obtained by diluting the photosensitive platinum (Pt) catalyst "trimethyl(methylcyclopentadienyl)platinum(IV)" manufactured by Sigma-Aldrich Japan K.K. with toluene to a solid content concentration of 15% by mass (0.76 parts by mass in terms of solid content) was added using a disperser, and uniformly stirred and mixed to prepare an adhesive solution for coating.

[0321] Next, the above-mentioned adhesive solution was coated on a substrate 2 made of a polyethylene terephthalate (PET) film with a thickness of 38 μm. Then, the adhesive solution coated on the substrate 2 was initially dried stepwise at a temperature of 40 to 90°C in the first half of a drying oven, and further heated for 3 minutes in a region where the maximum temperature of the heat treatment provided in the second half of the drying oven was 120°C to dry it, thereby forming an adhesive layer 3 with a dried thickness of 40 μm. Next, a release liner that had been subjected to a release treatment with a fluoroalkyl-modified silicone was adhered to the adhesive layer 3. Thus, an adhesive tape 1 with a total dried thickness of 78 μm was obtained.

[0322] (Comparative Example 5)

[0323] An silicone resin (S11) solution was prepared as follows. In the preparation of the adhesive solution, the amount of the solution of the photosensitive platinum (Pt) catalyst added was changed to 5.07 parts by mass (0.76 parts by mass in terms of solid content), and the dried thickness of the adhesive layer 3 was changed to 20 μm. Otherwise, the same operations as in Example 2 were performed to obtain an adhesive tape 1 with a total dried thickness of 58 μm.

[0324] <Preparation of Silicone Resin Solution>

[0325] The silicone resin (S11) obtained by mixing silicone resin (b), silicone resin (d), and silicone resin (h) in a mass ratio of (b) / (d) / (h) of 91.76 / 0.90 / 7.34 was diluted with toluene and stirred to prepare a silicone resin (S11) solution (solid content concentration: 30% by mass). In this silicone resin (S11), the mixing ratio of silicone rubber (G) to silicone resin (R) ((G) / (R)) was 33.0 / 67.0, and the vinyl group content was 3.4×10 -6 mol / g. Here, the total mass of silicone rubber (G) was the sum of "silicone rubber (G alk ) in silicone resin (b)" and "silicone rubber (G alk ) in silicone resin (d)". In addition, the total mass of silicone resin (R) was the sum of "silicone resin (R) in silicone resin (b)" and "silicone resin (R) in silicone resin (h)".

[0326] The layer configurations of the adhesive tapes 1 produced in Examples 1 to 10 and Comparative Examples 1 to 5 and the combinations of the adhesive layers 3 are shown in Tables 1 to 3.

[0327] [Table 1]

[0328]

[0329] [Table 2]

[0330]

[0331] [Table 3]

[0332]

[0333] 2. Evaluation method

[0334] Next, the evaluation method for the adhesive tape 1 will be described.

[0335] (1) Adhesion test (before UV irradiation)

[0336] For the adhesive tapes 1 produced in Examples 1 to 10 and Comparative Examples 1 to 5, a BA-SUS adhesion test (peel adhesion test) was performed according to the method described in the Adhesive Tape / Adhesive Sheet Test Method (JIS Z 0237 (2009)).

[0337] Specifically, the adhesive tape 1 with the release liner peeled off is adhered to a stainless steel plate (SUS304) having a surface roughness (Ra) of 50 ± 25 nm after bright annealing (BA) treatment, and a roller with a mass of 2000 g is reciprocated once at a speed of 5 mm / s for crimping. Then, after leaving it for 20 to 40 minutes, a tensile testing machine is used to peel it in a direction 180° from the stainless steel plate at a speed of 5 mm / s, and the adhesive force to the polished SUS plate is measured.

[0338] It should be noted that the adhesive force test is performed on the adhesive tape 1 before ultraviolet (UV) irradiation. In addition, as a result of the adhesive force test, if considering the fixing force when using the adhesive tape 1 for cutting semiconductor materials, it is preferably 2.4 N / 10 mm or more, and from the viewpoint of the pick-up property of semiconductor chips and the like singulated by cutting, it is preferably 5.5 N / 10 mm or less. More preferably, it is 2.7 N / 10 mm or more and 4.1 N / 10 mm or less.

[0339] (2) Ball tack test

[0340] (2-1) Measurement of initial (before UV irradiation) ball tack

[0341] For the adhesive tape 1 before UV irradiation produced in Examples 1 to 10 and Comparative Examples 1 to 5, a ball tack test is carried out according to the method described in the Adhesive Tape / Adhesive Sheet Test Method (JIS Z 0237 (2009)).

[0342] (2-2) Measurement of ball tack after UV irradiation

[0343] UV is irradiated from the base material side of each adhesive tape produced in Examples 1 to 10 and Comparative Examples 1 to 5. After leaving it for 20 to 40 minutes under the conditions of a temperature of 23 °C and a humidity of 50 ± 5% RH, the release liner of each adhesive tape 1 is peeled off, and a ball tack test is carried out in the same manner as the initial ball tack according to the method described in the Adhesive Tape / Adhesive Sheet Test Method (JIS Z 0237 (2009)).

[0344] For the UV irradiation, a high-pressure mercury lamp is used, and the ultraviolet ray with a wavelength of 365 nm is adjusted to irradiate with an integrated light quantity of 1200 mJ / cm 2 The irradiation is carried out. It should be noted that the ball tack when the integrated light quantity is set to 3000 mJ / cm 2 is also measured in the same way, but no difference is seen compared with when the integrated light quantity is set to 1200 mJ / cm 2 Therefore, here the integrated light quantity is set to 1200 mJ / cm 2 for evaluation.

[0345] As a result of the ball viscosity test, if the pick-up property of a semiconductor chip or the like singulated by cutting is considered, it is preferable that the ball viscosity (ball number) after UV irradiation is lower than the initial ball viscosity (ball number). That is, when the value of the ball number before UV irradiation is set as BN0 and the value of the ball number after UV irradiation is set as BN1, the relationship of BN0 > BN1 is preferable. This relationship means that the crosslinking reaction of the adhesive layer 3 is promoted by UV irradiation, and the cohesive force is also increased compared with before UV irradiation.

[0346] (3) Holding force test

[0347] (3-1) Measurement of initial (before UV irradiation) holding force

[0348] For the adhesive tapes 1 before UV irradiation produced in Examples 1 to 10 and Comparative Examples 1 to 5, a holding force test was carried out according to the method described in the Adhesive Tape / Adhesive Sheet Test Method (JIS Z 0237(2009)).

[0349] Specifically, the release liner of each adhesive tape 1 was peeled off, the adhesive layer 3 was pasted on a stainless steel plate (SUS304) polished with waterproof abrasive paper, and it was kept under the condition of a temperature of 40°C and a humidity of 33%RH in a state where a predetermined heavy object was installed, and the elapsed time (falling time (minutes)) from when the adhesive tape 1 was peeled off from the stainless steel plate until it fell was measured. Further, the failure mode when the adhesive tape 1 was peeled off from the stainless steel plate was observed (whether the failure mode between the adhesive layer 3 and the stainless steel plate was interfacial peeling or cohesive failure). It should be noted that the measurement of the falling time in the holding force test was carried out until 2880 minutes. In addition, as a result of the holding force test shown in Tables 4 to 6 described later, the falling time (minutes) and the failure mode of the adhesive tape 1 were shown.

[0350] (3-2) Measurement of holding force after UV irradiation

[0351] Operating in the same conditions as those described in the measurement of the ball viscosity after the above-mentioned UV irradiation, the adhesive tape 1 was irradiated with UV, and after standing, a holding force test was carried out in the same manner as the initial holding force.

[0352] (3-3) Regarding the relationship between the holding force and the failure mode

[0353] Here, the relationship between the holding force and the failure mode of the adhesive tape 1 will be described. Figure 3 It is a schematic diagram showing the relationship between the crosslinking density of the silicone-based resin in the adhesive layer 3 and the result (falling time) of the holding force test of the adhesive tape 1.

[0354] As Figure 3As shown, for the adhesive tape 1, as the crosslinking density of the silicone resin in the adhesive layer 3 increases, the failure mode of the adhesive tape 1 in the holding force test relative to the stainless steel plate changes as [cohesive failure (falling) of the adhesive layer 3] → [holding (not falling)] → [interface peeling (falling) between the adhesive layer 3 and the stainless steel plate].

[0355] In addition, as Figure 3 shown, in the region where the failure mode of the adhesive tape 1 is cohesive failure, the holding force (falling time) of the adhesive tape 1 increases as the crosslinking density of the silicone resin in the adhesive layer 3 increases.

[0356] On the other hand, as Figure 3 shown, in the region where the failure mode of the adhesive tape 1 is interface peeling, the holding force (falling time) of the adhesive tape 1 decreases as the crosslinking density of the silicone resin in the adhesive layer 3 increases. This is presumably because, as the crosslinking density of the silicone resin increases, the cohesive force of the adhesive layer 3 increases, and the adhesive force of the adhesive tape 1 decreases. As a result, the adhesive tape becomes easier to peel off and fall from the stainless steel plate.

[0357] As a result of the holding force test, it is preferable that at least the failure mode after UV irradiation is holding or interface peeling, more preferably at least the failure mode after UV irradiation is interface peeling, and further preferably the failure modes before (before UV irradiation) and after UV irradiation are both interface peeling. In addition, when the failure modes before (before UV irradiation) and after UV irradiation are both interface peeling, in terms of the falling time, before (before UV irradiation), from the observation of the fixing force when the adhesive tape 1 is used for cutting semiconductor materials, it is preferably as long as possible or does not fall, and after UV irradiation, from the observation of the pick-up property of semiconductor chips etc. made monolithic by cutting, it is preferably shorter than before (before UV irradiation).

[0358] In this case, after the adhesive tape 1 is used for cutting a semiconductor element substrate etc., when the obtained semiconductor chips etc. are peeled off from the adhesive tape 1, by irradiating the adhesive tape 1 with UV light, it is not easy to generate residual glue on the semiconductor chips etc.

[0359] (4) Residual glue test for silicone resin

[0360] For the adhesive tapes 1 produced in Examples 1 to 10 and Comparative Examples 1 to 5, a residual glue test for silicone resin was conducted.

[0361] First, an A agent and a B agent of a methyl-containing silicone resin (KER-2500N (trade name) manufactured by Shin-Etsu Chemical Co., Ltd.), which is a silicone resin for LED devices, are mixed at a mixing ratio of 1:1 to prepare a mixed solution. This mixed solution is coated on a stainless steel plate and cured by heating under the conditions of 100°C × 1 hour and further 150°C × 2 hours to produce a silicone test piece A.

[0362] Similarly, an A agent and a B agent of a phenyl-containing silicone resin (KER-6110 (trade name) manufactured by Shin-Etsu Chemical Co., Ltd.), which is a silicone resin for LED devices, are mixed at a mixing ratio of 3:7 to prepare a mixed solution. This mixed solution is coated on a stainless steel plate and cured by heating under the conditions of 100°C × 2 hours and further 150°C × 5 hours to produce a silicone test piece B.

[0363] Next, the release liner of the adhesive tape 1 is peeled off, and the adhesive layer 3 is respectively pasted on the silicone test pieces A and B, and a roller with a mass of 2000 g is reciprocated once at a speed of 5 mm / s for crimping. Then, in the same manner as the conditions described in the measurement of the ball adhesiveness after UV irradiation, after irradiating UV from the base material 2 side of the adhesive tape 1, it is left in an environment of a temperature of 40°C and a humidity of 90% RH for 120 hours. Then, at room temperature, the adhesive tape 1 is peeled off in a direction perpendicular to the silicone test pieces A and B at a speed of 800 mm / s to 1200 mm / s, and the residual adhesive on the silicone test pieces A and B is visually confirmed.

[0364] (5) Residual Adhesive Test for Epoxy Resin

[0365] For the adhesive tape 1 produced in Examples 1 to 10 and Comparative Examples 1 to 5, a residual adhesive test for epoxy resin is carried out.

[0366] For an epoxy test piece composed of an epoxy resin board (NL-EG-23 (trade name) manufactured by Nichi Asahi Kasei Co., Ltd.) impregnated with epoxy resin in a glass cloth base material, the adhesive layer 3 of the adhesive tape 1 with the release liner peeled off is pasted, and a roller with a mass of 2000 g is reciprocated once at a speed of 5 mm / s for crimping. Then, in the same manner as the conditions described in the measurement of the ball adhesiveness after UV irradiation, after irradiating UV from the base material 2 side of the adhesive tape 1, it is left in an environment of a temperature of 40°C and a humidity of 90% RH for 120 hours. Then, at room temperature, the adhesive tape 1 is peeled off in a direction perpendicular to the epoxy test piece at a speed of 800 mm / s to 1200 mm / s, and the residual adhesive on the epoxy test piece is visually confirmed.

[0367] The residual adhesive test for silicone resin and the residual adhesive test for epoxy resin are evaluated according to the following judgment criteria. It should be noted that the evaluation of A or B is considered qualified.

[0368] A: There is no residual adhesive within the range of 100% of the per unit area of the test piece.

[0369] B: Residual adhesive is seen within the range of less than 2% of the per unit area of the test piece.

[0370] C: Residual adhesive is seen within the range of 2% or more and less than 5% of the per unit area of the test piece.

[0371] D: Residual adhesive is seen within the range of 5% or more of the per unit area of the test piece or residual adhesive is seen at the edge portion of the test piece.

[0372] (6) Cutting test

[0373] For the adhesive tapes 1 produced in Examples 1 to 10 and Comparative Examples 1 to 5, a cutting test was conducted.

[0374] Specifically, first, the molding epoxy resin (CEL-400ZHF40-W75G (trade name) manufactured by Hitachi Chemical Co., Ltd.) was put into a mold and heated and cured under the conditions of a sealing pressure of 50 kgf / cm 2 (491 N / cm 2 ), a thickness of the sealing material of 0.3 mm, and a heating temperature of 150 °C for 300 seconds to manufacture a disc-shaped (diameter 200 mm (8 inches)) cutting test piece.

[0375] Next, the adhesive layer 3 of the adhesive tape 1 from which the release liner was peeled was pasted onto the cutting ring. After cutting off the portion that overflowed from the ring, it was further laminated with a fluorine-based release film (SS1A (trade name) manufactured by NIPPA Co., Ltd., thickness 75 μm). Next, a roller with a mass of 2000 g was reciprocated to press the adhesive tape 1 against the ring portion. Next, the fluorine-based release film was peeled off, and the cutting test piece was laminated and pressed against the adhesive layer 3 at the central portion of the ring.

[0376] Furthermore, using a cutting device (A-WD-100A (trade name) manufactured by Tokyo Seimitsu Co., Ltd.) and a cutting blade manufactured by DISCO Corporation, the cutting test piece and the adhesive tape 1 were cut into chips of 10 mm × 10 mm. At this time, the number of scattered chips was measured to evaluate the fixing force in the cutting test.

[0377] Next, for the adhesive tape 1 pasted onto the chips that were singulated into 10 mm × 10 mm, UV was irradiated under the same conditions as those described in the measurement of the ball viscosity after UV irradiation. Then, the singulated chips were picked up from the adhesive tape 1, and the presence or absence of residual adhesive on the chips was visually confirmed to evaluate the residual adhesive in the cutting test. In addition, the number of chips that failed to be picked up when picking up the chips was counted to evaluate the pick-up property in the cutting test.

[0378] The fixing force in the cutting test is evaluated according to the following criteria. Note that the evaluation of A or B is considered qualified.

[0379] A: The number of scattered chips is 0 out of 100 and no chip notch is confirmed.

[0380] B: The number of scattered chips is 1 out of 100 and no chip notch is confirmed.

[0381] C: The number of scattered chips is 2 out of 100 and no chip notch is confirmed.

[0382] D: The number of scattered chips is 3 or more out of 100 or a chip notch is confirmed.

[0383] The residual glue in the cutting test is evaluated according to the following criteria. Note that the evaluation of A is considered qualified.

[0384] A: No residual glue is seen on the chip.

[0385] D: Residual glue is seen on the chip or adhesive draw is seen on the side of the chip.

[0386] The pick-up performance in the cutting test is evaluated according to the following criteria. Note that the evaluation of A or B is considered qualified.

[0387] A: The number of chips with pick-up failure is 0 out of 100.

[0388] B: The number of chips with pick-up failure is 1 out of 100.

[0389] C: The number of chips with pick-up failure is 2 out of 100.

[0390] D: The number of chips with pick-up failure is 3 or more out of 100.

[0391] 3. Test Results

[0392] The evaluation results of the adhesive tape 1 for Examples 1 to 10 and Comparative Examples 1 to 5 are shown in Tables 4 to 6.

[0393] [Table 4]

[0394]

[0395] [Table 5]

[0396]

[0397] [Table 6]

[0398]

[0399] As shown in Tables 4 and 5, the pressure-sensitive adhesive tapes 1 of Examples 1 to 10 in which the pressure-sensitive adhesive layer satisfies the requirements of the present invention have obtained satisfactory results in the adhesive force test, ball tack test, holding force test, residual adhesive test for silicone resin, residual adhesive test for epoxy resin, and cutting test (fixing force, residual adhesive, and pick-up property).

[0400] Among them, the content of alkenyl groups bonded to silicon atoms in the entire silicone-based resin is 3.0×10 -6 mol / g or more and 1.0×10 -5 mol / g or less. The pressure-sensitive adhesive tapes 1 of Examples 1 to 8 and the content of alkenyl groups bonded to silicon atoms in the entire silicone-based resin are 1.9×10 -6 mol / g and 2.5×10 -6 mol / g respectively. Compared with the pressure-sensitive adhesive tapes 1 of Examples 9 and 10, the evaluation results are generally good in the residual adhesive test for silicone resin and the residual adhesive test for epoxy resin.

[0401] Therefore, it is confirmed that the pressure-sensitive adhesive tapes 1 of Examples 1 to 10 are useful as pressure-sensitive adhesive tapes for cutting semiconductor materials, and more specifically as pressure-sensitive adhesive tapes for cutting that are pasted from the side of the sealing resin of a semiconductor element substrate and used for cutting.

[0402] In contrast, as shown in Table 6, in the pressure-sensitive adhesive tapes 1 of Comparative Examples 1 to 5 in which the pressure-sensitive adhesive layer 3 does not satisfy the requirements of the present invention, some test results are worse than those of Examples 1 to 10 in the residual adhesive test for silicone resin, the residual adhesive test for epoxy resin, and the cutting test (fixing force, residual adhesive, and pick-up property).

[0403] Specifically, in the pressure-sensitive adhesive tape 1 of Comparative Example 1 in which the pressure-sensitive adhesive layer 3 does not contain a crosslinking agent, even when UV irradiation is applied, crosslinking of the silicone-based resin does not occur. Therefore, before and after UV irradiation, no change is seen in the results of the ball tack test and the holding force test, and an increase in the cohesion of the pressure-sensitive adhesive layer 3 caused by UV irradiation is not confirmed. Therefore, in the residual adhesive test for silicone resin and the residual adhesive test for epoxy resin for confirming practicality, a lot of residual adhesive is seen. In addition, in the cutting test, the pick-up property of the chips of the cut test pieces is also poor, and residual adhesive is also seen on the chips.

[0404] In addition, in the adhesive tape 1 of Comparative Example 2 in which the adhesive layer 3 does not contain a photosensitive platinum (Pt) catalyst but contains a normal platinum (Pt) catalyst, in the stage before UV irradiation, that is, in the heating and drying processes for applying the adhesive layer 3 to the substrate 2, the vinyl group bonded to a silicon atom in the silicone resin in the adhesive layer 3 and the SiH group of the crosslinking agent have already undergone an addition reaction through the platinum (Pt) catalyst, and have been crosslinked and cured to become too hard. Therefore, in the cutting test, the fixing force of the cut test piece slightly decreases, and slightly more chips are scattered during cutting. Since the adhesive layer 3 does not contain a photosensitive platinum (Pt) catalyst, even when UV irradiation is applied, the cohesive force does not increase, and no change is seen in the results of the ball tack test and the holding force test before and after UV irradiation. However, since the cohesive force of the adhesive layer 3 is high, no residual adhesive is seen in the residual adhesive test for the silicone resin and the residual adhesive test for the epoxy resin. In addition, in the cutting test, no residual adhesive is seen on the chips that do not scatter.

[0405] Furthermore, in the adhesive tape 1 of Comparative Example 3 in which the content of the vinyl group bonded to a silicon atom in the silicone resin in the adhesive layer 3 is less than the lower limit value of the requirements of the present invention, no change is seen in the results of the ball tack test and the holding force test before and after UV irradiation, and the effect of increasing the cohesive force of the adhesive layer 3 caused by UV irradiation is insufficient, and the cohesive force itself is small. Therefore, a lot of residual adhesive is seen in the residual adhesive test for the silicone resin and the residual adhesive test for the epoxy resin. In addition, in the cutting test, the pick-up property of the chips of the cut test piece is also poor, and residual adhesive is seen on the chips.

[0406] Still further, in the adhesive tape 1 of Comparative Example 4 in which the mixing ratio ((G) / (R)) of the silicone rubber (G) and the silicone resin (R) in the silicone resin in the adhesive layer 3 is greater than the upper limit value of the requirements of the present invention, the ratio of the silicone rubber (G) in the adhesive layer 3 is large. In the cutting test, the vibration during cutting is easily transmitted to the adhesive layer 3 and the vibration amplitude becomes large, and notches are confirmed on the singulated semiconductor chips. In addition, since the adhesive force is also low, the fixing force of the cut test piece is low, and a large number of chips are scattered during cutting. In addition, since the content of the vinyl group bonded to a silicon atom in the silicone resin in the adhesive layer 3 is greater than the upper limit value of the present embodiment, when the adhesive tape 1 is subjected to the test, the release liner is not easily peeled from the adhesive layer 3 compared with other adhesive tapes 1, and the workability is poor. It should be noted that the effect of increasing the cohesive force of the adhesive layer 3 caused by UV irradiation is sufficient, so no residual adhesive is seen in the residual adhesive test for the silicone resin and the residual adhesive test for the epoxy resin. In addition, in the cutting test, no residual adhesive is seen on the chips that do not scatter.

[0407] Furthermore, in the adhesive tape 1 of Comparative Example 5 in which the mixing ratio ((G) / (R)) of silicone rubber (G) and silicone resin (R) is less than the lower limit value of the requirements of the present invention, the ratio of the silicone resin (R) having no vinyl group bonded with a silicon atom in the adhesive layer 3 is large, and the effect of increasing the cohesion of the adhesive layer 3 caused by UV irradiation is not sufficient. In the residual glue test for the silicone resin and the residual glue test for the epoxy resin, a slightly larger amount of residual glue attributed to the uncrosslinked component of the silicone resin (R) is observed. In addition, in the cutting test, the pick-up property of the chip of the cut test piece is also poor, and a lot of residual glue is also seen on the chip.

[0408] Symbol description

[0409] 1... Adhesive tape, 2... Substrate, 3... Adhesive layer, 100... Semiconductor element substrate, 101... Substrate, 102... Semiconductor element, 103... Encapsulating resin, 200... Semiconductor chip.

Claims

1. An adhesive tape for cutting, which has a base material and an adhesive layer laminated on the base material, and the adhesive tape for cutting is used when dividing a semiconductor material having a plurality of semiconductor elements covered with a coating material into a plurality of semiconductor chips. Characterized in that: The adhesive layer is composed of an adhesive composition, and the adhesive composition contains a silicone resin formed by mixing silicone rubber G and silicone resin R, an organopolysiloxane having at least two or more hydrogen atoms bonded to silicon atoms (SiH groups) in one molecule as a crosslinking agent for the silicone resin, and a photosensitive platinum (Pt) catalyst. The mixing ratio G / R of silicone rubber G and silicone resin R in the whole silicone resin is in the range of 35.0 / 65.0 to 50.0 / 50.0 by mass ratio. The silicone rubber G comprises silicone rubber G alk , the silicone rubber G alk It is composed of an organopolysiloxane containing alkenyl groups bonded to silicon atoms. The content of the alkenyl group bonded with a silicon atom in the entire silicone-based resin is in the range of 1.8×10 -6 mol / g or more and 1.0×10 -5 mol / g or less.

2. The adhesive tape for cutting according to claim 1. Characterized in that: For the semiconductor material in which the plurality of semiconductor elements are sealed by the coating material made of silicone resin, it is used by being pasted from the coating material side.

3. The adhesive tape for cutting according to claim 1 or 2. Characterized in that: In the adhesive layer, the content of the alkenyl group bonded to the silicon atom in the entire organosilicon resin is in the range of 3.0×10 -6 mol / g or more and 1.0×10 -5 mol / g or less.

4. The adhesive tape for cutting according to claim 1 or 2. Characterized in that: In the adhesive layer, the molar ratio of the total content of the hydrogen atoms bonded to silicon atoms (SiH groups) of the crosslinking agent contained in the adhesive composition to the total content of the alkenyl groups bonded to silicon atoms in the whole silicone resin contained in the adhesive composition, that is, SiH group / alkenyl group bonded to silicon atom, is in the range of 2.0 or more and 10.0 or less.

5. The adhesive tape for cutting according to claim 1 or 2. Characterized in that: In the adhesive layer, based on 100 parts by mass of the solid content of the whole silicone resin, the content of the photosensitive platinum (Pt) catalyst in the adhesive composition is in the range of 0.10 part by mass or more and 3.00 parts by mass or less in terms of solid content.

6. The adhesive tape for cutting according to claim 1 or 2. Characterized in that: In the adhesive characteristics according to JIS Z0237 (2009), all of the following conditions (a) to (c) are satisfied: (a) The adhesive force to the BA-SUS test plate before light irradiation is in the range of 2.7 N / 10 mm or more and 4.1 N / 10 mm or less. (b) Regarding the ball number value in the inclined ball tack test with an inclination angle of 30°, a temperature of 23 °C, and a relative humidity of 50% RH, when the ball number value before light irradiation is set as BN0 and the ball number value after light irradiation is set as BN1, the relationship is BN0 > BN1. (c) In the holding force test after light irradiation at a temperature of 40 °C, a relative humidity of 33% RH, and a placement time of 2880 minutes, the failure phenomenon during dropping is the interfacial peeling between the adhesive layer and the BA-SUS test plate or no dropping in this holding force test.

7. A method for manufacturing a semiconductor chip, which comprises: Pasting step: For a semiconductor element substrate on which a plurality of semiconductor elements sealed with a sealing resin made of silicone resin are formed, paste the adhesive tape for cutting according to claim 1 or 2 from the side of the sealing resin; Cutting step: Cut the semiconductor element substrate pasted with the adhesive tape for cutting into a plurality of semiconductor chips; Irradiation step: Irradiate light on the adhesive tape for cutting of the semiconductor element substrate; And Peeling step: Peel the adhesive tape for cutting from a plurality of the semiconductor chips.

Images