Wafer bonding method and system

Abstract

Embodiments of the present application provide a wafer bonding method and system, the method comprising: providing a bonding relationship, the bonding relationship being used to indicate a bonding between at least two wafer groups; obtaining basic information of a wafer group corresponding to the bonding relationship according to the bonding relationship; performing a first rule check on the basic information, and after the check is successful, transferring the wafer group to a bonding site; updating the basic information of the wafer group transferred to the bonding site to obtain updated basic information; performing a second rule check on the updated basic information, and after the check is successful, performing wafer bonding on the wafer group transferred to the bonding site according to the bonding relationship.

Description

[0001] Cross-references to related applications

[0002] This application is based on and claims priority to Chinese Patent Application No. 202011375319.4, filed on November 30, 2020, the entire contents of which are incorporated herein by reference. Technical Field

[0003] This application relates to the field of semiconductor manufacturing, and more particularly to a wafer bonding method and system. Background Technology

[0004] Currently, wafer bonding processes are typically controlled manually. Wafer bonding is usually selected based on the number of layers the wafers are in within a wafer cassette. For example, the first wafer to be bonded is placed in the first wafer cassette, and the second wafer to be bonded is placed in the second wafer cassette. The first wafer is taken from the first layer of the first wafer cassette, and the second wafer is taken from the first layer of the second wafer cassette for bonding, without considering the potential problems of individual wafers within the wafer cassette, such as defects. This results in a very low yield rate for the bonded products. Summary of the Invention

[0005] In view of this, embodiments of this application provide a wafer bonding method and system to solve at least one problem existing in the prior art.

[0006] To achieve the above objectives, the technical solution of this application embodiment is implemented as follows:

[0007] In a first aspect, embodiments of this application provide a wafer bonding method, the method comprising:

[0008] Provide a bonding relationship, which is used to indicate bonding between at least two wafer sets;

[0009] Based on the bonding relationship, obtain the basic information of the wafer group corresponding to the bonding relationship;

[0010] The basic information is checked using the first rule. If the check is successful, the wafer assembly is transmitted to the bonding site.

[0011] The basic information of the wafer group transmitted to the bonding site is updated to obtain the updated basic information;

[0012] The updated basic information is checked using a second rule. If the check is successful, the wafer assembly transmitted to the bonding site is bonded according to the bonding relationship.

[0013] In an alternative embodiment, the basic information at least includes one of the following: process information of the wafer group, health information of the wafer group, grade of the wafer in the wafer group, abnormal state of the wafer group, risk assessment of the wafer group, process abnormality of the wafer group, and defect of the wafer group.

[0014] In an alternative embodiment, before the first rule check on the basic information, the method further comprises:

[0015] predicting a yield of the wafer group after bonding according to the basic information, to obtain a predicted bonding result;

[0016] if the predicted bonding result meets a preset standard, performing the first rule check.

[0017] In an alternative embodiment, before the first rule check on the basic information, the method further comprises:

[0018] performing a third rule check on the basic information, and uploading the basic information to an information backup site after the third rule check is successful.

[0019] In an alternative embodiment, the third rule at least includes one of the following: whether the product identification matches, whether the wafer grade matches, whether the wafer group is arranged for bonding, and whether the wafer is bonded with multiple wafers.

[0020] In an alternative embodiment, before the first rule check on the basic information, the method further comprises:

[0021] checking whether the preparation process of the wafer group is completed;

[0022] if the preparation process of the wafer group is completed, sending a wafer group identification to a bonding site.

[0023] In an alternative embodiment, the first rule at least includes one of the following: whether the preparation process of the wafer group is completed, whether the product identification matches, whether the bonding type and the pairing combination match, whether the wafer grade matches, whether the wafer group identification covers each wafer, whether the wafer group is arranged for bonding, and whether the wafer is bonded with multiple wafers.

[0024] In an alternative embodiment, the second rule at least includes one of the following: whether the preparation process of the wafer group is completed, whether the product identification matches, whether the bonding type and the pairing combination match, whether the wafer grade matches, whether the wafer group identification covers each wafer, whether the wafer group is arranged for bonding, whether the wafer is bonded with multiple wafers, and whether the wafer group is qualified.

[0025] In an optional implementation, in the step of the first rule check, the second rule check or the third rule check, if the check is unsuccessful, a system error is reported and the bonding relationship is reacquired.

[0026] In an optional implementation, before the step of transmitting the wafer group to the bonding station, the method further comprises:

[0027] acquiring a preparation process of the wafer group according to the basic information;

[0028] determining a bonding type according to the preparation process.

[0029] In an optional implementation, before the step of performing the first rule check according to the basic information, the method further comprises:

[0030] changing the bonding relationship;

[0031] determining whether a preparation process of a wafer group corresponding to the bonding relationship is completed;

[0032] if the preparation process of the wafer group is not completed, the change of the bonding relationship is successful;

[0033] if the preparation process of the wafer group is completed, the change of the bonding relationship is unsuccessful.

[0034] In an optional implementation, if the change of the bonding relationship is successful, the method further comprises:

[0035] reacquiring basic information of a changed wafer group corresponding to the changed bonding relationship according to the changed bonding relationship;

[0036] performing the first rule check and the second rule check according to the basic information of the changed wafer group in sequence, and performing wafer bonding according to the changed bonding relationship if the check is successful.

[0037] In a second aspect, an embodiment of the present application provides a wafer bonding system, comprising:

[0038] a receiving module configured to provide a bonding relationship, the bonding relationship being used to indicate bonding between at least two wafer groups;

[0039] a process module configured to acquire basic information of a wafer group corresponding to the bonding relationship according to the bonding relationship;

[0040] a transition module configured to perform a first rule check on the basic information, and transmit the wafer group to a bonding station if the check is successful;

[0041] an updating module configured to update the basic information of the wafer group transmitted to the bonding station, to obtain updated basic information;

[0042] a bonding module configured to perform a second rule check on the updated basic information, and perform wafer bonding on the wafer group transmitted to the bonding station according to the bonding relationship after the check is successful.

[0043] In an optional embodiment, the basic information at least includes one of the following: process information of the wafer group, health information of the wafer group, grade of the wafer in the wafer group, abnormal state of the wafer group, risk assessment of the wafer group, process abnormality of the wafer group, and defect of the wafer group.

[0044] In an optional embodiment, the method further comprises:

[0045] a prediction module configured to predict a yield of the wafer group bonded according to the bonding relationship based on the basic information, to obtain a predicted bonding result;

[0046] If the predicted bonding result meets a preset standard, a first rule check is performed.

[0047] In an optional embodiment, the method further comprises:

[0048] a backup module configured to perform a third rule check on the basic information, and upload the basic information to an information backup station after the check is successful.

[0049] In an optional embodiment, the third rule at least includes one of the following: whether the product identification matches, whether the wafer grade matches, whether the wafer group is arranged for bonding, and whether the wafer is bonded with multiple wafers.

[0050] In an optional embodiment, the method further comprises:

[0051] a process control module configured to check whether the preparation process of the wafer group is completed;

[0052] If the preparation process of the wafer group is completed, a wafer group identification is sent to the bonding station.

[0053] In an optional embodiment, the first rule at least includes one of the following: whether the preparation process of the wafer group is completed, whether the product identification matches, whether the bonding type and the pairing combination match, whether the wafer grade matches, whether the wafer group identification covers each wafer, whether the wafer group is arranged for bonding, and whether the wafer is bonded with multiple wafers.

[0054] In an alternative embodiment, the second rule comprises at least one of the following: whether the preparation process of the wafer group is completed, whether the product identification is matched, whether the bonding type and the pairing combination are matched, whether the wafer grade is matched, whether the wafer group identification covers each wafer, whether the wafer group is arranged for bonding, whether the wafer is bonded with multiple wafers, and whether the wafer group is qualified.

[0055] In an alternative embodiment, in the step of performing the first rule check by the transition module, the second rule check by the bonding module, or the third rule check by the backup module, if the check is unsuccessful, a system error is generated, and the bonding relationship is reacquired by the receiving module.

[0056] In an alternative embodiment, the system further comprises:

[0057] The determining module is configured to acquire the preparation process of the wafer group according to the basic information, and determine the bonding type according to the preparation process.

[0058] In an alternative embodiment, the system further comprises:

[0059] The changing module is configured to change the bonding relationship, and determine whether the preparation process of the wafer group corresponding to the bonding relationship is completed. If the preparation process of the wafer group is not completed, the change of the bonding relationship is successful. If the preparation process of the wafer group is completed, the change of the bonding relationship is unsuccessful.

[0060] In an alternative embodiment, when the change of the bonding relationship is successful, the process module is further configured to acquire the basic information of the changed wafer group corresponding to the changed bonding relationship according to the changed bonding relationship.

[0061] The transition module is further configured to perform the first rule check according to the basic information of the changed wafer batch, and the bonding module is further configured to perform the second rule check according to the basic information of the changed wafer batch, and perform wafer bonding according to the changed bonding relationship after the check is successful.

[0062] The embodiment of the present application provides a wafer bonding method and system, the method comprises the following steps: providing a bonding relationship, the bonding relationship is used for indicating the bonding between at least two wafer groups; obtaining basic information of a wafer group corresponding to the bonding relationship according to the bonding relationship; performing first rule checking on the basic information, and transmitting the wafer group to a bonding station after the checking is successful; updating the basic information of the wafer group transmitted to the bonding station to obtain updated basic information; performing second rule checking on the updated basic information, and performing wafer bonding on the wafer group transmitted to the bonding station according to the bonding relationship after the checking is successful. The embodiment of the present application provides a wafer bonding method, the basic information of the corresponding wafer group is obtained through the bonding relationship, and the first rule checking and the second rule checking are performed based on the basic information of the wafer group before bonding, so that the quality of the wafer group during bonding is ensured, and therefore, the yield of wafer bonding can be greatly improved, and the management and control of the bonding process can be strengthened. BRIEF DESCRIPTION OF DRAWINGS

[0063] Figure 1 An implementation flow diagram of a wafer bonding method provided by the embodiment of the present application is shown in the figure;

[0064] Figure 2 A schematic diagram of wafer grades provided by the embodiment of the present application is shown in the figure;

[0065] Figure 3 An implementation flow diagram of a wafer bonding method provided by the embodiment of the present application is shown in the figure;

[0066] Figure 4 A component structure diagram of a wafer bonding system provided by the embodiment of the present application is shown in the figure. DETAILED DESCRIPTION

[0067] The exemplary embodiments of the present application will be described in detail with reference to the drawings. Although the exemplary embodiments of the present application are shown in the drawings, it should be understood that the present application can be implemented in various forms, and should not be limited by the specific embodiments described herein. On the contrary, these embodiments are provided so that the present application can be more thoroughly understood, and the scope of the present application can be completely conveyed to those skilled in the art.

[0068] In the following description, a large number of specific details are given in order to provide a more thorough understanding of the present application. However, it should be apparent to those skilled in the art that the present application can be implemented without one or more of these details. In other examples, in order to avoid obscuring the present application, some technical features known in the art are not described; that is, all features of the actual embodiments are not described herein, and well-known functions and structures are not described in detail.

[0069] In the drawings, the size of layers, regions, elements, and the like can be exaggerated for clarity. Like reference numbers in different drawings can represent the same element, or different elements.

[0070] It will be understood that the spatially relative terms "beneath", "below", "lower", "under", "above", "upper" and the like, can be used herein for ease of description to describe one element or feature's relationship to another element(s) or feature(s) as illustrated in the figures. It will be understood that the spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientations depicted in the figures. For example, if the device in the figures is turned over, elements described as "below" or "beneath" other elements or features would then be oriented "above" the other elements or features. Thus, the exemplary term "below" can encompass both an orientation of above and below. The device can be otherwise oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly.

[0071] The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the present application. As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will be further understood that the terms "comprises" and / or "comprising", when used in this specification, specify the presence of stated features, integers, steps, operations, elements, and / or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and / or groups thereof. As used herein the term "and / or" includes any and all combinations of one or more of the associated listed items.

[0072] Embodiments of the present application provide a wafer bonding method, Figure 1 An implementation flowchart of the wafer bonding method provided by embodiments of the present application is shown in Figure 1 As shown, the method mainly includes the following steps:

[0073] In step 101, a bonding relationship is provided, which is used to indicate the bonding between at least two wafer groups.

[0074] In the embodiments of the present application, a bonding relationship is provided, which is used to indicate the bonding between at least two wafer groups, for example, the bonding between a first wafer group and a second wafer group. It should be noted that the embodiments of the present application are not limited to this, and the wafer bonding method provided by the embodiments of the present application can also be used to perform the bonding technology between more than two wafer groups. In actual application, the bonding relationship between the wafer groups that need to be bonded can be set according to the actual bonding requirements. It should be noted that the embodiments of the present application take the bonding relationship used to indicate the bonding between two wafer groups as an example for description; and in the execution process of the wafer bonding method, a plurality of bonding relationships as described above can be included. In other words, in actual application, the wafer bonding method provided by the embodiments of the present application can be executed according to a plurality of bonding relationships. Here, the wafers in the wafer group corresponding to the bonding relationship can include silicon, germanium, silicon carbide, silicon on insulator, or the above combinations. In some embodiments, the wafers in the wafer group corresponding to the bonding relationship can include silicon (such as single crystal silicon, polycrystalline silicon), silicon germanium, gallium arsenide, germanium, silicon on insulator, germanium on insulator, or any appropriate combination of the above. In actual application, the first wafer group can be a memory array wafer group, and the second wafer group can be a peripheral circuit wafer group.

[0075] In the embodiments of the present application, 25 wafers can be defined as a wafer group. In the preparation process of the wafer group, the wafer group is in the form of a wafer group. It should be noted that the number of wafer slices in the first wafer group and the second wafer group is the same, so that the wafers in the first wafer group and the wafers in the second wafer group can be bonded one by one. In actual application, the bonding between the first wafer group and the second wafer group is specifically the bonding between one of the wafers in the first wafer group and one of the wafers in the second wafer group.

[0076] It should be noted that when the bonding relationship is provided, the wafer group corresponding to the bonding relationship can not have completed its preparation process. Since the wafer bonding method provided by the embodiments of the present application has more preliminary verification procedures, in order to save bonding time, the preliminary verification of the bonding process can be performed when the wafer group has not completed its preparation process.

[0077] Step 102, obtaining the basic information of the wafer group corresponding to the bonding relationship according to the bonding relationship.

[0078] In the embodiments of the present application, the basic information of the wafer lot corresponding to the bonding relationship is obtained from a wafer preparation process control system according to the bonding relationship. The basic information at least includes one of the following: wafer lot process, wafer lot health, wafer grade, wafer abnormal status, wafer lot risk evaluation, wafer lot process different with standard process, wafer lot defect.

[0079] Figure 2 A schematic diagram of wafer grade provided by the embodiments of the present application is shown in FIG. 1. As shown in FIG. 1, the wafer grade in the wafer lot can be divided into four grades: normal, low risk, middle risk and high risk. Figure 2

[0080] In the embodiments of the present application, the wafer preparation process control system is a system for controlling all preparation processes of the wafer lot. There is a process flow for each step of the wafer in the wafer preparation process control system. That is, the wafer preparation process control system will arrange the process to be performed by the memory array wafer lot and the peripheral circuit wafer lot.

[0081] In the embodiments of the present application, the yield of the wafer lot after bonding corresponding to the bonding relationship can also be predicted according to the basic information to obtain a predicted bonding result. If the predicted bonding result meets a preset standard, the first rule check is performed. In actual application, the process property and yield of the wafer lot corresponding to the bonding relationship can be predicted according to the basic information, and then the yield of the wafer lot after bonding is predicted based on the process property and yield of the wafer lot to obtain a predicted bonding result. If the predicted bonding result meets a preset standard, the first rule check is performed.

[0082] ​In the embodiment of the present application, before the first rule check, the basic information can also be subjected to a third rule check, and after the check is successful, the basic information is uploaded to an information backup site. The third rule at least includes one of the following: product identification if match, wafer grade if match, wafer lot if arrange bonding, and wafer if bonding with multi wafer. Here, the third rule is a bonding rule. The third rule check on the basic information is a bonding rule check on the basic information. Here, the third rule is described by taking product identification if match as an example. Through the product identification, the number of layers of the product and the preparation process of the product can be obtained, for example, 64 layers of product, 64 layers of storage array process and 64 layers of peripheral circuit process. Based on the basic information of the wafer lot, it is determined whether the number of layers of the wafer in the wafer lot and the preparation process match the number of layers of the product and the preparation process of the product obtained through the product identification, and if they match, the first rule check is successful.

[0083] In the embodiment of the present application, in the step of the third rule check, if the check is not successful, a system error is generated, and the bonding relationship is reacquired. In actual application, if the third rule check is not successful, a system error is generated, and after the engineer receives the system error instruction, the bonding relationship is updated, so that after the system is refreshed, the updated bonding relationship can be reacquired.

[0084] In the embodiment of the present application, the information backup site can be an information transmission site between the wafer preparation process control system and the bonding management system. The basic information is uploaded to the information backup site, so that the bonding management system can acquire the basic information from the information backup site.

[0085] In the embodiment of the present application, after the third rule check, it is also determined whether the preparation process of the wafer lot is completed, and if the preparation process of the wafer lot is completed, the wafer lot identification is sent to a bonding site. In actual application, the preparation processes of the storage array wafer lot and the peripheral circuit wafer lot can be checked respectively, and if the preparation process of the storage array wafer lot is completed first, the storage array wafer lot identification is sent to the bonding site first, and if the preparation process of the peripheral circuit wafer lot is completed first, the peripheral circuit wafer lot identification is sent to the bonding site first. Here, the bonding site is a site for performing a bonding process, and the bonding process of the bonding site is controlled by the bonding management system.

[0086] Step 103, performing first rule check on the basic information, and transmitting the wafer lot to the bonding station after the check is successful.

[0087] In the embodiment of the present application, the first rule check is performed on the basic information, and the wafer lot is transmitted to the bonding station after the check is successful. The first rule includes at least one of the following: check wafer lot if accomplish process, Product ID if match, bond type and pairing group if match, wafer grade if match, wafer lot ID if cover every wafer, wafer lot if arrange bonding, and wafer if bonding with multi wafer. Here, after the first rule check is successful, the wafer lot is transmitted from the wafer preparation process control system to the bonding station of the bonding management system.

[0088] In the embodiment of the present application, in the step of the first rule check, if the check is not successful, a system error is reported, and the bonding relationship is reacquired. In actual application, if the first rule check is not successful, a system error is reported, and the bonding relationship is updated by an engineer after receiving the system error instruction, so that the updated bonding relationship can be reacquired after the system is refreshed.

[0089] In the embodiment of the present application, before the wafer lot is transmitted to the bonding station, the method further includes: acquiring the preparation process of the wafer lot according to the basic information; and determining the bonding type according to the preparation process. Here, the preparation process of the wafer lot can be acquired according to the basic information, specifically, the preparation process of the storage array wafer lot and the preparation process of the peripheral circuit wafer lot can be acquired according to the basic information, and the storage array wafer lot and the peripheral circuit wafer lot are classified according to the preparation process of the storage array wafer lot and the preparation process of the peripheral circuit wafer lot. In actual application, the wafer lot can be classified according to the risk level of the preparation process of the wafer lot. The bonding type obtained based on the bonding classification corresponds to different bonding yields, so the bonding yield can be obtained based on the bonding type. It should be noted that the bonding yield here is only a predicted yield.

[0090] Step 104, updating the basic information of the wafer lot transferred to the bonding station to obtain updated basic information.

[0091] In the embodiment of the present application, the basic information of the wafer lot is updated after the wafer lot arrives at the bonding station to obtain updated basic information. Here, the updated basic information can be obtained from a wafer preparation process control system.

[0092] Step 105, performing a second rule check on the updated basic information, and performing wafer bonding on the wafer lot transferred to the bonding station according to the bonding relationship after the check is successful.

[0093] In the embodiment of the present application, the second rule check is performed on the updated basic information, and the wafer bonding management system controls the wafer bonding of the wafer lot transferred to the bonding station according to the bonding relationship after the check is successful. The second rule at least includes one of the following: check wafer lot if accomplish process, product ID if match, bond type and pairing group if match, wafer grade if match, wafer lot ID if cover every wafer, wafer lot if arrange bonding, wafer if bonding with multi wafer, and wafer lot if qualified. Here, wafer lot if qualified is used to determine whether an accident occurs when the wafer lot is transferred to the bonding station, such as being contaminated.

[0094] In the embodiment of the present application, in the step of the second rule check, if the check is not successful, a system error is generated, and the bonding relationship is reacquired. In actual application, if the second rule check is not successful, a system error is generated, and the bonding relationship is reacquired after the bonding relationship is updated by an engineer receiving a system error instruction after the system is refreshed.

[0095] In the embodiments of the present application, a bonding information system is further provided, which tracks the process progress of the wafer group at any time. Each process that the wafer group goes through is recorded by the bonding information system. In addition, the health information of the wafer group, the grade of the wafer in the wafer group, the abnormal state of the wafer group, the risk assessment of the wafer group, the process abnormality of the wafer group, and the defects of the wafer group are also recorded by the bonding information system. Thus, when the wafer group is checked in the bonding process, the wafer group can be checked by its basic information and bonded based on the basic information.

[0096] In the embodiments of the present application, the bonding relationship can also be changed. The specific process is as follows: the bonding relationship is changed; it is determined whether the preparation process of the wafer group corresponding to the bonding relationship is completed; if the preparation process of the wafer group is not completed, the change of the bonding relationship is successful; if the preparation process of the wafer group is completed, the change of the bonding relationship is unsuccessful. In some embodiments, it can be determined whether the preparation process of the wafer group corresponding to the bonding relationship is completed first; if the preparation process of the wafer group is not completed, the bonding relationship is changed; if the preparation process of the wafer group is completed, the bonding relationship cannot be changed.

[0097] In the embodiments of the present application, in the case that the change of the bonding relationship is successful, the basic information of the changed wafer group corresponding to the changed bonding relationship is reacquired according to the changed bonding relationship; the third rule check, the first rule check and the second rule check are sequentially performed according to the basic information of the changed wafer group, and wafer bonding is performed according to the changed bonding relationship after the check is successful.

[0098] The wafer bonding method provided by the embodiments of the present application can also be applied to the case where the bonding relationship is not provided. The wafer to be bonded can be directly provided, and the wafer to be bonded is checked by the wafer bonding method described above before bonding. After the check is successful, wafer bonding is performed.

[0099] The embodiment of the present application provides a wafer bonding method, the method comprises the following steps: providing a bonding relationship, the bonding relationship is used for indicating bonding between at least two wafer groups; obtaining basic information of a wafer group corresponding to the bonding relationship according to the bonding relationship; performing first rule checking on the basic information, and transmitting the wafer group to a bonding station after successful checking; updating the basic information of the wafer group transmitted to the bonding station to obtain updated basic information; performing second rule checking on the updated basic information, and performing wafer bonding on the wafer group transmitted to the bonding station according to the bonding relationship after successful checking. The embodiment of the present application provides a wafer bonding method, the basic information of the corresponding wafer group is obtained through the provided bonding relationship, and the first rule checking and the second rule checking are performed based on the basic information of the wafer group before bonding, so that the quality of the wafer group during bonding is ensured, so that the yield of wafer bonding can be greatly improved, and the management and control of the bonding process can be strengthened.

[0100] The embodiment of the present application provides a wafer bonding method, Figure 3 The embodiment of the present application provides a wafer bonding method, and the implementation flowchart of the method mainly comprises the following steps:

[0101] Step 301, providing a bonding relationship.

[0102] In the embodiment of the present application, the bonding relationship is used for indicating bonding between at least two wafer groups; and basic information of a wafer group corresponding to the bonding relationship is obtained according to the bonding relationship.

[0103] Step 302, predicting a yield of the wafer group corresponding to the bonding relationship after bonding according to the basic information, and obtaining a predicted bonding result.

[0104] In the embodiment of the present application, if the predicted bonding result meets a preset standard, step 303 is performed; if the predicted bonding result does not meet the preset standard, the system rejects bonding, and returns to step 301.

[0105] Step 303, performing third rule checking.

[0106] In the embodiment of the present application, if the third rule checking is successful, step 304 is performed; if the third rule checking is unsuccessful, the system reports an error, and performs system refreshing, and after the system refreshing, the system error processing is completed, and the method returns to step 301 to reacquire the bonding relationship.

[0107] Step 304, uploading the basic information to an information backup station.

[0108] Step 305, checking whether a preparation process of the wafer group is completed.

[0109] In the embodiment of the present application, if the preparation process of the wafer group is completed, step 306 is executed; if the preparation process of the wafer group is not completed, step 306 is executed after the preparation process of the wafer group is completed.

[0110] Step 306: the wafer group identification is sent to the bonding station.

[0111] Step 307: the first rule check is performed.

[0112] In the embodiment of the present application, if the first rule check is successful, step 308 is executed; if the first rule check is not successful, the system reports an error and performs system refreshing, and after the system refreshing is completed, the system error processing is completed, and step 301 is returned to reacquire the bonding relationship.

[0113] Step 308: the wafer group is transmitted to the bonding station.

[0114] Step 309: the second rule check is performed.

[0115] In the embodiment of the present application, if the second rule check is successful, step 310 is executed; if the second rule check is not successful, the system reports an error and performs system refreshing, and after the system refreshing is completed, the system error processing is completed, and step 301 is returned to reacquire the bonding relationship.

[0116] Step 310: wafer bonding is performed on the wafer group transmitted to the bonding station according to the bonding relationship.

[0117] The embodiment of the present application provides a wafer bonding method, which first predicts a bonding result through basic information of a wafer group, and then sequentially performs third rule check, first rule check and second rule check under the condition that the bonding result meets a preset standard, and only when the checks are all successful, wafer bonding is performed on the wafer group transmitted to the bonding station according to the bonding relationship. In this way, multiple check barriers are set in the method to ensure the yield of the bonded wafers and the yield after bonding. Furthermore, if the check is not successful in each check process, the system reports an error, so that engineers can troubleshoot and solve the problem, thereby facilitating the management and optimization of the bonding process.

[0118] Based on the same technical concept as the wafer bonding method described above, the embodiment of the present application provides a wafer bonding system, in some embodiments, the wafer bonding system can be realized in the form of a software module, Figure 4 A component structure diagram of a wafer bonding system provided by the embodiment of the present application is shown in FIG. 4. Figure 4 The wafer bonding system 400 provided by the embodiment of the present application includes:

[0119] The receiving module 401 is configured to provide a bonding relationship, where the bonding relationship is used to indicate a bonding between at least two wafer groups.

[0120] The process module 402 is configured to acquire basic information of the wafer group corresponding to the bonding relationship according to the bonding relationship.

[0121] The transition module 403 is configured to perform a first rule check on the basic information, and transmit the wafer group to a bonding station after the check is successful.

[0122] The updating module 404 is configured to update the basic information of the wafer group transmitted to the bonding station, and obtain updated basic information.

[0123] The bonding module 405 is configured to perform a second rule check on the updated basic information, and perform wafer bonding on the wafer group transmitted to the bonding station according to the bonding relationship after the check is successful.

[0124] In other embodiments, the basic information at least includes one of the following: process information of the wafer group, health information of the wafer group, grade of the wafer in the wafer group, abnormal state of the wafer group, risk assessment of the wafer group, process abnormality of the wafer group, and defect of the wafer group.

[0125] In other embodiments, the method further includes:

[0126] The prediction module 406 is configured to predict a yield of the wafer group corresponding to the bonding relationship after bonding according to the basic information, and obtain a predicted bonding result.

[0127] If the predicted bonding result meets a preset standard, the first rule check is performed.

[0128] In other embodiments, the method further includes:

[0129] The backup module 407 is configured to perform a third rule check on the basic information, and upload the basic information to an information backup station after the check is successful.

[0130] In other embodiments, the third rule at least includes one of the following: whether product identification is matched, whether wafer grade is matched, whether the wafer group is arranged for bonding, and whether the wafer is bonded with multiple wafers.

[0131] In other embodiments, the method further includes:

[0132] The process control module 408 is configured to check whether a preparation process of the wafer group is completed.

[0133] If the preparation process of the wafer group is completed, a wafer group identification is sent to the bonding station.

[0134] In other embodiments, the first rule comprises at least one of: whether the preparation process of the wafer group is completed, whether the product identification is matched, whether the bonding type and the matching combination are matched, whether the wafer grade is matched, whether the wafer group identification covers each wafer, whether the wafer group is arranged for bonding, and whether the wafer is bonded with multiple wafers.

[0135] In other embodiments, the second rule comprises at least one of: whether the preparation process of the wafer group is completed, whether the product identification is matched, whether the bonding type and the matching combination are matched, whether the wafer grade is matched, whether the wafer group identification covers each wafer, whether the wafer group is arranged for bonding, whether the wafer is bonded with multiple wafers, and whether the wafer group is qualified.

[0136] In other embodiments, in the step of performing the first rule check by the transition module 403, the second rule check by the bonding module 405, or the third rule check by the backup module 407, if the check is unsuccessful, a system error is reported, and the bonding relationship is reacquired by the receiving module 401.

[0137] In other embodiments, the method further comprises:

[0138] The determining module 409 is configured to acquire the preparation process of the wafer group according to the basic information, and determine the bonding type according to the preparation process.

[0139] In other embodiments, the method further comprises:

[0140] The changing module 410 is configured to change the bonding relationship, and determine whether the preparation process of the wafer group corresponding to the bonding relationship is completed. If the preparation process of the wafer group is not completed, the bonding relationship changing is successful. If the preparation process of the wafer group is completed, the bonding relationship changing is unsuccessful.

[0141] In other embodiments, in the case that the bonding relationship changing is successful, the process module 402 is further configured to reacquire the basic information of the changed wafer group corresponding to the changed bonding relationship according to the changed bonding relationship.

[0142] The transition module 403 is further configured to perform the first rule check according to the basic information of the changed wafer batch, and the bonding module 405 is further configured to perform the second rule check according to the basic information of the changed wafer batch, and perform wafer bonding according to the changed bonding relationship after the check is successful.

[0143] The components in the embodiments of the present application can be integrated in one processing unit, or each unit can exist physically, or two or more units can be integrated in one unit. The integrated unit can be realized in the form of hardware or in the form of a software function module.

[0144] It is understood that the embodiments described herein can be implemented in hardware, software, firmware, middleware, microcode, or any combination thereof. For a hardware implementation, the processing units can be implemented within one or more application specific integrated circuits (ASICs), digital signal processors (DSPs), digital signal processing devices (DSP Devices), programmable logic devices (PLDs), field programmable gate arrays (FPGAs), processors, controllers, micro-controllers, microprocessors, other electronic units designed to perform the functions described herein, or a combination thereof.

[0145] For a software implementation, the techniques described herein can be implemented with modules (e.g., procedures, functions, and so on) that perform the functions described herein. The software codes can be stored in memory units and executed by processors. The memory unit can be implemented within the processor or external to the processor.

[0146] It should be understood that all statements herein made regarding a "one embodiment" or "an embodiment" are intended to encompass both a standalone embodiment and an embodiment that is part of a larger embodiment. For example, an embodiment that includes a feature can also be described as an embodiment that does not include the feature, and vice versa. Furthermore, these particular features, structures, or characteristics can be combined in any suitable manner in one or more embodiments. It should be understood that the sequence of steps in the foregoing embodiments can be modified in any suitable manner without departing from the scope of the application. The sequence of steps in the foregoing embodiments should be understood, therefore, not to be a limitation of the application. Also, the aforementioned embodiments are not intended to limit the application to the embodiments described herein. Rather, the scope of the application is defined by the appended claims and equivalents thereof.

[0147] In several embodiments provided in the present application, it should be understood that the disclosed method and device can be implemented in other ways. The above-described device embodiments are only schematic. For example, the division of the units is only a logical function division. There can be another division manner in actual implementation. For example, a plurality of units or components can be combined or integrated into another system, or some features can be ignored or not executed. In addition, the coupling or direct coupling or communication connection between the various components shown or discussed can be indirect coupling or communication connection through some interface, device or unit, and can be electrical, mechanical or in other forms.

[0148] The units described as separate components above can or can not be physically separate, and the components displayed as units can or can not be physical units, that is, can be located in one place or distributed on multiple network units; part or all of the units can be selected according to actual needs to achieve the purpose of the embodiment scheme.

[0149] In addition, each functional unit in each embodiment of the present application can be integrated into one processing module, or each unit can be separately implemented as a unit, or two or more units can be integrated into one unit; the integrated unit can be implemented in the form of hardware or in the form of hardware plus software functional unit. Those skilled in the art can understand that all or part of the steps of the above method embodiments can be completed by program instruction related hardware, and the above program can be stored in a computer readable storage medium. When the program is executed, the steps of the above method embodiments are executed; and the above storage medium includes: mobile storage device, read-only memory (ROM, Read-Only Memory), random access memory (RAM, Random Access Memory), magnetic disk or optical disk and various storage program codes.

[0150] The methods disclosed in the several method embodiments provided by the present application can be combined arbitrarily without conflict to obtain new method embodiments.

[0151] The features disclosed in the several product embodiments provided by the present application can be combined arbitrarily without conflict to obtain new product embodiments.

[0152] The features disclosed in the several method or device embodiments provided by the present application can be combined arbitrarily without conflict to obtain new method or device embodiments.

[0153] The above is only a specific embodiment of the present application, but the protection scope of the present application is not limited thereto, and any person skilled in the art can easily think of changes or replacements within the technical range disclosed by the present application, which should be covered within the protection scope of the present application. Therefore, the protection scope of the present application should be subject to the protection scope of the claims.

Claims

1. A wafer bonding method, characterized by, The bonding method comprises: providing a bonding relationship for indicating bonding between at least two wafer groups; obtaining basic information of the at least two wafer groups; the basic information comprises at least one selected from the group consisting of process information of the wafer group, health information of the wafer group, wafer grade in the wafer group, abnormal state of the wafer group, risk assessment of the wafer group, process abnormality of the wafer group, and defect of the wafer group; performing rule checking on the at least two wafer groups, comprising: performing first rule checking on the at least two wafer groups, if the basic information of the at least two wafer groups passes the first rule checking, the at least two wafer groups are transmitted to a bonding station; the first rule comprises at least one selected from the group consisting of whether the preparation process of the wafer group is completed, whether the product identification is matched, whether the bonding type and the matching combination are matched, whether the wafer grade is matched, whether the wafer group identification covers each wafer, whether the wafer group is arranged for bonding, and whether the wafer is bonded with multiple wafers; performing second rule checking on the at least two wafer groups, if the updated basic information of the at least two wafer groups passes the second rule checking, wafer bonding is performed on the at least two wafer groups according to the bonding relationship; wherein the updated basic information is obtained by updating the basic information of the at least two wafer groups transmitted to the bonding station; the second rule comprises at least one selected from the group consisting of whether the preparation process of the wafer group is completed, whether the product identification is matched, whether the bonding type and the matching combination are matched, whether the wafer grade is matched, whether the wafer group identification covers each wafer, whether the wafer group is arranged for bonding, whether the wafer is bonded with multiple wafers, and whether the wafer group is qualified.

2. The wafer bonding method according to claim 1, wherein, Before the rule checking on the at least two wafer groups, the bonding method further comprises: predicting yield of the at least two wafer groups after wafer bonding according to the basic information of the at least two wafer groups, to obtain a predicted bonding result; if the predicted bonding result meets a preset standard, performing rule checking on the at least two wafer groups.

3. The wafer bonding method according to claim 1, wherein The rule checking on the at least two wafer groups comprises: before the first rule checking on the at least two wafer groups, performing third rule checking on the at least two wafer groups, if the basic information of the at least two wafer groups passes the third rule checking, the basic information is uploaded to an information backup station.

4. The wafer bonding method according to claim 3, wherein the third rule comprises at least one selected from the group consisting of whether the product identification is matched, whether the wafer grade is matched, whether the wafer group is arranged for bonding, and whether the wafer is bonded with multiple wafers.

5. The wafer bonding method of claim 1, wherein Before the first rule checking on the at least two wafer groups, the bonding method further comprises: checking whether the preparation process of the at least two wafer groups is completed; if the preparation process of the at least two wafer groups is completed, wafer group identification is sent to the bonding station.

6. The wafer bonding method according to claim 3, wherein In the step of rule checking, if the at least two wafer groups do not pass the rule checking, a system error is reported and a bonding relationship is re-obtained.

7. The wafer bonding method of claim 1, wherein The bonding method further comprises, before the first rule check on the at least two wafer groups: According to the basic information, the preparation process of the at least two wafer groups is obtained; According to the preparation process of the at least two wafer groups, the bonding type is determined.

8. The wafer bonding method of claim 1, wherein, The bonding method further comprises, before the first rule check on the at least two wafer groups: The bonding relationship is changed; It is determined whether the preparation process of the at least two wafer groups corresponding to the bonding relationship is completed; If the preparation process of the at least two wafer groups is not completed, the bonding relationship change is successful; If the preparation process of the at least two wafer groups has been completed, the bonding relationship change is unsuccessful.

9. The wafer bonding method according to claim 8, wherein, In the case that the bonding relationship change is successful, the bonding method further comprises: According to the changed bonding relationship, the basic information of the changed at least two wafer groups corresponding to the changed bonding relationship is re-obtained; The changed at least two wafer groups are subjected to the rule check, and if the basic information of the changed at least two wafer groups passes the rule check, wafer bonding is performed according to the changed bonding relationship.

10. A wafer bonding system, characterized by, The bonding system comprises: A receiving module for providing a bonding relationship for indicating bonding between at least two wafer groups; A process module for obtaining basic information of the at least two wafer groups; the basic information includes at least one selected from the following group: process information of the wafer group, health information of the wafer group, wafer grade in the wafer group, abnormal state of the wafer group, risk assessment of the wafer group, process abnormality of the wafer group, and defect of the wafer group; A transition module for performing a first rule check on the at least two wafer groups, and if the basic information of the at least two wafer groups passes the first rule check, the at least two wafer groups are transmitted to a bonding site; the first rule includes at least one selected from the following group: whether the preparation process of the wafer group is completed, whether the product identification is matched, whether the bonding type and the matching combination are matched, whether the wafer grade is matched, whether the wafer group identification covers each wafer, whether the wafer group is arranged for bonding, and whether the wafer is bonded with multiple wafers; A bonding module for performing a second rule check on the at least two wafer groups, and if the updated basic information of the at least two wafer groups passes the second rule check, wafer bonding is performed on the at least two wafer groups according to the bonding relationship; the second rule includes at least one selected from the following group: whether the preparation process of the wafer group is completed, whether the product identification is matched, whether the bonding type and the matching combination are matched, whether the wafer grade is matched, whether the wafer group identification covers each wafer, whether the wafer group is arranged for bonding, whether the wafer is bonded with multiple wafers, and whether the wafer group is qualified; An updating module for obtaining the updated basic information, which is obtained by updating the basic information of the at least two wafer groups transmitted to the bonding site.

11. The wafer bonding system of claim 10, wherein, The bonding system further comprises: A prediction module for predicting the yield of the at least two wafer groups after wafer bonding according to the basic information of the at least two wafer groups, and obtaining a predicted bonding result; If the predicted bonding result meets preset standards, the at least two wafer groups are subjected to rule checking.

12. The wafer bonding system of claim 10, wherein, The bonding system further comprises: A backup module is configured to perform third rule checking on the at least two wafer groups, and if the basic information of the at least two wafer groups passes the third rule checking, the basic information is uploaded to an information backup site.

13. The wafer bonding system of claim 12, wherein The third rule comprises at least one selected from the group consisting of whether product identification is matched, whether wafer grades are matched, whether wafer groups are arranged for bonding, and whether wafers are bonded with multiple wafers.

14. The wafer bonding system of claim 10, wherein, The bonding system further comprises: A process control module is configured to check whether preparation processes of the at least two wafer groups are completed; If the preparation processes of the at least two wafer groups are completed, wafer group identification is sent to a bonding site.

15. The wafer bonding system of claim 12, wherein, In the steps of performing the first rule checking by the transition module, the second rule checking by the bonding module, or the third rule checking by the backup module, if the at least two wafer groups fail to pass the checking, a system error is reported, and the bonding relationship is reacquired through the receiving module.

16. The wafer bonding system of claim 10, wherein, The bonding system further comprises: A determination module is configured to acquire preparation processes of the at least two wafer groups according to the basic information, and determine a bonding type according to the preparation processes of the at least two wafer groups.

17. The wafer bonding system of claim 10, wherein, The bonding system further comprises: A change module is configured to change the bonding relationship, and determine whether preparation processes of the at least two wafer groups corresponding to the bonding relationship are completed, if the preparation processes of the at least two wafer groups are not completed, the change of the bonding relationship is successful, and if the preparation processes of the at least two wafer groups are completed, the change of the bonding relationship is unsuccessful.

18. The wafer bonding system of claim 17, wherein, If the change of the bonding relationship is successful, the process module is further configured to acquire basic information of the at least two wafer groups corresponding to the changed bonding relationship according to the changed bonding relationship; The transition module is further configured to perform first rule checking on the at least two changed wafers, and the bonding module is further configured to perform second rule checking on the at least two changed wafers, if the at least two changed wafer groups pass the first rule checking and the second rule checking, wafer bonding is performed according to the changed bonding relationship.

19. A wafer bonding system, comprising: The wafer bonding system comprises: A network interface is configured to realize connection communication between components; A memory is configured to store executable instructions; A processor is configured to execute the executable instructions stored in the memory, and realize the wafer bonding method of any one of claims 1 to 9.

20. A storage medium, characterized by The storage medium stores a computer program, and when the computer program is executed by at least one processor, the wafer bonding method of any one of claims 1 to 9 is realized.

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